JP6582784B2 - Component positioning device, component insertion device - Google Patents

Description

The present invention, parts products positioning device, and a component insertion device.

  In the electronic component insertion device described in Patent Document 1, an electronic component having a lead terminal is gripped, and the electronic component lead terminal is inserted into a hole formed in the substrate by pressing the gripped electronic component toward the substrate side. The pusher to do is described.

JP-A-10-51196

  In the electronic component insertion device described in Patent Document 1, since the pusher presses the electronic component (component) toward the substrate side, the relative position between the hole formed in the substrate and the electronic component is shifted from the reference. The lead terminal (terminal) may break without being inserted into the hole.

  An object of the present invention is to suppress damage to a terminal as compared with a case where a component is pressed toward a substrate and a terminal of the component is inserted into a hole of the substrate.

The component insertion method according to the first aspect of the present invention includes a step of positioning a penetrating member in which a penetrating portion penetrating in the vertical direction is formed above a substrate in which holes are formed, and a plurality of surfaces along one direction. A component having a formed main body portion and a terminal extending in one direction from the main body portion is dropped into the penetration portion, and at least a part of the plurality of surfaces is brought into contact with a plurality of guide surfaces constituting the penetration portion. And guiding the component while inserting the terminal into the hole.

According to a second aspect of the present invention, there is provided a substrate device manufacturing method comprising: an insertion step of inserting the terminal of the component into the hole formed in the substrate by the component insertion method according to the first aspect ; And a soldering process for soldering to a substrate.

Component positioning device according to claim 1 of the present invention is a penetrating member penetrating portion penetrating vertically is formed, the through portion, the body portion having a plurality of faces along the one direction is formed And a penetrating member configured to include a guide surface for guiding a part having a terminal extending in one direction from the main body, and a pair of guide walls formed on an upper surface of the penetrating member , A pair of guide walls having a pair of surfaces which are arranged on the same plane as each of a pair of side surfaces which constitute a part and are opposed to each other, and which are respectively connected to the pair of side surfaces, and the parts which are guided by the guide surfaces The positioning member for positioning the penetrating member above the substrate and the component supplied between the pair of guide walls are dropped into the penetrating portion so that the terminal of the pin is inserted into the hole formed in the substrate. a drop member which causes, is guided to the pair of guide walls Characterized in that it and a drop member that moves.
A component positioning device according to a second aspect of the present invention is the component positioning device according to the first aspect, wherein the component positioning device is disposed so as to straddle the pair of guide walls, and a lower end portion is fixed to the pair of guide walls. A stacking member comprising a stacking member in which the components are stacked inside and supplying a lowest-order component between the pair of guide walls, the dropping member including the lowest-order component in the stacked component It is made to move at constant speed until it falls to this penetration part.

According to a third aspect of the present invention, there is provided a component insertion device including the component positioning device according to the first or second aspect and the component positioning device configured to insert the component into which the terminal is inserted into the hole of the substrate. And a pressing member that presses the head.
A component insertion device according to a fourth aspect of the present invention is the component insertion device according to the third aspect, wherein the pressing member is disposed above the penetrating portion of the positioning device.

According to the component insertion method of the first aspect of the present invention, it is possible to suppress the damage to the terminal as compared with the case where the component is pressed toward the substrate side and the component terminal is inserted into the hole of the substrate. it can.

According to the substrate device manufacturing method of the second aspect of the present invention, it is possible to suppress an increase in the number of man-hours compared to a case where the component is pressed toward the substrate side and the terminal of the component is inserted into the hole of the substrate. Can do.

According to the component positioning apparatus of the first aspect of the present invention, it is possible to suppress damage to the terminal as compared with the case where the component is pressed toward the substrate side and the component terminal is inserted into the hole of the substrate. it can. According to the component positioning apparatus of the first aspect of the present invention, the insertion rate at which the component terminals are inserted into the holes of the board is improved as compared with the case where there is no pair of guide walls.
Further, according to the component positioning apparatus of the second aspect of the present invention, since the change in the posture of the component pushed out to the penetrating portion can be suppressed, the success rate of inserting the component terminal into the hole of the board is improved.

According to the component insertion device of the third aspect of the present invention, the component and the substrate can be reliably brought into contact with each other as compared with the case where the pressing member that presses the component to the substrate side is not used.
Further, according to the component insertion device of the fourth aspect of the present invention, handling of the board can be reduced as compared with the case where the pressing member is not disposed above the penetrating portion.

It is the perspective view which showed the component positioning device which concerns on 1st Embodiment of this invention. It is sectional drawing which showed the component positioning device which concerns on 1st Embodiment of this invention. It is the perspective view which showed the component positioning device which concerns on 1st Embodiment of this invention. It is sectional drawing which showed the component positioning device which concerns on 1st Embodiment of this invention. It is the perspective view which showed the component positioning device which concerns on 1st Embodiment of this invention. It is sectional drawing which showed the component positioning device which concerns on 1st Embodiment of this invention. It is the perspective view which showed the component positioning device which concerns on 1st Embodiment of this invention. It is sectional drawing which showed the component positioning device which concerns on 1st Embodiment of this invention. It is the perspective view which showed the component positioning device which concerns on 1st Embodiment of this invention. It is sectional drawing which showed the component positioning device which concerns on 1st Embodiment of this invention. (A) (B) It is the block diagram which showed the press apparatus with which the component insertion apparatus which concerns on 1st Embodiment of this invention was equipped. (A) (B) It is process drawing used for demonstrating the soldering process of the manufacturing method of the board | substrate apparatus which concerns on 1st Embodiment of this invention. It is the perspective view which showed the electronic component used for the manufacturing method of the board | substrate apparatus which concerns on 1st Embodiment of this invention, and a board | substrate. It is the perspective view which showed the component positioning device which concerns on 2nd Embodiment of this invention. It is the perspective view which showed the component positioning device which concerns on 2nd Embodiment of this invention. It is sectional drawing which showed the component positioning device which concerns on 2nd Embodiment of this invention. It is sectional drawing which showed the component positioning device which concerns on 2nd Embodiment of this invention. It is the perspective view which showed the component positioning device which concerns on 2nd Embodiment of this invention. It is sectional drawing which showed the component positioning device which concerns on 2nd Embodiment of this invention. It is sectional drawing which showed the component positioning device which concerns on 2nd Embodiment of this invention. It is sectional drawing which showed the component positioning device which concerns on 2nd Embodiment of this invention. It is sectional drawing which showed the component positioning device which concerns on 2nd Embodiment of this invention. It is sectional drawing which showed the component positioning device which concerns on 3rd Embodiment of this invention. It is sectional drawing which showed the component positioning device which concerns on 3rd Embodiment of this invention. It is sectional drawing which showed the component positioning device which concerns on 3rd Embodiment of this invention.

<First Embodiment>
An example of a component insertion method, a board device manufacturing method, a component positioning device, and a component insertion device according to the first embodiment of the present invention will be described with reference to FIGS. In the drawing, an arrow H indicates the vertical direction of the apparatus (vertical direction), an arrow W indicates the apparatus width direction (horizontal direction), and an arrow D indicates the depth direction of the apparatus (horizontal direction).

  The component insertion device 10 (see FIG. 1) is a device for manufacturing the board device 150 (see FIG. 12B). Specifically, a lead terminal 114 as an example of a terminal formed in the electronic component 110 is inserted into a through hole 100A as an example of a hole formed in the substrate 100 (see FIG. 13), and the lead terminal 114 is inserted. In this device, the electronic component 110 is pressed toward the substrate 100.

  First, the board | substrate 100 and the electronic component 110 are demonstrated, and the component insertion apparatus 10 is demonstrated after that.

(substrate)
The substrate 100 has wiring with a metal pattern (not shown), has a thickness of 1.2 [mm], and has a rectangular outer shape as shown in FIG. The substrate 100 is formed with the six through holes 100A described above. Specifically, a pair of through-holes 100A arranged in the apparatus depth direction are arranged at an interval in the apparatus width direction at the front side (left side in the drawing) of the substrate 100 in the apparatus depth direction. In the first embodiment, the through hole 100A has a hole diameter of 0.7 [mm]. Note that the direction used in describing the substrate 100 is the direction in which the substrate 100 is set in the component insertion device 10 (see FIG. 3).

  In addition, circular through holes 100B into which stepped pins 24 described later are inserted are formed in the four corners of the substrate 100, respectively.

  Furthermore, three positioning holes 100 </ b> C used for positioning the substrate 100 with respect to a penetrating member 30 described later are formed in the substrate 100. Two positioning holes 100C are formed on both sides in the apparatus width direction on the near side (left side in the drawing) of the substrate 100 in the apparatus depth direction. Furthermore, one positioning hole 100C is formed in a central portion in the apparatus width direction on the back side (right side in the drawing) of the substrate 100 in the apparatus depth direction.

(Electronic parts)
The electronic component 110 is an example of a component and is mounted on the substrate 100. As shown in FIG. 13, the electronic component 110 includes a main body 112 that is a rectangular parallelepiped, and lead terminals 114 that extend from the main body 112.

The main body 112 has six surfaces. In concrete terms, the main body portion 112, temporarily placed state of component insertion apparatus 10 state lead terminals 114 into the through-hole 100A of the substrate 100 which is set in (see FIG. 3) is inserted (hereinafter, "electronic components 110 ]), A bottom surface 112A facing the substrate 100 and a top surface 112B positioned on the opposite side of the bottom surface 112A are formed. Further, with the electronic component 110 temporarily placed, the main body 112 has a pair of side surfaces 112C facing the apparatus width direction, a front surface 112D facing the front side in the apparatus depth direction, and a back surface 112E facing the back side in the apparatus depth direction. And are formed. Then, with the electronic component 110 temporarily placed, the pair of side surfaces 112C, the front surface 112D, and the back surface 112E are along the vertical direction (one direction) of the apparatus. As described above, the pair of side surfaces 112C, the front surface 112D, and the back surface 112E are examples of surfaces along one direction.

  In the first embodiment, the width dimension (L1 in the drawing) of the main body 112 is 66.5 [mm], the height dimension (L2 in the drawing) is 8.0 [mm], and the depth dimension. (L3 in the figure) is 15.3 [mm].

  Further, six lead terminals 114 described above extend from the bottom surface 112 </ b> A of the main body 112. Specifically, in a temporarily placed state of the electronic component 110, the six lead terminals 114 extend downward from the bottom surface 112A of the main body 112 to the vertical direction (one direction) of the apparatus. The relative positional relationship between the respective lead terminals 114 is the same as the relative positional relationship between the respective through holes 100A.

  In the first embodiment, the lead terminal 114 has an outer diameter of 0.3 [mm] and a length of 3 [mm]. Furthermore, as shown in the enlarged view of FIG. 10, the tip of the lead terminal 114 is inclined with respect to the extending direction of the lead terminal 114 and is tapered.

(Parts insertion device)
The component insertion device 10 includes a component positioning device 12 (see FIG. 1) and a pressing device 14 (see FIG. 11A) as an example of a pressing member.

[Part positioning device]
As shown in FIG. 1, the component positioning device 12 includes a mounting table 20 on which a substrate 100 (see FIG. 13) is placed, and a penetrating member 30 in which a penetrating portion 32 penetrating in the vertical direction is formed. Further, the component positioning device 12 includes a dropping member 40 that drops the electronic component 110 onto the penetrating portion 32, and a moving device 50 that moves the penetrating member 30 and the dropping member 40.

[Mounting table]
The mounting table 20 has a rectangular shape when viewed from above, and the mounting table 20 has a mounting surface 20A facing upward. Further, columnar guide members 22 extending upward are arranged on the four corner sides of the mounting surface 20A.

  Further, stepped pins 24 are arranged on the four corner sides of the mounting surface 20 </ b> A and inside the guide member 22, respectively. The relative positional relationship between the respective stepped pins 24 is the same as the relative positional relationship between the respective through holes 100 </ b> B (see FIG. 13) formed in the substrate 100.

  In this configuration, an operator (not shown) inserts the stepped pin 24 into the through hole 100B formed in the substrate 100, and the substrate 100 is placed on the mounting table 20 as shown in FIGS. It is supposed to be. In this state, as shown in FIG. 4, the edge of the through hole 100 </ b> B in the substrate 100 hits the stepped portion 24 </ b> A of the stepped pin 24 so that the substrate 100 and the mounting surface 20 </ b> A of the mounting table 20 are separated from each other. It has become. Further, the outer diameter of the through hole 100B is made larger than the outer diameter of the small diameter portion of the stepped pin 24, and the substrate 100 is inserted in the depth direction of the apparatus with the stepped pin 24 inserted into the through hole 100B. And it is movable within a predetermined range in the apparatus width direction.

[Penetration member]
As shown in FIG. 1, the penetrating member 30 is disposed above the mounting table 20, and the penetrating member 30 has a rectangular shape similar to that of the mounting table 20 as viewed from above. The penetrating member 30 is formed with an upper surface 30A facing upward and a lower surface 30B facing downward, and the thickness of the penetrating member 30 is constant.

  Further, through holes 30 </ b> C penetrating the front and back of the penetrating member 30 are formed at the four corners of the penetrating member 30, and the above-described guide members 22 are inserted into the respective through holes 30 </ b> C. As a result, the penetrating member 30 can move up and down while maintaining its posture.

  Further, as described above, the penetrating member 30 is formed with the penetrating portion 32 penetrating the front and back of the penetrating member 30 in the vertical direction.

  The penetrating portion 32 is formed to extend in the apparatus width direction, and the penetrating member 30 is formed with an opening portion 34 that opens a central portion of the penetrating portion 32 in the apparatus width direction to the near side in the apparatus depth direction. Has been.

  And the penetration part 32 is comprised from the several surface. Specifically, the penetrating portion 32 includes a pair of side surfaces 32A, a front surface 32B, a rear surface 32C, and an auxiliary surface 32D (see FIG. 2).

  The pair of side surfaces 32 </ b> A face each other in the apparatus width direction and are formed perpendicular to the upper surface 30 </ b> A of the penetrating member 30. The distance between the pair of side surfaces 32A (L4 in the figure) is 66.8 [mm] in the present embodiment.

  The front surface 32 </ b> B is connected to the front edge of the pair of side surfaces 32 </ b> A in the apparatus depth direction and faces the back side in the apparatus depth direction, and is divided by the opening portion 34. The front surface 32 </ b> B is perpendicular to the upper surface 30 </ b> A of the penetrating member 30.

  Further, the rear surface 32C is connected to the edge of the pair of side surfaces 32A in the apparatus depth direction, and as shown in FIG. 2, is inclined with respect to the apparatus vertical direction when viewed from the apparatus width direction. Further, an auxiliary surface 32D facing the front side in the apparatus depth direction is connected to the lower end side edge of the rear surface 32C. The auxiliary surface 32 </ b> D is perpendicular to the upper surface 30 </ b> A of the penetrating member 30. The pair of side surfaces 32 </ b> A, the front surface 32 </ b> B, and the auxiliary surface 32 </ b> D are examples of guide surfaces that guide the electronic component 110.

  In the first embodiment, the height of the penetrating part 32 (L5 in the figure) is 22.0 [mm], and the inlet width (L6 in the figure) of the penetrating part 32 in the apparatus depth direction is 22.3 [L]. mm], and the outlet width (L7 in the figure) of the penetration portion 32 in the apparatus depth direction is 15.5 [mm].

[Falling member]
As shown in FIG. 1, the dropping member 40 is placed on the upper surface 30 </ b> A of the penetrating member 30, and is disposed on the far side in the apparatus depth direction with respect to the penetrating portion 32. The dropping member 40 includes a main body 40A having a rectangular cross section extending in the apparatus width direction, and a pair of protrusions 40B protruding from the both ends of the main body 40A in the apparatus width direction toward the front side in the apparatus depth direction. have. Opposing surfaces facing each other in the pair of protruding portions 40 </ b> B are located on the same surface as the pair of side surfaces 32 </ b> A of the through portion 32.

  With this configuration, in a state where the dropping member 40 is in a retracted position, which will be described later, as shown in FIGS. 3 and 4, the operator can make the bottom surface 112A of the electronic component 110 face the near side in the apparatus depth direction. The electronic component 110 is arranged between the pair of protrusions 40B. Then, the operator abuts the top surface 112B of the electronic component 110 against the main body portion 40A, and further abuts one side surface 112C of the electronic component 110 against the one protrusion portion 40B. Thereby, the electronic component 110 is set on the dropping member 40.

[Moving device]
As shown in FIG. 1, the moving device 50 is disposed on the outer side in the device width direction with respect to the mounting table 20 and the penetrating member 30. The moving device 50 includes a lever 52 and a link box 54 in which a link mechanism (not shown) that operates by tilting the lever 52 is disposed.

  The link mechanism disposed inside the link box 54 and the penetrating member 30 are connected via a connecting member (not shown), and the link mechanism disposed inside the link box 54 and the dropping member 40 are connected to the apparatus width. It is connected via a connecting member 56 extending in the direction.

  In this configuration, the lever 52 is disposed at the initial position so as to extend in the vertical direction of the apparatus by the elastic force of an elastic member (not shown) in a free state where no force is applied.

  In the state where the lever 52 is disposed at the initial position, the penetrating member 30 is disposed at a separated position away from the mounting table 20 in the vertical direction of the apparatus, as shown in FIGS. In the depth direction of the apparatus, it is disposed at a retreat position where it is retreated with a large distance from the penetrating portion 32.

  Further, when the operator rotates the lever 52, the penetrating member 30 moves downward in the vertical direction of the apparatus, and as shown in FIGS. 5 and 6, a proximity position close to the mounting table 20 in the vertical direction of the apparatus. To move to.

  Furthermore, when the operator rotates the lever 52, the dropping member 40 moves to the near side in the apparatus depth direction with the penetrating member 30 disposed at the close position. Then, as shown in FIGS. 7 and 8, the electronic component 110 set on the dropping member 40 is moved to an extrusion position where the electronic component 110 is pushed out to the through portion 32.

[Others]
Next, the positioning pin 60 as an example of a positioning member used for positioning the substrate 100 with respect to the penetrating member 30 will be described.

  Three positioning pins 60 are provided, and are attached to the lower surface 30B of the penetrating member 30 as shown in FIGS.

  Specifically, two positioning pins 60 are attached to both sides in the apparatus width direction on the near side (left side in the figure) in the apparatus depth direction on the lower surface 30B of the penetrating member 30. Further, one positioning pin 60 is attached to the center side in the apparatus width direction on the back side (right side in the drawing) in the apparatus depth direction on the lower surface 30B of the penetrating member 30. The relative positional relationship between the positioning pins 60 is the same as the relative positional relationship between the positioning holes 100 </ b> C (see FIG. 13) formed in the substrate 100.

  As shown in FIG. 2, each positioning pin 60 includes a columnar portion 60A that protrudes downward from the lower surface 30B of the penetrating member 30, and a conical portion 60B that is fixed to the tip (lower end) of the columnar portion 60A. Have. The maximum diameter of the conical portion 60B is made smaller than the diameter of the cylindrical portion 60A, and the positioning pin 60 is stepped. Further, the diameter of the circle constituting the bottom surface of the conical portion 60B is the same as the diameter of the positioning hole 100C (see FIG. 13) formed in the substrate 100.

In this configuration, when the penetrating member 30 is moved from the separated position to the adjacent position, the positioning pin 60 is the substrate 100 on which the tip of the positioning pin 60 is placed on the mounting table 20, as shown in FIGS. Is inserted into the positioning hole 100C. And the lower end of 60 A of cylindrical parts and the board | substrate 100 come into contact. Accordingly, the substrate 100 is positioned with respect to the penetrating member 30 by moving the substrate 100 so that the center of the positioning hole 100C is positioned at the center of the positioning pin 60. In other words, the positioning pin 60 positions the penetrating member 30 above the substrate 100.

  When the electronic component 110 is dropped into the through portion 32 with the bottom surface 112A facing downward in the state where the substrate 100 is positioned in this way, the lead terminal 114 of the electronic component 110 is inserted into the through hole 100A of the substrate 100. (Details will be described later).

  As described above, in a state where the stepped pin 24 is inserted into the through hole 100B formed in the substrate 100, the substrate 100 can move within a predetermined range in the apparatus depth direction and the apparatus width direction. Has been. Accordingly, the substrate 100 is moved so that the center of the positioning hole 100C is positioned at the pin center of the positioning pin 60.

[Pressing device]
The pressing device 14 is a device that presses the electronic component 110 in which at least the tip side of the lead terminal 114 is inserted into the through hole 100A formed in the substrate 100 toward the substrate 100 side.

  The pressing device 14 is a so-called power cylinder, and as shown in FIG. 11A, a main body portion 14A extending in the vertical direction of the device, and an electronic device disposed below the pressing device 14 from the lower end portion of the main body portion 14A. And a pressing portion 14 </ b> B that moves toward the component 110.

  In this configuration, the pressing portion 14B has a standby position (see FIG. 11A) separated from the electronic component 110 disposed below the pressing device 14 and the electronic component 110 disposed below the pressing device 14 as a substrate. It moves to the pressing position (refer FIG. 11 (B)) pressed toward the 100 side. Thereby, when the front end side of the lead terminal 114 of the electronic component 110 is inserted into the through hole 100A, but the bottom surface 112A of the electronic component 110 and the substrate 100 are not in surface contact, the bottom surface 112A and the substrate 100 are in surface contact. It is supposed to let you.

(Function)
Next, the component insertion method for inserting the lead terminal 114 of the electronic component 110 into the through hole 100A of the substrate 100 using the component insertion device 10 and the substrate device by mounting the electronic component 110 on the substrate 100 using the component insertion method. A method for manufacturing a substrate device for manufacturing 150 will be described.

  In a state in which the manufacture of the board device 150 is started, the lever 52 of the component positioning device 12 is disposed at the initial position, the penetrating member 30 is disposed at the separated position, and the dropping member 40 is shown in FIGS. Is disposed at the retracted position. Further, the pressing portion 14B of the pressing device 14 is disposed at the standby position as shown in FIG.

  In this state, the operator inserts the stepped pin 24 into the through hole 100 </ b> B formed in the substrate 100 as shown in FIGS. 3 and 4. As a result, the substrate 100 is placed on the mounting table 20.

  Furthermore, the operator arranges the electronic component 110 between the pair of protrusions 40B so that the bottom surface 112A of the electronic component 110 faces the front side in the apparatus depth direction. Then, the worker abuts the top surface 112B of the electronic component 110 against the main body portion 40A, and further abuts one side surface 112C of the electronic component 110 against the one protrusion portion 40B. Thereby, the electronic component 110 is set on the dropping member 40.

  Next, the operator rotates the lever 52 as shown in FIGS. Then, the penetrating member 30 arranged at the separated position moves to the close position. When the penetrating member 30 moves to the proximity position, the substrate 100 moves so that the center of the positioning hole 100C is located at the pin center of the positioning pin 60. Thereby, the board | substrate 100 is positioned with respect to the penetration member 30 (1st process).

  Next, the operator further rotates the lever 52 as shown in FIGS. Then, the dropping member 40 arranged at the retracted position moves to the pushing position. As a result, as shown in FIGS. 9 and 10, the electronic component 110 set on the dropping member 40 is pushed out by the penetrating portion 32 and jumps out and falls in the penetrating portion 32.

Specifically, the electronic component 110 falls in the penetrating part 32 while drawing a parabola while rotating so that the bottom surface 112A faces downward. When the electronic component 110 falls, the pair of side surfaces 112C (see FIG. 13) of the electronic component 110 are guided by the pair of side surfaces 32A (see FIG. 1) constituting the penetrating portion 32, thereby penetrating. The position of the electronic component 110 in the apparatus width direction with respect to the portion 32 is restricted. Further, the front part 112D and the rear face 112E (see FIG. 13 ) of the electronic component 110 are guided by the front face 32B and the auxiliary face 32D (see FIG. 2) constituting the penetration part 32, so that the electronic part 110 with respect to the penetration part 32 is obtained. The position of the device in the depth direction is restricted. In other words, the electronic component 110 is brought into contact with at least a part of the pair of side surfaces 112C, the front surface 112D, and the back surface 112E of the electronic component 110 with the pair of side surfaces 32A, the front surface 32B, and the auxiliary surface 32D constituting the penetrating portion 32. The position in the apparatus width direction and the apparatus depth direction are regulated. The length of the auxiliary surface 32D in the vertical direction is determined so that the main body 112 contacts the auxiliary surface 32D before the lead terminal 114 is inserted into the through hole 100A of the substrate 100.

  Thereby, the device width direction of the electronic component 110 and the position of the device depth are regulated, so that the lead terminal 114 of the electronic component 110 is inserted into the through hole 100A of the substrate 100 (second step).

  Thus, the insertion process of inserting the lead terminal 114 of the electronic component 110 into the through hole 100A of the substrate 100 includes the first process and the second process described above.

  Next, the operator releases the force applied to the lever 52. Thereby, the lever 52 moves to the initial position, the penetrating member 30 moves to the separated position, and the dropping member 40 moves to the retracted position (see FIG. 1).

  Next, as shown in FIG. 11A, the worker arranges the substrate 100 in a state where the lead terminals 114 of the electronic component 110 are inserted into the through holes 100 </ b> A below the pressing device 14. At this time, the electronic component 110 is positioned below the pressing device 14.

  And an operator moves the press part 14B arrange | positioned in a standby position to a press position as FIG. 11 (A) (B) shows. Accordingly, the pressing device 14 presses the electronic component 110 toward the substrate 100 (pressing process).

  In this way, even when the leading end side of the lead terminal 114 of the electronic component 110 is inserted into the through hole 100A and the bottom surface 112A of the electronic component 110 and the substrate 100 are not in surface contact, the bottom surface 112A and the substrate 100 are in surface contact. To do.

  Next, the operator moves the pressing portion 14B to the retracted position.

  Next, as shown in FIG. 12A, the worker solders the lead terminal 114 of the electronic component 110 to the back surface (lower surface in the figure) side of the substrate 100 by, for example, flow soldering. As shown in FIG. 12B, the solder goes up through the through hole 100A (so-called solder up) and solidifies (soldering process). In this way, the substrate device 150 is manufactured.

(Summary)
As described above, in the component insertion method, the electronic component 110 is guided by dropping the electronic component 110 toward the substrate 100, and the lead terminal 114 of the electronic component 110 is inserted into the through hole 100 </ b> A of the substrate 100. For example, since the electronic component 110 is not pressed against the substrate 100 when the lead terminal 114 and the through hole are not aligned with each other, the lead terminal 114 is prevented from being damaged. In other words, damage to the lead terminal 114 is suppressed as compared with the case where the electronic component is pressed toward the substrate side and the lead terminal of the electronic component is inserted into the through hole of the substrate.

  Further, in the manufacturing method of the substrate device, for example, when there is an inspection process after the soldering process, it is discovered in this inspection process that the lead terminal 114 in a damaged state is soldered. However, as described above, the damage to the lead terminal 114 is suppressed, and soldering of the lead terminal 114 in a damaged state is also suppressed. Thereby, compared with the case where an electronic component is pressed to the board | substrate side and the lead terminal of an electronic component is inserted in the through hole of a board | substrate, the increase in a correction man-hour is suppressed.

  In the component positioning device 12, the board 100 is positioned with respect to the penetrating member 30 by using the positioning stepped pins 60. In other words, the penetrating member 30 is positioned above the substrate 100. As a result, the lead terminals 114 are inserted into the through holes 100A more efficiently than when the penetrating member 30 is not positioned above the substrate 100. Further, the lead terminal 114 is efficiently inserted into the through hole 100A, thereby preventing the lead terminal 114 from being damaged.

  Further, in the component insertion device 10, the pressing device 14 presses the electronic component 110 into which at least the distal end side of the lead terminal 114 is inserted toward the substrate 100 side. Thereby, when the front end side of the lead terminal 114 of the electronic component 110 is inserted into the through hole 100A, but the bottom surface 112A of the electronic component 110 and the substrate 100 are not in surface contact with each other, the bottom surface 112A and the substrate 100 are surely connected. Surface contact.

Second Embodiment
An example of a component insertion method, a board device manufacturing method, a component positioning device, and a component insertion device according to a second embodiment of the present invention will be described with reference to FIGS. In addition, about the same member as 1st Embodiment, the same code | symbol is attached | subjected, the description is abbreviate | omitted, and a different part from 1st Embodiment is mainly demonstrated.

(Parts insertion device)
The component insertion device 210 includes a component positioning device 212 (see FIG. 14) and a pressing device 14 (see FIG. 11A).

[Part positioning device]
As shown in FIG. 14, the component positioning device 212 includes a mounting table 20 on which a substrate 100 (see FIG. 15) is placed, and a penetrating member 230 in which a penetrating portion 32 penetrating in the vertical direction is formed. Further, the component positioning device 212 includes a dropping unit 240 that drops the electronic component 110 (see FIG. 15) on the penetrating portion 32, a moving device 250 that moves the penetrating member 230, and a stacking member 270 on which the electronic component 110 is loaded. It has.

[Penetration member]
The penetrating member 230 is disposed above the mounting table 20 and has a rectangular shape when viewed from above. The penetrating member 230 has an upper surface 230A facing upward and a lower surface 230B facing downward, and the thickness of the penetrating member 230 is the same.

Further, a pair of guide walls 236 for guiding the movement of the dropping member 242 described later in the apparatus depth direction is formed on the upper surface 230A. The pair of guide walls 236 are arranged at an interval in the apparatus width direction and extend from the front surface 32 </ b> B of the penetrating portion 32 to the back side in the apparatus depth direction. Further, each guide wall 236 is formed with a guide surface 236A disposed on the same surface as the pair of side surfaces 32A constituting the penetrating portion 32. The side surface 32A and the guide surface 236A are connected. Further, the height dimension (H1 in the figure) of the guide wall 236 is the same as the depth dimension (L3 in FIG. 13) of the electronic component 110, and is 15.3 [mm].

[Fall unit]
As shown in FIGS. 14 and 16, the dropping unit 240 is placed on the upper surface 230 </ b> A of the penetrating member 230, and is disposed on the far side in the apparatus depth direction with respect to the penetrating portion 32. The dropping unit 240 includes a dropping member 242 that drops an electronic component 110 supplied from a stacking member 270 described later, and an electric actuator 246 that moves the dropping member 242 in the depth direction of the apparatus (hereinafter referred to as “actuator 246”). ing.

  The dropping member 242 extends in the apparatus width direction and has a rectangular cross section. In addition, the pair of end surfaces 242A facing the outside in the apparatus width direction in the dropping member 242 are opposed to or in contact with the guide surface 236A of the guide wall 236, respectively. Thereby, the dropping member 242 is guided by the pair of guide walls 236 and moves in the depth direction of the apparatus while maintaining the posture. The height dimension (H2 in FIG. 14) of the dropping member 242 is 15.3 [mm], which is the same as the depth dimension (L3 in FIG. 13) of the electronic component 110.

  The actuator 246 is disposed on the far side in the apparatus depth direction with respect to the dropping member 242. The actuator 246 includes a main body 246A that is fixed to the upper surface 230A of the penetrating member 230, and a rod 242B that extends from the main body 246A toward the dropping member 242 and has a distal end fixed to the dropping member 242. Yes.

  In this configuration, when the actuator 246 is in the OFF state, as shown in FIGS. 15 and 17, the dropping member 242 is disposed at a retracted position where the dropping member 242 is retracted greatly away from the penetrating portion 32 in the apparatus depth direction. An electronic component 110 supplied from a stacking member 270 described later is disposed on the upper surface 230A on the near side in the apparatus depth direction of the dropping member 242 disposed at the retracted position. On the other hand, when the actuator 246 is turned on from the off state, the rod 242B extends, and the dropping member 242 moves toward the penetrating portion 32 toward the near side in the apparatus depth direction. Then, the dropping member 242 arranged at the retracted position passes through an extrusion position (see FIG. 20) for pushing the electronic component 110 into the penetrating portion 32, and reaches the edge 320 on the far side in the apparatus depth direction at the penetrating portion 32. It stops at the stop position reached (see FIG. 21). Further, when the actuator 246 is turned off, the dropping member 242 at the stop position moves to the retracted position.

  Here, the pushing position is a position where the center of gravity G of the electronic component 110 and the edge 320 of the penetrating part 32 overlap in the vertical direction of the apparatus (see FIG. 20). The speed at which the drop unit 240 moves the electronic component 110 will be described in the operation described later.

[Moving device]
As shown in FIG. 14, the moving device 250 is disposed on the outer side in the device width direction with respect to the mounting table 20 and the penetrating member 230. The moving device 250 includes a lever 252 and a link box 254 in which a link mechanism (not shown) that operates by tilting the lever 252 is disposed.

  The link mechanism disposed inside the link box 254 and the penetrating member 230 are connected via a connecting member 256.

  In this configuration, the lever 252 is disposed at an initial position (see FIG. 14) extending in the vertical direction of the apparatus by the elastic force of an elastic member (not shown) in a free state where no force is applied.

  In the state where the lever 252 is disposed at the initial position, the penetrating member 230 is disposed at a separated position away from the mounting table 20 in the vertical direction of the apparatus, as shown in FIGS.

  When the operator rotates the lever 252, the penetrating member 230 moves downward in the vertical direction of the apparatus, and as shown in FIGS. 18 and 19, the proximity position close to the mounting table 20 in the vertical direction of the apparatus. To move to.

[Loading material]
As shown in FIG. 14, the stacking member 270 is formed by bending a steel plate, and when viewed from above, the stacking member 270 has a C shape in which the front side in the apparatus depth direction is opened and flanges are formed at both ends. Further, as shown in FIGS. 14 and 16, the stacking member 270 is disposed so as to straddle the pair of guide walls 236 on the near side in the apparatus depth direction with respect to the dropping member 242 disposed at the retracted position. ing. The lower end portion of the stacking member 270 is fixed to the pair of guide walls 236.

  In this configuration, as shown in FIGS. 15 and 17, the plurality of electronic components 110 are stocked inside the stacking member 270 such that the bottom surface 112 </ b> A of the electronic components 110 faces the front side in the apparatus depth direction. It has become. The electronic components 110 are stacked on the upper surface 230 </ b> A, and the lowest electronic component 110 is supplied between the pair of guide walls 236.

  Further, the moving distance (L8 in FIG. 20) of the electronic component 110 from when the electronic component 110 is pushed by the dropping member 242 and separated from the stacked electronic components 110 to when the dropping member 242 reaches the pushing position is L The height of the component 110 is set to be equal to or larger than the height dimension (L2 in FIG. 20).

(Function)
Next, a component insertion method for inserting the lead terminal 114 of the electronic component 110 into the through hole 100A of the substrate 100 using the component positioning device 212 will be described.

  In the non-operating state of the component positioning device 212, as shown in FIG. 14, the lever 52 of the component positioning device 212 is disposed in the initial position, and the penetrating member 230 is disposed in the separated position. Further, the actuator 246 is turned off, and the dropping member 242 is disposed at the retracted position.

  In this state, the worker stacks the plurality of electronic components 110 inside the stacking member 270 as shown in FIGS. 15 and 17. Thereby, the lowest electronic component 110 is supplied between the pair of guide walls 236.

  Next, the operator inserts the stepped pin 24 into the through hole 100 </ b> B formed in the substrate 100 and sets the substrate 100 on the mounting table 20.

  Next, the operator rotates the lever 252 as shown in FIGS. Then, the penetrating member 230 arranged at the separated position moves to the close position. As the penetrating member 230 moves to the proximity position, the substrate 100 moves so that the center of the positioning hole 100C is located at the pin center of the positioning pin 60. Thereby, the board | substrate 100 is positioned with respect to the penetration member 230 (1st process).

  Next, the operator turns on the actuator 246 while rotating the lever 252. Then, as shown in FIGS. 19, 20, and 21, the dropping member 242 disposed at the retracted position passes through the pushing position (see FIG. 20) and stops at the stop position (see FIG. 21). . Thereby, the electronic component 110 supplied between the pair of guide walls 236 is moved by being pushed by the dropping member 242, and when the dropping member 242 reaches the pushing position, the electronic component 110 is pushed out by the penetrating portion 32 and jumps out. The inside of the penetration part 32 falls. Then, the lead terminal 114 of the dropped electronic component 110 is inserted into the through hole 100A of the substrate 100 (second process).

  Here, the electronic component 110 is moving at a constant speed from when the electronic component 110 pushed by the dropping member 242 is separated from the stacked electronic component 110 until the dropping member 242 reaches the pushing position. In this embodiment, this moving speed is set to 30 [mm / s] or more and 50 [mm / s] or less as an example.

  Next, the operator turns off the actuator 246. Then, as shown in FIG. 22, the dropping member 242 at the stop position moves to the retracted position. As the dropping member 242 moves to the retracted position, the lowest-order electronic component 110 stacked inside the stacking member 270 moves downward from within the stacking member 270 due to gravity, and between the pair of guide walls 236. Supplied.

  Next, the worker releases the force applied to the lever 252. Thereby, the lever 252 moves to the initial position, and the penetrating member 230 moves to the separated position (see FIG. 14). In this way, the lead terminal 114 of the electronic component 110 is inserted into the through hole 100A of the substrate 100.

(Summary)
As described above, the pair of guide walls 236 are formed on the upper surface 230 of the penetrating member 230. Each guide wall 236 is formed with a guide surface 236A disposed on the same plane as the pair of side surfaces 32A constituting the penetrating portion 32, and the side surface 32A and the guide surface 236A are connected to each other. For this reason, when the electronic component 110 is pushed out to the penetration part 32, the electronic component 110 is not caught by the edge of 32 A of side surfaces. Thereby, compared with the case where the guide surface 236A connected to the side surface 32A is not formed, the change in the posture of the electronic component 110 pushed out to the through portion 32 is suppressed.

  In addition, since the change in the posture of the electronic component 110 is suppressed, the lead terminal 114 of the electronic component 110 is inserted into the through hole 100A of the substrate 100 as compared with the case where the guide surface 236A connected to the side surface 32A is not formed. The success rate will be improved.

  In addition, the electronic component 110 moves at a constant speed from when the electronic component 110 pushed by the dropping member 242 is separated from the stacked electronic component 110 until the dropping member 242 reaches the pushing position. For this reason, compared with the case where the dropping member 40 is moved by rotating the lever 52 as in the first embodiment, the moving speed of the dropping member 242 is stabilized, and the posture of the electronic component 110 pushed out to the penetrating portion 32. The change of is suppressed.

  In addition, since the change in the posture of the electronic component 110 is suppressed, the lead terminal 114 of the electronic component 110 can be compared with the case where the dropping member 40 is moved by rotating the lever 52 as in the first embodiment. The success rate of inserting into the through hole 100A of the substrate 100 is improved.

In addition, since a plurality of electronic components 110 are stacked inside the stacking member 270, the trouble of setting the electronic components 110 each time is saved.
Other operations are the same as those in the first embodiment.

<Third Embodiment>
An example of a component insertion method, a board device manufacturing method, a component positioning device, and a component insertion device according to a third embodiment of the present invention will be described with reference to FIGS. In addition, about the same member as 2nd Embodiment, the same code | symbol is attached | subjected, the description is abbreviate | omitted, and a different part from 2nd Embodiment is mainly demonstrated.

(Electronic parts)
The electronic component 310 used in the component positioning device 322 according to the third embodiment is an example of a component and is mounted on the substrate 100. As shown in FIG. 23, a protrusion 314 is formed on the bottom surface 312A side of the front surface 312D of the electronic component 310. In addition, a recess 316 is formed in a portion of the back surface 312E of the electronic component 310 on the bottom surface 312A side. Further, the width dimension of the protrusion 314 (the dimension in the apparatus depth direction in the figure) and the width dimension of the recess 316 are the same. The protrusion amount of the protrusion 314 is larger than the recess amount of the recess 316. As a result, a gap 318 is formed between the stacked electronic components 310 where the depth side in the apparatus depth direction is open.

(Falling member)
The dropping member 342 is formed with a thin plate-like protruding portion 342A that protrudes from the upper surface of the dropping member 342 toward the front side in the apparatus depth direction. Further, the tip side of the overhang portion 342A is tapered. When the dropping member 342 is disposed at the retracted position, the protruding portion 342A of the dropping member 342 and the electronic component 310 are separated from each other in the apparatus depth direction.

  In this configuration, as shown in FIGS. 23, 24, and 25, when the dropping member 342 arranged at the retracted position moves toward the pushing position (see FIG. 25), the overhang portion 342 </ b> A is , And enter the gap 318. The overhanging portion 342A lifts the upper electronic component 310 with respect to the lowest electronic component 310.

  Accordingly, the posture of the moving electronic component 310 is changed by the frictional force generated between the lowest electronic component 310 and the upper electronic component 310 as compared with the case where the upper electronic component 310 cannot be lifted. To be suppressed.

In addition, since the change in the posture of the moving electronic component 310 is suppressed, the lead terminal 114 of the electronic component 310 is placed in the through hole 100A of the substrate 100 as compared with the case where the upper electronic component 310 cannot be lifted. Insertion success rate is improved.
Other operations are the same as in the second embodiment.

  Although the present invention has been described in detail with respect to specific embodiments, the present invention is not limited to such embodiments, and various other embodiments can be taken within the scope of the present invention. This will be apparent to those skilled in the art. For example, in the above-described embodiment, the lead terminals 114 of one electronic component 110 are inserted into the through hole 100A formed in the substrate 100 using the component insertion devices 10 and 210, but the dropping members 40, 242, 342, and By using a plurality of through portions 32, lead terminals of a plurality of electronic components may be inserted into through holes formed in the substrate.

  In addition, although each process was demonstrated in said 1st Embodiment, this process is a process performed continuously (sequentially) by rotating the lever 52. FIG.

  Although not particularly described in the first, second, and third embodiments, the pressing device 14 may be disposed above the penetrating portion 32. Thereby, the handling of the substrate 100 is reduced.

DESCRIPTION OF SYMBOLS 10 Component insertion apparatus 12 Component positioning apparatus 14 Press apparatus (an example of a press member)
30 penetration member 32 penetration part 32A side (an example of a guide surface)
32B front (example of guide surface)
32D auxiliary surface (example of guide surface)
40 Dropping member 60 Stepped pin (an example of a positioning member)
100 Substrate 100A Through hole (an example of hole)
110 Electronic parts (an example of parts)
112 Main Body 112C Side (Example of surface)
112D front (example of surface)
112E back (example of surface)
114 Lead terminal (an example of terminal)
150 board device 210 component insertion device 212 component positioning device 230 penetrating member 242 dropping member 310 electronic component (an example of a component)
322 Component positioning device 342 Dropping member

Claims (4)

A penetrating member in which a penetrating portion penetrating in the vertical direction is formed, the penetrating portion having a main body portion on which a plurality of surfaces along one direction are formed and a terminal extending from the main body portion in the one direction. A penetrating member configured to include a guide surface for guiding parts;
A pair of guide walls formed on the upper surface of the penetrating member, which are part of the guide surface and are disposed on the same plane as the pair of side surfaces facing each other, and are connected to the pair of side surfaces, respectively. A pair of guide walls having a pair of surfaces;
A positioning member for positioning the penetrating member above the substrate such that the terminal of the component guided by the guide surface is inserted into a hole formed in the substrate;
A dropping member for dropping the component supplied between the pair of guide walls to the penetrating portion , the dropping member moving while being guided by the pair of guide walls ;
A component positioning device comprising: The stacking member is arranged to straddle the pair of guide walls, and the lower end portion is fixed to the pair of guide walls, the components are stacked inside, and the lowest component is placed on the pair of guide walls. With loading members to feed in between
The dropping member moves the lowermost part at a constant speed from the time when it is separated from the stacked parts to the time when it is dropped to the penetration part.
The component positioning apparatus according to claim 1. The component positioning device according to claim 1 or 2 ,
A pressing member that presses the component with the terminal inserted into the hole of the substrate toward the substrate by the component positioning device;
A component insertion device comprising: The pressing member is disposed above the penetrating portion of the positioning device.
The component insertion device according to claim 3.

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