JP6560328B2 - Pad insertion device, bundling system, and bundling method for bundling band - Google Patents

Description

  The present invention relates to an insertion device and an insertion method for a base protection pad for a binding band for binding, for example, a coiled rolled steel strip.

Rolled steel strips or tubes and electric wires used for various applications in the industry are generally wound in a coil shape and conveyed in a cylindrical form for reasons such as transportation restrictions. At this time, the coiled rolled steel strip or the like is constrained by a binding band made of metal or the like so as to prevent the winding from being unwound in the process of conveyance (hereinafter, an article to be bound by this binding band is referred to as a “bound object”. Also called).
In many cases, the binding mode of the binding band is such that the binding band is bound so as to surround the object to be bound as disclosed in the patent document described later, or is a hollow object to be bound. Are bound so as to tie the inside and outside of the object to be bound along the height direction of the object to be bound.

The above-described binding band is jointed by joint metal fittings or welding or the like in a state where the front end portion and the rear end portion are stacked when binding the object to be bound. A joint part is formed.
Since a metal such as a metal fitting may be disposed in the binding joint part, a seal pad (hereinafter referred to as “the binding joint part” and the object to be bound is used so as not to damage the surface of the object to be bound. The binding band is bound by interposing a pad).

  Such a pad is formed of, for example, a resin material such as compressed pulp, expanded polystyrene, plastic, or felt, woven fabric, or the like, and a thin rectangular parallelepiped pad is used as the shape thereof. The pad can take various shapes. For example, in Patent Document 1, a placement portion 1A for placing the strap 2 on the upper surface 1a and a longitudinal direction of the strap 2 from both ends of the placement portion 1A, respectively. Two side piece portions 1B extending in parallel to the strap 2 and having a space between them (between each side piece portion), and a notch surrounded on three sides by the two side piece portions 1B and the placement portion 1A. The overall planar shape is formed in a substantially U shape, such as having the portion 1C.

JP 2000-142618 A

However, it cannot be said that not only the above-mentioned patent documents but also the current technology adequately meet market needs, the above-described methods have the following problems.
That is, when a pad is inserted between the binding joint portion and the object to be bound, at present, the pad is gripped and inserted by a claw portion having two leaf springs facing each other.

Certainly, the pad can be easily inserted between the binding joint and the object to be bound by physically grasping the pad with a leaf spring (claw) or the like. One leaf spring must be interposed, and the surface of the object to be bound may be damaged.
Furthermore, in the above case, even if the surface of the object to be bound is not scratched, the leaf spring may be deteriorated due to friction generated between the pad and the object to be bound by repeated use. I can't deny it.

In addition, as shown in Patent Document 1 described above, the pad is usually placed horizontally from the upper side to the lower side in the vertical direction. However, the pad is placed horizontally due to space constraints. It is possible to envisage situations where it is impossible.
In the case of such a non-horizontal mounting, if the pad is simply inserted between the binding joint portion and the object to be bound by simply grasping the pad with the claw portion, the pad may be displaced. .

As described above, in the existing technology, there are various problems such as restrictions on the pad mounting mode, the surface of the object to be bound may be damaged, or concerns about the early deterioration of the device for inserting the pad. There is still much room for improvement.
The present invention has been made in view of the above-described problem as an example. The pad can be inserted even in a non-horizontal state, and the surface of the object to be bound is greatly damaged with a long life. An object of the present invention is to provide a pad insertion device, a bundling system, and a bundling method for a bundling band that can be suppressed.

In order to solve the above-mentioned problems, a pad insertion device according to an embodiment of the present invention is (1) a pad insertion device for inserting a pad interposed between a binding joint portion and an object to be bound, and a plurality of pads And a storage mechanism that feeds one of the stacked pads to a first delivery position, and a first suction holding part that sucks the pad positioned at the first delivery position, An insertion mechanism that is movable from a first delivery position to a second delivery position for placing the pad on the object to be bound, and a binding band that restrains the object to be bound, until it is formed, anda holding mechanism for holding the pad has moved to the second transfer position by the insertion mechanism, the second transfer position, the holding device Is a position where the pad sucks and holds the pad, and the insertion mechanism portion turns the first suction holding portion around the space between the accommodation mechanism portion and the holding mechanism portion, thereby the first suction holding portion. part allowed to move between the second delivery position and the first delivery position, characterized in Rukoto.

In order to solve the above problems, a pad insertion device according to an embodiment of the present invention includes: (2) a pad insertion device for inserting a pad interposed between a binding joint portion and a binding object, And a receiving mechanism for feeding one of the stacked pads to the first delivery position, and a first suction holding part for adsorbing the pad positioned at the first delivery position. An insertion mechanism that is movable from the first delivery position to a second delivery position for placing the pad on the object to be bound; and a binding band that restrains the object to be bound by the binding band. A holding mechanism portion that holds the pad that has been moved to the second delivery position by the insertion mechanism portion until the portion is formed, and the insertion mechanism portion includes the pad The first suction holding portion is linearly moved in the process of the second delivery position from the first delivery position while being sucked by the first suction holding portion, and the holding mechanism portion is positioned at the second delivery position. The held pad may be held, and the held pad may be moved so as to press against the side of the object to be bound.

In the pad insertion device described in ( 2 ) above, ( 3 ) the accommodation mechanism unit includes an erecting device that erects the pad and positions the pad at the first delivery position, and the insertion mechanism unit includes: It is preferable that the pad set up at the first delivery position is adsorbed by the first suction holding unit, and the first suction holding unit is linearly moved in the process of the second delivery position from the first delivery position. .

Moreover, in order to solve the said subject, the pad insertion apparatus concerning one Embodiment of this invention is ( 4 ) The pad insertion apparatus which inserts the pad interposed between a binding joint part and a to-be-bound object, And a receiving mechanism for feeding one of the stacked pads to the first delivery position, and a first suction holding part for adsorbing the pad positioned at the first delivery position. An insertion mechanism that is movable from the first delivery position to a second delivery position for placing the pad on the object to be bound; and a binding band that restrains the object to be bound by the binding band. until parts are formed, anda holding mechanism for holding the pad has moved to the second transfer position by the insertion mechanism, the holding mechanism portion, the second A second suction holding unit that sucks the pad that has moved to the transfer position, and the pad by the first suction holding unit after the second suction holding unit sucks the pad at the second transfer position; It is good also as a structure by which adsorption | suction of is cancelled | released.

Moreover, in order to solve the said subject, the binding system concerning one Embodiment of this invention is (5) Pad insertion apparatus in any one of said (1)-( 4 ), the said binding joint part, and the said A band binding mechanism that binds the object to be bound using the binding band in a state where the pad is interposed between the object and the object to be bound.

Moreover, in order to solve the said subject, the binding method of the binding band concerning one Embodiment of this invention is (6) The binding method of the binding band which binds a binding band to a to-be-bound object via a pad, The step of placing the object to be bound in the vicinity of the accommodation mechanism portion that accommodates the pad, and the pad fed to the first delivery position by the accommodation mechanism portion is adsorbed by the first suction holding portion of the insertion mechanism portion. A step of moving the sucked pad from the first delivery position to a second delivery position for placing the pad on the object to be bound; and a binding joint formed when the binding band is bound Holding the pad that has been moved to the second delivery position by the insertion mechanism so that the pad is interposed between the portion and the object to be bound by the holding mechanism, and the holding By a step of bundling the material to be bound with the binding band through the pad, only free, the second transfer position is a position where the holding mechanism portion sucks and holds the pad, the insertion mechanism The first suction holding part is turned between the first delivery position and the second delivery position by turning the first suction holding part around the space between the housing mechanism part and the holding mechanism part. It is made to move by .
Moreover, in order to solve the said subject, the binding method of the binding band concerning one Embodiment of this invention is a binding method of the binding band which binds a binding band to a to-be-bound object through the pad, (7) The step of placing the object to be bound in the vicinity of the accommodation mechanism portion that accommodates the pad, and the pad fed to the first delivery position by the accommodation mechanism portion is adsorbed by the first suction holding portion of the insertion mechanism portion. A step of moving the sucked pad from the first delivery position to a second delivery position for placing the pad on the object to be bound; and a binding joint formed when the binding band is bound Holding the pad that has been moved to the second delivery position by the insertion mechanism so that the pad is interposed between the portion and the object to be bound by the holding mechanism, and the holding Bundling the object to be bound with the binding band via the pad, and the insertion mechanism unit is configured to remove the pad from the first delivery position while adsorbing the pad by the first suction holding unit. The first suction holding unit is linearly moved in the process of the second delivery position, and the holding mechanism unit holds the pad positioned at the second delivery position and moves the held pad to the side of the object to be bound. It is made to move so that it may press against.
Moreover, in order to solve the said subject, the binding method of the binding band concerning one Embodiment of this invention is the binding method of the binding band which binds a binding band to a to-be-bound object through the pad, (8) The step of placing the object to be bound in the vicinity of the accommodation mechanism portion that accommodates the pad, and the pad fed to the first delivery position by the accommodation mechanism portion is adsorbed by the first suction holding portion of the insertion mechanism portion. A step of moving the sucked pad from the first delivery position to a second delivery position for placing the pad on the object to be bound; and a binding joint formed when the binding band is bound Holding the pad that has been moved to the second delivery position by the insertion mechanism so that the pad is interposed between the portion and the object to be bound by the holding mechanism, and the holding Bundling the object to be bound with the binding band through the pad, and the holding mechanism has a second suction holding unit that sucks the pad moved to the second delivery position The suction of the pad by the first suction holding part is released after the second suction holding part sucks the pad at the second delivery position.

  According to the present invention, since the pad is adsorbed, it is possible to insert the pad even in a non-horizontal state, and further, it is not necessary to interpose a nail or the like between the pad and the object to be bound, so that the life of the apparatus can be increased. It becomes. In addition, it is possible to greatly suppress damage to the surface of the object to be bound.

It is a perspective view showing typically pad insertion device 100 concerning a 1st embodiment. It is a flowchart which shows the binding method of the binding band concerning 1st Embodiment. It is a state transition diagram (the 1) at the time of binding a binding band to a thing to be bound using pad insertion device 100. FIG. 11 is a state transition diagram (part 2) when a binding band is bound to an object to be bound using the pad insertion device 100. FIG. 11 is a state transition diagram (part 3) when a binding band is bound to an object to be bound using the pad insertion device 100. It is a schematic diagram showing a state in which the object to be bound 1 is bound by a binding band B. It is a perspective view showing typically pad insertion device 200 concerning a 2nd embodiment. FIG. 6 is a perspective view of an essential part of the pad insertion device 200. It is a state transition diagram (the 1) at the time of binding a binding band to a thing to be bound using pad insertion device 200. FIG. 11 is a state transition diagram (part 2) when a binding band is bound to an object to be bound using the pad insertion device 200. FIG. 11 is a state transition diagram (part 3) when a binding band is bound to an object to be bound using the pad insertion device 200; FIG. 10 is a state transition diagram (part 4) when a binding band is bound to an object to be bound using the pad insertion device 200. FIG. 10 is a state transition diagram (part 5) when a binding band is bound to an object to be bound using the pad insertion device 200. FIG. 11 is a state transition diagram (part 6) when a binding band is bound to an object to be bound using the pad insertion device 200. FIG. 14 is a state transition diagram (part 7) when a binding band is bound to an object to be bound using the pad insertion device 200; FIG. 11 is a state transition diagram (No. 8) when a binding band is bound to an object to be bound using the pad insertion device 200;

  Embodiments for carrying out the present invention will be described. In the following description, the X direction, the Y direction, and the Z direction are respectively set as illustrated for convenience. However, it goes without saying that the present invention does not depend on the above-mentioned direction definition and does not unduly reduce the scope of the claims.

<< First Embodiment >>
<Pad Insertion Device 100>
A pad insertion device 100 according to a first embodiment of the present invention will be described with reference to FIGS. 1 and 3 as appropriate.

As shown in FIGS. 1 and 6, the pad insertion device 100 according to the present embodiment has a function of inserting a pad interposed between the binding joint portion and the object 1 to be bound, The mechanism unit 20 and the holding mechanism unit 30 are provided at least.
Here, the “bound object” is a product that is bound by a binding band during transportation as described above, and examples thereof include a rolled steel strip, a tube, and a metal wire. As an example, as shown in FIG. 1, the diameter D of the to-be-bound object 1 can illustrate about 1000-2000 mm, for example.

  The accommodation mechanism unit 10, the insertion mechanism unit 20, and the holding mechanism unit 30 are held by a device frame 40 (to be described later), and are configured so that their operations are appropriately controlled by a control device 50 (to be described later). .

The storage mechanism unit 10 has a function of stacking and storing a plurality of pads P and a function of sending one of the stacked pads P to the first delivery position FP.
More specifically, the accommodation mechanism unit 10 of the present embodiment includes a housing 11, a pad delivery unit 12, a first stopper 13, and a second stopper 14.

  The housing 11 is a rectangular parallelepiped container that houses a plurality of pads P in a stacked state, and is made of, for example, resin or metal. As shown in FIGS. 1 and 3, the pads P are stacked in a flat state in the housing 11, and are sent to the first delivery position FP one by one by a pad sending unit 12 described later.

  As shown in FIG. 1, the pad sending section 12 is provided on the opposite side of the housing 11 from the first delivery position FP in the present embodiment. The pad delivery unit 12 has a function of pressing the stacked pads P toward the first delivery position FP via an elastic means such as a known spring. Thereby, after the pad P is sent out toward the second delivery position SP at the first delivery position FP, the next pad P can be shifted to the first delivery position FP by the pad delivery unit 12. Yes.

  As shown in FIGS. 3 to 5, the first stopper 13 does not interfere with a first suction holding portion 21 of the insertion mechanism portion 20 to be described later in one end portion (on the first delivery position FP side) of the housing 11. It is provided at a position corresponding to the end of the pad P. Thereby, even if the pad P stacked in the housing 11 is pressed toward the one end by the pad sending part 12, the pad P is allowed to stay at the first delivery position FP by the first stopper 13.

As is clear from FIG. 3 and the like, the first stopper 13 is provided on the end side of the pad P in the direction (Y direction) in which the accommodation mechanism portion 10 and the insertion mechanism portion 20 are arranged, so that the first suction holding is performed. The obstacle to the movement of the unit 21 is avoided.
Moreover, there is no restriction | limiting in particular in the material of the 1st stopper 13, For example, you may apply well-known various materials, such as resin and a metal.

  As shown in FIGS. 3 to 5 indirectly (the second stopper 14 is installed inside the main body frame 24, the main body frame 24 is viewed for convenience in these drawings), as will be described later. The main body frame 24 has a function of defining the rotation stop position of the first suction holding unit 21. That is, as will be described later, since the first suction holding portion 21 of the present embodiment rotates (turns) via the moving arm 22, the first suction holding portion 21 is turned by the second stopper 14 in the main body frame 24. A later stop position is defined. In other words, the first suction holding portion 21 is stopped at the same height (position in the Z direction) as the first delivery position FP by stopping the rotational movement restricted by the second stopper 14 in the main body frame 24. Can be positioned.

Next, the detailed structure of the insertion mechanism unit 20 in the present embodiment will be described.
The insertion mechanism unit 20 includes a first suction holding unit 21 that sucks the pad P positioned at the first delivery position FP described above, and a second delivery position for placing the pad P on the object 1 to be bound. It has a function of moving the pad P from the first delivery position FP to the SP.

More specifically, the insertion mechanism section 20 of the present embodiment includes a moving arm 22, a proximity / rotation mechanism 23a, a main body frame 24, and a suction mechanism 25 in addition to the first suction holding section 21 described above.
The first suction holding unit 21 is attached to a distal end portion of a moving arm 22 described later and has a function of gripping the pad P. In the present embodiment, the first suction holding unit 21 sucks and holds the pad P via a suction mechanism 25 described later.

  As is clear from FIG. 3, the first suction holding portion 21 is other than the portion held by the first stopper 13 described above so as not to hinder the rotational movement of the first suction holding portion 21 in the peripheral edge of the pad P. Are gripped (both ends in the Z direction).

  One end of the moving arm 22 is fixed to a proximity / rotation mechanism 23a described later, and the other end is fixed to the first suction holding unit 21 described above. Therefore, when the moving arm 22 is rotated by the proximity / rotation mechanism 23a, the first suction holding portion 21 at the tip of the moving arm 22 can also rotate around the X axis around the rotation center C.

  The proximity / rotation mechanism 23a includes the first suction holding portion toward the first delivery position FP after the first suction holding portion 21 contacts the first stopper 14 and the position (height) in the Z direction is determined. A proximity movement that moves the X 21 in the X direction, and a rotation (turning) movement that moves the first suction holding section 21 toward the second delivery position SP after the first suction holding section 21 sucks and holds the pad P; It has a function to perform.

In other words, the insertion mechanism portion 20 (main body frame 24) in the present embodiment has the second stopper 14 that defines the turning limit of the first suction holding portion 21. Then, after the first suction holding portion 21 is stopped at the specified position via the second stopper 14 in the main body frame 24, the first suction holding portion 21 moves in the X direction toward the first delivery position FP of the accommodation mechanism portion 10. It can be said that the pad P is absorbed.
There is no restriction | limiting in particular as such a specific mechanism of the proximity / rotation mechanism 23a, The rotary actuator etc. which mount a well-known air cylinder mechanism etc. can be illustrated.

The main body frame 24 is mounted on an apparatus frame 40 which will be described later, and has a function of mounting the first suction holding unit 21 and the proximity / rotation mechanism 23a described above. The material of the main body frame 24 is not particularly limited, and known materials such as resins and metals can be exemplified as with other members.
As shown in FIGS. 1 and 3, in this embodiment, the main body frame 24 is installed on the apparatus frame 40 so that the insertion mechanism 20 is interposed between the accommodation mechanism 10 and the holding mechanism 30.

  The suction mechanism 25 is connected to a pump (not shown) or the like, and gives a suction function to the first suction holding unit 21 via the pump. Therefore, one or a plurality of suction holes are formed in a region facing the pad P in the first suction holding portion 21 of the present embodiment, and the suction holes are connected to the suction mechanism 25 described above to thereby perform the suction. Retention is realized.

Next, the detailed structure of the holding mechanism unit 30 in the present embodiment will be described.
The holding mechanism portion 30 has a function of holding the pad that has been moved to the second delivery position by the insertion mechanism portion 20 until the binding joint portion BJ is formed by the binding band B restraining the object 1 to be bound. doing.

  Here, the “first delivery position FP” in the present embodiment is a position where the first suction holding unit 21 sucks and holds the pad P whose position is defined by the first stopper 13. On the other hand, the “second delivery position SP” in the present embodiment can be said to be a position where the second suction holding section 31 of the holding mechanism section 30 holds the pad P by suction.

  As described above, the insertion mechanism unit 20 turns (rotates) the first suction holding unit 21 around the center (rotation center C) between the accommodation mechanism unit 10 and the holding mechanism unit 30, so that the first suction is performed. The holding portion 21 is moved between the first delivery position FP and the second delivery position SP.

More specifically, the holding mechanism unit 30 according to the present embodiment includes a second suction holding unit 31, a suction mechanism 32, a binding band passing recess 33, and a main body frame 34.
The second suction holding unit 31 is installed in a main body frame 34 to be described later, and is fixedly arranged in the main body frame 34 in the present embodiment. The second suction holding unit 31 has a function of sucking the pad P moved to the second delivery position SP through a suction mechanism 32 described later.

  As described later, in this embodiment, the pad P is transferred from the first suction holding unit 21 to the second suction holding unit 31. More specifically, after the second suction holding unit 31 sucks the pad P at the second delivery position SP described above, the suction of the pad P by the first suction holding unit 21 is released. In other words, the state changes from “the state where the first suction holding unit 21 sucks the pad P” to “the state where both the first suction holding unit 21 and the second suction holding unit 31 suck the pad P”, and then The process proceeds to the “state where the second suction holding unit 31 sucks the pad P”.

Similar to the suction mechanism 25 described above, the suction mechanism 32 is connected to a pump (not shown) and the like, and gives a suction function to the second suction holding unit 31 via the pump. In the present embodiment, two second suction holding portions 31 are provided on the main body frame 34, and suction holding is realized by connecting them to the suction mechanism 32 described above.
In the present embodiment, the two second suction holding portions 31 are provided on the main body frame 34, but the number of the second suction holding portions 31 may be three or more, or the second suction holding portions. 31 may be singular.

  The binding band passing recess 33 is a part for securing a space that allows the binding band B to pass through the recess while the second suction holding unit 31 sucks the pad P. As a result, the object 1 to be bound can be bound by the binding band B while the pad P is interposed while the binding band B passes through the binding band passing recess 33.

  The main body frame 34 is mounted on an apparatus frame 40 which will be described later, and has a function of mounting the second suction holding unit 31 and the suction mechanism 32 described above. The material of the main body frame 34 is not particularly limited, and examples thereof include known materials such as resin and metal.

  The device frame 40 is a framework on which the above-described accommodation mechanism unit 10, the insertion mechanism unit 20, and the holding mechanism unit 30 are mounted. Although there is no restriction | limiting in particular in the material of this apparatus frame 40, Since a heavy article is mounted, various metal materials, such as steel materials, are preferable.

The control device 50 includes a CPU that executes a binding band binding method, which will be described later, and the storage mechanism unit 10, the insertion mechanism unit 20, and the holding mechanism unit 30 are controlled under the control of the control device 50. Has been.
As this control apparatus 50, the computer provided with the well-known arithmetic unit, memory, etc. can be illustrated, for example. Note that the control device 50 may be equipped with a known communication device and connected to an external network (such as the Internet) by wire or wireless so that it can be remotely operated.

<Bundling system>
The bundling system according to the present embodiment includes the above-described pad insertion device 100 and a known band bundling mechanism. The band bundling mechanism is not particularly limited as long as it has a bundling band bundling function. For example, the apparatus examples disclosed in Japanese Patent Application Laid-Open Nos. 2009-298476 and 2001-301712 may be applied.
Among these, the band binding mechanism has a function of binding the object 1 to be bound using the binding band B in a state where the pad P is interposed between the binding joint portion and the object 1 to be bound by the pad insertion device 100. doing.
According to such a binding system, it is possible to bind the object 1 to be bound by the binding band B while suppressing damage to the surface of the object 1 to be bound.

<Bundling method of binding band>
Next, the binding method of the binding band according to the present embodiment will be described with reference to FIGS. In the binding method, since the binding band B is bound to the object 1 through the pad P described above, damage to the object 1 due to the binding band B is suppressed.

First, in step S101, as illustrated in FIG. 1, the object 1 is placed in the vicinity of the accommodation mechanism unit 10 that accommodates the pad P (that is, in the vicinity of the pad insertion device 100).
Next, in step S <b> 102, the pad P sent to the first delivery position FP by the accommodation mechanism unit 10 is adsorbed by the first suction holding unit 21 of the insertion mechanism unit 20.

The state transition of the pad insertion device 100 in step S102 will be described in more detail with reference to FIG.
That is, as shown in FIG. 4, in step S <b> 102, first, the proximity / rotation mechanism 23 a rotates the moving arm 22 to a position where the rotational movement of the moving arm 22 is regulated by the second stopper 14. Next, as indicated by the arrow “1” in FIG. 4, after the height in the Z direction is determined, the proximity / rotation mechanism 23 a moves the first suction holding portion 21 together with the moving arm 22 to the first delivery position FP. Move towards.

At this time, as shown in FIG. 4, the position of the lowermost pad P <b> 1 among the plurality of pads P stacked in the housing 11 is maintained by the first stopper 13.
When the first suction holding unit 21 moves along the X direction and comes into contact with the pad P1, the control device 50 performs control to suck and hold the pad P1 by the first suction holding unit 21 via the suction mechanism 25.

  In step S103, the control device 50 determines whether or not the suction of the pad P1 by the first suction holding unit 21 has been completed. More specifically, the control device 50 monitors the negative pressure value indicated by the suction mechanism 25, and the pad P <b> 1 is adsorbed to the first suction holding unit 21 when this value falls within a predetermined range. Judge that

Next, in step S104, the sucked pad P1 is moved from the first delivery position FP to the second delivery position SP for placing the pad P1 on the object 1 to be bound.
That is, as indicated by the arrow “2” in FIG. 4, the proximity / rotation mechanism 23 a moves the first suction holding portion 21 together with the moving arm 22 from the first delivery position FP toward the second delivery position SP. Let

Next, in step S105, the control device 50 determines whether or not the pad P1 that has been swung has reached the specified position.
The specified position is a position where at least a part of the pad P1 faces the second suction holding unit 31. From here, the pad P1 and the second suction holding unit 31 are relatively close to each other, so that the second suction holding unit 31 can hold the pad P1 by suction.

  That is, in the subsequent step S106, the pad P1 is transferred from the insertion mechanism unit 20 to the holding mechanism unit 30. More specifically, first, as indicated by an arrow “3” in FIG. 5, the proximity / rotation mechanism 23 a moves the first suction holding portion 21 together with the moving arm 22 toward the second delivery position SP along the X axis. Move in the direction. As a result, the pad P <b> 1 held by the first suction holding unit 21 and the second suction holding unit 31 come into contact with each other. At this time, the control device 50 starts the suction of the pad P1 by the second suction holding unit 31 via the suction mechanism 32.

Therefore, in this state, the pad P1 is adsorbed by the first suction holding unit 21 on one side and is adsorbed by the second suction holding unit 31 on the other side. In other words, the pad P <b> 1 is sucked by both the first suction holding unit 21 and the second suction holding unit 31.
Then, after detecting the above state based on the negative pressure values of the suction mechanism 25 and the suction mechanism 32, the control device 50 causes the proximity / rotation mechanism 23a to move as indicated by an arrow "4" in FIG. Then, the operation of moving the first suction holding part 21 together with the moving arm 22 away from the pad P1 is performed.
With the above operation, the pad P1 is transferred from the insertion mechanism unit 20 to the holding mechanism unit 30.

  After the delivery of the pad P1 from the insertion mechanism unit 20 to the holding mechanism unit 30, the next pad P2 is held, so that the proximity / rotation is performed as indicated by an arrow “5” in FIG. The mechanism 23a moves (turns) the first suction holding unit 21 together with the moving arm 22 toward the first delivery position FP.

In step S107, the pad P1 moved to the second delivery position SP by the insertion mechanism 20 so that the pad P1 is interposed between the binding joint BJ generated when the binding band B is bound and the object 1 to be bound. Is held by the holding mechanism 30.
That is, as shown in FIG. 5, the pad P <b> 1 is held by the holding mechanism unit 30, and the holding mechanism unit 30 and the bundled object 1 can be brought close to each other and the bundled object 1 can be bundled by the binding band B. To make sure

  In the present embodiment, as shown in FIG. 1B, a part of the device frame 40 turns to turn part of the pad insertion device 100 (in this example, the insertion mechanism part 20 and the holding mechanism part 30). Thus, control is performed to bring the pad P1 close to the object 1 so that the pad P1 is interposed between the binding joint part BJ and the object 1 to be bound.

  Next, in step S108, the objects to be bound 1 are bound by the binding band B through the pad P1 held in step S107. More specifically, the objects to be bound 1 are bound by the binding band B using the above-described known binding device. As a result, for example, as illustrated in FIG. 6, the object 1 is bound by the binding band B via the pad P.

At this time, the binding joint portion BJ is not in direct contact with the surface of the object 1 to be bound, and the pad P also functions as a cushioning material, so that damage to the surface of the object 1 to be bound is suppressed. .
According to the binding band binding method in the present embodiment described above, the binding object 1 can be bound with a simple configuration while suppressing damage to the surface of the binding object 1.

<< Second Embodiment >>
<Pad Insertion Device 200>
Next, the pad insertion apparatus 200 concerning 2nd Embodiment is demonstrated using FIGS. In the pad insertion device 200 according to the second embodiment, the accommodation mechanism unit 10 has the standing device 15, the insertion mechanism unit 20 moves the first suction holding unit 21 linearly, and the holding mechanism unit 30 is the turning mechanism 35. The main feature is that it moves between the binding joint portion BJ and the object 1 to be bound by turning and holding. Therefore, below, the same reference number is attached | subjected to the component of the same function as 1st Embodiment, and the description is abbreviate | omitted suitably.

As shown in FIGS. 7 and 8, the pad insertion device 200 according to the present embodiment further includes a standing device 15.
The erecting device 15 erects the pad P delivered to the placement surface 15a (rises the main surface of the pad P so as to be parallel to the suction surface of the first suction holding unit 21) to the first delivery position. It has a function to be positioned on the FP. The specific configuration of the standing device 15 is not particularly limited, and for example, a known cylinder mechanism or motor drive mechanism may be appropriately employed.

Next, an operation until the pad P arranged at the first delivery position FP is attracted by the first suction holding unit 21 will be described in detail with reference to FIGS. 9 to 12.
First, as shown in FIGS. 9 and 10, the pad delivery section 12 is configured by a cylinder mechanism and a plate-like member in the present embodiment. Then, the plate member is moved in the Y direction by the cylinder mechanism, so that the lowermost pad P stacked in the housing 11 is sent into the mounting surface 15a of the standing device 15 as a so-called dart drop. It is possible. Therefore, the thickness of the plate member in the Z direction is set to be equal to or less than the thickness of the pad P.

As is apparent from FIG. 9, in the present embodiment, since a plurality of pads P are stacked in the vertical direction, the push-down member 14 is placed on the uppermost pad P in the housing 11. Thereby, after the lowermost pad P is sent out, the next pad P is pushed down to the feedable position by the weight of the push-down member 14 and the pad P.
As the push-down member 14, for example, a known mechanism capable of generating a push-down force such as a weight having a predetermined weight, a spring mechanism, or a cylinder mechanism may be applied.

  Next, as shown in FIG. 11, the pad P that has reached the placement surface 15 a of the standing device 15 by the pad sending portion 12 faces the first suction holding portion 21 of the insertion mechanism portion 20 by the standing device 15. To get in touch. On the other hand, the control device 50 performs an operation to prepare for the next pad P delivery by controlling the plate-like member of the pad delivery unit 12 to return to the original position.

Then, as shown in FIG. 12, when the pad P comes into contact with the first suction holding unit 21 by the standing device 15, the control device 50 holds the pad P by suction with the first suction holding unit 21 via the suction mechanism 25. Control.
Further, as shown in the figure, after the pad P is sucked and held by the first sucking and holding part 21, the control device 50 controls the standing device 15 to return to the original position, thereby the next pad. An operation to prepare for the startup of P is executed.

<Bundling method of binding band>
Hereinafter, the binding method of the binding band in the present embodiment will be described mainly with respect to differences from the first embodiment with reference to FIGS. 2 and 13 to 16.
In general, the insertion mechanism 20 in the present embodiment is also characterized. Then, the holding mechanism unit 30 holds the pad P positioned at the second delivery position SP and moves the held pad P so as to press the side of the bundle 1.

Generally, in the binding method of the binding band of the present embodiment,
(1) After the pad sent out from the accommodation mechanism unit 10 is raised by the standing device 15, the pad P is sucked by the first suction holding unit 21;
(2) The first suction holding part 21 is linearly moved in the process of the second delivery position SP from the first delivery position FP while the pad P is adsorbed by the first suction holding part 21;
(3) The holding mechanism unit 30 holds the pad P positioned at the second delivery position SP, and moves through the turning mechanism 35 so as to press the held pad P against the side of the bundle 1. There are features such as,

First, similarly to step S101 described in the first embodiment, the object to be bound 1 is placed in the vicinity of the pad insertion device 200.
Next, in step S102, as already described with reference to FIGS. 9 to 12, the pad P1 sent to the first delivery position FP is suction-held by the first suction holding portion 21 of the insertion mechanism portion 20.
In step S103, as in the first embodiment, the control device 50 determines whether or not the suction of the pad P1 by the first suction holding unit 21 has been completed.

In subsequent step S104, the sucked pad P1 is moved from the first delivery position FP to the second delivery position SP for placing the pad P1 on the object 1 to be bound.
That is, as indicated by the arrow “1” in FIG. 13, the linear movement mechanism 23 b first moves the first suction holding portion 21 together with the moving arm 22 in the −X direction to a state where linear movement is possible. .

Next, the linear movement mechanism 23 c linearly moves the first suction holding unit 21 in the Y direction together with the moving arm 22. As a result, the pad P <b> 1 held by the first suction holding unit 21 faces the second suction holding unit 32.
After that, the linear movement mechanism 23b moves the first suction holding unit 21 in the X direction together with the moving arm 22 so that the pad P1 comes into contact with the second suction holding unit 32.

  Next, in step S105, the control device 50 determines whether or not the pad P1 that has been swung has reached the specified position. The specified position is a position where at least a part of the pad P1 faces the second suction holding unit 31.

In step S106, the pad P1 is transferred from the insertion mechanism unit 20 to the holding mechanism unit 30. More specifically, the control device 50 first starts the suction of the pad P1 by the second suction holding unit 31 via the suction mechanism 32. Next, after the controller 50 detects the suction state based on the negative pressure values of the suction mechanism 25 and the suction mechanism 32, the operation of releasing the suction of the pad P1 by the first suction holding unit 21 is performed.
With the above operation, the pad P1 is transferred from the insertion mechanism unit 20 to the holding mechanism unit 30.

  In addition, after completion of the delivery of the pad P1 from the insertion mechanism part 20 to the holding mechanism part 30, as shown by the numbers “4” and “5” in FIG. The linear moving mechanisms 23b and 23c linearly move the first suction holding unit 21 together with the moving arm 22 toward the first delivery position FP.

Thereafter, in the same manner as in the first embodiment described above, in step S107, control is performed to bring the pad P1 closer to the object 1 so that the pad P1 is interposed between the binding joint part BJ and the object 1 to be bound. Is done.
More specifically, as shown in FIG. 16, a part of the device frame 40 turns while holding the pad P <b> 1 by the holding mechanism unit 30, so that a part of the pad insertion device 200 (in this example, the holding mechanism unit). 30) turns and the pad P1 comes close to the object 1 to be bound.

  Next, in step S108, the objects to be bound 1 are bound by the binding band B through the pad P1 held in step S107. More specifically, the objects to be bound 1 are bound by the binding band B using the above-described known binding device. As a result, for example, as illustrated in FIG. 6, the object 1 is bound by the binding band B via the pad P.

In step 109, as in the first embodiment, the object 1 is bound by the binding band B through the pad P1 held in step S107.
Also with the pad insertion device 200 and the bundling system in the second embodiment described above, it is possible to bind the bundling object 1 with a simple configuration while suppressing damage to the surface of the bundling object 1.

Note that the above-described embodiment is an example, and a new pad insertion device or a binding system may be configured by appropriately combining the elements of the embodiment without departing from the spirit of the present application.
For example, the number and arrangement positions of the first suction holding unit 21 and the second suction holding unit 31 described above may be adjusted as appropriate.

  As described above, the pad insertion device and the bundling system of the present invention are used to construct a device system that can prevent the surface of the object to be bound from being scratched while reducing the size of the device with a simple configuration. Is suitable.

DESCRIPTION OF SYMBOLS 100,200 Pad insertion apparatus 10 Storage mechanism part 20 Insertion mechanism part 30 Holding mechanism part 40 Apparatus frame 50 Control apparatus B Binding band BJ Binding joint part

Claims (8)

A pad insertion device for inserting a pad to be interposed between a binding joint part and a bound object,
A storage mechanism that stacks and stores a plurality of pads and sends one of the stacked pads to the first delivery position;
A first suction holding portion that sucks the pad positioned at the first delivery position, and is movable from the first delivery position to a second delivery position for placing the pad on the object to be bound; An insertion mechanism,
A holding mechanism that holds the pad that has been moved to the second delivery position by the insertion mechanism until the binding band restrains the object to be bound to form the binding joint;
Equipped with,
The second delivery position is a position where the holding mechanism unit sucks and holds the pad,
The insertion mechanism section pivots the first suction holding section about the space between the storage mechanism section and the holding mechanism section, thereby moving the first suction holding section to the first delivery position and the second delivery position. pad insertion device according to claim Rukoto move between a position. A pad insertion device for inserting a pad to be interposed between a binding joint part and a bound object,
A storage mechanism that stacks and stores a plurality of pads and sends one of the stacked pads to the first delivery position;
A first suction holding portion that sucks the pad positioned at the first delivery position, and is movable from the first delivery position to a second delivery position for placing the pad on the object to be bound; An insertion mechanism,
A holding mechanism that holds the pad that has been moved to the second delivery position by the insertion mechanism until the binding band restrains the object to be bound to form the binding joint;
Comprising
The insertion mechanism part linearly moves the first suction holding part in the process of the second delivery position from the first delivery position while adsorbing the pad by the first suction holding part,
The holding mechanism unit holds the pad positioned at the second delivery position, and moves the held pad so as to press the side of the object to be bound. The accommodating mechanism includes an erecting device that erects the pad and positions the pad at the first delivery position;
The insertion mechanism unit sucks the pad standing at the first delivery position with the first suction holding unit, and linearly moves the first suction holding unit from the first delivery position to the second delivery position. The pad insertion device according to claim 2 to be moved. A pad insertion device for inserting a pad to be interposed between a binding joint part and a bound object,
A storage mechanism that stacks and stores a plurality of pads and sends one of the stacked pads to the first delivery position;
A first suction holding portion that sucks the pad positioned at the first delivery position, and is movable from the first delivery position to a second delivery position for placing the pad on the object to be bound; An insertion mechanism,
A holding mechanism that holds the pad that has been moved to the second delivery position by the insertion mechanism until the binding band restrains the object to be bound to form the binding joint;
Comprising
The holding mechanism unit has a second suction holding unit that sucks the pad that has moved to the second delivery position;
A pad insertion device in which suction of the pad by the first suction holding part is released after the second suction holding part sucks the pad at the second delivery position. The pad insertion device according to any one of claims 1 to 4 ,
A band binding mechanism for binding the object to be bound using the binding band in a state where the pad is interposed between the binding joint part and the object to be bound;
A bundling system comprising: A bundling method of a bundling band for bundling a bundling band to a bundling object through a pad,
Placing the object to be bound in the vicinity of the housing mechanism for housing the pad;
A step of adsorbing the pad fed to the first delivery position by the accommodation mechanism by the first suction holding unit of the insertion mechanism;
Moving the sucked pad from the first delivery position to a second delivery position for placing the pad on the object to be bound;
The holding mechanism portion holds the pad that has been moved to the second delivery position by the insertion mechanism so that the pad is interposed between the binding joint portion generated when the binding band is bound and the object to be bound. And a process of
Binding the object to be bound with the binding band through the held pad;
Only including,
The second delivery position is a position where the holding mechanism unit sucks and holds the pad,
The insertion mechanism section pivots the first suction holding section about the space between the storage mechanism section and the holding mechanism section, thereby moving the first suction holding section to the first delivery position and the second delivery position. A binding method for a binding band, wherein the binding band is moved between positions . A bundling method of a bundling band for bundling a bundling band to a bundling object through a pad,
Placing the object to be bound in the vicinity of the housing mechanism for housing the pad;
A step of adsorbing the pad fed to the first delivery position by the accommodation mechanism by the first suction holding unit of the insertion mechanism;
Moving the sucked pad from the first delivery position to a second delivery position for placing the pad on the object to be bound;
The holding mechanism portion holds the pad that has been moved to the second delivery position by the insertion mechanism so that the pad is interposed between the binding joint portion generated when the binding band is bound and the object to be bound. And a process of
Binding the object to be bound with the binding band through the held pad;
Including
The insertion mechanism part linearly moves the first suction holding part in the process of the second delivery position from the first delivery position while adsorbing the pad by the first suction holding part,
The holding mechanism unit holds the pad positioned at the second delivery position, and moves the held pad so as to press the side of the object to be bound. . A bundling method of a bundling band for bundling a bundling band to a bundling object through a pad,
Placing the object to be bound in the vicinity of the housing mechanism for housing the pad;
A step of adsorbing the pad fed to the first delivery position by the accommodation mechanism by the first suction holding unit of the insertion mechanism;
Moving the sucked pad from the first delivery position to a second delivery position for placing the pad on the object to be bound;
The holding mechanism portion holds the pad that has been moved to the second delivery position by the insertion mechanism so that the pad is interposed between the binding joint portion generated when the binding band is bound and the object to be bound. And a process of
Binding the object to be bound with the binding band through the held pad;
Including
The holding mechanism unit has a second suction holding unit that sucks the pad that has moved to the second delivery position;
The binding method of a binding band, wherein the suction of the pad by the first suction holding unit is released after the second suction holding unit sucks the pad at the second delivery position.