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JP6584087B2 - Scanning optical device - Google Patents
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JP6584087B2 - Scanning optical device - Google Patents

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JP6584087B2
JP6584087B2 JP2015028945A JP2015028945A JP6584087B2 JP 6584087 B2 JP6584087 B2 JP 6584087B2 JP 2015028945 A JP2015028945 A JP 2015028945A JP 2015028945 A JP2015028945 A JP 2015028945A JP 6584087 B2 JP6584087 B2 JP 6584087B2
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light
light receiving
substrate
scanning device
hole
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JP2016151667A (en
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潤 永利
潤 永利
充広 太田
充広 太田
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Canon Inc
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Canon Inc
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Priority to JP2015028945A priority Critical patent/JP6584087B2/en
Priority to US15/043,322 priority patent/US9740135B2/en
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Priority to US15/653,296 priority patent/US10281834B2/en
Priority to US16/386,039 priority patent/US10649360B2/en
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Description

本発明は、光束を偏向する光偏向器、光束の通過するタイミングを検知する検出手段を含む複数の光学系部品を備えた走査光学装置に関する。   The present invention relates to an optical deflector that deflects a light beam and a scanning optical device that includes a plurality of optical system parts including a detection unit that detects the timing at which the light beam passes.

従来のレーザプリンタ等の画像形成装置に用いられる走査光学装置は、画像信号に応じて光源から出射したレーザ光束を光変調し、光変調されたレーザ光束を例えば回転多面鏡からなる光偏向器で偏向走査している。偏向走査されたレーザ光束は、被走査面上の走査開始位置のタイミングを制御するために、光検出手段(受光素子)としてのBDセンサに導かれる。その後、fθ特性を有する結像光学系などの走査レンズによって、感光性の記録媒体面上にスポット状に結像され、光走査を行う。光走査の書き出しタイミングは、BDセンサがレーザ光束を検知したことに基づいて同期信号を発した所定時間後である。   A scanning optical device used in a conventional image forming apparatus such as a laser printer optically modulates a laser beam emitted from a light source in accordance with an image signal, and the light modulated laser beam is an optical deflector formed of, for example, a rotating polygon mirror. Deflection scanning. The laser beam that has been deflected and scanned is guided to a BD sensor as a light detection means (light receiving element) in order to control the timing of the scanning start position on the surface to be scanned. Thereafter, the image is formed in a spot shape on the photosensitive recording medium surface by a scanning lens such as an imaging optical system having fθ characteristics, and optical scanning is performed. The optical scanning start timing is a predetermined time after the synchronization signal is generated based on the detection of the laser beam by the BD sensor.

特許文献1には、上述したようなBDセンサを回路基板上に実装した構成が開示されている。   Patent Document 1 discloses a configuration in which the BD sensor as described above is mounted on a circuit board.

特許第4109878号Patent No.4109878

特許文献1の構成では、BDセンサの素子をスルーホール実装しているが、近年では、装置の小型化、低コスト化のために、BDセンサなどの受光素子として表面実装用の素子を用いることが考えられている。受光素子を表面実装する場合、基板に素子を嵌め込む貫通穴を設け、貫通穴に入った光を受光素子で受光可能な構成としている。   In the configuration of Patent Document 1, the element of the BD sensor is mounted through-hole. However, in recent years, an element for surface mounting is used as a light receiving element such as a BD sensor in order to reduce the size and cost of the apparatus. Is considered. When the light receiving element is surface-mounted, a through hole for fitting the element into the substrate is provided, and the light entering the through hole can be received by the light receiving element.

しかし、上述したように基板に貫通穴を設けた構成の場合、光が貫通穴を通過する際、光の位置や向きによっては貫通穴の内壁面で反射した光が受光素子の受光部へ入射し、誤検知してしまうことがある。   However, in the case where the through hole is provided in the substrate as described above, when the light passes through the through hole, the light reflected by the inner wall surface of the through hole is incident on the light receiving portion of the light receiving element depending on the position and orientation of the light. In some cases, erroneous detection may occur.

そこで、本発明は、上記課題に鑑みて、受光素子が誤検知することを抑制することを目的とする。   In view of the above problems, an object of the present invention is to suppress erroneous detection of a light receiving element.

上述の課題を解決するための本発明は、光源と、前記光源から出射された光束を偏向する偏向手段と、前記光源が取り付けられた貫通穴を備える基板と、受光部を備え、前記基板に実装された受光部材と、を有し、前記受光部材が、前記偏向手段で偏向され走査方向へ移動しつつ前記貫通穴へ入った前記光束を受光する光学走査装置において、前記偏光手段を収容し前記基板が外側に取り付けられた光学箱を有し、前記受光部材は、前記偏向手段から離れた側の前記基板の面に実装され、前記受光部は、前記走査方向に関して、前記受光部材の中央よりも下流側で、且つ、前記偏向手段によって偏向され、前記貫通穴の内壁で反射した光束が入射しない位置に配置されており、前記走査方向において前記受光部材よりも下流側の前記受光部材と前記基板の間の隙間が上流側より大きいことを特徴とする。 The present invention for solving the above-described problems includes a light source, a deflecting unit that deflects a light beam emitted from the light source, a substrate including a through hole to which the light source is attached, a light receiving unit, and the substrate. has a mounting light-receiving member, wherein the light receiving member, in the optical scanning device for receiving the light beam entering into the through-hole while moving to the deflected scanning direction by the deflecting means, accommodating the polarization means The substrate has an optical box attached to the outside, the light receiving member is mounted on the surface of the substrate away from the deflecting means, and the light receiving unit is centered on the light receiving member with respect to the scanning direction. downstream from, and is deflected by said deflecting means, said light beam reflected by the inner wall of the through hole and is arranged at a position not incident, the light receiving member of the downstream side of the light receiving member in the scanning direction Gap between the substrate and wherein the larger upstream.

本発明によれば、受光素子が誤検知することを抑制できる。   ADVANTAGE OF THE INVENTION According to this invention, it can suppress that a light receiving element detects erroneously.

画像形成装置の概略断面図。1 is a schematic sectional view of an image forming apparatus. 光学走査装置の概略斜視図。1 is a schematic perspective view of an optical scanning device. 光学走査装置のBDセンサ近傍の部分斜視図。The partial perspective view of the BD sensor vicinity of an optical scanning device. (a)BDセンサの実装前の状態におけるBDセンサとそれが実装される基板との関係を示す斜視図、(b)BDセンサの実装後の状態におけるBDセンサとそれが実装される基板との関係を示す斜視図。(A) The perspective view which shows the relationship between the BD sensor in the state before mounting of a BD sensor, and the board | substrate with which it is mounted, (b) Between the BD sensor in the state after mounting of BD sensor, and the board | substrate with which it is mounted The perspective view which shows a relationship. BDセンサに入射するレーザ光束Lを図示した走査断面図。The scanning sectional view which illustrated laser beam L which enters a BD sensor. 点Bで反射したレーザ光束Lを図示した走査断面図。FIG. 4 is a scanning sectional view illustrating a laser beam L reflected at a point B. 別形態の光学走査装置の概略断面図。FIG. 6 is a schematic cross-sectional view of another form of optical scanning device.

<第1実施形態>
[画像形成装置]
図1は画像形成装置101を示す図である。後述する光学走査装置100は光学台103に設置されている。光学台103は画像形成装置101の筐体の一部である。画像形成装置101には、画像形成手段である、プロセスカートリッジ108、その他に転写材Pを載置する給紙部104、給紙ローラ105、転写ローラ(転写手段)106、定着器(定着手段)107が設けられている。プロセスカートリッジ108には像担持体である感光ドラム(感光体)8、帯電ローラ108a、現像ローラ108bが備わっている。転写ローラ106と感光ドラム8は接触して転写ニップを形成している。
<First Embodiment>
[Image forming apparatus]
FIG. 1 is a diagram illustrating an image forming apparatus 101. An optical scanning device 100 to be described later is installed on the optical bench 103. The optical bench 103 is a part of the housing of the image forming apparatus 101. The image forming apparatus 101 includes an image forming unit, such as a process cartridge 108, a sheet feeding unit 104 on which a transfer material P is placed, a sheet feeding roller 105, a transfer roller (transfer unit) 106, and a fixing device (fixing unit). 107 is provided. The process cartridge 108 includes a photosensitive drum (photosensitive member) 8 that is an image carrier, a charging roller 108a, and a developing roller 108b. The transfer roller 106 and the photosensitive drum 8 are in contact with each other to form a transfer nip.

感光ドラム8は回転軸周りに回転しながら帯電ローラ108aにより表面を帯電された後、光学走査装置100がレーザ光を出射してその表面を走査して潜像を形成する。その後、現像ローラ108bにより表面にトナーを付着させられて、潜像がトナーによって現像されたトナー像となる。   The surface of the photosensitive drum 8 is charged by the charging roller 108a while rotating around the rotation axis, and then the optical scanning device 100 emits laser light and scans the surface to form a latent image. Thereafter, toner is adhered to the surface by the developing roller 108b, and the latent image becomes a toner image developed by the toner.

一方、転写材Pは給紙部104から給紙ローラ105によって給送され、転写ローラ106により感光ドラム8上に形成されたトナー像が転写される。その後定着器107において転写材P上のトナー像は熱と圧力によって転写材Pに定着する。トナーが定着した転写材Pは排紙ローラ110によって画像形成装置101の外に出力される。   On the other hand, the transfer material P is fed from the paper feed unit 104 by the paper feed roller 105, and the toner image formed on the photosensitive drum 8 is transferred by the transfer roller 106. Thereafter, the toner image on the transfer material P is fixed to the transfer material P by heat and pressure in the fixing device 107. The transfer material P on which the toner is fixed is output to the outside of the image forming apparatus 101 by the paper discharge roller 110.

[光学走査装置]
次に光学走査装置100について説明する。図2は光学走査装置100の概略斜視図である。図3は光学走査装置100のBDセンサ6近傍の斜視図である。半導体レーザユニット1はレーザ光束Lを出射する光源としての不図示の半導体レーザ1a及びその駆動回路1bをユニット化したものである。半導体レーザ1aから出射されたレーザ光束Lは、コリメータレンズ機能とシリンドリカルレンズ機能を有するレンズ2、開口絞り3を通過して、偏向手段5の回転多面鏡(ポリゴンミラー)4に形成された複数の反射面12のうちの1つに入射する。ポリゴンミラー4は偏向手段5が備えるモータによって矢印の方向に回転駆動され、反射面12の向きが変化することで、レーザ光束Lを反射する方向を連続的に変化させ、レーザ光束Lを偏向する。ポリゴンミラー4がある回転位相の時、反射面12で反射したレーザ光束LはBDレンズ14を透過して集光され、受光部材(受光素子)としてのBDセンサ6の受光部10へ入射する。またポリゴンミラー4が別の回転位相の時、レーザ光束Lは、fθレンズ(走査レンズ)7に入射し、感光ドラム8の表面である感光面(被走査面)へ入射する。上述した光学部材(半導体レーザユニット1、レンズ2、開口絞り3、偏向手段5、BDセンサ6、fθレンズ7)が光学箱9に位置決め支持され、固定される。
[Optical scanning device]
Next, the optical scanning device 100 will be described. FIG. 2 is a schematic perspective view of the optical scanning device 100. FIG. 3 is a perspective view of the vicinity of the BD sensor 6 of the optical scanning device 100. The semiconductor laser unit 1 is formed by unitizing a semiconductor laser 1a (not shown) as a light source for emitting a laser beam L and its drive circuit 1b. A laser beam L emitted from the semiconductor laser 1 a passes through a lens 2 having a collimator lens function and a cylindrical lens function, and an aperture stop 3, and a plurality of laser beams L formed on a rotating polygon mirror (polygon mirror) 4 of the deflecting unit 5. Incident on one of the reflective surfaces 12. The polygon mirror 4 is rotationally driven in the direction of the arrow by a motor provided in the deflecting means 5 and changes the direction of the reflecting surface 12 to continuously change the direction in which the laser beam L is reflected, thereby deflecting the laser beam L. . When the polygon mirror 4 is in a certain rotational phase, the laser beam L reflected by the reflecting surface 12 is transmitted through the BD lens 14 and collected, and enters the light receiving unit 10 of the BD sensor 6 as a light receiving member (light receiving element). When the polygon mirror 4 is in another rotational phase, the laser beam L enters the fθ lens (scanning lens) 7 and enters the photosensitive surface (scanned surface) that is the surface of the photosensitive drum 8. The optical members (semiconductor laser unit 1, lens 2, aperture stop 3, deflecting means 5, BD sensor 6, fθ lens 7) described above are positioned and supported by the optical box 9 and fixed.

[レーザ光による感光ドラムの走査]
次に光学走査装置100による、レーザ光で感光ドラム8を走査する方法について説明する。半導体レーザユニット1の半導体レーザ1aから出射したレーザ光束Lは、レンズ2によって主走査方向では略平行光または収束光とされ、副走査方向では収束光とされる。次にレーザ光束Lは、開口絞り3を通って光束幅が制限されて、ポリゴンミラー4の反射面12上において主走査方向に長く伸びた焦線状に結像する。そして、ポリゴンミラー4の回転によって反射面12でのレーザ光束Lの反射方向が連続的に変化し、レーザ光束Lを偏向する。ポリゴンミラー4が所定の回転位相にあるとき、反射されたレーザ光束Lは、BDセンサ6近傍の光学箱9やBDセンサ6の表面に入射し、円形状のスポットS1を形成する。ポリゴンミラー4の回転に伴って、レーザ光束LのスポットS1は図3の破線矢印の方向に移動して受光部10を通過する。このとき、BDセンサ6は受光部10での受光量が所定の閾値以上となるとBD信号を出力する。このBD信号が出力されたタイミングを基準として、画像データに基づく光源の発光開始(画像の書き出し)のタイミングが決まる。
[Scanning of photosensitive drum with laser light]
Next, a method for scanning the photosensitive drum 8 with laser light by the optical scanning device 100 will be described. The laser beam L emitted from the semiconductor laser 1a of the semiconductor laser unit 1 is converted into substantially parallel light or convergent light in the main scanning direction by the lens 2 and converged light in the sub-scanning direction. Next, the laser beam L passes through the aperture stop 3 and is limited in its beam width, and forms an image on the reflecting surface 12 of the polygon mirror 4 in the form of a focal line extending long in the main scanning direction. Then, the reflection direction of the laser beam L on the reflecting surface 12 is continuously changed by the rotation of the polygon mirror 4, and the laser beam L is deflected. When the polygon mirror 4 is in a predetermined rotational phase, the reflected laser beam L is incident on the surface of the optical box 9 or the BD sensor 6 near the BD sensor 6 to form a circular spot S1. As the polygon mirror 4 rotates, the spot S1 of the laser beam L moves in the direction of the broken line arrow in FIG. At this time, the BD sensor 6 outputs a BD signal when the amount of light received by the light receiving unit 10 exceeds a predetermined threshold. Based on the timing at which the BD signal is output, the light emission start timing (image writing) based on the image data is determined.

ポリゴンミラー4が更に所定量回転すると、反射されたレーザ光束Lはfθレンズ7を透過して感光ドラム8の表面に入射する。fθレンズ7は、レーザ光束Lを集光させて、感光ドラム8の表面にスポット像として結像させる。レーザ光束Lがfθレンズ7へ入射を開始してからポリゴンミラー4が更に所定量回転する間は、レーザ光束Lはfθレンズ7を透過して感光ドラム8の表面に入射し続け、レーザ光束Lのスポット像はポリゴンミラー4の回転方向に対応する走査方向へ移動する。走査方向は感光ドラム8の回転軸方向と平行である。fθレンズ7は、レーザ光束Lのスポット像が感光ドラム8の表面上で等速に走査方向に移動するようにレーザ光束Lの結像位置が設計されている。   When the polygon mirror 4 further rotates a predetermined amount, the reflected laser beam L passes through the fθ lens 7 and enters the surface of the photosensitive drum 8. The fθ lens 7 focuses the laser beam L and forms it as a spot image on the surface of the photosensitive drum 8. While the polygonal mirror 4 further rotates by a predetermined amount after the laser beam L starts to enter the fθ lens 7, the laser beam L continues to be incident on the surface of the photosensitive drum 8 through the fθ lens 7. The spot image moves in the scanning direction corresponding to the rotation direction of the polygon mirror 4. The scanning direction is parallel to the rotational axis direction of the photosensitive drum 8. The fθ lens 7 is designed at an imaging position of the laser beam L such that the spot image of the laser beam L moves in the scanning direction at a constant speed on the surface of the photosensitive drum 8.

レーザ光束Lのスポット像が感光ドラム8の表面上を走査方向に移動する間に、半導体レーザユニット1の光源には、形成する画像データに対応するレーザ駆動信号(VIDEO信号)に基づいて駆動電流が供給され、光源が点灯する。これにより、走査方向に画像データに対応した潜像をレーザ光束Lで走査(主走査)して形成する。   While the spot image of the laser beam L moves on the surface of the photosensitive drum 8 in the scanning direction, a driving current is supplied to the light source of the semiconductor laser unit 1 based on a laser driving signal (VIDEO signal) corresponding to image data to be formed. Is supplied and the light source is turned on. As a result, a latent image corresponding to the image data in the scanning direction is formed by scanning (main scanning) with the laser beam L.

上述したポリゴンモータ4の回転に加え、感光ドラム8が回転軸まわりに回転することによって、レーザ光束Lのスポット像が感光ドラム表面8に対して、走査方向に直交する方向に相対的に移動(副走査)する。このような、ポリゴンミラー4の回転及び感光ドラム8の回転により、感光ドラム8の表面上に画像データに対応した2次元の潜像をレーザ光束Lで走査して形成する。   In addition to the rotation of the polygon motor 4 described above, the photosensitive drum 8 rotates around the rotation axis, so that the spot image of the laser beam L moves relative to the photosensitive drum surface 8 in a direction perpendicular to the scanning direction ( (Sub scan). By rotating the polygon mirror 4 and the photosensitive drum 8 as described above, a two-dimensional latent image corresponding to image data is scanned and formed on the surface of the photosensitive drum 8 with the laser beam L.

上述した、BD信号の出力工程と、その後の感光ドラム8上でのレーザ光束Lによる走査工程は、ポリゴンミラー4の回転に伴い反射面12毎に行われる。   The BD signal output process and the subsequent scanning process using the laser beam L on the photosensitive drum 8 described above are performed for each reflection surface 12 as the polygon mirror 4 rotates.

[BDセンサ6の位置決め]
図4は、BDセンサ6とそれが実装(組み付ける)される基板20との関係を示す斜視図であり、(a)はBDセンサ6の実装前の状態、(b)はBDセンサ6の実装後の状態を示す。レーザ光束LのスポットS1のBDセンサ6の表面上における移動方向(走査方向)をX方向、基板20の表面に平行であって走査方向Xに直交する方向をY方向とする。
[Positioning of BD sensor 6]
4A and 4B are perspective views showing the relationship between the BD sensor 6 and the substrate 20 on which the BD sensor 6 is mounted (assembled). FIG. 4A is a state before the BD sensor 6 is mounted, and FIG. Shown later. The moving direction (scanning direction) of the spot S1 of the laser beam L on the surface of the BD sensor 6 is defined as the X direction, and the direction parallel to the surface of the substrate 20 and orthogonal to the scanning direction X is defined as the Y direction.

基板20には半導体レーザ1a及びBDセンサ6が実装されるため、基板20は半導体レーザ1aの駆動制御回路やBD信号出力回路を備える。基板20上には貫通穴である穴21が設けられており、端子列23が基板20のパッド22に半田付けされることで、BDセンサ6が基板20に表面実装される。なお、BDセンサ6の少なくとも一部を穴21に挿入して嵌め込んだ状態で、端子列23をパッド22に半田付けしてもよい。基板20のパッド22は、BDセンサ6を穴21に嵌め込んだ時に端子列23と重なり合うように配置されている。また、パッド22は、端子列23よりもY方向先端側に長い形状になっている。パッド22には予めクリーム半田が塗布されており、部品の端子列23とパッド22が重なり合った状態でリフロー炉に流すことでBDセンサ6が半田で基板20に固定される。   Since the semiconductor laser 1a and the BD sensor 6 are mounted on the substrate 20, the substrate 20 includes a drive control circuit for the semiconductor laser 1a and a BD signal output circuit. A through hole 21 is provided on the substrate 20, and the terminal array 23 is soldered to the pad 22 of the substrate 20, so that the BD sensor 6 is surface-mounted on the substrate 20. Note that the terminal row 23 may be soldered to the pad 22 in a state in which at least a part of the BD sensor 6 is inserted and fitted into the hole 21. The pads 22 of the substrate 20 are arranged so as to overlap the terminal rows 23 when the BD sensor 6 is fitted into the holes 21. Further, the pad 22 is longer than the terminal row 23 on the front end side in the Y direction. Cream solder is applied to the pad 22 in advance, and the BD sensor 6 is fixed to the substrate 20 with solder by flowing it through a reflow furnace in a state where the terminal row 23 of the component and the pad 22 overlap each other.

リフロー炉に基板20を流すと、パッド22に塗布されているクリーム半田が溶け、溶けたクリーム半田の表面張力により端子列23とパッド22が重なり合うようX方向にBDセンサ6が移動するセルフアライメントが起こる。表面張力によるセルフアライメントが起こる事で、BDセンサ6がX方向にずれていてもBDセンサ6がX方向に移動してパッド22の中央位置へ移動して位置が決まる。更に、パッド22が端子列23に対してY方向に一回り長い形状になっていることにより、半田の表面張力を増加させ、セルフアライメントをより安定させることができる。端子列23は、BDセンサ6のX方向に平行な2つの辺に配置され、その位置は、BDセンサ6の中心と通るX方向に平行な中心線を基準に線対称である。このため、BDセンサ6を基板20の表面上において、回転させようとするモーメントが発生し難く、安定したセルフアライメントが発生する。   When the substrate 20 is flowed through the reflow furnace, the cream solder applied to the pad 22 melts, and the self-alignment in which the BD sensor 6 moves in the X direction so that the terminal row 23 and the pad 22 overlap each other due to the surface tension of the melted cream solder. Occur. By self-alignment due to surface tension, even if the BD sensor 6 is displaced in the X direction, the BD sensor 6 moves in the X direction and moves to the center position of the pad 22 to determine the position. Furthermore, since the pad 22 has a shape that is slightly longer than the terminal row 23 in the Y direction, the surface tension of the solder can be increased and the self-alignment can be further stabilized. The terminal row 23 is arranged on two sides parallel to the X direction of the BD sensor 6, and the positions thereof are axisymmetric with respect to a center line parallel to the X direction passing through the center of the BD sensor 6. For this reason, a moment to rotate the BD sensor 6 on the surface of the substrate 20 hardly occurs, and stable self-alignment occurs.

以上により、X方向に関して基板のパッド22の位置に高精度にBDセンサ6が実装される。ここでX方向とはBDセンサに対し光束が走査する方向であり、BDセンサ6の位置が高精度に実装されることにより、画像の書き出しタイミングが精度良く決まる。また、Y方向については、セルフアライメントは発生しにくい。このため、Y方向のBDセンサ6の位置決めは、BDセンサ6のX方向に平行な2つの辺の位置を穴21で規制し、BDセンサ6自体を穴21に嵌合することによって位置を決める。
[BDセンサ6への迷光防止]
図5は、図4(b)に示すポリゴンミラー4により偏向されたレーザ光束Lの走査断面としてのA−A断面を上方から見た図であり、BDセンサ6に入射するレーザ光束Lを図示したものである。上述したように、BDセンサ6は半導体レーザ1aが実装された基板20の実装面24に表面実装されているため、レーザ光束Lは実装面24に平行な受光面である受光部10の法線方向に対して、角度θ1で入射する。基板20の穴21は、基板20の実装面24の側から金型によりプレス加工で形成されるため、穴21の内壁面は、実装面24の法線方向に対して、角度θ2の傾きが生じる。
As described above, the BD sensor 6 is mounted with high accuracy at the position of the pad 22 on the substrate in the X direction. Here, the X direction is a direction in which the light beam scans the BD sensor, and the position of the BD sensor 6 is mounted with high accuracy, whereby the image writing timing is accurately determined. Further, self-alignment hardly occurs in the Y direction. Therefore, the positioning of the BD sensor 6 in the Y direction is determined by restricting the positions of two sides parallel to the X direction of the BD sensor 6 with the holes 21 and fitting the BD sensor 6 itself into the holes 21. .
[Prevents stray light on BD sensor 6]
FIG. 5 is a view of the AA section as a scanning section of the laser beam L deflected by the polygon mirror 4 shown in FIG. 4B as viewed from above, and shows the laser beam L incident on the BD sensor 6. It is a thing. As described above, since the BD sensor 6 is surface-mounted on the mounting surface 24 of the substrate 20 on which the semiconductor laser 1 a is mounted, the laser beam L is normal to the light receiving unit 10 that is a light receiving surface parallel to the mounting surface 24. Incident at an angle θ1 with respect to the direction. Since the hole 21 of the substrate 20 is formed by pressing from the mounting surface 24 side of the substrate 20 with a mold, the inner wall surface of the hole 21 has an inclination of an angle θ2 with respect to the normal direction of the mounting surface 24. Arise.

レーザ光束LはX方向(図中右から左)へ走査しており、穴21はレーザ光束Lが受光部10を通過した後に通る側(受光部10のX方向下流側)が広く開いている。穴21の受光部10のX方向下流側部分の大きさについて説明する。穴21の内壁面のうち走査方向で最も下流側の部分を端面25とすると、レーザ光束Lが受光部10を通過した後に端面25で反射した光が受光部10に入射し、それに基づいてBDセンサ6がBD信号を出力する可能性がある。特に、本実施形態の受光部10は、BDセンサ6の中央よりもX方向下流側に配置されているため、端面25に近く、端面25で反射した光が入射しやすい配置となっている。このようなBDセンサ6の誤検知を抑制するため、端面25で反射した光が受光部10に入射しないような穴21の形状としている。   The laser beam L scans in the X direction (from right to left in the figure), and the hole 21 is wide open on the side that the laser beam L passes after passing through the light receiving unit 10 (downstream in the X direction of the light receiving unit 10). . The size of the downstream portion of the hole 21 in the X direction of the light receiving unit 10 will be described. If the innermost wall surface of the hole 21 is the end surface 25 on the most downstream side in the scanning direction, the light reflected by the end surface 25 after the laser beam L has passed through the light receiving unit 10 is incident on the light receiving unit 10, and based on that, the BD There is a possibility that the sensor 6 outputs a BD signal. In particular, since the light receiving unit 10 of the present embodiment is disposed on the downstream side in the X direction with respect to the center of the BD sensor 6, the light receiving unit 10 is close to the end surface 25 and is easily incident on the light reflected by the end surface 25. In order to suppress such erroneous detection of the BD sensor 6, the shape of the hole 21 is set so that the light reflected by the end face 25 does not enter the light receiving unit 10.

端面25の中で最もポリゴンミラー4に近い点を点Bとする。点Bは、反射したレーザ光束Lが最も受光部10側に向かう反射点である。また、点Bを含む実装面24に平行な面である基板20の裏面26に受光部10からおろした垂線の長さをtとする。   A point closest to the polygon mirror 4 in the end face 25 is a point B. Point B is a reflection point at which the reflected laser beam L is closest to the light receiving unit 10 side. Also, let t be the length of a perpendicular drawn from the light receiving unit 10 to the back surface 26 of the substrate 20 that is parallel to the mounting surface 24 including the point B.

図6は、図5と同様、図4(b)に示すポリゴンミラー4により偏向されたレーザ光束Lの走査断面としてのA−A断面を上方から見た図であり、レーザ光束Lが点Bで反射する様子を示す。受光部10への入射光束同様、受光部10の垂直方向に対して、入射角θ1で入射したレーザ光は、穴の内側の角度θ2を加味して、θ1+2・θ2 の角度となる。このため、点Bで反射したレーザ光が受光部10と同じ高さに到達した時のX方向に関する点Bからの距離D1はt・tan(θ1+2・θ2)となる。
このため、X方向に関する、受光部10と点Bとの距離Dが、以下の式(1)を満たすようになっていれば、点Bで反射したレーザ光が受光部10へ入射しない。
D>t・tan(θ1+2・θ2)・・・式(1)
反射点Bで反射した光束のX方向に直交する方向に対する角度をθ(=θ1+2・θ2)とすれば、式(1)は以下のように置き換えられる。
D>t・tanθ・・・式(1)´
このように、距離Dが(1)の式を満たしていれば、点Bで反射したレーザ光束Lは受光部10に入射しないため、基板20の穴21の端面25で反射したレーザ光速Lが受光部10に入射することはない。本実施形態では、BDセンサ6のX方向の位置を、距離Dが式(1)を満たす位置に決めている。これにより、穴21の内壁面で反射した光がBDセンサ6の受光部10に入ることを抑制することができる。
FIG. 6 is a view of the AA cross section as a scanning cross section of the laser beam L deflected by the polygon mirror 4 shown in FIG. Shows how it reflects. Like the incident light beam to the light receiving unit 10, the laser light incident at an incident angle θ1 with respect to the vertical direction of the light receiving unit 10 takes an angle θ1 + 2 · θ2 in consideration of the angle θ2 inside the hole. Therefore, the distance D1 from the point B in the X direction when the laser beam reflected at the point B reaches the same height as the light receiving unit 10 is t · tan (θ1 + 2 · θ2).
For this reason, if the distance D between the light receiving unit 10 and the point B in the X direction satisfies the following expression (1), the laser light reflected at the point B does not enter the light receiving unit 10.
D> t · tan (θ1 + 2 · θ2) (1)
Assuming that the angle of the light beam reflected at the reflection point B with respect to the direction orthogonal to the X direction is θ (= θ1 + 2 · θ2), Equation (1) can be replaced as follows.
D> t · tan θ Formula (1) ′
As described above, if the distance D satisfies the expression (1), the laser beam L reflected at the point B does not enter the light receiving unit 10, so that the laser light velocity L reflected at the end face 25 of the hole 21 of the substrate 20 is It does not enter the light receiving unit 10. In the present embodiment, the position of the BD sensor 6 in the X direction is determined as a position where the distance D satisfies the expression (1). Thereby, the light reflected by the inner wall surface of the hole 21 can be prevented from entering the light receiving unit 10 of the BD sensor 6.

<第2実施形態>
図7は第2実施形態の光学走査装置100の概略斜視図である。本実施形態が第1実施形態と異なるのは、BDレンズ14を備えていない点である。ポリゴンミラー4がある回転位相の時、反射面12で反射したレーザ光束Lはレンズ等を透過することなく、BDセンサ6の受光部へ入射する。BDレンズ14を備えていない本実施形態の構成の場合、第1実施形態のBDレンズ14有りの構成よりもBDセンサ6の位置におけるレーザ光束LのスポットS1は大きい。このため、レーザ光束Lが穴21の内壁面で反射して受光部10に入射すると比較的大きな光量としてBDセンサ6で検出してしまう虞がある。従って、式(1)を満たすように構成することがより有効である。
Second Embodiment
FIG. 7 is a schematic perspective view of the optical scanning device 100 of the second embodiment. This embodiment is different from the first embodiment in that the BD lens 14 is not provided. When the polygon mirror 4 is in a certain rotational phase, the laser beam L reflected by the reflecting surface 12 is incident on the light receiving portion of the BD sensor 6 without passing through a lens or the like. In the case of the configuration of the present embodiment that does not include the BD lens 14, the spot S1 of the laser beam L at the position of the BD sensor 6 is larger than the configuration of the first embodiment with the BD lens 14. For this reason, when the laser beam L is reflected by the inner wall surface of the hole 21 and enters the light receiving unit 10, the BD sensor 6 may detect a relatively large light amount. Therefore, it is more effective to configure so as to satisfy the formula (1).

6 BDセンサ
10 受光部
20 基板
21 穴
22 パッド
23 端子列
25 端面
6 BD sensor 10 light receiving portion 20 substrate 21 hole 22 pad 23 terminal row 25 end face

Claims (6)

光源と、前記光源から出射された光束を偏向する偏向手段と、前記光源が取り付けられた貫通穴を備える基板と、受光部を備え、前記基板に実装された受光部材と、を有し、前記受光部材が、前記偏向手段で偏向され走査方向へ移動しつつ前記貫通穴へ入った前記光束を受光する光学走査装置において、
前記偏光手段を収容し前記基板が外側に取り付けられた光学箱を有し、
前記受光部材は、前記偏向手段から離れた側の前記基板の面に実装され、
前記受光部は、前記走査方向に関して、前記受光部材の中央よりも下流側で、且つ、前記偏向手段によって偏向され、前記貫通穴の内壁で反射した光束が入射しない位置に配置されており、
前記走査方向において前記受光部材よりも下流側の前記受光部材と前記基板の間の隙間が上流側より大きいことを特徴とする光学走査装置。
A light source, a deflecting means for deflecting a light beam emitted from the light source, a substrate including a through hole to which the light source is attached, a light receiving member including a light receiving unit and mounted on the substrate, In the optical scanning device that receives the light beam entering the through hole while the light receiving member is deflected by the deflection unit and moves in the scanning direction,
An optical box containing the polarizing means and having the substrate mounted on the outside;
The light receiving member is mounted on the surface of the substrate on the side away from the deflecting means;
The light receiving portion is disposed downstream of the center of the light receiving member with respect to the scanning direction, and at a position where the light beam deflected by the deflecting unit and reflected by the inner wall of the through hole does not enter .
An optical scanning device characterized in that a gap between the light receiving member on the downstream side of the light receiving member and the substrate in the scanning direction is larger than the upstream side .
前記偏向手段に偏向された光束を走査断面で見たとき、前記貫通穴の内壁のうち、前記走査方向で最も下流に配置され、且つ、最も前記偏向手段に近い側の点を反射点とし、前記走査方向に関する前記反射点と前記受光部との距離をD、前記走査方向に直交する方向に関する前記反射点と前記受光部との距離をt、前記反射点で反射した光束の前記走査方向に直交する方向に対する角度をθとすると、
D>t・tanθ
を満たすことを特徴とする請求項1に記載の光学走査装置。
When the light beam deflected by the deflecting unit is viewed in a scanning cross section, a point disposed on the most downstream side in the scanning direction among the inner walls of the through hole and closest to the deflecting unit is a reflection point, The distance between the reflection point and the light receiving unit in the scanning direction is D, the distance between the reflection point and the light receiving unit in the direction orthogonal to the scanning direction is t, and the light flux reflected at the reflection point is in the scanning direction. If the angle with respect to the orthogonal direction is θ,
D> t · tan θ
The optical scanning device according to claim 1, wherein:
前記基板には前記光源が実装されていることを特徴とする請求項1又は2に記載の光学走査装置。   The optical scanning device according to claim 1, wherein the light source is mounted on the substrate. 前記受光部は前記光束を受光したことに基づいて信号を出力し、前記信号が出力されたタイミングに基づいて前記光源が発光することを特徴とする請求項1乃至3のいずれか一項に記載の光学走査装置。   The said light-receiving part outputs a signal based on having received the said light beam, The said light source light-emits based on the timing when the said signal was output, The Claim 1 thru | or 3 characterized by the above-mentioned. Optical scanning device. 前記偏向手段は、反射面を備え、前記反射面で前記光束を反射する方向を連続的に変化させることで前記光束を偏向し、前記反射面で反射された前記光束はレンズを通過することなく前記受光部へ入射することを特徴とする請求項1乃至4のいずれか一項に記載の光学走査装置。   The deflecting unit includes a reflecting surface, deflects the light beam by continuously changing a direction in which the light beam is reflected by the reflecting surface, and the light beam reflected by the reflecting surface does not pass through the lens. The optical scanning device according to claim 1, wherein the optical scanning device is incident on the light receiving unit. 前記受光部材は少なくとも一部が前記貫通穴に挿入された状態で前記基板に実装されていることを特徴とする請求項1乃至5のいずれか一項に記載の光学走査装置。   The optical scanning device according to claim 1, wherein the light receiving member is mounted on the substrate in a state in which at least a part is inserted into the through hole.
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