JP6559032B2 - Support apparatus and support method - Google Patents

Description

  The present invention relates to a support device and a support method.

  2. Description of the Related Art Conventionally, there is a tape applicator that attaches an adhesive tape to a semiconductor wafer (hereinafter sometimes simply referred to as “wafer”) by swinging the other end of the tray table that supports the adhesive tape around one end. Known (for example, Patent Document 1).

JP-A-8-78366

  However, in the supporting device used in the tape sticking device described in Patent Document 1, when the adhesive tape supported by the tray table is loosened (so loose), the adhesive tape before being pressed by the rubber roll comes into contact with the wafer. There is an inconvenience that sticking occurs.

  An object of the present invention is to provide a support device and a support method capable of preventing sticking and sticking an adhesive sheet to an adherend.

  In order to solve the above-described problems, the present invention provides a sheet sticking apparatus that presses an adhesive sheet with a pressing means from one end side to the other end side of an adherend and attaches the adhesive sheet to the adherend. A supporting device used, a sheet supporting means for supporting an outer edge portion of the adhesive sheet in which a laminated surface on which an adhesive layer is laminated is set to have a shape larger than an adherend surface of the adherend, and the adhesion An adherend support means for supporting the adherend by placing the adherend face oppositely with a predetermined gap between the adhesive layer and outside the outer edge of the adherend disposed oppositely Wherein the adhesive sheet is in contact with at least one of the adhesive layer and the laminated surface inside the outer edge of the adhesive sheet, and is opposed to the adhesion surface of the adhesive sheet in a direction parallel to the adhesion surface. Bonding before applying tension and pressing with the pressing means A supporting device characterized by having a tipped preventing means for preventing the layer is brought into contact with the adherend surface.

  The anti-sticking means may be provided so as to be displaceable by the pressing force of the pressing means.

  Displacement maintaining means for maintaining the displacement of the leading prevention means displaced by the pressing force of the pressing means may be provided.

  The adherend support means may include adherend moving means capable of separating and approaching the adherend surface of the adherend to the adhesive layer of the adhesive sheet supported by the anti-sticking means. .

  Another aspect of the present invention is a support method used in a sheet sticking method in which an adhesive sheet is pressed by a pressing unit from one end side to the other end side of an adherend, and the adhesive sheet is attached to the adherend. A sheet supporting step for supporting an outer edge portion of the adhesive sheet in which the laminated surface on which the adhesive layer is laminated is set to a shape larger than the adherend surface of the adherend, and the adhesive layer And an adherend support step for supporting the adherend by disposing the adherend face to each other with a predetermined interval therebetween, outside the outer edge of the adherend disposed oppositely, Abutting at least one of the adhesive layer and the laminated surface inside the outer edge of the adhesive sheet, and applying a tension in a direction parallel to the adherend surface to a facing region of the adhesive sheet facing the adherend surface. The adhesive layer before being pressed by the pressing means touches the adherend surface. A support method which comprises a tipped prevention step for preventing the.

According to the present invention, since the tension in the direction parallel to the adherend surface is applied to the facing area of the adhesive sheet by the anti-sticking means (pre-sticking preventing process), the facing area does not loosen and prevents the sticking. Thus, an adhesive sheet can be attached to the adherend.
Further, if the anti-adhesion means can be displaced by the pressing force of the pressing means, the adhesive sheet can be gradually attached to the adherend from one end side to the other end side with the movement of the pressing means, A tip can be prevented more reliably.
Furthermore, if a displacement maintaining means is provided, it can prevent that an adhesive sheet peels from a to-be-adhered body by a tipping prevention means returning from a displacement state to a state before displacement.
In addition, by providing an adherend moving means, a predetermined interval between the adhesive layer to be disposed opposite to the adherend surface is set to an arbitrary interval, and appropriate tension is applied to the adhesive sheet while preventing sticking. Then, the adhesive sheet can be attached to the adherend.

The side view of the support apparatus which concerns on embodiment. Operation | movement explanatory drawing of the support apparatus which concerns on embodiment.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
In this embodiment, the X axis, the Y axis, and the Z axis are orthogonal to each other, the X axis and the Y axis are axes within a predetermined plane, and the Z axis is an axis orthogonal to the predetermined plane. To do. Furthermore, in the present embodiment, when viewed from the near side of FIG. 1 parallel to the Y axis, when indicating the direction, “up” is the arrow direction of the Z axis, “down” is the opposite direction, “ “Left” is the arrow direction of the X axis, “Right” is the opposite direction, “Front” is the front direction orthogonal to the page, and “Rear” is the opposite direction of the Y axis arrow direction.

  In FIG. 1, the supporting device 10 </ b> A presses the adhesive sheet AS by the pressing means 40 from one end side (left side) to the other end side (right side) of the wafer WF as an adherend, and the adhesive sheet AS is transferred to the wafer WF. An outer edge portion AS2 of the adhesive sheet AS in which the laminated surface AS1 on which the adhesive AD layer is laminated is set to be larger than the adherend surface WF1 of the wafer WF. An adherend support means 30 for supporting the wafer WF with the adherend surface WF1 opposed to each other with a predetermined gap between the supporting sheet support means 20 and the adhesive AD layer, and one end side to the other end side. And pressing means 40 for pressing the adhesive sheet AS toward the wafer WF and the outer side of the outer edge of the wafer WF arranged opposite to the outer edge of the adhesive sheet AS. The adhesive AD layer before being pressed by the pressing means 40 by applying a tension in a direction parallel to the adherend surface WF1 to the facing area AS3 facing the adhesive AD layer and facing the adherend surface WF1 in the adhesive sheet AS. The anti-sticking means 50 which prevents contact | abutting to the said to-be-adhered surface WF1 and the displacement maintenance means 60 which maintains the displacement of the anti-sticking means 50 displaced with the pressing force of the press means 40 are provided. The support device 10 </ b> A according to the present invention includes a sheet support unit 20, an adherend support unit 30, a leading prevention unit 50, and a displacement maintaining unit 60.

  The sheet support means 20 is supported by a linear motion motor 21 as a driving device and an output shaft 21A of the linear motion motor 21, and a ring frame RF having an adhesive sheet AS attached to the upper surface thereof is applied to a decompression pump, a vacuum ejector, or the like. And a support table 22 having a support surface 22A that can be sucked and held by decompression means (not shown). In the case of the present embodiment, the adhesive sheet AS has the adhesive AD layer laminated on the entire laminated surface AS1.

  The adherend support means 30 is an adherend moving means capable of separating and approaching the adherend surface WF1 of the wafer WF to the adhesive AD layer of the adhesive sheet AS supported by the anti-sticking means 50, and serves as a driving device. A linear motion motor 31 and a support table 32 having a support surface 32A supported by an output shaft 31A of the linear motion motor 31 and capable of holding the wafer WF by a decompression means (not shown) such as a decompression pump or a vacuum ejector.

  The pressing unit 40 includes a linear motor 41 as a driving device, and a pressing roller 42 rotatably supported by a slider 41A of the linear motor 41 via a displacement maintaining unit 60.

  The anti-sticking means 50 is supported by a linear motion motor 51 as a driving device and an output shaft 51A of the linear motion motor 51 so as to be displaceable by the pressing force of the pressing means 40, and is provided in an annular shape surrounding the wafer WF. And a supporting member 52 having the sheet supporting portion 52A. In the case of the present embodiment, the sheet support portion 52A is configured by an elastic body such as rubber, resin, sponge, or spring, and is configured to be displaced by deformation.

  The displacement maintaining means 60 is set to a planar shape larger than the planar shape of the sheet support portion 52A, and suction holding by a decompression means (not shown) such as a decompression pump and a vacuum ejector and pressurization (not shown) such as a pressure pump and a turbine are performed. A displacement maintaining plate 61 having a maintaining surface 61A provided so as to be able to be released from close contact by means, and a bracket 62 that rotatably supports the pressing roller 42 are provided.

Next, operation | movement of 10 A of support apparatuses in this embodiment is demonstrated.
First, with respect to the sheet sticking device 10 indicated by a solid line in FIG. 1 in which each member stands by at an initial position, a transfer means (not shown) such as a human hand or an articulated robot or a belt conveyor places the wafer WF on the support surface 32A. The adherend support means 30 drives a decompression means (not shown) to hold the wafer WF by suction. Thereafter, when the ring frame RF to which the adhesive sheet AS is attached is placed on the support surface 22A by a manual operation or a transfer means (not shown), the sheet support means 20 drives the decompression means (not shown) to hold the ring frame RF by suction. . Then, the leading prevention means 50 drives the linear motor 51 to raise the support member 52 and lift the adhesive sheet AS by a predetermined amount by the sheet support portion 52A, as indicated by a two-dot chain line in FIG. At this time, the anti-sticking means 50 raises the support member 52 so that the upper end portion of the sheet support portion 52A is positioned 3 mm above the lowermost portion of the pressing roller 42. Next, the sheet support means 20 drives the linear motor 21, and as shown in FIG. 2A, a tension in a direction parallel to the adherend surface WF1 is applied to the facing area AS3, and the facing area AS3 is slackened. The support table 22 is lowered until it disappears or almost disappears. Thereafter, the adherend support means 30 drives the linear motion motor 31 to raise the wafer WF until the distance between the adherend surface WF1 and the adhesive AD layer becomes a predetermined distance. At this time, the adherend support means 30 raises the support table 32 so that the adherend surface WF1 is positioned 1 mm above the lowermost portion of the pressing roller 42.

  Then, the pressing means 40 drives the linear motor 41, and as shown in FIG. 2B, the pressing roller 42 is moved to the right to move the adhesive sheet AS from one end side to the other end side. Is pressed and affixed to the wafer WF to form an integrated object WK1. At this time, the sheet supporting portion 52A is displaced by being pressed by the pressing roller 42 and contracted downward, and the displaced sheet supporting portion 52A is pressed by the displacement maintaining plate 61 and the displacement is maintained. When the integrated object WK1 is formed, the displacement maintaining means 60 drives the decompression means (not shown) to attract and hold the adhesive sheet AS, and then the adherend support means 30 and the anti-adhesion means 50 are the linear motion motors 31, 51. And the support table 32 and the support member 52 are returned to the initial positions as shown in FIG. Thereafter, when a manual or transfer means (not shown) supports the integrated object WK1 from below the integrated object WK1, the sheet supporting means 20 and the displacement maintaining means 60 stop driving the decompressing means (not shown), and then the pressurizing means (not shown) Is driven to release the close contact between the maintenance surface 61A and the adhesive sheet AS, and the unitary object WK1 is transferred manually or to a transfer means (not shown). When a hand or a transfer means (not shown) receives the integrated object WK1, the integrated object WK1 is conveyed to the next process, the sheet support means 20 and the pressing means 40 drive the linear motion motor 21 and the linear motor 41, and the support table 22 and The pressing roller 42 is returned to the initial position, and thereafter the same operation as described above is repeated.

  According to the present embodiment as described above, since the tension in the direction parallel to the adherend surface WF1 is applied to the facing area AS3 in the adhesive sheet AS by the anti-sticking means 50, the facing area AS3 does not loosen, The adhesive sheet AS can be attached to the wafer WF while preventing the tipping.

  The means and steps in the present invention are not limited in any way as long as they can perform the operations, functions, or steps described with respect to those means and steps. The process is not limited at all. For example, if the sheet supporting means is capable of supporting the outer edge portion of the adhesive sheet in which the laminated surface on which the adhesive layer is laminated is set to a shape larger than the adherend surface of the adherend, There is no limitation as long as it is within the range in light of the original technical common sense (explanation of other means and steps is omitted).

The sheet support means 20 may be configured to support the ring frame RF with chuck means such as a mechanical chuck or a chuck cylinder, Coulomb force, adhesive, adhesive, magnetic force, Bernoulli suction, driving equipment, or the like.
The sheet support means 20 may be configured to directly support the outer edge portion AS2 of the adhesive sheet AS without using the ring frame RF.
The linear motion motor 21 provided in the sheet support means 20 may be one or two or more.
If the sheet support means 20 is configured such that the adhesive sheet AS is free from slacking or almost free from slacking only by the rise of the support member 52 by the anti-sticking means 50, the support table 22 does not need to be lifted or lowered. In this case, the linear motor 21 may or may not be provided. In such a case, an optical sensor for detecting the position of the upper end portion of the sheet support portion 52A and a support portion detection means such as an imaging means are provided, and the pressing means 40 is based on the detection result of the support portion detection means. The lowermost position of the pressing roller 42 relative to the upper end portion of the support portion 52A may be moved so as to be a predetermined position.

The adherend support means 30 may be configured to support the wafer WF with chuck means such as a mechanical chuck or a chuck cylinder, Coulomb force, adhesive, adhesive, magnetic force, Bernoulli suction, driving equipment, or the like. In particular, the configuration for supporting the wafer WF may not be adopted.
If the support table 22, the pressing roller 42, the support member 52, the displacement maintaining plate 61, etc. can be moved and the operation similar to that of the above embodiment is possible, the adherend support means 30 does not have to raise and lower the support table 32. In this case, the linear motor 31 may or may not be provided.
The adherend support means 30 may be positioned so that the adherend surface WF1 is at the same height as the bottom of the pressure roller 42 when the support table 32 is raised relative to the bottom of the pressure roller 42. It may be positioned above 1 mm or higher than 1 mm.
The adherend support means 30 may raise and lower the support table 32 so that the pressing means 40 applies a predetermined pressing force to the wafer WF.
An optical sensor for detecting the position of the lowermost portion of the pressure roller 42 and a pressure roller detection device such as an image pickup device are provided. You may make it move so that the position of the to-be-coated surface WF1 may become a predetermined position.

The pressing means 40 may rotate the pressing roller 42 with an appropriate driving device.
The pressing means 40 may employ a pressing member made of a blade material, rubber, resin, sponge, or the like instead of or in combination with the pressing roller 42, or the adhesive sheet AS by blowing air such as air or gas. A configuration may be employed in which the wafer is pressed and stuck to the wafer WF.
The pressing means 40 may employ a pressing roller 42 that can be elastically deformed, or may employ a pressing roller 42 that does not elastically deform.
The pressing unit 40 may move the wafer WF and the adhesive sheet AS without moving the pressing roller 42 when pressing the adhesive sheet AS against the wafer WF from one end side to the other end side of the adhesive sheet AS. Alternatively, both the pressing roller 42, the wafer WF, and the adhesive sheet AS may be moved and pressed to be pasted.
In the pressing means 40, the pressing roller 42 may be supported by the slider 41 </ b> A of the linear motor 41 without the displacement maintaining means 60. In this case, an appropriate drive device that moves the displacement maintaining means 60 may be adopted. .
The one end side and the other end side of the wafer WF may be at any position such as the right side and the left side of the wafer WF, the front side, and the rear side, and the pressing means 40 moves the adhesive sheet AS from the right side to the left side of the wafer WF. The adhesive sheet AS may be pressed from the front side to the rear side of the wafer WF, or the adhesive sheet AS may be pressed from any position to any position.
When the adhesive sheet AS is pressed and stuck to the wafer WF with another apparatus, the pressing means 40 may not be provided in the present invention.

The anti-sticking means 50 may not be displaced, and in this case, a configuration in which the pressing means 40 is deformed may be adopted.
The anti-sticking means 50 is configured such that the support member 52 is made of a non-deformable member such as resin, metal, earthenware, glass, etc., and the entire anti-sticking means 50 moves in the pressing direction of the pressing means 40. Also good.
The anti-sticking means 50 includes a support member 52 made of a non-deformable member such as a plurality of resins, metals, ceramics, glass, and the like, and is provided with an elastic member such as a spring or rubber that supports each support member 52 and a driving device. The elastic member or driving device corresponding to the area pressed by the pressing roller 42 may be displaced by moving the support member 52 in the pressing direction of the pressing means 40.
The linear motion motor 51 provided in the leading prevention means 50 may be one or two or more.
When the support member 52 is raised with respect to the lowermost part of the pressing roller 42, the anti-sticking means 50 may be positioned above 3 mm below the lowermost part of the pressing roller 42 or higher than 3 mm. It may be positioned above.
The sheet support portion 52A may be an uninterrupted annular shape or an intermittent annular shape. For example, the sheet supporting portion 52A may be two members that are positioned on one end side and the other end side of the wafer WF and extend in the front-rear direction or the left-right direction. It may be configured by three or more members extending in the front-rear direction, the left-right direction, and other directions, and the planar shape may be any shape such as a circle, an ellipse, a polygon, or any It may be arranged like this.
In the case where the above-described pressing roller detecting means is provided, the position of the upper end portion of the sheet supporting portion 52A with respect to the lowermost portion of the pressing roller 42 becomes a predetermined position based on the detection result of the pressing roller detecting means. You may move as follows.
If the support table 22, the support table 32, the pressing roller 42, the displacement maintaining plate 61, etc. are moved and the same operation as in the above embodiment is possible, the anti-sticking means 50 does not have to raise and lower the support member 52. In this case, the linear motor 51 may or may not be provided.

As shown by a two-dot chain line in FIG. 1, the displacement maintaining means 60 is supported by a frame (not shown) supported by the slider 41A, and is driven by a rotation motor 63A as a driving device, and is not shown. It is good also as a structure provided with the driven pulley 64 supported by the flame | frame, and the belt 65 wound around the drive pulley 63 and the driven pulley 64. FIG. In this case, the displacement maintaining means 60 may drive the rotation motor 63A to rotate the belt 65 in accordance with the speed of the pressing means 40 moving to the right, and the displacement maintaining means 60 is moved on the adhesive sheet AS. Unlike the case of sliding, it is possible to prevent the adhesive sheet AS from being wrinkled or scratched. It should be noted that the positions of the drive pulley 63 and the driven pulley 64 may be interchanged, both the pulleys need not be driven, the pulley located on the right side is omitted, and the belt 65 is wound around the pressing roller 42. Also good.
As shown in the diagram indicated by AA in FIG. 1, the displacement maintaining plate 61 is provided with a calling portion 61 </ b> C by performing C chamfering or R chamfering on the tip portion 61 </ b> B that slides on the adhesive sheet AS. As shown in the drawing indicated by the middle BB, a roller 61D may be provided at the tip portion 61B to make it difficult for the adhesive sheet AS to be caught on the tip portion 61B.
The displacement maintaining means 60 may employ a configuration that maintains the displacement of the anti-sticking means 50 that has been displaced by the spraying of air such as air or gas, or a plurality of rollers or the like.
The displacement maintaining means 60 may not employ at least one of the decompression means and the pressurization means.
In the present invention, the displacement maintaining means 60 may be omitted.

The support device may be placed upside down or placed horizontally.
The adhesive sheet AS may have the adhesive AD layer laminated on a part of the laminated surface AS1, and in such a case, the planar shape of the adhesive AD layer may be the same shape as the adherend surface WF1. The shape may be larger than the adherend surface WF1, may be smaller than the adherend surface WF1, or may be another shape such as a geometric shape or a spot shape that has nothing to do with the adherend surface WF1. In the case where the planar shape of the adhesive AD layer is smaller than the adherend surface WF1, the anti-sticking means 50 is a laminated surface outside the outer edge of the wafer WF and inside the outer edge of the adhesive sheet AS. It will contact AS1. When the planar shape of the adhesive AD layer is another shape such as a geometric shape or a spot shape, the anti-tip means 50 is outside the outer edge of the wafer WF and inside the outer edge of the adhesive sheet AS. This includes the case of contacting the adhesive AD layer and the laminated surface AS1.
The material, type, shape, etc. of the adhesive sheet AS, ring frame RF, wafer WF, etc. in the present invention are not particularly limited. For example, the adhesive sheet AS is not limited to adhesive forms such as pressure-sensitive adhesiveness and heat-sensitive adhesiveness. When a heat-sensitive adhesive is used, a heating means such as an appropriate coil heater or a heat pipe heating side for appropriately heating the adhesive sheet AS may be provided. The adhesive sheet AS is, for example, a single layer having only an adhesive layer, a base sheet and an adhesive layer, an intermediate layer between them, or a cover layer on the upper surface of the base sheet. It may be a three-layer or more layer, or a so-called double-sided adhesive sheet that can peel the substrate sheet from the adhesive layer. It may have an intermediate layer, or may be a single layer or multiple layers without an intermediate layer. In addition, as adherends, food, resin containers, semiconductor wafers such as silicon semiconductor wafers and compound semiconductor wafers, circuit boards, electrode boards, information recording boards such as optical disks, glass plates, steel plates, ceramics, wood plates or resin plates, Arbitrary forms of members and articles such as non-annular frames can also be targeted. Note that the adhesive sheet AS can be read in a functional or application manner, and can be any information such as an information description label, a decorative label, a protective sheet, a dicing tape, a die attach film, a die bonding tape, and a recording layer forming resin sheet. Sheets, films, tapes, etc. may be used.
The drive device in the embodiment employs an electric device such as a rotation motor, a linear motion motor, a linear motor, a single axis robot, an articulated robot, an actuator such as an air cylinder, a hydraulic cylinder, a rodless cylinder, and a rotary cylinder. In addition, it is possible to adopt a combination of them directly or indirectly (some of them overlap with those exemplified in the embodiment).

DESCRIPTION OF SYMBOLS 10A ... Support apparatus 20 ... Sheet support means 30 ... Adhering body supporting means 31 ... Linear motion motor (adhering body moving means)
40... Pressing means 50... Anti-sticking means 60... Displacement maintaining means AD ... Adhesive AS AS ... Adhesive sheet AS1 ... Laminated surface AS2 ... Outer edge AS3 ... Opposite area WF ... Wafer (Substrate)
WF1 ... deposition surface

Claims (5)

A support device used in a sheet sticking device that presses an adhesive sheet with a pressing means from one end side to the other end side of the adherend, and sticks the adhesive sheet to the adherend,
A sheet supporting means for supporting an outer edge portion of the adhesive sheet in which a laminated surface on which an adhesive layer is laminated is set in a shape larger than an adherend surface of the adherend;
An adherend support means for supporting the adherend by disposing the adherend surface with a predetermined gap between the adhesive layer and the adhesive layer;
An outer side of the outer edge of the adherend that is disposed to face the inner side of the adhesive sheet, and is in contact with at least one of the adhesive layer and the laminated surface, and faces the adherend surface of the adhesive sheet. And a sticking prevention means for applying a tension in a direction parallel to the adherend surface to the facing area and preventing the adhesive layer before being pressed by the pressing means from coming into contact with the adherend surface. Supporting device.   The support device according to claim 1, wherein the anti-sticking means is provided so as to be displaceable by a pressing force of the pressing means.   The support device according to claim 2, further comprising a displacement maintaining unit that maintains the displacement of the leading prevention unit displaced by the pressing force of the pressing unit.   The adherend support means includes adherend moving means capable of separating and approaching the adherend surface of the adherend to the adhesive layer of the adhesive sheet supported by the anti-sticking means. Item 4. The support device according to any one of Items 1 to 3. A support method used in a sheet sticking method of pressing an adhesive sheet with a pressing means from one end side to the other end side of an adherend, and sticking the adhesive sheet to the adherend,
A sheet supporting step for supporting an outer edge portion of the adhesive sheet in which the laminated surface on which the adhesive layer is laminated is set in a shape larger than the adherend surface of the adherend;
An adherend support step of supporting the adherend by placing the adherend face oppositely with a predetermined interval between the adhesive layer, and
An outer side of the outer edge of the adherend that is disposed to face the inner side of the adhesive sheet, and is in contact with at least one of the adhesive layer and the laminated surface, and faces the adherend surface of the adhesive sheet. Including an anti-adhesion step of applying a tension in a direction parallel to the adherend surface to the facing area and preventing the adhesive layer before being pressed by the pressing means from coming into contact with the adherend surface. Support method.