JP6500968B2 - Substrate processing equipment - Google Patents

Description

  The present invention relates to a substrate processing apparatus for processing a flexible substrate supported by a substrate support member with a predetermined tension.

  In an exposure apparatus used in a photolithography process, while rotating a cylindrical or cylindrical mask, the substrate is continuously moved over the length of several shots on the substrate (semiconductor wafer), and the outer periphery of the cylindrical mask An exposure apparatus is known which scans and exposes a pattern of several shots formed on the substrate on the substrate (e.g., Patent Document 1).

  Also, in recent years, a flexible long film wound in a roll to manufacture a display panel or color filter of a liquid crystal system, an organic EL system, etc. on a flexible thin substrate made of a polymer resin film or plastic. A roll-to-roll method has also been proposed in which the pattern of the cylindrical mask is continuously exposed to the light, as disclosed in, for example, Patent Document 2).

  The substrate to be exposed is not limited to an exposure apparatus using a cylindrical mask as in Patent Documents 1 and 2 above, and an exposure apparatus using a general flat mask or a maskless direct-write exposure apparatus. In the case where the substrate is a thin substrate such as resin, plastic or metal foil, the expansion and contraction of the substrate is a problem due to the characteristics of its physical properties. Therefore, when exposing a pattern for an electronic device such as a display panel or a pattern for a color filter on a flexible thin substrate, the pattern to be exposed (a projected image or a drawn image of a mask pattern) and the substrate It is desirable to precisely adjust the relative positional relationship.

JP 2008-076650 A JP, 2011-221536, A

In the substrate processing apparatus (exposure apparatus) that performs processing while sending the flexible substrate in the longitudinal direction while supporting the flexible substrate along the support surface (curved surface) of the substrate support member as in Patent Document 2 described above, the substrate support In the case where the substrate supported by the supporting surface of the member is loosened, that is, when the predetermined tension is not applied, the substrate may be wrinkled.
For this reason, in the substrate processing apparatus, control is performed such that a constant tension is applied to the substrate when the substrate is transported. However, when tension is applied to the substrate, deformation (stretching) in the width direction or longitudinal direction of the substrate due to the influence of the tension occurs before and after the processing position on the support surface (curved surface) of the substrate support member. It may occur. Therefore, in a substrate processing apparatus that processes a thin flexible substrate, processing accuracy (pattern transfer accuracy, overlay accuracy, etc., while taking into account deformation in the width direction or longitudinal direction of the substrate, that is, two-dimensional deformation. Etc.) is required.

  An aspect of the present invention is made in view of the above circumstances, and provides a highly accurate substrate processing apparatus by suppressing a decrease in processing accuracy due to deformation of the substrate in the width direction or the long direction due to the influence of tension. The purpose is to

According to the first aspect of the present invention, the above-mentioned rotation is performed while winding a flexible long substrate around a part of the outer peripheral surface of a rotating drum which rotates around a center line and moving the substrate in the long direction. A substrate processing apparatus for forming a pattern on the substrate supported by a drum, wherein a circumferential direction between an entering position where the substrate starts to contact the outer peripheral surface of the rotating drum and a separating position where the substrate is separated from the outer peripheral surface The processing apparatus for forming the pattern on the substrate and the at least two regions separated in a short direction orthogonal to the long direction on the substrate are formed along the long direction at specific positions. A first pattern detection device for detecting each position of the plurality of marks in a first detection area set between the approach position along the circumferential direction of the outer peripheral surface and the specific position; and the substrate the specific from the entry position The speed of movement of the forward direction toward the location, a first speed suitable for the formation of the pattern by the processing device, temporarily in order to detect the respective positions of the plurality of marks by the first pattern detection device And a controller configured to adjust the rotational speed of the rotating drum so as to switch to a second speed lower than the first speed set in the above.

  According to an aspect of the present invention, high processing accuracy is suppressed by suppressing deterioration in processing accuracy due to deformation of the flexible substrate due to the influence of tension applied during processing, in particular, reduction in positioning accuracy of the processing (exposure) area on the substrate. Can be obtained. Therefore, even a fine pattern can be faithfully formed on a flexible substrate.

FIG. 1 is a diagram showing the configuration of a device manufacturing system according to the first embodiment. FIG. 2 is a schematic view showing the overall configuration of a processing apparatus (exposure apparatus) according to the first embodiment. FIG. 3 is a schematic view showing the arrangement of the illumination area and the projection area in FIG. FIG. 4 is a schematic view showing a configuration of a projection optical system applied to the processing apparatus (exposure apparatus) of FIG. FIG. 5 is a perspective view of a rotary drum applied to the processing apparatus (exposure apparatus) of FIG. FIG. 6 is a perspective view for explaining the relationship between a detection probe and a reader applied to the processing apparatus (exposure apparatus) of FIG. FIG. 7 is an explanatory view for explaining the position of the reading device when the scale disk SD according to the first embodiment is viewed in the direction of the rotation center line AX2. FIG. 8 is an explanatory view for explaining a modification of the substrate according to the first embodiment. FIG. 9 is an explanatory view for explaining an example of the alignment mark. FIG. 9 is an explanatory view for explaining an example of the alignment mark. FIG. 10 is an explanatory view schematically illustrating an example of the change of the alignment mark due to the deformation of the substrate. FIG. 11 is an explanatory view schematically explaining the positional deviation between the projection image and the alignment mark. FIG. 12 is a flowchart showing an example of a procedure for correcting the processing of the processing apparatus (exposure apparatus) according to the first embodiment. FIG. 13 is a flowchart showing an example of a detection procedure of alignment marks of the processing apparatus (exposure apparatus) according to the second embodiment. FIG. 14 is an explanatory view showing an example of the detection position of the alignment mark. FIG. 15 is an explanatory view showing another example of the detection position of the alignment mark. FIG. 16 is a perspective view of a rotary drum applied to the processing apparatus (exposure apparatus) according to the third embodiment. FIG. 17 is an explanatory view for explaining the position of the reading device when the scale disc SD according to the third embodiment is viewed in the direction of the rotation center line AX2. FIG. 18 is an explanatory view schematically illustrating an example of the change of the alignment mark due to the deformation of the substrate. FIG. 19 is a flowchart illustrating an example of a procedure of correcting the processing of the processing apparatus (exposure apparatus) according to the third embodiment. FIG. 20 is a schematic view showing the overall configuration of a processing apparatus (exposure apparatus) according to the fourth embodiment. FIG. 21 is a schematic view showing the overall configuration of a processing apparatus (exposure apparatus) according to the fifth embodiment. FIG. 22 is a schematic view showing the overall configuration of a processing apparatus (exposure apparatus) according to the sixth embodiment. FIG. 23 is a perspective view showing a model example for obtaining the amount of deformation of each point on the substrate when the substrate is wound by applying tension to the cylindrical drum member. FIG. 24 is a graph of the result of simulation with the amount of displacement of each point associated with expansion and contraction in the longitudinal direction (MD direction) of the substrate in the model example of FIG. 23 as a friction coefficient of 0.45. FIG. 25 is a graph of the results of simulation of the amount of displacement of each point accompanying the expansion and contraction of the substrate in the longitudinal direction (MD direction) according to the model example of FIG. FIG. 26 is a graph of the results of simulation of the amount of displacement of each point with expansion and contraction in the short direction (TD direction) of the substrate according to the model example of FIG. FIG. 27 is a graph of the result of simulation of the amount of displacement of each point due to the expansion and contraction of the substrate in the short direction (TD direction) according to the model example of FIG. FIG. 28 is a flowchart showing a device manufacturing method using the processing apparatus (exposure apparatus) according to the first embodiment.

  A mode (embodiment) for carrying out the present invention will be described in detail with reference to the drawings. The present invention is not limited by the contents described in the following embodiments. Further, the components described below include those which can be easily conceived by those skilled in the art and those which are substantially the same. Furthermore, the components described below can be combined as appropriate. In addition, various omissions, replacements or modifications of the components can be made without departing from the scope of the present invention. For example, in the following embodiment, the electronic device is described as a case of manufacturing a flexible display panel of liquid crystal of active matrix type or OLED (organic EL), but is not limited thereto. As the electronic device, a wiring board (flexible printed circuit board), a flexible solar cell panel in which a large number of cells of photoelectric elements are arrayed, or the like can be manufactured.

First Embodiment
The substrate processing apparatus according to the first embodiment is an exposure apparatus that exposes and processes patterns for a display panel (including a plurality of patterns such as a large number of pixel units, pixel electrodes, TFTs, and bus lines) on a flexible substrate. The exposure apparatus is used by being incorporated into a device manufacturing system (manufacturing line) for manufacturing devices by subjecting the substrate after exposure to various processes. Therefore, first, a device manufacturing system will be described.

<Device manufacturing system>
FIG. 1 is a diagram showing the configuration of a device manufacturing system according to the first embodiment. The device manufacturing system 1 shown in FIG. 1 is a line (flexible display manufacturing line) for manufacturing a flexible display as a device. As a flexible display, there is an organic EL display, for example. The device manufacturing system 1 sends out the substrate P from a supply roll FR1 in which a flexible substrate P is wound in a roll shape, and continuously performs various processes on the fed-out substrate P. It is a so-called roll-to-roll system in which the processed substrate P is wound around a recovery roll FR2 as a flexible device. In the device manufacturing system 1 of the first embodiment, the substrate P which is a film-like sheet is fed from the supply roll FR1, and the substrates P fed from the supply roll FR1 are sequentially processed into n processing apparatuses U1, U2. , U3, U4, U5,... Un, and shows an example of winding up to the recovery roll FR2. First, the substrate P to be processed by the device manufacturing system 1 will be described.

  As a raw material of the board | substrate P, the foil (foil) etc. which consist of metals or alloys, such as a plastics, a resin film, stainless steel, etc. are used, for example. Examples of the material of the resin film include polyethylene resin, polypropylene resin, polyester resin, ethylene vinyl copolymer resin, polyvinyl chloride resin, cellulose resin, polyamide resin, polyimide resin, polycarbonate resin, polystyrene resin, and vinyl acetate resin. Includes one or more.

  For example, it is desirable to select a substrate P whose thermal expansion coefficient is not significantly large so that the amount of deformation due to heat received in various processes applied to the substrate P can be substantially ignored. The thermal expansion coefficient may be set smaller than the threshold according to the process temperature or the like, for example, by mixing an inorganic filler into the resin film. The inorganic filler may be, for example, titanium oxide, zinc oxide, alumina, silicon oxide or the like. The substrate P may be a single layer of ultrathin glass with a thickness of about 100 μm manufactured by the float method or the like, or a laminate obtained by bonding the above-mentioned resin film, foil or the like to this ultrathin glass. It may be

  The substrate P configured in this way is wound into a roll and becomes a supply roll FR1, and the supply roll FR1 is mounted to the device manufacturing system 1. The device manufacturing system 1 mounted with the supply roll FR1 repeatedly performs various processes for manufacturing one device on the substrate P delivered from the supply roll FR1. For this reason, the processed substrate P is in a state in which a plurality of devices are connected. That is, the substrate P delivered from the supply roll FR1 is a substrate for multiple chamfering. The substrate P is one obtained by modifying and activating the surface in advance by a predetermined pretreatment, or one having a fine partition structure (concave and convex structure) for precise patterning formed on the surface by an imprinting method But it is good.

  The processed substrate P is recovered as a recovery roll FR2 by being wound into a roll. The recovery roll FR2 is attached to a dicing apparatus (not shown). The dicing apparatus on which the recovery roll FR2 is mounted divides the processed substrate P into devices by dividing it into devices (dicing). The dimensions of the substrate P are, for example, about 10 cm to 2 m in the width direction (the direction in which the length is short) and 10 m or more in the length direction (the direction in which the length is long). In addition, the dimension of the board | substrate P is not limited to an above-described dimension.

  Next, the device manufacturing system 1 will be described with reference to FIG. In FIG. 1, it is an orthogonal coordinate system in which the X direction, the Y direction, and the Z direction are orthogonal. The X direction is a direction connecting the supply roll FR1 and the recovery roll FR2 in the horizontal plane, and is the left-right direction in FIG. The Y direction is a direction orthogonal to the X direction in the horizontal plane, and is the front-rear direction in FIG. The Y direction is the axial direction of the supply roll FR1 and the recovery roll FR2. The Z direction is the vertical direction, which is the vertical direction in FIG.

  The device manufacturing system 1 performs processing by the substrate supply device 2 for supplying the substrate P, the processing devices U1 to Un that perform various processes on the substrate P supplied by the substrate supply device 2, and the processing devices U1 to Un The apparatus includes a substrate recovery apparatus 4 for recovering the substrate P, and an upper control apparatus 5 for controlling each device of the device manufacturing system 1.

  A supply roll FR1 is rotatably mounted on the substrate supply device 2. The substrate supply device 2 has a drive roller DR1 for feeding the substrate P from the mounted supply roll FR1 and an edge position controller EPC1 for adjusting the position of the substrate P in the width direction (Y direction). The driving roller DR1 rotates while holding the front and back sides of the substrate P, and feeds the substrate P to the processing devices U1 to Un by sending out the substrate P in the transport direction from the supply roll FR1 to the recovery roll FR2. At this time, the edge position controller EPC1 is so arranged that the position at an end (edge) in the width direction of the substrate P falls within a range of about ± 10s of μm to ± 10s of μm with respect to the target position. P is moved in the width direction to correct the position of the substrate P in the width direction.

  A recovery roll FR2 is rotatably attached to the substrate recovery apparatus 4. The substrate recovery apparatus 4 has a drive roller DR2 for drawing the processed substrate P toward the recovery roll FR2 and an edge position controller EPC2 for adjusting the position of the substrate P in the width direction (Y direction). The substrate recovery device 4 rotates while pinching the front and back sides of the substrate P by the drive roller DR2, and draws the substrate P by pulling the substrate P in the transport direction and rotating the recovery roll FR2. At this time, the edge position controller EPC2 is configured in the same manner as the edge position controller EPC1, and corrects the position of the substrate P in the width direction so that the end in the width direction of the substrate P does not vary in the width direction. .

  The processing device U <b> 1 is a coating device that applies the photosensitive functional liquid to the surface of the substrate P supplied from the substrate supply device 2. As the photosensitive functional liquid, for example, a photoresist, a photosensitive silane coupling material, a UV curable resin liquid, or the like is used. The processing unit U1 is provided with a coating mechanism Gp1 and a drying mechanism Gp2 in this order from the upstream side in the transport direction of the substrate P. The application mechanism Gp1 includes an impression cylinder roller R1 around which the substrate P is wound, and an application roller R2 facing the impression cylinder roller R1. The coating mechanism Gp1 holds the substrate P by the impression cylinder roller R1 and the application roller R2 in a state in which the supplied substrate P is wound around the impression cylinder roller R1. The application mechanism Gp1 applies the photosensitive functional liquid with the application roller R2 while moving the substrate P in the transport direction by rotating the impression cylinder roller R1 and the application roller R2. The drying mechanism Gp2 sprays drying air such as hot air or dry air to remove the solute (solvent or water) contained in the photosensitive functional liquid, and dries the substrate P coated with the photosensitive functional liquid. A photosensitive functional layer is formed on the substrate P.

  The processing device U2 is a heating device that heats the substrate P transported from the processing device U1 to a predetermined temperature (for example, about several 10 to 120 ° C.) in order to stabilize the photosensitive functional layer formed on the surface of the substrate P It is. In the processing unit U2, a heating chamber HA1 and a cooling chamber HA2 are provided in order from the upstream side in the transport direction of the substrate P. The heating chamber HA1 is provided therein with a plurality of rollers and a plurality of air turn bars, and the plurality of rollers and the plurality of air turn bars constitute a transport path of the substrate P. The plurality of rollers are provided in rolling contact with the back surface of the substrate P, and the plurality of air turn bars are provided on the front surface side of the substrate P in a noncontact manner. The plurality of rollers and the plurality of air turn bars are arranged in a serpentine transfer path so as to lengthen the transfer path of the substrate P. The substrate P passing through the heating chamber HA1 is heated to a predetermined temperature while being transported along the serpentine transport path. The cooling chamber HA2 cools the substrate P to the ambient temperature so that the temperature of the substrate P heated in the heating chamber HA1 matches the ambient temperature of the subsequent process (processing device U3). The cooling chamber HA2 is provided with a plurality of rollers inside, and the plurality of rollers are arranged as a serpentine transfer path so as to lengthen the transfer path of the substrate P, similarly to the heating chamber HA1. The substrate P passing through the inside of the cooling chamber HA2 is cooled while being transported along the serpentine transport path. A drive roller DR3 is provided on the downstream side of the cooling chamber HA2 in the transport direction, and the drive roller DR3 faces the substrate P to the processing apparatus U3 by rotating while holding the substrate P that has passed through the cooling chamber HA2. Supply.

  The processing apparatus (substrate processing apparatus) U3 projects a pattern such as a circuit or wiring for a display panel on a substrate (photosensitive substrate) P having a photosensitive functional layer formed on the surface, supplied from the processing apparatus U2. It is an exposure device that exposes light. Although details will be described later, the processing unit U3 illuminates the illumination light flux on the pattern surface of the outer peripheral surface of the transmission or reflection type cylindrical mask (mask) DM, and the pattern appears in the illumination area on the cylindrical mask (mask) DM The projection light is projected and exposed on the substrate P through the projection optical system PL. The processing unit U3 includes a drive roller DR4 that feeds the substrate P supplied from the processing unit U2 to the downstream side in the transport direction, an edge position controller EPC that adjusts the position of the substrate P in the width direction (Y direction), and the substrate P. When the substrate P is moved in the reverse direction to the normal transport direction (during reverse transport), the back buffer unit BDL is provided to hold the substrate P in a fixed amount while being slackened.

  The back buffer unit BDL has two sets of nip-type drive rollers BDR1 and BDR2 that transport the substrate P to the upstream side or the downstream side in the transport direction in a state where the substrate P is slackened. The drive roller DR4 rotates while sandwiching the front and back sides of the substrate P, and sends the substrate P to the downstream side in the transport direction. Thereafter, the substrate P is cylindrically supported on a part of the outer peripheral surface of the rotary drum DR5, and is transported so as to pass through the projection area (exposure position) of the projection optical system PL. The edge position controller EPC is configured in the same manner as the edge position controller EPC1, and corrects the position of the substrate P in the width direction such that the width direction of the substrate P at the exposure position becomes the target position.

  The processing unit U3 further includes a buffer unit DL having two sets of nip-type drive rollers DR6 and DR7 for transferring the substrate P to the downstream side in the transport direction in a state in which the substrate P after exposure is slackened. . The two sets of drive rollers DR6 and DR7 are arranged at predetermined intervals in the transport direction of the substrate P. The driving roller DR6 holds and rotates the upstream side of the substrate P to be conveyed, and the driving roller DR7 turns and holds the downstream side of the substrate P to be conveyed, thereby directing the substrate P to the processing device U4. Supply. At this time, since the substrate P is stored in the buffer portion DL by a predetermined length, it is possible to absorb the fluctuation of the transport speed which occurs on the downstream side of the drive roller DR6 in the transport direction and reverse transport of the substrate P. Further, in the processing device U3, an alignment microscope for detecting an alignment mark or the like formed in advance on the substrate P in order to relatively align the image of a part of the mask pattern of the mask DM with the substrate P. AMG1 and AMG2 are provided.

  The processing unit U4 is a wet processing unit that performs wet development processing, electroless plating processing, and the like on the substrate P after exposure that has been transported from the processing unit U3. The processing device U4 has therein three processing tanks BT1, BT2, BT3 hierarchized in the vertical direction (Z direction), and a plurality of rollers for transporting the substrate P. The plurality of rollers are arranged inside the three processing baths BT1, BT2, and BT3 so as to be a transport path through which the substrate P sequentially passes. A drive roller DR8 is provided on the downstream side in the transport direction of the processing tank BT3, and the drive roller DR8 faces the substrate P toward the processing apparatus U5 by rotating while holding the substrate P which has passed through the processing tank BT3. Supply.

  Although illustration is omitted, the processing device U5 is a drying device for drying the substrate P transported from the processing device U4. The processing unit U5 removes the liquid adhering to the substrate P wet-processed in the processing unit U4, and adjusts the water content of the substrate P to a predetermined value. The substrate P dried by the processing unit U5 is transported to the processing unit Un through several processing units. Then, after being processed by the processing device Un, the substrate P is wound up on the recovery roll FR2 of the substrate recovery device 4.

  The host control device 5 centrally controls the substrate supply device 2, the substrate recovery device 4, and the plurality of processing devices U1 to Un. The host control device 5 controls the substrate supply device 2 and the substrate recovery device 4 to transport the substrate P from the substrate supply device 2 toward the substrate recovery device 4. In addition, the host control device 5 controls the plurality of processing devices U1 to Un to perform various processes on the substrate P while synchronizing with the transport of the substrate P.

<Exposure system (substrate processing system)>
Next, the configuration of the exposure apparatus (substrate processing apparatus) as the processing apparatus U3 of the first embodiment will be described with reference to FIGS. 2 to 4. FIG. 2 is a view showing the overall configuration of the exposure apparatus (substrate processing apparatus) of the first embodiment. FIG. 3 is a view showing the arrangement of illumination areas and projection areas of the exposure apparatus shown in FIG. FIG. 4 is a diagram showing the configuration of the illumination optical system and the projection optical system of the exposure apparatus shown in FIG.

  As shown in FIG. 2, the processing device U3 includes an exposure device (processing mechanism) EX and a transport device 9. The exposure apparatus EX is supplied with a substrate P (sheet, film or the like) by the transport device 9. The exposure apparatus EX is a so-called scanning exposure apparatus, which synchronously drives the rotation of the cylindrical mask DM and the feeding of the flexible substrate P, that is, the rotation of the rotary drum DR5 shown in FIG. The image of the pattern being formed is projected onto the substrate P via a multi-lens type projection optical system PL (PL1 to PL6) with a projection magnification of 1 × (× 1). The exposure apparatus EX shown in FIG. 2 sets the Y axis of the XYZ orthogonal coordinate system in parallel with the rotation center line AX1 of the first drum member 21 constituting the cylindrical mask DM. Similarly, the exposure apparatus EX sets the Y axis of the XYZ orthogonal coordinate system parallel to the rotation center line AX2 of the rotating drum DR5 (hereinafter also referred to as the second drum member 22).

  As shown in FIG. 2, the exposure apparatus EX includes a mask holding device 12, an illumination mechanism IU, a projection optical system PL, and a control device 14. The exposure apparatus EX rotationally moves the cylindrical mask DM held by the mask holding device 12 and conveys the substrate P by the conveying device 9. The illumination mechanism IU illuminates a part (illumination region IR) of the pattern surface (peripheral surface) of the cylindrical mask DM with uniform illumination from the inside of the cylindrical mask DM by the illumination light beam EL1. The projection optical system PL projects an image of a pattern in the illumination area IR on the cylindrical mask DM onto a part (projection area PA) of the substrate P conveyed by the conveyance device 9 and the rotary drum DR5. Thereby, the image of the predetermined pattern (mask pattern) disposed along the outer peripheral surface of the cylindrical mask DM is scan-exposed on the substrate P. The control device 14 cooperatively controls the respective units of the exposure apparatus EX and the conveyance device 9 to cause the respective units and the conveyance device 9 to execute predetermined operations.

  The control device 14 may be part or all of the upper control device 5 that centrally controls the plurality of processing devices U1 to Un of the device manufacturing system described above. Further, the control device 14 may be controlled by the host control device 5 and may be a device different from the host control device 5. The controller 14 includes, for example, a computer system. The computer system includes, for example, a CPU and hardware such as various memories, an OS, and peripheral devices. The process of the operation of each part of the processing unit U3 is stored in the form of a program in a storage unit of a computer readable recording medium, and the computer system reads and executes this program to perform various processes. The computer system also includes a home page providing environment (or display environment) when it can connect to the Internet or an intranet system. Further, the computer readable recording medium includes a portable medium such as a flexible disk, a magneto-optical disk, a ROM, a CD-ROM, and a storage device such as a hard disk built in a computer system. The computer-readable recording medium is one that holds a program dynamically for a short time, such as a communication line when transmitting a program via a network such as the Internet or a communication line such as a telephone line, in that case Such as volatile memory in a computer system that is a server or a client of the above, including one that holds a program for a certain period of time. Further, the program may be for realizing a part of the functions of the processing device U3, or may be one that can realize the functions of the processing device U3 in combination with a program already recorded in the computer system. Similar to the control device 14, the host control device 5 can be realized using a computer system.

  As shown in FIG. 2, the mask holding device 12 includes a first drum member 21 for holding the cylindrical mask DM, a guide roller 23 for supporting the first drum member 21, and a first drive unit 26 according to a control command of the control device 14. A drive roller 24 for driving the first drum member 21 and a first detector 25 for detecting the position of the first drum member 21 are provided.

  The first drum member 21 is a cylindrical member having a curved surface curved at a constant radius from a rotation center line AX1 (hereinafter also referred to as a first center axis AX1) which is a predetermined axis, and rotates around the predetermined axis. . The first drum member 21 forms a first surface P1 on which the illumination region IR on the cylindrical mask DM is disposed. In the present embodiment, the first surface P1 includes a surface (hereinafter referred to as a cylindrical surface) obtained by rotating a line segment (generation line) around an axis (first central axis AX1) parallel to the line segment. The cylindrical surface is, for example, the outer peripheral surface of a cylinder, the outer peripheral surface of a cylinder, or the like. The first drum member 21 is made of, for example, glass, quartz or the like, and is in the shape of a cylinder having a constant thickness, and the outer peripheral surface (cylindrical surface) forms the first surface P1. That is, in the present embodiment, the illumination region IR on the cylindrical mask DM is curved in a cylindrical surface shape having a constant radius r1 from the rotation center line AX1. As described above, the first drum member 21 has a curved surface which is curved at a constant radius from the rotation center line AX1 which is a predetermined axis. The first drum member 21 can be driven by the drive roller 24 to rotate around a rotation center line AX1 which is a predetermined axis.

  The cylindrical mask DM is formed, for example, as a transmission-type flat sheet mask in which a pattern is formed by a light shielding layer such as chromium on one surface of a strip-like ultrathin glass plate (for example, 100 Ru. The mask holding device 12 is used in a state in which the cylindrical mask DM is curved following the curved surface of the outer peripheral surface of the first drum member 21 and wound (adhered) around the curved surface. The cylindrical mask DM has an unpatterned area where no pattern is formed, and is attached to the first drum member 21 in the unpatterned area. The cylindrical mask DM is releasable with respect to the first drum member 21.

  The cylindrical mask DM is made of an extremely thin glass plate, and instead of winding the cylindrical mask DM around the first drum member 21 made of a transparent cylindrical base material, chromium is directly applied to the outer peripheral surface of the first drum member 21 made of a transparent cylindrical base material. The mask pattern by the light shielding layer such as may be drawn and integrated. Also in this case, the first drum member 21 functions as a support member for the pattern of the cylindrical mask DM.

  The first detector 25 optically detects the rotational position of the first drum member 21 and is constituted of, for example, a rotary encoder or the like. The first detector 25 outputs information indicating the detected rotational position of the first drum member 21, for example, a two-phase signal from an encoder head described later, to the control device 14. The first drive unit 26 including an actuator such as an electric motor adjusts torque and rotation speed for rotating the drive roller 24 according to a control signal input from the control device 14. The control device 14 controls the rotational position of the first drum member 21 by controlling the first drive unit 26 based on the detection result of the first detector 25. Then, the control device 14 controls one or both of the rotational position and the rotational speed of the cylindrical mask DM held by the first drum member 21.

  The second drum member 22 is a cylindrical member having a curved surface (first curved surface) curved at a constant radius from a rotation center line AX2 (hereinafter also referred to as a second center axis AX2) serving as a predetermined axis, and the predetermined axis Is a rotating drum that rotates around the The second drum member 22 forms a second surface (supporting surface) P2 supporting a portion including the projection area PA on the substrate P on which the imaging light flux from the projection optical system PL is projected in an arc shape (cylindrical shape) Do. The second drum member 22 is a drive roller DR5 that is rotated by the torque supplied from the second drive unit 36 including an actuator such as an electric motor.

  Thus, the second drum member 22 serves as the driving roller DR5 and also serves as a substrate support member (substrate stage) for supporting the substrate P to be exposed (processed). That is, the second drum member 22 may be a part of the exposure apparatus EX. The second drum member 22 is rotatable around the rotation center line AX2 (second center axis AX2) of the second drum member 22, and the substrate P has an outer peripheral surface (cylindrical surface on the second drum member 22). And the like, and curved in a cylindrical surface shape, and the projection area PA is disposed in a part of the curved portion.

  In the present embodiment, among the imaging light beams EL2 reaching the projection area PA, the chief rays passing through the center points of the projection area PA are viewed from the second central axis AX2 of the second drum member 22 as shown in FIG. The first specific position PX1 and the second specific position PX2 are reached at the positions of the angle θ in the circumferential direction across the central plane P3. The specific position PX between the first specific position PX1 and the second specific position PX2 viewed from the rotation center line AX2 is an average exposure of the substrate P on the curved surface of the second drum member 22. It is the center of the area.

  The transport device 9 includes a drive roller DR4, a second drum member 22 (drive roller DR5), and a drive roller DR6. The transport apparatus 9 moves the substrate P in the transport direction in which the substrate P is transported such that the substrate P passes through the first specific position PX1, the specific position PX, and the second specific position PX2. The second drive unit 36 adjusts the torque for rotating the second drum member 22 in accordance with the control signal output from the control device 14.

  In the present embodiment, the substrate P transported to the drive roller DR4 from the upstream of the transport path is guided by the first guide member 33 via the drive roller DR4 and transported to the second drum member 22. The substrate P is supported by the surface of the second drum member 22 and transported to the second guide member 33. The substrate P having passed through the second guide member 33 is transported to the downstream of the transport path. The rotation center line AX2 of the second drum member 22 (drive roller DR5) and the rotation center lines of the drive rollers DR4 and DR6 are both set to be parallel to the Y axis.

  Around the second drum member 22, a first guide member 32 and a second guide member 32 which regulate the transport direction in which the substrate P is transported and guide the substrate P are disposed. The second drum member 22 is in the transport direction in which the substrate P starts to move away from the curved surface of the second surface P2 from the approach position IA in the transport direction in which a portion of the substrate P is wound and the substrate P starts contacting the curved surface of the second surface P2. The substrate P is supported up to the release position OA. The first guide member 32 and the second guide member 32 adjust the tension or the like acting on the substrate P in the transport path by moving in the transport direction of the substrate P, for example. In addition, the first guide member 32 and the second guide member 33 move, for example, in the transport direction of the substrate P to wrap around the outer periphery of the second drum member 22, and the above-described entry position IA, release position OA, etc. It can be adjusted. The transfer device 9, the first guide member 32, and the second guide member 33 may be able to transfer the substrate P along the projection area PA of the projection optical system PL, and the transfer device 9, the first guide member 32, and The configuration of the second guide member 33 can be changed as appropriate.

  The second detector 35 is formed of, for example, a rotary encoder, and optically detects the rotational position of the second drum member 22. The second detector 35 outputs information indicating the detected rotational position of the second drum member 22 (for example, two-phase signals from encoder heads EN1, EN2, EN3, EN4, and EN5 described later) to the control device 14 . The control device 14 controls the rotational position of the second drum member 22 by controlling the second drive unit 36 based on the detection result of the second detector 35, and the first drum member 21 (cylindrical mask DM) and the like. The second drum member 22 is synchronously moved (synchronously rotated). The detailed configuration of the second detector 35 will be described later.

  The exposure apparatus EX of the present embodiment is an exposure apparatus on which it is assumed that a so-called multi-lens type projection optical system PL is mounted. The projection optical system PL includes a plurality of projection modules that project an image of a portion of the pattern of the cylindrical mask DM. For example, in FIG. 2, three projection modules (projection optical systems) PL1, PL3, and PL5 are disposed at regular intervals in the Y direction on the left side of the center plane P3, and three projection modules (projection System) PL2, PL4 and PL6 are arranged at regular intervals in the Y direction.

  In such a multi-lens type exposure apparatus EX, the Y-direction end portions of the areas (projection areas PA1 to PA6) exposed by the plurality of projection modules PL1 to PL6 are overlapped with each other by scanning to obtain a desired pattern. Project the whole picture. In such an exposure apparatus EX, even if the Y-direction size of the pattern on the cylindrical mask DM becomes large and the necessity of handling the substrate P having a large Y-direction width inevitably arises, the projection module PL and the projection module Since it is only necessary to add modules in the illumination mechanism IU corresponding to PL in the Y direction, there is an advantage that it can easily cope with the increase in the panel size (the width of the substrate P).

  The exposure apparatus EX may not be a multi-lens system. For example, when the size in the width direction of the substrate P is somewhat small, the exposure apparatus EX may project an image of the full width of the pattern onto the substrate P by one projection module. In addition, each of the plurality of projection modules PL1 to PL6 may project a pattern corresponding to one device. That is, the exposure apparatus EX may project patterns for a plurality of devices in parallel by a plurality of projection modules.

  The illumination mechanism IU of the present embodiment includes the light source device 13 and an illumination optical system. The illumination optical system includes a plurality (for example, six) of illumination modules IL aligned in the Y-axis direction corresponding to each of the plurality of projection modules PL1 to PL6. The light source device 13 includes, for example, a lamp light source such as a mercury lamp, or a solid light source such as a laser diode or a light emitting diode (LED). The illumination light emitted from the light source device is, for example, a bright line (g line, h line, i line) emitted from a lamp light source, far ultraviolet light (DUV light) such as KrF excimer laser light (wavelength 248 nm), ArF excimer laser light (Wavelength 193 nm) or the like. The illumination light emitted from the light source device is equalized in illuminance distribution, and is distributed to the plurality of illumination modules IL via a light guide member such as an optical fiber, for example.

  Each of the plurality of illumination modules IL includes a plurality of optical members such as a lens. In the present embodiment, light emitted from the light source device and passing through any of the plurality of illumination modules IL is referred to as an illumination light flux EL1. Each of the plurality of illumination modules IL includes, for example, an integrator optical system, a rod lens, a fly's eye lens, and the like, and illuminates the illumination region IR with the illumination light beam EL1 of uniform illuminance distribution. In the present embodiment, the plurality of illumination modules IL are disposed inside the cylindrical mask DM. Each of the plurality of illumination modules IL illuminates each illumination area IR of the mask pattern formed on the outer peripheral surface of the cylindrical mask DM from the inside of the cylindrical mask DM.

  FIG. 3 is a view showing the arrangement of the illumination area IR and the projection area PA in the present embodiment. In FIG. 3, a plan view of the illumination area IR on the cylindrical mask DM disposed on the first drum member 21 as viewed from the −Z side (the left side in FIG. 3) and the second drum member 22 The top view (figure on the right side in FIG. 3) which looked at projection area PA on the board | substrate P arrange | positioned from the + Z side is shown in figure. The code | symbol Xs in FIG. 3 shows the rotation direction (movement direction) of the 1st drum member 21 or the 2nd drum member 22. As shown in FIG.

  The plurality of illumination modules IL respectively illuminate the first to sixth illumination areas IR1 to IR6 on the cylindrical mask DM. For example, the first illumination module IL illuminates the first illumination area IR1, and the second illumination module IL illuminates the second illumination area IR2.

  The first illumination area IR1 will be described as a trapezoidal area elongated in the Y direction, but in the case of a projection optical system having a configuration to form an intermediate image plane like the projection optical system (projection module) PL, the intermediate image Since a field stop plate having a trapezoidal aperture can be arranged at the position of (1), it may be a rectangular area including the trapezoidal aperture. The third illumination region IR3 and the fifth illumination region IR5 are regions of the same shape as the first illumination region IR1, respectively, and are arranged at constant intervals in the Y-axis direction. Further, the second illumination area IR2 is a trapezoidal (or rectangular) area symmetrical to the first illumination area IR1 with respect to the central plane P3. The fourth illumination region IR4 and the sixth illumination region IR6 are regions of the same shape as the second illumination region IR2, respectively, and are arranged at constant intervals in the Y-axis direction.

  As shown in FIG. 3, when viewed along the circumferential direction of the first surface P1, each of the first to sixth illumination regions IR1 to IR6 has a triangular portion of the oblique side of the trapezoidal illumination region adjacent to each other. It is arranged to overlap (to overlap). Therefore, for example, the first area A1 on the cylindrical mask DM passing the first illumination area IR1 by the rotation of the first drum member 21 passes the second illumination area IR2 by the rotation of the first drum member 21. It partially overlaps with the upper second area A2.

  In the present embodiment, the cylindrical mask DM includes a pattern formation area A3 in which a pattern is formed and a pattern non-formation area A4 in which a pattern is not formed. The non-pattern formation area A4 is disposed to surround the pattern formation area A3 in a frame shape, and has a characteristic of shielding the illumination light beam EL1. The pattern formation area A3 of the cylindrical mask DM moves in the moving direction Xs as the first drum member 21 rotates, and each partial area in the Y axis direction of the pattern formation area A3 is the first to sixth illumination areas Pass one of IR1 to IR6. In other words, the first to sixth illumination areas IR1 to IR6 are arranged to cover the full width of the pattern formation area A3 in the Y-axis direction.

  As shown in FIG. 2, each of the plurality of projection modules PL1 to PL6 aligned in the Y-axis direction corresponds to each of the first to sixth illumination modules IL on a one-to-one basis, and is illuminated by the corresponding illumination modules An image of a partial pattern of the cylindrical mask DM appearing in the illumination area IR is projected onto each projection area PA on the substrate P.

  For example, the first projection module PL1 corresponds to the first illumination module IL, and the image of the pattern of the cylindrical mask DM in the first illumination area IR1 (see FIG. 3) illuminated by the first illumination module IL is displayed on the substrate P On the first projection area PA1 of the The third projection module PL3 and the fifth projection module PL5 correspond to the third and fifth illumination modules IL, respectively. The third projection module PL3 and the fifth projection module PL5 are disposed at positions overlapping with the first projection module PL1 when viewed from the Y-axis direction.

  In addition, the second projection module PL2 corresponds to the second illumination module IL, and the image of the pattern of the cylindrical mask DM in the second illumination area IR2 (see FIG. 3) illuminated by the second illumination module IL is displayed on the substrate P. To the second projection area PA2 of When viewed in the Y-axis direction, the second projection module PL2 is disposed at a symmetrical position with respect to the first projection module PL1 across the central plane P3.

  The fourth projection module PL4 and the sixth projection module PL6 are respectively disposed in correspondence with the fourth and sixth illumination modules IL, and the fourth projection module PL4 and the sixth projection module PL6 are viewed from the Y-axis direction, It is arrange | positioned in the position which overlaps with 2nd projection module PL2.

  In the present embodiment, light reaching each of the illumination areas IR1 to IR6 on the cylindrical mask DM from the respective illumination modules IL of the illumination mechanism IU is referred to as an illumination luminous flux EL1. In addition, the light beams subjected to intensity distribution modulation according to the partial pattern of the cylindrical mask DM appearing in the respective illumination regions IR1 to IR6 and entering the respective projection modules PL1 to PL6 to reach the respective projection regions PA1 to PA6 It is assumed to be EL2. Then, among the imaging light beams EL2 reaching the projection areas PA1 to PA6, the chief ray passing through the center points of the projection areas PA1 to PA6 is the second central axis AX2 of the second drum member 22, as shown in FIG. As seen from the above, they are respectively disposed at positions (specific positions) at an angle θ in the circumferential direction across the center plane P3.

  As shown in FIG. 3, the image of the pattern in the first illumination area IR1 is projected on the first projection area PA1, the image of the pattern in the third illumination area IR3 is projected on the third projection area PA3, and the fifth illumination area The image of the pattern in IR5 is projected onto the fifth projection area PA5. In the present embodiment, the first projection area PA1, the third projection area PA3, and the fifth projection area PA5 are arranged in a line in the Y-axis direction.

  The image of the pattern in the second illumination area IR2 is projected onto the second projection area PA2. In the present embodiment, the second projection area PA2 is disposed symmetrically to the first projection area PA1 with respect to the central plane P3 when viewed from the Y-axis direction. In addition, the image of the pattern in the fourth illumination region IR4 is projected to the fourth projection region PA4, and the image of the pattern in the sixth illumination region IR6 is projected to the sixth projection region PA6. In the present embodiment, the second projection area PA2, the fourth projection area PA4, and the sixth projection area PA6 are arranged in a line in the Y-axis direction.

  Each of the first to sixth projection areas PA1 to PA6 is an adjacent projection area (odd-numbered and even-numbered) in a direction parallel to the second central axis AX2 when viewed along the circumferential direction of the second surface P2. It arrange | positions so that the edge part (trapezoid triangle part) of each other may overlap. Therefore, for example, the third area A5 on the substrate P passing the first projection area PA1 by the rotation of the second drum member 22 is on the substrate P passing the second projection area PA2 by the rotation of the second drum member 22. It partially overlaps with the fourth area A6. The first projection area PA1 and the second projection area PA2 are arranged such that the exposure amount in the area where the third area A5 and the fourth area A6 overlap is substantially the same as the exposure amount in the non-overlapping area. The shape etc. are set. The first to sixth projection areas PA1 to PA6 are arranged to cover the entire width in the Y direction of the exposure area A7 exposed on the substrate P.

  Next, the detailed configuration of the projection optical system PL of the present embodiment will be described with reference to FIG. In the present embodiment, each of the second to fifth projection modules PL2 to PL5 has the same configuration as that of the first projection module PL1. Therefore, as a representative of the projection optical system PL, the configuration of the first projection module PL1 will be described, and the description of each of the second to fifth projection modules PL2 to PL5 will be omitted.

  In the first projection module PL1 shown in FIG. 4, the first optical system 41 for forming an image of the pattern of the cylindrical mask DM disposed in the first illumination region IR1 on the intermediate image plane P7 and the first optical system 41 are formed. A second optical system 42 for re-forming at least a part of the intermediate image on the first projection area PA1 of the substrate P, and a first field stop 43 disposed on an intermediate image plane P7 on which the intermediate image is formed .

  The first projection module PL1 further includes a focus correction optical member 44, an image shift correction optical member 45, a rotation correction mechanism 46, and a magnification correction optical member 47. The focus correction optical member 44 is a focus adjustment device that finely adjusts the focus state of a pattern image (hereinafter referred to as a projection image) of a mask formed on the substrate P. Further, the image shift correction optical member 45 is a shift adjustment device which slightly shifts the projected image laterally in the image plane. The magnification correction optical member 47 is a magnification adjustment device that slightly corrects the magnification of the projected image. The rotation correction mechanism 46 is a shift adjustment device that slightly rotates the projected image in the image plane.

  The imaging light beam EL2 from the pattern of the cylindrical mask DM is emitted from the first illumination region IR1 in the normal direction (D1), passes through the focus correction optical member 44, and is incident on the image shift correction optical member 45. The imaging light beam EL 2 transmitted through the image shift correction optical member 45 is reflected by the first reflection surface (plane mirror) p 4 of the first deflection member 50 which is an element of the first optical system 41, and passes through the first lens group 51. The light is reflected by the first concave mirror 52 (reflection surface p6), passes through the first lens group 51 again, is reflected by the second reflection surface (planar mirror) p5 of the first deflection member 50, and enters the first field stop 43. The imaging light beam EL2 having passed through the first field stop 43 is reflected by the third reflection surface (plane mirror) p8 of the second deflection member 57 which is an element of the second optical system 42, and passes through the second lens group 58 The light is reflected by the second concave mirror 59, passes through the second lens group 58 again, is reflected by the fourth reflecting surface (plane mirror) p9 of the second deflection member 57, and enters the magnification correction optical member 47. The image forming light beam EL2 emitted from the magnification correction optical member 47 is incident on the first projection area PA1 on the substrate P, and the image of the pattern appearing in the first illumination area IR1 is equal-magnified in the first projection area PA1 (× Projected in 1).

  When the radius of the cylindrical mask DM shown in FIG. 2 is radius r1 and the radius of the cylindrical surface of the substrate P wound around the second drum member 22 is radius r2, the radius r1 and the radius r2 are equal, each projection module The chief ray of the imaging light beam EL2 on the mask side of PL1 to PL6 is inclined to pass through the central axis AX1 of the cylindrical mask DM, but the inclination angle is the inclination angle of the chief ray of the imaging light EL2 on the substrate P side It becomes the same as θ (± θ with respect to the central plane P3).

  The angle θ3 formed by the third reflection surface p8 of the second deflection member 57 with the second optical axis AX4 is substantially the same as the angle θ2 formed by the second reflection surface p5 of the first deflection member 50 with the first optical axis AX3. is there. Further, an angle θ4 formed by the fourth reflective surface p9 of the second deflection member 57 with the second optical axis AX4 is substantially equal to an angle θ1 formed by the first reflective surface p4 of the first deflection member 50 with the first optical axis AX3. It is the same. The angle θ1 of the first reflection surface p4 of the first deflection member 50 shown in FIG. 4 with respect to the first optical axis AX3 is set smaller than 45 ° by Δθ1 to give the inclination angle θ described above. The angle θ4 of the fourth reflective surface p9 with respect to the second optical axis AX4 is smaller than 45 ° by Δθ4. Δθ1 and Δθ4 are set to the relationship of Δθ1 = Δθ4 = θ / 2 with respect to the angle θ shown in FIG.

  FIG. 5 is a perspective view of a rotary drum applied to the processing apparatus (exposure apparatus) of FIG. FIG. 6 is a perspective view for explaining the relationship between a detection probe and a reader applied to the processing apparatus (exposure apparatus) of FIG. FIG. 7 is an explanatory view for explaining the position of the reading device when the scale disk SD according to the first embodiment is viewed in the direction of the rotation center line AX2. In FIG. 5, for convenience, only the second to fourth projection areas PA2 to PA4 are illustrated, and the first, fifth, and sixth projection areas PA1, PA5, and PA6 are not illustrated.

  The second detector 35 shown in FIG. 2 optically detects the rotational position of the second drum member 22. The second detector 35 has a scale disk (scale member) SD with high roundness and an encoder head as a reader. Includes EN1, EN2, EN3, EN4, EN5.

  The scale disc SD is fixed to an end of the second drum member 22 orthogonal to the rotation axis ST of the second drum member 22. For this reason, the scale disc SD rotates integrally with the rotation axis ST around the rotation center line AX2. For example, a scale (grid) is engraved on the outer peripheral surface of the scale disk SD as the scale portion GP. The scale portion GP is annularly arranged along the circumferential direction in which the second drum member 22 rotates, and rotates with the second drum member 22 around the rotation axis ST (second central axis AX2). The encoder heads EN1, EN2, EN3, EN4, and EN5 are disposed around the scale portion GP when viewed from the rotation axis ST (the second central axis AX2). The encoder heads EN1, EN2, EN3, EN4, and EN5 are disposed to face the scale portion GP, and can read the scale portion GP without contact. The encoder heads EN1, EN2, EN3, EN4, and EN5 are disposed at different positions in the circumferential direction of the second drum member 22.

  The encoder heads EN1, EN2, EN3, EN4, and EN5 are reading devices having measurement sensitivity (detection sensitivity) with respect to variation in displacement of the scale part GP in the tangential direction (in the XZ plane). As shown in FIG. 5, the installation orientations of the encoder heads EN1, EN2, EN3, EN4 and EN5 (angular directions in the XZ plane centering on the rotation center line AX2) are installation orientations Le1, Le2, Le3, Le4 and In the case of Le5, as shown in FIG. 7, the encoder heads EN1 and EN2 are arranged such that the installation azimuth lines Le1 and Le2 are at an angle of ± θ ° with respect to the central plane P3. In the present embodiment, for example, the angle θ is 15 °.

  The projection modules PL1 to PL6 illustrated in FIG. 4 are processing units of the exposure apparatus EX that performs an irradiation process of irradiating the substrate P with light by using the substrate P as an object to be processed. In the exposure apparatus EX, chief rays of two imaging light beams EL2 enter the substrate P with respect to the substrate P. The projection modules PL1, PL3, PL5 are the first processing units, the projection modules PL2, PL4, PL6 are the second processing units, and principal rays of two imaging light beams EL2 enter the substrate P with respect to the substrate P The position is a specific position at which the substrate P is irradiated with light. The specific position is a position of an angle ± θ in the circumferential direction across the central plane P3 on the curved substrate P on the second drum member 22 as viewed from the second central axis AX2 of the second drum member 22. The installation azimuth line Le1 of the encoder head EN1 has one inclination angle θ with respect to the central plane P3 of the chief ray passing through the central points of the projection areas (projection fields) PA1, PA3 and PA5 of the odd-numbered projection modules PL1, PL3 and PL5. The installation azimuth line Le2 of the head EN2 has an inclination angle θ with respect to the central plane P3 of the chief ray passing through the central points of the projection areas (projection fields) PA2, PA4 and PA6 of the even-numbered projection modules PL2, PL4 and PL6. Match. For this reason, the encoder head EN1 serves as a reading device for reading the scale portion GP located in the direction connecting the first specific position PX1 and the second central axis AX2. Then, the encoder head EN2 serves as a reading device for reading the scale portion GP located in the direction connecting the second specific position PX2 and the second central axis AX2.

  The encoder head EN4 is disposed on the rear side in the transport direction of the substrate P, that is, on the front side of the exposure position (projection area), and rotates the installation azimuth line Le1 of the encoder head EN1 toward the rear side in the transport direction of the substrate P It is set on the installation direction line Le4 rotated about the axis of the center line AX2. Further, the encoder head EN5 is set on the installation azimuth Le5 obtained by rotating the installation azimuth Le1 of the encoder head EN1 around the axis of the rotation center line AX2 toward the rear side in the transport direction of the substrate P.

  The encoder head EN3 is disposed on the opposite side of the encoder heads EN1 and EN2 across the rotation center line AX2, and the installation azimuth line Le3 is set on the center plane P3.

  The scale disk SD, which is a scale member, uses a low thermal expansion metal, glass, ceramic or the like as a base material, and is made as large as possible in diameter (for example, 20 cm or more in diameter) in order to improve measurement resolution. In FIG. 5, the diameter of the scale disk SD is illustrated to be smaller than the diameter of the second drum member 22, but among the outer peripheral surfaces of the second drum member 22, the diameter of the outer peripheral surface on which the substrate P is wound and the scale By making the diameters of the scale portion GP of the disk SD uniform (substantially equal), it is possible to further reduce the so-called measurement Abbe error.

  The minimum pitch of the scale (grating) inscribed in the circumferential direction of the scale portion GP is limited by the performance of a scale marking device or the like for processing the scale disk SD. Therefore, if the diameter of the scale disk SD is increased, the angle measurement resolution corresponding to the minimum pitch can be increased accordingly.

  The principal ray of the imaging light beam EL2 enters the substrate P with respect to the substrate P when the directions of the installation azimuth lines Le1 and Le2 in which the encoder heads EN1 and EN2 reading the scale part GP are arranged are viewed from the rotation center line AX2. For example, even if the second drum member 22 is shifted in the X direction by a slight backlash (about 2 .mu.m to 3 .mu.m) of a bearing that supports the rotation shaft ST, projection is performed by this shift. It is possible to measure with high accuracy the encoder head EN1 or EN2 for a positional error in the transport direction (Xs) of the substrate P that may occur in the areas PA1 to PA6.

  As shown in FIG. 6, the image of the portion of the mask pattern projected by the projection optical system PL shown in FIG. 2 is relative to the substrate P on the portion of the substrate P supported by the curved surface of the second drum member 22. Alignment microscopes AMG1 and AMG2 for detecting alignment marks and the like formed in advance on the substrate P are provided for alignment (alignment). The alignment microscopes AMG1 and AMG2 have a detection probe for detecting a specific pattern formed discretely or continuously on the substrate P, and a detection region by the detection probe is in the conveyance direction of the substrate P than the above-described specific position. It is a pattern detection device arranged around the second drum member 22 so as to be set on the rear side.

  As shown in FIG. 6, the alignment microscopes AMG1 and AMG2 have a plurality of (for example, four) detection probes arranged in a line in the Y-axis direction (the width direction of the substrate P). The alignment microscopes AMG1 and AMG2 are detection probes at both ends of the second drum member 22 in the Y-axis direction, and can always observe or detect alignment marks formed near both ends of the substrate P. The alignment microscopes AMG1 and AMG2 are detection probes other than both ends of the second drum member 22 in the Y-axis direction (the width direction of the substrate P), and for example, a plurality of them are formed on the substrate P along the longitudinal direction. It is possible to observe or detect an alignment mark formed in a margin or the like between the pattern formation areas of the display panel.

  As shown in FIGS. 6 and 7, when viewed from the rotation center line AX2 in the XZ plane, it is the same as the detection center of the observation direction AM1 (toward the second center axis AX2) of the observation direction of the substrate P by the alignment microscope AMG1. Thus, the encoder head EN4 is disposed on the installation azimuth line Le4 set in the radial direction of the scale portion GP. In addition, when viewed from the rotation center line AX2 in the XZ plane, the radial direction of the scale portion GP is in the same direction as the detection center of the observation direction AM2 of the substrate P by the alignment microscope AMG2 (toward the rotation center line AX2). The encoder head EN5 is disposed on the installation azimuth line Le5 set to. Thus, the detection probes of the alignment microscopes AMG1 and AMG2 are disposed around the second drum member 22 when viewed from the second central axis AX2, and connect the position at which the encoder heads EN4 and EN5 are disposed and the second central axis AX2. The directions (installation orientation lines Le4 and Le5) are arranged to coincide with the direction connecting the second central axis AX2 and the detection regions of the alignment microscopes AMG1 and AMG2. The positions of the alignment microscopes AMG1 and AMG2 and the encoder heads EN4 and EN5 in the direction around the rotation center line AX2 are the approach position IA where the substrate P starts to contact the second drum member 22 and the second drum member 22 It is set between the detachment position OA from which the substrate P is detached. The specific position PX shown in FIG. 2 is on the extension of the central plane P3 viewed from the second central axis AX2 shown in FIG. 7, and the position where the alignment microscope AMG1 which is the first detection probe is arranged at the specific position PX. At a position around the second drum member 22 rotated to the release position OA side with respect to the specific position PX with respect to the second central axis AX2 by an angle substantially the same as the angle β rotated about the second central axis AX2 An alignment microscope AMG2 which is a second detection probe is disposed.

  The approach position IA and the removal position OA change according to the transfer speed at which the transfer device 9 transfers the substrate P. For example, when the transport speed is increased, the distance by which the substrate P is wound around the outer periphery of the second drum member 22 becomes longer, and a line connecting the approach position IA and the second central axis AX2, the separated position OA, and the second central axis AX2 The angle between it and the line connecting them increases. When the transport speed is reduced, the distance in which the substrate P is wound around the outer periphery of the second drum member 22 is shortened, and a line connecting the approach position IA and the second central axis AX2, the separated position OA, and the second central axis AX2 The angle with the connecting line is smaller.

  The observation direction AM2 of the alignment microscope AMG2 described above is disposed on the front side in the transport direction of the substrate P, that is, on the rear of the exposure position (projection region), and is an alignment mark formed near the end of the substrate P in the Y direction. In a state where the substrate P is being sent at a predetermined speed (formed in a region of several tens of μm to several hundreds of μm square), an image is detected at high speed by an imaging device or the like. The image of the mark is sampled at high speed. By storing the rotational angular position of the scale disc SD sequentially measured by the encoder head EN5 at the moment when the sampling is performed, the mark position of the alignment mark on the substrate P and the rotational angular position of the second drum member 22 The correspondence relationship of is required.

  On the other hand, the observation direction AM1 of the alignment microscope AMG1 described above is disposed on the rear side of the transport direction of the substrate P, that is, in front of the exposure position (projection area). The image of the alignment mark (formed in a region of several tens of μm to several hundreds of μm square) is sampled at high speed by an imaging device or the like in the same manner as the alignment microscope AMG2. By storing the rotational angle position of the scale disk SD, the correspondence between the mark position of the alignment mark on the substrate P and the rotational angle position of the second drum member 22 is determined.

  When a mark detected by the alignment microscope AMG1 is detected by the alignment microscope AMG2, the difference between the angular position measured and stored by the encoder head EN4 and the angular position measured and stored by the encoder head EN5 is previously determined The alignment angles of the two alignment microscopes AMG1 and AMG2 that have been calibrated are compared with the opening angles of Le4 and Le5. When the opening angle has an error, the substrate P may slightly slide on the second drum member 22 between the entering position IA and the disengaging position OA, or the conveyance direction (circumferential direction Or may extend and contract in a direction (Y-axis direction) parallel to the second central axis AX2.

  In general, the positional error at the time of patterning is determined according to the fineness and the superposition accuracy of the device pattern formed on the substrate P. For example, a linear pattern of 10 μm width is accurately overlapped on the underlying pattern layer For combined exposure, only an error of a fraction or less, that is, a position error of about ± 2 μm in terms of the dimension on the substrate P is permitted.

  In order to realize such high-accuracy measurement, the measurement direction of the mark image by each alignment microscope AMG1 and AMG2 (the tangential direction of the second drum member 22 in the XZ plane) and the encoder heads EN4 and EN5. It is necessary to align the measurement direction (the tangential direction of the outer periphery of the scale portion GP in the XZ plane) within the allowable angular error.

  As described above, the encoder heads EN4 and EN5 are arranged to coincide with the measurement direction of the alignment marks on the substrate P by the alignment microscopes AMG1 and AMG2 (the tangential direction of the circumferential surface of the second drum member 22). . Therefore, at the time of position detection of the substrate P (mark) by the alignment microscopes AMG1 and AMG2 (during image sampling), the second drum member 22 (scale disk SD) is orthogonal to the installation azimuth Le4 or Le5 in the XZ plane. Even in the case of shifting in the circumferential direction (tangential direction), highly accurate position measurement can be performed in consideration of the shift of the second drum member 22.

  The encoder heads EN1 to EN5 are arranged at five positions around the scale portion GP of the scale disc SD when viewed from the second central axis AX2. Therefore, output of measurement values by two or three appropriate encoder heads among them It is also possible to obtain the roundness (shape distortion), eccentricity error, and the like of the scale portion GP of the scale disk SD by performing arithmetic processing by combining the above.

  FIG. 8 is an explanatory view for explaining a modification of the substrate according to the first embodiment. In the exposure apparatus EX, when the substrate P in contact with the second drum member 22 is loosened, the substrate P may be wrinkled. For this reason, in the exposure apparatus EX, tension is applied to the substrate P when the substrate P is transported. As shown in FIG. 8, when tension is applied to the substrate P, the Y-direction end of the substrate P is curved in an arc before entering the curved surface of the second drum member 22, and tension is applied. The deformation Pw in the width direction of the substrate P may occur due to the influence of FIG. 9 is an explanatory view of an example of the alignment mark. The alignment microscope AMG1 shown in FIG. 8 is a detection probe at both ends of the second drum member 22 in the Y direction, and constantly observes alignment marks ma formed near both ends of the substrate P shown in FIG. 9 along the transport direction α. Or can be detected. As shown in FIG. 9, the substrate P is often a long sheet having the same width direction.

  As shown in FIG. 8, when tension is applied to the substrate P, the position from the approach position (position where contact starts) IA entering the curved surface of the second drum member 22 to the microscopic field (imaging range) of the alignment microscope AMG1 If the predetermined distance QL is, for example, about several centimeters, it can approach the original width PP of the substrate P. As described above, at the entry position IA, the substrate P may be deformed due to the tension applied to the substrate P, the friction coefficient of the outer peripheral surface of the second drum member 22, etc. However, the entry position IA If the substrate P and the second drum member 22 are in close contact with each other at a position separated by a predetermined distance QL, the tension applied to the substrate P is uniformly applied, and the deformation of the substrate P is stabilized. .

  FIG. 10 is an explanatory view schematically illustrating an example of the change of the alignment mark due to the deformation of the substrate. FIG. 11 is an explanatory view schematically explaining the positional deviation between the projection image and the alignment mark. FIG. 12 is a flowchart showing an example of a procedure for correcting the processing of the processing apparatus (exposure apparatus) according to the first embodiment. As shown in FIG. 10, the alignment microscope AMG1 detects the alignment mark ma within the range of the microscopic field (imaging range) mam1 in the detection direction AM1 as the first detection probe. Similarly, the alignment microscope AMG2 detects the alignment mark ma within the range of the microscopic field (imaging range) mam2 in the detection direction AM2 as a second detection probe. Thus, alignment microscope AMG1 and alignment microscope AMG2 detect alignment mark ma which is a specific pattern on substrate P shown in FIG. 10 (step S11). The alignment microscope AMG1 outputs an image of the alignment mark ma to the control device 14, and the control device 14 and the alignment microscope AMG1 store the alignment mark ma as image pickup data in the storage unit of the control device 14 as a first pattern detection device. . The alignment microscope AMG2 outputs an image of the alignment mark ma to the control device 14, and the control device 14 and the alignment microscope AMG2 store the alignment mark ma as image pickup data in the storage unit of the control device 14 as a second pattern detection device. .

  Next, an alignment mark ma which is the same as the imaging data of the alignment mark ma of the microscope visual field (imaging range) mam 1 stored in the storage unit in association with the positional information of the encoder head EN 4 from the positional information of the encoder head EN 5 Imaging range: detected as an alignment mark ma detected at mam2, and imaging data are compared. For example, the control device 14 calculates the interval WY1 of the alignment marks ma in the width direction (Y direction) of the substrate P from the imaging data of the alignment marks ma of the microscope visual field (imaging range) mam1. Then, the arithmetic unit 14 detects the same alignment mark ma as the imaging data of the alignment mark ma of the microscope field of view (imaging range) mam1 from the position information of the encoder head EN5 with the microscope field of view (imaging range) mam2, The interval WY2 of the alignment marks ma in the width direction (Y direction) of the substrate P is calculated. When the difference between the interval WY2 and the interval WY1 is within the allowable value stored in advance in the storage unit, and the imaging data of the alignment mark ma does not change due to the deformation of the substrate P (No in step S12), the control device 14 The process of S11 is performed. When the difference between the interval WY2 and the interval WY1 exceeds the allowable value stored in the storage unit in advance, and the imaging data of the alignment mark ma changes due to the deformation of the substrate P (Yes in step S12), the control device 14 The process proceeds to step S13.

  Alternatively, an alignment mark ma that is the same as the imaging data of the alignment mark ma of the microscope field of view (imaging range) mam 1 stored in the storage unit in association with the position information of the encoder head EN 4 Range: detected as alignment mark ma detected by mam2, and the imaging data are compared. Here, the alignment microscope AMG1 can detect the exposed projection image mas. Therefore, alignment microscope AMG1 is, for example, a phase contrast microscope or a polarization microscope. When, for example, the resist material receives light to change the refractive index of the material, a retardation microscope or a polarizing microscope can detect a change in refractive index as a difference in contrast, and can detect an exposure state as a latent image before development. In this case, when a projection image having the same shape as the alignment mark mam shown in FIG. 11 is exposed, the projection image mas of the latent image shape also becomes a shape similar to the alignment mark mam. When there is no change in the imaging data of the projection image mas of the latent image shape and the alignment mark ma (No in step S12), the control device 14 executes the process of step S11. When there is a change Δms in the imaging data of the projection image mas and the alignment mark ma shown in FIG. 11 (Yes in step S12), the control device 14 may advance the process to step S13.

  Next, the exposure apparatus EX adjusts the positions of the first guide member 32 and the second guide member 33, and obtains the second center obtained by the alignment mark ma (specific pattern) detected by the alignment microscope AMG1 as the first detection probe. The deformation amount of the substrate P in the axial direction parallel to the axis AX2 coincides with the deformation amount of the substrate P in the axial direction determined by the alignment mark ma (specific pattern) detected by the alignment microscope AMG2 which is the second detection probe. The entrance position IA and the exit position OA are set around the second drum member 22 so as to guide the substrate P. The exposure apparatus EX may adjust the transport direction of the EPC shown in FIG. 1 and the transport apparatus 9.

  The specific position PX shown in FIG. 2 is located at the position where the alignment microscope AMG1 which is the first detection probe is disposed, and is specified with respect to the second central axis AX2 by approximately the same angle as the angle rotated about the second central axis AX2. Since the alignment microscope AMG2 as the second detection probe is disposed at a position around the substrate support member rotated to the release position OA side with respect to the position PX, the alignment mark ma (specific pattern) detected by the alignment microscope AMG1. The amount of deformation of the substrate P in the axial direction parallel to the second central axis AX2 determined by the equation coincides with the amount of deformation of the substrate P in the axial direction determined by the alignment mark ma (specific pattern) detected by the alignment microscope AMG1. For example, the substrate P wound around the second drum member 22 can be presumed to be stable. Therefore, the exposure apparatus EX can precisely perform the process of irradiating the exposure light at the first specific position PX1, the specific position PX, or the second specific position PX2.

  The exposure apparatus EX detects the alignment mark ma which is the same as the imaging data of the alignment mark ma of the microscope field of view (imaging range) mam1 from the position information of the encoder head EN5 with the microscope field of view (imaging range) mam2 From this, the deformation amount in the width direction (Y direction) of the substrate P can be calculated. The image shift adjusting device described above corrects the projected image by shifting the position of the projected image in accordance with the amount of deformation in the width direction (Y direction) of the substrate P (step S13). Alternatively, the exposure apparatus EX may perform correction of a projected image in which the above-described magnification adjusting apparatus corrects the magnification of the projected image in accordance with the amount of deformation of the substrate P in the width direction (Y direction). Alternatively, the exposure apparatus EX corrects the projected image by correcting the shift and magnification of the projected image according to the amount of deformation of the substrate P in the width direction (Y direction) of the magnification adjustment apparatus and the image shift adjustment apparatus described above. You may go.

Second Embodiment
Next, a second embodiment of the processing apparatus according to the present invention will be described with reference to FIG. 13, FIG. 14 and FIG. FIG. 13 is a flowchart showing an example of a detection procedure of alignment marks of the processing apparatus (exposure apparatus) according to the second embodiment. FIG. 14 is an explanatory view showing an example of the detection position of the alignment mark. FIG. 15 is an explanatory view showing another example of the detection position of the alignment mark. In this figure, the same components as those of the first embodiment are denoted by the same reference numerals, and the description thereof is omitted. It is desirable that the exposure apparatus EX detect as many alignment marks ma on the substrate P as described above as much as possible, and correct the projected image using a large amount of detection data, in order to execute exposure with high accuracy. However, the arithmetic device 14 is subjected to an arithmetic operation load using a large amount of detection data. As described above, for example, the controller 14 controls the shift and magnification of the projected image until the alignment mark ma of the substrate P detected by the alignment microscope AMG1 is conveyed and reaches the first specific position PX1 shown in FIG. It is necessary to calculate correction data for correcting the projected image, and to control at least one of the image shift adjustment device and the magnification adjustment device. Therefore, when the transfer device 9 increases the transfer speed at which the substrate P can be transferred, the control device 14 may not calculate the correction data for correcting at least one of the shift and the magnification of the projected image. is there. Therefore, when the transport speed of the substrate P by the transport apparatus 9 is reduced (the rotational speed of the cylindrical mask DM is also reduced at the same time), the throughput of the exposure apparatus EX or the throughput of the device manufacturing system 1 may decrease.

  As shown in FIG. 13, the control device 14 stops the irradiation process of irradiating the substrate P of the processing unit described above with light (step S <b> 21). Next, the transfer device 9 moves the substrate P while the processing unit stops processing, and transfers the substrate P to the buffer unit DL (step S22). The transport device 9 makes the transport speed low, and gives the first pattern detection device or the second pattern detection device a time for making many alignment marks ma detectable. Next, at least the first pattern detection device described above detects an alignment mark ma which is a specific pattern. Alternatively, the processing unit may perform exposure only on the alignment mark ma, and the second pattern detection device may detect a shift in exposure on the alignment mark ma. Then, the control device 14 stores the alignment mark ma, which is a specific pattern, as imaging data in the storage unit of the control device 14 (step S23). At this time, in the case where a part of alignment marks ma described later is taken in, the control device 14 calculates correction data that complements the alignment mark ma that has not been taken in, and stores it in the storage unit.

  Next, the transport apparatus 9 moves the substrate P from the buffer unit DL to the back buffer unit BDL in a state where the processing unit has stopped processing, and moves the substrate P backward (step S24). When the substrate does not return to the initial position, which is the position at which the step S22 starts, as described above (No in step S25), the transport apparatus 9 continues the process (step S24) of moving the substrate backward to the initial position. When the substrate P returns to the initial position (Step S25, Yes), the transport apparatus 9 moves the substrate P so as to supply the substrate P toward the processing device U4 (Step S26).

  The first pattern detection device and the second pattern detection device described above detect a part of the alignment mark ma of the substrate P moved by the transfer device 9 (step S27). The control device 14 starts an irradiation process of irradiating the substrate P of the processing unit described above with light (step S28). For example, as shown in FIG. 14, in the case where the detected alignment mark ma is ma1 and the undetected alignment mark ma is ma2, the detected alignment mark ma1 sandwiches the undetected alignment mark ma2 and skips one. Alignment microscopes AMG1 and AMG2 are detected.

  The number of alignment marks ma2 not detected may be a predetermined number. For example, as shown in FIG. 15, four alignment marks ma2 may be arranged in the transport direction α. As a result, since the first pattern detection device and the second pattern detection device capture only a part of the alignment mark ma, the load of data processing can be thinned out, and the calculation load of the control device 14 can be suppressed. The control device 14 causes the processing unit to perform processing using the above-described correction data. For this reason, even if the transfer device 9 increases the transfer speed, the control device 14 is transferred until the alignment mark ma of the substrate P detected by the alignment microscope AMG1 is transferred and reaches the first specific position PX1 shown in FIG. Can calculate the correction data for correcting the projected image, which corrects at least one of the shift and the magnification of the projected image. The time for the control device 14 to calculate the correction of the projection image described above can be shortened and processed. As a result, the substrate transfer apparatus 9 can increase the transfer speed of the substrate P, and the exposure apparatus EX can improve the throughput.

  Alternatively, the first pattern detection device and the second pattern detection device detect all the alignment marks ma of the substrate P moved by the transfer device 9. When the control device 14 performs image processing for recognizing the alignment mark ma, a calculation load is applied. Therefore, for example, as illustrated in FIG. 14, when the control data of the alignment mark ma processed by the control device 14 is ma1 and the alignment mark ma not subjected to the image processing of the control device 14 is ma2, as shown in FIG. The alignment mark ma1 subjected to the image processing by the device 14 sandwiches the alignment mark ma2 not subjected to the image processing by the control device 14, and the alignment microscopes AMG1 and AMG2 detect it by skipping one. The number of alignment marks ma2 not subjected to image processing by the control device 14 may be a predetermined number. For example, as shown in FIG. 15, four alignment marks may be arranged in the transport direction α. Thereby, the first pattern detection device and the second pattern detection device detect the alignment mark ma, but thin out data processing to be acquired by image processing. As a result, the exposure apparatus EX can suppress the load on the control device 14. For this reason, even if the transfer device 9 increases the transfer speed, the control device 14 is transferred until the alignment mark ma of the substrate P detected by the alignment microscope AMG1 is transferred and reaches the first specific position PX1 shown in FIG. Can calculate the correction data for correcting the projected image, which corrects at least one of the shift and the magnification of the projected image. The time for the control device 14 to calculate the correction of the projection image described above can be shortened and processed. As a result, the transfer apparatus 9 can increase the transfer speed of the substrate P, and the exposure apparatus EX can improve the throughput.

  In steps S25 and S26 in FIG. 13, it is necessary to accelerate the substrate P to a predetermined transport speed, and it is necessary to set an initial position including an approach distance for that purpose. Further, the alignment marks ma to be detected by the alignment microscope AMG1 or AMG2 during conveyance of the substrate P in the forward direction (+ α direction) are, for example, every other alignment mark ma1 as shown in FIG. While P is transported in the reverse direction (−α direction), the alignment mark ma2 that has not been detected may be sequentially detected. In that case, at least one alignment mark ma2 must be detected first during transport of the substrate P in the forward direction (+ α direction), or at least one alignment mark during transport of the substrate P in the reverse direction (−α direction). By double detection of ma1, it is possible to correct the influence of the slip error between the substrate P and the second drum member 22 that may occur when the transport of the substrate P is switched from the forward direction to the reverse direction.

Third Embodiment
Next, a third embodiment of the processing apparatus according to the present invention will be described with reference to FIG. 16 to FIG. FIG. 16 is a perspective view of a rotary drum applied to the processing apparatus (exposure apparatus) according to the third embodiment. FIG. 17 is an explanatory view for explaining the position of the reading device when the scale disc SD according to the third embodiment is viewed in the direction of the rotation center line AX2. FIG. 18 is an explanatory view schematically illustrating an example of the change of the alignment mark due to the deformation of the substrate. FIG. 19 is a flowchart illustrating an example of a procedure of correcting the processing of the processing apparatus (exposure apparatus) according to the third embodiment. In this figure, the same components as those of the first embodiment and the second embodiment are denoted by the same reference numerals, and the description thereof will be omitted.

  As in the first embodiment, in this embodiment, the exposure apparatus EX is a part of the mask pattern projected by the projection optical system PL shown in FIG. 2 on a part of the substrate P supported by the curved surface of the second drum member 22. Alignment microscopes AMG1 and AMG2 for detecting an alignment mark ma formed in advance on the substrate P are provided in order to align the image of the substrate P with the substrate P relatively. The exposure apparatus EX of the third embodiment further includes alignment microscopes AMG3 and AMG4 described later.

  As in the first embodiment, the control device 14 adjusts the positions of the first guide member 32 and the second guide member 33, and uses the alignment mark ma (specific pattern) detected by the alignment microscope AMG1 as the first detection probe. The deformation amount of the substrate P in the axial direction determined by the determined deformation amount of the substrate P in the axial direction parallel to the second central axis AX2 and the alignment mark ma (specific pattern) detected by the alignment microscope AMG2 which is the second detection probe. The entrance position IA and the exit position OA are set around the second drum member 22 so that the amounts coincide, and the substrate P is guided.

  As shown in FIG. 16, the alignment microscope AMG 3 is an image of a portion of the mask pattern projected by the projection optical system PL shown in FIG. 2 on the portion of the substrate P supported by the curved surface of the second drum member 22. And an alignment microscope similar to the alignment microscope AMG1 for detecting an alignment mark ma formed in advance on the substrate P in order to align the relative position with each other. The alignment microscope AMG3 has a plurality of (for example, four) detection probes arranged in a line in the Y-axis direction (the width direction of the substrate P). The alignment microscope AMG 3 is a detection probe at both ends of the second drum member 22 in the Y-axis direction, and can always observe or detect the alignment marks ma formed near both ends of the substrate P.

  The encoder head EN6 is disposed on the rear side in the transport direction of the substrate P, that is, on the front side of the exposure position (projection area), and rotates the installation azimuth line Le4 of the encoder head EN4 toward the rear side in the transport direction of the substrate P It is set on the installation direction line Le6 rotated about the axis of the center line AX2. In addition, when viewed from the rotation center line AX2 in the XZ plane, the radial direction of the scale portion GP is in the same direction as the detection center of the observation direction AM3 of the substrate P by the alignment microscope AMG3 (toward the rotation center line AX2). The encoder head EN6 is disposed on the installation azimuth line Le6 set to.

  As shown in FIG. 17, the detection probe of the alignment microscope AMG3 is disposed around the second drum member 22 when viewed from the second central axis AX2, and a direction connecting the position at which the encoder head EN6 is disposed and the second central axis AX2. (Installation orientation line Le6) is arranged to coincide with the direction connecting the second central axis AX2 and the detection area of the alignment microscope AMG3. Therefore, when viewed from the rotation center line AX2 in the XZ plane, the alignment microscope AM3 is disposed between the approach position IA shown in FIG. 2 and the alignment microscope AMG1 and around the second drum member 22.

  The first specific position PX1 shown in FIG. 2 is an extension of the installation azimuth line Le1 (the azimuth line of the chief ray of the imaging light beam EL2) viewed from the second central axis AX2 shown in FIG. At the position where the alignment microscope AMG3 which is the third detection probe is disposed, it deviates from the first specific position PX1 viewed from the second central axis AX2 by an angle substantially the same as the angle γ1 rotated about the second central axis AX2. Alignment microscope AMG2 which is a 2nd detection probe is arrange | positioned in the position around the 2nd drum member 22 rotated to position OA side. The control device 14 adjusts the positions of the first guide member 32 and the second guide member 33, and the second central axis AX2 determined by the alignment mark ma (specific pattern) detected by the alignment microscope AMG3 as the third detection probe. The amount of deformation of the substrate P in the parallel axial direction and the amount of deformation of the substrate P in the axial direction determined by the alignment mark ma (specific pattern) detected by the alignment microscope AMG2 as the second detection probe are equalized The position IA and the release position OA may be set around the second drum member 22 to guide the substrate P.

  The encoder head EN7 shown in FIG. 16 is disposed on the front side in the transport direction of the substrate P, that is, on the rear side of the exposure position (projection region), and the installation orientation of the encoder head EN5 toward the front side in the transport direction of the substrate P. The line Le5 is set on the installation azimuth line Le7 rotated about the axis of the rotation center line AX2. The exposure apparatus EX further includes an alignment microscope AMG4 (not shown) having the same configuration as the alignment microscope AMG3 described above. As shown in FIG. 17, when viewed from the rotation center line AX2 in the XZ plane, the scale is in the same direction as the detection center of the observation direction AM4 (toward the rotation center line AX2) of the substrate P by the alignment microscope AMG4. The encoder head EN7 is disposed on the installation azimuth line Le7 set in the radial direction of the portion GP.

  The second specific position PX2 shown in FIG. 2 is an extension of the installation azimuth line Le2 (the azimuth line of the chief ray of the imaging light beam EL2) viewed from the second central axis AX2 shown in FIG. At the position where the alignment microscope AMG1 which is the first detection probe is disposed, it deviates from the second specific position PX2 viewed from the second central axis AX2 by an angle substantially the same as the angle γ2 rotated about the second central axis AX2. The alignment microscope AMG4, which is a fourth detection probe, is disposed at a position around the second drum member 22 rotated to the position OA. The control device 14 adjusts the positions of the first guide member 32 and the second guide member 33, and the second central axis AX2 obtained by the alignment mark ma (specific pattern) detected by the alignment microscope AMG1 as the first detection probe. The amount of deformation of the substrate P in the parallel axial direction and the amount of deformation of the substrate P in the axial direction determined by the alignment mark ma (specific pattern) detected by the alignment microscope AMG4 as the fourth detection probe The position IA and the release position OA may be set around the second drum member 22 to guide the substrate P.

  For example, the alignment microscope AMG3 outputs an imaging of the alignment mark ma to the control device 14, and the control device 14 and the alignment microscope AMG3 use the alignment mark ma as imaging data in the storage unit of the control device 14 as a third pattern detection device. Remember. The alignment microscope AMG1 outputs an image of the alignment mark ma to the control device 14, and the control device 14 and the alignment microscope AMG1 store the alignment mark ma as image pickup data in the storage unit of the control device 14 as a first pattern detection device. . Therefore, the distance from the approach position IA entering the curved surface of the second drum member 22 to the microscope visual field (imaging range) mam1 of the alignment microscope AMG1 shown in FIG. 17 is a predetermined distance QL1, and the alignment microscope AMG1 to the alignment microscope AMG3 When the distance to the microscope field of view (imaging range) mam3 is a predetermined distance QL2, the predetermined distance QL = QL1 + QL2 from the approach position IA to the microscope field of view (imaging range) mam1 of the alignment microscope AMG1. Then, the alignment microscope AMG1 and the alignment microscope AMG3 detect an alignment mark ma which is a specific pattern on the substrate P shown in FIG. 17 (Step S31 in FIG. 19).

  Next, the same alignment mark ma as the imaging data of the alignment mark ma of the microscopic field of view (imaging range) mam 3 stored in the storage unit is compared with the alignment mark ma detected in the microscopic field of view (imaging range) mam 1 Compare. For example, the control device 14 calculates the interval WY3 of the alignment marks ma in the width direction (Y direction) of the substrate P from the imaging data of the alignment marks ma of the microscope visual field (imaging range) mam3. In addition, the same alignment mark ma as the imaging data of the alignment mark ma of the microscope visual field (imaging range) mam 4 stored in the storage unit is compared with the alignment mark ma detected in the microscopic visual field (imaging range) mam 2 and the imaging data are compared Do. For example, the control device 14 may calculate the interval WY4 of the alignment marks ma in the width direction (Y direction) of the substrate P from the imaging data of the alignment marks ma of the microscope visual field (imaging range) mam4. Then, the arithmetic unit 14 detects the same alignment mark ma as the imaging data of the alignment mark ma of the microscope field of view (imaging range) mam3 from the position information of the encoder head EN4 with the microscope field of view (imaging range) mam1, The interval WY1 of the alignment marks ma in the width direction (Y direction) of the substrate P is calculated. When the difference Δm between the interval WY3 and the interval WY1 is within the allowable value stored in advance in the storage unit and there is no change in the imaging data of the alignment mark ma due to the deformation of the substrate P (No in step S32 of FIG. 19) The apparatus 14 repeatedly executes the process of step S31 of FIG. When the difference Δm between the interval WY3 and the interval WY1 exceeds the allowable value stored in the storage unit in advance, and there is a change in the imaging data of the alignment mark ma due to the deformation of the substrate P (Step S32 in FIG. 19 is Yes), The control device 14 proceeds with the process to step S33 in FIG.

  Next, the exposure apparatus EX adjusts the positions of the first guide member 32 and the second guide member 33, and obtains the second center obtained by the alignment mark ma (specific pattern) detected by the alignment microscope AMG1 as the first detection probe. The deformation amount of the substrate P in the axial direction parallel to the axis AX2 coincides with the deformation amount of the substrate P in the axial direction determined by the alignment mark ma (specific pattern) detected by the alignment microscope AMG2 which is the second detection probe. The entrance position IA and the exit position OA are set around the second drum member 22 so as to guide the substrate P. For example, the control device 14 controls the transfer device 9 so as to achieve the target width PP in the width direction of the substrate P, and reduces the speed in the transfer direction of the substrate P.

Note that, in order to change the dimension in the width direction of the substrate P to a minute, tension in the width direction is applied to the substrate P just before the substrate P enters (adheres to) the outer peripheral surface of the second drum member 22 A roller, for example, a roller having a large (or small) diameter at the central portion and a small (or large) diameter at both end portions in the rotational axis direction may be provided as, for example, the rotational roller DR4 in FIG.
In addition, by sandwiching each of both ends in the width direction of the substrate P with a nip roller driven by a motor, the feeding direction of the substrate P by the nip roller is oblique to the original feeding direction (substrate length direction), The substrate P may be expanded by applying a pulling force to both ends in the width direction of the substrate P together.

  The specific position PX shown in FIG. 2 is located at the position where the alignment microscope AMG1 which is the first detection probe is disposed, and is specified with respect to the second central axis AX2 by approximately the same angle as the angle rotated about the second central axis AX2. Since the alignment microscope AMG2 as the second detection probe is disposed at a position around the substrate support member rotated to the release position OA side with respect to the position PX, the alignment mark ma (specific pattern) detected by the alignment microscope AMG1. The amount of deformation of the substrate P in the axial direction parallel to the second central axis AX2 determined by the equation coincides with the amount of deformation of the substrate P in the axial direction determined by the alignment mark ma (specific pattern) detected by the alignment microscope AMG1. For example, the substrate P wound around the second drum member 22 can be presumed to be stable. Therefore, the exposure apparatus EX can precisely perform the process of irradiating the exposure light at the first specific position PX1, the specific position PX, or the second specific position PX2.

  The exposure apparatus EX detects the alignment mark ma which is the same as the imaging data of the alignment mark ma of the microscope field of view (imaging range) mam1 from the position information of the encoder head EN5 with the microscope field of view (imaging range) mam2 From this, the deformation amount in the width direction (Y direction) of the substrate P can be calculated. The image shift adjusting device described above corrects the projected image by shifting the position of the projected image in accordance with the amount of deformation in the width direction (Y direction) of the substrate P (step S13). Alternatively, the exposure apparatus EX may perform correction of a projected image in which the above-described magnification adjusting apparatus corrects the magnification of the projected image in accordance with the amount of deformation of the substrate P in the width direction (Y direction). Alternatively, the exposure apparatus EX corrects the projected image by correcting the shift and magnification of the projected image according to the amount of deformation of the substrate P in the width direction (Y direction) of the magnification adjustment apparatus and the image shift adjustment apparatus described above. You may go.

Fourth Embodiment
Next, a fourth embodiment of the processing apparatus according to the present invention will be described with reference to FIG. FIG. 20 is a schematic view showing the overall configuration of a processing apparatus (exposure apparatus) according to the fourth embodiment. In this figure, the same components as those of the first embodiment are denoted by the same reference numerals, and the description thereof is omitted. The exposure apparatus EX2 emits an illumination light beam EL1 illuminated from the light source to the cylindrical mask DM.

  The illumination light beam EL1 emitted from the light source of the light source device 13 is guided to the illumination module IL, and when a plurality of illumination optical systems are provided, the illumination light beam EL1 from the light source is split into a plurality of illumination light beams EL1. Lead to the lighting module IL.

  Here, the illumination light beam EL1 emitted from the light source device 13 enters the polarization beam splitters SP1 and SP2. In the polarization beam splitters SP1 and SP2, in order to suppress the energy loss due to the separation of the illumination light beam EL1, it is preferable to use a light flux that reflects all the incident illumination light flux EL1. Here, the polarization beam splitters SP1 and SP2 reflect light fluxes to be linearly polarized light of S polarization and transmit light fluxes to be linear polarized light of P polarization. Therefore, the light source device 13 emits to the first drum member 21 the illumination light beam EL1 in which the illumination light beam EL1 incident on the polarization beam splitters SP1 and SP2 is a light beam of linear polarization (S polarization). Thereby, the light source device 13 emits the illumination light beam EL1 whose wavelength and phase are uniform.

  The polarization beam splitters SP1 and SP2 reflect the illumination light beam EL1 from the light source, while transmitting the imaging light beam (projection light beam) EL2 reflected by the cylindrical mask DM. In other words, the illumination light beam EL1 from the illumination module IL is incident on the polarization beam splitters SP1 and SP2 as a reflected light beam, and the imaging light beam EL2 from the cylindrical mask DM is incident on the polarization beam splitters SP1 and SP2 as a transmission light beam .

  As described above, the illumination module IL, which is the processing unit, performs a process of reflecting the illumination light beam EL1 on a predetermined pattern (mask pattern) on the cylindrical mask DM, which is the object to be processed. Thereby, the projection optical system PL can project the image of the pattern in the illumination area IR on the cylindrical mask DM onto a part (projection area PA) of the substrate P being transported by the transport device 9. The exposure apparatus EX2 can process exposure light to the substrate P at the first specific position PX1 and the second specific position PX2 by the projection light beam reflected by the cylindrical mask DM.

Fifth Embodiment
Next, a fifth embodiment of the processing apparatus according to the present invention will be described with reference to FIG. FIG. 21 is a schematic view showing the overall configuration of a processing apparatus (exposure apparatus) according to the fifth embodiment. In this figure, the same components as those of the first embodiment are denoted by the same reference numerals, and the description thereof is omitted. The exposure apparatus EX3 includes polygon scanning units PO1 and PO2, and a spot of a beam obtained by the polygon scanning unit PO, for example, the beam emitted from an ultraviolet laser light source being intensity-modulated according to pattern data by a modulator such as AOM. It may be a spot scanning type drawing apparatus which scans the spot light in the Y direction parallel to the rotation center axis AX2 while emitting the light toward the substrate P.

  As described above, the exposure apparatus EX3 shown in FIG. 21 can process the exposure light (spot light) onto the substrate P at the first specific position PX1 and the second specific position PX2 even without the cylindrical mask DM.

Sixth Embodiment
Next, a sixth embodiment of the processing apparatus according to the present invention will be described with reference to FIG. FIG. 22 is a schematic view showing the overall configuration of a processing apparatus (exposure apparatus) according to the sixth embodiment. In this figure, the same components as those of the first embodiment are denoted by the same reference numerals, and the description thereof is omitted.

  The exposure apparatus EX4 is a processing apparatus that subjects the substrate P with so-called proximity exposure. The exposure device EX4 sets the gap between the cylindrical mask DM and the second drum member 22 minutely, and the illumination mechanism IU directly irradiates the substrate P with the illumination light flux EL, and performs non-contact exposure. In the present embodiment, the second drum member 22 is rotated by the torque supplied from the second drive unit 36 including an actuator such as an electric motor. For example, a driving roller MGG coupled by a magnetic gear drives the first drum member 21 so as to be reverse to the rotation direction of the second driving unit 36. The second drive unit 36 rotates the second drum member 22 and rotates the drive roller MGG and the first drum member 21 together to synchronize the first drum member 21 (cylindrical mask DM) and the second drum member 22. Move (synchronize).

  The exposure apparatus EX4 further includes an encoder head EN8 that detects the position PX6 of the scale section at a specific position where the chief ray of the illumination light beam IL irradiated on the cylindrical mask DM or the substrate P is incident on the substrate P. Here, since the diameter of the outer peripheral surface on which the substrate P is wound among the outer peripheral surfaces of the second drum member 22 is equal to the diameter of the scale portion of the scale disk, the position PX8 is the above-described as viewed from the second central axis AX2. Match the specified position. The encoder head EN4 is set on the installation direction line Le4 rotated approximately 90 ° around the axis of the rotation center line AX2 of the installation direction line Le5 of the encoder head EN5 toward the rear side in the transport direction of the substrate P .

  The exposure apparatus EX4 of this embodiment uses the encoder head EN5 as a first reading device and the encoder head EN4 as a second reading device, and the position of the axis of the second drum member 22 and the specific position obtained from the reading output of the scale unit. And the component of the displacement in the direction orthogonal to the axis can be subjected to processing corrected by the read output of the first reader.

  The first to sixth embodiments described above exemplify the exposure apparatus as the processing apparatus. The processing apparatus is not limited to the exposure apparatus, and the processing unit may be an apparatus that prints a pattern on the substrate P, which is an object to be processed, by an ink drop apparatus of inkjet. Alternatively, the processing unit may be an inspection device.

(Example of evaluation)
Here, when the substrate P is wound around the outer peripheral surface of the cylindrical second drum member 22 at a constant angle, the degree of deformation at the portion where the substrate P is in close contact with the second drum member 22 is shown in FIG. Let's simulate using a model example. In FIG. 23, the rotation center axis AX2 of the second drum member 22 is parallel to the Y axis, and the substrate P is wound around substantially the 180 ° of the upper half of the outer peripheral surface of the second drum member 22.

In the simulation, one end of the substrate P is a fixed end, the other end is a load end, and when a load (tension) in the -Z direction is uniformly applied to the load end, it can rotate around the rotation center axis AX2. It is determined on the outer peripheral surface of the second drum member 22 how many points set every 22.5 degrees are displaced. Here, five line segments ψ ₀ , _{−1 −1} , _{−2 −2} , _{+1 +1} , and ψ ₊₂ are set in a plane orthogonal to the rotation center axis AX2 and parallel to the XZ plane. The line segment ψ ₀ is parallel to the Z axis, and the line segment 回 転₋₁ is rotated −22.5 ° around the rotation center axis AX _{2 with} respect to the line segment ψ ₀ , and the line segment _{+1 +1} is a line The part is rotated + 22.5 ° around the rotation center axis AX2 with respect to the parting point ₀ . Further, the line segment _{[psi -2} are those obtained by -45 ° rotation around the rotational axis AX2 with respect to the segment [psi _0, segment [psi ₊₂ is about the rotational center axis AX2 with respect to the segment [psi ₀ By + 45 degrees.

Further, many target points on the substrate P are on the region QA in the circumferential direction on one end side in the width direction (short direction and Y axis direction) of the substrate P, on the region QB in the circumferential direction on the other end side, For each of the central circumferential regions QC, a total of 15 points corresponding to each of five line segments ψ ₀ , ψ ₋₁ , _{−2 −2} , ψ ₊₁ , and ψ ₊₂ are set. For example, an object point located in the direction of line segment ψ ₀ on the central area QC in the circumferential direction is represented by QC (ψ ₀ ), and on the area QA in the circumferential direction on one end side, line segment _{+1 +1} The target point located in the direction of is represented by QA (ψ ₊₁ ).
Further, the lengthwise direction of the substrate P is taken as the MD direction, the short direction as the TD direction, and the positive and negative directions of the TD direction are matched with the positive and negative directions of the Y axis.

  In the model example of FIG. 23, the substrate P is made of PET with a thickness of 100 μm and a width of 30 cm, the fixed end is uniformly clamped in the TD direction, and the load end at the other end has uniform tension in the MD direction ( Tension) shall be applied. The substrate P extends in the MD direction according to the magnitude of the tension. The expansion and contraction of the substrate P in the MD direction is not affected much by the magnitude of the coefficient of friction between the outer peripheral surface of the second drum member 22 and the back surface of the substrate P because the second drum member 22 is rotatably supported. Stretch freely to

FIG. 24 shows five target points QA (ψ ₋₂ ), QA (ψ ₋₁ ), QA (ψ ₀ ), and QA (ψ ₀ ) on the area QA of the substrate P when the coefficient of friction μ is 0.45. ₊₁ ), QA (ψ ₊₂ ), five target points QB (ψ ₋₂ ) on the area QB, QB (ψ ₋₁ ), QB (ψ ₀ ), QB (ψ ₊₁ ), QB (ψ ₊₂ ), and , Each of five target points QC (ψ _-2 ), QC () _-1 ), QC (ψ ₀ ), QC () ₊₁ ), QC (ψ ₊₂ ) on the area QC, changes in tension (N) Is a graph showing how much displacement in the MD direction is obtained by simulation.

Further, FIG. 25 shows five target points QA (ψ ₋₂ ) to QA (ψ ₊₂ ) on the area QA of the substrate P and five target points QB on the area QB, where the coefficient of friction μ is 200. _{ψ -2) ~QB (ψ +2)} , and each of the five target points on the region _{QC QC (ψ -2) ~QC (} ψ +2) is, with respect to a change in tension (N) [horizontal axis] It is the graph which calculated | required by simulation how much it displaces to MD direction [vertical axis].

Each target point was not influenced by the magnitude of the coefficient of friction, and each target point had a value within the linear range indicated by the hatched portion in the graph. The linear change showing the largest inclination within the shaded area is the target point QA (ψ ₊₂ ) located in the direction of the line segment ψ ₊₂ (+ 45 °) in any of the three regions QA, QB and QC. QB (B ₊₂ ) and QC (ψ ₊₂ ). Further, in the range of the hatched portion, the linear change showing the smallest inclination is the target point QA positioned in the direction of the line segment _{−2 −2} (−45 °) in any of the three regions QA, QB and QC. It was 、 _-2 ), QB (ψ- ₂ ) and QC (ψ- ₂ ).

On the other hand, the expansion and contraction of the substrate P in the TD direction is changed by the influence of the magnitude of the coefficient of friction between the outer peripheral surface of the second drum member 22 and the back surface of the substrate P. 26, when the friction coefficient μ and 0.45, five interesting points on areas _{QA QA (ψ -2) ~QA (} ψ +2), 5 one target point on the region QB QB (ψ _-2 ) ~QB (ψ _+2), and each of the five target points on the region _{QC QC (ψ -2) ~QC (} ψ +2) is, how much displacement in the TD direction with respect to the change in the tension (N) Is a graph obtained by simulation.

Further, FIG. 27 shows five target points QA (ψ ₋₂ ) to QA (ψ ₊₂ ) on the area QA of the substrate P and five target points QB on the area QB, where the coefficient of friction μ is 200. _{ψ -2) ~QB (ψ +2)} , and each of the five target points on the region _{QC QC (ψ -2) ~QC (} ψ +2) is, with respect to a change in tension (N) [horizontal axis] It is the graph which calculated | required by simulation how much it displaces to TD direction [vertical axis].

  As can be seen from the graphs of FIGS. 26 and 27, the regions QA and QB on both sides in the TD direction of the substrate P are displaced toward the central region QC of the substrate P as the tension increases. That is, it deforms in the direction in which the width of the substrate P in the TD direction is reduced. The amount of deformation changes in accordance with the magnitude of the coefficient of friction in the TD direction between the outer peripheral surface of the second drum member 22 and the back surface of the substrate P. When the coefficient of friction is set to 0.45, the substrate P can slide slightly in the TD direction on the outer peripheral surface of the second drum member 22, and the shrinkage in the TD direction becomes relatively large. On the other hand, when the coefficient of friction is 200, the substrate P can hardly slide in the TD direction on the outer peripheral surface of the second drum member 22, and the shrinkage in the TD direction becomes relatively small.

  From the above, the outer peripheral surface of the second drum member 22 of the substrate P is determined by the magnitude of the friction between the back surface of the substrate P and the outer peripheral surface of the second drum member 22 and the magnitude of the tension in the MD direction. It is also possible to predict in advance the tendency and amount of deformation of the part in close contact with the other. Of course, the rigidity and the friction coefficient of the substrate P change depending on whether the material of the substrate P or the process has been received, so that more practical deformation prediction becomes possible by taking these also into consideration.

  Therefore, the amount of deformation of the substrate P in the direction parallel to the rotation center axis AX2 determined by the specific pattern detected by the first detection probe, and the direction parallel to the rotation center axis AX determined by the specific pattern detected by the second detection probe When a guide member for guiding the substrate P is provided at a position where the approach position and the removal position are set such that the amount of deformation of the substrate P matches, the guide member is a tension (tension) of the substrate P in the MD direction. A conveyance mechanism (including rotation control of a drive roller of a nip method, a rotation roller for tension adjustment, etc.) may be used to adjust.

<Device manufacturing method>
Next, a device manufacturing method will be described with reference to FIG. FIG. 28 is a flowchart showing a device manufacturing method using the processing apparatus (exposure apparatus) according to the first embodiment.

  In the device manufacturing method shown in FIG. 28, first, function / performance design of a display panel by self-light emitting elements such as organic EL is performed, and necessary circuit patterns and wiring patterns are designed by CAD (step S201). Next, based on the pattern of each of the various layers designed by CAD or the like, a cylindrical mask DM for the necessary layer is manufactured (step S202). Also, the substrate P is manufactured by preparing the supply roll FR1 on which the flexible substrate P (resin film, metal foil film, plastic, etc.) which is to be the display panel is wound (step S203). . The roll-like substrate P prepared in this step S203 has its surface modified as necessary, a base layer (for example, minute unevenness by imprint method) formed in advance, photosensitivity What laminated the functional film and transparent film | membrane (insulation material) of previously is also good.

  Next, on the substrate P, a backplane layer composed of electrodes and wirings constituting the display panel device, an insulating film, a TFT (thin film semiconductor) and the like is formed, and organic EL etc. A light emitting layer (display pixel portion) is formed by the self light emitting element of the above (step S204). Although this step S204 includes the conventional photolithography process of exposing the photoresist layer using the exposure apparatuses EX, EX2, EX3 and EX4 described in the above embodiments, the photosensitivity is used instead of the photoresist. The pattern exposure of the substrate P coated with the silane coupling material is performed to form a pattern with hydrophilicity and water repellency on the surface, the photosensitive catalyst layer is pattern exposed, and nickel, copper, gold, etc. are formed by electroless plating. It also includes processing by a wet process of forming a pattern (wiring, electrode, etc.) of a metal film, or a printing process of drawing a pattern by a conductive ink containing silver nanoparticles, etc.

  Then, the substrate P is diced for each display panel device continuously manufactured on a long substrate P by a roll method, or a protective film (anti-environment barrier layer) or a color filter is formed on the surface of each display panel device. A sheet or the like is attached to assemble a device (step S205). Then, an inspection process is performed to determine whether the display panel device functions properly or satisfies the desired performance and characteristics (step S206). As described above, a display panel (flexible display) can be manufactured.

DESCRIPTION OF SYMBOLS 1 device manufacturing system 2 substrate supply apparatus 4 substrate collection | recovery apparatus 5 high-order control apparatus 9 conveyance apparatus 12 mask holding apparatus 13 light source apparatus 14 control apparatus 22 2nd drum member DR1-DR8 drive roller 32 1st guide member 33 2nd guide member 35 Second detector 44 Focus correction optical member 45 Image shift correction optical member 46 Rotation correction mechanism 47 Magnification correction optical members AMG1, AMG2, AMG3 Alignment microscope DM Cylindrical masks EN1, EN2, EN3, EN4, EN5 Encoder heads EX, EX2, EX3, EX4 Exposure system (substrate processing system)
PO1, PO2 polygon scanning unit

Claims (8)

A flexible long substrate is wound around a part of the outer peripheral surface of a rotating drum rotating around a center line and moved in a long direction while a pattern is formed on the substrate supported by the rotating drum. A substrate processing apparatus to be formed,
A processing apparatus for forming the pattern on the substrate at a specific position in the circumferential direction between an entering position where the substrate starts to contact the outer peripheral surface of the rotating drum and a separating position where the substrate is separated from the outer peripheral surface;
Each of the plurality of marks formed along the long direction of each of the at least two locations in the region spaced short direction perpendicular to the long direction on the substrate, along the circumferential direction of the outer peripheral surface A first pattern detection device that detects a state in which the substrate is moved by rotating the rotary drum in a first detection region set between the approach position and the specific position;
A speed of forward movement of the substrate from the entry position toward the specific position, a first speed suitable for forming the pattern by the processing device, and a plurality of marks of the plurality of marks by the first pattern detection device in so that continuously varied between temporarily set as the lower than the first speed the second speed to detect each, and a control device for adjusting the rotational speed of the rotary drum,
Equipped with
When the speed of the substrate is set to the second speed, the control device stops the operation of forming the pattern by the processing device, and the plurality of the plurality of patterns are detected by the first pattern detection device. The detection operation of each position of the mark is performed, and after the detection operation is finished, the rotation of the rotary drum is controlled so that the substrate moves from the specific position toward the approach position in the reverse direction by a predetermined length. ,
Substrate processing equipment. The substrate processing apparatus according to claim 1 , wherein
A first guide member for applying longitudinal tension to the substrate on the upstream side of the entry position with respect to movement of the substrate in the forward direction;
A substrate processing apparatus, further comprising: a second guide member for applying longitudinal tension to the substrate downstream of the removal position with respect to movement of the substrate in the forward direction. The substrate processing apparatus according to claim 1 or 2 , wherein
A scale portion provided to rotate with the rotary drum around the center line, and in which a scale is engraved along the circumferential direction;
A first encoder head arranged around the scale section and in the same orientation as the orientation of the first detection area when viewed from the center line, and reading the scale of the scale section;
A second encoder head arranged around the scale section and in the same orientation as the orientation of the specific position when viewed from the center line, for reading the scale of the scale section;
A substrate processing apparatus further comprising The substrate processing apparatus according to claim 3 , wherein
The controller is
By storing the position of the scale on the scale section measured by the first encoder head when the first pattern detection device detects the mark on the substrate in the first detection area. Determine the correspondence between the position of the mark on the substrate and the rotational angle position of the rotating drum,
Substrate processing equipment. The substrate processing apparatus according to any one of claims 1 to 4 , wherein
The processing unit
A first processing unit disposed on the periphery of the rotating drum and forming a pattern on the substrate supported by the outer peripheral surface of the rotating drum at the specific position;
The circumferential surface of the rotating drum is supported by the outer circumferential surface of the rotating drum at a second specific position set between the specific position and the disengaging position in the circumferential direction of the outer circumferential surface of the rotating drum A second processing unit for forming a pattern on the substrate;
Substrate processing equipment. The substrate processing apparatus according to claim 5 , wherein
The first processing unit and the second processing unit are exposure apparatuses that emit exposure light for forming a pattern on the substrate at each of the specific position and the second specific position,
Substrate processing equipment. The substrate processing apparatus according to claim 6 , wherein
The exposure apparatus includes a shift adjustment device that shifts the position of a pattern formed on the substrate by the exposure light in each of the specific position and the second specific position in the long direction or the short direction. ,
Substrate processing equipment. The substrate processing apparatus according to claim 6 or 7 , wherein
The exposure apparatus includes a magnification adjustment device that adjusts a magnification of a pattern formed on the substrate by the exposure light at each of the specific position and the second specific position.
Substrate processing equipment.

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