JP6654978B2 - Board work machine - Google Patents

Description

  The present invention relates to a board-to-board working machine for mounting lead components on a board.

  The following patent document describes a technique for mounting a lead component on a substrate by inserting a lead of the lead component into an insertion hole formed in the substrate.

JP-A-4-271200 JP-A-3-218699

  According to the technology described in the above-mentioned patent document, it is possible to insert the lead of the lead component into an insertion hole formed to a certain extent in the substrate, but it is desired to increase the insertion accuracy of the lead into the insertion hole. It is rare. The present invention has been made in view of such circumstances, and an object of the present invention is to increase the accuracy of insertion of a lead into an insertion hole.

  In order to solve the above problems, a substrate working machine according to the present application includes a substrate holding device that holds a substrate having an insertion hole for inserting a lead of a lead component, and a holding head that holds a lead component. Above the substrate held by the substrate holding device, an upward moving device that moves the holding head to an arbitrary position, an imaging device that captures an image, and below the substrate held by the substrate holding device, A downward moving device for moving the imaging device to an arbitrary position; and a control device, wherein the control device moves the imaging device below the insertion hole of the substrate held by the substrate holding device, and inserts the imaging device. An imaging unit that captures a hole with the imaging device; and a calculation unit that calculates data related to the position of the insertion hole of the board based on image data of an image captured by the imaging unit. Using the data regarding the position of the insertion hole of the board calculated by the calculation unit, controlling the operation of the upward moving device, and inserting the lead of the lead component held by the holding head into the insertion hole of the board. And an insertion portion.

  In the working machine for substrates described in the present application, the insertion hole is imaged by the imaging device arranged below the substrate held by the substrate holding device, and data on the position of the insertion hole is calculated based on the imaged data. Is done. This makes it possible to increase the accuracy of insertion of the lead into the insertion hole. In addition, while the work by the holding head is being performed, the image of the insertion hole is taken by the imaging device, so that data on the position of the insertion hole can be obtained without stopping the work by the holding head. This makes it possible to prevent a delay in the cycle time due to the stoppage of the work by the holding head.

It is a perspective view showing a component mounting machine. It is a perspective view which shows a component mounting apparatus. It is a perspective view which shows a cut-and-clinch unit and a unit moving device. It is a perspective view showing a cut and clinch unit. It is a block diagram showing a control device. It is the schematic which shows the cut and clinch unit at the time of cutting | disconnection and bending of the lead of a lead component. It is a perspective view showing a turntable of a unit moving device of a modification. It is a perspective view which shows the lower end part of the cut and clinch unit of a modification.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings as embodiments for carrying out the present invention.

<Configuration of component mounter>
FIG. 1 shows a component mounter 10. The component mounter 10 is a device for executing a component mounting operation on the circuit substrate 12. The component mounter 10 includes an apparatus main body 20, a substrate transport and holding device 22, a component mounting device 24, a first imaging device 26, a second imaging device 28, a component supply device 30, a loose component supply device 32, and a cut and clinch unit ( 4), a unit moving device (see FIG. 3) 36, a third imaging device (see FIG. 4) 37, and a control device (see FIG. 5) 38. The circuit substrate 12 includes a circuit substrate, a substrate having a three-dimensional structure, and the like, and the circuit substrate includes a printed wiring board, a printed circuit board, and the like.

  The apparatus main body 20 includes a frame section 40 and a beam section 42 mounted on the frame section 40. The substrate transfer and holding device 22 is disposed at the center of the frame section 40 in the front-rear direction, and has a transfer device 50 and a clamp device 52. The transport device 50 is a device that transports the circuit substrate 12, and the clamp device 52 is a device that holds the circuit substrate 12. As a result, the substrate transfer and holding device 22 transfers the circuit substrate 12 and fixedly holds the circuit substrate 12 at a predetermined position. In the following description, the transport direction of the circuit substrate 12 is referred to as an X direction, a horizontal direction perpendicular to the direction is referred to as a Y direction, and a vertical direction is referred to as a Z direction. That is, the width direction of the component mounter 10 is the X direction, and the front-rear direction is the Y direction.

  The component mounting device 24 is disposed on the beam section 42 and has two work heads 60 and 62 and a work head moving device 64. As shown in FIG. 2, a suction nozzle 66 is provided on the lower end surface of each of the work heads 60 and 62, and the suction nozzle 66 holds a component by suction. The working head moving device 64 has an X-direction moving device 68, a Y-direction moving device 70, and a Z-direction moving device 72. Then, the two work heads 60 and 62 are integrally moved to an arbitrary position on the frame unit 40 by the X direction moving device 68 and the Y direction moving device 70. The work heads 60 and 62 are detachably mounted on the sliders 74 and 76, and the Z-direction moving device 72 moves the sliders 74 and 76 individually in the vertical direction. That is, the working heads 60 and 62 are individually moved in the vertical direction by the Z-direction moving device 72.

  In addition, the first imaging device 26 has a light source (see FIG. 5) 78 and a camera (see FIG. 5) 80, and is attached to the slider 74 so as to face downward as shown in FIG. I have. Thus, the first imaging device 26 is moved in the X, Y, and Z directions together with the work head 60, and captures an arbitrary position on the frame unit 40. The second imaging device 28 has a light source (see FIG. 5) 82 and a camera (see FIG. 5) 84, and as shown in FIG. The device 30 is disposed so as to face upward. Thereby, the second imaging device 28 captures an image of the component held by the suction nozzle 66 of the work heads 60 and 62.

  The component supply device 30 is disposed at one end of the frame unit 40 in the front-rear direction. The component supply device 30 includes a tray-type component supply device 86 and a feeder-type component supply device (see FIG. 5) 88. The tray-type component supply device 86 is a device that supplies components placed on a tray. The feeder-type component supply device 88 is a device that supplies components using a tape feeder and a stick feeder (not shown).

  The loose component supply device 32 is disposed at the other end of the frame portion 40 in the front-rear direction. The loose component supply device 32 is a device that aligns a plurality of components that are scattered separately and supplies the components in an aligned state. In other words, this is an apparatus that arranges a plurality of components in an arbitrary posture in a predetermined posture and supplies the components in a predetermined posture.

  The components supplied by the component supply device 30 and the bulk component supply device 32 include electronic circuit components, components of a solar cell, components of a power module, and the like. The electronic circuit components include components having leads and components not having leads.

  The cut and clinch unit 34, the unit moving device 36, and the third imaging device 37 are disposed below the transport device 50. As shown in FIG. 3, the cut-and-clinch unit 34 and the third imaging device 37 are integrally formed, and the cut-and-clinch unit 34 and the third imaging device 37 are integrally formed as a unit moving device 36. Thereby, it can be moved to an arbitrary position below the transfer device 50.

  First, the cut and clinch unit 34 will be described with reference to FIG. The cut and clinch unit 34 cuts and bends a lead (see FIG. 6) 108 of a lead component (see FIG. 6) 106 inserted into a through hole (see FIG. 6) 104 formed in the circuit substrate 12. Device. The cut and clinch unit 34 has a pair of slide bodies 112. The pair of slide bodies 112 are slidably supported by slide rails 116 arranged to extend in the X direction. As a result, the pair of slide bodies 112 approach and separate in the X direction. Further, the distance between the pair of slide bodies 112 is changed by driving an electromagnetic motor (see FIG. 5) 118 so that the distance can be controlled.

  Each of the pair of slide bodies 112 includes a fixed part 120 and a movable part 122, and is slidably held on a slide rail 116 in the fixed part 120. The movable section 122 is held by the fixed section 120 so as to be slidable in the X direction. Then, the movable section 122 is slidably controlled in the X direction with respect to the fixed section 120 by driving an electromagnetic motor (see FIG. 5) 128.

  The upper end of the fixing portion 120 is tapered as shown in FIG. 6, and the first insertion hole 130 is formed so as to penetrate the upper end in the vertical direction. An opening edge of the first insertion hole 130 toward the upper end surface is a fixed blade 131. On the other hand, the upper end of the movable portion 122 is also tapered, and an L-shaped bent portion 133 is formed at the upper end. The bent portion 133 extends above the upper end surface of the fixed portion 120. The first insertion hole 130 opened at the upper end surface of the fixing portion 120 is covered by the bent portion 133, and the second insertion hole 136 is formed in the bent portion 133 so as to face the first insertion hole 130. Are formed. The opening edge of the second insertion hole 136 on the lower end surface of the bent portion 133 is a movable blade 138.

  As shown in FIG. 3, the unit moving device 36 includes an X-direction moving device 150, a Y-direction moving device 152, a Z-direction moving device 154, and a rotation device 156. X direction moving device 150 includes slide rail 160 and X slider 162. The slide rail 160 is provided so as to extend in the X direction, and the X slider 162 is slidably held on the slide rail 160. Then, the X slider 162 moves in the X direction by driving an electromagnetic motor (see FIG. 5) 164. Y-direction moving device 152 includes a slide rail 166 and a Y slider 168. The slide rail 166 is provided on the X slider 162 so as to extend in the Y direction, and the Y slider 168 is slidably held on the slide rail 166. Then, the Y slider 168 moves in the Y direction by driving the electromagnetic motor (see FIG. 5) 170. The Z-direction moving device 154 includes a slide rail 172 and a Z slider 174. The slide rail 172 is provided on the Y slider 168 so as to extend in the Z direction, and the Z slider 174 is slidably held on the slide rail 172. Then, the Z slider 174 moves in the Z direction by driving the electromagnetic motor (see FIG. 5) 176.

  Further, the rotation device 156 has a generally disk-shaped rotary table 178. The rotary table 178 is supported by a Z slider 174 so as to be rotatable about its axis, and is rotated by driving an electromagnetic motor (see FIG. 5) 180. The cut-and-clinch unit 34 is disposed on the turntable 178. With such a structure, the cut and clinch unit 34 is moved to an arbitrary position by the X-direction moving device 150, the Y-direction moving device 152, and the Z-direction moving device 154, and is rotated to an arbitrary angle by the rotation device 156. I do. Thus, the cut and clinch unit 34 can be positioned at an arbitrary position below the circuit board 12 held by the clamp device 52.

  Further, the third imaging device 37 has a light source (see FIG. 5) 182 and a camera (see FIG. 5) 184. As shown in FIG. 4, on the upper surface of the housing 100 of the cut and clinch unit 34, It is arranged facing upward. Accordingly, the third imaging device 37 is moved to an arbitrary position by the unit moving device 36 together with the cut-and-clinch unit 34, and captures an arbitrary position on the back surface of the circuit substrate 12 held by the clamp device 52. .

  The control device 38 includes a controller 190, a plurality of drive circuits 192, a plurality of control circuits 194, and an image processing device 196, as shown in FIG. The plurality of drive circuits 192 include the transfer device 50, the clamp device 52, the work heads 60 and 62, the work head moving device 64, the tray type component supply device 86, the feeder type component supply device 88, the loose component supply device 32, and the electromagnetic motor. 118, 128, 164, 170, 176, 180. The controller 190 includes a CPU, a ROM, a RAM, and the like, is mainly composed of a computer, and is connected to a plurality of drive circuits 192. As a result, the operations of the substrate transfer and holding device 22, the component mounting device 24, and the like are controlled by the controller 190. Further, the controller 190 is connected to the light sources 78, 82, 182 of the respective imaging devices 26, 28, 37 via the control circuit 194. As a result, the light sources 78, 82, and 182 emit controllable light by the controller 190. Further, the controller 190 is also connected to the image processing device 196. The image processing device 196 processes image data obtained by the cameras 80, 84, 184 of the respective imaging devices 26, 28, 37, and the controller 190 acquires various information from the image data.

<Operation of component mounter>
In the component mounter 10, components are mounted on the circuit substrate 12 held by the substrate transfer / holding device 22 by the above-described configuration. In the component mounter 10, various components can be mounted on the circuit substrate 12, but a case where lead components are mounted on the circuit substrate 12 will be described below.

  At the time of component mounting, first, the circuit substrate 12 is transported to a work position, where it is fixedly held by the clamp device 52. Next, the first imaging device 26 moves above the circuit substrate 12 and images the fiducial mark printed on the circuit substrate 12. Then, information on the holding position of the circuit substrate 12 and the like is calculated based on the image data. Further, the component supply device 30 or the loose component supply device 32 supplies the lead component 106 at a predetermined supply position. Then, one of the work heads 60 and 62 moves above the component supply position, and the suction nozzle 66 holds the component main body (see FIG. 6) 200 of the lead component 106 by suction.

  Subsequently, the work heads 60 and 62 holding the lead components 106 move above the second imaging device 28, and the second imaging device 28 images the lead components 106 held by the suction nozzles 66. Then, based on the imaging data, information regarding the holding position of the component and the like is calculated. Then, the lead 108 of the lead component 106 held by the suction nozzle 66 is inserted into the through hole 104 formed in the circuit substrate 12, and at the time of insertion, the image data of the through hole 104 by the third imaging device 37 is Used.

  More specifically, information on the position of the through hole 104 formed in the circuit substrate 12 is stored in the controller 190 in advance according to the type of the circuit substrate 12. Then, in the conventional method, the lead 108 of the lead component 106 is inserted into the through hole 104 based on the information on the position of the through hole 104. However, since the position information of the through hole 104 stored in the controller 190 is relative position information with respect to the circuit substrate 12, the holding of the circuit substrate 12 calculated based on the imaging data of the fiducial mark is performed. The relative position of the through hole 104 with respect to the component mounter 10 is calculated using the data on the position, and based on the relative position of the through hole 104 with respect to the component mounter 10, the lead 108 is inserted into the through hole 104. Inserted. However, the step of writing the fiducial mark on the circuit board 12 and the step of forming the through-hole 104 on the circuit board 12 are performed separately. There is a case where the relative positional relationship with the formation position slightly deviates from the set value. In such a case, the position of the through hole 104 calculated using the written position of the fiducial mark is slightly deviated from the actual position of the through hole 104, and the lead 108 is appropriately inserted into the through hole 104. There is a possibility that it cannot be inserted.

  In view of the above, in the component mounter 10, the lead 108 is held by the clamp device 52 while the suction nozzle 66 holds the lead component 106 in order to insert the lead 108 into the through hole 104. Below the circuit substrate 12, the through hole 104 into which the lead 108 is to be inserted is imaged by the third imaging device 37, and the position of the through hole 104 is corrected based on the imaged data. Specifically, the third imaging device 37 is moved by the unit moving device 36 to below the through hole 104 where the lead 108 is to be inserted while the suction component 66 holds the lead component 106 or the like. Is done. When the third imaging device 37 is moved below the through hole 104, the position information of the through hole 104 stored in the controller 190 is used. Then, the through-hole 104 is imaged by the third imaging device 37, and light is emitted from the light source 184 of the third imaging device 37 at the timing when the through-hole 104 is imaged by the third imaging device 37. Accordingly, it is possible to clearly image the through hole 104, and information on the position of the through hole 104 is appropriately calculated based on the image data obtained by the third imaging device 37. The position information of the through hole 104 calculated based on the imaging data is relative position information of the through hole 104 with respect to the component mounter 10. Therefore, the operation of the work head moving device 64 is controlled based on the calculated position information, and the lead 108 of the lead component 106 held by the suction nozzle 66 is inserted into the through hole 104. However, before the lead 108 is inserted into the through hole 104, the cut and clinch unit 34 is moved so that the second insertion hole 136 of the cut and clinch unit 34 is located below the through hole 104. .

  Specifically, the through-hole 104 is imaged by the third imaging device 37, and when the position information of the through-hole 104 is calculated based on the imaged data, the cut-and-clinch unit 34 generates a pair of slide bodies 112. The distance between the pair of slides 112 is such that the distance between the second insertion holes 136 of the movable part 122 is the same as the distance between the two through holes 104 formed in the circuit board 12. Is adjusted by the electromagnetic motor 118. At this time, the position information of the through-hole 104 calculated based on the imaging data of the third imaging device 37 is used. By the operation of the X-direction moving device 150 and the Y-direction moving device 152, the coordinates of the second insertion hole 136 of the slide body 112 in the XY directions and the coordinates of the through hole 104 of the circuit substrate 12 in the XY directions are changed. The cut and clinch unit 34 is moved so as to match. That is, as the cut-and-clinch unit 34 is moved in the XY directions, the second insertion hole 136 of the slide body 112 and the through-hole 104 of the circuit substrate 12 are vertically overlapped. Note that, even when the cut and clinch unit 34 moves, the position information of the through-hole 104 calculated based on the imaging data is used.

  Further, the cut-and-clinch unit 34 operates such that the upper surface of the movable portion 122 is in contact with the lower surface of the circuit substrate 12 or is positioned slightly below the lower surface of the circuit substrate 12 by the operation of the Z-direction moving device 154. Be raised. As described above, by controlling the operations of the X-direction moving device 150, the Y-direction moving device 152, and the Z-direction moving device 154, the second insertion hole 136 of the slide body 112 and the through hole 104 of the circuit substrate 12 are formed. The cut-and-clinch unit 34 is arranged below the circuit board 12 in a state where is overlapped.

  Then, when the lead 108 of the lead component 106 held by the suction nozzle 66 is inserted into the through hole 104 of the circuit board 12, the tip of the lead 108 is cut and clinched as shown in FIG. 34 is inserted into the first insertion hole 130 of the fixed part 120 via the second insertion hole 136 of the movable part 122. Subsequently, when the lead 108 is inserted into the first insertion hole 130 via the second insertion hole 136, the movable parts 122 of the pair of slide bodies 112 slide in the direction in which they are separated. Thereby, the lead 108 is cut by the fixed blade 131 of the first insertion hole 130 and the movable blade 138 of the second insertion hole 136.

  Further, the pair of movable parts 122 are slid further away from each other even after cutting the lead 108. For this reason, the new tip of the lead 108 due to the cutting bends as the movable part 122 slides. As a result, the pair of leads 108 are bent in a direction away from each other, and the lead components 106 are mounted on the circuit substrate 12 in a state where the leads 108 are prevented from coming out of the through holes 104.

  Thus, in the component mounter 10, the through-hole 104 is imaged by the third imaging device 37, and the position information of the through-hole 104 is calculated based on the imaged data. Then, based on the calculated position information of the through hole 104, the operation of the unit moving device 36 is controlled such that the through hole 104 and the second insertion hole 136 of the cut and clinch unit 34 overlap in the vertical direction, Further, the operation of the work head moving device 64 is controlled such that the leads 108 of the lead components 106 held by the suction nozzles 66 are inserted into the through holes 104. As a result, the lead 108 can be properly inserted into the through hole 104 and the second insertion hole 136 of the cut-and-clinch unit 34, and the lead 108 can be appropriately mounted on the circuit board 12 in a bent state. Becomes possible.

  Note that it is also possible to image the through hole 104 by the first imaging device 26 and calculate the position information of the through hole 104 based on the image data. However, since the first imaging device 26 is moved by the work head moving device 64 together with the work heads 60 and 62, when the first imaging device 26 takes an image of the through hole 104, the work by the work heads 60 and 62 is performed. That is, it is not possible to perform the work of holding the lead component 106 by the suction nozzle 66 or the like. As a result, the holding operation of the lead component 106 enters a standby state, and the cycle time becomes longer. On the other hand, the third imaging device 37 is moved by the unit moving device 36 together with the cut-and-clinch unit 34. During the operation of holding the lead component 106 by the suction nozzle 66, the operation to be performed by the cut-and-clinch unit 34 There is no. For this reason, during the work of holding the lead component 106 by the suction nozzle 66, the third imaging device 37 captures an image of the through-hole 104, so that no work is in a standby state. As described above, the third imaging device 37, not the first imaging device 26, captures an image of the through-hole 104, and the position information of the through-hole 104 is calculated based on the captured image data, so that any operation is required to wait. And the delay of the cycle time can be prevented.

  The controller 190 of the control device 38 includes an imaging unit 210, an irradiation unit 212, a calculation unit 214, and an insertion unit 216, as shown in FIG. The imaging unit 210 is a functional unit for imaging the through hole 104 by the third imaging device 37. The irradiating unit 212 is a functional unit for irradiating the light source 182 of the third imaging device 37 at the timing when the through-hole 104 is imaged by the third imaging device 37. The calculation unit 214 is a functional unit for calculating the position information of the through hole 104 based on the image data captured by the third imaging device 37. The insertion unit 216 is a functional unit for inserting the lead 108 into the through hole 104 using the calculated position information of the through hole 104.

  Further, in the component mounter 10, since the third imaging device 37 is disposed below the circuit substrate 12 held by the clamp device 52, not only the calculation of the position information of the through-hole 104 but also various For matters, the third imaging device 37 can be used. Specifically, for example, a 2D code or the like may be written on the lower surface side of the circuit substrate 12 held by the clamp device 52. In such a case, the 2D code can be imaged by the third imaging device 37 and the 2D code can be read. Whether or not the lead 108 has been inserted into the through hole 104 is determined using a pressure sensor or the like. However, when the number of leads is large, the leads are thin and almost no pressure is generated when the leads are bent. In such a case, the insertion of the lead 108 into the through hole 104 cannot be properly determined. Therefore, when the lead 108 is inserted into the through hole 104, the third imaging device 37 captures an image of the through hole 104, so that it is possible to determine whether or not the lead 108 is properly inserted into the through hole 104. Becomes

  Incidentally, the component mounting machine 10 is an example of a board working machine. The cut and clinch unit 34 is an example of a working head. The unit moving device 36 is an example of a downward moving device. The third imaging device 37 is an example of an imaging device. The control device 38 is an example of a control device. The clamp device 52 is an example of a substrate holding device. The working heads 60 and 62 are examples of a holding head. The work head moving device 64 is an example of an upward moving device. The light source 78 is an example of a light source. The through hole 104 is an example of an insertion hole. The lead component 106 is an example of a lead component. The lead 108 is an example of a lead. The imaging unit 210 is an example of an imaging unit. The irradiation unit 212 is an example of an irradiation unit. Arithmetic unit 214 is an example of an arithmetic unit. The insertion section 216 is an example of an insertion section.

  The present invention is not limited to the above-described embodiment, but can be implemented in various modes with various modifications and improvements based on the knowledge of those skilled in the art. Specifically, for example, in the above-described embodiment, the third imaging device 37 is fixed to the cut-and-clinch unit 34 and can be moved together with the cut-and-clinch unit 34 by the unit moving device 36. The and clinch unit 34 may be detachable from the unit moving device 36, and an imaging device may be mounted on the unit moving device 36 instead of the cut and clinch unit 34.

  Specifically, as shown in FIG. 7, the mounting section 220 is provided on the upper surface of the turntable 178 of the unit moving device 36. The mounting portion 220 is generally rectangular, and a pair of bolt holes 222 and an erect portion provided between the pair of bolt holes 222 are provided at both ends in the longitudinal direction of the mounting portion 220. A pin 224 is provided. On the other hand, a pair of legs 230 is provided on the lower surface of the cut and clinch unit 34 as shown in FIG. Each leg 230 is provided with a pair of bolts 232 that can be fastened to a pair of bolt holes 222 of the mounting section 220. Further, each leg 230 is formed with a fitting hole (not shown) in which the standing pin 224 of the mounting part 220 can be fitted. In each leg 230, the standing pin 224 is fitted in the fitting hole, and the bolt 232 is fastened to the bolt hole 222, so that the cut and clinch unit 34 is fixed to the upper surface of the turntable 178. That is, the cut and clinch unit 34 is mounted on the unit moving device 36. Then, in each leg 230, the fastening of the bolt 232 to the bolt hole 222 is released and the standing pin 224 is removed from the fitting hole, so that the cut and clinch unit 34 is removed from the unit moving device 36. As a result, the cut and clinch unit 34 can be attached to and detached from the unit moving device 36.

  Further, the third imaging device 37 is a very compact imaging device, and the imaging device of a normal size is approximately the same size as the cut and clinch unit 34. For this reason, by attaching the same one of the pair of legs 230 to the lower surface of the normal size imaging device, it becomes possible to detachably mount this imaging device to the mounting portion 220 at each leg. . That is, the imaging device is detachable from the unit moving device 36. Thus, the cut-and-clinch unit 34 and the imaging device can be exchanged and can be detachably mounted on the unit moving device 36.

  In the above embodiment, the cut-and-clinch unit 34 is employed to perform the operation on the lead 108 inserted into the through hole 104. However, other devices, such as the lead 108 inserted into the through hole 104, are used. A coating device that applies a viscous fluid such as solder to the surface may be adopted. That is, a coating device that applies a viscous fluid such as solder may be mounted on the unit moving device 36, and the third imaging device 37 may be fixed to the coating device.

  In the above embodiment, the light is emitted from the light source 182 of the third imaging device 37 at the timing when the through hole 104 is imaged by the third imaging device 37, but the light is emitted by the light source 78 of the first imaging device 26. Irradiation may be performed. The light source 78 of the first imaging device 26 emits light downward, and the light emitted by the light source 78 is emitted toward the circuit substrate 12. At this time, the light is emitted through the through hole 104 of the circuit substrate 12 toward the lower side of the circuit substrate 12, that is, toward the third imaging device 37. An image is taken in a state where the outline of 104 is clear. Thereby, the boundary line that divides the through hole 104 becomes clear, and the information on the position of the through hole 104 can be appropriately calculated based on the image data obtained by the third imaging device 37.

  10: Component mounting machine (to board working machine) 34: Cut and clinch unit (work head) 36: Unit moving device (downward moving device) 37: Third imaging device (imaging device) 38: Control device 52: Clamp device ( Substrate holding device) 60: Working head (holding head) 62: Working head (holding head) 64: Working head moving device (upward moving device) 78: Light source 104: Through hole (insertion hole) 106: Lead component 108: Lead 210 : Imaging unit 212: irradiation unit 214: calculation unit 216: insertion unit

Claims (4)

A board holding device for holding a board having an insertion hole for inserting a lead of a lead component,
A holding head for holding the lead component,
Above the substrate held by the substrate holding device, an upward moving device that moves the holding head to an arbitrary position,
An imaging device for capturing an image,
Below the substrate held by the substrate holding device, a downward moving device that moves the imaging device to an arbitrary position,
With a control device,
The control device,
An imaging unit configured to move the imaging device below the insertion hole of the substrate held by the substrate holding device and image the insertion hole with the imaging device;
A calculation unit that calculates data related to the position of the insertion hole of the board based on image data of an image captured by the imaging unit;
Using the data regarding the position of the insertion hole of the board calculated by the calculation unit, the operation of the upward moving device is controlled to insert the lead of the lead component held by the holding head into the insertion hole of the board. And a board working machine having a unit. The board working machine,
A light source disposed above the substrate held by the substrate holding device;
The control device includes:
2. The machine for working with a substrate according to claim 1, further comprising: an irradiating unit configured to irradiate the substrate with light from the light source when the insertion hole of the substrate is imaged by the imaging unit. 3. The board working machine,
Equipped with a work head that performs work on the lead inserted into the insertion hole of the board,
The downward moving device,
The board working machine according to claim 1, wherein the work head is moved to an arbitrary position below the substrate held by the substrate holding device together with the imaging device. The board working machine,
Equipped with a work head that performs work on the lead inserted into the insertion hole of the board,
The downward moving device,
The image pickup device has a mounting portion to be detachably mounted,
The working head is
3. The work machine for substrates according to claim 1, wherein the work unit is detachably mounted on the mounting unit instead of the imaging device. 4.

Images