JP6534105B2 - Liquid crystal panel manufacturing method - Google Patents

Description

  The present invention relates to a liquid crystal panel manufacturing method for obtaining a plurality of liquid crystal panels having a predetermined shape from a glass base material for chamfering a plurality of liquid crystal panels formed by bonding an array substrate and a color filter substrate.

  Generally, when manufacturing liquid crystal panels, a method (so-called multi-chamfering) in which a plurality of liquid crystal panels are simultaneously manufactured from a set of glass base materials and then divided into single liquid crystal panels is widely adopted. It has been. And when dividing a glass base material, methods, such as a scribe break, a laser ablation process, and an etching process, were used in many cases.

  However, when a scribe break is adopted, it is difficult to form a panel other than a rectangular shape such as a panel having a rounded contour or a panel having a notch. Further, in the laser ablation process, problems such as a slow processing speed and contamination due to ablation debris easily occurred. Furthermore, in the etching process, it is necessary to separately perform an appropriate masking process to protect the electrode terminal portion of the array substrate from the etching solution, which may make it difficult to improve the production efficiency.

  Therefore, some of the conventional techniques employ an etching process in which the electrode terminal portion is also masked simultaneously when applying the etching resistant agent to the color filter substrate (see, for example, Patent Document 1). ). By adopting such a configuration, a separate process is not required to protect the electrode terminal portion, and it has been supposed that protection of the electrode terminal portion is surely performed.

JP, 2016-224201, A

  However, in the prior art described above, although it is not necessary to separately perform the process for protecting the electrode terminal portion, it is still necessary to perform the masking process on the glass base material in the etching process, and after the etching process It had to be peeled off. In addition, since it is necessary to provide a space between each liquid crystal panel in the glass base material in consideration of the influence of side etching which proceeds in the direction orthogonal to the thickness direction of the glass base material, the efficiency of multiple beveling may be deteriorated. The

  An object of the present invention is to provide a liquid crystal panel manufacturing method which can eliminate the masking process involved in the etching process and can minimize the influence of the side etching.

  The liquid crystal panel manufacturing method according to the present invention is to obtain a plurality of liquid crystal panels having a predetermined shape from a multiple bevel glass base material for multiple beveling of a liquid crystal panel formed by bonding an array substrate and a color filter substrate. This liquid crystal panel manufacturing method at least includes a reforming line forming step, an etching step, a cutting step, and a terminal portion forming step.

  In the modifying line forming step, the modifying line is formed along the shape cutting planned line corresponding to the shape of the liquid crystal panel to the array substrate and the color filter substrate, and has a property of being easier to be etched than other places To form a reforming line. Representative examples of the method of forming the reforming line include filament processing with a picosecond laser or a femtosecond laser. The width of the reforming line is preferably set to about 10 μm or less.

  In the etching step, the array substrate and the color filter substrate are etched while being not cut along the planned shape cutting lines. As the etching process progresses, the cutting groove or the like may penetrate in the thickness direction along the planned shape cutting line, so the etching process is performed while confirming the shape cutting planned line at a slow etching rate of 10 μm / min or less. It is preferable to

  In the cutting step, cutting is performed at a planned shape cutting line after the etching process. After the etching process, it is in a substantially substantially cut state at the planned shape cutting line. Furthermore, a reformed region is present at the center in the thickness direction, making it easy to cut the glass substrate. For this reason, it is possible to realize complete cutting by applying a slight mechanical pressure or thermal stress. For example, complete cutting can be realized without fouling the multi-faceted glass base material by applying a minute pressing force, giving a minute ultrasonic vibration, or heating.

  In the terminal portion forming step, the color filter substrate is removed along the terminal portion cut expected line for removing the color filter substrate opposed to the region where the electrode terminal portion is formed in the array substrate. The electrode terminal portion is formed on the main surface of the array substrate facing the color filter substrate in the liquid crystal panel, and the electrode terminal portion is exposed by removing the color filter substrate. The terminal portion forming step can be performed at any timing as long as it is at least after the etching step. For example, it may be performed before or after the cutting step, or may be performed simultaneously with the cutting step.

  In the present invention, since the etching process is performed after the planned shape cutting line is easily cut in advance, the masking process for selectively etching only the planned shape cutting line is not necessary. Further, since the planned shape cutting line is easily cut in advance, the amount of etching can be significantly reduced as compared to the case where the entire thickness direction is etched, so the influence of side etching can be minimized. It will be possible. As a result, it is possible to use a multi-facet glass base material in which liquid crystal panels are arranged close to each other, and the bevel efficiency is improved.

  In the liquid crystal panel manufacturing method described above, it is preferable that the reforming line has a perforated shape having a plurality of through holes or a plurality of reforming holes formed by the beam of the pulse laser. In order to process the shape cutting scheduled line of the liquid crystal panel with a pulse laser, even if the contour of the liquid crystal panel includes a complicated portion or a curved portion or an opening is formed in the liquid crystal panel, appropriate processing It is possible to realize

  Preferably, the terminal portion forming step includes a groove forming step and a breaking step. The groove forming step is a step of forming a groove in the color filter substrate along the terminal part cutting line. The breaking step is a step of applying a pressing force to the groove formed along the terminal portion cutting expected line together with the shape cutting intended line in the cutting step. By carrying out the step of processing the terminal portion simultaneously with the division of the liquid crystal panel, the production efficiency is further improved.

  According to the present invention, in the manufacture of a liquid crystal panel, it is possible to eliminate the masking process involved in the etching process and to minimize the influence of the side etching.

It is a figure which shows schematic structure of the liquid crystal panel which concerns on one Embodiment of this invention. It is a figure which shows schematic structure of the glass base material for multiple chamfers containing several liquid crystal panels. It is a figure which shows the outline of the laser processing with respect to the glass base material for multiple chamfers. It is a figure which shows an example of the etching apparatus applied to this invention. It is a figure which shows the variation of the etching process applied to this invention. It is a figure which shows the state of the shape cutting scheduled line by which the etching process was carried out. It is a figure which shows the outline of the glass base material for multiple chamfers of the parted state. It is a figure which shows the characteristic of a structure of a liquid crystal panel. It is a figure which shows other embodiment in division | segmentation of a liquid crystal panel.

  FIG. 1A shows a schematic configuration of a liquid crystal panel 10 according to an embodiment of the present invention. As shown in the figure, the liquid crystal panel 10 is configured such that the array substrate 12 and the color filter substrate 14 are bonded together with the liquid crystal layer interposed therebetween. The configurations of the array substrate 12 and the color filter substrate 14 may adopt the same configurations as known configurations, and thus the description thereof is omitted here.

  The array substrate 12 has an electrode terminal portion 122 provided so as to extend from the area to be bonded to the color filter substrate 14. A plurality of electric circuits are connected to the electrode terminal portion 122, and the liquid crystal panel 10 and the electric circuits thereof are housed in a case, whereby, for example, the smartphone 100 as shown in FIG. Configured

  Subsequently, an example of a method of manufacturing the liquid crystal panel 10 will be described. As shown in FIGS. 2A and 2B, generally, the liquid crystal panel 10 is manufactured as a multiple bevel glass base material 50 including a plurality of liquid crystal panels, and the multiple bevel glass substrate 50 is divided. By doing this, a single liquid crystal panel 10 is obtained. In this embodiment, for convenience, the process for the multiple bevel glass base material 50 in which six liquid crystal panels 10 are arranged in a matrix of 3 rows and 2 columns will be described. However, the liquid crystal panel included in the multiple bevel glass base material 50 The number of ten can be increased or decreased as appropriate.

  First, as shown in FIGS. 3 (A) to 3 (C), the glass substrate 50 for multiple beveling has a reforming line 20 along a line to be cut corresponding to the shape (outline) of the liquid crystal panel 10. It is formed. The modification line 20 is, for example, a plurality of filaments formed by light beam pulses (a beam diameter is about 1 to 5 μm) irradiated from a pulse laser such as picosecond laser (wavelength 515 nm) or femtosecond laser (1030 nm) It is a filament array in which layers are arranged. The light beam from the picolaser has a depth of focus deeper than the range including at least both the array substrate 12 and the color filter substrate 14. Therefore, reforming lines 20 for dividing the liquid crystal panel 10 are simultaneously formed on both the array substrate 12 and the color filter substrate 14.

  In principle, it is possible to process both the array substrate 12 and the color filter substrate 14 simultaneously by one laser, but this causes a defect in the liquid crystal layer or the sealing material for sealing the liquid crystal layer. The liquid crystal layer and the seal are formed by forming the reforming line 20 only on the array substrate 12 from the array substrate 12 side and forming the reforming line 20 only on the color filter substrate 14 from the color filter substrate 14 side. It becomes easy to control generation | occurrence | production of the malfunction in materials.

  In this embodiment, the reforming line 20 has a perforation shape having a plurality of through holes or reforming layers as shown in FIG. 3 (C). The reforming line 20 has the property of being easier to etch than the other portions of the multiple bevel glass substrate 50. Of course, the shape of the reforming line 20 is not limited to the shape as shown in FIG. 3C, and may have other shapes. Preferably, the reforming line 20 is formed over the entire area in the plate thickness direction of the array substrate 12 and the color filter substrate 14.

  After the formation of the reforming line 20, as shown in FIG. 4, the multiple bevel glass base material 50 is introduced into the etching apparatus 300, and is subjected to an etching process with an etching solution containing hydrofluoric acid, hydrochloric acid, and the like. In the etching apparatus 300, the etching liquid is brought into contact with one side or both sides of the glass substrate for multiple chamfering 50 in the etching chamber while the glass substrate for multiple chamfering 50 is transported by the transport roller, thereby the glass substrate for multiple chamfering An etching process for 50 is performed. In addition, since the cleaning chamber for washing away the etching liquid adhering to the glass base material 50 for multiple chamfers is provided in the latter part of the etching chamber in the etching apparatus 300, the etching liquid removes the glass base material 50 for multiple chamfers. It is discharged from the etching apparatus 300 in the closed state.

  As an example of the method of bringing the etching solution into contact with the glass substrate 50 for multiple chamfering, as shown in FIG. 5A, in each etching chamber 302 of the etching apparatus 300, the etching solution for the glass substrate 50 for multiple chamfering And spray etching. Also, instead of spray etching, as shown in FIG. 5B, in the overflow type etching chamber 304, a configuration is employed in which the glass substrate for multiple chamfers 50 is transported while being in contact with the overflowing etching solution. Is also possible.

  Furthermore, as shown in FIG. 5C, a dip type etching in which one or a plurality of multi-faceted glass base materials 50 contained in the carrier are immersed in the etching bath 306 containing the etching solution is adopted. It is also possible.

  In any case, it is important not to cut the multi-chamfering glass base material 50 by the planned shape cutting line penetrating in the thickness direction during the etching process. Therefore, during the etching process (in particular, the latter half of the etching process), it is necessary to reduce the etching rate to control the etching amount accurately. In this embodiment, the etching process is performed at a slow speed of 10 μm / min or less by a thin hydrofluoric acid of 2 wt% or less, but it is not limited to this method.

  If the etching rate is not slowed down in the entire etching process but is gradually delayed while adopting an earlier etching rate, it is possible to shorten the etching time. For example, it is preferable to adopt a configuration in which the concentration of hydrofluoric acid in the etching solution is reduced within the range of about 1 to 10% by weight as the processing proceeds to the latter stage of the etching apparatus 300.

  When the glass substrate for multiple chamfers 50 passes through the etching apparatus 300, the reforming line 20 is etched. In the reforming line 20, the etching solution penetrates faster than the other places, and the glass is melted along this line to form the planned cutting groove 26. In addition, even when flaws or the like occur inside the array substrate 12 and the color filter substrate 14 during laser irradiation, the flaws are easily eliminated. The planned cutting groove 26 is not an isotropic groove formed by ordinary etching, but the aspect ratio in the depth direction is larger than the width direction. For this reason, even if it is the glass base material 50 for multiple chamfers in which each liquid crystal panel adjoins, the scheduled cutting groove 26 can be formed without affecting the liquid crystal panel 10. The planned cutting grooves 26 are formed in the array substrate 12 or the color filter substrate 14 so as not to completely penetrate in the thickness direction. At this time, the thickness of the lower portion of the planned cutting groove 26 is preferably 100 μm or less. If the plate thickness exceeds 100 μm, division in the cutting step may be difficult.

  In the glass substrate for multiple beveling 50, the planned shape cutting line is reduced in strength due to the planned cutting groove 26 and the reforming region (reforming line 20) present in the lower part of the planned cutting groove 26. For this reason, the glass substrate for multiple chamfers 50 can be divided in the reforming line 20 only by applying a slight mechanical pressure to the planned shape cutting line. Specifically, it is possible to divide by applying a minute pressing force to the multiple bevel glass base material 50 or giving a minute ultrasonic vibration. In the present embodiment, the liquid crystal panel 10 is divided using the pressing device 60 as shown in FIG. 7. The pressing device 60 has a bar-like shape, and has a spherical rotating jig 62 at its tip. The rotating jig 62 is rotatably supported at the tip of the pressing device 60. The rotating jig 62 is configured to rotate by moving the pressing tool 60 along the planned cutting line in a state where the pressing tool 60 is pressed against the planned cutting groove 26. When stress is applied to the modified region located in the lower part of the planned cutting groove 26 by the pressing device 60, a crack occurs and the liquid crystal panel 10 can be divided. By using the pressing tool 60, it is possible to divide the liquid crystal panel 10 while preventing staining of the glass substrate for multiple chamfers 50 and contact between the end faces.

  Subsequently, a cutting process for removing a region of the color filter substrate 14 facing the electrode terminal portion 122 of the array substrate 12 is performed. In this embodiment, the inside of the region of the color filter substrate 14 facing the electrode terminal portion 122 of the color filter substrate 14 is cut along the terminal portion cut expected line by the scribe wheel (wheel cutter) 250. The terminal cutting groove 30 is formed on the color filter substrate 14 by the scribing wheel 250 along the terminal cutting lines. Furthermore, the color filter substrate 14 can be removed from the terminal portion cutting groove 30 by applying a pressing force to the terminal portion cutting groove 30 using a pressing device 60 or the like.

  In this embodiment, since the multiple bevel glass base material 50 is not completely cut by the etching process, the liquid crystal panel 10 end faces separated during the etching collide with each other to cause a failure. It is prevented. In addition, it is possible to carry the multi-faceted glass base material 50 in the incompletely cut state after the etching process (in the large size state). Furthermore, since the etching solution does not reach the electrode terminal portion 122, it becomes unnecessary to protect the electrode terminal portion by the etching agent-provided masking agent. In addition, since the etching process is applied to at least the central portion of the end face of the liquid crystal panel 10, the strength (for example, bending strength) of the liquid crystal panel is higher than when the cutting is performed only by laser processing.

  FIGS. 8A to 8C show schematic configurations of the liquid crystal panel 10 after division. As shown in the figure, the end face of the liquid crystal panel 10 is substantially perpendicular to the main surface. For example, the taper widths (L1 to L3 in FIG. 8C) generated on the end faces of the array substrate 12 and the color filter substrate 14 each having a thickness of about 0.15 mm to 0.25 mm are 50 μm or less (mostly) It can be suppressed to 20 to 35 μm.

  As described above, when manufacturing the liquid crystal panel 10, the influence of the side etching hardly occurs, so that it is possible to design the multiple bevel glass base material 50 in which the liquid crystal panels 10 are arranged close to each other. For example, if there is a gap of about 10 μm in total with a laser width of 2 μm + α, it is possible to properly separate the multiple bevel glass base material 50 into a single liquid crystal panel 10. Further, the shape of the liquid crystal panel is not limited to that of the present embodiment, and, for example, one having a notch or the like can also correspond.

  In the above-described embodiment, after the liquid crystal panel 10 is divided from the multiple bevel glass base material 50, the color filter substrate 14 is removed in a region facing the electrode terminal portion 122. However, the color filter substrate 14 is cut. Can be performed at any timing. For example, as shown in FIGS. 9 (A) and 9 (B), a terminal cutting groove is formed along the planned cutting line of the terminal using the scribing wheel 250 with respect to the multiple bevel glass base material 50 after the etching process. Form 30. Then, as shown in FIG. 9C, when the liquid crystal panel 10 is divided along the shape cutting planned line, a pressing force is applied not only to the shape cutting planned line but also to the terminal cutting groove 30, The division of the liquid crystal panel 10 and the processing of the electrode terminal portion can be performed simultaneously. In addition, once the terminal cutting groove 30 is formed, the color filter substrate 14 can be removed, for example, at an arbitrary timing in the post process, even when the cutting of the liquid crystal panel 10 is not performed simultaneously.

  The above description of the embodiments should be considered in all respects as illustrative and not restrictive. The scope of the present invention is indicated not by the embodiments described above but by the claims. Further, the scope of the present invention is intended to include all modifications within the scope and meaning equivalent to the claims.

DESCRIPTION OF SYMBOLS 10-Liquid crystal panel 12-Array substrate 14-Color filter substrate 20-Reforming line 30-Terminal cutting groove 50-Glass base material for multiple chamfer 100-Smartphone 122-Electrode terminal part 250-Scribe wheel 300-Etching device 302, 304 -Etching chamber 306-Etching chamber

Claims (2)

A liquid crystal panel manufacturing method for obtaining a plurality of liquid crystal panels having a predetermined shape from a glass base material having a plurality of chamfers for chamfering a liquid crystal panel formed by bonding an array substrate and a color filter substrate.
A modification line formed along a shape cutting scheduled line corresponding to the shape of a liquid crystal panel with respect to the array substrate and the color filter substrate, and having a property of being more easily etched than other portions Forming a reforming line to form
An etching step of performing an etching process on the array substrate and the color filter substrate while preventing the shape cutting scheduled line from being cut;
A cutting step of cutting at the shape cutting scheduled line after the etching process;
A terminal portion forming step of cutting the color filter substrate along a terminal portion cutting expected line for removing the color filter substrate opposed to the region where the electrode terminal portion is formed in the array substrate;
At least only it contains, and,
The method for manufacturing a liquid crystal panel according to claim 1, wherein the modification line has a perforation shape having a plurality of through holes or a plurality of modification holes formed by a beam of a pulse laser . The terminal portion forming step is a groove forming step of forming a groove along the terminal portion cutting expected line;
A breaking step of applying a pressing force to the groove formed along the terminal part cutting planned line together with the shape cutting planned line in the cutting step;
The liquid crystal panel manufacturing method according to claim 1, further comprising:

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