JP6540198B2 - Compound grinding machine and compound grinding method - Google Patents

Description

  The present invention comprises a pivotable swivel table for sequentially transporting a workpiece, a plurality of grindstones, and a plurality of correction grindstones for correcting the properties of the respective grindstones; The present invention relates to a compound grinder and a compound grinding method capable of correcting the properties of a grindstone by a correction grindstone.

  For example, in Patent Document 1, two grinding wheels are provided with grinding wheels respectively, one spindle head is provided with a spindle for holding a workpiece, and the spindle head is provided with two grinding stone correction devices for correcting the properties of each grinding wheel. A grinding machine is described. In this grinding machine, when one of the grinding wheels is being corrected, it is possible to control the other grinding wheel to grind. Further, according to Patent Document 2, one grindstone head is provided with a grindstone, one tool rest is provided with a cutting tool, and the properties of the spindle and the grindstone holding the workpiece on two spindle stands and the properties of the cutting tool are respectively corrected A combined grinding machine is described which comprises two grinding wheel correction devices for each. In this compound grinding machine, it is possible to control both grinding (grinding and cutting) with the grinding wheel and cutting tool or correction of the grinding wheel and cutting tool, or one of machining and the other correction.

JP, 2000-107982, A International Publication 2014/065137

  In the case of sequentially grinding the workpiece while sequentially conveying it, the grinding machine described in Patent Document 1 or the compound grinding machine described in Patent Document 2 needs to further include a conveying device, and the overall configuration tends to be large. It is in.

  The present invention has been made in view of such circumstances, and it is possible to sequentially grind a workpiece while sequentially conveying it, and at the same time, it is a compact composite grinding machine capable of correcting the properties of a grindstone. And provide a combined grinding method.

(Compound grinding machine)
The combined grinding machine according to the present invention is provided with a swivel table pivotable about a pivot axis, and provided on a circumference centered on the pivot axis in the pivot table, and rotates about a main axis parallel to the pivot axis. Workpiece spindles having movable work spindles, Workpiece holding devices provided on the plurality of work spindles and capable of holding cylindrical workpieces, and relative movement with respect to the turning table In each case where the workpiece is sequentially positioned by rotation of the turning table so that the workpiece is positioned at the corresponding respective grinding turning positions, the outer circumference or the inside of the corresponding work is provided . a plurality of grinding wheel for grinding the periphery, when a plurality of grinding wheel correction device for correcting respective properties of the plurality of grindstones, at least one of the plurality of grindstones for grinding said workpiece At least one other of the plurality of grinding wheels by any of the plurality of grinding wheel correction devices when the workpiece is not positioned at the grinding pivot position corresponding to at least one other of the plurality of grinding wheels And a controller for correcting one of the characteristics.

The composite grinding machine can sequentially convey the workpiece by turning, can grind the workpiece positioned at the grinding turning position, and has the characteristics of the grinding wheel when the workpiece is not positioned at the grinding turning position. It has a swivel table that can be corrected. As a result, the combined grinding machine does not have to be newly provided with a transfer device, and can be made compact. Further, the grinding of the workpiece and the correction of the properties of the grinding wheel can be simultaneously performed, and the tact time can be shortened. In particular, when the workpiece W is ground with another dedicated grinding wheel except at least one of the two or more dedicated grinding wheels, the grinding of the workpiece W is performed with the at least one dedicated grinding wheel described above It is possible to create a state that you do not do. Therefore, the correction of the at least one dedicated grinding wheel can be performed in that state, and the tact time can be shortened.

(Combined grinding method)
The compound grinding method in the compound grinding machine according to the present invention is provided with a swivel table pivotable about a pivot axis, and provided on a circumference centered on the pivot axis in the pivot table and holding a cylindrical workpiece A plurality of workpiece holding devices capable of rotating about a main axis parallel to the pivot axis, and provided so as to be movable relative to the pivot table, the workpiece being sequentially conveyed by the pivot of the pivot table Are used to correct the properties of the plurality of grindstones for grinding the outer periphery or the inner periphery of the corresponding work and the plurality of grindstones when the work is positioned at the corresponding respective grinding turning positions. And a plurality of grinding wheel correction devices, wherein at least one of the plurality of grinding wheels grinds the workpiece. At least one other property of the plurality of grinding wheels by any of the plurality of grinding wheel correction devices when the workpiece is not positioned at the grinding turning position corresponding to at least one other of the plurality of grinding wheels Correcting the According to this composite grinding method, it is possible to obtain the same effects as the effects obtained by the above-mentioned composite grinding device.

It is the schematic which shows the whole structure of the compound grinder of this embodiment. It is a top view of the turning table with which the compound grinder of FIG. 1 is provided. It is the sectional view on the AA line of the turntable of FIG. It is a flowchart for demonstrating the operation | movement of the compound grinder of FIG. It is a 1st figure which shows the state of the compound grinder in each process of FIG. It is a 2nd figure which shows the state of the compound grinder in each process of FIG.

(Configuration of compound grinding machine)
Hereinafter, an embodiment of the present invention is described based on a compound grinder which grinds an outer ring and an inner ring of a bearing as a plurality of kinds of workpieces. In addition, let the direction orthogonal to a horizontal surface be the X-axis direction and the Y-axis direction, and let the direction orthogonal to the X-axis direction and the Y-axis direction be the Z-axis direction.
As shown in FIG. 1, the compound grinding machine 1 is provided with a bed 2, and on the bed 2, it can be pivoted about a C axis (pivotal axis) parallel to the Z axis direction by a drive mechanism 51 (see FIG. 3). Column 3a that can be reciprocated (advanced) in the Xa axis direction parallel to the X axis direction, the Xb axis direction, and the Xc axis direction by the turning table 5 and the drive mechanism (only the drive mechanism 3A of the column 3a is shown in FIG. 1) 3b and 3c, and a pivot arm 3d pivotable about a Zd axis parallel to the Z axis direction by a drive mechanism (not shown).

  As shown in FIG. 1 and FIG. 2, in the turning table 5, four workpiece holding devices 61, 62, 63, 64 are equiangularly spaced (90 degrees apart) on the same circumference centering on the C axis. Provided. As shown in FIG. 3, workpiece spindle mounts 81, 82, 83, 84 are attached to the respective workpiece holding devices 61, 62, 63, 64. The workpiece headstocks 81, 82, 83, 84 include a spindle body 811 and a machining spindle 812. The machining spindle 812 is provided so as to protrude from the upper end of the spindle main body 811 so as to be rotatable about a G axis parallel to the C axis direction by a not-shown drive mechanism incorporated in the spindle main body 811. A work holding device (the work holding device 61 is shown in FIG. 3) is fixed to the upper end of the work spindle 812.

  Through holes 52 are respectively drilled in the turntable 5 on which the workpiece holding devices 61, 62, 63, 64 are disposed. Then, the main spindle body 811 of the workpiece headstock 81 is fixed to the back surface of the turning table 5 corresponding to each through hole 52, and the working spindle 812 of the workpiece spindle head 81 is penetrated in each through hole 52. Each of the workpiece holding devices 61, 62, 63, 64 attracts and holds the workpiece W by the magnetic force on the upper surface, and rotates around the G axis with the machining spindle 812.

  The workpiece W is a workpiece holding device positioned on the left side on the paper surface of FIG. 2 (it is the workpiece holding device 61 in the state of FIG. 2 but is replaced by the turning of the turning table 5. The same applies hereinafter). It is carried out and carried out from the workpiece holding device (it is the workpiece holding device 64 in the state of FIG. 2 but it is replaced by the turning of the turning table 5 in the state of FIG. 2). Be done. Loading and unloading of the workpiece W is performed by a robot not shown. The robot is configured to be able to carry in the workpiece W with the central axis of the workpiece W aligned with the rotation center of the workpiece holding device 61. The loading and unloading of the workpiece W may be performed by the operator, and the center alignment in that case is performed using a jig or the like.

  Although the details will be described later, the turning table 5 turns clockwise at a predetermined angle in FIG. 2 to convey the workpiece W. Then, in FIG. 2, in the workpiece holding device 61 positioned on the left side, outer peripheral surface grinding is performed when the workpiece W to be carried in is the outer ring Wa, and inner peripheral surface grinding is performed when the inner ring Wb is. The outer ring raceway surface grinding of the outer ring Wa is performed in the workpiece holding device 62 positioned on the upper side, and the inner ring raceway surface grinding of the inner ring Wb is performed in the workpiece holding device 63 positioned on the right side. Then, in the workpiece holding device 64 positioned on the lower side, the outer ring raceway surface superfinishing grinding of the outer ring Wa or the inner ring raceway surface superfinishing grinding of the inner ring Wb is performed and carried out. In the following description, the position on the left side is the circumferential surface grinding position Pp, the position on the upper side is the outer ring grinding position Po, the position on the right side is the inner ring grinding position Pi, and the position on the lower side is superfinishing The grinding position is called Pb.

  As shown in FIG. 1, on the side surfaces of the columns 3a, 3b, 3c, the drive mechanisms 41a, 41b, 41c respectively move up and down (back and forth) in the Za axial direction parallel to the Z axial direction, Zb axial direction, and Zc axial direction. The possible grinding wheels 4a, 4b, 4c are provided respectively. Each of the grinding heads 4a, 4b and 4c is a rotary type that can be rotationally driven around the Za axis (grindstone axis), around the Zb axis (grindstone axis), and around the Zc axis (grind stone axis) by drive mechanisms 91a, 91b and 91c. The grinding wheels 9a, 9b, 9c are provided respectively. The grinding wheels 9a, 9b, 9c are respectively held by the lower ends of holding shafts 92a, 92b, 92c extending downward.

  The respective columns 3a, 3b and 3c are arranged on the bed 2 so that each grinding wheel 9a, 9b and 9c can be advanced and retracted respectively with respect to the peripheral surface grinding position Pp, the outer ring grinding position Po and the inner ring grinding position Pi. Ru. The grinding wheel 9a uses, for example, a CBN (Cubic Boron Nitride) grinding wheel to grind the outer peripheral surface of the outer ring Wa or the inner peripheral surface of the inner ring Wb. The grinding wheels 9b and 9c grind the outer ring raceway surface of the outer ring Wa. In order to grind the inner ring raceway surface of the inner ring Wb, for example, an alumina grinding wheel is used. In place of the rotary grinding wheels 9a, 9b and 9c, single stone grinding wheels may be used.

  The pivoting arm 3d is provided with a single stone type grindstone 9d which can be moved up and down in the Ze axial direction parallel to the Z axial direction and rotatable around the Ze axial line (grindstone axis) by a drive mechanism (not shown). The grindstone 9d is held on the peripheral surface of the lower end portion of the holding shaft 92d extending downward from the tip of the swing arm 3d so that the grinding portion of the grindstone 9d is directed in the direction perpendicular to the Ze axis. The grindstone 9d is, for example, a CBN grindstone, in order to perform the outer ring raceway surface superfinishing grinding of the outer ring Wa or the inner ring raceway surface superfinishing grinding of the inner ring Wb. In addition, it may replace with single stone type grindstone 9d, and may be a rotary type grindstone.

  Below the grindstone pedestals 4a, 4b, 4c on the bed 2, grindstone correction devices 7a, 7b, 7c for respectively correcting the grinding surfaces of the grinding wheels 9a, 9b, 9c are provided. Each grinding stone correction device 7a, 7b, 7c is a general correction grinding wheel 71a, 71b, 71b, 71b, 71b, 71c, which can be rotationally driven around the Zp axis parallel to the Z axis, Zq axis, and Zr axis, respectively, by a drive mechanism not shown. Each has 71c. The respective correction grinding wheels 71a, 71b, 71c are respectively held by the upper ends of holding shafts 72a, 72b, 72c extending upward.

  For example, a CBN grinding wheel is used as the correction grinding wheels 71a, 71b, 71c. Since the grinding wheel 9a uses a CBN grinding wheel, the correction frequency by the correction grinding wheel 71a is small, but since the grinding wheels 9b and 9c use an alumina grinding wheel, the correction frequency by the correction grinding wheels 71b and 71c is large . Also, instead of the correction wheel 71a, 71b, 71c of a complete shape, a general rotary correction wheel or a single stone correction wheel may be used.

  The compound grinding machine 1 includes a control device 30, and as a functional configuration of the control device 30, an X-axis control unit 31 that controls the feed of the columns 3a, 3b, and 3c, and lifting and lowering of the wheel heads 4a, 4b, and 4c. Axis control unit 32 that controls the rotation, C axis control unit 33 that controls the rotation of the turning table 5, rotation of the work headstocks 81, 82, 83, 84 and suction of the work holding device 61, 62, 63, 64 The spindle control unit 34 that controls the rotation, the correction control unit 35 that controls the rotation of the correction grinding wheels 71a, 71b, 71c, the grinding wheel axis control unit 36 that controls the rotations of the grinding wheels 9a, 9b, 9c, the turning of the turning arm 3d An arm control unit 37 that controls rotation and elevation of the grindstone 9d, and a recording unit 38 that records data and a program are provided. The control device 30 can perform a plurality of grinding processes by controlling each device based on preset control data.

(Operation of combined grinding machine)
Next, in the compound grinding machine 1, as grinding of a plurality of types of workpieces W, outer peripheral surface grinding of the outer ring Wa of the bearing, outer ring raceway surface grinding, outer ring raceway surface superfinishing grinding, inner peripheral surface grinding of the inner ring Wb, inner ring raceway surface The operation of the compound grinding machine 1 when performing grinding, inner ring raceway superfinishing grinding, and correction of the grinding wheels 9 b and 9 c will be described with reference to FIGS. 4 and 5. Here, in the compound grinding machine 1, the state in which the workpiece holding device 61 is positioned at the circumferential surface grinding position Pp (the state shown in FIG. 2) is taken as the initial state, and the turning position of the turning table 5 at this time is referenced. It is assumed that the position is 0 degrees.

  First, the control device 30 mounts the first outer ring Waa on the workpiece holding device 61 (step S1 in FIG. 4, see (a) in FIG. 5A). Then, the control device 30 controls the outer peripheral surface grinding of the outer ring Waa based on the outer peripheral surface grinding program (see step S2 in FIG. 4 and (a) in FIG. 5A).

  Specifically, when the outer ring Waa is carried onto the workpiece holding device 61 by the robot, the main spindle control unit 34 attracts and holds the outer ring Waa by magnetic force. Then, the grinding wheel axis control unit 36 rotates the grinding wheel 9 a, and the spindle control unit 34 rotates the workpiece spindle head 81. Then, the X-axis control unit 31 moves the column 3a toward the workpiece holding device 61, and the Z-axis control unit 32 lowers the grindstone table 4a to bring the grinding wheel 9a into contact with the outer peripheral surface of the outer ring Waa. After grinding the outer peripheral surface, the grinding wheel 9a is retracted to the standby position.

  Next, when grinding of the outer peripheral surface of the outer ring Waa is completed, the control device 30 turns the turning table 5 by 90 degrees (see step S3 in FIG. 4 and (b) in FIG. 5A). Specifically, the C-axis control unit 33 turns the turning table 5 whose turning position is located at the reference position (0 degree) clockwise in FIG. 5 and turns 90 degrees from the reference position when turning. Thereby, the workpiece holding device 61 is positioned at the outer ring grinding position Po, and the workpiece holding device 64 is positioned at the circumferential surface grinding position Pp.

Then, the control device 30 attaches the first inner ring Wba to the workpiece holding device 64 (see step S4 in FIG. 4 and (c) in FIG. 5A). Then, control device 30 controls the inner peripheral surface grinding of inner ring Wba based on the inner peripheral surface grinding program, and controls the outer ring raceway surface grinding of outer ring Waa based on the outer ring raceway surface grinding program (step S5 in FIG. 4, S6, see FIG. 5A (c)). These controls are performed in parallel.

  Specifically, when the inner ring Wba is carried onto the workpiece holding device 64 by the robot, the spindle control unit 34 attracts and holds the inner ring Wba by magnetic force. The grinding wheel axis control unit 36 rotates the grinding wheel 9a and the grinding wheel 9b, and the spindle control unit 34 rotates the workpiece spindle block 81 and the workpiece spindle block 82, respectively. Then, the X-axis control unit 31 moves the column 3a and the column 3b toward the workpiece holding device 64 and the workpiece holding device 61, respectively, and the Z-axis control unit 32 respectively performs the grinding wheel head 4a and the grinding wheel head 4b. The grinding wheel 9a is brought into contact with the inner peripheral surface of the inner ring Wba to perform inner surface grinding, and the grinding wheel 9b is brought into contact with the raceway surface of the outer ring Waa to perform outer ring raceway surface grinding. After the outer ring raceway surface grinding is completed, the grinding wheel 9a and the grinding wheel 9b are retracted to the standby position.

Next, when the grinding of the inner circumferential surface of the inner ring Wba and the grinding of the outer ring surface of the outer ring Waa are completed, the control device 30 turns the turning table 5 by 180 degrees (see step S7 in FIG. 4 and (d) in FIG. 5A). ).
Specifically, the C-axis control unit 33 turns the turning table 5 whose turning position is positioned at 90 degrees clockwise in FIG. 5 and turns at 270 degrees from the reference position and stops turning.

  Thereby, the workpiece holding device 61 is positioned at the superfinishing grinding position Pb, the workpiece holding device 64 is positioned at the inner ring grinding position Pi, and the workpiece holding device 62 is positioned at the circumferential surface grinding position Pp It will be. Then, the workpiece holding device 63 is positioned at the outer ring grinding position Po in an empty state where the outer ring Wa and the inner ring Wb are not adsorbed. In this positioning state, while the outer ring Wa or the inner ring Wb described below is ground in the workpiece holding devices 61, 62, 64, the grinding of the outer ring Wa and the inner ring Wb is not performed in the workpiece holding device 63. become. Therefore, correction of the grinding wheel 9b described below is performed using this free time.

  The control device 30 mounts the next outer ring Wab on the workpiece holding device 62 (see step S8 in FIG. 4 and (e) in FIG. 5B). Then, control device 30 controls the outer peripheral surface grinding of outer ring Wab based on the outer peripheral surface grinding program, and controls the correction of the grinding portion of grinding wheel 9b based on the correction program, and the inner ring of inner ring Wba based on the inner ring raceway surface grinding program. The raceway surface grinding is controlled, and the outer ring superfinishing grinding of the outer ring Waa is controlled based on the outer ring superfinishing grinding program (steps S9, S10, S11, S12 in FIG. 4, see (e) in FIG. 5B). These controls are performed in parallel.

  Specifically, when the outer ring Wab is carried onto the workpiece holding device 62 by the robot, the main spindle control unit 34 attracts and holds the outer ring Wab by the magnetic force. Then, the grinding wheel axis control unit 36 rotates the grinding wheel 9a and the grinding wheel 9c, and the spindle control unit 34 rotates the workpiece spindle mount 82 and the workpiece spindle mount 84, respectively. Then, the X-axis control unit 31 moves the column 3a and the column 3c toward the workpiece holding device 62 and the workpiece holding device 64, respectively, and the Z-axis control unit 32 respectively performs the grinding wheel head 4a and the grinding wheel head 4c. The grinding wheel 9a is brought into contact with the outer peripheral surface of the outer ring Wab to perform grinding on the outer peripheral surface, and the grinding wheel 9c is brought into contact with the raceway surface of the inner ring Wba to perform the inner ring raceway surface grinding. After the grinding is completed, the grinding wheel 9a and the grinding wheel 9c are retracted to the standby position.

  Further, the correction control unit 35 rotates the correction grinding wheel 71b. Then, the grinding wheel axis control unit 36 rotates the grinding wheel 9b. Then, the X-axis control unit 31 moves the column 3b toward the grindstone correction device 7b, and the Z-axis control unit 32 lowers the grindstone head 4b to use the grinding wheel 9a as a correction grinding wheel portion of the correction grinding wheel 71b. The grinding wheel portion of the grinding wheel 9a is corrected by contact, and after the correction is completed, the grinding wheel 9a is retracted to the standby position.

Further, the arm control unit 37 rotates the swing arm 3d and rotates and lowers the grindstone 9d to bring the grindstone 9d into contact with the raceway surface of the outer ring Waa on the workpiece holding device 61 to perform outer ring superfinishing grinding. After completing the superfinishing grinding, the grinding wheel 9d is retracted to the standby position.
When the outer ring superfinishing of the outer ring Waa is completed, the control device 30 takes out the outer ring Waa from the workpiece holding device 61 (see step S13 in FIG. 4 and (e) in FIG. 5B).
Specifically, when the robot grips the outer ring Waa on the workpiece holding device 61, the spindle control unit 34 stops the suction by the magnetic force. Thereby, the robot can take out the outer ring Waa from the work holding device 61.

Next, when the outer peripheral surface grinding of the outer ring Wab, the correction of the grinding wheel 9a, and the inner ring raceway surface grinding of the inner ring Wba are completed, the control device 30 turns the turn table 5 90 degrees (step S14 in FIG. 4; (F) See the figure).
Specifically, the C-axis control unit 33 turns the turning table 5 whose turning position is positioned at 270 degrees clockwise in FIG. 5 and turns 360 degrees from the reference position and turns and stops.

  Thereby, the workpiece holding device 61 is positioned at the circumferential surface grinding position Pp, the workpiece holding device 62 is positioned at the outer ring grinding position Po, and the workpiece holding device 64 is positioned at the superfinishing grinding position Pb. It will be. Then, the workpiece holding device 63 is positioned at the inner ring grinding position Pi in an empty state where the outer ring Wa and the inner ring Wb are not adsorbed. In this positioning state, while the outer ring Wa and the inner ring Wb described below are ground in the workpiece holding devices 61, 62 and 64, the outer ring Wa and the inner ring Wb are not ground in the workpiece holding device 63. become. Therefore, correction of the grinding wheel 9c described below is performed using this free time.

  The control device 30 attaches the next inner ring Wbb to the workpiece holding device 61 (see step S15 in FIG. 4 and (g) in FIG. 5B). Then, control device 30 controls the inner peripheral surface grinding of inner ring Wbb based on the inner peripheral surface grinding program, controls the outer ring raceway surface grinding of outer ring Wab based on the outer ring raceway surface grinding program, and grinding wheel 9c based on the correction program. The correction of the grinding portion is controlled, and the inner ring superfinishing of the inner ring Wba is controlled based on the inner ring superfinishing program (steps S16, S17, S18, S19 in FIG. 4, see (g) in FIG. 5B). These controls are performed in parallel.

  Specifically, when the inner ring Wbb is carried onto the workpiece holding device 61 by the robot, the spindle control unit 34 attracts and holds the inner ring Wbb by magnetic force. The grinding wheel axis control unit 36 rotates the grinding wheel 9a and the grinding wheel 9b, and the spindle control unit 34 rotates the workpiece spindle block 81 and the workpiece spindle block 82, respectively. Then, the X-axis control unit 31 moves the column 3a and the column 3b toward the workpiece holding device 61 and the workpiece holding device 62, respectively, and the Z-axis control unit 32 respectively performs the grinding wheel head 4a and the grinding wheel head 4b. The grinding wheel 9a is brought into contact with the inner peripheral surface of the inner ring Wbb to perform the inner surface grinding, and the grinding wheel 9b is brought into contact with the raceway surface of the outer ring Wab to perform the outer ring raceway surface grinding. After the outer ring raceway surface grinding is completed, the grinding wheel 9a and the grinding wheel 9b are retracted to the standby position.

  Further, the correction control unit 35 rotates the correction grinding wheel 71c. Then, the grinding wheel axis control unit 36 rotates the grinding wheel 9c. Then, the X-axis control unit 31 moves the column 3c toward the grindstone correction device 7c, and the Z-axis control unit 32 lowers the grindstone head 4c to use the grinding wheel 9c as a correction grinding wheel portion of the correction grinding wheel 71c. The grinding wheel portion of the grinding wheel 9c is corrected by making contact, and after the correction is completed, the grinding wheel 9c is retracted to the standby position.

Further, the arm control unit 37 rotates the swing arm 3d and rotates and lowers the grindstone 9d to bring the grindstone 9d into contact with the raceway surface of the inner ring Wba on the workpiece holding device 64 to perform inner ring superfinishing grinding. After completing the superfinishing process, the grinding wheel 9d is retracted to the standby position.
When the inner ring superfinishing of the inner ring Wba is completed, the control device 30 takes out the inner ring Wba from the workpiece holding device 64 (see step S20 in FIG. 4 and (g) in FIG. 5).
Specifically, when the robot grips the inner ring Wba on the workpiece holding device 64, the spindle control unit 34 stops the suction by the magnetic force. Thereby, the robot can take out the inner ring Wba from the work holding device 64. Then, the control device 30 returns to step S7 and repeats the above-described processing.

  As described above, since the outer wheel Wa and the inner wheel Wb can be continuously and alternately ground, and at the same time, the grinding wheels 9b and 9c can be continuously and alternately corrected, the tact time can be shortened. Further, in a state where the outer ring Wa and the inner ring Wb are held by the workpiece holding device 61, 62, 63, 64, it is possible to perform from the surface grinding of the first process to the track surface superfinishing of the last process. Since the attachment and removal of Wb are not performed, the positions of the outer ring Wa and the inner ring Wb do not shift in each process. For this reason, the relative position accuracy of the grinding surface of the outer ring Wa and the inner ring Wb is improved.

(Others)
In the above embodiment, grinding wheels common to grinding the outer ring Wa and the inner ring Wb (grinding stones common to outer peripheral surface grinding of the outer ring Wa and inner peripheral surface grinding of the inner ring Wb, outer ring raceway surface superfinishing grinding of the outer ring Wa and inner ring It has two common grinding wheels, grinding wheel 9a and grinding wheel 9d, as a grinding wheel common to inner ring raceway superfinishing grinding of Wb, and is dedicated to grinding grinding wheel 9b and inner ring Wb as grinding wheels dedicated to grinding outer ring Wa As a grindstone, it was set as the structure provided with two exclusive grindstones of the grindstone 9c. Then, grinding is performed using the grinding wheels 9a, 9b, 9c and the grinding wheel 9d in the four work holding devices 61, 62, 63, 64 arranged equally on the same circumference of the turning table 5, and The grinding wheels 9b or 9c not involved in grinding are alternately corrected.

  However, two workpiece holders are provided with only two wheels dedicated to grinding each of two types of workpieces, and two workpieces equally spaced on the same circumference of the turntable using two dedicated wheels The apparatus may be configured to perform grinding, respectively. In that case, two types of workpieces are alternately carried into the workpiece holding device on one side, and the two types of workpieces are alternately carried out from the workpiece holding device on the other side. Then, when the workpiece is ground by one dedicated grindstone, the other dedicated grindstone is corrected, and when the workpiece is ground by the other dedicated grindstone, one dedicated grindstone is corrected.

  In the above embodiment, one common grindstone and two dedicated grindstones (corresponding to two types of workpieces Wa and Wb) are provided. However, two or more common grindstones and three or more dedicated grindstones Grinding is carried out respectively in the work holding device of the total number of common grindstones and dedicated grindstones arranged on the same circumference of the turning table using the dedicated grindstones configured to correspond to three or more types of workpieces). It may be a configuration to be performed. In that case, as in the present embodiment, the workpiece is carried into one workpiece holding device, and the workpiece is carried out from the workpiece holding device adjacent in the reverse turning direction of the turning table. Then, the exclusive grindstones not involved in the grinding are sequentially corrected.

  Further, although the workpiece holding devices 61, 62, 63, 64 suck the workpiece W by the magnetic force, the workpiece holding devices 61, 62, 63 may be suctioned by a vacuum chuck, or the liquid is frozen. , 64 and the workpiece W may be fastened. Further, the workpiece holding devices 61, 62, 63, 64 may not be disposed at equal angular intervals on the turning table 5, but may be disposed at, for example, an arbitrary angular interval obtained by combining integer multiple angles with one angle. .

(effect)
As described above, the compound grinding machine 1 of the present embodiment is provided on the swivel table 5 capable of swiveling about the swivel axis, and on the circumference centered on the swivel axis in the swivel table 5 and parallel to the swivel axis. A plurality of workpiece holding devices 61, 62, 63 provided on a plurality of work spindles 81 having a work spindle 812 rotatable about a spindle line and a plurality of work spindles 812, each capable of holding a workpiece W , 64 and the rotary table 5 are provided so as to be movable relative to each other, and the workpiece W is sequentially conveyed by the rotation of the rotary table 5, whereby the workpiece W is positioned at the corresponding respective grinding rotational positions. In the case, a plurality of grindstones 9a, 9b, 9c for grinding the corresponding workpiece W, and a plurality of grindstone correction devices 7a, 7b, 7c for respectively correcting the properties of the plurality of grindstones 9a, 9b, 9c, When at least one of the number of grindstones 9a, 9b, 9c grinds the workpiece W, and when the workpiece W is not positioned at the grinding turning position corresponding to at least one other of the plurality of grindstones 9b, 9c And a control device 30 that corrects at least one other property of the plurality of grindstones 9b and 9c by any of the plurality of grindstone correction devices 7b and 7c.

  The composite grinding machine 1 can sequentially convey the workpiece W by turning, can grind the workpiece W positioned at the grinding turning position, and the work W is not positioned at the grinding turning position. The turning table 5 capable of correcting the properties of the grindstones 9 b and 9 c is provided. As a result, the composite grinding machine 1 does not have to be newly provided with a transfer device, and can be made compact. Further, the grinding of the workpiece W and the correction of the properties of the grindstones 9b and 9c can be performed simultaneously, and the tact time can be shortened.

  Further, the plurality of grinding wheels 9a, 9b, 9c include one or more grinding wheels 9a common to grinding a plurality of workpieces W, and two or more grinding wheels 9b, 9c dedicated to each grinding of a plurality of workpieces W Including. The control device 30 is a case where all of the common grindstones 9a and at least one of the dedicated grindstones 9b and 9c grind the workpiece W, and the grinding corresponding to at least one of the dedicated grindstones 9b and 9c is performed. When the workpiece W is not positioned at the turning position, the corresponding grindstone correction device corrects at least one other property of the dedicated grindstones 9b and 9c. As a result, when the workpiece W is being ground with another dedicated grindstone except at least one dedicated grindstone of two or more dedicated grindstones 9b and 9c, the workpiece is produced by the above-mentioned at least one dedicated grindstone It is possible to create a state in which W is not ground. Therefore, the correction of the at least one dedicated grinding wheel can be performed in that state, and the tact time can be shortened.

  Further, each time the turning table 5 is turned by a predetermined angle, the control device 30 sequentially corrects the two or more dedicated grindstones 9b and 9c by the corresponding grindstone correction device. As a result, the correction of all the dedicated grindstones 9b and 9c can be performed when the workpiece W is being ground by a grindstone other than the grinding stone being corrected, and the tact time can be shortened.

  Further, the compound grinding machine 1 used in the compound grinding method of the present embodiment is provided on the circumference around the turning axis of the turning table 5 which can turn about the turning axis and the turning axis of the turning table 5 A plurality of work holding devices 61, 62, 63, 64 capable of holding the main axis parallel to the turning axis and capable of relative movement with respect to the turning table 5; When the workpiece W is sequentially conveyed by the turning, the workpiece W is positioned at the corresponding respective grinding turning positions, a plurality of grinding wheels 9a, 9b, 9c for grinding the corresponding workpiece W, And a plurality of grinding stone correction devices 7a, 7b and 7c for respectively correcting the properties of the grinding stones 9a, 9b and 9c.

  And, in the composite grinding method of the present embodiment, at least one of the plurality of grinding wheels 9a, 9b, 9c grinds the workpiece W, and the grinding turning corresponding to the other at least one of the plurality of grinding wheels 9b, 9c. And correcting at least one other property of the plurality of grindstones 9b and 9c by any of the plurality of grindstone correction devices 7b and 7c when the workpiece W is not positioned at the position.

  Further, the plurality of grinding wheels 9a, 9b, 9c include one or more grinding wheels 9a common to grinding a plurality of workpieces W, and two or more grinding wheels 9b, 9c dedicated to each grinding of a plurality of workpieces W In the case where all the common grindstones 9a and at least one of the dedicated grindstones 9b and 9c grind the workpiece W, and the grinding pivot position corresponding to the other at least one of the dedicated grindstones 9b and 9c is included. When the workpiece W is not positioned, there is a step of correcting at least one other property of the dedicated grindstones 9b and 9c by the corresponding grindstone correction device. Further, each time the turning table 5 is turned by a predetermined angle, there is provided a step of sequentially correcting the two or more dedicated grindstones 9b and 9c by the corresponding grindstone correction device. According to these combined grinding methods, the same effects as the effects obtained by the above-described combined grinding machine 1 can be obtained.

  1: Compound grinding machine 2: Bed 3a, 3b, 3c: Column 4a, 4b, 4c: Grinding stone stand 5: Turning table 61, 62, 63, 64: Workpiece holding device 7a, 7b, 7c: Grinding wheel correction device 81: Workpiece spindle head 9a, 9b, 9c: grinding wheel 9d: grinding wheel 30: control device 31: X axis control unit 32: Z axis control unit 33: C axis control unit 34: spindle control unit 35: correction control unit 36: grinding wheel Axis control unit 37: Arm control unit 38: Recording unit W: Workpiece Wa: Outer ring Wb: Inner ring

Claims (5)

A swivel table pivotable about a pivot axis,
A plurality of workpiece headstocks, each provided on a circumference centered on the pivot axis in the pivot table and having a work spindle that is rotatable about a spindle parallel to the pivot axis;
A plurality of work holding devices provided on a plurality of the work spindles, each capable of holding a cylindrical work;
The movable table is provided so as to be movable relative to the swivel table, and the workpiece is sequentially transported by the swivel of the swivel table to position the workpiece at the corresponding respective grinding swivel positions. Grinding wheels for grinding the outer periphery or the inner periphery of the workpiece to be machined;
A plurality of grinding wheel correction devices for respectively correcting the properties of the plurality of grinding wheels;
In the case where at least one of the plurality of grinding wheels grinds the workpiece, and the workpiece is not positioned at the grinding turning position corresponding to at least one other of the plurality of grinding wheels, the plurality of grinding wheels A controller for correcting at least one other property of the plurality of wheels by any of the wheel correction devices;
Equipped with a combined grinding machine. The plurality of grinding wheels include one or more grinding wheels common to grinding the plurality of workpieces, and include two or more grinding wheels dedicated to each grinding of the plurality of workpieces,
The control device is a case where all of the common grindstones and at least one of the dedicated grindstones grind the workpiece, and the machining is performed at the grinding pivot position corresponding to at least one of the dedicated grindstones. The compound grinder according to claim 1, wherein when the object is not positioned, at least one other property of the dedicated grinding wheel is corrected by the corresponding grinding wheel correction device.   A swivel table pivotable about a pivot axis,
  A plurality of workpiece headstocks, each provided on a circumference centered on the pivot axis in the pivot table and having a work spindle that is rotatable about a spindle parallel to the pivot axis;
  A plurality of work holding devices provided on a plurality of the work spindles, each capable of holding a cylindrical work;
  The movable table is provided so as to be movable relative to the swivel table, and the workpiece is sequentially transported by the swivel of the swivel table to position the workpiece at the corresponding respective grinding swivel positions. Grinding wheels for grinding the outer periphery or the inner periphery of the workpiece to be machined;
  A plurality of grinding wheel correction devices for respectively correcting the properties of the plurality of grinding wheels;
  In the case where at least one of the plurality of grinding wheels grinds the workpiece, and the workpiece is not positioned at the grinding turning position corresponding to at least one other of the plurality of grinding wheels, the plurality of grinding wheels A controller for correcting at least one other property of the plurality of wheels by any of the wheel correction devices;
  Equipped with
  The plurality of grinding wheels include one or more grinding wheels common to grinding the plurality of workpieces, and include two or more grinding wheels dedicated to each grinding of the plurality of workpieces,
  The control device is a case where all of the common grindstones and at least one of the dedicated grindstones grind the workpiece, and the machining is performed at the grinding pivot position corresponding to at least one of the dedicated grindstones. A compound grinder, wherein when the object is not positioned, at least one other property of the dedicated grinding wheel is corrected by the corresponding grinding wheel correction device. The compound grinding machine according to claim 2 or 3 , wherein the control device sequentially corrects two or more dedicated whetstones by the corresponding whetstone correction device each time the turning table is turned by a predetermined angle. A swivel table pivotable about a pivot axis,
A plurality of workpiece holding devices respectively provided on the circumference of the pivot table about the pivot axis, capable of holding a cylindrical workpiece and rotatable about a principal axis parallel to the pivot axis;
The movable table is provided so as to be movable relative to the swivel table, and the workpiece is sequentially transported by the swivel of the swivel table to position the workpiece at the corresponding respective grinding swivel positions. Grinding wheels for grinding the outer periphery or the inner periphery of the workpiece to be machined;
A compound grinding method in a compound grinding machine comprising: a plurality of grinding wheel correction devices for respectively correcting the properties of the plurality of grinding wheels,
In the case where at least one of the plurality of grinding wheels grinds the workpiece, and the workpiece is not positioned at the grinding turning position corresponding to at least one other of the plurality of grinding wheels, the plurality of grinding wheels Modifying at least one other property of said plurality of wheels by any of the wheel correction devices.

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