JP6487066B2 - 特殊電気部品、プリント回路基板アセンブリ、及び電気器具を製造する方法 - Google Patents
特殊電気部品、プリント回路基板アセンブリ、及び電気器具を製造する方法 Download PDFInfo
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- JP6487066B2 JP6487066B2 JP2017554019A JP2017554019A JP6487066B2 JP 6487066 B2 JP6487066 B2 JP 6487066B2 JP 2017554019 A JP2017554019 A JP 2017554019A JP 2017554019 A JP2017554019 A JP 2017554019A JP 6487066 B2 JP6487066 B2 JP 6487066B2
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
- H05K1/184—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] associated with components inserted in holes through the PCBs and wherein terminals of the components are connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0338—Layered conductor, e.g. layered metal substrate, layered finish layer or layered thin film adhesion layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09854—Hole or via having special cross-section, e.g. elliptical
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10037—Printed or non-printed battery
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/1009—Electromotor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10742—Details of leads
- H05K2201/1075—Shape details
- H05K2201/10757—Bent leads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10742—Details of leads
- H05K2201/1075—Shape details
- H05K2201/10787—Leads having protrusions, e.g. for retention or insert stop
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10742—Details of leads
- H05K2201/1075—Shape details
- H05K2201/10818—Flat leads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10742—Details of leads
- H05K2201/1075—Shape details
- H05K2201/10871—Leads having an integral insert stop
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/046—Means for drawing solder, e.g. for removing excess solder from pads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1173—Differences in wettability, e.g. hydrophilic or hydrophobic areas
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
−本開示で提案する特殊電気部品を提供する工程と、
−特殊電気部品のはんだ付けピンとスルーホールとの間に、液体の過剰なはんだをプリント回路基板の前側から裏側へ運ぶのに十分に強力である毛管力が生じるように選択されたサイズを有する、少なくとも1つの金属化されたスルーホールを有するプリント回路基板を提供する工程と(前述したように、スルーホールの寸法は、はんだ付けピンの中心に位置する前セクションとスルーホールの内壁との間の距離が約0.5mm以下となるように取ってもよい)、
−前セクションが前側を通って少なくとも約0.3mm、任意に1.2mm未満突き出るまで、少なくとも1本のはんだ付けピンの前セクションを、プリント回路基板の裏側からプリント回路基板の前側へスルーホールを通して押す工程と、
−プリント回路基板の前側のスルーホールの箇所に液体はんだを適用することによって、はんだ付けピンをプリント回路基板に接続する工程。
−接続する工程において、過剰なはんだを、スルーホールを通してはんだ付けピンの第1のセクションの方へ、スルーホールとスルーホール内を延伸するはんだ付けピンの前セクションとの間に生じる毛管力によって運ぶ工程と、
−はんだ付けピンの前セクションをスルーホールを通して押す工程において、前セクションを、第1のセクションの横断縁部がプリント回路基板の裏側に接触するまで押す工程と、
−少なくとも2つの特殊電気部品を互いに対して固定された位置に設け、少なくとも2つの金属化されたスルーホールを伴うプリント回路基板を設ける工程であって、スルーホールはそれらの距離においてはんだ付けピンの距離と一致している工程。
Claims (10)
- モータ、蓄電池、又は電気サブアセンブリ等の特殊電気部品であって、前記特殊電気部品をプリント回路基板にはんだ接合するための少なくとも1本のはんだ付けピン、特には、少なくとも2本のはんだ付けピンを有し、前記少なくとも1本のはんだ付けピンが、前記はんだ付けピンの自由端における前セクションと、前記前セクションに隣接する第1のセクションと、を含む接続端を有し、前記前セクションが、2つの対向する主表面と、狭側面と、を有するとともに、前記第1のセクションの幅よりも小さい幅を有し、特には、前記前セクションの前記幅が、前記第1のセクションの前記幅よりも少なくとも25%小さく、特には、少なくとも50%小さく、
前記第1のセクションが、前記前セクションから離れて横方向に突出する翼セクションを含み、そのため、前記前セクションの横方向縁部、及び前記翼セクションの横断縁部が、90度を超える角度で配置されており、
前記はんだ付けピンが、表面コーティングを少なくとも前記接続端の主表面上に有するが、狭側面には有さず、そのため、はんだが、少なくとも前記前セクション及び前記第1のセクションの前記狭側面と結合しない、特殊電気部品。 - 第2のセクションが、前記前セクションとは反対側で前記第1のセクションに隣接して配置され、前記前セクション、前記第1のセクション、及び前記第2のセクションが共に、本質的にt形状であり、前記t形状の十字線が、少なくとも前記はんだ付けピンの1つの横方向側面から突出している、請求項1に記載の特殊電気部品。
- 前記前セクションの前記横方向縁部と前記翼セクションの前記横断縁部との間の前記角度が、少なくとも92.5度、特には、95度〜105度である、請求項1または2に記載の特殊電気部品。
- 前記はんだ付けピンが、0.1mm〜0.4mmの厚さを有するシート材料から作製され、前記前セクションの前記幅が、0.5mm〜2.0mmである、請求項1〜3のいずれか一項に記載の特殊電気部品。
- 前記少なくとも1本のはんだ付けピンが、特には前記はんだ付けピンのばね様変形として実現される、弾性セクションを含み、任意に、前記特殊電気部品が、互いに平行に延伸し、かつ両方とも弾性セクションを有する、少なくとも2本のはんだ付けピンを有する、請求項1〜4のいずれか一項に記載の特殊電気部品。
- 請求項1〜5のいずれか一項に記載の少なくとも1つの特殊電気部品と、プリント回路基板と、を含む、プリント回路基板アセンブリであって、前記プリント回路基板は、前記はんだ付けピンの前記前セクションが通過して延伸する、金属化されたスルーホールを有し、前記はんだ付けピンが、はんだ接合によって前記プリント回路基板に接続されている、プリント回路基板アセンブリ。
- 前記はんだ付けピンの前記前セクションが、前記プリント回路基板の前側の上方に少なくとも約0.3mm、任意に約1.2mm以下延伸する、請求項6に記載のプリント回路基板アセンブリ。
- 前記スルーホールが、細長い断面、特には、長円形、楕円形又は丸みを帯びた矩形の断面を有し、前記細長いスルーホールの長軸が、前記スルーホールの短軸よりも50%〜250%長く、特には、前記短軸が、0.8mm〜1.2mmのサイズを有し、前記長軸が、1.2mm〜2.5mmのサイズを有する、請求項6又は請求項7に記載のプリント回路基板アセンブリ。
- 前記プリント回路基板が、裏側に、前記スルーホールを通過する導電性トラックであって、金属化されたスルーホール縁部と伝導性トラック縁部との間が0.5mm未満の距離である、という伝導性トラックを有し、特には、この距離が、約0.3mmである、請求項6〜8のいずれか一項に記載のプリント回路基板アセンブリ。
- 請求項6〜9の一項に記載のプリント回路基板アセンブリを含む電気器具。
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP15164470.5A EP3086628B1 (en) | 2015-04-21 | 2015-04-21 | Special electric component, printed circuit board assembly, and method of manufacturing an electric appliance |
| EP15164470.5 | 2015-04-21 | ||
| PCT/IB2016/052076 WO2016170449A2 (en) | 2015-04-21 | 2016-04-12 | Special electric component, printed circuit board assembly, and method of manufacturing an electric appliance |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2018513562A JP2018513562A (ja) | 2018-05-24 |
| JP6487066B2 true JP6487066B2 (ja) | 2019-03-20 |
Family
ID=53008303
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017554019A Active JP6487066B2 (ja) | 2015-04-21 | 2016-04-12 | 特殊電気部品、プリント回路基板アセンブリ、及び電気器具を製造する方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US10264679B2 (ja) |
| EP (1) | EP3086628B1 (ja) |
| JP (1) | JP6487066B2 (ja) |
| CN (1) | CN107852826B (ja) |
| CA (1) | CA2982698C (ja) |
| WO (1) | WO2016170449A2 (ja) |
Family Cites Families (28)
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| US4241497A (en) * | 1979-01-11 | 1980-12-30 | The Singer Company | P.C. Board lead trimming method |
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| US4541034A (en) * | 1984-04-26 | 1985-09-10 | At&T Technologies, Inc. | Electrical terminal and method of securing same in circuit substrate thru-hole |
| JPS63107159A (ja) * | 1986-10-24 | 1988-05-12 | Toshiba Corp | 半導体装置 |
| JPH03124010A (ja) * | 1989-10-08 | 1991-05-27 | Murata Mfg Co Ltd | 電子部品の端子 |
| US5166570A (en) * | 1990-06-08 | 1992-11-24 | Murata Manufacturing Co. Ltd. | Electronic component |
| JP3093476B2 (ja) * | 1992-08-31 | 2000-10-03 | ローム株式会社 | 電子部品およびその実装方法 |
| JPH07320800A (ja) * | 1994-05-18 | 1995-12-08 | Star Micronics Co Ltd | 端子及びその製造方法 |
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| JP2004063688A (ja) * | 2002-07-26 | 2004-02-26 | Mitsubishi Electric Corp | 半導体装置及び半導体アセンブリモジュール |
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| JP2007317806A (ja) * | 2006-05-24 | 2007-12-06 | Fujitsu Ltd | プリント基板ユニット |
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| CN101652902B (zh) * | 2007-02-02 | 2013-02-13 | 富加宜汽车控股公司 | 连接设备 |
| KR100965683B1 (ko) * | 2008-03-31 | 2010-06-24 | 삼성에스디아이 주식회사 | 배터리 팩 |
| DE102009046446A1 (de) * | 2009-11-06 | 2011-05-12 | Robert Bosch Gmbh | Elektronisches Bauelement |
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| JP5927435B2 (ja) * | 2012-05-30 | 2016-06-01 | パナソニックIpマネジメント株式会社 | 電子装置 |
| EP3090649B1 (en) | 2015-04-28 | 2019-07-17 | Braun GmbH | Electric oral hygiene device storage container |
| EP3092973B1 (en) | 2015-05-12 | 2018-02-28 | Braun GmbH | Personal hygiene device with treatment force measurement unit |
| ES2670015T3 (es) | 2015-05-12 | 2018-05-29 | Braun Gmbh | Dispositivo de higiene personal con unidad de medición de la fuerza de tratamiento |
| ES2820704T3 (es) | 2015-06-30 | 2021-04-22 | Braun Gmbh | Sistema de higiene personal |
| EP3112120B8 (en) | 2015-06-30 | 2018-06-27 | Braun GmbH | Injection molding device comprising movable strippers |
| EP3124991B1 (en) | 2015-07-30 | 2018-04-18 | Braun GmbH | Method for determining a spatial correction of an ultrasonic emitter and measurement device for applying the method |
| EP3156001B1 (en) | 2015-10-16 | 2019-01-09 | Braun GmbH | Personal hygiene device and method of controlling the personal hygiene device |
-
2015
- 2015-04-21 EP EP15164470.5A patent/EP3086628B1/en active Active
-
2016
- 2016-04-12 WO PCT/IB2016/052076 patent/WO2016170449A2/en not_active Ceased
- 2016-04-12 US US15/097,018 patent/US10264679B2/en active Active
- 2016-04-12 JP JP2017554019A patent/JP6487066B2/ja active Active
- 2016-04-12 CN CN201680023203.XA patent/CN107852826B/zh active Active
- 2016-04-12 CA CA2982698A patent/CA2982698C/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN107852826A (zh) | 2018-03-27 |
| CN107852826B (zh) | 2021-08-03 |
| US10264679B2 (en) | 2019-04-16 |
| US20160316564A1 (en) | 2016-10-27 |
| EP3086628A1 (en) | 2016-10-26 |
| CA2982698A1 (en) | 2016-10-27 |
| WO2016170449A3 (en) | 2018-01-18 |
| EP3086628B1 (en) | 2018-07-18 |
| WO2016170449A2 (en) | 2016-10-27 |
| JP2018513562A (ja) | 2018-05-24 |
| CA2982698C (en) | 2020-12-29 |
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