JP6517032B2 - Thermosetting adhesive composition, and thermosetting adhesive sheet - Google Patents

Description

  The present invention relates to a conductive thermosetting adhesive composition for connecting and reinforcing a ground terminal of a flexible printed wiring board to a metal plate, and a thermosetting adhesive sheet.

  2. Description of the Related Art Conventionally, a flexible printed wiring board is adhered to a metal plate and reinforced, and a ground terminal of the flexible printed wiring board is grounded to a metal plate and shielded. A conductive thermosetting adhesive composition is used for bonding the flexible printed wiring board and the metal plate (see, for example, Patent Document 1).

  Moreover, gold plating is given to a ground terminal etc., and the improvement of the adhesive force with respect to a gold plating surface is desired. Although it is effective to contain sulfur to improve the adhesion to the gold-plated surface, it is difficult to improve the adhesion because the rubber component blended to form a sheet is vulcanized.

JP, 2011-79959, A

  The present invention has been proposed in view of such conventional circumstances, and provides a thermosetting adhesive composition and a thermosetting adhesive sheet capable of obtaining high adhesion to a gold-plated surface.

  As a result of intensive studies, the inventor of the present invention adds an epoxy resin having an aromatic thioether skeleton, and adds a predetermined amount of a rubber component to the total of the epoxy resin and the polyamide resin to vulcanize the rubber component. It was found that it is suppressed and high adhesion to a gold-plated surface can be obtained.

That is, the thermosetting adhesive composition according to the present invention contains a rubber component, an epoxy resin, a polyamide resin, and an epoxy resin curing agent, and the epoxy resin contains an epoxy resin having an aromatic thioether skeleton. the content of the rubber component, relative to the epoxy resin 15 to 60 parts by weight, Ri 75 to 120 parts by mass der, the rubber component, characterized in that it comprises a nitrile rubber, an acrylic rubber.

Moreover, the thermosetting adhesive sheet according to the present invention contains a rubber component, an epoxy resin, a polyamide resin, and an epoxy resin curing agent, and the epoxy resin contains an epoxy resin having an aromatic thioether skeleton, the content of the rubber component, relative to the epoxy resin 15 to 60 parts by weight, Ri 75 to 120 parts by mass der, the rubber component, characterized in that it comprises a nitrile rubber, an acrylic rubber.

  According to the present invention, the vulcanization of the rubber component is suppressed, and high adhesion to the gold-plated surface can be obtained.

FIG. 1 is a perspective view showing a connection method using a thermosetting adhesive sheet. FIG. 2 is a cross-sectional view of a connection structure using a thermosetting adhesive sheet.

Hereinafter, embodiments of the present invention will be described in detail in the following order with reference to the drawings.
1. Thermosetting adhesive composition2. Thermosetting adhesive sheet 3. Example

<1. Thermosetting adhesive composition>
The thermosetting adhesive composition according to the present embodiment contains a rubber component (A), an epoxy resin (B), a polyamide resin (C), and an epoxy resin curing agent (D). Hereinafter, each component (A)-(D) of a thermosetting adhesive composition is demonstrated in detail.

[(A) rubber component]
The rubber component imparts film formability at the time of film formation, and imparts flexibility and toughness to the cured product. As a rubber component, acrylic rubber (ANM: copolymer of alkyl (meth) acrylate and acrylonitrile (AN)), nitrile rubber (NBR: acrylonitrile-butadiene rubber), styrene butadiene rubber (SBR), butadiene rubber (BR) Among these, one of them may be used alone, or two or more of them may be used in combination. Among these, it is preferable to use a nitrile rubber and an acrylic rubber in combination.

  Nitrile rubber is excellent in mechanical performance and elasticity, and thus can improve temporary tackability. The addition amount of the nitrile rubber is preferably 15 to 35 parts by mass with respect to 75 to 120 parts by mass of the rubber component. If the addition amount is too small, the temporary sticking property tends to decrease, and if the addition amount is too large, the conduction resistance tends to increase in a high temperature environment or a high temperature and high humidity environment.

  The acrylic rubber is preferably a copolymer of alkyl (meth) acrylate, acrylonitrile (AN) and glycidyl methacrylate (GMA). Here, (meth) acrylate means acrylate (acrylic acid ester) or methacrylate (methacrylic acid ester).

  The alkyl (meth) acrylate can be appropriately selected and used from those used in conventional acrylic thermosetting adhesives applied to the field of electronic components. Alkyl (meth) acrylates having 12 alkyl groups can be used. Specific examples include methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, butyl (meth) acrylate, isobutyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, octyl (meth) acrylate and isooctyl (Meth) acrylate, isononyl (meth) acrylate, lauryl (meth) acrylate and the like, and one of them may be used alone, or two or more may be used in combination. Among these, it is preferable to use ethyl acrylate (EA), butyl acrylate (BA) and 2-ethylhexyl acrylate (2EHA).

  The amount of the alkyl (meth) acrylate in all the monomers constituting the acrylic rubber is preferably 55 to 80 wt% because the basic properties tend to decrease when the amount is too small, and the heat resistance tends to decrease when the amount is too large.

  Also, the amount of acrylonitrile (AN) in all the monomers constituting the acrylic rubber is preferably 15 to 30% by weight because the heat resistance decreases when the amount is too small, and the amount tends to be difficult to dissolve in the solvent when the amount is too large. .

  In addition, the amount of glycidyl methacrylate (GMA) in all the monomers constituting the acrylic rubber is preferably 5 to 15 wt% because the heat resistance tends to decrease when the amount is too small and the peel strength tends to decrease when the amount is too large. .

  The polymerization method of the acrylic rubber is not particularly limited, but it is preferable to use pearl polymerization from the viewpoint of obtaining high molecular weight. When the weight average molecular weight of the acrylic copolymer is too small, the heat resistance is lowered, and when it is too large, the solution viscosity tends to increase and the coatability tends to deteriorate, so 500000 to 700000, preferably 55000 to 650,000. It is.

  The content of the rubber component (A) is 75 to 120 parts by mass with respect to 15 to 60 parts by mass of the epoxy resin (B). When the rubber component is in the above-mentioned range, it is possible to form a sheet into a film, and it is possible to improve the adhesive strength.

[(B) epoxy resin]
The epoxy resin forms a three-dimensional network structure, imparts good heat resistance and adhesiveness, and includes an epoxy resin having an aromatic thioether skeleton. By containing the epoxy resin having an aromatic thioether skeleton, it is possible to suppress the vulcanization of the rubber component and obtain high adhesion to the gold-plated surface. As an epoxy resin which has aromatic thioether frame | skeleton, the epoxy resin shown, for example by following General formula (I) is mentioned.

  In general formula (I), R represents a hydrogen atom or a monovalent organic group having 1 to 18 carbon atoms, and all of them may be the same or different. n is an average value and represents a positive number of 0 to 10. Among the epoxy resins represented by the general formula (I), the tert-butyl group is the tert-butyl group at the 3,3'-position when the position substituted by the oxygen atom in R is 4 and 4'-position, It is preferable to use an epoxy resin in which the 'position is a methyl group and the other is a hydrogen atom. As a commercial item of the epoxy resin which has aromatic thioether frame, the brand name "YSLV-120TE" (Nippon Steel Sumikin Chemical Co., Ltd.) etc. are mentioned, for example.

  In addition to the epoxy resin having an aromatic thioether skeleton, it is preferable that another epoxy resin is further contained. Other epoxy resins include, for example, bisphenol type epoxy resins such as bisphenol A type, bisphenol F type, bisphenol AD type and bisphenol S type; novolac type epoxy resins such as phenol novolac type and cresol novolac type; trisphenol methane triglycidyl Aromatic epoxy resins such as ether, etc .; naphthalene type epoxy resin, biphenyl type epoxy resin, fluorene type epoxy resin, dicyclopentadiene type epoxy resin, resorcinol type epoxy resin, etc. may be mentioned. Or two or more kinds can be used in combination. Among these, it is preferable to use a dicyclopentadiene type epoxy resin. As a commercial item of a dicyclopentadiene type epoxy resin, the brand name "HP7200" (DIC Corporation) etc. are mentioned, for example.

  The content of the epoxy resin (B) is preferably 15 to 60 parts by mass with respect to 75 to 120 parts by mass of the rubber component (A). Moreover, it is preferable that content of the epoxy resin which has aromatic thioether frame | skeleton is 5-20 mass parts with respect to 15-60 mass parts of epoxy resin (B). As a result, excellent adhesion to metals such as gold, SUS, and aluminum can be obtained.

[(C) polyamide resin]
The polyamide resin has a reactive functional group at the end. Thereby, since it is possible to crosslink with the epoxy resin, heat resistance is improved, and high adhesion to metals such as SUS, aluminum, gold and the like can be obtained.

  As a reactive functional group, an amino group which reacts with an epoxy resin, a carboxyl group, a hydroxyl group etc. are mentioned. Among these, it is particularly preferable to use a polyaminoamide having an amino group at the end.

  If the content of the polyamide resin (C) is too small, the peel strength is reduced, and if too large, the toughness tends to be reduced. Therefore, the content of the polyamide resin (C) is 15 to 60 mass of epoxy resin (B) It is preferable that it is 5-15 mass parts with respect to a part.

[(D) Epoxy resin curing agent]
As an epoxy curing agent, a commonly used known curing agent can be used. For example, organic acid dihydrazide, dicyandiamide, amine compound, polyamidoamine compound, cyanate ester compound, phenol resin, acid anhydride, carboxylic acid, tertiary amine compound, imidazole, Lewis acid, Bronsted acid salt, polymercaptan hardener And urea resins, melamine resins, isocyanate compounds, blocked isocyanate compounds, latent curing agents and the like, and one of them may be used alone or in combination of two or more. Among these, it is preferable to use an organic acid dihydrazide from the viewpoint of storage stability at normal temperature.

  Since the organic acid dihydrazide is solid at normal temperature, the normal temperature storage stability of the thermosetting adhesive composition can be improved. As the organic acid dihydrazide, for example, adipic acid dihydrazide, oxalic acid dihydrazide, malonic acid dihydrazide, succinic acid dihydrazide, iminodiacetic acid dihydrazide, pimelic acid dihydrazide, suberic acid dihydrazide, azelaic acid dihydrazide, sebacic acid dihydrazide, dodecanediohydrazide, hexadecane dihydrazide Maleic acid dihydrazide, fumaric acid dihydrazide, diglycolic acid dihydrazide, tartaric acid dihydrazide, malic acid dihydrazide, isophthalic acid dihydrazide, terephthalic acid dihydrazide, 2,6-naphthoic acid dihydrazide, 4,4'-bisbenzene dihydrazide, 1,4- Examples include naphthoic acid dihydrazide, amicure VDH, amicure UDH (trade name, manufactured by Ajinomoto Co., Ltd.), citric acid trihydrazide and the like. One from among these alone or may be used in combination of two or more. Among these, it is preferable to use adipic acid dihydrazide in that it has a relatively low melting point, is excellent in the balance of curability, and is easy to obtain.

  The average particle diameter of the organic acid dihydrazide is preferably 0.5 to 15 μm, more preferably 1 to 5 μm. When the average particle size is too small, when an organic solvent is used to apply the thermosetting adhesive composition, the organic acid dihydrazide particles tend to dissolve and storage stability at normal temperature decreases, and when the average particle size is too large The coatability of the thermosetting adhesive composition is lowered, and the particle size is large, which makes it difficult to sufficiently mix it with the acrylic copolymer or the epoxy resin.

  If the content of the epoxy resin curing agent (D) is too small, unreacted epoxy groups remain and crosslinking is not sufficient, so the heat resistance and adhesion decrease, and if too large, the excess curing agent remains unreacted. Since the heat resistance and the adhesiveness tend to be lowered because they remain, it is preferably 7 to 12 parts by mass with respect to 15 to 60 parts by mass of the epoxy resin (B).

[Conductive filler]
Moreover, by mix | blending a conductive filler with a thermosetting adhesive composition, it can be used suitably as a conductive adhesive which has high adhesive force with respect to gold plating surfaces, such as a ground terminal. Examples of the conductive filler include particles of various metals and metal alloys such as nickel, copper, aluminum, tin, lead, chromium, cobalt, silver, and gold. In addition, copper-coated copper powder, silver-coated copper powder, gold-coated copper powder, silver-coated nickel powder, gold-coated nickel powder, etc. in which various metals are coated on the surface of metal particles by electrolytic method, liquid phase reduction method, etc. It is also good. Moreover, as a shape of a conductive filler, spherical shape, flaky shape, filamentous shape, dendritic shape (dendritic) etc. are mentioned, for example, It may use individually by 1 type or in combination of 2 or more types out of these. it can. Among these, it is preferable to use a dendritic conductive filler from the viewpoint of increasing the number of electrical contacts.

  Here, the dendritic shape is also referred to as dendrite, and means a shape like a branch of a tree, and has a main branch and a side branch. Since the main branch and the side branch of the dendritic conductive filler tend to entangle each other, it is possible to suppress the lowering of the electrical contact against the separation of the conductive fillers in the conductive layer due to bending or deformation.

Moreover, the tap density of the dendritic conductive filler is 1.0~1.8g / cm ^3, it is more preferably at 1.1~1.6g / cm ^3. If the tap density is too low, the resin flow (protruding) of the thermosetting adhesive composition by the hot press tends to increase, and if the tap density is too high, the filling of the conductive filler becomes excessive, and the high temperature environment or high temperature high humidity The continuity stability under the environment tends to decrease. The tap density is measured by the method defined in JIS Z 2512. Specifically, it is a density obtained by placing a specified amount of powder in a container, tapping using a tapping device until the volume of the powder does not decrease any further, and dividing the mass of the powder by the volume of the powder after tapping.

  The dendritic conductive filler can be obtained, for example, by forming a main branch and a side branch on the metal powder by an electrolytic method, a liquid phase reduction method or the like. As metal powder, copper powder, silver powder, nickel powder etc. are mentioned, As a main branch and a side branch, copper, silver, gold etc. are mentioned. That is, as a dendritic conductive filler, copper-coated copper powder, silver-coated copper powder, gold-coated copper powder, silver-coated nickel powder, gold-coated nickel powder, etc. may be mentioned, and among these, silver-coated copper powder is used Is preferred.

The average particle size of the conductive filler is preferably 3 to 20 μm, more preferably 5 to 15 μm. When the average particle size is too small, it is difficult to secure conductivity, and when the average particle size is too large, it becomes difficult to thin the film. Here, the average particle diameter of the conductive filler is, for example, a particle diameter D ₅₀ of 50% of the under-sieve integrated fraction calculated from the particle diameter distribution measurement result by the laser diffraction scattering method. Moreover, since there exists a tendency for conductivity to fall, too little or too much, content of a conductive filler is 180-260 mass parts with respect to 15-60 mass parts of epoxy resin (B). preferable.

[Other additives]
Further, as other additives to be added to the thermosetting adhesive composition, as necessary, organic fillers, inorganic fillers, heat conductive particles, film forming resins, monomers for dilution such as various acrylic monomers, fillers, softening, Agents, colorants, flame retardants, thixotropic agents, silane coupling agents, etc. may be blended.

  Since a thermosetting adhesive composition composed of such components contains an epoxy resin having an aromatic thioether skeleton, it prevents vulcanization of the rubber component and obtains high adhesion to a gold-plated surface. be able to.

<2. Thermosetting adhesive sheet>
The thermosetting adhesive sheet according to the present embodiment contains a rubber component (A), an epoxy resin (B), a polyamide resin (C), and an epoxy resin curing agent (D). Since each component (A)-(D) is the same as that of the above-mentioned thermosetting adhesive composition, description is abbreviate | omitted here.

  The above-mentioned thermosetting adhesive composition can be prepared by mixing uniformly by a conventional method. Then, the thermosetting adhesive composition is applied on a substrate film by a bar coater or a roll coater so that the dry thickness is 10 to 60 μm, and the thermosetting adhesive layer having a thermosetting adhesive layer is dried by an ordinary method. Adhesive sheet can be manufactured.

  As a base film, the peeling base material which carried out the release process by silicone etc. can be used with respect to base materials, such as a polyethylene terephthalate film and a polyimide film, as needed.

  Such a thermosetting adhesive sheet is, for example, a terminal portion of a flexible printed wiring board and a reinforcing sheet having a thickness of 50 μm to 2 mm, such as polyethylene terephthalate, polyimide, glass epoxy, stainless steel, or aluminum, for backing the terminal. It is preferably applicable for adhesive fixing. Moreover, since it can be made to closely_contact | adhere with the reinforcement sheet | seat easily by heat lamination, workability | operativity can be improved.

  FIG.1 and FIG.2 is a figure which shows the example of a connection using a thermosetting adhesive sheet. As shown in FIGS. 1 and 2, in the connection structure using a thermosetting adhesive sheet, the flexible printed wiring board 10 and the metal plate 30 are adhered by the thermosetting adhesive sheet 20.

  In the flexible printed wiring board 10, the base 12, the wiring 13, the adhesive layer 14, and the protective layer 15 are stacked in this order, and have the ground terminal 11 at the end. The flexible printed wiring board 10 is made of, for example, polyimide as the base 12, copper as the wiring 13, and polyimide as the protective layer 15, and the surface of the ground terminal 11 is plated with gold.

  By bonding the flexible printed wiring board 10 to the metal plate 30 using the thermosetting adhesive sheet 20, the flexible printed wiring board 10 is reinforced, and the ground terminal 11 of the flexible printed wiring board 10 is grounded to the metal plate 30. , Can be shielded. In particular, since the thermosetting adhesive sheet described above contains an epoxy resin having an aromatic thioether skeleton, it can prevent vulcanization of the rubber component and can obtain high adhesion to a gold-plated surface, which is high. A reliable connection structure can be obtained.

<3. Example>
In this example, a thermosetting adhesive sheet was produced, and the adhesion to a gold-plated substrate and a SUS substrate was verified. The thermosetting adhesive sheet prepared the thermosetting adhesive composition using the following components. A thermosetting adhesive sheet having a thermosetting adhesive layer applied to a release-treated polyethylene terephthalate film (PET), dried in a drying oven at 50 to 130 ° C., and having a thickness of 35 μm. Was produced. And the test piece was produced using the thermosetting adhesive sheet, and peeling strength was measured as adhesive force of a thermosetting adhesive sheet.

NBR: Nipole 1001, Nippon Zeon Co., Ltd.
Acrylic rubber: Acrylic copolymer obtained by copolymerizing butyl acrylate (BA), alkyl (meth) acrylate 66 wt% containing ethyl acrylate (EA), 24 wt% acrylonitrile (AN), and 10 wt% glycidyl methacrylate (GMA) Thioether Type epoxy resin: YSLV-120TE, Nippon Steel Sumikin Chemical Co., Ltd., solid type alicyclic epoxy resin: HP 7200, DIC, DCPD type bisphenol F type epoxy resin: EP 806, Mitsubishi Chemical Corp., liquid type naphthalene type Epoxy resin: ESN 175, Nippon Steel & Sumikin Chemical Co., Ltd.
Polyamide resin: TOROMIDE 558, T & K TOKA CORPORATION, polyaminoamide epoxy resin curing agent: Adipic acid dihydrazide Conductive particles: Resinous copper powder, average particle diameter 10 μm

[Measurement of peel strength]
A thermosetting adhesive sheet is cut into strips (2 cm × 5 cm), and after temporarily attaching the thermosetting adhesive layer on one side to a 1.5 cm × 40 cm gold-plated substrate or a SUS substrate with a laminator set at 140 ° C. The release substrate was removed to expose the thermosetting adhesive layer on the other side. A 50 μm thick polyimide film of the same size is overlaid on the exposed thermosetting adhesive layer, and a vacuum press (Vacuum Star, manufactured by Mikado Technos Co., Ltd.) is used at a temperature of 185 ° C. and a pressure of 4.0 MPa. After hot pressing under the conditions of a vacuum holding time of 10 seconds and a pressing time of 90 seconds, it was held in an oven at 140 ° C. for 60 minutes. Thereafter, the polyimide film was subjected to a 90 degree peeling test at a peeling speed of 50 mm / min, and the force required for peeling was measured as the peeling strength. The peel strength is preferably 10 N / cm or more.

Example 1
As shown in Table 1, 20 parts by mass of NBR, 65 parts by mass of acrylic rubber, 10 parts by mass of thioether epoxy resin, 30 parts by mass of alicyclic epoxy resin, 10 parts by mass of polyamide resin, and 190 parts of conductive particles A thermosetting adhesive sheet was produced using a thermosetting adhesive composition containing a part and 8.5 parts by mass of an epoxy curing agent. The peeling strength with respect to the gold plating board | substrate of this thermosetting adhesive sheet was 12 N / cm, and the peeling strength with respect to a SUS board | substrate was 15 N / cm.

Example 2
As shown in Table 1, 15 parts by mass of NBR, 60 parts by mass of acrylic rubber, 5 parts by mass of thioether epoxy resin, 10 parts by mass of alicyclic epoxy resin, 5 parts by mass of polyamide resin, and 180 parts of conductive particles A thermosetting adhesive sheet was produced using a thermosetting adhesive composition containing a part and 7 parts by mass of an epoxy curing agent. The peeling strength with respect to the gold plating board | substrate of this thermosetting adhesive sheet was 10 N / cm, and the peeling strength with respect to a SUS board | substrate was 13 N / cm.

Example 3
As shown in Table 1, 30 parts by mass of NBR, 90 parts by mass of acrylic rubber, 20 parts by mass of thioether epoxy resin, 40 parts by mass of alicyclic epoxy resin, 15 parts by mass of polyamide resin, and 260 parts of conductive particles A thermosetting adhesive sheet was produced using a thermosetting adhesive composition containing a part and 12 parts by mass of an epoxy curing agent. The peeling strength with respect to the gold plating board | substrate of this thermosetting adhesive sheet was 11 N / cm, and the peeling strength with respect to a SUS board | substrate was 14 N / cm.

Comparative Example 1
As shown in Table 1, a thermosetting adhesive sheet was produced in the same manner as in Example 1 except that NBR was not blended. The peeling strength with respect to the gold plating board | substrate of this thermosetting adhesive sheet was 6 N / cm, and the peeling strength with respect to a SUS board | substrate was 10 N / cm.

Comparative Example 2
As shown in Table 1, when a thermosetting adhesive sheet was produced in the same manner as in Example 1 except that no acrylic rubber was blended, no film could be formed.

Comparative Example 3
As shown in Table 1, a thermosetting adhesive sheet was produced in the same manner as in Example 1 except that 10 parts by mass of bisphenol F-type epoxy resin was blended instead of the thioether-type epoxy resin. The peeling strength with respect to the gold plating board | substrate of this thermosetting adhesive sheet was 8 N / cm, and the peeling strength with respect to a SUS board | substrate was 12 N / cm.

Comparative Example 4
As shown in Table 1, a thermosetting adhesive sheet was produced in the same manner as in Example 1 except that 10 parts by mass of a naphthalene type epoxy resin was blended instead of the thioether type epoxy resin. The peeling strength with respect to the gold plating board | substrate of this thermosetting adhesive sheet was 6 N / cm, and the peeling strength with respect to a SUS board | substrate was 11 N / cm.

Comparative Example 5
As shown in Table 1, a thermosetting adhesive sheet was produced in the same manner as in Example 1 except that the polyimide resin was not blended. The peeling strength with respect to the gold plating board | substrate of this thermosetting adhesive sheet was 7 N / cm, and the peeling strength with respect to a SUS board | substrate was 8 N / cm.

  When the amount of addition of the rubber component is small as in Comparative Example 1, high peel strength can not be obtained, and film formation becomes difficult as in Comparative Example 2. When a bisphenol F-type epoxy resin or a naphthalene-type epoxy resin is blended instead of the thioether-type epoxy resin as in Comparative Examples 3 and 4, although a high peel strength is obtained with respect to the SUS substrate, it is higher than the gold-plated substrate. Peeling strength was not obtained. Moreover, when the polyimide resin was not mix | blended like Comparative Example 5, high peeling strength was not obtained with respect to both a gold plating board | substrate and a SUS board | substrate.

  On the other hand, as in Examples 1 to 3, when the content of the rubber component is in the range of 75 to 120 parts by mass with respect to 15 to 60 parts by mass of the epoxy resin, a gold plated substrate High peel strength was obtained for both of the SUS substrates.

Reference Signs List 10 flexible printed wiring board, 11 ground terminal, 12 base material, 13 wiring, 14 adhesive layer, 15 protective layer, 20 thermosetting adhesive sheet, 30 metal plate

Claims (8)

Containing rubber component, epoxy resin, polyamide resin, epoxy resin curing agent,
The epoxy resin comprises an epoxy resin having an aromatic thioether skeleton,
The content of the rubber component, relative to the epoxy resin 15 to 60 parts by weight, Ri 75 to 120 parts by mass der,
A thermosetting adhesive composition , wherein the rubber component comprises nitrile rubber and acrylic rubber . Epoxy resins having the aromatic thioether skeleton, thermosetting adhesive composition according to claim 1, wherein represented by the following general formula (I).

In general formula (I), R represents a hydrogen atom or a monovalent organic group having 1 to 18 carbon atoms, and all of them may be the same or different. n is an average value and represents a positive number of 0 to 10. The thermosetting adhesive composition according to claim 1 or 2 , wherein a content of the epoxy resin having an aromatic thioether skeleton is 5 to 20 parts by mass with respect to 15 to 60 parts by mass of the epoxy resin. The thermosetting adhesive composition according to any one of claims 1 to 3 , wherein the epoxy resin further comprises a dicyclopentadiene type epoxy resin. The thermosetting adhesive composition according to any one of claims 1 to 4 , wherein the content of the polyamide resin is 5 to 15 parts by mass with respect to 15 to 60 parts by mass of the epoxy resin. The thermosetting adhesive composition according to any one of claims 1 to 5 , wherein the epoxy resin curing agent is an organic acid dihydrazide. The thermosetting adhesive composition according to any one of claims 1 to 6 , further comprising conductive particles. Containing rubber component, epoxy resin, polyamide resin, epoxy resin curing agent,
The epoxy resin comprises an epoxy resin having an aromatic thioether skeleton,
The content of the rubber component, relative to the epoxy resin 15 to 60 parts by weight, Ri 75 to 120 parts by mass der,
A thermosetting adhesive sheet , wherein the rubber component comprises nitrile rubber and acrylic rubber .

Images