JP6575663B2 - Probe card type temperature sensor and wafer chuck temperature measuring method - Google Patents

Description

  The present invention relates to a prober and a wafer chuck temperature measuring method for inspecting electrical characteristics of a plurality of semiconductor elements (chips) formed on a semiconductor wafer, and more particularly to a prober and a wafer chuck temperature provided with a probe card type temperature sensor. It relates to the measurement method.

  Conventionally, in the field of probers that inspect the electrical characteristics of a plurality of semiconductor elements formed on a semiconductor wafer, the probe has a temperature sensor that detects the upper surface (surface) temperature of the wafer chuck. Based on this, a prober configured to control the upper surface temperature of the wafer chuck to a predetermined temperature has been proposed (see, for example, Patent Document 1).

JP 2009-99693 A

  However, in general, the measurement of the upper surface temperature of the wafer chuck is performed in a state where the probe card is removed, that is, in an environment different from the environment where the original inspection is performed. There is a problem that the measurement cannot be performed with high accuracy and the upper surface temperature of the wafer chuck cannot be properly calibrated.

  The present invention has been made in view of such circumstances, and provides a prober and a wafer chuck temperature measuring method capable of measuring the upper surface temperature of a wafer chuck under the same or substantially the same environment as the original inspection. For the purpose.

  In order to achieve the above object, a prober of the present invention comprises a probe card holding mechanism and a wafer chuck adjusted to a target temperature, and is held by the probe of the probe card held by the probe card holding mechanism and the wafer chuck. In a prober that electrically connects a semiconductor element formed on a wafer to be inspected and inspects the electrical characteristics of the semiconductor element, the probe card comprises a probe card type temperature sensor exchanged with the probe card, The mold temperature sensor is a probe card type temperature sensor having the same or substantially the same shape as the probe card, and is provided on the probe card type card body and the card body, contacting the upper surface of the wafer chuck and the wafer A plurality of temperature sensors for measuring the temperature of the chuck, and the probe Over de holding mechanism, a probe card type temperature sensor after the replacement, to retain the same or substantially the same orientation in the probe card and the same or substantially the same position before the exchange.

  In one aspect of the prober of the present invention, a first pogo frame, a second pogo frame exchanged with the first pogo frame, and a pogo frame exchange holding mechanism for exchanging and holding the first pogo frame or the second pogo frame. And the first pogo frame includes a plurality of pogo pins that are electrically connected to the probe of the probe card before the replacement held by the probe card holding mechanism, and the second pogo frame includes the A plurality of pogo pins electrically connected to the plurality of temperature sensors of the replaced probe card type temperature sensor held by the probe card holding mechanism, wherein the pogo frame replacement holding mechanism includes a second post-replacement mechanism; The pogo frame is held in the same or substantially the same position at the same or substantially the same position as the first pogo frame before replacement.

  In one aspect of the prober of the present invention, the detector further includes a detector that is electrically connected to the plurality of pogo pins of the second pogo frame and records information representing the temperature of the wafer chuck measured by the plurality of temperature sensors. Prepare.

  In one aspect of the prober of the present invention, transmission means for wirelessly transmitting information representing the temperature of the wafer chuck measured by the plurality of temperature sensors, and information representing the temperature of the wafer chuck wirelessly transmitted by the transmission means. And a detector for recording information representing the temperature of the wafer chuck received by the receiving means.

  One aspect of the prober of the present invention further includes wafer chuck temperature control means for adjusting the temperature of the wafer chuck based on the recorded contents of the detector.

  In one aspect of the prober of the present invention, the probe card held by the probe card holding mechanism or a seal member that forms a sealed space between the probe card type temperature sensor and the wafer chuck, and the sealed space is evacuated. Pressure reducing means for bringing the probe card into a state, and when the probe card is held by the probe card holding mechanism, the wafer chuck is drawn toward the probe card by bringing the sealed space into a vacuum state. When the probe of the probe card and a semiconductor element formed on the wafer held by the wafer chuck are electrically connected and the probe card temperature sensor is held by the probe card holding mechanism, the sealing is performed. By setting the space to a vacuum state, the wafer chuck can be Attracted towards Bukado temperature sensor of the plurality of temperature sensors of the probe card type temperature sensor comes into contact with the upper surface of the wafer chuck.

  In one aspect of the prober of the present invention, the prober is provided with a plurality of measurement units and a housing that houses the probe card type temperature sensor, and the probe card type temperature sensor is measured at the conveyance destination by moving to the measurement unit of the conveyance destination. A plurality of measurement units, each of which includes the probe card holding mechanism and the wafer chuck, moves between the plurality of measurement units, and is a destination measurement unit. A probe card transport mechanism for transporting the probe card temperature sensor transported by the transport unit to the probe card retaining mechanism and holding the probe card retaining mechanism by the probe card retaining mechanism.

  In one aspect of the prober of the present invention, each measuring unit is two-dimensionally arranged in the horizontal direction and the vertical direction.

  In one embodiment of the prober of the present invention, a probe card holding mechanism and a wafer chuck adjusted to a target temperature are provided, and the probe of the probe card held by the probe card holding mechanism and the wafer held by the wafer chuck. In a prober that electrically connects a semiconductor element formed thereon and inspects electrical characteristics of the semiconductor element, a first pogo frame, and a second pogo frame exchanged with the first pogo frame, A pogo frame exchange holding mechanism for exchanging and holding the first pogo frame or the second pogo frame, and the first pogo frame is electrically connected to a probe of the probe card held by the probe card holding mechanism. The second pogo frame includes a plurality of pogo pins to be connected, and the second pogo frame has a probe card type temperature. Includes a sensor, wherein the pogo frame exchange holding mechanism, a second pogo frame after the replacement, to retain the same or substantially the same orientation in the first pogo frame the same or substantially the same position before the exchange.

  In order to achieve the above object, a wafer chuck temperature measuring method of the present invention comprises a probe card holding mechanism and a wafer chuck adjusted to a target temperature, and the probe of the probe card held by the probe card holding mechanism. In a wafer chuck temperature measuring method in a prober that electrically connects a semiconductor element formed on a wafer held by the wafer chuck and inspects the electrical characteristics of the semiconductor element, the probe card holding mechanism Replacement of the held probe card with a probe card type temperature sensor, and holding the replaced probe card type temperature sensor in the same or substantially the same position at the same or substantially the same position as the probe card before the exchange Holding step and held by the probe card holding mechanism A temperature measuring step of measuring the temperature of the wafer chuck by bringing the plurality of temperature sensors of the probe card type temperature sensor after replacement into contact with the upper surface of the wafer chuck, and the probe card type temperature sensor comprises: A probe card type temperature sensor having the same or substantially the same shape as the probe card, the probe card type card main body, and provided on the card main body, contacting the upper surface of the wafer chuck and measuring the temperature of the wafer chuck A plurality of temperature sensors.

  According to the present invention, it is possible to provide a prober and a wafer chuck temperature measuring method capable of measuring the upper surface temperature of the wafer chuck under the same or substantially the same environment as the original inspection.

The perspective view which shows schematic structure of the prober 10 of this embodiment. Front view of each measuring unit 14 Perspective view of transport unit 16 A longitudinal sectional view showing a schematic configuration of the transport unit 16 Perspective view of moving device 22 Partially enlarged perspective view of moving device 22 A longitudinal sectional view showing a schematic configuration of the transport unit 16 and the measurement unit 14 The perspective view which shows schematic structure of the prober 10 Front view of each measuring unit 14 (vertical line) Schematic showing the positional relationship between the head stage 20, the pogo frame 46 and the test head 44. Partial enlarged perspective view of the measurement unit 14 Schematic showing how the test head 44 is pulled out Schematic showing how the pogo frame 46 is pulled out A top view showing that the pull-out direction of the maintenance target device and the transport direction of the transported object are in a straight line Schematic for explaining sealed space SS The figure which shows a mode that the pin type temperature sensor 68b and the post pin 68c are contacting the upper surface of the wafer chuck 18, etc. (A) Top view of probe card type temperature sensor 68, (b) Side view Schematic for explaining the configuration of the pin-type temperature sensor 68b

  Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings.

  FIG. 1 is a perspective view showing a schematic configuration of a prober 10 of the present embodiment.

  As shown in FIG. 1, the prober 10 according to the present embodiment moves between a transported object storage unit 12, a plurality of measurement units 14, a transported object storage unit 12, and each measurement unit 14, In the embodiment, at least one of a wafer, a probe card, and a probe card type temperature sensor) is transported into the transported object storage unit 12 or into each measurement unit 14, and the transport unit 16 is connected to the transported object storage unit 12 and each of the measurement units 14. And a moving device 22 for moving between the measuring unit 14.

  The transported object storage unit 12 and each measuring unit 14 are arranged at a constant interval in the Y direction in a state where the surfaces accessed by the transport unit 16 face each other (that is, face to face).

  The transport unit 16 is disposed between the transported object storage unit 12 and each measurement unit 14.

  The conveyed product storage unit 12 includes a wafer storage unit 12a that stores a plurality of wafers, a probe card storage unit 12b that stores a plurality of probe cards, and a probe card type temperature sensor storage unit that stores a probe card type temperature sensor. The number and arrangement form of the conveyed product storage units 12 are not particularly limited, and in the present embodiment, the four conveyed product storage units 12 including the wafer storage unit 12a, the probe card storage unit 12b, and the probe card type temperature sensor storage unit include: It is arranged in the horizontal direction (X-axis direction) with the surface (the right-side surface in FIG. 1) accessed by the transport unit 16 oriented in the same direction. Note that the side opposite to the side accessed by the transfer unit 16 (the left side in FIG. 1) is accessed by an operator when collecting a wafer or a probe card.

  As shown in FIG. 8, the plurality of measuring units 14 are arranged between the transport area A1 and the maintenance area A2. As shown in FIG. 1, each of the plurality of measurement units 14 is a rectangular parallelepiped configured by combining a plurality of frames extending in the X-axis direction, a plurality of frames extending in the Y-axis direction, and a plurality of frames extending in the Z-axis direction. A shape measurement chamber (also referred to as a prober chamber), as shown in FIGS. 9 and 10, is mounted on a wafer chuck 18 for holding a wafer, a head stage 20, and the head stage 20. The test head 44, the pogo frame 46 disposed between the head stage 20 and the test head 44, a first probe card holding mechanism 36 (not shown in FIGS. 9 and 10) for holding the probe card PC, Is arranged. In addition, as shown in FIG. 11, a test head lifting mechanism 48, a test head pulling mechanism 50, a pogo frame lifting mechanism 52, and a pogo frame pulling mechanism 54 are disposed inside each measurement unit 14. .

  FIG. 2 is a front view of each measurement unit 14.

  The number and arrangement form of the measurement units 14 are not particularly limited. In this embodiment, as shown in FIGS. 1 and 2, a measurement unit group including four measurement units 14 arranged in the horizontal direction (X-axis direction). Are stacked in three stages in the vertical direction (Z-axis direction), and are arranged two-dimensionally with the surface (the left surface in FIG. 1) accessed by the transport unit 16 facing the same direction.

  Each measurement unit 14 (surface on the side accessed by the transfer unit 16) has an opening 14a through which the wafer holding arm 16b and the probe card holding arm 16c of the transfer unit 16 enter and exit. Moreover, the opening 14b (refer FIG. 8) for drawing out the test head 44 and the pogo frame 46 is formed in the opposite side to the side in which the opening 14a was formed among each measurement part 14. FIG. Surfaces other than the surface on which the openings 14a and 14b of each measurement unit 14 are formed may be closed or an opening may be formed.

  The wafer chuck 18 is adjusted to a high or low target temperature (inspection temperature) by a known temperature adjusting device (for example, a heat plate or a chiller device built in the wafer chuck 18).

  The wafer chuck 18 is provided with a sealing mechanism. As shown in FIG. 15, the sealing mechanism includes an elastic ring-shaped seal member 74 provided in the vicinity of the outer periphery of the upper surface of the wafer chuck 18.

  The ring-shaped seal member 74 is a means for forming a sealed space SS between the probe card PC or probe card type temperature sensor 68 held by the first probe card holding mechanism 36 and the wafer chuck 18.

  A suction port (not shown) communicating with the sealed space SS is formed on the upper surface of the wafer chuck 18, and this suction port is connected to a suction path (not shown) formed inside the wafer chuck 18. A decompression means 76 is connected.

  The decompression means 76 is a means for making the sealed space SS into a vacuum state, and is constituted by, for example, a vacuum pump. The sealed space SS can be brought into a vacuum state by operating the vacuum pump and performing suction through the suction port and the suction path.

  When the probe card PC is held by the first probe card holding mechanism 36, the sealed space SS is brought into a vacuum state, whereby the wafer chuck 18 is drawn toward the probe card PC and the probe of the probe card PC and the wafer chuck The semiconductor elements formed on the wafer held by 18 are electrically connected so that the inspection can be started. On the other hand, when the probe card type temperature sensor 68 is held by the first probe card holding mechanism 36, the wafer chuck 18 is drawn toward the probe card type temperature sensor 68 by making the sealed space SS into a vacuum state. A plurality of pin type temperature sensors 68b of the probe card type temperature sensor 68 come into contact with the upper surface of the wafer chuck 18 so that temperature measurement can be started.

  The environment in each measurement unit 14 is controlled as follows. For example, the temperature in each measurement unit 14 is controlled to the target temperature (inspection temperature) by the temperature of the wafer chuck 18 disposed in each measurement unit 14. The humidity in each measurement unit 14 is controlled to the target humidity by purging dry air into each measurement unit 14 by a known mechanism. The environment in each measurement unit 14 is controlled by purging a predetermined gas (nitrogen gas) into each measurement unit 14 by a known mechanism. Each measurement unit 14 performs a plurality of types of inspections such as a high temperature inspection, a low temperature inspection, and an inspection under a predetermined gas (for example, nitrogen gas) atmosphere. The environment in each measurement unit 14 is controlled so that the environment in each measurement unit 14 becomes an environment according to the inspection performed in each measurement unit 14. In addition, the test | inspection implemented by each measurement part 14 may be the same between each measurement part, and may mutually differ.

  The first probe card holding mechanism 36 is a means for detachably holding the probe card PC (see FIG. 3) or the probe card type temperature sensor 68 (see FIG. 17). 20 side. The first probe card holding mechanism 36 has the same or substantially the same posture at the same or substantially the same position of the probe card PC or the probe card type temperature sensor 68 conveyed to the first probe card holding mechanism 36 by the probe card conveying mechanism described later. Hold it detachably. Since the first probe card holding mechanism 36 is well known (see, for example, Japanese Patent Application Laid-Open No. 2000-150596), further explanation is omitted.

  Each measurement unit group includes four alignment devices 38 and alignment devices 38 that perform relative alignment between the probe card PC held by the first probe card holding mechanism 36 and the wafer held by the wafer chuck 18. A moving device (not shown) that moves between the units 14 is arranged. The alignment device 38 is moved between the four measurement units 14 included in the measurement unit group in which the alignment device 38 is arranged, and is shared among the four measurement units 14. As the moving device that moves the alignment device 38 between the four measuring units 14, for example, a device described in Japanese Patent Application Laid-Open No. 2014-150168 can be applied.

  The alignment device 38 is a means for performing relative alignment between the probe card PC held by the first probe card holding mechanism 36 and the wafer held by the wafer chuck 18 and is moved up and down in the Z-axis direction. It is composed of a moving / rotating mechanism for moving the wafer chuck 18 in the XYZ-θ directions such as the shaft movable portion 38a, the Z-axis fixed portion 38b, and the XY movable portion 38c. The alignment device 38 mainly moves the wafer W held on the wafer chuck 18 while moving in the XYZ-θ direction to the probe of the probe card PC held above the wafer chuck 18 by a known method. Alignment is performed, the wafer W and the probe are brought into electrical contact, and the wafer W is used to inspect the electrical characteristics through the test head.

  The alignment device 38 holds the wafer chuck 18 in the measurement unit 14, and the probe card receiving position P1 (see FIG. 7A) near the opening 14a and the position P2 below the first probe card holding mechanism 36 (see FIG. 7A). (See FIG. 7B). That is, the alignment device 38 moves between the transport area A1 side and the maintenance area A2 side in the measurement unit 14 at the movement destination. This movement is realized by a known alignment apparatus moving device (not shown).

  The alignment device moving device moves the alignment device 38 holding the wafer chuck 18 heated to the target temperature when receiving the probe card PC to the probe card receiving position P1, and the first probe card holding mechanism 36 of the probe card PC. During the transfer to the position, the alignment device 38 holding the probe card PC and the wafer chuck 18 heated to the target temperature is moved to the position P2.

  The alignment device 38 includes a second probe card holding mechanism 40 (also referred to as a card lifter).

  The second probe card holding mechanism 40 is a means for receiving the probe card PC (or the probe card type temperature sensor 68) from the probe card holding arm 16c and holding it, for example, in a state of surrounding the wafer chuck 18 with Z A holding part 40a (for example, a ring-shaped member or a plurality of pins) attached to the shaft movable part 38a, and an elevating mechanism (not shown) for raising and lowering the holding part 40a in the Z-axis direction with respect to the Z-axis movable part 38a And is composed of.

  To receive and hold the probe card PC, the holding unit 40a is lifted in the Z-axis direction with respect to the Z-axis movable unit 38a while the alignment device 38 is moved to the probe card receiving position P1, and the probe card PC ) And the probe card PC is lifted from the probe card holding arm 16c by the holding portion 40a rising in the Z-axis direction. The probe card PC is held immediately above the wafer chuck 18. The same applies to the probe card type temperature sensor 68.

  The probe card transport mechanism transports the probe card PC (or probe card type temperature sensor 68) held by the second probe card holding mechanism 40 to the first probe card holding mechanism 36 and holds it in the first probe card holding mechanism 36. For example, it is constituted by an alignment device 38 (a Z-axis movable portion 38a moved up and down in the Z-axis direction). The alignment device 38 moves between the plurality of measurement units 14, and in the measurement unit 14 at the movement destination, the probe card PC conveyed by the conveyance unit 16 is conveyed to the first probe card holding mechanism 36 and the probe card The holding mechanism 36 holds it. The same applies to the probe card type temperature sensor 68.

  The probe card PC (or probe card type temperature sensor 68) is transported to the first probe card holding mechanism 36 by raising the Z-axis movable part 38a in the Z-axis direction with the alignment device 38 moved to the position P2. It is realized with.

  FIG. 3 is a perspective view of the transport unit 16, and FIG. 4 is a longitudinal sectional view illustrating a schematic configuration of the transport unit 16.

  The transfer unit 16 moves in the X-axis direction and the Z-axis direction between the transfer object storage unit 12 and each measurement unit 14 to transfer the wafer W, the probe card PC, or the probe card type temperature sensor 68 in the transfer object storage unit 12. Alternatively, as shown in FIGS. 3 and 4, a housing for storing the wafer W and the probe card PC (or the probe card type temperature sensor 68), which is a means for transporting into each measurement unit 14. And a housing 16a having an opening 16f through which the probe card PC (or probe card type temperature sensor 68) enters and exits. The housing 16a has a rectangular parallelepiped shape, and includes a wafer holding arm 16b, a probe card holding arm 16c, an arm moving mechanism (not shown) for individually moving the arms 16b and 16c, and the housing 16a. An environmental control means 16d for controlling the internal environment and a sensor 16e for detecting the internal environment of the housing 16a are arranged. The number of transport units 16 is not particularly limited, and one transport unit 16 is used in the present embodiment. In FIG. 1, two transport units 16 are depicted. This is because one transport unit 16 is accessing the transport object storage unit 12 (probe card storage unit 12 b) (in the lower right in FIG. 1). The drawing shows the state of accessing the measurement unit 14 and the measurement unit 14 (see the conveyance unit 16 drawn on the upper left in FIG. 1).

  The wafer holding arm 16b is a means for holding the wafer W. For example, the wafer holding arm 16b is arranged in the casing 16a so as to be movable in the horizontal direction along a guide rail (not shown) provided in the casing 16a. Yes. The wafer holding arm 16b is housed in the housing 16a together with the wafer W while holding the wafer W.

  The probe card holding arm 16c is a means for holding the probe card PC or the probe card type temperature sensor 68. For example, the probe card holding arm 16c can be moved horizontally along a guide rail (not shown) provided in the housing 16a. Is disposed in the housing 16a. The probe card holding arm 16c is housed in the housing 16a together with the probe card PC or the probe card type temperature sensor 68 while holding the probe card PC or the probe card type temperature sensor 68. The probe card PC and the probe card type temperature sensor 68 include a card holder CH. A seal ring may be included instead of the card holder CH.

  The number and arrangement form of the arms 16b and 16c are not particularly limited. In this embodiment, as shown in FIG. 4, two wafer holding arms 16b and one probe card holding arm 16c are arranged in three upper and lower stages. Yes.

  The arm moving mechanism is configured by a known mechanism, for example, a drive motor (not shown) provided in the housing 16a. By rotating the drive motor forward and backward, the arms 16b and 16c individually move back and forth in the horizontal direction and enter and exit through an opening 16f formed in the housing 16a.

  The transport unit 16 includes air curtain forming means 42.

  The air curtain forming means 42 is a means for forming an air curtain that closes the opening 16f formed in the housing 16a to make the inside of the housing 16a sealed or substantially sealed space. It is configured.

  The number, shape, and arrangement of the air injection ports are not particularly limited. In the present embodiment, as shown in FIG. 4, the upper end is located near the upper end edge of the opening 16 f in a posture in which a plurality of air injection ports inject downward. It is arranged along the edge (in a direction perpendicular to the paper surface in FIG. 4).

  The environment in the housing 16a is controlled as follows. For example, the temperature and humidity in the housing 16a are controlled to the target temperature and humidity by purging dry air (high-temperature or low-temperature dry air) or a predetermined gas (nitrogen gas) into each measurement unit 14. This is a known environment control means 16d, for example, a temperature control gas supply source including a heater and a cooler (cooler), a blower, and a pipe line (not shown) and a pipe line (not shown) connected to the casing 16a. (Not shown). The environment control means 16d may include a dehumidifier. A gas (high-temperature or low-temperature dry air) whose temperature (and humidity) has been adjusted by a temperature-controlled gas supply source is supplied into the housing 16a through a duct by a blower, and is jetted from an air injection port. An air curtain that closes the opening 16f formed in 16a is formed. As a result, the inside of the housing 16a becomes a sealed or substantially sealed space. The gas supply source supplied into the housing 16a and the gas supply source injected from the air injection port may be the same or different. Surfaces other than the surface on which the opening 16f of the housing 16a is formed may be closed or an opening may be formed. The environment control means 16d may be attached to the housing 16a or may be attached to the arms 16b and 16c.

  The sensor 16e is a sensor that detects the environment inside the housing 16a, and is, for example, a temperature sensor or a humidity sensor. The sensor 16e may be included in the environment control unit 16d.

  The environment control unit 16d controls the environment in the housing 16a so as to be an environment according to the environment of the transport destination of the transported object. Specifically, the environment control means 16d controls the inside of the housing 16a to a target environment based on the detection result of the sensor 16e. For example, the environment control unit 16d controls the temperature control gas supply source based on the detection result of the sensor 16e so that the temperature and humidity in the housing 16a become the target temperature and humidity. The function of the environmental control means 16d is realized by feedback control by a controller (not shown) to which the sensor 16e and a temperature control gas supply source (heater and cooler) are electrically connected, for example.

  FIG. 5 is a perspective view of the moving device 22, and FIG. 6 is a partially enlarged perspective view of the moving device 22.

  The moving device 22 is a means for moving the transport unit 16 in the X-axis direction and the Z-axis direction between the transport object storage unit 12 and each measurement unit 14, for example, as shown in FIGS. The first movable body 24 and the first movable body 24 that move in the horizontal direction (X-axis direction) that is the arrangement direction of each measurement unit 14 between the transported object storage unit 12 and each measurement unit 14 are arranged in the horizontal direction (X-axis). A first movable body moving mechanism (not shown) that is moved in the direction), and is attached to the first movable body 24 so as to be movable in the vertical direction (Z-axis direction), which is the arrangement direction of each measuring unit 14, and a transport unit A second movable body 26 that rotatably supports 16 around a vertical axis (Z axis) as a rotation center, and a second movable body moving mechanism (not shown) that moves the second movable body 26 in the vertical direction (Z-axis direction). , Attached to the second movable body 26, and the transport unit 16 is It is constituted by the transport unit rotating mechanism 28 for rotating the rotating around the Z axis).

  The first movable body 24 is, for example, a frame body configured by connecting four corners of each of a pair of upper and lower rectangular frames 24a with four frames 24b extending in the Z-axis direction, and a lower portion thereof is connected to the transported object storage unit 12. It is movably connected to two guide rails 30 extending in the X-axis direction and arranged in parallel to each other on a base 34 between each measurement unit 14.

  The first movable body moving mechanism is configured by a known moving mechanism, for example, a ball screw connected to the first movable body 24, a drive motor (none of which is shown), or the like that rotates the ball screw. By rotating the drive motor forward and backward, the first movable body 24 (conveyance unit 16) moves along the guide rail 30 in the X-axis direction. Of course, not limited to this, the first movable body moving mechanism is a mechanism for causing the first movable body 24 to self-run, for example, a wheel provided on the first movable body 24 and a drive motor for rotating the wheel. Also good.

  The second movable body 26 is movably connected to two guide rails 32 that extend in the Z-axis direction and are arranged in parallel to the first movable body 24.

  The second movable body moving mechanism includes a known moving mechanism, for example, a ball screw connected to the second movable body 26, a drive motor (none of which is shown) that rotates the same, and the like. By rotating the drive motor forward and reverse, the second movable body 26 (conveyance unit 16) moves along the guide rail 32 in the Z-axis direction. Of course, not limited to this, the second movable body moving mechanism is a mechanism for causing the second movable body 26 to self-run, for example, a wheel provided on the second movable body 26 and a drive motor for rotating the wheel. Also good.

  The transport unit rotation mechanism 28 includes a known rotation mechanism, for example, a rotation shaft (vertical shaft) provided on the second movable body 26, a drive motor 28a for rotating the rotation shaft, and the like. The upper surface of the transport unit 16 is fixed to a rotation axis (vertical axis). By rotating the drive motor 28a forward and backward, the transport unit 16 rotates 180 ° about the vertical axis (Z axis), and an opening 16f formed in the transport unit 16 through which the arms 16b and 16c enter and exit is provided. It will be in the state which opposes the conveyed product storage part 12 or each measurement part 14. FIG.

  The test head 44 is a maintenance target device (a device that performs maintenance over time) used when inspecting a semiconductor element formed on a wafer, and a plurality of test heads 44 are electrically connected to the pogo pins 46 b of the pogo frame 46. Terminal (not shown).

  The test head 44 is held by a test head holding mechanism.

  As shown in FIG. 11, the test head holding mechanism includes a base 56 and two test head guide rails 58 that are fixed on the base 56 and extend in the Y-axis direction. The test head 44 is slidably connected to the test head guide rail 58. The test head holding mechanism (base 56) is movably connected to a vertical guide rail (not shown) extending in the Z-axis direction. The base 56 is provided with a lock mechanism (not shown) for locking (fixing) the test head 44 to the base 56 (and the test head guide rail 58). The locking mechanism is configured by an engaging portion such as a claw portion that is engaged with or released from the test head 44, for example.

  The test head elevating mechanism 48 is a means for elevating the test head 44, and is configured by an actuator such as a test head cylinder (air or hydraulic cylinder), for example. For example, one end of the cylinder is connected to the base 56 side, and the other end is connected to the head stage 20 side. The cylinder may be equipped with a brake. By this actuator, the test head holding mechanism (base 56) is moved up and down along the vertical guide rail in the Z-axis direction, so that the test head 44 is locked together with the test head guide rail 58 and the Z-axis in a locked state by the lock mechanism. It moves up and down in the direction and moves to the pogo pin connection position P3 (see FIG. 10) or the test head lead-out position P4 (see FIG. 12A).

  The pogo pin connection position P3 is a position where the terminal of the test head 44 and the pogo pin 46b of the pogo frame 46 are electrically connected. The test head lead-out position P4 is such that when the test head 44 is pulled out, the test head 44 does not come into contact with the pogo pin 46b (and the positioning pin 60a described later) of the pogo frame 46 (and there is a rising space of the pogo frame 46 described later). This is a considered position (as ensured).

  The test head pull-out mechanism 50 (test head slide mechanism) is a means for pulling out the test head 44 raised to the test head pull-out position P4 to the maintenance area A2 side, and is constituted by, for example, a test head guide rail 58. .

  The test head 44 raised to the test head pull-out position P4 is slid in the Y-axis direction along the test head guide rail 58 by the operator releasing the lock by the lock mechanism and pulling it forward. It is pulled out to the maintenance area A2 side through the opening 14b (see FIG. 12B). Thereby, maintenance of the test head 44 (for example, replacement of the substrate inside the test head, etc.) becomes possible.

  After completion of the maintenance, the test head 44 is slid in the Y-axis direction along the test head guide rail 58 to the test head pull-out position P4, and then lowered to the pogo pin connection position P3 along the vertical guide rail. . At that time, as shown in FIG. 10, the test head 44 is positioned above the pogo frame 46, that is, at the pogo pin connection position P <b> 3 while being positioned with respect to the pogo frame 46 by the test head positioning mechanism 60.

  The test head positioning mechanism 60 is a means for positioning the test head 44 with respect to the pogo frame 46, and includes, for example, a positioning pin 60a and a recess 60b with which the positioning pin 60a abuts. The positioning pin 60a may be provided on the pogo frame 46 side, or may be provided on the test head 44 side. When the positioning pin 60a is provided on the pogo frame 46 side, the recess 60b with which the positioning pin 60a abuts is provided on the test head 44 side. On the other hand, when the positioning pin 60a is provided on the test head 44 side, the recess 60b with which the positioning pin 60a abuts is provided on the pogo frame 46 side.

  The pogo frame 46 (corresponding to the first pogo frame of the present invention) is a maintenance target apparatus (an apparatus that performs maintenance over time) used when inspecting a semiconductor element formed on a wafer. As shown, it is composed of a pogo frame body 46a and a plurality of pogo pins 46b held by the pogo frame body 46a. The upper end portion of the pogo pin 46b protrudes from the upper surface of the pogo frame main body 46a, and the lower end portion of the pogo pin 46b protrudes from the lower surface of the pogo frame main body 46a. The pogo pin 46 b is electrically connected to the terminal of the test head 44 and is also electrically connected to the probe of the probe card PC held by the first probe card holding mechanism 36.

  The pogo frame 46 is held by a pogo frame holding mechanism.

  As shown in FIG. 11, the pogo frame holding mechanism includes a base 62 and two pogo frame guide rails 64 that are fixed on the base 62 and extend in the Y-axis direction. The pogo frame 46 is slidably connected to the pogo frame guide rail 64. The pogo frame holding mechanism (base 62) is movably connected to a vertical guide rail (not shown) extending in the Z-axis direction. The base 62 is provided with a lock mechanism (not shown) that locks (fixes) the pogo frame 46 to the base 62 (and the pogo frame guide rail 64). The lock mechanism is configured by an engaging portion such as a claw portion that is engaged with or released from the pogo frame 46, for example.

  The pogo frame 46 is exchanged with the dedicated pogo frame 70 by the pogo frame exchange holding mechanism. The pogo frame exchange holding mechanism is means for exchanging and holding the pogo frame 46 or the dedicated pogo frame 70, and is mainly constituted by the pogo frame holding mechanism, the pogo frame lifting mechanism 52, and the pogo frame drawing mechanism 54.

  The pogo frame elevating mechanism 52 is a means for elevating and lowering the pogo frame 46, and is constituted by an actuator such as a pogo frame cylinder (air or hydraulic cylinder), for example. For example, one end of the cylinder is connected to the base 62 side, and the other end is connected to the head stage 20 side. The cylinder may be equipped with a brake. By this actuator, the pogo frame holding mechanism (base 62) is moved up and down in the Z-axis direction along the vertical guide rail, so that the pogo frame 46 is locked together with the pogo frame guide rail 64 in the Z-axis direction while being locked by the locking mechanism. It moves up and down in the direction and moves to the probe connection position P5 (see FIG. 12A) or the pogo frame drawing position P6 (see FIG. 13A).

  The probe connection position P5 is a position where the pogo pin 46b of the pogo frame 46 and the probe (not shown) of the probe card held by the first probe card holding mechanism 36 are electrically connected. The pogo frame drawing position P6 is a position that is considered so that the pogo frame 46 (pogo pin 46b) does not come into contact with a probe (and a positioning pin 66a described later) of the probe card when the pogo frame 46 is pulled out.

  The pogo frame pull-out mechanism 54 (pogo frame slide mechanism) is a means for pulling out the pogo frame 46 raised to the pogo frame pull-out position P6 toward the maintenance area A2, and is constituted by, for example, a pogo frame guide rail 64. .

  The pogo frame 46 raised to the pogo frame pull-out position P6 is slid in the Y-axis direction along the pogo frame guide rail 64 by the operator releasing the lock by the lock mechanism and pulling it forward. It is pulled out to the maintenance area A2 side through the opening 14b (see FIG. 13B). Thereby, maintenance of the pogo frame 46 (for example, pogo pin replacement etc.) becomes possible. Further, the pogo frame 46 can be detached from the pogo frame guide rail 64 and the dedicated pogo frame 70 can be attached (exchanged) to the pogo frame guide rail 64.

  The dedicated pogo frame 70 (corresponding to the second pogo frame of the present invention) is replaced with the pogo frame 46. As shown in FIG. 16, the dedicated pogo frame 70 is a dedicated pogo frame having the same or substantially the same shape as the pogo frame 46, and is composed of a pogo frame main body 70a and a plurality of pogo blocks 70b held by the pogo frame main body 70a. Has been. The plurality of pogo blocks 70b are provided in the same number as the plurality of pin type temperature sensors 68b. Each of the plurality of pogo blocks 70b includes four pogo pins (not shown). The four pogo pins are electrically connected to a plurality of pin type temperature sensors 68b (four lead wires 68b4 (see FIG. 18A)) of the probe card type temperature sensor 68 held by the first probe card holding mechanism 36. Is done.

  A detector 72 that records information (temperature data) indicating the temperature of the wafer chuck 18 measured by the plurality of pin-type temperature sensors 68b is electrically connected to the plurality of pogo blocks 70b (pogo pins) of the dedicated pogo frame 70. ing. Based on the recorded contents of the detector 72, the temperature of the wafer chuck 18 is adjusted (calibrated). The function of adjusting the temperature of the wafer chuck 18 is realized, for example, by controlling a heat plate (not shown) built in the wafer chuck 18 by a heat controller (not shown).

  After the maintenance is completed, the pogo frame 46 (or the replaced dedicated pogo frame 70) is slid in the Y-axis direction along the pogo frame guide rail 64 to the pogo frame drawing position P6 by the operator, and then the vertical guide rail. And descends to the probe connection position P5. At that time, the pogo frame 46 (or the exchanged dedicated pogo frame 70) is positioned with respect to the head stage 20 by the pogo frame positioning mechanism 66 as shown in FIG. It is arranged above, that is, at the probe connection position P5.

  The pogo frame positioning mechanism 66 is a means for positioning the pogo frame 46 (or the exchanged dedicated pogo frame 70) with respect to the head stage 20. For example, the pogo frame positioning mechanism 66 includes a positioning pin 66a and a recess 66b with which the positioning pin 66a abuts. It is configured. The positioning pin 66a may be provided on the pogo frame 46 side, or may be provided on the head stage 20 side. When the positioning pin 66a is provided on the pogo frame 46 side, the recess 66b with which the positioning pin 66a abuts is provided on the head stage 20 side. On the other hand, when the positioning pin 66a is provided on the head stage 20 side, the recess 66b with which the positioning pin 66a abuts is provided on the pogo frame 46 side.

  17A is a top view of the probe card type temperature sensor 68, and FIG. 17B is a side view.

  The probe card type temperature sensor 68 is replaced with a probe card PC. As shown in FIG. 17, the probe card type temperature sensor 68 is a probe card type temperature sensor having the same or substantially the same shape as the probe card PC, and includes a probe card type card body 68a and a plurality of pin type temperature sensors 68b. And a plurality of post pins 68c and a printed circuit board 68d.

  The card body 68a is a card body having the same or substantially the same shape (disk shape in the present embodiment) as the probe card PC, and a card body having a size (diameter) corresponding to the size (diameter) of the wafer chuck 18 is used. The material of the card body 68a is preferably the same as that of the probe card PC from the viewpoint of measuring the upper surface temperature of the wafer chuck 18 under the same or substantially the same environment as the original inspection.

  The card body 68a is formed with a plurality of pin type temperature sensor through holes 68a1 and a plurality of post pin through holes 68a2 penetrating in the thickness direction. The number and arrangement of the pin-type temperature sensor through holes 68a1 and the post pin through-holes 68a2 are not particularly limited. In this embodiment, as shown in FIG. 17, a total of 29 pin-type temperature sensor through-holes 68a1 and A total of 28 post pin through holes 68a2 are arranged concentrically between the center and the outer periphery of the card body 68a. The number and arrangement of the pin-type temperature sensor through-holes 68a1 and post-pin through-holes 68a2 may be set to an appropriate number and arrangement according to the size (diameter) of the probe card type temperature sensor 68 (card body 68a). it can.

  The plurality of pin-type temperature sensors 68b are means for measuring the temperature of the wafer chuck 18 in contact with the upper surface of the wafer chuck 18 (see FIG. 16). As shown in FIG. The metal protective tube 68b1 is in contact with the upper surface of the metal 18 and the temperature sensor 68b2 is accommodated in the metal protective tube 68b1.

  The metal protective tube 68b1 includes a lower end portion 68b3 that contacts the upper surface of the wafer chuck 18. The material of the metal protective tube 68b1 is not particularly limited, and for example, SUS316 can be used. The shape of the lower end portion 68b3 is not particularly limited, and in the present embodiment, it is a spherical shape from the viewpoint of reducing contact thermal resistance.

  The temperature sensor 68b2 is, for example, a platinum resistance temperature detector (for example, a platinum resistor Pt100). Of course, the temperature sensor 68b2 is not limited to this, and may be a temperature sensor other than the platinum resistance thermometer, for example, a thermocouple. A lead wire 68b4 is electrically connected to the temperature sensor 68b2, and the lead wire 68b4 is drawn out from the upper end portion 68b5 of the metal protective tube 68b1.

  The number and arrangement of the pin type temperature sensors 68b are not particularly limited. In the present embodiment, as shown in FIG. 17, a total of 29 pin type temperature sensors 68b are a plurality of pin types formed on the card body 68a. The card main body 68a is provided with being inserted (press-fitted) into the temperature sensor through hole 68a1. Specifically, each pin type temperature sensor 68b is fixed to the card body 68a with an adhesive such as resin while being inserted into the pin type temperature sensor through hole 68a1. Of course, not limited to this, each pin type temperature sensor 68b may be fixed to the card body 68a by mechanical means (for example, an engaging claw) in a state of being inserted into the pin type temperature sensor through hole 68a1. . The upper end portion of each pin type temperature sensor 68b protrudes from the upper surface of the card body 68a by the same or substantially the same amount, and the lower end portion of each pin type temperature sensor 68b protrudes from the lower surface of the card body 68a by the same or substantially the same amount.

  The plurality of post pins 68c are means for receiving a load by contacting the upper surface of the wafer chuck 18 with the plurality of pin type temperature sensors 68b contacting the upper surface of the wafer chuck 18 (see FIG. 16).

  The material or structure of the post pin 68c is not particularly limited. However, from the viewpoint of receiving a load by contacting the upper surface of the wafer chuck 18, a material or structure that is less likely to be elastically deformed than the pin type temperature sensor 68b (metal protective tube 68b1) (for example, It is desirable to have a solid structure rather than a hollow structure like a metallic protective tube. The number and arrangement of the post pins 68c are not particularly limited. In this embodiment, as shown in FIG. 17, a total of 28 post pins 68c are inserted into a plurality of post pin through holes 68a2 formed in the card body 68a ( The card body 68a is provided in a press-fit state. Specifically, each post pin 68c is fixed to the card main body 68a with an adhesive such as a resin while being inserted into the post pin through hole 68a2. Of course, the present invention is not limited to this, and each post pin 68c may be fixed to the card body 68a by mechanical means (for example, an engaging claw) while being inserted into the post pin through hole 68a2. The upper end portion of each post pin 68c protrudes from the upper surface of the card body 68a, and the lower end portion of each post pin 68c protrudes from the lower surface of the card body 68a.

  The length (protrusion amount) of each pin type temperature sensor 68b and the length of each post pin 68c (protrusion amount) are equivalent (same or substantially the same). Further, the length variation of each pin type temperature sensor 68b and each post pin 68c is suppressed to 30 μm or less. The flatness of the upper surface of the wafer chuck 18 is 15 μm or less. Thereby, when each pin type temperature sensor 68b contacts the upper surface of the wafer chuck 18, parallel accuracy can be maintained.

  The printed circuit board 68d includes a region (wiring, electrode pad, pogo seat, etc.) to which the four pogo pins of the pogo block 70 are electrically connected. The region includes four regions of the pin-type temperature sensor 68b shown in FIG. The lead wire 68b4 is electrically connected in a bent state. As shown in FIG. 18B, four pogo seats 68b6 are used corresponding to the four pogo pins. FIG. 18B shows an example of an electrical connection form between the pogo block 70 (pogo pin) and the pin-type temperature sensor 68b.

  The alignment device 38, arm moving mechanism, environment control means 16d, moving device 22 (first movable body moving mechanism, second movable body moving mechanism, transport unit rotating mechanism 28), test head lifting mechanism 48, pogo frame lifting mechanism. Each device and mechanism such as 52 is driven by control by a control means (controller or the like) (not shown).

  Next, an operation example of the transport unit 16 in the prober 10 of the present embodiment will be described.

<Example of wafer transfer operation>
First, an operation example when the transfer unit 16 transfers the wafer W from the wafer storage unit 12a to the measurement unit 14 where inspection (for example, high temperature inspection or low temperature inspection) is performed will be described.

  First, the transfer unit 16 is moved to a position where the wafer storage unit 12a can be accessed (a position where the wafer W can be taken out), and the transfer unit 16 is rotated by 180 ° so that the arms 16b and 16c enter and exit. The opening 16f formed on the wafer is opposed to the wafer storage portion 12a.

  Next, the wafer holding arm 16b is advanced into the wafer storage unit 12a, and one wafer W is taken out from the wafer storage unit 12a and stored in the housing 16a. At the same time, the environment in the housing 16a is controlled so as to be an environment according to the environment of the measurement unit 14 at the transport destination. Specifically, a gas whose temperature is adjusted by a temperature-controlled gas supply source is supplied into the housing 16a, and an air curtain is formed that closes the opening 16f formed in the housing 16a by being injected from the air injection port. Is done. As a result, the inside of the housing 16a is sealed or substantially sealed.

  Next, the transfer unit 16 is moved to a position where the measurement unit 14 at the transfer destination can be accessed (position where the wafer W can be delivered), and the transfer unit 16 is rotated by 180 ° so that the arms 16b and 16c enter and exit. The opening 16f formed in the transport unit 16 is opposed to the measurement unit 14 at the transport destination.

  Next, the wafer holding arm 16b is advanced in the Y-axis direction into the measurement unit 14 through the opening 16f on the transfer unit 16 side on which the air curtain is formed and the opening 14a on the measurement unit 14 side, and the wafer W is moved to the wafer chuck 18. To load. The arrow on the right side in FIG. 14 represents the transfer direction of the transfer object (wafer W here). The wafer holding arm 16b advances into the measurement unit 14 through the opening 16f closed by the air curtain while holding the wafer W.

  The loaded wafer W is held on the wafer chuck 18 by vacuum suction. Then, the wafer W waits until the wafer chuck 18 reaches the inspection temperature. When the wafer W reaches the inspection temperature, the alignment device 38 moves in the XYZ-θ direction, and the wafer W held on the wafer chuck 18 is moved to the wafer. The probe of the probe card PC held above the chuck 18 is aligned by a known method, and then the wafer chuck 18 is moved in the Z-axis direction by the action of the alignment device 38 to electrically connect the wafer W and the probe. By bringing them into contact, the electrical characteristics of the wafer W are inspected via the pogo frame 46 (pogo pins 46b) and the test head 44.

  In this way, the environment in the transfer unit 16 is controlled using the time until the wafer is transferred from the wafer storage unit 12a to the transfer destination measurement unit 14, and the inspection temperature at the transfer destination measurement unit 14 is controlled. By reducing the difference, it is possible to shorten (or eliminate) the waiting time for bringing the wafer close to the inspection temperature in the measurement unit 14 at the transfer destination as compared with the conventional technique. Thereby, the throughput in the measurement part 14 can be improved.

<Example of probe card transport operation>
Next, an operation example when the transport unit 16 transports the probe card PC from the probe card storage unit 12b to the measurement unit 14 where inspection (for example, high temperature inspection or low temperature inspection) is performed will be described.

  First, the transport unit 16 is moved to a position where the probe card storage unit 12b can be accessed (position where the probe card PC can be taken out), and the transport unit 16 is rotated by 180 ° to transport the arms 16b and 16c in and out. The opening 16f formed in the unit 16 is opposed to the probe card storage portion 12b.

  Next, the probe card holding arm 16c is advanced into the probe card storage portion 12b, and one probe card PC is taken out from the probe card storage portion 12b and stored in the housing 16a. At the same time, the environment in the housing 16a is controlled so as to be an environment according to the environment of the measurement unit 14 at the transport destination. Specifically, a gas whose temperature is adjusted by a temperature-controlled gas supply source is supplied into the housing 16a, and an air curtain is formed that closes the opening 16f formed in the housing 16a by being injected from the air injection port. Is done. As a result, the inside of the housing 16a is sealed or substantially sealed.

  Next, the conveyance unit 16 is moved to a position where the measurement unit 14 at the conveyance destination can be accessed (position where the probe card PC can be handed over), and the conveyance unit 16 is rotated by 180 ° so that the arms 16b and 16c enter and exit. The opening 16f formed in the transport unit 16 to be transported is opposed to the measurement unit 14 at the transport destination.

  Next, the probe card holding arm 16c is advanced in the Y-axis direction into the measurement unit 14 through the opening 16f on the transport unit 16 side where the air curtain is formed and the opening 14a on the measurement unit 14 side (FIG. 7A). reference). While holding the probe card PC, the probe card holding arm 16c advances into the measurement unit 14 in the Y-axis direction through the opening 16f closed by the air curtain. The arrow on the right side in FIG. 14 represents the transport direction of the transported object (here, probe card PC).

  Next, the probe card PC is received from the probe card holding arm 16c and held by the holding portion 40a of the second probe card holding mechanism 40. Specifically, with the alignment device 38 holding the wafer chuck 18 moved to the probe card receiving position P1, the holding portion 40a is raised in the Z-axis direction with respect to the Z-axis movable portion 38a to thereby move the probe card PC. The probe card PC is lifted from the probe card holding arm 16c by the holding portion 40a that is brought into contact with the outer peripheral edge of the lower surface and is raised in the Z-axis direction. As a result, the probe card PC is delivered to the holding unit 40a, and held by the holding unit 40a directly above the wafer chuck 18.

  Next, the alignment device 38 holding the probe card PC and the wafer chuck 18 is moved to the position P2 (see FIG. 7B).

  Next, the probe card PC is transported to the first probe card holding mechanism 36 (see FIG. 7B). Specifically, by moving the Z-axis movable portion 38a (second probe card holding mechanism 40) in the Z-axis direction while the alignment device 38 holding the wafer chuck 18 is moved to the position P2, The probe card PC held by the two-probe card holding mechanism 40 is conveyed to the first probe card holding mechanism 36. The probe card PC conveyed to the first probe card holding mechanism 36 is detachably held by the first probe card holding mechanism 36.

<Example of test head pull-out operation>
Next, an operation example when the test head 44 is pulled out to the maintenance area A2 side will be described.

  First, as shown in FIG. 12A, the test head lifting mechanism 48 raises the test head holding mechanism (base 56) from the pogo pin connection position P3 to the test head drawing position P4. As a result, the test head 44 moves to the test head drawing position P4 together with the test head guide rail 58 fixed to the base 56 while being locked by the locking mechanism.

  Next, after the operator releases the lock by the lock mechanism, the operator pulls the test head 44 raised to the test head pull-out position P4 to the near side. Thereby, as shown in FIG. 12B, the test head 44 slides in the Y-axis direction along the test head guide rail 58 and is pulled out to the maintenance area A2 side through the opening 14b. Thereby, maintenance of the test head 44 (for example, replacement of the substrate inside the test head, etc.) becomes possible. The arrow on the left side in FIG. 14 represents the pull-out direction (and push-in direction) of the maintenance target apparatus (here, the test head 44).

  Next, an operation example in the case where the test head 44 that has undergone maintenance is returned to the pogo pin connection position P3 will be described.

  First, the operator pushes the test head 44 for which maintenance has been completed along the test head guide rail 58 and slides the test head 44 to the test head pull-out position P4 in the Y-axis direction, and locks by the lock mechanism at that position. .

  Next, the test head lifting mechanism 48 lowers the test head holding mechanism (base 56) from the test head pull-out position P4 to the pogo pin connection position P3. As a result, the test head 44 moves to the pogo pin connection position P3 together with the test head guide rail 58 fixed to the base 56 in a locked state by the lock mechanism. At that time, as shown in FIG. 10, the test head 44 is positioned above the pogo frame 46, that is, at the pogo pin connection position P <b> 3 while being positioned with respect to the pogo frame 46 by the test head positioning mechanism 60. As a result, the terminals of the test head 44 and the pogo pins 46b of the pogo frame 46 are aligned, so that both can be electrically connected with high accuracy.

  As described above, the pull-out direction of the maintenance target apparatus (here, the test head 44) (see the left arrow in FIG. 14) and the transfer direction of the transfer object (wafer W or probe card PC) (right arrow in FIG. 14). Therefore, the Abbe error that must be taken into account when positioning the test head 44 with respect to the pogo frame 46, which requires high accuracy, can be suppressed (or eliminated). . In particular, when the test head 44 for which maintenance has been completed is returned to the pogo pin connection position P3, it is possible to suppress a decrease in positioning accuracy in the X-axis direction.

<Pogo frame extraction operation example>
Next, an operation example when the pogo frame 46 is pulled out to the maintenance area A2 side will be described.

  First, as shown in FIG. 12A, the test head lifting mechanism 48 raises the test head holding mechanism (base 56) from the pogo pin connection position P3 to the test head drawing position P4. As a result, the test head 44 moves to the test head drawing position P4 together with the test head guide rail 58 fixed to the base 56 while being locked by the locking mechanism. Thereby, the rising space S of the pogo frame 46 is ensured.

  Next, as shown in FIG. 13A, the pogo frame lifting mechanism 52 raises the pogo frame holding mechanism (base 62) from the probe connection position P5 to the pogo frame drawing position P6. As a result, the pogo frame 46 is moved to the pogo frame drawing position P6 together with the pogo frame guide rail 64 fixed to the base 62 while being locked by the locking mechanism.

  Next, after the operator releases the lock by the lock mechanism, the operator pulls the pogo frame 46 raised to the pogo frame pull-out position P6 toward the front. As a result, the pogo frame 46 is slid in the Y-axis direction along the pogo frame guide rail 64 and pulled out to the maintenance area A2 side through the opening 14b, as shown in FIG. 13B. Thereby, maintenance of the pogo frame 46 (for example, pogo pin replacement etc.) becomes possible. The left arrow in FIG. 14 represents the pulling direction (and the pushing direction) of the maintenance target device (here, the pogo frame 46).

  Next, an operation example in the case where the pogo frame 46 for which maintenance has been completed is returned to the probe connection position P5 will be described.

  First, the operator pushes the pogo frame 46 for which maintenance has been completed along the pogo frame guide rail 64 and slides the pogo frame 46 to the pogo frame pull-out position P6 in the Y-axis direction. .

  Next, the pogo frame lifting mechanism 52 lowers the pogo frame holding mechanism (base 62) from the pogo frame pull-out position P6 to the probe connection position P5. As a result, the pogo frame 46 is moved to the probe connection position P5 together with the pogo frame guide rail 64 fixed to the base 62 while being locked by the locking mechanism. At that time, as shown in FIG. 12A, the pogo frame 46 is positioned above the head stage 20, that is, at the probe connection position P5 while being positioned with respect to the head stage 20 by the pogo frame positioning mechanism 66. Is done. Thereby, since the pogo pin 46b of the pogo frame 46 and the probe of the probe card are aligned, both can be electrically connected with high accuracy.

  As described above, the pull-out direction of the maintenance target device (here, the pogo frame 46) (see the arrow on the left side in FIG. 14) and the transfer direction of the transfer object (wafer W or probe card PC) (the arrow on the right side in FIG. 143). Therefore, it is possible to suppress (or eliminate) an Abbe error that must be taken into account when positioning the pogo frame 46 with respect to the head stage 20 for which high accuracy is required. . In particular, when the pogo frame 46 for which maintenance has been completed is returned to the probe connection position P5, it is possible to suppress a decrease in positioning accuracy in the X-axis direction.

  In the prior art, the pogo frame is pulled out without raising the pogo frame, so the probe card had to be carried out of the measuring unit (cell) before pulling out the pogo frame. In the present embodiment, the pogo frame 46 is raised to the pogo frame drawing position P6 and separated from the probe card, and then the pogo frame 46 raised to the pogo frame drawing position P6 is pulled out. The pogo frame 46 can be pulled out without unloading the PC from the measuring unit 14.

<Wafer chuck temperature measurement method>
Next, an operation example when measuring the temperature of the wafer chuck 18 will be described.

  First, the pogo frame 46 is pulled out to the maintenance area A2 side by the procedure of the pogo frame pulling-out operation example, and this is replaced with the dedicated pogo frame 70. Specifically, the pogo frame 46 drawn to the maintenance area A2 side is removed from the pogo frame guide rail 64, and the dedicated pogo frame 70 is attached to the pogo frame guide rail 64. Then, the dedicated pogo frame 70 is returned to the probe connection position P5 by the procedure of the pogo frame pushing operation example. The pogo frame exchange holding mechanism (pogo frame holding mechanism, pogo frame raising / lowering mechanism 52, pogo frame pulling mechanism 54) is configured so that the dedicated pogo frame 70 after replacement has the same or substantially the same position (probe connection position) as the pogo frame 46 before replacement. P5) is held in the same or substantially the same posture.

  Next, the probe card temperature sensor 68 is transported into the measurement unit 14 where the temperature of the wafer chuck 18 is measured by the transport unit 16 according to the procedure of the above probe card transport operation example, and the first probe is transported by the alignment device 38. The card is transported to the card holding mechanism 36 and is held by the first probe card holding mechanism 36. The first probe card holding mechanism 36 holds the probe card type temperature sensor 68 after replacement in the same or substantially the same posture at the same or substantially the same position as the probe card PC before replacement. The probe card type temperature sensor 68 is held in a state where each pin type temperature sensor 68 b is in electrical contact with a plurality of pogo blocks 70 b (pogo pins) of the dedicated pogo frame 70.

  Next, the wafer chuck 18 is moved mainly in the Z-axis direction by the alignment device 38 to form a sealed space SS between the probe card type temperature sensor 68 and the wafer chuck 18. And the sealed space SS is made into a vacuum state by operating the decompression means 76. As a result, the wafer chuck 18 is attracted toward the probe card type temperature sensor 68, and a plurality of pin type temperature sensors 68b of the probe card type temperature sensor 68 come into contact with the upper surface of the wafer chuck 18 so that temperature measurement can be started. It becomes. At this time, each post pin 68c contacts the upper surface of the wafer chuck 18 and receives a load, and each pin type temperature sensor 68b that contacts the upper surface of the wafer chuck 18 bends. Thereby, the contact pressure of each pin type temperature sensor 68b is controlled to be constant or substantially constant. As a result, the contact state between each pin type temperature sensor 68b and the upper surface of the wafer chuck 18 becomes constant or substantially constant, and the temperature of the wafer chuck 18 can be accurately measured. In other words, parallel accuracy is maintained by the action of each post pin 68c when each pin type temperature sensor 68b contacts the upper surface of the wafer chuck 18. Then, when each pin type temperature sensor 68b comes into contact with the upper surface of the wafer chuck 18, each post pin 68c receives a load load of contact so that the load can be uniformly transmitted to each pin type temperature sensor 68b. Thereby, the influence on the temperature measurement by each pin type temperature sensor 68b is suppressed. As a result, the temperature of the wafer chuck 18 can be accurately measured.

  Further, each pin type temperature sensor 68b has its spherical lower end 68b3 abutting on the upper surface of the wafer chuck 18 in a form close to point contact, so that the contact thermal resistance is reduced as compared with the case of contact in a form close to surface contact. Is done. As a result, the contact state between each pin type temperature sensor 68b and the upper surface of the wafer chuck 18 becomes constant or substantially constant, and the temperature of the wafer chuck 18 can be accurately measured.

  Information representing the temperature measured by each pin-type temperature sensor 68 b is transmitted through a plurality of pogo blocks 70 b (pogo pins) of the dedicated pogo frame 70 and recorded in the detector 72. Based on the recorded contents of the detector 72, the temperature of the wafer chuck 18 is adjusted (calibrated).

  As described above, according to the present embodiment, a prober 10 and a wafer chuck temperature measuring method capable of measuring the upper surface temperature of the wafer chuck 18 in the same or substantially the same environment as the original inspection is performed are provided. Can do.

  This is because, firstly, the probe card PC and the probe card type temperature sensor 68 are held in the same or substantially the same position in the same or substantially the same position by the first probe card holding mechanism 36, and secondly, the original This is because both the inspection and the measurement of the upper surface (surface) temperature of the wafer chuck 18 are performed in an environment where the sealed space SS is in a vacuum state.

  In addition, according to the present embodiment, the upper surface temperature of the wafer chuck 18 is measured in an environment where the sealed space SS formed between the probe card type temperature sensor 68 and the wafer chuck 18 is in a vacuum state. Thus, the upper surface temperature of the wafer chuck 18 can be accurately measured without being affected by thermal convection.

  Further, according to the present embodiment, it is possible to provide a probe card type temperature sensor that can control the contact pressure of each of the plurality of temperature sensors with respect to the upper surface of the wafer chuck to be constant or substantially constant.

  This is because, as a result of using a plurality of pin type temperature sensors 68b as a plurality of temperature sensors, each pin type temperature sensor 68b in contact with the upper surface of the wafer chuck 18 is the same (in the thickness direction of the probe card type temperature sensor 68). This is due to bending in form.

  Further, each post pin 68c abuts on the upper surface of the wafer chuck 18 and receives a load, so that the probe card type temperature sensor 68 and the upper surface of the wafer chuck 18 are kept in a parallel or substantially parallel state. This also makes it possible to control the contact pressure of each of the plurality of temperature sensors to the upper surface of the wafer chuck to be constant or substantially constant. Each post pin 68c may be omitted as appropriate.

  As described above, the contact pressure of each of the plurality of temperature sensors with respect to the upper surface of the wafer chuck is controlled to be constant or substantially constant. As a result, the contact state between each pin type temperature sensor 68b and the upper surface of the wafer chuck 18 is constant or substantially constant. As a result, the temperature of the wafer chuck 18 can be accurately measured.

  Next, a modified example will be described.

  In the present embodiment, the configuration using the dedicated pogo frame 70 and the detector 72 electrically connected to the plurality of pogo blocks 70b (pogo pins) of the dedicated pogo frame 70 is exemplified. This receiving means uses a transmitting means for wirelessly transmitting information representing the temperature of the wafer chuck 18 measured by the temperature sensor 68b and a receiving means for receiving information representing the temperature of the wafer chuck 18 wirelessly transmitted by the transmitting means. Information representing the temperature of the wafer chuck 18 received by the detector 72 may be recorded by the detector 72. In this way, the dedicated pogo frame 70 can be omitted. The transmitting means can be provided in the pin-type temperature sensor 68b, and the receiving means can be provided in the detector 72.

  Further, in the present embodiment, the configuration in which the probe card type temperature sensor 68 is not provided in the dedicated pogo frame 70 is illustrated, but the present invention is not limited to this, and the probe card type temperature sensor 68 is provided in the dedicated pogo frame 70. After removing the probe card PC, the pogo frame 46 may be replaced with a dedicated pogo frame 70 provided with a probe card type temperature sensor 68 (for example, fixed) by a pogo frame replacement holding mechanism. In this case, the pogo frame replacement holding mechanism holds the dedicated pogo frame 70 after replacement in the same or substantially the same position at the same or substantially the same position as the pogo frame 46 before replacement. The probe card type temperature sensor 68 is held in the same or substantially the same position at the same or substantially the same position as the probe card PC before removal. In this way, since the conveyance of the probe card type temperature sensor 68 by the conveyance unit 16 can be omitted, the temperature of the wafer chuck 18 is immediately after replacing the dedicated pogo frame 70 provided with the probe card type temperature sensor 68. Measurement can be started.

  In the present embodiment, the sealing mechanism (ring-shaped seal member 74) is used to operate the decompression means 76 so that the sealed space SS formed between the probe card type temperature sensor 68 and the wafer chuck 18 is in a vacuum state. In this example, the wafer chuck 18 is drawn toward the probe card type temperature sensor 68 and the plurality of pin type temperature sensors 68b of the probe card type temperature sensor 68 are brought into contact with the upper surface of the wafer chuck 18. Without being limited thereto, the sealing mechanism (ring-shaped seal member 74) and the decompression means 76 are omitted, and the alignment device 38 holding the wafer chuck 18 is raised in the Z-axis direction, so that a plurality of pins of the probe card type temperature sensor 68 are provided. The mold temperature sensor 68 b may be brought into contact with the upper surface of the wafer chuck 18.

  In the present embodiment, the pin type temperature sensor 68b is used as an example. However, the present invention is not limited to this, and various types of temperature sensors such as a sheet shape, a box shape, and a spherical shape can be used.

  In this embodiment, the example in which the temperature of the upper surface of the wafer chuck 18 is measured by bringing the plurality of pin-type temperature sensors 68b of the probe card type temperature sensor 68 into contact with the upper surface of the wafer chuck 18 has been described. For example, the temperature of the wafer itself may be measured by bringing a plurality of pin type temperature sensors 68b of the probe card type temperature sensor 68 into contact with the upper surface of the wafer held by the wafer chuck 18. it can.

  In the present embodiment, the pogo frame elevating mechanism 52 is used and the pogo frame 46 that has been raised by the pogo frame 46 is drawn out. However, the present invention is not limited thereto, and the pogo frame elevating mechanism 52 may be omitted. In other words, a pogo frame pulling mechanism similar to that of the prior art may be used, and the pogo frame 46 may be pulled out without raising the pogo frame 46.

  Further, in the present embodiment, the configuration in which the arms 16b and 16c of the transport unit 16 enter and exit through the opening 16f formed in the housing 16a is illustrated, but the present invention is not limited thereto, and for example, the housing of the transport unit 16 A similar opening (not shown) is formed on the surface of 16a opposite to the side on which opening 16f is formed, and arms 16b and 16c individually reciprocate in the horizontal direction to open opening 16f and its opposite side. You may comprise so that it may come in and out through the opening of the side. In this way, the transport unit rotation mechanism 28 can be omitted. Even though the transport unit rotation mechanism 28 is omitted, that is, without the transport unit 16 being rotated, access to the transport object storage unit 12 or each measurement unit 14 by the arms 16b and 16c can be realized. In this case, in addition to the air curtain forming means 42 that forms an air curtain that closes the opening 16f formed in the housing 16a of the transport unit 16, an air curtain that closes the opening formed on the opposite side of the opening 16f is provided. By providing the air curtain forming means to be formed in the transport unit 16, the inside of the housing 16a can be sealed or substantially sealed space, and the same effect as in the above embodiment can be obtained.

  Further, in the present embodiment, the configuration in which each measurement unit 14 is two-dimensionally arranged in the horizontal direction (X-axis direction) and the vertical direction (Z-axis direction) is illustrated, but the measurement unit 14 is not limited thereto. May be arranged only in a line in the horizontal direction (X-axis direction), or may be arranged only in a line in the vertical direction (Z-axis direction). The second movable body moving mechanism can be omitted by arranging the measuring units 14 in only one row in the horizontal direction (X-axis direction). Also, the first movable body moving mechanism can be omitted by arranging the measuring units 14 in only one line in the vertical direction (Z-axis direction).

  Further, in the present embodiment, the configuration using one transport unit 16 and one moving device 22 is illustrated, but the present invention is not limited to this, and a plurality of transport units 16 and a plurality of moving devices 22 may be used. In this way, the throughput in each measurement unit 14 can be further improved.

  Further, in the present embodiment, the configuration using the wafer holding arm 16b and the probe card holding arm 16c has been illustrated, but not limited to this, only the probe card holding arm 16c may be used.

  Further, in the present embodiment, the configuration in which the arms 16b and 16c are provided in the transport unit 16 is illustrated, but not limited thereto, the arms 16b and 16c (or the transport unit storage unit 12 side and the measurement unit 14 side) are provided. An arm corresponding to this may be provided. Also by this, it is possible to take out the conveyed product from the conveyed product storage unit 12 or the measurement unit 14 by each arm and store it in the conveyance unit 16, and to take out the conveyed product from the conveyance unit 16 and to store the conveyed product storage unit 12 or It can be delivered to the measurement unit 14.

  Further, in the present embodiment, the configuration in which the opening 16f formed in the casing 16a is closed with an air curtain is illustrated, but the present invention is not limited thereto, and the opening is opened when the transported object is taken out or delivered, and An opening / closing means such as a shutter or a door that is closed during the conveyance may be provided in the conveyance unit 16, and the opening 16f may be opened / closed by the opening / closing means. Moreover, you may comprise so that the opening 14a formed in each measurement part 14 may be obstruct | occluded with the same air curtain, or you may comprise so that the opening 14a may be opened and closed with the same opening opening / closing means.

  As described above, the probe card is replaced with a probe card type temperature sensor, and the replaced probe card type temperature sensor is held in the same or substantially the same position at the same or substantially the same position as the probe card before the exchange. Thus, the idea of measuring the upper surface temperature of the wafer chuck under the same or substantially the same environment as the original inspection is performed is not only the prober of the above embodiment, but also the probe card that holds the probe card detachably. It can be applied to all types of probers equipped with a holding mechanism (see, for example, JP 2007-294665 A, JP 2000-150596 A, JP 2003-177158 A, JP 2008-16676 A). it can.

  Although the prober of the present invention has been described in detail above, the present invention is not limited to the above examples, and various improvements and modifications may be made without departing from the scope of the present invention. is there.

  DESCRIPTION OF SYMBOLS 10 ... Prober, 12 ... Conveyed object storage part, 12a ... Wafer storage part, 12b ... Probe card storage part, 14 ... Measurement part, 14a ... Opening, 16 ... Conveyance unit, 16a ... Case, 16b ... Wafer holding arm, 16c DESCRIPTION OF SYMBOLS ... Probe card holding arm, 16d ... Environmental control means, 16e ... Sensor, 16f ... Opening, 18 ... Wafer chuck, 20 ... Head stage, 22 ... Moving device, 24 ... First movable body, 26 ... Second movable body, 28 ... transport unit rotation mechanism, 28a ... drive motor, 30, 32 ... guide rail, 34 ... base, 36 ... first probe card holding mechanism, 38 ... alignment device, 40 ... second probe card holding mechanism, 40a ... holding section, 42 ... Air curtain forming means, 44 ... Test head, 46 ... Pogo frame (first pogo frame), 46a ... Pogo frame body 46b ... pogo pin, 48 ... test head lifting mechanism, 50 ... test head pulling mechanism, 52 ... pogo frame lifting mechanism, 54 ... pogo frame pulling mechanism, 56 ... base, 58 ... test head guide rail, 60 ... test head positioning mechanism , 60a ... positioning pin, 60b ... concave, 62 ... base, 64 ... pogo frame guide rail, 66 ... pogo frame positioning mechanism, 66a ... positioning pin, 66b ... concave, 68 ... probe card type temperature sensor, 70 ... pogo frame (Second pogo frame), 72 ... detector, CH ... card holder, PC ... probe card, W ... wafer

Claims (7)

A probe card type temperature sensor used in exchange for a probe card of a prober for inspecting electrical characteristics of a wafer,
The card body,
A plurality of contacts provided on the main surface of the card body and functioning as temperature sensors for detecting the temperature of the wafer chuck by contacting the wafer chuck of the prober;
A probe card type temperature sensor. The contact is a pin-type contact;
The probe card type temperature sensor according to claim 1.   Each of the contacts includes a spherical portion that contacts the wafer chuck.
  The probe card type temperature sensor according to claim 1 or 2. Provided with a plurality of post pins protruding from the main surface of the card body,
The probe card type temperature sensor according to any one of claims 1 to 3 .   The post pin is formed of a material that is less elastically deformed than the contact, or has a structure that is less elastically deformed than the contact.
  The probe card type temperature sensor according to claim 4.   6. When measuring the temperature of a wafer chuck using the probe card type temperature sensor according to claim 4, the post pin is brought into contact with the wafer chuck in a state where the contact is in contact with the wafer chuck. By receiving a load from the wafer chuck, the contact pressure of the contact with the wafer chuck is controlled.
  Wafer chuck temperature measurement method.   When measuring the temperature of the wafer chuck using the probe card type temperature sensor according to any one of claims 1 to 5,
  A sealing member is used to form a sealed space between the probe card type temperature sensor and the wafer chuck,
  The sealed space is depressurized to be in a vacuum state, the wafer chuck is drawn toward the probe card type temperature sensor, and the contact of the probe card type temperature sensor is brought into contact with the wafer chuck.
  Wafer chuck temperature measurement method.

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