JP6586038B2 - Processing liquid cooling apparatus and substrate processing apparatus - Google Patents

Description

  The present invention relates to a processing liquid cooling apparatus that cools a high-temperature processing liquid discharged from a substrate processing apparatus with cooling water, and a substrate processing apparatus including the processing liquid cooling apparatus.

  In substrate processing apparatuses for processing substrates such as glass substrates for organic EL display devices, glass substrates for liquid crystal display devices, panel substrates for solar cells, glass substrates for plasma displays, glass substrates for photomasks, substrates for optical disks, and semiconductor wafers. The processing liquid used for processing the substrate is discharged. The temperature of the processing liquid is, for example, a high temperature of 100 degrees Celsius or higher. Therefore, when the processing liquid is discharged to the waste liquid portion, it is necessary to cool the processing liquid in advance by the processing liquid cooling device. Such a processing liquid cooling apparatus may be disposed inside the substrate processing apparatus, but may be installed as an apparatus different from the substrate processing apparatus.

  Patent Document 1 discloses a substrate processing apparatus having a configuration in which a processing liquid flowing down from a processing tank is stored in a buffer tank, and the processing liquid stored in the buffer tank is cooled by a cooling medium flowing in a spiral tube. ing.

  Patent Document 2 discloses a distillation still that performs heat exchange by passing a high-temperature fluid through a heat-exchange channel formed in a low-temperature fluid.

  Further, Patent Document 3 discloses a substrate processing apparatus that cools a pair of film forming units with a cooling gas flowing through a single circulation line.

Japanese Patent No. 3517135 Japanese Patent No. 4249208 JP 2014-236060 A

  In such a processing liquid cooling apparatus, when cooling the processing liquid by a plurality of cooling units, depending on the amount of the processing liquid in each cooling unit and the temperature of the processing liquid, it is necessary to cool the processing liquid appropriately. The amount of the processing solution is not constant. However, in the conventional processing liquid cooling device, a configuration in which constant cooling water is always circulated through a plurality of cooling units is usually employed.

  For this reason, depending on the amount and temperature of the processing liquid in each cooling unit, the amount of cooling water is insufficient, or the cooling unit that does not need to circulate the cooling water without cooling the processing liquid is also cooled. There is a problem that water is circulating and cooling water cannot be used efficiently.

  The present invention has been made to solve the above-described problem, and efficiently cools the processing liquid by supplying an appropriate amount of cooling water to a plurality of cooling units according to the processing status. It is an object of the present invention to provide a treatment liquid cooling apparatus capable of performing the above.

  The invention according to claim 1 is a cooling device that cools the high-temperature processing liquid discharged from the substrate processing apparatus with cooling water, and a plurality of cooling units that cool the high-temperature processing liquid with cooling water; The ratio of the cooling water used in each of the plurality of cooling units in a state where the total amount of cooling water used in the plurality of cooling units is substantially constant according to the cooling capacity required in each of the cooling units. And a flow rate control unit for changing.

  The invention according to claim 2 is provided with a flow meter for measuring a total amount of cooling water used in the plurality of cooling units in the invention according to claim 1, and the flow control unit is measured by the flow meter. The ratio of the cooling water used in each of the plurality of cooling units is changed in a state where the flow rate of the cooling water is constant.

  The invention according to claim 3 is the invention according to claim 1, further comprising a pressure gauge for measuring the pressure of the cooling water discharged from the plurality of cooling units, wherein the flow rate control unit is measured by the pressure gauge. The ratio of the cooling water used in each of the plurality of cooling units is changed in a state where the pressure of the cooling water to be made is constant.

  According to a fourth aspect of the present invention, in the invention according to any one of the first to third aspects, the plurality of cooling units include a flow rate adjusting valve that adjusts an amount of cooling water used in each cooling unit. The flow rate control units are connected to each other, and change the ratio of the cooling water used in each of the plurality of cooling units by controlling the flow rate adjusting valves.

  According to a fifth aspect of the present invention, in the cooling device that cools the high-temperature processing liquid discharged from the substrate processing apparatus with cooling water, the high-temperature processing liquid can be stored and the processing liquid is cooled. A first tank and a second tank having a cooling water flow passage; a cooler having a treatment liquid flow passage which stores cooling water therein and passes through the cooling water; the first tank; Two tanks, a treatment liquid flow passage in the cooler, and a treatment liquid feed line for sending treatment liquid between a waste liquid portion of the treatment liquid, the first tank, the second tank, and In accordance with the cooling capacity required in each of the coolers, the first tank, the second tank, and the total amount of cooling water used in the cooler are substantially constant, The second tank and the cooler A flow control unit for changing the ratio of the cooling water used in people, characterized by comprising a.

  According to a sixth aspect of the present invention, in the fifth aspect of the invention, the temperature sensor that measures the temperature of the processing liquid stored in the first tank, and the temperature of the processing liquid stored in the second tank. A temperature sensor for measuring, and the flow rate control unit uses cooling water used in each of the first tank, the second tank, and the cooler based on the temperature of the processing liquid measured by each temperature sensor. Change the ratio.

  According to a seventh aspect of the present invention, in the fifth aspect of the present invention, a liquid level sensor that measures a liquid level of the processing liquid stored in the first tank, and a processing liquid stored in the second tank. A liquid level sensor for measuring the liquid level, and the flow rate control unit is configured to determine whether the first tank, the second tank, or the cooler is based on the liquid level of the processing liquid measured by each liquid level sensor. Change the ratio of cooling water used.

  The invention according to claim 8 is the invention according to claim 5, further comprising a temperature sensor for measuring the temperature of the cooling water discharged from the first tank, the second tank, and the cooler, respectively. The flow rate control unit changes a ratio of cooling water used in each of the first tank, the second tank, and the cooler based on the temperature of the cooling water measured by each temperature sensor.

  A ninth aspect of the present invention is a substrate processing apparatus for supplying a processing liquid to a substrate to process the substrate, and includes the processing liquid cooling apparatus according to any one of the first to eighth aspects.

  According to invention of Claim 1 and Claim 9, the ratio of the cooling water used in each of several cooling parts is changed in the state which made the total amount of the cooling water used by several cooling parts substantially constant. Therefore, it is possible to efficiently cool the processing liquid by sending an appropriate amount of cooling water to the plurality of cooling units according to the processing state. At this time, since the total amount of the cooling water used in the plurality of cooling units does not vary greatly, it is possible to eliminate the influence on other devices that use the cooling water.

  According to the invention described in claim 2, since the ratio of the cooling water used in each of the plurality of cooling units is changed in a state where the flow rate of the cooling water measured by the flow meter is constant, It is possible to suppress fluctuations in the total amount of cooling water used in the section.

  According to the invention of claim 3, since the ratio of the cooling water used in each of the plurality of cooling units is changed in a state where the pressure of the cooling water measured by the pressure gauge is constant, the cooling as a whole is performed. It is possible to make the total amount of cooling water used in the plurality of cooling units substantially constant while maintaining a constant pressure loss of water.

  According to the fourth aspect of the present invention, the cooling water used in the plurality of cooling units is accurately supplied by the flow rate adjusting valve corresponding to each cooling unit while accurately supplying the cooling water required in each cooling unit. The total amount can be made substantially constant.

  According to the fifth aspect of the present invention, in each of the first tank, the second tank and the cooler, the total amount of cooling water used in the first tank, the second tank and the cooler is substantially constant. Since the ratio of the cooling water used is changed, an appropriate amount of cooling water is sent to the first tank, the second tank, and the cooler according to the processing situation, thereby efficiently treating the processing liquid. Cooling can be performed. At this time, since the total amount of cooling water used in the first tank, the second tank, and the cooler does not vary greatly, it is possible to eliminate the influence on other devices that use the cooling water.

  According to the sixth aspect of the present invention, the ratio of the cooling water used in each of the first tank, the second tank, and the cooler is changed based on the temperature of the processing liquid measured by each temperature sensor. It becomes possible to supply an appropriate amount of cooling water to each of the first tank, the second tank, and the cooler according to the temperature of the treatment liquid.

  According to the invention described in claim 7, the ratio of the cooling water used in each of the first tank, the second tank and the cooler is changed based on the liquid level of the processing liquid measured by each liquid level sensor. Therefore, it becomes possible to supply an appropriate amount of cooling water to each of the first tank, the second tank, and the cooler according to the amount of the processing liquid.

  According to the eighth aspect of the present invention, the ratio of the cooling water used in each of the first tank, the second tank, and the cooler is changed based on the temperature of the cooling water measured by each temperature sensor. It is possible to supply an appropriate amount of cooling water corresponding to the amount required for cooling to each of the first tank, the second tank, and the cooler.

It is a schematic diagram of the processing liquid cooling device concerning this invention. 2 is a schematic diagram showing a cooling water supply system to a first tank 11, a second tank 12, and a cooler 13. FIG. It is a block diagram which shows the main control systems of the process liquid cooling device which concerns on 1st Embodiment of this invention. It is explanatory drawing which shows typically the operation | movement which cools a process liquid by a one-pass system. It is explanatory drawing which shows typically the operation | movement which cools a process liquid by a one-pass system. It is explanatory drawing which shows typically the operation | movement which cools a process liquid by a continuous system. It is explanatory drawing which shows typically the operation | movement which cools a process liquid by a continuous system. It is a block diagram which shows the main control systems of the process liquid cooling device which concerns on 2nd Embodiment of this invention. 2 is a schematic diagram showing a cooling water supply system to a first tank 11, a second tank 12, and a cooler 13. FIG. It is a block diagram which shows the main control systems of the process liquid cooling device which concerns on 3rd Embodiment of this invention.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a schematic view of a processing liquid cooling apparatus according to the present invention.

  The processing liquid cooling apparatus includes a first tank 11 and a second tank 12 that temporarily store and cool high-temperature processing liquid discharged from the substrate processing apparatus via the discharge pipes 51, 54, and 57, and And a cooler 13 that cools the processing liquid sent from one tank 11 or the second tank 12 with high heat exchange efficiency. The processing liquid cooling device may be disposed inside the substrate processing apparatus, or may be installed as an apparatus different from the substrate processing apparatus.

  The discharge pipe 51 is, for example, a SPM (sulfur-acid and hydrogen-peroxide mixture) from a standby pod disposed at a standby position of a discharge nozzle that discharges processing liquid onto a substrate in a plurality of processing units in the substrate processing apparatus. This is for discharging the treatment liquid. Treatment liquid from a plurality of standby pods flows into the discharge pipe 51, and this treatment liquid enters the first tank 11 via the pipe line 52 when the on-off valve 36 is opened and the on-off valve 35 is closed. When the on-off valve 36 is closed and the on-off valve 35 is opened, it flows down to the second tank 12 through the pipe line 53.

  The discharge conduit 54 is for discharging processing liquid such as SPM from a cup that captures processing liquid scattered from the substrate in a plurality of processing units in the substrate processing apparatus, for example. The treatment liquid from a plurality of cups flows into the discharge pipe 54, and the treatment liquid flows down to the first tank 11 through the pipe 55 when the on-off valve 34 is opened and the on-off valve 33 is closed. Then, when the on-off valve 34 is closed and the on-off valve 33 is opened, it flows down to the second tank 12 through the pipeline 56.

  The discharge conduit 57 is for discharging, for example, a processing liquid such as sulfuric acid used for cleaning each processing unit in a plurality of processing units in the substrate processing apparatus. The treatment liquid from the plurality of treatment units flows into the discharge pipe 57, and this treatment liquid enters the first tank 11 through the pipe 58 when the on-off valve 32 is opened and the on-off valve 31 is closed. When the on-off valve 32 is closed and the on-off valve 31 is opened, it flows down to the second tank 12 via the pipe line 59.

  A spiral cooling water flow passage 15 is disposed in the first tank 11. Cooling water is supplied from the cooling water inflow conduit 23 to the cooling water flow passage 15, and the cooling water used for cooling the processing liquid in the first tank 11 is discharged from the cooling water flow passage 15 to the cooling water discharge conduit 24. . Further, a spiral cooling water flow passage 16 is disposed in the second tank 12. Cooling water is supplied from the cooling water inflow conduit 25 to the cooling water flow passage 16, and the cooling water used for cooling the processing liquid in the second tank 12 is discharged from the cooling water flow passage 16 to the cooling water discharge conduit 26. . Furthermore, the cooler 13 can store the coolant, and the coolant is supplied from the coolant inflow pipe 21 into the cooler 13, and is used for cooling the treatment liquid flowing through the spiral treatment liquid flow passage 17. The cooled water thus discharged is discharged from the cooler 13 to the cooling water discharge line 22.

  In addition, although illustration is abbreviate | omitted, in the 1st tank 11 and the 2nd tank 12, the bubbling mechanism which cools and diffuses a process liquid by spraying air in a process liquid is arrange | positioned. . In addition to this bubbling mechanism, a pressure reducing mechanism that promotes cooling of the processing liquid by reducing the pressure in the first tank 11 and the second tank 12 may be provided.

  In the first tank 11 and the second tank 12, it is possible to cool a predetermined amount of the processing liquid in the storage state by the action of the cooling water flow passages 15 and 16. On the other hand, in the cooler 13, it is possible to quickly cool the processing liquid having a small capacity passing through the processing liquid flow passage 17 by the cooling water having a large capacity stored therein.

  The pipe 61 connected to the bottom of the first tank 11 is connected to the lower end of the processing liquid flow passage 17 in the cooler 13 via the on-off valve 41, the pipe 63 and the liquid feed pump 27. Further, the pipe line 62 connected to the bottom of the second tank 12 is connected to the lower end part of the processing liquid flow path 17 in the cooler 13 via the on-off valve 42, the pipe line 63 and the liquid feed pump 27. The opening / closing valve 41 and the opening / closing valve 42 are configured such that when one of them is opened, the other is closed.

  The pipe line 67 connected to the bottom of the first tank 11 is connected to the waste liquid part 14 via the on-off valve 43, the waste liquid pump 28, the on-off valve 45, and the pipe line 69. Further, the pipe line 68 connected to the bottom of the second tank 12 is connected to the waste liquid part 14 via the on-off valve 44, the waste liquid pump 28, the on-off valve 45 and the pipe line 69. In addition, when the process liquid discharged | emitted from the 1st tank 11 and the 2nd tank 12 flows down to the waste liquid part 14 with dead weight, you may abbreviate | omit the waste liquid pump 28. FIG.

  In FIG. 1, the pipeline 61 and the pipeline 67 are connected to the bottom of the first tank 11. However, the pipe 61 and the pipe 67 may be connected to the lower side of the side surface of the first tank 11, and the pipe 61 and the pipe 67 enter the first tank 11 from above the first tank 11. And the structure by which the front-end | tip may be arrange | positioned near the bottom face of the 1st tank 11 may be sufficient. Similarly, in FIG. 1, the pipeline 62 and the pipeline 68 are connected to the bottom of the second tank 12. However, the pipe line 62 and the pipe line 68 may be connected below the side surface of the second tank 12, and the pipe line 62 and the pipe line 68 enter the second tank 12 from above the second tank 12. And the structure by which the front-end | tip is arrange | positioned in the bottom face vicinity of the 2nd tank 12 may be sufficient.

  The upper end portion of the processing liquid flow path 17 in the cooler 13 is a path that reaches the first tank 11 via the on-off valve 38 and the pipe line 64 and a path that reaches the second tank 12 via the on-off valve 39 and the pipe line 65. Branching to the opening / closing valve 45 via the opening / closing valve 37 and the conduit 66 and branching to the waste liquid section 14 via the conduit 69. One of the on-off valve 37, the on-off valve 38, and the on-off valve 39 is selectively opened, and the other two are closed.

  In FIG. 1, the processing liquid passing through the cooler 13 circulates from the lower end portion of the processing liquid flow passage 17 toward the upper end portion, but the processing liquid flow passage 17 is directed from the upper end portion to the lower end portion. You may pass through. Further, the treatment liquid flow passage 17 may be formed not in the vertical direction shown in FIG. 1 but in the horizontal direction.

  When the on-off valve 41 and the on-off valve 37 are opened, the processing liquid in the first tank 11 is piped from the first tank 11 through the processing liquid flow passage 17 in the cooler 13 by the action of the liquid feed pump 27. The liquid is sent to the passage 66 and discharged to the waste liquid section 14 through the on-off valve 45 and the pipe 69. Further, the processing liquid in the first tank 11 passes from the first tank 11 through the processing liquid flow passage 17 in the cooler 13 by the action of the liquid feed pump 27 in a state where the on-off valve 41 and the on-off valve 39 are opened. To the second tank 12. Furthermore, when the on-off valve 43 is opened, the processing liquid in the first tank 11 is discharged to the waste liquid section 14 through the on-off valve 45 and the pipe 69 by the action of the waste liquid pump 28.

  When the on-off valve 42 and the on-off valve 37 are opened, the processing liquid in the second tank 12 is piped from the second tank 12 through the processing liquid flow passage 17 in the cooler 13 by the action of the liquid feed pump 27. The liquid is sent to the passage 66 and discharged to the waste liquid section 14 through the on-off valve 45 and the pipe 69. Further, the processing liquid in the second tank 12 passes from the second tank 12 through the processing liquid flow path 17 in the cooler 13 by the action of the liquid feeding pump 27 in a state where the on-off valve 42 and the on-off valve 38 are opened. To the first tank 11. Furthermore, when the on-off valve 44 is opened, the processing liquid in the second tank 12 is discharged to the waste liquid section 14 through the on-off valve 45 and the pipe 69 by the action of the waste liquid pump 28.

  FIG. 2 is a schematic diagram showing a cooling water supply system to the first tank 11, the second tank 12 and the cooler 13.

  The cooling water from the cooling water supply source 70 is supplied to the processing liquid cooling apparatus according to the present invention via the pipe line 81. The cooling water includes a cooling water inflow conduit 21 for supplying cooling water into the cooler 13 described above, a cooling water inflow conduit 23 for supplying cooling water to the cooling water flow passage 15 of the first tank 11, It is separated into a cooling water inflow conduit 25 for supplying cooling water to the cooling water flow passage 16 of the second tank 12, and is supplied to the cooler 13, the first tank 11 and the second tank 12. The cooling water used for cooling the processing liquid in the cooler 13, the first tank 11, and the second tank 12 includes a cooling water discharge pipe 22 that discharges the cooling water from the cooler 13, and cooling of the first tank 11. Liquid is sent to a common pipe 82 via a cooling water discharge pipe 24 for discharging cooling water from the water flow path 15 and a cooling water discharge pipe 26 for discharging cooling water from the cooling water flow path 16 of the second tank 12. And discharged to the cooling water discharge portion 71.

  A flow rate adjusting valve 73 for adjusting the amount of cooling water supplied to the cooler 13 is disposed in the cooling water inflow conduit 21, and the amount of cooling water supplied to the cooler 13 is set in the cooling water discharge conduit 22. A flow meter 76 for measurement is provided. The cooling water inflow conduit 23 is provided with a flow rate adjusting valve 72 for adjusting the amount of cooling water supplied to the first tank 11, and the cooling water discharge conduit 24 is supplied to the first tank 11. A flow meter 75 for measuring the amount of cooling water is provided. Further, a flow rate adjusting valve 74 for adjusting the amount of cooling water supplied to the second tank 12 is disposed in the cooling water inflow conduit 25, and the cooling water discharge conduit 26 is supplied to the second tank 12. A flow meter 77 is provided for measuring the amount of cooling water.

  The flow rate adjusting valves 72, 73, 74, the cooler 13, the first tank 11, the second tank 12, and the flow meters 75, 76, 77 do not have to be in the positional relationship shown in FIG. . Each flow control valve 72, 73, 74 may be disposed downstream of the cooler 13, the first tank 11 and the second tank 12, and each flow meter 75, 76, 77 is provided with the cooler 13, The first tank 11 and the second tank 12 may be disposed on the upstream side.

  FIG. 3 is a block diagram showing a main control system of the processing liquid cooling apparatus according to the first embodiment of the present invention.

  The processing liquid cooling apparatus includes a CPU that executes logical operations, a ROM that stores an operation program necessary for controlling the apparatus, and a RAM that temporarily stores data during control, and controls the entire apparatus. 90. This control unit is connected to the above-described on-off valve 31, 32, 33, 34, 35, 36, 37, 38, 39, 41, 42, 43, 44, 45, and the valve driving unit 91 for opening and closing. Yes. These on-off valves 31, 32, 33, 34, 35, 36, 37, 38, 39, 41, 42, 43, 44, 45 are controlled to be opened and closed by the control unit 90 via the valve drive unit 91. The control unit 90 is connected to the liquid feed pump 27 and the waste liquid pump 28 described above. Further, the control unit 90 is also connected to the above-described flow rate adjusting valves 72, 73, 74 and flow meters 75, 76, 77.

  Although not shown in FIG. 1, the first tank 11 includes a temperature sensor 92 that detects the temperature of the processing liquid stored in the first tank 11 and a liquid level of the stored processing liquid. A liquid level sensor 94 is provided. The second tank 12 is provided with a temperature sensor 93 for detecting the temperature of the processing liquid stored in the second tank 12 and a liquid level sensor 95 for detecting the liquid level of the stored processing liquid. ing. Further, a temperature sensor 99 for detecting the temperature of the processing liquid discharged through the cooler 13 is disposed on the downstream side of the processing liquid flow passage 17. The controller 90 is also connected to these temperature sensors 92, 93, 99 and liquid level sensors 94, 95.

  As the temperature sensors 92, 93, and 99, a resistance temperature detector, a thermocouple, a sensor that measures temperature by detecting infrared rays emitted from the processing liquid, and the like can be used. As the liquid level sensors 94 and 95, a sensor that measures the height of the liquid by detecting capacitance, an optical sensor, or the like can be used.

  Next, the cooling operation of the processing liquid in the above-described processing liquid cooling apparatus will be described. First, the operation of cooling the processing liquid by the one-pass method that selectively uses the first tank 11 and the second tank 12 will be described. 4 and 5 are explanatory views schematically showing the operation of cooling the processing liquid by the one-pass method. In FIGS. 4 and 5, the region where the processing liquid flows in the processing liquid feeding path is represented by a bold line. The same applies to the following drawings.

  First, a high-temperature processing liquid is discharged from the substrate processing apparatus to the first tank 11. When the temperature of the processing liquid reaches the first tank 11, it is about 100 degrees Celsius, for example. This processing liquid is stored in the first tank 11. The processing liquid stored in the first tank 11 is cooled by the cooling water passing through the spiral cooling water flow passage 15 disposed in the first tank 11. The cooling water supplied to the cooling water flow passage 15 from the cooling water inflow conduit 23 and used for cooling the processing liquid is discharged from the cooling water flow passage 15 to the cooling water discharge conduit 24. The temperature of the processing liquid in the first tank 11 at this time is detected by the temperature sensor 92 shown in FIG. 2, and the liquid level of the processing liquid is detected by the liquid level sensor 94 shown in FIG.

  If the temperature of the processing liquid stored in the first tank 11 is about 80 degrees Celsius, the processing liquid in the first tank 11 is transferred to the waste liquid section 14 via the cooler 13 as shown in FIG. Discharge. The temperature of the processing liquid at this time is lowered to about 35 degrees Celsius by the action of the cooler 13 that efficiently cools the processing liquid. When the processing liquid in the first tank 11 is discharged, the high-temperature processing liquid discharged from the substrate processing apparatus is discharged to the first tank 11. Thereby, a high temperature process liquid can be made to pass through the cooler 13 preferentially. FIG. 4 shows such a state.

  Instead of discharging the high temperature processing liquid discharged from the substrate processing apparatus to the first tank 11, the high temperature processing liquid discharged from the substrate processing apparatus may be discharged to the second tank 12. In the case of adopting such a configuration, the processing liquid can be gradually cooled in the second tank 12 while the total amount of the processing liquid passing through the cooler 13 is being suppressed.

  Further, when there is a processing liquid stored in the second tank 12, if the temperature is about 80 degrees Celsius, the processing liquid in the second tank 12 is passed through the cooler 13 as shown in FIG. 5. And discharged to the waste liquid section 14. The temperature of the processing liquid at this time is also lowered to about 50 degrees Celsius due to the action of the cooler 13 that efficiently cools the processing liquid. On the other hand, when the processing liquid in the second tank 12 is discharged, the high-temperature processing liquid discharged from the substrate processing apparatus is discharged into the second tank 12 as described above.

  In this way, the high-temperature processing liquid discharged from the substrate processing apparatus is preferentially introduced into the cooler 13 by cooling the processing liquid by the one-pass method using the first tank 11 and the second tank 12 alternately. Thus, the processing liquid can be efficiently cooled.

  Next, another embodiment of the processing liquid cooling operation in the above-described processing liquid cooling apparatus will be described. In this embodiment, an operation for cooling the processing liquid by a continuous method in which the first tank 11 and the second tank 12 are continuously used will be described. 6 and 7 are explanatory diagrams schematically showing the operation of cooling the processing liquid by the continuous method.

  From the substrate processing apparatus, the high temperature processing liquid is discharged to the first tank 11. When the temperature of the processing liquid reaches the first tank 11, it is about 150 degrees Celsius, for example. This processing liquid is temporarily stored in the first tank 11. The processing liquid stored in the first tank 11 is gradually cooled by the cooling water passing through the spiral cooling water flow passage 15 disposed in the first tank 11. The cooling water supplied to the cooling water flow passage 15 from the cooling water inflow conduit 23 and used for cooling the processing liquid is discharged from the cooling water flow passage 15 to the cooling water discharge conduit 24. The temperature of the processing liquid in the first tank 11 at this time is detected by the temperature sensor 92 shown in FIG. 2, and the liquid level of the processing liquid is detected by the liquid level sensor 94 shown in FIG.

  The processing liquid temporarily stored in the first tank 11 is stored in the second tank 12 via the cooler 13, as shown in FIG. At this time, the temperature of the processing liquid is lowered to about 80 degrees Celsius by the action of the cooler 13 that cools the processing liquid with high efficiency. If the temperature of the processing liquid stored in the second tank 12 reaches about 60 degrees Celsius, the processing liquid in the second tank 12 is passed through the cooler 13 as shown in FIG. To discharge. The temperature of the processing liquid at this time is also lowered to about 35 degrees Celsius due to the action of the cooler 13 that efficiently cools the processing liquid. Conversely, if the temperature of the processing liquid stored in the second tank 12 is higher than 60 degrees Celsius, the processing liquid stored in the second tank 12 is returned to the first tank 11 via the cooler 13. . By repeating this operation, the temperature of the processing liquid is lowered.

  When performing the cooling operation by the one-pass method and the continuous method as described above, the cooling water is supplied to the first tank 11, the second tank 12, and the cooler 13, and is used for cooling the processing liquid. At this time, the amount of cooling water used in the processing liquid cooling apparatus is set in advance depending on where the substrate processing apparatus is installed. Generally, when a plurality of substrate processing apparatuses are installed, the cooling water is connected so as to cross the plurality of substrate processing apparatuses in series. Therefore, if there is a change in the amount of cooling water used in each substrate processing apparatus, the amount of cooling water flowing through the cooling water supply source 70 and the cooling water discharge unit 71 will be affected. In order to eliminate the influence on other substrate processing apparatuses and the cooling water supply source in the factory, it is necessary to always keep the amount of cooling water used in the substrate processing apparatus constant. For this reason, in the treatment liquid cooling apparatus according to the present invention, the first tank 11 in the apparatus is kept in a state where the total amount of cooling water used in the first tank 11, the second tank 12 and the cooler 13 is constant. A configuration is adopted in which the ratio of the cooling water used in each of the second tank 12 and the cooler 13 is changed.

  That is, in this processing liquid cooling apparatus, the temperature of the processing liquid in the first tank 11 measured by the temperature sensor 92, the liquid level of the processing liquid in the first tank 11 measured by the liquid level sensor 94, and the temperature sensor. Based on the temperature of the processing liquid in the second tank 12 measured by 93 and the liquid level of the processing liquid in the second tank 12 measured by the liquid level sensor 95, the first tank 11, the second tank 12 and the cooling The structure which changes the ratio of the cooling water used in each of the vessels 13 is adopted.

  The ratio of the cooling water used in each of the first tank 11, the second tank 12 and the cooler 13 at this time is changed by the controller 90 changing the opening degree of the flow rate adjusting valves 72, 73, 74. Executed. The ratio of the cooling water used in each of the first tank 11, the second tank 12 and the cooler 13 at this time is the temperature and level of the processing liquid in the first tank 11 and the processing in the second tank 12. Based on the relationship between the temperature of the liquid and the liquid level, it is experimentally determined and stored in advance.

  That is, with respect to the 1st tank 11 and the 2nd tank 12, the quantity of the processing liquid stored there is large, and a quantity of cooling water is used, so that the temperature of a processing liquid is high. In the cooler 13, for example, a larger amount of cooling water is preferentially used when the processing liquid passes through it, and only a small amount of cooling water is used when the processing liquid does not pass therethrough. Such a rule regarding the ratio of the cooling water sent to the first tank 11, the second tank 12 and the cooler 13 is stored in the control unit 90 in advance.

  In addition, the flow rate of the cooling water used in the first tank 11, the cooler 13, and the second tank 12 at this time is measured by the flow meters 75, 76, 77, and the control unit 90 Sent to. The control unit 90 determines the total value of the cooling water flow measured by the flow meters 75, 76, 77, that is, the total amount of cooling water used in the first tank 11, the second tank 12 and the cooler 13. The opening degree of the flow rate adjusting valves 72, 73, 74 is changed so as to be constant.

  By adopting such a configuration, by supplying an appropriate amount of cooling water to the first tank 11, the second tank 12 and the cooler 13 according to the processing situation, it is possible to efficiently treat the processing liquid. Cooling can be performed. At this time, since the total amount of the cooling water used in the first tank 11, the second tank 12, and the cooler 13 is constant, it is possible to eliminate the influence on other devices that use the cooling water.

  Next, another embodiment of the present invention will be described. FIG. 8 is a block diagram showing a main control system of the processing liquid cooling apparatus according to the second embodiment of the present invention. In addition, about the member similar to 1st Embodiment mentioned above, the same code | symbol is attached | subjected and detailed description is abbreviate | omitted.

  In the processing liquid cooling apparatus according to the first embodiment described above, the temperature of the processing liquid in the first tank 11 measured by the temperature sensor 92 and the liquid of the processing liquid in the first tank 11 measured by the liquid level sensor 94. The first tank 11, the first tank 11, the second tank 12, the temperature of the treatment liquid in the second tank 12 measured by the temperature sensor 93, and the treatment liquid level in the second tank 12 measured by the liquid level sensor 95. The structure which changes the ratio of the cooling water used in each of 2 tank 12 and the cooler 13 is employ | adopted. On the other hand, in the processing liquid cooling device according to the second embodiment, the first tank 11, the first tank 11, the second tank 12, and the cooling water discharged from the cooler 13 are used. The structure which changes the ratio of the cooling water used in each of 2 tank 12 and the cooler 13 is employ | adopted.

  That is, the processing liquid cooling apparatus according to the second embodiment includes a temperature sensor 96 that measures the temperature of the cooling water in the cooling water discharge pipe 22 that discharges the cooling water from the cooler 13 shown in FIG. A temperature sensor 97 that measures the temperature of the cooling water in the cooling water discharge pipe 24 that discharges the cooling water from the tank 11, and the temperature of the cooling water in the cooling water discharge pipe 26 that discharges the cooling water from the second tank 12. And a temperature sensor 98 for measuring.

  When the cooling water for cooling each of the first tank 11, the second tank 12 and the cooler 13 is insufficient, the temperature of the cooling water discharged from the first tank 11, the second tank 12 and the cooler 13 is increased, When the cooling water for cooling each of the first tank 11, the second tank 12 and the cooler 13 is sufficient, the temperature of the cooling water discharged from the first tank 11, the second tank 12 and the cooler 13 is lowered. . For this reason, in the processing liquid cooling apparatus according to the second embodiment, the temperature of the cooling water used for cooling the processing liquid in the first tank 11 measured by the temperature sensor 97 and the second temperature measured by the temperature sensor 98 are used. Based on the temperature of the cooling water used for cooling the processing liquid in the tank 12 and the temperature of the cooling water used for cooling the processing liquid passing through the cooler 13 measured by the temperature sensor 96. 11, the structure which changes the ratio of the cooling water used in each of the 2nd tank 12 and the cooler 13 is employ | adopted.

  Also in this second embodiment, the flow rate of the cooling water used in the first tank 11, the cooler 13 and the second tank 12 is measured by the flow meters 75, 76, 77, and the flow meters 75, 76, 77 to the control unit 90. The control unit 90 determines the total value of the cooling water flow measured by the flow meters 75, 76, 77, that is, the total amount of cooling water used in the first tank 11, the second tank 12 and the cooler 13. The opening degree of the flow rate adjusting valves 72, 73, 74 is changed so as to be constant.

  Next, still another embodiment of the present invention will be described. FIG. 9 is a schematic diagram showing a cooling water supply system to the first tank 11, the second tank 12 and the cooler 13 in the processing liquid cooling apparatus according to the third embodiment of the present invention. FIG. 10 is a block diagram showing a main control system of the processing liquid cooling apparatus according to the third embodiment of the present invention. In addition, about the member similar to 1st, 2nd embodiment mentioned above, the same code | symbol is attached | subjected and detailed description is abbreviate | omitted.

  In the processing liquid cooling apparatus according to the first embodiment and the second embodiment described above, the flow rate of the cooling water used in the first tank 11, the cooler 13, and the second tank 12 is determined by the flow meters 75, 76, 77. The total value of the cooling water flow rate measured by these flow meters 75, 76, 77, that is, the total amount of cooling water used in the first tank 11, the second tank 12 and the cooler 13 is constant. The structure which changes the opening degree of the flow regulating valves 72, 73, 74 is adopted. In contrast, the treatment liquid cooling apparatus according to the third embodiment includes a pressure gauge 79 that measures the pressure of the cooling water discharged from the first tank 11, the second tank 12, and the cooler 13. A configuration is adopted in which the ratio of the cooling water used in each of the first tank 11, the second tank 12 and the cooler 13 is changed in a state where the pressure of the cooling water measured by the pressure gauge 79 is constant. .

  That is, in the processing liquid cooling apparatus according to the third embodiment, a pressure gauge 78 is disposed in a pipe 81 for supplying cooling water from a cooling water supply source 70, and cooling water is supplied to a cooling water discharge unit 71. A pressure gauge 79 is disposed in a pipe line 82 for feeding the liquid. And the control part 90 changes the ratio of the cooling water used in each of the 1st tank 11, the 2nd tank 12, and the cooler 13 in the state which made the pressure of the cooling water measured with the pressure gauge 79 constant. The structure to be adopted is adopted. At this time, the pressure of the cooling water measured by the pressure gauge 78 is also constant.

  If the flow path resistance in the first tank 11, the second tank 12 and the cooler 13 is the same, if the total amount of cooling water used in the first tank 11, the second tank 12 and the cooler 13 is constant, The pressure of the cooling water measured by the pressure gauge 79 is also constant. In such a case, if the pressure of the cooling water measured by the pressure gauge 79 is constant, the total amount of the cooling water used in the first tank 11, the second tank 12 and the cooler 13 is constant. Can do. However, when the flow path resistances in the first tank 11, the second tank 12 and the cooler 13 are different from each other, even when the pressure of the cooling water measured by the pressure gauge 79 is constant, the first tank 11, When the ratio of the cooling water used in each of the second tank 12 and the cooler 13 varies, the total amount of the cooling water used in the first tank 11, the second tank 12 and the cooler 13 changes slightly. Will do.

  However, when the pressure of the cooling water measured by the pressure gauge 79 is constant, the ratio of the cooling water used in each of the first tank 11, the second tank 12 and the cooler 13 varies with the first tank. 11, the variation of the total amount of cooling water used in the second tank 12 and the cooler 13 is negligible. Even in such a case, the first tank 11, the second tank 12 and the cooler 13 are used. The total amount of cooling water can be made substantially constant. The total amount of cooling water in the present invention is a concept including the case where the pressure is constant and the total amount of cooling water is substantially constant.

  As in the third embodiment, the ratio of the cooling water used in each of the first tank 11, the second tank 12 and the cooler 13 with the pressure of the cooling water measured by the pressure gauge 79 being constant. Even in the case of adopting a configuration for changing the temperature, as in the case of the first and second embodiments, it is possible to efficiently cool the processing liquid, and the first tank 11, the second tank 12, and Since the total amount of cooling water used in the cooler 13 is substantially constant, it is possible to eliminate the influence on other devices that use the cooling water.

  In the above-described embodiment, the processing liquid is cooled using the first tank 11 and the second tank 12 and the cooler. However, using the single tank and the cooler, or The processing liquid may be cooled using three or more tanks and a cooler. Alternatively, the processing liquid may be cooled using only two or more tanks.

DESCRIPTION OF SYMBOLS 11 1st tank 12 2nd tank 13 Cooler 14 Waste liquid part 15 Cooling water flow path 16 Cooling water flow path 17 Processing liquid flow path 21 Cooling water inflow conduit 22 Cooling water discharge conduit 23 Cooling water inflow conduit 24 Cooling water discharge conduit 25 Cooling water inflow line 26 Cooling water discharge line 27 Liquid feed pump 28 Waste liquid pump 70 Cooling water supply source 71 Cooling water discharge part 72 Flow rate adjusting valve 73 Flow rate adjusting valve 74 Flow rate adjusting valve 75 Flow meter 76 Flow meter 77 Flow meter 78 Pressure gauge 79 Pressure gauge 92 Temperature sensor 93 Temperature sensor 94 Liquid level sensor 95 Liquid level sensor 96 Temperature sensor 97 Temperature sensor 98 Temperature sensor 99 Temperature sensor

Claims (9)

In the cooling device that cools the high-temperature processing liquid discharged from the substrate processing apparatus with cooling water,
A plurality of cooling units for cooling the high-temperature treatment liquid with cooling water;
The cooling used in each of the plurality of cooling units in a state where the total amount of cooling water used in the plurality of cooling units is substantially constant according to the cooling capacity required in each of the plurality of cooling units. A flow control unit for changing the water ratio;
A treatment liquid cooling apparatus comprising: The processing liquid cooling device according to claim 1,
A flow meter for measuring a total amount of cooling water used in the plurality of cooling units;
The said flow control part is a process liquid cooling device which changes the ratio of the cooling water used in each of these cooling parts in the state which made the flow volume of the cooling water measured with the said flow meter constant. The processing liquid cooling device according to claim 1,
A pressure gauge for measuring the pressure of cooling water discharged from the plurality of cooling units,
The said flow control part is a process liquid cooling device which changes the ratio of the cooling water used in each of these cooling parts in the state which made the pressure of the cooling water measured with the said pressure gauge constant. In the processing liquid cooling device in any one of Claims 1-3,
The plurality of cooling units are each connected to a flow rate adjustment valve that adjusts the amount of cooling water used in each cooling unit,
The said flow control part is a process liquid cooling device which changes the ratio of the cooling water used in each of these cooling parts by controlling each said flow regulating valve. In the cooling device that cools the high-temperature processing liquid discharged from the substrate processing apparatus with cooling water,
A first tank and a second tank capable of storing the high-temperature processing liquid and provided with a cooling water flow passage for cooling the processing liquid;
A cooler having a treatment liquid flow passage that stores cooling water therein and passes through the cooling water;
A treatment liquid feed line for sending a treatment liquid between the first tank, the second tank, a treatment liquid flow passage in the cooler, and a waste liquid portion of the treatment liquid;
The total amount of cooling water used in the first tank, the second tank, and the cooler is substantially constant according to the cooling capacity required for each of the first tank, the second tank, and the cooler. A flow rate control unit that changes a ratio of cooling water used in each of the first tank, the second tank, and the cooler,
A treatment liquid cooling apparatus comprising: In the processing liquid cooling device according to claim 5,
A temperature sensor that measures the temperature of the processing liquid stored in the first tank; and a temperature sensor that measures the temperature of the processing liquid stored in the second tank;
The flow rate control unit changes the ratio of the cooling water used in each of the first tank, the second tank, and the cooler based on the temperature of the processing liquid measured by each temperature sensor. . In the processing liquid cooling device according to claim 5,
A liquid level sensor for measuring the liquid level of the processing liquid stored in the first tank, and a liquid level sensor for measuring the liquid level of the processing liquid stored in the second tank,
The flow rate control unit changes the ratio of cooling water used in each of the first tank, the second tank, and the cooler based on the liquid level of the processing liquid measured by each liquid level sensor. Cooling system. In the processing liquid cooling device according to claim 5,
A temperature sensor for measuring the temperature of the cooling water discharged from the first tank, the second tank and the cooler, respectively;
The flow rate control unit changes the ratio of cooling water used in each of the first tank, the second tank, and the cooler based on the temperature of the cooling water measured by each temperature sensor. . A substrate processing apparatus for processing a substrate by supplying a processing liquid to the substrate,
A substrate processing apparatus comprising the processing liquid cooling device according to claim 1.

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