JP6590529B2 - Piezoelectric device - Google Patents

Description

  The present invention relates to a piezoelectric device such as a crystal resonator or a crystal oscillator.

  As a piezoelectric device, a crystal resonator or a crystal oscillator for generating an oscillation signal that vibrates at a predetermined frequency is known (for example, Patent Document 1). Patent Document 1 discloses an oven controlled crystal oscillator (OCXO) in which a crystal resonator is housed in a thermostatic chamber.

  A crystal device such as a crystal resonator or a crystal oscillator has a crystal resonator element (piezoelectric resonator element) configured by providing a pair of excitation electrodes on both main surfaces of a plate-shaped crystal piece. The crystal resonator element is mounted on a mounting surface of an element mounting member that constitutes a part of the package of the crystal device. Specifically, first, a pair of extraction electrodes connected to a pair of excitation electrodes are provided on one main surface of the crystal resonator element. On the other hand, a pair of element pads is provided on the mounting surface of the element mounting member. The quartz resonator element is disposed opposite to the mounting surface of the element mounting member via a gap, and the pair of extraction electrodes and the pair of element pads are formed by a pair of conductive bumps disposed therebetween. Be joined. Thereby, the crystal resonator element is fixed and electrically connected to the element mounting member.

JP 2006-311496 A

  The mounting surface of the element mounting member may be deformed due to various factors. For example, when heat is applied to the piezoelectric device, the mounting surface of the element mounting member is warped due to a difference in thermal expansion between portions of the package. The deformation of the mounting surface causes a change in the relative position of the pair of element pads on the mounting surface, which in turn causes a deformation of the piezoelectric vibration element bonded to the pair of element pads. From another viewpoint, unintended stress is generated in the piezoelectric vibration element. And the characteristic change of a piezoelectric vibration element arises. Therefore, for example, there is a possibility that the intended frequency cannot be obtained in a crystal resonator housed in a thermostat and placed in a relatively high temperature environment. In addition, for example, when a piezoelectric device is used in an environment where the temperature change is large, there is a possibility that stable characteristics cannot be obtained.

  Therefore, it is preferable to provide a piezoelectric device that can reduce the influence of deformation of the element mounting member on the characteristics of the piezoelectric vibration element.

  A piezoelectric resonator element according to an aspect of the present invention includes an element mounting member having a pair of pads on a mounting surface, a piezoelectric element plate, a pair of excitation electrodes provided on both main surfaces of the piezoelectric element plate, and A piezoelectric vibration element having a pair of element terminals connected to the pair of excitation electrodes, disposed opposite to the mounting surface; and positioned between the mounting surface and the piezoelectric vibration element; And an interposition part joined to the pair of element terminals at a position away from the joining position in the direction along the mounting surface.

  Preferably, the interposition part is located between the mounting surface and the piezoelectric vibration element, and has a pair of conductive pieces joined to the pair of pads and the pair of element terminals. .

  Preferably, the pair of pads are separated from each other in a predetermined direction in a plan view of the mounting surface, and the pair of conductive pieces are separated from each other in the predetermined direction in a plan view of the mounting surface. In addition, the pair of excitation electrodes extends from a bonding position with the pair of pads in a direction orthogonal to the predetermined direction, and the pair of excitation electrodes are positioned between the pair of conductive pieces in a plan view of the mounting surface. The pair of element terminals are located on both sides in the predetermined direction with respect to the pair of excitation electrodes in a plan view of the mounting surface, and the pair of conductive pieces, It is joined to a portion extending in the orthogonal direction from the joining position.

  Preferably, each of the pair of conductive pieces protrudes toward the piezoelectric vibration element from the base portion positioned between the mounting surface and the piezoelectric vibration element, and contacts the outer peripheral surface of the piezoelectric vibration element. And a projecting portion capable of contacting.

  Preferably, the piezoelectric element plate is formed in a shape having a curved outer peripheral surface that swells on both sides in the predetermined direction in a plan view of the mounting surface, and the pair of conductive pieces are respectively mounted on the mounting surface. A base located between a surface and the piezoelectric vibration element, and two protrusions protruding from the base toward the piezoelectric vibration element and spaced apart from each other in a direction perpendicular to the predetermined direction, In the piezoelectric vibration element, a portion that swells on both sides in the predetermined direction is located between the two protruding portions of each of the pair of conductive pieces.

  Preferably, the element mounting member has a pair of pedestal portions raised from the mounting surface, and the pair of conductive pieces overlaps the pair of pads at one end side in a plan view of the mounting surface. The other end overlaps the pair of pedestal portions, and the pair of element terminals and the pair of conductive pieces are formed between the pair of pads and the pair of pedestal portions in plan view of the mounting surface. Are joined together.

  Preferably, the pair of pads have a width that overlaps the entire pair of conductive pieces in a plan view of the mounting surface.

  Preferably, the interposition part includes an insulating base positioned between the mounting surface and the piezoelectric vibration element, and a pair of wirings provided on the insulating base, and the pair of wirings is , Bonded to the pair of pads and the pair of element terminals.

  Preferably, the pair of wirings are bonded to the pair of pads at the center of the edges of both sides of the insulating base in the predetermined direction, and are orthogonal to the predetermined direction of the insulating base. Joined to the pair of element terminals at the center of the edges on both sides in the direction.

  Preferably, the insulating base includes a substrate portion facing the mounting surface and the piezoelectric vibration element, and a frame portion raised from the edge of the substrate portion toward the piezoelectric vibration element. And the pair of element terminals and the pair of wires are joined on the frame portion.

  Preferably, the piezoelectric element plate is made of quartz, and the insulating base is made of quartz.

  According to said structure, the influence which the deformation | transformation of an element mounting member has on the characteristic of a piezoelectric vibration element can be reduced.

1A is a perspective view of the crystal resonator according to the first embodiment of the present invention as viewed from the upper surface side, and FIG. 1B is a perspective view of the crystal resonator of FIG. 1A as viewed from the lower surface side. . The exploded perspective view which looked at the crystal oscillator of Drawing 1 from the upper surface side. The exploded perspective view which looked at the crystal oscillator of Drawing 1 from the undersurface side. 4A is a plan view showing the inside of the crystal resonator of FIG. 1, and FIG. 4B is a sectional view taken along line IVb-IVb of FIG. FIG. 5A is a plan view showing an element mounting member and conductive pieces according to the second embodiment of the present invention, and FIG. 5B is a perspective view of the conductive pieces. The exploded perspective view which looked at the crystal oscillator concerning a 3rd embodiment of the present invention from the upper surface side. The disassembled perspective view which looked at the crystal oscillator of FIG. 6 from the lower surface side. 8A is a plan view showing the inside of the crystal resonator of FIG. 6, and FIG. 8B is a cross-sectional view taken along the line VIIIb-VIIIb of FIG. The figure which shows the application example of a crystal oscillator.

  Hereinafter, a piezoelectric device according to an embodiment of the present invention will be described with reference to the drawings. Note that the drawings used in the following description are schematic, and the dimensional ratios and the like on the drawings do not necessarily match the actual ones. Further, for convenience of explanation, the drawings are provided with an orthogonal coordinate system including a D1 axis, a D2 axis, and a D3 axis that are orthogonal to each other.

  The piezoelectric device may be either upward or downward, but hereinafter, for convenience, terms such as an upper surface and a lower surface will be used with the positive side in the D3 axis direction as the upper side.

  Similar parts or members may be given different numbers and uppercase alphabet letters, such as “first excitation electrode 17A” and “second excitation electrode 17B”. In this case, simply “excitation electrode” 17 ”or the like.

  In the description of the second and subsequent embodiments, configurations that are the same as or similar to the configurations of the embodiments that have already been described are denoted by the same reference numerals as those that have been applied to the configurations of the embodiments that have already been described, and description thereof will be omitted. is there. In addition, even if a configuration corresponding to (similar to) the configuration of the embodiment already described is denoted by a reference numeral different from the configuration of the embodiment already described, matters that are not particularly described are described in detail. The configuration is the same as that of the embodiment.

<First Embodiment>
FIG. 1A is a perspective view of a crystal resonator 1 according to the first embodiment of the present invention (hereinafter, “crystal” may be abbreviated as “vibrator 1”) as viewed from above. is there. FIG. 1B is a perspective view of the vibrator 1 viewed from the lower surface side.

  The vibrator 1 is a piezoelectric device used to generate an oscillation signal that vibrates at a predetermined frequency. The size of the vibrator 1 may be appropriate. For example, in a comparatively small thing, the length (D1-axis direction or D2-axis direction) in planar view is 1-2 mm, and thickness (D3-axis direction) is 0.2-0.4 mm.

  The external shape of the vibrator 1 (its package 3) is, for example, approximately a thin rectangular parallelepiped shape. A plurality of external terminals 5 are provided on the lower surface. The vibrator 1 is disposed with its lower surface facing a mounting surface such as a circuit board (not shown), and a plurality of pads provided on the mounting surface and a plurality of external terminals 5 are a plurality of bumps (not shown). It is mounted by being joined by (for example, solder). In the vibrator 1, an AC voltage is applied to any two of the plurality of external terminals 5.

  More specifically, for example, the outer shape of the vibrator 1 is a rectangular parallelepiped shape having a lower surface recess 7 formed on the lower surface. The shape and size of the lower surface recess 7 may be set as appropriate. For example, the planar shape of the lower surface recess 7 is a generally rectangular shape having four sides parallel to the four sides of the generally rectangular bottom surface of the vibrator 1. Of the lower surface of the vibrator 1, the rectangular frame-shaped portion surrounding the lower surface recess 7 is formed such that one of the four sides (side extending in the D2 axis direction) is wider than the other pair of sides. .

  The plurality of external terminals 5 are provided, for example, at least at the four corners of the lower surface of the crystal unit 1. In the example of FIG. 1, in each of the two sides formed in a wide manner, three are arranged along each side, and a total of six are provided. The external terminal 5 is made of, for example, a conductive material (for example, metal) formed in a layer shape. The planar shape may be set as appropriate, for example, a rectangle.

  Two of the plurality of external terminals 5 are applied with an AC voltage for generating an oscillation signal. The other external terminal 5 is, for example, for mounting the vibrator 1 on a circuit board (not shown) by a bump, and is electrically floated or given a reference potential. Further, for example, the other external terminal 5 may be for applying a reference potential to the lid member 13 described later.

  In the description of the present embodiment, when it is called a rectangular parallelepiped or a rectangle, the shape includes those whose corners are chamfered so as not to impair the overall shape. For example, the rectangle includes one that is 1/10 or less the length of one side and chamfered so that one end of the one side is cut. The chamfering may occur unintentionally depending on the accuracy of etching or the like, or may be intentionally made. In addition, the rectangle includes those whose sides are slightly curved due to the accuracy of etching or the like.

  FIG. 2 is an exploded perspective view of the vibrator 1 as viewed from the upper surface side. FIG. 3 is an exploded perspective view of the vibrator 1 as viewed from the lower surface side.

  The vibrator 1 includes, for example, a crystal vibration element 9 (hereinafter, sometimes referred to as “vibration element 9”, which may be referred to as “vibration element 9”) that generates mechanical vibration when an AC voltage is applied, and crystal vibration. A box-shaped element mounting member 11 that accommodates the element 9, a lid member 13 that seals the opening of the element mounting member 11, and an interposition part 10 that is interposed between the crystal vibration element 9 and the element mounting member 11 are provided. is doing. The package 3 includes an element mounting member 11 and a lid member 13. For example, the inside of the package 3 is evacuated or sealed with nitrogen. In this embodiment, the point where the interposition part 10 is provided is one of the characteristics compared with the past. These specific configurations are, for example, as follows.

  The vibration element 9 includes, for example, a crystal piece 15, a first excitation electrode 17A (FIG. 2) and a second excitation electrode 17B (FIG. 3) for applying a voltage to the crystal piece 15, and the vibration element 9 as an element mounting member. 11 has a first extraction electrode 19A and a second extraction electrode 19B (FIG. 3). The first extraction electrode 19A is connected to the first excitation electrode 17A, and the second extraction electrode 19B is connected to the second excitation electrode 17B.

  The crystal piece 15 is a member that generates mechanical vibration when an alternating voltage is applied by a pair of excitation electrodes 17. The crystal piece 15 is formed, for example, in a plate shape having a constant thickness as a whole. The planar shape may be an appropriate shape, and in the present embodiment, a circular shape with a part cut. From another viewpoint, the crystal piece 15 has a curved outer peripheral surface that swells outward in a plan view.

  The excitation electrode 17 and the extraction electrode 19 are made of a conductive layer formed on the surface of the crystal piece 15. The conductive layer (the same applies to other conductive layers described later) is made of, for example, metal, and may be configured by laminating two or more types of conductive layers.

  The pair of excitation electrodes 17 are located, for example, on the center side of both main surfaces of the crystal piece 15 and face each other across the crystal piece 15. The pair of excitation electrodes 17 have, for example, the same shape and size as each other, and are completely overlapped in plan view. The shape of the excitation electrode 17 may be an appropriate shape. In the present embodiment, the circular shape is concentric with the outer edge of the crystal piece 15.

  For example, the first extraction electrode 19 </ b> A extends from the first excitation electrode 17 </ b> A to the radially outer side of the main surface of the crystal piece 15 on the first excitation electrode 17 </ b> A side, and passes through the outer peripheral surface of the crystal piece 15. 15 to the main surface of the second excitation electrode 17B side (element mounting member 11 side). Further, the second extraction electrode 19B extends, for example, the main surface of the crystal piece 15 on the second excitation electrode 17B side outward from the second excitation electrode 17B in the radial direction to the outer edge of the main surface. The ends of the pair of extraction electrodes 19 serve as element terminals 25 for mounting the vibration element 9 on the element mounting member 11 via the interposition part 10 as will be described later.

  The position of the pair of element terminals 25 may be an appropriate position as long as it is a position on the outer peripheral side of the crystal piece 15. In the present embodiment, the position of the pair of element terminals 25 is opposite to the center of the circle of the crystal piece 15. From another viewpoint, the pair of element terminals 25 are positioned on both sides in the D2 axis direction with respect to the pair of excitation electrodes 17 (the center in the present embodiment). Further, the shape and size of the pair of element terminals 25 may be set as appropriate. In the example of FIG. 3, the extraction electrode 19 is formed with a constant width over the whole, and as a result, the pair of element terminals 25 have the same width as the other part (wiring part) of the extraction electrode 19. It is a rectangle.

  Unlike the illustrated example, the second extraction electrode 19B extends through the outer peripheral surface of the crystal piece 15 to the main surface of the crystal piece 15 on the first excitation electrode 17A side, and the tip is the main surface. It may be located on the outer peripheral side. That is, the vibration element 9 may be reversible up and down.

  The element mounting member 11 is similar to, for example, a base body 27 that is the main body of the element mounting member 11, a pair of element pads 29 (FIG. 2) for mounting the vibration element 9, and a pair of element pads 29. The pair of pedestal pads 30 (FIG. 2) configured as described above and the plurality of external terminals 5 described above are provided.

  The base body 27 is made of an insulating material. The insulating material is, for example, ceramic or resin. The base body 27 may be composed of a plurality of members, or may be integrally formed as a whole. The base body 27 may have an appropriate shape as long as the vibration element 9 can be mounted and sealed. For example, the base body 27 has a shape in which an upper surface recess 31 (FIG. 2) is formed on the upper surface of a substantially rectangular parallelepiped and the above-described lower surface recess 7 is formed on the lower surface.

  The upper surface recess 31 is for accommodating the vibration element 9 and the interposition part 10. Its shape and size may be set appropriately. In the present embodiment, the upper surface recess 31 is a rectangle having a planar shape having four sides parallel to the four sides of the upper surface of the base body 27, and the width thereof is wider than the width of the lower surface recess 7.

  The pair of element pads 29 are provided, for example, on the bottom surface of the upper surface recess 31. More specifically, for example, the pair of element pads 29 are located at two adjacent corners among the four corners of the bottom surface of the upper surface recess 31. From another point of view, the pair of element pads 29 are provided side by side along one side of the bottom surface of the upper surface recess 31. The element pad 29 is made of, for example, a conductive layer. The planar shape may be set as appropriate, and is rectangular in the example of FIG.

  One external terminal 5 and one element pad 29 are connected by a connection conductor (not shown), and the other one external terminal 5 and another one element pad 29 are connected by a connection conductor (not shown). Yes. The connection conductor is constituted by, for example, a via conductor or an inner layer conductor provided inside the base body 27. Therefore, as will be described later, when the pair of extraction electrodes 19 and the pair of element pads 29 are connected via the interposition part 10, the pair of excitation electrodes 17 and the two external terminals 5 are electrically connected. Connected to.

  The pair of pedestal pads 30 are used for reinforcing the strength of the element mounting member 11 and / or assisting in mounting the vibration element 9 on the element mounting member 11. The pair of pedestal pads 30 are provided, for example, on the bottom surface of the upper surface recess 31. Therefore, the element mounting member 11 has a pedestal that rises from the mounting surface on which the pair of element pads 29 are provided. The pair of pedestal pads 30 are located at, for example, two corners of the bottom surface of the upper surface recess 31 where the pair of element pads 29 are not provided. In another aspect, the pair of pedestal pads 30 are formed on the pair of element pads 29 at positions away from the pair of element pads 29 in a direction orthogonal to the arrangement direction of the pair of element pads 29. They are arranged in parallel.

  The pedestal pad 30 has, for example, the same configuration as the element pad 29. That is, the pedestal pad 30 is configured by a metal layer provided on the bottom surface of the upper surface recess 31, and the height thereof is the same as that of the element pad 29. However, it may be made higher or lower than the element pad 29. The planar shape and the width of the pedestal pad 30 may be appropriately set. In the present embodiment, the shape and the width are substantially the same as those of the element pad 29.

  The pedestal pad 30 is in an electrically floating state, for example. However, the pedestal pad 30 may be applied with the same potential as that of the corresponding element pad 29 in the opposing direction (D1 axis direction) between the pair of element pads 29 and the pair of pedestal pads 30. More specifically, for example, the pedestal pad 30 may be electrically connected to the element pad 29 facing in the D1 axis direction by a wiring (not shown) on the surface of the element mounting member 11 or inside.

  The lid member 13 is constituted by a substantially rectangular metal plate, for example. The lid member 13 is overlapped and joined to the upper surface of the frame portion surrounding the upper surface recess 31 of the element mounting member 11. The joining is performed, for example, by welding metal layers provided on both. The lid member 13 may be made of an insulating material.

  The interposition part 10 has a pair of conductive pieces 21, for example. Each conductive piece 21 is formed in, for example, a substantially long shape, and is disposed between the element mounting member 11 and the vibration element 9, and one end side portion is bonded to the element pad 29 of the element mounting member 11, A portion away from the joining position to the other end side is joined to the element terminal 25 of the vibration element 9. Therefore, the vibration element 9 is elastically supported by the element mounting member 11 as compared with the case where the element terminal 25 is directly bonded to the element pad 29. The arrangement, material, shape, and the like of the pair of conductive pieces 21 may be appropriately set. For example, they are as follows.

  For example, the pair of conductive pieces 21 are aligned in the direction (D2 axis direction) of the pair of element pads 29 while the longitudinal direction thereof coincides with the direction (D1-axis direction) orthogonal to the direction in which the pair of element pads 29 are aligned. In the axial direction). In the following, regarding the description of the pair of conductive pieces 21, the side between the pair of conductive pieces 21 in the D2 axis direction may be referred to as the inside, and the opposite side may be referred to as the outside.

  Each conductive piece 21 is made of, for example, a single metal plate and has an appropriate shape by pressing and / or etching. For example, the conductive piece 21 includes a plate-like base portion 21 a disposed so as to face the bottom surface of the upper surface recess portion 31, and two protruding from the base portion 21 a to the side opposite to the bottom surface of the upper surface recess portion 31 (vibration element 9 side). And a protruding portion 21b.

  The base portion 21a includes, for example, a support portion 21aa that is bonded to the element pad 29, and an extending portion 21ab that extends from the support portion 21aa and to which the element terminal 25 is bonded. The planar shape of the support portion 21aa is, for example, a rectangle. The extending portion 21ab extends linearly from one side of the support portion 21aa with a width shorter than the length of the one side. That is, the base portion 21a is formed wider on the element pad 29 side than on the element terminal 25 side. The protruding portion 21b rises from an outer edge portion of the base portion 21a, for example, and is formed in a wall shape extending at a certain height along the edge portion.

  FIG. 4A is a plan view showing the inside of the vibrator 1 (a plan view with the lid member 13 removed). FIG. 4B is a cross-sectional view taken along line IVb-IVb in FIG. In FIG. 4A, for the sake of convenience, the surfaces of some members (29, 30) (that is, non-cross-sectional surfaces) are hatched.

  As shown in FIG. 4B, the element mounting member 11 is configured by stacking, for example, three layers of members. Specifically, the element mounting member 11 includes the flat substrate portion 27a, the upper surface frame portion 27b that forms the upper surface recess portion 31 on the upper surface side of the substrate portion 27a, and the lower surface recess portion 7 on the lower surface side of the substrate portion 27a. And a lower surface frame portion 27c. The upper surface of the substrate portion 27a constitutes the bottom surface of the upper surface recess 31.

  As shown in FIGS. 4A and 4B, the conductive piece 21 has the support portion 21aa located on the element pad 29 and the tip of the extension portion 21ab located on the pedestal pad 30. Be placed. The element pad 29 and the support portion 21aa are joined by the conductive bump 33 (FIG. 4B). Thereby, the conductive piece 21 is fixed to the element mounting member 11 and electrically connected thereto. The bump 33 is made of, for example, a conductive adhesive. The conductive adhesive is configured, for example, by mixing a conductive filler in a thermosetting resin. The tip of the extending portion 21ab floats from the pedestal pad 30 at a height substantially corresponding to the thickness of the bump 33.

  The vibration element 9 is disposed to face the bottom surface of the upper surface recess 31. At this time, the vibration element 9 is arranged so that the arrangement direction of the pair of element terminals 25 matches the arrangement direction of the element pads 29. The pair of element pads 29 are positioned on one side of the bottom surface of the upper surface recess 31, and the pair of element terminals 25 are positioned on the same straight line passing through the center of the vibration element 9. The position of the element pad 29 and the position of the pair of element terminals 25 are separated from each other in the direction (D1 axis direction) orthogonal to the arrangement direction of the pair of element pads 29.

  When the vibration element 9 is arranged from above the conductive piece 21 to face the bottom surface of the upper surface recess 31, the vibration element 9 includes the pair of excitation electrodes 17 between the pair of conductive pieces 21. A pair of element terminals 25 on both sides overlaps the extending portion 21ab of the pair of conductive pieces 21. The pair of element terminals 25 and the pair of extending portions 21ab are joined by a pair of conductive bumps 35 (FIG. 4B). Accordingly, the vibration element 9 is fixed to the pair of conductive pieces 21 and is electrically connected to the pair of conductive pieces 21. As a result, the vibration element 9 is supported (fixed) and electrically connected to the element mounting member 11 via the pair of conductive pieces 21. The configuration of the bump 35 is the same as that of the bump 33, for example.

  A part of the vibration element 9 on the side where the pair of element terminals 25 is provided fits between the two protruding portions 21 b of each conductive piece 21. Thereby, the vibration element 9 is positioned in the plane direction (D1-axis direction and D2-axis direction). In addition, it is preferable that the vibration element 9 abuts on the four protrusions 21b in total (fits in the gaps between the four protrusions 21b), but may actually be separated by a minute gap.

  The method for manufacturing the vibrator 1 described above may be substantially the same as the conventional method for manufacturing the vibrator except that the vibration element 9 is mounted via the conductive piece 21. At the time of mounting, for example, bumps 33 (conductive adhesive) are first applied on the element pads 29 using a dispenser or the like. Next, the conductive piece 21 is placed on the bump 33, the bump 33 is cured, and the conductive piece 21 is bonded to the element pad 29. Next, a bump 35 (conductive adhesive) is applied on the conductive piece 21 using a dispenser or the like. Next, the vibration element 9 is placed on the bump 35, the bump 35 is cured, and the vibration element 9 is bonded to the conductive piece 21.

  As described above, the vibrator 1 according to this embodiment includes the element mounting member 11, the vibration element 9, and the interposition part 10. The element mounting member 11 has a pair of element pads 29 on the bottom surface (mounting surface) of the upper surface recess 31. The vibration element 9 has a crystal piece 15, a pair of excitation electrodes 17 provided on both main surfaces of the crystal piece 15, and a pair of element terminals 25 connected to the pair of excitation electrodes 17. Oppositely disposed on the bottom surface of the upper surface recess 31. The interposition part 10 is located between the upper surface recess 31 and the vibration element 9 and is even bonded to the pair of element pads 29, and the direction along the bottom surface of the upper surface recess 31 from the bonding position (D1-axis direction). Are joined to a pair of element terminals 25 at positions separated from each other.

  Therefore, for example, the vibration element 9 is elastically supported as compared with the case where the element terminal 25 of the vibration element 9 is directly bonded to the element pad 29 of the element mounting member 11. As a result, for example, even if the element mounting member 11 is deformed by heat and the relative position of the pair of element pads 29 is changed, a part of the change amount is absorbed by the interposition part 10. Thereby, deformation (stress) generated in the vibration element 9 is relieved, and consequently, a change in characteristics of the vibration element 9 is suppressed. Since the influence of the deformation of the element mounting member 11 on the characteristic change of the vibration element 9 is mitigated, for example, even if the vibrator 1 is used in a relatively high heat environment, the actual frequency characteristic is the intended frequency characteristic. Displacement is suppressed. Further, for example, even if the vibrator 1 is used in an environment where the temperature change is relatively large, it is possible to suppress the frequency characteristics from becoming unstable.

  Further, in the present embodiment, the interposition part 10 is located between the bottom surface (mounting surface) of the upper surface recess 31 and the vibration element 9 and joined to the pair of element pads 29 and the pair of element terminals 25. A pair of conductive pieces 21 is provided.

  Therefore, for example, compared to a third embodiment described later, the two conductive pieces are easily deformed independently of each other. As a result, for example, the stress transmitted to the vibration element 9 can be relaxed flexibly in response to the deformation of the element mounting member 11 in various directions. Further, for example, it is inexpensive because only a conductive piece such as a metal piece needs to be prepared.

  In the present embodiment, the pair of element pads 29 are provided apart from each other in the D2 axis direction (predetermined direction) in plan view. The pair of conductive pieces 21 are separated from each other in the D2 axis direction in a plan view, and extend in the D1 axis direction (a direction orthogonal to a predetermined direction) from the bonding position with the pair of element pads 29. . The pair of excitation electrodes 17 is located between the pair of conductive pieces 21 in plan view. The pair of element terminals 25 are located on both sides in the D2 axis direction with respect to the pair of excitation electrodes 17 in a plan view, and from the bonding position of the pair of conductive pieces 21 to the pair of element pads 29. It is joined to a portion extending in the D1 axis direction.

  Therefore, the vibration element 9 is supported on both sides of the excitation electrode 17 in the predetermined direction (D2 axis direction) and is stably supported. On the other hand, the length of the conductive piece 21 is not ensured in a predetermined direction, but is ensured in a direction orthogonal thereto. Therefore, for example, as compared with the case where the pair of element pads 29 are positioned outside the D2 axis direction with respect to the pair of element terminals 25, the vibration element 9, the pair of conductive pieces 21 and the pair The arrangement area of the element pads 29 is reduced. That is, the vibrator 1 can be miniaturized. In such a configuration, it is particularly preferable that the crystal piece 15 has a shape (for example, a circular shape or a similar shape) having a curved outer peripheral surface that swells on both sides in the D2 axis direction. In this case, the vibration element 9 and the pair of conductive pieces 21 overlap only on a part of both sides of the vibration element 9 in the D2 axis direction. As a result, the risk of unintended contact between the vibration element 9 and the conductive piece 21 can be reduced.

  In the present embodiment, the pair of conductive pieces 21 project from the base 21a located between the bottom surface (mounting surface) of the upper surface recess 31 and the vibration element 9, and from the base 21a toward the vibration element 9 to vibrate. And a protrusion 21b that can contact the outer peripheral surface of the element 9.

  Therefore, for example, the pair of conductive pieces 21 contribute not only to the elastic support of the vibration element 9 but also to the positioning of the vibration element 9 in the planar direction. As a result, variation in mounting of the vibration element 9 can be suppressed with a simple configuration. Further, if the vibration element 9 is positioned in contact with the vibration element 9 directly against the element mounting member 11, the contact may affect the vibration of the vibration element 9. On the other hand, in this embodiment, since positioning is performed via the conductive piece 21, the possibility that the contact for positioning affects the vibration of the vibration element 9 is reduced.

  In the present embodiment, the crystal piece 15 is formed in a shape having a curved outer peripheral surface that swells outward in plan view. Each of the pair of conductive pieces 21 has two protruding portions 21b. In the plan view, the vibration element 9 has a portion having a curved outer peripheral surface that bulges outward, and is positioned between the two protruding portions 21 b of each of the pair of conductive pieces 21.

  Therefore, when the vibration element 9 is placed on the base portion 21a, the vibration element 9 has a natural configuration in which a portion that swells outward is accommodated in the gap between the protruding portions 21b. Positioning can also be performed at. That is, the overall configuration is not wasteful and simple.

  In the present embodiment, the element mounting member 11 has a pair of pedestal pads 30 raised from the bottom surface of the upper surface recess 31. In the plan view, the pair of conductive pieces 21 have one end side overlapped with the pair of element pads 29 and the other end side overlapped with the pair of pedestal pads 30. The pair of element terminals 25 and the pair of conductive pieces 21 are joined between the pair of element pads 29 and the pair of base pads 30 in plan view.

  Therefore, for example, the bottom surface of the upper surface recess 31 is reinforced by the pedestal pad 30, and deformation of the element mounting member 11 is suppressed. Further, for example, when the pair of conductive pieces 21 are mounted on the element mounting member 11, even if the tip of the extension portion 21 ab (an opposite side to the support portion 21 aa) is inclined, the extension portion 21 ab The tip is supported by the pedestal pad 30 so that the inclination is suppressed. As a result, variation in mounting of the conductive piece 21 is suppressed. When the bumps 33 are cured and contracted, the conductive pieces 21 are separated from the pedestal pads 30 by lifting the tips of the extending portions 21ab. Therefore, the base pad 30 does not adversely affect the vibration of the vibration element 9. Even if the conductive piece 21 does not float from the pedestal pad 30, the vibration element 9 itself is not supported by the pedestal pad 30, but the conductive piece 21 is supported by the pedestal pad 30. The influence on the vibration of 9 is reduced.

Second Embodiment
FIG. 5A is a plan view showing the element mounting member 211 and the interposition part 210 (conductive piece 221) of the vibrator 201 according to the second embodiment of the present invention. FIG. 5B is a perspective view showing the conductive piece 221 of the vibrator 201.

  The vibrator 201 is different from the first embodiment in the conductor pattern on the bottom surface of the upper surface recess 31 of the element mounting member 211 and the shape of the conductive piece 221. Specifically, it is as follows.

  Only a pair of element pads 229 are provided on the bottom surface of the upper surface recess 31 of the element mounting member 211, and the base pad 30 is not provided. The pair of element pads 229 covers, for example, most of the bottom surface of the upper surface recess 31 as a whole. That is, the pair of element pads 229 have the same shape as the region when the bottom surface of the upper surface recess 31 is divided into two by a groove having a predetermined width and extending in the D1 axis direction. From another point of view, the pair of element pads 229 has an area that overlaps the entire pair of conductive pieces 221.

  Therefore, for example, instead of the base pad 30 of the first embodiment, the bottom surface (mounting surface) of the upper surface recess 31 is reinforced by the element pad 229, and the inclination of the conductive piece 221 is suppressed. Moreover, the area is large and the pattern is simple. Unlike the present embodiment, when the pair of element terminals 25 are directly joined to the pair of element pads 229, for example, when the vibration element 9 is tilted, the excitation electrode 17 and the element pad 229 having different potentials from each other Is close. As a result, an unintended electric field may affect the vibration of the vibration element 9. However, in the present embodiment, even if the vibration element 9 is tilted, the conductive piece 221 is interposed between the vibration element 9 and the element pad 229. The only element pad 229 and the conductive piece 221 are close to each other. Therefore, the influence of an unintended electric field on the vibration of the vibration element 9 is reduced.

  The conductive piece 221 is composed of, for example, a metal piece, for example, like the conductive piece 21 of the first embodiment, and is formed in a long shape in the D1 axis direction. Note that the conductive piece 221 includes only a base portion 221 a formed in a plate shape facing the bottom surface of the upper surface recess 31 and the vibration element 9. However, similarly to the first embodiment, the protruding portion 21b may be provided. Similarly to the first embodiment, the base portion 221a extends to be bonded to the element terminal 25, and the support portion 221aa bonded to the element pad 29, and extends from the support portion 221aa to a width smaller than the support portion 221aa. Part 221ab. A portion protruding inward is formed on the inner edge of the extending portion 221ab in order to secure a bonding area with the element terminal 25. However, such a portion may not be provided.

  As shown in FIG. 5 (b), the conductive piece 221 has a lower part on the upper surface side in the support portion 221aa. Thereby, for example, the possibility that the vibration element 9 abuts on the upper surface of the support portion 221aa is reduced.

  In addition, the conductive piece 221 has a lower surface on the extending portion 221ab. As a result, when the bump 33 (see FIG. 4B) that joins the support portion 221aa and the element pad 229 is cured, the lower surface of the extending portion 221ab is the bottom surface of the upper surface recess 31 (element pad 229). It is possible to reduce the risk of being kept in contact with the.

  Note that the processing for lowering a part of the upper surface of the conductive piece 221 or increasing a part of the lower surface of the conductive piece 221 may be realized by, for example, half etching.

<Third Embodiment>
FIG. 6 is an exploded perspective view of the vibrator 301 according to the third embodiment of the present invention as viewed from the upper surface side. FIG. 7 is an exploded perspective view of the vibrator 301 as viewed from the lower surface side.

  The vibrator 301 is mainly different from the first and second embodiments in the configuration of the interposition part. That is, in the first and second embodiments, the interposition part is configured by a pair of conductive pieces, whereas in this embodiment, the interposition part 310 is configured by one member. Specifically, it is as follows.

  The interposition part 310 includes an insulating base 321 and a first wiring 323A and a second wiring 323B provided on the insulating base 321.

  The insulating base 321 is made of, for example, resin or ceramic. More preferably, the insulating base 321 is made of the same material as the quartz piece 15 (that is, quartz in this embodiment). In addition, although the same material here points out that a composition is the same, More preferably, a structure (crystal structure) is also the same. Further, it is preferable that the insulating base 321 and the crystal piece 15 are arranged so that the crystal orientations coincide with each other.

  The insulating base 321 has, for example, a plate-like substrate portion 321a and a frame portion 321b (FIG. 6) provided on the outer edge of the upper surface of the substrate portion 321a. From another viewpoint, the insulating base 321 has a shape in which a concave portion is formed on the center side of the plate-like upper surface. The planar shape of the board | substrate part 321a and the frame part 321b is a rectangle, for example.

  The pair of wirings 323 is made of, for example, a conductive layer (metal layer) formed on the surface of the insulating base 321. The pair of wirings 323 reach the upper surface of the insulating base 321 from the lower surface through the side surface. Therefore, a portion of the pair of wirings 323 located on the lower surface side of the insulating base 321 is bonded to the pair of element pads 29, and a portion of the pair of wirings 323 located on the upper surface side of the insulating base 321 is one. By being bonded to the pair of element terminals 25, the vibration element 9 is mounted on the element mounting member 311 via the interposition part 310.

  Specifically, for example, the pair of element pads 29 are located near the center of a pair of sides parallel to each other on the bottom surface of the upper surface recess 31. On the other hand, the pair of element terminals 25 is located near the center of the remaining pair of sides. In the interposition part 310, each wiring 323 extends from the portion located near the center of one side of the lower surface of the insulating base 321 along the one side and one side orthogonal to the one side. The side surface extends and reaches the upper surface of the insulating base 321 (frame portion 321b) in the vicinity of the center of the orthogonal one side. That is, the wiring 323 extends over a length of 1/4 of the entire circumference over two sides. The pair of wirings 323 have, for example, a rotationally symmetrical shape and arrangement, and are thus reversible with respect to the vibration element 9 and the like.

  FIG. 8A is a plan view showing the inside of the vibrator 301 (a plan view with the lid member 13 removed). FIG.8 (b) is sectional drawing in the VIIIb-VIIIb line | wire of Fig.8 (a). In FIG. 8A, for the sake of convenience, the surface of some members (29) (that is, the surface that is not a cross section) is hatched.

  The interposition part 310 is disposed to face the bottom surface of the upper surface recess 31. For example, the interposition part 310 is slightly smaller than the area of the bottom surface of the upper surface recess 31, and its edge part overlaps the pair of element pads 29. More specifically, the interposition part 310 overlaps with the pair of element pads 29 at the center of a pair of edges (sides) parallel to each other. As a result, one end of the pair of wirings 323 located on the lower surface of the insulating base 321 faces the pair of element pads 29. Then, the pair of wirings 323 and the pair of element pads 29 are joined together by bumps 33 (FIG. 8B) made of a conductive adhesive or the like, for example, as in the other embodiments.

  The vibration element 9 is disposed to face the interposition part 310. In the present embodiment, the vibration element 9 has a curved outer peripheral surface (circular shape) that bulges outward, the interposition part 310 is rectangular, and the former diameter and the length of one side of the latter are equivalent to each other. . Therefore, the four sides of the frame portion 321b (the edge portion of the interposition portion 310) overlap the edge portion of the vibration element 9 at the center of each side, and are positioned outside the vibration element 9 at the corner portions. A pair of sides that do not overlap with the pair of element pads 29 in the frame portion 321 b overlap the pair of element terminals 25. As a result, one end of the pair of wirings 323 located on the upper surface of the insulating base 321 faces the pair of element terminals 25. The pair of wirings 323 and the pair of element terminals 25 are joined by, for example, bumps 35 ((FIG. 8B)) made of a conductive adhesive or the like, as in the other embodiments.

  Also in the vibrator 1 of the third embodiment, as in the first and second embodiments, the interposition part 310 is located between the bottom surface of the upper surface recess 31 and the vibration element 9, and a pair of element pads 29. And is bonded to the pair of element terminals 25 at a position away from the bonding position in the direction along the bottom surface (mounting surface) of the upper surface recess 31.

  Accordingly, the same effects as those of the first and second embodiments can be obtained. For example, the deformation of the element mounting member 311 is partly absorbed by the interposition part 310 and transmitted to the vibration element 9, so that the stress generated in the vibration element 9 is reduced. As a result, the vibrator 301 can be used under a relatively high heat environment and / or under a relatively large temperature change.

  In the present embodiment, the interposition part 310 includes an insulating base 321 positioned between the bottom surface of the top recess 31 and the vibration element 9 and a pair of wirings 323 provided on the insulating base 321. Yes. The pair of wirings 323 are bonded to the pair of element pads 29 and to the pair of element terminals 25.

  Therefore, compared with the first and second embodiments, for example, the number of parts constituting the interposition part 310 is small, and management and mounting of the interposition part 310 (parts) is facilitated. Moreover, since the components which comprise the interposition part 310 become large compared with 1st and 2nd embodiment, management and mounting of the interposition part 310 are facilitated also in this point.

  Further, in the present embodiment, the pair of wirings 323 are joined to the pair of element pads 29 at the center of the edges of both sides of the insulating base 321 in the D2 axis direction (predetermined direction), and the insulating base 321 is joined to a pair of element terminals 25 at the center of the edge on both sides in the D1 axis direction (direction orthogonal to the predetermined direction).

  Therefore, the insulating base 321 ensures the maximum distance between the pair of element pads 29 and the pair of element terminals 25 (equivalent to a quarter turn). As a result, the effect of elastic support by the interposition part 310 is improved. Note that the edge portion of the insulating base 321 here is a range having a certain width located inside the outline of the insulating base 321 in plan view, and the width is, for example, the excitation electrode 17 of the vibration element 9. It may have a size about the width from the outer edge to the outer edge of the crystal piece 15.

  In the present embodiment, the insulating base 321 includes the substrate portion 321a facing the bottom surface (mounting surface) of the upper surface recess 31 and the vibration element 9, and the vibration element 9 side from the edge of the substrate portion 321a. And a raised frame portion 321b. The vibration element 9 has a pair of element terminals 25 connected to a pair of wirings 323 on the frame portion 321b.

  Therefore, for example, while the vibration element 9 is reliably supported on the outer edge side of the insulating base 321, a portion sandwiched between the excitation electrodes 17 of the vibration element 9 may come into contact with the insulating base 321, and vibration may be adversely affected. Can be reduced. For example, since the center side of the insulating base 321 is thinned, the effect of elastic support by the insulating base 321 can be increased.

  In the present embodiment, the crystal piece 15 is made of crystal, and the insulating base 321 is made of crystal. Therefore, both of them tend to have close thermal expansion coefficients. As a result, the risk of stress due to the difference in thermal expansion between them is reduced.

<Usage example of vibrator>
FIG. 9 is a cross-sectional view showing the configuration of the OCXO 101 having the vibrator 1. That is, FIG. 9 shows a usage example of the vibrator 1. In FIG. 9, the vibrator 1 of the first embodiment is taken as an example, but the vibrator of another embodiment may be used.

  The OCXO 101 includes, for example, the vibrator 1 and a mounting substrate 103 on which the vibrator 1 is mounted. The OCXO 101 includes, for example, an IC 105 and a heater 107 as electronic components other than the vibrator 1 mounted on the mounting substrate 103. Further, the OCXO 101 includes a tank 109 that accommodates each of the above components and an external terminal 111 that is exposed from the tank 109.

  The mounting substrate 103 is constituted by, for example, a rigid printed wiring board. The vibrator 1 has a plurality of external terminals 5 and a plurality of vibrator pads 113 provided on the main surface of the mounting substrate 103 joined by bumps 115 made of solder or the like, whereby the mounting substrate 103 is attached. It is fixed and electrically connected.

  The IC 105 is, for example, for generating an oscillation signal by applying a voltage to the vibrator 1 and includes an oscillation circuit. For example, the IC 105 is fixed to the mounting substrate 103 by bonding the plurality of IC terminals 117 and the plurality of IC pads 119 provided on the main surface of the mounting substrate 103 by bumps 121 made of solder or the like. And electrically connected. The mounting position of the IC 105 may be an appropriate position. In the example of FIG. 9, the IC 105 is mounted at a position where a part of the upper surface side is accommodated in the lower surface recess 7 of the vibrator 1.

  The heater 107 and the bath 109 are for maintaining the atmosphere around the vibrator 1 at a constant temperature, and constitute a thermostatic bath 123. For example, the heater 107 is mounted at a position overlapping the vibrator 1 on the main surface of the mounting substrate 103 opposite to the main surface on which the vibrator 1 is mounted. The tank 109 is made of an appropriate material such as metal or ceramic, and houses the mounting substrate 103 on which the vibrator 1 and the like are mounted. The inside of the tank 109 is preferably sealed, and air or other gas (for example, nitrogen) is present.

  Although not particularly illustrated, a temperature sensor (which may be incorporated in the IC) is provided in the tank 109. The heater 107 is feedback-controlled by an IC (not shown) so that the detection value of the temperature sensor becomes a constant value. Thereby, the temperature in the tank 109 is kept constant. Note that the atmosphere around the vibrator 1 is kept constant by the thermostatic bath 123, but the IC 105 may include a temperature compensation circuit.

  The external terminal 111 is a pin made of metal, for example. One end thereof is inserted into and fixed to the mounting substrate 103 and is electrically connected. As a result, the external terminal 111 is electrically connected to the IC 105 or the like via the mounting substrate 103. The other end of the external terminal 111 extends from the tank 109. The OCXO 101 is mounted on the circuit board by inserting the other end of the external terminal 111 into a circuit board (not shown) and soldering.

  Thus, the vibrator 1 or the like of the embodiment may be used for OCXO. The vibrator arranged in the thermostat is used at a higher temperature than a normal vibrator. However, even if the element mounting member 11 is deformed by heat, the vibrator 1 or the like of the embodiment has a smaller influence on the vibration element 9 or the like than the conventional one. Therefore, the intended frequency characteristic can be easily obtained.

  In the above embodiment, each of the crystal resonators 1, 201, and 301 is an example of a piezoelectric device. The crystal vibration element 9 is an example of a piezoelectric vibration element. The crystal piece 15 is an example of a piezoelectric element plate. The base pad 30 is an example of a base part.

  The present invention is not limited to the above embodiment, and may be implemented in various aspects.

  The piezoelectric device is not limited to a piezoelectric vibrator such as a crystal vibrator, and may be, for example, a piezoelectric oscillator having an oscillation circuit, or may be an oscillator with a thermostatic bath as shown in FIG. The piezoelectric vibrator may have an electronic element other than a vibration element such as a thermistor. The piezoelectric body (piezoelectric element plate) is not limited to quartz but may be ceramic, for example.

  The entire structure including the package (element mounting member or lid) of the piezoelectric device can be changed as appropriate. For example, a piezoelectric vibration element may be mounted on a single layer substrate, and the piezoelectric vibration element may be covered with a metal cap. A thermistor or IC may be mounted on the bottom surface of the lower surface recess of the element mounting member. You may make it not form the lower surface recessed part of an element mounting member.

  The planar shape of the piezoelectric element plate is not limited to a circle, and may be a rectangle, for example. Further, when the piezoelectric element plate has a curved outer peripheral surface that swells outward, the shape is not limited to a circle, and may be, for example, an ellipse. Further, the side surface of the piezoelectric element may have a so-called mesa shape that protrudes by a curved surface or a stepped surface in a side view (sectional view). Further, the positions where the pair of element terminals are provided are not limited to the opposite sides of the excitation electrode. For example, the pair of element terminals may be provided at positions separated from each other at an angle of 120 ° around the center of the excitation electrode.

  A direction in which the bonding position (bonding region) between the interposition part and the element pad and the bonding position (bonding region) between the interposition part and the element terminal are separated in a plan view may be an appropriate direction. Even if the two joining positions are separated in any direction, the distance along the mounting surface of the interposition portion is secured at that distance, and as a result, a portion that absorbs deformation of the element mounting member is configured in the interposition portion. . In relation to this, the arrangement, direction, length, and the like of the pair of conductive pieces or the pair of wirings may be appropriately set.

  The conductive piece is not limited to one made of a metal piece, and may be one obtained by plating the surface of an insulating piece made of resin or the like, for example. Further, the conductive piece is not limited to a long one, and may be, for example, a rectangle close to a square. In addition, the conductive piece may extend in a curved shape or change in width.

  In the intervening portion having the insulating base and the pair of wirings, the insulating base is not limited to a plate shape, and may be a frame shape, for example. Further, the wiring may be arranged not on the surface of the insulating base but inside.

  The joining of the interposition part and the pad of the element mounting member is not limited to that made by conductive bumps. For example, joining may be performed by welding.

  The base portion of the element mounting member is not limited to the same configuration as the pad. For example, the pedestal portion may be formed by forming a part of the insulating base so as to rise. In the embodiment, the combination of the conductive piece and the pedestal portion is shown. However, as in the third embodiment, in the interposition portion in which the pair of wirings are provided on the insulating base, it overlaps the interposition portion (insulating base). A pedestal may be provided at the position.

  DESCRIPTION OF SYMBOLS 1 ... Crystal oscillator (piezoelectric device), 9 ... Quartz vibration element (piezoelectric vibration element), 10 ... Interposition part, 11 ... Element mounting member, 15 ... Quartz piece (piezoelectric base plate), 17A ... 1st excitation electrode, 17B ... second excitation electrode, 19A ... first extraction electrode, 25 ... element terminal, 29 ... element pad.

Claims (6)

An element mounting member having a pair of pads on the mounting surface;
A piezoelectric element plate, a pair of excitation electrodes provided on both main surfaces of the piezoelectric element plate, and a pair of element terminals connected to the pair of excitation electrodes, are arranged to face the mounting surface. Piezoelectric vibration element,
It is located between the mounting surface and the piezoelectric vibration element, is bonded to the pair of pads, and is connected to the pair of element terminals at a position away from the bonding position in the direction along the mounting surface. The intervening part being joined;
Have
The interposition part is located between the mounting surface and the piezoelectric vibration element, and has a pair of conductive pieces joined to the pair of pads and the pair of element terminals,
Each of the pair of conductive pieces has one end and the other end in a plan view of the mounting surface, the joining position joined to the pad is located on the one end side, and the joining position is more than the joining position. The whole of the other end side is not supported by the mounting surface, and is joined to the element terminal at a position away from the joining position on the one end side to the other end side ,
The pair of pads are separated from each other in a predetermined direction in a plan view of the mounting surface,
The pair of conductive pieces are separated from each other in the predetermined direction in a plan view of the mounting surface, and extend in a direction orthogonal to the predetermined direction from a bonding position with the pair of pads.
The pair of excitation electrodes are located between the pair of conductive pieces in a plan view of the mounting surface,
The pair of element terminals are located on both sides in the predetermined direction with respect to the pair of excitation electrodes in a plan view of the mounting surface, and the pair of conductive pieces are joined to the pair of pads. A piezoelectric device bonded to a portion extending from the position in the orthogonal direction . An element mounting member having a pair of pads on the mounting surface;
A piezoelectric element plate, a pair of excitation electrodes provided on both main surfaces of the piezoelectric element plate, and a pair of element terminals connected to the pair of excitation electrodes, are disposed opposite to the mounting surface. Piezoelectric vibration element,
It is located between the mounting surface and the piezoelectric vibration element, is bonded to the pair of pads, and is connected to the pair of element terminals at a position away from the bonding position in the direction along the mounting surface. The intervening part being joined;
Have
The interposition part is located between the mounting surface and the piezoelectric vibration element, and has a pair of conductive pieces joined to the pair of pads and the pair of element terminals,
The element mounting member has a pair of pedestal portions raised from the mounting surface,
In the plan view of the mounting surface, the pair of conductive pieces has one end side overlapped with the pair of pads, and the other end side overlapped with the pair of pedestal portions,
The pair of element terminals and the pair of conductive pieces are bonded between the pair of pads and the pair of pedestal portions in plan view of the mounting surface. An element mounting member having a pair of pads on the mounting surface;
A piezoelectric element plate, a pair of excitation electrodes provided on both main surfaces of the piezoelectric element plate, and a pair of element terminals connected to the pair of excitation electrodes, are arranged to face the mounting surface. Piezoelectric vibration element,
It is located between the mounting surface and the piezoelectric vibration element, is bonded to the pair of pads, and is connected to the pair of element terminals at a position away from the bonding position in the direction along the mounting surface. The intervening part being joined;
Have
The interposition part is located between the mounting surface and the piezoelectric vibration element, and has a pair of conductive pieces joined to the pair of pads and the pair of element terminals,
The pair of pads have a width that overlaps the entire pair of conductive pieces in a plan view of the mounting surface. The pair of pads are separated from each other in a predetermined direction in a plan view of the mounting surface,
The pair of conductive pieces are separated from each other in the predetermined direction in a plan view of the mounting surface, and extend in a direction orthogonal to the predetermined direction from a bonding position with the pair of pads.
The pair of excitation electrodes are located between the pair of conductive pieces in a plan view of the mounting surface,
The pair of element terminals are located on both sides in the predetermined direction with respect to the pair of excitation electrodes in a plan view of the mounting surface, and the pair of conductive pieces are joined to the pair of pads. The piezoelectric device according to claim 2 , wherein the piezoelectric device is bonded to a portion extending in a direction perpendicular to the position. Each of the pair of conductive pieces is
A base located between the mounting surface and the piezoelectric vibration element;
The piezoelectric device according to claim 1, further comprising: a protruding portion that protrudes from the base portion toward the piezoelectric vibrating element side and that can contact an outer peripheral surface of the piezoelectric vibrating element. The piezoelectric element plate is formed in a shape having a curved outer peripheral surface that swells on both sides in the predetermined direction in a plan view of the mounting surface,
Each of the pair of conductive pieces is
A base located between the mounting surface and the piezoelectric vibration element;
Two protrusions protruding from the base toward the piezoelectric vibration element side and provided apart from each other in a direction orthogonal to the predetermined direction,
Said piezoelectric vibrating element, the predetermined direction on both sides bulging portion of said pair of conductive strips of each piezoelectric device according to in which claim 1 or 4 located between the two protrusions.

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