JP6572515B2 - Ultrasonic bonding apparatus and control apparatus therefor - Google Patents

Description

  The present invention relates to an ultrasonic bonding apparatus for ultrasonic bonding of materials to be bonded and a control apparatus for the apparatus.

  From the start of the ultrasonic vibration of the horn to the detection of at least one of the output of the ultrasonic metal bonding machine or the sinking amount of the upper metal plate of the two metal plates to be joined, A technique for judging whether or not a metal plate is joined by comparing at least one of an output waveform of a sonic metal joining machine or a waveform of a sinking amount of a metal plate with that during normal joining is known (for example, Patent Document 1). reference).

JP 2010-184252 A

  However, the sinking amount or the like of the metal plate is reduced by dirt such as oil or fat attached to the surface of the metal plate to be joined. In the above technique, even if the amount of oil and fat adhering to the metal plate is a small amount that does not hinder the normal bonding of the metal plate, it is the same as that during normal bonding until a predetermined time elapses. If this waveform is not obtained, defective product determination is made even if the bonding strength is sufficient, and the yield of the metal plate assembly decreases.

  The problem to be solved by the present invention is to provide an ultrasonic bonding apparatus capable of improving the yield of the ultrasonic bonded body and a control apparatus therefor.

According to the present invention , the vibration energy detected by the vibration energy detection means is such that the amount of subtraction of the joint is less than the first subtraction threshold, is equal to or greater than the second subtraction threshold smaller than the first subtraction threshold. Is equal to or greater than a predetermined vibration energy threshold , the above problem is solved by outputting an ultrasonic welding stop signal to the ultrasonic bonding apparatus.

  According to the present invention, since the subsidence detected by the subsidence detection means exceeds the first subsidence threshold value, it is judged whether the ultrasonic bonding strength is good. In this case, it is possible to prevent the non-defective product from being determined as a defective product, and to improve the yield of the ultrasonic bonded body.

It is a block diagram which shows one Embodiment of the ultrasonic bonding apparatus to which the control apparatus of the ultrasonic bonding apparatus which concerns on this invention is applied. It is a figure which shows operation | movement of the ultrasonic bonding apparatus of FIG. 1A (pressurization start). It is a figure which shows operation | movement of the ultrasonic bonding apparatus of FIG. 1A (ultrasonic oscillation start). It is a figure which shows operation | movement of the ultrasonic bonding apparatus of FIG. 1A (ultrasonic bonding completion). It is a flowchart which shows the control procedure which the control apparatus of FIG. 1A performs. It is a graph for demonstrating the 1st example of control which the control apparatus of FIG. 1A performs. It is a graph for demonstrating the 2nd control example which the control apparatus of FIG. 1A performs. It is a graph for demonstrating the 3rd control example which the control apparatus of FIG. 1A performs. It is an example of the graph which shows the result of having measured the joining strength of the to-be-joined material at the time of changing the amount of sinking variously using the ultrasonic joining apparatus of FIG. 1A. It is another example of the graph which shows the result of having measured the joining strength of the to-be-joined material at the time of changing the amount of sinking variously using the ultrasonic joining apparatus of FIG. 1A.

  Hereinafter, an embodiment of the present invention will be described with reference to the drawings. FIG. 1A is a block diagram showing an embodiment of an ultrasonic bonding apparatus to which the control apparatus for an ultrasonic bonding apparatus according to the present invention is applied, and two bonded materials W1 and W2 made of a metal material such as aluminum and copper. The embodiment of the present invention will be described by taking as an example the case of ultrasonic bonding.

The ultrasonic bonding apparatus 1 of the present embodiment is used, for example, when bonding output terminals of thin secondary batteries, or between an output terminal and a current collector, but the use of the materials to be bonded W1, W2 is not particularly limited. . Also the present invention will be described an example in which joining two members to be joined W1, W2 in the following embodiments may be used in the case of joining three or more members to be joined as required .

  The ultrasonic bonding apparatus 1 of the present embodiment applies the ultrasonic vibration in a state where the second bonded material W2 is superimposed on the first bonded material W1, thereby the first and second bonded materials. As shown in FIG. 1A, a power source 12, a horn 13, an anvil 14, an oscillator 15, and a booster are devices for forming an ultrasonic bonded body in which materials W1 and W2 are bonded to each other at a bonded portion. 16 and a presser 17.

  The horn 13 includes an arm portion 131 extending in the vibration direction of the oscillator 15, that is, the left direction in FIG. 1A, and a contact portion 132. The arm portion 131 has a columnar shape having a substantially constant diameter along the extending direction, and the base end (the right end in FIG. 1A) of the arm portion 131 is connected to the booster 16. The abutting portion 132 is provided at the tip of the arm portion 131 (the left end in FIG. 1A), and the lower surface of the abutting portion 132 abuts on the upper surface of the second material W2 to be joined via the arm portion 131. The ultrasonic vibration transmitted from the oscillator 15 is propagated to the workpiece W2. The lower surface of the abutting portion 132 that abuts on the second material to be joined W2 may be subjected to nitriding treatment or diamond coating as necessary.

  The arm part 131 and the contact part 132 of this embodiment are formed integrally and are made of a material having a hardness that enables transmission of ultrasonic vibration generated by the oscillator 15. Examples of such a material include cemented carbide such as tungsten. The horn 13 may be formed by forming the arm part 131 and the contact part 132 as separate members and then attaching them to each other.

  The anvil 14 is a metal fitting on which the first material to be joined W1 is placed, and the second material to be joined W2 is further placed on the upper side of the first material to be joined W1. The anvil 14 receives the ultrasonic vibration and the pressing force transmitted from the horn 13 in a state where the first and second materials to be joined W1 and W2 are sandwiched between the contact portions 132 of the horn 13.

  The oscillator 15 is a device that generates ultrasonic vibrations that are the reciprocating motion in the horizontal direction of FIG. 1A using the power of the power supply 12, and includes, for example, a vibrator formed of a piezoelectric element. The oscillator 15 receives a command from the control unit 22 of the bonding control device 2 and applies a voltage having a predetermined frequency to the vibrator to vibrate the vibrator, thereby ultrasonic vibration having an amplitude of 2 to 3 μm. Is generated.

  The booster 16 is an amplifying device that amplifies the ultrasonic vibration generated by the oscillator 15. The right end of FIG. 1A is connected to the oscillator 15, and the left end of FIG. 1A is connected to the arm portion 131 of the horn 13. . The booster 16 amplifies the ultrasonic vibration with an amplitude of 2 to 3 μm transmitted from the oscillator 15 into an ultrasonic vibration with an amplitude of 20 to 30 μm. The ultrasonic vibration amplified by the booster 16 is propagated to the first and second workpieces W1 and W2 via the horn 13.

  The presser 17 is a device that generates a pressing force when pressing the horn 13 against the first and second workpieces W1 and W2, and is a load cell that measures the pressing force as shown in FIGS. 1B to 1D. 171 and includes, for example, an air cylinder or a hydraulic cylinder. The oscillator 15, the booster 16, and the horn 13 of the present embodiment are provided so as to be vertically movable with respect to the base 1 a of the ultrasonic bonding apparatus 1. The main body of the presser 17 is provided on the base 1 a, and the drive unit of the presser 17 is provided on the booster 16. When the ultrasonic bonding is started, the pressing force generated by the advancement of the driving unit of the pressing unit 17 is applied to the first and second workpieces W1 and W2 via the booster 16 and the horn 13. Communicated. When the ultrasonic bonding is finished, the drive unit of the presser 17 is moved backward, so that the horn 13 is separated from the first and second workpieces W1 and W2.

  Moreover, in the ultrasonic bonding apparatus 1 of the present embodiment, as shown in FIG. 1A, the encoder 18 is provided between the base 1 a and any one of the oscillator 15, the booster 16, and the horn 13. The encoder 18 has an amount (depth) of the contact portion 132 of the horn 13 submerged from a predetermined reference position with respect to the first and second workpieces W1 and W2 by the pressing force generated by the presser 17. This is a device that detects The detection result by the encoder 18 is read into the control unit 22 of the joining control device 2.

  The bonding control device 2 of the present embodiment is a device for controlling the ultrasonic bonding device 1 and includes an input unit 21 and a control unit 22.

  The input unit 21 is a device that inputs information necessary for controlling the ultrasonic bonding apparatus 1 to the control unit 22, and includes, for example, a pointing device such as a keyboard, a touch panel, and a mouse.

  The control unit 22 has a function of controlling the ultrasonic bonding apparatus 1 based on information input to the input unit 21, and is configured from a computer including a RAM, a ROM, a CPU, and the like, for example. In addition, the control unit 22 has a function of calculating the vibration energy value of the oscillator 15 based on the power consumption of the power source 12 in the ultrasonic bonding apparatus 1 from the start of ultrasonic bonding. The control unit 22 controls the ultrasonic bonding apparatus 1 based on the vibration energy value of the oscillator 15, the information input to the input unit 21, and the sinking amount of the horn 13 detected by the encoder 18.

  Next, the control procedure of the ultrasonic bonding apparatus 1 executed by the bonding control apparatus 2 of the present embodiment will be described. FIG. 2 is a flowchart showing a control procedure executed by the bonding control apparatus 2 of the ultrasonic bonding apparatus 1 of this embodiment, and this routine is executed at intervals of several msec, for example. 1B to 1D are diagrams showing the operation of the ultrasonic bonding apparatus 1, and FIGS. 3 to 5 are diagrams for explaining a control example executed by the bonding control apparatus 2 of the ultrasonic bonding apparatus 1 according to the present embodiment. It is a graph.

First, in step S01, the setting value of the sinking amount of the horn 13 with respect to the first and second materials W1 and W2 and the setting value of the vibration energy value of the oscillator 15 are input from the input unit 21. Specifically, a first _subtraction threshold value C _th1 of the _subtraction amount of the horn 13 and a second subduction threshold value C _th2 lower than the first _subtraction threshold value are set, and the oscillator 15 The vibration energy threshold value _Vth is set.

  Here, the collapse amount (Collapse) in the joining control device 2 according to the present invention is the sum of the amounts of the contact portions 132 of the horn 13 and the contact portions of the anvil 14 that have entered the workpieces W1 and W2, respectively. It is defined as (the total amount sunk) and is obtained from the value detected by the encoder 18. That is, with reference to the position where the contact portion 132 of the horn 13 is in contact with the second material W2, the contact portion 132 of the horn 13 and the contact portion of the anvil 14 are connected to the materials W1 and W2, respectively. It is defined as the total length of the length that has entered (sunk). However, the amount of subsidence correlates with the depth of the indentation formed on the workpieces W1 and W2, but the depth of the indentation is influenced by the wear state of the contact portion 132 of the horn 13, etc. This is because it is practically difficult to detect the depth of the impression during ultrasonic bonding.

The first _subsidence threshold C _th1 is the first submerged material W1 when the sinking amount of the horn 13 with respect to the first and second members W1 and W2 is equal to or greater than the threshold C _th1. This is the subsidence threshold value that is the median value of the standard value of the bonding strength and appearance quality with the second workpiece W2. 6, by using the ultrasonic bonding apparatus 1 of the present embodiment, a result of the sinking amount was measured the bonding strength of the welded material W1, W2 in the case of changing between C ₁ mm~C 2 _mm It is a graph (level n10 for each subsidence amount). In this case, the standard value of the bonding strength is S ₀ N, and the lower limit value of the sinking amount that satisfies this standard value is C _min mm. However, in the sample in which the sinking amount exceeds C _max mm, the appearance defect of the impression is generated, and therefore C _max mm becomes the upper limit value of the standard value. Accordingly, the first _subsidence amount C _th1 in the illustrated result is the median value of the lower limit value C _min mm and the upper limit value C _max mm, that is, (C _max + C _min ) / 2 mm.

Note that the first _subsidence threshold value C _th1 may be obtained by using, for example, six sigma 6σ, which is a standard deviation, in addition to the above-described median value. FIG. 7 shows the results of measuring the bonding strength of the materials to be bonded W1 and W2 when the subsidence amount is changed between C ₁ mm and C ₂ mm using the ultrasonic bonding apparatus 1 of the present embodiment. It is a graph to show. In this case, first, the joining strength is obtained by setting the sinking amount to a level n between C ₁ mm and C ₂ mm, and the average value μ of the joining strength is obtained from the relationship between the obtained sinking amount and the joining strength. As shown in the figure, the sinking amount is selected such that the value of μ-6σ using the standard deviation σ is likely to be larger than the standard value S ₀ N of the bonding strength. And about these selected sinking amounts, the level n is increased to determine the joining strength, and finally the sinking amount at which μ−6σ satisfies S ₀ N, which is the standard value of the joining strength, is set as the first sinking amount. The subduction threshold C _th1 is set. In the illustrated example, the first _subsidence threshold C _th1 is illustrated. It should be noted that for the three _{subsidences on} the left side of the first _subsidence threshold C _th1 , all of the increased level plots are omitted, and these do not satisfy S ₀ N or more.

On the other hand, the second _subsidence threshold C _th2 is a case where the subsidence amount of the horn 13 with respect to the first and second workpieces W1 and W2 is less than the first _subsidence threshold C _th1. However, as a precondition that the oscillator 15 gives a predetermined amount of vibration energy to the materials W1 and W2, the bonding strength between the first material W1 and the second material W2 is, for example, a standard value. This is the subsidence threshold value that is the lower limit value. The vibration energy of the oscillator 15 which is a precondition at this time is set as the vibration energy threshold value _Vth . Each of these threshold values (first sinking threshold value C _th1 , second sinking threshold value C _th2 , and vibration energy threshold value V _th ) is, for example, the type and thickness of the materials to be joined W1 and W2 to be joined, the oscillator 15 Is appropriately set according to the vibration frequency of the ultrasonic vibration generated, the amplification factor of the ultrasonic vibration by the booster 16, the pressing force by the presser 17, and the like.

  Next, in step S02, the power supply 12 of the ultrasonic bonding apparatus 1 is turned on based on the information input in step S01, and the oscillator 15 and the presser 17 are operated. Specifically, the ultrasonic vibration generated by the oscillator 15 is amplified by the booster 16, and the amplified ultrasonic vibration is propagated to the horn 13. 1B, the presser 17 lowers the oscillator 15, the booster 16, and the horn 13, and applies a downward pressing force to the horn 13 in FIG. 1A. As a result, as shown in FIG. 1C, the contact portion 132 of the horn 13 contacts the upper surface of the second workpiece W2, and the first and second objects to be sandwiched between the horn 13 and the anvil 14 are obtained. The bonding materials W1 and W2 are pressed downward while the ultrasonic vibration is propagated in the horizontal direction.

  At this time, the encoder 18 measures the amount of sinking of the contact portion 132 of the horn 13 with respect to the first and second workpieces W1 and W2 by the pressing force applied by the pressing unit 17 over time. The control unit 22 of the bonding control device 2 reads the measurement result. Further, the control unit 22 also reads information regarding the power of the power source 12 consumed for generating ultrasonic vibrations in the oscillator 15 (step S03).

Next, in step S04, the control unit 22 determines whether or not the amount of subtraction of the horn 13 measured by the encoder 18 has reached the first _subtraction threshold C _th1 set in step S01. When the sinking amount of the horn 13 with respect to the first and second workpieces W1 and W2 is equal to or greater than the first sinking threshold _Cth1 (YES in step S04), the control unit 22 It is determined that the ultrasonic bonding between the material to be bonded W1 and the second material to be bonded W2 has been normally performed, and a stop signal for ultrasonic bonding is sent to the ultrasonic bonding apparatus 1 to control the bonding control apparatus 2. (See the first control example, FIG. 3). The ultrasonic bonding apparatus 1 that has received the ultrasonic vibration stop signal stops, for example, the supply of power from the power supply 12 to the oscillator 15 and stops the generation of the pressing force by the presser 17 (see FIG. 1D).

As described above, sinking amount of the first and second of the junction member W1, W2 horn 13 against the step S04 is if they reached the first subduction threshold Cth1 is shown in FIG. 3, for example As described above, the amount of sinking of the horn 13 and the vibration energy of the oscillator 15 are gradually increased from the start of ultrasonic bonding. In this case, the joined portions of the first and second workpieces W1 and W2 are joined with sufficient joining strength (for example, the median value of the standard value or the six sigma value).

In step S04, when the first and sinking amount of the second material to be joined W1, W2 horn 13 against is less than the threshold value _{C th1} sinking first (NO in step S04), to step S06 move on. In step S06, the ultrasonic bonding operation (propagation of ultrasonic vibration and application of pressing force) is further continued.

  Subsequently, the encoder 18 measures the amount of subsidence that the contact portion 132 of the horn 13 sinks with respect to the first and second workpieces W1 and W2 with the pressing force applied by the pressing unit 17 over time. The control unit 22 of the bonding control device 2 reads the measurement result. Further, the control unit 22 also reads information regarding the power of the power source 12 consumed for generating ultrasonic vibrations in the oscillator 15 (step S07).

Next, in step S08, first, the vibration energy of the oscillator 15 is calculated based on the information regarding the power of the power source 12 consumed in the oscillator 15. And the control part 22 determines whether the vibration energy of the oscillator 15 is more than the vibration energy threshold value _Vth set in step S01. When the vibration energy of oscillator 15 becomes equal to or higher than vibration energy threshold value _Vth (YES in step S08), the process proceeds to step S09. When the vibration energy of oscillator 15 is less than vibration energy threshold value _Vth (NO in step S08), the process returns to step S06, and the ultrasonic bonding operation is further continued. When the vibration energy of oscillator 15 becomes equal to or greater than vibration energy threshold value _Vth (YES in step S08), the process proceeds to step S09.

In step S09, the controller 22 determines whether or not the amount of subtraction of the horn 13 with respect to the first and second workpieces W1 and W1 is greater than or equal to the second subtraction threshold set in step S01. To do. If the amount of _subsidence is equal to or greater than the second _subsidence threshold C _th2 (YES in step S09), the process proceeds to step S05, and a stop signal for ultrasonic bonding is sent to the ultrasonic bonding apparatus 1. Then, the control ends (second control example, see FIG. 4). Then, the ultrasonic bonding apparatus 1 that has received the ultrasonic vibration stop signal stops, for example, the supply of power from the power source 12 to the oscillator 15 and the generation of the pressing force by the presser 17.

Sinking amount of the first and second of the junction member W1, W2 horn 13 against the, if there is less than a first sinking threshold Cth1 is a second sinking threshold Cth2 more (Step S09 YES), as shown in FIG. 4, the sinking amount of the horn 13 and the vibration energy of the oscillator 15 gradually increase from the start of the ultrasonic bonding, and the vibration energy reaches the vibration energy threshold value Vth and the sinking amount is reduced. The state is equal to or higher than the second threshold Cth2 and lower than the first threshold Cth1. For example, when a minute foreign matter having a thickness of 1 μm or less is mixed between the first material to be bonded W1 and the second material to be bonded W2, the sinking amount of the horn 13 is slightly reduced, and the sinking is performed. However, the foreign matter is gradually removed by the continued propagation of the ultrasonic vibration, but as a result, the bonding strength within the standard value is reduced. Can be obtained.

On the other hand, in step S09, when sinking amount of the first and second material to be joined W1, W1 horn 13 against was the second less than the threshold _{C th2} sinking (NO in step S09), step Proceed to S10.

In step S10, the control unit 22 determines that the ultrasonic bonding of the first material to be bonded W1 and the second material to be bonded W2 has not been performed normally. In this case, as shown in FIG. 5, while the vibration energy of the oscillator 15 increases and reaches the vibration energy threshold V _th , the sinking amount of the horn 13 gradually increases from the start of ultrasonic bonding. The amount of _subsidence does not exceed the second threshold value _Cth2, and the amount of subsidence is significantly reduced as compared to the first control example (see FIG. 3) described above. For example, when a foreign substance (film or the like) having a thickness of about several hundreds μm is mixed between the first material to be joined W1 and the second material to be joined W2, the sinking amount of the horn 13 is greatly reduced. It decreases, and appropriate joint strength cannot be obtained.

  In this case, a stop signal for ultrasonic bonding is sent to the ultrasonic bonding apparatus 1, and a signal indicating that ultrasonic bonding is not properly performed is also sent to the ultrasonic bonding apparatus 1 for control. (See the third control example, FIG. 5). The ultrasonic bonding apparatus 1 that has received the ultrasonic vibration stop signal stops, for example, the supply of power from the power supply 12 to the oscillator 15 and the generation of the pressing force by the pressing device 17. In addition, the ultrasonic bonding apparatus 1 receives a signal from the bonding control apparatus 2 that the ultrasonic bonding is not properly performed, and issues a warning such as an alarm to the operator.

  As described above, the bonding control apparatus 2 of the ultrasonic bonding apparatus 1 of the present embodiment has the following operational effects.

  When ultrasonic bonding is performed on the materials to be bonded W1 and W2 using the ultrasonic bonding apparatus 1, if oil or fat is attached to the materials to be bonded W1 or W2, ultrasonic vibration is caused by the presence of the oil or fat. Is difficult to propagate to the materials W1 and W2. However, when a small amount of oil or the like is attached to the materials to be bonded W1, W2, the ultrasonic vibration is gradually applied to the materials to be bonded W1, W2 by continuously applying ultrasonic vibration to the materials to be bonded W1, W2. Thus, appropriate ultrasonic bonding of the materials to be bonded W1 and W2 can be performed. Conventionally, since the quality of ultrasonic bonding is judged after a certain time from the start of ultrasonic bonding, the amount of oil or the like adhering to the materials W1 and W2 is an amount capable of performing appropriate ultrasonic bonding. In addition, the ultrasonic bonded body may be treated as a defective product in the quality determination after the predetermined time.

  On the other hand, in the joining control device 2 of the ultrasonic joining device 1 according to the present embodiment, first, the quality of the ultrasonic joining is determined based only on the sinking amount of the horn 13 with respect to the first and second workpieces W1 and W2. Make a decision. Thereby, it is possible to prevent the ultrasonic bonded body from being judged as a defective product despite the amount of oil and fat adhering to the materials W1 and W2 being able to perform ultrasonic bonding with appropriate bonding strength. Therefore, the yield of the obtained ultrasonic bonded body can be improved.

Further, in the present embodiment, in the case where the sinking amount of the horn 13 does not reach the first sinking threshold value _Cth1 due to a minute foreign matter mixed between the first and second workpieces W1 and W2. If the subsidence amount is equal to or greater than a preset second _subsidence threshold value C _th2 and the vibration energy of the oscillator 15 is equal to or greater than the vibration energy threshold value V _th , the ultrasonic bonded body is determined as a non-defective product. . For this reason, it is possible to avoid erroneously determining that an ultrasonic bonded body that is a non-defective product is defective, and it is possible to further improve the yield of the obtained ultrasonic bonded body.

In addition, when the sinking amount of the horn 13 with respect to the first and second workpieces W1 and W2 does not reach the first sinking threshold value _Cth1 , the sinking amount is set to a second sinking threshold value set in advance. When the vibration energy of the oscillator 15 is not less than the vibration energy threshold value V _th and not C _th2 or more, the control unit 22 determines that the ultrasonic bonded body is defective. For this reason, damage to the horn 13 due to the vibration energy of the oscillator 15 being continuously applied to the horn 13 can be suppressed, and the productivity of the ultrasonic bonded body can be improved.

By the way, in setting the above-described first _subsidence threshold C _th1 , as shown in FIG. 6, the lower limit value and the median value of the upper limit value satisfying the standard value of the joint strength are set as the first subsidence value. In addition to the threshold value C _th1 , as shown in FIG. 7, Six sigma μ-6σ may use the subsidence amount C _th1 that satisfies the lower limit value of the standard value of the bonding strength as the first subsidence threshold value. Since the materials of the materials W1 and W2 shown in FIGS. 6 and 7 are different, as a result, the first _subsidence threshold C _th1 shown in FIG. 7 is larger. towards threshold C _th1 subduction, as compared with the median shown in FIG. 6, the threshold C _th1 sinking first approaching the lower limit of the standard value of the bonding strength.

  Here, when the materials to be bonded W1 and W2 are relatively hard materials such as copper, longer time (more energy) is required in ultrasonic bonding than when the materials to be bonded W1 and W2 are aluminum. To do. Accordingly, the temperature increase range of the horn 13 is relatively large, and heat is accumulated in the horn 13 by repeated ultrasonic bonding. When the horn 13 is bonded under a constant bonding condition, the bonding quality is deteriorated as the temperature of the horn 13 increases. It becomes easy to do. For this reason, as shown in FIG. 7, the first subsidence threshold value is the minimum value that satisfies the lower limit value of the standard value of the bonding strength or a value that approximates this (in other words, the lower limit value within the range of the standard value). By setting to a value close to (2), it is possible to ensure to some extent the accuracy of determination of bonding failure due to foreign matter mixing while suppressing the occurrence of bonding quality failure due to the temperature rise of the horn 13. As shown in FIG. 6, compared to the case where bonding is performed up to the median of the standard value range, the bonding time is shortened, and the horn 13 can be extended in life.

  The embodiment described above is described for facilitating the understanding of the present invention, and is not described for limiting the present invention. Therefore, each element disclosed in the above embodiment is intended to include all design changes and equivalents belonging to the technical scope of the present invention.

  For example, in the above-described embodiment, only when the proper ultrasonic bonding is not performed, the bonding control device 2 outputs the stop signal and the abnormal end signal to the ultrasonic bonding device 1. It is not particularly limited to this. For example, the bonding controller 2 may output a stop signal and a normal end signal to the ultrasonic bonding apparatus 1 only when proper ultrasonic bonding is performed. Further, when proper ultrasonic bonding is performed, the bonding control device 2 outputs a stop signal and a normal end signal to the ultrasonic bonding device 1, and when proper ultrasonic bonding is not performed. Alternatively, the bonding control device 2 may output a stop signal and an abnormal end signal to the ultrasonic bonding device 1.

  The encoder 18 corresponds to a sinking amount detection unit according to the present invention, the bonding control device 2 corresponds to a control unit according to the present invention, and the bonding control device 2 and the encoder 18 serve as a control device according to the present invention. The control unit 22 corresponds to the vibration energy detection means according to the present invention, and the horn 13, the booster 16, the oscillator 15, and the power source 12 correspond to the oscillation device according to the present invention.

DESCRIPTION OF SYMBOLS 1 ... Ultrasonic bonding apparatus 1a ... Base 12 ... Power supply 13 ... Horn 131 ... Arm part 132 ... Contact part 14 ... Anvil 15 ... Oscillator 16 ... Booster 17 ... Pressor 18 ... Encoder 2 ... Junction control device 21 ... Input unit 22 ... Control unit W1 ... First material W2 ... Second workpiece Bonding material

Claims (4)

In a control device for an ultrasonic bonding apparatus that ultrasonically bonds the bonded material by applying ultrasonic vibration to a bonded portion of the bonded material,
A subsidence amount detecting means for detecting a subsidence amount of the material to be joined, at least from the start of propagation of the ultrasonic vibration to the material to be joined;
Vibration energy detection means for detecting vibration energy of the ultrasonic vibration at least from the start of propagation of the ultrasonic vibration to the material to be joined;
The sinking amount detected by the sinking amount detection means is less than a first sinking threshold , is equal to or greater than a second sinking threshold smaller than the first sinking threshold, and the vibration energy detecting means is A control device for an ultrasonic bonding apparatus, comprising: a control unit that outputs a stop signal for stopping the ultrasonic bonding to the ultrasonic bonding apparatus when the detected vibration energy is equal to or greater than a predetermined vibration energy threshold value . Said first subduction threshold, according to claim 1, premeasured Six Sigma value of the distribution of the bonding strength (μ-6σ) is set to subduction amount satisfying the lower limit of the predetermined bonding strength Control device for ultrasonic bonding equipment. A horn and anvil that are in contact with the materials to be joined;
An oscillator that applies ultrasonic vibration to the horn and presses the horn against the material to be joined;
In a control device for controlling the oscillation device,
The controller is
A subsidence amount detecting means for detecting a subsidence amount of the material to be joined, at least from the start of propagation of the ultrasonic vibration to the material to be joined;
Vibration energy detection means for detecting vibration energy of the ultrasonic vibration at least from the start of propagation of the ultrasonic vibration to the material to be joined;
The sinking amount detected by the sinking amount detection means is less than a first sinking threshold , is equal to or greater than a second sinking threshold smaller than the first sinking threshold, and the vibration energy detecting means is An ultrasonic bonding apparatus comprising: control means for outputting an ultrasonic bonding stop signal to the oscillation device when the detected vibration energy is equal to or greater than a predetermined vibration energy threshold value . Said first subduction threshold, according to claim 3, premeasured Six Sigma value of the distribution of the bonding strength (μ-6σ) is set to subduction amount satisfying the lower limit of the predetermined bonding strength Ultrasonic bonding device.