JP6635840B2 - Stripping device, flat surface polishing device and stripping method - Google Patents

Description

  The present invention relates to a peeling device that peels off a work adhered to an upper surface plate when parallel plane processing is completed, a plane polishing device equipped with the peeling device, and a method of peeling a work adhered to the upper surface plate.

  In a planar polishing apparatus, a thin plate-like work such as a wafer is often adhered to an upper surface plate after polishing is completed. When such a phenomenon occurs, the process of automatically loading and collecting the work is stopped and productivity is deteriorated.At the same time, if the work quality is forcibly peeled off, a large load acts on the end of the work and the work may be damaged. Various problems arise, such as the possibility of breakage. Therefore, it is necessary to peel off this work without difficulty.

  2. Description of the Related Art A conventional technique of an apparatus for peeling a workpiece is disclosed in, for example, Japanese Patent Application Laid-Open No. 55-037141. The polishing apparatus described in Patent Literature 1 employs a member overhanging method, in which push rods are arranged in a plurality of through holes provided in an upper surface plate. A weight member is provided on the upper part of the push rod. After processing, the upper platen is raised while the push bar is operated to avoid sticking of the work, and even when the work is stuck, the work sticking to the upper platen is operated by operating the push bar. This is effective when the sticking force is small with a small number of small parts.

  Another conventional technique for peeling off a workpiece is disclosed in, for example, Japanese Patent Application Laid-Open No. 61-203269. The device for preventing adhesion of products described in Patent Document 2 is a fluid discharge system, in which a fluid discharge port is provided over the entire area of the upper platen processing surface, and a work is performed while discharging the fluid when the upper platen rises after processing. The work adhered to the upper surface plate is separated by discharging the fluid even when adhered. In this fluid discharge method, damage to the work can be suppressed because the work is not in contact with the work.

  Further, another conventional technique of an apparatus for peeling off a work is disclosed in, for example, Patent Document 3 (Japanese Patent Laid-Open No. 62-099072). The processing method described in Patent Literature 3 is a method in which the upper and lower contact areas are changed, and an upper surface plate having a processing surface having a smaller area than the lower surface plate is used. The work is attached to the lower platen side, which contacts with a larger force in the area, to prevent the work from adhering to the upper platen.

Japanese Utility Model Publication No. 55-037141 JP-A-61-203269 JP-A-62-099072

  It has been found that there is a problem in the conventional technique for preventing peeling when a workpiece having a small contact area with the surface plate is used and the number of processings per operation is large.

  For example, in the prior art shown in Patent Document 1, at least as many through holes and push rods as the number of target workpieces are necessary, and when the number of workpieces is large and the shape is small, the number of through holes and push rods is inversely proportional to the increase in the number of through holes. The processing area is reduced, which is not practically feasible. Further, as the number of through holes and push rods of the upper stool increases, the processing cost of the upper stool increases.

  Also, when a workpiece with a large contact area and a large sticking force to the upper surface plate is targeted, and the workpiece is forcibly peeled off with a point-like or linear member, the push rod acts especially near the center of the sticking part. Then, there is a concern that a large load is applied to the work, which causes damage and quality deterioration. It has been found that there is a problem in a method and an apparatus in which a work is simply pressed by a rod-shaped member to peel off the work.

  The conventional technique disclosed in Patent Document 2 is a method in which the upper platen is evenly and slightly elevated to discharge the fluid simultaneously from the discharge holes. Therefore, if the number of workpieces is relatively small and the contact area with the surface plate is secured to some extent, it is possible to set the number of discharge holes small, but the application conditions are limited. Further, since the through holes are provided in the entire area of the upper surface plate, the configuration is very complicated, and the processing cost of the upper surface plate is large.

  Further, the blowing pattern depends on the size of the gap between the lower surface of the upper platen and the surface of the work surface, the amount of the gap between the lower surface of the upper platen and the carrier surface, or the amount of the clearance between the lower surface of the upper platen and the lower surface of the platen. (Flow rate, discharge pressure, etc.) fluctuates, so setting conditions (equalizing the gap amount, increasing discharge flow rate, etc.) is complicated, and equipment (fluid supply circuit, etc.) for applying the pressure fluid uniformly from the entire board surface ) Is very expensive and complicated, and if this assumption changes, peeling leakage may occur. In addition, when the flow rate is large, there is a high possibility that the work may jump out or vibrate and be damaged. The problem of wanting to peel off with a simple method was found.

  Further, in the conventional technique disclosed in Patent Document 3, although there is room for relatively freely selecting groove specifications on a surface plate or the like for performing lapping processing, generally, the processing specifications on the upper and lower surfaces are changed, so other processing is performed. It is difficult to realize with a device. Also, as described in Table 3 of Patent Document 3 which shows the adhesion rate of the wafer to the upper surface plate, even if the contact area is changed on the upper and lower surfaces, the wafer still adheres to the upper surface plate, and the effect is reliable. However, it can be difficult to apply to an automated device. The problem of wanting to peel off with a simple method was found.

  In view of the above, the present invention has been made in view of the above-described problem, and its purpose is to reliably and safely peel off not only a normal work but also a work that is a small number of parts in addition to a normal work. It is an object of the present invention to provide a peeling device, a planar polishing device, and a peeling method.

The invention according to claim 1 of the present invention is:
An apparatus is provided on the upper surface plate of a flat polishing apparatus that rotates the carrier holding the work, and the upper and lower surface plates perform plane processing on both surfaces of the work,
An elevating cylinder arranged on the upper surface side of the upper stool,
A peeling unit having a peeling member disposed on a lower surface side of the upper platen and disposed in a housing groove extending substantially in the radial direction of the upper platen, wherein the peeling member is moved up and down by the elevating cylinder,
When peeling the work adhered to the lower surface of the upper platen, after raising the upper platen by a small amount, the lifting cylinder lowers the peeling unit from the lower surface of the upper platen. The peeling device is characterized in that a part of the peeling member is projected, and the upper platen and the carrier holding the work are relatively slid.

The invention according to claim 2 of the present invention
2. The peeling device according to claim 1, wherein the tip of the peeling member has an arc shape, and the material is made of a resin that is more flexible than the work.

In addition, the invention according to claim 3 of the present invention provides:
The peeling device,
Means for determining the amount by which the peeling unit is lowered to project the peeling member from the lower surface of the upper surface plate,
After projecting the peeling member from the lower surface of the upper surface plate, the upwardly-moving cushion mechanism that acts when the peeling member slides relative to the carrier or the work is provided.
The peeling device according to claim 1 or 2, wherein the peeling member does not interfere with the carrier or the work when sliding.

The invention according to claim 4 of the present invention is
With the front and back surfaces of the work inserted into the work holding hole of the carrier sandwiched between the lower surface plate and the upper surface plate, the carrier rotates and revolves, and the upper surface plate and the lower surface plate move relative to the carrier. It is a plane polishing apparatus for lapping or polishing a workpiece by rotating the workpiece, comprising the peeling apparatus according to any one of claims 1 to 3,
When peeling the work adhered to the lower surface of the upper platen, first, the upper platen is raised by an amount smaller than the thickness of the carrier, and then the peeling member is brought into contact with an end of the work. The upper platen or the carrier is rotated while the upper platen is projected from the lower surface of the upper platen, and is moved in the circumferential direction by the work holding hole while being stuck to the lower surface of the upper platen. A planar polishing apparatus, wherein the peeling member relatively moving in the circumferential direction applies a downward force to the constrained work, and peels the entire work from the lower surface of the upper platen. And

Further, the invention according to claim 5 of the present invention,
When the work adhered to the lower surface of the upper stool is peeled off, the upper stool is first raised by an amount smaller than the thickness of the carrier, and then a peeling member of the upper stool is brought into contact with the end of the work. Project from the bottom,
By rotating the upper stool or the carrier, the work held in the state of being stuck to the lower surface of the upper stool and being restrained from moving in the circumferential direction by the work holding hole, relatively in the circumferential direction. The peeling method is characterized in that the moving peeling member applies a downward force, and the workpiece is peeled from the lower surface of the upper stool by bringing the peeling member into contact with the entire work.

  According to the present invention, there is provided a peeling device, a plane polishing device, and a peeling method for reliably and safely peeling a workpiece that is a small or large number of parts in addition to a normal workpiece despite its simple structure. can do.

FIG. 1 is a configuration diagram of a planar polishing apparatus according to an embodiment for carrying out the present invention. It is an AA arrow view explaining a career and a work on a lower platen of a plane polishing machine of an embodiment for carrying out the present invention. FIG. 4 is a view taken along the line BB for explaining a peeling device on an upper surface plate of the planar polishing device according to the embodiment of the present invention. It is an internal structure figure of the exfoliation device of the form for carrying out the present invention. FIGS. 5A and 5B are explanatory views of the operation of a peeling device according to an embodiment of the present invention, in which FIG. 5A is a diagram illustrating a housed state during polishing, and FIG. FIGS. 6A and 6B are explanatory views of a peeling method according to an embodiment of the present invention, in which FIG. 6A shows a state where the peeling member is housed, FIG. () Is a diagram showing a contact state of the peeling member. FIGS. 7A and 7B are explanatory views of a peeling method according to an embodiment of the present invention, in which FIG. 7A shows a peeling initial state, FIG. 7B shows a peeling halfway state, and FIG. It is a figure showing an end state. FIG. 8A is a partial configuration diagram of a planar polishing apparatus according to another embodiment for carrying out the present invention, and FIG. 8A is a view taken along a line BB of a planar polishing apparatus having one peeling device. (b) is a BB view of the planar polishing apparatus having five peeling apparatuses.

  A planar polishing apparatus 10 according to an embodiment of the present invention will be described with reference to the drawings. As shown in FIG. 1 and FIG. 2, the planar polishing apparatus 10 includes a lower housing 11, an upper housing 12, an upper platen driving device 13, a servo cylinder 14, an elevating shaft 15, an upper platen fixing plate 16, A surface plate 17, a lower surface plate 18, a cover 19, and a peeling device 20 are provided.

  FIG. 1 shows a state in which the upper stool 17 is in the raised position, and a rectangular portion on the upper stool fixing plate 16 indicates the peeling device 20. FIG. 2 is a view showing an example of the arrangement of the carrier 30 and the work 40, wherein a plurality of (five in FIG. 1) carriers 30 hold a small-diameter (empty) small / many-parts work 40. Is shown. Since the surface area of the workpiece 40 is small and the number of workpieces is large, it can be assumed that it is difficult to apply the conventional method when peeling. FIG. 2 is a view taken along the line AA of FIG.

  Next, details of the planar polishing apparatus 10 will be described with reference to FIGS. As shown in FIG. 1, the planar polishing apparatus 10 has an upper housing 12 integrally fixed to a lower housing 11 which is a robust mechanical structure. An upper surface plate driving device 13 is attached to the upper housing 12, and a servo cylinder 14 is supported at a tip of the upper surface plate driving device 13.

  The servo cylinder 14 raises and lowers the upper surface plate fixing plate 16 and the upper surface plate 17 attached to the tip of the elevating shaft 15. The carrier 30 and the work 40 can be carried in and out when the upper platen 17 is raised. The upper stool 17 and the lower stool 18 are annular disks having the same inner and outer diameters. The surface polishing apparatus is of a 4-way type, and the upper platen 17 is driven to rotate by an upper platen driving device 13, and the lower platen 18 is driven to rotate by a driving unit (not shown) inside the lower housing 11. .

  In the plane polishing apparatus 10, a carrier 30 for holding a work 40 in a work holding hole 31 as shown in FIG. The work 40 is processed in a state of being closely sandwiched between the lower stool 18 and the upper stool 17. The carrier 30 is engaged with an internal gear and a sun gear (not shown) so as to perform planetary motion by rotation and revolution. As shown in FIG. 1, a cover 19 is provided on the side of the lower platen 18 so as to prevent the slurry and the like supplied at the time of polishing from scattering to the outside.

  On the upper surface side of the upper platen fixing plate 16, a peeling device 20 is disposed. As will be described later, the peeling device 20 peels the work 40 attached to the lower surface of the upper surface plate 17 after processing. In the present embodiment, as shown by the arrow BB in FIG. 3, an example in which two peeling devices 20 are provided on the upper surface plate fixing plate 16 on the circumference when the number of carriers 30 is five is shown. Show.

  During planar processing of the work 40, the upper and lower surfaces of the work 40 are polished while the work 40 is in contact with the lower surface plate 18 and the upper surface plate 17 with an optimum processing load. At the time of this polishing, for example, the rotation of the upper surface plate 17 and the lower surface plate 18, the sun gear and the internal gear (not shown) is controlled, and the carrier 30 performs a planetary motion of revolving while rotating. The upper stool 17, the lower stool 18 and the carrier 30 rotate at optimum speeds. During this processing, a rinse or slurry is supplied from a supply hole (not shown) provided in the upper stool 17. Thus, the upper and lower surfaces of the work 40 are polished. Then, after the processing is completed, the work 40 is carried out, and the processing is completed.

  Subsequently, details of the peeling device 20 will be described with reference to FIG. As shown in FIG. 4, the peeling device 20 includes an elevating cylinder 21, a rod holding device 22, a support 23, a cushion mechanism 24, and a peeling unit 25.

  The lifting cylinder 21 includes a cylinder body 211 and a cylinder rod 212. The cylinder main body 211 of the elevating cylinder 21 is fixed to the lower rod holding device 22, and the cylinder rod 212 is fixed to the lower support 23 via the rod holding device 22. The cylinder body 211 of the elevating cylinder 21 at the top of the apparatus moves the cylinder rod 212 in and out and moves up and down. The distal end of the cylinder rod 212 is connected to a cylinder connecting plate 243 of the cushion mechanism 24.

  The rod gripping device 22 mechanically grips the cylinder rod 212 inserted therein and fixes the current positions of the lower cushion mechanism 24 and the peeling unit 25. As will be described later, it is fixed in one of the housed state during polishing shown in FIG. 5A and the projected state during peeling shown in FIG. 5B.

  As shown in FIG. 4, the cushion mechanism 24 includes a peeling unit stopper 241, a peeling unit guide member 242, a cylinder connecting plate 243, and an elastic body 244. The peeling unit guide member 242 inserted into the hole of the cylinder connecting plate 243 is fixed to the peeling member support plate 251 of the peeling unit 25. The peeling unit stopper 241 is provided above the peeling unit guide member 242 to prevent the peeling unit guide member 242 from coming off the cylinder connecting plate 243 downward. Then, the elastic body 244 is inserted into the peeling unit guide member 242, and urges the peeling member support plate 251 of the peeling unit 25 downward with respect to the cylinder connecting plate 243.

  The peeling unit 25 further includes a peeling member support plate 251, a peeling member support bar 252, and a peeling member 253. The peeling member support plate 251 is connected to the peeling member 253 via a plurality of (three in this embodiment) peeling member support bars 252.

  The peeling member 253 is a long rod-like member that is housed in a long housing groove 171 that extends in the radial direction from the inner peripheral side to the outer peripheral side in the upper stool 17. Since the peeling member support bar 252 moves up and down using the holes formed in the upper surface plate fixing plate 16 and the upper surface plate 17 as a guide, the peeling member support plate 251 and the peeling member 253 also move up and down. As shown in FIG. 6A, the peeling member 253 is formed so that at least the lower end of the member that comes into contact with the workpiece 40 includes an arc shape when viewed from the side, and is made of a flexible material such as resin. Accordingly, when the peeling member 253 relatively slides, it is possible to prevent damage to the contacting work 40 and to reduce frictional resistance at the time of sliding. It is possible to operate smoothly without interference when the vehicle gets over 40.

  In the connection structure of the entire peeling device 20, when a load acts on the lower side of the peeling member 253, the peeling member support plate 251 is lifted upward while receiving a reaction force from the elastic body 244. However, it moves only in the vertical direction due to the movement constraint of the peeling member support rod 252.

  Here, the protrusion amount of the peeling member 253 will be described. The upper platen 17, which is a lap platen or a grindstone platen, wears itself. The amount of wear generally ranges from several mm to several tens mm. Even in a structure with an abrasive cloth, it is necessary to consider the wear of the abrasive cloth. Therefore, it is necessary to make the protrusion amount of the bar-shaped peeling member 253 variable. However, it is cumbersome to sequentially set the protrusion amount manually, and the structure is complicated and expensive.

  Therefore, in the present embodiment, after the upper platen 17 is slightly elevated, the peeling member 253 is stopped down on the surface of the carrier 30 or the surface of the work 40 with a slight load by the cushion mechanism 24 so that the protrusion amount is increased each time. In this state, the rod holding device 22 locks and fixes the cylinder rod 212. For this reason, it is not necessary to adjust the operation stroke of the cylinder rod 212 so that the protrusion amount becomes an appropriate amount in advance. Therefore, the peeling device 20 can automatically adjust the protrusion amount that needs to be changed due to wear or the like.

  In addition, the cushion mechanism 24 has an allowance for expansion and contraction corresponding to the thickness of the work 30. Therefore, the vertical movement of the peeling member 253 can be absorbed even at the step when moving from the carrier 30 to the work 40 or at the step when moving from the work 40 to the carrier 30.

  Here, the elastic member 244 is a compression rubber or a compression spring. By appropriately setting the elastic coefficient of the elastic member 244, the peeling member 253 causes a step due to the carrier 30, the work 40, or the like to exert a large load on the work 40. Without giving, you can get over it smoothly.

  In the present invention, by automatically adjusting the amount of protrusion, even if the upper platen 17 is rotated in a state where the peeling member 253 is projected, the peeling member 253 can smoothly move between the adjacent carriers 30. Further, in the present invention, the peeling device 20 can be constituted by a small-scale mechanism. In addition, since the workpiece is mechanically peeled as compared with the above-described prior art (method of changing the contact area ratio or method of discharging a fluid), the effect is the most certain and is suitable for realizing automation.

Next, the operation of the peeling device 20 will be described.
When the peeling device 20 is not used (including at the time of polishing), the elevating cylinder 21 raises the cylinder rod 212, and as shown in FIG. 4 and FIG. The peeling member 253 is stored and retracted in the groove 171. The peeling member 253 is housed in the upper stool 17 (inside the polished surface).

  When the peeling device 20 is used, as shown in FIG. 5 (b), the lifting cylinder 21 lowers the cylinder rod 212 with a slight pressure to cause the peeling member 253 to protrude, and the peeling member 253 is moved to the carrier 30 on the lower platen 18. Alternatively, it is brought into contact with the upper surface of the work 40. The rod gripping device 22 is operated to fix the cylinder rod 212, and the position of the peeling member 253 is fixed. The peeling member 253 rotates together with the upper surface plate 17 in this state, and peels off the work 40 adhered to the processing surface of the upper surface plate 17.

  Subsequently, a description will be given of a peeling method using the planar polishing apparatus 10 equipped with the peeling apparatus 20 which is a feature of the present invention, together with an operation of each component. As shown in FIG. 2 and FIG. 3, as a prerequisite, a description will be given assuming that five carriers 30 are provided and the peeling devices 20 are arranged at two substantially diagonal positions.

  Initially, as shown in the state diagram before peeling in FIGS. 6A and 5A, the peeling member 253 is retracted upward and is housed in the housing groove 171. In this state, normal double-side polishing is performed, and when the work thickness reaches a predetermined set range, the rotation of the upper stool 17, the lower stool 18 and the carrier 30 is stopped. As shown by the arrow BB in FIG. 3, the phases of the upper platen 17 and the carrier 30 are operated so that the peeling member 253 is positioned on the upper surface side of the carrier 30 on the lower platen 18 to stop each of them. .

  After the stop, the servo cylinder 14 raises the upper platen 17 by a small amount. Then, as shown in FIG. 6B, the workpiece 40 stuck to the upper stool 17 rises together as indicated by an arrow b. It should be noted that the small amount of rise is a guide smaller than the thickness of the carrier 30 (specifically, about half the thickness of the work). It is sufficient that the work 40 adhered to the upper platen 17 moves in the horizontal direction so that the work 40 does not come off the work holding hole 31 of the carrier 30, and is appropriately set in consideration of the operation error of the servo cylinder 14. do it. Further, the thickness may be appropriately set in consideration of the balance between the thickness of the work 40 and the thickness of the carrier 30, and a gap is not formed more than necessary.

  Although the servo cylinder 14 is configured to raise and position the upper surface plate 17, a fine lifting mechanism (not shown) such as an operation mechanism using a servomotor is further provided. It is also possible to raise and position a small amount at the same time as moving up and down.

  Subsequently, in the peeling device 20, a minute pressure is supplied to the elevating cylinder 21 to lower the peeling member 253 as shown by an arrow c. In some cases, it may be lowered by its own weight of the member system such as the peeling member 253. Then, as shown in FIG. 6C, the peeling member 253 is lowered to the surface of the carrier 30, and the extension operation of the cylinder rod 212 is stopped. As shown in the BB view of FIG. 3, when the peeling members 253 of the two peeling devices 20 descend, the two places come into contact with each other on the carrier 30.

  In any case, the carrier 30 is lowered to a position where it makes slight contact at the contact portion on the surface. At this time, since the cushion mechanism 24 of the peeling device 20 needs to maintain flexibility, the peeling member 253 may be brought into contact with a weak force.

  When the peeling member 253 is lowered, any position on the surface of the carrier 30 may be used, or a position where the work 40 is stuck may be used. In this case, the work 40 is peeled down from the upper surface plate 17 and falls. Then, the peeling member 253 comes into contact with the surface of the work 40. Therefore, in this case, the position may be fixed and slid. Since the cushion mechanism 24 applies a downward force, when the upper platen 17 rotates, the peeling member 253 contacts both the surface of the work 40 and the surface of the carrier 30.

  However, forcibly separating the work 40 by applying a force from the upper surface to the lower surface is not preferable depending on the shape of the work. Not so good. Therefore, preferably, the phases of the upper stool 17 and the carrier 30 are operated so as to be stopped so that they first descend on and come into contact with the surface of the carrier 30 as described above. After the position of the peeling member 253 is determined in this way, the rod gripping device 22 clamps the cylinder rod 212 to lock the current position.

  Subsequently, the upper platen 17 is rotated together with the peeling device 20 in the direction of the arrow a in the figure from the stopped state of the lower platen 18 shown by the arrow BB in FIG. Slide on the surface of. FIG. 7A shows an initial state of the workpiece peeling. When the peeling member 253 that moves in the direction of the arrow d acts on the right end of the work 40, the work 40 slightly moves to the left, and the left end of the work 40 hits the side surface of the work holding hole 31 of the carrier 30. Progresses. The peeling member 253 rises in the direction of arrow e when riding on the workpiece 40.

  At the time of this peeling, it is preferable to perform the peeling operation while dropping a liquid such as a rinse from the processing surface of the upper surface plate 17, since the sliding of the peeling member 253 becomes smoother. When the peeling member 253 first contacts the right end of the work 40, the whole work 40 may be peeled off.

  Now, as shown in FIG. 7B, the peeling member 253 slides on the surface of the work 40, and peels the work 40 from the upper surface plate 17. Since the work 40 is thicker than the carrier 30, the peeling member 253 rides on the work 40. However, since the elastic body 244 of the cushion mechanism 24 has a degree of freedom to avoid interference, the peeling member 253 is retracted upward. Continue peeling with.

  As shown in FIG. 7C, the peeling member 253 passes on the surface of the work 40. After that, it moves onto the surface of the carrier 30 again and moves to the next work 40. Then, while keeping the height of the peeling member 253 as it is, it moves on the surface of the next carrier 30 and continues the peeling operation. Thereafter, the upper platen 17 is rotated so that the peeling member 253 passes through the workpieces 40 in all the carriers 30. By the above operation, all the workpieces 40 adhered to the upper stool 17 are peeled and lowered onto the lower stool 18.

  Then, after the peeling member 253 is raised and housed in the housing groove portion 171 as shown in FIG. 6A, the upper platen 17 is raised to a predetermined position to take out the work 40 and load another work. Do. The above is the peeling operation using the peeling device 20.

  In the peeling operation of the planar polishing apparatus 10 equipped with such a peeling device 20, the work 40 stuck to the upper platen 17 can be very slowly peeled from the end, so that the load acting on the work 40 is minimized. Can be suppressed. In addition, since it is a method of mechanical peeling, a more reliable peeling effect can be expected as compared with a fluid discharge method, a method of changing the contact area, or the like.

Next, another embodiment of the planar polishing apparatus of the present invention will be described.
The embodiment described above is an embodiment in which two peeling devices 20 are provided as shown in FIG. However, a configuration in which one peeling device 20 is provided as shown in FIG. 8A, or a configuration in which five peeling devices 20 are provided as shown in FIG. 8B may be employed. The peeling device 20 can be provided from a minimum of one to a maximum of five. In the apparatus shown in FIG. 8B, since one peeling member 253 is peeled off particularly for one carrier, the peeling operation can be sped up. The determination of the number of the peeling devices 20 is determined by assuming the peeling operation time.

  Next, another embodiment of the planar polishing apparatus of the present invention will be described. This embodiment is a modification of the planar polishing apparatus described above with reference to FIGS. In the above-described embodiment, the peeling member 253 is described as a single long member. However, in the case of a plane polishing apparatus having a large diameter of the upper and lower platens, the peeling member 253 has a radius within one accommodation groove. It may be divided in a plurality of directions and arranged so that the function of the cushion mechanism 24 can be easily exhibited.

  Further, the carrier 30 may be rotated relative to the upper surface plate 17 (self-revolution) instead of rotating the upper surface plate 17 at the time of peeling. For example, in a 4-way flat polishing machine in which the upper platen 17 rotates, the upper platen 17 is rotated and peeled off as described above. However, in a 3-way flat polishing device in which the upper platen does not rotate, sun gear and By rotating the internal gear together or rotating the sun gear with the internal gear fixed, the carrier revolves around itself and peels off. Further, as a combined operation of the upper stool and the carrier, the peeling step may be completed early.

  The peeling operation of rotating the carrier by itself will be described. After the processing is completed, the peeling member 253 is lowered onto the surface of the carrier 30 or the work 40 to make a contact state, and the rod gripping device 22 fixes the position of the cylinder rod 212. The carrier 30 is rotated / revolved while supplying a fluid such as a rinse from the upper stool, so that all the workpieces 40 are operated so as to pass through the peeling member 253. Thus, the peeling operation is performed as shown in FIGS. 7A to 7C. Thereafter, the rotation / revolution operation of the carrier 30 is stopped, and the upper stool 17 is raised. At this time, the peeling member 253 is housed in the upper surface plate 17. The peeling may be performed in this manner.

  Further, the peeling device may have a structure without a cushion mechanism. In the embodiment for carrying out the present invention described above, the "peeling operation" is realized, and it is only necessary that the cushioning mechanism does not hinder the transfer of the peeling member to the next carrier or the step of the work. is there. From the above, the structure of the peeling device can be realized by another means as described below.

  For example, the amount of wear of the upper surface plate is detected, and the amount of protrusion of the peeling member is set in advance by an elevating cylinder while considering the minute amount of rise of the upper surface plate, so that the cylinder rod protrudes with this amount of protrusion. Is also good. Even with a peeling device without a cushion mechanism, interference with a work or the like on the lower surface plate can be avoided, and the structure of the peeling device can be simplified.

  Further, a means for adjusting the amount of extension of the peeling member 253 may be employed. As a method of detecting a state in which the peeling member 253 is in contact with the surface of the carrier 30, for example, a means for arranging a contact sensor at the end of the peeling member 253 to detect contact with the carrier surface and stop the device can be employed. is there. As another method, the extension stroke of the cylinder rod 212 shown in FIG. 4 may be detected, or it may be detected whether the head of the peeling unit stopper 241 separates from the cylinder connecting plate 243 and rises. Further, even if the amount of wear on the upper and lower stools is small, or when abrasion occurs, the amount of abrasion can be separately measured to adjust the amount of protrusion of the member. After the position of the peeling member 253 is determined, the rod holding device 22 clamps the cylinder rod 212 to lock the current position.

  As described above, the extension amount of the peeling member 253 may be appropriately controlled so that the moving of the peeling member 253 between carriers or over the work may be prevented from being caught or a large load that hinders the movement. A more appropriate means or configuration may be appropriately selected in consideration of the thickness and the material of the constituent members.

According to the apparatus and method of the present invention described above, there are the following advantages.
(1) The peeling member 253 in contact with the work 40 has an arc shape when viewed from the side. Even when sliding on the surface of the work 40, only a slight load acts on the work 40. Further, since the work 40 is separated from the end, the load acting on the work 40 can be reduced. Therefore, the work 40 can be peeled off reliably and easily without applying a load to the work 40.

(2) Since the cushion mechanism 24 has a degree of freedom to retreat upward, the load acting on the work 40 when sliding on the surface of the work 40 can be further reduced.

(3) Only an appropriate number of small-scale peeling devices 20 are arranged on the upper surface plate 17, and the entire workpiece 40 is peeled by utilizing the surface rotating function or the carrier rotating function of the planar polishing device 10 itself. Therefore, the cost for the equipment can be significantly reduced as compared with the conventional method.

  ADVANTAGE OF THE INVENTION According to this invention as mentioned above, a peeling device which can be peeled reliably and safely with a simple structure, and is especially suitable for a work having a small contact area with a surface plate and a large number of processings per one time. , A planar polishing apparatus and a peeling method.

10: Planar polishing device 11: Lower housing 12: Upper housing 13: Upper surface plate driving device 14: Servo cylinder 16: Upper surface plate fixed plate 17: Upper surface plate 18: Lower surface plate 19: Cover 20: Peeling device 21: Lifting cylinder 211: Cylinder main body 212: Cylinder rod 22: Rod holding device 23: Support body 24: Cushion mechanism 241: Peeling unit stopper 242: Peeling unit guide member 243: Cylinder connecting plate 244: Elastic body 25: Peeling unit 251 : Peeling member support plate 252: peeling member support bar 253: peeling member 30: carrier 31: work holding hole 40: work

Claims (5)

An apparatus is provided on the upper surface plate of a flat polishing apparatus that rotates the carrier holding the work, and the upper and lower surface plates perform plane processing on both surfaces of the work,
An elevating cylinder arranged on the upper surface side of the upper stool,
A peeling unit having a peeling member disposed on a lower surface side of the upper platen and disposed in a housing groove extending substantially in the radial direction of the upper platen, wherein the peeling member is moved up and down by the elevating cylinder,
When peeling the work adhered to the lower surface of the upper platen, after raising the upper platen by a small amount, the lifting cylinder lowers the peeling unit from the lower surface of the upper platen. A peeling device, wherein a part of the peeling member is projected, and the upper surface plate and the carrier holding the work are relatively slid.   2. The peeling device according to claim 1, wherein the peeling member has a circular arc shape at a tip end, and is made of a resin that is more flexible than the workpiece. 3. The peeling device,
Means for determining the amount by which the peeling unit is lowered to project the peeling member from the lower surface of the upper surface plate,
After projecting the peeling member from the lower surface of the upper surface plate, the upwardly-moving cushion mechanism that acts when the peeling member slides relative to the carrier or the work is provided.
The peeling device according to claim 1, wherein the peeling member does not interfere with the carrier or the work when sliding. With the front and back surfaces of the work inserted into the work holding hole of the carrier sandwiched between the lower surface plate and the upper surface plate, the carrier rotates and revolves, and the upper surface plate and the lower surface plate move relative to the carrier. It is a plane polishing apparatus for lapping or polishing a workpiece by rotating the workpiece, comprising the peeling apparatus according to any one of claims 1 to 3,
When peeling the work adhered to the lower surface of the upper platen, first, the upper platen is raised by an amount smaller than the thickness of the carrier, and then the peeling member is brought into contact with an end of the work. The upper platen or the carrier is rotated while the upper platen is projected from the lower surface of the upper platen, and is moved in the circumferential direction by the work holding hole while being stuck to the lower surface of the upper platen. A planar polishing apparatus, wherein the peeling member relatively moving in the circumferential direction applies a downward force to the constrained work, and peels the entire work from the lower surface of the upper platen. . When the work adhered to the lower surface of the upper stool is peeled off, the upper stool is first raised by an amount smaller than the thickness of the carrier, and then a peeling member of the upper stool is brought into contact with the end of the work. Project from the bottom,
By rotating the upper stool or the carrier, the work held in the state of being stuck to the lower surface of the upper stool and being restrained from moving in the circumferential direction by the work holding hole, relatively in the circumferential direction. A peeling method, wherein the moving peeling member applies a downward force, and the peeling member is brought into contact with the entire work to peel the work from the lower surface of the upper surface plate.

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