JP6571783B2 - Component mounter - Google Patents

Description

  The present specification relates to a component mounter for mounting an electronic component on a circuit substrate.

  Patent Document 1 discloses an electronic component supply device that conveys an electronic component stored in a carrier tape to a component suction position. An electronic component transporter that transports electronic components includes a carrier tape and a top cover tape that covers the surface of the carrier tape. The electronic component supply apparatus includes a reel holding unit that holds a reel around which the electronic component carrier is wound, a tape peeling unit that peels the top cover tape from the electronic component carrier drawn from the reel, and a reel holding unit or a reel. And a humidity adjusting device provided in a conveyance path from the holding unit to the tape peeling unit. In this apparatus, the surface resistance value is adjusted by increasing the moisture content of the carrier tape by humidifying the electronic component carrier.

JP 2009-231521 A

  In the electronic component supply device of Patent Document 1, the amount of static electricity generated when the top cover tape is peeled off can be suppressed by increasing the moisture content of the carrier tape by the humidifier, and the electronic component adsorption error can be reduced. It is supposed to be possible. However, in the electronic component supply apparatus of Patent Document 1, the humidity inside the electronic component mounting apparatus is not increased by the humidifying apparatus, but the humidity inside the apparatus due to heat during operation of the electronic component mounting apparatus can be handled. I can't. For this reason, static electricity generated from the electronic component carrier cannot be sufficiently suppressed, and as a result, there is a possibility that the accurate operation of the component mounting machine is impaired. The present specification discloses a component mounter that can sufficiently suppress the amount of static electricity generated when the cover tape is peeled off by keeping the humidity inside the component mounter constant.

  The component mounter disclosed in this specification mounts an electronic component on a circuit substrate. The component mounting machine supports the component feeder, the suction nozzle that sucks the upper surface of the electronic component, and the suction nozzle. By moving the suction nozzle relative to the component feeder and the circuit substrate, the component feeder uses the component feeder. A transfer head for adsorbing an electronic component conveyed to the adsorption position to an adsorption nozzle and mounting the electronic component adsorbed by the adsorption nozzle on a circuit substrate, a humidifying device for humidifying the inside of the component mounting machine, and a component mounting machine A sensor for measuring the humidity inside the apparatus and a control device for controlling the humidifier according to the output of the sensor. The component feeder includes a carrier tape, a cover tape that covers the surface of the carrier tape, and an electronic component that is accommodated between the carrier tape and the cover tape, and conveys the electronic component to a component suction position by conveying the carrier tape. To do. In the conveyance path for conveying the carrier tape of the component feeder, a tape peeling portion for peeling the cover tape from the carrier tape is provided. The tape peeling part is arrange | positioned inside the component mounting machine. A humidifier is arrange | positioned in the position facing a tape peeling part, and ejects humidified air toward a tape peeling part.

  In the above-described component mounter, the humidifier is controlled in accordance with the output of the sensor. Therefore, the inside of the component mounter is humidified by humidified air ejected from the humidifier, and the humidity is kept constant. For this reason, even if the operating condition of a component mounting machine fluctuates, the amount of static electricity generated from the carrier tape or the cover tape can be appropriately suppressed. Further, a humidifier is disposed inside the component mounter, and humidified air from the humidifier is ejected toward the tape peeling portion. For this reason, the amount of static electricity when peeling the cover tape, which is particularly likely to generate static electricity, is suppressed, and the sprayed humidified air diffuses into the component mounter to control the humidity inside the component mounter appropriately. be able to.

FIG. 3 is a side view schematically showing the configuration of the component mounting machine according to the first embodiment. The figure which shows the structure of a carrier tape and a cover tape. The side view which shows typically the structure of the component mounting machine of Example 2. FIG. The side view which shows typically the structure of the component mounting machine of Example 3. FIG.

  The main features of the embodiments described below are listed. The technical elements described below are independent technical elements and exhibit technical usefulness alone or in various combinations, and are not limited to the combinations described in the claims at the time of filing. Absent.

(Feature 1) In the component mounter disclosed in the present specification, the sensor may be disposed in the vicinity of the tape peeling unit inside the component mounter. If comprised in this way, the humidity near a tape peeling part can be managed accurately. Further, the humidifier may be attached to the inside of the component mounter, on the side opposite to the conveying direction of the component feeder with respect to the tape peeling portion, and above. If comprised in this way, it can suppress that a humidifier becomes the obstruction of operation | movement of an adsorption nozzle.

(Feature 2) The component mounter disclosed in the present specification may further include a discard unit that discards an electronic component in which an abnormality has occurred when an abnormality occurs in the electronic component supplied from the component feeder. . In addition, when the suction nozzle picks up an abnormal electronic component, the control device moves the transfer head so that the suction nozzle moves above the disposal unit, and the humidifier Humidified air may be ejected toward an adsorption nozzle that adsorbs a component. If comprised in this way, when discarding the electronic component which produced abnormality, it can suppress that the said electronic component sticks to an adsorption nozzle by static electricity.

(Characteristic 3) In the component mounting machine disclosed in the present specification, a reel around which a carrier tape covered with a cover tape is wound, and a discharging unit that stores the discharging agent and injects the discharging agent that is stored You may have. Further, the injection unit may inject the charge eliminating agent toward the reel. If comprised in this way, generation | occurrence | production of static electricity can be suppressed more.

  Hereinafter, the component mounter 10 according to the first embodiment will be described. The component mounter 10 is a device that mounts the electronic component 4 on the circuit substrate 2. The component mounter 10 is also referred to as a surface mounter or a chip mounter. Usually, the component mounting machine 10 is provided together with a solder printer, other component mounting machines, and a board inspection machine, and constitutes a series of mounting lines. The circuit board 2 is, for example, a printed wiring board on which no electronic circuit component is mounted, an electronic circuit component is mounted on one surface and electrically connected, and an electronic circuit component is not mounted on the other surface. The printed circuit board, the base material on which the bare chip is mounted and constituting the substrate with the chip, the base material on which the electronic circuit component including the ball grid array is mounted, the base material having a three-dimensional shape, and the like are included.

  As shown in FIG. 1, the component mounter 10 includes a component feeder 12, a feeder holding unit 14, a transfer head 16, a moving device 18 that moves the transfer head 16, a transport lane 26, and an operation panel 28. A humidifier 30, a sensor 32 for measuring humidity, and a controller 50.

  As shown in FIG. 2, the component feeder 12 includes a carrier tape 7 and a cover tape 8. A plurality of electronic components 4 are accommodated between the carrier tape 7 and the cover tape 8. Specifically, the carrier tape 7 is made of paper, and a plurality of recesses 7a are formed at a certain interval in the longitudinal direction. An electronic component 4 is accommodated in each of the recesses 7a. A cover tape 8 is attached to the upper surface of the carrier tape 7 (the surface on which the recess 7a is formed) to prevent the electronic component 4 from falling. The component feeder 12 includes a reel (not shown) around which the carrier tape 7 is wound and a drive mechanism (not shown) that intermittently drives the reel. The carrier tape 7 wound on the reel is intermittently pulled out from the reel, whereby the electronic component 4 is supplied to a component suction position of a suction nozzle 6 described later.

  In the conveyance path for conveying the carrier tape 7 of the component feeder 12, a tape peeling unit 9 for peeling the cover tape 8 from the carrier tape 7 is provided. A known configuration can be used for the tape peeling portion 9. When the carrier tape 7 is conveyed to the tape peeling part 9 by the component feeder 12, the cover tape 8 is peeled in order from the carrier tape 7 by the tape peeling part 9. The peeled cover tape 8 is once drawn upward and then wound on a take-up reel 15 provided in the component feeder 12.

  The moving device 18 moves the transfer head 16 between the component feeder 12 and the circuit substrate 2. The moving device 18 of the present embodiment is an XY robot that moves the moving base 18a in the X direction and the Y direction. The moving device 18 includes a guide rail that guides the moving base 18a, a moving mechanism that moves the moving base 18a along the guide rail, a motor that drives the moving mechanism, and the like. The moving device 18 is disposed above the component feeder 12 and the circuit substrate 2. A transfer head 16 is attached to the moving base 18a. The transfer head 16 is moved above the component feeder 12 and above the circuit substrate 2 by the moving device 18.

  The transfer head 16 includes a suction nozzle 6 that sucks the electronic component 4. The suction nozzle 6 can be attached to and detached from the transfer head 16. The suction nozzle 6 is attached to the transfer head 16 so as to be movable in the vertical direction (the Z direction in the drawing). The suction nozzle 6 is configured to move up and down by an actuator (not shown) accommodated in the transfer head 16 and to suck the electronic component 4. In order to mount the electronic component 4 on the circuit substrate 2 by the transfer head 16, first, the suction nozzle 6 is positioned above the component suction position. At the component suction position, the cover tape 8 has already been peeled from the upper surface of the carrier tape 7 by the tape peeling portion 9, so that the electronic component 4 accommodated in the recess 7 a of the carrier tape 7 can be sucked by the suction nozzle 6. ing. Next, the suction nozzle 6 is moved downward until the lower surface (suction surface) of the suction nozzle 6 contacts the electronic component 4 conveyed to the component suction position. Next, the electronic component 4 is attracted to the suction nozzle 6 and the suction nozzle 6 is moved upward. Next, the transfer device 16 is positioned by the moving device 18 at a position where the electronic component 4 is mounted on the circuit substrate 2. Next, the electronic component 4 is mounted on the circuit substrate 2 by lowering the suction nozzle 6 toward the circuit substrate 2.

  The transport lane 26 carries in the circuit base material 2 to the component mounting machine 10, positions it on the component mounting machine 10, and carries it out of the component mounting machine 10. The conveyance lane 26 of the present embodiment is constituted by, for example, a pair of belt conveyors, a support device (not shown) that is attached to the belt conveyor and supports the circuit substrate 2 from below, and a driving device that drives the belt conveyor. be able to. The operation panel 28 is an input device that receives user instructions and a display device that displays various types of information to the user. The operation panel 28 is attached above the front surface of the housing 5. The housing 5 covers the conveyance lane 26 and the parts feeder 12. A space 13 is formed in the housing 5, and the transfer head 16 moves in the space 13.

  The humidifier 30 humidifies the inside of the component mounter 10 (the space 13 in the housing 5) by ejecting humidified air. The humidifier 30 is disposed at a position facing the tape peeling unit 9. That is, as shown in FIG. 1, the humidifier 30 is a space 13 in the housing 5, and in the Y direction of the drawing, transports the carrier tape 7 on the side opposite to the tape feeder 9 with respect to the component feeder 12. It is arranged on the opposite side of the direction. Specifically, the humidifier 30 is attached to the front side of the housing 5 (the front side of the component mounter 10) above the component feeder 12. The humidifier 30 ejects humidified air toward the tape peeling part 9 through the space 13 in the housing 5. For this reason, the component mounter 10 can humidify the entire space 13 in the housing 5 with the tape peeling portion 9 as the center. Note that the term “spouting humidified air” here is not limited to spraying high-humidity air, but also includes spraying moisture. Note that a plurality of component feeders 12 may be attached to the feeder holding portion 14 side by side in the X direction of FIG. In this case, for example, humid air may be ejected toward the tape peeling portion 9 of the component feeder 12 located at the center in the X direction among the plurality of component feeders 12. Also with such a configuration, the humidity inside the component mounter 10 can be suitably managed. Alternatively, a humidified air outlet may be provided corresponding to each of the plurality of component feeders 12, and the humidified air may be ejected from each outlet toward the tape peeling portion 9 of the corresponding component feeder 12.

  The sensor 32 measures the humidity inside the component mounter 10 (the space 13 in the housing 5). The sensor 32 is disposed inside the component mounter 10 and in the vicinity of the tape peeling unit 9. Therefore, it is possible to accurately manage the humidity at the tape peeling portion 9 where static electricity is particularly likely to occur. For the sensor 32, for example, a hygrometer is used. As described above, a plurality of component feeders 12 may be attached to the feeder holding unit 14. In this case, a plurality of sensors 32 may be arranged for each tape peeling portion 9 of the plurality of component feeders 12. By providing the sensor 32 in each component feeder 12, the humidity in the tape peeling part 9 of each component feeder 12 can be monitored, and the humidifier 30 can be controlled appropriately.

  The control device 50 is configured using a computer including a CPU, a ROM, and a RAM. The parts feeder 12, the transfer head 16, the moving device 18, the operation panel 28, the humidifying device 30, and the sensor 32 are connected to the control device 50 so as to communicate with each other. The control device 50 controls these components, thereby controlling the mounting of the electronic component 4 on the circuit base 2 and the humidity inside the component mounting machine 10.

  The control device 50 controls the humidifying device 30 according to the output of the sensor 32. Specifically, when the output from the sensor 32 (humidity of the space 13 in the housing 5) exceeds a predetermined first threshold value, the control device 50 stops the operation of the humidifier 30 (injection of humidified air). Further, when the output from the sensor 32 falls below a predetermined second threshold value, the operation of the humidifier 30 (injection of humidified air) is started. That is, the control device 50 can keep the humidity inside the component mounter 10 at a constant value (predetermined value) by controlling the humidifier 30 on and off according to the output value of the sensor 32. Alternatively, the control device 50 may control the amount of humidified air ejected from the humidifying device 30 in multiple stages according to the output of the sensor 32. By performing such control, the humidity inside the component mounter 10 can be finely controlled. In addition, since control of the component feeder 12, the transfer head 16, and the moving device 18 by the control device 50 can be performed by a conventionally known method, detailed description thereof is omitted here.

  The effect of the component mounting machine 10 of Example 1 is demonstrated. The component mounter 10 is uniformly humidified by the humidifier 30 that ejects humidified air, and the humidity can be kept constant. For this reason, the generation amount of static electricity inside the component mounter 10 due to drying can be suppressed. Therefore, it is possible to reduce the suction mistake and mounting mistake of the electronic component 4 and to suitably mount the electronic component 4 on the circuit base 2.

  Further, since the humidifying device 30 of the component mounting machine 10 ejects humidified air from the carrier tape 7 toward the tape peeling portion 9 that peels the cover tape 8, it is particularly likely to generate static electricity when peeling the cover tape 8. The amount of static electricity can be suppressed. Further, since humidified air is ejected from the humidifying device 30 disposed above the component feeder 12 toward the tape peeling portion 9, the humidified air is used as the cover tape 8 peeled from the upper surface of the carrier tape 7 or the electronic component 4. It also contacts the suction nozzle 6 that sucks the water. As a result, the winding operation of the cover tape 8 to the winding reel 15, the suction operation of the electronic component 4 to the suction nozzle 6, and the mounting operation of the electronic component 4 to the circuit substrate 2 can be performed without error.

  Next, the component mounter 10a according to the second embodiment will be described with reference to FIG. Hereinafter, only differences from the first embodiment will be described, and detailed description of the same configurations as those of the first embodiment will be omitted.

  As shown in FIG. 3, the component mounter 10a includes a discard unit 40 that discards electronic components. When an abnormality (for example, failure or defect) occurs in the electronic component 4 supplied from the component feeder 12, the discarding unit 40 discards the electronic component 4 in which the abnormality has occurred. The discard unit 40 is provided between the component feeder 12 and the transport lane 26 in the Y direction of the drawing. As is apparent from the figure, the tape peeling portion 9 of the component feeder 12 is located in the vicinity of a straight line connecting the humidifying device 30 and the discarding portion 40. For this reason, a part of the humidified air ejected from the humidifier 30 to the tape peeling part 9 also flows toward the disposal part 40. When the suction nozzle 6 sucks the abnormal electronic component 4, the control device 50 positions the transfer head 16 above the discarding unit 40 (position where the abnormal electronic component 4 is discarded) by the moving device 18. . Next, the suction nozzle 6 is lowered toward the disposal unit 40, and the suction of the electronic component 4 is stopped. As a result, the electronic component 4 falls from the suction nozzle 6 and is discarded in the disposal unit 40.

  Whether or not an abnormality has occurred in the electronic component 4 can be determined by a captured image of an imaging camera (not shown) connected to the control device 50 so as to be communicable. For example, a captured image of a camera that captures the electronic component 4 from above the component feeder 12 or an electronic component 4 attached to the moving device 18 and moved together with the suction nozzle 6 so as to be sucked by the suction nozzle 6 A captured image of a camera that captures images from one side can be used. When it is determined that an abnormality has occurred in the electronic component 4 based on the captured image of the imaging camera, the control device 50 discards the electronic component 4 attracted by the suction nozzle 6 to the disposal unit 40.

  In addition, the position where the disposal unit 40 is provided is not limited to the above position, and the disposal unit 40 may be disposed at a position where the electronic component 4 can be discarded by the suction nozzle 6 (within the movable region of the suction nozzle 6 on the XY plane). Good.

  When the suction nozzle 6 sucks the abnormal electronic component 4, the control device 50 causes the humidifying device 30 to eject humid air toward the suction nozzle 6 that sucks the abnormal electronic component 4. Specifically, the transfer head 16 (adsorption nozzle 6) is moved so that the humidified air ejected from the humidifier 30 contacts the adsorption nozzle 6. Next, the humidified air is ejected toward the suction nozzle 6 by ejecting the humidified air from the humidifier 30. Thereby, the humidity of the atmosphere around the suction nozzle 6 (the electronic component 4 in which an abnormality has occurred) can be increased. Therefore, static electricity generated in the electronic component 4 that causes an abnormality that is attracted to the suction nozzle 6 can be suppressed. That is, when the electronic component 4 in which an abnormality has occurred is discarded, the electronic component 4 can be prevented from sticking to the suction nozzle 6 due to static electricity. For this reason, the electronic component 4 is appropriately released from the suction nozzle 6, and the disposal mistake of the electronic component 4 can be reduced. When the humidifier 30 includes a mechanism for adjusting the direction in which the humidified air is ejected, the humidified air may be ejected toward the adsorption nozzle 6 by adjusting the direction in which the humidified air is ejected.

  In the component mounting machine 10a of the second embodiment, when the suction nozzle 6 sucks the electronic component 4 in which an abnormality has occurred, the control device 50 ejects humidified air from the humidifier 30 toward the suction nozzle 6. Thereby, the electronic component 4 can be discarded without mistake. Further, while the electronic device 4 is normally mounted on the circuit substrate 2, the control device 50 ejects humidified air from the humidifier 30 toward the tape peeling unit 9 according to the output of the sensor 32. Therefore, the component mounting machine 10a according to the second embodiment can achieve the same effects as the component mounting machine 10 according to the first embodiment.

  In the present embodiment, the control device 50 ejects humidified air from the humidifying device 30 toward the suction nozzle 6 when the suction nozzle 6 sucks the abnormal electronic component 4. The humidifying air may be ejected from the humidifier 30 toward the suction nozzle 6 when the rate at which the suction nozzle 6 sucks the electronic component 4 in which an abnormality has occurred increases. For example, when the suction nozzle 6 sucks an electronic component 4 in which an abnormality has occurred, the control device 50 displays all the electrons sucked by the suction nozzle 6 in a predetermined period immediately before the suction of the electronic component 4 in which the abnormality has occurred. When the ratio of the electronic component 4 that has caused an abnormality with respect to the component 4 is calculated and the ratio exceeds a predetermined value, the humidified air may be ejected from the humidifier 30 toward the suction nozzle 6, or the control device 50 calculates the ratio of the electronic components 4 in which an abnormality has occurred with respect to all the electronic components 4 sucked by the suction nozzle 6 at regular intervals, and if the ratio exceeds a predetermined value, the suction from the humidifier 30 Humidified air may be ejected toward the nozzle 6.

  Next, the component mounter 10b according to the third embodiment will be described. As shown in FIG. 4, the component feeder 12 includes a reel 11 around which a carrier tape 7 covered with a cover tape 8 is wound. Further, the component mounting machine 10 b includes an injection unit 42 that injects a neutralizing agent at a position adjacent to the reel 11.

  The reel 11 is provided at the end of the component feeder 12 opposite to the component transport direction (the end on the front side of the housing 5 in the Y direction in FIG. 4). Specifically, as shown in FIG. 4, the reel 11 is provided outside the housing 5 of the component mounter 10 b and on the side opposite to the mounting direction of the component feeder 12 to the feeder holding portion 14. . The carrier tape 7 wound around the reel 11 is pulled out intermittently at a predetermined time interval and conveyed to the conveyance path. Since a mechanism known in the art can be used for the mechanism in which the carrier tape 7 is pulled out from the reel 11 and conveyed, detailed description thereof is omitted here.

  The injection unit 42 contains a neutralizing agent therein. The injection unit 42 is disposed in the vicinity of the reel 11, and injects a neutralizing agent toward the reel 11. For this reason, it is possible to prevent the carrier tape 7 wound around the reel 11 and the cover tape 8 covering the carrier tape 7 from being charged. Therefore, the generation of static electricity when the cover tape 8 is peeled off at the tape peeling portion 9 can be further suppressed.

  Also in the component mounter 10b of the third embodiment, the configurations of the humidifier 30 and the sensor 32 are the same as those of the first embodiment, and therefore, the same operational effects as the component mounter 10 of the first embodiment can be achieved.

  As mentioned above, although the Example of the technique which this specification discloses was described in detail, these are only illustrations and do not limit a claim. The technology described in the claims includes various modifications and changes of the specific examples illustrated above.

  For example, in each of the above-described embodiments, the humidifier 30 is attached to the front side of the housing 5 (the front side of the component mounter 10) above the component feeder 12, but is not limited thereto. The position where the humidifier 30 is provided may be a position where the humidified air can be ejected toward the tape peeling portion 9 and does not hinder the movement of the suction nozzle 6.

  The technical elements described in this specification or the drawings exhibit technical usefulness alone or in various combinations, and are not limited to the combinations described in the claims at the time of filing. In addition, the technology illustrated in the present specification or the drawings achieves a plurality of objects at the same time, and has technical utility by achieving one of the objects.

2: Circuit substrate 4: Electronic component 5: Housing 6: Adsorption nozzle 7: Carrier tape 8: Cover tape 9: Tape peeling unit 10: Component mounting machine 11: Reel 12: Component feeder 14: Feeder holding unit 15: Winding Reel 16: transfer head 18: moving device 18a: moving base 26: transfer lane 28: operation panel 30: humidifier 32: sensor 40: disposal unit 42: jetting unit 50: control device

Claims (4)

A component mounter for mounting electronic components on a circuit board,
A carrier tape; a cover tape that covers a surface of the carrier tape; and the electronic component that is accommodated between the carrier tape and the cover tape. A parts feeder to be transported to the suction position;
A suction nozzle for sucking an upper surface of the electronic component;
The suction nozzle is supported, and by moving the suction nozzle relative to the component feeder and the circuit substrate, the electronic component conveyed to the component suction position by the component feeder is used as the suction nozzle. A transfer head for adsorbing and mounting the electronic component adsorbed by the adsorption nozzle on the circuit substrate;
A humidifier for humidifying the interior of the component mounter;
A sensor for measuring the humidity inside the component mounter;
A control device that controls the humidifier according to the output of the sensor,
The transport path for transporting the carrier tape of the component feeder is provided with a tape peeling portion for peeling the cover tape from the carrier tape,
The tape peeling portion is disposed inside the component mounting machine,
The said humidifier is a component mounting machine which is arrange | positioned in the position facing the said tape peeling part, and ejects humidified air toward the said tape peeling part. The sensor is disposed inside the component mounter and in the vicinity of the tape peeling portion,
2. The component mounter according to claim 1, wherein the humidifier is attached to the inside of the component mounter, on the side opposite to the transport direction of the component feeder with respect to the tape peeling portion, and above. . When an abnormality occurs in the electronic component supplied from the component feeder, the electronic device further includes a discarding unit that discards the electronic component in which the abnormality has occurred,
The control device moves the transfer head so that the suction nozzle moves above the disposal unit when the suction nozzle sucks the electronic component in which the abnormality has occurred, and the humidifier, The component mounting machine according to claim 1, wherein humidified air is jetted toward the suction nozzle that sucks the electronic component having the abnormality. A reel wound with the carrier tape covered with the cover tape;
And a discharging unit for discharging the discharging agent, and further containing a discharging agent,
The said mounting part is a component mounting machine as described in any one of Claims 1-3 which sprays the said static elimination agent toward the said reel.

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