JP6512394B2 - Lighting light source and lighting device - Google Patents

Description

  The present invention relates to a light source for illumination and an illumination apparatus provided with the same.

  BACKGROUND Semiconductor light emitting devices such as light emitting diodes (LEDs) are expected as light sources for various products because of their small size and long life. Among them, light bulb-shaped lamps (LED light bulbs) using LEDs are actively being developed as illumination light sources to replace conventionally known light bulb-shaped fluorescent lamps and incandescent light bulbs (see, for example, Patent Document 1) .

  The LED bulb includes, for example, an LED module (light emitting module), a globe (cover) covering the LED module, a module plate for mounting the LED module, a drive circuit for emitting light from the LED module, and the LED module It has a heat sink for radiating heat generated and a cap for receiving power from the outside for emitting light from the LED module.

JP, 2011-146241, A

  The heat sink is formed, for example, in a tubular shape, and is disposed to surround the drive circuit. However, in this case, since the heat of the LED module is conducted to heat the heat sink, the drive circuit is placed in a high temperature environment when the LED module emits light. Therefore, there is a problem that the circuit elements constituting the drive circuit are affected by the heat generated in the LED module. As a result, for example, the circuit element may be degraded by heat, or the circuit element can only be operated at a temperature close to the heat resistance limit, and high wattage can not be realized.

  The present invention has been made to solve such a problem, and it is an object of the present invention to provide an illumination light source and an illumination device capable of reducing the influence of heat generated in the light emitting module by the drive circuit. .

  In order to achieve the above object, one aspect of the illumination light source according to the present invention includes a light emitting module, a globe covering the light emitting module, a drive circuit for causing the light emitting module to emit light, and the light emitting module A heat sink coupled to the drive circuit and surrounding the drive circuit, wherein the heat sink is positioned on a first heat transfer plate and inward of the first heat transfer plate, and the first heat transfer plate And a second heat transfer plate disposed with a gap.

  According to the present invention, the heat generated in the light emitting module can be less easily transmitted to the drive circuit, so that the drive circuit can be less affected by the heat generated in the light emitting module.

It is sectional drawing of the LED light bulb which concerns on embodiment. It is a top view of the LED module in the LED bulb which concerns on embodiment. It is a perspective view of the heat sink in the LED bulb which concerns on embodiment. It is sectional drawing of the heat sink in the LED bulb which concerns on embodiment. It is a figure for demonstrating the effect of the LED light bulb which concerns on embodiment. It is sectional drawing of the illuminating device which concerns on embodiment. It is a perspective view of the heat sink in the LED bulb which concerns on the modification 1. FIG. It is a top view of the heat sink in the LED light bulb concerning modification 2. FIG. It is a perspective view of the heat-transfer piece which comprises the heat sink in the LED light bulb which concerns on the modification 2. FIG. It is a perspective view of the 1st other example of the heat-transfer piece which comprises the heat sink in the LED bulb which concerns on the modification 2. FIG. It is a perspective view of the 2nd other example of the heat-transfer piece which comprises the heat sink in the LED bulb which concerns on the modification 2. FIG. It is a perspective view of the 3rd other example of the heat-transfer piece which comprises the heat sink in the LED bulb which concerns on the modification 2. FIG. FIG. 10 is a partial cross-sectional view of an LED bulb according to a third modification. FIG. 10 is a cross-sectional view of an LED bulb according to a fourth modification. It is sectional drawing of the LED light bulb which concerns on the modification 5. FIG. It is a top view of the heat sink concerning a modification. It is a top view of the LED module concerning a modification.

Embodiment
Hereinafter, embodiments of the present invention will be described. Each of the embodiments described below shows a preferable specific example of the present invention. Therefore, the numerical values, shapes, materials, components, arrangement positions and connection forms of the components, and the steps and the order of steps shown in the following embodiments are merely examples, and the gist of the present invention is limited. Absent. Therefore, among the components in the following embodiments, components that are not described in the independent claims indicating the highest concept of the present invention are described as optional components.

  Further, each drawing is a schematic view, and is not necessarily illustrated exactly. In the drawings, substantially the same components are denoted by the same reference numerals, and overlapping descriptions will be omitted or simplified.

[LED bulb]
In the following embodiment, a bulb-shaped LED lamp (LED bulb) as an alternative to a bulb-shaped fluorescent lamp or an incandescent bulb will be described as an example of a light source for illumination.

  FIG. 1 is a cross-sectional view of the LED bulb 1 according to the embodiment. In FIG. 1, an alternate long and short dash line drawn along the vertical direction of the drawing shows the central axis J of the LED bulb 1. In the present embodiment, the central axis J is the optical axis (lamp axis) of the LED bulb 1 and coincides with the axis (globe axis) of the globe 20. Further, the central axis J is an axis serving as a rotation center when attaching the LED bulb 1 to a socket of a lighting fixture (not shown), and coincides with the rotation axis of the base 60.

  As shown in FIG. 1, the LED bulb 1 is thermally coupled to the LED module 10, a globe 20 covering the LED module 10, a drive circuit 30 for emitting light from the LED module 10, and the LED module 10, , And a heat sink 40 surrounding the drive circuit 30. The LED bulb 1 further includes a housing 50, a base 60, lead wires 71 to 74, and a screw 80.

  In the present embodiment, in the LED bulb 1, an envelope is configured by the globe 20, the housing 50, and the base 60.

  Hereinafter, the details of each component of the LED bulb 1 will be described with reference to FIG.

[LED module]
The LED module 10 is a light emitting device (light emitting module) that emits light of a predetermined color (wavelength). The LED module 10 is configured to emit, for example, white light.

  The LED module 10 is disposed inside the globe 20 and emits light by the power supplied from the drive circuit 30. In the present embodiment, the LED module 10 is fixed to the heat sink 40.

  Here, the detailed configuration of the LED module 10 will be described with reference to FIG. 1 and FIG. 2. FIG. 2 is a top view of the LED module in the LED bulb 1 according to the embodiment.

  As shown in FIGS. 1 and 2, the LED module 10 has a substrate 11 and a light emitting element 12 disposed on the substrate 11.

  The substrate 11 is a mounting substrate for mounting the light emitting element 12. The substrate 11 is, for example, a substantially circular plate-like substrate in a plan view, and is fixed to the heat sink 40. Specifically, the substrate 11 is placed on the third heat transfer plate 43 of the heat sink 40 and fixed to the third heat transfer plate 43. A through hole 11 a for inserting a screw 80 is provided in the substrate 11, and the substrate 11 and the third heat transfer plate 43 are screwed and fixed by the screw 80. In addition, the fixing method of the board | substrate 11 and the heat sink 40 is not restricted to screwing, You may use other fixing means, such as an adhesive agent.

  As the substrate 11, for example, a metal base substrate obtained by applying an insulating film to a metal substrate such as aluminum, a ceramic substrate which is a sintered body of a ceramic material such as alumina, or a resin substrate made of a resin material Is used. The shape of the substrate 11 is not limited to a circular shape, and a rectangular substrate may be used.

  A pair of electrode terminals (not shown) is provided on the surface of the substrate 11 as a feeding portion. A pair of lead wires 71 and 72 drawn from the drive circuit 30 is connected to each of the pair of electrode terminals. Further, on the surface of the substrate 11, metal wires (not shown) for electrically connecting the electrode terminals and the plurality of light emitting elements 12 are formed in a pattern of a predetermined shape.

  A through hole 11 b for inserting a pair of lead wires 71 and 72 led from the drive circuit 30 is provided in the central portion of the substrate 11. The position of the through hole 11 b may not be at the central portion of the substrate 11. Further, instead of providing the through holes 11 b in the substrate 11, notches are provided in the edge of the substrate 11 etc., and the pair of lead wires 71 and 72 are inserted through the notches to pair the electrodes of the substrate 11. It may be connected to a terminal.

  A plurality of light emitting elements 12 are mounted on one side of the substrate 11. In the present embodiment, the plurality of light emitting elements 12 are arranged on the circumference centering on the central axis J so as to form an annular arrangement. In FIG. 2, eight light emitting elements 12 are mounted as an example, but the number of light emitting elements 12 mounted is not limited to this, and may be one or eight. There may be more than one.

  The light emitting element 12 in the present embodiment is a surface mount device (SMD) type LED element packaged individually, and as shown in FIGS. 1 and 2, a container (package) 12 a and a container The LED chip 12b primarily mounted in 12a and the sealing member 12c which seals the LED chip 12b are provided. The light emitting element 12 which is an SMD type LED element is secondarily mounted on the substrate 11.

  The container 12a is a resin-molded article or a white ceramic-molded article made of a white resin, and has an inverted truncated cone-shaped recess (cavity). The inner surface of the recess is inclined and configured to reflect the light from the LED chip 12 b upward.

  The LED chip 12b is mounted on the bottom of the recess of the container 12a. The LED chip 12 b is an example of a semiconductor light emitting element that emits light by a predetermined direct current power, and is a bare chip that emits monochromatic visible light. The LED chip 12 b is, for example, a blue LED chip that emits blue light when energized.

  The sealing member 12c is a translucent insulating resin material such as silicone resin. The sealing member 12c in the present embodiment includes a phosphor as a wavelength conversion material that converts the wavelength of light from the LED chip 12b. That is, the sealing member 12c is a phosphor-containing resin in which a phosphor is contained in a translucent resin, and performs wavelength conversion (color conversion) of light from the LED chip 12b to a predetermined wavelength. The sealing member 12c is filled in the recess of the container 12a.

  As the sealing member 12c, for example, when the LED chip 12b is a blue LED, phosphor-containing resin in which yellow phosphor particles of YAG (yttrium aluminum garnet) type are dispersed in silicone resin in order to obtain white light Can be used. As a result, the yellow phosphor particles are excited by the blue light of the blue LED chip to emit yellow light. Therefore, from the sealing member 12c, white light is generated as a composite light of the excited yellow light and the blue light of the blue LED chip. Light is emitted. The sealing member 12c may contain a light diffusing material such as silica.

  The plurality of light emitting elements 12 configured in this way are, for example, connected in series, and emit light by the DC power supplied from the drive circuit 30 via the pair of lead wires 71 and 72. The manner of connection of the plurality of light emitting elements 12 (serial connection, parallel connection, connection of a combination of serial connection and parallel connection, and the like) is not particularly limited.

[Globe]
The globe 20 is a translucent cover that covers the LED module 10, and is configured to extract light emitted from the LED module 10 to the outside of the lamp. That is, the light of the LED module 10 incident on the inner surface of the globe 20 is transmitted through the globe 20 and taken out of the globe 20.

  The glove 20 is a hollow member having an opening 21 and is substantially spherical with the top opposite to the opening 21 closed. As shown in FIG. 1, the globe 20 is, for example, a hollow rotary body having a central axis J as a rotation axis, and has a shape in which the opening 21 is narrowed.

  The glove 20 is fixed to the opening on the glove side of the housing 50. In the present embodiment, the opening 21 of the glove 20 is inserted into the recess provided at the end of the opening of the outer shell 51 of the housing 50, and the opening 21 of the glove 20 is formed by an adhesive such as silicone resin. And the outer shell 51 of the housing 50 are fixed.

  As a material of the glove 20, a translucent material made of a glass material such as silica glass transparent to visible light, or a resin material such as acrylic (PMMA) or polycarbonate (PC) can be used.

  It is preferable that the globe 20 be subjected to a diffusion treatment for diffusing the light emitted from the LED module 10. For example, by forming a light diffusion film (light diffusion layer) on the inner surface or the outer surface of the globe 20, the globe 20 can have a light diffusion function.

  Specifically, a milky white light diffusion film can be formed by applying a resin containing a light diffusion material such as silica or calcium carbonate, a white pigment or the like on the entire inner surface or outer surface of the glove 20. Alternatively, the globe 20 can have a light diffusing function by forming a plurality of light diffusing dots or a plurality of minute depressions in the globe 20. As described above, by providing the light diffusion function to the globe 20, the light incident from the LED module 10 to the globe 20 can be diffused, so that the light distribution angle can be widened.

  The globe 20 may be transparent so that the LED module 10 inside can be viewed without providing the light diffusion function to the globe 20. Further, the shape of the globe 20 may be a spheroid or a spheroid, or may be a shape conforming to an A-type bulb which is a general bulb shape.

[Drive circuit]
The drive circuit 30 is a power supply circuit (power supply unit) for driving the LED module 10, and supplies the LED module 10 with power for causing the LED module 10 (light emitting element 12) to emit light. The drive circuit 30 converts, for example, AC power supplied from the base 60 via the pair of lead wires 73 and 74 into DC power, and applies the DC power to the LED module 10 via the pair of lead wires 71 and 72. Supply. The LED module 10 (light emitting element 12) is turned on and off by the DC power supplied from the drive circuit 30 (lighting circuit).

  The drive circuit 30 includes a circuit board 31 and a plurality of electronic components 32 mounted on the circuit board 31. The drive circuit 30 is disposed between the LED module 10 and the base 60. Specifically, the drive circuit 30 is housed in the inner shell 52 of the housing 50, and is fixed to the inner shell 52 by screwing, bonding, engagement, or the like.

  The circuit board 31 is a printed circuit board (PCB) in which metal wiring such as copper foil is patterned on one surface (solder surface). The plurality of electronic components 32 mounted on the circuit board 31 are electrically connected to each other by the metal wiring formed on the circuit board 31. The circuit board 31 is disposed, for example, in a posture (vertically) in which the main surface of the circuit board 31 is substantially parallel to the central axis J. The circuit board 31 is not limited to the vertical arrangement, and may be arranged in a posture (horizontally arranged) in which the main surface of the circuit board 31 is substantially orthogonal to the central axis J.

  The electronic component 32 is a plurality of circuit elements for lighting the LED module 10. For example, a capacitive element such as an electrolytic capacitor or a ceramic capacitor, a resistive element such as a resistor, a rectifier circuit element, a coil element, a choke coil Transformers, noise filters, diodes, or semiconductor elements such as integrated circuit elements. The electronic component 32 (circuit component) having low heat resistance such as an electrolytic capacitor may be mounted on the end of the circuit board 31 on the base 60 side.

  The drive circuit 30 configured in this manner is housed in the inner shell 52 of the casing 50 made of an insulating resin, thereby ensuring insulation. The drive circuit 30 may be combined with a light control circuit or a booster circuit.

  The drive circuit 30 and the LED module 10 are electrically connected by a pair of lead wires 71 and 72. Further, the drive circuit 30 and the base 60 are electrically connected by a pair of lead wires 73 and 74. These four lead wires 71 to 74 are, for example, alloy copper lead wires, and each consist of a core wire made of alloy copper and an insulating resin film for covering the core wire.

  The pair of lead wires 71 and 72 is a wire that supplies DC power from the drive circuit 30 to the LED module 10. For example, the lead wire 71 is a high voltage side output terminal wire, and the lead wire 72 is a low voltage side output terminal wire. The lead wires 71 and 72 are inserted into the through holes provided in the heat sink 40 and the through holes provided in the LED module 10, and are connected to the substrate 11 of the LED module 10.

  The lead wires 73 and 74 are electric wires for supplying AC power from the base 60 to the drive circuit 30. The lead wire 73 is connected to the shell portion 61 of the base 60. On the other hand, the lead wire 74 is connected to the eyelet portion 63 of the base 60.

[heatsink]
The heat sink 40 is a heat radiating member that radiates heat mainly generated by the LED module 10. The heat sink 40 in the present embodiment also functions as a support member for supporting the LED module 10, and the LED module 10 is fixed to the heat sink 40. The heat sink 40 is configured to surround the drive circuit 30 and is disposed between the LED module 10 and the base 60.

  Here, the detailed configuration of the heat sink 40 will be described with reference to FIG. 1 with reference to FIGS. 3A and 3B. FIG. 3A is a perspective view of the heat sink 40 in the LED bulb 1 according to the embodiment, and FIG. 3B is a cross-sectional view of the heat sink 40.

  As shown in FIGS. 1, 3 </ b> A and 3 </ b> B, the heat sink 40 has a first heat transfer plate 41 and a second heat transfer plate 42.

  The first heat transfer plate 41 is an outer wall portion (first wall portion) positioned more outward than the second heat transfer plate 42, and is disposed with a predetermined gap from the second heat transfer plate 42. On the other hand, the second heat transfer plate 42 is an inner wall portion (second wall portion) positioned inward of the first heat transfer plate 41, and is disposed with a predetermined gap from the first heat transfer plate 41. . That is, the heat sink 40 has a double structure of the first heat transfer plate 41 and the second heat transfer plate 42, and the first heat transfer plate 41 and the second heat transfer plate 42 have a predetermined distance therebetween. They are disposed to face each other such that there is a gap (air layer).

  The first heat transfer plate 41 is, for example, a cylindrical metal member centered on the central axis J, and is, for example, a metal plate having a constant thickness. Specifically, the first heat transfer plate 41 has a tapered first cylindrical portion configured to be inclined with respect to the central axis J, and a first diameter which is extended in the direction of the central axis J is constant. It consists of 2 cylindrical parts.

  The first heat transfer plate 41 is formed to surround the second heat transfer plate 42. Further, the first heat transfer plate 41 surrounds the lateral periphery of the drive circuit 30 via the second heat transfer plate 42 and the inner shell 52. As shown in FIG. 1, the inner surface of the first heat transfer plate 41 faces the outer surface of the second heat transfer plate 42, and the outer surface of the first heat transfer plate 41 is the outer shell 51 of the housing 50. Face the inner side of the

  The second heat transfer plate 42 is, for example, a cylindrical metal member centered on the central axis J, and is formed of, for example, a metal plate having a constant thickness. Specifically, the second heat transfer plate 42 is formed of a cylindrical portion having a constant diameter extending in the direction of the central axis J.

  The second heat transfer plate 42 is formed to surround the inner portion 52 of the housing 50. Further, the second heat transfer plate 42 surrounds the lateral periphery of the drive circuit 30 via the inner shell 52. As shown in FIG. 1, the outer surface of the second heat transfer plate 42 faces the inner surface of the first heat transfer plate 41, and the inner surface of the second heat transfer plate 42 is an inner portion of the housing 50. Facing the exterior of 52.

  The first heat transfer plate 41 and the second heat transfer plate 42 are connected at an end (an end on the base 60 side) opposite to the globe 20 side. That is, the heat sink 40 has a connecting portion that connects the first heat transfer plate 41 and the second heat transfer plate 42. In the present embodiment, the first heat transfer plate 41 and the second heat transfer plate 42 are integrally formed, and are formed to be bent like a hairpin.

  Further, the length of the second heat transfer plate 42 in the direction of the central axis J is 1/2 or more of the length of the first heat transfer plate 41 in the direction of the central axis J. That is, the second heat transfer plate 42 is bent so as to be equal to or more than a half length of the first heat transfer plate 41.

  The heat sink 40 in the present embodiment further includes a third heat transfer plate 43. The third heat transfer plate 43 is, for example, a disk-like plate-like metal member. The third heat transfer plate 43 is connected to the first heat transfer plate 41, and in the present embodiment, is integrally formed with the first heat transfer plate 41. Specifically, the third heat transfer plate 43 is erected from an end portion of the first heat transfer plate 41, and is formed to be bent at a right angle from the first heat transfer plate 41.

  The third heat transfer plate 43 is a mounting portion on which the LED module 10 is mounted, and functions as a module plate. The LED module 10 is mounted on the third heat transfer plate 43 and fixed to the third heat transfer plate 43. Specifically, the substrate 11 of the LED module 10 is mounted on one surface of the third heat transfer plate 43 so as to be in contact with it.

  As shown in FIG. 1, since the third heat transfer plate 43 and the LED module 10 are fixed by screwing with a screw 80, the third heat transfer plate 43 is provided with a through hole 43 a for inserting the screw 80. It is done. Therefore, the through holes 43 a are provided at positions corresponding to the through holes 11 a of the substrate 11. Further, in the central portion of the third heat transfer plate 43, a through hole 43b for inserting the lead wires 71 and 72 is provided. The through holes 43 b are provided at positions corresponding to the through holes 11 b of the substrate 11.

  The other end of the third heat transfer plate 43 is in contact with the end on the glove 20 side of the inner shell 52 of the housing 50. The heat sink 40 is thereby supported by the inner shell 52 of the housing 50. That is, the heat sink 40 is supported by the housing 50 in a state in which the LED module 10 is fixed to the heat sink 40.

  The heat sink 40 configured in this way can be formed by processing a metal plate such as an aluminum plate, for example.

[Case]
The housing 50 is disposed between the glove 20 and the base 60. The housing 50 has an outer shell 51 (a first housing portion) surrounding at least a part of the periphery of the heat sink 40. Furthermore, the casing 50 has an inner shell 52 (second casing) as a portion disposed inside the heat sink 40. The root on the base 60 side of the outer shell 51 is connected to the inner shell 52. Specifically, the end on the base 60 side of the outer shell 51 is connected to the inner shell 52. As a result, since the outer shell 51 and the inner shell 52 can be manufactured by integral molding, the number of parts can be reduced and cost reduction can be achieved.

  The outer shell portion 51 is an exposed portion exposed to the outside (in the air) of the housing 50 and constitutes an outer shell member of the LED bulb 1. Therefore, the outer surface of the outer shell 51 is exposed to the outside. The outer shell 51 is configured to surround the first heat transfer plate 41 of the heat sink 40.

  The outer shell 51 has, for example, a substantially cylindrical shape whose wall thickness is constant and whose inner and outer diameters gradually change. The inner peripheral surface and the outer peripheral surface of the outer shell portion 51 are tapered surfaces (inclined surfaces) configured to be inclined with respect to the central axis J. In the present embodiment, the outer shell 51 is configured such that the inner diameter and the outer diameter gradually decrease toward the base 60 side.

  The outer shell 51 and the first heat transfer plate 41 are disposed to face each other, and the inner surface of the outer shell 51 and the outer surface of the first heat transfer plate 41 face each other. The inner surface shape of the outer shell 51 is a shape along the surface shape of the first heat transfer plate 41.

  A clearance is set between the outer shell 51 and the first heat transfer plate 41, and a gap (a space) exists. That is, the outer shell 51 and the first heat transfer plate 41 are configured not to be in surface contact with each other. Thereby, even if the heat sink 40 (the first heat transfer plate 41) and the housing 50 (the outer shell 51) thermally expand or shrink, the thermal expansion difference due to the linear expansion coefficient difference between the heat sink 40 and the housing 50 The stress associated with the thermal contraction difference can be absorbed by the gap between the outer shell 51 and the first heat transfer plate 41. As an example, the gap between the outer shell 51 and the first heat transfer plate 41 is substantially constant. The outer shell 51 and the first heat transfer plate 41 may be in contact with each other.

  On the other hand, the inner shell 52 is a cylinder configured to surround the drive circuit 30. That is, the inner shell 52 functions as a circuit case that protects the drive circuit 30. The inner shell 52 has, for example, a substantially cylindrical shape with a constant wall thickness and a constant inner diameter and outer diameter.

  The inner shell 52 and the second heat transfer plate 42 are disposed to face each other, and the outer surface of the inner shell 52 and the inner surface of the second heat transfer plate 42 face each other. The outer surface shape of the inner shell 52 is a shape along the surface shape of the second heat transfer plate 42.

  In the present embodiment, the inner shell 52 has a cylindrical shape formed to extend in the direction of the central axis J of the LED bulb 1. The inner shell 52 and the outer shell 51 sandwich the first heat transfer plate 41 and the second heat transfer plate 42 of the heat sink 40. That is, the casing 50 has a double structure of the outer shell 51 and the inner shell 52, and the first heat transfer plate 41 and the second heat exchanger plate 42 are sandwiched between the outer shell 51 and the inner shell 52. Is configured as.

  A clearance is set between the inner shell 52 and the second heat transfer plate 42, and a gap (space) exists. That is, the inner shell 52 and the second heat transfer plate 42 are configured not to be in surface contact with each other. Thereby, the stress associated with the thermal expansion difference or the thermal contraction difference due to the linear expansion coefficient difference between the heat sink 40 and the housing 50 can be absorbed by the gap between the inner shell 52 and the second heat transfer plate 42. As an example, the gap between the inner shell 52 and the second heat transfer plate 42 is substantially constant. The inner shell 52 and the second heat transfer plate 42 may be in contact with each other.

  A screwing portion 52 a is formed in a portion of the inner shell 52 which is extended to the base 60 side. The screwing portion 52 a is screwed with the base 60. That is, the base 60 is screwed into the screwing portion 52a.

  The inner shell 52 is provided with a structure for fixing the circuit board 31 of the drive circuit 30. That is, the inner shell portion 52 also functions as a holding portion (holder) for holding the drive circuit 30.

  The housing 50 configured in this way is integrally formed of resin. That is, the outer shell 51 and the inner shell 52 are formed by integral molding. That is, the case 50 is an integrally molded article made of resin. Thereby, the housing 50 can be easily manufactured at low cost. The housing 50 can be made of, for example, an insulating resin material such as polybutylene terephthalate (PBT).

[Cap]
The base 60 is a power receiving unit that receives power for making the LED module 10 (light emitting element 12) emit light from the outside of the lamp. The base 60 is attached to, for example, a socket of a lighting fixture. Thereby, the base 60 can receive power from the socket of the lighting fixture when lighting the LED bulb 1.

  For example, AC power is supplied to the base 60 from a commercial power source. The base 60 in the present embodiment receives AC power at two contacts, and the power received by the base 60 is input to the drive circuit 30 via the pair of lead wires 73 and 74.

  The base 60 has a cylindrical shape with a bottom and made of metal, and includes a shell portion 61 whose outer peripheral surface is an external thread, and an eyelet portion 63 attached to the shell portion 61 via the insulating portion 62. The insulating portion 62 is made of, for example, glass cullet.

  On the outer peripheral surface of the base 60, a screwing portion for screwing the socket of the lighting apparatus is formed. In addition, a screwing portion for screwing with the screwing portion 52 a of the inner shell 52 of the housing 50 is formed on the inner peripheral surface of the base 60. The base 60 is externally fitted to the housing 50 (inner shell 52) by screwing and fitting into the screwing portion 52a of the inner shell 52.

  The type of the base 60 is not particularly limited, but in the present embodiment, a screw-in type Edison type (E-type) base is used. For example, examples of the base 60 include E26, E17, and E16. In addition, as the base 60, a plug-in base may be used.

[Function effect]
Next, the function and effect of the LED bulb 1 in the present embodiment will be described using FIG. 4. FIG. 4 is a figure for demonstrating the effect of the LED light bulb 1 which concerns on embodiment.

  In the LED bulb 1 according to the present embodiment, as shown in FIG. 4, the heat sink 40 has a double structure of the first heat transfer plate 41 and the second heat transfer plate 42, and the first heat transfer plate 41 There is a gap (air layer) between the second heat transfer plate 42 and the second heat transfer plate 42.

  Thus, the heat generated from the LED module 10 (the light emitting element 12) when the LED bulb 1 is lit (when the LED module 10 emits light) is transmitted through the third heat transfer plate 43 of the heat sink 40 as the first heat transfer plate Conduct to 41.

  Part of the heat conducted to the first heat transfer plate 41 radiates outward. That is, part of the heat conducted to the first heat transfer plate 41 is radiated to the outside of the LED bulb 1 through the outer shell 51 of the housing 50. Thereby, the heat generated in the LED module 10 can be efficiently dissipated to the outside of the LED bulb 1.

  On the other hand, the other part of the heat conducted to the first heat transfer plate 41 radiates inward. That is, the other part of the heat conducted to the first heat transfer plate 41 radiates toward the drive circuit 30. At this time, the second heat transfer plate 42 is provided to face the first heat transfer plate 41, and an air layer is present between the first heat transfer plate 41 and the second heat transfer plate 42. This air layer functions as a heat insulation layer (heat insulation space). For this reason, the heat radiated inward from the first heat transfer plate 41 among the heat generated in the LED module 10 is thermally insulated by the air layer. Thus, the heat generated by the LED module 10 can be less easily transmitted to the drive circuit 30, so that the drive circuit 30 can be less affected by the heat generated by the LED module 10.

  Furthermore, by providing the second heat transfer plate 42 so as to face the first heat transfer plate 41, the heat radiated from the first heat transfer plate 41 toward the drive circuit 30 is conducted to the second heat transfer plate 42. be able to. That is, heat can be recovered by the second heat transfer plate 42. Thereby, the heat radiated from the first heat transfer plate 41 toward the drive circuit 30 can be thermally conducted to the base 60 side which is the low temperature side whose temperature is relatively lower than that of the globe 20 side.

  Moreover, by providing the second heat transfer plate 42 so as to face the first heat transfer plate 41, the enveloping volume at the nozzle 60 side whose temperature is relatively low compared to the case where the second heat transfer plate 42 is not provided. Can be increased.

  As described above, by providing the second heat transfer plate 42 so as to face the first heat transfer plate 41, heat can be concentrated on the side of the base 60 having a relatively low temperature. Heat dissipation can be improved.

  As described above, according to the LED bulb 1 in the present embodiment, the drive circuit 30 can be less affected by the heat generated by the LED module 10, and excellent heat dissipation can be realized.

  Further, in the LED bulb 1 in the present embodiment, the heat sink 40 is disposed between the LED module 10 and the base 60. That is, the first heat transfer plate 41 of the heat sink 40 is extended from the LED module 10 toward the base 60.

  Thereby, the heat generated in the LED module 10 is conducted to the first heat transfer plate 41 extended toward the base 60, so that the heat generated in the LED module 10 is dissipated to the base 60 on the relatively low temperature side be able to. Therefore, the heat dissipation of the LED bulb 1 can be further improved.

  Further, in the present embodiment, the first heat transfer plate 41 and the second heat transfer plate 42 are connected at the end opposite to the glove 20 side. That is, the first heat transfer plate 41 and the second heat transfer plate 42 are connected at the end on the die 60 side.

  Thereby, the heat from the first heat transfer plate 41 collected by the second heat transfer plate 42 can be effectively dissipated to the die 60 side having a relatively low temperature. Therefore, the heat dissipation of the LED bulb 1 can be further improved.

  Further, in the present embodiment, the first heat transfer plate 41 and the second heat transfer plate 42 are cylindrical, and are configured to surround the sides of the entire periphery of the drive circuit 30.

  Thereby, the heat generated in the LED module 10 can be effectively dissipated to the base 60 side, so the heat dissipation of the LED bulb 1 can be further improved.

  Further, in the present embodiment, the heat sink 40 has the third heat transfer plate 43 on which the LED module 10 is mounted, and the third heat transfer plate 43 is integrated with the first heat transfer plate 41. It is molded.

  Thereby, the heat generated in the LED module 10 is directly conducted to the third heat transfer plate 43 and conducted to the first heat transfer plate 41 without thermal resistance. Therefore, the heat dissipation of the LED bulb 1 can be further improved.

(Modification 1)
FIG. 6 is a perspective view of the heat sink 40A in the LED bulb according to the first modification.

  As shown in FIG. 3A, in the heat sink 40 according to the above-described embodiment, the third heat transfer plate 43 is formed so as to fill the opening of the first heat transfer plate 41 having a disk shape and a cylindrical shape. However, as shown in FIG. 6, in the heat sink 40 </ b> A in the present modification, a plurality of third heat transfer plates 43 </ b> A are partially formed from the opening of the first heat transfer plate 41.

  Specifically, in the present modification, four third heat transfer plates 43A are provided. Each third heat transfer plate 43 </ b> A is formed to be bent from the opening of the first heat transfer plate 41.

  As described above, also in this modification, as in the above-described embodiment, the influence of heat generated by the drive circuit 30 on the LED module 10 can be reduced, and excellent heat dissipation can be realized.

  Furthermore, in the present modification, since the third heat transfer plate 43 can be formed by bending, the heat sink 40A can be manufactured easily and inexpensively as compared with the heat sink 40 shown in FIG. 7A.

(Modification 2)
FIG. 7A is a perspective view of a heat sink 40B in an LED bulb according to a second modification. Moreover, FIG. 7B is a perspective view of heat-transfer piece 40Ba which comprises the heat sink 40B.

  As shown to FIG. 7A, the heat sink 40B in this modification is comprised by the several heat-transfer piece (heat-transfer body). That is, the heat sink 40B is divided (divided) into a plurality of heat transfer pieces, and is configured by combining the plurality of heat transfer pieces.

  In the present modification, the heat sink 40B is configured of four heat transfer pieces 40Ba to 40Bd. Each of the four heat transfer pieces 40Ba to 40Bd is arranged along the circumference of the central axis J. Specifically, the four heat transfer pieces 40Ba to 40Bd are equally disposed at intervals of 90 degrees in the circumferential direction around the central axis J. In addition, the four heat transfer pieces 40Ba to 40Bd are arranged such that a gap is present between the adjacent heat transfer pieces.

  As shown in FIGS. 7A and 7B, each of the heat transfer pieces 40Ba to 40Bd has a first heat transfer plate 41B, a second heat transfer plate 42B, and a third heat transfer plate 43B. 7B shows only the heat transfer piece 40Ba among the heat transfer pieces 40Ba to 40Bd, but in the present modification, each of the four heat transfer pieces 40Ba to 40Bd is the same component and is the same. Shape and same size.

  As in the above embodiment, the first heat transfer plate 41B is positioned outward of the second heat transfer plate 42B, and the second heat transfer plate 42B is positioned inwardly of the first heat transfer plate 41B. A predetermined gap (air layer) exists between the first heat transfer plate 41B and the second heat transfer plate 42B. Therefore, also in this modification, the heat sink 40B has a double structure of the first heat transfer plate 41B and the second heat transfer plate 42B.

  The first heat transfer plate 41B and the second heat transfer plate 42B are connected at an end on the die 60 side, and are processed so as to be bent like a hairpin. In this modification, since the heat sink 40B is divided into a plurality of heat transfer pieces 40Ba to 40Bd, the first heat transfer plate 41B and the second heat transfer plate 42B connected so as to be bent have a spring property. For example, when an external force is applied, the second heat transfer plate 42B elastically deforms about a connection portion with the first heat transfer plate 41B as a fulcrum, and when the external force is released, the second heat transfer plate 42B is restored to the original position Do. Also in this modification, the length of the second heat transfer plate 42B in the direction of the central axis J is 1/2 or more of the length of the first heat transfer plate 41B in the direction of the central axis J.

  Further, the heat sink 40B in the present modification also has the third heat transfer plate 43B. The third heat transfer plate 43B is connected to the first heat transfer plate 41B. The third heat transfer plate 43B is integrally formed with the first heat transfer plate 41B so as to be bent from the first heat transfer plate 41B.

  The third heat transfer plate 43B is a mounting portion on which the LED module 10 is mounted, and functions as a module plate. The LED module 10 is mounted on the third heat transfer plate 43B of the four heat transfer pieces 40Ba to 40Bd and fixed to the third heat transfer plate 43. Each third heat transfer plate 43B is provided with a through hole 43a for inserting a screw 80 therethrough. The end on the globe 20 side of the inner shell 52 of the housing 50 is in contact with each third heat transfer plate 43B.

  In the present variation, each of the four heat transfer pieces 40Ba to 40Bd is a pressed product of a metal plate. For example, each heat transfer piece 40Ba to 40Bd can be formed by bending a metal plate such as an aluminum plate.

  As described above, also in this modification, as in the above-described embodiment, the influence of heat generated by the drive circuit 30 on the LED module 10 can be reduced, and excellent heat dissipation can be realized.

  Furthermore, in the present modification, the heat sink 40B is configured of a plurality of heat transfer pieces 40Ba to 40Bd, and the heat sink 40B is divided. Thus, since each of the plurality of heat transfer pieces 40Ba to 40Bd can be formed by press processing such as bending, the heat sink 40B can be manufactured at low cost. Furthermore, by dividing the heat sink 40B into a plurality of heat transfer pieces 40Ba to 40Bd, one of the heat sink 40B and the housing 50 is removed from the other by the thermal expansion difference and the thermal contraction difference due to the linear expansion coefficient difference between the heat sink 40B and the housing 50. Can be suppressed from being stressed or received. Therefore, deterioration of the heat sink 40B and the housing 50 can be suppressed. In particular, the occurrence of a crack or the like in the resin case 50 can be suppressed.

  Further, by combining a plurality of heat transfer pieces 40Ba to 40Bd into one heat sink 40B, the heat transfer pieces 40Ba to 40Bd suitable for the necessary heat radiation characteristics or the size of the heat sink 40B according to the type of the LED bulb. The number of can be adjusted appropriately. That is, by adjusting the number of heat transfer pieces 40Ba to 40B in combination, a desired heat sink 40B can be obtained.

  Furthermore, the heat sink 40B can be easily incorporated into the housing 50 by dividing the heat sink 40B into a plurality of heat transfer pieces 40Ba to 40Bd.

  Further, as in this modification, the heat transfer pieces 40Ba to 40Bd may be arranged such that a gap is present between adjacent heat transfer pieces. Thereby, even if the heat sink 40 and the housing 50 thermally expand or shrink, the stress caused by the thermal expansion difference or the thermal contraction difference due to the linear expansion coefficient difference between the heat sink 40B and the housing 50 can be Can be absorbed by the gap between Therefore, deterioration of the heat sink 40B and the housing 50 can be further suppressed.

  In addition, you may use the heat-transfer piece shown by FIGS. 8-10 as each of the several heat-transfer piece which comprises the heat sink 40B. The heat transfer piece 40Ca shown in FIG. 8 has a first heat transfer plate 41C, a second heat transfer plate 42C, and a third heat transfer plate 43C. The heat transfer piece 40Da shown in FIG. 9 has a first heat transfer plate 41D, a second heat transfer plate 42D, and a third heat transfer plate 43D. The heat transfer piece 40Ea shown in FIG. 10 has a first heat transfer plate 41E, a second heat transfer plate 42E, and a third heat transfer plate 43E. The heat transfer pieces 40Ca to 40Ea shown in FIGS. 8 to 10 have fewer curved surface portions than the heat transfer piece 40Ba shown in FIG. 7A. Thereby, since heat transfer pieces 40Ca-40Ea can be easily produced by press processing, the processing cost of a heat sink can be reduced further.

  Moreover, in this modification, although each of the several heat-transfer piece which comprises the heat sink 40B was used as the same components, it does not restrict to this. Each of the plurality of heat transfer pieces constituting the heat sink 40B may be parts of all different shapes, or parts of parts of different shapes may be included. However, the cost can be reduced most by making all of the plurality of heat transfer pieces constituting the heat sink 40B the same component.

(Modification 3)
FIG. 11 is a partial cross-sectional view of an LED bulb according to a third modification.

  In the heat sink 40 in the LED bulb 1 according to the embodiment shown in FIG. 1, the second heat transfer plate 42 is connected to the first heat transfer plate 41, but in the heat sink 40F in the LED bulb in the present modification, The second heat transfer plate 42F is connected to the third heat transfer plate 43.

  Specifically, in the above embodiment, the end of the second heat transfer plate 42 on the base 60 side is connected to the end of the first heat transfer plate 41 on the base 60 side, but in the present modification The end on the globe 20 side of the second heat transfer plate 42F is connected to the other surface of the third heat transfer plate 43.

  As described above, also in this modification, as in the above-described embodiment, the influence of heat generated by the drive circuit 30 on the LED module 10 can be reduced, and excellent heat dissipation can be realized.

  However, the LED bulb 1 in the embodiment shown in FIG. 1 can conduct heat from the first heat transfer plate 41 collected by the second heat transfer plate 42 to the die 60 side.

(Modification 4)
FIG. 12 is a cross-sectional view of an LED bulb according to a fourth modification.

  The heat sink 40 </ b> G in the LED light bulb according to the present modification includes only the first heat transfer plate 41 and the second heat transfer plate 42 and does not have the third heat transfer plate 43. And, in the LED bulb in the present modified example, a module plate 90 for mounting the LED module 10 is provided instead of the third heat transfer plate 43.

  The module plate 90 is a support that supports the LED module 10. The module plate 90 is, for example, a disk-like support plate. Similar to the third heat transfer plate 43, the LED module 10 is mounted and fixed on the module plate 90. The module plate 90 is provided with a through hole for inserting the screw 80.

  The module plate 90 also functions as a heat radiating member (heat sink) for radiating heat generated by the LED module 10 (light emitting element 12). Therefore, the module plate 90 may be made of a metal material mainly composed of aluminum (Al), copper (Cu), iron (Fe) or the like, or a resin material having a high thermal conductivity.

  The module plate 90 is connected to the heat sink 40G. Thereby, the heat generated in the LED module 10 can be efficiently conducted to the heat sink 40G through the module plate 90.

  Specifically, the module plate 90 is connected to the opening of the first heat transfer plate 41 of the heat sink 40G. In this case, for example, the module plate 90 is inserted into the opening of the first heat transfer plate 41 of the heat sink 40G and fixed to the heat sink 40G by caulking a part of the outer peripheral surface of the first heat transfer plate 41. Can.

  As described above, also in this modification, as in the above-described embodiment, the influence of heat generated by the drive circuit 30 on the LED module 10 can be reduced, and excellent heat dissipation can be realized.

(Modification 5)
FIG. 13 is a cross-sectional view of an LED bulb according to a fifth modification.

  In the LED bulb according to the present modification, the heat sink 40H includes the first heat transfer plate 41, the second heat transfer plate 42, and the third heat transfer plate 43, as in the above embodiment.

  Unlike the LED bulb in the above embodiment, in the LED bulb in the present modification, the housing 50 does not have the outer shell 51. Specifically, the case 50 has the inner shell 52, but the outer shell 51 is not provided in the case 50.

  For this reason, the heat sink 40H functions as an outer casing, and the first heat transfer plate 41 is exposed to the outside. In this case, the first heat transfer plate 41 functions as an outer casing, and the outer surface of the first heat transfer plate 41 is exposed. The heat sink 40H is made of, for example, aluminum as in the above embodiment.

  As described above, also in this modification, as in the above-described embodiment, the influence of heat generated by the drive circuit 30 on the LED module 10 can be reduced, and excellent heat dissipation can be realized.

  In this modification, the globe 20 is fixed to the third heat transfer plate 43 of the heat sink 40, but the method of fixing the globe 20 is not limited to this.

(Other modifications etc.)
As mentioned above, although the light source for illuminations and the illuminating device which concern on this invention were demonstrated based on embodiment and a modification, this invention is not limited to said embodiment and each modification.

  For example, in the second modification (FIG. 7A), the heat sink 40B is divided into four and is configured by four heat transfer pieces 40Ba to 40Bb, but the invention is not limited to this. As an example, as shown in FIG. 14, the heat sink 40I may be configured by three heat transfer pieces 40Ia, 40Ib and 40Ic.

  Moreover, in said embodiment and each modification, although the LED module 10 was comprised by the board | substrate 11 of 1 sheet, it does not restrict to this. For example, as shown in FIG. 15, an LED module 10A configured using a substrate 11A divided into four so as to correspond to the four heat transfer pieces 40Ba to 40Bd shown in FIG. 7A may be used. Note that the plurality of divided substrates 11A may be electrically connected separately by lead wires or the like, or the light emitting elements 12 of each substrate 11A may be electrically connected by introducing eight lead wires from the drive circuit 30 or the like. It may be configured to be driven independently.

  In the above embodiment and each modification, the light emitting element 12 is an SMD type LED element, but the present invention is not limited to this. For example, a COB (Chip On Board) type LED module in which a bare chip is directly mounted (primary mounting) on a substrate may be used. That is, the LED chip itself may be adopted as the light emitting element 12. In this case, the plurality of LED chips may be sealed collectively or individually by the sealing member. The sealing member may contain a wavelength conversion material such as a yellow phosphor as described above.

  Moreover, in said embodiment and each modification, although the light emitting element 12 was a B-Y type white LED element which discharge | releases white light with a blue LED chip and a yellow fluorescent substance, it does not restrict to this. For example, a phosphor-containing resin containing a red phosphor and a green phosphor may be used to emit white light by combining this with a blue LED chip. In addition to the yellow phosphor, a red phosphor or a green phosphor may be further mixed in order to improve color rendering. In addition, an LED chip that emits a color other than blue may be used, for example, an ultraviolet LED chip that emits ultraviolet light having a shorter wavelength than blue light emitted by the blue LED chip, mainly by ultraviolet light. The light emitting device may be configured to emit white light by a blue phosphor, a green phosphor and a red phosphor which are excited to emit blue light, red light and green light.

  In the above embodiment and each modification, the LED is exemplified as the light emitting element, but a semiconductor light emitting element such as a semiconductor laser, a light emitting element such as organic EL (Electro Luminescence) or inorganic EL, and other solid light emitting elements You may use.

  In addition, the embodiments obtained by applying various modifications that those skilled in the art would think to the above embodiment and modifications, or the components in the embodiments and modifications within the scope of the present invention An embodiment realized by combining functions arbitrarily is also included in the present invention.

1 LED bulb (light source for lighting)
10, 10A LED module (light emitting module)
Reference Signs List 20 globe 30 drive circuit 40, 40A, 40B, 40F, 40G, 40I heat sink 41, 41B, 41C, 41D, 41E first heat transfer plate 42, 42B, 42C, 42D, 42E, 42F second heat transfer plate 43 , 43A, 43B, 43C, 43D, 43E third heat transfer plate 50 housing 51 outer shell 52 inner shell 60 base 90 module plate

Claims (11)

A light emitting module,
A glove covering the light emitting module;
A drive circuit for causing the light emitting module to emit light;
A heat sink thermally coupled to the light emitting module and surrounding the drive circuit;
The heat sink has a first heat transfer plate, and a second heat transfer plate positioned inward of the first heat transfer plate and spaced apart from the first heat transfer plate. ,
The light emitting module is located on a heat transfer body connected to the first heat transfer plate ,
A light source for illumination, wherein the first heat transfer plate and the second heat transfer plate are connected at an end opposite to the glove side and not connected at the end on the glove side . The illumination light source according to claim 1, wherein the heat sink has a third heat transfer plate as the heat transfer body. The illumination light source according to claim 1, wherein the heat transfer body is a support that supports the light emitting module. Furthermore, it has a cap for receiving power for emitting light from the light emitting module,
The light source for illumination according to any one of claims 1 to 3, wherein the heat sink is disposed between the light emitting module and the base. The central axis direction of the length of the second light source the lighting in the heat transfer plate, wherein it is first half or in the central axis direction of the length of the illuminating light source in the heat transfer plate according to claim 1-4 The illumination light source according to any one of the above. The light source for illumination according to any one of claims 1 to 5 , wherein the first heat transfer plate and the second heat transfer plate have a cylindrical shape. The illumination light source according to claim 2, wherein the third heat transfer plate is integrally formed with the first heat transfer plate. The illumination light source according to claim 3, wherein the support is connected to the heat sink. The light source for illumination according to any one of claims 1 to 8 , further comprising a housing having an outer shell surrounding at least a part of the heat sink. The casing further has an inner shell portion sandwiching the first heat transfer plate and the second heat transfer plate with the outer shell portion,
The illumination light source according to claim 9 , wherein the inner shell surrounds the drive circuit. An illumination device comprising the illumination light source according to any one of claims 1 to 10 .

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