JP6602022B2 - Mounting apparatus and mounting method - Google Patents

Description

  The present invention relates to a mounting apparatus and mounting method for mounting a semiconductor chip such as a flip chip on a circuit board.

  As an apparatus for mounting a semiconductor chip such as a flip chip (hereinafter referred to as a chip component) on a circuit board, the present applicant has applied for a mounting apparatus of Patent Document 1.

  As shown in FIG. 9, the mounting apparatus described in Patent Literature 1 temporarily press-bonds the chip component 4 to each circuit pattern 7 of the circuit board 2 on which the plurality of circuit patterns 7 are formed via the adhesive resin 6. The plurality of chip components 4 and the circuit board 2 are pressurized and heated in the next step of the temporary pressure bonding, and the chip components 4 are mounted on the circuit board 2 by being pressure bonded.

  The circuit board 2 is a collective board in which a plurality of circuit patterns 7 are arranged in a matrix in order to increase productivity, and the above-described temporary press bonding process applies the chip components 4 to all the circuit patterns 7 of one circuit board 2. After the temporary pressure bonding is performed at the temporary pressure bonding section 100, the circuit board 2 is then transferred to the main pressure bonding section 200, and a method of batch processing is performed in which the main pressure bonding process is performed.

  When the chip component is temporarily bonded to the circuit board 2, the adhesive resin 6 is in an uncured state and is held with an adhesive force such that the positioned chip component 4 is not displaced.

  The substrate stage of the main pressure bonding part 200 used in the main pressure bonding process has a built-in stage heater for improving the fluidity of the adhesive resin 6 of the circuit board 2 so that the circuit board 2 is about 70 ° C. It is heated.

JP 2010-232234 A

  In the main pressure bonding process, the chip component 4 is pressurized and heated. Heating is performed using a heater provided on the pressure head 207 side, and heat is transferred from the chip component 4 to the resin 6. At this time, as shown in FIG. 10, heat from the heating of the heater is transferred from the place where the main pressure bonding of the circuit board 2 is performed to the adjacent temporary pressure bonded position. Due to this heat, the curing reaction of the adhesive resin at the pre-pressed portion proceeds, and the hardened resin is caught between the bump 5 of the chip component 4 and the electrode 3 of the circuit board 2 when performing the main press bonding. There is a problem of causing poor bonding.

  Further, when there are many circuit patterns provided on the circuit board 2, it takes time from the final crimping operation of the first chip component 4 to the final crimping operation of the final chip component 4. 6 has a problem that curing progresses with the passage of time, resulting in poor bonding when the final chip component 4 is finally crimped.

  In addition, since the adhesive resin 6 in the temporarily press-bonded state is in an uncured state and has low adhesive strength, it is transferred when the circuit board 2 is transferred from the stage of the temporary press-bonding section 100 to the stage of the main press-bonding section 200. There is a problem that the chip component 4 is displaced due to hand-handling or vibration during conveyance.

  In addition, when the main pressure bonding is performed with a heater heated to a temperature equal to or higher than the curing temperature of the adhesive resin 6 in the main pressure bonding process, depending on the characteristics of the adhesive resin 6, the heat curing rapidly proceeds to inhibit the fluidity of the adhesive resin 6. Since the adhesive resin 6 is caught between the bump and the electrode, causing poor conduction, the fluidity of the adhesive resin 6 is improved at the start of the main pressure bonding, and the pressure is set at a temperature at which the curing does not proceed, and then the curing temperature. In some cases, it is raised to the final pressure.

  In that case, it is necessary to cool the heater heated to the curing temperature to the start temperature, which causes a problem that the tact time becomes long and the productivity is deteriorated.

  Accordingly, an object of the present invention is to provide a bonding apparatus in which a chip component is mounted on each circuit pattern of a circuit board on which a plurality of circuit patterns are formed by performing a temporary pressing process and a main pressing process via an adhesive resin. Provided are a highly productive mounting apparatus and mounting method that do not cause a shift.

In order to solve the above problem, the invention according to claim 1 is:
A mounting device for mounting a chip component on each circuit pattern of a circuit board on which a plurality of circuit patterns are formed via an adhesive resin,
A temporary crimping head for positioning the chip component and the circuit pattern provided on the circuit board and temporarily crimping the chip component to the circuit pattern;
A main pressure bonding head that heats and presses the temporarily pressure-bonded chip component to heat and cure the adhesive resin and finally press-bond the chip component to the circuit pattern;
A substrate holding stage having a function of holding a circuit board and having a built-in stage heater ;
A mechanism for alternately moving between a temporary pressure-bonding portion provided with a temporary pressure-bonding head and a main pressure-bonding portion provided with a main pressure-bonding head in a state where the circuit board is held on the substrate holding stage;
A mounting device equipped with a controller that temporarily presses the chip component onto the circuit pattern and then moves the substrate holding stage from the lower side of the temporary pressing head to the lower side of the main pressing head to perform the main pressing of the chip component onto the circuit pattern. is there.

The invention described in claim 2
A mounting device for mounting a chip component on each circuit pattern of a circuit board on which a plurality of circuit patterns are formed via an adhesive resin,
A temporary crimping head for positioning the chip component and the circuit pattern provided on the circuit board and temporarily crimping the chip component to the circuit pattern;
A main pressure bonding head that heats and presses the temporarily pressure-bonded chip component to heat and cure the adhesive resin and finally press-bond the chip component to the circuit pattern;
A substrate holding stage having a function of holding a circuit board and having a built-in stage heater ;
A mechanism for alternately moving the temporary pressure bonding head and the main pressure bonding head onto the substrate holding stage;
The mounting apparatus includes a control unit that moves the temporary pressure bonding head onto the substrate holding stage and performs temporary pressure bonding, and then moves the main pressure bonding head onto the substrate holding stage to perform the main pressure bonding.

The invention of claim 3 is the invention of claim 1 or claim 2,
The present crimping head is a mounting apparatus provided with a tool for heating and pressurizing a plurality of chip components at once.

The invention of claim 4 is the invention of claim 3,
This is a mounting device having a function of varying the pressing force according to the quantity of a plurality of chip parts to be pressed by a control unit that controls the pressing force of the main pressure bonding head.

The invention described in claim 5
A mounting method for mounting a chip component to each circuit pattern of a circuit board on which a plurality of circuit patterns are formed via an adhesive resin,
A step of aligning the chip component and the circuit pattern provided on the circuit board, and temporarily bonding the chip component to the circuit pattern using a temporary pressure bonding head;
Heating and pressurizing the temporarily crimped chip component to heat and cure the adhesive resin, and finally crimping the chip component to the circuit pattern using the main crimping head,
A process of holding a circuit board and having a built-in stage heater and moving the substrate holding stage to the lower side of the temporary press-bonding head, and temporarily pressing and moving the board to the lower side of the main press-bonding head. Are alternately mounted, and a step of removing the circuit board after preliminarily and chip-bonding the chip components to all circuit patterns on the circuit board.

The invention described in claim 6
A mounting method for mounting a chip component to each circuit pattern of a circuit board on which a plurality of circuit patterns are formed via an adhesive resin,
A step of aligning the chip component and the circuit pattern provided on the circuit board, and temporarily bonding the chip component to the circuit pattern using a temporary pressure bonding head;
Heating and pressurizing the temporarily crimped chip component to heat and cure the adhesive resin, and finally crimping the chip component to the circuit pattern using the main crimping head,
The process of holding the circuit board and moving the temporary pressure-bonding head on the substrate holding stage with a built-in stage heater and temporarily bonding it and the process of moving the main pressure-bonding head and finally pressure-bonding are performed alternately. The mounting method includes a step of removing the circuit board after temporarily pressing and main-bonding the chip parts to all circuit patterns on the circuit board.

  According to the first aspect of the present invention, in a state where the circuit board is held on the substrate holding stage, the chip component is temporarily pressure-bonded to the circuit pattern of the circuit board by the temporary pressure-bonding portion, and then the substrate holding stage is moved to the main pressure-bonding portion. Then, the temporarily crimped chip component is finally crimped by the crimping head. Since the adhesive resin is cured by performing the final pressure bonding every time the chip component is temporarily bonded, even if there is heat transfer from the substrate when the chip component is finally pressure bonded to another circuit pattern, the adhesive resin is already Since the curing is complete, the curing reaction is not repeated. For this reason, there is no occurrence of misalignment or bonding failure in the chip component of the circuit pattern that has been pressure-bonded.

  In addition, the temporary crimping head delivers the next chip component during the final crimping, and the temporary crimping head can be cooled to the next final crimping start temperature during the temporary crimping. Tact time can be shortened.

  In addition, the substrate on the substrate holding stage is held by suction, and the circuit board is transferred to the final chip component by reciprocating the temporary pressure bonding part and the main pressure bonding part. The problem of displacement disappears.

  According to the second aspect of the present invention, the temporary press-bonding head is moved on the substrate holding stage and temporarily pressed in a state where the circuit board is held on the substrate holding stage, and then the main press-bonding head is placed on the substrate holding stage. Move and perform final crimping. Since the adhesive resin is cured by performing the final pressure bonding every time the chip component is temporarily bonded, even if there is heat transfer from the substrate when the chip component is finally pressure bonded to another circuit pattern, the adhesive resin is already Since the curing is complete, the curing reaction is not repeated. For this reason, there is no occurrence of misalignment or bonding failure in the chip component of the circuit pattern that has been pressure-bonded.

  According to the third aspect of the present invention, the present crimping head includes a tool for heating and pressurizing a plurality of chip components at once. For this reason, a plurality of temporarily press-bonded chip components can be collectively bonded together, and the tact time can be shortened.

  According to the fourth aspect of the present invention, the control unit that controls the pressurizing force of the main pressure bonding head has a function of varying the pressurizing force in accordance with the quantity of a plurality of chip parts to be pressed. Therefore, even if a circuit pattern that has not been temporarily crimped due to a defect in the circuit pattern is included in the crimping portion of the main crimping, appropriate pressure can be applied to each chip component. Further, when the circuit board has a circular shape such as a wafer, the pressurizing force is varied according to the number of chip parts when the plurality of circuit patterns on the outer peripheral portion are subjected to main pressure bonding, so that no press failure occurs.

  According to the fifth aspect of the present invention, the substrate holding stage for holding the circuit board is moved to the lower side of the temporary crimping head and temporarily crimped, and is moved to the lower side of the final crimping head and finally crimped. Steps are alternately performed, and the circuit board is taken out after the chip components are temporarily press-bonded and main-bonded to all circuit patterns of the circuit board. Since the adhesive resin is hardened by pressing the chip component every time it is temporarily bonded, even if there is heat transfer from the circuit board when the chip component is finally bonded to another circuit pattern, the adhesive resin is already used. Since the curing of is completed, the curing reaction is not repeated. For this reason, there is no occurrence of misalignment or bonding failure in the chip component of the circuit pattern that has been pressure-bonded.

  According to the invention described in claim 6, the step of moving the temporary pressure bonding head on the substrate holding stage for holding the circuit board and temporarily bonding the pressure bonding and the step of moving the main pressure bonding head and performing the final pressure bonding are alternately performed. And a step of removing the circuit board after temporarily pressing and main-bonding the chip parts to all circuit patterns of the circuit board. Since the adhesive resin is hardened by pressing the chip component every time it is temporarily bonded, even if there is heat transfer from the circuit board when the chip component is finally bonded to another circuit pattern, the adhesive resin is already used. Since the curing of is completed, the curing reaction is not repeated. For this reason, there is no occurrence of misalignment or bonding failure in the chip component of the circuit pattern that has been pressure-bonded.

It is a schematic side view of the mounting apparatus according to the first embodiment of the present invention. It is the schematic plan view which showed an example of the circuit board. 4 is an operation flowchart of the mounting apparatus according to the first embodiment. It is the figure which graphed the condition of the pressurization and heating at the time of this press-fit. It is a schematic side view of the mounting apparatus which concerns on Embodiment 2 of this invention. 6 is an operation flowchart of the mounting apparatus according to the second embodiment. It is a schematic side view of the principal part of the mounting apparatus which concerns on Embodiment 3 of this invention. It is a schematic side view of the principal part of the mounting apparatus which concerns on Embodiment 4 of this invention. It is a schematic side view of the conventional mounting apparatus. It is the figure which showed a mode that the heat | fever by the heating of a heater transferred from the location which is performing the main crimping | compression-bonding of a circuit board to the adjacent temporary crimped location.

  Embodiment 1 of the present invention will be described below with reference to the drawings. In FIG. 1, the left-right direction toward the mounting apparatus 1 is the X-axis, the front direction is the Y-axis, the axis orthogonal to the XY plane composed of the X-axis and the Y-axis is the Z-axis, and the direction rotates about the Z-axis. Is the θ direction. The mounting apparatus 1 includes a temporary crimping unit 100 that temporarily crimps the chip component 4 to the circuit board 2, a final crimping unit 200 that crimps the chip component 4 to the circuit board 2, and a control unit 150 that controls the entire mounting apparatus 1. It consists of and.

  The temporary pressure bonding unit 100 is a chip component on the substrate holding stage 102 placed on the base 101, the support frame 103 provided at the rear of the base 101 in the Y direction, and the circuit board 2 provided on the support frame 103. Pressure bonding means 104 for temporarily pressing 4, a chip slider 110 for supplying the chip component 4 to the temporary pressing head 107 provided in the pressing means 104, an alignment mark provided on the circuit board 2, and the chip component 4. The two-view camera 130 recognizes an image of the provided alignment mark.

  The circuit board 2 is supplied to the substrate holding stage 102 by a conveying means (not shown). The substrate holding stage 102 is provided with position adjusting means 106 that can move in the XY directions. The position adjusting means 106 is configured to drive the substrate holding stage 102 in the XY directions by a mechanism such as a ball screw connected to a servo motor. A stage heater 105 is built in the substrate holding stage 102 in order to improve the fluidity of the resin 6 of the circuit board 2.

  The position adjusting means 106 of the substrate holding stage 102 is provided on a slide rail 120 extending from the temporary pressure bonding part 100 to the main pressure bonding part 200. A linear guide 121 provided at the lower part of the slide rail 120 and the position adjusting means 106 is fitted, and the substrate holding stage 102 can be reciprocated between the temporary pressure bonding part 100 and the main pressure bonding part 200. In FIG. 1, the substrate holding stage 102 that has moved to the main pressure bonding part 200 is indicated by a dotted line.

  The pressurizing means 104 includes a temporary pressure-bonding head 107 driven in the Z direction, a lifting / lowering means 108 for driving the temporary pressure-bonding head 107, and a rotating means 109 for driving in the θ direction. The elevating means 108 is configured to drive the temporary press-bonding head 107 in the Z direction by a servo motor and ball screw mechanism. Not only the configuration of the servo motor and the ball screw, but also a configuration of a pneumatic cylinder and a piston or a voice coil motor may be used.

  The temporary pressure bonding head 107 is provided with a temporary pressure bonding heater 125 and a temporary pressure bonding attachment 126. The temporary pressure bonding heater 125 is for heating the chip component 4 and is constituted by a cartridge heater. However, the present invention is not limited to the cartridge heater, and any material that can heat the chip component 4 such as a rubber heater may be used.

  The temporary crimping attachment 126 holds the chip component 4. The temporary crimping attachment 126 is held by the temporary crimping heater 125 by suction. Further, the temporary crimping attachment 126 is configured to be heated by the temporary crimping heater 125. That is, the temporary crimping attachment 126 is configured to position and hold the chip component 4 and to heat the chip component 4 by heat transfer from the temporary crimping heater 125.

  By making the outer peripheral size of the surface for adsorbing the chip component 4 of the temporary crimping attachment 126 smaller than the size of the chip component 4, the adhesive resin 6 (for example, NCF) protrudes from between the chip component 4 and the circuit board 2. Even if it does, the problem of adhering to the temporary crimping attachment 126 does not occur. Each side of the temporary crimping attachment 126 is preferably about 0.1 mm to 0.5 mm smaller than each side of the chip component 4.

  The chip slider 110 horizontally transports the chip component 4 from a chip supply unit (not shown) to a position below the temporary pressure bonding head 107. The chip slider 110 includes a slide rail 111 that extends from the chip supply unit to the provisional pressure bonding head 107 and a chip transport unit 112 that transports the chip component 4. The chip transfer unit 112 is configured to move horizontally below the chip supply unit and the temporary pressure bonding head 107 while holding the chip component 4 by suction.

  The two-field camera 130 is a camera having a vertical field of view, and is inserted between the temporary press-bonding head 107 and the substrate holding stage 102, and an alignment mark provided on the circuit board 2 and an alignment mark provided on the chip component 4. It is comprised so that image recognition can be carried out. In FIG. 1, the inserted state is indicated by a dotted line.

  The main crimping section 200 includes a support frame 203 provided at the rear of the base 101 in the Y direction, a pressurizing unit 204 for final crimping the chip component 4 to the circuit board 2 provided on the support frame 203, and a resin sheet supply mechanism. 210. A substrate holding stage 102 provided on the slide rail 120 is configured to be movable from the temporary pressure bonding portion 100 to the main pressure bonding portion 200.

  The pressurizing means 204 is composed of a main pressure bonding head 207 driven in the Z direction, a lifting / lowering means 208 for driving the main pressure bonding head 207, and a rotation means 209 for driving in the θ direction. The elevating means 208 is configured to drive the main pressure bonding head 207 in the Z direction by a mechanism of a servo motor and a ball screw. Not only the configuration of the servo motor and the ball screw, but also a configuration of a pneumatic cylinder and a piston or a voice coil motor may be used. The main pressure bonding head 220 is assembled with a main pressure bonding heater 220 so that the adhesive resin 6 filled in the circuit board 2 can be cured by heating. The pressing force of the pressurizing means 204 is controlled so as to be variable according to the number of electrodes of the chip component 4 and the contact area between the electrodes with the circuit board 2.

  The resin sheet supply mechanism 210 includes a resin sheet unwinding portion 211 and a resin sheet unwinding portion 212 as constituent elements, and a tape-shaped resin sheet 213 wound around the resin sheet unwinding portion 211 and a main crimping attachment 221 and a chip component. 4, the resin sheet take-up unit 212 takes up the sheet. In addition to the resin sheet unwinding unit 211 and the resin sheet winding unit 212, the resin sheet supply mechanism 210 may include a guide roll for stably transporting the resin sheet 213. Here, as the resin sheet 213, a material having flexibility, excellent heat resistance, and excellent adhesion to a semiconductor chip is preferable. Polytetrafluoroethylene (PTFE) is used as a material having this characteristic. ), A fluororesin such as tetrafluoroethylene / perfluoroalkyl vinyl ether copolymer (PFA) is preferred. Further, the thickness is preferably about 20 to 50 μm in consideration of thermal conductivity to the chip component 4 (for example, a semiconductor chip) while maintaining mechanical strength.

  The main heater 220 is for heating the chip component 4. The main pressure bonding heater 220 includes a cartridge heater 205 and is incorporated in the main pressure bonding head 207. In the present embodiment, the main heater 220 is composed of the cartridge heater 205, but is not limited to this, and can heat the chip component 4 to a predetermined temperature, such as a ceramic heater or a rubber heater. If it is.

  Further, depending on the characteristics of the adhesive resin 6, the heat curing rapidly proceeds to inhibit the fluidity of the adhesive resin 6, and the adhesive resin 6 bites between the bump and the electrode, thereby causing poor conduction. At the start of the main press bonding, it is necessary to press the fluid at a temperature at which the adhesive resin 6 improves and the curing does not proceed, and then raise the temperature to the curing temperature to perform the main press bonding. A cooling mechanism is built in to cool the heated heater to the starting temperature. The cooling means may be any means that removes heat, such as air, nitrogen, or water.

  The main bonding attachment 221 presses the chip component 4 through the resin sheet 213. The main crimping attachment 221 is configured to be heated by the main crimping heater 220. That is, the main crimping attachment 221 is configured to pressurize the chip component 4 and at the same time be heated by heat transfer from the main crimping heater 220. Unlike the temporary crimping attachment 126, the final crimping attachment 221 does not need to suck and hold the chip component 4, and therefore does not need a suction hole.

  The resin sheet 213 prevents the adhesive resin 6 from sticking to the main crimping attachment 221 even if the adhesive resin 6 protrudes from the chip component 4 during the main crimping. Can be bigger. Therefore, heat can be transmitted to the entire periphery of the chip component 4, the fillet shape of the adhesive resin 6 protruding from the outer periphery of the chip component 4 can be stabilized, and the bonding strength can be increased. Further, by making the outer peripheral size of the surface to which the chip component 4 is pressure-bonded smaller than the mounting pitch size, the main pressure bonding can be performed while suppressing interference between the adjacent chip components 4. In addition, it is preferable to use a material having a thermal conductivity of 50 W / mK or more for the main attachment 221 for efficiently transferring heat.

  The main attachment 221 is preferably inexpensive as long as it is separated from the main attachment heater 220 and can be attached and detached. However, the main attachment 221 is preferably compatible with a plurality of types by replacement, but may have an integrated structure.

  The control unit 150 communicates data with an input / output device such as a touch panel, appropriate hardware mainly including a memory chip and a microprocessor, a hard disk device incorporating a program for operating the hardware, and each component. It comprises a suitable interface circuit to perform, and performs overall control of the mounting apparatus 1.

  As shown in FIG. 2, the circuit board 2 is provided with a plurality of circuit patterns 7, and each circuit pattern 7 is filled with an adhesive resin 6 by an adhesive resin supply means (not shown). Instead of filling the adhesive resin 6, a sheet-like thermosetting sheet may be attached on the circuit board 2.

  Further, a sheet-like thermosetting sheet may be attached to the circuit surface of the chip component 4. By sticking a sheet-like thermosetting sheet on the circuit surface of the chip component 4 in advance, the adhesive resin supply means and the adhesive resin filling step are unnecessary, which is desirable.

  A mounting method for mounting the chip component 4 on the circuit board 2 using the mounting apparatus 1 having such a configuration will be described below with reference to an operation flowchart of FIG.

  First, the circuit board 2 is sucked and held on the board holding stage 102 (step ST01). At this time, the substrate holding stage 102 has moved to the temporary pressure bonding part 100. The camera for the circuit board 2 of the two-view camera 130 recognizes the posture correction mark of the circuit board 2 held on the board holding stage 102, and calculates the mounting point position. Next, the substrate holding stage 102 is moved to the position of the resin supply means (not shown) in order to supply the adhesive resin 6 to the calculated first mounting point.

  Next, the adhesive resin 6 is filled into the circuit pattern 7 on the circuit board 2 in one circuit pattern where the chip component 4 is mounted (step ST02). When the chip component 4 in which a sheet-like thermosetting sheet is bonded to the circuit surface of the chip component 4 in advance is used, this step is not necessary.

  Next, the chip slider 110 conveys the chip component 4 from the chip supply unit to the lower side of the temporary pressure bonding head 107 (step ST03).

  Next, the temporary press-bonding head 107 is lowered to receive the chip component 4 from the chip slider 110 (step ST04).

  Next, the chip slider 110 is retracted to the chip supply unit, and the two-field camera 130 is inserted between the chip component 4 and the circuit board 2. The two-field camera 130 recognizes an image of the alignment mark provided on the chip component 4 and the alignment mark provided on the predetermined circuit pattern 7. Based on the image-recognized data, the controller 150 aligns the substrate holding stage 102 in the XY direction and the temporary press-bonding head 107 in the θ direction (step ST05).

  Next, the two-field camera 130 moves to the retracted position, the temporary press-bonding head 107 is lowered to the circuit board 2 side, and the chip component 4 is temporarily pressed onto the predetermined circuit pattern 7 (step ST06). The temporary press-bonding head 107 moves up after pressing the chip component 4 against the circuit pattern 7 for a predetermined time. The chip component 4 is temporarily fixed to the circuit pattern 7 via the resin 6.

  Next, the substrate holding stage 102 is moved based on the mounting point information calculated by the temporary press-bonding section 100 so that the chip component 4 temporarily press-bonded comes below the main press-bonding head 207 of the main press-bonding section 200 (step). ST07). If the inclination of the circuit board 2 held on the substrate holding stage 102 is too large, it is desirable to rotate the pressure bonding head 207 according to the inclination of the circuit board 2.

  Next, the main pressure bonding head 207 descends to a position where the chip component 4 is temporarily pressure bonded, and press bonding with a predetermined pressure and heating at a predetermined temperature to perform main pressure bonding (step ST08). As shown in FIG. 3, the pressurization and heating start the predetermined pressurization when the main pressure bonding head 207 contacts the chip component 4, and heat the adhesive resin 6 after a predetermined time delay (t in FIG. 4). Heating to a curing temperature is performed. Thus, after the bumps 5 of the chip component 4 are pressed to the electrodes 3 provided on the circuit pattern 7 with a predetermined pressure, the adhesive resin 6 around the bumps 5 undergoes a curing reaction. Therefore, the bump 5 and the electrode 3 are bonded satisfactorily. Depending on the characteristics of the adhesive resin 6, if the heating is carried out in a state heated to the curing temperature of the adhesive resin 6, the curing reaction of the adhesive resin 6 is started before the bumps 5 are preliminarily pressurized. There is a problem that causes defects.

  While the main pressure bonding unit 200 is performing the main pressure bonding, in the temporary pressure bonding unit 100, the chip slider 110 transports the chip component 4 to be mounted next from the chip supply unit to the lower side of the temporary pressure bonding head 107, and the temporary pressure bonding is performed. The chip component 4 is delivered to the head 107 (step ST09).

  Next, the main pressure-bonding head 207 is raised, and the substrate holding stage 102 is moved from the main pressure-bonding part 200 to the temporary pressure-bonding part 100 (step ST10).

  Next, the circuit pattern 7 of the circuit board 2 is filled with the adhesive resin 6 in the circuit pattern 7 of the next mounting point. In the case of three-dimensional mounting using a through electrode, the adhesive resin 6 is filled into the surface to be joined on the upper surface side of the chip component mounted last time (step ST11).

  Next, a two-field camera 130 is inserted between the temporary press-bonding head 107 and the substrate holding stage 102, and the alignment mark provided on the circuit pattern 7 to be mounted next and the chip component sucked and held by the temporary press-bonding head 107 are used. Recognize image with alignment mark. Based on the image-recognized data, the controller 150 aligns the substrate holding stage 102 in the XY direction and the temporary press-bonding head 107 in the θ direction (step ST12).

  Next, the two-field camera 130 moves to the retracted position, the temporary press-bonding head 107 moves down to the circuit board 2 side, and the chip component 4 is temporarily pressed onto the predetermined circuit pattern 7 (step ST13). The temporary press-bonding head 107 moves up after pressing the chip component 4 against the circuit pattern 7 for a predetermined time. The chip component 4 is temporarily fixed to the circuit pattern 7 via the adhesive resin 6.

  While the temporary pressure bonding unit 100 is performing temporary pressure bonding, the main pressure bonding head 207 of the main pressure bonding part 200 is cooled (step ST14).

  Next, the operation after step ST07 is repeated, and when the chip component 4 is temporarily press-bonded and finally press-bonded to all the circuit patterns 7 of the circuit board 2, the circuit board 2 is discharged from the mounting apparatus 1 (step ST15).

  As described above, each time the temporary pressure bonding is performed, the substrate holding stage 102 is moved from the temporary pressure bonding portion 100 to the main pressure bonding portion 200 to perform the main pressure bonding, so that the adhesive resin 6 of each circuit pattern 7 is heated. Since the curing reaction is completed, the curing reaction due to heat conduction disappears even if the main circuit bonding is performed on the adjacent circuit pattern 7.

  Further, since the main crimping heater 220 of the main crimping section 200 is cooled during the temporary crimping and the chip component 4 of the temporary crimping section 100 is conveyed during the final crimping, the tact time is shortened and efficient production is achieved. It can be performed.

  Further, since the circuit board 2 once sucked and held on the substrate holding stage 102 is not removed until all the steps are completed, it is possible to prevent displacement of the chip component 4 due to replacement or the like accompanying the conveyance of the circuit board 2. Can do.

  Next, a second embodiment of the present invention will be described with reference to FIG. Note that members having the same functions as those in Embodiment 1 are described with the same reference numerals. In the mounting apparatus 500 shown in FIG. 5, the substrate holding stage 102 is fixed to the base 101 via the position adjusting means 106. A gate frame 300 is erected on the base 101. The gate frame 300 is provided with a slide rail 301 in which the pressurizing means 104 for temporary crimping moves horizontally and a slide rail 302 in which the pressurizing means 204 for main crimping moves horizontally. The substrate holding stage 102 is set as a work position, and the pressurizing means 104 and the pressurizing means 204 can move between the work position and the retracted position by a servo motor and a ball screw mechanism. The chip slider 110 that has transported the chip component 4 from the chip supply unit transfers the chip component 4 to the provisional pressure bonding head 107 at the retreat position of the pressurizing means 104. The two-field camera 130 is configured to be inserted on the substrate holding stage 102. Although not shown, the resin sheet supply mechanism 210 is configured to be inserted on the substrate holding stage 102.

  A mounting method for mounting the chip component 4 on the circuit board 2 using such a mounting apparatus 500 will be described below with reference to an operation flowchart of FIG.

  First, the circuit board 2 is sucked and held on the board holding stage 102 (step ST51).

  Next, the adhesive resin 6 is filled into the circuit pattern 7 at one place where the chip component 4 is mounted on the circuit pattern 7 of the circuit board 2 (step ST52). When the chip component 4 in which a sheet-like thermosetting sheet is bonded to the circuit surface of the chip component 4 in advance is used, this step is not necessary.

  Next, the chip slider 110 conveys the chip component 4 to the lower side of the temporary pressure bonding head 107 that has moved from the chip supply unit to the retracted position (step ST53).

  Next, the temporary press-bonding head 107 is lowered to receive the chip component 4 from the chip slider 110 (step ST54).

  Next, the temporary pressure bonding head 107 moves onto the substrate holding stage 102 (step ST55).

  Next, the two-field camera 130 is inserted between the chip component 4 and the circuit board 2. The two-field camera 130 recognizes an image of the alignment mark provided on the chip component 4 and the alignment mark provided on the predetermined circuit pattern 7. Based on the image-recognized data, the controller 150 aligns the substrate holding stage 102 in the XY direction and the temporary press-bonding head 107 in the θ direction (step ST56).

  Next, the two-field camera 130 moves to the retracted position, the temporary pressure-bonding head 107 is lowered to the circuit board 2 side, and the chip component 4 is temporarily pressure-bonded to the predetermined circuit pattern 7 (step ST57). The temporary press-bonding head 107 moves up after pressing the chip component 4 against the circuit pattern 7 for a predetermined time. The chip component 4 is temporarily fixed to the circuit pattern 7 via the adhesive resin 6.

  Next, the temporary pressure bonding head 107 moves to the retracted position, and the main pressure bonding head 207 for main pressure bonding moves onto the substrate holding stage 102 (step ST58).

  Next, the main pressure bonding head 207 descends to a position where the chip component 4 is temporarily pressure bonded, and press bonding with a predetermined pressure and heating at a predetermined temperature to perform main pressure bonding (step ST59). Pressurization and heating are performed with the profile shown in FIG.

  While the main pressure bonding head 207 is performing the main pressure bonding, the chip slider 110 conveys the chip component 4 to be mounted next from the chip supply unit to the lower side of the temporary pressure bonding head 107, and the temporary pressure bonding head 107 receives the chip component 4. Has been delivered (step ST60).

  Next, the main pressure-bonding head 207 moves up, and the main pressure-bonding head 207 moves from the substrate holding stage 102 to the retracted position (step ST61).

  Next, the temporary pressure bonding head 107 moves onto the substrate holding stage 102 while holding the chip component 4 (step ST62).

  Next, the adhesive resin 6 is filled in the circuit pattern 7 of the next mounting point of the circuit board 2. In the case of three-dimensional mounting using the through electrode, the adhesive resin 6 is filled into the surface to be joined on the upper surface side of the chip component mounted last time (step ST63).

  Next, the two-field camera 130 is inserted between the chip component 4 and the circuit board 2. The two-field camera 130 recognizes an image of the alignment mark provided on the chip component 4 and the alignment mark provided on the predetermined circuit pattern 7. Based on the image-recognized data, the controller 150 aligns the substrate holding stage 102 in the XY direction and the temporary press-bonding head 107 in the θ direction (step ST64).

  Next, the two-field camera 130 moves to the retracted position, the temporary press-bonding head 107 moves down to the circuit board 2 side, and the chip component 4 is temporarily pressed onto the predetermined circuit pattern 7 (step ST65). The temporary press-bonding head 107 moves up after pressing the chip component 4 against the circuit pattern 7 for a predetermined time. The chip component 4 is temporarily fixed to the circuit pattern 7 via the adhesive resin 6.

  While the temporary pressure bonding is being performed, the main pressure bonding head 207 is cooled (step ST66).

  Next, the operation after step ST58 is repeated, and when the chip component 4 is temporarily press-bonded and finally press-bonded to all the circuit patterns 7 of the circuit board 2, the circuit board 2 is discharged from the mounting apparatus 500 (step ST67).

  As described above, the temporary pressure bonding head 107 and the main pressure bonding head 207 are alternately moved on the substrate holding stage 102 to perform the temporary pressure bonding and the main pressure bonding. Therefore, the adhesive resin 6 of each circuit pattern 7 is cured by heating. Therefore, even if the main pressure bonding is performed on the adjacent circuit pattern 7, the curing reaction due to heat conduction is eliminated.

  Further, since the main crimping heater 220 of the main crimping section 200 is cooled during the temporary crimping and the chip component 4 of the temporary crimping section 100 is conveyed during the final crimping, the tact time is shortened and efficient production is achieved. It can be performed.

  Furthermore, in the case of three-dimensional mounting using a through electrode, the temporary press-bonding operation can be performed continuously, so that the main press-bonding time and the cooling time of the main press-heating heater 220 can be used without waste, so that efficient production can be performed. .

  Further, since the circuit board 2 once sucked and held on the substrate holding stage 102 is not removed until all the steps are completed, it is possible to prevent displacement of the chip component 4 due to replacement or the like accompanying the conveyance of the circuit board 2. Can do.

  Next, Embodiment 3 of the present invention will be described with reference to FIG. FIG. 7 shows the shape of the main pressure bonding head 207 of the mounting apparatus 1,500 of the first embodiment or the second embodiment. The main crimping head 207 has a large head width so that a plurality of chip components 4 can be finally crimped together. By using such a main pressure bonding head 207, after the temporary pressure bonding operation is performed on the plurality of chip components 4, the main pressure bonding can be performed, so that the production efficiency can be greatly improved.

  Further, compared to the case where the main pressure bonding heater 220 provided in the main pressure bonding head 207 is cooled for each chip component 4, the main pressure bonding heater 220 can be cooled once for each mounting of the plurality of chip components 4. Therefore, it can cool reliably.

  Further, if the pressing force of the main press-bonding head 207 is made variable according to the quantity of the plurality of chip parts 4, the circuit pattern 7 that has not been temporarily press-bonded due to the defect of the circuit pattern 7 becomes a press-bonding portion of the main press-bonding. Even if it is included, it is possible to apply appropriate pressure to the individual chip components 4. In addition, when the circuit board 2 has a circular shape such as a wafer, when the circuit patterns 7 on the outer peripheral portion are subjected to main pressure bonding, the pressing force can be varied according to the number of chip parts 4, so that a press failure is not caused. Do not generate.

Next, a fourth embodiment of the present invention will be described with reference to FIG. FIG. 8 is a diagram for explaining a case where a plurality of chip components 4 are stacked on the circuit board 2 by the substrate holding stage 102 of the mounting apparatus 1,500 according to the first or second embodiment. The chip components 4 are sequentially laminated in a pre-bonded state, and when the pre-bonding is completed up to a predetermined number of layers, the chip component 4 moves to the main bonding process and is pressurized and heated. Thus, after laminating | stacking in a temporary crimping | compression-bonding state, the effect similar to the effect of the said Embodiment 1 and Embodiment 2 is acquired by this crimping | bonding.

DESCRIPTION OF SYMBOLS 1 Mounting apparatus 2 Circuit board 3 Electrode 4 Chip component 5 Bump 6 Adhesive resin 7 Circuit pattern 100 Temporary crimping part 101 Base 102 Substrate holding stage 103 Support frame 104 Pressurizing means 105 Stage heater 106 Position adjusting means 107 Temporary crimping head 108 Lifting means 109 Rotating means 110 Chip slider 111 Slide rail 112 Chip transfer section 120 Slide rail 121 Linear guide 125 Temporary pressure bonding heater 126 Temporary pressure bonding attachment 130 Two-field camera 150 Control section 200 Main pressure bonding section 203 Support frame 204 Pressure means 205 Cartridge Heater 207 Main pressure bonding head 208 Lifting means 209 Rotating means 210 Resin sheet supply mechanism 211 Resin sheet unwinding section 212 Resin sheet winding section 213 Resin sheet 220 Main pressure The heater 221 present crimping attachment 300 Gate side frame 301 slide rail 302 slide rail 500 mounting device

Claims (6)

A mounting device for mounting a chip component on each circuit pattern of a circuit board on which a plurality of circuit patterns are formed via an adhesive resin,
A temporary crimping head for positioning the chip component and the circuit pattern provided on the circuit board and temporarily crimping the chip component to the circuit pattern;
A main pressure bonding head that heats and presses the temporarily pressure-bonded chip component to heat and cure the adhesive resin and finally press-bond the chip component to the circuit pattern;
A substrate holding stage having a function of holding a circuit board and having a built-in stage heater;
A mechanism for alternately moving between a temporary pressure-bonding portion provided with a temporary pressure-bonding head and a main pressure-bonding portion provided with a main pressure-bonding head in a state where the circuit board is held on the substrate holding stage;
A mounting apparatus including a control unit that temporarily press-bonds a chip component to a circuit pattern, and then moves the substrate holding stage from the lower side of the temporary press-bonding head to the lower side of the main press-bonding head to press-bond the chip component to the circuit pattern. A mounting device for mounting a chip component on each circuit pattern of a circuit board on which a plurality of circuit patterns are formed via an adhesive resin,
A temporary crimping head for positioning the chip component and the circuit pattern provided on the circuit board and temporarily crimping the chip component to the circuit pattern;
A main pressure bonding head that heats and presses the temporarily pressure-bonded chip component to heat and cure the adhesive resin and finally press-bond the chip component to the circuit pattern;
A substrate holding stage having a function of holding a circuit board and having a built-in stage heater;
A mechanism for alternately moving the temporary pressure bonding head and the main pressure bonding head onto the substrate holding stage;
A mounting apparatus provided with a control unit that moves a temporary pressure bonding head onto a substrate holding stage and performs temporary pressure bonding, and then moves the main pressure bonding head onto the substrate holding stage to perform final pressure bonding. In the invention of claim 1 or claim 2,
A mounting device equipped with a tool that heats and pressurizes a plurality of chip components at once by this crimping head. In the invention of claim 3,
A mounting apparatus having a function of varying the pressing force according to the quantity of a plurality of chip parts to be pressed by a control unit that controls the pressing force of the main pressure bonding head. A mounting method for mounting a chip component to each circuit pattern of a circuit board on which a plurality of circuit patterns are formed via an adhesive resin,
A step of aligning the chip component and the circuit pattern provided on the circuit board, and temporarily bonding the chip component to the circuit pattern using a temporary pressure bonding head;
Heating and pressurizing the temporarily crimped chip component to heat and cure the adhesive resin, and finally crimping the chip component to the circuit pattern using the main crimping head,
The process of holding the circuit board and moving the substrate holding stage with a built-in stage heater to the lower side of the temporary crimping head and temporarily crimping it, and the process of moving to the lower side of the final crimping head and final crimping And a step of taking out the circuit board after pre-crimping and main-crimping the chip parts on all circuit patterns on the circuit board. A mounting method for mounting a chip component to each circuit pattern of a circuit board on which a plurality of circuit patterns are formed via an adhesive resin,
A step of aligning the chip component and the circuit pattern provided on the circuit board, and temporarily bonding the chip component to the circuit pattern using a temporary pressure bonding head;
Heating and pressurizing the temporarily crimped chip component to heat and cure the adhesive resin, and finally crimping the chip component to the circuit pattern using the main crimping head,
The process of holding the circuit board and moving the temporary pressure-bonding head on the substrate holding stage with a built-in stage heater and temporarily bonding it and the process of moving the main pressure-bonding head and finally pressure-bonding are performed alternately. And a mounting method including a step of removing the circuit board after temporary and final pressure-bonding the chip parts to all circuit patterns of the circuit board.

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