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JP6501296B2 - Refractive index measuring device - Google Patents
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JP6501296B2 - Refractive index measuring device - Google Patents

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JP6501296B2
JP6501296B2 JP2015027423A JP2015027423A JP6501296B2 JP 6501296 B2 JP6501296 B2 JP 6501296B2 JP 2015027423 A JP2015027423 A JP 2015027423A JP 2015027423 A JP2015027423 A JP 2015027423A JP 6501296 B2 JP6501296 B2 JP 6501296B2
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refractive index
light
diffraction grating
receiving element
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JP2016151421A (en
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洋 猪川
洋 猪川
佐藤 弘明
弘明 佐藤
篤史 小野
篤史 小野
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Shizuoka University NUC
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Description

本発明は、屈折率測定装置に関する。   The present invention relates to a refractive index measurement apparatus.

屈折率の測定は、農業、化学、生物学及び医学などの様々な分野において応用が期待されている。屈折率を測定する技術として、特許文献1〜3には、導波モード共鳴や表面プラズモン共鳴を利用した屈折率の測定装置及び測定方法が記載されている。   The measurement of refractive index is expected to be applied in various fields such as agriculture, chemistry, biology and medicine. As a technique of measuring a refractive index, the measuring apparatus and measuring method of the refractive index which utilized waveguide mode resonance and surface plasmon resonance in patent documents 1-3 are described.

特許文献1には、試料の屈折率を容易に且つ高精度で求める屈折率計が記載されている。この屈折率計を用いて屈折率を測定する場合には、導波モード共鳴フィルタの導波層端面に測定光を導入し、このときの導波モード共鳴フィルタの格子で回折した出射光を光検出器により検出する。測定光の出射角度は検出器の位置を移動させることにより所定角度範囲で走査され、屈折率に対応した共鳴出射角度が求められる。   Patent Document 1 describes a refractometer that easily and accurately determines the refractive index of a sample. When measuring the refractive index using this refractometer, the measurement light is introduced to the end face of the waveguide layer of the waveguide mode resonance filter, and the emitted light diffracted by the grating of the waveguide mode resonance filter at this time is Detected by a detector. The emission angle of the measurement light is scanned within a predetermined angle range by moving the position of the detector, and the resonance emission angle corresponding to the refractive index is obtained.

特許文献2には、回折格子を有し、小型化に適する表面プラズモン共鳴センサチップが記載されている。回折格子は弾性変形可能な弾性膜上に形成されている。このチップを用いて屈折率を測定する場合には、試料を回折格子面の近傍に配置した状態で、回折格子に向けて光を入射する。従来の表面プラズモン共鳴センサチップでは、入射光の入射角度を走査して、回折光の強度を測定していたが、このチップでは入射光の入射角度の走査に代えて、弾性膜を膨出させて回折格子面の格子ピッチを動的に変化させることにより、屈折率に対応した共鳴ピッチを求める。   Patent Document 2 describes a surface plasmon resonance sensor chip that has a diffraction grating and is suitable for miniaturization. The diffraction grating is formed on an elastically deformable elastic film. When the refractive index is measured using this chip, light is incident on the diffraction grating in a state where the sample is disposed in the vicinity of the diffraction grating surface. In the conventional surface plasmon resonance sensor chip, the incident angle of incident light is scanned to measure the intensity of diffracted light, but in this chip, the elastic film is bulged instead of scanning the incident angle of incident light. By dynamically changing the grating pitch of the diffraction grating surface, the resonant pitch corresponding to the refractive index is determined.

特許文献3には、表面プラズモン共鳴センサが記載されている。このセンサは、測定用の光を入射する導波路コア層と、金属薄膜と、誘電体膜と、誘電体膜上に形成された測定用の試料を設けるためのサンプル層とを有している。このセンサを用いて屈折率を測定する場合には、サンプル層に試料を設け、導波路コア層に光を入射させて、導波路コア層を透過する光の波長スペクトルあるいは入射角度スペクトルを測定する。   Patent Document 3 describes a surface plasmon resonance sensor. This sensor has a waveguide core layer for receiving light for measurement, a metal thin film, a dielectric film, and a sample layer for providing a sample for measurement formed on the dielectric film. . When measuring the refractive index using this sensor, a sample is provided in the sample layer, light is incident on the waveguide core layer, and the wavelength spectrum or incident angle spectrum of the light transmitted through the waveguide core layer is measured. .

特開2010−210384号公報Unexamined-Japanese-Patent No. 2010-210384 特開2009−168469号公報JP, 2009-168469, A 特開2004−170095号公報JP, 2004-170095, A

特許文献1〜3に記載された屈折率測定装置では、共鳴フィルタから出射された光の強度に基づいて、共鳴ピークを与える共鳴角度、共鳴波長、又は共鳴ピッチを測定し、測定結果から屈折率を算出している。しかし、これらの方法によると、共鳴フィルタから出射された光の強度を検出するために共鳴フィルタとは別体の光検出器が必要であり、装置構成が煩雑化する。また、光検出器が別体であるため共鳴フィルタから出射された反射光の利用効率が低下し、光の強度の検出精度が悪化することで、屈折率の測定精度が悪化する傾向があった。また、これらの屈折率測定装置では、測定光の強度変動に対して測定精度を維持することが困難である。   In the refractive index measurement devices described in Patent Documents 1 to 3, the resonance angle giving resonance peak, the resonance wavelength or the resonance pitch is measured based on the intensity of light emitted from the resonance filter, and the refractive index is determined from the measurement result Is calculated. However, according to these methods, in order to detect the intensity of light emitted from the resonance filter, a photodetector separate from the resonance filter is required, and the apparatus configuration becomes complicated. Moreover, since the photodetector is a separate body, the utilization efficiency of the reflected light emitted from the resonance filter is lowered, and the detection accuracy of the light intensity is deteriorated, so that the measurement accuracy of the refractive index tends to be deteriorated. . Moreover, in these refractive index measuring devices, it is difficult to maintain the measurement accuracy against the intensity fluctuation of the measuring light.

そこで、本発明は、装置構成を簡素化すると共に屈折率の測定精度を向上させることを可能にした屈折率測定装置を提供することを目的とする。   Therefore, an object of the present invention is to provide a refractive index measurement device that can simplify the device configuration and improve the measurement accuracy of the refractive index.

本発明に係る屈折率測定装置は、入射した光に対応する信号を出力する第1の半導体受光素子部と、第1の半導体受光素子部上の光の入射側に配置され、直線状の溝が所定ピッチで複数形成された第1の回折格子部と、光に対応する信号を出力する第2の半導体受光素子部と、第2の半導体受光素子部上の光の入射側に配置され直線状の溝が所定ピッチと異なるピッチで複数形成された第2の回折格子部と、を有するフォトダイオードと、所定の波長の光を第1及び第2の回折格子部に向けて出射する光源と、第1の半導体受光素子部から出力された信号と、第2の半導体受光素子部から出力された信号とのそれぞれの強度を対数変換して出力する対数変換回路と、対数変換回路から出力されたそれぞれの強度の差分を増幅する差動増幅回路と、を備える屈折率測定装置。   In the refractive index measurement device according to the present invention, a first semiconductor light receiving element portion that outputs a signal corresponding to incident light, and a linear groove disposed on the light incident side on the first semiconductor light receiving element portion A first diffraction grating portion formed with a plurality of predetermined pitches, a second semiconductor light receiving element portion that outputs a signal corresponding to light, and a straight line disposed on the light incident side on the second semiconductor light receiving element portion A second diffraction grating portion in which a plurality of grooves are formed at a pitch different from a predetermined pitch, and a light source for emitting light of a predetermined wavelength toward the first and second diffraction grating portions A logarithmic conversion circuit for logarithmically converting and outputting the respective intensities of the signal output from the first semiconductor light receiving element unit and the signal output from the second semiconductor light receiving element unit; Differential amplification circuit that amplifies the difference between the respective intensities , The refractive index measuring device comprising a.

この屈折率測定装置によれば、直線状の溝部が所定ピッチで形成された第1の回折格子部を光入射側に備える第1の半導体受光素子部と、直線状の溝部が第1の回折格子部と異なるピッチで形成された第2の回折格子部を光入射側に備える第2の半導体受光素子部とに対して、光源から光が入射可能とされる。光の入射に応じて、第1及び第2の半導体受光素子部から出力された2つの信号の強度が、対数変換回路によってそれぞれ対数変換された後に、差動増幅回路によってそれらの差分が増幅して出力される。この出力を用いることにより、光源の出力光の強度が変動したり、光源の出力光の強度が弱い場合でも、フォトダイオード上に配置された物質の屈折率を精度よく測定することができる。また、別体の光検出器を用いることなく屈折率を測定できるため、装置構成を簡素化することができる。しかも、フォトダイオードに入射する光の利用効率が向上することで光の強度の検出精度がさらに向上する。その結果、装置構成を簡素化すると共に屈折率の測定精度を向上させることができる。   According to this refractive index measurement apparatus, the first semiconductor light receiving element portion provided on the light incident side with the first diffraction grating portion in which the linear groove portions are formed at the predetermined pitch, and the linear diffraction portion is the first diffraction Light from the light source can be made incident on a second semiconductor light receiving element portion provided on the light incident side with a second diffraction grating portion formed at a pitch different from that of the grating portion. After the intensities of the two signals output from the first and second semiconductor light receiving element sections are logarithmically converted by the logarithmic conversion circuit in response to the incidence of light, the differences between them are amplified by the differential amplifier circuit. Output. By using this output, even when the intensity of the output light of the light source fluctuates or the intensity of the output light of the light source is weak, it is possible to accurately measure the refractive index of the substance disposed on the photodiode. Further, since the refractive index can be measured without using a separate photodetector, the apparatus configuration can be simplified. Furthermore, the detection efficiency of the light intensity is further improved by improving the utilization efficiency of the light incident on the photodiode. As a result, the apparatus configuration can be simplified and the measurement accuracy of the refractive index can be improved.

ここで、光源は、所定周波数で光を変調して出射し、対数変換回路から出力されたそれぞれの強度を、所定周波数でロックイン検出する、ことでもよい。この場合、フォトダイオードの出力に含まれる、暗電流のような直流成分、及びショット雑音等の広い周波数帯域の雑音の影響を減らすことで、屈折率の検出精度を一層高めることができる。   Here, the light source may modulate and emit light at a predetermined frequency, and lock-in detection of each intensity output from the logarithmic conversion circuit may be performed at the predetermined frequency. In this case, the detection accuracy of the refractive index can be further enhanced by reducing the influence of a direct current component such as dark current and noise in a wide frequency band such as shot noise included in the output of the photodiode.

また、第1の回折格子部と第2の回折格子部とは、溝の形成方向が互いに平行となるように構成され、光源は、第1の回折格子部の溝の形成方向、及び第2の回折格子部の溝の形成方向に垂直な平面内で前記第1及び第2の半導体受光素子部表面に垂直な方向に対して傾斜した方向から光を出射する、ことでもよい。この場合、フォトダイオード上に配置された物質の屈折率の変化に対する、第1の半導体受光素子部の出力と第2の半導体受光素子部の出力との差分の変化率が高くなり、屈折率の検出精度をさらに一層高めることができる。   Further, the first diffraction grating portion and the second diffraction grating portion are configured such that the formation directions of the grooves are parallel to each other, and the light source is a formation direction of the grooves of the first diffraction grating portion, and The light may be emitted from a direction inclined with respect to the direction perpendicular to the surfaces of the first and second semiconductor light receiving element portions in a plane perpendicular to the direction in which the grooves of the diffraction grating portion are formed. In this case, the rate of change in the difference between the output of the first semiconductor light receiving element and the output of the second semiconductor light receiving element with respect to the change in the refractive index of the substance disposed on the photodiode becomes high. Detection accuracy can be further enhanced.

本発明によれば、装置構成を簡素化すると共に屈折率の測定精度を向上できる。   According to the present invention, the apparatus configuration can be simplified and the measurement accuracy of the refractive index can be improved.

本発明の好適な一実施形態に係る屈折率測定装置を示す斜視図である。It is a perspective view showing the refractive index measuring device concerning one preferred embodiment of the present invention. 図1のフォトダイオードの要部断面図である。It is principal part sectional drawing of the photodiode of FIG. 測定光と導波路モードとの位相整合条件の関係を示す図である。It is a figure which shows the relationship of the phase matching conditions of measurement light and a waveguide mode. 屈折率とピーク波長及びピーク値との関係を示すグラフである。It is a graph which shows the relationship between a refractive index, a peak wavelength, and a peak value. 図2のフォトダイオードにおける測定光の波長と2つの半導体受光素子部のそれぞれが生成する光電流の大きさとの関係を示すグラフである。It is a graph which shows the relationship between the wavelength of the measurement light in the photodiode of FIG. 2, and the magnitude | size of the photoelectric current which each of two semiconductor light receiving element parts produces | generates. 図2のフォトダイオードにおける屈折率差と光電流差との関係を示すグラフである。It is a graph which shows the relationship between the refractive index difference and the photocurrent difference in the photodiode of FIG. 図1の屈折率算出処理部の構成を示すブロック図である。It is a block diagram which shows the structure of the refractive index calculation process part of FIG. 図7の対数変換回路部の詳細構成を示す回路図である。It is a circuit diagram which shows the detailed structure of the logarithmic transformation circuit unit of FIG. 図2の半導体受光素子部の出力と図7の対数変換回路部の出力との関係を示すグラフである。It is a graph which shows the relationship between the output of the semiconductor light receiving element part of FIG. 2, and the output of the logarithmic conversion circuit part of FIG. 被測定物Mの屈折率に関する屈折率差と、図7の差動増幅回路の出力相当値との関係を示すグラフである。It is a graph which shows the relationship between the refractive index difference regarding the refractive index of the to-be-measured object M, and the output equivalent value of the differential amplifier circuit of FIG. 本発明の変形例に係る屈折率算出処理部の構成を示すブロック図である。It is a block diagram which shows the structure of the refractive index calculation process part which concerns on the modification of this invention.

以下、添付図面を参照しながら本発明を実施するための形態を詳細に説明する。図面の説明において同一の要素には同一の符号を付し、重複する説明を省略する。   Hereinafter, embodiments of the present invention will be described in detail with reference to the attached drawings. In the description of the drawings, the same elements will be denoted by the same reference symbols, without redundant description.

図1は、本発明の好適な一実施形態に係る屈折率測定装置を示す斜視図、図2は、屈折率測定装置に用いるフォトダイオードの要部断面図である。本実施形態に係る屈折率測定装置1は、図1に示されるように、被測定物Mに測定光(光)Lを照射することにより被測定物Mの屈折率nを検出する装置である。屈折率測定装置1は、測定光Lの照射により、配置された被測定物Mの屈折率n等に応じた電気信号を出力するフォトダイオード3と、測定光Lを出射する光源装置(光源)2と、を備えている。さらに、屈折率測定装置1は、フォトダイオード3から出力された電気信号を処理及び検出する屈折率算出処理部5を備えている。   FIG. 1 is a perspective view showing a refractive index measurement apparatus according to a preferred embodiment of the present invention, and FIG. 2 is a cross-sectional view of an essential part of a photodiode used in the refractive index measurement apparatus. The refractive index measuring apparatus 1 according to the present embodiment is an apparatus for detecting the refractive index n of the object to be measured M by irradiating the object to be measured M with the measuring light (light) L as shown in FIG. . The refractive index measuring apparatus 1 includes a photodiode 3 that outputs an electric signal according to the refractive index n and the like of the disposed object M by irradiation of the measuring light L, and a light source device (light source) that emits the measuring light L 2 and. Furthermore, the refractive index measurement device 1 includes a refractive index calculation processing unit 5 that processes and detects an electric signal output from the photodiode 3.

光源装置2は、所定の帯域に含まれる特定波長の測定光Lを出射するものである。また、光源装置2は、フォトダイオード3に対する測定光Lの入射角度が調整可能であり、本実施形態の光源装置2は、測定光Lがフォトダイオード3上の回折格子部6A,6Bに向けて斜めに入射するように、詳細には、後述する回折格子部6A,6Bの溝部の形成方向に対して垂直な平面内でフォトダイオード3表面に垂直な方向に対して傾斜した方向から入射するように配置されている。   The light source device 2 emits measurement light L of a specific wavelength included in a predetermined band. Further, the light source device 2 can adjust the incident angle of the measurement light L to the photodiode 3, and the light source device 2 of this embodiment directs the measurement light L to the diffraction grating portions 6 A and 6 B on the photodiode 3. In order to make the light incident obliquely, in detail, the light is incident from a direction perpendicular to the direction perpendicular to the surface of the photodiode 3 in a plane perpendicular to the formation direction of the grooves of the diffraction grating portions 6A and 6B described later. Is located in

フォトダイオード3は、測定光Lの光強度に対応する2つの電気信号をそれぞれ生成する2つの半導体受光素子部3A,3Bと、それぞれの半導体受光素子部3A,3B上に設けられた2つの回折格子部6A,6Bとを備えている。なお、以下の説明においては、フォトダイオード3を構成する各層の積層方向をZ軸方向とし、後述する回折格子部6A,6Bのそれぞれに形成された複数の直線状の溝部6Aa,6Baの配列方向をY軸方向、及びそれらの溝部6Aa,6Baの形成方向をX軸方向とし、各軸は互いに直交するものとする。   The photodiode 3 includes two semiconductor light receiving element units 3A and 3B that respectively generate two electric signals corresponding to the light intensity of the measurement light L, and two diffractions provided on the respective semiconductor light receiving element units 3A and 3B. The grids 6A and 6B are provided. In the following description, the lamination direction of each layer constituting the photodiode 3 is taken as the Z-axis direction, and the arrangement direction of the plurality of linear groove portions 6Aa and 6Ba formed in each of the diffraction grating portions 6A and 6B described later. Is the Y-axis direction, and the forming direction of the grooves 6Aa and 6Ba is the X-axis direction, and the respective axes are orthogonal to each other.

このフォトダイオード3は、シリコン基板(基板)7と、シリコン基板7上に配置された埋め込み絶縁層8と、埋め込み絶縁層8上にY軸方向に並んで配置された2つの半導体受光素子部3A,3Bと、を有している。半導体受光素子部3Aは、X方向に並んで形成された半導体層9,11A,12と、半導体層9,11A,12上に配置されたゲート絶縁層13Aと、によって構成され、半導体受光素子部3Bは、X方向に並んで形成された半導体層9,11B,12と、半導体層9,11B,12上に配置されたゲート絶縁層13Bと、によって構成される。これらの半導体受光素子部3A,3Bは、シリコン基板7と埋め込み絶縁層8とともに、いわゆるMOS構造の横型pn接合ダイオードを構成する。埋め込み絶縁層8は酸化シリコンからなり、半導体層9,11A,11B,12は所定の不純物を含むシリコンからなり、ゲート絶縁層13A,13Bは酸化シリコンからなる。従って、フォトダイオード3は、シリコン基板7を基板(支持体)としたSOI(Silicon On Insulator)構造を有している。   The photodiode 3 includes a silicon substrate (substrate) 7, a buried insulating layer 8 disposed on the silicon substrate 7, and two semiconductor light receiving element portions 3A disposed on the buried insulating layer 8 in the Y-axis direction. , And 3B. The semiconductor light receiving element portion 3A includes the semiconductor layers 9, 11A and 12 formed side by side in the X direction, and the gate insulating layer 13A disposed on the semiconductor layers 9, 11A and 12, and the semiconductor light receiving element portion 3B is composed of semiconductor layers 9, 11B and 12 formed side by side in the X direction, and a gate insulating layer 13B disposed on the semiconductor layers 9, 11B and 12. These semiconductor light receiving element portions 3A and 3B, together with the silicon substrate 7 and the buried insulating layer 8, constitute a so-called lateral pn junction diode of a MOS structure. The buried insulating layer 8 is made of silicon oxide, the semiconductor layers 9, 11A, 11B, 12 are made of silicon containing a predetermined impurity, and the gate insulating layers 13A, 13B are made of silicon oxide. Therefore, the photodiode 3 has an SOI (Silicon On Insulator) structure in which the silicon substrate 7 is used as a substrate (support).

半導体受光素子部3Aの半導体層9,11A,12は、埋め込み絶縁層8上の矩形状の所定領域において、X軸方向に沿って、この順で隣接して設けられている。光導波路及び光吸収層として機能する半導体層11Aは、深さ方向(Z軸方向)の大部分が空乏化し、シリコンに対して低濃度でボロンやリン等のp型不純物又はn型不純物が添加されている。アノード電極及びカソード電極である半導体層9,12は、それぞれ、埋め込み絶縁層8上において半導体層11AをX軸に沿った方向から挟むように、半導体層11Aとほぼ同一の厚さでp型半導体層及びn型半導体層として形成されている。このp型半導体層9及びn型半導体層12は、それぞれ、シリコンに対して高濃度(1019cm−3以上)でボロン等のp型不純物及びリン等のn型不純物が添加されており、半導体層11Aに並設されることでアノード電極及びカソード電極として機能する。これらの半導体層9,11A,12上には、半導体層9,11A,12を覆うようにゲート絶縁層13Aが形成されている。また、半導体受光素子部3Bも同様な構成を有する。 The semiconductor layers 9, 11A and 12 of the semiconductor light receiving element portion 3A are provided adjacent to each other in this order along the X-axis direction in a rectangular predetermined region on the buried insulating layer 8. In the semiconductor layer 11A functioning as an optical waveguide and a light absorption layer, most of the depth direction (Z-axis direction) is depleted and a low concentration of silicon is doped with a p-type impurity such as boron or phosphorus or an n-type impurity. It is done. The semiconductor layers 9 and 12 serving as the anode electrode and the cathode electrode are each p + -type in substantially the same thickness as the semiconductor layer 11A so as to sandwich the semiconductor layer 11A on the embedded insulating layer 8 from the direction along the X axis. The semiconductor layer and the n + -type semiconductor layer are formed. The p + -type semiconductor layer 9 and the n + -type semiconductor layer 12 are each doped with a p-type impurity such as boron and an n-type impurity such as phosphorus at a high concentration (10 19 cm −3 or more) with respect to silicon. By being arranged in parallel to the semiconductor layer 11A, it functions as an anode electrode and a cathode electrode. A gate insulating layer 13A is formed on the semiconductor layers 9, 11A, 12 so as to cover the semiconductor layers 9, 11A, 12. The semiconductor light receiving element portion 3B also has the same configuration.

このような半導体受光素子部3A,3Bによって同時に測定光Lを検出する際には、回折格子部6A,6Bにゲート電圧Vgが印加され、シリコン基板7に基板電圧Vsubが印加される。ゲート電圧Vg及び基板電圧Vsubを調整することで、半導体層11A,11Bの上下の界面における電子又は正孔の密度を広範囲で制御することができる。特に、ゲート電圧Vg及び基板電圧Vsubは、ゲート絶縁層13A,13Bに接する半導体層11A,11Bの界面と、埋め込み絶縁層8に接する半導体層11A,11Bの界面における電子又は正孔の密度が半導体層11A,11Bのそれぞれの真性キャリア密度よりも十分に大きくなるように設定されることが好ましい。なお、ゲート電圧Vgは、回折格子部6A,6Bで共通で印加されてもよいし、回折格子部6A,6Bで独立に印加されて、それぞれの電圧を独立に調整可能とされてもよい。   When the measurement light L is simultaneously detected by such semiconductor light receiving element units 3A and 3B, the gate voltage Vg is applied to the diffraction grating sections 6A and 6B, and the substrate voltage Vsub is applied to the silicon substrate 7. By adjusting the gate voltage Vg and the substrate voltage Vsub, the density of electrons or holes at the upper and lower interfaces of the semiconductor layers 11A and 11B can be controlled in a wide range. In particular, the gate voltage Vg and the substrate voltage Vsub are such that the electron or hole density at the interface of the semiconductor layers 11A and 11B in contact with the gate insulating layers 13A and 13B and the interface of the semiconductor layers 11A and 11B in contact with the buried insulating layer 8 is semiconductor It is preferable to set so as to be sufficiently larger than the intrinsic carrier density of each of the layers 11A and 11B. The gate voltage Vg may be commonly applied to the diffraction grating portions 6A and 6B, or may be independently applied to the diffraction grating portions 6A and 6B so that the respective voltages can be adjusted independently.

光源装置2からの光の入射側のゲート絶縁層13A上の少なくとも半導体層11Aを覆う領域には、回折格子部6Aが配置されている。従って、回折格子部6Aは、ゲート絶縁層13Aを介して半導体層11Aを覆っており、半導体層9,11A,12から電気的に絶縁されている。回折格子部6Aは、平面状の導電部材である金属膜に、半導体層11Aを覆う領域に亘ってX軸方向に沿ってゲート絶縁層13Aの表面まで貫通する複数の直線状の溝部6Aa(図2参照)が形成されている。これらの複数の溝部6AaはY軸方向に一定の格子ピッチ(周期)P1で並設されている。このような回折格子部6Aの材料としては、例えば、チタン(Ti)の付着力強化層上に形成した金(Au)、銀(Ag)、アルミニウム(Al)、等の導電性金属、又は、n型もしくはp型の不純物を高濃度に添加した多結晶シリコン(ポリSi)等の導電性材料が用いられる。この回折格子部6Aは、所定波長を有する測定光Lを半導体層11Aへ導く役割、ゲート電極としての役割、及び被測定物Mを配置するための配置部としての役割を有する。   A diffraction grating portion 6A is disposed in a region covering at least the semiconductor layer 11A on the gate insulating layer 13A on the light incident side of the light source device 2. Therefore, the diffraction grating portion 6A covers the semiconductor layer 11A via the gate insulating layer 13A, and is electrically insulated from the semiconductor layers 9, 11A, and 12. The diffraction grating portion 6A is formed of a plurality of linear grooves 6Aa penetrating the metal film, which is a planar conductive member, along the X-axis direction to the surface of the gate insulating layer 13A over the region covering the semiconductor layer 11A. 2) is formed. The plurality of grooves 6Aa are juxtaposed in the Y-axis direction at a constant lattice pitch (period) P1. As a material of such a diffraction grating portion 6A, for example, a conductive metal such as gold (Au), silver (Ag), aluminum (Al) or the like formed on the adhesion strengthening layer of titanium (Ti), or A conductive material such as polycrystalline silicon (poly-Si) to which an n-type or p-type impurity is added at a high concentration is used. The diffraction grating portion 6A has a role of guiding the measurement light L having a predetermined wavelength to the semiconductor layer 11A, a role as a gate electrode, and a role as a placement portion for placing the object to be measured M.

光源装置2からの光の入射側のゲート絶縁層13B上の少なくとも半導体層11Bを覆う領域には、回折格子部6Bが配置されている。回折格子部6Bは、ゲート絶縁層13Bを介して半導体層11Bを覆っており、半導体層9,11B,12から電気的に絶縁されている。回折格子部6Bは、回折格子部6Aと同様な構造を有し、回折格子部6Bの溝部6Baの形成方向が回折格子部6Aの溝部6Aaの形成方向と平行になるように構成され、かつ、複数の溝部6BaのY軸方向の格子ピッチP2が、回折格子部6Aの格子ピッチP1よりも小さくなるように設定されている(図2)。この回折格子部6Bは、所定波長を有する測定光Lを半導体層11Bへ導く役割、ゲート電極としての役割、及び被測定物Mを配置するための配置部としての役割を有する。   A diffraction grating portion 6B is disposed in a region covering at least the semiconductor layer 11B on the gate insulating layer 13B on the light incident side of the light source device 2. The diffraction grating portion 6B covers the semiconductor layer 11B via the gate insulating layer 13B, and is electrically insulated from the semiconductor layers 9, 11B and 12. Diffraction grating portion 6B has the same structure as that of diffraction grating portion 6A, and is formed such that the formation direction of groove portion 6Ba of diffraction grating portion 6B is parallel to the formation direction of groove portion 6Aa of diffraction grating portion 6A, The grating pitch P2 in the Y-axis direction of the plurality of groove portions 6Ba is set to be smaller than the grating pitch P1 of the diffraction grating portion 6A (FIG. 2). The diffraction grating portion 6B has a role of guiding the measurement light L having a predetermined wavelength to the semiconductor layer 11B, a role as a gate electrode, and a role as a placement portion for placing the object to be measured M.

フォトダイオード3では、回折格子部6A,6Bに同時に測定光Lが照射されると、半導体層11A,11Bの導波路モードとの間で位相整合条件を満たす特定波長の測定光Lが最も効率よく半導体層11A,11Bに捉えられる。半導体層11A,11Bに捉えられた測定光Lは、半導体層11A,11B中において吸収されて電子・正孔対を生成する。そして、生成され分離された電子と正孔の量に対応する光電流が、それぞれの半導体受光素子部3A,3Bにおいてカソードからアノードへ流れるため、それぞれの半導体受光素子部3A,3Bの半導体層12から電気信号が取り出される。   In the photodiode 3, when the measurement light L is simultaneously irradiated to the diffraction grating portions 6A and 6B, the measurement light L having a specific wavelength that satisfies the phase matching condition with the waveguide mode of the semiconductor layers 11A and 11B is most efficient. It is captured by the semiconductor layers 11A and 11B. The measurement light L captured by the semiconductor layers 11A and 11B is absorbed in the semiconductor layers 11A and 11B to generate electron-hole pairs. Then, a photocurrent corresponding to the amount of electrons and holes generated and separated flows from the cathode to the anode in each of the semiconductor light receiving element portions 3A and 3B, so that the semiconductor layers 12 of the respective semiconductor light receiving element portions 3A and 3B. An electrical signal is taken out from.

この半導体層11Aにおける導波路モードの伝搬波長λは、式(1)により示される。ここで、λは測定光Lの波長であり、nは半導体層11Aの屈折率であり、tは半導体層11Aの厚さであり、nは埋め込み絶縁層8及びゲート絶縁層13Aの屈折率である。TEモードとは、導波路(すなわち、半導体層11A)を伝搬する光の電界方向が伝搬方向に垂直で導波路平面内にあるモードであり、TMモードとは同じく磁界方向が伝搬方向に垂直で導波路平面内にあるモードであり、各モードに対応して式(1)が異なる。

Propagation wavelength lambda g of the waveguide mode in the semiconductor layer 11A is represented by the formula (1). Here, λ is the wavelength of the measurement light L, n s is the refractive index of the semiconductor layer 11A, t s is the thickness of the semiconductor layer 11A, and n i is that of the buried insulating layer 8 and the gate insulating layer 13A. It is a refractive index. The TE mode is a mode in which the electric field direction of light propagating in the waveguide (that is, the semiconductor layer 11A) is perpendicular to the propagation direction and in the plane of the waveguide, and similarly to the TM mode, the magnetic field direction is perpendicular to the propagation direction The modes are in the waveguide plane, and equation (1) is different corresponding to each mode.

位相整合条件について説明する。図3は測定光と導波路モードとの位相整合条件の関係を示す図である。図3(a)に示されるように、回折格子部6Aに対して測定光Lが入射角度αで斜めに入射したとき、回折格子部6Aにおける1ピッチP(=P1)あたりに生じる光路長(P×sinα)と屈折率nと波長λとに起因して、位相差Δ(=P(2πn/λ)sinα)が生じる。そして、位相整合条件は、位相差Δを波数k(=2π/λ)で除した値(Δ/k)を半導体層11Aの伝搬波長λに対して加算又は減算した値(=λ±Δ/k)が、格子ピッチPと等しいとして示される。図3(b)は加算される場合を示しており、半導体層11Aには前進波が伝搬する。減算される場合は、後進波が伝搬する。従って、式(2−1)及び式(2−2)が得られる。ここで、λは測定光Lの波長であり、nは被測定物Mの屈折率であり、Pは格子ピッチであり、αは測定光Lの入射角度である。また、λgfは半導体層11Aにおける前進波の伝搬波長であり、λgbは半導体層11Aにおける後進波の伝搬波長である。位相整合条件が満たされる場合とは、式(2−1)及び式(2−2)を満足する場合である。式(2−1)及び式(2−2)によれば、位相整合条件を満たす場合とは、格子ピッチP、屈折率n、測定光Lの波長λ、入射角度αにより規定される値が、導波路モードの伝搬波長λgf,λgbと一致する場合であるともいえる。

The phase matching condition will be described. FIG. 3 is a diagram showing the relationship of the phase matching condition between the measurement light and the waveguide mode. As shown in FIG. 3A, when the measurement light L obliquely enters the diffraction grating portion 6A at the incident angle α, an optical path length (per one pitch P (= P1) in the diffraction grating portion 6A ((A)) A phase difference Δ (= P (2πn / λ) sin α) occurs due to P × sin α), the refractive index n, and the wavelength λ. The phase matching condition is a value obtained by adding or subtracting a value (Δ / k g ) obtained by dividing the phase difference Δ by the wavenumber k g (= 2π / λ g ) with respect to the propagation wavelength λ g of the semiconductor layer 11A (= λ g ± Δ / k g ) is shown as being equal to the grating pitch P. FIG. 3B shows the case of addition, and the forward wave propagates to the semiconductor layer 11A. In the case of subtraction, a backward wave propagates. Therefore, Formula (2-1) and Formula (2-2) are obtained. Here, λ is the wavelength of the measurement light L, n is the refractive index of the device under test M, P is the grating pitch, and α is the incident angle of the measurement light L. Further, λ gf is a propagation wavelength of the forward wave in the semiconductor layer 11A, and λ gb is a propagation wavelength of the backward wave in the semiconductor layer 11A. The case where the phase matching condition is satisfied is a case where the equations (2-1) and (2-2) are satisfied. According to the equations (2-1) and (2-2), when the phase matching condition is satisfied, the value defined by the grating pitch P, the refractive index n, the wavelength λ of the measurement light L, and the incident angle α is It can also be said that the cases coincide with the propagation wavelengths λ gf and λ gb of the waveguide mode.

式(2−1)及び式(2−2)によれば、測定光Lの入射角度αが0度以外、換言すると測定光Lが回折格子部6Aに対して斜めに照射された状態で、屈折率nの変化が生じると位相整合条件を満たすために測定光Lの波長λのシフトが必要になることがわかる。同様に、半導体層11Bにおける位相整合条件も同様の式によって表される。   According to the equations (2-1) and (2-2), the incident angle α of the measurement light L is other than 0 degree, in other words, in a state where the measurement light L is obliquely irradiated to the diffraction grating portion 6A, It can be seen that when the change of the refractive index n occurs, the shift of the wavelength λ of the measurement light L is necessary to satisfy the phase matching condition. Similarly, the phase matching condition in the semiconductor layer 11B is also expressed by the same equation.

光電流の分光特性について説明する。図4は屈折率とピーク波長及びピーク値との関係を示すグラフである。図4に示されるように、光電流の分光特性は、測定光Lの波長λと、その測定光Lを照射したときにフォトダイオード3から出力される電気信号の大きさとの関係であり、波長λごとの電気信号の大きさを示すものである。図4において、横軸は測定光Lの波長λであり、縦軸は電気信号の大きさを示す光電流である。式(2−1)及び式(2−2)の右辺の値が左辺の伝搬波長λgf,λgbに近づくほど、電気信号の値が大きくなり、右辺の値と左辺の値が一致したとき(位相整合条件を満たすとき)に電気信号は最大値(ピーク)になる。 The spectral characteristics of the photocurrent will be described. FIG. 4 is a graph showing the relationship between the refractive index and the peak wavelength and peak value. As shown in FIG. 4, the spectral characteristic of the photocurrent is a relationship between the wavelength λ of the measurement light L and the magnitude of the electrical signal output from the photodiode 3 when the measurement light L is irradiated, and the wavelength It shows the magnitude of the electrical signal for each λ. In FIG. 4, the horizontal axis is the wavelength λ of the measurement light L, and the vertical axis is the photocurrent indicating the magnitude of the electrical signal. When the value on the right side of Equations (2-1) and (2-2) approaches the propagation wavelengths λ gf and λ gb on the left side, the value of the electrical signal increases and the value on the right side matches the value on the left side. The electrical signal has a maximum value (peak) (when the phase matching condition is satisfied).

屈折率nの変化に伴うピーク波長λpのシフトについて更に説明する。図4(a)は、回折格子部6Aに対する測定光LのY−Z平面内で傾けた入射角度αが10度であるときの光電流の分光特性を示す。図4(b)は、回折格子部6Aに対する測定光Lの入射角度αが20度であるときの光電流の分光特性を示す。更に、図4(a)のグラフG1及び図4(b)のグラフG3は、被測定物Mの屈折率がn=1である場合の光電流の分光特性を示している。グラフG1は2個のピークpk1,pk2を有し、グラフG3はピークpk5,pk6を有している。2個のピークのうち、長波長のピーク(すなわち、pk1、pk3)が後進波に対応し、短波長のピーク(すなわち、pk2、pk4)が前進波に対応する。図4(a)のグラフG2及び図4(b)のグラフG4は、被測定物Mの屈折率がn=1.4933である場合の光電流の分光特性を示している。グラフG2は2個のピークpk3,pk4を有し、グラフG4はピークpk7,pk8を有している。同じく、長波長のピーク(すなわち、pk5、pk7)が後進波に対応し、短波長のピーク(すなわち、pk6、pk8)が前進波に対応する。   The shift of the peak wavelength λp with the change of the refractive index n will be further described. FIG. 4A shows the spectral characteristics of the photocurrent when the incident angle α of the measurement light L with respect to the diffraction grating 6A in the YZ plane is 10 degrees. FIG. 4B shows the spectral characteristics of the photocurrent when the incident angle α of the measurement light L to the diffraction grating portion 6A is 20 degrees. Furthermore, the graph G1 of FIG. 4A and the graph G3 of FIG. 4B show the spectral characteristics of the photocurrent when the refractive index of the device under test M is n = 1. The graph G1 has two peaks pk1 and pk2, and the graph G3 has peaks pk5 and pk6. Of the two peaks, long wavelength peaks (i.e., pk1, pk3) correspond to backward waves, and short wavelength peaks (i.e., pk2, pk4) correspond to forward waves. Graph G2 of FIG. 4A and graph G4 of FIG. 4B show the spectral characteristics of the photocurrent when the refractive index of the device under test M is n = 1.4933. The graph G2 has two peaks pk3 and pk4, and the graph G4 has peaks pk7 and pk8. Similarly, long wavelength peaks (i.e., pk5, pk7) correspond to backward waves, and short wavelength peaks (i.e., pk6, pk8) correspond to forward waves.

ここで、図4(a)の後進波のピークpk1,pk3を比較すると、グラフG1(n=1)のピークpk1に対して、グラフG2(n=1.4933)のピークpk3は、ピーク波長λpが長波長側へシフトしていることがわかる。また、前進波のピークに関しては、グラフG1(n=1)のピークpk2に対して、グラフG2(n=1.4933)のピークpk4は、ピーク波長λpが短波長側へシフトしていることがわかる。また、図4(a)のピークpk1,pk3を比較すると、グラフG1(n=1)のピークpk1に対して、グラフG2(n=1.4933)のピークpk3は、ピーク値が減少していることがわかる。また、グラフG1(n=1)のピークpk2に対して、グラフG2(n=1.4933)のピークpk4も、ピーク値が減少していることがわかる。   Here, when the peaks pk1 and pk3 of the reverse wave in FIG. 4A are compared, the peak pk3 of the graph G2 (n = 1.4933) has a peak wavelength with respect to the peak pk1 of the graph G1 (n = 1). It can be seen that λp is shifted to the long wavelength side. In addition, with regard to the peak of the forward wave, the peak wavelength λp of the peak pk4 of the graph G2 (n = 1.4933) is shifted to the short wavelength side with respect to the peak pk2 of the graph G1 (n = 1). I understand. Further, comparing the peaks pk1 and pk3 in FIG. 4A, the peak pk3 of the graph G2 (n = 1.4933) decreases with respect to the peak pk1 of the graph G1 (n = 1). I understand that Further, it can be seen that the peak value of the peak pk4 of the graph G2 (n = 1.4933) also decreases with respect to the peak pk2 of the graph G1 (n = 1).

このように、ピーク波長λpのシフト量と屈折率nとの間には所定の関係があり、ピーク値の減少量と屈折率nとの間にも所定の関係があることがわかる。そこで、本実施形態の屈折率測定装置1では、ピーク波長λpが屈折率nの変化に応じてシフトするという性質を利用して屈折率nを検出する。この検出メカニズムについて、図5及び図6を参照しながらさらに説明する。   Thus, it can be seen that there is a predetermined relationship between the shift amount of the peak wavelength λp and the refractive index n, and there is also a predetermined relationship between the decrease amount of the peak value and the refractive index n. Therefore, in the refractive index measurement device 1 of the present embodiment, the refractive index n is detected using the property that the peak wavelength λp shifts according to the change of the refractive index n. This detection mechanism is further described with reference to FIGS. 5 and 6.

図5は、フォトダイオード3における測定光Lの波長と半導体受光素子部3A,3Bのそれぞれが生成する光電流I,Iの大きさとの関係を示すグラフである。同図中において、各光電流I,Iの実線の特性は、ある基準屈折率nを有する被測定物Mが配置された場合の特性を示し、各光電流I,Iの点線の特性は、基準屈折率nとは異なる屈折率nを有する被測定物Mが配置された場合の特性を示している。本実施形態の屈折率測定装置1では、実線の特性が示すように、光源装置2から入射角度αで出射された測定光Lの波長λに対して、基準屈折率nを有する被測定物Mが配置された場合の光電流I,Iの値が互いに等しくなるように、回折格子部6Aの格子ピッチP1及び回折格子部6Bの格子ピッチP2が設計されている。これに対して、点線の特性に示すように、屈折率測定装置1では、光源装置2から入射角度αで出射された測定光Lの波長λに対して、屈折率nを有する被測定物Mが配置された場合の2つの光電流I,Iの差が、屈折率nのnからの変化量に応じた大きさで生じる。この性質を利用して、屈折率測定装置1では、2つの光電流I,Iの差を基にして被測定物Mの屈折率nを検出する。 FIG. 5 is a graph showing the relationship between the wavelength of the measurement light L in the photodiode 3 and the magnitudes of the photocurrents I 1 and I 2 generated by the semiconductor light receiving element portions 3A and 3B. During the drawing, the solid line characteristics of each photocurrent I 1, I 2 represents the characteristic when the object to be measured M with a certain reference refractive index n 0 is positioned, of the optical current I 1, I 2 The characteristic of the dotted line shows the characteristic when the device under test M having a refractive index n different from the reference refractive index n 0 is disposed. In the refractive index measurement device 1 of the present embodiment, as shown by the characteristics of the solid line, the measurement is performed with the reference refractive index n 0 with respect to the wavelength λ L of the measurement light L emitted from the light source device 2 at the incident angle α. The grating pitch P1 of the diffraction grating portion 6A and the grating pitch P2 of the diffraction grating portion 6B are designed so that the values of the photocurrents I 1 and I 2 when the object M is disposed become equal to each other. On the other hand, as shown by the characteristic of the dotted line, in the refractive index measuring device 1, an object under test having a refractive index n with respect to the wavelength λ L of the measuring light L emitted from the light source device 2 at the incident angle α. When M is disposed, the difference between the two photocurrents I 1 and I 2 occurs with a magnitude corresponding to the amount of change of the refractive index n from n 0 . Using this property, the refractive index measurement device 1 detects the refractive index n of the object M based on the difference between the two photocurrents I 1 and I 2 .

図6は、フォトダイオード3における被測定物Mの屈折率nの基準屈折率nに対する差と2つの光電流I,Iの差との関係を示すグラフである。同図において、特性G5は、屈折率測定装置1における所定の発光強度の測定光Lに対する屈折率差n−nと光電流差I−Iとの関係を示し、特性G6は、測定光Lの発光強度を50%に減少させた場合の屈折率差n−nと光電流差I−Iとの関係を示し、特性G7は、測定光Lの発光強度を10%に減少させた場合の屈折率差n−nと光電流差I−Iとの関係を示す。こられの特性G5,G6,G7に示すように、それぞれの特性では屈折率差n−nに対して光電流差I−Iはほぼ線形に変化しているが、測定光Lの発光強度を減少させるに従って、光電流差I−Iの屈折率差n−nに対する変化率(傾き)が小さくなる。従って、光源装置2の発光強度が弱くなると、屈折率nの検出感度が低下することが想定される。 FIG. 6 is a graph showing the relationship between the difference between the refractive index n of the object to be measured M and the reference refractive index n 0 in the photodiode 3 and the difference between the two photocurrents I 1 and I 2 . In the figure, the characteristic G5 shows the relationship between the refractive index difference n-n 0 and the photocurrent difference I 1 -I 2 with respect to the measurement light L of the predetermined luminous intensity in the refractive index measurement device 1, and the characteristic G6 is the measurement The relationship between the refractive index difference n−n 0 and the photocurrent difference I 1 −I 2 when the light emission intensity of the light L is reduced to 50% is shown, and the characteristic G 7 sets the light emission intensity of the measurement light L to 10%. The relationship between the refractive index difference n−n 0 and the photocurrent difference I 1 −I 2 when decreasing is shown. As shown by these characteristics G5, G6 and G7, the photocurrent difference I 1 -I 2 changes almost linearly with the refractive index difference n-n 0 in each characteristic. As the emission intensity decreases, the rate of change (slope) of the photocurrent difference I 1 -I 2 with respect to the refractive index difference n-n 0 decreases. Therefore, it is assumed that when the light emission intensity of the light source device 2 becomes weak, the detection sensitivity of the refractive index n decreases.

屈折率測定装置1は、このような屈折率の検出感度の低下を防止するために、下記のような構成の屈折率算出処理部5を備える。すなわち、屈折率算出処理部5は、図7に示すように、フォトダイオード3の半導体受光素子部3A,3Bの出力にそれぞれ接続された対数変換回路21A,21Bによって構成された対数変換回路部21と、対数変換回路21A,21Bの出力を差動増幅する差動増幅回路22とを含んでいる。この屈折率算出処理部5は、フォトダイオード3と同一のSOI基板上にオンチップで作製されている。   The refractive index measurement apparatus 1 includes a refractive index calculation processing unit 5 having the following configuration in order to prevent such a decrease in detection sensitivity of the refractive index. That is, as shown in FIG. 7, the refractive index calculation processing unit 5 is a logarithmic conversion circuit unit 21 configured by logarithmic conversion circuits 21A and 21B connected to the outputs of the semiconductor light receiving element units 3A and 3B of the photodiode 3, respectively. And a differential amplifier circuit 22 for differentially amplifying the outputs of the logarithmic conversion circuits 21A and 21B. The refractive index calculation processing unit 5 is manufactured on-chip on the same SOI substrate as the photodiode 3.

対数変換回路部21は、半導体受光素子部3A,3Bのそれぞれから出力される電気信号を対数変換する回路部である。図8は、対数変換回路部21の詳細構成を示す回路図、図9は、半導体受光素子部3A,3Bの出力と対数変換回路部21の出力との関係を示すグラフである。   The logarithmic conversion circuit unit 21 is a circuit unit that logarithmically converts the electric signal output from each of the semiconductor light receiving element units 3A and 3B. FIG. 8 is a circuit diagram showing the detailed configuration of the logarithmic conversion circuit unit 21. FIG. 9 is a graph showing the relationship between the outputs of the semiconductor light receiving element units 3A and 3B and the output of the logarithmic conversion circuit unit 21.

対数変換回路部21の対数変換回路21Aは、第1MOSFET(電界効果トランジスタ)M11と、第2MOSFETM12と、抵抗素子RL1とを含んで構成されている。この対数変換回路21Aにおいては、半導体受光素子部3Aの出力であるカソードが第1MOSFETM11のソース(電流端子)に接続され、第1MOSFETM11のソースは第2MOSFETM12のゲート(制御端子)にさらに接続されると共に、第1MOSFETM11のドレイン(電流端子)及びゲートが電源に接続されてバイアス電圧が印加されている。さらに、対数変換回路21Aにおいて、第2MOSFETM12のソースが、差動増幅回路22の反転入力端子に接続されると共に抵抗RL1を介してグランドに接続され、第2MOSFETM12のドレインが電源に接続されてバイアス電圧が印加されている。上記構成の対数変換回路21Aは、半導体受光素子部3Aから出力された光電流Iの電気信号の強度を対数変換して出力する回路である。 Logarithmic converter 21A of the logarithmic converter circuit 21, a first MOSFET (field effect transistor) M 11, and the 2MOSFETM 12, is configured to include a resistance element R L1. In the logarithmic conversion circuit 21A, the cathode which is the output of the semiconductor light-receiving element portion 3A is connected to a source (current terminals) of the 1MOSFETM 11, the source of the 1MOSFETM 11 is further connected to the gate (control terminal) of the 2MOSFETM 12 with the drain is connected (current terminals) and a gate to the power supply bias voltage of the 1MOSFETM 11 it is applied. Further, the logarithmic transformation circuit 21A, the source of the 2MOSFETM 12 is connected to ground through a resistor R L1 is connected to the inverting input terminal of the differential amplifier circuit 22, the drain of the 2MOSFETM 12 is connected to a power supply Bias voltage is applied. Logarithmic converter having the above structure 21A is the intensity of the light current I 1 of an electric signal output from the semiconductor light-receiving device section 3A is a circuit for outputting the logarithmic conversion.

同様に、対数変換回路部21の対数変換回路21Bは、第1MOSFET(電界効果トランジスタ)M21と、第2MOSFETM22と、抵抗素子RL2とを含んで構成され、対数変換回路21Aと同様な構成を有し、その入力端子が半導体受光素子部3Bの出力に接続され、その出力端子は差動増幅回路22の非反転入力端子に接続される。この対数変換回路21Bは、半導体受光素子部3Bから出力された光電流Iの電気信号の強度を対数変換して出力する回路である。 Similarly, the logarithmic conversion circuit 21B of the logarithmic converter 21, a first MOSFET (field effect transistor) M 21, and the 2MOSFETM 22, is configured to include a resistance element R L2, similar to the logarithmic conversion circuit 21A configured The input terminal is connected to the output of the semiconductor light receiving element 3 B, and the output terminal is connected to the non-inverted input terminal of the differential amplifier circuit 22. The logarithmic converter 21B is a circuit for intensity logarithmically converts the output of the photocurrent I 2 of the electric signal output from the semiconductor light-receiving element portion 3B.

図9は、対数変換回路21A,21Bに入力される光電流I,Iの対数値と対数変換回路21A,21B出力電圧VO1,VO2との関係を示すグラフである。このように、対数変換回路21A,21Bによれば、光電流I,Iの対数値logI,logIの所定範囲Wにおいては、それぞれの出力電圧VO1,VO2として、それぞれの対数値logI,logIに比例する電圧値が得られる。 Figure 9 is a graph showing the relationship between the logarithmic conversion circuit 21A, the light current I 1 is input to 21B, I 2 logarithm and the logarithm conversion circuit 21A, 21B output voltage V O1, V O2. As described above, according to the logarithmic conversion circuits 21A and 21B, in the predetermined range W of the logarithmic values logI 1 and logI 2 of the photocurrents I 1 and I 2 , the respective pairs of output voltages V O1 and V O2 are used. A voltage value proportional to the numerical values logI 1 and logI 2 is obtained.

差動増幅回路22は、対数変換回路21Aの出力電圧VO1の強度と、対数変換回路21Bの出力電圧VO2の強度との差分を増幅して出力する。図10は、被測定物Mの屈折率nに関する屈折率差n−nと、差動増幅回路22の出力相当値{logI−logI}との関係を示すグラフである。このように差動増幅回路22の出力は、屈折率差n−nに対して線形変化する特性を有し、この特性は、単に光電流の差I−Iを検出する場合と同様の特性となる。一方で、差動増幅回路22の出力は、実質的に光電流の比I/Iを対数変換したものを表しているので、光源装置2の強度には依存せず、その強度が低下しても屈折率に対する感度(傾き)が一定となる点で光電流の差I−Iを検出する場合とは異なる性質を有している。 The differential amplifier circuit 22 amplifies and outputs the difference between the intensity of the output voltage V O1 of the logarithmic conversion circuit 21A and the intensity of the output voltage V O2 of the logarithmic conversion circuit 21B. FIG. 10 is a graph showing the relationship between the refractive index difference n−n 0 relating to the refractive index n of the device under test M and the output equivalent value {log I 1 −log I 2 } of the differential amplifier circuit 22. Thus, the output of the differential amplifier circuit 22 has a characteristic that linearly changes with respect to the refractive index difference n−n 0 , and this characteristic is the same as the case of simply detecting the photocurrent difference I 1 −I 2 It becomes the characteristic of On the other hand, since the output of the differential amplifier circuit 22 substantially represents the ratio I 1 / I 2 of the photocurrent logarithmically converted, it does not depend on the intensity of the light source device 2, and the intensity decreases Even in the case where the sensitivity (inclination) to the refractive index is constant, it has a property different from the case of detecting the photocurrent difference I 1 -I 2 .

以上説明した屈折率測定装置1によれば、直線状の溝部6Aaが所定ピッチP1で形成された回折格子部6Aを光入射側に備える半導体受光素子部3Aと、直線状の溝部6Baが回折格子部6Aと異なるピッチで形成された回折格子部6Bを光入射側に備える半導体受光素子部3Bとに対して、光源装置2から光が入射可能とされる。光の入射に応じて、半導体受光素子部3A,3Bから出力された2つの信号の強度が、対数変換回路21A,21Bによってそれぞれ対数変換された後に、差動増幅回路22によってそれらの差分が増幅して出力される。この出力を用いることにより、光源装置2の出力強度が変動したり、光源装置2の出力強度が弱い場合でも、フォトダイオード3上に配置された被測定物Mの屈折率を精度よく測定することができる。すなわち、光源の出力強度の変動に起因する屈折率の検出誤差や、検出信号におけるSN比の低下に起因する検出誤差を低減できる。   According to the refractive index measurement device 1 described above, the semiconductor light receiving element portion 3A provided on the light incident side with the diffraction grating portion 6A in which the linear groove portions 6Aa are formed at the predetermined pitch P1, and the linear groove portion 6Ba is a diffraction grating Light can be made incident from the light source device 2 to the semiconductor light receiving element portion 3B provided on the light incident side with the diffraction grating portion 6B formed at a pitch different from that of the portion 6A. After the intensities of the two signals output from the semiconductor light receiving element sections 3A and 3B are logarithmically converted by the logarithmic conversion circuits 21A and 21B in response to the incidence of light, the differences between them are amplified by the differential amplifier circuit 22. Output. By using this output, even if the output intensity of the light source device 2 fluctuates or the output intensity of the light source device 2 is weak, the refractive index of the object to be measured M disposed on the photodiode 3 can be accurately measured. Can. That is, it is possible to reduce the detection error of the refractive index due to the fluctuation of the output intensity of the light source and the detection error due to the decrease of the SN ratio in the detection signal.

また、別体の光検出器を用いることなく屈折率を測定できるため、装置構成を簡素化することができる。しかも、フォトダイオード3に入射する光の利用効率が向上することで光の強度の検出精度がさらに向上する。その結果、装置構成を簡素化すると共に屈折率の測定精度を向上させることができる。例えば、屈折率測定装置1を応用することで、アレイ化した多数のセンサを含み、簡素な光学系で実現できる光学式バイオセンサチップが実現できる。これにより、蛍光標識を用いない簡便な方法で、高感度で高スループットな生物医学検査が可能となる。   Further, since the refractive index can be measured without using a separate photodetector, the apparatus configuration can be simplified. Moreover, by improving the utilization efficiency of the light incident on the photodiode 3, the detection accuracy of the light intensity is further improved. As a result, the apparatus configuration can be simplified and the measurement accuracy of the refractive index can be improved. For example, by applying the refractive index measurement device 1, it is possible to realize an optical biosensor chip that can be realized with a simple optical system, including a large number of arrayed sensors. This enables highly sensitive and high-throughput biomedical testing by a simple method that does not use a fluorescent label.

また、回折格子部6Aと回折格子部6Bとは、溝部6Aa,6Baの形成方向が互いに平行となるように構成され、光源装置2は、回折格子部6Aの溝部6Aaの形成方向、及び回折格子部6Bの溝部6Baの形成方向に垂直な平面内で半導体受光素子部3A及び3Bの表面に垂直な方向に対して傾斜した方向から光を出射する構成とされている。このような構成により、フォトダイオード3上に配置された被測定物Mの屈折率の変化に対する、半導体受光素子部3Aの出力と半導体受光素子部3Bの出力との差分の変化率が高くなり、屈折率の検出精度をさらに一層高めることができる。   The diffraction grating portion 6A and the diffraction grating portion 6B are configured such that the forming directions of the groove portions 6Aa and 6Ba are parallel to each other, and the light source device 2 includes the forming direction of the groove portion 6Aa of the diffraction grating portion 6A and the diffraction grating The light is emitted from a direction inclined with respect to the direction perpendicular to the surfaces of the semiconductor light receiving element portions 3A and 3B in a plane perpendicular to the forming direction of the groove portion 6Ba of the portion 6B. With such a configuration, the rate of change in the difference between the output of the semiconductor light receiving element 3A and the output of the semiconductor light receiving element 3B with respect to the change in the refractive index of the measurement object M disposed on the photodiode 3 becomes high. The detection accuracy of the refractive index can be further enhanced.

なお、本発明に係る屈折率測定装置は、上記実施形態に限定されるものではない。例えば、上記実施形態では、図11に示すような構成の屈折率算出処理部105を採用してもよい。同図に示す屈折率算出処理部105の屈折率算出処理部5との相違点は、対数変換回路21Aと差動増幅回路22の非反転入力との間に接続されたロックイン検出回路23Aと、対数変換回路21Bと差動増幅回路22の反転入力との間に接続されたロックイン検出回路23Bとを備える点である。   The refractive index measurement device according to the present invention is not limited to the above embodiment. For example, in the above embodiment, the refractive index calculation processing unit 105 having a configuration as shown in FIG. 11 may be employed. The difference from the refractive index calculation processing unit 5 of the refractive index calculation processing unit 105 shown in the figure is the lock-in detection circuit 23A connected between the logarithmic conversion circuit 21A and the non-inverting input of the differential amplification circuit 22. , And a lock-in detection circuit 23B connected between the logarithmic conversion circuit 21B and the inverting input of the differential amplification circuit 22.

同図に示す変形例では、光源装置2は、発光強度が所定の周波数fで変調された光を出射するように構成されている。そして、ロックイン検出回路23Aは、対数変換回路21Aから出力された電気信号を受けて、その強度を周波数fでロックイン検出することによって、電気信号の周波数fの成分だけを抽出して差動増幅回路22に出力する。同様に、ロックイン検出回路23Bは、対数変換回路21Bから出力された電気信号の強度を周波数fでロックイン検出することによって、電気信号の周波数fの成分だけを抽出して差動増幅回路22に出力する。   In the modification shown in the figure, the light source device 2 is configured to emit light whose light emission intensity is modulated at a predetermined frequency f. Then, the lock-in detection circuit 23A receives the electric signal output from the logarithmic conversion circuit 21A, and performs lock-in detection of the intensity at the frequency f, thereby extracting only the component of the frequency f of the electric signal to perform differential operation. The signal is output to the amplifier circuit 22. Similarly, the lock-in detection circuit 23B extracts only the component of the frequency f of the electric signal by performing lock-in detection of the strength of the electric signal output from the logarithmic conversion circuit 21B at the frequency f, and the differential amplifier circuit 22 Output to

このような構成により、フォトダイオード3の出力に含まれる、暗電流のような直流成分、及びショット雑音等の広い周波数帯域の雑音の影響を減らすことで、屈折率の検出精度を一層高めることができる。   With such a configuration, the detection accuracy of the refractive index can be further enhanced by reducing the influence of DC components such as dark current and noise in a wide frequency band such as shot noise included in the output of the photodiode 3. it can.

1…屈折率測定装置、2…光源装置、3…フォトダイオード、3A,3B…半導体受光素子部、5,105…屈折率算出処理部、6A,6B…回折格子部、6Aa,6Ba…溝部、21…対数変換回路部、21A,21B…対数変換回路、22…差動増幅回路、23A,23B…ロックイン検出回路、L…測定光、M…被測定物。   DESCRIPTION OF SYMBOLS 1 ... refractive index measuring apparatus, 2 ... light source device, 3 ... photodiode, 3A, 3B ... semiconductor light receiving element part, 5, 105 ... refractive index calculation processing part, 6A, 6B ... diffraction grating part, 6Aa, 6Ba ... groove part, 21: Logarithmic conversion circuit unit, 21A, 21B: Logarithmic conversion circuit, 22: Differential amplifier circuit, 23A, 23B: Lock-in detection circuit, L: Measurement light, M: Measurement object.

Claims (3)

入射した光に対応する信号を出力する第1の半導体受光素子部と、前記第1の半導体受光素子部上の前記光の入射側に配置され、直線状の溝が所定ピッチで複数形成された第1の回折格子部と、前記光に対応する信号を出力する第2の半導体受光素子部と、前記第2の半導体受光素子部上の前記光の入射側に配置され直線状の溝が前記所定ピッチと異なるピッチで複数形成された第2の回折格子部と、を有するフォトダイオードと、
所定の波長の光を前記第1及び第2の回折格子部に向けて出射する光源と、
前記第1の半導体受光素子部から出力された信号と、前記第2の半導体受光素子部から出力された信号とのそれぞれの強度を対数変換して出力する対数変換回路と、
前記対数変換回路から出力されたそれぞれの強度の差分を増幅する差動増幅回路と、
を備える屈折率測定装置。
A first semiconductor light receiving element portion for outputting a signal corresponding to the incident light, and a plurality of linear grooves formed at a predetermined pitch, disposed on the light incident side of the first semiconductor light receiving element portion A first diffraction grating portion, a second semiconductor light receiving element portion for outputting a signal corresponding to the light, and a linear groove disposed on the incident side of the light on the second semiconductor light receiving element portion A photodiode having a plurality of second diffraction grating portions formed at a pitch different from the predetermined pitch;
A light source for emitting light of a predetermined wavelength toward the first and second diffraction grating portions;
A logarithmic conversion circuit that logarithmically converts the intensities of the signal output from the first semiconductor light receiving element unit and the signal output from the second semiconductor light receiving element unit;
A differential amplifier circuit for amplifying the difference between the intensities output from the logarithmic conversion circuit;
A refractive index measuring device comprising:
前記光源は、所定周波数で前記光を変調して出射し、
前記対数変換回路から出力されたそれぞれの強度を、前記所定周波数でロックイン検出する、
請求項1に記載の屈折率測定装置。
The light source modulates and emits the light at a predetermined frequency,
The respective intensities output from the logarithmic converter, lock-in detection at the predetermined frequency,
The refractive index measurement device according to claim 1.
前記第1の回折格子部と前記第2の回折格子部とは、前記溝の形成方向が互いに平行となるように構成され、
前記光源は、前記第1の回折格子部の前記溝の形成方向、及び前記第2の回折格子部の前記溝の形成方向に垂直な平面内で前記第1及び第2の半導体受光素子部表面に垂直な方向に対して傾斜した方向から前記光を出射する、
請求項1又は2に記載の屈折率測定装置。
The first diffraction grating portion and the second diffraction grating portion are configured such that the formation directions of the grooves are parallel to each other,
The light source is a surface of the first and second semiconductor light receiving element portions in a plane perpendicular to the formation direction of the grooves of the first diffraction grating portion and the formation direction of the grooves of the second diffraction grating portion. Emit the light from a direction inclined with respect to a direction perpendicular to the
The refractive index measurement device according to claim 1.
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