JP6654975B2 - Supporting device and supporting method - Google Patents

Description

  The present invention relates to a supporting device and a supporting method.

  Conventionally, an adherend support means for supporting an adherend to which an adhesive sheet having a size protruding from the adherend surface is attached, and provided at a predetermined interval outside the adherend support means, 2. Description of the Related Art There is known a supporting device including sheet supporting means for supporting a protruding portion of an adhesive sheet protruding from an adherend surface, and adhesion releasing means for releasing adhesion between an adherend supporting means and an adherend (for example, And Patent Document 1).

JP 2014-241331 A

  However, in a conventional supporting device described in Patent Document 1, gas is present in a contact area between a semiconductor wafer (hereinafter, also simply referred to as a “wafer”) (adherend) and a support surface (adherend support means). Is retained so that the adherence between the adherend support means and the adherend is released. Depending on the outer edge shape and characteristics of the adherend, the outer edge of the adherend and the support surface may be used. And the gas cannot flow out to the outside from the portion to be retained in the contact area, and the adherence between the adherend supporting means and the adherend cannot be released. .

  An object of the present invention is to provide a supporting device and a supporting method capable of reliably releasing the adherence between the adherend supporting means and the adherend.

  In order to achieve the above object, a support device of the present invention includes an adherend supporting means for supporting an adherend to which an adhesive sheet having a size protruding from an adherend surface is attached, and an outside of the adherend support means. Is provided at a predetermined interval, and a sheet supporting means for supporting a protruding portion of the adhesive sheet protruding from the adherend surface of the adherend, and a close contact between the adherend support means and the adherend. A contact releasing means for releasing, the closing releasing means closing the gap between the adherend supporting means and the sheet supporting means, the closing means, the sheet supporting means, the protruding portion And an internal pressure increasing means for increasing the internal pressure of a sealed space formed by the adherend and the adherend supporting means, wherein the internal pressure increasing means increases the internal pressure of the sealed space and the adherend supporting means And the adherend To cancel the close contact, it has adopted the configuration that.

  At this time, in the support device of the present invention, it is preferable that the closing unit includes a sealing member that elastically deforms to close the gap.

  On the other hand, the supporting method of the present invention comprises: an adherend supporting step of supporting an adherend on which an adhesive sheet having a size protruding from an adherend surface is adhered by an adherend supporting means; A sheet support step of supporting a protruding portion of the adherend that protrudes from the adherend surface with sheet support means provided at a predetermined interval, and contact between the adherend support means and the adherend. A closing step of closing a gap between the adherend supporting means and the sheet supporting means with a closing means, the closing means, and the sheet supporting means. An internal pressure increasing step of increasing an internal pressure of a sealed space formed by the protruding portion, the adherend, and the adherend supporting means, wherein the internal pressure of the sealed space is increased by the internal pressure increasing step. Body support means and said To release the adhesion to the adherend, it has adopted the configuration that.

  According to the present invention as described above, the internal pressure of the closed space formed by the closing means, the sheet support means, the protruding portion, the adherend, and the adherend support means is increased, and the adherend support means and the adherend are raised. Since the close contact with the body is released, the tightness of the closed space does not become insufficient due to the outer edge shape and characteristics of the adherend, and the close contact between the adherend support means and the adherend is reliably released. Can be.

  At this time, if the closing means is provided with a sealing member for closing the gap by elastically deforming, the sealing property of the gap can be improved.

The side view of the sheet sticking apparatus concerning one embodiment of the present invention. (A), (B) is operation | movement explanatory drawing of a sheet sticking apparatus. (A), (B) is a side view which concerns on the modification of this invention.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
In this embodiment, the X axis, the Y axis, and the Z axis are orthogonal to each other. The X axis and the Y axis are axes within a predetermined plane, and the Z axis is an axis orthogonal to the predetermined plane. I do. Furthermore, in the present embodiment, based on the case of viewing from the near side in FIG. 1 parallel to the Y axis, when the direction is indicated, “up” is the arrow direction of the Z axis, “down” is the opposite direction, The left is the direction of the arrow on the X axis, the right is the opposite direction, the front is the front direction in FIG. 1 parallel to the Y axis, and the rear is the opposite direction.

  In FIG. 1, a sheet sticking device 10 includes a support device 20 that supports a wafer WF as an adherend, a sticking unit 30 that presses and bonds an adhesive sheet AS to the wafer WF, a support device 20, and a sticking unit 30. And a linear motor 41 as a driving device for supporting the support device 20 with a slider 41A.

The support device 20 has a linear motor 22 as a driving device supported on a frame 21 supported by a slider 41A, and an adhesive sheet AS supported by an output shaft 22A and protruding from an adherend surface WF1. Is supported on the frame 21 via a bracket 21A, and is provided at a predetermined interval outside the adherend support means 23. The apparatus includes sheet support means 24 for supporting the protruding portion AS1 of the adhesive sheet AS protruding from the adherend surface WF1, and adhesion releasing means 25 for releasing the adherence between the adherend support means 23 and the wafer WF.
The adherend support means 23 is formed of a circular member as viewed from above having a plurality of through holes 23B on a wafer support surface 23A for supporting the wafer WF, and holds the wafer WF via a pipe 23C communicating with the through holes 23B. A decompression unit 23D as a holding unit such as a decompression pump or a vacuum ejector is connected.
The sheet support means 24 includes a ring frame RF and a ring-shaped member having a plurality of through holes 24B in a frame support surface 24A that supports the ring frame RF, and a pipe 24C communicating with the through holes 24B. A decompression unit 24D as a holding unit such as a decompression pump or a vacuum ejector that holds the ring frame RF is connected through the intermediary.
The adhesion releasing means 25 includes a closing means 25A for closing the gap GA between the adherend supporting means 23 and the sheet supporting means 24, a closing means 25A, the sheet supporting means 24, the protruding portion AS1, the wafer WF, and the Internal pressure increasing means 25B for increasing the internal pressure of the sealed space SC (see FIG. 2) formed by the body supporting means 23, and the adherend support means 23 and the wafer are increased by increasing the internal pressure of the sealed space SC by the internal pressure increasing means 25B. The contact with the WF is released.
The closing means 25A includes a linear motor 25C as a driving device supported on the frame 21, a plate 25E supported on an output shaft 25D thereof, and an elastic member supported on the plate 25E, such as rubber or resin. And a sealing member 25 </ b> F having an annular shape in a top view that elastically deforms and closes the gap GA.
The internal pressure increasing means 25B includes a pressure means 25H such as a pressure pump or a turbine for sending air AR between the wafer WF and the wafer support surface 23A through a pipe 25G communicating with the through hole 23B.

  The sticking means 30 includes a support roller 31 for supporting the raw sheet RS on which the adhesive sheet AS is temporarily attached to the release sheet RL, a guide roller 32 for guiding the raw sheet RS, and turning the release sheet RL back from the release sheet RL. A peeling plate 33 as peeling means for peeling the adhesive sheet AS, a pressing roller 34 as pressing means for pressing and bonding the adhesive sheet AS to the wafer WF, and a pinch roller driven by a rotating motor 35A as driving equipment And a recovery roller 37 for recovering the release sheet RL.

A procedure for forming the integrated object WK in the above-described sheet sticking apparatus 10 will be described.
First, after the operator sets the raw sheet RS as shown in FIG. 1 on the sheet sticking apparatus 10 indicated by solid lines in FIG. An automatic operation start signal is input via the input means. Then, as shown by solid lines in FIG. 1, a worker or a transfer means (not shown) such as an articulated robot or a belt conveyor places the wafer WF and the ring frame RF on the adherend support means 23 and the sheet support means 24, respectively. Then, the support device 20 drives the decompression units 23D and 24D, and starts suction holding of the wafer WF and the ring frame RF on the wafer support surface 23A and the frame support surface 24A, respectively. Next, when it is detected by a detection unit (not shown) such as an optical sensor or an imaging unit that the upper surfaces of the wafer WF and the ring frame RF are not located on the same plane, the support device 20 drives the linear motor 22 and Are adjusted so that are positioned on the same plane.

  Thereafter, the moving means 40 drives the linear motor 41 to move the support device 20 to the left, and when the support device 20 reaches a predetermined position is detected by a not-shown detection means such as an optical sensor or an imaging means. Then, the attaching means 30 drives the rotation motor 35A, and feeds out the raw sheet RS such that the adhesive sheet AS is supplied to the left at the same speed as the moving speed of the support device 20 to the left. As a result, the adhesive sheet AS is peeled off from the release sheet RL by the release plate 33, and is pressed and adhered to the wafer WF and the ring frame RF by the pressing roller 34 to form an integral body WK. When the support device 20 reaches a predetermined position on the left side of the pressing roller 34 after the formation of the integral body WK, the moving unit 40 and the support device 20 stop driving the linear motor 41 and the pressure reducing unit 23D. Thereafter, the support device 20 drives the linear motor 25C, and as shown in FIG. 2A, raises the sealing member 25F to close the gap GA between the adherend support means 23 and the sheet support means 24. The closed space SC is formed. When the gap GA is closed, since the sealing member 25F is elastically deformed, even if there is a step between the bottom surface of the adherend support means 23 and the bottom surface of the sheet support means 24, or if the bottom surfaces are rough, The airtightness of the closed space SC does not decrease.

  Next, the support device 20 drives the pressurizing unit 25H to send air AR between the wafer WF and the wafer support surface 23A to release the close contact between the adherend support unit 23 and the wafer WF. At this time, if the supplied air AR flows out only from a part between the wafer support surface 23A and the wafer WF and leaks to the atmosphere through the gap GA, the adherend support means 23 and the wafer WF However, in the present embodiment, since the closed space SC is formed by closing the gap GA, the air AR that is going to leak into the atmosphere is not removed. It can stay in the closed space SC. As a result, the internal pressure of the sealed space SC rises, and the protruding portion AS1 of the adhesive sheet AS is deformed so as to expand upward, and as shown in FIG. The close contact of the entire contact portion in contact with the wafer WF is released. When the release of the entire contact portion is detected by a detection unit (not shown) such as an optical sensor or an imaging unit, the support device 20 stops driving the pressing unit 25H, and then drives the linear motor 25C. By lowering the sealing member 25F, the wafer WF is mounted again on the wafer support surface 23A.

  Next, after the supporting device 20 stops the driving of the decompression means 24D and the conveying means (not shown) conveys the integrated object WK to the next step, each means drives each driving device to return each member to the initial position. Thereafter, the same operation as described above is repeated.

  According to the above-described embodiment, the inner pressure of the closed space SC formed by the closing means 25A, the sheet supporting means 24, the protruding portion AS1, the wafer WF, and the adherend supporting means 23 is increased to support the adherend. Since the close contact between the means 23 and the wafer WF is released, the hermeticity of the sealed space SC is not insufficient due to the outer edge shape and characteristics of the wafer WF, and the close contact between the adherend support means 23 and the wafer WF is ensured. Can be canceled.

  As described above, the best configuration and method for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this. That is, although the present invention has been particularly shown and described with particular reference to particular embodiments, without departing from the spirit and scope of the invention, the shape, Those skilled in the art can make various modifications in materials, quantities, and other detailed configurations. In addition, the description in which the shapes, materials, and the like disclosed above are limited is merely an example for facilitating the understanding of the present invention, and does not limit the present invention. The description by the name of the member excluding some or all of the limitations such as is included in the present invention.

  For example, as shown in FIG. 3 (A), the support device 20 may be provided in place of or in combination with the closing means 25A on an annular plate 26C, which is provided below the gap GA, in an annular shape when viewed from above. And a pressurizing pump for sending air between the plate 26C and the sealing member 26D via a through hole 26E and a pipe 26F formed in the plate 26C, and a sealing member 26D having an annular shape as viewed from above, the outer edges of which are supported. A closing means 26A having a pressurizing means 26G such as a gas turbine or a turbine is employed, or the upper and lower ends of the sheet supporting means 24 are supported on the inner peripheral surface thereof as shown in FIG. An air supply between the inner peripheral surface of the sheet support means 24 and the sealing member 27C through the through-hole 27D and the pipe 27E formed in the annularly-shaped sealing member 27C in a top view and the sheet support means 24. The closing means 27A that includes a pressurizing means 27F pumps and turbines, etc. to or employed, the sealing member 26D and 27C is expanded may be to close the gap GA. The sealing member 27C shown in FIG. 3B is supported on the outer peripheral surface of the adherend support means 23, and the adherend support means is provided through a through hole and a pipe (not shown) formed in the adherend support means 23. A closing means (not shown) for closing the gap GA by sending air between the outer peripheral surface of the sealing member 23 and the sealing member 27C may be adopted.

  The support device 20 does not need to raise and lower the adherend support means 23, and employs a driving device that raises and lowers the sheet support means 24 even when the adherend support means 23 is not lifted or lowered, and The upper surfaces of the WF and the ring frame RF may be configured to be located on the same plane, or after the adherence of the entire contact portion where the adherend supporting means 23 and the wafer WF are in contact with each other, is released. The body support means 23 and the wafer WF are relatively moved to place the wafer WF on the wafer support surface 23A again, and then the sealing member 25F is lowered to prevent the wafer WF from being impacted. Alternatively, the upper surfaces of the wafer WF and the ring frame RF do not have to be located on the same plane. It may be no detection means for detecting the upper surface position of al, may support the wafer WF to advance the adhesive sheet AS is attached, in this case, bonding means 30 and the moving means 40 may be omitted.

  The adherend supporting means 23 may be polygonal, elliptical, or any other shape having a triangle or more when viewed from above, or when the through-hole 23B is unnecessary when the pressure reducing means 23D is not used as the holding means. The through hole 23B may not be provided.

  The seat support means 24 may directly support the protruding portion AS1 on the frame support surface 24A without using the ring frame RF as a component, or may use another member other than the ring frame RF as a component, and May be supported via a protrusion, a polygonal ring having a triangle or more in a top view, an elliptical ring, or a ring having another shape may be supported, and the decompression means 24D is not used as the holding means. When the through hole 24B is unnecessary in a case or the like, the through hole 24B may not be provided, and the shape of the ring frame RF or another member replacing the ring frame RF may be a polygonal ring, a circle or a circle having a triangle or more in a top view. It may be an elliptical ring, a ring of any other shape, a ring that is not circular, or the like, or a portion AS protruding toward the sheet support means 24 from above the protruding portion AS1. It may be provided sheet auxiliary supporting means for supporting and pressing a.

  The closing means 25A may move the adherend supporting means 23 and the sheet supporting means 24 while closing or moving the sealing member 25F to close the gap GA. Before or in parallel with the application of the adhesive sheet AS, the gap GA may be closed, or an elastically deformable member such as rubber or soft resin may be adopted as the sealing members 25F, 26D, and 27C. In place of the sealing members 25F, 26D, and 27C, a member that is not elastically deformed, such as a metal or a hard resin, may be employed, the plate 25E may not be provided, and the members that expand the sealing members 26D and 27C may be: It may be air, a gas such as a single gas or a mixed gas, a liquid such as water or oil, a fluid or a solid such as a gel, a plate 25E or 26C, or a sealing member 25F or 2F. D and 27C are viewed from a circular annular, or polygonal annular triangular, oval annular, may be cyclic other shapes.

  The internal pressure increasing means 25B is used in place of or in combination with the pressurizing means 25H, between the wafer WF and the wafer support surface 23A, a gas such as air, a single gas or a mixed gas, a liquid such as water or oil, or a gel. A fluid such as a body may be sent, or the sealed space SC may not be directly between the wafer WF and the wafer supporting surface 23A but may be directly from the outer peripheral surface of the adherend supporting means 23 or the inner peripheral surface of the sheet supporting means 24, for example. The above-mentioned air, gas, liquid, gel-like body or solid may be sent to increase the internal pressure.

  The sticking means 30 is configured such that a closed loop-shaped cut is formed in the band-shaped adhesive sheet base material to form an adhesive sheet AS on the inside, and a plurality of adhesive sheets AS are temporarily formed at predetermined intervals into a release sheet RL. The attached web may be unwound, or when a web in which a strip-shaped adhesive sheet substrate is temporarily attached to the release sheet RL is employed, a cutting means forms a closed loop cut in the adhesive sheet substrate. Then, the adhesive sheet AS may be formed inside the cut, or the band-shaped adhesive sheet base may be attached to the wafer WF and the ring frame RF, and then the adhesive sheet base may be cut into the adhesive sheet base by cutting means. May be formed, and the adhesive sheet AS may be formed inside the cut, or when the adhesive sheet AS is pasted to the wafer WF and the ring frame RF by another device to form the integrated body WK, Good.

  The moving unit 40 may fix the position of the support device 20, or may move the sticking unit 30 while moving the sticking unit 30, and may or may not stick the adhesive sheet AS to the wafer WF by the sticking unit 30. Good.

  The material, type, shape, and the like of the adhesive sheet AS and the adherend are not particularly limited. For example, the adhesive sheet AS may have a circular shape, an elliptical shape, a polygonal shape such as a triangle or a quadrangle, or other shapes, or may have an adhesive form such as pressure-sensitive adhesiveness or heat-sensitive adhesiveness. When the heat-sensitive adhesive sheet AS is employed, it may be bonded by an appropriate method such as providing a suitable coil heater for heating the adhesive sheet AS or a heating means such as a heating side of a heat pipe. Further, such an adhesive sheet AS is, for example, a single layer having only an adhesive layer, a sheet having an intermediate layer between the base sheet and the adhesive layer, and having a cover layer on the upper surface of the base sheet. Three or more layers, furthermore, a so-called double-sided adhesive sheet capable of peeling the base sheet from the adhesive layer may be used, and the double-sided adhesive sheet may be a single-layer or multilayer intermediate layer. It may have a single layer or multiple layers without an intermediate layer. Examples of the adherend include foods, resin containers, semiconductor wafers such as silicon semiconductor wafers and compound semiconductor wafers, circuit boards, information recording substrates such as optical discs, glass plates, steel plates, pottery, wood plates, resin plates, and the like. Any form of member or article can be targeted. It should be noted that the adhesive sheet AS may be replaced with a functional or application-specific reading method. An arbitrary sheet, film, tape, or the like having a shape can be attached to any object to be processed as described above.

The means and steps in the present invention are not limited in any way as long as they can perform the operations, functions or steps described for the means and steps, much less the constituents of only one embodiment shown in the above embodiment and There is no limitation to the process at all. For example, the adherend supporting means is capable of supporting the adherend to which the adhesive sheet having a size protruding from the adherend surface of the adherend is attached, in light of the common general technical knowledge at the time of filing the application. There is no limitation as long as it is within the range (the description of other means and steps is omitted).
Further, the driving device in the above embodiment includes a rotating motor, a linear motion motor, a linear motor, a single-axis robot, an electric device such as an articulated robot, an actuator such as an air cylinder, a hydraulic cylinder, a rodless cylinder, and a rotary cylinder. In addition to those that can be employed, those obtained by directly or indirectly combining them may be employed (some may overlap with those exemplified in the embodiment).
In the above-described embodiment, when rollers are employed, a driving device that rotationally drives each roller may be provided, or the surface of each roller may be formed of an elastically deformable member such as rubber or resin. However, each roller may be configured by a member that does not elastically deform, or when a pressing unit or a pressing member such as a pressing roller or a pressing head is employed, the roller may be used instead of or in combination with the above examples. , A pressing member such as a round bar, a blade material, rubber, resin, sponge, or the like, or a configuration in which the pressing is performed by blowing air such as air or gas, or a pressing unit or a pressing member may be used. The portion may be made of a member that can be elastically deformed, such as rubber or resin, or may be made of a member that is not elastically deformed. When a peeling means or a peeling member is employed, a round bar or a roller is used. Etc. When a structure that supports or holds a supported member such as a supporting (holding) means or a supporting (holding) member is employed, a gripping means such as a mechanical chuck or a chuck cylinder, Coulomb force, an adhesive, or an adhesive , A magnetic force, Bernoulli suction, a device for supporting (holding) a supported member by a driving device, or the like, or in the case where a cutting means or a cutting blade is employed, instead of or in combination with those exemplified above. Then, use a cutting member such as a cutter blade, laser cutter, ion beam, thermal power, heat, water pressure, heating wire, spraying gas, liquid, etc., or move the cutting member by combining appropriate driving equipment You may make it cut | disconnect.

Reference Signs List 20 support device 23 adherend support means 24 sheet support means 25 close contact release means 25A, 26A, 27A closing means 25B internal pressure increasing means 25F, 26D, 27C sealing member AS adhesive sheet AS1 protruding portion GA gap SC closed space WF wafer Kimono)
WF1 attached surface

Claims (3)

An adherend supporting means for supporting the adherend to which the adhesive sheet having a size protruding from the adherend surface is attached,
Sheet support means provided at a predetermined interval outside the adherend support means and supporting a protruding portion of the adhesive sheet protruding from the adherend surface of the adherend,
The apparatus further includes an adhesion releasing unit configured to release the adhesion between the adherend support unit and the adherend.
The close-contact release unit includes a closing unit that closes a gap between the adherend support unit and the sheet support unit, the closing unit, the sheet support unit, the protruding portion, the adherend, and the cover. Internal pressure increasing means for increasing the internal pressure of the sealed space formed by the body support means, and the internal pressure increasing means increasing the internal pressure of the sealed space to increase the close contact between the adherend supporting means and the adherend. A support device characterized by releasing.   The supporting device according to claim 1, wherein the closing unit includes a sealing member that closes the gap by elastically deforming. An adherend supporting step of supporting the adherend to which the adhesive sheet having a size protruding from the adherend surface is adhered by the adherend supporting means,
Sheet supporting means provided at a predetermined interval outside the adherend supporting means, a sheet supporting step of supporting a protruding portion protruding from the adherend surface of the adherend,
An adhesion releasing step of releasing the adhesion between the adherend supporting means and the adherend,
The close contact releasing step is a closing step of closing a gap between the adherend supporting means and the sheet supporting means with a closing means, and the closing means, the sheet supporting means, the protruding portion, the adherend and An internal pressure increasing step of increasing an internal pressure of a sealed space formed by the adherend supporting means, wherein the internal pressure of the sealed space is increased by the internal pressure increasing step and the adherend supporting means and the adherend are increased. A supporting method characterized by releasing the close contact of the object.

Images