JP6640764B2 - Transfer arm, substrate transfer device and substrate processing device - Google Patents

Description

  The present disclosure relates to a transfer arm, a substrate transfer device, and a substrate processing device.

  In a processing apparatus for a semiconductor wafer (hereinafter, a semiconductor wafer is referred to as a wafer), as shown in Patent Document 1, each wafer is placed between a cassette on which a large number of wafers are mounted and a supporting member of the wafer mounted on the processing apparatus. A transfer device provided with a transfer arm for transferring a sheet is used, and ceramic having high heat resistance is used as the transfer arm.

JP 2011-211063 A

  In such a transfer device, it is required to move the transfer arm at high speed in order to increase transfer efficiency. The movement of the transfer arm is programmed so as not to contact the cassette or the like. However, a large force may be applied to the transfer arm by contact with another member due to malfunction or contact with a cassette or the like while moving at high speed. In such a case, the force is concentrated on a portion where the transfer arm is fixed to the transfer device, and the transfer arm made of ceramic may be damaged. For this reason, there has been a problem in the transfer arm of the related art that it is difficult to break even if a force is concentrated on a portion fixed to the transfer device.

  The present disclosure has been devised in view of the above problems, and has as its object to provide a transfer arm that is not easily damaged, a substrate transfer device including the transfer arm, and a substrate processing apparatus including the substrate transfer device. Is what you do.

A transfer arm according to the present disclosure is a transfer arm having a plate-shaped main body made of ceramics and connected to a substrate transfer device, wherein the main body has a first surface facing a conveyed object and a first surface opposite to the first surface. And a second surface located thereon. The main body has a connecting portion, a mounting portion corresponding to a portion facing the article, and an intermediate portion connected to each of the connecting portion and the mounting portion and located between the connecting portion and the mounting portion. . Then, a metal plate is provided at a position extending from the connecting portion to the intermediate portion on at least one of the first surface and the second surface. In addition, a support member for supporting the conveyed object is provided on the first surface of the mounting portion, wherein the metal plate is formed of the supporting member of the mounting portion following the intermediate portion from the connecting portion. It is position to close.

  A substrate transfer device according to the present disclosure includes the above-described transfer arm. Further, a substrate processing apparatus according to the present disclosure includes the above-described substrate transfer device.

  The transfer arm according to the present disclosure is less likely to be damaged even when force is concentrated on a portion fixed to the transfer device.

  The substrate transfer device and the substrate processing apparatus according to the present disclosure can be used for a long period of time because the transfer arm is not easily damaged.

(A) is a plan view of a first surface of the transfer arm, (b) is a plan view of a second surface of the transfer arm, and (c) is an example of the transfer arm of the present disclosure. It is sectional drawing in the AA 'line, and (d) is sectional drawing in the BB' line in (c). (A) is a plan view of a first surface of the transfer arm, (b) is a plan view of a second surface of the transfer arm, and (c) is (a) illustrating another example of the transfer arm of the present disclosure. FIG. 7 is a sectional view taken along line CC ′ in FIG. (A) is a plan view of a first surface of the transfer arm, and (b) is a cross-sectional view taken along line D-D 'in (a), illustrating another example of the transfer arm of the present disclosure. (A) is a plan view of a first surface of the transfer arm, (b) is a plan view of a second surface of the transfer arm, and (c) is (a) illustrating another example of the transfer arm of the present disclosure. () Is a sectional view taken along line EE ′. 1 is a top view illustrating an example of a substrate processing apparatus according to the present disclosure. (A) is a plan view of a molded body that becomes a support member, and (b) and (c) are plan views of a molded body that becomes a part of a main body. FIG. 7A is a cross-sectional view illustrating a state of lamination of the respective molded bodies illustrated in FIG. 6, FIG. 7B is a cross-sectional view illustrating a laminated body after lamination, and FIG. It is sectional drawing of the transfer arm provided with a metal plate.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. However, in all the drawings of the present specification, the same parts are denoted by the same reference numerals and the description thereof will be appropriately omitted unless confusion occurs.

  As shown in FIG. 1, the transfer arm 31 of the present embodiment has a plate-shaped main body 3 having a first surface 1 and a second surface 2 located on a surface opposite to the first surface 1. The main body 3 is made of ceramics. The main body 3 includes a connecting portion 7 connected to the substrate transfer device, a mounting portion 13 located at the second end 9 of the main body and facing a portion to be transferred 11, and a connecting portion 7 and a mounting portion 13. It has an intermediate portion 15 that is connected to each other and is located between the connecting portion 7 and the placing portion 13.

  In other words, when the end closer to the substrate transfer device to be connected is the first end 5 and the end farther away is the second end 9, the connecting portion 7 is located on the first end 5 side. The mounting portion 13 is located on the second end portion 9 side. Note that the first surface 1 is also a surface facing the conveyed object 11, and thus can be referred to as a mounting surface. The connecting portion 7 is a portion that overlaps with the object to be connected of the substrate transfer device. In FIG. 1A, a line is drawn in the overlapping portion to indicate a boundary between the connecting portion 7 and the intermediate portion 15. I have. 2 (a), 3 (a) and 4 (a) also show the boundary between the connecting portion 7 and the intermediate portion 15.

  The transfer arm 31 of the present embodiment includes the metal plate 29 at a position extending from the connecting portion 7 to the intermediate portion 15 on at least one of the first surface 1 and the second surface 2. FIG. 1 shows an example in which a metal plate 29 is provided on the second surface 2. The metal plate 29 may be joined to the main body 3 using an epoxy-based adhesive, or may be gripped by the board transfer device, similarly to the connecting portion 7 of the main body 3.

  By satisfying such a configuration, the transfer arm 31 of the present embodiment is brittle even if a large force is applied to the main body 3 and stress concentrates on the boundary between the connecting portion 7 and the intermediate portion 15 of the main body 3. The main body 3 made of easily breakable ceramics is not easily broken due to the presence of the metal plate 29 that does not break brittlely. The width of the metal plate 29 (the length of the portion orthogonal to the longitudinal direction of the main body 3) existing at a position extending from the connecting portion 7 to the intermediate portion 15 is determined when the width of the connecting portion 7 and the width of the intermediate portion 15 are the same. The ratio of the width of the metal plate 29 to the width of the connecting portion 7 and the intermediate portion 15 is preferably 0.8 or more.

  As shown in FIG. 2, when the metal plate 29 is located from the connecting portion 7 to the mounting portion 13 following the intermediate portion 15, not only the boundary between the connecting portion 7 of the main body 3 and the intermediate portion 15, but also Also, even at the boundary between the intermediate portion 15 and the mounting portion 13, it is hard to be damaged.

  As shown in FIG. 3, a support member 19 for supporting the transported object 11 is provided on the first surface 1 of the mounting portion 13, and the metal plate 29 is supported by the mounting portion 13 following the intermediate portion 15. It may be located near the member 19. With such a configuration, the transfer arm 31 is hardly damaged even from the intermediate portion 15 to the mounting portion 13. Note that the metal plate 29 may be in contact with the support member 19, but if a gap of about 1 to 2 mm is provided between the support member 19 and the metal plate 29, the transfer arm 31 can be easily manufactured. In FIG. 3, a gap between the support member 19 and the metal plate 29 is omitted.

  Further, as shown in FIG. 4, metal plates 29 may be joined to both surfaces of the main body 3. With such a configuration, breakage becomes difficult regardless of the direction in which the stress is applied. In the example of FIG. 4, the external shape and thickness of the metal plate 29 joined to the first surface 1 and the external shape and thickness of the metal plate 29 joined to the second surface 3 are the same, but they are different. You may.

  Further, in a portion corresponding to a boundary between the connecting portion 7 and the intermediate portion 15, the thickness of the main body 3 may be set to 1.0 mm or more and 5.0 mm or less, and the thickness of the metal plate 29 may be set to 50 μm or more and 0.5 mm or less. In addition, the thickness of the metal plate 29 when the metal plate 29 is joined to both surfaces of the main body 3 means the thickness of each metal plate 29.

  When such a relationship is satisfied, the thickness of the metal plate 29 is reduced with respect to the body 3 because the thickness of the metal plate 29 is small with respect to the main body 3 while the reinforcing effect of the metal plate 29 is maintained. In addition, the mass of the transfer arm 31 can be reduced. It is possible to provide the transfer arm 31 that is hardly damaged while having a small increase in mass.

  Further, as shown in FIG. 4, a concave portion 33 may be provided in a portion except for a boundary between the connecting portion 7 and the intermediate portion 13. With such a configuration, the mass of the metal plate 29 in a portion where stress is unlikely to concentrate can be reduced by the amount of the concave portion 33, and the mass of the transfer arm 31 can be suppressed. The recess 33 may be a through-hole penetrating the metal plate 29.

  The largest surface 29a of the exposed surfaces of the metal plate 29 may be a mirror surface. Note that the largest means that the area is the largest. With such a configuration, it is difficult for the metal to fall off from the largest surface 29a among the exposed surfaces, and the amount of contaminants adhered to the surface is reduced. The possibility that the substance becomes suspended particles and contaminates the internal space is reduced.

  The mirror surface refers to a surface having an arithmetic average roughness Ra of 0.4 μm or less. The arithmetic average roughness Ra may be measured in accordance with JIS B 0601: 2013 (ISO 4287-1997). When measuring using a stylus type surface roughness meter, a measuring length is 5 mm, a cutoff value is 0.8 mm, a stylus having a stylus tip radius of 2 μm is applied, and a scanning speed of the stylus is applied. May be set to 0.5 mm / sec. The average value of the five points obtained by this measurement is defined as arithmetic average roughness Ra.

The surface of the metal plate 29 not facing the main body 3 is covered with a polyimide resin, a polytetrafluoroethylene resin, a poly (chlorotrifluoroethylene) resin, a polyvinylidene fluoride resin, or a polybenzimidazole resin (not shown). It may be. Here, the surface not facing the main body 3 is at least one of the surface 29a shown in FIGS. 1 to 4 and a side surface connected to each of the surface facing the main body 3 and the surface not facing the main body 3. That aspect. With such a configuration, even if the transfer arm 31 is subjected to vibration, impact, or the like, since the portion covered with the resin does not fall off the metal plate 29, the contamination of the internal space due to the falling is suppressed. can do.

  What is necessary is just to select the shape of the mounting part 13 according to the magnitude | size of the board | substrate 11 to convey. In FIGS. 1 to 4, the mounting portion 13 bifurcates toward the second end portion 9, and is provided at three locations near the second end portion 9 and at the branch portion for adsorbing the transported object 9. An example in which a support member 19 having a hole 17 is provided is shown. In addition, in FIGS. 1 to 4, the transfer arm 31 including the support member 19 is shown in three places near the second end 9 and at the branch portion, but the support member 19 is not limited to this.

  1 to 4, an intake hole 21 connected to a suction mechanism (not shown) is opened in the first surface 1 of the connecting portion 7, and a shaft or the like of the substrate transfer device is provided at four locations around the intake hole 21. An example is shown in which an insertion hole 23 for inserting a bolt (not shown) for fastening to an opening is opened.

  In each of the transfer arms 31, a suction passage 25 that connects the suction hole 17 and the suction hole 21 is provided inside the main body 3.

  The transfer of the conveyed object using the transfer arm 31 shown in FIGS. 1 to 4 is performed by operating a suction mechanism (not shown) connected to the transfer arm 31 so that the suction port 21 and the suction path 25 are connected. The object is sucked by the suction holes 17 at three places, and the conveyed object is adsorbed on the mounting surface 1a by the attraction force generated at this time, and is conveyed to the next step.

  Here, main body 3 is made of, for example, ceramics containing aluminum oxide, silicon carbide, or the like as a main component. The metal plate 29 is made of, for example, carbon steel such as S15C, S45C, S50C, and S60C or stainless steel such as SUS304, SUS316, and SUS630.

  The main component in the present embodiment refers to a component occupying 60% by mass or more of 100% by mass of the component constituting the ceramic. After each component constituting the ceramics was identified using an X-ray diffractometer (XRD), the content of each component was determined using a fluorescent X-ray analyzer (XRF) or an ICP emission spectrometer (ICP). What is necessary is just to determine the content of the element and convert it to the content of the identified component.

  FIG. 5 is a top view illustrating an example of an embodiment of the substrate transfer device 39 using the transfer arm 31 of the present embodiment and the substrate processing device 55 using the substrate transfer device 39.

  The substrate processing device 35 has a substrate transfer device 39 substantially at the center of the transfer chamber 37. Further, the substrate processing apparatus 35 includes a plurality of processing chambers 43a to 43d around the transfer chamber 37 via a gate valve 41 and two substrate cassette chambers 47 each including a substrate cassette 45 for storing the substrates 11 before and after processing. Have. The substrate processing apparatus 35 is a multi-chamber type substrate processing apparatus 35 that continuously processes the substrates 11 one by one.

  Here, in each of the processing chambers 43a to 43d, for example, the following processing is performed. In the processing chamber 43a, an oxidation treatment is performed on the silicon single crystal substrate as the substrate 11, and a silicon oxide film is formed on the surface thereof. Alternatively, raw materials are supplied in a gaseous state according to the type of a thin film to be formed, and the thin film is formed by a gas phase reaction. In the processing chamber 43b, the oxide film formed on the substrate 11 is removed using a plasma dry etching apparatus. Further, in the processing chamber 43c, an epitaxial process for forming an epitaxial layer is performed. In the processing chamber 43d, a layer made of, for example, aluminum, titanium, titanium nitride, or the like is formed on the substrate 11 by a sputtering method.

  The substrate transfer device 39 is rotatably attached to a shaft 51 that rotates in the axial direction, a first arm 52 that is rotatably attached to the shaft 51, and a tip of the first arm 52. A second arm 53, a third arm 54 rotatably attached to the tip of the second arm 53, and a transfer arm 31 having a connection portion connected to the third arm 54 are provided. The transfer arm 31 is provided with a metal plate 29 at a position extending from the connecting portion to the intermediate portion 15.

  After the gate valves 41 of the processing chamber 43 and the substrate cassette chamber 47 are opened, the substrate transfer device 39 extends the second arm 53 to enter the processing chamber 43 or the substrate cassette 45 in the substrate cassette chamber 47. The transport arm 31 is caused to enter the gap between the substrates 11 stored in the container, and is carried out and carried out.

  In the processing of the substrate 11 using the substrate processing apparatus 35 of the present embodiment provided with these, first, the substrate 11 before processing is carried into the substrate cassette chamber 47 in cassette units.

  Then, after evacuation or replacement with an inert gas is performed in the substrate cassette chamber 47, the gate valve 41 between the transfer chamber 37 and the substrate cassette chamber 47 is opened, and the substrate transfer device 39 moves the substrate cassette 45 to the substrate cassette 45. The transfer arm 31 is advanced into the gap between the plurality of stored substrates 11, and one substrate 11 is taken out and transferred into the transfer chamber 37.

  Next, after evacuation or replacement with an inert gas is performed in predetermined processing chambers 43a to 43d, the gate valve 41 between the transfer chamber 37 and the processing chambers 43a to 43d is opened, and the substrate 11 The wafer is carried into the processing chambers 43a to 43d, and processing such as film formation and etching is performed. The substrate 11 finally processed is transferred by the substrate transfer device 39 and stored in the substrate cassette 45 in the substrate cassette chamber 47. In this manner, a series of processing is performed in a predetermined atmosphere without exposing the substrate 11 to the outside air.

  By using the transfer arm 31 of the present disclosure in the substrate transfer device 39 of the present embodiment, the main body 3 is hardly damaged, so that it can be used for a long period of time. The trouble of replacing parts can be eliminated, and the board transfer device 39 with high efficiency can be obtained.

  Also, in the substrate processing apparatus 35 of the present embodiment, the long-term use is possible by installing the substrate transfer apparatus 39 of the present embodiment using the transfer arm 31 of the present disclosure that is hard to be damaged. Thus, the substrate processing apparatus 35 has high efficiency.

  Next, a manufacturing method for obtaining the transfer arm 31 of the present embodiment will be described with reference to FIGS.

  FIG. 6 shows a molded body that becomes the main body 3 constituting the transfer arm 31 shown in FIG. (A) is a molded body 3a that becomes a support portion 19 after firing, (b) is a molded body 3b that becomes a part of the main body 3 after firing, and (c) is a molded body 3c that becomes a part of the main body 3 after firing. FIG. 7A is a cross-sectional view showing the state of lamination of the respective molded bodies shown in FIG. 6, FIG. 7B is a cross-sectional view showing the laminated body after lamination, and FIG. It is sectional drawing of the conveyance arm provided with a metal plate in a laminated body.

As shown in FIGS. 6 and 7, the main body 3 is obtained by laminating and firing a formed body divided into a plurality of members.

  The method for manufacturing the transfer arm 31 according to the present embodiment includes, first, a powder of aluminum oxide having a purity of 99.9% by mass or more and an average particle diameter of 0.5 μm or more and 1.0 μm or less; Prepare each powder of magnesium. The content of aluminum oxide is 99.5% by mass or more, and the content of calcium oxide and silicon oxide is 20% by mass or more, respectively, of the total 100% by mass of each powder of calcium oxide, silicon oxide, and magnesium oxide. A mixed powder weighed so as to be 37.5% by mass or less and the remainder being magnesium oxide was put into a rotary mill together with a solvent such as water, and the purity was 99.5% by mass or more and 99.99% by mass or less. Mixing is performed with ceramic balls made of aluminum oxide.

  Next, a binder for molding such as polyvinyl alcohol, polyethylene glycol or acrylic resin is added to the solvent, and then mixed to obtain a slurry. Here, the addition amount of the molding binder is 2 to 10 parts by mass in total with respect to 100 parts by mass of the mixed powder. If the amount of the molding binder is less than 2 parts by mass, the molded article does not have the required strength and flexibility, resulting in a brittle molded article. On the other hand, when the addition amount of the molding binder exceeds 10 parts by mass, the molding binder is less likely to be burned off by firing, and the possibility of occurrence of defects such as cracks increases. By setting the addition amount of the molding binder to 2 parts by mass or more and 10 parts by mass or less with respect to 100 parts by mass of the mixed powder, the strength and flexibility required for the molded body can be obtained, and defects such as cracks are less likely to occur. A molded article can be obtained.

  Next, a sheet obtained by forming a mixed powder, a slurry obtained by mixing a forming binder and the like by a doctor blade method is punched into a shape of a formed body, or a mixed powder, a slurry obtained by mixing a slurry obtained by mixing a forming binder, and the like is used by granulation. Press molding. Further, if necessary, a cutting process is performed, and as shown in FIG. 6, a molded body 3a that becomes a cylindrical support portion 19 after firing, an adsorption hole 17 that becomes a part of the main body 3 after firing, and an intake hole 21 as shown in FIG. Then, a plate-shaped molded body 3b having a groove serving as the suction path 25 and the insertion hole 23 and a plate-shaped molded body 3c having the insertion hole 23 which becomes a part of the main body 3 after firing are obtained.

  Next, a contact liquid is applied to the surfaces of these molded bodies facing each other, and the positions of the suction holes 17, the suction passages 25 and the insertion holes 23 are aligned as shown in FIG. 6A and 6C, the members shown in FIGS. 6B and 6C are oriented such that the surface shown in FIG. 6B faces upward. Are laminated so as to face downward to obtain a laminate. After the laminate is pressed, it is fired at a temperature of 1580 ° C. or more and 1650 ° C. or less to obtain the main body 3 shown in FIG. 7B. Then, after applying an epoxy-based adhesive to one main surface of the metal plate 29, it is brought into contact with a position extending from the connecting portion to the intermediate portion, and is pressed from the thickness direction, thereby carrying the carrier shown in FIG. The arm 31 can be obtained.

  The metal plate 29 can be formed into a required shape by, for example, punching a metal plate having a predetermined thickness with a mold. For example, as shown in FIGS. 1 to 4, a portion corresponding to the intake port 21 and the insertion hole 23 may be formed with a through hole when punching with a die. Further, after a plate having a predetermined thickness is masked, a required shape can be formed by etching or the like using a chemical. In addition, a metal plate 29 having a mirror surface can be prepared by punching out a metal plate whose one surface is mirror-finished in advance with a mold or performing etching. Further, in order to provide the concave portion 33 in the metal plate 29, it is preferable to perform masking, blasting or etching to remove the metal in the portion to be the concave portion 33 except for the portion where the concave portion 33 is provided.

  When the surface of the metal plate 29 which is not opposed to the main body 3 is coated with a resin, the primer (base material) is applied, the primer is dried, and then the polyimide resin, the polytetrafluoroethylene resin, What is necessary is just to apply a trifluorinated ethylene resin, a polyvinylidene fluoride resin or a polybenzimidazole resin by spraying and heat-treat it at a temperature exceeding the glass transition point or melting point of the applied resin. It is to be noted that a portion that does not require resin coating may be masked before applying a primer (base material), and the masking may be removed after heat treatment.

  Although the embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments, and various improvements and modifications may be made without departing from the spirit of the present invention. For example, the transport arm 31 may have a mechanism for holding the transported object 11 by means other than suction. Further, the shape of the transfer arm 31 may be selected according to the transferred object 11 and the purpose.

DESCRIPTION OF SYMBOLS 1 1st surface 2 2nd surface 3 Main body 3a, 3b, 3c Molded body 5 which becomes a part of a main body after baking 5 1st end 7 Connecting part 9 2nd end 11 Conveyed object (substrate)
13 Placement part 15 Intermediate part 17 Suction hole 19 Support part 21 Intake hole 23 Insertion hole 25 Suction path 27 Notch 29 Metal plate 31 Transfer arm 33 Depression 35 Substrate processing unit 37 Transfer chamber 39 Substrate transfer unit

Claims (10)

A transfer arm connected to a substrate transfer device, having a plate-shaped main body made of ceramics,
The main body includes a first surface facing the article to be transported, and a second surface opposite to the first surface,
The main body is connected to each of the connecting portion, the mounting portion corresponding to the portion facing the transported object, and the connecting portion and the mounting portion, and is located between the connecting portion and the mounting portion. And an intermediate part,
On at least one of the first surface and the second surface, a metal plate is provided at a position extending from the connection portion to the intermediate portion ,
A support member for supporting the transported object is provided on the first surface of the placement section, and the metal plate is provided near the support member of the placement section following the intermediate section from the connection section. The transfer arm is located up to . 2. The transfer arm according to claim 1 , wherein the metal plate includes a concave portion at a portion other than a boundary between the connecting portion and the intermediate portion. 3. The transfer arm according to claim 1, wherein the largest surface of the exposed surfaces of the metal plate is a mirror surface. The metal plate has a surface not facing the main body, which is coated with a polyimide resin, a polytetrafluoroethylene resin, a polychlorofluoroethylene resin, a polyvinylidene fluoride resin, or a polybenzimidazole resin. 1 to conveying arm according to claim 3.   A transfer arm connected to a substrate transfer device, having a plate-shaped main body made of ceramics,
  The main body includes a first surface facing the article to be transported, and a second surface opposite to the first surface,
  The main body is connected to each of the connecting portion, the mounting portion corresponding to the portion facing the transported object, and the connecting portion and the mounting portion, and is located between the connecting portion and the mounting portion. And an intermediate part,
  On at least one of the first surface and the second surface, a metal plate is provided at a position extending from the connection portion to the intermediate portion,
  The metal plate has a concave portion in a portion other than a boundary between the connecting portion and the intermediate portion,
M   A transfer arm connected to a substrate transfer device, having a plate-shaped main body made of ceramics,
  The main body includes a first surface facing the article to be transported, and a second surface opposite to the first surface,
  The main body is connected to each of the connecting portion, the mounting portion corresponding to the portion facing the transported object, and the connecting portion and the mounting portion, and is located between the connecting portion and the mounting portion. And an intermediate part,
  On at least one of the first surface and the second surface, a metal plate is provided at a position extending from the connection portion to the intermediate portion,
  The transfer arm, wherein the largest surface of the exposed surface of the metal plate is a mirror surface.   A transfer arm connected to a substrate transfer device, having a plate-shaped main body made of ceramics,
  The main body includes a first surface facing the article to be transported, and a second surface opposite to the first surface,
  The main body is connected to each of the connecting portion, the mounting portion corresponding to the portion facing the transported object, and the connecting portion and the mounting portion, and is located between the connecting portion and the mounting portion. And an intermediate part,
  On at least one of the first surface and the second surface, a metal plate is provided at a position extending from the connection portion to the intermediate portion,
  The transfer arm, wherein the metal plate has a surface not facing the main body coated with a polyimide resin, a polytetrafluoroethylene resin, a polychlorotrifluoroethylene resin, a polyvinylidene fluoride resin or a polybenzimidazole resin. . In the boundary portion corresponding to between the connecting portion and the intermediate portion, wherein it is the thickness of the body is less than 1.0mm 5.0mm or less, the thickness of the metal plate is 50μm or more 0.5mm or less, according to claim 1 to 7 The transfer arm according to any one of the above. Comprising a conveying arm according to any one of claims 1 to 8, the substrate transfer apparatus. A substrate processing apparatus comprising the substrate transfer device according to claim 9 .

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