JP6597178B2 - Bonded IC card and manufacturing method thereof - Google Patents

Description

The present invention relates to a bonded IC card and a method for manufacturing the same.
Specifically, an inlet made of an IC chip and an antenna is inserted between a base material for a surface made of paper or a plastic sheet that is transparent to ultraviolet rays and a base material for a back surface, and the base material for a surface made of the inlet and paper or a plastic sheet Further, the present invention relates to an IC card in which a substrate for back surface is bonded with an ultraviolet curable adhesive and a method for producing the same.

As a method of manufacturing a card at low cost, an adhesive (particularly an ultraviolet curable adhesive) is applied between the paper or plastic sheet on which the card design is printed and the inlet (a sheet-like module in which an IC chip and an antenna are integrated). There is a method of manufacturing together.
In this case, when the adhesive is completely cured, the IC chip portion of the inlet becomes convex, and rises when the IC cards are stacked, and there is a problem that load resistance and impact resistance are reduced even during normal use. is there.

If the ultraviolet curable adhesive of the bonded IC card is left in an uncured state, the adhesive layer becomes a cushion material that covers the periphery of the IC chip, and the load resistance and impact resistance of the card are improved. However, if the adhesive is actually in an uncured state, the adhesive is likely to adhere to the punching blade in the process of punching into a card shape, and the fingertip will have a sticky feeling when held in the hand. There is. Therefore, in the prior art, the adhesive has to be cured almost completely.

FIG. 5 is a cross-sectional view of a conventional bonded IC card.
As shown in FIG. 5, the conventional bonded IC card 1 j has an inlet 11 inserted between a front substrate 12 made of paper or a plastic sheet and a rear substrate 13 made of paper or a plastic sheet. It is the structure which bonded together between the base material 12 for front surfaces, and the inlet 11, and between the base material 13 for back surfaces, and the inlet 11 with ultraviolet curable adhesive bond layers 12s and 13s.
The inlet 11 is formed by forming the antenna 2 on a plastic sheet and electrically connecting the IC chip 3 to the end of the antenna 2. As a result, data can be exchanged with an external data reader without contact.

The conventional bonded IC card 1j is formed into individual IC cards 1j by punching with a rectangular blade shape after making it an intermediate product in a large-sized multi-faceted state. Accordingly, there are portions where the ultraviolet curable adhesive layers 12s and 13s are exposed around the IC card 1j, and when the adhesive (ultraviolet curable resin) is in an uncured state, it sticks to the fingertip and tends to cause stickiness. In addition, as described above, the adhesive easily adheres to the punching blade during punching.

Therefore, in the present invention, the surface base material 12, the back surface base material 13 and the inlet 11 are bonded using an ultraviolet curable adhesive as an adhesive, while the IC chip 3 portion of the inlet 11 is optically masked. Irradiate ultraviolet rays to make the periphery of the IC chip 3 part uncured, but completely cure the part other than the IC chip 3 part periphery so as not to cause manufacturing problems and leave no sticky feeling. Is.

Although prior art documents directly related to the present application cannot be detected, Patent Document 1 discloses a non-contact IC card in which paper base materials are laminated on both upper and lower surfaces of an antenna sheet (inlet).
However, the embodiment described in FIG. 4 of this document is different from the present application in that paper substrates are bonded with a vinyl acetate adhesive.
In Patent Document 2, an inlet is stored in the recess of the lower paper base provided with a recess capable of storing an inlet, and a resin having insulating properties and flexibility is filled in the space of the recess. An IC card is described in which materials are stacked and then flattened by heating and pressing. However, this IC card is different from that of the present application in layer structure and materials used.
Patent Document 3 describes the use of a porous thermoplastic material as a member for protecting the antenna sheet, but the material is different from that of the present application.

JP 2000-155821 A JP 2012-256217 A JP 2009-140027 A

A bonded IC with a structure in which an inlet is inserted between a front substrate and a rear substrate made of UV-permeable paper or plastic sheet, and the front and rear substrates and the inlet are bonded with an ultraviolet curable adhesive. By making the adhesive around the IC chip part uncured in the card, the IC chip part is prevented from protruding in a convex shape, thereby realizing an IC card having high load resistance and impact resistance. This is the issue.
On the other hand, when all of the ultraviolet curable adhesive is uncured, the IC chip portion is reduced from becoming convex, but the uncured adhesive is exposed at the edge of the IC card, and the sticky feeling is felt. There are problems that arise. Avoiding this problem is also an issue.

The first of the gist of the present invention is that an inlet is inserted between the surface base material and the back surface base material of the paper or plastic sheet, both of which are UV transmissive, and between the front surface base material and the inlet, and the back surface. The substrate and the inlet are bonded with an ultraviolet curable adhesive, and only the ultraviolet curable adhesive around the IC chip portion of the inlet is uncured, and the ultraviolet curable adhesive other than the periphery of the IC chip portion is cured. In the bonded IC card, the design is printed on the outer surface of the surface base material, and the surface base material including the design is UV transmissive .

In the above, the a inner surface or outer surface of the surface base material can be made to the ultraviolet light shielding pattern is formed on the IC chip portion peripheral portion of the inlet, a inner or outer surface of the back base material An ultraviolet light shielding pattern may be formed around the IC chip portion of the inlet.

The second of the gist of the present invention is the following steps (1) to (6): (1) a step of printing a pattern capable of transmitting ultraviolet light on the outer surface of the ultraviolet light transmitting base material;
(2) A step of making the outer surface of the base material for UV transmissive back surface unprinted or printing a pattern capable of transmitting UV light, (3) UV curable adhesion to the surface on the inlet side of the surface base material. A step of applying an agent, (4) a step of applying an ultraviolet curable adhesive to a surface on the inlet side of the back surface substrate, and (5) an ultraviolet curable adhesive coating surface of the surface substrate. A step of inserting an inlet between the UV-curable adhesive coated surfaces of the substrate for back surface and press-bonding to form a temporarily bonded IC card; (6) one surface of the temporarily bonded IC card; Alternatively, there is a method for manufacturing a bonded IC card, which includes a step of applying a photomask that shields only the periphery of the IC chip portion of the inlet on both sides and irradiating ultraviolet rays from one side or both sides to which the photomask is applied.

The third of the gist of the present invention is the following steps (1) to (7) (1) a step of printing a pattern capable of transmitting ultraviolet light on the outer surface of the ultraviolet light transmitting surface substrate,
(2) A step of making the outer surface of the base material for the back surface of an ultraviolet ray transparent, or printing a pattern capable of transmitting ultraviolet light, (3) IC of the inlet for the surface base material and / or the base material for the back surface A step of forming an ultraviolet light shielding pattern on an inner surface or an outer surface of a portion facing the periphery of the chip portion, (4) a step of applying an ultraviolet curable adhesive to a surface on the inlet side of the surface base material, (5) A step of applying an ultraviolet curable adhesive to a surface on the inlet side of the back surface substrate; (6) an ultraviolet curable adhesive coated surface of the surface substrate and an ultraviolet curable adhesive of the back surface substrate; A step of forming a bonded IC card in a temporarily bonded state by inserting an inlet between the coated surfaces and press-bonding; (7) a front substrate or a back surface on which an ultraviolet light shielding pattern of the bonded IC card in the temporarily bonded state is formed; One side or both sides for substrate Method for producing a bonded IC card having step, the irradiating ultraviolet rays from, in.

It is sectional drawing of the 1st form of a bonding IC card. It is sectional drawing of the 2nd form of a bonding IC card. It is a figure explaining an inlet. It is a perspective view of a bonded IC card. It is sectional drawing of the conventional bonded IC card.

Hereinafter, description will be given with reference to the drawings.
FIG. 1 is a cross-sectional view of a first embodiment of a bonded IC card.
As shown in FIG. 1, the bonded IC card 1 has an inlet 11 in the center layer. The inlet 11 is a sheet-like module in which an antenna is formed on a plastic substrate such as polyethylene terephthalate (PET) and an IC chip is mounted on the antenna.
On both surfaces of the inlet 11, a front surface base 12 and a back surface base 13 are bonded and bonded together via ultraviolet curable adhesive layers 12 s and 13 s.

The front surface substrate 12 and the back surface substrate 13 are made of ultraviolet transmissive paper or plastic sheet. What is necessary is just to be able to permeate | transmit ultraviolet rays (especially the range of 200-400 nm) to such an extent that an ultraviolet curable adhesive can be practically hardened with a normal hardening method.
Paper is a concept that includes synthetic paper in addition to normal fibrous paper. Plastic sheets include various materials such as sheets and films. These base materials are temporarily bonded in a state where the ultraviolet curable adhesive is uncured, and later transmit ultraviolet rays irradiated from both the front and back sides or from one side to be cured. Characteristics are required.

The feature of the bonded IC card 1 of the present invention is that the ultraviolet curable adhesive thus cured adheres between the surface base 12 and the inlet 11 and between the back surface base 13 and the inlet 11. In this state, only the ultraviolet curable adhesive around the IC chip 3 part of the inlet 11 is made into the uncured ultraviolet curable adhesive layers 12m and 13m.
By being in an uncured state, the adhesive layer serves as a cushion material covering the periphery of the IC chip 3 part, and the load resistance and impact resistance of the IC card are improved.

The IC chip 3 part periphery means the IC chip 3 part and its periphery, and when the IC chip 3 is mounted on the surface base 12 side of the inlet base, the mounting side inlet top surface of the IC chip 3 And between the inlet base material on the lower side of the IC chip 3 and the back surface base material 13 and its periphery. The periphery is a range of about 1.0 to 3.0 mm from the periphery of the IC chip 3. This is because the IC chip 3 does not extremely approach the peripheral side of the IC card 1 and within this range, the punching blade does not contact the uncured state portion at the time of cutting and the problem of stickiness does not occur.

FIG. 2 is a sectional view of a second embodiment of the bonded IC card.
As in FIG. 1, in the second embodiment, the ultraviolet light shielding pattern 12 p is formed only on the surface of the surface base 12 that faces the inlet 11 and faces the periphery of the IC chip 3 part of the inlet 11. And the ultraviolet light shielding pattern 13p is formed only on the surface of the base material 13 for the back surface on the inlet 11 side and facing the periphery of the IC chip 3 portion of the inlet. And it is the same as that of the 1st form that only the ultraviolet curable adhesive of the IC chip 3 part vicinity of the inlet 11 is made into the uncured ultraviolet curable adhesive layers 12m and 13m. The concept around the third part of the IC chip is the same as in the first embodiment.
The ultraviolet light shielding pattern may be formed only on one side of the front substrate 12 and the back substrate 13. This is because an uncured state around the 3 parts of the IC chip can be realized by irradiating ultraviolet rays from the formed substrate surface side.

In this way, the ultraviolet light shielding patterns 12p and 13p are formed on the surface on the inlet 11 side, so that three parts of the IC chip can be used without manufacturing a photomask on the outer surface of the front substrate 12 and the rear substrate 13 during manufacturing. The surrounding adhesive can be uncured.
The formation of the light shielding pattern includes not only printing a pattern such as black by printing, but also spraying paint containing aluminum foil, attaching a light shielding label, and the like.

In addition, although the normal design may be printed on the outer surface of the base material 12 for the front surface and the base material 13 for the back surface, it is a matter of course that this design is required to be UV transmissive. Although the ultraviolet light shielding patterns 12p and 13p can be provided on the outer surfaces of the front substrate 12 and the rear substrate 13 (the outer surface of the IC card 1), the pattern close to black tends to impair the design.
However, since recent IC chips are miniaturized, it is easy to make the ultraviolet light shielding patterns 12p and 13p inconspicuous. It is also possible to make a design that hides the ultraviolet light shielding patterns 12p and 13p so as not to impair the design.
In FIG. 2, the ultraviolet light shielding patterns on the outer surfaces of the front surface substrate 12 and the back surface substrate 13 are not shown, but this does not exclude the formation of the ultraviolet light shielding pattern on the outer surface side.

Here, the inlet will be described. FIG. 3 is a diagram illustrating the inlet.
The inlet 11, which is also called an antenna sheet, is a module in which an IC chip 3 is mounted and integrated on a loop-shaped antenna 2 formed on a flat plastic substrate such as PET.
In general, the antenna 2 is formed by etching a copper foil or aluminum foil laminated on the inlet base 110, and the IC chip 3 is mounted on the end thereof. Such an inlet 11 is used for a non-contact type IC card, and does not use a contact terminal board on the surface of the card. Therefore, the installation position of the IC chip 3 is not particularly specified.
Usually, it is mounted avoiding the central part that is not easily subjected to stress deformation, but it is extremely close to the periphery.
The thickness of the inlet base 110 is about 50 to 150 μm, and the IC chip 3 has been downsized in recent years. The IC chip 3 has a rectangular shape with a side of about 0.5 to 4.5 mm, and the thickness is about 30 to 150 μm. Many.

FIG. 4 is a perspective view of a bonded IC card. The completed form is shown, and both the first form and the second form appear similarly in appearance.
The bonded IC card 1 of the present invention is generally a wallet-sized card (ID-1 type) defined by ISO 7810, but is not particularly limited to this size.
In appearance, it is not different from ordinary bonded IC cards. The thickness is about 0.3 to 0.8 mm as in the case of a normal bonded IC card.
As described above, the bonded IC card 1 of the present invention is characterized in that the front surface base 12 and the back surface base 13 are provided with the ultraviolet curable adhesive layers 12s and 13s on both sides of the inlet 11 as a central layer. Are stacked. Accordingly, a thin layer of the cured UV curable adhesive is slightly exposed on the side surface. Further, although not visible in appearance, the ultraviolet curable adhesive around the IC chip 3 part of the inlet 11 is in an uncured state.

When the ultraviolet light shielding patterns 12p and 13p are not provided as in the first embodiment (FIG. 1), a photomask is used at the time of ultraviolet irradiation after temporary bonding.
The selection of the color tone of the ultraviolet light shielding pattern is important. In general, the black system absorbs all color light, and therefore absorbs ultraviolet rays and does not transmit them. In the case of purple, since the color around purple is reflected, the ultraviolet ray is also reflected and the mask functions. In the case of red, colors around red are reflected, but other colors are transmitted, so the mask function is not performed. The same applies to green. White reflects all color light on average, but does not function as a mask because of its high transmittance.

Next, a method for manufacturing the bonded IC card 1 will be described. The manufacturing method includes a first method using a mask (photomask) and a second method not using it. First, the first method will be described.
First, a process of printing a design capable of transmitting ultraviolet light on the outer surface of the ultraviolet light transmitting base material 12 is performed. The pattern printing is performed by offset printing or silk screen printing. Next, similarly, the process of making the outer surface of the base material 13 for the back surface of the ultraviolet ray transmissive unprinted or printing a pattern capable of transmitting ultraviolet rays is performed. When printing, it is performed in the same manner as the surface substrate 12.
Next, an ultraviolet curable adhesive is applied to the surface of the surface substrate 12 on the inlet 11 side and the surface of the back substrate 13 on the inlet 11 side. Perform the process. Since the ultraviolet curable adhesive is preferably thick, it is performed by silk screen printing. For the adhesive, a medium ink for ultraviolet curable silk screen is used.

A screen of about 150 to 180 mesh is used for printing the medium ink for the ultraviolet curable silk screen. The printing thickness needs to be about 40 to 180 μm. Since thick ink is clear ink, curing is accelerated. If it is desired to reduce the viscosity, a reducer can be added.

Next, the step of inserting the inlet 11 between the UV curable adhesive coated surfaces of both the front surface substrate 12 and the back surface substrate 13 and press-bonding them to form a temporarily bonded IC card is performed. At this time, alignment is performed using the registration marks provided in advance on the front substrate 12, the rear substrate 13, and the inlet 11.
Finally, a step of applying a photomask that shields only the periphery of the IC chip 3 portion of the inlet 11 to one or both sides of the temporarily bonded bonded IC card, and irradiating ultraviolet rays from one or both sides of the side to which the photomask is applied I do.
Single-sided or double-sided is the case where the surface base material 12 or the back surface base material 13 and the inlet 11 of the inlet 11 have sufficient ultraviolet transmittance, and irradiation from one side is sufficient, and the ultraviolet transmittance is insufficient. This is because it is appropriate to irradiate from both sides. From one side, an uncured portion remains on the side opposite to the photomask, but the outer surface of the card is gradually cured by natural light.

For irradiation with ultraviolet rays, those containing ultraviolet rays as a light emitting component such as a metal halide lamp, a UV lamp, and a high-pressure mercury lamp can be used. Since it is a thick film in screen printing, it is necessary to use a high-power lamp of 120 W / cm or more. For the lamp house, it is preferable to use a convergent type with focus so that higher ultraviolet intensity can be obtained.

Next, a second method that does not use a photomask will be described.
First, a process of printing a design capable of transmitting ultraviolet light on the outer surface of the ultraviolet light transmitting base material 12 is performed. Next, similarly, the process of making the outer surface of the base material 13 for the back surface of the ultraviolet ray transmissive unprinted or printing a pattern capable of transmitting ultraviolet rays is performed.
Next, a step of forming an ultraviolet light shielding pattern on the inner surface or outer surface of the portion facing the periphery of the IC chip portion of the inlet for the front substrate and / or the rear substrate is performed. The term “and / or” means that an ultraviolet light shielding pattern may be formed on both the front surface substrate 12 and the back surface substrate 13, or only one of them may be formed. The ultraviolet light shielding patterns 12p and 13p may be formed by silk screen printing or offset printing, and may be sprayed with a paint containing aluminum foil or attached with a light shielding label as described above.
Next, a step of applying an ultraviolet curable adhesive to the surface on the inlet 11 side of the front substrate 12 and the surface on the inlet 11 side of the rear substrate 13 is performed. Since the ultraviolet curable adhesive is preferably thick, it is performed by silk screen printing. For the adhesive, a medium ink for silk screen is used.

As described above, when the ultraviolet light shielding patterns 12p and 13p can be configured in a pattern that does not impair the design, the light shielding is not performed on the outer surface side but on the inner surface on the inlet 11 side of the surface base material 12 or the back surface base material 13. A pattern can be formed.

Next, the step of inserting the inlet 11 between the UV curable adhesive coated surfaces of both the front surface substrate 12 and the back surface substrate 13 and press-bonding them to form a temporarily bonded IC card is performed. In this case, alignment is performed using the registration marks provided in advance on the front substrate 12, the rear substrate 13, and the inlet 11.
Finally, a step of irradiating ultraviolet rays from one side or both sides of the bonded IC card in the temporarily bonded state is performed. Naturally, “single side” means irradiation from the side of the base material surface on which the ultraviolet light shielding pattern is formed, and both sides mean the ultraviolet light shielding patterns 12p and 13p on both the front surface substrate 12 and the back surface base material 13. Is formed.

In the second method, it is not necessary to use a special photomask.
Ultraviolet irradiation is performed in the same manner as in the first method.
Since both the first method and the second method are manufactured in a large format with about 30 faces, cutting with a punching blade is performed to form individual IC cards. Functional inspection and shipping inspection are also performed as usual.

<Embodiment related to material>
Next, the material used for the bonded IC card of the present invention will be described.
(Base material for surface, base material for back surface)
The paper substrate is not particularly limited as long as it has structural strength and is UV transmissive. Examples thereof include fine paper, art paper, coated paper, cast coated paper, glassine paper, semi-paper, synthetic paper, synthetic resin or emulsion impregnated paper, and cellulose fiber paper.
White paper looks white because it reflects colored light on average, but the fiber itself is transparent, so the thin paper is transparent to ultraviolet light. However, if the paper quality is thick and dense, it hardly transmits ultraviolet rays according to the degree of density. Therefore, the choice of paper substrate is quite limited.
Transparent plastics that do not contain UV absorbers are excellent in UV transparency except for some of them.
Polyethylene and vinyl chloride are known to have good ultraviolet transmittance. However, vinyl chloride containing a plasticizer reduces ultraviolet light transmission on the short wavelength side according to the amount of addition. It is said that the plasticizer contains a benzene ring in the chemical structure. Polyvinyl alcohol (PVA), polyethylene terephthalate (PET), and cellophane have good ultraviolet transmittance. Polyamide (nylon 6) has good ultraviolet transmittance on the long wavelength side. Polyester-based synthetic paper or the like having a hollow structure therein also has ultraviolet transparency. On the other hand, polyethylene naphthalate (PEN) itself has an ultraviolet cut performance.

(UV curable adhesive)
The ultraviolet curable adhesive is a kind of active energy ray curable adhesive, and changes its phase from a liquid to a solid by a chain photopolymerization reaction when irradiated with ultraviolet rays. As the resin, a prepolymer having a double bond is used, and a urethane (meth) acrylate resin or the like is frequently used. A urethane monomer having a double bond serves as a diluting solvent and also serves as a crosslinking agent. A photoinitiator may be added as a sensitizer.

Example 1
As the substrate for inlet 11, a material obtained by laminating aluminum foil on a biaxially stretched PET sheet having a thickness of 50 μm was used. This was etched to form the antenna 2 as shown in FIG. 3, and the IC chip 3 was mounted on the end of the antenna 2 to form an inlet 11. The size of the IC chip 3 is 0.5 mm square and the thickness is 120 μm.
Polyester-based biaxially stretched synthetic paper “Chrisper (thickness: 100 μm)” manufactured by Toyobo Co., Ltd. was used as the front substrate 12 and the back substrate 13. The crisper has a void-containing structure and is white and opaque in appearance. However, even those having a thickness of 100 μm have ultraviolet transparency.
Silk screen medium ink that prints a pattern capable of transmitting ultraviolet light on the outer surface (surface side of the IC card 1) of the surface substrate 12, and further functions as an ultraviolet curable adhesive on the inner surface (side surface that contacts the IC chip 3). (“Lure Cure OP4300 Series” manufactured by Jujo Chemical Co., Ltd.) was used, and coating was performed to a thickness of 150 μm.
The outer surface of the base material 13 for the back surface was not printed, and the silk screen medium ink was applied to the inner surface so as to have a thickness of 50 μm (see FIG. 1).

The inlet 11 is inserted between the UV curable adhesive coated surface of the front substrate 12 and the UV curable adhesive coated surface of the back substrate 13 to form a bonded IC card in a temporarily bonded state. did. A photomask that shields only the periphery of the IC chip 3 portion of the inlet 11 is applied to both surfaces of the temporarily bonded IC card, and UV irradiation is performed from both surfaces with a UV lamp for about 1 to 2 seconds. A 450 μm bonded IC card 1 was completed.

(Example 2)
The same material as in Example 1 was used for the inlet 11, the front surface substrate 12, and the back surface base material 13.
A pattern capable of transmitting ultraviolet light is printed on the outer surface (surface side of the IC card 1) of the surface base material 12, and the ultraviolet light shielding pattern 12p on the inner surface (side surface contacting the IC chip 3) is further radiused from the center of the IC chip 3. It printed with black ink so that it might become a circle of 2 mm. Thereafter, a silk screen medium ink (“Recure OP4300 series” manufactured by Jujo Chemical Co., Ltd.) functioning as an ultraviolet curable adhesive was applied to the surface of the ultraviolet light shielding pattern 12p so as to have a thickness of 150 μm. The outer surface of the back substrate 13 was not printed, and after the ultraviolet light shielding pattern 13p was printed on the inner surface in the same manner as the front substrate 12, the silk screen medium ink was applied to a thickness of 50 μm (FIG. 2). reference).

The inlet 11 is inserted between the UV curable adhesive coated surface of the front substrate 12 and the UV curable adhesive coated surface of the back substrate 13 to form a bonded IC card in a temporarily bonded state. did. A process of irradiating UV light from both surfaces of the bonded IC card in the temporarily bonded state for about 1 to 2 seconds was completed, and a bonded IC card 1 having a thickness of about 450 μm was completed.

(Example 3)
The same inlet 11 as in Example 1 was used. High-quality paper having a thickness of 100 μm was used for the front surface substrate 12 and the back surface substrate 13.
Ultraviolet light shielding patterns 12p and 13p were formed in the same manner as in Example 2, and silk screen medium ink ("Recure OP4300 series" manufactured by Jujo Chemical Co., Ltd.) functioning as an ultraviolet curable adhesive on the surface of the ultraviolet light shielding pattern 12p. Used and coated to a thickness of 150 μm. The outer surface of the back substrate 13 was not printed, and after the ultraviolet light shielding pattern 13p was formed on the inner surface in the same manner as the front substrate 12, the silk screen medium ink was applied to a thickness of 50 μm (FIG. 2). reference).
Thereafter, a step of irradiating UV light from both surfaces of the bonded IC card in a temporarily bonded state for about 2 to 3 seconds was performed to complete a bonded IC card 1 having a thickness of about 450 μm.

In the bonded IC card 1 obtained in Examples 1 to 3, the ultraviolet curable adhesive around the IC chip 3 part is in an uncured state, so that the card protrudes at the IC chip 3 part. There was no load and shock resistance was high.

DESCRIPTION OF SYMBOLS 1 Bonding IC card 1j Conventional bonding IC card 2 Antenna 3 IC chip 4 Bridge 11 Inlet 12 Surface base material 13 Back surface base material 12s, 13s UV curable adhesive layers 12m, 13m UV curable in an uncured state Adhesive layer 12p, 13p UV light shielding pattern

Claims (5)

In each case, an inlet is inserted between the base material for the surface and the back surface of the paper or plastic sheet that is UV transmissive, and UV curing is performed between the base material for the front surface and the inlet, and between the base material for the back surface and the inlet. Bonded IC card which is bonded by a curable adhesive, only the UV curable adhesive around the IC chip portion of the inlet is uncured, and the UV curable adhesive other than the periphery of the IC chip portion is in a cured state in the the outer surface of the surface base material and symbols are printed, bonded IC card surface base material for Ru UV transparent der including symbols. In each case, an inlet is inserted between the base material for the surface and the back surface of the paper or plastic sheet that is UV transmissive, and UV curing is performed between the base material for the front surface and the inlet, and between the base material for the back surface and the inlet. Bonded IC card which is bonded by a curable adhesive, only the UV curable adhesive around the IC chip portion of the inlet is uncured, and the UV curable adhesive other than the periphery of the IC chip portion is in a cured state In the above, a design is printed on the outer surface of the surface base material, the surface base material including the design is UV transmissive, and is an inner surface or an outer surface of the surface base material on the periphery of the IC chip portion of the inlet. Lamination IC card ultraviolet light shielding pattern that has been formed. In each case, an inlet is inserted between the base material for the surface and the back surface of the paper or plastic sheet that is UV transmissive, and UV curing is performed between the base material for the front surface and the inlet, and between the base material for the back surface and the inlet. Bonded IC card which is bonded by a curable adhesive, only the UV curable adhesive around the IC chip portion of the inlet is uncured, and the UV curable adhesive other than the periphery of the IC chip portion is in a cured state In the above, a pattern is printed on the outer surface of the surface base material, the surface base material including the pattern is UV transmissive, and is an inner surface or an outer surface of the back surface base material on the periphery of the IC chip portion of the inlet. Lamination IC card ultraviolet light shielding pattern that has been formed. Steps (1) to (6) below (1) A step of printing a pattern capable of transmitting ultraviolet rays on the outer surface of the ultraviolet ray-permeable surface substrate,
(2) The step of printing the pattern that can transmit ultraviolet rays or not printing the outer surface of the base material for UV-permeable back surface;
(3) A step of applying an ultraviolet curable adhesive to the surface on the inlet side of the surface base material,
(4) A step of applying an ultraviolet curable adhesive to the surface on the inlet side of the substrate for back surface,
(5) An inlet is inserted between the UV curable adhesive coated surface of the surface substrate and the UV curable adhesive coated surface of the back substrate to form a bonded IC card in a temporarily bonded state. The process of
(6) A step of applying a photomask that shields only the periphery of the IC chip portion of the inlet to one or both sides of the temporarily bonded IC card, and irradiating ultraviolet rays from one or both sides of the photomask.
The manufacturing method of the bonding IC card which has this. Steps (1) to (7) below: (1) A step of printing a pattern capable of transmitting ultraviolet light on the outer surface of the ultraviolet light transmitting base material;
(2) The step of printing the pattern that can transmit ultraviolet rays or not printing the outer surface of the base material for UV-permeable back surface;
(3) a step of forming an ultraviolet light shielding pattern on the inner surface or outer surface of the portion facing the periphery of the IC chip portion of the inlet for the surface substrate and / or the substrate for the back surface;
(4) A step of applying an ultraviolet curable adhesive to a surface which is an inlet side of the surface base material,
(5) A step of applying an ultraviolet curable adhesive to the surface on the inlet side of the substrate for back surface,
(6) An inlet is inserted between the UV curable adhesive coated surface of the front substrate and the UV curable adhesive coated surface of the back substrate to form a bonded IC card in a temporarily bonded state. The process of
(7) A step of irradiating ultraviolet light from one side or both sides of the substrate for the front surface or the substrate for the back surface on which the ultraviolet light shielding pattern of the temporarily bonded IC card is formed,
The manufacturing method of the bonding IC card which has this.

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