JP6506552B2 - Chip electronic parts inspection and sorting device - Google Patents

Description

  The present invention relates to the improvement of a chip electronic component inspection and sorting apparatus used to inspect the electrical characteristics of a large amount of chip electronic components at high speed and continuously.

  With the increase in the production of small electronic products such as mobile phones, smart phones, liquid crystal televisions, electronic game machines, etc., the production of micro chip electronic components to be incorporated into such electric products has significantly increased. Most parts of the chip electronic component are formed of a main body portion formed of an insulating material and electrodes provided on opposite end surfaces of the main body portion. Examples of chip electronic components having such a configuration include chip capacitors (also called chip capacitors), chip resistors (including chip varistors), and chip inductors.

  In recent years, chip electronic components have become extremely small with the further miniaturization of electrical products into which chip electronic components are incorporated and with the increase in the number of chip electronic components incorporated into electrical products. For example, for chip capacitors, capacitors of very small size (for example, a size of 0.2 mm × 0.2 mm × 0.4 mm called 0402 chip) have generally been used in recent years. Such minute chip electronic components are mass-produced in units of tens of thousands to hundreds of thousands of one lot.

  In an electronic product in which chip electronic components are incorporated, it is common practice to conduct 100% inspection of chip electronic components manufactured in large quantities in order to reduce the defective product rate of the electronic products caused by defects in the chip electronic components. For example, with regard to chip capacitors, inspection of electrical characteristics such as electrostatic capacity and leakage current is performed for all the chip capacitors.

  Therefore, it is necessary to inspect the electrical characteristics of a large number of chip electronic components at high speed, and in recent years, as an apparatus for automatically performing the high speed inspection, a transport disk (chip electronics in which a large number of through holes are formed) 2. Description of the Related Art An automated apparatus (i.e., chip electronic component inspection and sorting apparatus) for inspection and sorting of the electrical characteristics of chip electronic components provided with component temporary holding plates) is generally used. Usually, a large number of through-holes for temporarily storing and holding chip electronic components to be inspected are formed in the transport disk in a row of three or more rows along the circumference. When the chip electronic component inspection and sorting apparatus is used, the chip electronic components are temporarily accommodated and held in the through holes of the rotating transfer disk, and then the chip electronic components are held by the transfer disk. A pair of electrode terminal sets (contacts for inspection) consisting of a plurality of fixed electrode terminals and movable electrode terminals assembled along a rotational path of the transfer disk are brought into contact with the electrodes of the chip electronic component to make the chip electronic component The electrical characteristics of the chip are measured, and then based on the measurement results, the chip electronic component is discharged from the through hole of the transfer disk so as to be accommodated in a predetermined container (classification container) for sorting (or classification) Work is carried out.

  That is, the recent automated inspection and sorting apparatus for chip electronic components has a base, a chip electronic component transfer disk rotatably supported rotatably on the base (however, the chip electronic component transfer disk has an opposing end face Three or more rows of through holes, each capable of temporarily accommodating chip electronic components having an electrode, are formed along the circumference), and provided in order along the rotation path of the transfer disc A chip electronic component supply storage section (supply storage area) for supplying and storing a chip electronic component in a through hole of a transfer disk, a chip electronic component electric characteristic inspection section (inspection area) for inspecting the electrical characteristics of the chip electronic component, It can be said to be a chip electronic component inspection and sorting apparatus that includes a chip electronic component classification unit (classification area) that classifies inspected chip electronic components based on inspection results.

  For example, in the case of inspecting the capacitance of the chip capacitor, the electrical characteristic inspection unit may use an inspection device (electrical characteristic measuring device) provided in the chip electronic component inspection and sorting device via an inspection electrode terminal. Then, a test voltage having a predetermined frequency is applied to the chip capacitor. Then, the tester detects the current value of the current generated in the chip capacitor by the application of the test voltage, and based on the detected current value and the voltage value of the test voltage, the capacitance of the chip capacitor to be tested is The examination of

  As an example of the chip electronic component inspection and sorting apparatus, an apparatus described in Patent Document 1 can be mentioned. That is, in Patent Document 1, a chip electronic component to be inspected manufactured so as to exhibit predetermined identical electrical characteristics based on the same standard using the chip electronic component inspection and sorting apparatus having the above-described configuration. After temporarily storing and holding each of the through holes arranged in a plurality of rows close to each other on the transport disk and then electrically connecting the tester to each of the chip electronic components, the respective chip electronics from the tester In order to continuously inspect the electrical characteristics of the chip electronic component, including the step of applying a test voltage to the component and detecting the current value generated in each chip electronic component by the application of the test voltage by the tester. A chip electronic component inspection and sorting apparatus is described.

  In the conventionally used chip electronic component inspection and sorting apparatus, the chip electronic components accommodated in a plurality of rows of through holes provided along the circumference of the carrier disk are arranged along the radial direction of the carrier disk. A current (or voltage) is sequentially applied to each chip electronic component in a state where an inspection electrode terminal set consisting of a fixed electrode terminal and a movable electrode terminal is simultaneously brought into contact with each of the electrodes at both ends of the chip electronic component. The electrical characteristics of each chip electronic component are inspected (measured) by The sequential application of current to the plurality of chip electronic components and the extraction of the inspection value are performed using a tester (for example, a capacitance measuring device), but simplification of the structure of the inspection sorting apparatus is necessary. Therefore, testers for applying current to each chip electronic component and extracting test values are not prepared for each of the test electrode terminal sets, but usually, plural sets of 2 to 4 sets are used. A set of testers is provided for a certain test electrode terminal set. Then, the plurality of sets of inspection electrode terminal sets and the inspection device are connected via a connection switching device (relay switch means), and the connection between each chip electronic component and the inspection device utilizes the relay switch means. Switching at high speed sequentially.

WO 2014/010623 A1

  Although not specifically described in Patent Document 1, in the conventionally used chip electronic component inspection and sorting apparatus, a mercury relay switch capable of stable switching is generally used as a switch (relay switch means). Used in However, as described above, since the chip electronic components to be measured in recent years are extremely small, the size of the inspection electrode terminal set is also extremely miniaturized, whereas the mercury relay switch has its volume Is relatively large, the mercury relay switch can not be placed close to the test electrode terminal set. For this reason, the mercury relay switch is disposed at a position away from each of the fixed electrode terminal and the movable electrode terminal of the inspection electrode terminal set, and each comprises a cable for applying a test current and a cable for extracting an inspection value. It is common to be connected by a coaxial cable.

  A mercury relay switch used as a connection switching means between a tester for measuring electrical characteristics and an inspection electrode terminal set in a conventional chip electronic component inspection and sorting device is capable of highly reliable connection switching (switching) From this point of view, it can be said that it is an excellent connection switching means, but because it is a mechanical connection switching means, the service life is not sufficient, the speed of connection switching is limited, and the environment caused by using mercury. And other problems such as

  For this reason, the inventor of the present invention searched for connection switching means to replace the mercury relay switch. And as a result, it turned out that high-speed connection switching becomes possible without using mercury, and extension of a use life is also realized by using MOS FET which is one of the semiconductor switch elements.

  However, as a result of further research, it has also been found that using MOS FET (and its drive circuit) instead of the mercury relay switch as the connection switching means reduces the accuracy of the measurement result of the electrical characteristics. For example, using a conventional chip electronic component inspection and sorting apparatus (a mercury relay switch is used as a connection switching means, and the mercury relay switch is connected to a test electrode terminal set by a coaxial cable of about 1 meter), electrostatic Measuring the capacitance (Cp) and loss factor (Df) of a capacitor (capacitance) with a capacitance of 1 pF and determining their standard deviation, the standard deviation of Cp is about 0.0025050 pF, and the standard deviation of Df is It will be about 0.000043. On the other hand, the test electrode terminal set and the switching means including the MOS FET are connected by a coaxial cable of the same length, and the capacitance and loss coefficient of the capacitor having a capacitance of 1 pF are also measured. The standard deviation of Cp is about 0.000455 pF, and the standard deviation of Df is about 0.000082, and the standard deviation of capacitance and the standard deviation of loss coefficient are both about twice. From the increase, it can be seen that the accuracy of the measurement data is reduced.

  The inventor of the present invention considers the above measurement results and searches for causes of increase in each of the standard deviation of capacitance and the standard deviation of loss coefficient generated when a MOS FET is used as a connection switching means. Research was conducted. Then, when the influence of the length of the coaxial cable connecting the test electrode terminal set and the connection switching means was examined in the research process, as shown in FIG. 15 as a graph, the case of using the MOS FET as the connection switching means The standard deviation of each of the capacitances and loss coefficients found in has a strong correlation with the length of the coaxial cable, and when the length of the coaxial cable is 0 meter (ie, when the coaxial cable is not used), It has been found that even if MOS FETs are used instead of mercury relay switches as connection switching means, almost no difference appears in any of the standard deviations of capacitance and loss coefficient.

  Based on the above new findings, the inventor of the present invention uses the FET as the connection switching means, and the chip electronic component inspection and sorting of the connection switching means can obtain measurement data with high accuracy comparable to the case of using a mercury relay switch. The installation method to the device was further examined. Then, as a result of the examination, the MOS FET is accommodated in a housing, and the housing accommodating the MOS FET is disposed adjacent to each of the fixed electrode terminal and the movable electrode terminal of the inspection electrode terminal set, By directly connecting the MOS FET (and its drive circuit) accommodated in the fixed electrode terminal and the movable electrode terminal through the connector, the use of a coaxial cable connecting the MOS FET and the inspection electrode terminal set is avoided , And as a result, it has been found that a MOS FET can be used in a chip electronic component inspection and sorting apparatus as a connection switching means between a tester for measuring electrical characteristics and an inspection electrode terminal set without causing any practical problems, The present invention has been reached.

  Therefore, according to the present invention, a chip electronic component transfer disk rotatably supported on the base, the chip electronic component transfer disk temporarily having a chip electronic component having an electrode on each of the opposing end surfaces. A plurality of through holes which can be accommodated in a plurality of rows are formed along the circumference thereof, and chip electronic components are provided in the through holes of the transfer disc, which are sequentially provided along the rotational path of the transfer disc A chip electronic component supply / storage unit for supplying and storing a plurality of sets of test electrode terminal sets each including a fixed electrode terminal for testing the electric characteristics of the chip electronic component and a movable electrode terminal; Then, a classification unit for classifying the inspected chip electronic components based on the inspection results is included, and an electrical characteristic tester is connected to each of the fixed electrode terminal and the movable electrode terminal through relay switch means. A chip electronic component inspection and sorting apparatus, using the MOS FET housed in the housing as the relay switch means, and fixing the inspection electrode terminal set to the housing housing the MOS FET (and its drive circuit) The chip electronic component inspection and sorting apparatus is characterized in that the MOS FET is connected to the fixed electrode terminal and the movable electrode terminal through a connector, which is disposed adjacent to the electrode terminal and the movable electrode terminal.

  In the chip electronic component inspection and sorting apparatus according to the present invention, the connector is preferably provided on the end face of the housing, and the MOS FET is a MOS FET having an ON resistance of 500 mΩ or less and an OFF capacity of 20 pF or less. Is preferred.

  In the chip electronic component inspection and sorting apparatus according to the present invention, the mercury relay is used as the semiconductor switch element MOS FET and its drive circuit instead of the mercury relay switch as a connection means between the inspection electrode terminal set and the electrical property inspector. The problems caused by the use of switches, namely the insufficient service life, the limit of speeding up of connection switching and the risk to the environment by using mercury can be avoided.

  Furthermore, in the chip electronic component inspection and sorting apparatus of the present invention, the connection operation between the electrical property inspection tool and the inspection electrode terminal set for measuring the electric characteristics of the chip electronic component is extremely easy, and the inspection electrode terminal set There is also the advantage that the work of installation and repair is simplified. That is, in the conventional chip electronic component inspection and sorting apparatus, when, for example, three sets of electrode terminal sets and three sets of mercury relay switches are connected by coaxial cables, the fixed electrode terminals and movable electrode terminals of each set are respectively connected There are a total of six coaxial cables connecting the three sets of mercury relay switches. And when a malfunction generate | occur | produces in an electrode terminal set, it is necessary to once remove a coaxial cable from an electrode set, to repair or replace, and a complicated operation | work is needed. Further, as described above, since the electrode terminal set is small in size, when removing the coaxial cable from a set of electrode terminal sets, it may be necessary to also remove the coaxial cable from the electrode terminal set adjacent thereto. Because of this, the work of replacing and repairing the electrode terminal set tends to be more complicated. Such complicated work is, of course, also required when incorporating the test electrode terminal set into the sorting machine and connecting the coaxial cable. In the chip electronic component inspection and sorting apparatus according to the present invention, it is not necessary to use a coaxial cable to connect the inspection electrode terminal set and the connection switching means (means for switching the electrical connection between the electrode terminal set and the tester). There is also an advantage that the assembly operation and the repair operation of the chip electronic component inspection and sorting apparatus become extremely easy because the complicated operation of the device is unnecessary.

It is a perspective view which shows the structure of the chip | tip electronic component of test object by making a chip capacitor into an example. It is a front view which shows the example of the whole structure of a chip | tip electronic component test | inspection sorting apparatus. A chip electronic component transfer disk of a chip electronic component inspection and sorting device, a chip electronic component supply storage unit (supply storage area) arranged in order along the rotation direction in the rotation path of the transfer disk, a chip electronic component electrical characteristic inspection unit (Inspection area) and a chip electronic component classification unit (classification area) are shown. It is a front view of a chip electronic parts conveyance disk, and a sectional view of a conveyance disk and a support structure behind it. The front view and side view of a chip | tip electronic component supply accommodating part are shown. The broken lines are drawn to indicate the internal structure of the chip electronic component supply and storage unit. It is a figure which shows the internal structure of the bucket with which the chip electronic component supply accommodating part is equipped, (a) is a front view which shows the internal structure of a bucket, (b) is a side sectional view of a bucket. In addition, the side cross-sectional view of the latter bucket also shows the cross-section of the side surface of the transfer disk and the base plate (reference base) provided behind the transfer disk. FIG. 17 is a cross-sectional view showing the state of supply and storage of chip electronic components to the through hole of the transfer disk in the chip electronic component supply and storage unit, and is arranged along the circumference of the transfer disk along a circular arc; It is a figure which shows the state in which the chip electronic component is accommodated in a hole and is conveyed. The arrows indicate the rotation direction of the transport disc (moving direction of the through hole). It is sectional drawing which shows the state which test | inspects the electrical property of the chip electronic component accommodated in the through-hole of the conveyance disc in an inspection part. It is a figure which shows the state which is accommodated in the through-hole of a conveyance disc, and is discharging | emitting by the classification | category part the chip electronic component which the test | inspection by the test | inspection part completed. FIG. 6 is a circuit diagram showing a wiring system including a mercury relay used as a switching means in a known chip electronic component. It is a circuit diagram which shows the example of the wiring system containing MOS FET accommodated in the housing | casing used as a switching means with the chip electronic component of this invention. It is the schematic which shows the combination of the housing | casing (with a connector) which accommodated MOS FET used by the chip electronic component of this invention, and the electrode set for a test | inspection. It is the schematic which shows the state which the housing | casing (it accommodated MOS FET) shown in FIG. 12 was assembled | attached to the electrode set for a test | inspection. It is the schematic which shows the state which is test | inspecting a chip | tip electronic component using the electrode set for a test | inspection with which the housing | casing (it accommodates MOS FET) shown in FIG. 13 is assembled | attached. It is a graph which shows the relationship between the length (displayed by standard deviation) of the length of the coaxial cable connecting the MOS FET and the test electrode terminal set in the chip electronic component inspection and sorting device and the electrical characteristic measurement value.

  Hereinafter, representative configurations of the chip electronic component inspection and sorting apparatus of the present invention will be described with reference to FIGS. 1 to 14 of the accompanying drawings. As is apparent from the description described above, the present invention is an improvement on the connection switching structure including the connection switching means (relay switch) of the known chip electronic component inspection and sorting apparatus. A typical configuration of the electronic component inspection and sorting apparatus will be described.

  FIG. 1 is a perspective view showing the configuration of a chip electronic component to be inspected, taking a chip capacitor as an example, and a chip electronic component (chip capacitor) 19 is opposed to the capacitor body 21 made of dielectric and both ends thereof. It is comprised from a pair of electrodes 22a and 22b provided. An ordinary chip capacitor 19 is a chip ceramic capacitor using ceramic as a dielectric. A solder layer for mounting the chip electronic component on various substrates is attached to the surface of the electrode of the normal chip electronic component.

  FIG. 2 is a front view showing a configuration example of a chip electronic component inspection and sorting apparatus, and FIG. 3 is a chip electronic component conveyance disk of the chip electronic component inspection and sorting apparatus and a rotation path of the conveyance disk along the rotation direction. The chip electronic component supply storage unit (supply storage area), the chip electronic component electrical characteristic inspection unit (inspection area), and the chip electronic component classification unit (classification area) arranged in order are shown. The chip electronic component inspection and sorting apparatus shown in FIG. 2 is an apparatus in which a large number of through holes are arranged in six rows along the circumference of a transport disk. In addition, the conveyance disk of FIG. 3 has shown the conveyance disk in the structure which many through-holes along the circumference were put in order in 3 rows for simplification of illustration. FIG. 4A is a front view of the chip electronic component transfer disk shown in FIG. 3, and FIG. 4B is a cross-sectional view showing the transfer disk and the support structure behind it.

  In the chip electronic component inspection and sorting apparatus 10 shown in FIG. 2, a large number of through holes 11a capable of temporarily accommodating chip electronic components (for example, chip capacitors) on the surface of a disk-shaped material are arranged along the circumference. A chip electronic component transfer disk (hereinafter may be simply referred to as a transfer disk) 11 formed in an oval arrangement is pivotally supported by the base 41 so as to be able to rotate along the plane of the disk. In the rotation path of the transfer disk 11, as shown in FIG. 3, the supply and storage unit (supply and storage area) 101 of the chip electronic component, the inspection unit (inspection area) 102 of the electrical characteristics of the chip electronic component, and A classification unit (classification area) 103 of the chip electronic component is set. In the inspection unit 102, electrode terminals for measuring electrical characteristics are provided at positions adjacent to both openings of the through holes 11a in each row of the transport disk 11. The electrode terminals are provided with a controller 15 electrically connected to the testers 14a, 14b and electrically connected to the tester so as to supply a signal related to the testing process to the tester. The chip electronic component to be inspected is placed in the hopper 47 and supplied from the chip electronic component supply port 31 to the through hole of the transfer disk 11 via the bucket (see FIGS. 5 and 6).

  The through holes 11a of the chip electronic component transfer disk 11 are usually arranged on the surface of the transfer disk at positions where the concentric circles are equally divided on a plurality of concentric circles.

  In the apparatus 10 shown in FIG. 2, a total of six through holes arranged in the radial direction between the center and the peripheral edge of the transfer disk 11 are provided, and the total of six holes accommodated in the respective through holes are provided. An inspection of the electrical characteristics of the chip electronics is carried out for each chip electronics. The number of through holes arranged in the diametrical direction between the center and the peripheral edge of the transport disk 11 is preferably in the range of 3 to 20, and more preferably in the range of 3 to 12.

  The transport disk 11 is rotatably installed (fixed) on the base 41 via, for example, a base plate (reference platform) 45 and a central axis 42, and the rotary drive 43 disposed on the back side is By operating, it rotates around the central axis 42 intermittently.

  The chip electronic component to be inspected is temporarily accommodated in the through hole 11 a of the transport disk 11 in the chip electronic component supply and storage unit 101 in order to inspect the electrical characteristics thereof.

  The detailed configuration of the chip electronic component supply and storage unit 101 is shown in FIG. 5 and FIG. The chip electronic component supply storage section 101 is also called a bucket section, and is an area for storing chip electronic components supplied from the outside through the chip electronic component supply port 31 in the through holes 11 a of the transport disk 11 via the buckets 32. . In FIG. 5 and FIG. 6, the buckets 32 are for supplying chip electronic components to three rows (shown as three rows for simplification as in FIG. 3) provided on the transport disk 11. As a configuration, three rows of grooves for lowering the chip electronic component in three rows in an arc shape are separated and formed by the partition wall 33. The chip electronic components supplied from the chip electronic component supply port 31 and lowered along the partition wall 33 inside the bucket 32 are gas suction formed in the base plate (reference base) 45 near the bottom of the bucket 32 The suction force is applied to the through hole 11a by the strong suction force exerted on the through hole 11a of the transport disk 11 through the passage 45a. The suction and storage of the chip electronic component in the through hole 11a of the transfer disk 11 is usually performed with the transfer disk once in a stationary state.

  FIG. 7 shows a state in which the chip electronic component is sucked and stored in the through hole 11 a of the transfer disk 11. That is, the chip electronic components 19 accumulated near the bottom of the bucket 32 are attracted to the through holes 11 a of the transfer disk 11 through the gas suction passage 45 a formed in the base plate (reference base) 45. Suction is accommodated in the through hole 11a. When the chip electronic component 19 accumulated near the bottom of the bucket 32 is sucked and stored in the through hole 11a, air is blown from the outside into the vicinity of the bottom of the bucket 32 to generate an air flow to stir the chip electronic component 19. It is preferable to float in a state in order to smoothly advance suction and storage of the chip electronic components. Such blowing of air from the outside into the vicinity of the bottom of the bucket 32 can be performed, for example, using the air blow 37 illustrated in FIG.

  As described above, the base plate 45 is disposed on the back side of the chip electronic component transfer disk 11 or on the rear side (right side in FIG. 7) of the apparatus. The base plate 45 is formed with a plurality of gas suction passages 45 a which are opened at the surface on the side of the transport disk 11. Each gas suction passage is connected to a gas suction device 46 for supplying a strong suction force to the through hole. When the gas suction device 46 is operated, the gas in the gas suction passage 45a is sucked by a strong suction force, and the gap formed between the transport disk 11 and the base plate 45 is in a reduced pressure state.

  The chip electronic component is supplied to the surface of the transfer disk through the chip electronic component supply port 31 and the bucket 32 while intermittently rotating the transfer disk 11 in the direction indicated by the arrow in FIG. When the gap between the transfer disk 11 and the base plate 45 is decompressed, the chip electronic component 19 is sucked and stored in each of the through holes 11 a of the transfer disk 11.

  The chip electronic component 19 accommodated in the through hole 11 a of the transfer disk 11 is then sent to the inspection unit 102 shown in FIGS. 2 and 3 by the intermittent rotational movement of the transfer disk 11 described above. In addition, after the storage of the chip electronic component 19 in the through hole 11a is completed, the transfer disc 11 is rotated and the chip accommodated in the through hole 11a is in the gap between the transfer disc 11 and the base plate 45. Until the electronic component 19 moves to the inspection unit 102 and reaches the classification unit 103, a weak pressure reduction state is established. Therefore, the chip electronic component 19 accommodated in the through hole 11 a of the transfer disk 11 in the chip electronic component supply and storage unit 101 reaches the classification unit 103 through the inspection unit 102 by the subsequent rotation of the transfer disk 11. Until it does, it does not drop out of the through-hole 11a.

  In the inspection section, as shown in FIG. 8, in order to electrically connect the chip electronic component to the tester of the electrical characteristics, each of the inspection sections is located at a position close to both openings of the through hole 11a of the transport disk 11. A combination of 12a and 13a configured as a pair (the former is a fixed electrode terminal and the latter is a movable electrode terminal, the same applies hereinafter), a combination of 12b and 13b, a combination of 12c and 13c, a combination of 12d and 13d, 12e And 13e, and 12f and 13f.

  As described above, one of the electrode terminals (12a, etc.) is fixed to the base plate 45 via an electrically insulating cylinder disposed around the electrode terminal (12a, etc.). The surfaces of the electrode terminals and the transport disk side of the base plate 45 are usually made smooth and flat by polishing or the like. The other electrode terminal (13a, etc.) is a movable electrode, and is supported by the electrode terminal support plate 53 so as to be capable of advancing and retreating.

  By moving the electrode terminal support plate 53 to the side of the transport disk 11, the movable electrode terminals (13 a, etc.) supported by the electrode terminal support plate 53 also move to the side of the transport disk 11. By the movement of the movable electrode terminal (13a, etc.), the chip electronic component is sandwiched between the paired electrode terminals (12a, 13a, etc.) to be in a contact state. Therefore, the electrode 22a of the chip electronic component is electrically connected to the electrode terminal (12a, etc.), and the electrode 22b is electrically connected to the electrode terminal (13a, etc.). As a result, the chip electronic component is electrically connected to the tester through the pair of electrode terminals (12a, 13a, etc.).

  Note that the “position close to” both openings of each through hole of the transfer disk in which the paired electrode terminals are arranged means that each electrode terminal is located when the chip electronic component is accommodated in each through hole. When the position electrically connected to the electrode of each chip electronic component or the electrode terminal is configured to be movable, the electrode terminal is moved to electrically connect to the electrode of the chip electronic component Means a possible position.

  The inspection unit 102 has predetermined electrical characteristics for each of the six chip electronic components 19a, 19b, 19c, 19d, 19e, and 19f housed and arranged in a line in the diameter direction of the transport disk 11. It is inspected.

  The chip electronic components whose electrical characteristics have been inspected are subsequently sent to the chip electronic component classification unit 103 shown in FIG. 2 and FIG. 3 by the intermittent rotational movement of the carrier disk 11.

  As shown in FIG. 9, the classification unit 103 is provided with a tube support cover 61 having a plurality of through holes 61a formed on the front side of the transport disc 11 or on the front side of the apparatus (left side in FIG. 9). There is. To each of the through holes 61 a of the tube support cover 61, a tube 62 which constitutes a discharge passage of the chip electronic component 19 a is connected. In FIG. 2, only a part of the tubes 62 connected to each of the through holes 61 a of the tube support cover 61 is shown.

  Further, the base plate 45 disposed on the back side of the transport disc 11 or on the rear side of the apparatus (right side in FIG. 9) opens in the surface of the transport disc 11 in the region of the classification unit 103 A plurality of gas supply passages 45b are formed. Each gas supply passage 45 b is connected to the pressurized gas supply device 63.

  When the pressurized gas supply device 63 is operated, the pressurized gas is supplied to the gas supply passage 45 b, and the pressurized gas is jetted to the chip electronic component 19 a accommodated in the through hole 11 a of the transfer disk 11. Thus, the chip electronic components are discharged to the tube 62.

  The chip electronic component 19a passes, for example, a total of ten through holes 61a located on the outermost side among a plurality of through holes 61a formed in the tube support cover 61 shown in FIG. The ten through holes 61 a are connected to the chip electronic component storage container 64 via the tubes 62 respectively.

  Therefore, the chip electronic components discharged from the through holes by the classification unit 103 are inspected as a result of inspection through any of the ten tubes 62 connected to the ten through holes 61 a of the tube support cover 61. Based on the determined electrical characteristics, it is accommodated in a predetermined chip electronic component accommodating container 64.

  Next, the relay means (switch) used in the chip electronic component inspection and sorting apparatus of the present invention will be described, but before that, the arrangement of the mercury relay in the known chip electronic component inspection and sorting apparatus will be described.

  The arrangement of the mercury relay in the chip electronic component inspection and sorting apparatus can be roughly understood from the description of Patent Document 1 and FIG. 7, but a more detailed configuration is shown in FIG. 10 of the accompanying drawings of the present specification. In FIG. 10, combinations of three combinations of fixed electrode terminals 12a, 12b, 12c and movable electrode terminals 13a, 13b, 13c according to the four-terminal method can be electrically connected to the tester 14a through the mercury relay switch 20 respectively. FIG. 1 is a circuit diagram showing a system being implemented. The inspection device 14a has four terminals (Hcur, Hpot, Lcur, Lpot) electrically connected to the respective electrode terminals in contact with the chip electronic components 19a, 19b, 19c via the mercury relay switch 20. It is equipped.

  Each mercury relay switch 20 switches the electrical connection between the tester 14a and each electrode terminal in accordance with an instruction transmitted from the tester 14a and the controller 15. Although information on the arrangement of the mercury relay switch 20 in the chip electronic component inspection and sorting apparatus can not be obtained from FIG. 10, as described above, the mercury relay switch is located near the electrode terminal because its size is large. Instead, it is general to place each electrode terminal and the mercury relay switch by a coaxial cable by arranging the sensor in the vicinity of the inspection device 14a separated from the electrode terminal set.

  Next, the MOS FETs housed in the case used in the present invention and the arrangement thereof will be described with reference to FIGS.

  From FIG. 11, the MOS FET 24 housed in the housing 23 is connected to the tester 14 a at one end thereof, and a connector (for connection to the electrode terminal) protruded to the outside of the housing 23 at the other end It can be understood that the connector 25 is connected. The connector may be attached to a recess provided on the end face of the housing.

  A MOS FET is a relay switch classified as a semiconductor switch element, and its structure and characteristics are already known. As a MOS FET used as a switch (relay switch) of the chip electronic component inspection and sorting apparatus of the present invention, a MOS FET having an ON resistance of 500 mΩ or less and an OFF capacity of 20 pF or less is preferable.

  As apparent from FIG. 12, the housing 23 accommodating the MOS FET is provided with a coaxial cable connected to the tester at the left end face of the figure, and the connector 25 is provided at the right end face. Each of the connectors 25 can be electrically connected to each electrode terminal of an electrode terminal unit (an integrated electrode terminal set, the movable electrode terminal unit being shown in this figure) 26 It is configured.

  FIG. 13 shows a state in which the housing 23 accommodating the MOS FET shown in FIG. 12 and the electrode terminal unit (movable electrode terminal unit) 26 are connected via a connector. This movable electrode terminal unit 26 comprises six electrode terminals and is thus combined with a corresponding fixed electrode terminal unit also having six fixed electrode terminals, by means of a connection switching mechanism utilizing the MOS FET 24. Electrical characteristics of six chip electronic components can be measured sequentially at high speed.

  In FIG. 14, a unit (movable electrode terminal side unit) in which the housing 23 housing the MOS FET shown in FIG. 13 and the movable electrode terminal unit are connected via a connector similarly houses the MOS FET. For measurement of the electrical characteristics of the chip electronic component 19 in which the housing 23 and the unit (fixed electrode terminal side unit) in which the fixed electrode terminal unit is connected via the connector (fixed electrode terminal side unit) are accommodated in the transport disk 11, FIG. 10 is a schematic view showing a state in which the chip electronic component 19 is in contact with an electrode terminal.

  In this specification, the description of the configuration of the chip electronic component inspection and sorting apparatus has been described using an example in which the chip electronic component transport disk described in Patent Document 1 is disposed in the vertical direction and operates. Of course, the chip electronic component inspection and sorting apparatus according to the present invention may be an apparatus in which a chip electronic component transport disk is pivotally supported on a base in an inclined state.

DESCRIPTION OF SYMBOLS 10 chip | tip electronic component inspection sorting apparatus 11 chip | tip electronic component conveyance disk 11a through-hole 12a, 12b, 12c, 12d, 12e, 12f fixed electrode terminal 13a, 13b, 13c, 13d, 13e, 13f movable electrode terminal 14a, 14b inspection device 15 Controller 19 chip electronic components (chip capacitor)
19a, 19b, 19c Chip electronic components (chip capacitors)
19d, 19e, 19f chip electronic components (chip capacitors)
20 mercury relay switch 21 capacitor body 22a, 22b electrode 23 case (for electrode terminal connection)
24 MOS FET
25 connector 26 electrode terminal unit (movable electrode terminal unit)
31 chip electronic component supply port 32 bucket 33 partition wall 41 base 42 central axis 43 rotary drive unit 45 base plate (reference base)
101 chip electronic parts supply storage unit (supply storage area)
102 Chip Electronic Component Electrical Characteristic Inspection Department (Inspection Area)
103 Chip Electronic Component Classification Department (Classification Area)

Claims (2)

A base, a chip electronic component transfer disk rotatably supported on the base, provided that the chip electronic component transfer disk temporarily accommodates a chip electronic component having an electrode on each of the opposing end faces. A plurality of through holes which can be formed in a plurality of rows along its circumference, and a chip for supplying and containing chip electronic components in the through holes of the transfer disk, provided in order along the rotation path of the transfer disk Electronic component supply / accommodation unit, electrical characteristic inspection unit provided with plural sets of inspection electrode terminal sets consisting of fixed electrode terminals for inspecting the electrical characteristics of chip electronic components and movable electrode terminals, and inspected chip electronics includes a classification unit for classifying on the basis of parts on the test result, the chip electronic component electrical property test device via a relay switch means, each of said fixed electrode terminal and the movable electrode terminals are connected A査選another device, as the relay switch means, there is ON resistance 500mΩ or less, the MOS FET OFF capacitance is less than 20 pF, housed in a housing connector provided to connect to the output circuit of the MOS FET Each of the fixed electrode terminal and the movable electrode terminal of the inspection electrode terminal set is removably connected to the connector, and the casing is disposed adjacent to each of the fixed electrode terminal and the movable electrode terminal. Chip electronic parts inspection and sorting equipment. The chip electronic component inspection and sorting apparatus according to claim 1, wherein the connector is provided on an end surface of the housing.

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