JP6487644B2 - Polishing equipment - Google Patents

Description

  The present invention relates to a diamond surface polishing apparatus, and more particularly to an apparatus for polishing the surface of various diamond products.

  Diamond, which is a carbon crystal, has extremely high hardness, excellent wear resistance, excellent slipperiness and thermal conductivity, and a high refractive index. Because of these physical properties, diamond is, for example, cutting tools such as tools, end mills, and files, plastic working dies such as punches and dies, sliding members such as valve lifters and bearings, and heat dissipation members such as heat sinks. It is used for optical parts such as electronic boards, lenses, windows, etc., but such diamond products are processed according to the application, but generally the surface can be polished to a smooth surface. Often required.

In the past, the polishing of diamond surfaces used mechanical polishing methods that used diamond abrasive grains and stones as the polishing means. There is also a problem that the surface of the diamond to be polished is not suitable for polishing a three-dimensional surface having irregularities rather than a flat surface. For this reason, at present, a polishing method using chemical treatment instead of mechanical polishing has been proposed. First, the polishing method is a step in which a processed part is brought to a high temperature state, and the diamond surface is rubbed with a highly reactive metal or metal oxide to be reacted and removed.
Patent Document 1 uses a polishing member composed of a metal that easily reacts with carbon in diamond crystals, applies ultrasonic waves to the polishing member, and heats the polishing member while ultrasonically vibrating the diamond member. A polishing method is disclosed in which polishing is performed by pressing onto a metal, and metals that easily react with carbon serving as a polishing member include stainless steel containing γ-Fe, titanium (Ti), zirconium (Zr), and tantalum (Ta). Is illustrated.

  For the above heating method that uses frictional heat due to ultrasonic vibration, temperature control must be performed by frequency and pressing force, which is very difficult to control, and polishing is performed stably and with constant efficiency. In addition, the frictional heat is used, the energy efficiency is low, and in order to raise the temperature, it is necessary to press the abrasive member against the diamond surface with a considerable pressing force. Since the hardness of the metal constituting the polishing member is considerably lower than that of diamond, there is a disadvantage that the wear of the polishing member is remarkable and its life is short. In view of this point, as a heating method, a method of polishing the diamond surface by converging and irradiating laser light so that the diamond surface becomes a focal point has been proposed. FIG. 6 shows a polishing apparatus of this type, in which a laser beam 2a is condensed and heated by a heating means 2 near the processing surface 1a of a workpiece 1 having a diamond surface, and a fixed polishing member 3a is covered. The workpiece 1 is rotated while being pressed against the machining surface of the workpiece 1 for polishing. Although the heating efficiency has been improved, since the abrasive member is fixed, there still remains a drawback that its wear is significant and the life is short.

  The thing shown by patent document 2 employ | adopts the preheating method by laser irradiation, and grind | polishes by making the metal which comprises the grinding | polishing member chemically react with carbon of the diamond surface. The purpose is a diamond surface that can be easily applied to polishing uneven three-dimensional surfaces as well as providing a smooth surface with a long polishing member life and easy control. It is possible to provide a polishing method, and to perform polishing by using a polishing member formed of an inexpensive metal alone without using an expensive material obtained by a special manufacturing method such as an intermetallic compound. It is an object of the present invention to provide a possible diamond surface polishing method. For this purpose, as shown in FIGS. 5B and 5C, the present invention heats the polishing member 3 or the surface to be processed (diamond surface) 1a with a laser beam or the like prior to polishing by the polishing member, 3 is a linear member 3b, a belt member 3c, and at least the surface is made of a material that is easily reactive with carbon or a carburizing metal, and a polishing member support such as a pulley 4a or a roller 4b. The polishing member 3 is wound around 4 and the polishing surface is pressed against the diamond surface via the polishing member support 4 while continuously or intermittently displacing the polishing surface. A polishing method is provided.

  In this polishing method, a polishing member having a linear or belt shape formed of the metal material described above is used, and the contact portion of the polishing member is displaced to rub the diamond surface. The polished members are renewed sequentially, so that the reaction between the reactive metal and the carbon on the diamond surface or the diffusion and penetration of the carbon does not reach a saturated state, or the surface pressure does not change due to wear, and the polishing is always performed stably. Will progress. As a result, there is an effect that stable polishing can be performed continuously over a long period of time. However, as shown in FIG. 5A, the polishing member 3 wound around the polishing member support 4 is removed. Since it is the form which presses and grinds toward the to-be-processed surface (diamond surface) 1a while feeding and winding sequentially, the polishing member support 4 such as a pulley or a roller around which the polishing member 3 is wound is disposed on the outside of the processing surface. The large-sized polishing apparatus provided with the sending-up winding means 6 for sending out and winding up the polishing member and the pressing means 7 faces each other. Therefore, the processed surface 1a of the member to be polished 1 needs to be structurally free, and a semi-closed space such as the inner peripheral surface of a cylindrical member or a ring member can be polished by a polishing apparatus having such a mechanism. Can not.

JP 2005-231022 A "Diamond Polishing Method and Apparatus" Published September 2, 2005 JP 2011-177883 A "Diamond Surface Polishing Method" Published on September 15, 2011

  An object of the present invention is to use a long-shaped polishing member such as a linear shape or a belt shape, and wrap around the polishing member support tool to discontinue the polishing surface continuously or intermittently. An object of the present invention is to provide a diamond polishing apparatus that performs polishing while pressing against a surface, and has a function capable of polishing a surface of a semi-closed space such as an inner peripheral surface of a cylindrical member or a ring member.

A polishing apparatus according to the present invention includes a linear or belt-shaped polishing member, a feeding and winding means for displacing the polishing member continuously or intermittently , a polishing member support that enables the polishing member to be wound and displaced, A base on which the polishing member support is attached; and pressing means for pressing the base toward the processing surface of the member to be polished, the base being opposite to the attachment position of the pressing means. An extending portion extending in a direction different from the direction of the pressing force biased at the position, and supporting the polishing member so that the tip end portion of the extending portion can come into contact with the processing inner peripheral surface of the member to be polished A tool is disposed, and the polishing member is bridged between the feeding and winding means so as to wind the polishing member support tool, and the feeding and winding means and the pressing means are arranged so as to be shifted from the processing surface. Semi-closed by being And characterized in that enabling machining of the diamond surface.

In one embodiment of the present invention, a means for feeding and winding the polishing member is mounted on the base.
In a further embodiment of the present invention, the direction in which the polishing member presses the processed surface of the member to be polished is horizontal.
In a further embodiment of the present invention, the polishing member has a surface made of a metal easily reactive with carbon, a carburizable metal, or a metal oxide. A further embodiment was for polishing diamond or diamond film. In a further embodiment, a configuration having a heating means for heating the polishing member and / or the member to be polished is employed.

  The base of the polishing apparatus according to the present invention has a configuration in which an extending portion extending in a direction different from the pressing direction with respect to the processing surface is provided, and the polishing member support is disposed at a distal end portion of the extending portion. Therefore, the processing position where the polishing member support tool is disposed can be shifted from the position of the main body portion and the pressing means of the base, and the main body portion and the pressing means of the base can avoid interference with the member to be polished. The semi-closed space such as the inner peripheral surface of the cylindrical member or the ring member can be polished.

In the polishing apparatus of the present invention adopting a configuration in which the means for feeding and winding the polishing member is mounted on the base, the polishing member support and the means for feeding and winding the polishing member are mounted on the same base. Therefore, there is no change in the tension of the polishing member spanned between the two during operation, and the pressing force on the processing surface becomes stable.
In the polishing apparatus of the present invention in which the direction in which the polishing member presses toward the processing surface of the member to be polished is horizontal, the pressing direction of the processing surface is orthogonal to the direction of gravity, so the influence of gravity on each member of the apparatus Polishing can be performed without receiving.

When the polishing apparatus of the present invention adopting a material having a surface made of carbon, a carburizable metal, or a metal oxide as the polishing member is used for polishing diamond or diamond film, Effective polishing is possible by chemical treatment, not by mechanical processing.
Further, in the polishing apparatus of the present invention to which a heating means for heating the polishing member and / or the member to be polished is added, chemical treatment is promoted and processing time is shortened.

It is the figure which showed the form which processes the internal peripheral surface of a ring member with the grinding | polishing apparatus which concerns on this invention. It is a figure which shows two embodiment of the grinding | polishing apparatus which concerns on this invention. It is a figure explaining the form which is not influenced by gravity, when processing the internal peripheral surface of a ring member with the polisher concerning the present invention. It is a figure which shows one Embodiment of the grinding | polishing apparatus based on this invention which added the heating apparatus. It is a figure explaining the conventional grinding | polishing apparatus which sends out a grinding | polishing member. It is a figure which shows the basic composition of the polisher of the conventional chemical polishing system.

Hereinafter, embodiments of the present invention will be described in detail.
A diamond polishing in which a long polishing member is wound around a polishing member support and the polishing surface is continuously or intermittently displaced and pressed against the surface of the member to be polished through the polishing member support. Since the apparatus has a function capable of polishing even the surface of a semi-closed space such as the inner peripheral surface of a cylindrical member or ring member, the basic feature adopted by the present invention is this kind of diamond polishing apparatus. Polishing by winding the polishing member so that the presence of the feeding and winding means of the long polishing member which is an accessory member and the pressing means for pressing toward the processing surface of the member to be polished do not interfere with the structure of the member to be processed The member support is attached to the extending portion of the base extending in a direction different from the pressing direction by the pressing means. Since the base of the present invention is provided with an extending portion extending in a direction different from the pressing direction with respect to the work surface, and the polishing member support is disposed at the distal end portion of the extending portion, The processing position at which the polishing member support is disposed can be shifted from the position of the main body of the base and the pressing means, and the main body of the base and the pressing means can be prevented from interfering with the member to be polished. In addition, a semi-closed space such as the inner peripheral surface of the ring member can be polished.

  With reference to FIG. 1, the aspect which grind | polishes the internal peripheral surface of a ring member is demonstrated by the typical embodiment of this invention. The apparatus of this embodiment is provided with a delivery winding means 6 for feeding and winding the polishing member 3 to the base 5 and a pressurizing means 7 for pressing the base 5 toward the work surface 1a. ing. The base 5 is provided with an extending portion 5a extending in a direction perpendicular to the direction of the pressing force urging at a position opposite to the position where the pressurizing means 7 is provided. An abrasive member support 4 such as a pulley or a roller is attached in the vicinity. Further, a long polishing member 3 such as a linear shape or a belt shape is spanned between the polishing member support 4 and the delivery winding means 6 so as to wind the polishing member support 4. In the polishing apparatus of the present invention, the polishing member support 4 is attached to an extending portion extending in a direction orthogonal to the direction of the pressing force urging at a position opposite to the position where the pressurizing means is attached, and the polishing member support 4 is wound thereon. Since the polishing member 3 is structured to polish the surface of the member 1 to be polished, it is possible to shift the position of the take-up winding means 6 and the pressurizing means 7 that are large-sized devices with the polishing processing part, Interference with the workpiece 1 can be avoided. Therefore, as shown in FIG. 1, even if the workpiece 1 is ring-shaped, the polishing member support 4 can be brought into contact with the inner peripheral surface thereof, and polishing can be performed.

  The polishing apparatus of the present invention is not limited to the embodiment described above, and various modifications can be made. In the example shown in FIG. 1, a configuration is adopted in which a delivery winding means 6 that feeds and winds the polishing member 3 to the base 5 is adopted, but a semi-closed space such as an inner peripheral surface of a cylindrical member or a ring member. The above configuration is not necessarily an indispensable requirement for the object of the present invention to provide a polishing apparatus having a function capable of polishing the surface of the surface. As shown in FIG. 2A, the base 5 is provided with an extending portion 5a in a direction different from the pressing direction, the polishing member support 4 is attached to the tip of the extending portion 5a, and the polishing member 3 is sent out and wound up. 6 may be a form that is not attached to the base 5. However, when attached to the base 5 as shown in FIG. 1, the positions of the polishing member support 4 and the delivery winding means 6 are fixed, so that the relative displacement of both members during operation causes the polishing member to move to the polishing member. Since the tension does not change and does not affect the polishing process, it can be said to be a more preferable form. In the polishing process, the pressing force of the polishing member applied to the surface of the member to be polished greatly affects the polishing state and the heating state, which is an important requirement.

  Further, the extending part 5a of the base must necessarily extend in a direction orthogonal to the direction of the pressing force that biases the base 5 at a position opposite to the position where the pressing means 7 is attached. There is no limitation as long as it extends in a direction different from the pressing direction by the pressing means. In short, it is sufficient that the position of the polishing member support around which the polishing member is wound can be shifted from the position of the take-up winding means 6 and the pressurizing means 7 which are large-sized devices, and the form shown in FIG.

  A more preferred embodiment of the polishing apparatus of the present invention will be described with reference to FIG. In this embodiment, the direction of the pressing force by the pressurizing means 7 is set to the horizontal direction so as not to be affected by the gravity acting on each member of the apparatus. Although it is possible to remove the influence of gravity by using a balance device using weight, air pressure, etc., it is necessary to control the increase in the number of parts and the change in weight due to abrasion of the polishing member, etc. This is not preferable because of complicating the process. The processed surface 1a of the member 1 to be polished is set in the vertical direction, and the pressing force of the polishing member 3 acts in the horizontal direction. Therefore, since the influence of gravity acting in the vertical direction can be excluded regardless of the wear amount of the polishing member with a simple structure, the processed surface to be polished is not affected. As described above, since the pressing force of the polishing member applied to the surface of the member to be polished in the polishing process greatly affects the polishing state and the heating state, this also has an important significance.

  Furthermore, a further preferred embodiment of the polishing apparatus of the present invention to which a heating means is added will be described with reference to FIG. The heating means 2 uses a laser oscillator to focus the laser beam 2a on the processing part and heat it. Since the processing part is irradiated with laser light, the reaction between the diamond to be polished and the carbon readily reactive metal, carburizing metal or metal oxide of the polishing member is promoted, and the polishing time is shortened. can do. Furthermore, if a heater is provided at the tip of the extending portion 5a of the base on which the polishing member support 4 is disposed as a heating means, the heating effect is further increased and the polishing time can be further shortened.

  In the present specification, the polishing member of the present invention has been described as having a metal that is easily reactive with carbon or a carburizing metal on the surface thereof, and chemical polishing is performed. As long as the polishing member is continuously or intermittently fed and wound, it can be applied to a mechanical polishing method using diamond polishing paper, belt polishing material, diamond wire or the like.

１ Polished (machined) member
2 Heating means 2a Laser light 3 Polishing member 3a Fixed polishing member
3b Linear Abrasive Member 3c Belt Abrasive Member 4 Abrasive Member Support 4a Pulley
4b Roller 5 Base 5a Extension 6 Sending winding means 7 Pressurizing means

Claims (5)

A linear or belt-shaped polishing member, a feeding and winding means for continuously or intermittently displacing the polishing member, a polishing member support that holds the polishing member in a displaceable manner, and the polishing member support And a pressing means that presses the base toward the processed surface of the member to be polished, and the base is pressed at a position opposite to the position where the pressing means is attached. An extending portion extending in a direction different from the direction of the pressure, and the polishing member support is disposed at a distal end portion of the extending portion so as to be in contact with a processing inner peripheral surface of the polished member, The polishing member is stretched between the feeding and winding means so as to wind the polishing member support, and the feeding and winding means and the pressing means are arranged so as to be shifted from the processing surface. Semi-closed diamond Polishing apparatus is characterized in that it possible to process the surface. The polishing apparatus according to claim 1, wherein a feeding and winding means for continuously or intermittently displacing the polishing member is mounted on the base.   The polishing apparatus according to claim 1, wherein a direction in which the polishing member is pressed toward a processed surface of the member to be polished is horizontal.   The polishing apparatus according to any one of claims 1 to 3, wherein the polishing member has a surface made of a metal easily reactive with carbon, a carburizable metal, or a metal oxide.   The polishing apparatus according to claim 4, further comprising a heating unit configured to heat the polishing member and / or the member to be polished.

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