JP6570074B2 - Chuck mechanism - Google Patents

Description

The present invention relates to a chuck Organization.

  Conventionally, as a device for cleaning a substrate such as a semiconductor wafer and drying after cleaning, a batch method has been used in which a plurality of substrates are immersed in a cleaning layer for cleaning, and then lifted from the cleaning layer and dried.

  The batch method can process multiple substrates at the same time, so it is excellent in work efficiency, but in order to increase the degree of substrate cleaning, the substrate is cleaned by spraying a cleaning solution while rotating the substrates one by one on the stage. Then, a single wafer type which is then dried is advantageous.

  In the single wafer cleaning / drying apparatus, a chuck portion for holding the substrate is required. Patent Document 1 discloses a structure in which a plurality of chucking arms constituting a substrate support portion are connected to a cylinder device that moves in a vertical direction via connection wires. In this structure, when the cylinder device is raised, the wire pulls the chucking arm to chuck the substrate, and when the cylinder device is lowered, the chucking operation is released.

  In a single wafer cleaning / drying apparatus, the vicinity of the outer periphery of the stage may be deformed in the direction of the rotation axis due to the centrifugal force during rotation, and the chuck may come off. Patent Document 2 discloses a structure in which a counterweight movable in the radial direction is provided under the stage and held by a spring that expands and contracts in the radial direction. In this structure, the counterweight overcomes the elastic force of the spring during rotation and moves to the outer peripheral side by centrifugal force, thereby preventing the vicinity of the outer periphery of the stage from being deformed and preventing the chuck from being removed.

  In the single wafer cleaning / drying apparatus, if the chuck portion is always in contact with the wafer during cleaning, the contact portion may not be cleaned and a cleaning residue may occur. Patent Document 3 discloses a support bar that supports a substrate only during high-speed rotation as a chuck portion. By rotating the support bar around the hinge pin, the portion above the hinge pin is held in contact with the substrate. In the support bar, the mass of the portion above the hinge pin is smaller than the mass of the lower portion, and the lower portion is pressed to the stage side by a spring. The support bar does not chuck the substrate during low-speed rotation, but during high-speed rotation, the lower part overcomes the pressing force of the spring and moves to the opposite side of the stage side by centrifugal force to hold it in contact with the substrate. . When the centrifugal force is reduced after the cleaning and the support bar is detached, the cleaning liquid flows through the contact portion, so that no cleaning liquid remains.

JP 2001-223198 A JP 2010-10221 A JP 2001-110771 A

  However, the structures described in Patent Documents 1 to 3 have the following problems.

  The structure of Patent Document 1 requires a cylinder and a wire in the chuck mechanism, which is complicated and expensive, and when these parts are made of metal, generated from cleaning liquid, cleaning liquid mist, or cleaning liquid There is a problem that there is a risk of corrosion due to corrosive gas.

  The structure of Patent Document 2 is relatively simple. However, in order to reliably chuck the wafer, a fine balance adjustment between a plurality of counterweights and springs is necessary, and the workability is poor. Was made of metal and had a problem of corrosion.

  Although the structure of Patent Document 3 is also relatively simple, it still requires a spring and has a problem of corrosion.

The present invention has been made in view of the above problem, the structure can be simple and reliably chuck the wafer, and an object thereof to provide an excellent chuck Organization corrosion resistance.

The chuck mechanism according to the present invention is a chuck mechanism for holding a wafer in a single wafer type, and is arranged uniformly on a disk-shaped stage rotatable in a surface direction and on a circumference centering on the rotation axis of the stage. Three or more chuck portions provided so as to be rotatable in the radial direction of the stage and surrounding an end surface of the wafer, and a holding portion provided on the stage and rotatably holding the chuck portion. The chuck portion has a rod-like shape, and a chuck main body held by the holding portion so that one end surface faces upward as an upper end, a radial direction of the stage, and an axis of the chuck main body A rotation center hole formed in the chuck body so as to be orthogonal to the direction, and a long hole provided through the lower side of the rotation center hole of the chuck body in the radial direction of the stage. wherein the chat Parts are in the outer side in the radial direction of the stage of the rotation center axis, and the center of gravity is located below the rotation center axis, wherein the holding portion is provided through the rotation center hole The chuck mechanism includes a round rod-shaped guide rod provided so as to penetrate the elongated hole, and the elongated hole is slidable with the guide rod in the circumferential direction of the stage. It is provided so that it may contact, and the diameter of an up-down direction is larger than the diameter of the said guide rod .
According to this invention, since the center of gravity of the chuck portion is outside and below the rotation center axis, the smaller the centrifugal force due to the rotation of the stage, the more the chuck portion rotates away from the wafer and the greater the centrifugal force. The chuck part rotates in a direction approaching the wafer.
For this reason, a mechanism that reliably dechucks the wafer when the stage rotation speed is below a certain level and reliably chucks the wafer above a certain level requires a spring and counterweight that only defines the relationship between the center axis of rotation and the position of the center of gravity. It can be realized with a simple structure.
If the structure is simple, the chuck portion can be formed of a resin injection molded product or the like without using a spring or complicated parts, so that the corrosion resistance can be improved.
Further, since the rotation moment generated in the through shaft due to the rotation of the stage is alleviated by the guide rod coming into contact with the side surface of the long hole, it is possible to prevent the chuck mechanism from being deformed by the rotation moment when the stage rotates.

The chuck mechanism according to the present invention, the chuck portion is provided on the upper end of the front Symbol chuck body, a lower surface holding portion having a support surface for supporting contact with the lower surface of the wafer, in contact with the end surface of the wafer an end face sandwiching portion having a holding surface for holding a wafer holder provided with, provided at the lower end of the front Symbol chuck body in the radial direction of the stage, and a bent portion provided by bending outwardly of the chuck body , wherein the holding portion is provided before SL on the stage, the structure comprising a base portion for fixing the through-shaft is considered.
According to the present invention, since the center of gravity of the chuck portion is located outside and below the rotation center axis by providing a bent portion that bends outside the chuck body at the lower end of the chuck body, the structure is simple. It is. If the structure is simple, the chuck portion can be formed of a resin injection molded product or the like without using a spring or complicated parts, so that the corrosion resistance can be improved.

In the chuck mechanism according to the present invention, the chuck main body, the wafer holding portion, and the bent portion may have an integrated structure.
According to this structure, since the chuck portion can be manufactured by integrally molding by resin molding or the like, the corrosion resistance can be improved.

In the chuck mechanism according to the present invention, the end surface holding portion is provided so as to rise from the chuck body, and has a protrusion portion having a contact surface that contacts the end surface of the wafer, and the protrusion along the radial direction of the stage. The structure provided with the drainage groove provided in the part can be considered.
According to the present invention, the abutting surface comes into contact with the end surface of the wafer at the time of chucking, so that the chuck can be reliably performed.
In addition, according to this structure, when cleaning is performed while rotating the stage, the cleaning liquid is discharged from the drainage groove by centrifugal force, so that the cleaning liquid remains between the end surface sandwiching portion and the end surface of the wafer to contaminate the wafer. Can be prevented.

In the chuck mechanism according to the present invention, it is considered that the lower surface holding portion includes a tapered portion inclined upward from the radial inner side to the outer side of the stage, and the support surface is an upper surface of the tapered portion. It is done.
According to the present invention, the angle at which the lower surface of the wafer and the upper surface of the taper portion come into contact with each other can be reduced in a state where the rotation speed of the stage is below a certain level and the chuck portion is rotated away from the wafer. Can be prevented.

In the chuck mechanism according to the present invention, the chuck portion is made of, for example, vinyl chloride or polyether ether ketone.
According to the present invention, the chuck portion can be made of a material that is lightweight, inexpensive, and has high corrosion resistance, and the corrosion resistance of the chuck mechanism can be improved.

The perspective view of the chuck mechanism in an embodiment of the present invention. The perspective view of the stage in the said embodiment. The perspective view of the chuck | zipper part of the area | region A of FIG. 1 in the said embodiment. The side view of the chuck | zipper part in the said embodiment. The perspective view of the holding | maintenance part in the said embodiment. The perspective view of the guide rod in the said embodiment. The perspective view of the key plate in the said embodiment. The perspective view which shows the state which mounted the wafer in the chuck mechanism in the said embodiment. In the said embodiment, the side view which shows the state which mounted the wafer in the state which stopped rotation of the stage. In the said embodiment, the side view which shows the state which mounted the wafer in the state which rotated the stage.

DESCRIPTION OF EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings.
First, the configuration of the chuck mechanism 1 according to the present embodiment will be described with reference to FIGS.
Here, the chuck mechanism is exemplified by a mechanism that holds the wafer when it is cleaned and when it is dried after cleaning.

  As shown in FIG. 1, the chuck mechanism 1 is a device that holds a wafer 100 (see FIG. 8) to be described later in a single wafer type, and includes a stage 3, a chuck portion 5, and a holding portion 7. The chuck mechanism 1 also has a guide rod 9 and a key plate 11.

The stage 3 is a disk-like member on which the constituent members of the chuck mechanism 1 are mounted.
As shown in FIG. 2, the stage 3 can rotate in the plane direction around the rotation center O.
The stage 3 is preferably made of a material having corrosion resistance to the cleaning liquid, and is made of, for example, vinyl chloride or polyether ether ketone.
The stage 3 has a rotation center hole 20 at the rotation center O as shown in FIG. The rotation center hole 20 is a hole to which a rotation shaft of a rotation motor (not shown) is attached.

As shown in FIG. 2, the stage 3 is provided with a chuck portion insertion hole 13 and a holding portion fixing hole 19 on the outer periphery of the upper surface. The stage 3 has a boss insertion hole 15 formed in the radial direction of the stage 3 from the outer peripheral end surface toward the chuck portion insertion hole 13.
The stage 3 also has a key plate fixing hole 21 provided on both sides of the boss insertion hole 15 on the outer peripheral end surface.

  The chuck part insertion hole 13 is a hole into which the chuck part 5 is inserted, and is provided on a circumference centering on the rotation center O. Here, they are equally arranged along six locations on the outer periphery of the stage 3. A guide rod insertion hole 17 that is formed toward the rotation center O and into which the tip of the guide rod 9 is inserted is formed on the inner periphery of the chuck portion insertion hole 13.

The holding portion fixing holes 19 are holes into which bolts or the like (not shown) for fixing the holding portion 7 are inserted. Here, the holding portion fixing holes 19 are provided at four locations around the chuck portion insertion hole 13.
The boss insertion hole 15 is a hole into which the key plate 11 is inserted.
The key plate fixing hole 21 is a hole into which a bolt or the like (not shown) that fixes the key plate 11 is inserted.

The chuck portion 5 is a member that can be rotated in the radial direction of the stage 3, and is a member that holds the wafer 100 by rotation. The chuck portion 5 is preferably made of a material having corrosion resistance to the cleaning liquid, and is made of, for example, vinyl chloride or polyether ether ketone.
In FIG. 1, the chuck portion 5 is evenly arranged along the circumference around the rotation center O of the stage 3, here the outer periphery of the stage 3, and 6 so as to surround the end surface 103 (see FIG. 9) of the wafer 100. One is provided.
The number of chuck portions 5 is not limited to six. However, it is preferable that there are at least three so that the stress generated in the wafer 100 is not biased when the wafer 100 is held and held.
As shown in FIG. 3, the chuck unit 5 includes a chuck main body 31 and a wafer holding unit 33. The chuck portion 5 also has a rotation center hole 43, a bent portion 45, and a long hole 47.

The chuck body 31 is a member having a rod-like shape, and is held by the holding portion 7 so that one end portion thereof faces upward as an upper end 34.
The wafer holding unit 33 is a member provided so as to rise upward from the upper end 34 of the chuck main body 31 (positive direction in the Z direction), and includes a lower surface holding unit 35 and an end surface clamping unit 41.

  The lower surface holding part 35 is a member that contacts and supports the lower surface 105 (see FIG. 9) of the wafer 100. In FIG. 3, the lower surface holding part 35 is a tapered part that is inclined upward from the inner side to the outer side in the radial direction of the stage 3. In this structure, the upper surface of the tapered portion is a support surface that supports the lower surface 105 of the wafer 100.

  The end surface clamping unit 41 is a member that sandwiches and holds the wafer 100 in cooperation with the other chuck unit 5 by contacting the end surface 103 (see FIG. 9) of the wafer 100. The end surface clamping portion 41 is a pair of projecting portions provided on the outer side in the radial direction of the stage 3 with respect to the lower surface holding portion 35 and facing the chuck direction (the radial direction of the stage 3).

A drainage groove 39 is provided between the pair of end surface clamping portions 41 along the radial direction of the stage 3.
The drain groove 39 holds the wafer 100 on the chuck mechanism 1 and rotates it to clean the wafer 100 so that the cleaning liquid remains in order to prevent the cleaning liquid from remaining between the end surface holding portion 41 and the end surface 103 of the wafer 100. It is a groove to discharge.

The end surface clamping unit 41 has a pair of contact surfaces 37 as holding surfaces that come into contact with the wafer 100.
The contact surface 37 is a surface that includes surfaces that face each other via the drain grooves 39 and that has a curved surface formed in the vicinity of a corner portion on the radially inner side of the stage 3.

The rotation center hole 43 is a through hole that becomes the center when the chuck body 31 rotates, and is provided below the wafer holding portion 33.
The rotation center hole 43 is formed in a direction (Y direction in FIG. 3) orthogonal to both the radial direction of the stage 3 (direction in which the chuck portion 5 chucks the wafer 100) and the axial direction of the chuck body 31.

The bent portion 45 is a member for setting the center of gravity of the chuck portion 5 to a desired position.
The bent portion 45 is a rod-like member provided at the lower end 36 of the chuck body 31. The bent portion 45 is bent outward of the chuck body 31 in the radial direction of the stage 3.

The long hole 47 is a through hole into which the guide rod 9 is inserted. The long hole 47 is formed on the lower side (bending portion 45 side) than the rotation center hole 43 and penetrates in the radial direction of the stage 3, that is, in the direction orthogonal to the rotation center hole 43.
The height h of the long hole 47 in the vertical direction (the axial direction of the chuck body 31, here the Z direction) is larger than the diameter DL (see FIG. 6) of the main shaft 71 of the guide rod 9. The width W in the circumferential direction (Y direction) of the stage 3 of the long hole 47 is a length that can slide in contact with the main shaft 71 of the guide rod 9 (a length that is about the same as the diameter DL of the main shaft 71). .

  The chuck portion 5 preferably has an integral structure. Specifically, it is preferable that the chuck main body 31, the wafer holding part 33, and the bent part 45 have an integral structure. This is because the integral structure allows the chuck portion 5 to be integrally molded by resin molding or the like, thereby improving the corrosion resistance.

  As shown in FIG. 4, the chuck portion 5 is outside of the rotation center axis C in the radial direction of the stage 3 (direction to chuck the wafer 100) and below the rotation center axis C (rotation center). The center of gravity G needs to be positioned on the opposite side of the wafer holding unit 33 with respect to the axis C.

The holding part 7 is a member that holds the chuck part 5 in a rotatable manner, and is provided on the stage 3 as shown in FIG.
As shown in FIG. 5, the holding portion 7 includes a through shaft 59, a base portion 51, through shaft holding portions 55 and 57, and a C ring 63.

The penetrating shaft 59 is a shaft for holding the chuck portion 5, and has a head portion 61 whose one end portion is enlarged in diameter. Although the illustration of the other end is omitted, a concave groove extending around the axis is formed on the outer peripheral surface.
The base 51 is a plate-like member fixed to the stage 3, and an insertion hole 53 into which the chuck portion 5 is inserted is formed at the center.
At four positions around the insertion hole 53 of the base portion 51, a holding portion side through hole 65 corresponding to the holding portion fixing hole 19 of FIG. 2 is formed.
The holding part side through hole 65 is inserted with a bolt or the like (not shown) for fixing the holding part 7 to the stage 3.

The through shaft holding portions 55 and 57 are semicircular plate-like members provided so as to face each other with the insertion hole 53 interposed therebetween.
The through shaft 59 is provided through the through shaft holding portions 55 and 57 so as to pass above the insertion hole 53.

The C ring 63 is a retaining member that prevents the penetrating shaft from coming out of the penetrating shaft holding portions 55 and 57 by being fitted in a not-shown concave groove formed at the other end of the penetrating shaft 59.
The C-ring 63 is preferably made of a material having sufficient elasticity to withstand deformation when fitted to the through shaft 59 and corrosion resistance against a cleaning liquid or the like. An example of such a material is a fluororesin.
The members of the holding part 7 other than the C ring 63 are preferably made of a material that has corrosion resistance against a cleaning liquid and the like and has a higher strength than the C ring 63. Such materials include, for example, vinyl chloride or polyether ether ketone.
It is desirable that the bolt (not shown) for fixing the holding unit 7 to the stage 3 is also made of a material having corrosion resistance against a cleaning liquid or the like, similar to the holding unit 7.

The guide rod 9 is a round bar-shaped member that relieves a rotational moment on the YZ plane generated in the through shaft 59 when the stage 3 rotates. The guide rod 9 is preferably made of a material having corrosion resistance against a cleaning liquid or the like. Such materials include, for example, vinyl chloride or polyether ether ketone.
As shown in FIG. 6, the guide rod 9 includes a main shaft 71, a ring 75, and a fixing pin 73.

The main shaft 71 is a round bar-shaped shaft that passes through the long hole 47 shown in FIG.
When the stage 3 rotates, the main shaft 71 slides in contact with the side surface of the long hole 47 to bear a part of the rotational moment generated in the chuck portion 5, and the rotational moment is concentrated on the through shaft 59. Prevent deformation.

One end of the main shaft 71 is a front end 77 that is inserted into the guide rod insertion hole 17 of FIG.
The ring 75 is a member provided at the other end of the main shaft 71 and has an annular shape with a diameter larger than that of the main shaft 71. The ring 75 is a member that fixes the position of the guide rod 9 and enables the chuck portion 5 to rotate.
Specifically, when the guide rod 9 is inserted into the guide rod insertion hole 17 and the front end portion 77 abuts, the key plate 11 of FIG. 1 abuts against the ring 75, so that the position of the guide rod 9 is fixed. A gap in which the chuck portion 5 is rotatable is formed.

  The fixing pin 73 is a round bar-like member extending from the end of the ring 75 in the direction opposite to the main shaft 71. The fixing pin 73 is a member that positions the guide rod 9 by penetrating the key plate 11 of FIG. 1, and has a smaller diameter than the main shaft 71 and the ring 75.

The key plate 11 is a member that fixes the guide rod 9 to the stage 3.
The key plate 11 is preferably made of a material having corrosion resistance against a cleaning liquid or the like. Such materials include, for example, vinyl chloride or polyether ether ketone.

  As shown in FIG. 7, the key plate 11 includes a plate body 81, a boss 85, a guide rod through hole 83, and a plate fixing through hole 87.

The plate body 81 is a plate-like member that contacts the outer periphery of the stage 3.
The boss 85 is a member protruding from the back surface of the plate body 81 (the surface in contact with the stage 3), and has a shape corresponding to the boss insertion hole 15 in FIG.

  The guide rod through hole 83 is a hole into which the fixing pin 73 of FIG. 6 is inserted, and penetrates the plate body 81 and the boss 85 in the radial direction of the stage 3.

The plate fixing through hole 87 is a hole corresponding to the key plate fixing hole 21 of FIG. 2, and a bolt or the like (not shown) for fixing the plate body 81 to the stage 3 is inserted therein.
It is desirable that the bolt (not shown) is also made of a material having corrosion resistance against the cleaning liquid or the like, similar to the key plate 11.

  The above is the description of the configuration of the chuck mechanism 1.

  Next, an example of an assembly method of the chuck mechanism 1 will be briefly described.

  First, the base 51 of the holding unit 7 is attached to the stage 3. Specifically, the holding portion side through hole 65 of the base portion 51 shown in FIG. 5 and the holding portion fixing hole 19 of the stage 3 shown in FIG. Fix to 3.

  Next, the chuck part 5 is inserted from below into the chuck part insertion hole 13 of the stage 3 shown in FIG. In this state, the through shaft 59 of the holding portion 7 is inserted into the rotation center hole 43 shown in FIG. 3, and the C-ring 63 is fitted into a not-shown concave groove to fix the chuck portion 5 to the base portion 51.

Next, the main shaft 71 of the guide rod 9 shown in FIG. 6 is inserted into the elongated hole 47 of the chuck portion 5 shown in FIG. 3, and the front end portion 77 is inserted into the guide rod insertion hole 17 shown in FIG.
Finally, the key plate 11 is attached to the stage 3 as shown in FIG. 1 so that the fixing pin 73 is inserted into the guide rod through hole 83.
Specifically, the boss 85 shown in FIG. 7 is inserted into the boss insertion hole 15 shown in FIG. 2, and a plate fixing through hole 87 shown in FIG. 7 and a key plate fixing hole 21 shown in FIG. Insert and fix.
The chuck mechanism 1 is assembled by the above procedure.

  As shown in FIG. 9, the chuck portion 5 has a center of gravity G located outside the rotation center axis C in the radial direction of the stage 3 and below the rotation center axis C. Therefore, when the stage 3 does not rotate in a state where the chuck mechanism 1 is assembled, the main shaft 71 of the chuck portion 5 changes from a state where the axial direction is horizontal in the vertical direction (Z direction) to a state where the main shaft 71 is rotated in the direction R1. Retained.

At this time, the distance DC between the rotation center O of the stage 3 and the contact surface 37 of the chuck portion 5 is larger than the radius DW of the wafer 100.
The above is the description of an example of the assembly method of the chuck mechanism 1.

  Next, an operation when the chuck mechanism 1 chucks the wafer 100 will be described with reference to FIGS.

First, with the stage 3 stationary, the wafer 100 is mounted on the chuck mechanism 1 as shown in FIG.
Specifically, as shown in FIG. 9, the wafer 100 is mounted so that the lower surface 105 is in contact with the lower surface holding part 35.

In this state, as shown in FIG. 9, the end surface 103 of the wafer 100 is not in contact with the contact surface 37 of the chuck portion 5, and thus is not sandwiched between the chuck portions 5.
Next, in this state, a motor (not shown) connected to the stage 3 is driven to rotate the stage 3.
Since the center of gravity G is located on the chuck portion 5 on the outer side in the radial direction of the stage 3 with respect to the rotation center axis C and on the lower side with respect to the rotation center axis C, the centrifugal force due to the rotation is in the direction of R2 in FIG. Added to.
When the rotation speed becomes a certain level or more, the chuck portion 5 rotates in the direction of R2 around the rotation center axis C as shown in FIG. 10 by centrifugal force, and the contact surface 37 contacts the end surface 103 of the wafer 100. And press.
In this state, since the wafer 100 is sandwiched between the chuck portions 5, the wafer 100 is fixed to the chuck portions 5.
When the rotational speed of the stage 3 is lowered from the state shown in FIG. 10, the centrifugal force generated in the direction of R2 is weakened, and when the rotational speed is below a certain level, the contact surface 37 is separated from the wafer 100 and the fixation is released. .
The above is the description of the operation when the chuck mechanism 1 chucks the wafer 100.

  Thus, according to the present embodiment, the center of gravity G of the chuck portion 5 is outside and below the rotation center axis C. In this structure, the chuck unit 5 rotates in a direction away from the wafer 100 as the centrifugal force due to the rotation of the stage 3 decreases, and the chuck unit 5 rotates in a direction closer to the wafer 100 as the centrifugal force increases.

In this embodiment, a mechanism that reliably dechucks the wafer 100 when the rotation speed of the stage 3 is below a certain level and reliably chucks the wafer 100 when the rotation speed is above a certain level is only defined by the relationship between the rotation center axis C and the center of gravity G. It can be realized with a simple structure that does not require a spring or counterweight.
If the structure is simple, the chuck portion 5 can be formed of a resin injection molded product or the like without using a spring or complicated parts, so that the corrosion resistance can be improved.

According to this embodiment, the center of gravity G of the chuck portion 5 is located outside and below the rotation center axis C by providing the bent portion 45 that bends outside the chuck body 31 at the lower end 36 of the chuck body 31. The structure is located in
In this embodiment, the chuck portion 5 has a simple structure. If the structure is simple, the chuck portion 5 can be formed of a resin injection molded product or the like without using complicated parts such as a spring, and the corrosion resistance can be improved.

According to the present embodiment, the chuck portion 5 penetrates the long hole 47 provided below the rotation center hole 43 of the chuck body 31 so as to penetrate in the radial direction of the stage 3 and the long hole 47. A round rod-shaped guide rod 9 is provided. The long hole 47 is provided so as to be slidably in contact with the guide rod 9 in the circumferential direction of the stage 3 and has a vertical diameter (height h) larger than the diameter DL of the guide rod.
In this embodiment, the rotational moment generated in the through shaft 59 due to the rotation of the stage 3 is alleviated by the guide rod 9 coming into contact with the side surface of the long hole 47, so that the chuck mechanism 1 operates when the stage 3 rotates. It is possible to prevent deformation due to rotational moment.

According to the present embodiment, the chuck main body 31, the wafer holding part 33, and the bent part 45 have an integral structure.
In this embodiment, the chuck portion 5 can be manufactured by integral molding by resin molding or the like, and the corrosion resistance can be improved.

According to the present embodiment, the end surface holding portion 41 is a protruding portion that is provided so as to rise from the chuck main body 31 and has the contact surface 37 that contacts the end surface 103 of the wafer 100, and extends along the radial direction of the stage 3. A provided drainage groove 39 is provided.
In this embodiment, since the contact surface 37 contacts the end surface 103 of the wafer 100 during chucking, the chuck can be surely performed.
Further, when cleaning is performed while rotating the stage 3, the cleaning liquid is discharged from the drain groove 39 by centrifugal force, so that the cleaning liquid remains between the end surface holding portion 41 and the end surface of the wafer 100 to contaminate the wafer 100. Can be prevented.

According to the present embodiment, the lower surface holding portion 35 is a tapered portion that is inclined upward from the radially inner side to the outer side of the stage 3, and supports the lower surface 105 of the wafer 100.
In this embodiment, the angle at which the lower surface 105 of the wafer 100 and the upper surface of the lower surface holding portion 35 come into contact with each other can be reduced while the rotation speed of the stage 3 is below a certain level and the chuck portion 5 is rotated away from the wafer 100. It is possible to prevent the wafer 100 from being damaged at the time of contact.

According to the present embodiment, the chuck portion 5 is made of vinyl chloride or polyether ether ketone.
In this embodiment, the chuck portion 5 can be made of a lightweight, inexpensive, and highly corrosion-resistant material, and the corrosion resistance of the chuck mechanism 1 can be improved.

  The present invention has been described above with reference to the embodiments, but the present invention is not limited to the above-described embodiments. It is natural for a person skilled in the art to come up with various modifications and improvements within the scope of the technical idea of the present invention, and these are also included in the scope of the present invention.

  DESCRIPTION OF SYMBOLS 1 ... Chuck mechanism, 3 ... Stage, 5 ... Chuck part, 7 ... Holding part, 9 ... Guide rod, 11 ... Key plate, 13 ... Chuck part insertion hole, 15 ... Boss insertion hole, 17 ... Guide rod insertion hole, 19 DESCRIPTION OF SYMBOLS ... Holding part fixing hole, 20 ... Rotation center hole, 21 ... Key plate fixing hole, 31 ... Chuck body, 33 ... Wafer holding part, 34 ... Upper end, 35 ... Lower surface holding part, 36 ... Lower end, 37 ... Contact surface, DESCRIPTION OF SYMBOLS 39 ... Drain groove, 41 ... End surface clamping part, 43 ... Turning center hole, 45 ... Bending part, 47 ... Long hole, 51 ... Base part, 53 ... Insertion hole, 55 ... Through-shaft holding part, 57 ... Through-shaft holding part , 59 ... penetrating shaft, 61 ... head, 63 ... C ring, 65 ... holding part side through hole, 71 ... main shaft, 73 ... fixing pin, 75 ... ring, 77 ... front end, 81 ... plate body, 83 ... guide Rod through hole, 85 ... Boss, 87 ... For plate fixing Hole, 100 ... wafer, 103 ... end face, 105 ... lower surface.

Claims (6)

A chuck mechanism for holding a wafer in a single wafer type,
A disk-shaped stage that can rotate in the surface direction;
Three or more chuck portions that are evenly arranged on a circumference around the rotation axis of the stage, are rotatable in the radial direction of the stage, and are provided so as to surround an end surface of the wafer;
A holding unit provided on the stage and rotatably holding the chuck unit;
With
The chuck portion is
A chuck body that has a rod-like shape and is held by the holding portion so that one end face faces upward as an upper end;
A rotation center hole formed in the chuck body so as to be orthogonal to the radial direction of the stage and the axial direction of the chuck body;
A long hole provided below the rotation center hole of the chuck body in a radial direction of the stage;
With
The chuck portion has a center of gravity located outside the rotation center axis in the radial direction of the stage and below the rotation center axis .
The holding portion includes a through shaft provided through the rotation center hole,
The chuck mechanism includes a round rod-shaped guide rod provided so as to penetrate the elongated hole,
The chuck mechanism, wherein the long hole is provided so as to be slidably contacted with the guide rod in a circumferential direction of the stage, and has a diameter in a vertical direction larger than a diameter of the guide rod . The chuck mechanism according to claim 1,
The chuck portion,
Provided at the upper end of the front Symbol chuck body comprises a lower surface holding portion having a support surface for supporting contact with the lower surface of the wafer, and a end surface sandwiching portion having a holding surface for holding in contact with the end surface of the wafer A wafer holder ;
Provided at the lower end of the front Symbol chuck body in the radial direction of the stage, and a bent portion provided by bending outwardly of said chuck body,
With
The holding portion is provided before SL on the stage, the chuck mechanism characterized in that it comprises a base portion for securing the through-shaft. The chuck mechanism according to claim 2 ,
The chuck mechanism according to claim 1, wherein the chuck main body, the wafer holding part, and the bent part have an integral structure. The chuck mechanism according to claim 2 or 3 , wherein
The end surface sandwiching portion is provided so as to rise from the chuck body, and has a projecting portion having a contact surface that contacts the end surface of the wafer;
A drainage groove provided in the protrusion along the radial direction of the stage;
A chuck mechanism comprising: The chuck mechanism according to any one of claims 2 to 4 ,
The lower surface holding part is
A chuck mechanism comprising: a taper portion that is inclined upward from the inner side to the outer side in the radial direction of the stage, wherein the support surface is an upper surface of the taper portion. The chuck mechanism according to any one of claims 1 to 5 ,
The chuck mechanism, wherein the chuck portion is made of vinyl chloride or polyether ether ketone.

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