JP6583446B2 - Vapor deposition mask and organic semiconductor device manufacturing method - Google Patents

Description

  The present invention relates to a vapor deposition mask and a method for manufacturing an organic semiconductor element.

  With the increase in size of products using organic EL elements or the increase in substrate size, there is an increasing demand for increasing the size of vapor deposition masks. And the metal plate used for manufacture of the vapor deposition mask comprised from a metal is also enlarged. However, with the current metal processing technology, it is difficult to accurately form a slit in a large metal plate, and it is not possible to cope with the high definition of the slit. Further, in the case of a vapor deposition mask made of only metal, the mass increases with an increase in size, and the total mass including the frame also increases, resulting in trouble in handling.

  Under such circumstances, Patent Document 1 is laminated with a metal mask provided with slits and a resin mask in which openings corresponding to a pattern to be deposited and formed on the surface of the metal mask are arranged in multiple rows vertically and horizontally. A vapor deposition mask is proposed. According to the vapor deposition mask proposed in Patent Document 1, both high definition and light weight can be satisfied even when the size is increased, and a high-definition vapor deposition pattern can be formed. ing.

  By the way, at the time of vapor deposition pattern formation using the vapor deposition mask proposed by patent document 1, a vapor deposition material passes the slit provided in the metal mask, and the opening part provided in the resin mask, and it becomes a vapor deposition object. A vapor deposition pattern is formed. Here, when the vapor deposition mask proposed in Patent Document 1 is repeatedly used, the vapor of the vapor deposition material released from the vapor deposition source adheres to the vapor deposition mask, and the vapor is deposited ( (Hereinafter referred to as adhesion). If the vapor of the vapor deposition material adheres to the inner wall surface of the opening portion of the vapor deposition mask or the vicinity of the opening, the vapor deposition material released from the vapor deposition source is removed. This is a factor that causes a so-called pattern defect in which an insufficient pattern is formed on the vapor deposition object. In addition, the wrinkles that adhere to the vapor deposition mask are caused by the vapor deposition material, and there are also wrinkles that adhere when the vapor deposition mask is stored. In any case, when a deposition pattern is formed in a state where wrinkles adhere to the vapor deposition mask, in particular, in a state where wrinkles adhere to the inner wall surface of the opening or the vicinity of the opening, high-definition vapor deposition is performed. It becomes difficult to form a pattern.

  As a method for removing wrinkles adhering to the vapor deposition mask, an ultrasonic cleaning method can be used. By the way, depending on the amount of soot deposited on the vapor deposition mask and the manner of attachment, there are many cases where the soot cannot be removed without applying a physical force. In order to remove wrinkles attached to the deposition mask, when the deposition mask is cleaned by applying a physical force, for example, when ultrasonic cleaning is performed at a low frequency to increase the physical force. As a result, the resin mask is damaged, dimensional variation occurs in the opening provided in the resin mask, and it becomes difficult to form a high-definition vapor deposition pattern.

Japanese Patent No. 5288072

  The present invention has been made in view of such a situation, and even when the size is increased, both high definition and light weight are satisfied, and vapor deposition is performed while suppressing damage to the opening of the resin mask. To provide a vapor deposition mask that can easily remove wrinkles attached to the mask and form a high-definition vapor deposition pattern over a long period of time, and to manufacture an organic semiconductor element with high accuracy It is a main subject to provide a manufacturing method.

In order to solve the above problems, the present invention provides a vapor deposition mask in which a metal layer provided with a metal opening is laminated on one surface of a resin layer provided with a resin opening corresponding to a pattern to be produced by vapor deposition. (I) a region corresponding to a position overlapping with the metal opening on one surface of the resin layer and / or the other surface of the resin layer, or (ii) An antifouling layer is provided on one or both of the resin opening and the metal opening, and a region corresponding to a position overlapping with the metal opening on one surface of the resin layer, and The antifouling layer provided on either one or both surfaces of the resin layer has a thickness of 100 nm or more and 2 μm or less, and the antifouling layer contains a releasable resin.
Moreover, the present invention for solving the above-described problems is formed by laminating a metal layer provided with a metal opening on one surface of a resin layer provided with a resin opening corresponding to a pattern to be deposited. In the vapor deposition mask, an antifouling layer is provided in a region corresponding to a position overlapping the metal opening on one surface of the resin layer, and the antifouling layer has a thickness of 100 nm to 2 μm, The antifouling layer contains a releasable resin.
Further, the present invention for solving the above problems is a vapor deposition mask in which a metal mask provided with a slit is laminated on one surface of a resin mask provided with an opening corresponding to a pattern to be produced by vapor deposition. And an antifouling layer is provided on one or both of the area corresponding to the position overlapping with the slit on one surface of the resin mask and the other surface of the resin mask. Features.

  The antifouling layer may contain a releasable resin.

  Further, the metal mask is provided with a plurality of slits, the resin mask is provided with openings necessary for constituting a plurality of screens, and each of the slits is provided at a position overlapping with at least one entire screen. It may be done.

  Further, the metal mask is provided with one slit, the resin mask is provided with a plurality of openings, and all of the plurality of openings are provided at positions overlapping the one slit. Also good.

  Moreover, this invention for solving the said subject is a manufacturing method of an organic-semiconductor element, Comprising: A vapor deposition pattern is formed in a vapor deposition target object using the vapor deposition mask with a metal frame by which the vapor deposition mask was fixed by welding to the metal frame. In the step of forming the vapor deposition pattern including a step, the vapor deposition mask welded and fixed to the metal frame has a slit on one surface of the resin mask provided with an opening corresponding to the pattern to be vapor deposited. The provided metal mask is laminated, and the antifouling is provided on one or both of the region corresponding to the position overlapping with the slit on one surface of the resin mask and the other surface of the resin mask. It is a vapor deposition mask provided with a layer.

  According to the vapor deposition mask of the present invention, even when the size is increased, both high definition and light weight are satisfied, and the attached wrinkles are easily removed while preventing damage to the opening of the resin mask. It is possible to form a high-definition deposition pattern over a long period of time. Moreover, according to the manufacturing method of the organic semiconductor element of this invention, an organic semiconductor element can be manufactured with sufficient precision.

It is the front view which looked at the vapor deposition mask of one Embodiment from the metal mask side. It is an AA partial schematic sectional drawing of the vapor deposition mask shown in FIG. It is a partial schematic sectional drawing of the vapor deposition mask of one Embodiment. It is a partial schematic sectional drawing of the vapor deposition mask of one Embodiment. It is the front view which looked at the vapor deposition mask of 1st Embodiment from the metal mask side. It is the front view which looked at the vapor deposition mask of 1st Embodiment from the metal mask side. It is the front view which looked at the vapor deposition mask of 1st Embodiment from the resin mask side. It is the front view which looked at the vapor deposition mask of 1st Embodiment from the metal mask side. It is the front view which looked at the vapor deposition mask of 2nd Embodiment from the metal mask side. It is BB sectional drawing of the vapor deposition mask shown in FIG. It is the front view which looked at the vapor deposition mask of 2nd Embodiment from the metal mask side. It is the front view which looked at the vapor deposition mask of 2nd Embodiment from the metal mask side. It is B1-B1 sectional drawing of the vapor deposition mask shown in FIG. It is a figure for demonstrating an example of the manufacturing method of the vapor deposition mask of one Embodiment of this invention, (a)-(c) is a partial schematic sectional drawing. It is a figure for demonstrating an example of the formation method of the metal mask with a resin plate, (a), (b) is a partial schematic sectional drawing. It is a figure for demonstrating an example of the formation method of the metal mask with a resin plate, (a), (b) is a partial schematic sectional drawing. It is a figure for demonstrating an example of the formation method of the metal mask with a resin plate, (a), (b) is a partial schematic sectional drawing. It is a figure for demonstrating an example of the formation method of the metal mask with a resin plate, (a), (b) is a partial schematic sectional drawing. It is a figure for demonstrating an example of the formation method of the metal mask with a resin plate, (a), (b) is a partial schematic sectional drawing. It is a partial schematic sectional drawing of the vapor deposition mask of one Embodiment, (a), (b) is a partial schematic sectional drawing. It is a partial schematic sectional drawing which shows an example of the metal mask with a resin plate.

<< Evaporation mask >>
Below, the vapor deposition mask 100 of one Embodiment of this invention is demonstrated concretely.

  As shown in FIGS. 1 and 2, the vapor deposition mask 100 according to an embodiment of the present invention is provided with slits 15 on one surface of a resin mask 20 provided with openings 25 corresponding to patterns to be produced by vapor deposition. The metal mask 10 thus formed is laminated. In the present invention, the antifouling layer 40 is provided on one or both of the region corresponding to the position overlapping the slit 15 and the other surface of the resin mask on one surface of the resin mask 20. It is characterized by being. FIG. 1 is a front view of a vapor deposition mask according to an embodiment of the present invention as viewed from the metal mask side, and FIG. 2 is a partial schematic cross-sectional view taken along line AA of FIG. Each configuration will be described below. In addition, the vapor deposition mask 100 of each embodiment demonstrated below is the area | region corresponding to the position which overlaps with the slit 15 of the metal mask 10, or the vapor deposition mask 20 on one surface of the vapor deposition mask 20, so that it may mention later. A common feature is that the antifouling layer 40 is provided on the other surface.

(Resin mask)
For the resin mask 20, a conventionally known resin material can be appropriately selected and used, and the material is not particularly limited. However, a high-definition opening 25 can be formed by laser processing or the like. It is preferable to use a lightweight material having a small dimensional change rate and moisture absorption rate. Examples of such materials include polyimide resin, polyamide resin, polyamideimide resin, polyester resin, polyethylene resin, polyvinyl alcohol resin, polypropylene resin, polycarbonate resin, polystyrene resin, polyacrylonitrile resin, ethylene vinyl acetate copolymer resin, ethylene- Examples thereof include vinyl alcohol copolymer resin, ethylene-methacrylic acid copolymer resin, polyvinyl chloride resin, polyvinylidene chloride resin, cellophane, and ionomer resin. Among the materials exemplified above, a resin material having a thermal expansion coefficient of 16 ppm / ° C. or less is preferable, a resin material having a moisture absorption rate of 1.0% or less is preferable, and a resin material having both conditions is particularly preferable. .

  There is no particular limitation on the thickness of the resin mask 20, but when vapor deposition is performed using the vapor deposition mask 100 of one embodiment of the present invention, a vapor deposition portion that is thinner than the target vapor deposition film thickness, so-called In order to prevent the occurrence of shadows, the resin mask 20 is preferably as thin as possible. However, when the thickness of the resin mask 20 is less than 3 μm, defects such as pinholes are likely to occur, and the risk of deformation and the like increases. On the other hand, if it exceeds 25 μm, shadows may occur. Considering this point, the thickness of the resin mask 20 is preferably 3 μm or more and 25 μm or less. By setting the thickness of the resin mask 20 within this range, it is possible to reduce the risk of defects such as pinholes and deformation, and to effectively prevent the generation of shadows. In particular, by setting the thickness of the resin mask 20 to 3 μm or more and 10 μm or less, more preferably 4 μm or more and 8 μm or less, it is possible to more effectively prevent the influence of shadows when forming a high-definition pattern exceeding 400 ppi. . In addition, the resin mask 20 and the metal mask 10 to be described later may be bonded directly or via an adhesive layer, but the resin mask 20 and the metal mask via an adhesive layer. 10 is bonded, it is preferable that the total thickness of the resin mask 20 and the pressure-sensitive adhesive layer is within the range of the preferable thickness.

  Note that the shadow is thinner than the target deposition film thickness because a part of the deposition material released from the deposition source collides with the inner wall surface of the slit 15 of the metal mask 10 and does not reach the deposition target. This refers to a phenomenon in which an undeposited portion having a film thickness occurs. In particular, as the shape of the opening 25 is miniaturized, the influence of the shadow increases.

  In the form shown in FIG. 2, the opening shape of the opening 25 is rectangular, but the opening shape is not particularly limited, and the opening shape of the opening 25 may be any shape such as a trapezoidal shape or a circular shape. There may be.

  Although the end faces of the resin mask that form the opening 25 facing each other may be substantially parallel to each other, as shown in FIG. 2, the opening 25 has a shape in which the cross-sectional shape expands toward the vapor deposition source. It is preferable. Specifically, the angle between the bottom end of the bottom of the resin mask and the top end of the top of the resin mask is preferably in the range of 5 ° to 85 °, and 15 ° to 80 °. More preferably, it is in the range of 25 ° to 65 °. In particular, within this range, an angle smaller than the vapor deposition angle of the vapor deposition machine to be used is preferable.

(Metal mask)
As shown in FIG. 2, the metal mask 10 is laminated on one side of the resin mask 20. The metal mask 10 is made of metal and has slits 15 extending in the vertical direction or the horizontal direction. The slit 15 is synonymous with the opening. There is no particular limitation on the arrangement example of the slits, as shown in FIG. 1, the slits extending in the vertical direction and the horizontal direction may be arranged in a plurality of rows in the vertical direction and the horizontal direction, the slits extending in the vertical direction, A plurality of rows may be arranged in the horizontal direction, and a plurality of slits extending in the horizontal direction may be arranged in the vertical direction. Further, only one row may be arranged in the vertical direction or the horizontal direction.

  The material of the metal mask 10 is not particularly limited, and any conventionally known material can be appropriately selected and used in the field of the evaporation mask, and examples thereof include metal materials such as stainless steel, iron-nickel alloy, and aluminum alloy. . Among them, an invar material that is an iron-nickel alloy can be suitably used because it is less deformed by heat.

  Although the thickness of the metal mask 10 is not particularly limited, it is preferably 100 μm or less, more preferably 50 μm or less, and more preferably 35 μm or less in order to more effectively prevent the occurrence of shadows. Particularly preferred. When the thickness is less than 5 μm, the risk of breakage and deformation increases and handling tends to be difficult.

  In the form shown in FIG. 1, the opening shape of the slit 15 is rectangular, but the opening shape is not particularly limited, and the opening shape of the slit 15 is any shape such as a trapezoidal shape or a circular shape. Also good.

  The cross-sectional shape of the slit 15 formed in the metal mask 10 is not particularly limited, but is preferably a shape that expands toward the vapor deposition source as shown in FIG. More specifically, the angle formed by the straight line connecting the lower bottom tip of the slit 15 of the metal mask 10 and the upper bottom tip of the slit 15 of the metal mask 10 and the bottom surface of the metal mask 10 is 5 ° to 85 °. It is preferably within the range, more preferably within the range of 15 ° to 80 °, and even more preferably within the range of 25 ° to 65 °. In particular, within this range, an angle smaller than the vapor deposition angle of the vapor deposition machine to be used is preferable.

  The method for laminating the metal mask 10 on the resin mask 20 is not particularly limited, and the resin mask 20 and the metal mask 10 may be bonded using various adhesives, or a resin mask having self-adhesiveness may be used. Good. Resin mask 20 and metal mask 10 may have the same size or different sizes. If the resin mask 20 is made smaller than the metal mask 10 and the outer peripheral portion of the metal mask 10 is exposed in consideration of the optional fixing to the frame thereafter, the metal mask 10 It is preferable because it can be easily welded to the frame.

(Anti-fouling layer)
As shown in FIG. 1 and FIG. 2, on one surface of the resin mask 20, the region corresponding to the position overlapping the slit 15 and the other surface of the resin mask, or both surfaces, An antifouling layer 40 is provided. The antifouling layer 40 can be adhered due to the vapor deposition material passing through the opening of the resin mask when the vapor deposition mask 100 of one embodiment of the present invention is used repeatedly, during vapor deposition, or storage of the vapor deposition mask. It is a layer that plays a role for removing foreign substances that may sometimes adhere for some reason (hereinafter collectively referred to as wrinkles, etc.). Specifically, it is a layer that has a property that it is difficult for wrinkles or the like to adhere, or the attached wrinkles and the like can be easily removed by washing.

  The antifouling layer 40 is not limited as long as it has the above-mentioned properties, and a conventionally known antifouling layer is used in the fields of “antireflection film”, “water repellent sheet” and the like. be able to.

  Considering the removal performance of wrinkles and the like, as the component of the antifouling layer, a silicone resin or a release resin such as a fluororesin is suitable.

  According to the vapor deposition mask 100 of one embodiment of the present invention having the antifouling layer 40, even if the above-described wrinkles or the like adhere to the vapor deposition mask, the physical force is not exerted. Soot and the like can be easily removed. In addition, in a vapor deposition mask that does not have an antifouling layer, wrinkles and the like cannot be removed unless a large physical force is applied, and when wrinkles are removed by applying a large physical force, for example, When the wrinkles are removed by ultrasonic cleaning at a low frequency to increase the physical force, the dimensions of the openings provided in the resin mask will fluctuate. In other words, in a vapor deposition mask that does not have an antifouling layer, the dimensional accuracy of the opening of the resin mask decreases each time cleaning for removing wrinkles and the like is repeated. That is, with a vapor deposition mask that does not have an antifouling layer, it is difficult to accurately form a vapor deposition pattern over a long period of time.

  In the present specification, “the antifouling layer is provided in a region corresponding to the position overlapping with the slit of the metal mask on one surface of the resin mask” means that one of the resin masks 20 as shown in FIG. In the surface, not only the form in which the antifouling layer 40 is provided on the entire region corresponding to the position overlapping with the slit 15 but also the position overlapping with the slit 15 on one surface of the resin mask 20 as shown in FIG. The antifouling layer 40 is provided in a part on the region corresponding to the above. That is, part of the resin mask 20 may be exposed at a position overlapping the slit 15. In this case, as shown in FIG. 3, it is preferable that the antifouling layer 40 is provided on the resin mask in the vicinity of the opening 25. When the antifouling layer is not provided on the resin mask in the vicinity of the opening 25, wrinkles and the like adhering to the vicinity of the opening 25 cannot be removed. This is because the vapor deposition material released from the vapor deposition source is blocked, and an insufficient pattern is formed on the vapor deposition target, which causes a so-called pattern defect.

  Further, in the embodiment shown in FIG. 2, the antifouling layer 40 is provided only on the one surface of the resin mask 20 so as to overlap with the slit 15, but the slit 15 of the metal mask 10 is formed as shown in FIG. An antifouling layer 40 may be further provided on the inner wall surface to be configured or on the top surface of the metal mask 10 (in the embodiment shown in FIG. 4, the antifouling layer is provided on the top surface of the metal mask). By forming the antifouling layer 40 on the top surface of the metal mask 10 or the inner wall surface constituting the slit 15 of the metal mask 10, soot adheres to the top surface of the metal mask 10 or the inner wall surface constituting the slit 15. Even in such a case, wrinkles and the like attached to the portion can be easily removed by washing. Moreover, it can also be set as the form which combined the form shown in FIG. 3, and the form shown in FIG.

  The thickness of the antifouling layer 40 is not particularly limited, but as the antifouling layer 40 is increased in thickness, the apparent thickness of the resin mask 20 is increased. Depending on the thickness of the antifouling layer, generation of shadows may occur. There are cases where it cannot be prevented. Therefore, it is desirable to determine the thickness of the antifouling layer 40 in consideration of this point. Specifically, the antifouling layer 40 preferably has a thickness of 2 μm or less. Although there is no limitation in particular about a lower limit, it is about 100 nm from the point of the ease of antifouling layer formation. An example of a more preferable thickness of the antifouling layer 40 is in the range of 100 nm to 1 μm.

  A method for forming the antifouling layer 40 will be described in a vapor deposition mask manufacturing method described later.

  In the above description, the description has been focused on an example in which the antifouling layer 40 is provided on one surface of the resin mask, that is, on the surface of the resin mask 20 on the side in contact with the metal mask 10, but FIG. As shown, an antifouling layer 40 may be provided on the other surface of the resin mask 20. Further, as shown in FIG. 20B, an antifouling layer 40 may be provided on both the surface corresponding to the position overlapping the slit 15 on one surface of the resin mask 20 and the other surface of the resin mask. it can.

  The antifouling layer 40 may be provided on the entire surface of the other surface of the resin mask 20, or may be provided on a part of the other surface of the resin mask 20. When providing the antifouling layer 40 on a part of the other surface of the resin mask 20, the antifouling layer 40 is provided in the vicinity of the opening on the other surface of the resin mask 20. Is preferred. This is because, when the antifouling layer 40 is not present in the vicinity of the opening 25, wrinkles attached to the vicinity of the opening 25 on the other surface of the resin mask 20 cannot be removed. This is because the haze becomes a hindrance when forming a high-definition deposition pattern.

  Note that the vapor deposition mask is attracted so that the other surface of the resin mask faces the vapor deposition object, and therefore, when the antifouling layer 40 is provided on the other surface of the resin mask 20, the vapor deposition mask is protected. When the dirt layer 40 has low smoothness, there is a gap between the vapor deposition mask 100 and the vapor deposition object depending on the case where the adhesion between the vapor deposition mask 100 and the vapor deposition object is insufficient or depending on the smoothness. There is a risk of occurrence. Moreover, as the thickness of the antifouling layer 40 is increased, the gap between the vapor deposition mask and the vapor deposition object increases, and the pattern accuracy to be formed tends to decrease. Therefore, when the antifouling layer 40 is provided on the other surface of the resin mask 20, it is preferable to provide the antifouling layer 40 having high smoothness in consideration of this point. The preferable thickness of the antifouling layer 40 when the antifouling layer 40 is provided on the other surface of the resin mask 20 is the same as the preferable thickness described in the case of being provided on the one surface of the resin mask. In addition, the form in which the antifouling layer 40 is provided on one surface of the vapor deposition mask is that the vapor deposition mask 100 and the vapor deposition object can be closely adhered to each other regardless of the smoothness of the antifouling layer 40. It can be said that this is a preferred form. Moreover, the form in which the antifouling layer 40 is provided on both the one surface and the other surface of the resin mask is excellent in the removal performance of adhered wrinkles and the like.

  Hereinafter, the form of the vapor deposition mask that enables the production of a higher-definition vapor deposition pattern will be described by taking the first embodiment and the second embodiment as examples.

<Deposition Mask of First Embodiment>
As shown in FIG. 5, the vapor deposition mask 100 according to the first embodiment of the present invention is a vapor deposition mask for simultaneously forming vapor deposition patterns for a plurality of screens, and a plurality of vapor deposition masks are formed on one surface of the resin mask 20. The metal mask 10 provided with the slits 15 is laminated, and the resin mask 20 is provided with openings 25 necessary for constituting a plurality of screens, and each slit 15 is at a position overlapping at least one entire screen. It is provided. Furthermore, the vapor deposition mask 100 of the first embodiment is formed on the surface corresponding to the position overlapping the slit 15 on one surface of the resin mask 20 and / or the other surface of the resin mask. The antifouling layer 40 described is provided. In FIG. 5, the antifouling layer 40 is provided in a region corresponding to the position overlapping the slit 15 on one surface of the resin mask 20.

  The vapor deposition mask 100 of 1st Embodiment is a vapor deposition mask used in order to form the vapor deposition pattern for several screens simultaneously, and can form the vapor deposition pattern corresponding to several products simultaneously with one vapor deposition mask 100. FIG. it can. The “opening” referred to in the vapor deposition mask of the first embodiment means a pattern to be produced using the vapor deposition mask 100 of the first embodiment. For example, the vapor deposition mask is formed as an organic layer in an organic EL display. When used for the above, the shape of the opening 25 is the shape of the organic layer. In addition, “one screen” includes an assembly of openings 25 corresponding to one product. When the one product is an organic EL display, it is necessary to form one organic EL display. An aggregate of organic layers, that is, an aggregate of openings 25 serving as an organic layer is “one screen”. And the vapor deposition mask 100 of 1st Embodiment arrange | positions the said "one screen" for several screens at predetermined intervals in the resin mask 20 in order to form the vapor deposition pattern for multiple screens simultaneously. . That is, the resin mask 20 is provided with openings 25 necessary for forming a plurality of screens.

  In the vapor deposition mask of the first embodiment, a metal mask 10 provided with a plurality of slits 15 is provided on one surface of a resin mask, and each slit is provided at a position overlapping at least one entire screen. Features a point. In other words, between the openings 25 necessary to form one screen, between the openings 25 adjacent in the horizontal direction, the length is the same as the length of the slit 15 in the vertical direction, and is the same as the metal mask 10. There is no metal line part having a thickness or a metal line part having the same length as the horizontal length of the slit 15 and the same thickness as the metal mask 10 between the openings 25 adjacent in the vertical direction. It is characterized by that. Hereinafter, the same length as the length of the slit 15 in the vertical direction and the same thickness as the metal mask 10 or the length of the slit 15 in the horizontal direction and the same length as the metal mask 10 Metal wire portions having a thickness may be collectively referred to simply as metal wire portions.

  According to the vapor deposition mask 100 of the first embodiment, when the size of the opening 25 necessary to configure one screen and the pitch between the openings 25 configuring one screen are narrowed, for example, a screen exceeding 400 ppi. Therefore, even if the size of the openings 25 and the pitch between the openings 25 are extremely small, it is possible to prevent interference due to the metal line portion and to form a high-definition image. It becomes. When one screen is divided by a plurality of slits, for example, when there is a metal line portion having the same thickness as the metal mask 10 between the openings 25 constituting one screen, one screen is displayed. As the pitch between the openings 25 constituting the metal film becomes narrower, the metal line portion existing between the openings 25 becomes a hindrance when forming the vapor deposition pattern on the vapor deposition object, and the formation of the high-definition vapor deposition pattern is difficult. It becomes difficult. In other words, when there is a metal line portion having the same thickness as the metal mask 10 between the openings 25 constituting one screen, the metal line portion causes the generation of a shadow and forms a high-definition screen. It becomes difficult.

  Next, an example of the opening 25 constituting one screen will be described with reference to FIGS. In the form shown in the figure, a region closed by a broken line is one screen. In the illustrated form, for convenience of description, a small number of openings 25 are aggregated as one screen. However, the present invention is not limited to this form. For example, when one opening 25 is defined as one pixel, one screen There may be an opening 25 of several million pixels.

  In the form shown in FIG. 5, one screen is constituted by an aggregate of openings 25 in which a plurality of openings 25 are provided in the vertical direction and the horizontal direction. In the form shown in FIG. 6, one screen is constituted by an aggregate of openings 25 in which a plurality of openings 25 are provided in the horizontal direction. Moreover, in the form shown in FIG. 7, one screen is constituted by an aggregate of openings 25 in which a plurality of openings 25 are provided in the vertical direction. 5 to 7, a slit 15 is provided at a position overlapping the entire screen.

  As described above, the slit 15 may be provided at a position overlapping only one screen, or as illustrated in FIGS. 8A and 8B, provided at a position overlapping two or more entire screens. It may be. In FIG. 8A, in the resin mask 20 shown in FIG. 5, the slit 15 is provided at a position overlapping the entire two screens that are continuous in the horizontal direction. In FIG. 8B, the slit 15 is provided at a position overlapping the entire three screens that are continuous in the vertical direction.

Next, taking the form shown in FIG. 5 as an example, the pitch between the openings 25 constituting one screen and the pitch between the screens will be described. There is no particular limitation on the pitch between the openings 25 constituting one screen and the size of the openings 25, and they can be set as appropriate according to the pattern to be deposited. For example, when forming a high-definition deposition pattern of 400 ppi, the horizontal pitch (P1) and vertical pitch (P2) of the adjacent openings 25 in the openings 25 constituting one screen are about 60 μm. It becomes. The size of the opening becomes 500μm ² ~1000μm ² about. In addition, one opening 25 is not limited to corresponding to one pixel. For example, depending on the pixel arrangement, a plurality of pixels can be integrated into one opening 25.

  The horizontal pitch (P3) and the vertical pitch (P4) between the screens are not particularly limited, but as shown in FIG. 5, when one slit 15 is provided at a position overlapping the entire screen, A metal line portion exists between the screens. Accordingly, the vertical pitch (P4) and horizontal pitch (P3) between the screens are smaller than the vertical pitch (P2) and horizontal pitch (P1) of the openings 25 provided in one screen. In this case, or when they are substantially equivalent, the metal wire portion existing between the screens is easily broken. Therefore, in consideration of this point, it is preferable that the pitch (P3, P4) between the screens is wider than the pitch (P1, P2) between the openings 25 constituting one screen. An example of the pitch (P3, P4) between the screens is about 1 mm to 100 mm. Note that the pitch between the screens means a pitch between adjacent openings in one screen and another screen adjacent to the one screen. The same applies to the pitch of the openings 25 and the pitch between the screens in the vapor deposition mask of the second embodiment to be described later.

  In addition, as shown in FIG. 8, when one slit 15 is provided at a position overlapping two or more entire screens, a slit is not provided between a plurality of screens provided in one slit 15. The metal wire part which comprises an inner wall surface will not exist. Therefore, in this case, the pitch between two or more screens provided at a position overlapping with one slit 15 may be substantially equal to the pitch between the openings 25 constituting one screen.

  Further, a groove (not shown) 28 extending in the vertical direction or the horizontal direction of the resin mask 20 may be formed in the resin mask 20. When heat is applied during vapor deposition, the resin mask 20 may thermally expand, which may cause changes in the size and position of the opening 25. However, by forming a groove, the expansion of the resin mask can be absorbed. It is possible to prevent the resin mask 20 from expanding in a predetermined direction as a whole and accumulating the thermal expansion that occurs at various portions of the resin mask and changing the size and position of the opening 25. There is no limitation on the position where the groove is formed, and it may be provided between the openings 25 constituting one screen or at a position overlapping with the openings 25, but is preferably provided between the vertical screens. Further, the groove may be provided only on one surface of the resin mask, for example, the surface in contact with the metal mask, or may be provided only on the surface not in contact with the metal mask. Alternatively, it may be provided on both surfaces of the resin mask 20.

  Moreover, it is good also as a groove | channel extended in the vertical direction between adjacent screens, and you may form the groove | channel extended in a horizontal direction between adjacent screens. Furthermore, it is possible to form the grooves in a combination of these.

  The depth and width of the groove are not particularly limited. However, when the depth of the groove is too deep or too wide, the rigidity of the resin mask 20 tends to decrease, so this point is taken into consideration. It is necessary to set it. Further, the cross-sectional shape of the groove is not particularly limited, and may be arbitrarily selected in consideration of a processing method such as a U shape or a V shape. The same applies to the vapor deposition mask of the second embodiment.

<Deposition Mask of Second Embodiment>
Next, the vapor deposition mask of 2nd Embodiment is demonstrated. As shown in FIGS. 9 and 10, the vapor deposition mask of the second embodiment has a single slit 16 (hereinafter referred to as a slit 16) on one surface of a resin mask 20 provided with a plurality of openings 25 corresponding to the pattern to be vapor deposited. The metal mask 10 provided with one through-hole 16) is laminated, and all of the plurality of openings 25 are provided at positions overlapping with one through-hole provided in the metal mask 10. It is characterized by that. Furthermore, the vapor deposition mask of the second embodiment has a region corresponding to a position overlapping one through-hole 16 on one surface of the resin mask 20 and one or both of the other surfaces of the resin mask. The antifouling layer 40 described above is provided. The opening 25 referred to in the second embodiment means an opening necessary for forming a vapor deposition pattern on the vapor deposition target, and an opening not necessary for forming the vapor deposition pattern on the vapor deposition target is 1 It may be provided at a position that does not overlap with the two through holes 16. 9 is a front view of the vapor deposition mask showing an example of the vapor deposition mask of the second embodiment as seen from the metal mask side, and FIG. 10 is a cross-sectional view taken along the line BB of the vapor deposition mask shown in FIG.

  In the vapor deposition mask 100 of the second embodiment, the metal mask 10 having one through hole 16 is provided on the resin mask 20 having the plurality of openings 25, and all of the plurality of openings 25 are It is provided at a position overlapping with the one through hole 16. In the vapor deposition mask 100 of the second embodiment having this configuration, there is no metal line portion between the openings 25 that is the same as the thickness of the metal mask or thicker than the thickness of the metal mask. As described in the vapor deposition mask of the embodiment, it is possible to form a high-definition vapor deposition pattern according to the size of the opening 25 provided in the resin mask 20 without receiving interference from the metal line portion.

  Moreover, according to the vapor deposition mask of 2nd Embodiment, even if it is a case where the thickness of the metal mask 10 is made thick, since it hardly receives the influence of a shadow, the thickness of the metal mask 10 is made durable. In addition, the thickness and the handling property can be sufficiently increased, and the durability and the handling property can be improved while enabling the formation of a high-definition deposition pattern.

(Resin mask)
The resin mask 20 in the vapor deposition mask of the second embodiment is made of resin, and as shown in FIGS. 9 and 10, a plurality of openings 25 corresponding to the pattern for vapor deposition are provided at positions overlapping one through hole 16. It has been. The opening 25 corresponds to a pattern to be produced by vapor deposition, and the vapor deposition material released from the vapor deposition source passes through the opening 25 so that a vapor deposition pattern corresponding to the opening 25 is formed on the vapor deposition target. The In the illustrated embodiment, an example in which the openings are arranged in a plurality of rows in the vertical and horizontal directions is described. However, the openings may be arranged only in the vertical or horizontal direction.

  The vapor deposition mask 100 of 2nd Embodiment may be used for formation of the vapor deposition pattern corresponding to 1 screen, and may be used for simultaneous formation of the vapor deposition pattern corresponding to two or more screens. . “One screen” in the vapor deposition mask of the second embodiment means an aggregate of openings 25 corresponding to one product, and when the one product is an organic EL display, one organic EL display. An aggregate of organic layers necessary to form the film, that is, an aggregate of the openings 25 serving as the organic layer is “one screen”. In this case, as shown in FIG. 11, it is preferable that the openings 25 are provided at predetermined intervals for each screen unit. In FIG. 11, an area enclosed by a broken line is “one screen”. In FIG. 11, one screen is constituted by twelve openings 25, but the present invention is not limited to this form. For example, when one opening 25 is one pixel, millions of One screen can be constituted by the opening 25. As an example of the pitch between the screens, both the vertical pitch and the horizontal pitch are about 1 mm to 100 mm. Note that the pitch between the screens means a pitch between adjacent openings in one screen and another screen adjacent to the one screen.

(Metal mask)
The metal mask 10 in the vapor deposition mask 100 of the second embodiment is made of metal and has one through hole 16. In the present invention, when the one through hole 16 is viewed from the front of the metal mask 10, the position overlaps all the openings 25, in other words, all the openings 25 arranged in the resin mask 20. It is placed in a visible position.

  Metal parts constituting the metal mask 10, that is, parts other than the through-holes 16 may be provided along the outer edge of the vapor deposition mask 100 as shown in FIGS. 9 and 10, and as shown in FIGS. Alternatively, the size of the metal mask 10 may be made smaller than that of the resin mask 20 to expose the outer peripheral portion of the resin mask 20. FIG. 13 is a B1-B1 cross-sectional view of the vapor deposition mask shown in FIG. Further, the size of the metal mask 10 may be made larger than that of the resin mask 20, and a part of the metal portion may protrude outward in the horizontal direction or in the vertical direction of the resin mask. In any case, the size of the through hole 16 is configured to be smaller than the size of the resin mask 20.

  Although there is no particular limitation on the width (W1) in the horizontal direction and the width (W2) in the vertical direction of the metal portion forming the wall surface of the through hole of the metal mask 10 shown in FIG. 9, the widths of W1 and W2 are reduced. As time goes on, durability and handling properties tend to decrease. Therefore, it is preferable that W1 and W2 have widths that can sufficiently satisfy durability and handling properties. An appropriate width can be set as appropriate according to the thickness of the metal mask 10, but as an example of a preferable width, both W1 and W2 are about 1 mm to 100 mm. Preferred pitches for the pitches (P1, P2) between the screens are as described in the first embodiment.

  The vapor deposition mask 100 of one embodiment of the present invention has been described above, but the vapor deposition mask of the present invention can be variously modified without departing from the spirit of the present invention. For example, in the above description, the example in which the antifouling layer 40 remains on the vapor deposition mask side has been mainly described. However, the antifouling layer 40 may be a layer that can be removed by a solvent. In this case, the antifouling layer can be removed together with the soot adhered by the solvent when the soot is attached to some extent.

  Examples of the material of the antifouling layer 40 that can be removed by a solvent include water-soluble resins and organic solvent-soluble resins. Water-soluble resins include water-soluble acrylic resins such as polyvinyl alcohol, polyvinyl pyrrolidone, hydroethyl cellulose, carboxymethyl cellulose, phenol resin, polyacrylic acid, polyacrylic acid ester, polyacrylic acid ester copolymer, and polymethacrylic acid. , Gelatin, starch, casein, and modified products thereof. Water-based resins are vinyl chloride resin emulsions, vinyl chloride-vinyl acetate resin emulsions, vinyl chloride resin emulsions such as vinyl chloride-acrylic resin emulsions, acrylic resin emulsions, urethane resin emulsions, PVC resin dispersions, acrylic resin dispersions. Examples include a solvent in which a part of the solvent is composed of water, such as John and urethane resin dispersions. Examples of the resin that can be dissolved in the organic solvent include a polyester resin, a polyurethane resin, and a polystyrene resin.

  Further, the antifouling layer 40 can be provided on the inner wall surface constituting the opening 25 of the resin mask 20. Further, a barrier layer can be provided on the inner wall surface constituting the opening 25 of the resin mask 20 on the inner wall surface constituting the opening 25 of the resin mask. As the barrier layer, an inorganic oxide, an inorganic nitride, a metal thin film layer, or a vapor deposition layer can be used. As the inorganic oxide, an oxide of aluminum, silicon, indium, tin, or magnesium can be used, and as the metal, aluminum or the like can be used.

  Moreover, in the form shown to each figure, although the opening part 25 is regularly arrange | positioned in the vertical direction and a horizontal direction, you may arrange | position the opening part 25 alternately in a horizontal direction. In other words, the openings 25 adjacent in the horizontal direction may be shifted in the vertical direction. By arranging in this way, even when the resin mask 20 is thermally expanded, the expansion generated in various places can be absorbed by the opening 25, and the expansion is prevented from accumulating and causing a large deformation. Can do.

(Method for manufacturing vapor deposition mask)
Next, an example of the manufacturing method of the vapor deposition mask of one Embodiment of this invention is demonstrated.

  As shown in FIG. 14A, the vapor deposition mask of one embodiment of the present invention is formed by laminating the metal mask 10 provided with the slits 15 on one surface of the resin plate 30, and A metal mask 50 with a resin plate provided with an antifouling layer 40 at a position overlapping with the slit 15 on the surface is prepared. Next, as shown in FIG. It can be obtained by irradiating a laser through the slit 15 from the 10 side and forming an opening 25 corresponding to a pattern to be deposited on the resin plate 30 as shown in FIG. Hereinafter, an example of forming a metal mask with a resin plate will be described using the method for forming a metal mask with a resin plate according to the first to fifth embodiments as an example.

  15A, the metal mask with a resin plate according to the first embodiment includes a step of laminating a metal mask 10 provided with slits 15 on one surface of a resin plate 30, and As shown in b), the antifouling layer 40 is formed at a position overlapping with the slit 15 on one surface of the resin plate 30 on which the metal mask 10 is laminated. For the resin plate 30, the materials described in the resin mask 20 can be used. The same applies to the following embodiments. Moreover, as a material of the antifouling layer in the metal mask with a resin plate of each embodiment, the materials described in the antifouling layer of the vapor deposition mask can be appropriately selected and used.

  The antifouling layer 40 is formed on the one surface side of the resin plate with respect to the laminate in which the metal mask 10 is provided on one surface of the resin plate 30, and the second embodiment. The coating solution prepared by dissolving or dispersing the material of the antifouling layer 40 in an appropriate solvent is applied using a conventionally known coating method such as spray coating, spin coating, dip coating, curtain coating, or die coating. It can be formed by working and drying. In this method, the antifouling layer 40 (not shown for the inner wall surface) is also formed on the top surface of the metal mask 10 and the inner wall surface constituting the slit 15 of the metal mask 10.

  As shown in FIG. 16A, the metal mask 50 with a resin plate according to the second embodiment includes a step of forming an antifouling layer 40 on one surface of the resin plate 30 and a step shown in FIG. The step of laminating the metal mask 10 provided with the slits 15 on one surface of the resin plate 30 is obtained.

  In the method for forming a metal mask with a resin plate according to the second embodiment, in addition to spin coating, spray coating, dip coating, curtain coating, die coating, etc., bar coating, comma coating, knife coating, gravure printing, screen printing, or gravure plate The antifouling layer 40 can be formed by using a conventionally known coating method such as reverse roll coating using.

  Next, as shown in FIG. 16B, the metal mask 10 provided with the slits 15 is laminated on one surface of the resin plate 30 provided with the antifouling layer 40. Thereby, the metal mask with a resin plate of the second embodiment is obtained. As the metal mask 10, the metal mask described in the metal mask with a resin plate of the first embodiment can be used as it is. Moreover, a metal plate is bonded on one surface of the resin plate 30 provided with the antifouling layer 40, and the slit 15 is formed in the metal plate, thereby obtaining the metal mask with a resin plate of the second embodiment. You can also.

  Further, as shown in FIG. 21, in the metal mask with a resin plate of the first embodiment and the second embodiment, the antifouling layer is formed at the opening formation planned position where the opening 25 is finally formed and in the vicinity thereof. 40 is preferably provided. If the antifouling layer 40 does not exist in the vicinity of the opening 25 when the resin mask 20 is finally formed, wrinkles attached to the vicinity of the opening 25 of the resin mask 20 can be removed. This is because the wrinkles hinder the formation of a high-definition deposition pattern.

  As shown in FIG. 17A, the metal mask 50 with a resin plate according to the third embodiment includes a step of forming an antifouling layer 40 on the other surface of the resin plate 30, and FIG. Thus, it is obtained by laminating the metal mask 10 provided with the slits 15 on one surface of the resin plate 30. Hereinafter, an example in which the metal mask 10 is laminated on one surface of the resin plate 30 after the antifouling layer 40 is formed on the other surface of the resin plate 30 will be described. The antifouling layer 40 can also be formed on the other surface of the resin plate 30 after laminating the metal mask 10 on one surface.

  In the metal mask with a resin plate of the third embodiment, the antifouling layer 40 may be provided on the entire surface of the other surface of the resin plate 30 or may be provided on a part of the other surface of the resin plate 30. It may be. In the case where the antifouling layer 40 is provided on a part of the other surface of the resin plate 30, at the opening formation planned position where the opening 25 is finally formed in the resin plate 30 and in the vicinity thereof. It is preferable that the antifouling layer 40 is provided.

  Next, as shown in FIG. 17B, the metal mask 10 provided with the slits 15 is laminated on one surface of the resin plate 30. Thereby, the metal mask with a resin plate of the third embodiment is obtained. As the metal mask 10, the metal mask described in the metal mask with a resin plate of the first embodiment can be used as it is. Moreover, the metal mask with a resin plate of 3rd Embodiment can also be obtained by bonding a metal plate on one surface of the resin plate 30 and forming the slit 15 in the metal plate.

(Metal mask with resin plate of 4th Embodiment)
As shown in FIG. 18A, the metal mask 50 with a resin plate of the fourth embodiment includes a step of laminating the metal mask 10 provided with the slits 15 on one surface of the resin plate 30, and FIG. As shown in FIG. 5B, the antifouling layer 40 is formed on the other surface of the resin plate 30 and the region corresponding to the position overlapping the slit 15 on one surface of the resin plate 30 on which the metal mask 10 is laminated. Obtained by the process.

  The metal mask with resin plate 50 of the fourth embodiment can be obtained by combining the methods described in the metal mask with resin plate of the first embodiment and the metal mask with resin plate of the third embodiment. Detailed description will be omitted here. According to the metal mask with a resin plate of the fourth embodiment, since the antifouling layer 40 is finally provided on both the one surface and the other surface of the resin mask, it adheres to the vapor deposition mask. Soot and the like can be removed more effectively.

(Metal mask with resin plate of the fifth embodiment)
As shown in FIG. 19A, the metal mask 50 with a resin plate of the fifth embodiment includes a step of forming an antifouling layer 40 on one surface and the other surface of the resin plate 30, and FIG. As shown to b), it obtains by the process of laminating | stacking the metal mask 10 in which the slit 15 was provided on one surface of the resin board 30. FIG.

  The metal mask with resin plate 50 of the fifth embodiment can be obtained by combining the methods described in the metal mask with resin plate of the second embodiment and the metal mask with resin plate of the third embodiment. Detailed description will be omitted here.

  Hereinafter, although an example using the metal mask with a resin plate of the first embodiment will be described, a deposition mask is formed using the metal mask with a resin plate of the second to fifth embodiments. You can also.

  Next, as shown in FIG. 14B, the antifouling layer and the resin plate are penetrated using the laser processing method, precision press processing, photolithographic processing, etc., with respect to the metal mask 50 with the resin plate prepared above. The slit 15 was provided on one surface of the resin mask 20 provided with the opening 25 corresponding to the pattern to be vapor-deposited by forming the opening 25 corresponding to the pattern to be vapor-deposited on the resin plate. The metal mask 10 is laminated, and the antifouling layer 40 is formed on one or both of the region corresponding to the position overlapping the slit 15 on one surface of the resin mask 20 and the other surface of the resin plate. The vapor deposition mask 100 according to an embodiment of the present invention is provided. In addition, it is preferable to use the laser processing method for formation of the opening part 25 from the point which can form the high definition opening part 25 easily. Further, the metal mask with a resin plate described above can be used as a vapor deposition mask preparation for manufacturing a vapor deposition mask in which a resin mask having an opening and a metal mask having a slit are laminated. it can.

  When the opening 25 is formed by using a laser processing method, as shown in FIGS. 15 to 19, when a metal mask with a resin plate provided with an antifouling layer 40 is used, vapor deposition is performed during laser processing. Soot that may adhere to the mask can also be removed by using the antifouling layer 40, which is a preferable method for producing a vapor deposition mask.

  In the example described above, the antifouling layer 40 is formed before the opening 25 is formed in the resin plate. However, the resin mask provided with the opening 25 corresponding to the pattern to be deposited is prepared. The antifouling layer 40 can be provided on the vapor deposition mask after obtaining the vapor deposition mask in which the metal mask 10 having the slits 15 provided on one surface 20 is laminated.

(Method for manufacturing organic semiconductor element)
Next, the manufacturing method of the organic-semiconductor element of one Embodiment of this invention is demonstrated. The manufacturing method of the organic-semiconductor element of one Embodiment of this invention has the process of forming a vapor deposition pattern by the vapor deposition method using a vapor deposition mask with a metal frame, and the following metal frame is attached in the process of forming the said organic-semiconductor element. It is characterized in that a vapor deposition mask is used.

  An organic semiconductor device manufacturing method according to an embodiment having a step of forming a vapor deposition pattern by a vapor deposition method using a vapor deposition mask with a metal frame includes an electrode formation step of forming an electrode on a substrate, an organic layer formation step, and a counter electrode formation A vapor deposition pattern is formed on the substrate by a vapor deposition method using a vapor deposition mask with a metal frame in each arbitrary step. For example, when the vapor deposition method using a vapor deposition mask with a metal frame is applied to the R, G, B light emitting layer forming step of the organic EL device, the vapor deposition pattern of each color light emitting layer is formed on the substrate. . In addition, the manufacturing method of the organic-semiconductor element of one Embodiment of this invention is not limited to these processes, It is applicable to the arbitrary processes of the conventionally well-known organic-semiconductor element using a vapor deposition method.

  In the method of manufacturing an organic semiconductor element according to an embodiment of the present invention, in the step of forming the vapor deposition pattern, the vapor deposition mask welded and fixed to the metal frame is provided with an opening corresponding to the pattern to be vapor deposited. A metal mask provided with a slit is laminated on one surface of the mask, and one of the surface corresponding to the position overlapping with the slit on one surface of the resin mask and the other surface of the resin plate It is a vapor deposition mask provided with an antifouling layer on one or both surfaces.

  As the vapor deposition mask constituting the vapor deposition mask with a metal frame, the vapor deposition mask 100 according to the embodiment of the present invention described above can be used as it is, and detailed description thereof is omitted here. According to the vapor deposition mask of one embodiment of the present invention described above, an organic semiconductor element having a high-definition pattern can be formed. As an organic semiconductor element manufactured with the manufacturing method of this invention, the organic layer, light emitting layer, cathode electrode, etc. of an organic EL element can be mentioned, for example. In particular, the method for manufacturing an organic semiconductor element according to an embodiment of the present invention can be suitably used for manufacturing R, G, and B light emitting layers of organic EL elements that require high-definition pattern accuracy.

DESCRIPTION OF SYMBOLS 100 ... Deposition mask 10 ... Metal mask 15 ... Slit 16 ... Through-hole 20 ... Resin mask 25 ... Opening 30 ... Resin plate 40 ... Antifouling layer 50 ... Metal mask with resin plate (deposition mask preparation)

Claims (3)

A vapor deposition mask in which a metal layer provided with a metal opening is laminated on one surface of a resin layer provided with a resin opening corresponding to a pattern to be produced by vapor deposition,
(I) a region corresponding to a position overlapping with the metal opening on one surface of the resin layer and / or the other surface of the resin layer, or (ii) the resin opening And an antifouling layer is provided on the inner wall surface of either one or both of the metal openings ,
The thickness of the antifouling layer provided on one or both of the region corresponding to the position overlapping with the metal opening on one surface of the resin layer and the other surface of the resin layer is 100 nm. And not more than 2 μm,
The antifouling layer contains a releasable resin,
Deposition mask.   A vapor deposition mask in which a metal layer provided with a metal opening is laminated on one surface of a resin layer provided with a resin opening corresponding to a pattern to be produced by vapor deposition,
  An antifouling layer is provided in a region corresponding to a position overlapping with the metal opening on one surface of the resin layer,
  The antifouling layer has a thickness of 100 nm to 2 μm,
  The antifouling layer contains a releasable resin,
  Deposition mask.   A method for producing an organic semiconductor element, comprising:
  Using a vapor deposition mask, forming a vapor deposition pattern on a vapor deposition object,
  The vapor deposition mask according to claim 1 or 2 is used as the vapor deposition mask.
  A method for producing an organic semiconductor element.

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