JP6512659B2 - Solder processing equipment - Google Patents

Description

  The present invention relates to a solder processing apparatus having a solder pot.

  In recent years, many electric devices are equipped with electronic circuits on which electronic components are mounted. In the process of forming an electronic circuit, soldering using a soldering iron is used. For example, the terminals and wires of the electronic component are inserted into through holes formed in the wiring substrate, and the tip portions thereof are soldered to a wiring pattern (land) formed around the through holes. Mounting and fixing to the wiring board are made.

  The soldering process is realized by supplying the solder heated and melted at the tip of the soldering iron to the wiring board. For example, in the apparatus disclosed in Patent Document 1, a solder piece is supplied into a cylindrical tip, and the supplied solder piece is heated and melted in the tip to perform soldering.

Patent No. 5184359 gazette

  However, in the conventional solder processing apparatus, a problem may occur in which the melted solder does not move to the wiring substrate side and stays in the tip.

  The present invention has been made in view of the above problems, and it is an object of the present invention to provide a solder processing apparatus in which molten solder in a tip of a solder surely moves to a substrate side and does not stay in the tip of a tin. is there.

  A solder processing apparatus according to the present invention is a solder processing apparatus for supplying solder onto a substrate to melt and fix it, including a supply hole as a path of the supply and for melting the supplied solder. And driving means for moving at least one of the substrate and the solder pot in the disengaging direction, and after the solder pot and the substrate are brought into contact with each other, the solder pot and the substrate are separated and separated. And a control unit configured to hold the state for a predetermined time. According to this configuration, the solder melted in the supply hole can be reliably moved to the substrate side.

  More specifically, as the above configuration, it is preferable that the control unit separates the solder weir and the substrate after the solder supplied to the solder weir melts.

  As a more specific configuration, it is preferable that the control unit separates the solder collar portion from the substrate after a predetermined time from the contact of the solder collar portion with the substrate.

  More specifically, as the above configuration, it is preferable to further include a detection unit that detects a contact between the solder pot portion and the substrate.

  The detection means is preferably a touch sensor.

  More specifically, as the above configuration, it is preferable to ventilate a gas into the supply hole and press out the solder in the supply hole to the substrate side.

  As the above-mentioned composition, more specifically, it is preferred that the separation distance of the above-mentioned solder collar part and the above-mentioned substrate is the range of 0.1 mm-3 mm.

  According to the solder processing apparatus according to the present invention, the molten solder in the supply hole of the solder pot portion reliably moves to the substrate side, and does not stay in the supply hole.

It is a perspective view which shows one Embodiment of the solder processing apparatus which concerns on this invention. It is a front view of the solder processing unit shown by FIG. It is a perspective view in a solder processing unit. It is a sectional view of a solder processing unit. It is explanatory drawing regarding a movement of a cutter upper blade. It is process drawing of soldering.

  Embodiments of the present invention will be described below with reference to the drawings. The content of the present invention is not limited to the embodiment. The directions of X, Y, and Z used in the following description are as shown in FIG.

[Whole composition of solder processing equipment]
1 is a perspective view showing one embodiment of a solder processing apparatus according to the present invention, FIG. 2 is a front view of a solder processing unit shown in FIG. 1, FIG. 3 is a perspective view inside a solder processing unit of FIG. FIG. 5 is a cross-sectional view of the solder processing unit of FIG. 3 cut along a plane P. FIG. 5 is an exploded perspective view of a part of a drive mechanism provided in the solder processing unit shown in FIG. 3. In FIG. 3, the exterior cover 81 and a part of the support portion 1 are cut to display the inside of the solder processing unit.

  As shown in FIG. 1, the solder processing apparatus A includes an articulated arm Am as a driving means, a solder processing unit U attached to the end of the articulated arm Am, and a jig Gj for fixing the wiring board Bd. . The solder pot portion Sa is exposed from the lower portion of the solder processing unit U. The articulated arm Am is capable of rotation around an axis extending in the Y direction, around an axis extending in the X direction, Y direction, movement in the Z direction and the X direction, and around the axis extending in the Z direction.

  The solder processing apparatus A supplies molten solder to the wiring board Bd attached to the jig Gj and the terminals of the electronic component Ep disposed on the wiring board Bd, and performs connection fixation. When soldering is performed, the articulated arm Am is moved in the X direction and the Y direction to position the solder ridge portion Sa of the solder processing unit U and the land Ld of the wiring board Bd. Then, by moving in the Z direction after positioning, the tip of the solder collar Sa can be brought into contact with the land Ld.

  As a result, the solder pot portion Sa attached to the tip of the multi-joint arm Am can freely contact and move away from the wiring board Bd, and soldering to a desired location on the wiring board Bd becomes possible. The specific process of soldering will be described later. The contact and separation between the solder potting portion Sa and the wiring substrate Bd may be performed by moving the jig Gj along with the movement of the articulated arm Am. Conversely, the solder processing unit U is fixed and the jig Gj is fixed. You may move it.

[Solder processing unit]
As shown in FIG. 2, the solder processing unit U includes a unit body 8 and a support frame 9. A support frame 9 is attached to the articulated arm Am. The support frame 9 has an upper frame portion 91 and a lateral frame portion 92. The unit body 8 is movably attached in the vertical direction by two slide bearings 93a and 93b which are attached to the horizontal frame portion 92 of the support frame 9 so as to be separated in the vertical direction. A tension coil spring 95 is interposed between the upper frame 91 of the support frame 9 and the unit body 8, and the unit body 8 is suspended by the tension coil spring 95. The downward movement of the unit body 8 is restricted by the stopper portion 94 formed on the lateral frame 92.

  Further, a touch sensor S is attached to the upper frame 91, and a contact portion 82 is formed at a position facing the touch sensor S on the unit body side. The unit body 8 is covered by the exterior cover 81, and the solder collar Sa is exposed from the lower surface of the exterior cover 81. The combination of the heater unit 4 and the tip 5 constitutes a solder pot portion Sa.

  In FIG. 2, the electronic component Ep is disposed on the lower surface side of the wiring substrate Bd, and the pin P of the electronic component Ep is inserted through the through hole and protrudes from the upper surface of the wiring substrate Bd. A land Ld is formed around the through hole. In soldering between the pin P and the land Ld, the control unit C drives the articulated arm Am to move the solder processing unit U (solder ridge portion Sa) based on previously input data, and the land Ld of the wiring board Bd After the tip 5 is positioned above, the tip 5 is moved downward to bring the tip 5 into contact with the wiring board Bd.

  The contact between the tip 5 and the wiring board Bd is performed by the touch sensor S. That is, when the tip 5 contacts the wiring board Bd, the unit body 8 moves upward relative to the support frame 9, and the contact portion 82 of the unit body 8 abuts on the touch sensor S and the touch sensor S Signals to the control unit C. The tip 5 may be brought into contact with the wiring board Bd by drive control of the articulated arm Am based on previously input data without using the touch sensor S. However, it is desirable to provide the touch sensor S because there is a possibility that a defect that the tip 5 does not contact the wiring board Bd may occur due to the bending or dimensional accuracy of the wiring board Bd. In the embodiment, the touch sensor S is a switch whose contact is turned on and off when in contact with the touch sensor S. However, a displacement sensor that continuously detects a change in position by electrical resistance or a load sensor using a strain gauge may be used. The force of the tension coil spring 95 acts upward against the weight of the unit body 8 to reduce the load when the tip 5 contacts the wiring board Bd. Therefore, the function of relieving the impact when the tip 5 contacts the wiring board Bd is exhibited.

[Unit body 8]
As shown in FIG. 3, the internal structure of the unit body 8 is such that the solder wire W is supplied from above and soldered using a tip 5 provided at the bottom. The unit body 8 includes a support portion 1, a cutter mechanism 2, a drive mechanism 3, a heater unit 4, a tip 5 and a solder feed mechanism 6. In addition, in FIG. 3, in consideration of the viewability of the drawing, a part of the support portion 1 is cut and displayed. Although not shown in FIGS. 3 and 4, the solder processing apparatus A is provided with a generation and supply device of an inert gas such as nitrogen.

  The support portion 1 is provided with a flat wall 11 erected. The cutter mechanism 2 is for cutting the wire solder W fed by the solder feeding mechanism 6 into solder pieces of a predetermined length. The cutter mechanism 2 includes a cutter lower blade 22 fixed to the sliding guide 13 and a cutter upper blade 21 disposed above the cutter lower blade 22 and slidably disposed. Further, the cutter mechanism 2 includes a pusher pin 23 which is driven in the vertical direction (direction intersecting with the sliding direction of the cutter upper blade 21) by a second actuator 32 of the drive mechanism 3 described later (see FIG. 4). ).

  As shown in FIG. 4, the cutter upper blade 21 is an upper blade hole 211 which is a through hole into which the solder wire W fed by the solder feeding mechanism 6 is inserted, and a through hole into which the pusher pin 23 is inserted. And a pin hole 212. The edge of the lower end of the upper blade hole 211 is formed in the shape of a cutting edge.

  The lower cutter blade 22 is provided with a lower blade hole 221 which is a through hole into which the solder wire W penetrating the upper blade hole 211 is inserted. The edge of the upper end of the lower blade hole 221 is formed in the shape of a cutting edge. The upper blade holes 211 and the lower blade holes 221 are cut in a direction intersecting with the wire solder W in a state where the wire solder W is inserted, so that the wire solder W is cut into solder pieces by the respective cutting edges.

  The upper blade hole 211 and the pin hole 212 are provided side by side in the sliding direction of the cutter upper blade 21. The cutter upper blade 21 slides between a position where the upper blade hole 211 and the lower blade hole 221 vertically overlap and a position where the pin hole 212 and the lower blade aperture 221 vertically vertically.

  As shown in FIG. 4, the drive mechanism 3 is fixed to the lower cutter blade 22 and has a first actuator 31 for sliding the upper cutter blade 21 and a second actuator attached to the upper cutter blade 21 for driving the pusher pin 23. It has 32 and.

  The first actuator 31 includes a cylinder 311 fixed to the lower cutter blade 22 and a piston rod 312 disposed inside the cylinder 311 and capable of expanding and contracting with the pressure of supplied air. The tip portion of the piston rod 312 is fixed to the cutter upper blade 21, and the cutter upper blade 21 slides by the expansion and contraction operation of the piston rod 312.

  In the unit body 8 shown in FIG. 4, when the piston rod 312 of the first actuator 31 protrudes most from the cylinder 311, the upper cutter edge 21 is at the left end in the figure, and the upper blade hole 211 is up and down with the lower blade hole 221. It is supposed to overlap with the Further, as shown in FIG. 5, when the piston rod 312 is stored in the cylinder 311, the cutter upper blade 21 moves to the right end in the figure, and the pin hole 212 vertically overlaps with the lower blade hole 221.

  The second actuator 32 includes a cylinder 321 fixed to the cutter upper blade 21 and a piston rod 322 disposed inside the cylinder 321 and capable of expanding and contracting with air pressure. The pusher pin 23 is fixed to the end of the piston rod 322.

  The second actuator 32 inserts the pusher pin 23 into the lower blade hole 221 by extending the piston rod 322 when the pin hole 212 and the lower blade hole 221 overlap vertically, thereby inserting the piston rod 322. The pusher pin 23 is removed from the lower blade hole 221 by being accommodated in the cylinder 321. Even when the solder pieces cut by the cutter mechanism 2 remain in the lower blade holes 221, they are pushed out by the operation of the pusher pins 23.

  The solder feeding mechanism 6 is for feeding the solder wire W, and comprises a pair of feed rollers 61 for feeding the wire solder W, and a guide tube 62 for guiding the thread solder W fed by the feed roller 61. The pair of feed rollers 61 are attached to the support portion 1 and sandwich the solder wire W and send the solder wire W downward by rotating. The feed roller 61 determines the length of the fed solder wire by the rotation angle (rotational speed).

  The guide tube 62 is a tube which can be elastically deformed, and the upper end thereof is disposed in the vicinity of the portion of the feed roller 61 from which the wire solder W is fed. Further, the lower end of the guide tube 62 moves following the slide of the cutter upper blade 21 and is connected to the upper blade hole 211. The guide tube 62 is provided so as not to be pulled or stretched in a range in which the upper cutter blade 21 slides.

  At the lower part of the lower cutter blade 22, a ventilation path 225 for feeding nitrogen or air into the lower blade hole 221 is provided. As shown in FIGS. 3 and 4, the solder collar Sa is fixed to the lower side of the cutter mechanism 2. The details of the solder pot portion Sa will be described below.

  The solder pot portion Sa includes a heater unit 4 and a tip 5 attached to the heater unit 4. As shown in FIG. 4, the heater unit 4 includes a heater 41 that generates heat when energized, a heater block 42 for attaching the heater 41, and a heater block holding unit 43 that holds the heater block 42.

  The heater block 42 has a cylindrical shape, and the heater 41 is wound around the outer peripheral surface. The heater block 42 is provided with a recess 421 having a circular cross section for attaching the tip 5 to the lower end in the axial direction, and a solder supply hole 422 penetrating from the center of the bottom of the recess 421 to the opposite side.

  The heater block holder 43 includes a through hole formed in a flat plate-like main body. The heater block 42 is held by the heater block holder 43 by press-fitting the heater block 42 into the through hole. By attaching the heater block holding portion 43 to the support portion 1, the solder collar portion Sa is fixed to the support portion 1. As shown in FIG. 4, the lower blade hole 221 of the lower cutter blade 22 communicates with the solder supply hole 422 of the heater block 42.

  The tip 5 is a non-wettable member to solder, and has a cylindrical shape extending in the vertical direction (axial direction). A solder hole (supply hole) 51 extending in the axial direction is formed in the central portion of the tip 5. The tip 5 is preferably made of a material having high thermal conductivity, for example, a ceramic such as silicon carbide or aluminum nitride, or a metal such as tungsten.

  The tip 5 is attachable to and detachable from the main body of the solder potion Sa, and at the time of mounting, the upper end is inserted into the recess 421 of the heater block 42, and the lower end protrudes downward from the heater block 42. In this state, the solder holes 51 of the tip 5 communicate with the solder supply holes 422. The wire solder cut by the cutter mechanism 2 is supplied from the lower blade hole 221 to the solder hole 51 through the solder supply hole 422.

  When soldering is performed at the solder potion Sa, the heat of the heater 41 is transmitted through the heater block 42, and the heat melts the solder pieces supplied to the solder holes 51. According to the unit body 8, it is possible to perform soldering in a state where the tip of the cylindrical tip 5 is in contact with the land Ld of the wiring board Bd. Thereby, it is possible to suppress scattering of solder, flux fumes, and the like.

  The solder pot portion Sa is provided with a first thermocouple 71 (hereinafter, may be referred to as “temperature detection means”) disposed to detect the temperature of the tip 5. The detection result of the temperature of the tip 5 by the temperature detection means is used as information for appropriately controlling the heating by the heater 41 so as to melt the solder piece and enable soldering.

  The solder pot portion Sa is also provided with a second thermocouple 72 arranged to detect the temperature of the heater block 42, and is used for applications such as controlling heating by the heater 41 more accurately. In addition, installation of the 2nd thermocouple 72 may be abbreviate | omitted, and means other than a thermocouple may be utilized as a means to detect the temperature of the tip 5. FIG.

  Further, the solder processing apparatus A is provided with a control unit C (shown in FIG. 2) that controls various operations so that the apparatus functions properly. The control unit C includes, for example, a logic circuit such as an MPU or a CPU, and has a function of controlling the first actuator 31, the second actuator 32, the heater 41, the roller 61, and the like. The control unit C also has a function of controlling the movement of the solder processing unit U (including the solder collar portion Sa) by the articulated arm Am, and further continuously acquires the detection result of the temperature detection means. Is possible.

  More specifically, the control unit C uses the process of moving the solder processing unit U (including the solder collar portion Sa) to a predetermined position by the articulated arm Am, and the solder piece supplied in the tip 5 Each part of the solder processing apparatus A is controlled such that a soldering process for soldering is appropriately performed.

[Soldering process]
The soldering process of the solder processing apparatus according to the present invention will be described based on FIG. The control unit C drives the articulated arm Am so that the tip of the tip 5 contacts the wiring board Bd (FIG. 6A). The contact between the wiring board Bd and the tip 5 is detected by the touch sensor S as described above. Then, based on the detection signal from the touch sensor S, the control unit C stops driving of the articulated arm Am. At this time, the load of the difference between the weight of the unit body 8 and the tensile force of the tension coil spring 95 acts on the wiring board 5 from the tip 5 to keep the wiring board Bd in contact with the tip 5. Thereafter, the control unit C controls the roller 61 and the respective actuators (31, 32) so that the solder piece W is cut out from the wire solder so that the solder piece W is supplied to the solder hole 51 of the tip 5 (FIG. 6 (b)).

  Further, the control unit C controls heating by the heater 41 so that the temperature at which the solder piece W melts before the solder piece W is turned on, and soldering using the solder piece W is performed on the wiring board Bd It is made to be achieved (FIG. 6 (c)). In addition, the control part C heat-controls the heater 41 in this case, for example so that the temperature of the tip 5 may be about 400 degreeC. The melted solder piece moves to the lower part of the tip 5 due to its weight or ventilation pressure, but if there is no gap between the tip 5 and the land Ld of the wiring board 5 before the insertion of the solder piece In some cases, the end of the tip 5, that is, the wiring board Bd is not sufficiently filled with the gas existing in the above.

  Therefore, the control unit C drives the articulated arm Am to separate the tip 5 from the wiring board Bd by a predetermined distance d (FIG. 6 (d)). Then, this separated state is held for a predetermined time. Thereby, a gap is generated between the tip 5 and the land Ld. Therefore, when the molten solder remains in the solder hole 51 of the tip 5, the molten solder flows down to the wiring board Bd with certainty. It can be done.

  In addition, when performing the melting process of the solder piece W, an inert gas such as nitrogen is used so as not to oxidize the solder piece inside the solder hole 51 or to discharge flux fume (smoke) etc. from the solder hole 51 to the outside. Are supplied into the solder holes 51. The inert gas supplied into the solder hole 51 is discharged from the discharge hole 52 formed in the peripheral wall of the tip 5. It is desirable to continuously ventilate the inert gas into the solder holes 51 even after the tip 5 is separated from the wiring board Bd. Thereby, the inert gas ventilating the inside of the solder hole 51 is blown out from the lower surface opening of the tip 5, and the molten solder remaining in the solder hole 51 is pressed out to the wiring board Bd side by the inert gas. .

  Here, the separation distance d between the wiring board Bd and the tip 5 is not particularly limited, and the inert gas may be exhausted from the gap between the wiring board Bd and the tip 5. Usually, the range of 0.1 mm to 3 mm is preferable, and more preferably in the range of 0.5 mm to 2 mm. Further, as a time for maintaining the separated state of the wiring board Bd and the tip 5, it is sufficient in 0.1 second to 2 seconds, preferably about 0.2 to 1 second.

  It is desirable that the timing for separating the blade tip 5 from the wiring board Bd be after the solder piece W supplied to the blade tip 5 is melted. If the tip 5 is separated from the wiring board Bd before the solder piece W melts, the temperature of the solder piece W may decrease due to contact with the outside air, and the melting may be incomplete, resulting in a soldering defect. is there.

  The elapsed time from when the tip 5 contacts the wiring board Bd can be used as one indicator of whether the solder piece W in the tip 5 has melted. The time from the supply of the solder piece W into the tip 5 to the melting thereof can be predicted from the shape and volume of the solder piece W, the heating temperature of the tip 5 and the like. Moreover, it can also measure by a preliminary experiment etc. Therefore, the melting failure of the solder piece W can be prevented by separating the tip 5 from the wiring board after a predetermined time from when the tip 5 contacts the wiring board Bd.

  A detection means may be provided to detect whether or not the solder piece W in the tip 5 has melted. As such a melting detection means, the configuration described in Japanese Patent Application No. 2014-234269 proposed by the present applicant can be used in the present invention.

  The control unit C moves the solder processing unit U to the next soldering processing position after separating the blade tip 5 from the wiring substrate Bd by a predetermined distance and holding it for a predetermined time. Then, the series of soldering steps shown in FIGS. 6A to 6D are repeated.

  If the touch sensor S does not detect contact with the wiring board Bd despite the fact that the driving amount set by the control unit C is sent using the touch sensor S, the wiring board Bd is not supplied, etc. It is determined that the positional relationship between the solder processing unit U and the wiring board Bd is not appropriate. When the touch sensor S detects a contact despite the fact that the drive amount has not reached the set value, the solder processing unit U and the wiring board Bd are in the same manner as described above, such as contact with components on the wiring board Bd. Judge that the positional relationship with is not appropriate. When the above abnormality is detected, it is also possible to notify the abnormality or to stop the soldering process.

  In the embodiment described above, the solder processing unit U is moved in a state in which the wiring board Bd is fixed, but the solder processing unit U may be fixed and the wiring board Bd may be moved. It is good also as a form which moves both sides of wiring board Bd.

  As mentioned above, although the solder processing apparatus which concerns on this invention was demonstrated based on figures, this invention is not limited to this content. Moreover, the embodiment of the present invention can add various modifications without departing from the spirit of the invention.

  The present invention is applicable to, for example, a solder processing apparatus that performs soldering automatically.

DESCRIPTION OF SYMBOLS 1 support part 11 wall 13 sliding guide 2 cutter mechanism 21 cutter upper blade 211 upper blade hole 212 pin hole 22 cutter lower blade 221 lower blade hole 23 pusher pin 3 drive mechanism 31 first actuator 311 cylinder 312 piston rod 32 second Actuator 321 Cylinder 322 Piston rod 4 Heater unit 41 Heater 42 Heater block 421 Recess 422 Solder supply hole 43 Heater block holding part 5 Tip 51 Solder hole (supply hole)
52 Discharge hole 6 Solder feed mechanism 61 Feed roller 62 Guide tube 71 First thermocouple 72 Second thermocouple A Solder processing device Sa Solder ridge W Wire solder (solder piece)
Bd wiring board Ep electronic components Ld land

Claims (7)

A solder processing apparatus for supplying solder pieces onto a substrate for melting and fixing,
A solder pot having a supply hole which is a path of the supply, and melting the supplied solder piece ;
Driving means for moving at least one of the substrate and the solder pot in the disengaging direction;
Contacting the substrate and the solder 鏝部, after melting the solder pieces supplied to the solder鏝部, and the substrate and the solder鏝部by a predetermined distance apart, thereby the separated state is maintained for a predetermined time A solder processing apparatus comprising: a control unit.   2. The solder processing apparatus according to claim 1, wherein the control unit separates the solder potion from the substrate after a predetermined time from when the solder potion contacts the substrate. Soldering apparatus according to claim 1 or 2 further comprising detection means for detecting contact between the substrate and the solder鏝部. The solder processing apparatus according to claim 3 , wherein the detection unit is a touch sensor. The solder processing apparatus according to any one of claims 1 to 4 , wherein a gas is ventilated in the supply hole, and the melted solder piece in the supply hole is pressed out to the substrate side. The solder processing apparatus according to any one of claims 1 to 5 , wherein a separation distance between the solder pot portion and the substrate is in a range of 0.1 mm to 3 mm. The solder processing apparatus according to any one of claims 1 to 6, wherein a time for which the separated state between the solder pot portion and the substrate is held is in a range of 0.1 seconds to 2 seconds.