JP6600249B2 - Adhesive tape and peeling method of adhesive tape - Google Patents

Description

The present invention relates to a pressure-sensitive adhesive tape that can be easily peeled even when affixed to an adherend with high pressure-sensitive adhesive force, and a method for peeling the pressure-sensitive adhesive tape.

Adhesive tape is used for all adherends such as plastic, glass, metal, wood, ceramics, rubber, paper, cloth, leather, etc., and adherends with adhesive tape are used in all fields. Yes.
Depending on the application of the pressure-sensitive adhesive tape, it is required that the pressure-sensitive adhesive tape once adhered is peeled off from the adherend without damaging the adherend or leaving adhesive residue. For example, in the manufacturing process of a semiconductor chip, in order to facilitate handling during processing such as a grinding process or a dicing process, and to prevent damage, the wafer is reinforced by attaching an adhesive tape to the wafer or via an adhesive tape. Then, a support plate is attached to the wafer for reinforcement.
In such applications, the adhesive tape is required to have a high adhesive enough to firmly fix the wafer during the processing process and a releasability that can be removed without damaging the wafer after completion of the process (hereinafter referred to as “high adhesion”). Also called “easy peeling”.)

Patent Document 1 describes a wafer processing method using a double-sided adhesive tape having an adhesive layer containing a gas generating agent that generates a gas upon stimulation with an azo compound or the like as a pressure-sensitive adhesive tape that achieves high adhesion and easy peeling. Yes. In the wafer processing method described in Patent Document 1, first, a wafer is fixed to a support plate via a double-sided adhesive tape. When stimulation is performed after the grinding process or the like is performed in this state, the gas generated from the gas generating agent is released to the interface between the surface of the tape and the wafer, and at least a part is peeled off by the pressure. If the double-sided adhesive tape of patent document 1 is used, it can peel, without damaging a wafer and without the adhesive residue.

However, in the pressure-sensitive adhesive tape, there is a trade-off relationship between adhesiveness and peelability, and it is difficult to exhibit high peelability at the same time while exhibiting high adhesiveness. For example, even when the double-sided adhesive tape described in Patent Document 1 is used in a semiconductor chip manufacturing process, an adhesive tape having higher adhesiveness can be obtained if the yield during the grinding process or dicing process is improved. It is necessary to use and fix firmly. However, when the adhesive tape is given a high degree of adhesiveness, it may not be sufficiently peeled even if gas is subsequently generated from the gas generating agent, which may reduce the yield. there were.

JP 2003-231872 A

An object of this invention is to provide the adhesive tape which can be easily peeled even if it sticks to a to-be-adhered body with high adhesive force in view of the said present condition, and the peeling method of this adhesive tape.

The present invention has a pressure-sensitive adhesive layer containing a gas generating agent that generates gas upon stimulation, and a linear shape reaching the end of the pressure-sensitive adhesive layer on the surface of the pressure-sensitive adhesive layer containing the gas generating agent It is an adhesive tape having a release processing part.
Further, the present invention is a method for peeling an adhesive tape from an adherend, wherein the adhesive tape has an adhesive layer containing a gas generating agent that generates gas by stimulation on the side attached to the adherend. And having a linear release treatment part reaching the end of the pressure-sensitive adhesive layer on the surface of the pressure-sensitive adhesive layer containing the gas generating agent, and a pressure-sensitive adhesive tape attached to the adherend Providing a stimulus to generate gas from the gas generating agent, and treating the adherend to which the pressure-sensitive adhesive tape has been affixed with a liquid to separate the pressure-sensitive adhesive tape from the adherend. It is the peeling method of an adhesive tape.
The present invention is described in detail below.

As a result of intensive studies, the present inventors have performed a linear release treatment on the surface of the pressure-sensitive adhesive layer containing the gas generating agent of the pressure-sensitive adhesive tape having the pressure-sensitive adhesive layer containing the gas generating agent that generates gas upon stimulation. It has been found that the separation mode at the time of gas generation can be controlled by providing the portion. Furthermore, in the adherend to which the adhesive tape is affixed, by treating with a liquid after generating gas, even an adhesive tape affixed to the adherend with a high adhesive force can be easily peeled off. The present invention has been completed by finding out what can be done.

The pressure-sensitive adhesive tape of the present invention has a pressure-sensitive adhesive layer (hereinafter, also referred to as “gas-generating pressure-sensitive adhesive layer”) containing a gas generating agent that generates gas upon stimulation.
The pressure-sensitive adhesive tape of the present invention may be a non-support tape consisting only of the gas-generating pressure-sensitive adhesive layer, or may be a single-sided pressure-sensitive adhesive tape having a gas-generating pressure-sensitive adhesive layer on one side of the base material. It may be a double-sided pressure-sensitive adhesive tape having a pressure-sensitive adhesive layer. In addition, when the said adhesive tape is a double-sided adhesive tape, the adhesive layer of an at least one surface should just be a gas generation adhesive layer.
Moreover, when the adhesive tape of this invention has a base material, the said base material is although it does not specifically limit, It is preferable that it is what permeate | transmits or passes light, for example, an acryl, an olefin, a polycarbonate, vinyl chloride, ABS, polyethylene Examples thereof include a sheet made of a transparent resin such as terephthalate (PET), polyethylene naphthalate (PEN), nylon, urethane, and polyimide, a sheet having a network structure, and a sheet having holes. Moreover, the said base material may be processed for improving adhesiveness with an adhesive layer, such as a corona treatment.

The pressure-sensitive adhesive constituting the gas generating pressure-sensitive adhesive layer is not particularly limited, but is a photocurable pressure-sensitive adhesive containing a photocurable pressure-sensitive adhesive component that is crosslinked and cured by light irradiation, and a thermosetting pressure-sensitive adhesive that is crosslinked and cured by heating. A curable adhesive such as a thermosetting adhesive containing an agent component is suitable. In such curable adhesives, the entire adhesive is uniformly and rapidly polymerized and cross-linked by light irradiation or heating, so that the elastic modulus is significantly increased due to polymerization and curing, and the adhesive strength is greatly reduced. To do. When a gas is generated from the gas generating agent in a hard cured product having an increased elastic modulus, most of the generated gas is released to the outside. In the pressure-sensitive adhesive tape of the present invention, since the linear release process part is provided on the surface of the gas generating pressure-sensitive adhesive layer, the generated gas is discharged particularly to the release process part, and particularly in the release process part. Peeling occurs between the adhesive tape and the adherend.

Examples of the photocurable pressure-sensitive adhesive include a photocurable pressure-sensitive adhesive containing a polymerizable polymer as a main component and a photopolymerization initiator.
Examples of the thermosetting pressure-sensitive adhesive include a thermosetting pressure-sensitive adhesive containing a polymerizable polymer as a main component and a thermal polymerization initiator.

The polymerizable polymer is prepared by, for example, previously synthesizing a (meth) acrylic polymer having a functional group in the molecule (hereinafter referred to as a functional group-containing (meth) acrylic polymer) and reacting with the functional group in the molecule. It can obtain by making it react with the compound (henceforth a functional group containing unsaturated compound) which has a functional group to perform and a radically polymerizable unsaturated bond.

The functional group-containing (meth) acrylic polymer is an acrylic having an alkyl group usually in the range of 2 to 18 as a polymer having adhesiveness at room temperature, as in the case of a general (meth) acrylic polymer. By copolymerizing an acid alkyl ester and / or methacrylic acid alkyl ester as a main monomer, a functional group-containing monomer, and, if necessary, another modifying monomer copolymerizable therewith by a conventional method It is obtained. The weight average molecular weight of the functional group-containing (meth) acrylic polymer is usually about 200,000 to 2,000,000.

Examples of the functional group-containing monomer include a carboxyl group-containing monomer such as acrylic acid and methacrylic acid; a hydroxyl group-containing monomer such as hydroxyethyl acrylate and hydroxyethyl methacrylate; and an epoxy group containing glycidyl acrylate and glycidyl methacrylate. Monomers; Isocyanate group-containing monomers such as isocyanate ethyl acrylate and isocyanate ethyl methacrylate; and amino group-containing monomers such as aminoethyl acrylate and aminoethyl methacrylate.

Examples of other modifying monomers that can be copolymerized include various monomers used in general (meth) acrylic polymers such as vinyl acetate, acrylonitrile, and styrene.

The functional group-containing unsaturated compound to be reacted with the functional group-containing (meth) acrylic polymer is the same as the functional group-containing monomer described above according to the functional group of the functional group-containing (meth) acrylic polymer. it can. For example, when the functional group of the functional group-containing (meth) acrylic polymer is a carboxyl group, an epoxy group-containing monomer or an isocyanate group-containing monomer is used, and when the functional group is a hydroxyl group, an isocyanate group-containing monomer is used. When the functional group is an epoxy group, a carboxyl group-containing monomer or an amide group-containing monomer such as acrylamide is used, and when the functional group is an amino group, an epoxy group-containing monomer is used.

Examples of the photopolymerization initiator include those activated by irradiation with light having a wavelength of 250 to 800 nm. Examples of such a photopolymerization initiator include acetophenone derivative compounds such as methoxyacetophenone; Benzoin ether compounds such as benzoin propyl ether and benzoin isobutyl ether; ketal derivative compounds such as benzyldimethyl ketal and acetophenone diethyl ketal; phosphine oxide derivative compounds; bis (η5-cyclopentadienyl) titanocene derivative compounds, benzophenone, Michler's ketone, Chlorothioxanthone, Todecylthioxanthone, Dimethylthioxanthone, Diethylthioxanthone, α-hydroxycyclohexyl phenyl ketone, 2-hydroxymethylphenylpropane, etc. These radical photopolymerization initiators. These photoinitiators may be used independently and 2 or more types may be used together.

Examples of the thermal polymerization initiator include those that decompose by heat and generate active radicals that initiate polymerization. Examples thereof include dicumyl peroxide, di-t-butyl peroxide, t-butyl peroxybenzoate, t- Examples include butyl hydroperoxide, benzoyl peroxide, cumene hydroperoxide, diisopropylbenzene hydroperoxide, paramentane hydroperoxide, and di-t-butyl peroxide. These thermal polymerization initiators may be used independently and 2 or more types may be used together.

The photocurable pressure-sensitive adhesive or thermosetting pressure-sensitive adhesive preferably further contains a radical polymerizable polyfunctional oligomer or monomer. By containing a radically polymerizable polyfunctional oligomer or monomer, photocurability or thermosetting is improved.
The polyfunctional oligomer or monomer preferably has a molecular weight of 10,000 or less, and more preferably has a molecular weight of 5000 or less so that the three-dimensional network of the pressure-sensitive adhesive layer can be efficiently formed by heating or light irradiation. And the number of radically polymerizable unsaturated bonds in the molecule is 2-20.

The polyfunctional oligomer or monomer is, for example, trimethylolpropane triacrylate, tetramethylolmethane tetraacrylate, pentaerythritol triacrylate, pentaerythritol tetraacrylate, dipentaerythritol monohydroxypentaacrylate, dipentaerythritol hexaacrylate or the same methacrylate as described above. And the like. Other examples include 1,4-butylene glycol diacrylate, 1,6-hexanediol diacrylate, polypropylene glycol # 700 diacrylate, polyethylene glycol diacrylate, commercially available oligoester acrylate, and methacrylates similar to those described above. These polyfunctional oligomers or monomers may be used alone or in combination of two or more.

The said gas generating agent is not specifically limited, For example, conventionally well-known gas generating agents, such as an azo compound and an azide compound, can be used.
Moreover, when performing a high temperature process etc. in the state which stuck the said adhesive tape to the to-be-adhered body, the said gas generating agent was hold | maintained at 150 degreeC for 1 hour by TG-DTA (thermogravimetric-differential thermal analysis) measurement. It is preferable that the weight loss amount is 5% or less. If it exceeds 5%, the gas generating agent is consumed during heating and gas is generated, so that it may be difficult to generate gas at a desired time.
In the present specification, the weight loss when the TG-DTA measurement is held at 150 ° C. for 1 hour is 5% or less means that the gas generating agent alone is from 35 ° C. to 150 ° C. at a temperature rising rate of 10 ° C./min. It means that the amount of weight loss between the time when the temperature is raised to 150 ° C. and the time when the temperature reaches 150 ° C. until 1 hour has elapsed is 5% or less.

Specific examples of the gas generating agent that satisfies the weight reduction amount include ring opening of 3-azidomethyl-3-methyloxetane, terephthalazide, p-tert-butylbenzazide, and 3-azidomethyl-3-methyloxetane. Polymers having an azide group such as glycidyl azide polymer (GAP) obtained by polymerization, carboxylic acid compounds such as ketoprofen and 2-xanthone acetic acid or salts thereof, 1H-tetrazole, 5,5′-bistetrazole di Examples thereof include tetrazole compounds such as ammonium salts and 5,5′-bistetrazoleamine monoammonium salts or salts thereof. These gas generating agents generate nitrogen gas mainly by irradiating light in the ultraviolet region with a wavelength of 400 nm or less.

Although content of the said gas generating agent is not specifically limited, The preferable minimum with respect to 100 weight part of said adhesives is 1 weight part, and a preferable upper limit is 200 weight part. When the content of the gas generating agent is within this range, both sufficient adhesiveness and gas generating property can be achieved. A more preferred lower limit is 3 parts by weight, and a more preferred upper limit is 100 parts by weight.

The gas generating pressure-sensitive adhesive layer is appropriately blended with various polyfunctional compounds that are blended in general pressure-sensitive adhesives such as isocyanate compounds, melamine compounds, and epoxy compounds as desired for the purpose of adjusting the cohesive force as the pressure-sensitive adhesive. May be. In addition, known additives such as an antistatic agent, a plasticizer, a resin, a surfactant, a wax, and a fine particle filler can be added.
Moreover, in order to improve stability of resin, you may mix | blend a heat stabilizer and antioxidant. Examples of such additives include phenol-based antioxidants, amine-based antioxidants, sulfur-based antioxidants, phosphorus-based antioxidants, organotin-based stabilizers, lead-based stabilizers, and the like. These additives may be used independently and 2 or more types may be used together.

The pressure-sensitive adhesive tape of the present invention has a linear release treatment part on the surface of the gas generating pressure-sensitive adhesive layer. By having such a mold release processing part, when the gas is generated from the gas generating agent by stimulating the pressure-sensitive adhesive tape of the present invention, the generated gas is particularly released to the mold release processing part. Peeling of the adhesive tape and the adherend occurs in the release processing section.

The said linear mold release process part has reached the edge part of the adhesive layer. As a result, when peeling between the adhesive tape and the adherend occurs in the linear release processing portion due to the generated gas, the peeling portion opens at the end of the pressure-sensitive adhesive layer. When performing, liquid can flow into the peeling portion from the opening.
In addition, although the said linear mold release process part should just have at least one end of the line | wire reached the edge part of an adhesive layer, it is preferable that the both ends of the line | wire have reached the edge part of the adhesive layer. .

The said linear mold release process part may be given to one surface of the said gas generation adhesive layer, and may be given to both surfaces.
The linear release treatment part may be provided on the surface of the gas generating pressure-sensitive adhesive layer on the side in contact with the adherend, and on the surface on the side in contact with the base (if it has a base). It may be given. In the case where the linear release processing part is provided on the surface in contact with the adherend, peeling occurs mainly at the interface between the gas generating pressure-sensitive adhesive layer and the adherend. Moreover, when the said linear mold release process part is given to the surface in the side which contacts a base material, peeling arises mainly in the interface of a gas generation adhesive layer and a base material.

It is preferable that the linear release processing part is applied over the entire surface of the gas generating pressure-sensitive adhesive layer. By being applied over the entire surface, the adhesive tape can be more reliably peeled off from the adherend.
FIG. 1 shows a specific example of the pattern of the linear release processing section. Examples of the pattern of the linear release processing unit include, for example, a parallel line shape (FIG. 1A), a lattice shape (FIG. 1B), a spiral shape (FIG. 1C), and a wave shape (FIG. 1). (D)).

The line width of the linear release treatment part is not particularly limited, but a preferred lower limit is 0.5 mm and a preferred upper limit is 10 mm. When the line width is within this range, both particularly high adhesiveness and peelability can be achieved. When the line width is less than 0.5 mm, gas is generated to cause separation of the adhesive tape and the adherend in the release processing section, and even if liquid processing is performed, the liquid sufficiently flows into the peeling section. In some cases, the peelability may decrease. When the line width exceeds 10 mm, the adhesiveness may be lowered. A more preferable lower limit of the line width is 1 mm, and a more preferable upper limit is 5 mm.

The ratio of the area of the linear release treatment part on the entire surface of the pressure-sensitive adhesive layer to be adhered to the adherend is not particularly limited, but the preferred lower limit is 5% and the preferred upper limit is 50%. When the ratio of the area of the linear release processing portion is within this range, both particularly high adhesiveness and peelability can be achieved. If the area ratio of the linear release processing part is less than 5%, gas may be generated and the liquid treatment may not be performed sufficiently. If the ratio of the area of the linear release processing part exceeds 50%, the adhesiveness may be lowered. The more preferable lower limit of the ratio of the area of the linear release processing portion is 10%, and the more preferable upper limit is 30%.

The method for forming the release treatment part on the surface of the pressure-sensitive adhesive layer is not particularly limited, but a method of treating the release agent by a printing method such as gravure printing is simple and preferable.
The release agent is not particularly limited, and for example, a silicon-based, long-chain alkyl-based, or fluorine-based release agent can be used.
Examples of the long-chain alkyl release agent include Pyroyl 1050 and Pyroyl 406 manufactured by Otsuka Oil Co., Ltd.
Examples of the silicon release agent include KM722T and KF412SP manufactured by Shin-Etsu Chemical Co., Ltd.
Examples of the fluorine-based mold release agent include EGC-1720 manufactured by 3M, and die-free manufactured by Nihon Kasei Co., Ltd.

The peeling method of the adhesive tape of this invention is a method of peeling an adhesive tape from the to-be-adhered body which the adhesive tape of this invention stuck.
In the pressure-sensitive adhesive tape peeling method of the present invention, first, a step of generating a gas from a gas generating agent by stimulating the pressure-sensitive adhesive tape attached to the adherend is performed.
The gas generated from the gas generating agent by applying the stimulus is particularly released to the mold release processing section, and in particular, the adhesive tape and the adherend are peeled off at the mold release processing section.

In the method for peeling off the pressure-sensitive adhesive tape of the present invention, the process of peeling the pressure-sensitive adhesive tape from the adherend is then performed by treating the adherend to which the gas-generated pressure-sensitive adhesive tape has been applied with a liquid.
As described above, after the gas generating agent, the pressure-sensitive adhesive tape and the adherend are peeled off particularly in the release treatment section. Moreover, since the said mold release process part has reached the edge part of the said adhesive layer, this peeling part is opening in the edge part of an adhesive layer. By treating with a liquid in such a state, the liquid flows into the peeling portion from the opening due to a capillary phenomenon, and the pressure-sensitive adhesive tape is reliably peeled off from the adherend by the pressure of the liquid.

The specific method of treating with the liquid is not particularly limited, and examples thereof include a method of applying a liquid to an adherend to which an adhesive tape is attached, a method of immersing an adherend to which an adhesive tape is attached, in a liquid, and the like. It is done.
The said liquid is not specifically limited, In addition to water, an acid, an alkali, or an organic solvent can be used.

ADVANTAGE OF THE INVENTION According to this invention, the adhesive tape which can be easily peeled even if it sticks to a to-be-adhered body with high adhesive force, and the peeling method of this adhesive tape can be provided.

It is a schematic diagram which shows the specific example of the pattern of a linear mold release process part.

Hereinafter, embodiments of the present invention will be described in more detail with reference to examples. However, the present invention is not limited to these examples.

Example 1
(1) Preparation of pressure-sensitive adhesive for support plate-side pressure-sensitive adhesive layer The following compounds were dissolved in ethyl acetate and polymerized by irradiating with ultraviolet rays to obtain an acrylic copolymer having a weight average molecular weight of 600,000.
-97.5 parts by weight of 2-ethylhexyl acrylate-1.5 parts by weight of 2-hydroxyethyl acrylate-1.0 part by weight of acrylic acid-0.2 part by weight of photopolymerization initiator Further, the acrylic copolymer after the reaction Benzophenone 0.5 parts by weight, polyisocyanate 2 parts by weight, glycidyl azide polymer (GAP5003, manufactured by NOF Corporation), 2,4-diethyl per 100 parts by weight of the resin solid content of the ethyl acetate solution containing 5 parts by weight of thioxanthone was mixed to prepare an ethyl acetate solution of a pressure-sensitive adhesive for a support plate-side pressure-sensitive adhesive layer containing a gas generating agent (azide compound).

(2) Preparation of wafer-side pressure-sensitive adhesive layer adhesive The following compound was dissolved in ethyl acetate, polymerized by irradiating ultraviolet rays, and a photocurable pressure-sensitive adhesive made of an acrylic copolymer having a weight average molecular weight of 700,000. An ethyl acetate solution was obtained.
-83 parts by weight of 2-ethylhexyl acrylate-10 parts by weight of butyl acrylate-2 parts by weight of acrylic acid-5 parts by weight of 2-hydroxyethyl acrylate-0.2 parts by weight of photopolymerization initiator (Irgacure 651, 50% ethyl acetate solution)
-0.01 parts by weight of lauryl mercaptan 0.01 parts by weight of resin solid content of 100 parts by weight of the photocurable adhesive ethyl acetate solution was added and reacted with 3.5 parts by weight of 2-isocyanatoethyl methacrylate, 5 parts by weight of a photopolymerization initiator (Irgacure 651) and 1.0 part by weight of a polyisocyanate are mixed with 100 parts by weight of the resin solid content of the ethyl acetate solution after the reaction to prepare ethyl acetate as a pressure sensitive adhesive for the wafer side pressure sensitive adhesive layer. A solution was prepared.

(3) Production of double-sided pressure-sensitive adhesive tape On the corona-treated surface of a transparent polyethylene naphthalate (PEN) film having a thickness of 50 μm and a corona-treated ethyl acetate solution of the pressure-sensitive adhesive for the support plate side pressure-sensitive adhesive layer, Coating was performed with a doctor knife so that the thickness of the dried film was about 30 μm, and the coating solution was dried by heating at 110 ° C. for 5 minutes to evaporate the solvent. The pressure-sensitive adhesive layer after drying showed adhesiveness in a dry state.
A long-chain alkyl release agent Pyroyl 1050 is printed on the surface of the obtained pressure-sensitive adhesive layer on the support plate by a gravure method to form a parallel-line-shaped release treatment portion as shown in FIG. did.
The line width of the mold release processing part was 2 mm, and the ratio of the area of the parallel linear mold release processing part over the entire surface of the support-plate-side pressure-sensitive adhesive layer was 20%.
A PET film subjected to a release treatment was laminated on the surface of the pressure-sensitive adhesive layer on the support plate after the formation of the release treatment portion.

Next, an ethyl acetate solution of the pressure-sensitive adhesive for the wafer-side pressure-sensitive adhesive layer was applied on a PET film having a release treatment on the surface with a doctor knife so that the dry film thickness was about 40 μm. The coating solution was dried by heating at 5 ° C. for 5 minutes to evaporate the solvent. The wafer-side pressure-sensitive adhesive layer after drying showed adhesiveness in a dry state.
Next, the surface of the base material provided with the support plate-side pressure-sensitive adhesive layer is subjected to corona treatment without the support plate-side pressure-sensitive adhesive layer, and the wafer side of the PET film subjected to the release treatment provided with the wafer-side pressure-sensitive adhesive layer. The surface of the adhesive layer was bonded together. Thereafter, the film was allowed to stand at 40 ° C. for 3 days for curing. As a result, a double-sided pressure-sensitive adhesive tape having a pressure-sensitive adhesive layer on both surfaces and having a parallel-line-shaped release treatment portion on the surface of the support-plate-side pressure-sensitive adhesive layer containing the gas generating agent on the side to be attached to the support plate was obtained.

(Example 2)
Implemented except that the long-chain alkyl release agent Pyroyl 1050 was printed on the surface of the support-plate-side pressure-sensitive adhesive layer by a gravure method to form a grid-like release processing section as shown in FIG. In the same manner as in Example 1, a double-sided adhesive tape was obtained.
The line width of the release treatment part was 1 mm, and the ratio of the area of the lattice-like release treatment part over the entire surface of the support plate-side pressure-sensitive adhesive layer was 20%.

(Comparative Example 1)
A double-sided pressure-sensitive adhesive tape was obtained in the same manner as in Example 1 except that a long-chain alkyl release agent Pyroyl 1050 was printed on the entire surface of the support plate-side pressure-sensitive adhesive layer by a gravure method to form a release treatment part. .

(Comparative Example 2)
A double-sided pressure-sensitive adhesive tape was obtained in the same manner as in Example 1 except that the release treatment part was not formed on the surface of the support plate-side pressure-sensitive adhesive layer.

(Evaluation)
The double-sided pressure-sensitive adhesive tapes obtained in Examples 1 and 2 and Comparative Examples 1 and 2 were evaluated by the following methods.
The results are shown in Table 1.

(1) Evaluation of adhesiveness The PET film that protects the wafer-side adhesive layer of the double-sided adhesive tape is peeled off and attached to a silicon wafer having a diameter of 20 cm and a thickness of about 750 μm, on which the circuit is formed. The PET film protecting the pressure-sensitive adhesive layer was peeled off, and a glass plate having a diameter of 20.4 cm was attached to the pressure-sensitive adhesive layer using a vacuum press to obtain a laminate.
The wafer side of the obtained laminate was ground and polished to a thickness of 50 μm.
The same operation was performed on ten silicon wafers, and the number of sheets peeled off during grinding was counted. Of the 10 sheets, the case where the number of peeled pieces was 1 or less was evaluated as “◯”, and the case where the number exceeded 1 was evaluated as “x”.

(2) Evaluation of peelability Using a super high pressure mercury lamp from the glass plate side to the laminated body after grinding, adjusting the illuminance so that the irradiation intensity of the ultraviolet light of 365 nm to the glass plate surface is 80 mW / cm ^2. Irradiation was performed for 1 minute to crosslink and cure the adhesive component, and gas was generated from the gas generating agent. Subsequently, the laminated body after ultraviolet irradiation was immersed in distilled water.
The same operation was performed on 10 sets of laminates, and the number of sets that were dipped in distilled water and peeled off the glass plate from the double-sided adhesive tape was counted. Of the 10 sets, the case where the number of peeled groups was 9 or more was evaluated as “◯”, and the case where the number was 8 or less was evaluated as “x”.
The same evaluation was performed when standard clean 1 (SC1) solution and standard clean 2 (SC2) solution were used instead of distilled water.
In addition, in the Example, it has confirmed that peeling had arisen between the glass plate and the support plate side adhesive layer.

(Example 3)
Corona treatment is applied to the ethyl acetate solution of the pressure-sensitive adhesive for the support plate-side pressure-sensitive adhesive layer, and a long-chain alkyl release agent Pyroyl 1050 is printed by a gravure method to form parallel lines as shown in FIG. On the release treatment surface of a transparent polyethylene naphthalate (PEN) film having a thickness of 50 μm formed with a release treatment part of the film, a dry knife is applied with a doctor knife so that the thickness of the dry film is about 30 μm, and 110 ° C. The solvent was evaporated by heating for 5 minutes to dry the coating solution. The pressure-sensitive adhesive layer after drying showed adhesiveness in a dry state.
The line width of the mold release processing part was 2 mm, and the ratio of the area of the parallel linear mold release processing part over the entire surface of the support-plate-side pressure-sensitive adhesive layer was 20%.
A PET film subjected to a release treatment was laminated on the surface of the pressure-sensitive adhesive layer on the support plate after the formation of the release treatment portion.

Next, on the corona-treated surface of a transparent polyethylene naphthalate (PEN) film having a thickness of 50 μm obtained by corona-treating the ethyl acetate solution of the wafer-side pressure-sensitive adhesive layer prepared by the same method as in Example 1. In addition, coating was performed with a doctor knife so that the thickness of the dried film was about 40 μm, and the coating solution was dried by heating at 110 ° C. for 5 minutes to volatilize the solvent. The wafer-side pressure-sensitive adhesive layer after drying showed adhesiveness in a dry state.
Next, the surface of the base material provided with the wafer-side pressure-sensitive adhesive layer is subjected to corona treatment without the wafer-side pressure-sensitive adhesive layer, and the support plate side of the PET film subjected to the release treatment provided with the support-plate-side pressure-sensitive adhesive layer The surface of the adhesive layer was bonded together. Thereafter, the film was allowed to stand at 40 ° C. for 3 days for curing. Thereby, the adhesive layer was provided on both surfaces, and the double-sided adhesive tape which has a parallel-line-shaped mold release process part on the surface of the base material side of the support plate side adhesive layer containing a gas generating agent was obtained.

Example 4
On the surface of the polyethylene naphthalate (PEN) film of the support plate side pressure-sensitive adhesive layer, a long-chain alkyl release agent Pyroyl 1050 is printed by a gravure method, and a grid-like release treatment as shown in FIG. A double-sided pressure-sensitive adhesive tape was obtained in the same manner as in Example 3 except that the part was formed.
The line width of the release treatment part was 1 mm, and the ratio of the area of the lattice-like release treatment part over the entire surface of the support plate-side pressure-sensitive adhesive layer was 20%.

(Comparative Example 3)
Except that a long-chain alkyl release agent Pyroyl 1050 was printed on the entire surface of the polyethylene naphthalate (PEN) film of the support plate side pressure-sensitive adhesive layer by a gravure method to form a release treatment part, the same as in Example 3. Thus, a double-sided adhesive tape was obtained.

(Comparative Example 4)
A double-sided pressure-sensitive adhesive tape was obtained in the same manner as in Example 3 except that the release treatment part was not formed on the polyethylene naphthalate (PEN) film surface of the support plate-side pressure-sensitive adhesive layer.

(Evaluation)
The double-sided pressure-sensitive adhesive tapes obtained in Examples 3 and 4 and Comparative Examples 3 and 4 were evaluated by the following methods.
The results are shown in Table 2.

(1) Evaluation of adhesiveness The PET film that protects the wafer-side adhesive layer of the double-sided adhesive tape is peeled off and attached to a silicon wafer having a diameter of 20 cm and a thickness of about 750 μm, on which the circuit is formed. The PET film protecting the pressure-sensitive adhesive layer was peeled off, and a glass plate having a diameter of 20.4 cm was attached to the pressure-sensitive adhesive layer using a vacuum press to obtain a laminate.
The wafer side of the obtained laminate was ground and polished to a thickness of 50 μm.
The same operation was performed on ten silicon wafers, and the number of sheets peeled off during grinding was counted. Of the 10 sheets, the case where the number of peeled pieces was 1 or less was evaluated as “◯”, and the case where the number exceeded 1 was evaluated as “x”.

(2) Evaluation of peelability Using a super high pressure mercury lamp from the glass plate side to the laminated body after grinding, adjusting the illuminance so that the irradiation intensity of the ultraviolet light of 365 nm to the glass plate surface is 80 mW / cm ^2. Irradiation was performed for 1 minute to crosslink and cure the adhesive component, and gas was generated from the gas generating agent. Subsequently, the laminated body after ultraviolet irradiation was immersed in distilled water.
The same operation was performed on 10 sets of laminates, and the number of sets in which the glass plate was peeled off from the double-sided adhesive tape with almost no resistance was counted by dipping in distilled water. Of the 10 sets, the case where the number of peeled groups was 9 or more was evaluated as “◯”, and the case where the number was 8 or less was evaluated as “x”.
The same evaluation was performed when standard clean 1 (SC1) solution and standard clean 2 (SC2) solution were used instead of distilled water.
In addition, in the Example, it has confirmed that peeling had arisen between the support plate side adhesive layer and the base material.

ADVANTAGE OF THE INVENTION According to this invention, the adhesive tape which can be easily peeled even if it sticks to a to-be-adhered body with high adhesive force, and the peeling method of this adhesive tape can be provided.

1 Gas generation adhesive layer 2 Linear mold release processing part

Claims (2)

A linear mold release treatment unit having a pressure-sensitive adhesive layer containing a gas generating agent that generates gas by stimulation and reaching the end of the pressure-sensitive adhesive layer on the surface of the pressure-sensitive adhesive layer containing the gas generating agent have a line width of the line-shaped release treatment unit is 0.5 to 10 mm, the adhesive tape the adhesive tape is characterized in that it is peeled off later affixed to the adherend, the liquid treatment . A method of peeling an adhesive tape from an adherend,
The pressure-sensitive adhesive tape has a pressure-sensitive adhesive layer containing a gas generating agent that generates a gas by stimulation on the side attached to the adherend, and the pressure-sensitive adhesive on the surface of the pressure-sensitive adhesive layer containing the gas generating agent. have a linear release processing unit reaches the end of the layer, the line width of the line-shaped release treatment unit is one which is 0.5 to 10 mm,
Stimulating the adhesive tape affixed to the adherend to generate a gas from the gas generating agent; treating the adherend affixed with the adhesive tape after the gas generation with a liquid; A method for peeling off an adhesive tape, comprising a step of peeling the adhesive tape from a body.

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