JP6646255B2 - Lamp equipment and lighting equipment - Google Patents

Description

  Embodiments described herein relate generally to a lamp device using a light emitting element and a lighting device using the lamp device.

  2. Description of the Related Art Conventionally, there is a flat lamp device using a base such as a GX53 base, a GH76p base, and a GH69h base.

  This lamp device includes a light emitting module having a light emitting element mounted on a substrate, a power supply circuit for supplying power to the light emitting module, a housing for accommodating the light emitting module and the power supply circuit, and the like. The substrate of the light emitting module is disposed in the housing via a heat conducting member so that heat generated when the light emitting element is turned on is efficiently radiated to the housing. In some cases, a metal member is used for the housing in order to efficiently radiate heat transmitted from the light-emitting element.

  There is also a light emitting module in which a power supply circuit is provided integrally with a light emitting element on a substrate. In the case of this light-emitting module, the substrate must be arranged in close contact with the housing in order to transfer heat of the light-emitting element on the substrate to the housing side. It is difficult to keep the insulation distance from the metal member, and it becomes difficult to secure the insulation of the power supply circuit.

  Further, since the heat conductive member is relatively expensive, it is preferable to reduce the amount of use, but it is necessary to ensure heat dissipation from the substrate to the housing by the heat conductive member.

JP-A-2005-5524

  The problem to be solved by the present invention is to provide a lamp device and a lighting device which can ensure the insulation of a power supply circuit of a substrate and reduce the amount of a heat conductive member while ensuring the heat dissipation of a light emitting element. It is to be.

The lamp device according to the embodiment includes a light emitting module, a housing, and a heat conductive member. The light emitting module has a substrate, a light emitting element mounted in a central region of the substrate, and a power supply circuit provided in a peripheral region of the substrate. The housing has a main body having a metal plate and a resin portion provided on the surface of the metal plate, a base provided on one end side of the main body, and a board arrangement provided on the other end side of the main body to arrange the substrate. It has a set part. An annular projection is provided in the substrate disposing portion between the central region and the peripheral region of the substrate so as to project annularly from the resin portion, and the metal plate is exposed inside the annular projection. The heat conductive member is filled inside the annular protrusion, and is in contact with the substrate and the metal plate, respectively. The annular protrusion has an arrangement surface on which the substrate is arranged on a tip end surface protruding from the main body, and has a groove provided on a part of the arrangement surface and communicating with the inside of the annular protrusion. The substrate has a window opening to face the groove.

  ADVANTAGE OF THE INVENTION According to this invention, while ensuring the insulation of the power supply circuit of a board | substrate, the heat dissipation of a light emitting element can be ensured, and it can be expected that the usage of a heat conductive member is reduced.

It is sectional drawing of the lamp apparatus which shows one Embodiment. FIG. 2 is an exploded perspective view of the lamp device. FIG. 3 is a front view of a light emitting module and a housing of the lamp device. FIG. 2 is a perspective view of a lighting device using the same lamp device.

  Hereinafter, an embodiment will be described with reference to FIGS.

  1 and 2 show a flat lamp device 10. FIG. Hereinafter, the light irradiation direction on the front side (the other end side) of the lamp device 10 will be described as the lower side, and the base side on the back side (one end side) opposite to the light irradiation direction will be described as the upper side.

  The lamp device 10 includes a housing 11, a light-emitting module 12 and a reflector 13 disposed in the housing 11, and a light-transmitting cover 14 attached to a lower portion of the housing 11.

  The housing 11 includes a main body 20. A base 22 having a pair of electrode pins 21 is provided on the upper side of the main body 20, and a substrate mounting section 23 for mounting the substrate of the light emitting module 12 is provided below the main body 20. The base 22 is, for example, a GX53 type base.

  The main body 20 includes an annular portion 24, a cylindrical outer peripheral portion 25 projecting downward from the outer periphery of the annular portion 24, and a substrate disposing portion 23 projecting downward from the inner periphery of the annular portion 24 via a step 26. It has. Further, from the inner periphery of the annular portion 24, a cylindrical protruding portion 27 constituting the base 22 is provided to protrude upward. Further, an annular space portion 28 is formed below the annular portion 24 and between the outer peripheral portion 25 and the substrate disposing portion 23 (the step portion 26).

  The housing 11 is integrally formed by insert molding that covers the metal plate 29 and the pair of electrode pins 21 with the resin portion 30.

  The metal plate 29 is formed by press-molding a flat plate of metal such as aluminum, for example, so as to cover the substrate mounting portion 23, the annular portion 24, and the outer peripheral portion 25. That is, the metal plate 29 is a flat metal plate portion 29a disposed on the substrate disposition portion 23, and a tube bent between the substrate disposition portion 23 and the annular portion 24 and disposed on the step portion 26. A metal plate portion 29b disposed on the annular portion 24, and a metal plate portion 29d disposed on the outer peripheral portion 25. A plurality of holes are formed in the metal plate 29, and the resin portion 30 goes around the holes, whereby the metal plate 29 and the resin portion 30 are integrally connected. Further, a plurality of holes 29e that are open downward are formed in the metal plate portion 29a of the metal plate 29 without the resin portion 30 wrapping around, and the insert position of the electrode pin 21 is formed in the metal plate portion 29e. A pair of holes 29f is formed corresponding to.

  The resin portion 30 forms the substrate mounting portion 23, the annular portion 24, the outer peripheral portion 25, and the protruding portion 27 with a resin material having an insulating property.

  Further, the substrate disposing portion 23 projects below the annular portion 24. An annular projection 31 is provided in the periphery of the board disposing portion 23 so as to project annularly downward from the resin portion 30. A circular opening 32 is formed inside the annular projection 31, and the metal plate 29 is exposed from the opening 32. A substantially annular disposing surface 33 for disposing the substrate of the light emitting module 12 is provided on the distal end surface of the annular protruding portion 31, and a part of the disposing surface 33 communicates with the inside and outside of the annular protruding portion 31. A groove 34 is provided. In this embodiment, the groove portions 34 are provided in a pair at two locations symmetrical with respect to the center of the annular projection 31, but may be provided at at least one location.

  The inside of the annular protrusion 31 is filled with a heat conductive member 35 such as a silicone resin. The heat conductive member 35 is in contact with the substrate of the light emitting module 12 and the metal plate 29 provided in the substrate mounting portion 23, respectively, and is capable of conducting heat from the substrate of the light emitting module 12 to the metal plate 29. A part of the heat conducting member 35 enters the hole 29e of the metal plate 29 and enters the groove 34 of the annular projection 31.

  The annular portion 24 has a pair of bosses 36 projecting downward from the resin portion 30 at symmetrical positions with respect to the center of the base 22, and the electrode pins 21 are fixed in the bosses 36. ing. The boss 36 protrudes into the space 28, and the lower end of the boss 36 protrudes below the board disposing portion 23 (annular protrusion 31). The pair of bosses 36 and the pair of grooves 34 are linearly located in the same radial direction from the center of the housing 11, respectively. In addition, a plurality of holes 37 are formed on the lower surface of the annular portion 24 so that the resin portion 30 is opened and the metal plate 29 is exposed. The hole 37 is formed in a long hole shape along the circumferential direction of the annular portion 24.

  A plurality of positioning portions 38 for positioning the substrate of the light emitting module 12 and a plurality of positioning portions 39 for positioning the reflector 13 are respectively provided inside the outer peripheral portion 25, and a plurality of mounting portions for attaching the light transmitting cover 14 are provided. Is formed. Further, inside the outer peripheral portion 25, an outer peripheral side disposing surface 41 for disposing the outer peripheral side of the substrate of the light emitting module 12 is formed. The outer peripheral surface 41 is formed in a plane parallel to the arrangement surface 33 of the annular projection 31.

  A pair of L-shaped key grooves 42 are provided on the outer peripheral surface of the protruding portion 27 at positions symmetrical with respect to the center of the base 22 and shifted from positions where the pair of electrode pins 21 are arranged (see FIG. 4). Are formed. An open space 43 that is opened upward is formed inside the protruding portion 27, and the substrate disposing portion 23 is provided at the bottom of the open space 43.

  The electrode pins 21 are formed of a conductive metal material. The electrode pin 21 has a base 44 fixed to the boss 36, and a pin 45 protruding from the upper end of the base 44. The base 44 has a fixing portion 46 protruding from the boss portion 36 and a screw hole 47 opening downward. A large diameter part 48 is formed at the tip of the pin part 45. The lower end of the electrode pin 21 projects below the lower end of the boss 36 or is flush with the lower end of the boss 36.

  Next, the light emitting module 12 includes a substrate 50, a plurality of light emitting elements 51 mounted on a surface (lower surface) which is one surface of the substrate 50, a power supply circuit 52 provided on the substrate 50, and a plurality of circuits of the power supply circuit 52. The component 53 includes a pair of connection members 54 (see FIG. 3) that are electrically connected and fixed to the substrate 50.

  The board 50 is a disc-shaped printed wiring board, and is a double-sided mounting board in which a wiring pattern is formed on both the front surface and the other back surface (upper surface). The substrate 50 has a size close to the outer diameter of the housing 11, is inserted inside the outer peripheral portion 25 of the housing 11, and is disposed on the arrangement surface 33 of the annular protrusion 31 and the outer peripheral side arrangement surface 41. ing. A plurality of grooves 55 are formed on the periphery of the substrate 50, and these grooves 55 are fitted into the positioning portions 38 of the housing 11, respectively, so that the substrate 50 is positioned in the housing 11.

  A light emitting element mounting area 56 for mounting the light emitting element 51 is formed in the central area of the substrate 50, and a circuit component mounting area 57 for mounting the circuit component 53 by providing the power supply circuit 52 in the peripheral area of the substrate 50. Between the central area and the peripheral area of the substrate 50, that is, between the light emitting element mounting area 56 and the circuit component mounting area 57, an arrangement area 58 arranged on the arrangement surface 33 of the annular projection 31 is formed. Have been. In the disposition area 58, a window 59 facing one groove 34 of the annular projection 31 is formed. The window portion 59 is a circular hole, and is opposed to the center of the groove portion 34 shifted to the outer diameter side from the inner peripheral position of the annular protrusion 31. On the periphery of the substrate 50, an outer peripheral side arrangement region 60 arranged on the outer peripheral side arrangement surface 41 is formed.

  In a peripheral region of the substrate 50, a pair of holes in which the connection member 54 is disposed at positions symmetrical with respect to the center of the substrate 50 and corresponding to the positions of the pair of bosses 36 and the pair of electrode pins 21. 61 are provided. These holes 61 are circular and have a diameter that allows the boss 36 to penetrate.

  In the light emitting element mounting area 56 on the surface of the substrate 50, a wiring pattern for mounting the plurality of light emitting elements 51 and connecting the mounted light emitting elements 51 in series or in series / parallel is formed. In a circuit component mounting area 57 on the front and back surfaces of the substrate 50, a wiring pattern that forms the power supply circuit 52 and mounts a plurality of circuit components 53 is formed. The wiring pattern in the light emitting element mounting area 56 and the wiring pattern in the circuit component mounting area 57 are electrically connected by a wiring pattern formed in the wiring area 58.

  As the light emitting element 51, for example, a surface mount type LED is used. The plurality of light emitting elements 51 are connected by soldering to a wiring pattern provided in a light emitting element mounting area 56 on the surface of the substrate 50. The light emitting element 51 is not limited to the LED, and another light emitting element such as an organic EL may be used.

  Further, the power supply circuit 52 is a rectifier circuit for rectifying and smoothing the AC power input from the pair of electrode pins 21. The output from the rectifier circuit is converted into a DC power supply by the switching operation of the switching element and supplied to the light emitting element 51. And a control unit for controlling the switching element.

  The circuit component 53 of the power supply circuit 52 includes a plurality of surface mount components and a plurality of lead components. The surface mount components are, for example, transistors, resistors, capacitors, ICs, and the like, and are connected by soldering to the wiring pattern of the circuit component mounting area 57 on the back surface of the substrate 50. The lead component is, for example, an electrolytic capacitor or an inductor.The lead component main body is disposed in the circuit component mounting area 57 on the surface of the substrate 50, and the lead wire projecting from the lead component main body penetrates the substrate 50 and The rear surface is connected to the wiring pattern of the circuit component mounting area 57 by soldering.

  Further, the connection member 54 is configured by a terminal called a lug terminal. One end of the connection member 54 is fixed to the surface of the substrate 50 at the side of the hole 61, and the other end is disposed on the hole 61. On one end side of the connection member 54, a plurality of connection pieces that penetrate the board 50 and are connected by soldering to the wiring pattern of the circuit component mounting area 57 on the back surface of the board 50 are provided. The pair of connecting members 54 are electrically connected to an input part of the power supply circuit 52 for inputting AC power.

  Then, the screw 64 to which the plate washer 62 and the spring washer 63 are attached is screwed into the screw hole 47 of the electrode pin 21 through the connecting member 54, so that the connecting member 54 is pressed against the electrode pin 21 and electrically connected. The substrate 50 is fixed to the housing 11 while being connected and the back surface of the substrate 50 is pressed against the substrate disposing portion 23.

  Next, in the reflector 13, an opening 70 facing the light emitting element 51 is formed at the center, and a reflecting surface 71 that expands downward from the periphery of the opening 70 is formed. A cover portion 72 is formed from the lower end in the outer radial direction. The cover 72 covers the circuit component 53 with the housing 11. A flange 73 is formed in the periphery of the reflector 13 so as to be sandwiched and held between the housing 11 and the translucent cover 14, and a groove that fits into the positioning portion 39 of the housing 11 in the flange 73. 74 are formed.

  Next, the light-transmitting cover 14 is formed in a disk shape with a synthetic resin having a light-transmitting property and a diffusing property. A fitting portion 80 that fits inside the outer peripheral portion 25 of the housing 11 protrudes from a peripheral portion of the light transmitting cover 14. At a plurality of positions of the fitting portion 80, claw portions 81 which are respectively attached to the attachment portions 40 of the outer peripheral portion 25 of the housing 11 and which fix the translucent cover 14 to the housing 11 are protruded.

  Next, the assembly of the lamp device 10 will be described.

  With the base 22 of the housing 11 facing downward and the inside of the housing 11 facing upward, the inside of the annular projection 31 of the housing 11 has a heat conducting member 35 such as a silicone resin or the like in a fluid state. Is injected in a predetermined amount.

  At this time, the heat conductive member 35 is injected onto the metal plate 29 inside the annular protrusion 31 and spreads on the metal plate 29, but is blocked by the inner peripheral wall of the annular protrusion 31 and the annular protrusion 31 Never spread outside.

  The injection amount of the heat conducting member 35 is set to be slightly larger than the volume of the inner space of the annular projection 31. When the fluidity of the heat conducting member 35 is relatively high, the heat conducting member 35 expands so that there is no space inside the annular protrusion 31, and the heat conduction member 35 is higher than the annular protrusion 31 due to surface tension. It will be in a state of excitement. Further, when the fluidity of the heat conductive member 35 is relatively low, the heat conductive member 35 may not spread all over the inside of the annular protrusion 31, but the heat conductive member 35 is higher than the annular protrusion 31. It is in a state of excitement.

  Then, the light emitting module 12 is inserted into the inside of the housing 11, the groove 55 of the substrate 50 is fitted into the positioning portion 38 of the housing 11, and the substrate 50 is inserted into the hole 61 of the substrate 50 through the boss 36. Press to 11 side.

  At this time, the back surface of the substrate 50 comes into contact with the heat conductive member 35 rising higher than the annular protrusion 31, and the heat conductive member 35 is pressed against the housing 11 on the back surface of the substrate 50. The heat conductive member 35 pressed on the back surface of the substrate 50 spreads so that the entire space inside the annular protrusion 31 is eliminated, and the heat conductive member 35 larger than the volume of the inner space of the annular protrusion 31 is It flows out of the pair of grooves 34 lower than the wiring surface 33 at the tip end of 31 toward the outside of the annular projection 31. When the back surface of the substrate 50 contacts the installation surface 33 of the annular protrusion 31 and the outer peripheral surface 41, the pressing of the substrate 50 against the housing 11 is restricted.

  Since the window 50 is provided on the substrate 50 so as to face the one groove 34, the heat conducting member 35 flowing out into the one groove 34 can be confirmed from the window 59.

  In a state where the light emitting module 12 is disposed in the housing 11, the connection member 54 disposed on the hole 61 of the substrate 50 is disposed to face the end face of the electrode pin 21. In this state, the connection member 54 is separated from the end face of the electrode pin 21.

  Then, the screw 64 to which the plate washer 62 and the spring washer 63 are attached is screwed into the screw hole 47 of the electrode pin 21 through the connecting member 54. With the screw 64, the connecting member 54 is displaced so as to press the connecting member 54 against the end face of the electrode pin 21, and the connecting member 54, the plate washer 62 and the spring washer 63 are formed between the screw 64 and the end face of the electrode pin 21. Tighten and fix.

  In the fixed state by the screw 64, the connecting member 54 comes into contact with the end face of the electrode pin 21, the connecting member 54 and the electrode pin 21 are electrically connected, and the connecting member 54 comes into contact with the plate washer 62 to connect. The member 54 and the electrode pin 21 are electrically connected through a plate washer 62, a spring washer 63, and a screw 64. Therefore, the power supply circuit 52 of the light emitting module 12 and the electrode pins 21 are electrically connected. Further, the board 50 is pressed against the board disposing portion 23 including the disposing surface 33 and the heat conducting member 35 by the connecting member 54 which is fixed by screws 64, and the substrate 50 is fixed to the housing 11.

  The light emitting element 51 mounted on the central region of the substrate 50 is located in the region of the heat conductive member 35 via the substrate 50. The lead wire of the lead component among the circuit components 53 of the power supply circuit 52 provided in the outer peripheral area of the substrate 50 projects into the space 28 on the outer diameter side of the annular projection 31, and the metal plate 29 of the annular portion 24. Is formed with a distance capable of ensuring insulation.

  After that, the heat conduction member 35 is cured. The heat conductive member 35 is in contact with the metal plate 29 and the resin portion 30 of the substrate disposing portion 23 and the back surface of the substrate 50, respectively, and thermally connects the substrate disposing portion 23 and the substrate 50. A part of the heat conducting member 35 enters the plurality of insertion holes 29e of the metal plate 29 and is thermally connected to the metal plate 29.

  Then, the reflector 13 is inserted inside the housing 11, and the light-transmitting cover 14 is attached to the housing 11. At this time, the fitting portion 80 of the translucent cover 14 pushes the flange portion 73 of the reflector 13 into the housing 11 so as to be sandwiched between the housing 11 and the flange portion 73. Further, the peripheral portion of the opening 70 of the reflector 13 pushed into the housing 11 by the translucent cover 14 abuts on the substrate 50, and presses the substrate 50 against the substrate disposing portion 23.

  The order of assembling the lamp device 10 is not limited to such an order.

  Next, FIG. 4 shows an illumination device 90 using the lamp device 10. The lighting device 90 is, for example, a downlight. The lighting device 90 includes a fixture main body 91, a socket 92, and the lamp device 10.

  The device main body 91 is opened downward and is also configured as a reflector.

  The socket 92 includes a socket main body 93 and terminals accommodated in the socket main body 93. The socket body 93 is made of an insulating resin and is formed in an annular shape, and an insertion hole 94 through which the protruding portion 27 of the lamp device 10 is inserted is formed in the center.

  On the lower surface of the socket body 93, a pair of connection holes 95 which are inserted and rotated by inserting the respective electrode pins 21 of the lamp device 10 are formed symmetrically with respect to the center of the socket 92. Each of the connection holes 95 is a long hole extending along the circumferential direction of the socket body 93, and an insertion hole 96 through which the large-diameter portion 48 of the electrode pin 21 can be inserted is formed at one end. Inside each connection hole 95, a terminal to which the electrode pin 21 inserted into the connection hole 95 is electrically connected is accommodated.

  A substantially L-shaped key formed on the outer peripheral surface of the protruding portion 27 of the base 22 as the electrode pin 21 of the base 22 is inserted into the connection hole 95 and rotated on the inner peripheral surface of the socket body 93. A key 97 protruding from the groove 42 for supporting the base 22 on the socket body 93 is provided.

  Then, in a state where the lamp device 10 is mounted on the socket 92, by supplying AC power to the power supply circuit 52 through the terminal of the socket 92 and the electrode pin 21 of the lamp device 10, the power supply circuit 52 converts the AC power into a predetermined DC power. Is supplied to the light emitting element 51, and the light emitting element 51 emits light.

  The light of the light emitting element 51 passes through the reflector 13 and passes through the translucent cover 14 to irradiate the illumination space.

  The heat generated by the light emitting element 51 during light emission is mainly conducted to the substrate 50, and is conducted from the substrate 50 to the metal plate 29 of the housing 11 through the heat conducting member 35. The heat conducted from the substrate 50 at the center of the metal plate 29 is diffused in the radial direction of the metal plate 29, and is conducted from the metal plate 29 to the resin portion 30 in the entire area of the metal plate 29. Thereby, the heat conducted to the resin part 30 is radiated from the surface of the resin part 30 into the air. Further, since the base 22 is connected to the socket 92, heat is also radiated from the base 22 to the socket 92 side.

  In the lamp device 10 of the present embodiment, the substrate disposing portion 23 of the housing 11 corresponds to a portion between the central region (light emitting element mounting region 56) and the peripheral region (circuit component mounting region 57) of the substrate 50. In order to dispose the substrate 50 on the annular protrusion 31, a power supply circuit 52 provided in a peripheral area (circuit component mounting area 57) of the substrate 50 is provided. By increasing the distance between the power supply circuit 52 and the metal plate 29 of the housing 11, insulation of the power supply circuit 52 of the substrate 50 can be ensured.

  Further, by filling the inside of the annular protrusion 31 with the heat conductive member 35, the heat dissipation of the light emitting element 51 can be ensured, the amount of the heat conductive member 35 used can be reduced, and the lamp device 10 can be manufactured at low cost. it can.

  In addition, the groove 34 of the annular projection 31 makes it possible to make the outflow point of the heat conduction member 35 when the substrate 50 is pressed against the housing 11 side constant, and the substrate 50 is opposed to the groove 34. By providing the window portion 59, it can be confirmed that the heat conduction member 35 is filled. That is, since the substrate disposing portion 23 of the housing 11 is covered by the substrate 50, it is not possible to confirm whether or not the heat conducting member 35 is filled if the substrate 50 does not have the window portion 59. Since the substrate 50 has the window 59, it is possible to check whether or not the heat conductive member 35 is filled through the window 59, and it is possible to determine the quality of the lamp device 10.

  In addition, since the metal plate 29 is not linearly bent between the substrate disposing portion 23 and the annular portion 24, but is bent corresponding to the annular protrusion 31, that is, since the metal plate portion 29b is provided. In addition, the surface area of the metal plate 29 is increased, and the heat dissipation can be improved.

  Further, inside the annular portion 24 of the housing 11, the resin portion 30 is provided with an elongated hole 37 along the circumferential direction of the annular portion 24 to expose the metal plate 29. The heat generated by the light emitting element 51 and the power supply circuit 52 can be radiated.

  Note that the configuration of the present embodiment is not limited to a lamp device having a GX53 type base, but can also be applied to a lamp device having a GH76p type base or a GH69h type base.

  Although several embodiments of the present invention have been described, these embodiments are provided by way of example and are not intended to limit the scope of the invention. These new embodiments can be implemented in other various forms, and various omissions, replacements, and changes can be made without departing from the spirit of the invention. These embodiments and their modifications are included in the scope and gist of the invention, and are also included in the invention described in the claims and their equivalents.

10 Lamp unit
11 housing
12 Light emitting module
20 Main unit
22 base
23 Board Arrangement
29 Metal plate
30 Resin section
31 Annular protrusion
33 Installation surface
34 Groove
35 Thermal conductive material
50 substrates
51 Light emitting element
52 Power supply circuit
59 Window
90 Lighting equipment
92 socket

Claims (2)

A light emitting module having a substrate, a light emitting element mounted in a central region of the substrate, and a power supply circuit provided in a peripheral region of the substrate;
A main body having a metal plate and a resin portion provided on the surface of the metal plate, a base provided at one end of the main body, and a substrate arrangement provided at the other end of the main body and arranging the substrate; An annular projection which is annularly projected from the resin portion between the central region and the peripheral region of the substrate, the annular portion being provided at the substrate disposing portion. A housing in which the metal plate is exposed inside;
A heat conducting member that is filled inside the annular protrusion and is in contact with the substrate and the metal plate, respectively;
Equipped with,
The annular protrusion has an arrangement surface for disposing the substrate on a tip end surface protruding from the main body, and has a groove provided on a part of the arrangement surface and communicating with the inside of the annular protrusion. And
The substrate includes a lamp unit, characterized by have a window that opens in opposition to the grooves. 1 SL and mounting of the lamp device according to claim;
A socket for mounting the base of the lamp device;
A lighting device comprising:

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