JP6485379B2 - Cutting simulation device - Google Patents

Description

  The present invention relates to a cutting simulation apparatus using voxels.

  2. Description of the Related Art A cutting simulation device (hereinafter referred to as “conventional device”) that simulates cutting of a material by a cutting machine using a voxel is known (see, for example, Patent Document 1).

JP 2008-287456 A

  In the conventional apparatus, voxels are set for the entire material to be machined (hereinafter referred to as “work material”), and the movement trajectory solid (hereinafter “ A cutting operation such as extraction of a voxel that overlaps the cutting portion trajectory solid) is performed. For this reason, a cutting operation is performed on whether or not the voxel that does not overlap the cutting portion trajectory solid overlaps the cutting portion trajectory solid. Therefore, the conventional apparatus performs useless cutting calculation, and the time required for cutting calculation becomes long.

  The present invention has been made to address the above-described problems. That is, one of the objects of the present invention is a cutting simulation device that simulates cutting using a voxel, and is a cutting simulation device (hereinafter referred to as “the device of the present invention”) that requires a short time for a cutting operation. Is to provide).

The apparatus of the present invention simulates cutting of a material by a cutting machine.
The device of the present invention
A voxel including the surface of the workpiece (50) that is the material to be cut is generated as a surface cell (S) (step 220),
A cutting part locus solid (60R) representing a movement locus of the cutting part (60) of the cutting machine during the cutting of the work material is generated (step 220),
Among the surface cells, a surface cell that overlaps with the cut portion locus solid is extracted as a cut cell (step 240),
A new voxel including a portion of the workpiece material adjacent to the cut cell is generated as a surface cell (step 240),
The extraction of the cut cell and the new generation of the surface cell are repeated until the cut cell is no longer extracted (step 240), and then the cut cell is deleted (step 250).
By repeatedly performing the extraction of the cut cell, the new generation of the surface cell, and the deletion of the cut cell for all the cut portion trajectory solids (until “Yes” is determined in Step 270), Simulate cutting of the workpiece.

  According to this, only voxels (surface cells) including the surface of the workpiece material are generated as the voxels representing the workpiece material. For this reason, there are few voxels used as the object of cutting calculation. Therefore, the time required for the simulation is shortened.

  In the above description, in order to help the understanding of the invention, the reference numerals used in the embodiments are attached to the configuration of the invention corresponding to the embodiments in parentheses, but each component of the invention is represented by the reference numerals. It is not limited to the embodiments specified.

FIG. 1 is a diagram showing a schematic configuration of a cutting simulation apparatus according to an embodiment of the present invention and a work material that is a material to be cut. FIG. 2 is a flowchart showing a simulation procedure of the cutting simulation device according to the present embodiment. FIG. 3 is a diagram for explaining generation of surface cells and boundary cells. FIG. 4 is a diagram for explaining a cutting operation of the cutting simulation device according to the present embodiment.

  Hereinafter, a cutting simulation apparatus according to an embodiment of the present invention (hereinafter referred to as “the present simulation apparatus”) will be described with reference to the drawings. This simulation apparatus is an apparatus that simulates cutting of a material by a cutting machine.

  As shown in FIG. 1, the simulation apparatus 10 includes an input device 20, a computer 30, and an output device 40.

  The input device 20 includes “data representing the shape of the work material 50 that is a material to be cut” by the operator of the simulation device 10, “data representing the shape of the cutting part 60 of the cutting tool of the cutting machine”, “Data representing the shape of a part other than the cutting tool of the cutting machine and the part of the cutting tool other than the cutting part 60 (hereinafter referred to as“ non-cutting part ”) 70”, “ “Data relating to the connection part” and “data relating to the movement locus of the cutting part 60 during the cutting process” are input.

  Data representing the shape of the work material 50 (hereinafter referred to as “work material shape data”) is data represented by polygons.

  Data representing the shape of the cutting part 60 (hereinafter referred to as “cutting part shape data”) and data representing the shape of the non-cutting part 70 (hereinafter referred to as “non-cutting part shape data”) are geometric. It is data expressed by academic shapes.

  Data relating to a connection part (hereinafter referred to as “connection part data”) between the components of the cutting machine is data relating to a position of the connection part, a constraint condition imposed on the connection part, and the like. The constraint condition is expressed by a one-axis vector, for example, when the connection part can rotate only around one axis.

  Data related to the movement trajectory of the cutting unit 60 during cutting (hereinafter referred to as “cutting unit trajectory data”) is expressed by the position of the tip of the cutting unit 60, the moving direction of the cutting unit 60, and the like.

  The computer 30 includes a memory 31 and a processor 32.

  The memory 31 stores “work material shape data, cutting part shape data, non-cutting part shape data, connection part data, and cutting part locus data” input to the input device 20 by the operator. Further, the memory 31 stores the results of interference calculation and cutting calculation described later performed by the processor 32. In addition, the memory 31 transmits the result of the interference calculation and the result of the cutting calculation to the output device 40 in response to the command of the processor 32.

  The processor 32 performs an interference calculation, a cutting calculation, and the like described later based on the data stored in the memory 31. Further, the processor 32 sends a command for causing the output device 40 to transmit the result of the interference calculation and the result of the cutting calculation from the memory 31 to the memory 31.

  The output device 40 outputs (displays) the results of the interference calculation and the cutting calculation transmitted from the memory 31 in response to the command of the processor 32.

  As a result of the interference calculation, the movement trajectory of the non-cutting part 70 that has interfered with the workpiece 50 (for example, the coordinates of the movement start position and the movement end position of the non-cutting part 70), and the non-interference that has interfered with the workpiece 50 There are names of the cutting parts 70 (for example, tools, holders, heads, and the like), parts of the work material 50 that interfere with the non-cutting parts 70 (for example, coordinates of the positions of the parts), and the like.

  As a result of the cutting calculation, there is a shape of the work material 50 finally obtained by cutting.

  By outputting the result of the interference calculation and the result of the cutting calculation by the output device 40, the operator can obtain the shape of the workpiece 50 finally obtained by the cutting and the workpiece 50 during the cutting. It is possible to know the non-cutting part 70 that interferes, the movement locus of the cutting part 60 in which the interference occurs, and the like.

  Next, the operation of the simulation apparatus will be described with reference to FIGS. When the simulation start operation is performed by the operator, the simulation apparatus 10 starts the simulation and performs the processing shown in FIG.

  When the simulation apparatus 10 starts the simulation, the processor 32 of the simulation apparatus 10 proceeds to step 210 and takes in the workpiece material shape data and the like stored in the memory 31.

  Next, the processor 32 proceeds to Step 220 to generate simulation data. More specifically, as shown in FIG. 3, the processor 32 includes a voxel (hereinafter referred to as “surface cell”) S including the surface of the workpiece 50 based on the workpiece shape data. Generate. Furthermore, the processor 32 has voxels (hereinafter referred to as “boundary cells”) on the surfaces of the six surfaces of each surface cell S that are not adjacent to the other surface cells S or the workpiece 50. B is generated. This boundary cell B does not include a portion of the workpiece material 50.

  In addition, the processor 32 passes when the cutting unit 60 moves for each movement locus (hereinafter referred to as “cutting portion locus”) of the cutting portion 60 based on the cutting portion shape data and the cutting portion locus data. A solid representing a space (hereinafter referred to as a “cutting portion locus solid”) is generated, and passes when the non-cutting portion 70 moves for each cutting portion locus based on the non-cutting portion data and the cutting portion locus data. A solid (hereinafter referred to as a “non-cutting portion trajectory solid”) is generated.

  Next, the processor 32 proceeds to Step 230 and performs an interference calculation on the m-th cutting part locus (cutting process). More specifically, the processor 32 extracts a surface cell S (hereinafter referred to as “interference cell”) that overlaps the non-cutting portion locus solid corresponding to the m-th cutting portion locus, and “extracted interference”. The memory 31 stores the “cell” and “the position and name of the non-cutting portion 70 that interferes with the interference cell”. Thereby, the interference calculation about the m-th cutting part locus is completed.

  The processor 32 sequentially extracts the interference cell, stores the extracted interference cell, and stores the position and name of the non-cutting portion 70 that interferes with the interference cell up to the N-th cutting portion trajectory as will be described later. . In this example, the initial value of m is “1”, and the N-th cutting portion locus is the last cutting portion locus in the cutting process. Accordingly, when the interference calculation for the N-th cutting portion trajectory is completed, the interference calculation for all the cutting portion trajectories is completed.

  Next, the processor 32 performs a cutting operation on the m-th cutting portion trajectory by sequentially performing the processes of Step 240 and Step 250. More specifically, in step 240, the processor 32 and the surface cell S (hereinafter referred to as “cut cell”) that overlaps with the cut portion trajectory solid corresponding to the m th cutting portion trajectory and the cut cell. , The boundary cell B (hereinafter referred to as “superimposition cell”) is extracted, the cut cell is changed (set) to the boundary cell, and the superposition cell is changed (set) to the erasure candidate cell.

  The processor 32 extracts the cut cells and the erase candidate cells, changes the cut cells to the boundary cells, and changes the superposed cells to the erase candidate cells, so that the cut cells and the superposed cells are not newly extracted. Repeat until

  When the cut cell and the superimposed cell are no longer extracted, the processor 32 proceeds to step 250 and erases the erase candidate cell (predetermined cell) that does not have the surface in contact with the surface cell S among the erase candidate cells. At the same time, the remaining erasure candidate cell is changed (set) to the boundary cell B. Thereby, the cutting calculation about the m-th cutting part locus is completed.

  The cutting operation described above (the processing of step 240 and step 250) will be described using the example shown in FIG.

  As shown in FIG. 4A, first, the surface cell S and the boundary cell B are generated based on the workpiece material shape data. In FIG. 4, reference numeral 50 </ b> R indicates “a solid representing the shape of the work material 50 (processed material solid)”, and reference numeral 60 </ b> R indicates a “cut portion locus solid”.

  As shown in FIG. 4B, when the cutting portion locus solid 60R overlaps the workpiece material solid 50R, the surface cell S (cutting) of the surface cell S and the boundary cell B that overlaps the cutting portion locus solid 60R. The boundary cell B (superimposed cell) adjacent to the finished cell and the cut cell is the surface cell s and the boundary cell b shown in FIG. Therefore, according to the simulation apparatus 10, as shown in FIG. 4D, the surface cell s (cut cell) is set as the boundary cell B, and the boundary cell b (superposed cell) is the erasure candidate cell C. Set to

  Further, as shown in FIG. 4E, among the six surfaces of the newly set boundary cell B, the surface that is not in contact with the erasure candidate cell C, the surface cell S, or the boundary cell B A surface cell S is newly generated. At this time, among the surface cell S and the boundary cell B, the surface cell S (cut cell) overlapping the cutting portion locus solid 60R and the boundary cell B (superimposed cell) adjacent to the cut cell are shown in FIG. The surface cell s and the boundary cell b shown in FIG. Therefore, according to the simulation apparatus 10, as shown in FIG. 4G, the surface cell s (cut cell) is set as the boundary cell B, and the boundary cell b (superposed cell) is the erasure candidate cell C. Set to

  Further, as shown in FIG. 4H, among the six surfaces of the newly set boundary cell B, the surface that is not in contact with the erasure candidate cell C, the surface cell S, or the boundary cell B A surface cell S is newly generated.

  At this time, there is no surface cell S that overlaps the cutting portion locus solid 60R. Therefore, according to the simulation apparatus 10, as shown in FIG. 4I, the erasure candidate cell C whose surface is not in contact with the surface cell S is erased. Finally, as shown in FIG. 4J, the remaining erasure candidate cell C is set as the boundary cell B.

  Thereby, the cutting calculation about one cutting part locus is completed. The above is an example of the cutting calculation in one cutting process.

  Referring to FIG. 2 again, after the processing of step 250, the processor 32 proceeds to step 260 and represents a value m (hereinafter referred to as "cutting portion trajectory number m") representing the order of the cutting portion trajectory. "Is incremented.

  Next, the processor 32 proceeds to step 270 and determines whether or not the cutting portion trajectory number m is larger than a value N representing the number of cutting portion trajectories included in the cutting process (hereinafter referred to as “total number of trajectories N”). Determine whether. If the cutting section trajectory number m is not equal to the total number of trajectories N, the processor 32 determines “No” in step 270 and returns to step 230 to perform interference calculation and cutting calculation for the next cutting section trajectory. Perform as described above.

  On the other hand, if the cutting section trajectory number m is equal to the total number of trajectories N, that is, if the interference calculation and the cutting calculation for all the cutting section trajectories have been completed, the processor 32 determines “Yes” in step 270. The process proceeds to step 280, and a command for transmitting the interference calculation result and the cutting calculation result from the memory 31 to the output device 40 is sent to the memory 31. As a result, the result of the interference calculation and the result of the cutting calculation are output (displayed) to the output device 40.

  The above is the simulation by the simulation apparatus 10, and according to this, only the voxel (surface cell S) including the surface of the workpiece material 50 is generated as the voxel representing the workpiece material 50. For this reason, there are few voxels used as the object of interference calculation and cutting calculation. Therefore, the time required for the simulation is shortened.

  In addition, this invention is not limited to the said embodiment, A various modified example is employable within the scope of the present invention.

  For example, even if no border cell is set, if a position where a surface cell should be newly set can be specified, the setting of the border cell may be omitted.

DESCRIPTION OF SYMBOLS 10 ... Simulation apparatus, 20 ... Input device, 30 ... Computer, 40 ... Output device, S ... Surface cell, s ... Cut cell, B ... Boundary cell, b ... Overlapping cell, C ... Erase candidate cell

Claims (1)

In a cutting process simulation device that simulates cutting of materials by a cutting machine,
A voxel including a surface of a work material that is the material to be cut is generated as a surface cell,
Generating a cutting part locus solid representing a movement locus of the cutting part of the cutting machine during the cutting of the work material;
Of the surface cells, the surface cell that overlaps the cutting portion locus solid is extracted as a cut cell,
A new voxel including a portion of the workpiece material adjacent to the cut cell is generated as a surface cell,
The extraction of the cut cell and the new generation of the surface cell are repeated until the cut cell is no longer extracted (step 240), after which the cut cell is erased,
The cutting of the work material is simulated by repeatedly performing extraction of the cut cell, new generation of the surface cell, and erasure of the cut cell for all the cut portion trajectory solids,
Cutting simulation device.

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