JP6641910B2 - Piezoelectric driving device and manufacturing method thereof, motor, robot, and pump - Google Patents

Description

  The present invention relates to a piezoelectric driving device and a manufacturing method thereof, a motor, a robot, and a pump.

  An ultrasonic motor that drives a driven body by vibrating a piezoelectric body does not require a magnet or a coil, and is therefore used in various fields (for example, see Patent Document 1). Such an ultrasonic motor generally uses a piezoelectric element (bulk piezoelectric element) including a bulk piezoelectric body (see, for example, Patent Document 2).

  On the other hand, as a piezoelectric element, an element having a thin-film piezoelectric body (thin-film piezoelectric element) is known. The thin film piezoelectric element is mainly used for ejecting ink in a head of an ink jet printer.

JP 2004-320979 A JP 2008-227123 A

  If such a thin film piezoelectric element is used for an ultrasonic motor, there is a high possibility that the ultrasonic motor and devices driven by the ultrasonic motor can be miniaturized. However, thin-film piezoelectric elements generally have significantly lower output than bulk piezoelectric elements. Therefore, the existing thin film piezoelectric element may not be able to obtain a sufficient output to be used as a drive source of a motor for driving a joint of a robot, for example.

  One of the objects according to some aspects of the present invention is to provide a piezoelectric drive device that can achieve high output. Another object of some embodiments of the present invention is to provide a method of manufacturing a piezoelectric driving device that can achieve high output. Another object of some embodiments of the present invention is to provide a motor, a robot, or a pump including the above-described piezoelectric driving device.

  SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following aspects or application examples.

[Application Example 1]
One aspect of the piezoelectric driving device according to the present invention is:
Board and
A piezoelectric element having a first electrode provided on the substrate, a piezoelectric layer provided on the first electrode, and a second electrode provided on the first piezoelectric layer;
A layer including copper provided along an outer periphery of the substrate in plan view and electrically connected to the first electrode;
A conductive layer containing nickel and phosphorus provided to cover the layer containing copper,
including.

  In such a piezoelectric driving device, the resistance of the member that electrically connects the first electrode to the terminal of the piezoelectric driving device can be reduced. Thus, in such a piezoelectric driving device, high output can be achieved.

  In the description according to the present invention, the term “electrically connected” refers to, for example, “a specific member (hereinafter, referred to as an“ A member ”) and another specific member (hereinafter,“ electrically connected ”) that is“ electrically connected ”. B member)). In the description according to the present invention, in such a case as in this example, the case where the A member and the B member are in direct contact and are electrically connected, and the case where the A member and the B member are other members. The term “electrically connected” is used to include the case where the connection is made electrically through the connection.

[Application Example 2]
In application example 1,
The conductive layer,
A layer containing nickel and phosphorus;
A gold layer provided to cover the layer containing nickel and phosphorus,
May be provided.

  In such a piezoelectric driving device, when the configuration of the terminal electrically connected to the piezoelectric element and the configuration of the conductive layer are the same and the material of the external wiring connected to the terminal is gold, The terminal and the external wiring can be joined by coupling (Au-Au coupling).

[Application Example 3]
In application example 2,
The conductive layer,
A palladium layer provided between a layer containing nickel and phosphorus and a gold layer may be provided.

  In such a piezoelectric driving device, the palladium layer can suppress diffusion between the layer containing nickel and phosphorus and the gold layer.

[Application Example 4]
In any one of Application Examples 1 to 3,
The conductive layer may be an electroless plating layer.

  In such a piezoelectric driving device, the conductive layer can be easily formed.

[Application Example 5]
In any one of Application Examples 1 to 4,
The substrate has a first surface and a second surface opposite to the first surface,
The piezoelectric element is provided on the first surface,
A metal layer is provided on the second surface;
The metal layer may be connected to the conductive layer.

  In such a piezoelectric driving device, the resistance of the member that electrically connects the first electrode to the terminal of the piezoelectric driving device can be further reduced.

[Application Example 6]
In application example 5,
A first piezoelectric vibrator, and a second piezoelectric vibrator joined to the first piezoelectric vibrator,
The first piezoelectric vibrator and the second piezoelectric vibrator,
The substrate, the piezoelectric element, and a layer containing copper, including,
The copper-containing layer of the first piezoelectric vibrator and the copper-containing layer of the second piezoelectric vibrator may be joined.

  In such a piezoelectric driving device, higher output can be achieved as compared with the case where only one piezoelectric vibrator is included.

[Application Example 7]
In application example 6,
The first piezoelectric vibrator and the second piezoelectric vibrator constitute a joined body,
The joined body includes the metal layer,
A plurality of the joined bodies are stacked in a thickness direction of the substrate,
In the adjacent joined bodies, the metal layer of one joined body and the metal layer of the other joined body may be joined.

  In such a piezoelectric driving device, higher output can be achieved as compared with the case where only one joined body is configured.

[Application Example 8]
One embodiment of a method of manufacturing a piezoelectric driving device according to the present invention includes:
Forming a first electrode on the substrate;
Forming a piezoelectric layer on the first electrode;
Forming a second electrode on the piezoelectric layer;
Forming a layer containing copper electrically connected to the first electrode so as to be along the outer periphery of the substrate in plan view;
Forming an electroless plating layer so as to cover the layer containing copper,
including.

  According to such a method of manufacturing a piezoelectric drive device, a piezoelectric drive device capable of achieving high output can be manufactured.

[Application Example 9]
One embodiment of the motor according to the present invention includes:
A piezoelectric driving device according to any one of application examples 1 to 7,
A rotor rotated by the piezoelectric driving device,
including.

  Since such a motor includes the piezoelectric driving device according to the present invention, high output can be achieved.

[Application Example 10]
One aspect of the robot according to the present invention is:
A plurality of links,
A joint connecting the plurality of links,
A piezoelectric driving device according to any one of application examples 1 to 7, wherein the plurality of link portions are rotated by the joint portions;
including.

  Such a robot can include the piezoelectric driving device according to the present invention.

[Application Example 11]
One embodiment of the pump according to the present invention includes:
A piezoelectric driving device according to any one of application examples 1 to 7,
A tube for transporting the liquid,
A plurality of fingers for closing the tube by driving the piezoelectric driving device;
including.

  Such a pump may include the piezoelectric drive according to the present invention.

FIG. 2 is a plan view schematically showing the piezoelectric driving device according to the embodiment. FIG. 2 is a cross-sectional view schematically illustrating the piezoelectric driving device according to the embodiment. FIG. 2 is a diagram schematically illustrating a piezoelectric drive device according to the embodiment. FIG. 2 is a plan view schematically showing a first piezoelectric vibrating body of the piezoelectric driving device according to the embodiment. FIG. 2 is a plan view schematically showing a first piezoelectric vibrating body of the piezoelectric driving device according to the embodiment. FIG. 3 is a cross-sectional view schematically illustrating a first piezoelectric vibrating body of the piezoelectric driving device according to the embodiment. FIG. 2 is a cross-sectional view schematically illustrating the piezoelectric driving device according to the embodiment. FIG. 2 is a cross-sectional view schematically illustrating the piezoelectric driving device according to the embodiment. FIG. 2 is a diagram showing an equivalent circuit for explaining the piezoelectric driving device according to the embodiment. FIG. 4 is a view for explaining a method of electrically connecting terminals and a drive circuit of the piezoelectric drive device according to the embodiment. FIG. 4 is a view for explaining the operation of the piezoelectric drive device according to the embodiment. 5 is a flowchart for explaining a method of manufacturing the piezoelectric drive device according to the embodiment. FIG. 4 is a cross-sectional view schematically showing a manufacturing process of the piezoelectric drive device according to the embodiment. FIG. 4 is a cross-sectional view schematically showing a manufacturing process of the piezoelectric drive device according to the embodiment. FIG. 4 is a cross-sectional view schematically showing a manufacturing process of the piezoelectric drive device according to the embodiment. FIG. 4 is a cross-sectional view schematically showing a manufacturing process of the piezoelectric drive device according to the embodiment. FIG. 9 is a cross-sectional view schematically illustrating a piezoelectric driving device according to a modification of the embodiment. FIG. 2 is a view for explaining the robot according to the embodiment. FIG. 3 is a diagram for explaining a wrist portion of the robot according to the embodiment. The figure for explaining the pump concerning this embodiment.

  Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings. The embodiments described below do not unduly limit the contents of the present invention described in the claims. In addition, all of the configurations described below are not necessarily essential components of the invention.

1. First, a piezoelectric drive device according to the present embodiment will be described with reference to the drawings. FIG. 1 is a plan view schematically showing a piezoelectric drive device 100 according to the present embodiment. FIG. 2 is a cross-sectional view taken along the line II-II of FIG. 1 schematically illustrating the piezoelectric driving device 100 according to the present embodiment. FIG. 3 is a diagram schematically illustrating the piezoelectric driving device 100 according to the present embodiment as viewed from the direction of arrow III in FIG. 1.

  As shown in FIGS. 1 to 3, the piezoelectric driving device 100 includes a first piezoelectric vibrating body 101 and a second piezoelectric vibrating body 102 joined to the first piezoelectric vibrating body 101. 2 and 3, the piezoelectric vibrators 101 and 102 are shown in a simplified manner.

  Here, FIGS. 4 and 5 are plan views schematically showing the first piezoelectric vibrating body 101. FIG. FIG. 6 is a cross-sectional view taken along the line VI-VI of FIGS. 4 and 5 schematically illustrating the first piezoelectric vibrating body 101. The first piezoelectric vibrating body 101 and the second piezoelectric vibrating body 102 basically have the same configuration. Therefore, the first piezoelectric vibrating body 101 will be described below with reference to FIGS. The description of the first piezoelectric vibrating body 101 can be basically applied to the second piezoelectric vibrating body 102.

  As shown in FIGS. 4 to 6, the first piezoelectric vibrating body 101 includes a substrate 10, a contact portion 20, a piezoelectric element 30, a first insulating layer 40, a second insulating layer 42, and a first wiring layer. 50 and a second wiring layer 52. In FIG. 4, members other than the substrate 10, the contact part 20, and the piezoelectric element 30 are not illustrated for convenience. In FIG. 5, illustration of members other than the substrate 10, the contact portion 20, and a part of the second wiring layer 52 is omitted.

  As shown in FIG. 6, the substrate 10 has a first surface 10a, a second surface 10b opposite to the first surface 10a, and a third surface (side surface) connecting the first surface 10a and the second surface 10b. ) 10c. The piezoelectric element 30 is provided on the first surface 10a. The substrate 10 is, for example, a silicon substrate. Note that the substrate 10 may include a stacked body of a silicon substrate, a silicon oxide layer provided over the silicon substrate, and a zirconium oxide layer provided over the silicon oxide layer.

  As shown in FIGS. 4 and 5, the substrate 10 has a vibrating body part 12, a support part 14, a first connection part 16, and a second connection part 18. The planar shape of the vibrating body portion 12 (the shape viewed from the thickness direction of the substrate 10) is substantially rectangular. The piezoelectric element 30 is provided on the vibrating body 12, and the vibrating body 12 can vibrate by deformation of the piezoelectric element 30. The support section 14 supports the vibrating body section 12 via the connection sections 16 and 18. In the illustrated example, the connecting portions 16 and 18 extend from a central portion in the longitudinal direction of the vibrating body portion 12 in a direction orthogonal to the longitudinal direction, and are connected to the support portion 14.

The contact section 20 is provided on the vibrating body section 12. In the illustrated example, a concave portion 12a is provided in the vibrating body portion 12, and the contact portion 20 is fitted into the concave portion 12a and joined (for example, bonded). The contact portion 20 is a member that contacts the driven member and transmits the movement of the vibrating body portion 12 to the driven member. The material of the contact portion 20 is, for example, ceramics (specifically, alumina (Al ₂ O ₃ )), zirconia (ZrO ₂ ), silicon nitride (Si ₃ N), or the like.

  The piezoelectric element 30 is provided on the substrate 10. Specifically, the piezoelectric element 30 is provided on the vibrating body 12. The piezoelectric element 30 has a first electrode 32, a piezoelectric layer 34, and a second electrode 36.

  The first electrode 32 is provided on the vibrating body 12. In the illustrated example, the planar shape of the first electrode 32 is a rectangle. The first electrode 32 may be configured by an iridium layer provided on the vibrating body 12 and a platinum layer provided on the iridium layer. The thickness of the iridium layer is, for example, 5 nm or more and 100 nm or less. The thickness of the platinum layer is, for example, 50 nm or more and 300 nm or less. The first electrode 32 is made of a metal layer made of Ti, Pt, Ta, Ir, Sr, In, Sn, Au, Al, Fe, Cr, Ni, Cu, or the like, or a mixture or stack of two or more of these. It may be something. The first electrode 32 is one electrode for applying a voltage to the piezoelectric layer 34.

The piezoelectric layer 34 is provided on the first electrode 32. In the illustrated example, the planar shape of the piezoelectric layer 34 is a rectangle. The thickness of the piezoelectric layer 34 is, for example, 50 nm or more and 20 μm or less, and preferably 1 μm or more and 7 μm or less. Thus, the piezoelectric element 30 is a thin-film piezoelectric element. If the thickness of the piezoelectric layer 34 is smaller than 50 nm, the output of the piezoelectric driving device 100 may decrease. Specifically, if the voltage applied to the piezoelectric layer 34 is increased to increase the output, the piezoelectric layer 34 may cause dielectric breakdown. If the thickness of the piezoelectric layer 34 is larger than 20 μm, cracks may occur in the piezoelectric layer 34.

The piezoelectric layer 34 is made of a perovskite oxide piezoelectric material. Specifically, the material of the piezoelectric layer 34 is, for example, lead zirconate titanate (Pb (Zr, Ti) O ₃ : PZT), lead zirconate titanate niobate (Pb (Zr, Ti, Nb) O). ₃ : PZTN). The piezoelectric layer 34 can be deformed (expanded or contracted) when a voltage is applied by the electrodes 32 and 36.

  The second electrode 36 is provided on the piezoelectric layer 34. In the illustrated example, the planar shape of the second electrode 36 is a rectangle. The second electrode 36 may be configured by an adhesion layer provided on the piezoelectric layer 34 and a conductive layer provided on the adhesion layer. The thickness of the adhesion layer is, for example, 10 nm or more and 100 nm or less. The adhesion layer is, for example, a TiW layer, a Ti layer, a Cr layer, a NiCr layer, or a laminate thereof. The thickness of the conductive layer is, for example, 1 μm or more and 10 μm or less. The conductive layer is, for example, a Cu layer, an Au layer, an Al layer, or a laminate thereof. The second electrode 36 is the other electrode for applying a voltage to the piezoelectric layer 34.

  As shown in FIG. 4, a plurality of piezoelectric elements 30 are provided. In the illustrated example, five piezoelectric elements 30 are provided (piezoelectric elements 30a, 30b, 30c, 30d, and 30e). In plan view (as viewed from the thickness direction of the substrate 10), for example, the areas of the piezoelectric elements 30a to 30d are the same, and the piezoelectric element 30e has an area larger than the piezoelectric elements 30a to 30d. The piezoelectric element 30 e is provided along the longitudinal direction of the vibrating body 12 at the center in the short direction of the vibrating body 12. The piezoelectric elements 30a, 30b, 30c, 30d are provided at four corners of the vibrating body 12. In the illustrated example, in the piezoelectric elements 30a to 30e, the first electrode 32 is provided as one continuous conductive layer.

  The first insulating layer 40 is provided so as to cover the piezoelectric element 30 as shown in FIG. The material of the first insulating layer 40 may be an inorganic material such as silicon oxide or aluminum oxide, or may be an organic material such as an epoxy resin, an acrylic resin, a polyimide resin, or a silicone resin. The material of the first insulating layer 40 may be a photosensitive material.

  The first wiring layer 50 is provided on the second electrode 36. The first wiring layer 50 is electrically connected to the second electrode 36. In the illustrated example, the first wiring layer 50 is provided on the first insulating layer 40 and the contact hole 40 a formed in the first insulating layer 40, and is connected to the second electrode 36.

  The first wiring layer 50 is a layer containing copper. The first wiring layer 50 may include a titanium tungsten layer and a copper layer provided on the titanium tungsten layer. In the illustrated example, the first wiring layer 50 is covered with an electroless plating layer 51 formed by electroless plating. The electroless plating layer 51 may be composed of a layer containing nickel and phosphorus (Ni-P layer). Alternatively, the electroless plating layer 51 may include a Ni-P layer and a gold layer provided on the Ni-P layer. Alternatively, the electroless plating layer 51 may include a Ni-P layer, a palladium layer provided on the Ni-P layer, and a gold layer provided on the palladium layer.

The second insulating layer 42 is provided so as to cover the first wiring layer 50. In the illustrated example, the second insulating layer 42 is provided so as to cover the first wiring layer 50 via the electroless plating layer 51. The material of the second insulating layer 42 is, for example, the same as the material of the first insulating layer 40.

  The second wiring layer 52 has a first portion 52 a electrically connected to the first electrode 32 and a second portion 52 b electrically connected to the second electrode 36. As shown in FIG. 5, the first portion 52a and the second portion 52b are electrically separated. The second wiring layer 52 is a layer containing copper. The second wiring layer 52 may include a titanium tungsten layer and a copper layer provided on the titanium tungsten layer.

  The first portion 52 a of the second wiring layer 52 is connected to the first electrode 32. In the example shown in FIG. 6, the first portion 52a is provided on the upper surface of the first electrode 32, the side surface of the first insulating layer 40, and the upper surface and the side surface of the second insulating layer 42. The first portion 52a is provided along the outer periphery of the substrate 10 in a plan view, as shown in FIG.

  As shown in FIG. 5, the first portion 52a of the second wiring layer 52 passes through the first connection portion 16 from the vibrator portion 12 and passes through the side of the support portion 14 (the side opposite to the contact portion 20) in plan view. (Side) 14a.

  As shown in FIG. 6, the second portion 52b of the second wiring layer 52 is provided on the first wiring layer 50 via the electroless plating layer 51. In the illustrated example, the second portion 52b is provided on the second insulating layer 42 and the contact hole 42a formed in the second insulating layer 42, and is connected to the electroless plating layer 51. In the illustrated example, a third insulating layer 44 is provided on the second insulating layer 42 and between the first portion 52a and the second portion 52b. Thereby, the first portion 52a and the second portion 52b can be more reliably electrically separated.

  The second portion 52b of the second wiring layer 52 is further divided into three parts as shown in FIG. That is, the second portion 52b of the second wiring layer 52 has a first part 52b1, a second part 52b2, and a third part 52b3. The first part 52b1 is connected to the second electrodes 36 of the piezoelectric elements 30a, 30d. The first part 52b1 extends from the vibrator part 12 through the first connection part 16 to the vicinity of the side 14a of the support part 14 in plan view. The second part 52b2 is connected to the second electrode 36 of the piezoelectric element 30e. The second part 52b2 extends from the vibrator part 12 through the second connection part 18 to the vicinity of the side 14a of the support part 14 in plan view. The third part 52b3 is connected to the second electrodes 36 of the piezoelectric elements 30b, 30c. The third part 52b3 extends from the vibrator part 12 through the second connection part 18 to the vicinity of the side 14a of the support part 14 in plan view.

  FIG. 7 is a cross-sectional view taken along the line VII-VII of FIG. 1 schematically illustrating the piezoelectric driving device 100. The first piezoelectric vibrating member 101 and the second piezoelectric vibrating member 102 are stacked in the thickness direction of the substrate 10 as shown in FIG. The distance between the substrate 10 of the first piezoelectric vibrator 101 and the substrate 10 of the second piezoelectric vibrator 102 is, for example, about 20 μm. The second wiring layer 52 of the first piezoelectric vibrating body 101 and the second wiring layer 52 of the second piezoelectric vibrating body 102 are joined. In the illustrated example, the second wiring layer 52 of the first piezoelectric vibrating body 101 and the second wiring layer 52 of the second piezoelectric vibrating body 102 are joined via the adhesive 2. The adhesive 2 is, for example, a conductive adhesive. Thereby, the second wiring layer 52 of the first piezoelectric vibrating body 101 and the second wiring layer 52 of the second piezoelectric vibrating body 102 can be electrically connected.

  Note that the second wiring layer 52 of the first piezoelectric vibrating body 101 and the second wiring layer 52 of the second piezoelectric vibrating body 102 may be joined by metal bonding (Cu-Cu joining). Thus, the piezoelectric vibrators 101 and 102 can be firmly joined without using an adhesive.

As shown in FIG. 7, the piezoelectric driving device 100 includes a conductive layer 60 containing nickel and phosphorus,
A metal layer 70.

  The conductive layer 60 is provided so as to cover an end of the second wiring layer 52. In the illustrated example, the conductive layer 60 is provided on the side of the first portion 52a of the second wiring layer 52 of the piezoelectric vibrators 101 and 102, and is connected to the first portion 52a. In other words, the conductive layer 60 is provided on a portion where the second wiring layer 52 is exposed to the side when the first piezoelectric vibrator 101 and the second piezoelectric vibrator 102 are joined.

  The conductive layer 60 is an electroless plating layer formed by an electroless plating method. The conductive layer 60 has, for example, a layer (Ni-P layer) 62 containing nickel and phosphorus, a palladium layer 64, and a gold layer 66. The Ni-P layer 62 is provided so as to cover the first portion 52a. The palladium layer 64 is provided so as to cover the Ni—P layer 62. The palladium layer 64 is provided between the Ni-P layer 62 and the gold layer 66. The gold layer 66 is provided so as to cover the Ni—P layer 62 via the palladium layer 64. Although not shown, the palladium layer 64 may not be provided. Further, the palladium layer 64 and the gold layer 66 may not be provided.

  The metal layer 70 is provided on the second surface 10b and the third surface 10c of the substrate 10. The metal layer 70 is connected to the conductive layer 60. In the illustrated example, the metal layer 70 is connected to the gold layer 66 of the conductive layer 60. The metal layer 70 is, for example, a copper layer.

  FIG. 8 is a cross-sectional view taken along the line VIII-VIII of FIG. 1 schematically illustrating the piezoelectric driving device 100. The piezoelectric driving device 100 has terminals 80, 82, 84, 86 as shown in FIGS. The terminals 80, 82, 84, and 86 have the same structure as the conductive layer 60. As shown in FIG. 1, the terminals 80, 82, 84, 86 protrude outward from the side 14 a of the support 14 in plan view. The width of the terminals 80, 82, 84, 86 (the length in the direction perpendicular to the thickness direction of the substrate 10) is, for example, about 200 μm. The distance between the adjacent terminals 80, 82, 84, 86 is, for example, about 100 μm.

  The terminal 80 is electrically connected to the common first electrode 32 of the piezoelectric elements 30a, 30b, 30c, 30d, and 30e, for example, via the first portion 52a (see FIG. 5) of the second wiring layer 52. . The terminal 80 may have a reference potential as a ground. The terminal 82 is electrically connected to the second electrode 36 of each of the piezoelectric elements 30a and 30d via, for example, the first part 52b1 (see FIG. 5) of the second portion 52b of the second wiring layer 52. The terminal 86 is electrically connected to the second electrode 36 of the piezoelectric elements 30b and 30c, for example, via the third part 52b3 (see FIG. 5) of the second portion 52b of the second wiring layer 52. The terminal 84 is electrically connected to the second electrode 36 of the piezoelectric element 30e, for example, via the second part 52b2 (see FIG. 5) of the second portion 52b of the second wiring layer 52. In the piezoelectric driving device 100, by connecting the terminals 80, 82, 84, 86 and the driving circuit, a voltage is applied to the piezoelectric layer 34 of the piezoelectric elements 30 a to 30 e, and the vibrating body section 12 can be vibrated. .

  The terminal 80 is connected to, for example, the metal layer 70. Although not shown, the terminals 82, 84, 86 are not connected to the metal layer 70. Further, the terminal 80 may not be connected to the metal layer 70.

In the piezoelectric vibrators 101 and 102 of the piezoelectric drive device 100, as shown in FIG. 8, the first conductive layer 33, the insulating layer 35, the second conductive layer 37, and the insulating layer 40 are provided on the support portion 14 and the connection portions 16 and 18. , 42, wiring layers 50 and 52, and electroless plating layer 51. Thereby, for example, in each of the piezoelectric vibrators 101 and 102, the difference in thickness (height) of the members provided on the vibrator part 12, the support part 14, and the connection parts 16 and 18 can be reduced. That is, the thickness uniformity of each of the piezoelectric vibrators 101 and 102 can be improved. Therefore, when the piezoelectric vibrators 101 and 102 are stacked, it is possible to suppress the generation of a gap between the piezoelectric vibrators 101 and 102. Thereby, the bonding strength between the piezoelectric vibrators 101 and 102 can be improved.

  The materials of the first conductive layer 33, the insulating layer 35, and the second conductive layer 37 are the same as the materials of the first electrode 32, the piezoelectric layer 34, and the second electrode 36, respectively. The first conductive layer 33, the insulating layer 35, and the second conductive layer 37 can be formed in the step of forming the first electrode 32, the piezoelectric layer 34, and the second electrode 36, respectively. No voltage is applied to the piezoelectric layer 34 by the conductive layers 33 and 37. In the example shown in FIG. 8, the first conductive layer 33 is electrically separated from the terminal 80. However, the first conductive layer 33 may be electrically connected to the terminal 80, and It may be electrically connected to the electrode 32. When the first conductive layer 33 is electrically connected to the first electrode 32 and the terminal 80, the second conductive layer 37 is electrically separated from the second electrode.

  FIG. 9 is a diagram showing an equivalent circuit for explaining the piezoelectric driving device 100. The piezoelectric elements 30 are divided into three groups. The first group has two piezoelectric elements 30a and 30d. The second group has two piezoelectric elements 30b and 30c. The third group has only one piezoelectric element 30e. As shown in FIG. 9, the first group of piezoelectric elements 30a and 30d are connected in parallel to each other and connected to the drive circuit 110. The piezoelectric elements 30 b and 30 c of the second group are connected in parallel with each other and are connected to the drive circuit 110. The third group of piezoelectric elements 30e is independently connected to the drive circuit 110.

  The drive circuit 110 has a predetermined period among the five piezoelectric elements 30a, 30b, 30c, 30d, and 30e, for example, a period between the first electrode 32 and the second electrode 36 of the piezoelectric elements 30a, 30d, and 30e. A constantly changing AC voltage or pulsating voltage is applied. Thus, the piezoelectric driving device 100 can ultrasonically vibrate the vibrating body portion 12 and rotate the rotor (driven member) in contact with the contact portion 20 in a predetermined rotation direction. Here, the “pulsating voltage” means a voltage obtained by adding a DC offset to an AC voltage, and the direction of the voltage (electric field) of the pulsating voltage is one direction from one electrode to the other electrode.

  The direction of the current is preferably from the second electrode 36 to the first electrode 32 rather than from the first electrode 32 to the second electrode 36. Further, by applying an AC voltage or a pulsating voltage between the electrodes 32, 36 of the piezoelectric elements 30b, 30c, 30e, the rotor contacting the contact portion 20 can be rotated in the opposite direction.

  FIG. 10 is a diagram for explaining an electrical connection method between the terminal 80 of the piezoelectric drive device 100 and the drive circuit 110. For convenience, FIG. 10 shows the piezoelectric vibrators 101 and 102 in a simplified manner.

  The terminal 80 is electrically connected to the drive circuit 110 via the flexible board 120 as shown in FIG. Specifically, the flexible substrate 120 includes an insulating substrate 122 and a wiring layer 124 provided on the insulating substrate 122, and the terminal 80 and the drive circuit 110 are electrically connected by the wiring layer 124. Can be. The wiring layer 124 is, for example, a gold layer or a copper layer.

  The terminals 82, 84, and 86 are also electrically connected to the drive circuit 110 via the flexible substrate 120, similarly to the terminal 80. Although not shown, the electrical connection between the terminals 80, 82, 84, 86 and the drive circuit 110 may be made using wires or solder.

  FIG. 11 is a diagram for explaining the operation of the vibrating body section 12 of the piezoelectric driving device 100. As shown in FIG. 11, the contact portion 20 of the piezoelectric driving device 100 is in contact with the outer periphery of the rotor 4 as a driven member. The drive circuit 110 applies an AC voltage or a pulsating voltage between the electrodes 32 and 36 of the piezoelectric elements 30a and 30d. Thereby, the piezoelectric elements 30a and 30d expand and contract in the direction of arrow x. In response to this, the vibrating body portion 12 bends in the plane of the vibrating body portion 12 (for example, flexural vibration along the lateral direction of the vibrating body portion 12 when no voltage is applied to the piezoelectric element 30). ) To deform into a meandering shape (S-shape). Further, the drive circuit 110 applies an AC voltage or a pulsating voltage between the electrodes 32 and 36 of the piezoelectric element 30e. Thereby, the piezoelectric element 30e expands and contracts in the direction of arrow y. As a result, the vibrating body portion 12 vertically vibrates in the plane of the vibrating body portion 12 (for example, longitudinal vibration along the longitudinal direction of the vibrating body portion 12 when no voltage is applied to the piezoelectric element 30). Due to the bending vibration and the longitudinal vibration of the vibrating body portion 12 as described above, the contact portion 20 makes an elliptical motion as indicated by an arrow z. As a result, the rotor 4 rotates in a predetermined direction R (clockwise in the illustrated example) around the center 4a.

  When the drive circuit 110 applies an AC voltage or a pulsating voltage between the electrodes 32 and 36 of the piezoelectric elements 30b, 30c, and 30e, the rotor 4 rotates in the direction opposite to the direction R (counterclockwise direction). To rotate.

  Further, it is preferable that the resonance frequency of the bending vibration and the resonance frequency of the longitudinal vibration of the vibrating body portion 12 are the same. Thereby, the piezoelectric driving device 100 can rotate the rotor 4 efficiently.

  As shown in FIG. 11, the motor 130 according to the present embodiment includes the piezoelectric driving device (the piezoelectric driving device 100 in the illustrated example) according to the present invention, and the rotor 4 rotated by the piezoelectric driving device 100.

  The piezoelectric driving device 100 has, for example, the following features.

  In the piezoelectric driving device 100, a second wiring layer 52 provided along the outer periphery of the substrate 10 in a plan view and electrically connected to the first electrode 32, and a conductive layer provided to cover the second wiring layer 52. And a layer 60. Therefore, in the piezoelectric driving device 100, the resistance of the member that electrically connects the first electrode 32 and the terminal 80 can be reduced. Accordingly, in the piezoelectric driving device 100, the efficiency of the voltage applied to the piezoelectric layer 34 can be improved, and the amount of heat generated by the member that electrically connects the first electrode 32 and the terminal 80 can be reduced. be able to. Further, since the thin-film piezoelectric element has a larger capacitance than the bulk piezoelectric element, the impedance of the piezoelectric layer is reduced. In the piezoelectric driving device 100, the impedance of the piezoelectric layer 34 can be increased by lowering the resistance of the member that electrically connects the first electrode 32 and the terminal 80, and the impedance is applied to the piezoelectric layer 34. The voltage can be increased. As a result, the piezoelectric drive device 100 can achieve high output.

  Note that heat treatment is performed in an oxygen atmosphere to form the piezoelectric layer 34, and the heat treatment is performed at 700 ° C to 800 ° C. Therefore, the first electrode 32 is made of a material that can withstand high temperatures and contains platinum that is not oxidized. Therefore, if the thickness of the first electrode is increased to reduce the resistance of the first electrode and increase the output of the piezoelectric driving device, the cost increases. In the piezoelectric drive device 100 according to the present embodiment, high output can be achieved while suppressing costs.

In the piezoelectric driving device 100, the conductive layer 60 has the gold layer 66 provided so as to cover the Ni—P layer 62. Therefore, the configuration of the terminals 80, 82, 84, 86 is the same as the configuration of the conductive layer 60, and external wiring connected to the terminals 80, 82, 84, 86 (specifically, the wiring layer 124 of the flexible substrate 120). In the case where the material of ()) is gold, the terminals 80, 82, 84, 86 and the external wiring can be joined by metal bonding (Au-Au bonding).

  In the piezoelectric driving device 100, the conductive layer 60 has a palladium layer 64 provided between the Ni-P layer 62 and the gold layer 66. Therefore, in the piezoelectric driving device 100, the diffusion between the Ni—P layer 62 and the gold layer 66 can be suppressed by the palladium layer 64.

  In the piezoelectric driving device 100, the conductive layer 60 is an electroless plating layer. Therefore, in the piezoelectric driving device 100, for example, palladium as a catalyst can be selectively attached to the surface of the first portion 52a of the second wiring layer 52, and the conductive layer 60 can be selectively formed. Thus, in the piezoelectric driving device 100, for example, the conductive layer 60 can be easily formed even when the substrate 10 is in a wafer state. Further, even if the distance between the substrate 10 of the first piezoelectric vibrator 101 and the substrate 10 of the second piezoelectric vibrator 102 is as small as about 20 μm, the conductive layer 60 can be easily formed. For example, when the conductive layer 60 is formed by a sputtering method or the like, it is necessary to perform sputtering from a direction perpendicular to the thickness direction of the substrate 10, and the conductive layer 60 may not be easily formed.

  Further, the electroless plating layer can be formed only by dipping in the liquid. Therefore, in the piezoelectric driving device 100, by forming the conductive layer 60, it is possible to prevent the second wiring layer 52 from being damaged. In the piezoelectric driving device 100, for example, the conductive layer 60 can be formed at low cost.

  In the piezoelectric driving device 100, the metal layer 70 is provided on the second surface 10 b of the substrate 10, and the metal layer 70 is connected to the conductive layer 60. Therefore, in the piezoelectric driving device 100, the resistance of the member that electrically connects the first electrode 32 and the terminal 80 can be further reduced.

  The piezoelectric driving device 100 includes a first piezoelectric vibrating body 101 and a second piezoelectric vibrating body 102 joined to the first piezoelectric vibrating body 101. Therefore, in the piezoelectric drive device 100, higher output can be achieved as compared with the case where only one piezoelectric vibrator is included.

  The piezoelectric driving device 100 includes an electroless plating layer 51 provided so as to cover the first wiring layer 50. Therefore, in the piezoelectric driving device 100, for example, when the second insulating layer 42 is formed, the oxidation of the first wiring layer 50 can be suppressed. Specifically, when the material of the second insulating layer 42 is an organic material, a heat treatment (bake) is performed when the second insulating layer 42 is formed. However, since the first wiring layer 50 contains copper, the heat treatment is performed. Easily oxidized by However, in the piezoelectric driving device 100, since the electroless plating layer 51 is provided so as to cover the first wiring layer 50, the oxidation of the first wiring layer 50 can be suppressed by the electroless plating layer 51.

  The motor 130 includes the piezoelectric driving device 100. Therefore, the output of the motor 130 can be increased.

2. Next, a method for manufacturing the piezoelectric drive device 100 according to the present embodiment will be described with reference to the drawings. FIG. 12 is a flowchart illustrating a method for manufacturing the piezoelectric driving device 100 according to the present embodiment. FIG. 13 to FIG. 16 are cross-sectional views schematically showing manufacturing steps of the piezoelectric driving device 100 according to the present embodiment.

The first piezoelectric vibrating body 101 and the second piezoelectric vibrating body 102 are basically formed by the same manufacturing method. Therefore, hereinafter, the first piezoelectric vibrating body 10 will be described with reference to FIGS.
1 will be described. The description of the method for manufacturing the first piezoelectric vibrator 101 can be basically applied to the method for manufacturing the second piezoelectric vibrator 102.

  As shown in FIG. 13, the first electrode 32 is formed on the vibrating part 12 of the substrate 10 (S1). The first electrode 32 is formed by, for example, a sputtering method, a CVD (Chemical Vapor Deposition) method, a vacuum deposition method, and the like, and a patterning (patterning by photolithography and etching). In this step, the first conductive layer 33 can be formed on the support portion 14 and the connection portions 16 and 18 of the substrate 10 (see FIG. 8).

  Note that the substrate 10 may be in a wafer state. That is, although not shown, a frame portion may be provided around the substrate 10 and the substrate 10 may be connected to the frame portion via the cut portion. In this case, the substrate 10, the frame section, and the section to be cut are provided integrally.

  Next, the piezoelectric layer 34 is formed on the first electrode 32 (S2). The piezoelectric layer 34 is formed, for example, by repeating formation of a precursor layer by a liquid phase method and crystallization of the precursor layer, followed by patterning. The liquid phase method is a method of forming a thin film material using a raw material liquid containing a constituent material of a thin film (piezoelectric layer), and specifically, a sol-gel method, a MOD (Metal Organic Deposition) method, or the like. . The crystallization is performed by a heat treatment at 700 ° C. to 800 ° C. in an oxygen atmosphere. In this step, the insulating layer 35 can be formed over the first conductive layer 33 (see FIG. 8).

  Next, the second electrode 36 is formed on the piezoelectric layer 34 (S3). The second electrode 36 is formed, for example, in the same manner as the first electrode 32. Although not shown, the patterning of the second electrode 36 and the patterning of the piezoelectric layer 34 may be performed as the same step. In this step, the second conductive layer 37 can be formed over the insulating layer 35 (see FIG. 8).

  Through the above steps, the piezoelectric element 30 can be formed on the vibrating body 12 of the substrate 10.

  As shown in FIG. 14, the first insulating layer 40 is formed so as to cover the piezoelectric element 30 (S4). The first insulating layer 40 is formed by, for example, a spin coating method or a CVD method. Next, the first insulating layer 40 is patterned to form a contact hole 40a. When the material of the first insulating layer 40 is a photosensitive material, the first insulating layer 40 can be patterned by exposure, development, and baking without etching. If the material of the first insulating layer 40 is not a photosensitive material, the first insulating layer 40 is patterned by photolithography and etching.

  Next, the first wiring layer 50 is formed on the second electrode 36 and the first insulating layer 40 (S5). The first wiring layer 50 is formed by, for example, plating (electroplating), film formation by sputtering, and patterning.

  Next, an electroless plating layer 51 is formed so as to cover the first wiring layer 50 (S6). The electroless plating layer 51 is formed by an electroless plating method. Specifically, after selectively depositing palladium as a catalyst on the surface of the first wiring layer 50, the electroless plating layer 51 is selectively formed on the surface of the first wiring layer 50 by an electroless plating method. I do.

As shown in FIG. 6, the second insulating layer 42 is formed so as to cover the electroless plating layer 51 (S7). Next, the second insulating layer 42 is patterned to form a contact hole 42a. The second insulating layer 42 and the contact hole 42a are formed, for example, in the same manner as the first insulating layer 40 and the contact hole 40a, respectively. For example, when the second insulating layer 42 is baked, the oxidation of the first wiring layer 50 by the electroless plating layer 51 can be suppressed. Note that a third insulating layer 44 may be formed on the second insulating layer 42 as shown in FIG. The third insulating layer 44 is formed, for example, by the same method as the first insulating layer 40.

  Next, a second wiring layer 52 is formed on the electrodes 32 and 36 and on the second insulating layer 42 (S8). The second wiring layer 52 is formed, for example, by the same method as the first wiring layer 50. Specifically, the first portion 52a of the second wiring layer 52 that is electrically connected to the first electrode 32 is formed along the outer periphery of the substrate 10 in plan view. Further, a second portion 52b of the second wiring layer 52 electrically connected to the second electrode 36 is formed.

  Through the above steps, the first piezoelectric vibrating body 101 and the second piezoelectric vibrating body 102 can be formed. When the substrate 10 is in a wafer state, the first piezoelectric vibrator 101 and the second piezoelectric vibrator 102 may be formed on different wafers.

  As shown in FIG. 15, the first piezoelectric vibrator 101 and the second piezoelectric vibrator 102 are joined (S9). Specifically, the second wiring layer 52 of the first piezoelectric vibrating body 101 and the second wiring layer 52 of the second piezoelectric vibrating body 102 are joined via the adhesive 2.

  As shown in FIG. 16, palladium P as a catalyst of the electroless plating method is selectively adhered to the exposed portion of the first portion 52a of the second wiring layer 52 (S10). The palladium P is attached, for example, by a known method.

  As shown in FIG. 7, a conductive layer 60 is formed so as to cover the second wiring layer 52 (S11). Specifically, the conductive layer 60 is selectively formed on the portion of the first portion 52a where the palladium P is attached. The conductive layer 60 is formed by an electroless plating method. The Ni-P layer 62 of the conductive layer 60 is formed, for example, by reducing a nickel layer with hypophosphorous acid (formed by a reduction type electroless plating method). The palladium layer 64 and the gold layer 66 of the conductive layer 60 are formed by, for example, a substitution type electroless plating method.

  Next, the metal layer 70 is formed on the surfaces 10b and 10c of the substrate 10 (S12). Metal layer 70 is formed so as to be connected to conductive layer 60. The metal layer 70 is formed by, for example, a sputtering method.

  Although not shown, when the substrate 10 is in a wafer state, after the step (S12), the cut portion is cut by etching or the like to separate the substrate 10 from the frame portion (to form a chip).

  Through the above steps, the piezoelectric driving device 100 can be manufactured.

  In the method of manufacturing the piezoelectric driving device 100, a step (S8) of forming the second wiring layer 52 electrically connected to the first electrode 32 along the outer periphery of the substrate 10 in plan view; Forming a conductive layer 60 that is an electroless plating layer so as to cover the layer including (S11). Therefore, in the method of manufacturing the piezoelectric driving device 100, the piezoelectric driving device 100 that can achieve high output can be manufactured.

3. Modification of Piezoelectric Driving Device Next, a piezoelectric driving device according to a modification of the present embodiment will be described with reference to the drawings. FIG. 17 is a cross-sectional view schematically showing a piezoelectric driving device 200 according to a modification of the present embodiment. For convenience, FIG. 17 shows the first piezoelectric vibrator 101 and the second piezoelectric vibrator 102 in a simplified manner.

  Hereinafter, in the piezoelectric driving device 200 according to the modification of the present embodiment, members having the same functions as those of the components of the piezoelectric driving device 100 according to the present embodiment are denoted by the same reference numerals, and detailed description thereof will be omitted. I do.

  In the above-described piezoelectric drive device 100, as shown in FIG. 2, one first piezoelectric vibrator 101 and one second piezoelectric vibrator 102 were included. On the other hand, the piezoelectric drive device 200 includes a plurality of first piezoelectric vibrators 101 and a plurality of second piezoelectric vibrators 102.

  In the piezoelectric driving device 200, the first piezoelectric vibrating body 101 and the second piezoelectric vibrating body 102 constitute a joined body 210. The joined body 210 has the metal layer 70. A plurality of joined bodies 210 are provided. In the illustrated example, three joined bodies 210 are provided. A plurality of bonded bodies 210 are stacked in the thickness direction of the substrate 10.

  In adjacent joints 210, the metal layer 70 of one joint 210 and the metal layer 70 of the other joint 210 are joined. For example, when the metal layer 70 is a gold layer, the metal layer 70 of one joint 210 and the metal layer 70 of the other joint 210 are joined by a metal bond (Au-Au junction). Thereby, the adjacent joined bodies 210 can be firmly joined without using an adhesive. Although not shown, the metal layer 70 of one joined body 210 and the metal layer 70 of the other joined body 210 may be joined by a conductive adhesive.

  In the piezoelectric driving device 200, a plurality of bonded bodies 210 are stacked in the thickness direction of the substrate 10. Therefore, in the piezoelectric drive device 200, higher output can be achieved as compared with the case where only one joint body 210 is configured.

4. Apparatus Using Piezoelectric Driving Apparatus A piezoelectric driving apparatus according to the present invention can apply a large force to a driven body by utilizing resonance, and is applicable to various apparatuses. The piezoelectric driving device according to the present invention is used as a driving device in various devices such as a robot (including an electronic component transport device (IC handler)), a medication pump, a calendar feed device for a clock, and a paper feed mechanism for a printing device. Can be used. Hereinafter, typical embodiments will be described. Hereinafter, a device including the piezoelectric driving device 100 will be described as the piezoelectric driving device according to the present invention.

4.1. Robot FIG. 18 is a diagram for explaining a robot 2050 using the piezoelectric driving device 100. The robot 2010 includes an arm 2010 including a plurality of link portions 2012 (also referred to as “link members”) and a plurality of joint portions 2020 that connect the link portions 2012 in a rotatable or bendable state. "Arm").

  Each joint 2020 has a built-in piezoelectric driving device 100, and the joint 2020 can be rotated or bent by an arbitrary angle using the piezoelectric driving device 100. A robot hand 2000 is connected to a tip of the arm 2010. The robot hand 2000 includes a pair of holding portions 2003. The piezoelectric drive device 100 is also built in the robot hand 2000, and the gripper 2003 can be opened and closed using the piezoelectric drive device 100 to grip an object. The piezoelectric drive device 100 is also provided between the robot hand 2000 and the arm 2010, and the robot hand 2000 can be rotated with respect to the arm 2010 using the piezoelectric drive device 100.

  FIG. 19 is a view for explaining the wrist portion of the robot 2050 shown in FIG. The wrist joint portion 2020 sandwiches the wrist rotating portion 2022, and the wrist link portion 2012 is attached to the wrist rotating portion 2022 so as to be rotatable around the central axis O of the wrist rotating portion 2022. . The wrist rotation unit 2022 includes the piezoelectric drive device 100, and the piezoelectric drive device 100 rotates the wrist link unit 2012 and the robot hand 2000 around the central axis O. The robot hand 2000 has a plurality of gripping portions 2003 erected. The base end of the gripper 2003 is movable within the robot hand 2000, and the piezoelectric driving device 100 is mounted on the base of the gripper 2003. For this reason, by operating the piezoelectric driving device 100, the gripper 2003 can be moved to grip the target object. The piezoelectric driving device 100 is not limited to a single-arm robot, but may be applied to a multi-arm robot having two or more arms.

  Here, inside the joint part 2020 of the wrist and the robot hand 2000, in addition to the piezoelectric driving device 100, a power line for supplying power to various devices such as a force sensor and a gyro sensor, a signal line for transmitting a signal, and the like. Includes and requires a lot of wiring. Therefore, it was very difficult to arrange the wiring inside the joint 2020 or the robot hand 2000. However, since the driving current of the piezoelectric driving device 100 can be smaller than that of a normal electric motor, it is necessary to arrange the wiring even in a small space such as the joint 2020 (particularly, the joint at the tip of the arm 2010) or the robot hand 2000. Becomes possible.

4.2. Pump FIG. 20 is a diagram illustrating an example of a liquid feed pump 2200 using the piezoelectric driving device 100. The liquid feed pump 2200 includes a reservoir 2211, a tube 2212, a piezoelectric driving device 100, a rotor 2222, a reduction transmission mechanism 2223, a cam 2202, a plurality of fingers 2213, 2214, 2215, 2216, 2217, 2218, and 2219.

  The reservoir 2211 is a storage unit for storing a liquid to be transported. The tube 2212 is a tube for transporting the liquid sent from the reservoir 2211. The contact portion 20 of the piezoelectric driving device 100 is provided so as to be pressed against the side surface of the rotor 2222, and the piezoelectric driving device 100 drives the rotor 2222 to rotate. The rotational force of the rotor 2222 is transmitted to the cam 2202 via the reduction transmission mechanism 2223. The fingers 2213 to 2219 are members for closing the tube 2212. When the cam 2202 rotates, the projections 2202A of the cam 2202 sequentially push the fingers 2213 to 2219 outward in the radial direction. The fingers 2213 to 2219 close the tube 2212 in order from the upstream side in the transport direction (reservoir 2211 side). Thereby, the liquid in the tube 2212 is sequentially transported to the downstream side. In this way, it is possible to realize a small-sized liquid sending pump 2200 that can send a very small amount of liquid with high accuracy.

  The arrangement of each member is not limited to the illustrated one. Further, a configuration may be adopted in which a ball or the like provided on the rotor 2222 closes the tube 2212 without a member such as a finger. The liquid sending pump 2200 as described above can be used for a drug dispensing device that administers a drug solution such as insulin to a human body. Here, by using the piezoelectric driving device 100, the driving current can be made smaller than that of a normal electric motor, so that the power consumption of the administration device can be suppressed. Therefore, it is particularly effective when the dosing device is driven by a battery.

  The above-described embodiments and modifications are merely examples, and the present invention is not limited to these. For example, each embodiment and each modified example can be appropriately combined.

The invention includes substantially the same configuration as the configuration described in the embodiment (for example, a configuration having the same function, method, and result, or a configuration having the same object and effect). Further, the invention includes a configuration in which a non-essential part of the configuration described in the embodiment is replaced. Further, the invention includes a configuration having the same function and effect as the configuration described in the embodiment or a configuration capable of achieving the same object. Further, the invention includes a configuration in which a known technique is added to the configuration described in the embodiment.

2 ... adhesive, 4 ... rotor, 4a ... center, 10 ... substrate, 10a ... first surface, 10b ... second surface, 10c ... third surface, 12 ... vibrator part, 12a ... recess, 14 ... support part, 14a ... side, 16 ... first connection, 18 ... second connection, 20 ... contact, 30, 30a, 30b, 30c, 30d, 30e ... piezoelectric element, 32 ... first electrode, 33 ... first conductive layer , 34: piezoelectric layer, 35: insulating layer, 36: second electrode, 37: second conductive layer, 40: first insulating layer, 40a: contact hole, 42: second insulating layer, 42a: contact hole, 44 ... third insulating layer, 50 ... first wiring layer, 51 ... electroless plating layer, 52 ... second wiring layer, 52a ... first part, 52b ... second part, 52b1 ... first part, 52b2 ... second part , 52b3: third part, 60: conductive layer, 62: Ni-P layer, 64: para 70, metal layer, 80, 82, 84, 86 terminal, 100 piezoelectric drive device, 101 first piezoelectric vibrator, 102 second piezoelectric vibrator, 110 drive circuit, 120: Flexible substrate, 122: Insulating substrate, 124: Wiring layer, 130: Motor, 200: Piezoelectric drive, 210: Joined body, 2000: Robot hand, 2003: Holding part, 2010: Arm, 2012: Link part, 2020 ... joint part, 2050 ... robot, 2200 ... liquid feed pump, 2202 ... cam, 2202A ... projection part, 2211 ... reservoir, 2212 ... tube, 2213, 2214, 2215, 2216, 2217, 2218, 2219 ... finger, 2222 ... rotor , 2223 ... reduction transmission mechanism, 2230 ... case

Claims (10)

Board and
A piezoelectric element having a second electrode provided on the first electrode, a piezoelectric layer provided on the first electrode, and prior Ki圧 collector layer provided on the substrate,
A layer including copper which has a portion provided above the second electrode and is electrically connected to the first electrode;
A conductive layer containing nickel and phosphorus, being connected to the layer containing copper, and having a portion that does not overlap with the piezoelectric layer in plan view of the substrate,
Only including,
The substrate has a first surface and a second surface opposite to the first surface,
The piezoelectric element is provided on the first surface,
A metal layer is provided on the second surface;
The piezoelectric driving device , wherein the metal layer is connected to the conductive layer . In claim 1,
The conductive layer,
A layer containing nickel and phosphorus;
A gold layer provided to cover the layer containing nickel and phosphorus,
A piezoelectric driving device comprising: In claim 2,
The conductive layer,
A piezoelectric driving device, comprising: a palladium layer provided between the layer containing nickel and phosphorus and the gold layer. In any one of claims 1 to 3,
The piezoelectric driving device, wherein the conductive layer is an electroless plating layer. In any one of claims 1 to 4 ,
A first piezoelectric vibrator, and a second piezoelectric vibrator joined to the first piezoelectric vibrator,
The first piezoelectric vibrator and the second piezoelectric vibrator,
The substrate, the piezoelectric element, and a layer containing copper, including,
The piezoelectric drive device, wherein the copper-containing layer of the first piezoelectric vibrator and the copper-containing layer of the second piezoelectric vibrator are joined. In claim 5 ,
The first piezoelectric vibrator and the second piezoelectric vibrator constitute a joined body,
The joined body includes the metal layer,
A plurality of the joined bodies are stacked in a thickness direction of the substrate,
The piezoelectric drive device, wherein, in the adjacent joined bodies, the metal layer of one of the joined bodies and the metal layer of the other joined body are joined. Forming a first electrode on the first surface of a substrate having a first surface and a second surface opposite to the first surface ;
Forming a piezoelectric layer on the first electrode;
Forming a second electrode on the piezoelectric layer;
Forming a layer containing copper that has a portion provided above the second electrode and is electrically connected to the first electrode;
A step of forming an electroless plating layer having a portion that is connected to the layer containing copper and that does not overlap with the piezoelectric layer in plan view of the substrate;
Forming a metal layer connected to the electroless plating layer on the second surface of the substrate . A piezoelectric driving device according to any one of claims 1 to 6 ,
A rotor rotated by the piezoelectric driving device,
Including, the motor. A plurality of links,
A joint connecting the plurality of links,
The piezoelectric drive device according to any one of claims 1 to 6 , wherein the plurality of link portions are rotated by the joint portions.
Robots, including. A piezoelectric driving device according to any one of claims 1 to 6 ,
A tube for transporting the liquid,
A plurality of fingers for closing the tube by driving the piezoelectric driving device,
Including, pump.

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