JP6500229B2 - Electronic component mounting device - Google Patents

Description

  The present invention relates to an electronic component mounting apparatus for mounting an electronic component on a substrate by a mounting head.

  In a component mounting line for mounting an electronic component on a substrate to produce an electronic substrate, various types of components are mounted on the substrate by an electronic component mounting device. Mounting holes formed on the circuit board that have leads for connecting power transistors, connector parts, etc. in addition to surface mount parts soldered to the electrode surface of the circuit board such as small chip type parts and QFPs in these parts There is an insertion part attached by inserting a lead into. The supply form of such an insertion part in the electronic part mounting apparatus varies depending on the kind of part, and is housed in a tray or the like and supplied in a horizontal posture, or a plurality of electronic parts are connected by taping and supplied in a vertical posture In such cases, the supply attitude of parts differs depending on the kind of parts.

  When the inserted component is supplied in the overturned posture, it is necessary to change the posture of the inserted component to the upstanding posture prior to mounting on the substrate. Therefore, it has a function to change the inserted component in the overturned posture to the upstanding posture. A part insertion machine has been proposed (see, for example, Patent Document 1). In the prior art shown in this patent document, the component holding hand for holding a component is constituted by two arms for holding and holding the component, and a link mechanism having a suction means for suctioning the component, and the component holding hand To change the posture of the component taken out of the component supply means from the sideways posture to the standing posture.

JP 2008-23641 A

  However, the prior art described above has the following disadvantages due to the configuration of the component holding hand. That is, in order to provide the link mechanism used for the component holding hand with a handling function such as changing the posture of the component, a complex mechanism such as an articulated drive mechanism is required. For this reason, it is difficult to make the component holding hand simple and compact, and in the electronic component mounting field where it is essential to work efficiently by making the mounting heads for component mounting compact and multi-connecting. Was difficult to apply. And this subject changes the attitude of the electronic component in a series of mounting operations from taking out the electronic component from the component supply unit to mounting on the substrate as well as the insertion component having the lead inserted into the insertion hole of the substrate Common to all types of electronic components that are required.

  SUMMARY OF THE INVENTION An object of the present invention is to provide an electronic component mounting apparatus capable of efficiently mounting on a substrate by changing the attitude of the electronic component by a mounting head having a compact configuration.

The electronic component mounting apparatus according to the present invention is an electronic component mounting apparatus including a mounting head for mounting an electronic component on a substrate, wherein the mounting head includes a lifting mechanism, and a lifting unit which is lifted and lowered by the lifting mechanism. It has a rotary body held horizontally rotatably with respect to the elevator, a rotation mechanism for horizontally rotating the rotary with respect to the elevator, and a suction path connected to a negative pressure generation source, A component holding unit having a nozzle for holding an electronic component at the opening end of the suction path using negative pressure generated by a pressure generation source, and the rotating body mounted thereon, the direction of the opening end of the nozzle being downward Alternatively, a posture changing mechanism for changing the posture of the component holding portion to be in the horizontal direction, a pusher capable of contacting an electronic component held by the nozzle in the horizontal direction, and the pusher being driven to be held by the nozzle The electronic component And a pusher driving mechanism headed push to, the posture changing mechanism equipped with the component holder to a lower portion of the posture changing mechanism while mounted on the rotary member, further, horizontally rotating the pusher together with the rotary body I did it .

  According to the present invention, the posture of the electronic component can be changed by the mounting head having a compact configuration, and the mounting can be efficiently performed on the substrate.

The perspective view which shows the structure of the electronic component mounting apparatus of one embodiment of this invention The perspective view of the multiple head in the electronic component mounting apparatus of one embodiment of this invention Side view of the mounting head in the electronic component mounting apparatus of one embodiment of the present invention Principal part side view of the mounting head in the electronic component mounting apparatus according to one embodiment of the present invention Bottom view of the mounting head in the electronic component mounting apparatus according to one embodiment of the present invention Sectional view of an attitude changing mechanism used for a mounting head in an electronic component mounting apparatus according to an embodiment of the present invention Sectional view of an attitude changing mechanism used for a mounting head in an electronic component mounting apparatus according to an embodiment of the present invention Explanatory drawing of the lead | read insertion operation | movement in the electronic component mounting apparatus of one embodiment of this invention Explanatory drawing of the lead | read insertion operation | movement in the electronic component mounting apparatus of one embodiment of this invention Explanatory drawing of the determination method of the component mounting error in the electronic component mounting apparatus of one embodiment of this invention A block diagram showing a configuration of a control system of an electronic component mounting apparatus according to an embodiment of the present invention Flow chart showing an electronic component mounting method according to an embodiment of the present invention Explanatory view of component data stored in the storage unit of the electronic component mounting apparatus according to one embodiment of the present invention Explanatory view of electronic component recognition and electronic component pickup in the electronic component mounting method of one embodiment of the present invention

  Next, embodiments of the present invention will be described with reference to the drawings. First, the entire configuration of the electronic component mounting apparatus 1 will be described with reference to FIGS. 1 and 2. In FIG. 1, a substrate transfer mechanism 3 is disposed on the upper surface of the base 2 in the X direction (substrate transfer direction). The substrate transfer mechanism 3 receives the substrate 4 to be mounted of components from the upstream apparatus (not shown), transfers it in the X direction, and positions and holds the mounting work position by the component mounting mechanism described below.

  The first component supply unit 5 and the second component supply unit 6 are disposed on the side (the front side in FIG. 1) of one side of the substrate transfer mechanism 3, and the third on the other side. The component supply unit 7 is arranged. The first component supply unit 5 is a tray feeder for supplying the tray 8 which is a flat container in which the electronic components 9 in the overturned posture are stored in a random state. Here, the “side down posture” refers to an electronic component having a shape that can not be made to stand on its own in a stable mounting posture in which the individual pieces such as leaded electronic components are mounted on the substrate 4. The posture which stored in the tray 8 the possible side as a holding bottom is said. In order to mount the electronic component 9 in the “side-down posture” on the substrate 4, it is necessary to convert the electronic component 9 into a mounting posture on the substrate by vertically rotating the electronic component by 90 degrees in the vertical plane. In the present embodiment, it is assumed that only one layer of electronic components 9 is arranged in the tray 8 and the plurality of electronic components 9 are supplied in a state where they do not overlap vertically as a whole or as a whole.

  The second component supply unit 6 is a radial component feeder that supplies a plurality of radial lead type electronic components 10 that are taped and connected in a standing posture. Here, the "standing posture" refers to the same posture as the mounting posture in which the electronic component is mounted on the substrate. That is, the electronic component in the “standing posture” can be mounted on the substrate 4 while holding the electronic component as it is without performing posture conversion.

  The third component supply unit 7 is a tape feeder that supplies a surface mounting component such as a chip type component held by a carrier tape. The first component supply unit 5, the second component supply unit 6, and the third component supply unit 7 supply the electronic components accommodated therein to the take-out position by the multiple head 14 of the component mounting mechanism described below. . As shown in FIG. 2, the multiple head 14 is a multiple head formed by arranging a plurality of mounting heads 17 in parallel, and the plurality of mounting heads 17 are enclosed by a head cover 14a.

  Above the tray 8, the supply unit recognition camera 11 is disposed with the imaging direction facing downward. The first component supply unit 5 used in the present embodiment does not supply components to be taken out in a regular grid arrangement like a commonly used tray feeder, but has leads 9a protruding from the lower surface. It has a form which has a tray 8 which accommodates the electronic component 9 of the overturned posture in a random state. When taking out the electronic component 9 from the tray 8 by the multiple head 14, the mounting head 17 provided with the multiple head 14 is based on the position recognition result recognized by imaging the electronic component 9 by the supply part recognition camera 11. The electronic component 9 is individually aligned.

  A Y-axis table 13 is disposed in the Y-direction on the upper surface of a pair of frame portions 12 disposed at both ends of the base 2 in the Y-direction, and the X-axis table 15 mounted on the Y-axis table 13 The multiple heads 14 are mounted movably in the X direction. Each of the Y-axis table 13 and the X-axis table 15 has a linear motion mechanism driven by a linear motor. By driving the Y-axis table 13 and the X-axis table 15, the multiple head 14 moves in the X direction and the Y direction.

  Thus, the mounting head 17 provided in the multiple head 14 holds the electronic components supplied from any of the first component supply unit 5, the second component supply unit 6, and the third component supply unit 7. These electronic components are mounted on the substrate 4 positioned and held by the substrate transfer mechanism 3 in a standing posture. That is, the electronic component mounting apparatus 1 has a function of mounting the electronic components on the substrate 4 in a standing posture, with the electronic components supplied in different postures such as a horizontal posture and a standing posture. In the above configuration, the Y-axis table 13, the X-axis table 15, and the multiple head 14 constitute a component mounting mechanism for mounting the electronic component on the substrate 4.

  A component recognition camera 16 is disposed between the first component supply unit 5 and the second component supply unit 6 and the substrate transfer mechanism 3 with the imaging direction facing upward. The component recognition camera 16 is positioned by positioning the multiple heads 14 obtained by taking out the electronic components from the first component supply unit 5, the second component supply unit 6, and the third component supply unit 7 above the component recognition camera 16. The image of the electronic component in the state of being held by the respective mounting heads 17 of the multiple head 14 is captured. Then, recognition processing of the imaging result is performed to perform position recognition of the electronic component. When the electronic component taken out of these component supply parts by the multiple head 14 is attached to the substrate 4, the attachment position correction is performed based on the position recognition result.

  Next, the structure of the mounting head 17 will be described with reference to FIGS. 3, 4 and 5. First, the entire configuration of the mounting head 17 will be described with reference to FIG. 3 showing the side surface of the mounting head 17. FIG. 3 shows a side of one of the plurality of mounting heads 17 covered by the head cover 14 a in the multiple head 14. The mounting head 17 is provided with a vertical mounting base portion 17a on which each of the elements described below is disposed, and mounting is performed by coupling the mounting base portion 17a to a base plate (not shown) constituting the multiple head 14. The head 17 is incorporated as a unit mounting head constituting the multiple head 14.

  A slider 18 a slidably mounted on a guide rail 18 vertically disposed on the mounting base portion 17 a is fixed to the vertical lifting and lowering base portion 19. Above the elevating base portion 19, a Z-axis motor 21 fixed to the mounting base portion 17a via a bracket 21a is disposed with the output shaft facing downward. A feed screw 23 is coupled to an output shaft of the Z-axis motor 21 via a coupling 22. The feed screw 23 is screwed into a nut member 24 coupled to the upper end of the elevating base 19, and the elevating base 19 is moved up and down by driving the Z-axis motor 21. A Z axis origin sensor 25 is disposed on the bracket 21a. In the raising and lowering operation of the raising and lowering base unit 19, the Z axis origin sensor 25 detects the detection dog 26 provided on the upper portion of the raising and lowering base unit 19, whereby the Z axis origin in the raising and lowering operation of the raising and lowering base unit 19 is detected. The Z-axis motor 21 incorporates an encoder, and the Z-axis position in the lifting and lowering operation of the lifting and lowering base unit 19 is determined from the output pulse signal of the encoder and the Z-axis origin detection signal from the Z-axis origin sensor 25.

  At the lower end portion of the elevation base portion 19, a rotating body holding portion 20 provided with a fitting hole 20a penetrating vertically is coupled. The rotating body 37 to which the component holding portion 41 for holding the electronic component 9 to be mounted is coupled is attached to the fitting hole 20a via the bearing 20b (FIG. 4), and the rotating body 37 holds the rotating member. The portion 20 is held so as to be horizontally rotatable. The component holder 41 has a nozzle 42 for holding the electronic component 9. The component holder 41 can change the posture of the nozzle 42 downward or sideways by the posture changing mechanism 40.

  An upper bracket 27 is mounted on the front surface (left side as viewed in the plane of FIG. 3) of the upper portion of the lift base portion 19. The upper bracket 27 protrudes forward to a position covering the upper side of the rotating body holding portion 20. Further, a lower bracket 27 b is mounted on the front surface of the rotating body holding portion 20. The side of the upper bracket 27 and the side of the lower bracket 27b are connected by a connecting plate 27a.

  On the upper surface of the upper bracket 27, a pusher drive cylinder 28 is disposed with the rod 28a (FIG. 4) directed downward. A lift connection portion 29 is coupled to the rod 28a, and an upper end portion of a pusher 30 penetrating the rotary body 37 in the vertical direction is engaged with the lift connection portion 29. By driving the pusher drive cylinder 28, the elevating connecting portion 29 moves up and down together with the pusher 30. The pusher 30 is disposed at a position where it can be in contact with the electronic component 9 held by the suction pad 42 a of the nozzle 42 whose orientation is horizontal. By driving the pusher drive cylinder 28 to lower the pusher 30 together with the elevating connecting portion 29, the contact portion 30a of the pusher 30 is brought into contact with the electronic component 9 held by the component holding portion 41 to press the lead 9a. It can be pushed into the insertion hole 4 a of the substrate 4.

  That is, in the above configuration, the pusher drive cylinder 28 and the elevating connecting portion 29 constitute a pusher drive mechanism for driving the pusher 30 up and down, and the pusher drive mechanism drives the pusher 30 to hold the electronic components held by the nozzle 42 It has a function of pushing 9 toward the substrate 4. The pusher 30 is disposed so as to penetrate the rotary body 37 up and down, and the lower end portion of the pusher 30 which protrudes downward is provided with the contact portion 30 a to be in contact with the electronic component 9. It is configured to be coupled to the elevation connection portion 29 of the pusher drive mechanism.

  A dog plate 32 for mounting determination of the electronic component 9 is disposed in the elevating connection portion 29. In the raising and lowering operation in which the dog plate 32 moves up and down together with the raising and lowering connecting portion 29, the electronic component 9 is a substrate by detecting the slit (see FIG. 10) formed in the dog plate 32 by the mounting determination sensor 31 fixed to the connecting plate 27a. It is possible to determine whether or not the device is properly attached.

  The θ-axis motor 33 is disposed on the upper surface of the lower bracket 27b with the rotation shaft 33a (FIG. 4) directed downward. A belt 36 is aligned with the drive pulley 34 coupled to the rotation shaft 33 a and the driven pulley 35 coupled to the upper end of the rotating body 37. The elevation base portion 19 is provided with a θ axis origin sensor 38 for detecting a detection dog 39 fixed to the upper surface of the driven pulley 35, and the θ axis origin sensor 38 detects the dog 39 in the θ rotation operation of the rotary body 37. By detection, the origin in the θ direction is detected. By driving the θ-axis motor 33, the rotating body 37 rotates about the vertical rotation axis AX (FIG. 4). In the rotation of the rotating body 37, the pushers 30 provided to penetrate the rotating body 37 up and down are also horizontally rotated around the rotation axis AX. With such a configuration, the relative positional relationship between the pusher 30 and the nozzle 42 can be kept constant regardless of the orientation of the rotary body 37.

  In FIG. 4 showing the main part of the mounting head 17, a guide rail 29f is vertically disposed on the elevating base portion 19 and elevating the slider 29b slidably fitted on the guide rail 29f in the vertical direction. The upper member 29a which comprises the connection part 29 is couple | bonded. The rod 28a of the pusher drive cylinder 28 is engaged with the upper member 29a, and the lower member 29d is coupled to the lower surface of the upper member 29a via the needle bearing 29c in a state where relative rotation about the rotation axis AX is permitted. ing. An engagement projection 30b provided on the upper end of the pusher 30 is engaged with an engagement recess 29e formed in the lower member 29d. The above-mentioned dog plate 32 is mounted on the upper member 29a.

  By driving the pusher drive cylinder 28, the elevating connecting portion 29 and the pusher 30 move up and down together. At this time, since the lower member 29d is coupled to the upper member 29a via the needle bearing 29c, the relative rotation of the pusher 30, which rotates horizontally with the rotary body 37, with respect to the upper member 29a is not hindered.

  In the above configuration, the Z-axis motor 21, the feed screw 23, the guide rail 18, and the slider 18a constitute an elevating mechanism, and the elevating base portion 19 and the rotating body holding portion 20 are elevating portions that are elevated by the elevating mechanism. . The θ-axis motor 33, the drive pulley 34, the driven pulley 35, and the belt 36 constitute a rotation mechanism that horizontally rotates the rotating body 37 with respect to the elevating unit. Furthermore, the upper member 29a, the slider 29b, and the guide rail 29f constitute a sub-lifting unit that moves up and down relative to the lifting and lowering unit of the above configuration by the pusher drive cylinder 28 that is a drive source. The lower member 29 d is horizontally rotatably mounted under the sub-lifting portion and is a coupling portion coupled to the upper end portion of the pusher 30. That is, the pusher driving mechanism shown in the present embodiment includes the sub-lifting portion having the above-described configuration, and a coupling portion mounted horizontally rotatably below the sub-lifting portion and coupled to the upper end portion of pusher 30. It has become.

  A posture changing mechanism 40 is mounted below the lower surface of the rotating body 37 which is horizontally rotatably supported by the elevating unit having the above-described structure and which is horizontally rotated by the above-described rotating mechanism. Further, on an output shaft 66 (see FIGS. 5, 6 and 7) provided at the lower part of the posture changing mechanism 40, a component holding portion 41 provided with a nozzle 42 for suction-holding the electronic component 9 is mounted. The posture changing mechanism 40 has a function of changing the posture of the component holding portion 41 so that the suction pad 42a which is the opening end of the nozzle 42 is directed downward or sideways. .

  As shown in FIG. 4, the first annular flow passage 20c and the second annular flow passage are provided on the inner peripheral surface of the fitting hole 20a (see FIG. 3) in the rotating body holding portion 20 in which the rotating body 37 is fitted. 20 d are formed. The first annular flow passage 20c and the second annular flow passage 20d communicate with the first connector 50 and the second connector 51, respectively, and both the first connector 50 and the second connector 51 are valve units. A positive pressure source 58 and a negative pressure source 59 are connected via 57. Inside the rotary body 37, a first internal flow passage 52 and a second internal flow passage 53 opened at a height position communicating with the first annular flow passage 20c and the second annular flow passage 20d are formed. ing. With this configuration, the first internal flow passage 52 and the second internal flow passage 53 always communicate with the first annular flow passage 20c and the second annular flow passage 20d regardless of the rotational direction position of the rotary body 37. In the state.

  The first inner flow passage 52 communicates with the third connector 54 provided on the lower surface of the rotary body 37, and the second inner flow passage 53 is an air introducing hole 61a provided in the posture changing mechanism 40 (see FIG. 6) in communication. The third connector 54 is connected to the fourth connector 55 provided in the component holder 41 via the tube pipe 56. Here, the third connector 54 is in communication with the suction pad 42 a, which is the open end of the nozzle 42, via the suction passage 41 a provided in the component holding portion 41.

  The posture changing mechanism 40 is driven by driving the positive pressure generation source 58 to supply positive pressure air to the posture changing mechanism 40 via the valve unit 57, the second annular flow passage 20d, and the second internal flow passage 53. Can be operated to change the posture of the component holder 41. Further, the negative pressure generation source 59 is driven, and the valve unit 57, the first annular flow passage 20c, the first internal flow passage 52, the third connector 54, the tube piping 56, the fourth connector 55 and the suction passage 41a. The electronic component 9 can be held by vacuum suction with the suction pad 42 a by vacuum suction from the suction pad 42 a via the

  That is, the component holding portion 41 has a suction passage 41a connected to the negative pressure generation source 59, and uses the negative pressure generated by the negative pressure generation source 59 to use the suction pad 42a which is the open end of the suction passage 41a. The nozzle 42 holds the electronic component 9. Further, by driving the positive pressure generation source 58, the valve unit 57, the first annular flow passage 20c, the first internal flow passage 52, the third connector 54, the tube piping 56, the fourth connector 55 and the suction passage By exhausting positive pressure air from the suction pad 42a through 41a, the electronic component 9 suctioned and held by the suction pad 42a can be detached from the nozzle 42.

  Further, in vacuum suction or positive pressure exhaust from the suction pad 42a, the flow rate sensor 75 (FIG. 11) detects the vacuum suction flow rate or the positive pressure exhaust flow rate and compares it with a preset threshold. Can detect whether the electronic component 9 is normally held by the suction pad 42a. In the present embodiment, by detecting the component holding state by the nozzle 42 after the component mounting operation by the component holding unit 41, whether the component mounting to the substrate 4 is correct or not is determined.

  Next, with reference to FIG. 5 showing a bottom view of the rotating body holding unit 20, the arrangement of the component holding unit 41, the attitude changing mechanism 40, and the pusher 30 on the lower surface of the rotating body 37 will be described. In FIG. 5, a posture changing mechanism 40 and a pusher 30 are further provided so as to protrude from the lower surface of the rotating body 37 protruding from the lower surface of the rotating body holding portion 20. On the inner side surface of the rotating body 37 of the posture changing mechanism 40, a component holding unit 41 provided with a suction pad 42a is vertically rotatably provided. Here, a state in which the suction pad 42a is directed downward (surface direction in the drawing), that is, an attitude when the electronic component is suctioned by the suction pad 42a is shown.

  Here, the relative positional relationship between the contact portion 30a of the pusher 30 and the suction pad 42a is such that the rotation center 37a of the rotating body 37 is located in the middle of the line connecting the contact portion 30a and the suction pad 42a. There is. That is, in the pusher 30, the position of the contact portion 30a in contact with the electronic component 9 is disposed horizontally away from the rotation center 37a of the rotary member 37, and the suction pad 42a is the open end of the nozzle 42 turned downward. Is arranged at a position sandwiching the rotation center 37a of the rotary body 37 between the center of the roller and the contact portion 30a of the pusher 30 in a plan view.

  In the example shown in FIG. 5, the rotation center 37a is located on the line connecting the contact portion 30a and the suction pad 42a, but the rotation center 37a necessarily connects the contact portion 30a and the suction pad 42a. It is not necessary to be located on the line, and it is sufficient if the rotation center 37a is sandwiched in plan view by the center of the suction pad 42a and the contact portion 30a. The point is that the center of the suction pad 42a and the contact portion 30a are disposed at positions respectively separated on both sides in the horizontal direction from the rotation center 37a on the lower surface of the rotary body 37. As a result, the radius of rotation of the contact portion 30a and the rotation center 37a of the nozzle 42 can be reduced, and the component holding portion 41 and the pusher 30 can be disposed in a space as compact as possible. The mounting head 17 can be realized with a small occupied space.

  Next, the internal structure and function of the posture change mechanism 40 will be described with reference to FIGS. 6 and 7. As shown in FIG. 6, the posture changing mechanism 40 mainly includes a main body 40 a having a rectangular block shape elongated in the vertical direction. A drive cylinder 61 and a return cylinder 62 are formed in the longitudinal direction inside the main body 40 a, and a fan-shaped housing portion 63 is formed below the drive cylinder 61 and the return cylinder 62. A drive piston 64 having rods 64a and 67a and a return piston 67 are fitted to the drive cylinder 61 and the return cylinder 62, and the housing portion 63 has an output shaft 66 which is a horizontal axis at the center. A substantially semicircular swing member 65 is rotatably fitted.

  At the top of the drive cylinder 61 in which the drive piston 64 is fitted, an air introduction hole 61a for introducing air pressure for drive is provided. By introducing air pressure into the drive cylinder 61 from the air introduction hole 61a, the drive piston 64 is lowered to push down the drive end 65a, whereby the swing member 65 is rotated. The component holder 41 is attached to the output shaft 66 coupled to the swing member 65. That is, the posture changing mechanism 40 is configured to include a swing member 65 rotatable around an output shaft 66 which is a horizontal axis, and a drive piston 64 which is vertically moved by air pressure to rotate the swing member 65. The component holder 41 is mounted on an output shaft 66 (see FIGS. 3 and 4) that rotates with the swing member 65.

  In the return cylinder 62, a spring member 68, which is a compression spring for return operation, is attached to the upper portion of the return piston 67, and in a state where pneumatic pressure for driving is not introduced into the drive cylinder 61, the return piston 67 is a spring. It is pushed down by the biasing force of the member 68 and located at the bottom dead center. In this state, the lower end of the rod 67a pushes down the return end 65b of the swing member 65, the swing member 65 is positioned at the counterclockwise rotation limit, and the drive piston 64 is at the top dead center in the drive cylinder 61. positioned. In this state, the component holder 41 coupled to the output shaft 66 is held in a posture in which the suction pad 42a is directed downward.

  FIG. 7 shows a state in which driving air pressure is introduced from the air introduction hole 61 a in the posture change mechanism 40 (arrow a). That is, in the drive cylinder 61, the drive piston 64 is pneumatically driven to lower the rod 64a (arrow b), whereby the drive end 65a of the swing member 65 is pushed down and the swing member 65 is rotated. The shaft 66 rotates clockwise (arrow c). As a result, the component holding portion 41 coupled to the output shaft 66 is changed in posture such that the suction pad 42 a is in the horizontal direction. At the same time, in the return cylinder 62, the rod 67a is pushed up (arrow d) by the return end 65b, and the spring member 68 is compressed by the return piston 67. Then, the introduction of the air pressure from the air introduction hole 61a is stopped, and the return piston 67 is pushed down by the elastic force of the spring member 68. As a result, the posture changing mechanism 40 returns to the state shown in FIG. 6, and the component holding portion 41 takes a posture in which the suction pad 42a is directed downward.

  Next, with reference to FIG. 8, FIG. 9, and FIG. 10, the mounting operation and mounting error detection of the electronic component 9 by the mounting head 17 will be described. First, in FIG. 8, the mounting head 17 in a state where the electronic component 9 is adsorbed and held by the suction pad 42 a of the component holder 41 is moved relative to the substrate 4 to be mounted, and the lead 9 a of the electronic component 9 is inserted into the substrate 4. It shows the state aligned with 4a. At this time, the lead 9a is not inserted into the insertion hole 4a, and the lower end portion of the lead 9a is in alignment with the insertion hole 4a. The pusher 30 driven by the pusher drive cylinder 28 is at the raised position, and the contact portion 30 a at the lower end is at a position separated from the electronic component 9. This state is confirmed by the mounting judgment sensor 31 detecting the second slit 32b (see FIG. 10) for detecting the rising position formed at the lower end of the dog plate 32.

  Next, FIG. 9 shows a state in which the mounting of the electronic component 9 is completed by inserting the lead 9 a into the insertion hole 4 a of the substrate 4. That is, the pusher drive cylinder 28 is driven to lower the pusher 30 (arrow e), and the contact portion 30a is brought into contact with the upper surface of the electronic component 9 in a state of being held by suction by the suction pad 42a. As a result, the electronic component 9 in the state of being held by the suction pad 42 a slides downward in the standing posture, and the lead 9 a is completely pushed into the insertion hole 4 a of the substrate 4. Thereby, the attachment of the electronic component 9 to the substrate 4 is completed. At this time, the mounting determination sensor 31 detects the first slit 32a (see FIG. 10) formed on the dog plate 32 which is lowered together with the elevating connection portion 29 for the mounting success detection, whereby the mounting success is detected.

  Here, the mounting determination by the mounting determination sensor 31 and the dog plate 32 will be described. As shown in FIGS. 8 and 9, a dog plate 32 shown in FIG. 10 is disposed at the elevating connecting portion 29 which is moved up and down together with the pusher 30 by the pusher driving cylinder 28. The dog plate 32 is formed with two slits, a first slit 32a and a second slit 32b from the upper side. The lower second slit 32b is a slit for confirming the state shown in FIG. 8A, that is, that the pusher 30 is in the raised position, and the mounting determination sensor 31 detects the second slit 32b. Thus, it is detected that the pusher 30 is in the raised position.

  The upper first slit 32 a is a slit corresponding to the detection position of the mounting determination sensor 31 in a state where the contact portion 30 a is in contact with the electronic component 9 mounted normally. When the mounting determination sensor 31 detects the first slit 32a, it is detected that the pusher 30 pushes the electronic component 9 and the lead 9a is properly inserted into the insertion hole 4a.

  A pattern example of mounting success and mounting failure will be described with reference to FIG. FIG. 10A shows an example in which the lead 9a is completely inserted into the insertion hole 4a by pressing the electronic component 9 against the substrate 4 by the contact portion 30a of the pusher 30, and the mounting is successful. . In this case, the detection optical axis 31a of the mounting determination sensor 31 matches the first slit 32a of the dog plate 32, the mounting determination sensor 31 detects light transmission, and it is determined that the component mounting has succeeded.

  On the other hand, in FIG. 10B, as a result of the lead 9a being misaligned with respect to the insertion hole 4a, even if the electronic component 9 is pressed against the substrate 4 by the contact portion 30a of the pusher 30, the lead 9a Is not inserted into the insertion hole 4a. In this case, the detection optical axis 31a of the mounting determination sensor 31 is at the light shielding position where the slit does not exist in the dog plate 32, does not output a light transmission signal, and it is determined that component mounting has failed.

  FIG. 10C shows a state in which the pusher 30 is lowered while the component holding portion 41 does not hold the electronic component 9 to be attached. In this case, since there is no electronic component 9 to be pushed, the pusher 30 is lowered below the normal abutment position. As a result, the dog plate 32 is lowered to a position where the first slit 32 a overruns downward with respect to the detection optical axis 31 a of the mounting determination sensor 31. Also in this case, the detection optical axis 31a of the mounting determination sensor 31 is at the light shielding position where the slit does not exist in the dog plate 32, does not output a light transmission signal, and it is determined that component mounting has failed.

  The mounting error detection process of the electronic component 9 described above is executed by the mounting error detection unit 72 (see FIG. 11) included in the electronic component mounting device 1. That is, the mounting error detection unit 72 detects the position of the pusher 30 when the pusher drive mechanism pushes the electronic component 9 held in the component holding unit 41 by the pusher 30 toward the substrate 4 to thereby detect the electronic component 9. To detect mounting errors. Here, the position of the pusher 30 is detected by the dog plate 32 which is disposed at the elevating connection portion 29 and is moved up and down together with the pusher 30 and the first slit 32a and the second slit 32b are formed at predetermined positions. This is performed by detecting whether the detection optical axis 31a of the sensor 31 is in the light shielding state or in the light transmitting state.

  Next, the configuration of the control system will be described with reference to FIG. In FIG. 11, the electronic component mounting apparatus 1 includes a storage unit 71 and a control unit 70 including a mounting error detection unit 72. An operation / input unit 73 is connected to the control unit 70, and the operation / input unit 73 inputs an operation command for operating the electronic component mounting apparatus 1 and inputs data to the storage unit 71. The storage unit 71 stores an operation program necessary for component mounting work by the electronic component mounting apparatus 1 and component information on electronic components to be mounted. Here, the component information stored in the storage unit 71 includes, as shown in FIG. 13, information on the suction target position PC on the side surface of the electronic component 9.

  In the component information, a suction target position PC when the mounting head 17 is aligned with the electronic component and the side surface of the electronic component 9 is sucked by the nozzle 42 is defined. In the example shown in FIG. 13, two end points P1 of the upper surface 9c which is the opposite surface of the lower surface 9b provided with the leads 9a in the electronic component 9 are defined as the feature points of the electronic component 9. A point separated by a predetermined dimension D appropriately set according to the component type from the midpoint PM of the two end points P1 toward the central portion of the electronic component 9 is set as the suction target position PC. When the electronic component 9 stored in the tray 8 of the first component supply unit 5 in the overturned posture is taken out by the mounting head 17, the mounting head 17 is positioned such that the suction target position PC described above is suctioned by the nozzle 42. Align.

  The control unit 70 is connected to the substrate transfer mechanism 3, the first component supply unit 5, the second component supply unit 6, the third component supply unit 7, the X-axis table 15, and the Y-axis table 13. Furthermore, the control unit 70 is connected to the Z-axis motor 21, the θ-axis motor 33, and the pneumatic circuit 74 that constitute the mounting head 17. The pneumatic circuit 74 includes the valve unit 57, the first annular flow passage 20c, the second annular flow passage 20d, the first annular flow passage 20c, the second annular flow passage 20d, and the first connector shown in FIG. 50, a fluid circuit for performing positive pressure application and vacuum suction for operating each part of the mounting head 17 such as the second connector 51, and connected to the positive pressure generation source 58 and the negative pressure generation source 59 .

  The control unit 70 controls the pneumatic circuit 74 to supply positive pressure or negative pressure to the component holding unit 41, the attitude change mechanism 40, and the pusher drive cylinder 28 at necessary timing. As a result, component suction by the nozzle 42 of the component holding unit 41, posture change of the component holding unit 41 by the posture changing mechanism 40, and push-down operation of the pusher 30 by the pusher drive cylinder 28 are executed. A flow rate sensor 75 is interposed in the flow path leading to the component holding unit 41, and the flow rate measurement result by the flow rate sensor 75 is transmitted to the mounting error detection unit 72 of the control unit 70.

  In the component mounting operation described above, the control unit 70 controls the above-described units based on various programs and data stored in the storage unit 71. As a result, the electronic component mounting apparatus 1 transports the substrate 4 by the mounting head 17 from the substrate transfer operation of transferring the substrate 4, the first component supply unit 5, the second component supply unit 6, and the third component supply unit 7. A component mounting operation for taking out and mounting on the substrate 4 is performed. In control of these operations, detection results transmitted to the control unit 70 from the mounting determination sensor 31 provided on the mounting head 17, the Z-axis origin sensor 25, and the θ-axis origin sensor 38 are referred to.

  The imaging result by the supply unit recognition camera 11 and the component recognition camera 16 is recognized and processed by an image recognition function built in the control unit 70. The recognition process of the imaging result by the supply unit recognition camera 11 recognizes the plurality of electronic components 9 stored in the tray 8 in the sideways posture in the random state. As a result, the suction target position PC (see FIG. 13) to be sucked by the direction in the horizontal plane of each electronic component 9 and the nozzle 42 is acquired. Further, by performing recognition processing on the imaging result by the component recognition camera 16, the positions of the leads of the electronic component 9 and the electronic component 10 held by the mounting head 17 are acquired.

  Next, the function of the mounting error detection unit 72 will be described. In the electronic component mounting apparatus 1 shown in the present embodiment, two types of mounting error detection methods can be selectively used according to the type of electronic component to be mounted. That is, the mounting error detection unit 72 pushes the electronic component 9 held by the component holding unit 41 by the pusher 30 toward the substrate 4 for the electronic component 9 supplied by the first component supply unit 5. The first mounting error detection unit detects the presence or absence of mounting error of the electronic component 9 by detecting the position of the pusher 30, and the electronic component 10 supplied by the second component supply unit 6 A second mounting error detection unit is set which detects mounting error of the electronic component 10 by detecting the presence or absence of the electronic component 10 at the suction pad 42a which is the opening end of the nozzle 42 after mounting the component 10 .

  The presence or absence of the electronic component 10 in the suction pad 42a is determined by comparing the flow rate measurement result of the flow rate sensor 75 with a preset threshold value. As a flow rate measurement result of the flow rate sensor 75, a vacuum suction flow rate in a state of vacuum suction from the suction pad 42a in component suction operation may be used, or in a state of positive pressure exhaust from the suction pad 42a in component detachment operation Any of the positive pressure exhaust flow rates may be used.

  The electronic component mounting apparatus 1 shown in the present embodiment is configured as described above, and the component mounting operation by the electronic component mounting apparatus 1 will be described below. First, in the electronic component mounting apparatus 1 configured as described above, an example will be described in which component mounting work is performed with the first component supply unit 5 and the second component supply unit 6 as component removal targets. That is, in the example shown here, the mounting head 17 provided in the multiple head 14 is the electronic component 9 supplied from the first component supply unit 5 or the electronic component 10 supplied from the second component supply unit 6. Hold and mount on the substrate 4 in a standing posture.

  As described above, the mounting head 17 includes the component holding portion 41, the posture changing mechanism 40, and the pusher 30, and prepares the mounting head 17 having the above-described configuration prior to the component mounting operation (mounting head preparation step ). Next, the first component supply unit 5 that supplies the electronic component 9 in the overturned posture and the second component supply unit 6 that supplies the electronic component 10 in the upright posture are prepared (component supply unit preparation step). When the component mounting operation is performed, the control unit 70 controls the mounting head 17 to perform the following operation.

  That is, when the electronic component 9 supplied from the first component supply unit 5 is attached to the substrate 4, after holding the electronic component 9 in the overturned posture by the nozzle 42 with the suction pad 42 a at the open end facing downward. The electronic component 9 held by the suction pad 42a is changed to the upright posture by turning the suction pad 42a sideways by the posture change mechanism 40, and the electronic component 9 in the upright posture held by the horizontal suction pad 42a is pushed by the pusher 30. At the same time as the first electronic component mounting step).

  When the electronic component 10 supplied from the second component supply unit 6 is attached to the substrate 4, the electronic component 10 in the upright posture is held by the nozzle 42 with the suction pad 42a at the open end facing downward. The electronic component 10 in the upright posture held by the nozzle 42 with the pad 42 a directed downward is mounted on the substrate 4 (second electronic component mounting step).

  Then, in the above-mentioned electronic component mounting step, in the case of detecting mounting error of the electronic component 9 supplied from the first component supply unit 5 in the first electronic component mounting step, the second setting in the mounting error detection unit 72 This is performed by the mounting error detection unit 1 (first mounting error detection step). That is, the presence or absence of a mounting error of the electronic component 9 is detected by detecting the position of the pusher 30 in the first electronic component mounting step. When a mounting error of the electronic component 10 supplied from the second component supply unit 6 is detected in the second electronic component mounting process, the second mounting error detection unit set in the mounting error detection unit 72 is performed (Second mounting error detection step). That is, by detecting the presence or absence of the electronic component 10 on the suction pad 42a of the nozzle 42 after the second electronic component mounting step, a mounting error of the electronic component is detected.

  Next, with reference to FIG. 12, the electronic component mounting method by the electronic component mounting apparatus 1 shown in the present embodiment will be described. Here, in the electronic component mounting apparatus 1, the electronic component 9 supplied by the first component supply unit 5 is inserted into the insertion hole 4 a of the substrate 4 by inserting the lead 9 a protruding from the lower surface thereof and mounted on the substrate 4 The method of mounting will be described.

  First, prior to the start of the electronic component mounting operation, the mounting head 17 necessary for performing the mounting operation is prepared (mounting head preparation step). Here, as shown in FIG. 3 and FIG. 4, the mounting head 17 provided with the component holding portion 41, the posture changing mechanism 40, the pusher 30, and the rotating body 37 is prepared. At the same time, the electronic component 9 is supplied sideways (electronic component supply process). That is, the first component supply unit 5 prepares the tray 8 in which the electronic components 9 are accommodated in a random state in a sideways posture. As a result, the electronic component mounting operation can be performed.

  When the electronic component mounting operation is started, electronic component imaging is first executed (ST1). That is, among the plurality of electronic components 9 in the random state in the tray 8, the electronic component 9 to be mounted is taken from above by the supply unit recognition camera 11. Thereby, an image shown in FIG. 14A is acquired. Here, an example is shown in which four electronic components 9 of electronic components 9 (1), (2), (3), and (4) among the plurality of electronic components 9 in the tray 8 are to be imaged. .

  Next, electronic component recognition is performed on the acquired image (ST2). That is, the position and the direction in the horizontal direction of the electronic component 9 supplied in the sideways posture are recognized (electronic component recognition step). In the example shown here, the side from which the lead 9 a is extended for the four electronic components 9 placed in different horizontal directions respectively, the electronic components 9 (1), (2), (3), and (4) The suction target position PC specified by the definition shown in FIG. 13 is obtained by the recognition process, the lower surface 9 b being the surface of the lower surface 9 b, the horizontal direction of the electronic component 9 (direction angle orthogonal to the lower surface 9 b).

  Next, based on the position recognition result acquired in FIG. 14A, suction position movement for moving the mounting head 17 is performed (ST3). Here, in one mounting operation turn for moving the multiple head 14 from the first component supply unit 5 to the substrate 4, the plurality of mounting heads 17 included in the multiple head 14 are sequentially aligned with the electronic component 9 An example is shown. That is, in each mounting head 17, the plurality of mounting heads 17 of the multiple head 14 are sequentially moved so that the suction pad 42a which is an open end is positioned above the plurality of electronic components 9 recognized in the electronic component recognition step. At the same time, the rotary member 37 is horizontally rotated so that the lower surface 9b of the electronic component 9 from which the lead 9a protrudes is directed in the opposite direction to the pusher 30 (electronic component suction preparation step).

  At this time, component information (FIG. 13) stored in the storage unit 71 is read prior to the electronic component suction preparation step, and information on the suction target position PC on the side surface of the electronic component 9 is referenced (component information reference step). Then, in the electronic component suction preparation step, the mounting head 17 is moved so that the suction pad 42a which is the opening end of the nozzle 42 is correctly positioned above the suction target position PC.

  FIG. 14 (b) shows the mounting head 17 (1) provided to the multiple electronic head 14 in the four electronic components 9 (1), (2), (3) and (4) shown in FIG. 14 (a). The state at the time of sequentially aligning (2), (3), and (4) is shown. For example, when aligning the mounting head 17 (1) with the electronic component 9 (1), the suction pad 42a of the mounting head 17 (1) is aligned with the suction target position PC of the electronic component 9 (1). The mounting head 17 (so that the pusher 30 and the rotation center 37a are positioned on a straight line passing through the suction target position PC and perpendicular to the lower surface 9b and the suction target position PC and the pusher 30 sandwich the rotation center 37a. 1) Align.

  Next, the electronic component pickup is performed (ST4). Here, first, the electronic component 9 (1) is picked up by the mounting head 17 (1) described above. That is, the Z-axis motor 21 is driven in the mounting head 17 (1) to lower the component holding portion 41, and the suction target position PC of the electronic component 9 (1) in the sideways posture is suctioned by the suction pad 42a of the nozzle 42. Hold (electronic component pickup process). Then, the electronic component pickup process is repeatedly executed until all electronic components 9 scheduled for the component mounting turn are completed (ST5). That is, the electronic components 9 (2), (3) and (4) are sequentially picked up similarly by the subsequent mounting heads 17 (2), (3) and (4).

  Next, the attitude of the component holder 41 is changed (ST6). That is, in each mounting head 17 picking up and holding the electronic component 9, the component holding portion 41 is vertically rotated by the posture changing mechanism 40 to lead the electronic component 9 held by suction to the suction pad 42 a, The lower face 9b from which the face 9a protrudes is changed to a standing posture directed downward (posture changing step).

  Next, lead imaging is performed. That is, the multiple head 14 is moved to the upper side of the component recognition camera 16, and here, the component recognition camera 16 picks up an image of the lead 9 a of the electronic component 9 held in the standing posture by each mounting head 17 of the multiple head 14 from below. (ST7). Next, lead recognition is performed. That is, the position of the lead 9a is recognized in each electronic component 9 by recognizing the image acquired by imaging by the recognition processing function incorporated in the control unit 70 (lead recognition step) (ST8).

  Thereafter, the mounting head 17 is positioned (ST9). That is, the multiple heads 14 are moved to the upper side of the substrate 4 to sequentially align the plurality of mounting heads 17 provided in the multiple heads 14 with the component mounting positions of the substrate 4 to execute the component mounting operation. Here, first, the lead 9a of the electronic component 9 whose posture has been changed to the upright posture by moving the mounting head 17 (1) first, and the insertion hole 4a of the substrate 4 into which the lead 9a is inserted (FIG. 8, (See FIG. 9) (alignment step). This alignment step is performed based on the position of the lead 9a recognized in the lead recognition step performed after the posture change step.

  The electronic component 9 has a plurality of leads 9a, and in the state of being held by suction by the suction pads 42a of the component holding portion 41, the direction in which the plurality of leads 9a are arranged in parallel is as shown in FIG. It depends on the In order to insert the leads 9a in such a state into the insertion holes 4a formed in the predetermined direction in the substrate 4 and correctly mount the electronic component 9 on the substrate 4, the insertion in the column direction of the plurality of leads 9a corresponds It is necessary to align the holes 4a in the row direction. For this reason, in the above-described alignment step, the row direction of the leads 9a is aligned with the row direction of the insertion holes 4a by horizontally rotating the rotary body 37 around the rotation center 37a.

  Next, lead pre-insertion is performed (ST10). Here, between the alignment step of aligning the lead 9a and the insertion hole 4a and the insertion step described below, the component holding portion 41 is lowered to the substrate 4 to form the lead 9a of the electronic component 9 in the standing posture. Only the lower end is inserted into the insertion hole 4a of the substrate 4 (preliminary insertion step). After this, lead insertion is performed (ST11). That is, the pusher 30 is brought into contact with the upper surface of the electronic component 9 in the upright posture and pushed into the substrate 4 to completely insert the lead 9a into the insertion hole 4a of the substrate 4 (insertion step).

  Next, a mounting error determination is performed (ST12). Here, after the insertion step, the position of the pusher 30 is detected to determine the presence or absence of the mounting error of the electronic component mounting (mounting error determination step). The determination of the mounting error is performed by the method shown in FIG. Here, if it is determined that there is a mounting error (see the mounting failure example shown in FIGS. 10B and 10C), error notification & device stop will be performed (ST13). That is, notification of occurrence of mounting error is notified by notification means (not shown) such as a notification light and a notification screen provided in the electronic component mounting device 1, and the device is stopped.

  When it is determined that there is no mounting error in (ST12), or after the predetermined operation is performed in (ST13) and the apparatus operation is resumed, the next mounting head 17 provided in the multiple head 14 is As a target, the work processing after (ST9) is repeatedly performed (ST14). Then, when it is confirmed in (ST14) that all the work on the mounting head 17 to be mounted in the multiple head 14 has been completed, the electronic component mounting work is ended.

  As described above, in the electronic component mounting apparatus 1 shown in the present embodiment, the electronic component 9 is mounted using negative pressure in the mounting head 17 that changes the posture of the electronic component 9 with a lead and mounts it on the substrate 4. The electronic component 9 held by the nozzle 42 in the sideways posture is provided with a posture changing mechanism 40 for changing the posture of the component holding portion 41 having the nozzle 42 so that the suction pad 42a of the nozzle 42 faces downward or sideways. A lead 9a is inserted by pushing toward the substrate 4 by the reference numeral 30, and the posture changing mechanism 40 is mounted on a horizontally rotatable rotary member 37 with respect to a lifting unit which is lifted and lowered by the lifting and lowering mechanism. Thus, the attitude of the electronic component 9 can be changed and mounted on the substrate 4 by the mounting head 17 having a compact configuration.

  In the electronic component mounting apparatus 1 and the electronic component mounting method according to the present embodiment, the electronic component 9 supplied from the first component supply unit 5 in the sideways posture and the upright posture supplied from the second component supply unit 6 In the case of mounting the electronic component 9 supplied in the overturned posture in mounting the electronic component 10 mounted on the substrate 4 by the common mounting head 17, the downturned nozzle 42 holds the electronic component 9 in the overturned posture After that, when the electronic component 9 changed to the upright posture by turning the nozzle 42 sideways by the posture change mechanism 40 is pushed into the substrate 4 by the pusher and mounted, and the electronic component 10 supplied in the upright posture is mounted, The mounting head 17 is operated so that the electronic component 10 in the standing posture is held by the downward nozzle 42 and the electronic component 10 in the standing posture is mounted on the substrate 4 It is as to cause. As a result, the plurality of types of electronic components 9 and 10 supplied in different attitudes can be taken out, the attitudes of the electronic components can be changed as needed, and the electronic components can be efficiently mounted on the substrate 4.

  Furthermore, in the electronic component mounting method of mounting the electronic component 9 having the lead 9a protruding from the lower surface to the substrate 4 by the electronic component mounting device 1 shown in the present embodiment, the horizontal direction of the electronic component 9 supplied in the overturned posture is The position and direction are recognized, and the mounting head 17 is moved so that the nozzle 42 of the mounting head 17 is positioned above the electronic component 9, and the rotating body 37 is directed in the direction in which the lower surface of the electronic component 9 faces the pusher. The component holder 41 is lowered and the nozzle 42 sucks and holds the electronic component 9 in the sideways posture, and the component holder 41 is rotated vertically to change the held electronic component 9 to the standing posture Align the lead 9a of the electronic component 9 whose posture has been changed to the upright posture with the insertion hole 4a of the substrate 4 into which the lead 9a is inserted, and the electronic portion of the pusher 30 in the upright posture 9 top to abut against the have to insert the lead 9a into the insertion hole 4a of the substrate 4 is pushed into the substrate 4. Thus, the mounting head 17 having a compact configuration can change the posture of the electronic component 9 and efficiently mount it on the substrate 4 with the electronic component 9 having the protruding leads 9 a and supplied in the overturned posture as a target. .

  The electronic component mounting apparatus of the present invention has an effect that the mounting head of the compact configuration can change the posture of the electronic component and efficiently mount it on the substrate, and the field of mounting the electronic component on the substrate by the mounting head It is useful in

DESCRIPTION OF SYMBOLS 1 electronic component mounting apparatus 4 board | substrate 5 1st components supply part 6 2nd components supply part 7 3rd components supply part 8 tray 9, 10 electronic components 9a lead 14 multiple head 17 mounting head 19 raising / lowering base part 20 rotation Body holding portion 21 Z-axis motor 28 Pusher driving cylinder 29 Lifting connection portion 30 Pusher 30a Contacting portion 31 Mounting determination sensor 32 Dog plate 37 Rotator 40 Position change mechanism 41 Component holding portion 41a Suction path 42 Nozzle 42a Suction pad 64 Drive piston 65 Swing member PC suction target position

Claims (5)

An electronic component mounting apparatus comprising a mounting head for mounting an electronic component on a substrate, the electronic component mounting apparatus comprising:
The mounting head is
Lift mechanism,
A lifting unit which is lifted and lowered by the lifting mechanism;
A rotating body held horizontally rotatable with respect to the elevating unit;
A rotation mechanism that horizontally rotates the rotating body with respect to the elevating unit;
A component holding unit having a suction path connected to a negative pressure generation source, and having a nozzle for holding an electronic component at an opening end of the suction path using negative pressure generated by the negative pressure generation source;
A posture changing mechanism mounted on the rotating body and changing the posture of the component holding portion so that the opening end of the nozzle is directed downward or sideways;
A pusher capable of abutting on an electronic component held by the horizontally oriented nozzle;
And a pusher drive mechanism for driving the pusher to push an electronic component held by the nozzle toward the substrate ,
The electronic component mounting apparatus according to claim 1, wherein the posture changing mechanism is mounted on the rotating body, the component holding portion is mounted under the posture changing mechanism, and the pusher is horizontally rotated with the rotating body . The position of the contact portion in contact with the electronic component in the pusher is disposed horizontally away from the rotation center of the rotating body,
The electronic component mounting apparatus according to claim 1, wherein the center of the open end of the nozzle, which is directed downward, is disposed at a position sandwiching the rotation center of the rotating body with the pusher in plan view. The pusher is disposed so as to vertically penetrate the rotating body, the contact portion is provided at the lower end portion of the pusher projecting downward of the rotating body, and the upper end portion of the pusher is coupled to the pusher driving mechanism The electronic component mounting apparatus according to claim 2 . The pusher driving mechanism, and a sub lift portion which moves up and down by a drive source, comprising a coupling portion coupled to the upper end of the pusher being horizontally rotatably mounted to the bottom of this sub lift part, to claim 3 Electronic component mounting apparatus as described. The mounting error detection unit detects a mounting error of the electronic component by detecting the position of the pusher when the pusher drive mechanism pushes the electronic component held by the component holding unit toward the substrate with the pusher. The electronic component mounting apparatus according to any one of claims 1 to 4 , comprising:

Images