JP6541546B2 - 切削装置 - Google Patents
切削装置 Download PDFInfo
- Publication number
- JP6541546B2 JP6541546B2 JP2015207468A JP2015207468A JP6541546B2 JP 6541546 B2 JP6541546 B2 JP 6541546B2 JP 2015207468 A JP2015207468 A JP 2015207468A JP 2015207468 A JP2015207468 A JP 2015207468A JP 6541546 B2 JP6541546 B2 JP 6541546B2
- Authority
- JP
- Japan
- Prior art keywords
- cutting
- dressing
- cutting blade
- grindstone
- outer peripheral
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
- B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P54/00—Cutting or separating of wafers, substrates or parts of devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/12—Dressing tools; Holders therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/06—Grinders for cutting-off
- B24B27/0608—Grinders for cutting-off using a saw movable on slideways
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B3/00—Sharpening cutting edges, e.g. of tools; Accessories therefor, e.g. for holding the tools
- B24B3/36—Sharpening cutting edges, e.g. of tools; Accessories therefor, e.g. for holding the tools of cutting blades
- B24B3/368—Sharpening cutting edges, e.g. of tools; Accessories therefor, e.g. for holding the tools of cutting blades installed as an accessory on another machine
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B3/00—Sharpening cutting edges, e.g. of tools; Accessories therefor, e.g. for holding the tools
- B24B3/36—Sharpening cutting edges, e.g. of tools; Accessories therefor, e.g. for holding the tools of cutting blades
- B24B3/46—Sharpening cutting edges, e.g. of tools; Accessories therefor, e.g. for holding the tools of cutting blades of disc blades
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/04—Devices or means for dressing or conditioning abrasive surfaces of cylindrical or conical surfaces on abrasive tools or wheels
- B24B53/053—Devices or means for dressing or conditioning abrasive surfaces of cylindrical or conical surfaces on abrasive tools or wheels using a rotary dressing tool
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/06—Devices or means for dressing or conditioning abrasive surfaces of profiled abrasive wheels
- B24B53/062—Devices or means for dressing or conditioning abrasive surfaces of profiled abrasive wheels using rotary dressing tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/06—Devices or means for dressing or conditioning abrasive surfaces of profiled abrasive wheels
- B24B53/08—Devices or means for dressing or conditioning abrasive surfaces of profiled abrasive wheels controlled by information means, e.g. patterns, templets, punched tapes or the like
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0064—Devices for the automatic drive or the program control of the machines
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
- B28D5/0094—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work the supporting or holding device being of the vacuum type
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
- H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
- H10P72/7618—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating carrousel
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Description
11 被加工物
14 切削ユニット
16 支持構造
18 切削ユニット移動機構
34 スピンドル
35 スピンドルハウジング
36 切削ブレード
38 ブレードカバー
40 切削液供給ノズル
44 ロータリードレッシング装置
46 ロータリードレッシング砥石
54 センサケース
54a 開口
56 光センサ
62 検査光
64 反射光
67 エアカーテン
Claims (3)
- 被加工物を保持するチャックテーブルと、スピンドルに装着した切削ブレードに切削液を供給しつつ該チャックテーブルに保持された被加工物を切削する切削手段と、を備えた切削装置であって、
該スピンドルを移動させ該切削ブレードを位置付ける移動手段と、
ドレッシング用砥石を該スピンドルと平行な回転軸で回転させるロータリードレッシング手段と、
該ドレッシング用砥石の外周位置を検出する光センサと、を備え、
該光センサで検出した該ドレッシング用砥石の外周位置に応じて該切削ブレードを該ロータリードレッシング手段に位置付け、所望の切り込み量で該ドレッシング用砥石を該切削ブレードで切削して該切削ブレードをドレッシングすることを特徴とする切削装置。 - 該光センサは、該ドレッシング用砥石の回転軸に向かって該光センサから出射された検査光が該ドレッシング用砥石の外周面に照射されるように位置づけられており、
該検査光の該ドレッシング用砥石の外周面からの反射光に基づいて該ドレッシング用砥石の直径を演算する演算手段を更に備え、
該演算手段で演算された該ドレッシング用砥石の直径に基づいて該切削ブレードを位置付け、該所定の切り込み量で該ドレッシング用砥石を該切削ブレードで切削する請求項1記載の切削装置。 - 該光センサから出射された検査光の通過を許容する開口を有する該光センサを収容する筐体と、
該開口近傍に設けられたエアカーテン形成手段とを更に備え、
該エアカーテン形成手段により形成されたエアカーテンにより、該開口から切削屑及び切削液が該筐体内に侵入し該光センサに付着するのを防止する請求項1又は2記載の切削装置。
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015207468A JP6541546B2 (ja) | 2015-10-21 | 2015-10-21 | 切削装置 |
| TW105127515A TWI685890B (zh) | 2015-10-21 | 2016-08-26 | 切割裝置 |
| KR1020160121516A KR102413812B1 (ko) | 2015-10-21 | 2016-09-22 | 절삭 장치 |
| US15/331,450 US10022838B2 (en) | 2015-10-21 | 2016-10-21 | Cutting apparatus |
| CN201610920580.5A CN106903810B (zh) | 2015-10-21 | 2016-10-21 | 切削装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015207468A JP6541546B2 (ja) | 2015-10-21 | 2015-10-21 | 切削装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2017077611A JP2017077611A (ja) | 2017-04-27 |
| JP6541546B2 true JP6541546B2 (ja) | 2019-07-10 |
Family
ID=58562215
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015207468A Active JP6541546B2 (ja) | 2015-10-21 | 2015-10-21 | 切削装置 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US10022838B2 (ja) |
| JP (1) | JP6541546B2 (ja) |
| KR (1) | KR102413812B1 (ja) |
| CN (1) | CN106903810B (ja) |
| TW (1) | TWI685890B (ja) |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6873712B2 (ja) * | 2017-01-17 | 2021-05-19 | 株式会社ディスコ | ドレッシングボード、切削ブレードのドレッシング方法及び切削装置 |
| JP7045841B2 (ja) * | 2017-12-08 | 2022-04-01 | 株式会社ディスコ | 切削装置 |
| JP7105093B2 (ja) * | 2018-04-17 | 2022-07-22 | 株式会社ディスコ | 切削装置 |
| JP7033485B2 (ja) * | 2018-04-17 | 2022-03-10 | 株式会社ディスコ | 切削ブレードの整形方法 |
| CN108818053A (zh) * | 2018-08-02 | 2018-11-16 | 苏州谊佳润机电制造有限公司 | 一种可稳定装夹的电梯配件加工用切割装置 |
| JP7222636B2 (ja) * | 2018-09-12 | 2023-02-15 | 株式会社ディスコ | エッジトリミング装置 |
| DE102018133083A1 (de) * | 2018-12-20 | 2020-06-25 | Carl Zeiss Jena Gmbh | Vorrichtung und Verfahren zum geregelten Bearbeiten eines Werkstückes mit einer Bearbeitungsstrahlung |
| US11565371B2 (en) * | 2018-12-31 | 2023-01-31 | Micron Technology, Inc. | Systems and methods for forming semiconductor cutting/trimming blades |
| JP7242129B2 (ja) * | 2019-01-21 | 2023-03-20 | 株式会社ディスコ | 切削装置及び切削ブレードのドレッシング方法 |
| JP7248557B2 (ja) * | 2019-10-24 | 2023-03-29 | Towa株式会社 | ブレード交換装置、切断装置、及び、切断品の製造方法 |
| CN110744731B (zh) * | 2019-10-30 | 2021-07-27 | 许昌学院 | 一种基于光电控制的晶片切片设备 |
| JP7493348B2 (ja) * | 2020-02-25 | 2024-05-31 | 株式会社ディスコ | 切削装置 |
| JP7277935B2 (ja) * | 2020-04-28 | 2023-05-19 | アピックヤマダ株式会社 | 樹脂モールド装置 |
| JP7277936B2 (ja) * | 2020-04-28 | 2023-05-19 | アピックヤマダ株式会社 | 樹脂モールド装置 |
| JP7354069B2 (ja) * | 2020-08-26 | 2023-10-02 | Towa株式会社 | 切断装置、及び、切断品の製造方法 |
| JP7754654B2 (ja) * | 2021-08-11 | 2025-10-15 | 株式会社ディスコ | ドレッシングリング及び被加工物の研削方法 |
| CN115781425B (zh) * | 2022-12-21 | 2026-01-16 | 广州市艾维斯机电科技有限公司 | 一种面料切割设备的磨刀及刀宽测量装置 |
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-
2015
- 2015-10-21 JP JP2015207468A patent/JP6541546B2/ja active Active
-
2016
- 2016-08-26 TW TW105127515A patent/TWI685890B/zh active
- 2016-09-22 KR KR1020160121516A patent/KR102413812B1/ko active Active
- 2016-10-21 US US15/331,450 patent/US10022838B2/en active Active
- 2016-10-21 CN CN201610920580.5A patent/CN106903810B/zh active Active
Also Published As
| Publication number | Publication date |
|---|---|
| KR20170046572A (ko) | 2017-05-02 |
| US10022838B2 (en) | 2018-07-17 |
| CN106903810B (zh) | 2020-02-21 |
| US20170113322A1 (en) | 2017-04-27 |
| KR102413812B1 (ko) | 2022-06-29 |
| CN106903810A (zh) | 2017-06-30 |
| JP2017077611A (ja) | 2017-04-27 |
| TWI685890B (zh) | 2020-02-21 |
| TW201715600A (zh) | 2017-05-01 |
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