JP6503224B2 - ヒートシンク - Google Patents
ヒートシンク Download PDFInfo
- Publication number
- JP6503224B2 JP6503224B2 JP2015101865A JP2015101865A JP6503224B2 JP 6503224 B2 JP6503224 B2 JP 6503224B2 JP 2015101865 A JP2015101865 A JP 2015101865A JP 2015101865 A JP2015101865 A JP 2015101865A JP 6503224 B2 JP6503224 B2 JP 6503224B2
- Authority
- JP
- Japan
- Prior art keywords
- cylindrical body
- end side
- heat
- support
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
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Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
- F21V29/503—Cooling arrangements characterised by the adaptation for cooling of specific components of light sources
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/20—Arrangements for cooling
- H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
- H10W40/226—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area
- H10W40/228—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area the projecting parts being wire-shaped or pin-shaped
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
- F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
- F21V17/12—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by screwing
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
- F21V29/89—Metals
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/01—Manufacture or treatment
- H10W40/03—Manufacture or treatment of arrangements for cooling
- H10W40/037—Assembling together parts thereof
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2215/00—Fins
- F28F2215/04—Assemblies of fins having different features, e.g. with different fin densities
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2215/00—Fins
- F28F2215/06—Hollow fins; fins with internal circuits
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2215/00—Fins
- F28F2215/10—Secondary fins, e.g. projections or recesses on main fins
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- Geometry (AREA)
Description
2 支持本体
3 筒状体
3a 開口部
3b 貫通口
3c 基端
4 支持板
5、6 筒体
9 冷却対象物
20、21 面
30 固定部分
31、32 位置
40 取付穴
41 厚肉部
42 脚部
60 凹凸表面
61 突条部
90 筐体プレート
91 基板
s1 隙間
Claims (6)
- 冷却対象物が固定される良熱伝導性材料よりなる支持本体と、
該支持本体に立設された単又は複数の良熱伝導性材料よりなる筒状体とを備え、
前記筒状体が、先端に内外開放された開口部を有するとともに、基端側の側壁に内外連通させる貫通口を設けてなり、
前記筒状体を、前記貫通口を有し且つ前記支持本体に固定される基端側の筒体と、前記開口部を有する先端側の筒体とを含む、少なくとも2つ以上の筒体を内部空間が連通した状態で軸方向に連結して構成し、
前記支持本体から放射された熱を含む雰囲気を、前記貫通口を通じて筒状体の内部に流入させるとともに、該筒状体の内部空間を流通させたうえ、先端の開口部から外部に放出可能としたことを特徴とするヒートシンク。 - 基端側の筒体の外径を先端側の筒体よりも小径に設定するとともに、基端側の筒体を先端側の筒体よりも熱伝導性の高い材料で構成してなる請求項1記載のヒートシンク。
- 先端側の筒体の外周面に、軸方向に沿って延びる突条部を周方向に間隔をおいて複数設けてなる請求項1又は2記載のヒートシンク。
- 筒体同士の連結を、拡管カシメで互いの端部同士を固定することにより連結してなる請求項1〜3の何れか1項に記載のヒートシンク。
- 前記支持本体を、プレス加工により前記筒状体をカシメ固定する支持板より構成してなる請求項1〜4の何れか1項に記載のヒートシンク。
- 支持板に筒状体を挿入して固定するための取付穴を設け、該取付穴の内周縁に沿ってバーリング加工により厚肉部を形成し、筒状体を前記取付穴に挿入した状態において厚肉部を軸方向から圧縮プレス加工し、該厚肉部を取付穴中心方向に塑性変形させて筒状体の外周面に圧着させることによりカシメ固定してなる請求項5記載のヒートシンク。
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015101865A JP6503224B2 (ja) | 2015-05-19 | 2015-05-19 | ヒートシンク |
| US15/139,539 US10297524B2 (en) | 2015-05-19 | 2016-04-27 | Heat sink |
| CN201610334369.5A CN106168364B (zh) | 2015-05-19 | 2016-05-19 | 散热器 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015101865A JP6503224B2 (ja) | 2015-05-19 | 2015-05-19 | ヒートシンク |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2016219575A JP2016219575A (ja) | 2016-12-22 |
| JP6503224B2 true JP6503224B2 (ja) | 2019-04-17 |
Family
ID=57325259
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015101865A Active JP6503224B2 (ja) | 2015-05-19 | 2015-05-19 | ヒートシンク |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US10297524B2 (ja) |
| JP (1) | JP6503224B2 (ja) |
| CN (1) | CN106168364B (ja) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN205213228U (zh) * | 2015-10-30 | 2016-05-04 | 比亚迪股份有限公司 | 散热器底板以及具有其的散热器和igbt模组 |
| US10101097B2 (en) * | 2016-09-25 | 2018-10-16 | Cooler Master Co., Ltd. | Heat sink having thermal distortion compensation |
| US10488028B2 (en) * | 2017-05-03 | 2019-11-26 | Fluence Bioengineering, Inc. | Systems and methods for a heat sink |
| WO2018220417A1 (en) * | 2017-05-31 | 2018-12-06 | Agile Power Switch 3D Integration Apsi3D | Heat sink structure |
| JP6918765B2 (ja) * | 2018-11-29 | 2021-08-11 | ファナック株式会社 | 放熱装置 |
| DE102018221951A1 (de) * | 2018-12-17 | 2020-06-18 | Rolls-Royce Deutschland Ltd & Co Kg | Rohrförmige Kühlrippen und deren Anwendung |
| US11435144B2 (en) * | 2019-08-05 | 2022-09-06 | Asia Vital Components (China) Co., Ltd. | Heat dissipation device |
| CN113395866B (zh) * | 2020-03-11 | 2023-04-28 | 苏州佳世达光电有限公司 | 散热装置 |
| FR3108169B1 (fr) * | 2020-03-13 | 2022-03-25 | Safran | Dispositif de transfert de calories |
| FR3108230A1 (fr) * | 2020-03-13 | 2021-09-17 | Safran | Dissipateur thermique pour composant electronique |
| JP7452253B2 (ja) * | 2020-05-26 | 2024-03-19 | 富士通株式会社 | 冷却装置 |
| CN116762170A (zh) * | 2021-01-22 | 2023-09-15 | 三菱电机株式会社 | 功率半导体装置及其制造方法以及电力转换装置 |
| EP4096376B1 (en) * | 2021-05-24 | 2025-09-24 | Aptiv Technologies AG | Cooling device and heatsink assembly incorporating the same |
| US20230125822A1 (en) * | 2021-10-27 | 2023-04-27 | Intel Corporation | Immersion cooling for integrated circuit devices |
| US12490410B2 (en) | 2021-12-06 | 2025-12-02 | Intel Corporation | Circuit devices integrated with boiling enhancement for two-phase immersion cooling |
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-
2015
- 2015-05-19 JP JP2015101865A patent/JP6503224B2/ja active Active
-
2016
- 2016-04-27 US US15/139,539 patent/US10297524B2/en active Active
- 2016-05-19 CN CN201610334369.5A patent/CN106168364B/zh active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN106168364A (zh) | 2016-11-30 |
| CN106168364B (zh) | 2019-12-13 |
| JP2016219575A (ja) | 2016-12-22 |
| US10297524B2 (en) | 2019-05-21 |
| US20160341492A1 (en) | 2016-11-24 |
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