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JP6541764B2 - Silver-coated copper powder and conductive paste, and method for producing them - Google Patents
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JP6541764B2 - Silver-coated copper powder and conductive paste, and method for producing them - Google Patents

Silver-coated copper powder and conductive paste, and method for producing them Download PDF

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Publication number
JP6541764B2
JP6541764B2 JP2017250620A JP2017250620A JP6541764B2 JP 6541764 B2 JP6541764 B2 JP 6541764B2 JP 2017250620 A JP2017250620 A JP 2017250620A JP 2017250620 A JP2017250620 A JP 2017250620A JP 6541764 B2 JP6541764 B2 JP 6541764B2
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silver
copper powder
coated copper
surface treatment
treatment agent
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JP2018076597A (en
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公一 本村
公一 本村
優樹 金城
優樹 金城
井上 健一
健一 井上
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Dowa Electronics Materials Co Ltd
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Dowa Electronics Materials Co Ltd
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Description

本発明は、電子部品等の電極や回路に適用される導電ペーストに用いられる銀被覆銅粉と、当該銀被覆銅粉を含む導電ペースト、並びにそれらの製造方法に係る。 The present invention relates to a silver-coated copper powder used for a conductive paste applied to electrodes and circuits of electronic parts and the like, a conductive paste containing the silver-coated copper powder, and a method for producing them .

電子部品等の電極や回路、電磁波シールドフィルム、導電性接着シートにおいて導電ペ
ーストが適用される。そして、当該導電ペーストには銅粉や銀粉といった金属粉が用いら
れている。
ここで、金属粉として銀粉を用いた銀系ペーストは、金属粉として銅粉を用いた銅系ペ
ーストと比較して耐酸化性に優れ、導電性にも優れているが、銀地金が高価である、マイ
グレーションが起こりやすい、はんだ食われ性において劣るといった課題も有している。
当該銀系ペーストの課題を解決するため、出願人は特許文献1、2を開示している。ま
た、特許文献3の提案もある。
A conductive paste is applied to electrodes and circuits of electronic parts and the like, an electromagnetic wave shielding film, and a conductive adhesive sheet. And metal powder, such as copper powder and silver powder, is used for the said conductive paste.
Here, a silver paste using silver powder as metal powder is superior in oxidation resistance and conductivity as compared to a copper paste using copper powder as metal powder, but silver metal is expensive. It also has the problems that migration is likely to occur and that it is inferior in solder corrosion resistance.
In order to solve the subject of the said silver-based paste, an applicant is disclosing patent document 1, two. There is also a proposal of Patent Document 3.

特開2010−275638号公報JP, 2010-275638, A 特開2012−167337号公報JP, 2012-167337, A 特開昭63−81706号公報Japanese Patent Application Laid-Open No. 63-81706

導電ペーストで用いる金属粉の形状としては球状のものとフレーク状のものとがある。
通常は、球状の金属粉とフレーク状の金属粉とを組み合わせて使用することが多い。
このとき、球状の金属粉は、当該導電ペーストにおける粘度の低減、硬化または燃焼さ
せた際の密度向上等といった効果を発揮し、フレーク状の金属粉は、当該導電ペーストに
おける粘性の増加、塗布性の向上、当該金属粉における嵩密度の上昇抑制といった効果を
発揮する、と考えられている。
しかしながら、当該球状およびフレーク状の銅粉を用いた導電ペーストであって、特に
低金属粉含量の導電ペーストでは、導電性の観点において更なる改善が望まれていた。
本発明は、上述の状況の下に成されたものであり、その解決しようとする課題は、低金
属粉含有量であっても十分な導電性を発揮する導電ペーストに用いることが出来る金属粉
を提供することである。
The shape of the metal powder used in the conductive paste may be spherical or flake.
Usually, spherical metal powder and flake metal powder are often used in combination.
At this time, the spherical metal powder exhibits effects such as reduction of viscosity of the conductive paste, and improvement of density when hardened or burned, and flake-like metal powder has an increase in viscosity of the conductive paste, and coatability. It is thought that the effect of improving the density of the metal powder and suppressing the increase of the bulk density of the metal powder is exhibited.
However, in the case of the conductive paste using the spherical and flake-like copper powder, particularly in the conductive paste with a low metal powder content, further improvement is desired from the viewpoint of conductivity.
The present invention has been accomplished under the above-described circumstances, and the problem to be solved is a metal powder that can be used for a conductive paste that exhibits sufficient conductivity even with a low metal powder content. To provide.

上述の課題を解決するため、本発明者らは鋭意研究を行った。
そして、樹状突起を有する銅粉、当該樹状突起を有する銅粉が複数個絡まって凝集し分
離不可能となった銅粉、当該樹状突起を有さない棒状の銅粉といった、球状でもフレーク
状でもない異形の銅粉へ銀被覆を施した銀被覆銅粉を知見した。
ここで、これらの異形の銅粉を混合したものへ銀を被覆した場合、それぞれの銅粉粒子
同士間や、銅粉粒子内において、銀被覆膜厚、銀被覆率等といった銀の被覆状態の均等性
が保たれない事態が考えられた。しかし、本発明者らの検討の結果、当該均等性に関わら
ず、銀被覆の有意な効果を得ることが出来た。その理由は明らかではないが、異形の銅粉
への銀被覆においては、従来の銀被覆銅粉と異なり、均等性が問われない状態が形成され
ているのではないかと推量している。
そして、当該銀被覆銅粉を導電ペーストに用いることで、球状やフレーク状の銅粉や銀
被覆銅粉を用いた場合に比較して、低電気抵抗値の導電路を多数形成することが可能にな
り、上述の課題を解決できることに想到し本発明を完成した。
In order to solve the above-mentioned subject, the present inventors conducted earnest research.
And even a spherical shape such as a copper powder having dendrites, a copper powder in which a plurality of copper powders having the dendrites are entangled and aggregated to become inseparable, and a rod-like copper powder not having the dendrites The silver-coated copper powder which applied silver coating to the non-flake-like odd-shaped copper powder was discovered.
Here, when silver is coated on a mixture of these different-shaped copper powders, the coated state of silver such as silver-coated film thickness, silver coverage, etc. between respective copper powder particles or in copper powder particles. In some cases, the evenness of However, as a result of studies by the present inventors, significant effects of the silver coating could be obtained regardless of the uniformity. Although the reason is not clear, it is inferred that, in the case of silver coating on the odd-shaped copper powder, unlike the conventional silver-coated copper powder, a state in which uniformity is not required may be formed.
And, by using the silver-coated copper powder for the conductive paste, it is possible to form a large number of conductive paths with low electric resistance compared to the case where spherical or flake-like copper powder or silver-coated copper powder is used. As a result, the present invention has been completed in view of solving the above-mentioned problems.

尚、説明の便宜のため、本発明に係る銀被覆銅粉に用いられる異形の銅粉において、上
述の樹状突起を有するものを「樹状突起銅粉」、当該樹状突起を有する銅粉が複数個絡ま
って凝集し分離不可能となったものを「棘状銅粉」、当該樹状突起を有さない棒状のもの
を「棒状銅粉」と記載することがある。また、これらの銅粉に銀被覆を施した銀被覆銅粉
を、「樹状突起銀被覆銅粉」「棘状銀被覆銅粉」「棒状銀被覆銅粉」と記載することがあ
る。
In addition, for convenience of explanation, among the copper powders of a different shape used for the silver-coated copper powder according to the present invention, those having the above-mentioned dendritic projections are referred to as “dendritic copper powders”, copper powders having the dendritic projections. In some cases, those in which a plurality of entanglements aggregate and become inseparable may be referred to as “clad copper powder”, and a rod-like one having no dendrites as “rod-like copper powder”. Moreover, the silver-coated copper powder which gave silver coating to these copper powders may be described as "dendritic silver-coated copper powder", "棘 -like silver-coated copper powder", and "rod-like silver-coated copper powder".

即ち、上述の課題を解決する第1の発明は、
樹状突起銀被覆銅粉と、棘状銀被覆銅粉と、棒状銀被覆銅粉とを含む銀被覆銅粉であって、
当該銀被覆の量が0.1質量%以上、30質量%以下であり、
当該銀被覆銅粉の表面に、パルミチン酸、ステアリン酸、オレイン酸から選ばれる1種ないし、これらの混合物からなる表面処理剤と、アジピン酸、マロン酸、こはく酸、アゼライン酸から選ばれる1種ないし、これらの混合物からなる表面処理剤とが設けられていることを特徴とする銀被覆銅粉である。
第2の発明は、
樹状突起銀被覆銅粉と、棘状銀被覆銅粉と、棒状銀被覆銅粉とを含む銀被覆銅粉であって、
当該銀被覆の量が0.1質量%以上、30質量%以下であり、
当該銀被覆銅粉の表面に、1H−ベンゾトリアゾールからなる表面処理剤が設けられていることを特徴とする銀被覆銅粉である。
第3の発明は、
第1または第2の発明に記載の銀被覆銅粉を含むことを特徴とする導電ペーストである。
第4の発明は、
銀被覆銅粉へ、第1の表面処理剤として、パルミチン酸、ステアリン酸、オレイン酸から選択される1種以上を含むエマルジョン、又はパルミチン酸、ステアリン酸、オレイン酸から選択される1種以上とアルコールとの混合溶液を添加して混合液とし、前記銀被覆銅粉へ第1の表面処理を行う工程と、
前記第1の表面処理を行った銀被覆銅粉へ、アジピン酸、マロン酸、こはく酸、アゼライン酸から選択される1種以上を含む第2の表面処理剤を添加して表面処理し、第1および第2の表面処理を行った銀被覆銅粉を得る工程とを、有することを特徴とする銀被覆銅粉の製造方法である。
第5の発明は、
銀被覆銅粉へ、1H−ベンゾトリアゾールからなる表面処理剤を添加して表面処理し銀被覆銅粉を得る工程を、有することを特徴とする銀被覆銅粉の製造方法である。
第6の発明は、
第4または第5の発明に記載の銀被覆銅粉の製造方法により製造された銀被覆銅粉と、適宜な樹脂および溶剤とを混練する工程を、有することを特徴とする導電ペーストの製造方法である。
That is, the first invention for solving the above-mentioned problems is:
A silver-coated copper powder comprising dendritic silver-coated copper powder, scale-like silver-coated copper powder, and rod-like silver-coated copper powder,
The amount of the silver coating is 0.1% by mass or more and 30% by mass or less,
1 type selected from palmitic acid, stearic acid and oleic acid on the surface of the silver-coated copper powder, and 1 type selected from adipic acid, malonic acid, succinic acid and azelaic acid Or a surface treatment agent comprising a mixture of these is provided, which is a silver-coated copper powder.
The second invention is
A silver-coated copper powder comprising dendritic silver-coated copper powder, scale-like silver-coated copper powder, and rod-like silver-coated copper powder,
The amount of the silver coating is 0.1% by mass or more and 30% by mass or less,
The surface treatment agent which consists of 1H-benzotriazole is provided in the surface of the said silver covering copper powder, It is a silver covering copper powder characterized by the above-mentioned.
The third invention is
A conductive paste comprising the silver-coated copper powder according to the first or second invention.
The fourth invention is
Silver coated copper powder, an emulsion comprising one or more selected from palmitic acid, stearic acid and oleic acid as a first surface treatment agent, or one or more selected from palmitic acid, stearic acid and oleic acid Adding a mixed solution with alcohol to form a mixed solution, and performing a first surface treatment on the silver-coated copper powder;
A second surface treatment agent containing one or more selected from adipic acid, malonic acid, succinic acid and azelaic acid is added to the first surface-treated silver-coated copper powder to perform surface treatment, Obtaining a silver-coated copper powder subjected to the first and second surface treatments, and a method of producing the silver-coated copper powder.
The fifth invention is
A method for producing a silver-coated copper powder comprising the steps of adding a surface treatment agent comprising 1H-benzotriazole to a silver-coated copper powder to perform surface treatment to obtain a silver-coated copper powder.
The sixth invention is
A method for producing a conductive paste, comprising the step of kneading the silver-coated copper powder produced by the method for producing a silver-coated copper powder according to the fourth or fifth invention, and an appropriate resin and solvent. It is.

本発明に係る銀被覆銅粉は、低金属粉含量であっても十分な導電性を発揮する導電ペー
ストの金属粉として用いることが出来る。
The silver-coated copper powder according to the present invention can be used as a metal powder of a conductive paste that exhibits sufficient conductivity even with a low metal powder content.

本発明に係る銀被覆銅粉を11枚の視野で捉えたSEM写真(1000倍)の1視野目である。It is 1st visual field of the SEM photograph (1000 times of magnification) which captured the silver-coated copper powder which concerns on this invention by 11 visual fields. 本発明に係る銀被覆銅粉を11枚の視野で捉えたSEM写真(1000倍)の2視野目である。It is 2 visual fields of the SEM photograph (1000 times) which captured silver covering copper powder concerning the present invention with 11 visual fields. 本発明に係る銀被覆銅粉を11枚の視野で捉えたSEM写真(1000倍)の3視野目である。It is 3rd visual field of the SEM photograph (1000 times) which captured silver covering copper powder concerning the present invention with 11 fields of visual field. 本発明に係る銀被覆銅粉を11枚の視野で捉えたSEM写真(1000倍)の4視野目である。It is 4th visual field of the SEM photograph (1000 times) which captured the silver-coated copper powder which concerns on this invention by 11 sheets of visual field. 本発明に係る銀被覆銅粉を11枚の視野で捉えたSEM写真(1000倍)の5視野目である。It is the 5th visual field of the SEM photograph (1000 times of magnification) which caught silver covering copper powder concerning the present invention by 11 visual fields. 本発明に係る銀被覆銅粉を11枚の視野で捉えたSEM写真(1000倍)の6視野目である。It is the sixth visual field of a SEM photograph (1000 ×) of the silver-coated copper powder according to the present invention captured in eleven visual fields. 本発明に係る銀被覆銅粉を11枚の視野で捉えたSEM写真(1000倍)の7視野目である。It is the 7th visual field of the SEM photograph (1000 times of magnification) which caught silver covering copper powder concerning the present invention by 11 visual fields. 本発明に係る銀被覆銅粉を11枚の視野で捉えたSEM写真(1000倍)の8視野目である。It is the eighth view of the SEM photograph (1000 ×) of the silver-coated copper powder according to the present invention captured in 11 views. 本発明に係る銀被覆銅粉を11枚の視野で捉えたSEM写真(1000倍)の9視野目である。It is the 9th visual field of the SEM photograph (1000 times of magnification) which caught silver covering copper powder concerning the present invention with 11 sheets of visual field. 本発明に係る銀被覆銅粉を11枚の視野で捉えたSEM写真(1000倍)の10視野目である。It is the tenth visual field of the SEM photograph (1000 ×) of the silver-coated copper powder according to the present invention captured in eleven visual fields. 本発明に係る銀被覆銅粉を11枚の視野で捉えたSEM写真(1000倍)の11視野目である。It is the 11th visual field of the SEM photograph (1000 times of magnification) which caught silver covering copper powder concerning the present invention with 11 sheets of visual field. 本発明に係る銀被覆銅粉の製造フロー図である。It is a manufacture flow figure of silver covering copper powder concerning the present invention.

本発明に係る導電ペースト用の銀被覆銅粉は、異形の銅粉に銀被覆がされた銀被覆銅粉
であり、さらに所望により表面処理剤1、2により表面処理されたものである。
以下、本発明に係る導電ペースト用銀被覆銅粉、その製造方法の順に説明する。
The silver-coated copper powder for a conductive paste according to the present invention is a silver-coated copper powder in which a silver powder is coated on a modified copper powder, and further surface-treated with surface treatment agents 1 and 2 as desired.
The silver-coated copper powder for a conductive paste according to the present invention and the method for producing the same will be described below in this order.

1.本発明に係る導電ペースト用銀被覆銅粉
本発明に係る銀被覆銅粉は、樹状突起を有する銀被覆銅粉、当該樹状突起を有する銀被
覆銅粉が複数個絡まって凝集し分離不可能となった銀被覆銅粉、当該樹状突起を有さない
棒状の銀被覆銅粉がある。これら銀被覆銅粉についてSEM写真を参照しながら説明する

図1〜11は、後述する実施例28に係る銀被覆銅粉を11枚の視野で捉えた1000
倍のSEM写真である。図1において、樹状突起銀被覆銅粉、棘状銀被覆銅粉、および棒
状銀被覆銅粉のそれぞれの典型例を楕円で囲み、印をつけた。
1. Silver-coated copper powder for conductive paste according to the present invention In the silver-coated copper powder according to the present invention, a plurality of silver-coated copper powder having dendritic projections and a plurality of silver-coated copper powders having dendritic projections are entangled and aggregated to cause separation failure. There are silver-coated copper powders that have become possible, and rod-like silver-coated copper powders that do not have such dendrites. These silver-coated copper powders are described with reference to SEM photographs.
FIGS. 1-11 are 1000 which caught silver covering copper powder which concerns on Example 28 mentioned later in the visual field of 11 sheets.
It is a double SEM picture. In FIG. 1, typical examples of dendritic silver-coated copper powder, sickle-like silver-coated copper powder, and rod-like silver-coated copper powder are circled and marked.

図1から理解できるように樹状突起銀被覆銅粉とは、一本の主軸となる幹部分を有して
おり、当該幹部分から複数の枝が分岐している構造を有している樹状突起銅粉に、0.1
〜30質量%の銀被覆が成されたものである。
棘状銀被覆銅粉は、複数の樹状突起銀被覆銅粉が、互いに絡まり凝集して分離不可能と
なった構造を有しているか、核となる中心部から枝が放射状に伸びた構造を有している棘
状銅粉に、0.1〜30質量%の銀被覆が成されたものである。
棒状銀被覆銅粉は、一本の主軸となる幹部分を有している樹状突起銅粉に、0.1〜3
0質量%の銀被覆が成されたものである。
As can be understood from FIG. 1, dendrite silver-coated copper powder has a trunk portion to be one main axis, and has a dendritic structure in which a plurality of branches are branched from the trunk portion. Protruding copper powder to 0.1
-30 mass% silver coating was made.
The cage-like silver-coated copper powder has a structure in which a plurality of dendritic silver-coated copper powders entangle and aggregate with each other to become inseparable, or a structure in which branches radially extend from a central portion serving as a core 0.1-30 mass% silver coating was made to the bowl-like copper powder which has these.
The rod-like silver-coated copper powder is 0.1 to 3 in dendrite copper powder having a trunk portion to be one main spindle.
A silver coating of 0% by mass was applied.

当該図1〜図11に示す11の視野において、本発明に係る銀被覆銅粉が358個観察
された。そして、当該358個の銀被覆銅粉中、樹状突起銀被覆銅粉が9個、棘状銀被覆
銅粉が254個、棒状銀被覆銅粉が95個存在した。当該個数の存在比率を求めると、樹
状突起銀被覆銅粉が2.5%、棘状銀被覆銅粉が71%、棒状銀被覆銅粉が26.5%と
なった。当該結果を表1に示す。
In the field of view 11 shown in FIGS. 1 to 11, 358 pieces of silver-coated copper powder according to the present invention were observed. Then, among the 358 silver-coated copper powders, 9 dendritic silver-coated copper powders, 254 scaly silver-coated copper powders, and 95 rod-shaped silver-coated copper powders were present. When the abundance ratio of the number was determined, the dendritic silver-coated copper powder was 2.5%, the scaly silver-coated copper powder was 71%, and the rod-like silver-coated copper powder was 26.5%. The results are shown in Table 1.

さらに、上述した11視野より、形状が分かり易い独立した樹状突起銀被覆銅粉の粒子
を9個選定し、当該樹状突起銀被覆銅粉に対して長径および短径を測定し、短径/長径比
を求めた。当該結果を表2に示す。
Furthermore, nine particles of dendrite-like silver-coated copper powder whose shapes are easy to understand are selected from the 11 fields of view mentioned above, and the major axis and minor axis are measured with respect to the dendrite-like silver-coated copper powder. The major diameter ratio was determined. The results are shown in Table 2.

本発明に係る銀被覆銅粉において、樹状突起銀被覆銅粉と、棘状銀被覆銅粉と、棒状銀
被覆銅粉とが含まれていることが好ましい。異なる形状を有する銀被覆銅粉が含まれてい
ることで、各々の銀被覆銅粉が有する突起間の導電路が形成し易くなると考えられる。
The silver-coated copper powder according to the present invention preferably includes dendritic silver-coated copper powder, scaly silver-coated copper powder, and rod-shaped silver-coated copper powder. It is considered that the inclusion of the silver-coated copper powder having different shapes facilitates formation of a conductive path between the projections of each silver-coated copper powder.

本発明に係る銀被覆銅粉において、樹状突起銀被覆銅粉と、棘状銀被覆銅粉と、棒状銀
被覆銅粉との存在割合は、これらの銀被覆銅粉との総個数において、前記樹状突起銀被覆
銅粉の占める個数割合が0.10%以上、80%以下の範囲、前記棘状銀被覆銅粉の占め
る個数割合が0.10%以上、75%以下の範囲、前記棒銀被覆状銅粉の占める個数割合
が0.10%以上、40%以下の範囲であることが、十分な導電性を担保する観点から好
ましい。これは、本発明に係る銀被覆銅粉を含む導電ペーストにおいて、各々の銀被覆銅
粉が上述の割合の配囲内で存在しているとき、各々の銀被覆銅粉が有する突起間の導電路
が形成し易くなる為であると考えられる。
また、これらの銀被覆銅粉の配合比としては、導電ペースト化の際における添加薬剤等
の影響もあるが、等量である必要ない。例えば、樹状突起銀被覆銅粉1個数部に対して、
棘状銀被覆銅粉0.1〜1000個数部、棒状銀被覆銅粉0.1〜1000個数部の配合
比であればよい。
In the silver-coated copper powder according to the present invention, the proportions of dendritic silver-coated copper powder, scale-like silver-coated copper powder, and rod-like silver-coated copper powder are the total number of these silver-coated copper powders. The percentage of the number occupied by the dendrite silver-coated copper powder is in the range of 0.10% or more and 80% or less, the number percentage of the scaly silver-coated copper powder is in the range of 0.10% or more and 75% or less, It is preferable from the viewpoint of securing sufficient conductivity that the number ratio occupied by the bar-silver-coated copper powder is in the range of 0.10% or more and 40% or less. This is because, in the conductive paste containing the silver-coated copper powder according to the present invention, when each silver-coated copper powder is present in the above-mentioned ratio range, the conductive path between the projections of each silver-coated copper powder Is considered to be easy to form.
Moreover, as a compounding ratio of these silver-coated copper powder, although there is also an influence of the addition chemical | medical agent in the case of electrically conductive paste-izing, etc., it is not necessary to be equivalent. For example, with respect to 1 part of dendritic silver coated copper powder,
What is necessary is just a compounding ratio of 0.1-1000 number part of bowl-like silver-coated copper powder and 0.1-1000 number part of rod-like silver-coated copper powder.

本発明に係る銀被覆銅粉において、銀被覆量が0.1質量%以上あれば十分な導電性を
担保することが出来る。一方、原料コストの観点からは、銀被覆量が30質量%以下であ
ることが好ましい。
In the silver-coated copper powder according to the present invention, sufficient conductivity can be ensured if the silver coating amount is 0.1% by mass or more. On the other hand, in terms of raw material cost, the silver coverage is preferably 30% by mass or less.

本発明に係る銀被覆銅粉において、所望により当該銀被覆銅粉の表面に1種または2種
以上の表面処理剤を設けることも好ましい構成である。当該表面処理剤を設けることで、
銀被覆銅粉を導電ペースト化した際、当該導電ペーストを構成する樹脂への分散性が向上
する、当該樹脂中における銀被覆銅粉の化学的安定性が向上する、等の効果を得ることが
出来る。
そして、当該表面処理剤の好ましい例として、ステアリン酸、パルミチン酸、オレイン
酸、1H−ベンゾトリアゾール、アジピン酸、マロン酸、こはく酸、アゼライン酸等を挙
げることが出来る。これらの表面処理剤から選択される1種または2種以上を銀被覆銅粉
の表面に設けることが出来る。
当該表面処理剤を銀被覆銅粉の表面に設ける量は、0.01質量%以上であれば上述し
た添加効果を得ることが出来る。一方、当該表面処理剤が導電性に与える影響や原料コス
トの観点からは、銀被覆銅粉の表面に設ける量は2質量%以下であることが好ましい。
In the silver-coated copper powder according to the present invention, it is also preferable to provide one or more surface treatment agents on the surface of the silver-coated copper powder, if desired. By providing the surface treatment agent,
When the silver-coated copper powder is converted to a conductive paste, the dispersibility in the resin constituting the conductive paste is improved, and the chemical stability of the silver-coated copper powder in the resin is improved. It can.
And as a preferable example of the said surface treatment agent, stearic acid, palmitic acid, an oleic acid, 1H-benzotriazole, adipic acid, malonic acid, a succinic acid, azelaic acid etc. can be mentioned. One or more selected from these surface treatment agents can be provided on the surface of the silver-coated copper powder.
If the amount of the surface treatment agent provided on the surface of the silver-coated copper powder is 0.01% by mass or more, the above-described addition effect can be obtained. On the other hand, it is preferable that the quantity provided in the surface of silver covering copper powder is 2 mass% or less from the viewpoint of the influence which the said surface treating agent gives to electroconductivity, and raw material cost.

本発明に係る銀被覆銅粉において、BET値が0.1m/g以上、1.0m/g以
下であることが好ましい。BET値が当該範囲にあると、当該銀被覆銅粉を導電ペースト
化した際、当該導電ペーストを構成する樹脂への分散性が良好で、各々の銀被覆銅粉が有
する突起間の導電路が形成し易くなる為であると考えられる。
In the silver-coated copper powder according to the present invention, the BET value is preferably 0.1 m 2 / g or more and 1.0 m 2 / g or less. When the BET value is within the above range, when the silver-coated copper powder is made into a conductive paste, the dispersibility in the resin constituting the conductive paste is good, and the conductive path between the projections of each silver-coated copper powder is It is considered to be easy to form.

本発明に係る銀被覆銅粉において、TAP密度の値が1g/cm以上、5g/cm
以下あることが好ましい。TAP密度の値が当該範囲にあると、当該銀被覆銅粉を導電ペ
ースト化した際、当該導電ペーストを構成する樹脂への分散性が良好で、各々の銀被覆銅
粉が有する突起間の導電路が形成し易くなる為であると考えられる。
In the silver-coated copper powder according to the present invention, the TAP density value is 1 g / cm 3 or more, 5 g / cm 3
It is preferable to have the following. When the value of the TAP density is within the above range, when the silver-coated copper powder is made into a conductive paste, the dispersibility in the resin constituting the conductive paste is good, and the conductive between the projections of each silver-coated copper powder is It is thought that it is because it becomes easy to form a path.

本発明に係る銀被覆銅粉は公知の方法で、適宜な樹脂、溶剤と混練することで、導電ペ
ーストを製造することが出来る。
The silver-coated copper powder which concerns on this invention can manufacture an electrically conductive paste by knead | mixing with appropriate resin and a solvent by a well-known method.

以上説明した本発明に係る当該銀被覆銅粉を導電ペーストに用いることで、球状やフレ
ーク状の銅粉や銀被覆銅粉を用いた場合に比較して、低金属粉含有量であっても当該導電
ペースト導電性を保つことが出来た。
これは、本発明に係る当該銀被覆銅粉が多数の突起を有することで、互いの銅粉におけ
る突起間において多数の導電路を形成することが可能になり、低金属粉含有量であっても
当該導電ペーストの導電性を保つことが出来るものと考えられる。
By using the silver-coated copper powder according to the present invention as described above for the conductive paste, the metal powder content is low even compared to when spherical or flake-like copper powder or silver-coated copper powder is used. It was possible to maintain the conductivity of the conductive paste.
This is because the silver-coated copper powder according to the present invention has a large number of projections, which makes it possible to form a large number of conductive paths between the projections in each other, which has a low metal powder content. It is considered that the conductivity of the conductive paste can be maintained.

2.本発明に係る導電ペースト用銀被覆銅粉の製造方法
本発明に係る導電ペースト用銀被覆銅粉の製造方法について、図12に示す製造フロー
を参照しながら説明する。
2. Method for Producing Silver-Coated Copper Powder for Conductive Paste According to the Present Invention A method for producing silver-coated copper powder for conductive paste according to the present invention will be described with reference to the production flow shown in FIG.

純水〈1〉を準備し、そこへエチレンジアミン四酢酸四ナトリウム塩(EDTA・4N
a)50%水溶液〈2〉と、炭酸アンモニウム〈3〉とを添加〈4〉し、溶解〈5〉して
液温を10〜45℃に調整し〈6〉溶液を得た。当該溶液において、エチレンジアミン四
酢酸四ナトリウム濃度は0.1〜40質量%、炭酸アンモニウム濃度は0.1〜40質量
%とする。当該溶液へ、硝酸銀水溶液〈7〉を添加〈8〉し、5〜60分間混合〈9〉し
て銀錯塩溶液を調製する。当該硝酸銀水溶液において銀濃度は0.1〜50質量%とする
Prepare pure water <1> and add ethylenediaminetetraacetic acid tetrasodium salt (EDTA · 4N)
a) 50% aqueous solution <2> and ammonium carbonate <3> were added <4>, dissolved <5>, and the solution temperature was adjusted to 10-45 ° C. to obtain <6> solution. In the solution, the concentration of tetrasodium ethylenediaminetetraacetate is 0.1 to 40% by mass, and the concentration of ammonium carbonate is 0.1 to 40% by mass. An aqueous solution of silver nitrate <7> is added to the solution <8> and mixed for 5 to 60 minutes <9> to prepare a silver complex salt solution. Silver concentration shall be 0.1-50 mass% in the said silver nitrate aqueous solution.

一方、純水〈10〉を準備し、そこへエチレンジアミン四酢酸四ナトリウム塩(EDT
A・4Na)50%水溶液〈11〉と、炭酸アンモニウム〈12〉と、所望によりイソプ
ロピルアルコール〈13〉とを添加して〈14〉溶解し〈15〉、液温を10〜45℃に
調整して〈16〉、溶液を得た。当該溶液において、エチレンジアミン四酢酸四ナトリウ
ム濃度は0.1〜40質量%、炭酸アンモニウム濃度は0.1〜40質量%、イソプロピ
ルアルコール濃度は0〜40質量%とする。当該溶液へ、樹状突起銅粉、棘状銅粉、棒状
銅粉を含む電解銅粉〈17〉を添加して〈18〉、5〜60分間攪拌、保持〈19〉して
銅粉分散液を得る。尚、電解銅粉〈17〉として、樹状突起銅粉、棘状銅粉、棒状銅粉を
含む市販の電解銅粉を用いることが出来る。
Prepare pure water <10> and add ethylenediaminetetraacetic acid tetrasodium salt (EDT)
A. 4Na) 50% aqueous solution <11>, ammonium carbonate <12> and optionally isopropyl alcohol <13> are added and dissolved <14><15>, and the solution temperature is adjusted to 10-45 ° C. The solution was obtained <16>. In the solution, the concentration of tetrasodium ethylenediaminetetraacetate is 0.1 to 40% by mass, the concentration of ammonium carbonate is 0.1 to 40% by mass, and the concentration of isopropyl alcohol is 0 to 40% by mass. Electrolytic copper powder <17> containing dendritic copper powder, cage-like copper powder and rod-like copper powder is added to the solution, <18>, stirring and holding for 5 to 60 minutes <19>, and copper powder dispersion Get In addition, as electrolytic copper powder <17>, a commercially available electrolytic copper powder containing dendritic copper powder, pot-like copper powder, and rod-like copper powder can be used.

前記10〜45℃に調整された銅粉分散液へ、前記銀錯塩溶液を添加〈20〉して混合
液とし、5〜60分間攪拌して熟成させ〈21〉、銅粉への銀被覆反応を実施して銀被覆
銅粉を生成させる。
当該添加混合の際の銀添加量は添加した電解銅粉<17>に対して0.1〜30質量%
とする。
尚、このとき、前記銅粉分散液を、乾燥窒素ガス雰囲気中に設置して液温を10〜45
℃に調整した後、前記銀錯塩溶液を添加することで、液温を10〜45℃に保持しながら
添加混合を行うことが出来る。
The silver complex salt solution is added to the copper powder dispersion adjusted to 10 to 45 ° C. <20> to make a mixed solution, stirred for 5 to 60 minutes and aged <21>, and silver covering reaction to copper powder To produce a silver-coated copper powder.
The amount of silver added during the addition and mixing is 0.1 to 30% by mass with respect to the added electrolytic copper powder <17>
I assume.
At this time, the copper powder dispersion is placed in a dry nitrogen gas atmosphere, and the liquid temperature is 10 to 45.
After adjusting to ° C, addition and mixing can be performed while maintaining the liquid temperature at 10 to 45 ° C by adding the silver complex salt solution.

前記保持後、所望により前記混合液へ、表面処理剤1の溶液(エマルジョン)〈22〉
を添加し〈23〉、5〜60分間攪拌を継続して熟成し〈24〉、生成した前記銀被覆銅
粉への表面処理を行う。
ここで当該表面処理剤1としては、パルミチン酸、ステアリン酸、オレイン酸等、およ
び、これらの混合物を挙げることが出来る。表面処理剤1の溶液(表面処理剤1のエマル
ジョン、または表面処理剤1とアルコールの混合溶液)における表面処理剤1の添加量は
、前記銀被覆銅粉に対して0.01〜1.0質量%とする。また、表面処理剤1とアルコ
ールの混合溶液のアルコールには、メタノール、エタノール、イソプロピルアルコール、
市販の変性アルコールなど種々のアルコールを使用できる。
After the holding, if necessary, a solution of the surface treatment agent 1 (emulsion) <22> to the mixed solution.
<23>, and stirring is continued for 5 to 60 minutes to ripen <24>, and surface treatment of the produced silver-coated copper powder is performed.
Here, examples of the surface treatment agent 1 include palmitic acid, stearic acid, oleic acid and the like, and mixtures thereof. The addition amount of the surface treatment agent 1 in the solution of the surface treatment agent 1 (the emulsion of the surface treatment agent 1 or the mixed solution of the surface treatment agent 1 and alcohol) is 0.01 to 1.0 to the silver-coated copper powder. We assume mass%. In addition, the alcohol of the mixed solution of surface treatment agent 1 and alcohol is methanol, ethanol, isopropyl alcohol,
Various alcohols such as commercially available denatured alcohols can be used.

前記表面処理の後、前記混合液を濾過して濾過物を得、当該濾過物を純水で洗浄して〈
25〉ウェットケーキを得る。当該得られたウェットケーキを、100〜150℃の窒素
雰囲気下で乾燥〈26〉を行い、銀被覆銅粉を得る。乾燥には、減圧乾燥機を使用して3
0〜100℃で乾燥を行ってもよい。当該得られた銀被覆銅粉から、目開き25〜50μ
mの篩操作により〈27〉粗大粒子を除去し、本発明に係る銀被覆銅粉〈31〉を得る。
ここで、所望により当該粗大粒子を除去した銀被覆銅粉へ表面処理剤2〈28〉を添加
して〈29〉表面処理し〈30〉、本発明に係る銀被覆銅粉〈31〉を得ても良い。
ここで、当該表面処理剤2としては、1H−ベンゾトリアゾール、アジピン酸、マロン
酸、こはく酸、アゼライン酸等および、これらの混合物を挙げることが出来る。表面処理
剤2の添加量は、前記銀被覆銅粉に対して0.01〜1.0質量%とする。
After the surface treatment, the mixture is filtered to obtain a filtrate, and the filtrate is washed with pure water.
25> Get a wet cake. The obtained wet cake is dried in a nitrogen atmosphere at 100 to 150 ° C. <26> to obtain a silver-coated copper powder. Use a vacuum dryer to dry 3
Drying may be performed at 0 to 100 ° C. From the obtained silver-coated copper powder, 25 to 50 μ openings
The coarse particles of <27> are removed by sieving operation m to obtain silver-coated copper powder <31> according to the present invention.
Here, the surface treatment agent 2 <28> is added to the silver-coated copper powder from which the coarse particles have been removed, if desired, to perform <29> surface treatment <30> to obtain the silver-coated copper powder <31> according to the present invention. It is good.
Here, as the surface treating agent 2, 1H-benzotriazole, adipic acid, malonic acid, succinic acid, azelaic acid and the like, and mixtures thereof can be mentioned. The addition amount of the surface treatment agent 2 shall be 0.01-1.0 mass% with respect to the said silver-coated copper powder.

以下、実施例を参照しながら、本発明を具体的に説明する。
(実施例1)
炭酸アンモニウム197gと、エチレンジアミン四酢酸四ナトリウム塩(EDTA・4
Na)50%水溶液634gとを純水729gに溶解し、液温を25℃に調整し溶液を得
た。当該得られた溶液と、銀27.8g含有の硝酸銀水溶液とを混合して、銀錯塩溶液を
調整した。
一方、炭酸アンモニウム178gと、エチレンジアミン四酢酸四ナトリウム塩(EDT
A・4Na)50%水溶液288gとを純水2416gに溶解させて溶液を得た。当該得
られた溶液へ、JX日鉱日石金属株式会社製#51−R(A)電解銅粉250gを加え攪
拌して銅粉分散液を得た。
前記銅粉分散液を乾燥窒素ガス雰囲気中に設置して液温を25℃に調整した後、前記銀
錯塩溶液を添加して混合液とし、銅粉への銀被覆反応を実施して銀被覆銅粉を生成させた
。そして、当該混合液を30分間攪拌しながら保持した。
その後、前記混合液を濾過して濾過物を得、当該濾過物を純水で洗浄して得られたウェ
ットケーキを120℃の窒素雰囲気で乾燥を行い、銀被覆銅粉を得た。
得られた銀被覆銅粉から、目開き32μmの篩いを用いて粗大粒子を除去し、実施例1
に係る銀被覆銅粉を得た。当該銀被覆銅粉の作製条件を表3に記載する。
Hereinafter, the present invention will be specifically described with reference to examples.
Example 1
197 g of ammonium carbonate and ethylenediaminetetraacetic acid tetrasodium salt (EDTA 4
Na) 50% aqueous solution (634 g) was dissolved in 729 g of pure water, and the solution temperature was adjusted to 25 ° C. to obtain a solution. The solution thus obtained was mixed with an aqueous solution of silver nitrate containing 27.8 g of silver to prepare a silver complex salt solution.
On the other hand, 178 g of ammonium carbonate and tetrasodium ethylenediaminetetraacetic acid salt (EDT
A. 4Na) 288 g of a 50% aqueous solution was dissolved in 2416 g of pure water to obtain a solution. To the resulting solution, 250 g of # 51-R (A) electrolytic copper powder manufactured by JX Nippon Mining & Metals Co., Ltd. was added and stirred to obtain a copper powder dispersion.
The copper powder dispersion is placed in a dry nitrogen gas atmosphere to adjust the liquid temperature to 25 ° C. Then, the silver complex salt solution is added to form a mixed solution, and the silver coating reaction on copper powder is carried out to coat the silver Copper powder was produced. And the said liquid mixture was hold | maintained stirring for 30 minutes.
Thereafter, the mixed solution is filtered to obtain a filtrate, and the wet cake obtained by washing the filtrate with pure water is dried in a nitrogen atmosphere at 120 ° C. to obtain a silver-coated copper powder.
Coarse particles are removed from the obtained silver-coated copper powder using a sieve with an opening of 32 μm.
Silver-coated copper powder according to The preparation conditions of the said silver-coated copper powder are described in Table 3.

実施例1に係る銀被覆銅粉のBET値、TAP密度、酸素含有量、炭素含有量、および
銀含有量を測定した。当該測定結果を表4に記載する。次に、当該銀被覆銅粉の10%の
累積粒度(D10)、25%の累積粒度(D25)、50%の累積粒度(D50)、75
%の累積粒度(D75)、90%の累積粒度(D90)を測定し、さらに、色差(L
、b)を測定した。当該測定結果を表4に記載する。
The BET value, TAP density, oxygen content, carbon content, and silver content of the silver-coated copper powder according to Example 1 were measured. The measurement results are described in Table 4. Next, the 10% cumulative particle size (D10), the 25% cumulative particle size (D25), the 50% cumulative particle size (D50), 75 of the silver-coated copper powder
% Cumulative particle size (D75), 90% cumulative particle size (D90), and further, color difference (L * ,
The a * and b * ) were measured. The measurement results are described in Table 4.

但し、BET値は、BET比表面積測定装置(ユアサイオニクス株式会社製:4ソーブ
US)を用いてBET法により求めた。
TAP密度は、特開2007−263860に準拠して測定した。
具体的には、金型(空の金型の高さをh0(μm)、空の金型の重量をw0(mg)と
した。)に試料を装填しマイクロメーターにセットした。次に、当該マイクロメーターの
アンビルをまわして当該金型を圧縮し、ラチェットを5回クリックさせてそのときの金型
の高さを読み取り、この高さをh1(μm)とした。一方、試料込みの金型の重量を測定
し、当該重量をw1(mg)とした。
w0、w1、h0、h1の値より、次式1よりTAP密度を求めた。尚、36.6は係
数である。
TAP密度=36.6×(w1−w0)÷(h1−h0)(g/cm)・・・(式1

酸素含有量は、酸素・窒素分析装置(LECO社製:TC−436型)により測定した
炭素含有量は、炭素・硫黄分析装置(堀場製作所製:EMIA−220V)により測定
した。
Ag含有量の測定方法について説明する。
試料2gを秤量し、純水で洗い流しながらビーカーへ移した後、硝酸10mlを投入し
て加熱溶解する。放冷後、溶解液をろ過し浮遊している有機物成分を除去して、ろ液を得
る。当該ろ液に純水100mlを加え、HClを6ml添加し十分に攪拌し、さらにHC
lを添加する。そして、新たなAgClの沈殿ができなくなるまでHClを添加した後、
溶液が透明になるまで加熱、熟成を実施する。その後、ガラスファイバーフィルター(重
量W1(g)とする)でろ過し、回収したAgClの沈殿を乾燥機により110℃で3時
間乾燥した。放冷後、ガラスファイバーフィルターと回収したAgClをあわせて秤量し
、その重量をW2(g)とした。
W1、W2の値より、次式2よりAg含有量を求めた。
Ag(質量%)=(W2−W1)/当初の試料量(g)×0.7526×100・・・
(式2)
累積粒度は、レーザー回折式粒度分布装置(SYMPATEC社製、ヘロス粒度分布測
定装置、HELOS&RODOS)により測定した。
色差は、色差計(日本電色工業株式会社製、Spectro Color Meter
SQ2000)により測定した。
However, the BET value was determined by the BET method using a BET specific surface area measuring device (manufactured by Yua Sionix Inc .: 4 sorb US).
TAP density was measured based on Unexamined-Japanese-Patent No. 2007-263860.
Specifically, the sample was loaded into a mold (the height of the empty mold was h0 (μm), and the weight of the empty mold was w0 (mg)), and the sample was set to a micrometer. Next, the anvil of the micrometer was turned to compress the mold, the ratchet was clicked five times, the height of the mold at that time was read, and this height was set to h1 (μm). On the other hand, the weight of the mold containing the sample was measured, and the weight was defined as w1 (mg).
From the values of w0, w1, h0 and h1, the TAP density was determined by the following equation 1. Here, 36.6 is a coefficient.
TAP Density = 36.6 × (w1-w0) ÷ (h1-h0) (g / cm 3) ··· ( wherein 1
)
The oxygen content was measured by an oxygen / nitrogen analyzer (manufactured by LECO: model TC-436). The carbon content was measured by a carbon / sulfur analyzer (manufactured by Horiba, Ltd .: EMIA-220V).
The measuring method of Ag content is demonstrated.
2 g of a sample is weighed and transferred to a beaker while washing away with pure water, and then 10 ml of nitric acid is added and dissolved by heating. After allowing to cool, the solution is filtered to remove suspended organic components to obtain a filtrate. 100 ml of pure water is added to the filtrate, 6 ml of HCl is added, and the mixture is sufficiently stirred, and further HC
Add l. And after adding HCl until it can not precipitate new AgCl,
Heat and age until the solution becomes clear. Thereafter, it was filtered through a glass fiber filter (weight W1 (g)), and the recovered AgCl precipitate was dried by a drier at 110 ° C. for 3 hours. After cooling, the glass fiber filter and the recovered AgCl were combined and weighed, and the weight was set to W2 (g).
Ag content was calculated | required from following Formula 2 from the value of W1, W2.
Ag (mass%) = (W2-W1) / initial sample amount (g) × 0.7526 × 100.
(Formula 2)
The accumulated particle size was measured by a laser diffraction particle size distribution apparatus (manufactured by SYMPATEC, HEROS particle size distribution measuring apparatus, HELOS & RODOS).
Color difference is measured by a color difference meter (Nippon Denshoku Kogyo Co., Ltd. Spectro Color Meter
It measured by SQ2000).

(実施例2)
硝酸銀水溶液中の銀含有量を20.3gとした以外は、実施例1と同様の操作を行って
、実施例2に係る銀被覆銅粉を得た。当該銀被覆銅粉の作製条件を表3に記載する。また
、当該銀被覆銅粉に対して実施例1と同様の測定を行い、当該測定結果を表4に記載する
(Example 2)
A silver-coated copper powder according to Example 2 was obtained in the same manner as in Example 1 except that the silver content in the aqueous silver nitrate solution was changed to 20.3 g. The preparation conditions of the said silver-coated copper powder are described in Table 3. In addition, the same measurement as in Example 1 is performed on the silver-coated copper powder, and the measurement result is described in Table 4.

(実施例3)
硝酸銀水溶液中の銀含有量を13.2gとした以外は、実施例1と同様の操作を行って
、実施例3に係る銀被覆銅粉を得た。当該銀被覆銅粉の作製条件を表3に記載する。また
、当該銀被覆銅粉に対して実施例1と同様の測定を行い、当該測定結果を表4に記載する
(Example 3)
A silver-coated copper powder according to Example 3 was obtained in the same manner as in Example 1 except that the silver content in the aqueous silver nitrate solution was changed to 13.2 g. The preparation conditions of the said silver-coated copper powder are described in Table 3. In addition, the same measurement as in Example 1 is performed on the silver-coated copper powder, and the measurement result is described in Table 4.

(実施例4)
炭酸アンモニウム197gと、エチレンジアミン四酢酸四ナトリウム塩(EDTA・4
Na)50%水溶液634gとを純水729gに溶解し、液温を25℃に調整し溶液を得
た。当該得られた溶液と、銀27.8g含有の硝酸銀水溶液とを混合して、銀錯塩溶液を
調整した。
一方、炭酸アンモニウム178gと、エチレンジアミン四酢酸四ナトリウム塩(EDT
A・4Na)50%水溶液288gとを純水2416gに溶解させて溶液を得た。当該得
られた溶液へイソプロピルアルコール100gを加え攪拌して、さらに福田金属箔粉工業
株式会社製FCC−115電解銅粉250gを加え攪拌して銅粉分散液を得た。
前記銅粉分散液を乾燥窒素ガス雰囲気中に設置して液温を25℃に調整した後、前記銀
錯塩溶液を添加して混合液とし、銅粉への銀被覆反応を実施して銀被覆銅粉を生成させた
。そして、当該混合液を30分間攪拌しながら保持した。
その後、前記混合液を濾過して濾過物を得、当該濾過物を純水で洗浄して得られたウェ
ットケーキを120℃の窒素雰囲気で乾燥を行い、銀被覆銅粉を得た。当該銀被覆銅粉の
作製条件を表3に記載する。また、当該銀被覆銅粉に対して実施例1と同様の測定を行い
、当該測定結果を表4に記載する。
(Example 4)
197 g of ammonium carbonate and ethylenediaminetetraacetic acid tetrasodium salt (EDTA 4
Na) 50% aqueous solution (634 g) was dissolved in 729 g of pure water, and the solution temperature was adjusted to 25 ° C. to obtain a solution. The solution thus obtained was mixed with an aqueous solution of silver nitrate containing 27.8 g of silver to prepare a silver complex salt solution.
On the other hand, 178 g of ammonium carbonate and tetrasodium ethylenediaminetetraacetic acid salt (EDT
A. 4Na) 288 g of a 50% aqueous solution was dissolved in 2416 g of pure water to obtain a solution. 100 g of isopropyl alcohol was added to the solution obtained and stirred, and further 250 g of electrolytic copper powder FCC-115 manufactured by Fukuda Metal Foil & Powder Co., Ltd. was added and stirred to obtain a copper powder dispersion.
The copper powder dispersion is placed in a dry nitrogen gas atmosphere to adjust the liquid temperature to 25 ° C. Then, the silver complex salt solution is added to form a mixed solution, and the silver coating reaction on copper powder is carried out to coat the silver Copper powder was produced. And the said liquid mixture was hold | maintained stirring for 30 minutes.
Thereafter, the mixed solution is filtered to obtain a filtrate, and the wet cake obtained by washing the filtrate with pure water is dried in a nitrogen atmosphere at 120 ° C. to obtain a silver-coated copper powder. The preparation conditions of the said silver-coated copper powder are described in Table 3. In addition, the same measurement as in Example 1 is performed on the silver-coated copper powder, and the measurement result is described in Table 4.

(実施例5)
硝酸銀水溶液中の銀含有量を20.3gとした以外は、実施例4と同様の操作を行って
、実施例5に係る銀被覆銅粉を得た。当該銀被覆銅粉の作製条件を表3に記載する。また
、当該銀被覆銅粉に対して実施例1と同様の測定を行い、当該測定結果を表4に記載する
(Example 5)
A silver-coated copper powder according to Example 5 was obtained in the same manner as in Example 4 except that the silver content in the aqueous silver nitrate solution was changed to 20.3 g. The preparation conditions of the said silver-coated copper powder are described in Table 3. In addition, the same measurement as in Example 1 is performed on the silver-coated copper powder, and the measurement result is described in Table 4.

(実施例6)
硝酸銀水溶液中の銀含有量を13.2gとした以外は、実施例5と同様の操作を行って
、実施例6に係る銀被覆銅粉を得た。当該銀被覆銅粉の作製条件を表3に記載する。また
、当該銀被覆銅粉に対して実施例1と同様の測定を行い、当該測定結果を表4に記載する
(Example 6)
A silver-coated copper powder according to Example 6 was obtained in the same manner as in Example 5 except that the silver content in the aqueous silver nitrate solution was changed to 13.2 g. The preparation conditions of the said silver-coated copper powder are described in Table 3. In addition, the same measurement as in Example 1 is performed on the silver-coated copper powder, and the measurement result is described in Table 4.

(実施例7)
表面処理剤1としてステアリン酸75質量%およびパルミチン酸25質量%の混合物を
含む、エマルジョンを準備した。当該エマルジョンにおける表面処理剤1の濃度は、15
.5wt%とし、さらに純水を加えて表面処理剤1の濃度を1.34wt%とした。そし
て、前記銅粉分散液を乾燥窒素ガス雰囲気中に設置して液温を25℃に調整した後、前記
銀錯塩溶液を添加して混合液とし、銅粉への銀被覆反応を実施して銀被覆銅粉を生成させ
た。そして、当該混合液を30分間攪拌しながら保持した後、当該混合液へ、表面処理剤
1エマルジョンを26.7g添加し、30分間攪拌を継続して、生成した前記銀被覆銅粉
への表面処理を行った以外は、実施例1と同様の操作を行って、実施例7に係る銀被覆銅
粉を得た。当該得られた実施例7に係る銅粉の表面処理剤1量は0.143質量%であっ
た。当該銀被覆銅粉の作製条件を表3に記載する。また、当該銀被覆銅粉に対して実施例
1と同様の測定を行い、当該測定結果を表4に記載する。
(Example 7)
An emulsion was prepared containing a mixture of 75% by weight of stearic acid and 25% by weight of palmitic acid as the surface treatment agent 1. The concentration of surface treatment agent 1 in the emulsion is 15
. The concentration of the surface treatment agent 1 was adjusted to 1.34 wt% by adding 5 wt% and further adding pure water. Then, after the copper powder dispersion is placed in a dry nitrogen gas atmosphere to adjust the liquid temperature to 25 ° C., the silver complex salt solution is added to form a mixed solution, and the silver coating reaction on copper powder is carried out. Silver coated copper powder was produced. Then, the mixed solution is kept for 30 minutes while being stirred, 26.7 g of the surface treatment agent 1 emulsion is added to the mixed solution, and the stirring is continued for 30 minutes, and the surface to the generated silver-coated copper powder is generated. A silver-coated copper powder according to Example 7 was obtained in the same manner as in Example 1 except that the treatment was performed. The amount of the surface treatment agent for copper powder according to Example 7 obtained was 0.143% by mass. The preparation conditions of the said silver-coated copper powder are described in Table 3. In addition, the same measurement as in Example 1 is performed on the silver-coated copper powder, and the measurement result is described in Table 4.

(実施例8)
表面処理剤1として、ステアリン酸75質量%およびパルミチン酸25質量%の混合物
を含むエマルジョンを準備した。当該エマルジョンにおける表面処理剤1の濃度は、15
.5wt%とし、さらに純水を加えて表面処理剤1の濃度を1.34wt%とした。
そして、前記銅粉分散液を乾燥窒素ガス雰囲気中に設置して液温を25℃に調整した後
、前記銀錯塩溶液を添加して混合液とし、銅粉への銀被覆反応を実施して銀被覆銅粉を生
成させた。そして、当該混合液を30分間攪拌しながら保持した後、当該混合液へ、表面
処理剤1エマルジョンを26.7g添加し、30分間攪拌を継続して、生成した前記銀被
覆銅粉への表面処理を行った以外は、実施例2と同様の操作を行って、実施例8に係る銀
被覆銅粉を得た。当該得られた実施例8に係る銅粉の表面処理剤1量は0.143質量%
であった。当該銀被覆銅粉の作製条件を表3に記載する。また、当該銀被覆銅粉に対して
実施例1と同様の測定を行い、当該測定結果を表4に記載する。
(Example 8)
An emulsion comprising a mixture of 75% by weight of stearic acid and 25% by weight of palmitic acid as a surface treatment agent 1 was prepared. The concentration of surface treatment agent 1 in the emulsion is 15
. The concentration of the surface treatment agent 1 was adjusted to 1.34 wt% by adding 5 wt% and further adding pure water.
Then, after the copper powder dispersion is placed in a dry nitrogen gas atmosphere to adjust the liquid temperature to 25 ° C., the silver complex salt solution is added to form a mixed solution, and the silver coating reaction on copper powder is carried out. Silver coated copper powder was produced. Then, the mixed solution is kept for 30 minutes while being stirred, 26.7 g of the surface treatment agent 1 emulsion is added to the mixed solution, and the stirring is continued for 30 minutes, and the surface to the generated silver-coated copper powder is generated. A silver-coated copper powder according to Example 8 was obtained in the same manner as in Example 2 except that the treatment was performed. The amount of the surface treatment agent for copper powder according to Example 8 obtained is 0.143% by mass
Met. The preparation conditions of the said silver-coated copper powder are described in Table 3. In addition, the same measurement as in Example 1 is performed on the silver-coated copper powder, and the measurement result is described in Table 4.

(実施例9)
表面処理剤1としてステアリン酸75質量%およびパルミチン酸25質量%の混合物を
含む、エマルジョンを準備した。当該エマルジョンにおける表面処理剤1の濃度は、15
.5wt%とし、さらに純水を加えて表面処理剤1の濃度を1.34wt%とした。
そして、前記銅粉分散液を乾燥窒素ガス雰囲気中に設置して液温を25℃に調整した後
、前記銀錯塩溶液を添加して混合液とし、銅粉への銀被覆反応を実施して銀被覆銅粉を生
成させた。そして、当該混合液を30分間攪拌しながら保持した後、当該混合液へ、表面
処理剤1エマルジョンを26.7g添加し、30分間攪拌を継続して、生成した前記銀被
覆銅粉への表面処理を行った以外は、実施例3と同様の操作を行って、実施例9に係る銀
被覆銅粉を得た。当該得られた実施例9に係る銅粉の表面処理剤1量は0.143質量%
であった。当該銀被覆銅粉の作製条件を表3に記載する。また、当該銀被覆銅粉に対して
実施例1と同様の測定を行い、当該測定結果を表4に記載する。
(Example 9)
An emulsion was prepared containing a mixture of 75% by weight of stearic acid and 25% by weight of palmitic acid as the surface treatment agent 1. The concentration of surface treatment agent 1 in the emulsion is 15
. The concentration of the surface treatment agent 1 was adjusted to 1.34 wt% by adding 5 wt% and further adding pure water.
Then, after the copper powder dispersion is placed in a dry nitrogen gas atmosphere to adjust the liquid temperature to 25 ° C., the silver complex salt solution is added to form a mixed solution, and the silver coating reaction on copper powder is carried out. Silver coated copper powder was produced. Then, the mixed solution is kept for 30 minutes while being stirred, 26.7 g of the surface treatment agent 1 emulsion is added to the mixed solution, and the stirring is continued for 30 minutes, and the surface to the generated silver-coated copper powder is generated. A silver-coated copper powder according to Example 9 was obtained in the same manner as in Example 3 except that the treatment was performed. The amount of the surface treatment agent for copper powder according to Example 9 obtained is 0.143% by mass
Met. The preparation conditions of the said silver-coated copper powder are described in Table 3. In addition, the same measurement as in Example 1 is performed on the silver-coated copper powder, and the measurement result is described in Table 4.

(実施例10)
表面処理剤1としてステアリン酸75質量%およびパルミチン酸25質量%の混合物を
含む、エマルジョンを準備した。当該エマルジョンにおける表面処理剤1の濃度は、15
.5wt%とし、さらに純水を加えて表面処理剤1の濃度を1.34wt%とした。
そして、前記銅粉分散液を乾燥窒素ガス雰囲気中に設置して液温を25℃に調整した後
、前記銀錯塩溶液を添加して混合液とし、銅粉への銀被覆反応を実施して銀被覆銅粉を生
成させた。そして、当該混合液を30分間攪拌しながら保持した後、当該混合液へ、表面
処理剤1エマルジョンを106.9g添加し、30分間攪拌を継続して、生成した前記銀
被覆銅粉への表面処理を行った以外は、実施例1と同様の操作を行って、実施例10に係
る銀被覆銅粉を得た。当該得られた実施例10に係る銅粉の表面処理剤1量は0.286
質量%あった。当該銀被覆銅粉の作製条件を表3に記載する。また、当該銀被覆銅粉に対
して実施例1と同様の測定を行い、当該測定結果を表4に記載する。
(Example 10)
An emulsion was prepared containing a mixture of 75% by weight of stearic acid and 25% by weight of palmitic acid as the surface treatment agent 1. The concentration of surface treatment agent 1 in the emulsion is 15
. The concentration of the surface treatment agent 1 was adjusted to 1.34 wt% by adding 5 wt% and further adding pure water.
Then, after the copper powder dispersion is placed in a dry nitrogen gas atmosphere to adjust the liquid temperature to 25 ° C., the silver complex salt solution is added to form a mixed solution, and the silver coating reaction on copper powder is carried out. Silver coated copper powder was produced. Then, after the mixed solution is kept stirred for 30 minutes, 106.9 g of the surface treatment agent 1 emulsion is added to the mixed solution, and the stirring is continued for 30 minutes, and the surface to the generated silver-coated copper powder is generated. A silver-coated copper powder according to Example 10 was obtained in the same manner as in Example 1 except that the treatment was performed. The amount of the surface treatment agent for copper powder according to Example 10 obtained is 0.286.
It was mass%. The preparation conditions of the said silver-coated copper powder are described in Table 3. In addition, the same measurement as in Example 1 is performed on the silver-coated copper powder, and the measurement result is described in Table 4.

(実施例11)
表面処理剤1をパルミチン酸とし、アルコールとの混合溶液を準備した。当該混合溶液
におけるパルミチン酸の濃度は、3.0wt%とした。アルコールには、日本アルコール
販売(株)製のソルミックスAP−7を使用した。
そして、前記銅粉分散液を乾燥窒素ガス雰囲気中に設置して液温を25℃に調整した後
、前記銀錯塩溶液を添加して混合液とし、銅粉への銀被覆反応を実施して銀被覆銅粉を生
成させた。そして、当該混合液を30分間攪拌しながら保持した後、当該混合液へ、表面
処理剤1アルコール混合溶液を11.9g添加し、30分間攪拌を継続して、生成した前
記銀被覆銅粉への表面処理を行った以外は、実施例1と同様の操作を行って、実施例11
に係る銀被覆銅粉を得た。当該得られた実施例11に係る銅粉の表面処理剤1量は0.1
43質量%であった。当該銀被覆銅粉の作製条件を表3に記載する。また、当該銀被覆銅
粉に対して実施例1と同様の測定を行い、当該測定結果を表4に記載する。
(Example 11)
The surface treatment agent 1 was changed to palmitic acid, and a mixed solution with alcohol was prepared. The concentration of palmitic acid in the mixed solution was 3.0 wt%. As alcohol, Solmix AP-7 manufactured by Japan Alcohol Sales Co., Ltd. was used.
Then, after the copper powder dispersion is placed in a dry nitrogen gas atmosphere to adjust the liquid temperature to 25 ° C., the silver complex salt solution is added to form a mixed solution, and the silver coating reaction on copper powder is carried out. Silver coated copper powder was produced. Then, the mixed solution is held for 30 minutes with stirring, and then 11.9 g of the surface treatment agent 1 alcohol mixed solution is added to the mixed solution, and the stirring is continued for 30 minutes to generate the above-mentioned silver-coated copper powder. Example 11 was carried out in the same manner as Example 1, except that the surface treatment of
Silver-coated copper powder according to The amount of the surface treatment agent for copper powder according to Example 11 obtained is 0.1.
It was 43% by mass. The preparation conditions of the said silver-coated copper powder are described in Table 3. In addition, the same measurement as in Example 1 is performed on the silver-coated copper powder, and the measurement result is described in Table 4.

(実施例12)
表面処理剤1をステアリン酸とし、アルコールとの混合溶液を準備した。当該混合溶液
におけるステアリン酸の濃度は、3.0wt%とした。アルコールには、日本アルコール
販売(株)製のソルミックスAP−7を使用した。
そして、前記銅粉分散液を乾燥窒素ガス雰囲気中に設置して液温を25℃に調整した後
、前記銀錯塩溶液を添加して混合液とし、銅粉への銀被覆反応を実施して銀被覆銅粉を生
成させた。そして、当該混合液を30分間攪拌しながら保持した後、当該混合液へ、表面
処理剤1アルコール混合溶液を11.9g添加し、30分間攪拌を継続して、生成した前
記銀被覆銅粉への表面処理を行った以外は、実施例1と同様の操作を行って、実施例12
に係る銀被覆銅粉を得た。当該得られた実施例12に係る銅粉の表面処理剤1量は0.1
43質量%であった。当該銀被覆銅粉の作製条件を表3に記載する。また、当該銀被覆銅
粉に対して実施例1と同様の測定を行い、当該測定結果を表4に記載する。
(Example 12)
The surface treatment agent 1 was stearic acid, and a mixed solution with alcohol was prepared. The concentration of stearic acid in the mixed solution was 3.0 wt%. As alcohol, Solmix AP-7 manufactured by Japan Alcohol Sales Co., Ltd. was used.
Then, after the copper powder dispersion is placed in a dry nitrogen gas atmosphere to adjust the liquid temperature to 25 ° C., the silver complex salt solution is added to form a mixed solution, and the silver coating reaction on copper powder is carried out. Silver coated copper powder was produced. Then, the mixed solution is held for 30 minutes with stirring, and then 11.9 g of the surface treatment agent 1 alcohol mixed solution is added to the mixed solution, and the stirring is continued for 30 minutes to generate the above-mentioned silver-coated copper powder. Example 12 was carried out in the same manner as Example 1, except that the surface treatment of
Silver-coated copper powder according to The amount of the surface treatment agent for copper powder according to Example 12 obtained is 0.1.
It was 43% by mass. The preparation conditions of the said silver-coated copper powder are described in Table 3. In addition, the same measurement as in Example 1 is performed on the silver-coated copper powder, and the measurement result is described in Table 4.

(実施例13)
表面処理剤1を工業用ステアリン酸とし、アルコールとの混合溶液を準備した。当該ア
ルコール混合溶液における工業用ステアリン酸の濃度は、3.0wt%とした。アルコー
ルには、日本アルコール販売(株)製のソルミックスAP−7を使用した。
そして、前記銅粉分散液を乾燥窒素ガス雰囲気中に設置して液温を25℃に調整した後
、前記銀錯塩溶液を添加して混合液とし、銅粉への銀被覆反応を実施して銀被覆銅粉を生
成させた。そして、当該混合液を30分間攪拌しながら保持した後、当該混合液へ、表面
処理剤1アルコール混合溶液を11.9g添加し、30分間攪拌を継続して、生成した前
記銀被覆銅粉への表面処理を行った以外は、実施例1と同様の操作を行って、実施例13
に係る銀被覆銅粉を得た。当該得られた実施例13に係る銅粉の表面処理剤1量は0.1
43質量%であった。当該銀被覆銅粉の作製条件を表3に記載する。また、当該銀被覆銅
粉に対して実施例1と同様の測定を行い、当該測定結果を表4に記載する。
(Example 13)
The surface treatment agent 1 was made into industrial stearic acid, and the mixed solution with alcohol was prepared. The concentration of industrial stearic acid in the alcohol mixture solution was 3.0 wt%. As alcohol, Solmix AP-7 manufactured by Japan Alcohol Sales Co., Ltd. was used.
Then, after the copper powder dispersion is placed in a dry nitrogen gas atmosphere to adjust the liquid temperature to 25 ° C., the silver complex salt solution is added to form a mixed solution, and the silver coating reaction on copper powder is carried out. Silver coated copper powder was produced. Then, the mixed solution is held for 30 minutes with stirring, and then 11.9 g of the surface treatment agent 1 alcohol mixed solution is added to the mixed solution, and the stirring is continued for 30 minutes to generate the above-mentioned silver-coated copper powder. Example 13 was carried out in the same manner as Example 1, except that the surface treatment of
Silver-coated copper powder according to The amount of the surface treatment agent for copper powder according to Example 13 obtained is 0.1.
It was 43% by mass. The preparation conditions of the said silver-coated copper powder are described in Table 3. In addition, the same measurement as in Example 1 is performed on the silver-coated copper powder, and the measurement result is described in Table 4.

(実施例14)
表面処理剤1をオレイン酸とし、アルコールとの混合溶液を準備した。当該アルコール
混合溶液におけるオレイン酸の濃度は、10.0wt%とした。アルコールには、日本ア
ルコール販売(株)製のソルミックスAP−7を使用した。
そして、前記銅粉分散液を乾燥窒素ガス雰囲気中に設置して液温を25℃に調整した後
、前記銀錯塩溶液を添加して混合液とし、銅粉への銀被覆反応を実施して銀被覆銅粉を生
成させた。そして、当該混合液を30分間攪拌しながら保持した後、当該混合液へ、表面
処理剤1アルコール混合溶液を1.7g添加し、30分間攪拌を継続して、生成した前記
銀被覆銅粉への表面処理を行った以外は、実施例1と同様の操作を行って、実施例14に
係る銀被覆銅粉を得た。当該得られた実施例14に係る銅粉の表面処理剤1量は0.14
3質量%であった。当該銀被覆銅粉の作製条件を表3に記載する。また、当該銀被覆銅粉
に対して実施例1と同様の測定を行い、当該測定結果を表4に記載する。
(Example 14)
The surface treatment agent 1 was oleic acid, and a mixed solution with alcohol was prepared. The concentration of oleic acid in the alcohol mixture solution was 10.0 wt%. As alcohol, Solmix AP-7 manufactured by Japan Alcohol Sales Co., Ltd. was used.
Then, after the copper powder dispersion is placed in a dry nitrogen gas atmosphere to adjust the liquid temperature to 25 ° C., the silver complex salt solution is added to form a mixed solution, and the silver coating reaction on copper powder is carried out. Silver coated copper powder was produced. Then, the mixed solution is held for 30 minutes with stirring, and then 1.7 g of the surface treatment agent 1 alcohol mixed solution is added to the mixed solution, and the stirring is continued for 30 minutes to generate the above-mentioned silver-coated copper powder. The silver coated copper powder which concerns on Example 14 was obtained by performing the same operation as Example 1 except having performed surface treatment of this. The amount of the surface treatment agent for copper powder according to Example 14 obtained is 0.14.
It was 3% by mass. The preparation conditions of the said silver-coated copper powder are described in Table 3. In addition, the same measurement as in Example 1 is performed on the silver-coated copper powder, and the measurement result is described in Table 4.

(実施例15)
表面処理剤1としてステアリン酸75質量%およびパルミチン酸25質量%の混合物を
含む、エマルジョンを準備した。当該エマルジョンにおける表面処理剤1の濃度は、15
.5wt%とし、さらに純水を加えて表面処理剤1の濃度を1.34wt%とした。
そして、前記銅粉分散液を乾燥窒素ガス雰囲気中に設置して液温を25℃に調整した後
、前記銀錯塩溶液を添加して混合液とし、銅粉への銀被覆反応を実施して銀被覆銅粉を生
成させた。そして、当該混合液を30分間攪拌しながら保持した後、当該混合液へ、表面
処理剤1エマルジョンを22.8g添加し、30分間攪拌を継続して、生成した前記銀被
覆銅粉への表面処理を行った以外は、実施例4と同様の操作を行って、実施例15に係る
銀被覆銅粉を得た。当該得られた実施例15に係る銅粉の表面処理剤1量は0.122質
量%であった。当該銀被覆銅粉の作製条件を表3に記載する。また、当該銀被覆銅粉に対
して実施例1と同様の測定を行い、当該測定結果を表4に記載する。
(Example 15)
An emulsion was prepared containing a mixture of 75% by weight of stearic acid and 25% by weight of palmitic acid as the surface treatment agent 1. The concentration of surface treatment agent 1 in the emulsion is 15
. The concentration of the surface treatment agent 1 was adjusted to 1.34 wt% by adding 5 wt% and further adding pure water.
Then, after the copper powder dispersion is placed in a dry nitrogen gas atmosphere to adjust the liquid temperature to 25 ° C., the silver complex salt solution is added to form a mixed solution, and the silver coating reaction on copper powder is carried out. Silver coated copper powder was produced. Then, the mixed solution is held for 30 minutes with stirring, and then 22.8 g of the surface treatment agent 1 emulsion is added to the mixed solution, and the stirring is continued for 30 minutes, and the surface to the generated silver-coated copper powder is generated. A silver-coated copper powder according to Example 15 was obtained in the same manner as in Example 4 except that the treatment was performed. The amount of the surface treatment agent for copper powder according to Example 15 obtained was 0.122% by mass. The preparation conditions of the said silver-coated copper powder are described in Table 3. In addition, the same measurement as in Example 1 is performed on the silver-coated copper powder, and the measurement result is described in Table 4.

(実施例16)
表面処理剤1としてステアリン酸75質量%およびパルミチン酸25質量%の混合物を
含む、エマルジョンを準備した。当該エマルジョンにおける表面処理剤1の濃度は15.
5wt%とし、さらに純水を加えて表面処理剤1の濃度を1.34wt%とした。
そして、前記銅粉分散液を乾燥窒素ガス雰囲気中に設置して液温を25℃に調整した後
、前記銀錯塩溶液を添加して混合液とし、銅粉への銀被覆反応を実施して銀被覆銅粉を生
成させた。そして、当該混合液を30分間攪拌しながら保持した後、当該混合液へ、表面
処理剤1エマルジョンを22.8g添加し、30分間攪拌を継続して、生成した前記銀被
覆銅粉への表面処理を行った以外は、実施例5と同様の操作を行って、実施例16に係る
銀被覆銅粉を得た。当該得られた実施例16に係る銅粉の表面処理剤1量は0.122質
量%であった。当該銀被覆銅粉の作製条件を表3に記載する。また、当該銀被覆銅粉に対
して実施例1と同様の測定を行い、当該測定結果を表4に記載する。
(Example 16)
An emulsion was prepared containing a mixture of 75% by weight of stearic acid and 25% by weight of palmitic acid as the surface treatment agent 1. The concentration of the surface treatment agent 1 in the emulsion is 15.
The concentration of the surface treatment agent 1 was adjusted to 1.34 wt% by adding 5 wt% and further adding pure water.
Then, after the copper powder dispersion is placed in a dry nitrogen gas atmosphere to adjust the liquid temperature to 25 ° C., the silver complex salt solution is added to form a mixed solution, and the silver coating reaction on copper powder is carried out. Silver coated copper powder was produced. Then, the mixed solution is held for 30 minutes with stirring, and then 22.8 g of the surface treatment agent 1 emulsion is added to the mixed solution, and the stirring is continued for 30 minutes, and the surface to the generated silver-coated copper powder is generated. A silver-coated copper powder according to Example 16 was obtained by performing the same operation as Example 5 except that the treatment was performed. The amount of the surface treatment agent for copper powder according to Example 16 obtained was 0.122% by mass. The preparation conditions of the said silver-coated copper powder are described in Table 3. In addition, the same measurement as in Example 1 is performed on the silver-coated copper powder, and the measurement result is described in Table 4.

(実施例17)
表面処理剤1としてステアリン酸75質量%およびパルミチン酸25質量%の混合物を
含む、エマルジョンを準備した。当該エマルジョンにおける表面処理剤1の濃度は15.
5wt%とし、さらに純水を加えて表面処理剤1の濃度を1.34wt%とした。
そして、前記銅粉分散液を乾燥窒素ガス雰囲気中に設置して液温を25℃に調整した後
、前記銀錯塩溶液を添加して混合液とし、銅粉への銀被覆反応を実施して銀被覆銅粉を生
成させた。そして、当該混合液を30分間攪拌しながら保持した後、当該混合液へ、表面
処理剤1エマルジョンを22.8g添加し、30分間攪拌を継続して、生成した前記銀被
覆銅粉への表面処理を行った以外は、実施例6と同様の操作を行って、実施例17に係る
銀被覆銅粉を得た。当該得られた実施例17に係る銅粉の表面処理剤1量は0.122質
量%であった。当該銀被覆銅粉の作製条件を表3に記載する。また、当該銀被覆銅粉に対
して実施例1と同様の測定を行い、当該測定結果を表4に記載する。
(Example 17)
An emulsion was prepared containing a mixture of 75% by weight of stearic acid and 25% by weight of palmitic acid as the surface treatment agent 1. The concentration of the surface treatment agent 1 in the emulsion is 15.
The concentration of the surface treatment agent 1 was adjusted to 1.34 wt% by adding 5 wt% and further adding pure water.
Then, after the copper powder dispersion is placed in a dry nitrogen gas atmosphere to adjust the liquid temperature to 25 ° C., the silver complex salt solution is added to form a mixed solution, and the silver coating reaction on copper powder is carried out. Silver coated copper powder was produced. Then, the mixed solution is held for 30 minutes with stirring, and then 22.8 g of the surface treatment agent 1 emulsion is added to the mixed solution, and the stirring is continued for 30 minutes, and the surface to the generated silver-coated copper powder is generated. A silver-coated copper powder according to Example 17 was obtained in the same manner as in Example 6, except that the treatment was performed. The amount of the surface treatment agent for copper powder according to Example 17 obtained was 0.122% by mass. The preparation conditions of the said silver-coated copper powder are described in Table 3. In addition, the same measurement as in Example 1 is performed on the silver-coated copper powder, and the measurement result is described in Table 4.

(実施例18)
実施例1と同様の操作を行って得られた、目開き32μmの篩いを用いて粗大粒子を除
去した銀被覆銅粉220gと、表面処理剤2として1H−ベンゾトリアゾール(和光純薬
工業株式会社製 和光特級)0.32gとを混合した以外は、実施例1と同様の操作を行
って、実施例18に係る銀被覆銅粉を得た。当該得られた実施例18に係る銅粉の表面処
理剤2量は0.143質量%あった。当該銀被覆銅粉の作製条件を表3に記載する。また
、当該銀被覆銅粉に対して実施例1と同様の測定を行い、当該測定結果を表4に記載する
(Example 18)
220 g of silver-coated copper powder from which coarse particles have been removed using a sieve with an opening of 32 μm obtained by performing the same operation as in Example 1, 1H-benzotriazole as a surface treatment agent 2 (Wako Pure Chemical Industries, Ltd. A silver-coated copper powder according to Example 18 was obtained in the same manner as in Example 1 except that 0.32 g of special grade was added. The amount of the surface treatment agent for copper powder according to Example 18 was 0.143% by mass. The preparation conditions of the said silver-coated copper powder are described in Table 3. In addition, the same measurement as in Example 1 is performed on the silver-coated copper powder, and the measurement result is described in Table 4.

(実施例19)
実施例7と同様の操作を行って得られた、目開き32μmの篩いを用いて粗大粒子を除
去した銀被覆銅粉220gと、表面処理剤2としてコーヒーミル(メリタジャパン株式会
社製 セレクトブラインド MJ−518)で合計40秒粉砕したアジピン酸(和光純薬
工業株式会社製 和光特級)0.32gとを混合した以外は、実施例7と同様の操作を行
って、実施例19に係る銀被覆銅粉を得た。当該得られた実施例19に係る銅粉の表面処
理剤1量は0.143質量%、表面処理剤2量は0.143質量%であった。当該銀被覆
銅粉の作製条件を表3に記載する。また、当該銀被覆銅粉に対して実施例1と同様の測定
を行い、当該測定結果を表4に記載する。
(Example 19)
220 g of a silver-coated copper powder from which coarse particles were removed using a sieve with an opening of 32 μm obtained by performing the same operation as in Example 7 and a coffee mill as a surface treatment agent 2 (Select Blind MJ manufactured by Merita Japan Co., Ltd. The silver coating according to Example 19 is carried out in the same manner as in Example 7, except that 0.32 g of adipic acid (Wako Pure Chemical Industries, Ltd. Wako special grade) pulverized for a total of 40 seconds at -518) is mixed. I got a copper powder. The amount of the surface treatment agent for copper powder according to Example 19 was 0.143% by mass, and the amount of the surface treatment agent 2 was 0.143% by mass. The preparation conditions of the said silver-coated copper powder are described in Table 3. In addition, the same measurement as in Example 1 is performed on the silver-coated copper powder, and the measurement result is described in Table 4.

(実施例20)
実施例19と同様の操作を行って得られた、目開き32μmの篩いを用いて粗大粒子を
除去した銀被覆銅粉220gと、表面処理剤2としてコーヒーミル(メリタジャパン株式
会社製 セレクトブラインド MJ−518)で合計80秒粉砕したアジピン酸(和光純
薬工業株式会社製 和光特級)0.32gとを混合した以外は、実施例19と同様の操作
を行って、実施例20に係る銀被覆銅粉を得た。当該得られた実施例20に係る銅粉の表
面処理剤1量は0.143質量%、表面処理剤2量は0.143質量%であった。当該銀
被覆銅粉の作製条件を表3に記載する。また、当該銀被覆銅粉に対して実施例1と同様の
測定を行い、当該測定結果を表4に記載する。
Example 20
220 g of a silver-coated copper powder from which coarse particles have been removed using a sieve with an opening of 32 μm obtained by performing the same operation as in Example 19, and a coffee mill as a surface treatment agent 2 (Select Blind MJ manufactured by Merita Japan Co., Ltd. The silver coating according to Example 20 is carried out in the same manner as in Example 19, except that 0.32 g of adipic acid (Wako Pure Chemical Industries, Ltd. Wako special grade) pulverized in a total of 80 seconds by -518) is mixed. I got a copper powder. The amount of the surface treatment agent of the copper powder according to Example 20 was 0.143% by mass, and the amount of the surface treatment agent 2 was 0.143% by mass. The preparation conditions of the said silver-coated copper powder are described in Table 3. In addition, the same measurement as in Example 1 is performed on the silver-coated copper powder, and the measurement result is described in Table 4.

(実施例21)
実施例19と同様の操作を行って得られた、目開き32μmの篩いを用いて粗大粒子を
除去した銀被覆銅粉220gと、表面処理剤2としてコーヒーミル(メリタジャパン株式
会社製 セレクトブラインド MJ−518)で合計400秒粉砕したアジピン酸(和光
純薬工業株式会社製 和光特級)0.32gとを混合した以外は、実施例19と同様の操
作を行って、実施例21に係る銀被覆銅粉を得た。当該得られた実施例21に係る銅粉の
表面処理剤1量は0.143質量%、表面処理剤2量は0.143質量%であった。当該
銀被覆銅粉の作製条件を表3に記載する。また、当該銀被覆銅粉に対して実施例1と同様
の測定を行い、当該測定結果を表4に記載する。
(Example 21)
220 g of a silver-coated copper powder from which coarse particles have been removed using a sieve with an opening of 32 μm obtained by performing the same operation as in Example 19, and a coffee mill as a surface treatment agent 2 (Select Blind MJ manufactured by Merita Japan Co., Ltd. The silver coating according to Example 21 is carried out in the same manner as in Example 19, except that 0.32 g of adipic acid (Wako Pure Chemical Industries, Ltd. Wako special grade) pulverized for a total of 400 seconds at -518) is mixed. I got a copper powder. The amount of the surface treatment agent for copper powder according to Example 21 was 0.143% by mass, and the amount of the surface treatment agent 2 was 0.143% by mass. The preparation conditions of the said silver-coated copper powder are described in Table 3. In addition, the same measurement as in Example 1 is performed on the silver-coated copper powder, and the measurement result is described in Table 4.

(実施例22)
硝酸銀水溶液中の銀含有量を20.3gとした以外は、実施例19と同様の操作を行っ
て、実施例22に係る銀被覆銅粉を得た。当該得られた実施例22に係る銅粉の表面処理
剤1量は0.122質量%、表面処理剤2量は0.143質量%あった。当該銀被覆銅粉
の作製条件を表3に記載する。また、当該銀被覆銅粉に対して実施例1と同様の測定を行
い、当該測定結果を表4に記載する。
(Example 22)
A silver-coated copper powder according to Example 22 was obtained in the same manner as in Example 19, except that the silver content in the aqueous silver nitrate solution was changed to 20.3 g. The amount of the surface treatment agent of the copper powder according to Example 22 was 0.122% by mass, and the amount of the surface treatment agent 2 was 0.143% by mass. The preparation conditions of the said silver-coated copper powder are described in Table 3. In addition, the same measurement as in Example 1 is performed on the silver-coated copper powder, and the measurement result is described in Table 4.

(実施例23)
硝酸銀水溶液中の銀含有量を13.2gとした以外は、実施例19と同様の操作を行っ
て、実施例22に係る銀被覆銅粉を得た。当該得られた実施例23に係る銅粉の表面処理
剤1量は0.143質量%、表面処理剤2量は0.143質量%であった。当該銀被覆銅
粉の作製条件を表3に記載する。また、当該銀被覆銅粉に対して実施例1と同様の測定を
行い、当該測定結果を表4に記載する。
(Example 23)
A silver-coated copper powder according to Example 22 was obtained in the same manner as in Example 19, except that the silver content in the aqueous silver nitrate solution was changed to 13.2 g. The amount of the surface treatment agent for the copper powder according to Example 23 was 0.143% by mass, and the amount of the surface treatment agent 2 was 0.143% by mass. The preparation conditions of the said silver-coated copper powder are described in Table 3. In addition, the same measurement as in Example 1 is performed on the silver-coated copper powder, and the measurement result is described in Table 4.

(実施例24)
表面処理剤2をアジピン酸(和光純薬工業株式会社製 和光特級)からコーヒーミル(
メリタジャパン株式会社製 セレクトブラインド MJ−518)で合計240秒粉砕し
たマロン酸(和光純薬工業株式会社製 和光特級)へ代替した以外は、実施例19と同様
の操作を行って、実施例24に係る銀被覆銅粉を得た。当該得られた実施例24に係る銅
粉の表面処理剤1量は0.143質量%、表面処理剤2量は0.143質量%であった。
当該銀被覆銅粉の作製条件を表3に記載する。また、当該銀被覆銅粉に対して実施例1と
同様の測定を行い、当該測定結果を表4に記載する。
(Example 24)
Surface treatment agent 2 from adipic acid (Wako Pure Chemical Industries, Ltd. Wako special grade) to coffee mill (
Example 24 is carried out in the same manner as Example 19, except that malonic acid (Wako Pure Chemical Industries, Ltd. Wako special grade) pulverized for a total of 240 seconds is substituted by Merita Japan Ltd. select blind MJ-518). Silver-coated copper powder according to The amount of the surface treatment agent of the copper powder according to Example 24 was 0.143% by mass, and the amount of the surface treatment agent 2 was 0.143% by mass.
The preparation conditions of the said silver-coated copper powder are described in Table 3. In addition, the same measurement as in Example 1 is performed on the silver-coated copper powder, and the measurement result is described in Table 4.

(実施例25)
表面処理剤2をアジピン酸(和光純薬工業株式会社製 和光特級)からコーヒーミル(
メリタジャパン株式会社製 セレクトブラインド MJ−518)で合計240秒粉砕し
たこはく酸(和光純薬工業株式会社製 和光特級)へ代替した以外は、実施例19と同様
の操作を行って、実施例25に係る銀被覆銅粉を得た。当該得られた実施例25に係る銅
粉の表面処理剤1量は0.143質量%、表面処理剤2量は0.143質量%であった。
当該銀被覆銅粉の作製条件を表3に記載する。また、当該銀被覆銅粉に対して実施例1と
同様の測定を行い、当該測定結果を表4に記載する。
(Example 25)
Surface treatment agent 2 from adipic acid (Wako Pure Chemical Industries, Ltd. Wako special grade) to coffee mill (
Example 25 is carried out in the same manner as Example 19, except that a succinic acid (Wako Pure Chemical Industries, Ltd. Wako special grade) pulverized for a total of 240 seconds with Merita Japan Ltd. Select Blind MJ-518) is substituted. Silver-coated copper powder according to The amount of the surface treatment agent for copper powder according to Example 25 was 0.143% by mass, and the amount of the surface treatment agent 2 was 0.143% by mass.
The preparation conditions of the said silver-coated copper powder are described in Table 3. In addition, the same measurement as in Example 1 is performed on the silver-coated copper powder, and the measurement result is described in Table 4.

(実施例26)
表面処理剤2をアジピン酸からコーヒーミル(メリタジャパン株式会社製 セレクトブ
ラインド MJ−518)で合計240秒粉砕したアゼライン酸(和光純薬工業株式会社
製 化学用)へ代替した以外は、実施例19と同様の操作を行って、実施例26に係る銀
被覆銅粉を得た。当該得られた実施例26に係る銅粉の表面処理剤1量は0.143質量
%、表面処理剤2量は0.143質量%であった。当該銀被覆銅粉の作製条件を表3に記
載する。また、当該銀被覆銅粉に対して実施例1と同様の測定を行い、当該測定結果を表
4に記載する。
(Example 26)
Example 19 except that a surface treating agent 2 was substituted from adipic acid to azelaic acid (for Wako Pure Chemical Industries, Ltd., chemical) crushed for a total of 240 seconds with a coffee mill (Select Blind MJ-518, manufactured by Melita Japan, Inc.) The same procedure as in the above was performed to obtain a silver-coated copper powder according to Example 26. The amount of the surface treatment agent for the copper powder according to Example 26 was 0.143% by mass, and the amount of the surface treatment agent 2 was 0.143% by mass. The preparation conditions of the said silver-coated copper powder are described in Table 3. In addition, the same measurement as in Example 1 is performed on the silver-coated copper powder, and the measurement result is described in Table 4.

(実施例27)
実施例15と同様の操作を行って得られた、目開き32μmの篩いを用いて粗大粒子を
除去した銀被覆銅粉220gと、表面処理剤2としてアジピン酸(和光純薬工業株式会社
製 和光特級)0.27gとを混合した以外は、実施例15と同様の操作を行って、実施
例27に係る銀被覆銅粉を得た。当該得られた実施例27に係る銅粉の表面処理剤1量は
0.122質量%、表面処理剤2量は0.122質量%であった。当該銀被覆銅粉の作製
条件を表3に記載する。また、当該銀被覆銅粉に対して実施例1と同様の測定を行い、当
該測定結果を表4に記載する。
(Example 27)
220 g of a silver-coated copper powder from which coarse particles were removed using a sieve with an aperture of 32 μm obtained by performing the same operation as in Example 15, and adipic acid as a surface treatment agent 2 (manufactured by Wako Pure Chemical Industries, Ltd. Wako A silver-coated copper powder according to Example 27 was obtained in the same manner as in Example 15, except that special grade 0.27 g was mixed. The amount of the surface treatment agent for copper powder according to Example 27 was 0.122% by mass, and the amount of the surface treatment agent 2 was 0.122% by mass. The preparation conditions of the said silver-coated copper powder are described in Table 3. In addition, the same measurement as in Example 1 is performed on the silver-coated copper powder, and the measurement result is described in Table 4.

(実施例28)
実施例15と同様の操作を行って得られた、目開き32μmの篩いを用いて粗大粒子を
除去した銀被覆銅粉220gと、表面処理剤2としてコーヒーミル(メリタジャパン株式
会社製 セレクトブラインド MJ−518)で合計40秒粉砕したアジピン酸(和光純
薬工業株式会社製 和光特級)0.27gとを混合した以外は、実施例15と同様の操作
を行って、実施例28に係る銀被覆銅粉を得た。当該得られた実施例28に係る銅粉の表
面処理剤1量は0.122質量%、表面処理剤2量は0.122質量%であった。当該銀
被覆銅粉の作製条件を表3に記載する。また、当該銀被覆銅粉に対して実施例1と同様の
測定を行い、当該測定結果を表4に記載する。
(Example 28)
220 g of a silver-coated copper powder from which coarse particles were removed using a sieve with an aperture of 32 μm obtained by performing the same operation as in Example 15, and a coffee mill as a surface treatment agent 2 (Select Blind MJ manufactured by Merita Japan Co., Ltd. Silver coated according to Example 28 by the same operation as Example 15 except that adipic acid (manufactured by Wako Pure Chemical Industries, Ltd., Wako special grade) 0.27 g pulverized in a total of 40 seconds by -518) was mixed. I got a copper powder. The amount of the surface treatment agent for copper powder according to Example 28 was 0.122% by mass, and the amount of the surface treatment agent 2 was 0.122% by mass. The preparation conditions of the said silver-coated copper powder are described in Table 3. In addition, the same measurement as in Example 1 is performed on the silver-coated copper powder, and the measurement result is described in Table 4.

(実施例29)
実施例15と同様の操作を行って得られた、目開き32μmの篩いを用いて粗大粒子を
除去した銀被覆銅粉220gと、表面処理剤2としてコーヒーミル(メリタジャパン株式
会社製 セレクトブラインド MJ−518)で合計40秒粉砕したアジピン酸(和光純
薬工業株式会社製 和光特級)0.44gとを混合した以外は、実施例15と同様の操作
を行って、実施例29に係る銀被覆銅粉を得た。当該得られた実施例29に係る銅粉の表
面処理剤1量は0.122質量%、表面処理剤2量は0.2質量%であった。当該銀被覆
銅粉の作製条件を表3に記載する。また、当該銀被覆銅粉に対して実施例1と同様の測定
を行い、当該測定結果を表4に記載する。
(Example 29)
220 g of a silver-coated copper powder from which coarse particles were removed using a sieve with an aperture of 32 μm obtained by performing the same operation as in Example 15, and a coffee mill as a surface treatment agent 2 (Select Blind MJ manufactured by Merita Japan Co., Ltd. The silver coating according to Example 29 is carried out in the same manner as in Example 15, except that 0.44 g of adipic acid (Wako Pure Chemical Industries, Ltd., Wako special grade) pulverized in a total of 40 seconds in -518) is mixed. I got a copper powder. The amount of the surface treatment agent for the copper powder according to Example 29 was 0.122% by mass, and the amount of the surface treatment agent 2 was 0.2% by mass. The preparation conditions of the said silver-coated copper powder are described in Table 3. In addition, the same measurement as in Example 1 is performed on the silver-coated copper powder, and the measurement result is described in Table 4.

(実施例30)
実施例17と同様の操作を行って得られた、目開き32μmの篩いを用いて粗大粒子を
除去した銀被覆銅粉220gと、表面処理剤2としてコーヒーミル(メリタジャパン株式
会社製 セレクトブラインド MJ−518)で合計40秒粉砕したアジピン酸(和光純
薬工業株式会社製 和光特級)0.27gとを混合した以外は、実施例17と同様の操作
を行って、実施30に係る銀被覆銅粉を得た。当該得られた実施例30に係る銅粉の表面
処理剤1量は0.122質量%、表面処理剤2量は0.122質量%であった。当該銀被
覆銅粉の作製条件を表3に記載する。また、当該銀被覆銅粉に対して実施例1と同様の測
定を行い、当該測定結果を表4に記載する。
(Example 30)
220 g of a silver-coated copper powder from which coarse particles have been removed using a sieve with an opening of 32 μm obtained by performing the same operation as in Example 17 and a coffee mill as a surface treatment agent 2 (Select Blind MJ manufactured by Merita Japan Co., Ltd. Silver coated copper according to Example 30 by the same operation as Example 17 except that adipic acid (manufactured by Wako Pure Chemical Industries, Ltd., Wako special grade) 0.27 g pulverized in a total of 40 seconds by -518) was mixed. I got a powder. The amount of the surface treatment agent for copper powder according to Example 30 was 0.122% by mass, and the amount of the surface treatment agent 2 was 0.122% by mass. The preparation conditions of the said silver-coated copper powder are described in Table 3. In addition, the same measurement as in Example 1 is performed on the silver-coated copper powder, and the measurement result is described in Table 4.

(実施例31)
表面処理剤1として、ステアリン酸75質量%およびパルミチン酸25質量%の混合物
を含むエマルジョンを準備した。当該エマルジョンにおける表面処理剤1の濃度は15.
5wt%とし、さらに純水を加えて表面処理剤1の濃度を1.34wt%とした。
そして、前記銅粉分散液に銅粉を添加する前の溶液へイソプロピルアルコール25gを
加え攪拌して前記銅粉分散液を乾燥窒素ガス雰囲気中に設置して液温を25℃に調整した
後、前記銀錯塩溶液を添加して混合液とし、銅粉への銀被覆反応を実施して銀被覆銅粉を
生成させた。そして、当該混合液を30分間攪拌しながら保持した後、当該混合液へ、表
面処理剤1エマルジョンを56.0g添加し、30分間攪拌を継続して、生成した前記銀
被覆銅粉への表面処理を行った以外は、実施例15同様の操作を行って、実施例31に係
る銀被覆銅粉を得た。当該得られた実施例31に係る銅粉の表面処理剤1量は0.3質量
%であった。当該銀被覆銅粉の作製条件を表3に記載する。また、当該銀被覆銅粉に対し
て実施例1と同様の測定を行い、当該測定結果を表4に記載する。
(Example 31)
An emulsion comprising a mixture of 75% by weight of stearic acid and 25% by weight of palmitic acid as a surface treatment agent 1 was prepared. The concentration of the surface treatment agent 1 in the emulsion is 15.
The concentration of the surface treatment agent 1 was adjusted to 1.34 wt% by adding 5 wt% and further adding pure water.
Then, 25 g of isopropyl alcohol is added to the solution before adding the copper powder to the copper powder dispersion and stirred, and the copper powder dispersion is set in a dry nitrogen gas atmosphere to adjust the liquid temperature to 25 ° C., The silver complex solution was added to form a mixture, and a silver coating reaction on copper powder was carried out to form silver-coated copper powder. Then, the mixed solution is held for 30 minutes with stirring, and then 56.0 g of the surface treatment agent 1 emulsion is added to the mixed solution, and the stirring is continued for 30 minutes, and the surface to the generated silver-coated copper powder is generated. A silver-coated copper powder according to Example 31 was obtained in the same manner as in Example 15, except that the treatment was performed. The amount of the surface treatment agent for copper powder according to Example 31 obtained was 0.3 mass%. The preparation conditions of the said silver-coated copper powder are described in Table 3. In addition, the same measurement as in Example 1 is performed on the silver-coated copper powder, and the measurement result is described in Table 4.

(比較例1)
JX日鉱日石金属株式会社製#51−R(A)電解銅粉を、湿式球状銅粉(D50で6
.4μm)へ代替した以外は、実施例7と同様の操作を行って、比較例1に係る銀被覆銅
粉を得た。当該得られた比較例1に係る銀被覆銅粉の表面処理剤1量は0.143質量%
であった。当該銀被覆銅粉の作製条件を表3に記載する。また、当該銀被覆銅粉に対して
実施例1と同様の測定を行い、当該測定結果を表4に記載する。
(Comparative example 1)
JX Nippon Mining & Metals Co., Ltd. # 51-R (A) electrolytic copper powder, wet spherical copper powder (D50 6
. A silver-coated copper powder according to Comparative Example 1 was obtained in the same manner as in Example 7 except that the thickness was changed to 4 μm. The amount of the surface treatment agent for the silver-coated copper powder according to Comparative Example 1 obtained is 0.143% by mass
Met. The preparation conditions of the said silver-coated copper powder are described in Table 3. In addition, the same measurement as in Example 1 is performed on the silver-coated copper powder, and the measurement result is described in Table 4.

(まとめ)
以上、表面処理剤1、2の種類、添加量を変化させながら実施例1〜31にわたり銀被
覆銅粉を調製した。当該実施例1〜31に係る銀被覆銅粉試料に対し、11枚の視野で捉
えた1000倍のSEM写真を撮影し、樹状突起銀被覆銅粉、棘状銀被覆銅粉、および棒
状銀被覆銅粉の存在状態を測定した。
すると、該実施例1〜31に係る銀被覆銅粉試料において、樹状突起銀被覆銅粉と、棘
状銀被覆銅粉と、棒状銀被覆銅粉とが含まれることを知見した。
そして、いずれの銀被覆銅粉試料も、前記樹状突起銀被覆銅粉と、棘状銀被覆銅粉と、
棒状銀被覆銅粉との総個数において、前記樹状突起銀被覆銅粉の占める個数割合が、0.
10%以上、80%以下であるか、前記棘状銀被覆銅粉の占める個数割合が、0.10%
以上、75%以下であるか、前記棒銀被覆状銅粉の占める個数割合が、0.10%以上、
40%以下であった。
さらに、いずれの銀被覆銅粉試料も、銀被覆量が0.1質量%以上、30質量%以下で
あった。
また、いずれの銀被覆銅粉試料もBET値が0.1m/g以上、1.0m/g以下
であった。
また、いずれの銀被覆銅粉試料もTAP密度の値が1g/cm以上、5g/cm
下であった。
以上の結果より、いずれの銀被覆銅粉試料も、低金属粉含量であっても十分な導電性を
発揮する導電ペーストへ用いることが出来る金属粉であると考えられる。
(Summary)
As mentioned above, silver covering copper powder was prepared over Examples 1-31 changing the kind of surface treating agents 1 and 2, and the amount of addition. With respect to the silver-coated copper powder samples according to Examples 1 to 31, the SEM photograph of 1000 magnifications captured in 11 fields of view is taken, dendrite silver-coated copper powder, scale-like silver-coated copper powder, and rod-like silver The state of presence of the coated copper powder was measured.
Then, in the silver-coated copper powder samples according to Examples 1 to 31, it was found that dendritic silver-coated copper powder, cage-like silver-coated copper powder, and rod-like silver-coated copper powder are contained.
And, in any silver-coated copper powder sample, the dendritic silver-coated copper powder and the scaly silver-coated copper powder,
In the total number of rod-shaped silver-coated copper powder, the proportion of the number of dendritic-type silver-coated copper powder is 0. 0.
10% or more and 80% or less, or 0.10% or so of the number ratio of the bowl-like silver-coated copper powder
The percentage of the number occupied by the bar-silver-coated copper powder is 0.10% or more, or 75% or less.
It was less than 40%.
Furthermore, the silver coating amount was 0.1 mass% or more and 30 mass% or less in any silver-coated copper powder sample.
Also, BET value either silver-coated copper powder sample 0.1 m 2 / g or more, was 1.0 m 2 / g or less.
Moreover, as for any silver-coated copper powder sample, the value of TAP density was 1 g / cm 3 or more and 5 g / cm 3 or less.
From the above results, it is considered that any silver-coated copper powder sample is also a metal powder that can be used as a conductive paste that exhibits sufficient conductivity even with a low metal powder content.

Claims (6)

樹状突起銀被覆銅粉と、棘状銀被覆銅粉と、棒状銀被覆銅粉とを含む銀被覆銅粉であって、
当該銀被覆の量が0.1質量%以上、30質量%以下であり、
当該銀被覆銅粉の表面に、パルミチン酸、ステアリン酸、オレイン酸から選ばれる1種ないし、これらの混合物からなる表面処理剤と、アジピン酸、マロン酸、こはく酸、アゼライン酸から選ばれる1種ないし、これらの混合物からなる表面処理剤とが設けられていることを特徴とする銀被覆銅粉。
A silver-coated copper powder comprising dendritic silver-coated copper powder, scale-like silver-coated copper powder, and rod-like silver-coated copper powder,
The amount of the silver coating is 0.1% by mass or more and 30% by mass or less,
1 type selected from palmitic acid, stearic acid and oleic acid on the surface of the silver-coated copper powder, and 1 type selected from adipic acid, malonic acid, succinic acid and azelaic acid And a silver-coated copper powder provided with a surface treatment agent comprising a mixture thereof.
樹状突起銀被覆銅粉と、棘状銀被覆銅粉と、棒状銀被覆銅粉とを含む銀被覆銅粉であって、
当該銀被覆の量が0.1質量%以上、30質量%以下であり、
当該銀被覆銅粉の表面に、1H−ベンゾトリアゾールからなる表面処理剤が設けられていることを特徴とする銀被覆銅粉。
A silver-coated copper powder comprising dendritic silver-coated copper powder, scale-like silver-coated copper powder, and rod-like silver-coated copper powder,
The amount of the silver coating is 0.1% by mass or more and 30% by mass or less,
1. A silver-coated copper powder, wherein a surface treatment agent comprising 1H-benzotriazole is provided on the surface of the silver-coated copper powder.
請求項1または2に記載の銀被覆銅粉を含むことを特徴とする導電ペースト。 A conductive paste comprising the silver-coated copper powder according to claim 1 or 2 . 銀被覆銅粉へ、第1の表面処理剤としてパルミチン酸、ステアリン酸、オレイン酸から選択される1種以上を含むエマルジョン、又はパルミチン酸、ステアリン酸、オレイン酸から選択される1種以上とアルコールとの混合溶液を添加して混合液とし、前記銀被覆銅粉へ第1の表面処理を行う工程と、
前記第1の表面処理を行った銀被覆銅粉へ、アジピン酸、マロン酸、こはく酸、アゼライン酸から選択される1種以上を含む第2の表面処理剤を添加して表面処理し、第1および第2の表面処理を行った銀被覆銅粉を得る工程とを、有することを特徴とする銀被覆銅粉の製造方法。
Silver coated copper powder, an emulsion comprising one or more selected from palmitic acid, stearic acid and oleic acid as a first surface treatment agent , or one or more selected from palmitic acid, stearic acid and oleic acid Adding a mixed solution with alcohol to form a mixed solution, and performing a first surface treatment on the silver-coated copper powder;
A second surface treatment agent containing one or more selected from adipic acid, malonic acid, succinic acid and azelaic acid is added to the first surface-treated silver-coated copper powder to perform surface treatment, 1) and a step of obtaining a silver-coated copper powder subjected to the second surface treatment, and a method of producing the silver-coated copper powder.
銀被覆銅粉へ、1H−ベンゾトリアゾールからなる表面処理剤を添加して表面処理し銀被覆銅粉を得る工程を、有することを特徴とする銀被覆銅粉の製造方法。A method for producing a silver-coated copper powder, comprising the step of adding a surface treatment agent comprising 1H-benzotriazole to silver-coated copper powder to perform surface treatment to obtain a silver-coated copper powder. 請求項4または5に記載の銀被覆銅粉の製造方法により製造された銀被覆銅粉と、適宜な樹脂および溶剤とを混練する工程を、有することを特徴とする導電ペーストの製造方法。A method for producing a conductive paste, comprising the step of kneading the silver-coated copper powder produced by the method for producing a silver-coated copper powder according to claim 4 or 5 with an appropriate resin and a solvent.
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