JP6493111B2 - Sequential forming method, sequential forming apparatus and sequential forming method tool - Google Patents

Description

  The present invention relates to a sequential forming method in which a pressing tool is pressed against a plate material and moved relative to the plate material, and the plate material is stretched and formed into a predetermined three-dimensional shape, and a tool used in the sequential forming apparatus. The present invention relates to a sequential molding method capable of achieving both speed and surface roughness, and a tool used in the sequential molding apparatus.

  As a plastic working method for mass production of automobile parts, press working using a mold is widely used.

However, in the plastic working method using a press device and a die, the equipment becomes large, and a die must be produced for each part. It is unsuitable for corresponding high-mix low-volume production. In addition, the shape of parts that can be produced by press working is limited, and it is difficult to produce parts having complicated shapes.

In Japanese Patent No. 4287912 of Patent Document 1, instead of a die having a specific shape, a general-purpose pressing tool is moved relative to a plate material while being moved, and a predetermined three-dimensional shape is formed while the plate material is stretched. An apparatus is disclosed.

Since the sequential forming apparatus performs the movement of the pressing tool by numerical control, it is possible to produce parts having different shapes with the same apparatus configuration, and in addition, it is possible to form complicated shapes that are difficult to press. . And even if the moving speed of the pressing tool is increased by supplying the lubricant to the forming part, adhesion to the pressing tool is prevented in the stainless steel plate material, and cracking can be prevented in the aluminum plate material. .

  Further, Japanese Patent No. 3959455 of Patent Document 2 discloses a sequential molding method that releases residual stress of a molded product by locally heating a processing portion as a moving destination of a bar-shaped pressing tool and improves dimensional accuracy. ing.

Japanese Patent No. 4287912 Japanese Patent No. 3959455

  However, when producing automobile parts and the like, it is necessary to increase the moving speed of the pressing tool in order to adjust the machining speed to the tact time. Therefore, if the moving speed of the pressing tool is made faster than the conventional method, the methods described in Patent Documents 1 and 2 cannot prevent adhesion between the plate material and the pressing tool and roughen the processing surface. It is difficult to achieve both surface formation and surface roughness.

The inventors have found that the adhesion between the plate material and the moving pressing tool can be prevented by melting and molding the surface of the plate material, and the above problem can be solved, and when performing high-speed molding by a sequential molding method, It was later discovered that there was a new problem.
That is, depending on the shape of the molded product, it may be difficult to process while maintaining the moving speed of the pressing tool at a high speed, and the sliding frictional heat is insufficient and the plate material surface cannot be melted.
Further, at the start of molding, sliding frictional heat due to relative movement of the pressing tool does not occur, and the surface of the molded product may become rough because the plate material surface is not melted.

  The present invention has been made in view of such problems of the prior art, and the object of the present invention is a case where sliding frictional heat is insufficient in sequential molding in which the surface of a plate material is melted and molded. It is possible to provide a sequential forming method capable of melting the surface of the plate material and satisfying both processing speed and surface roughness of the processed surface, a sequential forming apparatus used in the sequential forming method, and a tool used in the sequential forming apparatus. It is in.

  As a result of intensive studies to achieve the above object, the present inventor locally heated the contact portion between the moving pressing tool and the plate material according to the state of the plate material surface in contact with the moving pressing tool. The present inventors have found that the above object can be achieved by heating and controlling the material at a melting temperature or higher, and have completed the present invention.

That is, the sequential forming method of the present invention presses the plate material with a fixed pressing tool provided on one surface side of the plate material supported around the support frame and a movable pressing tool provided on the other surface side. Then, the plate material and the moving pressing tool and / or the fixed pressing tool are moved relative to each other to form the plate material into a three-dimensional shape.
And according to the state of the surface of the plate material that the moving pressing tool contacts, the contact portion is locally heated, and the temperature of the contact portion is heated and controlled to be equal to or higher than the melting temperature of the plate material surface. To do.

The sequential forming apparatus of the present invention is used in the above sequential forming method, and includes a support frame that supports the periphery of the plate material, a fixed pressing tool provided on one surface side of the plate material, and the other surface side. A moving pressing tool provided on the heating device and a heating device.
The heating device locally heats the contact portion between the moving pressing tool and the plate material in accordance with the state of the surface of the plate material with which the moving pressing tool contacts, and the temperature of the contact portion exceeds the melting temperature of the plate material surface. It is characterized by molding under heating control.

Moreover, the pressing tool for sequential forming apparatuses of this invention is used for the said sequential forming apparatus, The contact site | part with the said board | plate material contains hard carbon, It is characterized by the above-mentioned.

  According to the present invention, according to the state of the plate material surface where the pressing tool and the plate material are in contact with each other, since the contact portion is locally heated, the temperature of the plate material surface can be stably heated above the melting temperature, It is possible to provide a sequential molding method capable of forming a molded product having a small surface roughness at high speed, a sequential molding apparatus used in the sequential molding method, and a tool used in the sequential molding apparatus.

It is a figure explaining the state before the process start of a sequential shaping | molding method. It is a figure explaining the state in process of the sequential shaping | molding method. It is a figure explaining the state in process of the sequential shaping | molding method. It is the schematic which shows an example which attached the three-component force meter to the movement press tool. It is the schematic which shows an example which attached the thermocouple to the movement press tool. It is the schematic which shows an example of the state which detects the temperature of a process area with an infrared camera. It is the schematic which shows the state which energizes between a moving press member and a fixed press member, and performs local heating. It is the schematic which shows the state which energizes between the electrodes of a moving press member and a support frame, and heats it locally. (A) is the schematic which shows the state which rotates a moving press member and is heated locally, (b) is the schematic which shows the state which vibrates a moving press member ultrasonically and is heated locally. (A) is the schematic which shows the state which provided the laser heating apparatus and the heat gun integrally in the movement press member, (b) is the schematic which shows the state which locally heats the moving direction of a movement press member. .

The sequential molding method and sequential molding apparatus of the present invention will be described in detail.
In the sequential forming method of the present invention, the plate material is pressed by a fixed pressing tool provided on one surface side of a plate material supported by a support frame and a movable pressing tool provided on the other surface side. And the movable pressing tool and / or the fixed pressing tool are relatively moved to form the plate material into a three-dimensional shape. And the surface of a board | plate material is fuse | melted by locally heating the process area | region where the said board | plate material and a moving press tool contact, and it shape | molds.

The sequential forming method of the present invention increases the temperature of the processing region surface of the plate material and melts the surface, thereby reducing the surface roughness of the processing surface, and the moving speed of the moving pressing tool, that is, the sliding speed, It can be made faster than conventional high-speed molding.

And according to the state of the surface of the plate material that the moving pressing tool contacts, the contact portion is locally heated, so that the surface of the processed region of the plate material can be stably stabilized even when the sliding frictional heat of the processing region is insufficient. It can be melted and can save energy because only the processing region is heated.

  The sequential forming apparatus of the present invention includes a support frame that supports the periphery of a plate material, a moving pressing tool, a fixed pressing tool, a heating device, a plate surface condition detection device, a numerical control type driving device, and a control device.

The support frame 3 and the moving pressing tool 4 are moved in the horizontal direction (X-axis-Y-axis direction) and the vertical direction (Z-axis direction) by the driving device and relatively move. The fixed pressing tool 5 may be moved up and down.

  Then, the fixed pressing tool 5 is brought into contact with one surface of the plate 2 supported around the support frame 3 and the moving pressing tool 4 is brought into contact with the other surface, so that the moving pressing tool 4 and the fixed pressing tool 5 are brought into contact with each other. To perform sequential molding.

Specifically, as shown in FIG. 1, the movable pressing tool 4 is brought into contact with a portion of the plate material 2 corresponding to the edge of the fixed pressing tool 5. Then, as shown in FIG. 2, the movable pressing tool 4 is lowered by a predetermined amount to press the plate material 2, and the plate material 2 is plastically deformed. And as shown in FIG. 3, without changing the height of the movement press tool 4, the support frame 3 and / or the movement press tool so that the movement press tool 4 moves on the contour line of the molded product based on the numerical data. Move 4
When the moving pressing tool 4 finishes following the moving path on one contour line, the moving pressing tool 4 is further lowered by a predetermined amount, and the process of moving the moving path on the next contour line is repeated to form the plate material 2 in a three-dimensional shape. To form.

In the present invention, the processing is performed by controlling the temperature of the processing region where the movable pressing tool 4 and the plate material 2 are in contact with each other to be higher than the melting temperature of the plate material surface. Since the surface of the plate 2 in contact with the moving pressing tool 4 is melted, the moving pressing tool 4 can be moved at a high speed. Further, even if the moving pressing tool 4 scratches the surface of the plate member 2 to form unevenness, the surface is melted, so that unevenness is smoothed and the surface is prevented from becoming rough.
And according to the state of the plate material surface which the said moving press tool 4 contacts, the temperature of the plate material surface of a process area | region can be stably heated more than a melting temperature by heating the said process area | region locally.

  The plate material surface is melted by the sliding frictional heat between the moving pressing tool 4 and the plate material 2. Specifically, the surface of the plate 2 can be melted by sliding frictional heat by setting the relative moving speed of the moving pressing tool 4 to the plate 2 at a high speed, for example, 0.75 m / sec to 5 m / sec or more. it can.

  The present invention is a case where it is difficult to maintain the speed by detecting the surface state of the plate material in the processing region and locally heating the processing region in accordance with the state of the plate material surface that the movable pressing tool 4 contacts. Even in this case, the surface of the plate material in the processing region can be reliably melted.

Examples of the detection device for detecting the surface state of the plate material in the processing area include a three-component force meter 6 provided in the moving pressing tool, a thermocouple 7 provided in the moving pressing tool, and an infrared camera 8. .

  The three component force meter 6 measures the force in the horizontal direction (XY direction) and the vertical direction (Z direction) using a strain gauge or the like. The moving force tool 4 and the plate material 2 are measured by the three component force meter 6. By detecting the sliding frictional heat (μPV), it is possible to determine the shortage of the heat amount that melts the plate surface measured in advance, and an example of the sequential forming apparatus 1 using a three-component force meter is shown in FIG.

Here, the sliding frictional heat (μPV) is calculated from the friction coefficient (μ), the pressure (P) at the contact portion, and the sliding speed (V).
The friction coefficient (μ) is determined by measuring the machining resistance (main component force, back component force, feed component force) with a three-component force meter, the friction force (F: main component force) and the vertical load (W : Back component force × SINθ + feed component force COSθ, where θ is an angle between the plate and the tool, and can be obtained from friction force (F) / vertical load (W).

The thermocouple 7 is provided inside the moving pressing tool 4 and measures the temperature of the contact portion with the plate material, that is, the processing region, via the moving pressing tool. The infrared camera 8 is a moving pressing tool. The processing region where 4 and the plate material 2 are in contact with each other is photographed to measure the temperature.

By measuring the temperature of the processing region where the movable pressing tool 4 and the plate 2 are in contact with each other with the thermocouple 7 or the infrared camera 8, it is possible to detect a shortage of the plate surface with respect to the melting temperature. FIG. 5 is a schematic diagram of the moving pressing tool 4 provided with the thermocouple 7, and FIG. 6 is a diagram showing a state in which the temperature of the processing region is detected by the infrared camera 8.

The state of the obtained plate material surface, that is, the shortage with respect to the melting temperature of the plate material surface is sent to the control device. And a control apparatus heats locally the process area | region where the moving press tool 4 and the board | plate material 2 contact with a heating device more than the melting temperature of the board | plate material surface. The state of the plate material surface is sequentially sent to the control device, and the control device adjusts the heating amount according to the state of the plate material surface.

The said heating apparatus can use what utilizes electromagnetic energy, mechanical energy, or energy rays.

As shown in FIG. 7, the electromagnetic energy is used between the movable pressing tool 4 having conductivity and the fixed pressing tool 5 having conductivity, as shown in FIG. An example is one in which a conductive pressing tool 4 and an electrode 10 provided on the support frame 3 are energized.

As shown in FIG. 8 (b), the conductive pressing tool 4 having conductivity and the electrode 10 provided on the support frame 3 are energized independently of the support frame supporting the periphery of the plate material 2. It is preferable that a plurality of electrodes 10 are provided and the electrodes to be energized are switched and energized. As shown by the dotted arrows in FIG. 8B, the electrodes to be energized are switched, and the electrodes in the direction in which the moving pressing tool 4 is moved are energized, and the moving direction of the moving pressing tool 4 is changed. The current can be locally heated at the moving destination of the moving pressing tool 4.

Examples of utilizing the mechanical energy include those in which the moving pressing tool 4 is rubbed and heated by sliding frictional heat by rotating and / or ultrasonic vibration of the moving pressing tool 4 as shown in FIG. Can do. FIG. 9A is a diagram showing a state where the movable pressing tool 4 is rotated, and FIG. 9B is a diagram showing a state where the movable pressing tool 4 is ultrasonically vibrated.
The rotation and / or ultrasonic vibration of the moving pressing tool 4 is performed in addition to the relative movement for molding indicated by the dotted arrow in FIG. Sometimes done.

What uses the said energy ray should just be able to irradiate a light energy ray etc. to a contact part, for example, the laser heating apparatus 11 can be mentioned. The laser heating device 11 is preferably supported by a holder 12 provided on the moving pressing tool 4 and provided integrally with the moving pressing tool 4 to heat the moving destination of the moving pressing tool 4.
Instead of the laser heating device 11, a heat gun that blows out hot air generated by a heating wire may be used.

  As shown in FIG. 10B, the holder 12 is formed to be rotatable with respect to the central axis of the moving pressing tool 4. The surface of the plate material is melted by directing the laser heating device 11 toward the moving destination of the moving pressing tool 4 indicated by the dotted arrow.

  The plate material surface detection device and the heating device can be used in any combination.

Next, the moving pressing tool will be described.
Generally, when the temperature of the friction surface becomes high due to frictional heat, a severe adhesion phenomenon, that is, a seizure phenomenon occurs. For example, when the same kind of material such as iron and iron is rubbed, it adheres and the surface of the molded product is easily roughened.

In the sequential forming method of the present invention, as the moving pressing tool, it is preferable to select and use a material formed of a material different from the material constituting the surface of the plate material, and further, a material that is not alloyed with the plate material at the processing temperature. It is preferable to selectively use the formed one.

  Examples of the material constituting the moving pressing tool include tungsten carbide (WC), high carbon chromium bearing steel (SUJ2), powder, depending on the material constituting the surface of the plate material to be molded and the melting point of the surface material. High-speed steel can be mentioned, and these may be those in which a hard layer formed of a hard material is formed on the surface in contact with the plate material, and the hard material is bonded and bonded to the tip. It may be.

As said hard material, the thing containing hard carbon can be used, For example, the thing containing a diamond and / or diamond-like carbon can be mentioned. The diamond and diamond-like carbon are preferably polycrystalline, and examples thereof include diamond, a diamond sintered body (PCD), and a diamond-like carbon polycrystal.
By adhesively bonding the hard layer or hard material containing the polycrystalline diamond or the like, adhesion to the plate material can be prevented, and the surface roughness of the molded product can be reduced.

  The above-mentioned polycrystalline diamond does not have different characteristics depending on the crystal plane and crystal direction as in the case of single crystal diamond, and is isotropic, so it exhibits uniform characteristics in all directions and can be applied to force from any direction. It is also difficult to cleave. Furthermore, since it is harder and has a lower coefficient of friction than single crystal diamond, it can be molded at high speed over a long period of time.

  The average grain size of the polycrystalline diamond is preferably 10 μm or less. By being 10 micrometers or less, the surface roughness of a hardened layer can be reduced and a friction coefficient can be made small.

  The average particle size is measured for 100 diamond particles selected at random from the photographic image obtained by photographing the surface of the hardened layer or hard material, with the maximum diameter (major axis diameter) of the diamond particles being the particle size of the particles. Measure the diameter. And the number average particle diameter of diamond particles can be measured from these arithmetic averages.

The thickness of the hard layer is preferably 5 μm to 1 mm. When the thickness of the hard layer is within the above range, the adhesion with the base material is improved and the life of the moving pressing tool can be extended.

The hard material can contain a conductive material. By containing the conductive material, the moving pressing tool has conductivity, and local heating is possible by energizing the plate material from the moving pressing tool.
Examples of the conductive material include cobalt (Co), boron (B), silicon (Si), nickel (Ni), titanium (Ti), and molybdenum (Mo). These may be used alone or in combination. be able to.

  The hard layer can be formed by a sintering method, a chemical vapor deposition method (CVD), a physical vapor deposition method (PVD), or the like.

Moreover, when providing the said hard material in a moving press tool, it is preferable that the thermal expansion coefficient of a base material is ^5x10 <^-6> or less. The difference from the thermal expansion coefficient of diamond becomes small, and peeling of the hard layer and the like due to expansion and contraction is prevented.

The moving pressing tool is not necessarily moved, as long as the molded part that contacts the plate material is formed of a material that does not alloy with the plate material at the processing temperature, and the hard layer is formed on the molded part that contacts the plate material. It is not necessary for the entire pressing tool to be formed of a material that is not alloyed with the plate material, and it is not necessary to form the hard layer on the entire moving pressing tool.

A rod-shaped tool can be used as the moving pressing tool, and the shape of the tip is not particularly limited, and a rotating ball is provided in addition to a cylinder, a hemisphere, a cone, a polygonal column, and a polygonal pyramid. Although it is good, it is preferably a hemisphere.

The surface roughness (Ra) of the molding part where the moving pressing tool comes into contact with the plate material is preferably 0.2 μm or less, and more preferably 0.1 μm or less. When the surface roughness (Ra) is 0.2 μm or less, the friction coefficient is reduced, and high-speed molding is possible without supplying a lubricant. Further, the surface roughness of the molding surface is reduced, and the corrosion resistance of the plate material is improved.
The surface roughness (Ra) can be measured using a stylus type surface roughness meter in accordance with the provisions of JIS B 0601.

The fixed pressing tool presses the plate material from the opposite side of the moving pressing tool, and a mold having a shape that matches the contour of the molded product can be used. However, if the molded product has a simple shape, A rod-like tool can be used in the same manner as the moving pressing tool.

  The support frame sandwiches the periphery of the plate material, and is moved in the horizontal direction and the vertical direction by the numerical control type driving device to form the plate material in cooperation with the moving pressing tool.

The support frame is not clamped so that the plate material is not completely displaced, but the force for clamping the plate material is adjusted. When the stress generated by the deformation of the plate material becomes larger than the force for sandwiching the plate material, the plate material is slid between the support frames to prevent the finished dimension from becoming too thin.
The force for sandwiching the plate material may be adjusted by an element having a certain elastic force such as a spring, or may be adjusted by an actuator or the like that outputs the sandwiching force.

The control device detects the height of the fixed pressing tool, the positions of the moving pressing tool and the support frame, and the pressing force so that the moving pressing tool moves on the contour line of the molded product based on the numerical data of the molded product. Molding is performed by numerically controlling the drive unit.

  As the control device, for example, a numerical control type electronic control device using a microcomputer can be used. In the electronic control unit, the dimensions of each part expressing the part shape, the relative movement order of the moving pressing tool and the fixed pressing tool, the magnitude and timing of the pressing force, etc. are held as numerical data, and the driving device is automatically controlled by the program. can do.

The sheet can be molded by incremental forming method of the present invention is not particularly limited as long as it plastically deformed, for example, it is molded steel, stainless steel, a metal plate of aluminum material or the like.

The sequential forming method of the present invention is a method in which the surface of a plate material is melted and formed. When forming a plate material of a metal material having a high melting point, a metal material having a low melting point, for example, zinc (melting point: 420 ° C.) By using the plate material plated with, the surface of the plate material can be easily melted.

In addition, the galvanized steel sheet is prone to cracking and peeling when the plating layer is thick when the plating layer is thick. However, the sequential forming method of the present invention melts the plating layer and gradually forms the plating layer. Is prevented from peeling.

The galvanized steel sheet may be a pure galvanized steel sheet or an alloyed galvanized steel sheet.

In the sequential forming method of the present invention, it is not necessary to melt all of the plating layer, and it may be melted from the surface to about 0.5 μm to 5 μm. If the thickness is less than 0.5 μm, the surface roughness may increase. Depending on the thickness of the plating layer, if it exceeds 5 μm, the substrate may be exposed and the corrosion resistance may be lowered.

In the sequential molding method of the present invention, the sliding frictional heat (μPV) is preferably 3 × 10 ⁸ W / m ² or more, and more preferably 5 × 10 ⁸ W / m ² or more. When the sliding frictional heat (μPV) is 3 × 10 ⁸ W / m ² or more, the pure galvanized layer or the alloyed galvanized layer can be melted and the surface roughness can be reduced.

  EXAMPLES Hereinafter, although an Example demonstrates this invention in detail, this invention is not limited to the following Example.

[Comparative Example 1]
A moving press member (curvature radius R of tip: 3 mm) having a 7 μm thick hard layer coated with polycrystalline diamond on the surface of a carbide substrate is attached to a dieless NC forming device (manufactured by Amino Co., Ltd.) and moved. On the condition that the average sliding speed of the pressing member is 0.75 m / sec and the sliding frictional heat (μPV) is about 5 × 10 ⁸ W / m ² , the galvannealed steel sheet (GA material, plate thickness: 0) , 8 mm, plating thickness: 7 μm).
The surface roughness of the molded product was arbitrarily measured at five locations. The measurement results are shown in Table 1.

[Example 1]
Instead of a moving pressing member having a polycrystalline diamond coating layer containing a conductive material (Co) on its surface, a three-component force meter is attached to the moving pressing member to detect sliding frictional heat (μPV) and respond to sliding frictional heat. Then, molding was performed sequentially in the same manner as in Comparative Example 1 except that the moving pressing member and the fixed pressing member were energized and heated locally until the alloying hot-dip galvanized layer melted.
The surface roughness of the same part as Comparative Example 1 was measured. The measurement results are shown in Table 1.

  From the above results, it can be seen that the surface roughness of the molded product can be reduced by locally heating the contact portion according to the state of the surface of the plate material that the moving pressing tool contacts.

DESCRIPTION OF SYMBOLS 1 Sequential shaping | molding apparatus 2 Board | plate material 3 Support frame 4 Moving press member 5 Fixed press member 6 Three component force meter 7 Thermocouple 8 Infrared camera 9 Power supply 10 Electrode 11 Laser heating device 12 Holder

Claims (14)

The plate material and the moving pressing tool are pressed by a fixed pressing tool provided on one surface side of the plate material supported by the support frame and a moving pressing tool provided on the other surface side. Or a relative forming method of relatively moving the fixed pressing tool and forming the plate material into a three-dimensional shape,
The above-mentioned plate material has a melting point on its surface not higher than the processing temperature,
The temperature of the contact portion between the moving pressing tool and the plate material is processed by heating control to be equal to or higher than the melting temperature of the plate material surface,
The sequential forming method, wherein the heating control is to locally heat the contact portion according to a state of the surface of the plate material that the moving pressing tool contacts, and to melt the surface of the plate material .   The sequential forming method according to claim 1, wherein the heating control is to adjust a heating amount in accordance with sliding frictional heat between the moving pressing tool and the plate material.   The sequential molding method according to claim 1, wherein the heating control adjusts a heating amount according to a temperature of the contact portion.   The sequential forming method according to any one of claims 1 to 3, wherein the plate material is a galvanized steel plate. A sequential molding apparatus used in the sequential molding method according to any one of claims 1 to 4,
A support frame for supporting the periphery of the plate material, a fixed pressing tool provided on one surface side of the plate material, a movable pressing tool provided on the other surface side, a detection device for the plate material surface, and a heating device are provided. ,
The temperature of the contact portion between the moving pressing tool and the plate material is processed by heating to a temperature higher than the melting temperature of the plate material surface,
The sequential forming apparatus, wherein the heating device locally heats the contact portion according to a state of a surface of a plate material which the moving pressing tool contacts.   The heating device is a moving pressing tool having conductivity and a fixed pressing tool having conductivity, and the heating device is locally heated by energizing between the moving pressing tool and the fixed pressing tool. The sequential molding apparatus according to claim 5.   The heating device is a support frame including a plurality of electrodes that are independent of the moving pressing tool having conductivity, and the heating device is locally heated by energizing between the moving pressing tool and the electrode of the support frame. The sequential molding apparatus according to claim 5.   The said heating apparatus changes the direction of the electric current which flows through the said board | plate material by switching the electrode which the said support frame supplies with electricity, and it supplies with electricity in the moving direction of the said moving press tool, It is characterized by the above-mentioned. Sequential molding equipment.   6. The sequential forming apparatus according to claim 5, wherein the heating device is a device that locally heats the moving pressing tool by rotating and / or ultrasonically vibrating the moving pressing tool.   The sequential molding apparatus according to any one of claims 5 to 9, wherein the heating device irradiates the contact portion with an energy beam and locally heats the contact portion. It is a press tool for sequential forming devices given in any 1 paragraph of the above-mentioned Claims 5-10,
The moving pressing tool for a sequential forming apparatus, wherein the contact portion with the plate material contains hard carbon.   The pressing tool for a sequential forming apparatus according to claim 11, wherein the hard carbon is polycrystalline diamond or polycrystalline diamond-like carbon.   The moving pressing tool for a sequential forming apparatus according to claim 11 or 12, wherein the contact portion with the plate further includes a conductive material.   14. The pressing tool for a sequential forming apparatus according to claim 11, wherein a surface roughness (Ra) of a contact portion with the plate material is 0.2 μm or less.

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