JP6606966B2 - Light emitting device and manufacturing method thereof - Google Patents

Description

  The present invention relates to a light emitting device and a method for manufacturing the same.

  Light-emitting devices using light-emitting elements such as light-emitting diodes or laser diodes are used in many fields including general lighting such as indoor lighting, in-vehicle light sources, and backlights for liquid crystal displays. The performance required for these light-emitting devices is increasing day by day, and a further high-power light-emitting device is required.

  Examples of the substrate on which the light emitting element is placed include a ceramic substrate such as alumina and aluminum nitride having wiring, a resin package integrally formed with a lead frame, and the like. Further, a light emitting device is known in which a resin frame surrounding a light emitting element is formed on a resin package integrally formed with a lead frame (for example, Patent Document 1).

JP2013-206895A

  However, since the resin frame is formed on the substrate, the shape of the resin frame may be limited by the shape of the substrate. Accordingly, it is an object of the present invention to provide a light emitting device and a manufacturing method thereof in which the shape of the resin frame is suppressed from being limited by the shape of the substrate.

  A light emitting device according to an embodiment of the present invention is mounted on a base including a first lead and a second lead, and a first resin member that supports the first lead and the second lead, and the first lead. A light emitting element placed, a wire electrically connecting the light emitting element and the second lead, a second resin member surrounding the light emitting element and embedding at least a part of the wire, and the second And a sealing member that seals the light emitting element, and at least a part of the outer edge of the second resin member is located outside the outer edge of the base body in plan view.

  A method of manufacturing a light emitting device according to an embodiment of the present invention includes a lead frame including a first lead portion, a second lead portion, and a hanger portion, and the first lead portion, the second lead portion, and the hanger portion. A step of preparing a lead frame with a resin member having a first resin member covering a side surface; a step of placing a light emitting element on the first lead portion; and the light emitting element and the second lead portion. A step of electrically connecting; a step of forming a second resin member on the first lead portion, the second lead portion, and the hanger portion and surrounding the light emitting element; and removing the hanger portion And singulation.

  According to one embodiment of the present invention, it is possible to provide a light emitting device that suppresses the shape of the second resin member from being limited by the shape of the substrate, and a method for manufacturing the same.

FIG. 1 is a top view of the light-emitting device according to Embodiment 1 of the present invention. FIG. 2A is an end view taken along the line AA in FIG. FIG. 2B is an end view taken along the line BB in FIG. FIG. 2C is an end view taken along the line CC in FIG. FIG.2 (d) is an enlarged view of the dotted-line part of FIG.2 (c). FIG. 1 is a bottom view of the light-emitting device according to Embodiment 1 of the present invention. 4 (a) to 4 (c) are modifications of the light emitting device according to Embodiment 1 of the present invention. FIG. 5 is a top view of the light emitting device according to the embodiment of the invention. FIG. 6 is a top view in which the second resin member and the sealing member are omitted from the light emitting device according to the embodiment of the present invention. FIG. 7 is a top view illustrating the method for manufacturing the light emitting device according to the embodiment of the present invention. FIG. 8 is a top view illustrating the method for manufacturing the light emitting device according to the embodiment of the present invention. FIG. 9 is a top view showing the method for manufacturing the light emitting device according to the embodiment of the present invention. FIG. 10A is a top view illustrating the method for manufacturing the light emitting device according to the embodiment of the present invention. FIG.10 (b) is an enlarged view of the end surface along the DD line of the dotted line part of Fig.10 (a). FIG. 11 is a top view illustrating the method for manufacturing the light emitting device according to the embodiment of the present invention. FIG. 12 is a top view illustrating the method for manufacturing the light emitting device according to the embodiment of the present invention. FIG. 13A is a top view illustrating the method for manufacturing the light emitting device according to the embodiment of the present invention. FIG.13 (b) is an enlarged view of the end surface along the EE line of the dotted-line part of Fig.13 (a).

Hereinafter, embodiments for carrying out the present invention will be described in detail with reference to the drawings. However, the modes described below exemplify a light emitting device for embodying the technical idea of the present invention, and the present invention is not limited to the following embodiments. In addition, the dimensions, materials, shapes, relative arrangements, and the like of the component parts described in the embodiments are not intended to limit the scope of the present invention only to specific examples unless otherwise specified. Only. Note that the size, positional relationship, and the like of the members shown in each drawing may be exaggerated for clarity of explanation. In the following description, terms indicating a specific direction or position are used as necessary (for example, “up”, “down”, and other terms including these terms). The technical scope of the present invention is not limited by the meaning of these terms.
<Embodiment 1>

  1 to 3, the light emitting device 1000 according to the present embodiment includes a first lead 11 and a second lead 12, and a first resin member 13 that supports the first lead 11 and the second lead 12. 10, the light emitting element 20 placed on the first lead 11, the wire 30 that electrically connects the light emitting element 20 and the second lead 12, the second resin member 40 surrounding the light emitting element 20, A sealing member 50 for sealing the light emitting element 20.

Hereinafter, each component of the light-emitting device according to Embodiment 1 of the present invention will be described in detail.
(Substrate 10)

  The base 10 includes a first lead 11 and a second lead 12, and a first resin member 13 that supports the first lead 11 and the second lead 12. The light emitting element 20 is placed on the first lead 11.

  Although the shape of the 1st lead 11 and the 2nd lead 12 is not specifically limited, The plate shape which does not have the part bent in az direction is preferable. Since the first lead 11 and the second lead 12 are plate-shaped, the base 10 can be easily molded.

  As shown in FIGS. 2A to 2C, at least a part of the outer edges of the first lead 11 and / or the second lead 12 in contact with the first resin member 13 may be reduced in thickness in the z direction. preferable. By doing so, the contact area between the first lead 11 and / or the second lead 12 and the first resin member 13 can be increased. This makes it easier to support the first lead 11 and the second lead 12 with the first resin member 13.

  The sizes of the first lead 11 and the second lead 12 are not particularly limited, but the area of the first lead 11 is preferably larger than the area of the second lead 12 in plan view. Since the light emitting element 20 is placed on the first lead 11, the larger the area of the first lead 11, the easier it is to conduct the heat of the light emitting element 20 to the first lead 11. Thereby, since the temperature rise of the light emitting element 20 can be suppressed, the reliability of the light emitting device can be improved.

  As shown in FIG. 2A, the first lead 11 and / or the second lead 12 may be protruded from the side surface of the first resin member 13. The heat dissipation of the light emitting device can be improved by increasing the volume of the first lead 11 and / or the second lead 12. Moreover, it is preferable that the back surface of the first lead 11 directly under the light emitting element 20 is exposed from the first resin member 13. When the lower surface of the light emitting device is mounted on the mounting board, heat generated in the light emitting element 20 is easily conducted to the mounting board under the first lead 11 through the first lead 11 exposed from the first resin member 13. The heat dissipation of the light emitting device can be improved.

  The materials of the first lead 11 and the second lead 12 are not particularly limited, but are preferably formed of the same member. By doing in this way, shaping | molding of a base | substrate becomes easy. The first lead 11 and the second lead 12 are preferably formed of a material having a relatively large thermal conductivity. For example, by forming the first lead 11 and the second lead 12 with a material having a thermal conductivity of about 200 W / (m · K) or more, the heat generated in the light emitting element 20 is efficiently released. Can do. The first lead 11 and the second lead 12 are preferably formed of a material having high strength that can be easily punched or cut. For example, a single layer or laminated body such as copper, aluminum, gold, silver, tungsten, iron, nickel or the like or an alloy thereof, phosphor bronze, iron-containing copper, or the like can be used as a base material.

  The first lead 11 and the second lead 12 preferably contain silver from the viewpoint of light reflectivity. In particular, it is preferable that a reflective film containing silver is formed on a part or all of the portion of the first lead 11 on which the light emitting element 20 is placed. By doing in this way, the light from the light emitting element 20 becomes easy to be reflected, and the output of the light emitting device can be improved. Examples of the reflective film containing silver include a silver film, a film made of a silver alloy, and a film in which an additive is added to silver. Examples of the silver alloy include a silver-gold alloy. Additives added to silver include metals such as gold and copper, carbon sulfide compounds, selenium and the like. The reflective film containing silver is not limited to a single layer, and a reflective film containing silver may be laminated. Moreover, the structure which coat | covers the surface of a electrically-conductive member may be sufficient as the reflecting film containing silver.

  The method for forming the reflective film containing silver on the first lead 11 and / or the second lead 12 is not particularly limited, and various methods such as a plating method, a vapor deposition method, and a sputtering method can be used. The film thickness should just be the film thickness which can reflect the light from a light emitting element effectively, for example, is about 20 nm-10 micrometers, about 50 nm-5 micrometers are preferable, and about 100 nm-3 micrometers are more preferable. The thickness and shape of the first lead and the second lead are not particularly limited, and can be appropriately set within a range known in the art.

  The first lead 11 and the second lead 12 are supported by the first resin member 13. The first resin member 13 may embed and support a part of the first lead 11 and the second lead 12, or may be in contact with only the side surfaces of the first lead 11 and the second lead 12. The second lead 12 may be supported.

The first resin member 13 has electrical insulation. Examples of the material of the first resin member 13 include thermosetting resins such as epoxy resins, silicone resins, BT resins, polyimide resins and unsaturated polyester resins, thermoplastic resins such as polyphthalamide resins and nylon resins, and the like. Examples thereof include modified resins or hybrid resins containing one or more of these resins. Further, these base materials may contain colorants, fillers, reinforcing fibers and the like known in the art. In particular, the colorant is preferably a material with good reflectance, and white materials such as titanium oxide and zinc oxide are preferable. Examples of the filler include silica and alumina. Examples of the reinforcing fiber include glass, calcium silicate, potassium titanate and the like. Moreover, the 1st resin member 13 shaping | molding method is not specifically limited, You may use well-known methods, such as injection molding and compression molding.
(Light emitting element 20)

The light emitting element 20 is placed on the first lead 11. The light emitting element 20 is a semiconductor element that emits light by applying a voltage, and a known semiconductor element composed of a nitride semiconductor or the like can be applied. For example, a nitride semiconductor represented by the general formula In _X Al _Y Ga _1-XY N (0 ≦ X, 0 ≦ Y, X + Y ≦ 1), III-V group, II-VI group, etc. In the semiconductor, a stacked structure including an active layer is formed. The emission wavelength of the light emitting element 20 can be selected from the ultraviolet region to the infrared region including the visible region (380 to 780 nm). It is preferable that the substrate of the light-emitting element 20 has one or both of translucency and conductivity. As a substrate material of the light emitting element 20, sapphire, spinel, silicon, silicon carbide, gallium nitride, gallium phosphide, gallium arsenide, or the like can be used. The light emitting element 20 may have a substrate removed. Further, the light emitting element 20 may be placed on the first lead 11 via a submount.

  The shape of the light emitting element 20 is not particularly limited, and may be an arbitrary shape such as a polygon such as a triangle, a quadrangle, and a hexagon, or a shape similar to these in a top view. The light emitting element 20 may be a single-sided electrode in which an n electrode and a p electrode are formed on the same surface side, or two surfaces (for example, an upper surface and a lower surface) where the n electrode and the p electrode are opposite to each other. ) Of the double-sided electrodes formed respectively.

  When the light emitting element 20 is a single-sided electrode, it is mounted face up on the first lead 11. The face-up mounting is a form in which the surface opposite to the electrode forming surface of the light emitting element is mounted toward the base or the mounting substrate. As a joining member for the light emitting element and the first lead, an insulating joining member or a conductive joining member may be used, and a known joining member may be used. For example, the insulating bonding member includes an epoxy resin, a silicone resin, or a modified resin thereof, and the conductive bonding member includes a conductive paste such as silver, gold, palladium, or an Au—Sn eutectic. Examples thereof include solder and brazing materials such as low melting point metals.

In the case where the light emitting element is a double-sided electrode, a known joining member may be used as long as it is a conductive joining member as a joining member between the light emitting element and the first lead. For example, examples of the conductive bonding member include conductive pastes such as silver, gold, and palladium, solders such as Au—Sn eutectic, and brazing materials such as low melting point metals. In this case, the light emitting element and the first lead can be electrically connected by placing the light emitting element on the first lead.
(Wire 30)

  The light emitting element 20 and the second lead 12 are electrically connected via a wire 30. The wire 30 is made of a metal material having excellent conductivity, such as gold, aluminum, copper, silver, or the like. The method of wire bonding is not particularly limited, and a known method such as ball bonding or wedge bonding may be used.

When the light emitting element 20 is a single-sided electrode, electricity can be supplied to the light emitting element 20 using two wires as shown in FIGS. 1 and 2B. That is, the light emitting element 20 includes the first electrode 21 and the second electrode 22 on the upper surface, the first wire 31 that electrically connects the first electrode 21 and the second lead 12, and the second electrode 22 and the first lead. 11 and a second wire 32 that electrically connects the two. The wire 30 includes a first wire 31 and a second wire 32.
(Second resin member 40)

  The second resin member 40 is provided to surround the light emitting element 20 placed on the first lead 11. Since the second resin member 40 is provided so as to surround the light emitting element 20, it is easy to stop the uncured raw material to be the sealing member 50 in the second resin member 40. The second resin member 40 is formed by placing an uncured raw material that is a source of the second resin member 40 in a desired shape in a region where the second resin member 40 is to be formed, and curing the raw material. The second resin member 40 is formed away from the light emitting element 20 so that the light from the light emitting element 20 is not easily absorbed. In addition, an uncured raw material that becomes the sealing member 50 may be referred to as a sealing raw material, and an uncured raw material that is the source of the second resin member 40 may be referred to as a second resin raw material.

  As a material of the second resin member 40, an insulating material is preferably used so that the light emitting device does not short-circuit. Moreover, in order to ensure intensity | strength, a thermosetting resin, a thermoplastic resin, etc. can be used, for example. More specifically, a phenol resin, an epoxy resin, BT resin, PPA, a silicone resin, etc. are mentioned. In addition, a reflective member (for example, titanium oxide, aluminum oxide, zirconium oxide, magnesium oxide) that hardly absorbs light from the light emitting element 20 and has a large refractive index difference with respect to the base resin is used in the base resin. By dispersing this powder, light can be reflected efficiently. Particularly preferred is titanium oxide. When titanium oxide is contained in the second resin member 40, the light reflectance is increased, and the output of the light emitting device can be improved.

  In the embodiment of the present invention, as shown in FIGS. 1 and 3, at least a part of the outer edge of the second resin member 40 is located outside the outer edge of the base 10 in plan view. In other words, as shown in FIG. 2C and FIG. 2D, at least a part of the lower surface of the second resin member 40 is separated from the base body 10. By setting it as such a structure, it can suppress that the shape of the 2nd resin member 40 is restrict | limited by the shape of the base | substrate 10. FIG. That is, the inner edge and the outer edge of the second resin member in plan view can be made larger than when the second resin member 40 is formed only on the base 10. Thereby, for example, the distance between the second resin member 40 and the light emitting element 20 can be increased. Since the distance between the second resin member 40 and the light emitting element 20 is widened, the light from the light emitting element 20 is likely to be emitted from the light emitting device to the outside without being blocked by the second resin member 40. Thereby, the output of the light emitting device can be improved. Moreover, the freedom degree of design, such as a position which mounts a light emitting element, can be raised because the inner edge of the 2nd resin member becomes large. Note that “the second resin member is formed only on the base” means that all of the outer edges of the second resin member are located on the inner side or on the inner side of the base in a plan view.

  It is possible to position at least a part of the outer edge of the second resin member 40 outside the outer edge of the base 10 by adjusting the viscosity of the second resin material. For example, even when the second resin material is formed outside the outer edge of the base 10 by using the second resin material having a high viscosity, the second resin material can be prevented from dripping on the side surface of the base 10. . Thereby, the 2nd resin member 40 in which at least one part of an outer edge is located in the outer side of the outer edge of a base | substrate can be formed. The viscosity of the second resin material is not particularly limited, but is preferably 200 to 600 Pa · s. With such a value, even if the second resin raw material is formed outside the outer edge of the base body 10, the second resin raw material is hardly deformed.

  As shown in FIGS. 1 and 3, when the base 10 includes the first convex portion 14 and the second convex portion 15 extending from the side surface, the second resin located outside the outer edge of the base 10 in plan view. It is preferable that at least a part of the member 40 is located between the first convex portion 14 and the second convex portion 15. In addition, the 1st convex part 14 and the 2nd convex part 15 are extended | stretched from the same side surface of the base | substrate 10. As shown in FIG. By holding the second resin raw material with the first convex portion 14 and the second convex portion 15, it becomes easy to form the second resin member 40 on the outer side of the outer edge of the base 10.

  It is preferable that the base 10 includes the first convex portion 14 and the second convex portion 15 because the base 10 can be easily supported by the hanger portion described later. The hanger part is a part of the lead frame, and is located between the first convex part 14 and the second convex part 15 in plan view. You may form not only one 1st convex part 14 and 2nd convex part 15 but multiple, respectively. By doing in this way, the area enclosed by the 2nd resin member 40 can be expanded.

  Although the distance between the first convex portion 14 and the second convex portion 15 between which the second resin member 40 is located in plan view is not particularly limited, the base on which the first convex portion 14 and the second convex portion 15 are stretched. It is preferably 0.1 times or more and 0.9 times or less with respect to the length of 10 side surfaces. If it is smaller than 0.1 times, the area of the hanger part becomes small, so that it becomes difficult to support the substrate with the hanger part. Since the area of the hanger part larger than 0.9 times becomes large, it becomes difficult to miniaturize the light emitting device.

  The first convex portion 14 and the second convex portion 15 may be constituted by the first lead 11 or the second lead 12, but are preferably formed by the first resin member 13. Since the hanger part that supports the base 10 is a part of the lead frame, the first resin is a separate member from the hanger part rather than forming the first convex part 14 and the second convex part 15 with the same member as the hanger part. It is easier to support the base body 10 by forming the first convex portion 14 and the second convex portion 15 with members.

  Although the shape of the 1st convex part 14 and the 2nd convex part 15 is not specifically limited, as shown in FIG. 3, at least one part of the outer edge of the 1st convex part 14 and / or the 2nd convex part 15 is 2nd in planar view. It is preferable to be located outside the resin member 40. By doing in this way, it becomes easy to form the 2nd resin member 40 between the 1st convex part 14 and the 2nd convex part 15 in planar view.

  Further, the length by which the first convex portion 14 and the second convex portion 15 extend from the side surface of the base body 10 is not particularly limited, but is 0.1 to 1.1 times the width of the second resin member 40. preferable. When the length by which the first convex portion 14 and / or the second convex portion 15 extends is smaller than 0.1 times the width of the second resin member 40, the second resin material is the first convex portion in plan view. It becomes difficult to form between 14 and the 2nd convex part 15. FIG. Moreover, when the length which the 1st convex part 14 and / or the 2nd convex part 15 extend | stretch is larger than 1.1 time with respect to the width | variety of the 2nd resin member 40, it becomes difficult to reduce a light-emitting device. The width of the second resin member 40 is the shortest distance between the inner edge and the outer edge of the second resin member 40.

  The second resin member 40 is preferably embedded in at least a part of the wire 30. Thereby, it can suppress that the light from the light emitting element 20 is absorbed by the wire 30. FIG. Moreover, the light extraction efficiency of the light emitting device can be increased by forming the second resin member 40 with a member having a reflectance higher than that of the wire 30 with respect to the peak wavelength of the light emitting element 20.

  The length of the wire 30 embedded in the second resin member 40 is not particularly limited, but is preferably 0.05 to 0.5 times the entire length of the wire 30. When the length of the wire 30 embedded in the second resin member 40 is smaller than 0.05 times the total length of the wire 30, the light from the light emitting element 20 is easily absorbed by the wire 30. When the length of the wire 30 embedded in the second resin member 40 is larger than 0.5 times the total length of the wire 30, the distance between the light emitting element 20 and the second resin member 40 becomes short and the light emitting element 20 Is easily blocked by the second resin member 40.

  Furthermore, it is preferable that the connection portion between the wire 30 and the second lead 12 is embedded in the second resin member 40. The presence of the second resin member 40 suppresses sulfidation of the second lead 12 positioned around the connection portion, thereby suppressing wire breakage.

  When the light emitting element 20 is a single-sided electrode, the light emitting element 20 has two wires 30 including a first wire 31 and a second wire 32. In this case, it is preferable that both the connection portion between the first wire 31 and the second lead 12 and the connection portion between the second wire 32 and the first lead 11 are embedded by the second resin member 40. The disconnection of the second wire 32 can also be suppressed as compared with the case where only the connecting portion between the first wire 31 and the second lead 12 is embedded with the second resin member 40. The wire 30 may have a protective film for suppressing sulfidation and the like.

  The second resin member 40 may be formed only on the first lead 11, but is preferably formed across the first lead 11 and the second lead 12. By doing in this way, the area enclosed by the 2nd resin member 40 can be expanded. Thereby, since the distance of the 2nd resin member 40 and the light emitting element 20 can be expanded, it can suppress that the 2nd resin member 40 absorbs the light of the light emitting element 20. FIG. Moreover, it is preferable that at least a part of the second resin member 40 is formed on the first resin member 13. Since both the first resin member 13 and the second resin member 40 are made of a resin member, the second resin member 40 is more than the case where the second resin member 40 is formed on the first lead 11 and / or the second lead 12. It is possible to improve the adhesion by forming on the first resin member 13.

  In addition, the shape of the inner edge and the outer edge of the second resin member 40 is not particularly limited. You may make it a shape. In particular, as shown in FIG. 1, the shape of the inner edge and the outer edge of the second resin member 40 is preferably a shape in which square corners are chamfered. By chamfering the corners of the inner edge of the second resin member 40, the sealing material can easily reach the corners of the second resin member 40. Further, as shown in FIG. 3, at least a part of the chamfered portion of the outer edge of the second resin member 40 is preferably located outside the outer edge of the base 10. By doing in this way, the area enclosed by the 2nd resin member 40 can be enlarged. Further, the vicinity of the center of the second resin member 40 at the chamfered portion is preferably formed on the substrate 10. By doing in this way, it can suppress that the 2nd resin raw material located in the outer side of the outer edge of the base | substrate 10 deform | transforms. Moreover, the shape of the inner edge and the outer edge of the second resin member 40 is preferably substantially similar. By doing in this way, the inner edge of the 2nd resin member 40 can be enlarged.

  The second resin member 40 has a convex shape in which the cross section of the second resin member 40 has a rounded tip. The second resin member 40 whose inner and outer surfaces are curved can be formed by supplying the second resin raw material onto the substrate 10 and curing it with a distribution device such as a syringe.

  The thickness H of the second resin member 40 in the z direction is not particularly limited, but is preferably thicker than the light emitting element 20. Thereby, the sealing member 50 formed in the second resin member 40 can easily cover the upper surface of the light emitting element 20. The width W of the second resin member 40 is not particularly limited, but is preferably 0.2 times or more and 5 times or less the thickness H of the second resin member 40 in the z direction. If the width W of the second resin member 40 is thinner than 0.2 times the thickness H in the z direction, the strength of the second resin member 40 is lowered. If the width W of the second resin member 40 is greater than five times the thickness H in the z direction, the distance between the second resin member 40 and the light emitting element 20 is reduced, and part of the light from the light emitting element 20 is easily absorbed. Become. The width of the second resin member 40 is the shortest distance between the inner edge and the outer edge of the second resin member 40 as described above.

  Further, the length of the second resin member positioned outside the outer edge of the base body 10 in a cross-sectional view is not particularly limited, but is 0.05 of the length of the second resin member positioned inside the outer edge of the base body 10 in a cross-sectional view. It is preferably not less than twice and not more than 0.9 times. Here, the cross section is a plane along a direction substantially perpendicular to the outer edge of the substrate in plan view. When the length of the second resin member 40 located outside the outer edge of the base body 10 in cross-sectional view is smaller than 0.05 times the length of the second resin member located inside the outer edge of the base body 10, It is difficult to increase the inner and outer edges of the resin member 40. Further, when the length of the second resin member 40 located outside the outer edge of the base body 10 in cross-sectional view is greater than 0.9 times the length of the second resin member located inside the outer edge of the base body 10, It is difficult to form the second resin member located outside the outer edge of the base body in plan view.

  A plating layer may be applied to the surface of the second resin member 40. The said plating layer may be comprised from 1 or 2 or more metals, such as silver, aluminum, copper, and gold | metal | money. The plating layer is preferably made of silver, and all of the plating layer may be silver. Thereby, the light extraction efficiency can be increased.

  Further, as shown in FIG. 4A, the second resin member 40 may have a shape in which the second resin member 40 is connected to a substantially semicircle via a constricted portion in a cross-sectional view. . The second resin member 40 having such a cross-sectional shape is the same as the second resin member of the first stage after forming the second resin member of the first stage having a predetermined size on the base 10. By forming the second resin member of the second stage of the diameter on the second resin member of the first stage, it can be easily formed. By doing so, the thickness of the second resin member 40 can be easily increased.

In addition, when a base body having a recess surrounding the periphery of the light emitting element is formed by mold processing, the mold itself is modified in order to change the area, depth, etc. of the recess, and the recess The area, depth, etc. could not be changed. However, in this embodiment, since the periphery of the light emitting element 20 is surrounded by the second resin member 40, the shape, depth, etc. can be adjusted flexibly.
(Sealing member 50)

  The sealing member 50 is filled in a region surrounded by the second resin member 40 and seals the light emitting element 20. Thereby, the light emitting element 20 can be protected. In addition, when it has a protective film on the surface of the light emitting element 20, the sealing member 50 may seal the light emitting element 20 through a protective film. The shape of the sealing member 50 is not particularly limited, and as shown in FIG. 4B, even if the central portion is formed to be thicker than the outer peripheral portion, the sealing member 50 is shown in FIGS. Thus, it may be formed to have a substantially uniform thickness. In particular, the convex sealing member 50 having a thicker central portion than the outer peripheral portion can be easily formed by a dropping method. By making the central portion thicker than the outer peripheral portion, light from the light emitting element 20 is suppressed from being reflected at the interface between the sealing member 50 and air, so that the light extraction efficiency can be improved.

  The thickness of the sealing member 50 in the z direction is not particularly limited, and the sealing member 50 may be thicker or thinner than the second resin member 40 in the z direction. As shown in FIG. 4B, when the sealing member 50 is thicker than the second resin member 40, the light of the light emitting element 20 can be extracted from a part of the sealing member 50 that is not covered by the second resin member 40. Wide directional characteristics. In addition, when the sealing member 50 is thinner than the second resin member 40, it is difficult to extract light from the light emitting element 20 from the side surface of the sealing member 50, and thus the directivity can be narrowed.

  The material of the sealing member 50 is not particularly limited, and includes one or more of polycarbonate resin, epoxy resin, phenol resin, silicone resin, acrylic resin, polymethylpentene resin, polynorbornene resin, modified resins thereof, and these resins. A hybrid resin or the like can be used. In particular, the material of the sealing member 50 is preferably a dimethyl silicone resin or a phenyl silicone resin excellent in light resistance.

The refractive index of the sealing member 50 is not particularly limited, but a higher refractive index is preferable because a difference in refractive index from the light emitting element 20 is reduced. By increasing the refractive index of the sealing member 50, the refractive index difference between the light emitting element 20 and the sealing member is reduced, and the light extraction efficiency can be improved. Therefore, the refractive index of the sealing member is preferably 1.5 to 1.6. An example of the resin having a high refractive index is a phenyl silicone resin.
(Wavelength conversion member 51)

  Moreover, you may make the sealing member 50 contain the wavelength conversion member 51 as shown in FIG.4 (c). The wavelength conversion member 51 is a member that converts the light having the first peak wavelength emitted from the light emitting element 20 into the light having the second peak wavelength that is different from the first peak wavelength. By including the wavelength conversion member 51 in the sealing member 50, the mixed color light in which the light of the first peak wavelength emitted from the light emitting element 20 and the light of the second peak wavelength emitted from the wavelength conversion member 51 are mixed is output. be able to. For example, when a blue LED is used for the light emitting element 20 and a phosphor such as YAG is used for the wavelength conversion member 51, the blue light of the blue LED and yellow light emitted from the phosphor when excited by the blue light are mixed. Thus, a light emitting device that outputs the white light can be configured.

As the wavelength conversion member 51, a phosphor that can be excited by light from the light emitting element 20 is used. For example, phosphors that can be excited by blue light-emitting elements or ultraviolet light-emitting elements include yttrium-aluminum-garnet phosphors activated with cerium (Ce: YAG), and lutetium-aluminum-garnet phosphors activated with cerium. (Ce: LAG), nitrogen-containing calcium aluminosilicate phosphors activated with europium and / or chromium (CaO—Al ₂ O ₃ —SiO ₂ ), silicate phosphors activated with europium ((Sr, Ba) ₂ SiO ₄ ), β-sialon phosphors, CASN phosphors, SCASN phosphors and other nitride phosphors; KSF phosphors and other fluoride phosphors, sulfide phosphors and chloride phosphors Silicate phosphors, phosphate phosphors, quantum dot phosphors, and the like. In general formula KSF based phosphor can be represented by _{A2 [M 1-a Mn 4} + a F 6] ... (I). (In the formula, A represents at least one cation selected from the group consisting of K ⁺ , Li ⁺ , Na ⁺ , Rb ⁺ , Cs ⁺ and NH ⁴⁺ , and M represents a group 4 element and a group 14 element. Represents at least one element selected from the group consisting of group elements, and a satisfies 0.01 <a <0.20.) Also, A in the general formula (I) includes K ⁺ , and M is Si Fluoride-based phosphor containing By combining these phosphors with a blue light emitting element or an ultraviolet light emitting element, light emitting devices of various colors (for example, white light emitting devices) can be manufactured.

The wavelength conversion member 51 may be uniformly dispersed in the sealing member 50 or may be unevenly distributed in the sealing member 50. The wavelength conversion member 51 may be unevenly distributed in the vicinity of the light emitting element 20 from the upper surface of the sealing member 50. By doing in this way, even if it uses the wavelength conversion member 51 weak to a water | moisture content, since the sealing member 50 functions as a protective layer, degradation of the wavelength conversion member 51 can be suppressed. Examples of the wavelength converting substance that is weak against moisture include fluoride-based phosphors such as KSF-based phosphors, sulfide-based phosphors, chloride-based phosphors, silicate-based phosphors, and phosphate-based phosphors. .
(Light diffusion material 52)

  As shown in FIG. 4C, the sealing member 50 may contain a light diffusing material 52. The light diffusing material 52 reflects and / or refracts light from the light emitting element 20 due to a difference in refractive index with the sealing member 50 to diffuse. Thereby, luminance unevenness in the sealing member 50 can be suppressed. Moreover, when the wavelength conversion member 51 and the light diffusing material 52 are contained in the sealing member 50, color unevenness can be suppressed. The material of the light diffusing material 52 is not particularly limited, and a known member can be used. For example, as a material of the light diffusing material 52, silica, alumina, or the like can be given.

<Embodiment 2>
The light emitting device 2000 according to the present embodiment shown in FIG. 5 is different from the light emitting device 1000 according to the first embodiment in that there are a plurality of light emitting elements 20 and a protective element 60. . The other points are the same as in the first embodiment.

As shown in FIG. 5, not only one light emitting element 20 but also a plurality of light emitting elements 20 may be arranged. When there are a plurality of light emitting elements, the light emitting element 20 may be placed on the second lead 12. However, it is preferable that all of the plurality of light emitting elements 20 are placed on the first lead 11. By mounting a plurality of light emitting elements only on the first lead 11, the distance between the light emitting elements can be reduced, and the light emitting device can be downsized. Further, in the case of forming a wire that electrically connects one light emitting element and the other light emitting element, the distance between the light emitting elements can be reduced, so that wire breakage can be suppressed.
(Protective element 60)

  As shown in FIG. 6, in addition to the light emitting element 20, a protective element 60 may be placed. FIG. 6 is a diagram in which the second resin member 40 and the sealing member 50 are omitted for explanation. There may be one protective element 60, or two or more. The protective element 60 is not particularly limited, and may be any known element placed on the light emitting device. For example, when a voltage is applied to the light emitting element 20 in the reverse direction, a current flowing in the reverse direction is blocked, or when a forward voltage higher than the operating voltage of the light emitting element 20 is applied, an overcurrent is applied to the light emitting element. Examples thereof include a protection circuit and an electrostatic protection element that can prevent the flow. Specifically, a Zener diode can be used.

  The position where the protection element 60 is placed is not particularly limited, but it is preferable that the protection element 60 is placed so as to be partially or entirely embedded in the second resin member 40. Thereby, it can suppress that the light from a light emitting element absorbs with a protective element. Moreover, the light extraction efficiency of the light emitting device can be increased by forming the second resin member 40 with a member having a reflectance higher than that of the protective element 60 with respect to the peak wavelength of the light emitting element.

  The protective element 60 may be placed on either the first lead 11 or the second lead 12, but is preferably placed on the second lead 12. Since the light emitting element 20 is placed on the first lead 11, the distance between the light emitting element 20 and the protective element 60 can be easily increased by placing the protective element 60 on the second lead 12. Thereby, it can suppress that the protective element 60 absorbs the light from the light emitting element 20. FIG. Further, when the protection element 60 is embedded in the second resin member 40, the distance between the light emitting element 20 and the second resin member can be increased.

(Method for manufacturing light emitting device)
Next, a manufacturing method of the light emitting device according to the present embodiment will be described with reference to FIGS.

(I) Lead frame preparation step with resin member As shown in FIG. 7, a lead frame 19 including a first lead portion 16, a second lead portion 17, and a hanger portion 18, a first lead portion 16 and a second lead portion. A lead frame with a resin member having the lead portion 17 and the first resin member 13 covering the side surfaces of the hanger portion 18 is prepared. The first lead portion 16 is separated from the second lead portion 17 and the hanger portion 18 after cutting a lead frame 19 described later, and becomes the first lead 11 on which the above-described light emitting element is placed. The second lead portion 17 is separated from the first lead portion 16 and the hanger portion 18 after cutting a lead frame 19 to be described later, and becomes the second lead 12 electrically connected to the light emitting element by the wire described above. The hanger part 18 is a member that is separated from the first lead part 16 and the hanger part 18 after cutting the lead frame, which will be described later, and is located between the first convex part 14 and the second convex part 15 described above in plan view.

(II) Light-Emitting Element Placement Step As shown in FIG. 8, the light-emitting element 20 is placed on the first lead portion 16. There may be one light emitting element or two or more light emitting elements. When the light emitting element is mounted, a bonding member such as an epoxy resin, a silicone resin, or a silver paste is used. Further, the protection element 60 may be placed. When the protective element is placed, a known joining member such as a silver paste can be used.

(III) Wire Bonding Step As shown in FIG. 9, the light emitting element 20 and the second lead portion 17 are electrically connected by the wire 30. When there are two or more light emitting elements, one light emitting element and the other light emitting element may be electrically connected by a wire. Further, when the light emitting device has a protective element, the protective element and the first lead portion 16 or the second lead portion 17 are electrically connected by a wire.

(IV) Second Resin Member Forming Step As shown in FIGS. 10A and 10B, the first lead portion 16 and the second lead are used as the raw material of the second resin member 40 so as to surround the light emitting element 20. It supplies on the part 17 and the hanger part 18, and forms a frame. Thereafter, the raw material of the second resin member 40 is cured to form the second resin member 40. In addition, you may form in the position where at least one part of the 2nd resin member 40 does not overlap with the lead frame with a resin member in planar view. That is, at least a part of the lower surface of the raw material of the second resin member 40 may be separated from the lead frame with a resin member. This is possible by adjusting the viscosity of the raw material of the second resin member 40. Moreover, you may embed at least one part of the wire 30 at the time of formation of a 2nd resin member. By doing in this way, since the light of the light emitting element 20 absorbed by the wire 30 can be reduced, an output can be improved. When the light emitting device includes the protection element 60, the second resin member 40 may embed the protection element 60. By doing in this way, the light from the light emitting element absorbed by the protective element can be reduced and the output can be improved.

(V) Sealing member formation process As shown in FIG. 11, the sealing material which seals a light emitting element by filling the area | region enclosed by the 2nd resin member 40 with the raw material of the sealing member 50, and hardening this. A stop member 50 is formed. As described above, a wavelength conversion member or a light diffusing material may be included.

(VI) Lead frame cutting step The first lead portion 16 and the second lead portion 17 are cut by a dicer or the like along the cutting line X shown in FIG. Thereby, the 1st lead part 16, the 2nd lead part 17, and the hanger part 18 are isolate | separated. The first lead portion 16 becomes the first lead 11 which is a part of the base body 10. The second lead portion 17 becomes the second lead 12 that is a part of the base 10.

(VI) Separation process of light emitting device The hanger part 18 is removed and the light emitting device is separated. That is, the light emitting device shown in FIG. 13 can be manufactured by removing the hanger portion 18. The hanger part 18 is supported by suspending or pinching the side surface of the base body 10 and can be easily removed by pressing the hanger part 18 or the lower surface of the base body 10 with a pin or the like. The light emitting device may be separated by removing the hanger portion 18 simultaneously with the lead frame cutting step. Since the second resin member 40 is also formed on the hanger portion 18, at least a part of the outer edge of the second resin member 40 can be positioned outside the outer edge of the base 10 by removing the hanger portion 18.

  As mentioned above, although some embodiment which concerns on this invention was illustrated, this invention is not limited to embodiment mentioned above, It cannot be overemphasized that it can be made arbitrary, unless it deviates from the summary of this invention. .

1000, 2000 Light emitting device 10 Base body 11 First lead 12 Second lead 13 First resin member 14 First convex portion 15 Second convex portion 16 First lead portion 17 Second lead portion 18 Hanger portion 19 Lead frame 20 Light emitting element 21 First electrode 22 Second electrode 30 Wire 31 First wire 32 Second wire 40 Second resin member 50 Sealing member 60 Protection element

Claims (14)

A base comprising: a first lead and a second lead; and a first resin member that supports the first lead and the second lead;
A light emitting device mounted on the first lead;
A wire for electrically connecting the light emitting element and the second lead;
A second resin member that surrounds the periphery of the light emitting element and embeds at least a part of the wire;
A sealing member that is located in the second resin member and seals the light emitting element;
A light-emitting device in which at least a part of the outer edge of the second resin member is located outside the outer edge of the base body in plan view.   The base includes a first convex part and a second convex part extending from the same side surface, and in plan view, at least a part of the second resin member located outside the outer edge of the base is the first convex part. The light emitting device according to claim 1, wherein the light emitting device is located between the second convex portion.   The light emitting device according to claim 2, wherein a distance between the first convex portion and the second convex portion is 0.1 to 0.9 times the length of the side surface.   The light emitting device according to claim 2, wherein the first convex portion and the second convex portion are made of the first resin member.   The light emitting device according to any one of claims 1 to 4, wherein a back surface of the first lead immediately below the light emitting element is exposed from the first resin member.   The light emitting device according to claim 1, wherein a connection portion between the wire and the second lead is embedded in the second resin member.   The light emitting device according to any one of claims 1 to 6, wherein the sealing member contains a wavelength conversion member.   The light emitting device according to claim 1, wherein the second resin member is formed across the first lead and the second lead.   The light emitting device according to any one of claims 1 to 8, wherein the first lead and the second lead are plate-shaped. A lead frame comprising a first lead portion, a second lead portion, and a hanger portion;
A first resin member covering the side surfaces of the first lead part and the second lead part , the hanger part preparing a lead frame with a resin member that supports the outside of the first resin member ;
Placing a light emitting element on the first lead portion;
Electrically connecting the light emitting element and the second lead portion;
Forming a second resin member on the first lead portion, the second lead portion, and the hanger portion and surrounding the light emitting element;
Removing the hanger part into individual pieces;
A method for manufacturing a light-emitting device including:   The method for manufacturing a light-emitting device according to claim 10, further comprising a step of electrically connecting the light-emitting element and the second lead portion with a wire after the step of placing the light-emitting element.   The manufacturing method of the light-emitting device according to claim 10 or 11, further comprising a step of cutting the first lead portion and the second lead portion before the step of removing the hanger portion and dividing it into pieces.   The light emitting device according to any one of claims 10 to 12, further comprising a step of forming a sealing member that seals the light emitting element in the second resin member after the step of forming the second resin member. Manufacturing method.   The method for manufacturing a light-emitting device according to claim 11, wherein in the step of forming the second resin member, the second resin member embeds at least a part of the wire.

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