JP6489145B2 - Electronic component and method for manufacturing electronic component - Google Patents

Description

  The present invention relates to an electronic component having a flexible structure and an electronic component manufacturing method.

  There is a technology for connecting a plurality of substrates using a flexible substrate and a rigid substrate in order to miniaturize and mount a module at a high density.

According to Patent Document 1, a circuit board includes a flexible part and a rigid part, and the circuit board is accommodated in the connector housing by bending the flexible part according to the space of the connector housing provided so as to surround the connector pin. Disclosure.
Furthermore, this patent document 1 discloses that a cover member on which wiring is formed is provided and the wiring and the circuit board are pressed against each other.

  Patent Document 2 discloses a multi-axis servo amplifier that includes a flexible substrate and a rigid substrate, and has a cubic shape or a rectangular parallelepiped shape by bending the flexible substrate.

  Patent Document 3 discloses a structure including a wiring board and a carrier board having a rigid part and a flexible part, and bending the flexible part upward to connect the carrier board and the wiring board.

JP-A-2005-191130 JP 2005-1117013 A JP 2002-314039 A

  By the way, Patent Documents 1 to 3 configured as described above show a configuration in which a rigid substrate is bent via a flexible substrate disposed between rigid substrates. This configuration is a main board. The positional relationship with the substrate is not clear, and depending on the arrangement, there is a problem that space saving is hindered.

The present invention has been made in view of the above-described circumstances, and provides an electronic component and an electronic component manufacturing method capable of realizing high-density mounting and overall miniaturization.

In order to solve the above problems, the present invention proposes the following means.
The electronic component shown in the first embodiment of the present invention includes a main board and a sub board in which a plurality of boards are flexibly connected and at least one board is bent on the main board. A part of the sub-board is connected to one surface of the main board.

  In the method for manufacturing an electronic component shown in the second embodiment of the present invention, a part of a sub-board formed by flexibly connecting a plurality of boards is placed on the main board, and the other part of the sub-board is attached. And being connected to the surface on one side of the main substrate in a bent state.

  According to the present invention, high-density mounting of the board and overall miniaturization can be realized by connecting to one surface of the main board in a state where a part of the sub board is bent.

It is a front view of the electronic component which concerns on this invention. It is a front view of the electronic component which concerns on 1st Embodiment of this invention. It is a top view of the sub-board | substrate used for 1st Embodiment. It is a figure which shows the lead terminal pin in the LSI element before this invention. It is a front view of the electronic component which concerns on 2nd Embodiment of this invention.

The minimum configuration of the present invention will be described with reference to FIG.
FIG. 1 shows an electronic component 100 according to the present invention, which includes a main board 1 serving as a mother board and a sub board 2 mounted on the main board 1.

In the sub-substrate 2, a plurality of substrates C are flexibly connected, and at least one substrate C is installed on the main substrate 1. That is, at least a part of the sub-board 2 is made of a material that is more flexible than the other parts, and is configured to be easily bent and deformed.
The sub-board 2 is connected to one surface of the main board 1 in a state in which a part of the board C (indicated by reference numeral C ′) is bent.
Further, by bending a part of the sub-board 2, high-density mounting of the board C and overall size reduction can be realized.
In FIG. 1, what is indicated by reference numeral 3 is a heat sink provided as a heat generating component in order to release the heat generated in the substrate C to the outside .

As described above in detail, in the electronic component 100 shown in the present invention, a part of the sub-board 2 is folded and connected to one surface of the main board 1 so that the high-density mounting of the board C is achieved. In addition, it is possible to reduce the size of the mother board serving as the main board 11.
In the electronic component 100 of the present invention, “on the main board 11, a part of the sub-board 12 in which a plurality of boards C are flexibly connected is placed in contact with the other part of the sub-board 12; An electronic component manufacturing method characterized in that it is connected to one surface of the main board 11 in a bent state.

(First embodiment)
A first embodiment of the present invention will be described with reference to FIGS.
FIG. 2 shows an electronic component 101 according to the first embodiment, which includes a main board 11 serving as a mother board and a sub board 12 mounted on the main board 11.

The sub-board 12 includes a plurality of boards C1 to C5 and a flexible board 13 that is provided between the boards C1 to C5 and flexibly connects the boards C1 to C5. Among C5, at least one substrate (substrate C1 in this example) is installed on the main substrate 11.
Each of these substrates C1 to C5 includes mounting substrates 21 to 25 made of rigid substrates, and electronic modules 31 to 35 (LSI ( Large Scale Integration) elements 31 and memory elements 32) mounted on the mounting substrates 21 to 25. , 33 and power supply elements 34, 35).
The LSI element 31, the memory elements 32 and 33, and the power supply elements 34 and 35 are heat-generating components that generate heat.
Further, as the mounting boards 21 to 25, transmission loss is suppressed by using a low tan delta material having a low dielectric constant.

  Specifically, the substrate C1 includes an LSI mounting substrate 21 located in the center of the sub-board 12, and an LSI element 31 installed on the upper surface of the LSI mounting substrate 21 via lead terminals 26. The lower surface of the mounting substrate 21 is electrically connected to the upper surface of the main substrate 11 serving as a mother board via solder 27. Note that a build-up substrate is used as the LSI element 31.

The substrates C2 and C3 are located on both sides of the substrate C1 and sandwich the substrate C1. The memory mounting substrates 22 and 23 and the memory elements 32 and 33 mounted on the memory mounting substrates 22 and 23 Consists of.
The boards C4 and C5 are located outside the boards C2 and C3 and at the end of the sub-board 12, and are power supply mounting boards 24 and 25 and a power supply as a converter mounted on the power supply mounting boards 24 and 25. It consists of elements 34 and 35.
The power supply mounting boards 24 and 25 for mounting the power supply elements 34 and 35 are bent with respect to the adjacent memory mounting boards 22 and 23 and then connected to power supply terminals (not shown) on the main board 11 serving as a motherboard. Each is connected via 36.

In the sub-board 12 configured as described above, as shown in FIG. 3, the LSI element 31, the memory elements 32 and 33, and the power supply elements 34 and 35 constituting the electronic module are connected to each other via the flexible board 13. By being connected, the data signal D / power supply and the signal A related to GND (Ground) are transmitted and received in the electronic module. As a result, the number of I / O (Input / Output) pins provided on the LSI mounting substrate 21 corresponding to the solder 27 can be reduced.
FIG. 4 shows the lead terminal pins of the LSI element before the present invention. The pins indicated by solid lines are the lead terminal pins related to data processing, the pins indicated by the thick lines are terminal pins connected to the power source, and are indicated by broken lines. The pin shown is a terminal pin connected to GND.
As can be seen by comparing FIG. 3 and FIG. 4, in this embodiment (see FIG. 3), I / O (Input / Output) pins provided on the LSI mounting substrate 21 corresponding to the solder 27 are provided. The number can be reduced. As a result, it is possible to suppress problems that occur at the BGA connection part and TH (through hole).

Specifically, before the present invention (see FIG. 4), the power supply element and the memory element are provided on the main substrate, and the LSI element (LSI package) is connected to the memory element and the power supply element on the main substrate. This increases the number of I / O terminal pins between the main board and the LSI package.
On the other hand, in the electronic component 101 according to the embodiment, since the memory elements 32 and 33 and the power supply elements 34 and 35 are mounted on the sub board 12, the electronic modules 31 to 35 on the sub board 12 including these elements. Signal transmission / reception is performed in this manner, and the total number of I / O terminal pins between the main board 11 and the sub board 12 including the LSI package can be reduced.

On the other hand, as shown in FIG. 2, a heat sink 40 is disposed on the upper surface of the sub-board 12 located on the side different from the main board 11.
The heat sink 40 is formed in a polygonal shape in which a plurality of contacted surfaces 41 are provided on the side facing the sub-substrate 12.

These contacted surfaces 41 are in contact with any of the LSI elements 31, the memory elements 32 and 33, and the power supply elements 34 and 35 in the substrates C <b> 1 to C <b> 5 that are the heat generation sources of the sub-substrate 12. The LSI element 31 and the memory elements 32 and 33 are brought into contact with each other by being bent through the line.
That is, in the sub-board 12 of this embodiment, the LSI element 31 and the memory elements 32 and 33 located in the middle in the electronic module are bent via the flexible board 13, so that the heat sink 40 is connected via the contacted surface 41. Is touching.
On the other hand, the substrates C4 and C5 which are located at the end of the sub-substrate 12 and on which the power supply elements 34 and 35 are mounted are arranged so as to be bent with respect to the other substrates C1 to C3.

Specifically, in the sub-board 12, the boards C 2 and C 3 on both sides of the board C 1 located in the center extend in an oblique direction away from the main board 11 via the flexible board 13.
Further, the substrates C4 and C5 positioned at the end of the sub-board 12 are connected to a corresponding portion of the main board 11 by being bent substantially vertically toward the board 11 via the flexible board 13. .
In this example, since the power supply elements 34 and 35 are mounted on the boards C4 and C5, the board C4 and C5 are connected to a power supply terminal (not shown) on the main board 11 via the connector 36 by bending. And the board | substrates C4 and C5 used as a part of the subboard | substrate 12 are bent, and the high-density mounting of the board | substrates C1-C5 and the whole size reduction are realizable.

As described above in detail, in the electronic component 101 according to the first embodiment of the present invention, a part of the substrates C1 to C5 installed on the sub-substrate 12 is folded on one surface of the main substrate 11. By being connected, the high-density mounting of the boards C1 to C5 and the miniaturization of the mother board serving as the main board 11 can be realized.
Further, in the electronic component 101 according to the first embodiment, since the heat sink 40 is formed in a polygonal shape having a plurality of contacted surfaces 41, the substrates C1 to C5 of the sub-substrate 12 are bent, so that these substrates C1. -C5 can be brought into contact with the contacted surface 41 of the heat sink 40. As a result, the sub-board 12 can be efficiently cooled.

(Second Embodiment)
A second embodiment of the present invention will be described with reference to FIG.
The electronic component 102 according to the second embodiment differs from the electronic component 101 according to the first embodiment in the arrangement of the sub-board 12 with respect to the main board 11.
That is, in the sub-board 12 of the first embodiment, a part of the substrates C1 to C5 (boards C1 to C3) is in contact with the contacted surface 41 of the heat sink 40, whereas the sub-board of the second embodiment. 12, all of the substrates C <b> 1 to C <b> 5 are in contact with the contacted surface 41 of the heat sink 40.

Accordingly, the substrates C4 and C5 on which the power supply elements 34 and 35 are mounted are not bent toward the main substrate 11, and instead, the flexible substrate 13 connected to the ends of the substrates C4 and C5 is replaced with the main substrate 11. It is bent to the side and connected to a power supply terminal (not shown) on the main board 11 via the flexible board 13 and a connector 36 at its end.
In addition, what is shown with the code | symbol 42 in FIG. 5 is a contact pad for closely_contact | adhering the electronic modules 31-35 of the board | substrates C1-C5 to the to-be-contacted surface 41 of the heat sink 40. FIG.

As described in detail above, in the electronic component 102 according to the second embodiment of the present invention, the flexible substrate 13 at the end of the sub-substrate 12 is connected to one surface of the main substrate 11 in a bent state. Thus, similarly to the first embodiment, high-density mounting of the substrates C1 to C5 and miniaturization of the mother board serving as the main substrate 11 can be realized.
Further, in the electronic component 102 according to the second embodiment, since the heat sink 40 is formed in a polygonal shape provided with a plurality of contacted surfaces 41, these can be obtained by bending the substrates C1 to C5 of the sub-substrate 12. All of the substrates C1 to C5 can be brought into contact with the contacted surface 41 of the heat sink 40. As a result, the sub-board 12 can be efficiently cooled.

  In the above embodiment, the substrates C1 to C5 on which the LSI element 31, the memory elements 32 and 33, and the power supply elements 34 and 35 are mounted are provided in the sub-board 12, but this is an example and different elements are provided. The number of installations is not limited.

  Further, the flexible substrate and the rigid substrate in the embodiment are distinguished by referring to a relatively easy deformation as a flexible substrate and a relatively difficult deformation as a rigid substrate. They are not distinguished by ease. Therefore, if a flexible substrate can be deformed in a three-dimensional manner with respect to the surface of the rigid substrate by combining substrates that have relatively little flexibility (easiness of bending deformation). In addition, it is possible to expect the effect of increasing the density or downsizing of electronic equipment.

  As mentioned above, although embodiment of this invention was explained in full detail with reference to drawings, the concrete structure is not restricted to this embodiment, The design change etc. of the range which does not deviate from the summary of this invention are included.

 The present invention relates to an electronic component having a flexible structure and an electronic component manufacturing method.

DESCRIPTION OF SYMBOLS 1 Main board 2 Sub board 3 Heat sink 11 Main board 12 Sub board 13 Flexible board 21 Mounting board 22 Mounting board 23 Mounting board 24 Mounting board 25 Mounting board 31 LSI element 32 Memory element 33 Memory element 34 Power supply element 35 Power supply element 36 Connector 40 heat sink 41 contacted surface 100 electronic component 101 electronic component 102 electronic component C (C1-C5) substrate

Claims (8)

A main board;
A plurality of substrates arranged in series are flexibly connected to each other at a plurality of locations, and at least one substrate is bent to one side and the other side at a location where the substrates are flexibly connected to the main substrate. A sub-board installed in
A heat dissipating component that is provided on the side of the other surface of the sub-substrate opposite to the main substrate and that contacts at least a part of the plurality of substrates;
Have
A substrate disposed at an end of the plurality of substrates is connected to one surface of the main substrate as a part of the sub-substrate,
A part of the sub-board is provided so as to extend in a direction away from the main board and contacts the heat dissipation component,
An electronic component characterized in that it is connected to a corresponding portion of the main board by being bent substantially perpendicularly to the main board.   The electronic component according to claim 1, wherein a part of the sub-board is provided with a connector for connecting to a corresponding portion of the main board.   The said sub-board | substrate has these flexible boards and the flexible substrate which is provided between these board | substrates and connects this board | substrate flexibly, The one of Claim 1 or 2 characterized by the above-mentioned. Electronic components.   4. The electronic component according to claim 1, wherein each of the substrates includes a rigid substrate and a heat-generating component mounted on the rigid substrate. On the surface of the sub-board located on the side different from the main board, a heat dissipating component is placed in contact with
The electronic component according to claim 4 , wherein the sub-board is provided so that the heat-generating component is in contact with a plurality of surfaces of the heat-dissipating component. The heat dissipating component has a bottom surface formed of a plurality of surfaces,
The electronic component according to claim 5 , wherein the sub-board is bent corresponding to a shape of the heat dissipation component and contacts the heat dissipation component. LSI is installed as a substrate located in the center of the sub-board,
The electronic component according to claim 1 , wherein the LSI is electrically coupled to the main board.   A part of the sub-board, in which a plurality of boards arranged in series are flexibly connected to each other at a plurality of locations on one surface of the main board, is contacted and then the other part of the sub-board is bent. And bending at least a part of the plurality of substrates in a direction away from the main substrate to contact the heat radiating component, and further bending the substrate toward the main substrate so as to be substantially perpendicular to the one surface of the main substrate. A method of manufacturing an electronic component, characterized by being connected to a corresponding part of

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