JP6479095B2 - Light emitting device - Google Patents

Description

The present invention relates to a light-emitting device, an electronic device, and a lighting device using an organic electroluminescence (hereinafter also referred to as EL) phenomenon.

Research and development of light-emitting elements (also referred to as organic EL elements) using the organic EL phenomenon have been actively conducted. The basic structure of the organic EL element is such that a layer containing a light-emitting organic compound is sandwiched between a pair of electrodes. By applying voltage to this element, light emission from the light-emitting organic compound can be obtained.

Organic EL devices with features such as being easy to reduce the thickness and weight, being able to respond to input signals at high speed, and being able to be driven using a DC low-voltage power supply are the next-generation flat panel displays and Application to lighting is being studied. In particular, it is considered that a display device in which organic EL elements are arranged in a matrix is superior to a conventional liquid crystal display device in that it has a wide viewing angle and excellent visibility.

On the other hand, the organic EL element has a problem that reliability is impaired by impurities such as moisture and oxygen entering from the outside.

In some cases, impurities such as moisture or oxygen enter the organic compound or metal material constituting the organic EL element from the outside of the organic EL element, so that the lifetime of the organic EL element may be significantly reduced. Organic compounds and metal materials used in organic EL elements react with impurities such as moisture and oxygen,
It is because it will deteriorate.

Therefore, research and development is progressing on a technique for sealing an organic EL element in order to prevent impurities from entering.

For example, Patent Document 1 discloses a glass package that can be used for sealing an organic EL element and is sealed by bonding a first glass plate and a second glass plate with a frit. .

It is considered that the light-emitting device in which the organic EL element is sealed with the glass package disclosed in Patent Document 1 can suppress impurities from entering the light-emitting device from the outside after sealing. However, it is generally known that in the manufacturing process of a light-emitting device, moisture is adsorbed by a material constituting the light-emitting device, and moisture remains inside the light-emitting device. Patent Document 1
In the sealing technique described in, since there is no means for removing moisture that has once entered the light emitting device, the light enters the light emitting device before sealing, and the light emitting device enters after the sealing. It is difficult to prevent the moisture remaining in the glass from entering the organic compound or metal material constituting the organic EL element.

Patent Document 2 discloses an electro-optic display device in which a pixel interval wall made of an organic material is formed between each light emitting pixel. Furthermore, a configuration in which the pixel spacing wall contains a filler made of a material having a lower molecular weight than the organic material and a configuration in which the filler is a dehydrating material are disclosed.

Since the display device disclosed in Patent Document 2 includes a dehydrating material inside the device, moisture contained in the pixel interval wall or the like can be prevented from entering the organic compound or metal material constituting the organic EL element.

US Patent Publication No. 2004-0207314 JP 2004-235014 A

By the way, in the organic EL element, when the surface of the lower electrode is not flattened or dust exists on the lower electrode, the EL layer is not uniformly formed on the lower electrode, and the EL layer is lost. There is. In such a case, when the upper electrode is formed on the EL layer, the lower electrode and the upper electrode (anode and cathode) are in contact with each other at a defect portion where the EL layer is not formed, resulting in a short circuit.

In the display device disclosed in Patent Document 2, a pixel interval wall that covers an end portion of a pixel electrode (corresponding to a lower electrode) has an opening at a position overlapping a light emitting region of a light emitting element. When unevenness derived from a filler (for example, a dehydrating material) is present at the end (opening end) of the partition wall, in the light emitting element, there may be a defective portion where the light emitting layer (or the organic functional layer) is not formed. In the defective portion, there may be a problem that the lower electrode and the upper electrode are in contact with each other and short-circuited.

Therefore, an object of one embodiment of the present invention is to provide a highly reliable light-emitting device in which deterioration of an organic EL element can be suppressed and a lower electrode and an upper electrode are hardly short-circuited. Another object is to provide a highly reliable electronic device or lighting device including the light-emitting device.

The organic EL element includes a first electrode, a layer containing a light-emitting organic compound provided on the first electrode (hereinafter also referred to as an EL layer), a second electrode provided on the EL layer, . In the organic EL element, the inventors of the present invention have a configuration in which the partition covering the end of the first electrode includes a material that physically adsorbs moisture (hereinafter also referred to as a physical adsorption desiccant). The present inventors have conceived a configuration including a physical adsorption type desiccant having a maximum particle size equal to or less than the film thickness of the EL layer.

Thus, according to one embodiment of the present invention, a light-emitting element including a light-emitting element and a partition is provided in a space surrounded by the first substrate and the sealing body, and the light-emitting element is provided over the first substrate. 1 electrode, a layer containing a light-emitting organic compound provided on the first electrode, and a second electrode provided on the layer containing a light-emitting organic compound, and the partition wall includes the first electrode An opening is provided at a position that covers the edge of the light-emitting element and overlaps with the light-emitting region of the light-emitting element, and the partition wall is a physical adsorption type drying having a maximum particle size of 1 nanometer or more and a thickness of a layer containing a light-emitting organic compound or less A light-emitting device containing an agent.

As the sealing body, for example, a thin film with low moisture permeability can be used. Alternatively, a counter substrate and a sealing material (glass using glass frit or the like, resin, or the like) can be used. Since glass has high sealing properties, it is preferable to use glass as a sealing material. Further, since the resin is excellent in impact resistance and heat resistance and is not easily broken by deformation due to an external force or the like, it is preferable to use a resin as a sealing material.

One embodiment of the present invention includes a first substrate and a second substrate facing each other, a light-emitting portion including a light-emitting element and a partition, and a sealing material provided so as to surround an outer periphery of the light-emitting portion. A light-emitting element is provided in a space surrounded by the first substrate, the second substrate, and the sealing material, and the light-emitting element includes a first electrode and a first electrode provided on the first substrate. A light-emitting organic compound-containing layer and a second electrode provided on the light-emitting organic compound-containing layer, wherein the partition wall covers the end of the first electrode and emits light An opening is provided at a position overlapping the light emitting region of the element, and the partition wall is a light emitting device including a physical adsorption type desiccant having a maximum particle size of 1 nanometer or more and less than the thickness of the layer containing the light emitting organic compound. is there.

A light-emitting device of one embodiment of the present invention includes a light-emitting element (organic EL element) in a space surrounded by a first substrate and a sealing body (or a first substrate, a second substrate, and a sealing material). ) Is provided. Therefore, it is possible to suppress deterioration of the light-emitting element due to intrusion of impurities such as moisture and oxygen from the outside of the light-emitting device. In the light-emitting device of one embodiment of the present invention, the partition includes a physical adsorption desiccant. Therefore, impurities that have entered and remained inside the light emitting device during the manufacturing process can be adsorbed by the physical adsorption desiccant. Thus, deterioration of the light-emitting element due to impurities remaining inside the light-emitting device can be suppressed.

For example, the physical adsorption type desiccant is a first substrate, a sealing body (such as a second substrate), each film provided on the first substrate, or each film provided on the second substrate. It is possible to adsorb residual impurities that have entered the surface and inside. In particular, the surface of a film or the like close to the partition (the first substrate, the base film provided between the first substrate and the organic EL element, the film constituting the transistor for driving the organic EL element, or the like) Impurities that penetrate and remain inside can be easily adsorbed.

Further, even when the sealing ability is reduced and impurities enter the light emitting device from the outside, the impurities can be adsorbed by the physical adsorption desiccant. Accordingly, deterioration of the light-emitting element due to impurities can be suppressed.

In the light-emitting device of one embodiment of the present invention, the physical adsorption desiccant included in the partition wall has a maximum particle size of 1 nm or more and less than or equal to the thickness of the EL layer. Since the maximum particle size of the physical adsorption type desiccant is equal to or less than the film thickness of the EL layer, even if the partition wall contains a desiccant, the unevenness derived from the desiccant may cause a defect where the EL layer is not formed. Accordingly, it is possible to provide a highly reliable light-emitting device in which the first electrode and the second electrode are hardly short-circuited in the vicinity of the end portion of the partition wall. Further, the physical adsorption type desiccant is preferable because the maximum particle size is 1 nm or more because it is easy to produce.

In the above light-emitting device, it is preferable that the partition wall contain the physical adsorption type desiccant in a ratio of more than 0 weight percent (wt%) to 30 weight percent.

If the partition wall contains too much physical adsorption type desiccant, the function as the partition wall may not be achieved. Therefore, the physical adsorption type desiccant contained in the partition wall is preferably 50 wt% or less, and more preferably 30 wt% or less. In addition, it is preferable that the partition wall contains a small amount of the physical adsorption type desiccant because it is difficult to form irregularities derived from the desiccant on the partition wall surface and it is possible to suppress the occurrence of a defective portion where no EL layer is formed.

In the light emitting device, the physical adsorption desiccant is preferably zeolite.

The desiccant is roughly classified into a material that chemically adsorbs moisture and the like (referred to as a chemical adsorption type desiccant) and a material that physically adsorbs (referred to as a physical adsorption type desiccant). A chemisorption desiccant may generate heat due to a chemical reaction during the adsorption of moisture or the like, or the desiccant itself may change to another substance, resulting in a volume change. Accordingly, when heat is generated from the partition walls or volume change of the partition walls occurs, the organic EL element is damaged, which is not preferable. Therefore, in the present invention, a physical adsorption type desiccant such as zeolite or silica gel is used. In particular, zeolite has a sufficiently small particle size, is included in the resin material constituting the partition wall, and adsorbs moisture and the like even in a low humidity environment.
From the viewpoint of the above, it is preferable because it can be suitably used.

In the above light-emitting device, the partition walls are acrylic resin, siloxane resin, epoxy resin,
Or it is preferable that a phenol-type resin is included.

Since acrylic resins, siloxane resins, epoxy resins, and phenolic resins have high moisture permeability and water permeability, the desiccant contained in the partition adsorbs moisture and the like more when used as a partition material. Easy and preferable.

In the above light-emitting device, the partition preferably has a stacked structure of a first layer that does not include the physical adsorption desiccant and a second layer that includes the physical adsorption desiccant.

When the partition wall has a laminated structure, a physical adsorption type desiccant may be included in at least one of the layers. For example, in the case of a two-layer structure, a laminated structure in which a second layer containing a physical adsorption desiccant is provided on a first layer not containing a physical adsorption desiccant is preferable. With this configuration,
Since the end portion (particularly the end portion) of the partition wall is formed of a layer that does not contain a physical adsorption type desiccant, the first electrode and the second electrode are not easily short-circuited in the vicinity of the end portion of the partition wall, and the light emitting device has high reliability. Can be realized. In addition, when the second layer is provided over the first layer, the area where the first layer and the EL layer (or the second electrode) are in contact with each other is smaller than in the case where the second layer is not provided. Impurities remaining in the first layer hardly penetrate directly into the EL layer (or the second electrode) from the first layer. The impurities are
Before entering the EL layer, the possibility of entering the second layer is increased. Therefore, the impurities are
Since it becomes easy to adsorb | suck with the physical adsorption type desiccant contained in a 2nd layer, it can suppress that an impurity penetrate | invades into a light emitting element.

Moreover, the laminated structure which the 1st layer containing a physical adsorption type desiccant covers the 2nd layer which does not contain a physical adsorption type desiccant is preferable. By setting it as such a structure, the surface of a partition consists of a 2nd layer which does not contain a physical adsorption type desiccant. Therefore, even if the unevenness derived from the desiccant is present in the first layer, it is flattened by the second layer covering the first layer, and thus it is particularly suppressed that a defective portion where the EL layer is not formed is generated. In addition, it is possible to achieve a highly reliable light-emitting device in which the coverage of a film formed over the partition wall is increased and the first electrode and the second electrode are less likely to be short-circuited. In the case of adopting a partition wall having such a laminated structure, the maximum particle size of the physical adsorption type desiccant may be smaller than the sum of the film thickness of the EL layer and the film thickness of the second layer.

For the reasons listed above, it is preferable to use an acrylic resin, a siloxane resin, an epoxy resin, or a phenol resin for the layer containing the physical adsorption desiccant.

In the above light-emitting device, it is preferable that a spacer is provided on the partition wall, and the spacer includes a physical adsorption type desiccant having a maximum particle size of 1 nm or more and less than or equal to the film thickness of the spacer in a ratio of more than 0 wt% to 50 wt%. In particular, the spacer preferably contains a physical adsorption type desiccant having a maximum particle size of 1 nm or more and not more than the thickness of the spacer at a ratio of more than 0 wt% to 30 wt%.

In the light-emitting device, a spacer is provided over the partition wall, so that a pair of substrates (a first substrate and a second substrate are provided).
) Can be kept constant. By including the physical adsorption type desiccant in the spacer as well as the partition wall, impurities existing in the light emitting device can be more adsorbed. Accordingly, it is possible to further suppress the deterioration of the light emitting element due to the impurities.

In the light-emitting device, the light-emitting portion includes a transistor electrically connected to the first electrode,
The insulating film provided between the transistor and the light-emitting element preferably contains a physical adsorption type desiccant having a maximum particle size of 1 nm or more and less than or equal to the film thickness of the insulating film in a ratio of more than 0 wt% and 50 wt% or less. In particular, the insulating film preferably contains a physical adsorption type desiccant having a maximum particle size of 1 nm or more and not more than the thickness of the insulating film in a ratio of more than 0 wt% and 30 wt% or less.

By including a physical adsorption desiccant in the insulating film constituting the light emitting device, impurities existing inside the light emitting device can be more adsorbed. A configuration in which the desiccant is included in an insulating film (interlayer insulating film) provided between the transistor and the light-emitting element, a base film provided between the first substrate and the organic EL element, or the like is also included in the present invention. It is included in one aspect. The desiccant contained in these insulating films is organic E
Impurities that have entered the surface and inside of the transistor that drives the L element and remain can be adsorbed. Accordingly, it is possible to further suppress the deterioration of the light emitting element due to the impurities.

In the above light-emitting device, the second substrate includes a colored layer at a position overlapping the light-emitting region of the light-emitting element, and the colored layer has a physical adsorption type desiccant having a maximum particle size of 1 nm or more and the film thickness of the colored layer or less. 0wt%
It is preferable to include more at a ratio of 50 wt% or less. In particular, the colored layer has a maximum particle size of 1 nm.
As described above, it is preferable that the physical adsorption type desiccant having a thickness of the colored layer is contained in a ratio of more than 0 wt% and 30 wt% or less. In particular, the maximum particle size of the physical adsorption desiccant contained in the colored layer is preferably 300 nm or less.

In the light-emitting device, the second substrate includes a black matrix at a position that does not overlap the light-emitting region of the light-emitting element, and the black matrix has a maximum particle size of 1 nm or more and a physical adsorption type desiccant having a thickness of the black matrix or less. Is preferably contained in a proportion of more than 0 wt% and not more than 50 wt%. In particular, the black matrix preferably contains a physical adsorption type desiccant having a maximum particle size of 1 nm or more and not more than the film thickness of the black matrix in a ratio of more than 0 wt% and 30 wt%.

In the above light-emitting device, the second substrate includes a colored layer provided at a position overlapping with the light-emitting region of the light-emitting element, a black matrix provided at a position not overlapping with the light-emitting region, and an overcoat covering the colored layer and the black matrix. The overcoat layer has a maximum particle size of 1
A physical adsorption type desiccant having a thickness not less than nm and not more than the thickness of the overcoat layer is more than 0 wt% and 50 w
It is preferable to contain it in the ratio of t% or less. In particular, the overcoat layer preferably contains a physical adsorption type desiccant having a maximum particle size of 1 nm or more and not more than the film thickness of the overcoat layer in a ratio of more than 0 wt% and 30 wt% or less.

The light-emitting device of one embodiment of the present invention includes a physical adsorption desiccant in at least one of the coloring layer, the black matrix, and the overcoat layer, so that the light-emitting device enters the light-emitting device during a manufacturing process or the like. Impurities remaining inside can be adsorbed by the physical adsorption desiccant.

For example, the physical adsorption type desiccant is applied to the surface or the inside of the first substrate, the second substrate, each film provided on the first substrate, or each film provided on the second substrate. Impurities that penetrate and remain can be adsorbed. In particular, it penetrates into and remains on the surface or inside of a film or the like (second substrate, a colored layer provided on the second substrate, a black matrix, an overcoat layer, or the like) that is close to the layer containing the desiccant. Impurities can be easily adsorbed.

Further, even when the sealing ability is reduced and impurities enter the light emitting device from the outside, the impurities can be adsorbed by the physical adsorption desiccant. Accordingly, it is possible to further suppress the deterioration of the light emitting element due to the impurities.

Note that if the spacer, insulating film, colored layer, black matrix, and overcoat layer contain too much physical adsorption desiccant, the functions of each layer may not be achieved. Adsorption-type desiccant is 50 wt% or less, preferably 30
It is preferable that it is below wt%.

In addition, the overcoat layer and the colored layer are layers through which light passes when light emitted from the light-emitting element is extracted to the outside of the light-emitting device. Therefore,
The physical adsorption type desiccant included in the overcoat layer and the colored layer has a maximum particle size of 1 nm to 300 n.
m or less is preferable.

Another embodiment of the present invention is an electronic device including the light-emitting device having the above structure in a display portion. Also,
One embodiment of the present invention is a lighting device including the light-emitting device having the above structure in a lighting portion. Since the light-emitting device of one embodiment of the present invention can suppress deterioration of the organic EL element and the short-circuit between the lower electrode and the upper electrode is difficult, by applying the light-emitting device to an electronic device or a lighting device, a highly reliable electronic device or An illumination device can be realized.

A highly reliable light-emitting device in which deterioration of the organic EL element can be suppressed and the lower electrode and the upper electrode are hardly short-circuited can be provided. In addition, a highly reliable electronic device or lighting device including the light-emitting device can be provided.

FIG. 6 illustrates an example of a light-emitting device of one embodiment of the present invention. FIG. 6 illustrates an example of a light-emitting device of one embodiment of the present invention. 4A and 4B illustrate an example of a method for manufacturing a light-emitting device of one embodiment of the present invention. 4A and 4B illustrate an example of a method for manufacturing a light-emitting device of one embodiment of the present invention. FIG. 6 illustrates an example of a light-emitting device of one embodiment of the present invention. The figure which shows an example of EL layer. FIGS. 5A and 5B each illustrate an example of an electronic device and a lighting device of one embodiment of the present invention. FIGS. FIG. 6 illustrates an example of a lighting device of one embodiment of the present invention. FIG. 14 illustrates an example of an electronic device of one embodiment of the present invention. 4A and 4B illustrate an example of a light-emitting device of one embodiment of the present invention and a comparative light-emitting device.

Embodiments will be described in detail with reference to the drawings. However, the present invention is not limited to the following description, and it is easily understood by those skilled in the art that modes and details can be variously changed without departing from the spirit and scope of the present invention. Therefore, the present invention should not be construed as being limited to the description of the embodiments below. Note that in the structures of the invention described below, the same portions or portions having similar functions are denoted by the same reference numerals in different drawings, and
The repeated description is omitted.

(Embodiment 1)
In this embodiment, a light-emitting device of one embodiment of the present invention will be described with reference to FIGS.

The light-emitting device of one embodiment of the present invention includes a light-emitting portion in a space surrounded by the first substrate and the sealing body. In this embodiment, a structure in which a second substrate and a sealing material are used as a sealing body will be described as an example. The first substrate and the second substrate are opposed to each other. The sealing material is provided so as to surround the outer periphery of the light emitting unit. The light emitting unit includes a light emitting element (organic EL element) and a partition. The light-emitting element includes a first electrode over a first substrate, a layer containing a light-emitting organic compound (EL layer) over the first electrode, and a second electrode over the EL layer. Have. The partition wall covers the end portion of the first electrode and has an opening at a position overlapping the light emitting region of the light emitting element.

In one embodiment of the present invention, since a light-emitting portion (light-emitting element) is provided in a space surrounded by the first substrate and the sealing body, impurities such as moisture and oxygen enter from the outside of the light-emitting device to emit light. It can suppress that an element deteriorates.

In the light-emitting device of one embodiment of the present invention, the partition wall has a maximum particle size of 1 nm (nanometers).
The physical adsorption type desiccant below the thickness of the EL layer is included. Therefore, in one embodiment of the present invention, impurities that enter and remain inside the light-emitting device during a manufacturing process or the like can be adsorbed by the physical adsorption desiccant. Thus, deterioration of the light-emitting element due to impurities remaining inside the light-emitting device can be suppressed.

For example, the physical adsorption type desiccant is applied to the surface or the inside of the first substrate, the second substrate, each film provided on the first substrate, or each film provided on the second substrate. Impurities that penetrate and remain can be adsorbed. In particular, the surface or the inside of a film or the like close to the partition wall (the first substrate, a base film provided between the first substrate and the organic EL element, a film constituting a transistor for driving the organic EL element, or the like) Impurities that penetrate and remain in can be easily adsorbed.

Further, even when the sealing ability is reduced and impurities enter the light emitting device from the outside, the impurities can be adsorbed by the physical adsorption desiccant. Accordingly, deterioration of the light-emitting element due to impurities can be suppressed.

By the way, in the organic EL element, the surface of the lower electrode (the first electrode in this embodiment) is not flattened, or dust is present on the first electrode. The layer may not be uniformly formed, and the EL layer may be lost. In such a case, when the upper electrode (second electrode in this embodiment) is formed over the EL layer, the first electrode and the second electrode (in the defect portion where the EL layer is not formed) A problem arises that the anode and the cathode are in contact with each other and short-circuited.

The partition covering the end portion of the first electrode has an opening at a position overlapping the light emitting region of the light emitting element. When unevenness is present at the end portion (opening end) of the partition wall, a defective portion where the EL layer is not formed may occur in the light emitting element. And in the missing part where the EL layer is not formed,
The first electrode and the second electrode (anode and cathode) are in contact with each other, resulting in a short circuit.

From this viewpoint, the physical adsorption type desiccant contained in the partition walls preferably has a sufficiently small particle size. Moreover, it is preferable that the partition walls do not contain too much physical adsorption desiccant. In addition, since the physical adsorption type desiccant has a larger surface area as the particle size is smaller, a larger moisture absorption effect can be obtained with a small amount.

Specifically, a light-emitting device of one embodiment of the present invention and a comparative light-emitting device are described. FIG. 10 (A)
FIG. 10 illustrates a light-emitting device of one embodiment of the present invention, and FIG. 10B illustrates a comparative light-emitting device. FIG.
The light emitting device shown in (B) includes a light emitting element 130 which is an organic EL element on a first substrate 801.

In the light-emitting device shown in FIGS. 10A and 10B, a first electrode 118 is formed over a first substrate 801. The end portion of the first electrode 118 is covered with a partition wall 124. The first
An EL layer 120 is formed on the electrode 118, and the second electrode 12 is formed on the EL layer 120.
2 is formed.

A difference between the light-emitting device of one embodiment of the present invention illustrated in FIG. 10A and the comparative light-emitting device illustrated in FIG. 10B is a physical adsorption desiccant included in the partition wall 124.

In the comparative light emitting device shown in FIG. 10 (B), the physical adsorption type desiccant 1 contained in the partition wall 124.
No. 26 has a particle size larger than the film thickness of the EL layer 120. In the light-emitting device of one embodiment of the present invention illustrated in FIG. 10A, the physical adsorption desiccant 125 included in the partition wall 124 has a smaller particle size than the physical adsorption desiccant 126 and is a film of the EL layer 120. Less than thickness.

As shown in FIG. 10B, when unevenness derived from the physical adsorption desiccant 126 is present at the end (opening end) of the partition wall 124, a defective portion where the EL layer 120 is not formed occurs in the light emitting element 130. And in this defect | deletion location, the 1st electrode 118 and the 2nd electrode 122 are in contact,
The problem of short circuiting occurs.

However, in the light-emitting device of one embodiment of the present invention, the physical adsorption type desiccant 1 included in the partition wall 124 is used.
25, the maximum particle size is 1 nm or more and less than the film thickness of the EL layer 120. Therefore, as shown in FIG. 10A, the unevenness derived from the physical adsorption type desiccant 125 prevents the occurrence of a defective portion where the EL layer 120 is not formed, and the first electrode is formed in the vicinity of the end of the partition wall 124. A highly reliable light-emitting device in which 118 and the second electrode 122 are less likely to be short-circuited can be provided.

In addition, the lower the proportion of the physical adsorption type desiccant 125 contained in the partition wall 124, the lower the probability that unevenness derived from the desiccant is generated at the end of the partition wall, thereby suppressing the occurrence of a defective portion where no EL layer is formed. be able to. Specifically, the physical adsorption type desiccant 125 contained in the partition wall 124.
The ratio is preferably more than 0 wt% and 50 wt% or less, and more preferably 30 wt% or less.

Further, the physical adsorption type desiccant 125 contained in the partition wall 124 is preferably nano-sized (that is, the maximum particle size is 1 nm or more and 1000 nm or less), and particularly preferably 300 nm or less. When the maximum particle size is 300 nm or less, it is possible to particularly suppress the occurrence of defects where the EL layer 120 is not formed due to the unevenness derived from the physical adsorption desiccant 125,
A highly reliable light-emitting device in which the first electrode 118 and the second electrode 122 are not easily short-circuited in the vicinity of the end portion of the partition wall 124 can be provided.

Examples of the light-emitting device of one embodiment of the present invention are described below.

(Configuration example 1)
FIG. 1A is a plan view of a light-emitting device of one embodiment of the present invention. A cross-sectional view taken along the line AB in FIG. 1A is shown in FIG.

In the light-emitting device illustrated in FIGS. 1A and 1B, a light-emitting portion 802 is provided in a space 810 surrounded by a first substrate 801, a second substrate 806, and a sealing material 805.

The light-emitting portion 802 includes the light-emitting element 130 (the first electrode 118, the EL layer 120, and the second electrode 1).
22). The partition 124 covers the end portion of the first electrode 118 and has an opening at a position overlapping the light emitting region of the light emitting element 130. The partition wall 124 has a maximum particle size of 1 n.
A physical adsorption type desiccant 125 having a thickness of m or more and the thickness of the EL layer 120 is included.

The partition wall 124 can be formed using a resin. For example, a polyimide resin, an acrylic resin, a siloxane resin, an epoxy resin, a phenol resin, or the like can be used.

In particular, since the partition wall 124 can be easily manufactured, a negative photosensitive resin that becomes insoluble in an etchant by photosensitive light or a positive photosensitive resin that becomes soluble in an etchant by light is used. preferable.

In particular, acrylic resins, siloxane resins, epoxy resins, and phenolic resins
Since the moisture permeability and water permeability are high, the desiccant contained in the partition is preferable because it easily adsorbs moisture and the like.

A partition wall 124 is provided so as to cover an end portion of the first electrode 118. In order to improve the coverage of the EL layer 120 and the second electrode 122 formed on the partition 124, the partition 124
It is preferable that a curved surface having a curvature is formed at the upper end portion or the lower end portion. For example,
It is preferable to provide a curved surface having a curvature radius (0.2 μm to 3 μm) at the upper end portion or the lower end portion of the partition wall 124.

As the physical adsorption type desiccant 125, for example, silica gel or zeolite can be used. In particular, zeolite is preferable because it can be suitably used from the viewpoints of sufficiently reducing the particle size, being included in the resin material constituting the partition walls, and adsorbing moisture and the like even in an environment with low humidity.

The physical adsorption type desiccant 125 has a maximum particle size of 1 nm or more and not more than the film thickness of the EL layer 120. Preferably, it is 1000 nm or less, More preferably, it is 300 nm or less. As described above, when the physical adsorption type desiccant 125 has a nano-sized configuration, the resin used for the partition wall 124 may easily aggregate. Physical adsorption type desiccant 12 whose surface is modified with a silane coupling agent
Aggregation can be suppressed by using 5.

Since the light-emitting device of this embodiment includes the light-emitting portion 802 (light-emitting element 130) in a space 810 surrounded by the first substrate 801, the second substrate 806, and the sealing material 805, the light-emitting device It is possible to suppress the deterioration of the light emitting element 130 due to the entry of impurities such as moisture and oxygen from the outside.

In the light emitting device of this embodiment, the partition wall 124 includes a physical adsorption type desiccant 125. Therefore, impurities that have entered and remained inside the light emitting device during the manufacturing process can be adsorbed by the physical adsorption desiccant 125. Therefore, deterioration of the light-emitting element 130 due to impurities remaining inside the light-emitting device can be suppressed.

Further, in the light emitting device of the present embodiment, the physical adsorption type desiccant 12 included in the partition wall 124 is used.
5 has a maximum particle size of 1 nm or more and less than the film thickness of the EL layer 120. Therefore, the unevenness derived from the physical adsorption type desiccant 125 suppresses the occurrence of a defective portion where the EL layer 120 is not formed, and the first electrode 118 and the second electrode 122 are short-circuited in the vicinity of the end of the partition wall 124. This can be suppressed.

In the present invention, the partition wall 124 is not limited to a single layer, and may include a plurality of layers. When the partition wall 124 includes a plurality of layers, the physical adsorption type desiccant 125 may be included in at least one of the layers. An example of a light-emitting device of one embodiment of the present invention including the partition wall 124 including a plurality of layers is described below.

(Configuration example 2)
A cross-sectional view taken along a line AB in FIG. 1A is illustrated in FIG.

A light-emitting device illustrated in FIG. 1C includes a first substrate 801, a second substrate 806, and a sealing material 805.
A light-emitting portion 802 is provided in a space 810 surrounded by.

The light-emitting portion 802 includes the light-emitting element 130 (the first electrode 118, the EL layer 120, and the second electrode 1).
22). The partition 124 covers the end portion of the first electrode 118 and has an opening at a position overlapping the light emitting region of the light emitting element 130.

In the light-emitting device illustrated in FIG. 1C, the partition wall 124 includes the first layer 124 a and the second layer 12.
4b. Specifically, the second layer 124b is provided over the first layer 124a.
The first layer 124a has a physical adsorption type desiccant 125 having a maximum particle size of 1 nm or more and not more than the thickness of the EL layer.
including. The second layer 124b does not include the physical adsorption desiccant 125.

The layer containing the physical adsorption desiccant 125 (in the configuration example 2, the first layer 124a) is preferably formed using an acrylic resin, a siloxane resin, an epoxy resin, or a phenol resin. Since acrylic resins, siloxane resins, epoxy resins, and phenolic resins have high moisture permeability and water permeability, the desiccant contained in the partition adsorbs moisture and the like more when used as a partition material. Easy and preferable.

In addition, the layer not including the physical adsorption desiccant 125 (in the configuration example 2, the second layer 124b) may be formed using the same material as the layer including the physical adsorption desiccant 125, or may be formed using a different material. May be. For example, an organic compound such as a negative photosensitive resin that becomes insoluble in an etchant by photosensitive light, or a positive photosensitive resin that becomes soluble in an etchant by light,
Inorganic compounds such as silicon oxide and silicon oxynitride can be used.

(Configuration example 3)
As in the partition wall 204 illustrated in FIG. 2A, the lower surface shape of the second layer 204b may be smaller than the upper surface shape of the first layer 204a. The first layer 204a includes the physical adsorption type desiccant 125, and the second layer 204b does not include the physical adsorption type desiccant 125.

(Configuration example 4)
As in the partition wall 214 illustrated in FIG. 2B, the second layer 214b may cover the first layer 214a. The first layer 214a includes the physical adsorption type desiccant 125, and the second layer 214b does not include the physical adsorption type desiccant 125.

In the light-emitting device to which the structure in FIG. 2B is applied, the surface of the partition wall 214 is composed of the second layer 214b that does not contain a physical adsorption desiccant. A highly reliable light-emitting device in which the two electrodes are less likely to be short-circuited can be realized.

In the light-emitting device to which the structure in FIG. 2B is applied, if the maximum particle size of the physical adsorption desiccant is smaller than the sum of the thickness of the second layer 214b and the thickness of the EL layer, the end portion of the partition wall 214 In the vicinity
A highly reliable light-emitting device in which the first electrode and the second electrode are less likely to be short-circuited can be realized. Therefore, even if the EL layer is thin, a physical adsorption desiccant having a relatively large maximum particle size can be applied.

(Configuration example 5)
A partition 224 illustrated in FIG. 2C includes a first layer 224a and a second layer 224b. Specifically, the second layer 224b covers the first layer 224a. The first layer 224a does not include the physical adsorption desiccant 125. In addition, the second layer 224b includes a physical adsorption desiccant 125 having a maximum particle size of 1 nm or more and not more than the thickness of the EL layer.

(Configuration example 6)
Like the partition wall 234 illustrated in FIG. 2D, the top surface shape of the first layer 234 a and the second layer 234
The bottom surface shape of b may be equal. The first layer 234a is composed of the physical adsorption desiccant 12
5 is not included. In addition, the second layer 234 b includes a physical adsorption type desiccant 125.

(Configuration example 7)
As in the partition wall 244 illustrated in FIG. 2E, the lower surface shape of the second layer 244b may be smaller than the upper surface shape of the first layer 244a. The first layer 244a does not include the physical adsorption desiccant 125. In addition, the second layer 244b includes a physical adsorption type desiccant 125.

When the 2nd layer containing the physical adsorption type desiccant 125 is provided on the 1st layer like the structural examples 5-7, when it is not provided (that is, a partition does not contain a desiccant) Compared to a conventional partition wall, the area where the first layer and the EL layer (or the second electrode) are in contact with each other is small (particularly in the configuration example 5, the first layer 224a includes the EL layer and the second layer). Impurities that do not contact the electrode) and remain in the first layer are difficult to directly enter the EL layer (or the second electrode) from the first layer. The impurity is E
Before entering the L layer, the possibility of entering the second layer increases. Therefore, the impurities can be easily adsorbed by the physical adsorption desiccant 125 included in the second layer, so that the impurities can be prevented from entering the light emitting element.

In particular, in the configuration examples 6 and 7, the end portion (particularly the end) of the partition wall is formed of the first layer that does not include the physical adsorption desiccant 125. Therefore, even if unevenness derived from the physical adsorption type desiccant 125 is present in the first layer, it is flattened by the second layer covering the first layer, so that a defective portion where the EL layer is not formed is generated. In particular, it is possible to achieve a highly reliable light-emitting device in which the first electrode and the second electrode are not easily short-circuited.

<Materials that can be used for light-emitting device of one embodiment of the present invention>
Examples of materials that can be used for the light-emitting device of one embodiment of the present invention are described below. The above description can be referred to for the partition walls and the physical adsorption type desiccant.

[First substrate 801, second substrate 806]
As the substrate, materials such as glass, quartz, and organic resin can be used. The substrate on the side from which light from the light-emitting element is extracted is formed using a material that transmits light.

When an organic resin is used as the substrate, examples of the organic resin include polyester resins such as polyethylene terephthalate (PET) and polyethylene naphthalate (PEN), polyacrylonitrile resins, polyimide resins, polymethyl methacrylate resins, and polycarbonate (PC) resins. Polyether sulfone (PES) resin, polyamide resin, cycloolefin resin, polystyrene resin, polyamideimide resin, polyvinyl chloride resin, or the like can be used. A substrate in which glass fiber is impregnated with an organic resin or a substrate in which an inorganic filler is mixed with an organic resin can also be used.

Note that an insulating layer is preferably provided on the surface of the substrate 801 in order to prevent impurities included in the first substrate 801 from diffusing into each element provided over the first substrate 801.

[Light emitting element 130]
The first electrode 118 is provided on the side opposite to the light extraction side and is formed using a reflective material. As the reflective material, a metal material such as aluminum, gold, platinum, silver, nickel, tungsten, chromium, molybdenum, iron, cobalt, copper, or palladium can be used. In addition, an alloy containing aluminum (aluminum alloy) such as an alloy of aluminum and titanium, an alloy of aluminum and nickel, an alloy of aluminum and neodymium, or an alloy containing silver such as an alloy of silver and copper can be used. An alloy of silver and copper is preferable because of its high heat resistance.

The EL layer 120 includes at least a layer containing a light-emitting substance (light-emitting layer). In addition, a layer containing a substance having a high electron transporting property, a layer containing a substance having a high hole transporting property, a layer containing a substance having a high electron injecting property, a layer containing a substance having a high hole injecting property, a bipolar substance (electron A stacked structure in which layers including a substance having a high transportability and a high hole-transport property are combined as appropriate can be formed. An example of the structure of the EL layer will be described in detail in Embodiment 4.

As a light-transmitting material that can be used for the second electrode 122, indium oxide,
ITO, indium zinc oxide, zinc oxide, zinc oxide to which gallium is added, or the like can be used.

As the second electrode 122, a metal material such as gold, platinum, nickel, tungsten, chromium, molybdenum, iron, cobalt, copper, palladium, or titanium can be used. Alternatively, nitrides of these metal materials (for example, titanium nitride) may be used. Alternatively, graphene or the like may be used. Note that in the case where a metal material (or a nitride thereof) is used, it may be thinned so as to have a light-transmitting property.

Note that in the present embodiment, the light emission device having the top emission structure is illustrated, but a light emission device having a bottom emission structure (bottom emission structure) or a dual emission structure (double emission structure) may be used.

[Sealing material 805]
The sealing material 805 can be formed using a known sealing material, glass frit, or the like. In particular,
An organic resin such as a thermosetting resin or a photo-curing resin, or a material such as low-melting glass can be used. Moreover, the desiccant may be contained in the sealing material.

[Sealed body]
In this embodiment, the structure using the second substrate and the sealing material is described as an example of the sealing body, but a thin film with low moisture permeability can also be used as the sealing body. As a thin film with low moisture permeability,
An inorganic insulating film can be used. Specifically, a silicon oxide film, a silicon nitride film, a silicon nitride oxide film, a silicon oxynitride film, an aluminum nitride film, an aluminum oxide film, a silicon oxynitride film, a silicon nitride oxide film, or the like can be used. As the sealing body, a thin film with low moisture permeability can be used as a single layer or a stacked layer. A thin film with low moisture permeability can also be applied in combination with the second substrate and the sealing material.

[Space 810]
The space 810 may be filled with an inert gas such as a rare gas or nitrogen gas, or a solid such as an organic resin, or may be a reduced-pressure atmosphere.

As described above, the light-emitting device of one embodiment of the present invention includes the light-emitting portion (light-emitting element) in the space surrounded by the first substrate and the sealing body. It is possible to suppress deterioration of the light-emitting element due to intrusion of impurities such as.

In the light-emitting device of one embodiment of the present invention, the partition includes a physical adsorption desiccant. Therefore, impurities that enter and remain inside the light emitting device during the manufacturing process can be adsorbed by the physical adsorption desiccant. Thus, deterioration of the light-emitting element due to impurities remaining inside the light-emitting device can be suppressed.

Furthermore, in the light-emitting device of one embodiment of the present invention, the physical adsorption desiccant included in the partition wall has a maximum particle size of 1 nm or more and less than the film thickness of the EL layer. Therefore, the unevenness derived from the physical adsorption desiccant suppresses the occurrence of a defective portion where the EL layer is not formed, and suppresses the first electrode and the second electrode from being short-circuited in the vicinity of the end of the partition wall. Can do.

This embodiment can be combined with any of the other embodiments as appropriate.

(Embodiment 2)
In this embodiment, a method for manufacturing a light-emitting device of one embodiment of the present invention will be described with reference to FIGS. In particular, a method for manufacturing the light-emitting portion 802 will be described.

In this embodiment, a case where a photosensitive resin is used for the partition and zeolite is used as the physical adsorption type desiccant 125 will be described as an example.

(Configuration example 1)
First, an example of a manufacturing method of Structural Example 1 (FIG. 1B) will be described with reference to FIGS.

First, the first electrode 118 is formed over the first substrate 801 (FIG. 3A).

Next, a resin layer 134 including a physical adsorption desiccant 125 is formed over the first electrode 118 (
FIG. 3 (B)).

Here, a material for forming the resin layer 134 will be described.

First, the zeolite having a maximum particle size of 1 nm or more and not more than the thickness of the EL layer used as the physical adsorption desiccant 125 is dried by freeze drying or the like. In particular, the maximum particle size is 1 nm to 1000 nm
Or less, more preferably 300 nm or less.

Next, the surface of the zeolite is modified using a silane coupling agent or the like. Thereby, aggregation of the zeolite in resin can be suppressed.

Finally, zeolite is dispersed in the photosensitive resin used for the resin layer 134 using an extruder or the like. At this time, the ratio of the zeolite contained in the photosensitive resin is more than 0 wt% and 50 wt%.
% Or less, and more preferably 30 wt% or less.

The resin layer 134 is formed using the photosensitive resin containing the physical adsorption type desiccant 125 obtained in the above steps. For example, a photosensitive resin containing zeolite may be applied using a coating apparatus such as a spinner or a slit coater in an inert atmosphere.

Then, the resin layer 134 is selectively exposed using the mask 135. In addition, the photosensitive resin containing a zeolite may be hard to harden | cure by light in oxygen presence. In this case, it is preferable to cure the resin layer 134 in an inert atmosphere such as a nitrogen atmosphere or an argon atmosphere. Here, exposure is performed in a nitrogen atmosphere.

After that, development is performed to form the partition wall 124 from the resin layer 134 (FIG. 3C).

Note that the method for forming the partition wall 124 is not limited to this, and the partition wall 124 may be formed by a screen printing method or an inkjet method.

Next, heat treatment is performed to remove impurities such as moisture contained in the partition wall 124. In this embodiment mode, the first substrate 801 is washed and 200 to 300 ° C. (preferably 2 ° C.) in a nitrogen atmosphere.
Heat treatment at 50 to 300 ° C., and further 200 to 300 ° C. (preferably 25 in vacuum).
0 to 300 ° C.).

After the heat treatment in vacuum, the first substrate 801 is transported without being exposed to the atmosphere, vapor deposition is performed, and the EL layer 120 is formed over the first electrode 118 and the partition wall 124. And EL layer 12
A second electrode 122 is formed on 0. Through the above process, the light-emitting element 130 can be manufactured over the first substrate 801.

(Configuration example 2)
Next, an example of a manufacturing method of Structural Example 2 (FIG. 1C) will be described with reference to FIGS.

First, the first electrode 118 is formed over the first substrate 801 (FIG. 3A).

Next, the first layer 124 a including the physical adsorption desiccant 125 is formed over the first electrode 118. The first layer 124a can be formed by a method similar to the method for forming the resin layer 134 when the structural example 1 is manufactured. In this embodiment mode, a first resin layer 134a is formed by applying a photosensitive resin containing zeolite, and the first resin layer 134a is selectively exposed using a mask 135 (FIG. 4). (A)). Then, after development, heat treatment is performed to form the first layer 124a (FIG. 4B).

Next, on the first layer 124a, the second resin layer 134b that does not include the physical adsorption desiccant 125.
Form. In this embodiment, the same resin as the photosensitive resin used for the first resin layer 134a is applied using a coating apparatus in a nitrogen atmosphere.

Next, the second resin layer 134b is selectively exposed using the mask 135 (FIG. 4 (
C)).

Thereafter, development is performed and heat treatment is performed, so that the second layer 124b is formed. Through the above steps, the partition wall 124 including the first layer 124a and the second layer 124b is formed (FIG. 4D).
. This manufacturing method is preferable because the first layer 124a and the second layer 124b can be formed using one photomask and the number of masks required for manufacturing does not increase.

Note that even after the first resin layer 134a and the second resin layer 134b are sequentially applied, the first layer 124a and the second layer 124b are formed by performing exposure, development, and heat treatment at a time. It is preferable because the number of manufacturing steps is reduced.

After that, the light-emitting element 130 can be manufactured over the first substrate 801 by performing the same steps as in Structural Example 1 (FIG. 4C).

(Configuration example 3)
In Structural Example 3 (FIG. 2A), for example, in the manufacturing method of Structural Example 2, the first resin layer 134 is used.
The photosensitive resin used for a and the photosensitive resin used for the second resin layer 134b are different materials,
The first layer 204a and the second layer 204b can be manufactured by making a difference in development rate.

(Configuration example 4)
In Structural Example 4 (FIG. 2B), for example, in the manufacturing method of Structural Example 2, the first resin layer 134 is used.
The mask can be manufactured by making the mask used when exposing a different from the mask used when exposing the second resin layer 134b.

(Configuration examples 5 to 7)
In Structural Examples 5 to 7 (FIGS. 2C to 2E), the first resin layer 134a is formed using a photosensitive resin that does not include the physical adsorption desiccant 125, and the second resin layer 134b. Is formed using a photosensitive resin containing a physical adsorption type desiccant 125. Otherwise, the configuration example 5 is the configuration example 4
The same method can be applied. Similarly, the same method as the configuration example 2 can be applied to the configuration example 6, and the same method as the configuration example 3 can be applied to the configuration example 7.

Structural examples 2, 3, 6, and 7 are preferable because the partition wall includes a plurality of layers but can be manufactured using the same number of masks as in the case of a single layer.

As described above, the light-emitting device of one embodiment of the present invention can be manufactured.

This embodiment can be combined with any of the other embodiments as appropriate.

(Embodiment 3)
In this embodiment, a light-emitting device of one embodiment of the present invention will be described with reference to FIGS. FIG.
) Is a plan view illustrating a light-emitting device of one embodiment of the present invention, FIG. 5B is a cross-sectional view illustrating an example of a light-emitting portion included in the light-emitting device, and FIG. Is a cross-sectional view taken along a chain line CD.

An active matrix light-emitting device according to this embodiment includes a light-emitting portion 802, a drive circuit portion 803 (gate-side drive circuit portion), a drive circuit portion 804 (source-side drive circuit portion), and a first substrate 801. A sealant 805 is included. The light emitting portion 802 and the drive circuit portions 803 and 804 are sealed in a space formed by the first substrate 801, the second substrate 806, and the sealing material 805.

Since the light-emitting device includes a light-emitting portion 802 (light-emitting element 130) in a space 810 surrounded by the first substrate 801, the second substrate 806, and the sealing material 805, moisture can be emitted from the outside of the light-emitting device. It is possible to suppress deterioration of the light-emitting element 130 due to the entry of impurities such as oxygen and oxygen.

The light-emitting portion 802 illustrated in FIG. 5C includes a first transistor electrically connected to a switching transistor 140a, a current control transistor 140b, and a wiring (source electrode or drain electrode) of the current control transistor 140b. Are formed by a plurality of light emitting units.

The light-emitting element 130 includes a first electrode 118, a layer containing a light-emitting organic compound (EL layer) 120,
And the second electrode 122. A partition wall 124 is formed so as to cover an end portion of the first electrode 118. The partition wall 124 has a maximum particle size of 1 nm or more.
A physical adsorption type desiccant 125 having a thickness less than or equal to.

In the light emitting device of this embodiment, the partition wall 124 includes a physical adsorption type desiccant 125. Therefore, impurities that penetrate and remain inside the light-emitting device during the manufacturing process or the like are removed from the physical adsorption desiccant 1.
It can be adsorbed by 25. Therefore, impurities remaining inside the light emitting device
It can suppress that the light emitting element 130 deteriorates.

Further, in the light emitting device of the present embodiment, the physical adsorption type desiccant 12 included in the partition wall 124 is used.
5 has a maximum particle size of 1 nm or more and less than the film thickness of the EL layer 120. Therefore, the unevenness derived from the physical adsorption type desiccant 125 suppresses the occurrence of a defective portion where the EL layer 120 is not formed, and the first electrode 118 and the second electrode 122 are short-circuited in the vicinity of the end of the partition wall 124. This can be suppressed.

FIG. 5B illustrates another structure of the light-emitting portion 802. A light-emitting portion 802 illustrated in FIG. 5B includes a spacer 137 over the partition wall 124. In the light emitting device, the spacer 137 is formed on the partition wall 124.
The distance between the pair of substrates (the first substrate 801 and the second substrate 806) can be kept constant. The shape of the spacer 137 is not limited to the reverse tapered shape, and may be a tapered shape.

Note that the partition wall 124 of one embodiment of the present invention illustrated in FIG. 2A can have a structure in which the second layer 124b functions as a spacer by appropriately selecting a thickness and the like.

On the first substrate 801, a lead wiring for connecting an external input terminal for transmitting a signal (video signal, clock signal, start signal, reset signal, or the like) or potential from the outside to the driving circuit portions 803 and 804. Is provided. Here, FPC808 (external input terminal)
An example of providing a flexible printed circuit) is shown. In addition,
A printed wiring board (PWB) may be attached to the FPC 808. The light-emitting device in this specification includes not only a light-emitting device body but also a state in which an FPC or PWB is attached to the light-emitting device body.

The driver circuit portions 803 and 804 include a plurality of transistors. In FIG. 5, the drive circuit portion 803
Shows an example having a CMOS circuit in which an n-channel transistor 152 and a p-channel transistor 153 are combined. The circuit of the driver circuit portion can be formed by various CMOS circuits, PMOS circuits, or NMOS circuits. In this embodiment mode, a driver integrated type in which a driving circuit is formed on a substrate on which a light emitting portion is formed is shown, but the present invention is not limited to this configuration, and the substrate on which the light emitting portion is formed. A driving circuit can be formed on a different substrate.

<Materials that can be used for light-emitting device of one embodiment of the present invention>
Examples of materials that can be used for the light-emitting device of one embodiment of the present invention are described below. Board,
For the light-emitting element, the sealing material, the space, the physical adsorption desiccant, and the partition, the materials exemplified in Embodiment 1 can be used.

[Transistor]
Transistors used in the light-emitting device of one embodiment of the present invention (transistors 140a, 140b, 1
52, 153, etc.) is not particularly limited. A top-gate transistor may be used, or a bottom-gate transistor such as an inverted staggered transistor may be used. Further, a channel etch type or a channel stop (channel protection) type may be used. There is no particular limitation on the material used for the transistor.

The gate electrode may be formed as a single layer or a stacked layer using a metal material such as molybdenum, titanium, chromium, tantalum, tungsten, aluminum, copper, neodymium, or scandium, or an alloy material containing these elements. it can.

The gate insulating layer can be formed using a single layer or a stack of silicon oxide, silicon nitride, silicon oxynitride, silicon nitride oxide, or aluminum oxide, for example, using a plasma CVD method, a sputtering method, or the like.

The semiconductor layer can be formed using a silicon semiconductor or an oxide semiconductor. Examples of silicon semiconductors include single crystal silicon and polycrystalline silicon, and oxide semiconductors include I
An n-Ga-Zn-O-based metal oxide or the like can be used as appropriate. However, semiconductor layer 1
10, an oxide semiconductor that is an In—Ga—Zn—O-based metal oxide is used to form a semiconductor layer with a low off-current, thereby suppressing leakage current when the light-emitting element 130 to be formed later is off. This is preferable because it is possible.

As the source electrode layer and the drain electrode layer, for example, Al, Cr, Cu, Ta, Ti, M
o, a metal film containing an element selected from W, or a metal nitride film containing the element (titanium nitride film,
A molybdenum nitride film, a tungsten nitride film, or the like can be used. Further, a refractory metal film such as Ti, Mo, W or the like or a metal nitride film thereof (titanium nitride film, molybdenum nitride film, tungsten nitride film) is formed on one or both of the lower side or upper side of the metal film such as Al or Cu. It is good also as a structure which laminated | stacked. The source electrode layer 112a and the drain electrode layer 112b may be formed using a conductive metal oxide. As the conductive metal oxide, indium oxide (In ₂
O ₃ etc.), tin oxide (SnO ₂ etc.), zinc oxide (ZnO), indium tin oxide (IT
O), indium zinc oxide (such as In ₂ O ₃ —ZnO), or a metal oxide material containing silicon oxide can be used.

[First insulating layer 114, second insulating layer 116]
The first insulating layer 114 has an effect of suppressing diffusion of impurities into a semiconductor included in the transistor. As the first insulating layer 114, an inorganic insulating film such as a silicon oxide film, a silicon oxynitride film, or an aluminum oxide film can be used.

As the second insulating layer 116, it is preferable to select an insulating film having a planarization function in order to reduce surface unevenness due to the transistor. For example, an organic material such as polyimide, acrylic, or benzocyclobutene can be used. In addition to the organic material, a low dielectric constant material (low-k material) or the like can be used. Note that the second insulating layer 116 may be formed by stacking a plurality of insulating films formed using these materials.

The first insulating layer 114 and the second insulating layer 116 may contain a physical adsorption type desiccant having a maximum particle size of 1 nm or more and not more than the thickness of each insulating layer in a proportion of more than 0 wt% and 50 wt% or less. good. In particular, the insulating film has a physical adsorption type desiccant having a maximum particle size of 1 nm or more and not more than the thickness of each insulating layer.
It is preferable to contain in the ratio of more than 30% and 30 wt% or less.

By including a physical adsorption desiccant in the insulating film constituting the light emitting device, impurities existing inside the light emitting device can be more adsorbed. Therefore, a configuration in which the desiccant is included in an insulating film (interlayer insulating film) provided between the transistor and the light-emitting element, a base film provided between the first substrate and the organic EL element, or the like is also provided. It is included in one aspect of the invention. The desiccant contained in these insulating films can adsorb impurities that have penetrated and remained on the surface and inside of the transistor that drives the organic EL element. Accordingly, it is possible to further suppress the deterioration of the light emitting element due to the impurities.

[Spacer 137]
The spacer 137 can be formed using an inorganic insulating material, an organic insulating material, or a metal material. For example, silicon oxide, silicon nitride, or the like can be used as the inorganic insulating material. As the organic insulating material, a photosensitive resin, a non-photosensitive resin, or the like can be used. Further, titanium, aluminum, or the like can be used as the metal material.

As for the spacer, a physical adsorption type desiccant having a maximum particle size of 1 nm or more and less than the thickness of the spacer is 0 wt%.
It is preferable to contain it in the ratio of more than 50% and 50 wt% or less. In particular, the spacer has a maximum particle size of 1
It is preferable that a physical adsorption type desiccant having a thickness of not less than nm and not more than the thickness of the spacer is included in a ratio of more than 0 wt% and not more than 30 wt%. By including the physical adsorption type desiccant in the spacer as well as the partition wall, impurities existing in the light emitting device can be more adsorbed. Therefore, it is possible to further suppress the deterioration of the light emitting element due to the impurities present inside the light emitting device.

[Color filter 166, black matrix 164]
A color filter 166 that is a colored layer is provided over the substrate 806 so as to overlap with the light emitting element 130 (the light emitting region thereof). The color filter 166 is provided for the purpose of adjusting the emission color from the light emitting element 130. For example, when a full-color display device is formed using a light emitting element that emits white light, a plurality of light emitting units provided with different color filters are used. In that case, three colors of red (R), green (G), and blue (B) may be used, and yellow (Y
) To add four colors.

The color filter may contain a physical adsorption type desiccant having a maximum particle size of 1 nm or more and less than or equal to the film thickness of the color filter in a ratio of more than 0 wt% and 50 wt% or less. In particular, the color filter has a physical adsorption type desiccant with a maximum particle size of 1 nm or more and less than the film thickness of the color filter.
It is preferable to contain more at a ratio of 30 wt% or less. In particular, the maximum particle size of the physical adsorption type desiccant contained in the color filter is preferably 300 nm or less.

A black matrix 164 is provided between adjacent color filters 166 (positions that do not overlap with the light emitting region of the light emitting element 130). The black matrix 164 blocks light from the light emitting elements 130 of adjacent light emitting units, and suppresses color mixing between adjacent light emitting units. Here, by providing the end portion of the color filter 166 so as to overlap the black matrix 164, light leakage can be suppressed. Black matrix 16
4 can use a material that blocks light emitted from the light emitting element 130, and can be formed using a material such as a metal or an organic resin. Note that the black matrix 164 may be provided in a region other than the light emitting portion 802 such as the drive circuit portion 803.

The black matrix may contain a physical adsorption type desiccant having a maximum particle size of 1 nm or more and not more than the film thickness of the black matrix in a proportion of more than 0 wt% and 50 wt% or less. In particular, the black matrix preferably contains a physical adsorption type desiccant having a maximum particle size of 1 nm or more and not more than the film thickness of the black matrix in a ratio of more than 0 wt% and 30 wt%.

The overcoat layer 16 covering the color filter 166 and the black matrix 164 is also provided.
8 is formed. The overcoat layer 168 is made of a material that transmits light emitted from the light emitting element 130. For example, an inorganic insulating film or an organic insulating film can be used. Note that the overcoat layer 168 may be omitted if unnecessary.

The overcoat layer may contain a physical adsorption type desiccant having a maximum particle size of 1 nm or more and not more than the film thickness of the overcoat layer in a proportion of more than 0 wt% and 50 wt% or less. In particular, the overcoat layer has a physical adsorption type desiccant having a maximum particle size of 1 nm or more and not more than the film thickness of the overcoat layer.
It is preferable to contain it in a ratio of more than 0 wt% and 30 wt% or less. In particular, the maximum particle size of the physical adsorption desiccant contained in the overcoat layer is preferably 300 nm or less.

The light-emitting device of one embodiment of the present invention includes a physical adsorption desiccant in at least one of a color filter, a black matrix, and an overcoat layer, so that during a manufacturing process or the like,
Impurities that enter the light emitting device and remain inside the light emitting device can be adsorbed by the physical adsorption desiccant.

For example, the physical adsorption type desiccant is applied to the surface or the inside of the first substrate, the second substrate, each film provided on the first substrate, or each film provided on the second substrate. Impurities that penetrate and remain can be adsorbed. In particular, it penetrates into and remains on the surface or inside of a film or the like (second substrate, a colored layer provided on the second substrate, a black matrix, an overcoat layer, or the like) that is close to the layer containing the desiccant. Impurities can be easily adsorbed.

Further, even when the sealing ability is reduced and impurities enter the light emitting device from the outside, the impurities can be adsorbed by the physical adsorption desiccant. Accordingly, it is possible to further suppress the deterioration of the light emitting element due to the impurities.

Note that if the spacer, insulating film, color filter, black matrix, and overcoat layer contain too much physical adsorption desiccant, the functions of each layer may not be achieved. The adsorptive desiccant is preferably 50 wt% or less, and more preferably 30 wt% or less.

The overcoat layer and the color filter are layers through which light passes when the light emitted from the light-emitting element is extracted to the outside of the light-emitting device.
Therefore, the physical adsorption type desiccant included in the overcoat layer and the color filter has a maximum particle size of 1.
It is preferable that it is not less than nm and not more than 300 nm.

Note that although a light-emitting device using a color filter method has been described as an example in this embodiment mode, the structure of the present invention is not limited to this. For example, a coloring method or a color conversion method may be applied.
In addition, a physical adsorption type desiccant can be included also in the color conversion layer used when applying the color conversion system which is an example of a colored layer. Specifically, a physical adsorption type desiccant having a maximum particle size of 1 nm or more and not more than the film thickness of the color conversion layer may be contained in a ratio of more than 0 wt% and 50 wt% or less. In particular, a physical adsorption type desiccant having a maximum particle size of 1 nm or more and less than the film thickness of the color conversion layer is 0 wt%.
It is preferable to contain in the ratio of more than 30% and 30 wt% or less. In particular, the maximum particle size of the physical adsorption desiccant contained in the color conversion layer is preferably 300 nm or less.

This embodiment can be combined with any of the other embodiments as appropriate.

(Embodiment 4)
In this embodiment, structural examples of EL layers that can be applied to the light-emitting device of one embodiment of the present invention will be described with reference to FIGS.

A known substance can be used for the EL layer, and either a low molecular compound or a high molecular compound can be used. Note that the substance forming the EL layer includes not only an organic compound but also a structure including an inorganic compound in part.

In FIG. 6A, the EL layer 120 is provided between the first electrode 118 and the second electrode 122.
The EL layer 120 illustrated in FIG. 6A is stacked in the order of the hole injection layer 701, the hole transport layer 702, the light-emitting layer 703, the electron transport layer 704, and the electron injection layer 705 from the first electrode 118 side. ing.

A plurality of EL layers may be stacked between the first electrode 118 and the second electrode 122 as illustrated in FIG. In this case, the stacked first EL layer 120a and second EL layer 12 are stacked.
A charge generation layer 709 is preferably provided between 0b and 0b. A light-emitting element having such a structure hardly causes problems such as energy transfer and quenching, and can easily be a light-emitting element having both high light emission efficiency and a long lifetime by widening the range of material selection. It is also easy to obtain phosphorescence emission with one EL layer and fluorescence emission with the other. This structure can be used in combination with the structure of the EL layer described above.

Further, by making the light emission colors of the respective EL layers different, light emission of a desired color can be obtained as the whole light emitting element. For example, in a light-emitting element having two EL layers, the first
By making the emission color of the EL layer and the emission color of the second EL layer have a complementary relationship, it is possible to obtain a light emitting element that emits white light as a whole. The complementary color refers to a relationship between colors that become achromatic when mixed. That is, white light emission can be obtained by mixing light obtained from substances that emit light of complementary colors. The same applies to a light-emitting element having three or more EL layers.

As shown in FIG. 6C, the EL layer 120 includes a hole injection layer 701, a hole transport layer 702, a light-emitting layer 703, and an electron transport layer between the first electrode 118 and the second electrode 122. 704, electron injection buffer layer 706, electron relay layer 707, and composite material layer 7 in contact with second electrode 122
08 may be included.

Providing the composite material layer 708 in contact with the second electrode 122 is preferable because damage to the EL layer 120 can be reduced particularly when the second electrode 122 is formed by a sputtering method.

By providing the electron injection buffer layer 706, an injection barrier between the composite material layer 708 and the electron transport layer 704 can be relaxed, so that electrons generated in the composite material layer 708 can be easily injected into the electron transport layer 704. can do.

An electron relay layer 707 is preferably formed between the electron injection buffer layer 706 and the composite material layer 708. The electron relay layer 707 is not necessarily provided, but by providing the electron relay layer 707 having a high electron transporting property, electrons can be quickly sent to the electron injection buffer layer 706.

The structure in which the electron relay layer 707 is sandwiched between the composite material layer 708 and the electron injection buffer layer 706 includes an acceptor substance contained in the composite material layer 708 and the electron injection buffer layer 70.
6 is a structure that is difficult to interact with the donor substance contained in 6, and hardly interferes with each other's functions. Therefore, an increase in drive voltage can be suppressed.

Examples of materials that can be used for each layer are shown below. Note that each layer is not limited to a single layer, and two or more layers may be stacked.

The hole injection layer 701 is a layer containing a substance having a high hole injection property. Examples of the material having a high hole injection property include molybdenum oxide, titanium oxide, vanadium oxide, rhenium oxide,
Ruthenium oxide, chromium oxide, zirconium oxide, hafnium oxide, tantalum oxide, silver oxide, tungsten oxide, manganese oxide and other metal oxides, copper (II) phthalocyanine (abbreviation: CuPc), etc. A phthalocyanine compound or the like can be used.

In addition, 4,4 ′, 4 ″ -tris (N, N-diphenylamino) triphenylamine (abbreviation: TDATA), 4,4 ′, 4 ″ -tris [N- ( 3-methylphenyl) -N-phenylamino] triphenylamine (abbreviation: MTDATA), 4
, 4′-bis [N- (4-diphenylaminophenyl) -N-phenylamino] biphenyl (abbreviation: DPAB), 4,4′-bis (N- {4- [N ′-(3-methylphenyl)] −
N′-phenylamino] phenyl} -N-phenylamino) biphenyl (abbreviation: DNTP)
D), 1,3,5-tris [N- (4-diphenylaminophenyl) -N-phenylamino] benzene (abbreviation: DPA3B), 3- [N- (9-phenylcarbazol-3-yl) -N -Phenylamino] -9-phenylcarbazole (abbreviation: PCzPCA1), 3,
6-Bis [N- (9-phenylcarbazol-3-yl) -N-phenylamino] -9-
Phenylcarbazole (abbreviation: PCzPCA2), 3- [N- (1-naphthyl) -N- (
9-phenylcarbazol-3-yl) amino] -9-phenylcarbazole (abbreviation: P
An aromatic amine compound such as CzPCN1) can be used.

Furthermore, a high molecular compound can also be used. For example, poly (N-vinylcarbazole)
(Abbreviation: PVK), poly (4-vinyltriphenylamine) (abbreviation: PVTPA), poly [N- (4- {N ′-[4- (4-diphenylamino) phenyl] phenyl-N′-phenylamino } Phenyl) methacrylamide] (abbreviation: PTPDMA), poly [N, N′-
Bis (4-butylphenyl) -N, N′-bis (phenyl) benzidine] (abbreviation: Pol
and a high molecular compound such as y-TPD). In addition, a polymer compound to which an acid such as poly (3,4-ethylenedioxythiophene) / poly (styrenesulfonic acid) (PEDOT / PSS), polyaniline / poly (styrenesulfonic acid) (PAni / PSS) is added is used. be able to.

In particular, for the hole-injecting layer 701, a composite material in which an acceptor substance is contained in an organic compound having a high hole-transport property is preferably used. By using a composite material in which an acceptor substance is contained in a substance having a high hole-transport property, hole-injection property from the first electrode 118 can be improved, and the driving voltage of the light-emitting element can be reduced. These composite materials can be formed by co-evaporating a substance having a high hole-transport property and an acceptor substance. By forming the hole injection layer 701 using the composite material, hole injection from the first electrode 118 to the EL layer 120 is facilitated.

The organic compound used for the composite material is preferably a substance having a hole mobility of 10 ⁻⁶ cm ² / Vs or higher. Note that other than these substances, any substance that has a property of transporting more holes than electrons may be used. Below, the organic compound which can be used for a composite material is listed concretely.

Examples of organic compounds that can be used for the composite material include TDATA and MTDATA.
, DPAB, DNTPD, DPA3B, PCzPCA1, PCzPCA2, PCzPCN
1,4,4′-bis [N- (1-naphthyl) -N-phenylamino] biphenyl (abbreviation:
NPB or α-NPD), N, N′-bis (3-methylphenyl) -N, N′-diphenyl- [1,1′-biphenyl] -4,4′-diamine (abbreviation: TPD), 4- Phenyl-
4 ′-(9-phenylfluoren-9-yl) triphenylamine (abbreviation: BPAFLP)
) And the like, and 4,4′-di (N-carbazolyl) biphenyl (abbreviation: C
BP), 1,3,5-tris [4- (N-carbazolyl) phenyl] benzene (abbreviation: T
CPB), 9- [4- (10-phenyl-9-anthryl) phenyl] -9H-carbazole (abbreviation: CzPA), 9-phenyl-3- [4- (10-phenyl-9-anthryl) phenyl]- A carbazole derivative such as 9H-carbazole (abbreviation: PCzPA), 1,4-bis [4- (N-carbazolyl) phenyl] -2,3,5,6-tetraphenylbenzene can be used.

In addition, 2-tert-butyl-9,10-di (2-naphthyl) anthracene (abbreviation: t-
BuDNA), 2-tert-butyl-9,10-di (1-naphthyl) anthracene, 9
, 10-bis (3,5-diphenylphenyl) anthracene (abbreviation: DPPA), 2-t
ert-Butyl-9,10-bis (4-phenylphenyl) anthracene (abbreviation: t-B)
uDBA), 9,10-di (2-naphthyl) anthracene (abbreviation: DNA), 9,10-
Diphenylanthracene (abbreviation: DPAnth), 2-tert-butylanthracene (
Abbreviations: t-BuAnth), 9,10-bis (4-methyl-1-naphthyl) anthracene (abbreviation: DMNA), 9,10-bis [2- (1-naphthyl) phenyl] -2-tert
-Aromatic hydrocarbon compounds such as butylanthracene, 9,10-bis [2- (1-naphthyl) phenyl] anthracene, 2,3,6,7-tetramethyl-9,10-di (1-naphthyl) anthracene Can be used.

Furthermore, 2,3,6,7-tetramethyl-9,10-di (2-naphthyl) anthracene,
9,9′-bianthryl, 10,10′-diphenyl-9,9′-bianthryl, 10,
10′-bis (2-phenylphenyl) -9,9′-bianthryl, 10,10′-bis [(2,3,4,5,6-pentaphenyl) phenyl] -9,9′-bianthryl, anthracene , Tetracene, rubrene, perylene, 2,5,8,11-tetra (tert-butyl) perylene, pentacene, coronene, 4,4′-bis (2,2-diphenylvinyl)
Biphenyl (abbreviation: DPVBi), 9,10-bis [4- (2,2-diphenylvinyl)
An aromatic hydrocarbon compound such as phenyl] anthracene (abbreviation: DPVPA) can be used.

Moreover, high molecular compounds, such as PVK, PVTPA, PTPDMA, and Poly-TPD, can be used.

Examples of the electron acceptor include organic compounds such as 7,7,8,8-tetracyano-2,3,5,6-tetrafluoroquinodimethane (abbreviation: F ₄ -TCNQ), chloranil, and transition metal oxides. Can be mentioned. In addition, oxides of metals belonging to Groups 4 to 8 in the periodic table can be given. Specifically, vanadium oxide, niobium oxide, tantalum oxide, chromium oxide, molybdenum oxide, tungsten oxide, manganese oxide, and rhenium oxide are preferable because of their high electron accepting properties. Among them, molybdenum oxide is stable in the air and has low hygroscopicity.
It is particularly preferable because it is easy to handle.

The hole-transport layer 702 is a layer that contains a substance having a high hole-transport property. As a substance having a high hole-transport property, for example, NPB, TPD, BPAFLP, 4,4′-bis [N- (9,9-dimethylfluoren-2-yl) -N-phenylamino] biphenyl (abbreviation: DFLDPBi) )
An aromatic amine compound such as 4,4′-bis [N- (spiro-9,9′-bifluoren-2-yl) -N-phenylamino] biphenyl (abbreviation: BSPB) can be used.
The substances described here are mainly substances having a hole mobility of 10 ⁻⁶ cm ² / Vs or higher.
Note that other than these substances, any substance that has a property of transporting more holes than electrons may be used.

The hole transport layer 702 includes carbazole derivatives such as CBP, CzPA, and PCzPA, anthracene derivatives such as t-BuDNA, DNA, and DPAnth, PVK,
High molecular compounds such as PVTPA, PTPDMA, and Poly-TPD can also be used.

The light-emitting layer 703 can be formed using a fluorescent compound that emits fluorescence or a phosphorescent compound that emits phosphorescence.

As a fluorescent compound that can be used for the light-emitting layer 703, for example, N, N′-bis [4- (9H-carbazol-9-yl) phenyl] -N, N′— can be used as a blue light-emitting material.
Diphenylstilbene-4,4′-diamine (abbreviation: YGA2S), 4- (9H-carbazol-9-yl) -4 ′-(10-phenyl-9-anthryl) triphenylamine (
Abbreviations: YGAPA), 4- (10-phenyl-9-anthryl) -4 ′-(9-phenyl-9H-carbazol-3-yl) triphenylamine (abbreviation: PCBAPA), and the like. As green light-emitting materials, N- (9,10-diphenyl-2-anthryl) -N, 9-diphenyl-9H-carbazol-3-amine (abbreviation: 2PCAPA),
N- [9,10-bis (1,1′-biphenyl-2-yl) -2-anthryl] -N, 9
-Diphenyl-9H-carbazol-3-amine (abbreviation: 2PCABPhA), N- (9
, 10-diphenyl-2-anthryl) -N, N ′, N′-triphenyl-1,4-phenylenediamine (abbreviation: 2DPAPA), N- [9,10-bis (1,1′-biphenyl-2) -Yl) -2-anthryl] -N, N ′, N′-triphenyl-1,4-phenylenediamine (abbreviation: 2DPABPhA), N- [9,10-bis (1,1′-biphenyl-)
2-yl)]-N- [4- (9H-carbazol-9-yl) phenyl] -N-phenylanthracen-2-amine (abbreviation: 2YGABPhA), N, N, 9-triphenylanthracen-9-amine (Abbreviation: DPhAPhA). Further, as a yellow light emitting material, rubrene, 5,12-bis (1,1′-biphenyl-4-yl) -6,11
-Diphenyltetracene (abbreviation: BPT) etc. are mentioned. As a red light emitting material, N, N, N ′, N′-tetrakis (4-methylphenyl) tetracene-5,11-
Diamine (abbreviation: p-mPhTD), 7,14-diphenyl-N, N, N ′, N′-tetrakis (4-methylphenyl) acenaphtho [1,2-a] fluoranthene-3,10-diamine (abbreviation: p-mPhAFD) and the like.

Examples of phosphorescent compounds that can be used for the light-emitting layer 703 include bis [2- (4 ′, 6′-difluorophenyl) pyridinato-N, C ^{2 ′} ] as a blue light-emitting material.
Iridium (III) tetrakis (1-pyrazolyl) borate (abbreviation: FIr6), bis [2- (4 ′, 6′-difluorophenyl) pyridinato-N, C ^{2 ′} ] iridium (II
I) picolinate (abbreviation: FIrpic), bis {2- [3 ′, 5′-bis (trifluoromethyl) phenyl] pyridinato-N, C ^{2 ′} } iridium (III) picolinate (abbreviation: Ir (CF ₃ ppy) ₂ (pic)), bis [2- (4 ′, 6′-difluorophenyl) pyridinato-N, C ^{2 ′} ] iridium (III) acetylacetonate (abbreviation: FI
r (acac)). Further, as a green light-emitting material, tris (2-phenylpyridinato-N, C ^{2 ′} ) iridium (III) (abbreviation: Ir (ppy) ₃ ), bis (2-phenylpyridinato-N, C ^{2 '} ) Iridium (III) acetylacetonate (
Abbreviations: Ir (ppy) ₂ (acac)), bis (1,2-diphenyl-1H-benzimidazolato) iridium (III) acetylacetonate (abbreviation: Ir (pbi) ₂ (ac
ac)), bis (benzo [h] quinolinato) iridium (III) acetylacetonate (abbreviation: Ir (bzq) ₂ (acac)), tris (benzo [h] quinolinato) iridium (III) (abbreviation: Ir (bzq ₃ ) and the like. Further, as a yellow light-emitting material, bis (2,4-diphenyl-1,3-oxazolate-N, C ^{2 ′} ) iridium (I
II) Acetylacetonate (abbreviation: Ir (dpo) ₂ (acac)), bis [2- (4
'-Perfluorophenylphenyl) pyridinato] iridium (III) acetylacetonate (abbreviation: Ir (p-PF-ph) ₂ (acac)), bis (2-phenylbenzothiazolate-N, C ^{2 ′} ) iridium (III) Acetylacetonate (abbreviation: Ir (bt
) ₂ (acac)), (acetylacetonato) bis [2,3-bis (4-fluorophenyl) -5-methylpyrazinato] iridium (III) (abbreviation: Ir (Fdppr-Me))
₂ (acac)), (acetylacetonato) bis {2- (4-methoxyphenyl) -3,
5-dimethylpyrazinato} iridium (III) (abbreviation: Ir (dmmoppr) ₂ (a
cac)) and the like. As an orange light-emitting material, tris (2-phenylquinolinato-N, C ^{2 ′} ) iridium (III) (abbreviation: Ir (pq) ₃ ), bis (2-phenylquinolinato-N, C ^{2 ′} ) Iridium (III) acetylacetonate (abbreviation: I)
r (pq) ₂ (acac)), (acetylacetonato) bis (3,5-dimethyl-2-phenylpyrazinato) iridium (III) (abbreviation: Ir (mppr-Me) ₂ (acac
)), (Acetylacetonato) bis (5-isopropyl-3-methyl-2-phenylpyrazinato) iridium (III) (abbreviation: Ir (mppr-iPr) ₂ (acac)), and the like. As a red light emitting material, bis [2- (2′-benzo [4,5-α]
] Thienyl) pyridinato-N, C ^{3 ′} ] Iridium (III) acetylacetonate (abbreviation: Ir (btp) ₂ (acac)), bis (1-phenylisoquinolinato-N, C ^{2 ′}
) Iridium (III) acetylacetonate (abbreviation: Ir (piq) ₂ (acac))
, (Acetylacetonato) bis [2,3-bis (4-fluorophenyl) quinoxalinato] iridium (III) (abbreviation: Ir (Fdpq) ₂ (acac)), (acetylacetonato) bis (2,3,5 -Triphenylpyrazinato) iridium (III) (abbreviation: Ir
(Tppr) ₂ (acac)), (dipivaloylmethanato) bis (2,3,5-triphenylpyrazinato) iridium (III) (abbreviation: Ir (tppr) ₂ (dpm)), 2,
And organometallic complexes such as 3,7,8,12,13,17,18-octaethyl-21H, 23H-porphyrin platinum (II) (abbreviation: PtOEP). Tris (acetylacetonato) (monophenanthroline) terbium (III) (abbreviation: Tb (acac
₃ (Phen)), tris (1,3-diphenyl-1,3-propanedionate) (monophenanthroline) europium (III) (abbreviation: Eu (DBM) ₃ (Phen)),
Rare earth metal complexes such as tris [1- (2-thenoyl) -3,3,3-trifluoroacetonato] (monophenanthroline) europium (III) (abbreviation: Eu (TTA) ₃ (Phen)) Because it has light emission (electron transition between different multiplicity) from ions,
It can be used as a phosphorescent compound.

Note that the light-emitting layer 703 may have a structure in which the above-described light-emitting organic compound (light-emitting substance or guest material) is dispersed in another substance (host material). Various host materials can be used, and it is preferable to use a substance having a lowest lowest orbital level (LUMO level) and a lower highest occupied orbital level (HOMO level) than the guest material. .

As the host material, specifically, tris (8-quinolinolato) aluminum (III)
(Abbreviation: Alq), tris (4-methyl-8-quinolinolato) aluminum (III) (
Abbreviations: Almq ₃ ), bis (10-hydroxybenzo [h] quinolinato) beryllium (I
I) (abbreviation: BeBq ₂ ), bis (2-methyl-8-quinolinolato) (4-phenylphenolato) aluminum (III) (abbreviation: BAlq), bis (8-quinolinolato) zinc (
II) (abbreviation: Znq), bis [2- (2-benzoxazolyl) phenolato] zinc (I
I) (abbreviation: ZnPBO), bis [2- (2-benzothiazolyl) phenolato] zinc (I
I) Metal complexes such as (abbreviation: ZnBTZ), 2- (4-biphenylyl) -5- (4-te
rt-butylphenyl) -1,3,4-oxadiazole (abbreviation: PBD), 1,3-bis [5- (p-tert-butylphenyl) -1,3,4-oxadiazole-2- Yl] benzene (abbreviation: OXD-7), 3- (4-biphenylyl) -4-phenyl-5- (4
-Tert-butylphenyl) -1,2,4-triazole (abbreviation: TAZ), 2,2 '
, 2 ″-(1,3,5-benzenetriyl) tris (1-phenyl-1H-benzimidazole) (abbreviation: TPBI), bathophenanthroline (abbreviation: BPhen), bathocuproin (abbreviation: BCP), etc. Ring compounds, 9- [4- (10-phenyl-9-anthryl) phenyl] -9H-carbazole (abbreviation: CzPA), 3,6-diphenyl-
9- [4- (10-phenyl-9-anthryl) phenyl] -9H-carbazole (abbreviation: DPCzPA), 9,10-bis (3,5-diphenylphenyl) anthracene (abbreviation: DPPA), 9,10- Di (2-naphthyl) anthracene (abbreviation: DNA), 2-te
rt-butyl-9,10-di (2-naphthyl) anthracene (abbreviation: t-BuDNA),
9,9′-bianthryl (abbreviation: BANT), 9,9 ′-(stilbene-3,3′-diyl) diphenanthrene (abbreviation: DPNS), 9,9 ′-(stilbene-4,4′-diyl) Diphenanthrene (abbreviation: DPNS2), 3,3 ′, 3 ″-(benzene-1,3,5
-Triyl) tripylene (abbreviation: TPB3), 9,10-diphenylanthracene (abbreviation: DPAnth), condensed aromatic compounds such as 6,12-dimethoxy-5,11-diphenylchrysene, N, N-diphenyl-9- [ 4- (10-phenyl-9-anthryl) phenyl] -9H-carbazol-3-amine (abbreviation: CzA1PA), 4- (10-phenyl-9-anthryl) triphenylamine (abbreviation: DPhPA), N, 9 -Diphenyl-
N- [4- (10-phenyl-9-anthryl) phenyl] -9H-carbazole-3-
Amine (abbreviation: PCAPA), N, 9-diphenyl-N- {4- [4- (10-phenyl-9-anthryl) phenyl] phenyl} -9H-carbazol-3-amine (abbreviation: P
CAPBA), N- (9,10-diphenyl-2-anthryl) -N, 9-diphenyl-
9H-carbazol-3-amine (abbreviation: 2PCAPA), NPB (or α-NPD)
, Aromatic amine compounds such as TPD, DFLDPBi, and BSPB can be used.

A plurality of types of host materials can be used. For example, a substance that suppresses crystallization, such as rubrene, may be further added to suppress crystallization. Further, NPB, Alq, or the like may be further added in order to more efficiently transfer energy to the guest material.

With the structure in which the guest material is dispersed in the host material, crystallization of the light-emitting layer 703 can be suppressed. Further, concentration quenching due to the high concentration of the guest material can be suppressed.

For the light-emitting layer 703, a high molecular compound can be used. Specifically, poly (9,9-dioctylfluorene-2,7-diyl) (abbreviation: PFO) is used as a blue light-emitting material.
), Poly [(9,9-dioctylfluorene-2,7-diyl) -co- (2,5-dimethoxybenzene-1,4-diyl)] (abbreviation: PF-DMOP), poly {(9,9 -Dioctylfluorene-2,7-diyl) -co- [N, N'-di- (p-butylphenyl)
-1,4-diaminobenzene]} (abbreviation: TAB-PFH). Further, as a green light-emitting material, poly (p-phenylene vinylene) (abbreviation: PPV), poly [(9
, 9-Dihexylfluorene-2,7-diyl) -alt-co- (benzo [2,1,3
] Thiadiazole-4,7-diyl)] (abbreviation: PFBT), poly [(9,9-dioctyl-2,7-divinylenefluorenylene) -alt-co- (2-methoxy-5- (2-
Ethylhexyloxy) -1,4-phenylene)] and the like. As an orange to red light-emitting material, poly [2-methoxy-5- (2′-ethylhexoxy) -1,4-phenylenevinylene] (abbreviation: MEH-PPV), poly (3-butylthiophene-2, 5-
Diyl) (abbreviation: R4-PAT), poly {[9,9-dihexyl-2,7-bis (1-cyanovinylene) fluorenylene] -alt-co- [2,5-bis (N, N′-diphenylamino) ) -1,4-phenylene]}, poly {[2-methoxy-5- (2-ethylhexyloxy) -1,4-bis (1-cyanovinylenephenylene)]-alt-co- [2,5
-Bis (N, N′-diphenylamino) -1,4-phenylene]} (abbreviation: CN-PPV
-DPD).

In addition, by providing a plurality of light-emitting layers and making each layer have a different emission color, light emission of a desired color can be obtained as the entire light-emitting element. For example, in a light-emitting element having two light-emitting layers, a light-emitting element that emits white light as a whole of the light-emitting element by making the emission color of the first light-emitting layer and the emission color of the second light-emitting layer have a complementary relationship It is also possible to obtain The same applies to a light-emitting element having three or more light-emitting layers.

The electron transport layer 704 is a layer containing a substance having a high electron transport property. Examples of the substance having a high electron transporting property include metal complexes having a quinoline skeleton or a benzoquinoline skeleton, such as Alq, Almq ₃ , BeBq ₂ , and BAlq. In addition, bis [2- (2-hydroxyphenyl) benzoxazolate] zinc (abbreviation: Zn (BOX) ₂ ), bis [2- (2-hydroxyphenyl) benzothiazolate] zinc (abbreviation: Zn (BTZ) ₂ ) A metal complex having an oxazole-based or thiazole-based ligand such as can also be used. In addition to metal complexes, PBD, OXD-7, TAZ, BPhen, BCP, and the like can also be used. The substances mentioned here are mainly substances having an electron mobility of 10 ⁻⁶ cm ² / Vs or higher.

The electron injection layer 705 is a layer containing a substance having a high electron injection property. The electron injection layer 705 includes lithium, cesium, calcium, lithium fluoride, cesium fluoride, calcium fluoride,
An alkali metal such as lithium oxide, an alkaline earth metal, or a compound thereof can be used. Alternatively, a rare earth metal compound such as erbium fluoride can be used. Alternatively, a substance that forms the above-described electron transport layer 704 can be used.

Note that the hole injection layer 701, the hole transport layer 702, the light emitting layer 703, and the electron transport layer 704 described above are used.
The electron injection layer 705 can be formed by a method such as a vapor deposition method (including a vacuum vapor deposition method), an ink jet method, or a coating method.

A charge generation layer 709 illustrated in FIG. 6B can be formed using the above-described composite material. The charge generation layer 709 may have a stacked structure of a layer formed using a composite material and a layer formed using another material. In this case, as a layer made of another material, a layer containing an electron donating substance and a substance having a high electron transporting property, a layer made of a transparent conductive film, or the like can be used.

The composite material layer 708 illustrated in FIG. 6C can be formed using the above-described composite material in which an acceptor substance is contained in an organic compound with a high hole-transport property.

The electron injection buffer layer 706 includes electron injection of alkali metal, alkaline earth metal, rare earth metal, and compounds thereof (including oxides such as lithium oxide, halides, and carbonates such as lithium carbonate and cesium carbonate). It is possible to use a highly specific substance.

In the case where the electron injection buffer layer 706 is formed to include a substance having a high electron transporting property and a donor substance, the mass ratio with respect to the substance having a high electron transporting property is 0.001 or more and 0.1 or less. It is preferable to add the donor substance at the ratio of Note that donor materials include alkali metals, alkaline earth metals, rare earth metals, and compounds thereof (including oxides such as lithium oxide, halides, carbonates such as lithium carbonate and cesium carbonate), tetra An organic compound such as thianaphthacene (abbreviation: TTN), nickelocene, decamethyl nickelocene, or the like can also be used. In addition, as a substance having a high electron transport property, the electron transport layer 70 described above is used.
It can be formed using the same material as the material 4.

The electron relay layer 707 includes a substance having a high electron transporting property, and a LUM of the substance having a high electron transporting property.
The O level is formed so as to be between the LUMO level of the acceptor substance included in the composite material layer 708 and the LUMO level of the substance having a high electron transport property included in the electron transport layer 704.
In the case where the electron relay layer 707 includes a donor substance, the donor level of the donor substance is also the LUMO level of the acceptor substance included in the composite material layer 708 and the electron transport layer 70.
4 between the LUMO levels of substances having a high electron transporting property included in 4. As a specific value of the energy level, L of a substance having a high electron transporting property included in the electron relay layer 707 is used.
The UMO level is −5.0 eV or more, preferably −5.0 eV or more and −3.0 eV or less.

As the substance having a high electron-transport property included in the electron-relay layer 707, a phthalocyanine-based material or a metal complex having a metal-oxygen bond and an aromatic ligand is preferably used.

Specific examples of the phthalocyanine-based material included in the electronic relay layer 707 include CuPc, S
nPc (Phthalocyanine tin (II) complex), ZnPc
(Phthalocyanine zinc complex), CoPc (Cobal
t (II) phthalocyanine, β-form), FePc (Phthal
ocyanine Iron) and PhO-VOPc (Vanadyl 2,9,16,
It is preferable to use any one of 23-tetraphenoxy-29H and 31H-phthalocyanine).

As the metal complex having a metal-oxygen bond and an aromatic ligand contained in the electron relay layer 707, a metal complex having a metal-oxygen double bond is preferably used. Since the metal-oxygen double bond has an acceptor property (a property of easily accepting electrons), it becomes easier to transfer (transfer) electrons.

As the metal complex having a metal-oxygen bond and an aromatic ligand, a phthalocyanine-based material is preferable. Specifically, VOPc (Vanadyl phthalocyanine), SnO
Pc (Phthalocyanine tin (IV) oxide complex)
, TiOPc (Phthalocyanine titanium oxide com
plex) is preferable because the metal-oxygen double bond is likely to act on other molecules in terms of molecular structure and has high acceptor properties.

In addition, as a phthalocyanine-type material mentioned above, what has a phenoxy group is preferable.
Specifically, a phthalocyanine derivative having a phenoxy group, such as PhO-VOPc, is preferable. A phthalocyanine derivative having a phenoxy group is soluble in a solvent. for that reason,
It has the advantage of being easy to handle in forming a light emitting element. Also, because it is soluble in solvents,
There is an advantage that maintenance of an apparatus used for film formation becomes easy.

The electron relay layer 707 may further contain a donor substance. As a donor substance,
In addition to alkali metals, alkaline earth metals, rare earth metals and their compounds (including oxides such as lithium oxide, halides, carbonates such as lithium carbonate and cesium carbonate), TTN, nickelocene, decamethyl nickelocene, etc. Organic compounds can be used. By including these donor substances in the electron relay layer 707, the movement of electrons becomes easy, and the light-emitting element can be driven at a lower voltage.

In the case where the electron-relay layer 707 includes a donor substance, examples of the substance having a high electron-transport property include a substance having a LUMO level higher than the acceptor level of the acceptor substance included in the composite material layer 708 as the above-described material. Can be used. As a specific energy level, it is preferable to use a substance having an LUMO level in a range of −5.0 eV or more, preferably −5.0 eV or more and −3.0 eV or less. Examples of such substances include perylene derivatives and nitrogen-containing condensed aromatic compounds. Note that a nitrogen-containing condensed aromatic compound is a preferable material as a material used for forming the electron relay layer 707 because it is stable.

Specific examples of the perylene derivative include 3,4,9,10-perylenetetracarboxylic dianhydride (abbreviation: PTCDA), 3,4,9,10-perylenetetracarboxylic bisbenzimidazole (abbreviation: PTCBI), N, N′-dioctyl-3,4,9,10-perylenetetracarboxylic acid diimide (abbreviation: PTCDI-C8H), N, N′-dihexyl-
3,4,9,10-perylenetetracarboxylic acid diimide (abbreviation: Hex PTC) and the like can be given.

Specific examples of the nitrogen-containing condensed aromatic compound include pyrazino [2,3-f] [1,10].
Phenanthroline-2,3-dicarbonitrile (abbreviation: PPDN), 2, 3, 6, 7, 1
0,11-hexacyano-1,4,5,8,9,12-hexaazatriphenylene (abbreviation: HAT (CN) ₆ ), 2,3-diphenylpyrido [2,3-b] pyrazine (abbreviation: 2P)
YPR), 2,3-bis (4-fluorophenyl) pyrido [2,3-b] pyrazine (abbreviation: F2PYPR), and the like.

In addition, 7,7,8,8-tetracyanoquinodimethane (abbreviation: TCNQ), 1,4,
5,8-naphthalenetetracarboxylic dianhydride (abbreviation: NTCDA), perfluoropentacene, copper hexadecafluorophthalocyanine (abbreviation: F ₁₆ CuPc), N, N′-bis (2,2,3,3,4) 4,5,5,6,6,7,7,8,8,8-pentadecafluorooctyl) -1,4,5,8-naphthalenetetracarboxylic acid diimide (abbreviation: NTCD)
I-C8F), 3 ′, 4′-dibutyl-5,5 ″ -bis (dicyanomethylene) -5,5
'' -Dihydro-2,2 ′: 5 ′, 2 ″ -terthiophene) (abbreviation: DCMT), methanofullerene (eg, [6,6] -phenyl C ₆₁ butyric acid methyl ester) and the like can be used. .

Note that in the case where the electron-relay layer 707 includes a donor substance, the electron-relay layer 707 may be formed by a method such as co-evaporation of a substance having a high electron-transport property and a donor substance.

Through the above steps, the EL layer of this embodiment can be manufactured.

This embodiment can be freely combined with any of the other embodiments.

(Embodiment 5)
In this embodiment, examples of various electronic devices and lighting devices completed using the light-emitting device of one embodiment of the present invention will be described with reference to FIGS.

In the light-emitting device of one embodiment of the present invention, deterioration of the organic EL element can be suppressed, and the lower electrode and the upper electrode are hardly short-circuited. Therefore, by using the light-emitting device of one embodiment of the present invention, a highly reliable electronic device and lighting device can be realized.

As electronic devices to which the light-emitting device is applied, for example, a television set (also referred to as a television or a television receiver), a monitor for a computer, a digital camera, a digital video camera, a digital photo frame, a mobile phone (a mobile phone, a mobile phone) Also referred to as a telephone device), portable game machines, portable information terminals, sound reproduction devices, large game machines such as pachinko machines, and the like. Specific examples of these electronic devices and lighting fixtures are shown in FIGS.

FIG. 7A illustrates an example of a television device. In the television device 7100, a display portion 7103 is incorporated in a housing 7101. Images can be displayed on the display portion 7103, and the light-emitting device of one embodiment of the present invention can be used for the display portion 7103. By using the light-emitting device of one embodiment of the present invention for the display portion 7103, a highly reliable television device can be realized. Further, here, the housing 7101 is provided by the stand 7105.
The structure which supported is shown.

The television device 7100 can be operated with an operation switch included in the housing 7101 or a separate remote controller 7110. Channels and volume can be operated with an operation key 7109 provided in the remote controller 7110, and an image displayed on the display portion 7103 can be operated. The remote controller 7110 may be provided with a display portion 7107 for displaying information output from the remote controller 7110.

Note that the television device 7100 is provided with a receiver, a modem, and the like. General TV broadcasts can be received by a receiver, and connected to a wired or wireless communication network via a modem, so that it can be unidirectional (sender to receiver) or bidirectional (sender and receiver). It is also possible to perform information communication between each other or between recipients).

FIG. 7B illustrates a computer, which includes a main body 7201, a housing 7202, a display portion 7203, a keyboard 7204, an external connection port 7205, a pointing device 7206, and the like.
Note that the computer is manufactured using the light-emitting device of one embodiment of the present invention for the display portion 7203. By using the light-emitting device of one embodiment of the present invention for the display portion 7203, a highly reliable computer can be realized.

FIG. 7C illustrates a portable game machine which includes two housings, a housing 7301 and a housing 7302, which are connected with a joint portion 7303 so that the portable game machine can be opened or folded. A display portion 7 is provided in the housing 7301.
304 is incorporated, and a display portion 7305 is incorporated in the housing 7302. In addition, FIG.
In addition, a portable game machine shown in (C) includes a speaker portion 7306, a recording medium insertion portion 7307,
LED lamp 7308, input means (operation key 7309, connection terminal 7310, sensor 731
1 (force, displacement, position, velocity, acceleration, angular velocity, rotation speed, distance, light, liquid, magnetism, temperature, chemical, voice, time, hardness, electric field, current, voltage, power, radiation, flow rate, humidity, Gradient, vibration,
Including a function of measuring odor or infrared rays), a microphone 7312) and the like. Of course, the structure of the portable game machine is not limited to the above, and at least the display portion 730 is used.
The light-emitting device of one embodiment of the present invention may be used for both the display portion 4305 and the display portion 7305, or one of them, and a structure in which other accessory equipment is appropriately provided can be employed. By using the light-emitting device of one embodiment of the present invention for the display portion 7304 and / or the display portion 7305, a highly reliable portable game machine can be realized. The portable game machine shown in FIG. 7C shares information by reading a program or data recorded in a recording medium and displaying the program or data on a display unit, or by performing wireless communication with another portable game machine. It has a function. Note that the portable game machine illustrated in FIG. 7C is not limited to this, and can have a variety of functions.

FIG. 7D illustrates an example of a mobile phone. A mobile phone 7400 is provided with a display portion 7402 incorporated in a housing 7401, operation buttons 7403, an external connection port 7404, a speaker 7405, a microphone 7406, and the like. Note that the cellular phone 7400 is manufactured using the light-emitting device of one embodiment of the present invention for the display portion 7402. By using the light-emitting device of one embodiment of the present invention for the display portion 7402, a highly reliable mobile phone can be realized.

Information can be input to the cellular phone 7400 illustrated in FIG. 7D by touching the display portion 7402 with a finger or the like. Also, operations such as making a phone call or composing an email
This can be performed by touching the display portion 7402 with a finger or the like.

There are mainly three screen modes of the display portion 7402. The first mode is a display mode mainly for displaying an image. The first is a display mode mainly for displaying images, and the second is an input mode mainly for inputting information such as characters. The third is a display + input mode in which the display mode and the input mode are mixed.

For example, when making a call or creating a mail, the display portion 7402 may be set to a character input mode mainly for inputting characters, and an operation for inputting characters displayed on the screen may be performed. In this case, it is preferable to display a keyboard or number buttons on most of the screen of the display portion 7402.

In addition, by providing a detection device having a sensor for detecting inclination, such as a gyroscope or an acceleration sensor, in the mobile phone 7400, the orientation (vertical or horizontal) of the mobile phone 7400 is determined, and the screen display of the display portion 7402 is displayed. Can be switched automatically.

Further, the screen mode is switched by touching the display portion 7402 or operating the operation button 7403 of the housing 7401. Further, switching can be performed depending on the type of image displayed on the display portion 7402. For example, if the image signal to be displayed on the display unit is moving image data, the mode is switched to the display mode, and if it is text data, the mode is switched to the input mode.

Further, in the input mode, when a signal detected by the optical sensor of the display unit 7402 is detected and there is no input by a touch operation of the display unit 7402 for a certain period, the screen mode is switched from the input mode to the display mode. You may control.

The display portion 7402 can function as an image sensor. For example, the display unit 74
The user can be authenticated by touching 02 with a palm or a finger and capturing an image of a palm print, a fingerprint, or the like. In addition, if a backlight that emits near-infrared light or a sensing light source that emits near-infrared light is used for the display portion, finger veins, palm veins, and the like can be imaged.

FIG. 7E illustrates a table lamp, which includes a lighting unit 7501, an umbrella 7502, a variable arm 7503,
A support 7504, a stand 7505, and a power source 7506 are included. Note that the desk lamp is manufactured using the light-emitting device of one embodiment of the present invention for the lighting portion 7501. By using the light-emitting device of one embodiment of the present invention for the lighting portion 7501, a highly reliable desk lamp can be realized. Note that the lighting fixture includes a ceiling-fixed lighting fixture or a wall-mounted lighting fixture.

FIG. 8 illustrates an example in which the light-emitting device of one embodiment of the present invention is used for an indoor lighting device 811. Since the light-emitting device of one embodiment of the present invention can have a large area, it can be used for a lighting device having a large area. In addition, it can also be used as a roll-type lighting device 812. Note that, as shown in FIG. 8, the desk lamp 813 described in FIG.
May be used in combination.

9A and 9B illustrate a tablet terminal that can be folded in half. FIG. 9A illustrates an open state in which the tablet terminal includes a housing 9630, a display portion 9631a, a display portion 9631b, a display mode switching switch 9034, a power switch 9035, a power saving mode switching switch 9036, and a fastener 9033. And an operation switch 9038.

Part of the display portion 9631 a can be a touch panel region 9632 a and data can be input when a displayed operation key 9037 is touched. The display portion 963
In 1a, as an example, a configuration in which half of the region has a display-only function and a configuration in which the remaining half of the region has a touch panel function is shown, but the configuration is not limited thereto. Display unit 96
All the regions 31a may have a touch panel function. For example, the display unit 9
Keyboard buttons can be displayed on the entire surface of 631a to form a touch panel, and the display portion 9631b can be used as a display screen.

Further, in the display portion 9631b, as in the display portion 9631a, part of the display portion 9631b can be a touch panel region 9632b. In addition, a keyboard button can be displayed on the display portion 9631b by touching a position where the keyboard display switching button 9639 on the touch panel is displayed with a finger, a stylus, or the like.

Touch input can be performed simultaneously on the touch panel region 9632a and the touch panel region 9632b.

A display mode switching switch 9034 can switch the display direction such as vertical display or horizontal display, and can select switching between monochrome display and color display. The power saving mode change-over switch 9036 can optimize the display luminance in accordance with the amount of external light during use detected by an optical sensor built in the tablet terminal. The tablet terminal may include not only an optical sensor but also other detection devices such as a gyroscope, an acceleration sensor, and other sensors that detect inclination.

9A illustrates an example in which the display areas of the display portion 9631a and the display portion 9631b are the same, but there is no particular limitation, and the size of one display portion and the size of the other display portion may be different. The display quality may also be different. For example, one display panel may be capable of displaying images with higher definition than the other.

FIG. 9B illustrates a closed state, in which the tablet terminal includes a housing 9630, a solar cell 963, and the like.
3, a charge / discharge control circuit 9634, a battery 9635, and a DCDC converter 9636 are included. Note that in FIG. 9B, as an example of the charge / discharge control circuit 9634, a battery 9635, D
A structure including the CDC converter 9636 is shown.

Note that since the tablet terminal can be folded in two, the housing 9630 can be closed when not in use. Accordingly, since the display portion 9631a and the display portion 9631b can be protected, a tablet terminal with excellent durability and high reliability can be provided from the viewpoint of long-term use.

In addition, the tablet type terminal shown in FIGS. 9A and 9B has various information (still images,
(Video, text image, etc.) display function, calendar, date or time display function, touch display function for touch input operation or editing of information displayed on the display unit, various software (programs) to control processing Can have functions, etc.

The solar cell 9633 mounted on the surface of the tablet terminal allows power to be supplied to the touch panel,
It can be supplied to a display unit, a video signal processing unit, or the like. Note that the solar battery 9633 includes:
It is preferable to provide the housing 9630 on one or two surfaces because the battery 9635 can be efficiently charged. Note that as the battery 9635, when a lithium ion battery is used, there is an advantage that reduction in size can be achieved.

The structure and operation of the charge / discharge control circuit 9634 illustrated in FIG. 9B are described with reference to a block diagram in FIG. FIG. 9C illustrates a solar cell 9633, a battery 9635,
The DCDC converter 9636, the converter 9637, the switches SW1 to SW3, and the display portion 9631 are illustrated. The battery 9635, the DCDC converter 9636, the converter 9637, and the switches SW1 to SW3 are included in the charge / discharge control circuit 963 illustrated in FIG.
This corresponds to 4.

First, an example of operation in the case where power is generated by the solar battery 9633 using external light is described.
DCD is used so that the power generated by the solar cell becomes a voltage for charging the battery 9635.
The C converter 9636 performs step-up or step-down. When power from the solar battery 9633 is used for the operation of the display portion 9631, the switch SW1 is turned on, and the converter 9
In 637, the voltage required for the display portion 9631 is increased or decreased. In the case where display on the display portion 9631 is not performed, the battery 9635 may be charged by turning off the switch SW1 and turning on the switch SW2.

Note that the solar cell 9633 is described as an example of the power generation unit, but is not particularly limited, and the battery 9635 is charged by another power generation unit such as a piezoelectric element (piezo element) or a thermoelectric conversion element (Peltier element). There may be. For example, it is good also as a structure performed combining a non-contact electric power transmission module which transmits / receives electric power by radio | wireless (non-contact), and another charging means.

As described above, an electronic device or a lighting fixture can be obtained by using the light-emitting device of one embodiment of the present invention. The application range of the light-emitting device of one embodiment of the present invention is so wide that the light-emitting device can be applied to electronic devices in various fields.

Note that the structure described in this embodiment can be combined with any of the structures described in the above embodiments as appropriate.

110 Semiconductor layer 112a Source electrode layer 112b Drain electrode layer 114 First insulating layer 116 Second insulating layer 118 First electrode 120 EL layer 120a First EL layer 120b Second EL layer 122 Second electrode 124 124a first layer 124b second layer 125 physical adsorption type desiccant 126 physical adsorption type desiccant 130 light emitting element 134 resin layer 134a first resin layer 134b second resin layer 135 mask 137 spacer 140a transistor 140b transistor 152 transistor 153 Transistor 164 Black matrix 166 Color filter 168 Overcoat layer 204 Partition 204a First layer 204b Second layer 214 Partition 214a First layer 214b Second layer 224 Partition 224a First layer 224b Second layer 234 Partition 234a 1 layer 234b second layer 244 partition 244a first layer 244b second layer 701 hole injection layer 702 hole transport layer 703 light emission layer 704 electron transport layer 705 electron injection layer 706 electron injection buffer layer 707 electron relay layer 708 Composite material layer 709 Charge generation layer 801 First substrate 802 Light emitting portion 803 Drive circuit portion 804 Drive circuit portion 805 Sealant 806 Second substrate 810 Space 811 Lighting device 812 Lighting device 813 Tabletop lighting device 7100 Television device 7101 Case 7103 Display portion 7105 Stand 7107 Display portion 7109 Operation key 7110 Remote controller 7201 Main body 7202 Case 7203 Display portion 7204 Keyboard 7205 External connection port 7206 Pointing device 7301 Case 7302 Case 7303 Connection portion 7304 Display portion 305 Display unit 7306 Speaker unit 7307 Recording medium insertion unit 7308 LED lamp 7309 Operation key 7310 Connection terminal 7311 Sensor 7312 Microphone 7400 Mobile phone 7401 Case 7402 Display unit 7403 Operation button 7404 External connection port 7405 Speaker 7406 Microphone 7501 Illumination unit 7502 Umbrella 7503 Variable arm 7504 Post 7505 Base 7506 Power supply 9033 Tool 9034 Switch 9035 Power switch 9036 Switch 9037 Operation key 9038 Operation switch 9630 Housing 9631a Display unit 9631b Display unit 9632a Region 9632b Region 9633 Solar cell 9634 Charge / discharge control circuit 9635 Battery 9636 DCDC converter 9637 Converter 9539 Button

Claims (2)

A light emitting portion in a space surrounded by the first substrate, the second substrate, and the sealing material;
A transistor on the first substrate;
An insulating layer on the transistor;
A first electrode on the insulating layer;
A partition wall covering an end of the first electrode;
An EL layer on the first electrode and on the partition;
A second electrode on the EL layer,
The transistor is electrically connected to the first electrode;
The partition has a first layer and a second layer covering the first layer,
The first layer includes a physical adsorption desiccant,
The second layer does not contain the physical adsorption desiccant,
The maximum particle size of the physical adsorption type desiccant, Ri film sum less than Der thick film thickness of the second layer than 1nm and the EL layer,
The first electrode, the light emitting device according to claim Rukoto to have a region in contact with said first layer and said second layer. In claim 1,
The maximum particle size of the physical adsorption desiccant is 1 nm or more and 300 nm or less.

Images