JP6484932B2 - Multilayer coil parts - Google Patents

Description

  The present invention relates to a laminated coil component.

  2. Description of the Related Art Conventionally, a multilayer coil component in which a coil is formed inside a multilayer body composed of a plurality of insulating layers is known as a kind of multilayer electronic component.

  For example, Patent Document 1 below discloses a laminated coil component in which two coils are arranged in parallel inside a laminated body. More specifically, there is disclosed a laminated coil component in which two one-turn coil patterns are formed on one insulating layer. A shield electrode pattern is formed as a coupling suppression pattern on the insulating layer on which the coil pattern is formed and on a plurality of insulating layers adjacent to the insulating layer vertically, and a magnetic field generated in the coil by the shield electrode pattern. The magnetic field generated in the coil is prevented from affecting each other. The laminated coil component is provided with capacitors arranged in the lamination direction with respect to the coil.

JP-A-8-316035

  However, the multilayer coil component according to the above-described prior art has the following problems.

  That is, since the shield electrode pattern is formed in the same layer as the coil pattern, the shield electrode pattern inhibits the distance between the coil patterns from being reduced, thereby preventing the miniaturization of the component. Moreover, if the coil pattern and the shield electrode pattern are brought close to the limit in order to reduce the size of the component, there is a concern of short-circuiting.

  The present invention has been made to solve the above problems, and an object of the present invention is to provide a laminated coil component that can be miniaturized.

  A laminated coil component according to an aspect of the present invention includes a laminated body in which a plurality of insulating layers are laminated, and a pair of coils arranged in a direction perpendicular to the lamination direction of the laminated body in the laminated body. A coil pattern constituting a pair of coils whose coil axes are parallel to the stacking direction of the laminate, and a coupling suppression pattern formed only in a different layer from the coil pattern.

  In such a laminated coil component, since the coupling suppression pattern is formed only in a layer different from the coil pattern, the coupling suppression pattern inhibits when the distance between the coil patterns constituting the pair of coils is shortened. In addition, the coil pattern and the coupling suppression pattern are not in electrical contact and short-circuited. Therefore, according to the laminated coil component described above, the distance between the coil patterns can be shortened, and as a result, the size can be reduced.

  Moreover, the aspect in which the coupling | bonding suppression pattern was formed only in one layer which is a different layer from a coil pattern may be sufficient. Thus, even with a single layer binding suppression pattern, a sufficient binding suppression effect can be obtained.

  Further, in the laminated body, a capacitor further provided side by side in the lamination direction with respect to the pair of coils is further provided, and the coupling suppression pattern is formed on the side opposite to the capacitor side with respect to the pair of coils in the lamination direction. It may be an embodiment. In this case, since the magnetic distribution of the coil is simple, the design of the laminated coil component is easy.

  Moreover, the aspect by which the coil was comprised by the coil pattern of multiple layers may be sufficient. In this case, the stacking deviation at the time of stacking the plurality of coil patterns is suppressed by the coupling suppression pattern.

  According to one aspect and various embodiments of the present invention, a multilayer coil component that is miniaturized is provided.

It is a schematic perspective view of the laminated coil component which concerns on one Embodiment. It is the II-II sectional view taken on the line of the laminated coil component shown in FIG. FIG. 2 is a plan view of the laminated coil component shown in FIG. 1. It is a disassembled perspective view which shows the layer structure of the laminated coil component shown in FIG. It is the figure which showed the equivalent circuit of the laminated coil component shown in FIG. It is sectional drawing of the laminated coil component figure of a different aspect. It is a disassembled perspective view which shows the layer structure of the laminated coil component shown in FIG. It is sectional drawing of the laminated coil component figure of a different aspect. It is sectional drawing of the laminated coil component figure of a different aspect. It is the figure which showed the filter characteristic of each sample. It is a figure explaining the lamination | stacking shift | offset | difference of an insulating layer.

  Hereinafter, embodiments will be described in detail with reference to the drawings. In the description, the same reference numerals are used for the same elements or elements having the same function, and redundant description is omitted.

  A laminated coil component 1 shown in FIGS. 1, 2, and 3 is an electronic component that functions as a filter. More specifically, the laminated coil component 1 is a three-terminal low-pass filter.

  The laminated coil component 1 includes a laminated body 10 having a rectangular parallelepiped shape, a pair of external electrode terminals 20 provided on opposite end surfaces 10 a of the laminated body 10, and a pair provided on opposite side surfaces 10 b of the laminated body 10. The ground electrode terminal 30 is provided. 1 to 3 are illustrated with the laminated coil component 1 turned upside down so that the state of the bottom surface 10c can be clearly understood. Are appropriately reversed so that the bottom surface 10c faces the mounting surface of the substrate.

  The laminated body 10 has a configuration in which a plurality of insulating layers are laminated, and the coil 40 and the capacitor 50 are formed by a predetermined internal electrode pattern formed between the insulating layers. The material constituting the insulating layer of the laminate is, for example, a forsterite dielectric or a titanium oxide composite dielectric, and the material constituting the internal electrode pattern is, for example, silver or copper.

  The coil 40 is composed of two coils 41 and 42, and these coils 41 and 42 are perpendicular to the stacking direction of the laminate 10 (the vertical direction in FIG. 2) (that is, the insulating layer extends). In the existing direction). The coil axes of the coils 41 and 42 are parallel to the stacking direction of the stacked body 10.

  The capacitor 50 is formed to overlap the coil 40 in the vertical direction in the stacking direction of the stacked body 10.

  In such a multilayer coil component 1, for example, as shown in FIG. 2, the capacitor 50 is positioned on the bottom surface 10 c side of the multilayer body 10 with respect to the coil 40, and the capacitor 50 is on the lower side (that is, the substrate side). In this way, it is mounted on a substrate (not shown).

  The external electrode terminal 20 and the ground electrode terminal 30 are formed by baking (for example, 600 to 700 ° C.) an electrode material on the end face and side face of the multilayer body 10. The material constituting the external electrode terminal 20 and the ground electrode terminal 30 is, for example, silver or copper. Each terminal of the external electrode terminal 20 and the ground electrode terminal 30 partially wraps around from the end surface 10a side of the laminate 10 to the bottom surface 10c side and the top surface 10d side.

  Hereinafter, the internal electrode pattern formed between the insulating layers will be described in more detail with reference to FIG.

  As shown in FIG. 4, the laminated body 10 is configured by laminating a plurality of rectangular insulating layers L1 to L14 having substantially the same dimensions. More specifically, the layer structure of the laminate 10 is, in order from the bottom, the outermost insulating layer L1, the coupling suppression layer L2, the coil layers L3 to L6, the via connection layers L7 and L8, the capacitor layers L9 to L13, and The outermost insulating layer L14 is laminated. In FIG. 4, broken lines extending vertically indicate the connection relationship between internal electrode patterns that overlap vertically, and these connections are realized by vias (not shown) that penetrate the insulating layer.

  The outermost insulating layer L1 is a layer in which insulating layers composed of a plurality of layers (three layers in FIG. 4) are stacked.

  The coupling suppression layer L2 is a layer in which a coupling suppression pattern P0 is formed. The coupling suppression pattern P0 is a strip pattern extending in a straight line along the short direction of the insulating layer L2. The coupling suppression pattern P0 extends along the short side direction of the insulating layer L2 at an intermediate position of the long side of the insulating layer L2, and both end portions thereof are exposed to the side surface 10b of the stacked body 10, and are connected to the ground electrode terminal 30 described above. Connected.

  In each of the coil layers L3 to L6, coil patterns P3 to P6 constituting the coil 40 described above are formed.

  The coil pattern P3 includes a pair of coil patterns (a first coil pattern P31 and a second coil pattern P32), and the first coil pattern P31 and the second coil pattern P32 are arranged in the longitudinal direction of the insulating layer L3. Along each other, they are separated by a predetermined distance. The first coil pattern P31 is formed over the entire region of one side in the longitudinal direction of the insulating layer L3, and the second coil pattern P32 is formed over the entire region of the other side in the longitudinal direction of the insulating layer L3. Is formed. And the 1st coil pattern P31 and the 2nd coil pattern P32 form the non-pattern area | region extended in a straight line along the transversal direction of the insulating layer L2 in the intermediate position regarding the long side direction of the insulating layer L3. So that they are separated. Each coil pattern P31, P32 has one end extending to the short side of the insulating layer L3, exposed to the end face 10a of the multilayer body 10, and connected to the external electrode terminal 20 described above.

  Similarly to the coil pattern P3, the coil pattern P4 also includes a pair of coil patterns (a first coil pattern P41 and a second coil pattern P42). The formation region of the first coil pattern P41 substantially overlaps the formation region of the first coil pattern P31 of the coil pattern P3, and the formation region of the second coil pattern P42 is the second coil of the coil pattern 3. It substantially overlaps with the formation region of the pattern P32. Also in the coil pattern P4, the first coil pattern P41 and the second coil pattern P42 are arranged at a predetermined distance along the longitudinal direction of the insulating layer L4 to form the non-pattern region.

  Similarly to the coil patterns P3 and P4, the coil pattern P5 also includes a pair of coil patterns (a first coil pattern P51 and a second coil pattern P52). The formation region of the first coil pattern P51 substantially overlaps the formation region of the first coil patterns P31 and P41 of the coil patterns P3 and P4, and the formation region of the second coil pattern P52 is the coil pattern 3, 4 substantially overlaps the formation region of the second coil patterns P32 and P42. Also in the coil pattern P5, the first coil pattern P51 and the second coil pattern P52 are arranged at a predetermined distance along the longitudinal direction of the insulating layer L5 to form the non-pattern region.

  The coil pattern P6 includes a pair of coil patterns (a first coil pattern P61 and a second coil pattern P62) and a coil connection pattern P63. The first coil pattern P61 and the second coil pattern P62 are: They are arranged along the longitudinal direction of the insulating layer L6, and are electrically connected via a coil connection pattern P63 located substantially at the center of the insulating layer L3.

  The first coil patterns P31, P41, P51, and P61 of the coil patterns P3 to P6 are connected with respect to the stacking direction via vias (not shown), whereby the coil 41 described above is configured. Similarly, the above-described coil 42 is configured by connecting the second coil patterns P32, P42, P52, and P62 of the coil patterns P3 to P6 with respect to the stacking direction via vias (not shown).

  In the via connection layers L7 and L8, via patterns P7 and P8 are formed at the center position of the insulating layer, that is, the position overlapping the coil connection pattern P63 of the coil pattern P6. These via patterns P7 and P8 are electrically connected to the coil connection pattern P63 of the coil pattern P6 by vias not shown.

  In each of the coil layers L3 to L6, coil patterns P3 to P6 constituting the coil 40 described above are formed.

  In each of the capacitor layers L9 to L13, capacitor patterns P9 to P13 that form the above-described capacitor 50 and cover substantially the entire area of the insulating layer are formed. The capacitor patterns P9 to P13 arranged in the stacking direction of the stacked body 10 are electrically connected as appropriate by vias (not shown).

  The capacitor pattern P9 includes a counter electrode pattern P91 and a via pattern P92. The counter electrode pattern P91 is formed over substantially the entire area of the insulating layer L9. Further, a part of the counter electrode pattern P91 extends to the end portion on the long side side at the middle position of the long side of the insulating layer L9, is exposed to the side surface 10b of the stacked body 10, and is connected to the ground electrode terminal 30 described above. The The via pattern P92 is formed at the center position of the insulating layer, that is, the position overlapping the coil connection pattern P63 of the coil pattern P6. The via pattern P92 is electrically insulated from the counter electrode pattern P91 by a non-pattern region formed around the via pattern P92.

  The capacitor pattern P10 is configured only by the counter electrode pattern that faces the counter electrode pattern P91 of the capacitor pattern P9 described above.

  The capacitor pattern P11 includes a counter electrode pattern P111 and a via pattern P112. The capacitor pattern P11 is the same pattern as the capacitor pattern P9, and the counter electrode pattern P111 and the via pattern P112 of the capacitor pattern P11 correspond to the counter electrode pattern P91 and the via pattern P92 of the capacitor pattern P9, respectively. That is, also in the capacitor pattern P11, a part of the counter electrode pattern P111 extends to the end on the long side at the middle position of the long side of the insulating layer L11 and is exposed to the side surface 10b of the multilayer body 10, and the above-described ground Connected to the electrode terminal 30.

  The capacitor pattern P12 is composed only of the counter electrode pattern facing the counter electrode pattern P111 of the capacitor pattern P11 described above.

  Capacitor pattern P13 consists only of a counter electrode pattern, and this counter electrode pattern is formed over substantially the entire region of insulating layer L13. A part of the capacitor pattern P13 extends to the end portion on the long side at the middle position of the long side of the insulating layer L13, is exposed on the side surface 10b of the multilayer body 10, and is connected to the ground electrode terminal 30 described above.

  Like the outermost insulating layer L1, the outermost insulating layer L14 is a layer in which insulating layers composed of a plurality of layers (three layers in FIG. 4) are stacked.

  As described above, the laminated coil component 1 includes the coil 40 and the capacitor 50, and an equivalent circuit thereof is as shown in FIG. In FIG. 5, “IN / OUT” indicates connection to each external electrode terminal 20, and “GND” indicates connection to each ground electrode terminal 30.

  Hereinafter, the magnetic coupling between the two coils 41 and 42 in the laminated coil component 1 described above will be described.

  The coil 41 and the coil 42 that are arranged close to each other so that their coil axes are parallel to each other usually combine magnetic fluxes generated in each of them, thereby reducing element characteristics (for example, filter insertion loss). Therefore, in the laminated coil component 1, the coupling suppression pattern P <b> 0 described above is provided at a location where the magnetic flux of the coil 41 and the magnetic flux of the coil 42 pass, thereby realizing the suppression of the coupling of the magnetic flux.

  Here, from the viewpoint of suppressing the coupling between the magnetic flux of the coil 41 and the magnetic flux of the coil 42, the laminated coil component 1A having the configuration shown in FIGS.

  The laminated coil component 1A shown in FIGS. 6 and 7 is different from the laminated coil component 1 described above in the coil patterns P3 to P5 of the coil layers L3 to L5. That is, between the first coil patterns P31, P41, and P51 and the second coil patterns P32, P42, and P52, the coil patterns P3 ′ to P5 ′ in the coil layers L3 ′ to L5 ′ of the laminated coil component 1A In addition, the above-described coupling suppression pattern P0 is formed.

  Even in such a laminated coil component 1 </ b> A, the coupling between the magnetic flux of the coil 41 and the magnetic flux of the coil 42 can be suppressed as in the above-described laminated coil component 1.

  However, in the laminated coil component 1A, when the distance between the coil patterns P31, P32, P41, P42, P51, and P52 of the same layer constituting the coils 41 and 42 is shortened, the coupling suppression pattern P0 is inhibited. That is, since the coupling suppression pattern P0 exists in the same layer as the coil pattern, it is difficult to shorten the distance between the coil patterns to some extent. As a result, it is difficult to reduce the element dimensions of the laminated coil.

  In addition, in each of the coil layers L3 ′ to L5 ′ of the laminated coil component 1A, the first coil patterns P31, P41, P51 and the second coil patterns P32, P42, P52 are slightly misaligned during patterning. There is a risk of short circuit due to electrical contact with the coupling suppression pattern P0.

  On the other hand, in the laminated coil component 1 described above, the coupling suppression pattern P0 is formed in a layer different from the coil patterns P3 to P6 and is not formed in the same layer. When the distance between the coil patterns P31, P32, P41, P42, P51, and P52 of the layers is reduced, the coupling suppression pattern P0 does not inhibit. Therefore, according to the laminated coil component 1 described above, the distance between the coil patterns can be shortened, and as a result, the size can be reduced.

  Further, since the coupling suppression pattern P0 is formed in a layer different from the coil patterns P3 to P6 and is not formed in the same layer, the coil patterns P3 to P6 and the coupling suppression pattern P0 are in electrical contact with each other. There is no short circuit.

  The inventors prepared four samples (samples 1 to 4) in order to confirm the effect of suppressing the magnetic flux coupling of the laminated coil component 1 described above.

  Sample 1 is a sample having a configuration similar to that of the laminated coil component 1 described above. Sample 2 is a sample having the same configuration as the above-described laminated coil component 1A.

  The sample 3 is a sample having the same configuration as the laminated coil component 1B shown in FIG. The laminated coil component 1B is a laminated coil component having a configuration obtained by removing the coupling suppression pattern P0 from the laminated coil component 1 shown in FIGS. That is, in the laminated coil component 1B, the coupling suppression pattern P0 is not formed in the insulating layer (coupling suppression layer) L2 shown in FIG. 4, and the coupling suppression pattern P0 is also formed in the insulating layers (coil layers) L3 to L5. It has not been.

  Sample 4 is a sample having the same configuration as the laminated coil component 1 </ b> C shown in FIG. 9. The laminated coil component 1C is a laminated coil component having a configuration in which one coupling suppression pattern P0 closest to the upper surface 10d is removed from the laminated coil component 1A shown in FIGS. That is, in the laminated coil component 1C, the coupling suppression pattern P0 is not formed in the insulating layer (coupling suppression layer) L2 shown in FIG. 7, and the coupling suppression pattern P0 is formed in the insulating layers (coil layers) L3 ′ to L5 ′. Is formed.

  And about each sample 1-4, the insertion loss | S21 | (dB) of the filter which is an element characteristic relevant to magnetic flux coupling was calculated | required. The results were as shown in the graph of FIG.

  As apparent from the graph of FIG. 10, the sample 1 has sufficient filter characteristics at the same level as the sample 2 and the sample 4. As for the sample 3, since the coupling suppression pattern P0 does not exist, the filter characteristics are degraded as compared with the samples 1, 2, and 4.

  From this, it can be considered that the sample 1 suppresses the magnetic flux coupling at the same level as the sample 2 and the sample 4. In other words, even if the coupling suppression pattern P0 is formed in a single layer different from the coil pattern as in the sample 1, the coupling suppression pattern P0 is the coil pattern as in the sample 2 and the sample 4. The magnetic flux coupling is suppressed as in the case of being interposed therebetween.

  The inventors have found from this experiment that there is a high magnetic flux coupling suppression effect even when the coupling suppression pattern P0 is formed in only one layer on a layer different from the coil pattern. That is, the coupling suppression pattern P0 does not necessarily have to be formed in the same layer as the coil pattern, and the magnetic flux coupling can be sufficiently suppressed even when formed only in a layer different from the coil pattern.

  As described above, the laminated coil component 1 includes the laminated body 10 in which the plurality of insulating layers L1 to L14 are laminated, and the coil patterns of the insulating layers L3 to L6 that constitute the pair of coils 41 and 41 in the laminated body 10. P3-P6 and a coupling suppression pattern P0 formed only in the insulating layer L2 which is a different layer from the coil patterns P3-P6.

  In such a laminated coil component 1, since the coupling suppression pattern P0 is formed only in a different layer from the coil patterns P3 to P6, the coil patterns P31, P32, P41, which constitute the pair of coils 41, 42, When the distance between P42, P51, and P52 is reduced, the coupling suppression pattern P0 is not inhibited, and the coil patterns P3 to P6 and the coupling suppression pattern P0 are not in electrical contact and short-circuited. Therefore, according to the laminated coil component 1 described above, the distance between the coil patterns can be shortened, and as a result, the size can be reduced.

  And as above-mentioned, sufficient coupling | bonding suppression effect is acquired even if the coupling | bonding suppression pattern P0 is an aspect formed only in one layer.

  In the multilayer coil component 1, the coupling suppression pattern P <b> 0 is formed on the side opposite to the capacitor 50 side with respect to the pair of coils 41 and 42 in the stacking direction of the multilayer body 10. When the coupling suppression pattern P0 is formed in a layer different from the coil patterns P3 to P6, the formation positions are the capacitor 50 side (upper side in FIG. 2) with respect to the coils 41 and 42 and the opposite side (lower side in FIG. 2). Both). By forming the coupling suppression pattern P0 on the side opposite to the capacitor 50 side, the magnetic distribution of the coil 41 can be considered simply, and the design of the multilayer coil component 1 is facilitated. Further, as is clear from the cross-sectional view of FIG. 2, there are various patterns on the capacitor 50 side, but nothing on the opposite side, and an area for forming the coupling suppression pattern P0 can be easily secured. it can.

  Further, in the laminated coil component 1, the coil is composed of a plurality of layers of coil patterns P3 to P6. In this case, the above-described coupling suppression pattern P0 can suppress the lamination deviation. With reference to FIG. 11, the lamination | stacking shift | offset | difference of the insulating layers L3-L6 in which the coil patterns P3-P6 were formed is demonstrated.

  As described above, the insulating layer L3 on which the first coil pattern P31 and the second coil pattern are formed is overlaid on the insulating layer L2 on which the coupling suppression pattern P0 is formed. At this time, as shown in FIG. 11A, the non-pattern region between the first coil pattern P31 and the second coil pattern P32 is located at the position of the coupling suppression pattern P0 of the insulating layer L2. That is, the positional relationship is such that the coupling suppression pattern P0 of the insulating layer L2 is sandwiched from the left and right by the first coil pattern P31 and the second coil pattern P32 of the insulating layer L3. Therefore, as shown in FIG. 11B, in the state in which the insulating layer L3 is superimposed on the insulating layer L2, the coupling suppression pattern P0 functions as an anchor, and the insulating layer L3 has a lateral direction relative to the insulating layer L2. Movement is restrained. Therefore, even when coil patterns P41 and P42 similar to the coil patterns P31 and P32 are formed on the insulating layer L4 overlaid on the insulating layer L3, the insulating layer L3 is left and right with respect to the insulating layer L2. The shift in the direction is suppressed, and the stacking shift between the insulating layers L3 and L4 is suppressed.

  In addition, this invention is not limited to embodiment mentioned above, In the range which does not deviate from the summary of this invention, it can change variously.

  For example, the coupling suppression pattern is not limited to one layer and may be formed over a plurality of layers. Further, the shape of the coupling suppression pattern is not limited to a belt shape, and may be a circular shape or a polygonal shape.

  The number of coils arranged in parallel in the laminated body is not limited to two, and may be three or more. Further, the number of insulating layers constituting the laminated body, the coil pattern shape, and the like can be changed as appropriate. Furthermore, the laminated coil component is not limited to a filter including a capacitor, and may be another electronic component not including a capacitor.

  DESCRIPTION OF SYMBOLS 1 ... Laminated coil component, 10 ... Laminated body, 40 ... Coil, 50 ... Capacitor, L1-L13 ... Insulating layer, P0 ... Coupling suppression pattern, P3-P6 ... Coil pattern.

Claims (4)

A laminate in which a plurality of insulating layers are laminated;
A pair of coils arranged in a direction orthogonal to the stacking direction of the stacked body in the stacked body, wherein the coil axis of each coil is parallel to the stacking direction of the stacked body. Coil pattern,
The coil pattern is formed only in a separate layer, and includes a coupling suppression pattern positioned outside the pair of coils in the stacking direction ,
A laminated coil component having no internal electrode pattern between the coil pattern and the coupling suppression pattern with respect to the lamination direction.   The laminated coil component according to claim 1, wherein the coupling suppression pattern is formed only in one layer that is a different layer from the coil pattern. In the multilayer body, further comprising a capacitor provided side by side in the stacking direction with respect to the pair of coils,
The laminated coil component according to claim 1, wherein the coupling suppression pattern is formed on a side opposite to the capacitor side with respect to the pair of coils in the lamination direction.   The laminated coil component according to any one of claims 1 to 3, wherein the coil is configured by a plurality of coil patterns.

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