JP6576286B2 - IC label manufacturing method - Google Patents

Description

  The present invention relates to an IC label manufacturing method for continuously forming an inlet having a communicable IC chip mounted on a continuous peeled body.

  In recent years, as IC labels are to be affixed to products, it is desired that all IC labels of continuous IC labels supplied at the time of affixing are non-defective and are arranged at the same interval, while a surface body is provided. In the manufacture of an IC label in which an inlet with a single-sided adhesive layer called a cheap wet inlet is pasted on a continuous sheet and only good products are pasted on a release paper and die-cut, the die was cut after the inlet was pasted. It is necessary to efficiently separate unnecessary bodies remaining at the time.

  Conventionally, various techniques have been proposed in label production. For example, in Patent Document 1, a continuous surface sheet and an adhesive layer drawn from one roller are peeled from a release paper, and a continuous inlet and an adhesive layer drawn from the other roller are removed by laser light. Cutting and mounting the cut inlet on the release paper so that the pressure-sensitive adhesive layer is on the release paper side, then, on the release paper on which the inlet is mounted, a continuous surface sheet separated from the release paper, There has been proposed an IC label manufacturing apparatus in which an inlet is sandwiched and stacked so as to be adhered to each other by an adhesive layer and cut into a shape of a surface sheet at a die-cut portion.

Japanese Patent No. 4535700

  By the way, in the IC label manufacturing apparatus proposed in the above-mentioned Patent Document 1, the unnecessary body of the top sheet portion remaining after the cutting is continuous, and it can be separated and continuously wound up. In the case of an inlet with a single-sided pressure-sensitive adhesive layer that is not provided with a surface sheet, the surface sheet is not present, so it is discontinuously arranged on the release paper, and remains after cutting (die-cutting) the inlet. However, since it is discontinuous, there is a problem that it cannot be removed continuously after the cutting and must be removed in a separate process.

  Therefore, the present invention has been made in view of the above problems, and when an inlet having no surface body serving as an IC label is continuously formed on a peeled body, the remaining unnecessary body from which the inlet has been punched is efficiently obtained. An object of the present invention is to provide an IC label manufacturing method for separating and removing.

  In order to solve the above-mentioned problem, in the invention of claim 1, the first adhesive layer is provided with an inlet on which a surface body on which a communicable IC module is mounted is not provided on a continuous release body on which a release layer is formed. A method of manufacturing an IC label formed at predetermined intervals via an inlet substrate including a peripheral region of the IC module is prepared, and strips are formed on both end sides on the release layer in the width direction of the release body. A continuous body is provided via the second adhesive layer, and the inlet base is adhered to the continuous body on the release body at a predetermined interval on the release layer of the release body via the first adhesive layer. The step of affixing, the inlet base on the release layer of the release body is attached at a predetermined interval via the first adhesive layer, and the width direction of the release body corresponding to the peripheral area of each inlet base Peeling A step of any one of the steps of providing a band-like continuous body on both end sides of the layer via the second adhesive layer, and a portion to be an inlet excluding the peripheral region of the affixed inlet base And a step of separating the continuum from the peripheral area of the inlet base remaining after the die cutting.

  According to the first aspect of the present invention, an inlet base including the peripheral region of the IC module is prepared, and the continuous body is provided on both end sides on the release layer in the width direction of the release body. Are adhered to each continuous body and pasted on the release layer of the release body at a predetermined interval, or the inlet base is pasted on the release layer of the release body at a predetermined interval, and the peripheral area of each inlet base Corresponding to the width direction of the peeled body, strip-like continuums are respectively provided on both end sides of the peeled layer, and the portion of the pasted inlet base that becomes the inlet excluding the peripheral region is die-cut. By separating the continuous body from the peripheral area of the inlet base remaining after the die cutting, the remaining unnecessary body obtained by punching the inlet from the inlet base is removed. Rate well separated, but can be removed.

It is structure explanatory drawing of the IC label manufactured with the IC label manufacturing method concerning this invention. FIG. 2 is a production explanatory view of an inlet substrate used for manufacturing the IC label of FIG. 1. It is process explanatory drawing (1) which manufactures the IC label which concerns on this invention. It is process explanatory drawing (2) which manufactures the IC label which concerns on this invention. It is process explanatory drawing (1) of the other manufacturing method in label manufacture. It is process explanatory drawing (2) of the other manufacturing method in label manufacture.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
FIG. 1 shows a configuration explanatory diagram of an IC label manufactured by an IC label manufacturing method according to the present invention. In FIG. 1A, the continuous IC label 11 has an inlet 13 formed on a continuous release body 12 (release layer 12B) in which a release layer 12B is formed on a release substrate 12A via a first adhesive layer 15. The inlet 13 is formed in a continuous shape, and is a wet inlet with a single-sided adhesive layer in which the first adhesive layer 15 is provided on the IC module 14 composed of an IC chip and an antenna, and the surface body is not provided. is there.

  The inlet 13 is roughly classified into one shown in FIG. 1 (B) and one shown in FIG. 1 (C). An inlet 13 shown in FIG. 1B is obtained by forming an antenna on a label base 13A by printing and mounting an IC chip, and forming a first adhesive layer 15 on the mounting side. It is affixed on the peeling layer 12B of the peeling body 12 via.

  On the other hand, the inlet 13 shown in FIG. 1C is obtained by attaching an IC chip by bonding an antenna formed by etching to a label base 13A with an adhesive layer 13B, and forming a first adhesive layer 15 on the mounting side. Thus, it is affixed onto the release layer 12B of the release body 12 via the first adhesive layer 15. In the present invention, any of the above-described inlets 13 may be used. In the present embodiment, the inlet 13 shown in FIG.

  Therefore, FIG. 2 shows a production explanatory view of an inlet substrate used for manufacturing the IC label of FIG. 1, and FIGS. 3 and 4 show process explanatory views of manufacturing the IC label according to the present invention. FIG. 2 shows an inlet substrate (16) prepared for manufacturing a continuous IC label. As shown in FIG. 2 (A), for example, a transparent resin film such as PET (which may be a paper medium) is used. An IC module 14 is formed by forming an antenna on a continuous label base 13A by printing and mounting an IC chip.

  Subsequently, as shown in FIG. 2B, for example, a double-sided pressure-sensitive adhesive sheet is attached to the IC module 14 side to form the first pressure-sensitive adhesive layer 15. Then, as shown in FIG. 2 (C), the inlet base 16 separated into pieces is manufactured by including the peripheral region 13A-1 of the IC module 14 and performing die cutting.

  Therefore, in FIGS. 3A and 4A, the second adhesive is provided on the release layer 12B side of the continuous release body 12 in which the release layer 12B is formed on the release substrate 12A such as tack paper. For example, the continuous base portion 21 of the upper paper on which the layer 22 is formed is bonded to the second adhesive layer 22 so as to face each other, and as shown in FIGS. Separation lines 23 are formed in a half cut form from both side ends in the direction to portions of a predetermined length. The predetermined length is a length of a position that covers a peripheral region (described later) of the inlet base 16 to be attached later and does not reach the IC module 14.

  Subsequently, as illustrated in FIG. 3C and FIG. 4C, the separation portion 21 </ b> C between the separation lines 23 formed on the continuum base 21 is separated. The second adhesive layer 22B of the separation part 21C is easily separated because it is adhered to the release layer 12B of the release body 12. And it will be provided in the state where continuum 21A and 21B remained on both sides of width direction of exfoliation object 12, respectively.

  Therefore, as shown in FIGS. 3D and 4D, the inlet base 16 prepared in FIG. 2 has the first adhesive layer 15 side facing the release body 12 (release layer 12B) side. The peripheral region 13A-1 is bonded onto the continuous bodies 21A and 21B, and is attached to the release layer 12B of the release body 12 via the first adhesive layer 15 at a predetermined interval. For example, the above-described inlet mounting mechanism in Patent Document 1 can be applied to the attaching step.

  Subsequently, as shown in FIGS. 3 (E) and 4 (E), the portion that becomes the inlet 13 excluding the peripheral region 13A-1 of the inlet base 16 is die-cut in a half-cut state, and a die-cut line 24 is formed. Form. Then, as shown in FIGS. 3 (F) and 4 (F), the continuums 21A and 21B are the remaining peripheral regions in which the inlet base 16 is removed from the rollers 31A and 31B shown in FIG. 4 (F). 13A-1 is separated and wound around the unnecessary body take-up unit 32 as an unnecessary body. As a result, only the inlet 13 having no unnecessary body is stuck on the release layer 12B of the release body 12.

  In this manner, the remaining unnecessary body (peripheral region 13A-1) obtained by punching the inlet 13 from the inlet base 16 can be efficiently separated and removed in-line after the punching.

  Next, FIG.5 and FIG.6 shows process explanatory drawing of the other manufacturing method in label manufacture. FIG. 5 does not represent the continuums 21A and 21B from the continuum base 21 of FIGS. 3 and 4, but a single unit on both sides in the width direction of the release body 12 as shown in FIG. A continuous body 21A, 21B is provided.

  Therefore, as shown in FIG. 5B, the inlet base 16 prepared in FIG. 2 has the first adhesive layer 15 side facing the release body 12 (release layer 12B), and the continuous body 21A, The peripheral region 13A-1 is bonded onto 21B, and is attached to the release layer 12B of the release body 12 at a predetermined interval via the first adhesive layer 15.

  Subsequently, as shown in FIG. 5 (C), a portion that becomes the inlet 13 excluding the peripheral region 13A-1 of the inlet base 16 is die-cut in a half-cut state to form a die-cut line 24. Then, as shown in FIG. 5D, the continuous bodies 21A and 21B are separated from the peeled body 12 together with the peripheral region 13A-1 of the inlet base 16 as shown in FIG. It is wound around the part 32.

  As described above, even when the continuous bodies 21A and 21B are provided individually, the remaining unnecessary body (peripheral region 13A-1) obtained by punching the inlet 13 from the inlet base 16 in the same manner as described above is used for the mold. It can be efficiently separated and removed inline after removal.

  FIG. 6 shows the reverse of the step of providing the continuums 21A and 21B in FIG. 5 and the step of applying the inlet base 16, and first, as shown in FIG. An inlet base 16 is pasted on the layer 12B with the first adhesive layer 15 facing. Subsequently, as shown in FIG. 6 (B), in correspondence with only the peripheral region 13A-1 of the inlet base 16, strip-like continuous bodies 21A are formed on both end sides on the release layer 12B in the width direction of the release body 12 respectively. , 21B are provided via the second adhesive layer 22, respectively.

  Then, as shown in FIG. 6 (C), the portion that becomes the inlet 13 excluding the peripheral region 13A-1 of the inlet base 16 is die-cut in a half-cut state to form a die-cut line 24, and FIG. 6 (D). As shown in FIG. 5, the continuous bodies 21A and 21B are separated from the peeled body 12 together with the peripheral region 13A-1 of the inlet base 16 and wound around the unnecessary body winding portion 32.

  Thus, even if the process of providing the continuous bodies 21A and 21B in FIG. 5 and the process of applying the inlet base 16 are reversed, the remaining unnecessary body (peripheral region) obtained by punching the inlet 13 from the inlet base 16 in the same manner as described above. 13A-1) can be efficiently separated and removed in-line after the die cutting.

  The IC label manufacturing method of the present invention can be used in the industry of IC label manufacturing in which an inlet is continuously formed on a peeled body as it is, and in the industry such as sales and use of the manufactured IC label.

DESCRIPTION OF SYMBOLS 11 Continuous IC label 12 Release body 12A Release base 12B Release layer 13 Inlet 13A Label base body 13A-1 Peripheral area 14 IC module 15 First adhesive layer 16 Inlet base 21 Continuous body base 21A, 21B Continuous body 22, 22A Second adhesive layer 23 Separation line 24 Die cutting line

Claims (1)

This is an IC label manufacturing method in which an inlet without a surface body on which a communicable IC module is mounted is formed at a predetermined interval via a first adhesive layer on a continuous release body on which a release layer is formed. And
An inlet base including a peripheral region of the IC module is prepared,
A strip-shaped continuous body is provided on each end side of the release layer in the width direction of the release body via a second adhesive layer, and the inlet base is bonded to the peripheral area on the continuous body. A step of being applied at a predetermined interval on the release layer of the body via the first adhesive layer;
The inlet base is pasted on the release layer of the release body at predetermined intervals via the first adhesive layer, and both ends on the release layer in the width direction of the release body corresponding to the peripheral area of each inlet base. A step in which a belt-like continuous body is provided on each side through a second adhesive layer;
Any of the process steps;
Of the affixed inlet base, a step of punching out a portion that becomes an inlet excluding the peripheral region;
Separating the continuous body together with the peripheral region of the inlet base remaining after the die cutting;
The IC label manufacturing method characterized by including.

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