JP6623918B2 - Light emitting device inspection method - Google Patents

Description

  The present invention relates to a light emitting device inspection method.

  Light emitting devices having various structures are known as light emitting devices such as light emitting diodes (LEDs). For example, a structure is known in which a semiconductor light emitting element (hereinafter, also referred to as “light emitting element”) is mounted on a package such as a ceramic package or a molded resin package, and the light emitting element is further covered with a light-transmitting resin. .

  When conducting an inspection by energizing such a light emitting device, a probe is brought into contact with a terminal of the light emitting device and energized. At that time, the light emitting device is fixed so as not to move (for example, Patent Document 1).

JP-A-5-21544

  In recent years, light-emitting devices having various structures have been developed, and it may be difficult to perform inspection using the above-described inspection method.

The present disclosure includes the following configurations.
A step of preparing a light emitting device having a terminal portion on the lower surface, a pair of conductive portions including a light emitting device mounting portion provided on the upper surface and a contact portion provided at a different position from the light emitting device mounting portion; A step of preparing a measuring table having a supporting portion for supporting the light-emitting device and an adsorption hole for fixing the light-emitting device; and conducting the light-emitting device so that the conductive portion of the measuring table is in contact with the terminal portion of the light-emitting device. Mounting the light emitting device by vacuum suction using the suction holes provided on the upper surface of the measuring table without holding the upper surface of the light emitting device with a jig, and applying a probe to the contact portion. Contacting and energizing to cause the light emitting device to emit light.

  As described above, the characteristic inspection of the light emitting device can be easily performed.

FIGS. 1A to 1C are schematic diagrams illustrating a light emitting device used in a method for inspecting a light emitting device according to an embodiment. 2A and 2B are schematic diagrams illustrating a light emitting device inspection method according to the embodiment.

  An embodiment for carrying out the present invention will be described below with reference to the drawings. However, the embodiments described below exemplify a light emitting device inspection method for embodying the technical idea of the present invention, and the present invention does not limit the light emitting device inspection method to the following.

  In this specification, the members described in the claims are by no means specified as members of the embodiments. In particular, the dimensions, materials, shapes, relative arrangements, and the like of the components described in the embodiments are not intended to limit the scope of the present disclosure to only those components, unless otherwise specified. In addition, the size, positional relationship, and the like of the members shown in each drawing may be exaggerated for clarity of description. Further, in the following description, the same names and reference numerals denote the same or similar members, and a detailed description thereof will be omitted as appropriate.

<First embodiment>
The light emitting device inspection method according to the first embodiment includes the following steps.
1) Step of preparing a light emitting device 2) Step of preparing a measuring table 3) Step of fixing the light emitting device to the measuring table 4) Step of causing the light emitting device to emit light Hereinafter, each step will be described in detail.

1) Step of Preparing Light Emitting Device FIGS. 1A to 1C show an example of a light emitting device. (A) is a perspective view as viewed obliquely from above, (b) is a perspective view as viewed from obliquely below, and (c) is a cross-sectional view taken along line AA of (a). The light emitting device 1 includes a pair of terminal portions 11 on the lower surface 1a. The terminal portion 11 is a member that functions as a pair of electrodes of the light emitting device 1.

  The light emitting device 1 includes a light emitting element 12 and a resin member 13 that covers the light emitting element 12. The light emitting element 12 includes a laminated structure 12a including a semiconductor layer such as a light emitting layer, and a pair of positive and negative electrodes 12b. The electrode 12b is electrically connected to the terminal section 11. The resin member 13 includes a light-shielding resin member 13b that covers a side surface of the light emitting element 12, and a light transmitting resin member 13a that covers an upper surface of the light emitting element 12. Thus, the side surface 1c of the light emitting device 1 is mainly configured by the light-shielding resin member 13b, and the upper surface 1b of the light emitting device 1 is mainly configured by the translucent resin member 13a. The lower surface 1a of the light emitting device 1 includes a pair of terminal portions 11 and a light shielding resin member 13b. Note that the configuration of the light emitting device may include other members other than the above-described constituent members.

2) Step of Preparing Measuring Table The measuring table 20 is provided in an inspection device for energizing the light emitting device and measuring the light emission characteristics and the like. As shown in FIG. 2A, the measurement table 20 includes a pair of conductive portions 21 and an insulating support portion 22 that supports the conductive portions. The conductive portion 21 includes a light emitting device mounting portion 21a arranged on the upper surface 20a of the measuring table 20, and a contact portion 21c provided at a position different from the light emitting device mounting portion 21a. The contact portion 21c is a portion where the probe contacts. The contact portion 21c is provided on the lower surface of the measuring table 20 in FIG. However, the position is not limited to this position, and may be the top surface or side surface of the measurement table as long as it is a place where the probe can easily contact. The upper surface 20a of the measuring table 20 is provided with a suction hole 23 for sucking the light emitting device. The suction hole can be provided, for example, between the pair of conductive parts or outside the pair of conductive parts.

3) Step of Fixing Light Emitting Device to Measurement Table Next, the light emitting device 1 is mounted on the upper surface 20a of the measurement table 20 described above. At this time, the light emitting device 1 is mounted on the conductive portion 21 so that the light emitting device mounting portion 21a on the upper surface 20a of the measurement table 20 and the terminal portion 11 on the lower surface of the light emitting device 1 are in contact with each other.

  Next, the light emitting device 1 is fixed so as not to move on the upper surface 20a of the measuring table 20. In the fixing method, as shown in FIG. 2B, the measurement table 20 is fixed by vacuum suction using suction holes 23 provided between the conductive portions 21 on the upper surface 20 a of the measurement table 20. At this time, it is preferable to fix the upper surface of the light emitting device 1 without pressing it with a jig. Thereby, the light emitting device 1 can be fixed so that a load is not applied to the resin member constituting the side surface or the upper surface of the light emitting device 1.

4) Step of Making the Light Emitting Device Emit Next, the probe 24 is brought into contact with the contact part 21c of the measuring table 20 to energize it. Thereby, the light emitting device 1 can emit light. Since the probe 24 contacts not the light emitting device 1 but the contact portion 21c of the measuring table 20, the light emitting device 1 is not pressed from below.

  As described above, even when only the lower surface 1a side of the light emitting device 1 is fixed by vacuum suction, the probe is not directly brought into contact with the light emitting device. Is difficult to release.

<Embodiment 2>
In the second embodiment, the step of fixing the light emitting device is different from the first embodiment. That is, in the first embodiment, the light-emitting device is fixed by vacuum suction using the suction holes provided in the measurement table, whereas in the second embodiment, the magnet provided in the conductive portion and the electrode of the light-emitting device are fixed by magnetic force. The difference is that they are fixed.

  The inspection method according to the second embodiment can be applied to a light emitting device including a material that can be attracted to a magnet. For example, the present invention can be applied to a light-emitting device or the like using a metal material containing iron (Fe) as an electrode. Alternatively, as a member that does not function as an electrode, the present invention can be applied to, for example, a light-emitting device using a metal material containing iron as a heat dissipation member.

  As the magnet, an electromagnet is preferable. Further, vacuum suction and a magnet may be used in combination. Further, the conductive portion itself may be a magnet, or a magnet may be connected to the conductive portion and the conductive portion may be used as a pseudo magnet.

  The light-emitting device used in the method for inspecting a light-emitting device according to each of the above embodiments is effective in a case where the light-emitting device has a structure that is difficult to press on the top surface, side surface, and the like. For example, when the entire upper surface of the light emitting device is a translucent member as shown in FIG. 1, there is a possibility that the light emitting device may be stuck to the jig when pressing down from above using a jig during inspection. Therefore, the inspection can be easily performed by performing the inspection according to the method disclosed in the present disclosure.

  Further, in the light emitting device 1 shown in FIG. 1, a pair of terminal portions 11 on the lower surface 1a of the light emitting device are provided with a relatively large area. In the case of such a light emitting device, the resin member on the lower surface 1a of the light emitting device can be sucked by providing the suction hole between the pair of conductive portions on the upper surface of the measuring table. When the distance between the terminal portion and the side surface of the light emitting device is large on the lower surface of the light emitting device, the resin member outside the terminal portion may be a suction hole. In that case, a measuring table provided with suction holes outside the pair of conductive parts is used.

  In addition, if the light emitting device has a structure in which a convex lens portion is provided on a flat substrate, there is a possibility that the jig hits the convex lens portion and the like when the inspection device is pressed down from above using a jig. There is. Therefore, by inspecting with the method described in the present disclosure, the light emitting device can be easily inspected without being damaged.

  Also, when the light emitting device has a lower hardness or a higher tackiness in the resin member disposed on the side surface of the light emitting element than the translucent resin disposed on the upper surface of the light emitting element, There is a risk of being stuck or deformed. Therefore, by inspecting with the method described in the present disclosure, the light emitting device can be easily inspected without being damaged.

  The light emitting device inspection method according to the present disclosure can be applied as various light emitting device inspection methods.

DESCRIPTION OF SYMBOLS 1 ... Light emitting device 1a ... Lower surface of light emitting device 1b ... Upper surface of light emitting device 1c ... Side surface of light emitting device 11 ... Terminal part 12 ... Light emitting element 12a ... Laminated structure 12b ... Electrode 13 ... Resin member 13a ... Translucent resin member 13b ... Light-shielding resin member 20 ... Measurement table 20a ... Top surface of the measurement table 21 ... Conducting part 21a ... Light emitting device mounting part 21c ... Contact part 22 ... Support part 23 ... Suction hole 24 ... Probe

Claims (7)

A light-emitting element having an electrode on a lower surface, a light-shielding member covering the lower surface and side surfaces of the light-emitting element, a light-transmitting member covering the upper surface of the light-emitting element and the upper surface of the light-shielding member, and A terminal portion that is electrically connected to the electrode, and a step of preparing a light-emitting device having a lower surface at least including the light-shielding member and the terminal portion;
A pair of conductive portions provided with a light emission device mounting portion及beauty abutment, and a support portion for supporting the conductive part, and a suction hole for fixing the light emitting device, the light emitting device mounting the upper surface A step of preparing a measuring table provided with the mounting portion and the suction hole, and provided with the contact portion on the lower surface ,
The light-emitting device mounting portion , which is the conductive portion of the measurement table, and the light-emitting device is mounted on the upper surface of the measurement table so that the terminal portion of the light-emitting device is in contact with the light- emitting device mounting portion. and fixing the light emitting device by vacuum suction using the suction holes provided,
A step of contacting a probe to the contact portion that is the conductive portion of the measurement table to energize, and causing the light emitting device to emit light,
A light emitting device inspection method including: The light emitting device, the inspection method of the light emitting device according to claim 1, wherein the fixed without holding the top by a jig. The suction holes, the inspection method of the pair of light emitting device according to claim 1 or claim 2, wherein provided between the conductive portion. The suction holes, the inspection method of the pair of light emitting device according to claim 1 or claim 2, wherein provided on the outside of the conductive portion. The light emitting device, the inspection method of the preceding SL emitting device according to any one of claims 1 to 4, the entire upper surface of the light emitting device is made of the translucent member. The light emitting device, before KiToruhikari member inspection method of a light-emitting device according to any one of claims 1 to 5 comprises a convex lens portion. The inspection method for a light emitting device according to claim 1, wherein the light shielding member has a lower hardness than the light transmitting member.

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