JP6652844B2 - Multilayer board for air pump and electronic circuit board for air pump - Google Patents

Description

The present invention relates to a multilayer board for an air pump and an electronic circuit board for an air pump .

  There is an electronic circuit board on which electronic components including heating elements such as power transistors and rectifier diodes are mounted. In such an electronic circuit board, the heat dissipation of the heat generated in the heating element is enhanced. Patent Document 1 discloses that these heat generating elements are provided with radiating fins (heat sinks) or are brought into direct contact with a housing or the like of a device (hereinafter, also referred to as a “target device”) on which an electronic circuit board is mounted. To improve heat dissipation.

JP 2000-299564 A

  However, in the heat dissipating method in which the heat dissipating fins are attached to the heat generating element, the size of the entire electronic circuit board becomes large, and it may not be possible to store the electronic circuit board in the housing of the target device. On the other hand, in the heat radiation method in which the heat generating element is brought into direct contact with the housing or the like of the target device, it takes time and effort to adjust the electronic circuit board to come into contact with the housing at the time of assembly, resulting in poor workability. In some cases, it is necessary to perform a process such as molding due to a difference between the polarity of the heating element and the polarity of the housing. In this case, heat radiation is poor.

Therefore, an object of the present invention is to provide a multilayer board for an air pump and an electronic circuit board for an air pump that can improve the heat dissipation and the workability at the time of attachment to the air pump .

The multilayer substrate for an air pump of the present invention is a multilayer substrate for an air pump, which is stored in a housing in which the air pump is stored, and has a front surface and a back surface opposite to the front surface, and a core layer made of an insulating member. A first thermal conductive layer disposed on the surface side of the core layer and formed of a material having thermal conductivity, and a first insulating layer made of a material having thermal conductivity and insulating property with respect to the first thermal conductive layer. The first wiring layer formed of a material having thermal conductivity and conductivity and arranged on the back surface side of the core layer, which is formed of a material having thermal conductivity and conductivity, and has heat conductivity and conductivity. A second wiring layer formed from a material having a second insulating layer made of a material having thermal conductivity and insulating properties, and formed as an outermost layer on the back surface side of the core layer. Formed of a material having thermal conductivity, arranged through A second heat conductive layer, a first insulating layer, a first heat conductive layer, and a first connection portion that penetrates the core layer and thermally and electrically connects the first wiring layer and the second wiring layer. And a second connection portion penetrating the core layer, the second wiring layer, and the second insulating layer, and thermally connecting the first heat conductive layer and the second heat conductive layer, and a thread groove on a peripheral surface. e Bei a fixed portion, a with the formed threaded hole, the first connecting portion, the core layer, the first thermally conductive layer, the first wiring layer, the second wiring layer, and a second thermally conductive layer is laminated The electronic component is disposed so as to sandwich the electronic component in a plan view as viewed from the stacking direction, and the second heat conductive layer is a region overlapping the electronic component connected to the first wiring layer in a planar view, and the first heat conductive layer in the planar view. The first connection to the thermal pad, which is located in the area sandwiched by the connection portions and has no resist applied thereto, and the thermal pad in plan view And an absorbent layer on which a resist is applied. The convex portion and the fixing portion are fixed by screws so that the and the absorbing layer are separated from each other.

Electronic circuit board for the air pump of the present invention includes a multilayer substrate for said air pump, and an electronic component disposed in an electrically connected state to the first wiring layer in a multilayer substrate for the air pump, the.

According to the multi-layer board for an air pump and the electronic circuit board for an air pump having this configuration, heat generated in the heating element of the electronic component is transferred to the second wiring layer via the first wiring layer and the first connection portion. At the same time, heat is transferred to the first heat conductive layer via the first insulating layer. That is, another heat transfer path is formed in addition to the first connection portion, so that heat dissipation can be improved. More specifically, the heat transferred to the first heat conductive layer via the first insulating layer is diffused and radiated throughout the substrate, and the outermost layer on the back side of the core layer via the second connection portion. The heat is transferred to the second heat conductive layer formed on the second heat conductive layer. Further, the heat transferred to the second wiring layer via the first connection portion is transferred to the second heat conductive layer via the second insulating layer. And since the second heat conductive layer is formed as the outermost layer on the side opposite to the side where the electronic components are arranged, it is easy to make direct contact with the housing or the like. That is, in the multi-layer board for the air pump , the mounting to the air pump for improving the heat radiation is facilitated. As a result, heat dissipation can be improved, and workability at the time of attachment to the air pump can be improved.

In the multilayer substrate for an air pump according to the present invention, the second heat conductive layer may be provided with a fixing portion for heat-transferably fixing to the housing of the air pump .

In the multilayer board for an air pump having this configuration, the workability is improved because the air pump can be more easily attached to the housing.

In the multilayer board for an air pump of the present invention, the first heat conductive layer may be arranged so as to overlap with the electronic component in the plan view.

In the multilayer board for an air pump having this configuration, heat generated in the electronic component is effectively conducted to the first heat conduction layer, so that the heat radiation performance can be further improved.

In the multilayer board for an air pump of the present invention, in the above-described plan view, the first heat conductive layer may be arranged so as not to overlap with the transmitting element and / or the microcomputer among the electronic components.

Some electronic components are susceptible to heat. There is a demand for such electronic components to transmit as little heat as possible. In the multi-layer substrate for an air pump having this configuration, since heat transfer from the first heat conductive layer via the first insulating layer can be suppressed, the effect of heat on the electronic component can be suppressed.

  The heat dissipation can be improved, and the workability at the time of attachment to the target device can be improved.

It is the top view which looked at the multilayer substrate of one embodiment from the surface side. It is a sectional view of a multilayer substrate of one embodiment. FIG. 3 is a plan view of a first heat conductive layer in the multilayer substrate of FIG. 2 as viewed from a front surface side. FIG. 3 is a plan view of a second wiring layer in the multilayer substrate of FIG. 2 as viewed from a back surface side. FIG. 3 is a plan view of a second heat conductive layer in the multilayer substrate of FIG. 2 as viewed from a back surface side. It is sectional drawing which showed the attachment structure of the electronic circuit board and housing | casing of one Embodiment.

  Hereinafter, an electronic circuit board 1 including a multilayer board 20 according to one embodiment will be described with reference to the drawings. In the description of the drawings, the same elements will be denoted by the same reference symbols, without redundant description. The dimensional ratios in the drawings do not always match those described. 1 and 3 to 5, the first connection part 43 and the second connection part 45 are omitted from illustration except for the periphery of the MOSFET 11 illustrated by the II-II cross section (FIG. 2).

  The electronic circuit board 1 of the present embodiment is, for example, a pump driving driver that executes various control processes of an air pump (target device), and is attached to a housing 91 of the air pump (see FIG. 6). As shown in FIGS. 1 and 2, the electronic circuit board 1 includes a multilayer substrate 20 having a front surface 20a and a back surface 20b, and an electronic component group 10 mounted on the front surface 20a of the multilayer substrate 20. .

  The electronic component group 10 mainly includes four MOSFETs (metal-oxide-semiconductor field-effect transistors) 11, 12, 13, and 14, a DC 24 V diode 15, a driver 16, a microcomputer and a transmitting element (crystal) 17, ,have. The MOSFETs 11, 12, 13, 14 and the diode 15 have a heating element that generates heat when energized.

  As shown in FIG. 2, the multilayer substrate 20 includes a core layer 51, a first heat conductive layer 31, a first wiring layer 23, a second wiring layer 61, and a second heat conductive layer 71. It is a laminated substrate. The core layer 51 is formed of an insulating resin.

  The first heat conductive layer 31 is formed on the surface 51a of the core layer 51, and is formed of a material having heat conductivity (for example, copper foil). As shown in FIG. 3, the first heat conductive layer 31 of the present embodiment is a plan view (hereinafter, simply referred to as a “plan view”) viewed from a direction orthogonal to the front surface 51 a and the back surface 51 b of the core layer 51. , Except for a portion 31A (hereinafter, also referred to as “opening 31A”) that overlaps the microcomputer and the transmitting element 17, it is disposed on the entire surface 51a of the core layer 51. The size of the opening 31 </ b> A in the plan view is the same as the size of the microcomputer and the transmitting element 17 or slightly larger than the size of the microcomputer and the transmitting element 17.

  As shown in FIGS. 1 and 2, the first insulating layer 21 is disposed on the surface 51 a side of the core layer 51 and is formed so as to cover the first heat conductive layer 31. In the present embodiment, the first insulating layer 21 is formed on the entire surface 51 a of the core layer 51 in plan view. The first insulating layer 21 is made of a material having thermal conductivity and insulating properties. An example of a material having thermal conductivity and insulating properties is a prepreg resin such as an epoxy resin. The prepreg resin may contain a filler such as alumina or silica which is excellent in electric insulation and heat dissipation. In the present embodiment, it is preferable that a filler for increasing thermal conductivity between the first wiring layer 23 on which the electronic components 11 to 17 are arranged and the first thermal conductive layer 31 is contained.

  The first wiring layer 23 is disposed on the first heat conductive layer 31 with the first insulating layer 21 interposed therebetween, and a conductor pattern to which the electronic component group 10 is connected is formed. In FIG. 1, detailed conductor patterns are not shown. The first wiring layer 23 is made of a material having heat conductivity and conductivity (for example, copper or aluminum), and has a surface coated with a resist. The first wiring layer 23 is not coated with the above-described resist, and includes lands on which the electronic components 11 to 17 are mounted, pads for inserting leads of the electronic components, and the like. Each of the electronic components 11 to 17 and the first wiring layer 23 are electrically connected. For example, the electronic components 11 to 17 are electrically connected to the first wiring layer 23 by directly soldering the pad portions of the first wiring layer 23 on which the above-described resist is not applied. .

  As shown in FIG. 4, the second wiring layer 61 is formed on the back surface 51 b of the core layer 51, and has a conductor pattern formed according to the arrangement of the electronic component group 10 connected to the first wiring layer 23. . The second wiring layer 61 is formed of a material having heat conductivity and conductivity (for example, copper or aluminum). In FIG. 4, illustration of a path connecting each electronic component is omitted.

  As shown in FIG. 2, the second insulating layer 81 is disposed on the back surface 51 b side of the core layer 51 and is formed so as to cover the second wiring layer 61. In the present embodiment, the second insulating layer 81 is formed on the entire back surface 51 b of the core layer 51 in plan view. The second insulating layer 81 is made of a material having thermal conductivity and insulating properties. An example of a material having thermal conductivity and insulating properties is a prepreg resin such as an epoxy resin. The prepreg resin may contain a filler such as alumina or silica which is excellent in electrical insulation and heat dissipation. In the present embodiment, it is preferable that a filler for increasing the thermal conductivity between the second wiring layer 61 and the second heat conductive layer 71 is contained.

  As shown in FIGS. 2 and 5, the second heat conductive layer 71 is formed as the outermost layer on the back surface 51 b side of the core layer 51. Further, the second heat conductive layer 71 is also a surface for fixing terminals of each electronic component by soldering. In the present embodiment, the second heat conductive layer 71 is disposed on the entire back surface 51b of the core layer 51 in plan view. The second heat conductive layer 71 is disposed on the second wiring layer 61 via the second insulating layer 81, and is formed of a material having thermal conductivity (for example, copper or aluminum). The second insulating layer 81 may be subjected to a copper plating process. The second heat conductive layer 71 has an absorbing layer 71A to which a resist is applied and a thermal pad 71B to which no resist is applied. In addition, the heat pad 71B to which the resist is not applied may be a second heat conductive layer 71 such as a copper foil having thermal conductivity, which may be coated with gold plating or a solder paste. Thereby, oxidation of the second heat conductive layer 71 can be prevented.

  The heat pad 71B has a higher heat dissipation effect than the absorption layer 71A because the resist is not applied. For this reason, it is preferable that the thermal pad 71B be disposed at a position where heat dissipation is desired to be enhanced in a plan view, that is, at a position that overlaps a position at which a heating element that generates a higher amount of heat is disposed. In the present embodiment, they are arranged at positions overlapping the MOSFETs 11, 12, 13, and 14 in plan view. The thermal pad 71B preferably has an area larger than the area of the MOSFETs 11, 12, 13, 14 and the diode 15 in plan view.

  The first connection part 43 penetrates through the first insulating layer 21, the first heat conductive layer 31, and the core layer 51, and thermally and electrically connects the first wiring layer 23 and the second wiring layer 61. . In the first connection portion 43, a through electrode 43b such as copper is formed on a wall surface of a through hole 43a penetrating the first insulating layer 21, the first heat conductive layer 31, and the core layer 51 in the thickness direction.

  The second connection part 45 penetrates the core layer 51, the second wiring layer 61, and the second insulating layer 81, and thermally connects the first heat conductive layer 31 and the second heat conductive layer 71. In the second connection portion 45, a through electrode 45b such as copper is formed on a wall surface of a through hole 45a penetrating the core layer 51, the second wiring layer 61, and the second insulating layer 81 in the thickness direction.

  As shown in FIG. 6, a fixing portion 77 for fixing to the housing 91 of the air pump is formed on the heat pad 71B of the second heat conductive layer 71. Specifically, the fixing portion 77 is formed in the core layer 51 and the through hole 77a penetrating the second heat conductive layer 71, the second insulating layer 81, and the second wiring layer 61, and has a thread groove on the peripheral surface. And a formed screw hole 77b.

  The housing 91 is an aluminum die-cast. The housing 91 has a fixed portion 93 that is convex on the side where the pump and the electronic circuit board 1 are stored as a position where the electronic circuit board 1 is fixed. The fixed portion 93 has an insertion hole 93a through which a fixing screw 97 is inserted. The electronic circuit board 1 is attached to the housing 91 by screws 97. More specifically, a screw 97 inserted into the insertion hole 93a from the outside of the housing 91 is screwed into the fixing portion 77, so that the heat pad 71B is fixed in a state of contacting the housing 91.

  Next, a method for supplying power to the electronic component and a method for heat exchange will be described in detail. When the heat radiation electrode is VDD, the output (discharge electrode) from the diode 15 is transmitted from the land 23A, which is the first wiring layer 23 immediately below the diode 15, via the first connection portion 43, as shown in FIGS. 24V DC is output to the diode area 61E of the second wiring layer 61. Similarly to the power output, the heat generated in the diode 15 is transferred from the land 23 </ b> A, which is the first wiring layer 23 immediately below the diode 15, to the diode in the second wiring layer 61 by utilizing heat conduction in the first connection portion 43. The heat is radiated to the area 61E.

  On the other hand, the MOSFET 11 (MOSFET 12) whose discharge electrode is VDD, which is the same as the diode 15, is provided between the MOSFET area 61A (MOSFET area 61B) of the second wiring layer 61 and immediately below the MOSFET 11 (MOSFET 11) of the first connection portion 43 and the first wiring layer 23. Is supplied via the land 23A (land 23B). The heat generated in the MOSFET 11 (MOSFET 12) is transferred from the land 23A (land 23B) immediately below the MOSFET 11 (MOSFET 12) in the first wiring layer 23 to the MOSFET in the second wiring layer 61 by utilizing heat conduction in the first connection portion 43. The heat is radiated to the area 61A (MOSFET area 61B).

  In the case where the heat radiation electrodes are the MOSFETs 13 and 14 of the drive output voltage of the pump, a MOSFET area 61C and a MOSFET area 61D are provided as areas of the second wiring layer 61 for radiating heat generated in the MOSFETs 13 and 14, respectively. I have. The heat generated in the MOSFET 13 (MOSFET 14) is transferred from the land 23C (land 23D) immediately below the MOSFET 13 (MOSFET 14) in the first wiring layer 23 to the MOSFET area 61C of the second wiring layer 61 by utilizing heat conduction in the first connection portion 43. (The MOSFET area 61D).

  As described above, two kinds of heat of the VDD system and the drive output system are transferred to the second wiring layer 61. In the present embodiment, the second heat conductive layer 71 is disposed on the second wiring layer 61 via the second insulating layer 81 formed of a prepreg material. The heat transferred to the second wiring layer 61 is transferred to the second heat conductive layer 71 while the insulating state is maintained by the second insulating layer 81.

  In the present embodiment, the first heat conductive layer 31 is disposed on the first wiring layer 23 via the first insulating layer 21 formed of a prepreg material. The heat transferred to the first wiring layer 23 is transferred to the first heat conductive layer 31 while the insulating state is maintained by the first insulating layer 21. The copper foil, which is the first heat conductive layer 31, is disposed on the entire surface of the multilayer substrate 20 so that heat is diffused to the entire multilayer substrate 20 except for a portion directly under the microcomputer and the transmitting element 17 that are easily affected by heat. Further, the first heat conductive layer 31 and the second heat conductive layer 71 that are insulated from each other are connected by the second connection part 45. The heat absorbed by the first heat conductive layer 31 is radiated to the second heat conductive layer 71 using the heat conduction of the second connection part 45. That is, the heat of the first heat conductive layer 31 absorbed by the heat exchange from the first wiring layer 23 is diffused throughout the multilayer substrate 20 and is radiated to the second heat conductive layer 71 by the second connection portion 45. . The first heat conductive layer 31 and the second heat conductive layer 71, which are insulated from each other, are connected to the casing 91 of the pump and have the same potential (pump GND).

  Almost the entire surface of the second heat conductive layer 71 is a copper foil having the above-mentioned pump GND potential. Thus, heat can be released from any part of the back surface 20b of the multilayer substrate 20 by bringing it into close contact with a substance having good thermal conductivity. In the present embodiment, since the thermal pad (copper or gold plating) is particularly disposed immediately below the MOSFETs 11 to 14, a heat radiation route that can radiate heat from the heat generating element serving as a heat source to the casing 91 of the pump in the shortest time is formed. A fixing portion 77 (substrate fixing hole) is provided in or around the thermal pad 71B, and is screwed to the casing 91 of the pump shown in FIG. Thereby, while improving the adhesiveness between the thermal pad 71B and the housing 91 to enhance the heat radiation, the attachment of the electronic circuit board 1 to the pump device can be easily completed.

  According to the electronic circuit board 1 of the embodiment, the heat generated in the heating elements of the MOSFETs 11 to 14 and the diode 15 is transferred to the second wiring layer 61 via the first wiring layer 23 and the first connection portion 43. At the same time, heat is transferred to the first heat conductive layer 31 via the first insulating layer 21. That is, another heat transfer path is formed in addition to the first connection portion 43, so that heat dissipation can be improved. Further, the heat transferred to the first heat conductive layer 31 via the first insulating layer 21 is diffused and radiated to the entire multilayer substrate 20, and the back surface 51 b of the core layer 51 via the second connecting portion 45. The heat is transferred to the second heat conductive layer 71 formed on the outermost layer on the side. The heat transferred to the second wiring layer 61 via the first connection portion 43 is transferred to the second heat conductive layer 71 via the second insulating layer 81. That is, even if the heat generated in the heating element is branched and transmitted to the first heat conductive layer 31 and the second wiring layer 61, a part of the heat is concentrated in the second heat conductive layer 71. You. The second heat conductive layer 71 is formed as the outermost layer on the side opposite to the side where the electronic component group 10 is arranged, so that it can be easily attached directly to the housing 91 or the like. That is, in the electronic circuit board 1, workability at the time of attachment to the pump can be improved. As a result, heat dissipation can be improved, and workability at the time of attachment to the pump can be improved.

  According to the electronic circuit board 1 of the above embodiment, since the heat pad 71B of the second heat conductive layer 71 is provided with the fixing portion 77 for heat transfer to the housing 91 of the pump, It becomes much easier to attach it to the housing 91 of the pump device.

  According to the electronic circuit board 1 of the above embodiment, the first heat conductive layer 31 is arranged so as to overlap the electronic component group 10 (the MOSFETs 11 to 14, the diode 15, and the driver 16) in plan view. Thereby, the heat generated in each of the electronic component groups 10 is effectively conducted to the first heat conductive layer 31, so that the heat radiation performance can be further improved.

  According to the electronic circuit board 1 of the above embodiment, the first heat conductive layer 31 is arranged so as not to overlap with the microcomputer and the transmitting element 17 in a plan view. Thus, heat transfer from the first heat conductive layer 31 via the first insulating layer 21 can be suppressed, so that the influence of heat on the microcomputer and the transmitting element 17 can be suppressed.

  As described above, one embodiment has been described, but the present invention is not limited to the above embodiment, and various changes can be made without departing from the spirit of the invention.

  In the above embodiment, the example in which the first heat conductive layer 31 is disposed directly above the surface 51a of the core layer 51 has been described, but the present invention is not limited to this. For example, a wiring layer having a conductor pattern for supplying power to the electronic component group 10 may be formed directly above the surface 51 a of the core layer 51. In this case, the first heat conductive layer may be disposed on the wiring layer via an insulating layer. Note that such a wiring layer may be formed not only in one layer but also in a plurality of layers. In the case where a plurality of wiring layers are formed as described above, the first heat conductive layer may be arranged so as to be sandwiched between these wiring layers while the insulating state is maintained.

  In the above embodiment, the example in which only one layer is disposed as the first heat conductive layer 31 has been described. However, the present invention is not limited to this, and may be formed as, for example, a plurality of continuous layers.

  In the above embodiment, the example in which the second wiring layer 61 is disposed immediately above the back surface 51b of the core layer 51 has been described, but the present invention is not limited to this. For example, a heat conductive layer capable of conducting heat from the first heat conductive layer 31 via the connection portion may be provided directly above the back surface 51b of the core layer 51. In this case, the second wiring layer 61 may be disposed on the heat conductive layer via an insulating layer.

  In the above embodiment, the first connection portion 43 has the through electrode 43b such as copper formed on the wall surface of the through hole 43a penetrating the first insulating layer 21, the first heat conductive layer 31, and the core layer 51 in the thickness direction. Although an example has been described, the inside of the through-hole 43a may be filled with a filler. Note that examples of the filler include resin, ceramic, metal, and the like, for example, epoxy resin. Similarly, in the second connection portion 45, a through electrode 45b such as copper is formed on a wall surface of a through hole 45a penetrating the core layer 51, the second wiring layer 61, and the second insulating layer 81 in the thickness direction. Although described using an example, the inside of the through-hole 45a may be filled with a filler. Note that examples of the filler include resin, ceramic, metal, and the like, for example, epoxy resin.

  In the above embodiment, the example in which the absorption layer 71A and the thermal pad 71B having different thermal conductivities are arranged as the second thermal conductive layer 71 has been described. However, either one is disposed on the entire back surface 20b of the multilayer substrate 20. It may be arranged.

  In the above embodiment, MOSFETs, diodes, and the like have been described as examples of electronic components having a heating element. However, power elements other than MOSFETs, LEDs (Light Emitting Diodes), amplifiers that generate heat when energized, and the like are arranged. You may.

  The various embodiments and modifications described above may be combined in various ways without departing from the spirit of the present invention.

  DESCRIPTION OF SYMBOLS 1 ... Electronic circuit board, 10 ... Electronic component group, 11-14 ... MOSFET (electronic component), 15 ... Diode (electronic component), 16 ... Driver (electronic component), 17 ... Microcomputer and transmission element (electronic component), 20 ... multilayer board, 21 ... first insulating layer, 23 ... first wiring layer, 31 ... first heat conductive layer, 43 ... first connecting part, 45 ... second connecting part, 51 ... core layer, 51a ... surface, 51b ... Back side, 61... Second wiring layer, 71... Second thermal conductive layer, 71A... Absorption layer, 71B... Thermal pad, 77... Fixing part, 81.

Claims (4)

A multilayer board for the air pump, which is stored in a housing in which the air pump is stored,
Having a front surface and a back surface opposite to the front surface, a core layer made of an insulating member,
A first heat conductive layer disposed on the surface side of the core layer and formed of a material having thermal conductivity,
The first heat conductive layer is disposed via a first insulating layer made of a material having heat conductivity and insulation, and is formed of a material having heat conductivity and conductivity, and is connected to an electronic component. A first wiring layer to be
A second wiring layer disposed on the back side of the core layer and formed from a material having thermal conductivity and conductivity,
The core layer is formed as the outermost layer on the back surface side, and is disposed on the second wiring layer via a second insulating layer made of a material having thermal conductivity and insulating properties. A second heat conductive layer formed of a material having,
A first connection portion that penetrates the first insulating layer, the first heat conductive layer, and the core layer, and thermally and electrically connects the first wiring layer and the second wiring layer;
A second connection portion penetrating the core layer, the second wiring layer, and the second insulating layer, and thermally connecting the first heat conductive layer and the second heat conductive layer,
A fixing portion having a screw hole with a screw groove formed on a peripheral surface,
Bei to give a,
The first connection portion is the core layer, the first heat conductive layer, the first wiring layer, the second wiring layer, and a plan view viewed from a stacking direction in which the second heat conductive layer is stacked. , Is arranged to sandwich the electronic component,
The second heat conductive layer,
A thermal pad that is arranged in a region overlapping with the electronic component connected to the first wiring layer in the plan view and in a region sandwiched between the first connection portions in the plan view, and is not coated with a resist,
An absorption layer that is disposed so as to sandwich the first connection portion with respect to the thermal pad in the plan view, and that the resist is applied,
Has,
The projecting portion and the fixing portion are fixed such that the projecting portion protruding toward the area where the air pump is stored in the housing is in contact with the thermal pad, and the housing is separated from the absorbing layer. A multilayer board for an air pump, whose parts are fixed by screws . Prior Kitaira plane view, the first thermally conductive layer, the are arranged so as to overlap the electronic component, a multilayer substrate for the air pump of claim 1 Symbol placement. Prior Kitaira plane view, the first thermally conductive layer, the are arranged so as not to overlap with the transmitter element and / or the microcomputer of the electronic component, a multilayer substrate for the air pump of claim 1 or 2, wherein. A multilayer substrate for an air pump according to any one of claims 1 to 3 ,
An electronic component arranged in a state electrically connected to the first wiring layer in the multilayer substrate for the air pump .

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