JP6672079B2 - Sheet sticking device and sticking method - Google Patents

Description

  The present invention relates to a sheet sticking apparatus and a sheet sticking method.

  2. Description of the Related Art Conventionally, there has been known a sheet sticking apparatus that feeds an adhesive sheet to a position facing a support surface that supports an adherend and sticks the adhesive sheet to the adherend supported by the support surface (for example, see Patent Document 1). .

JP 2011-187465 A

  In the conventional sheet sticking apparatus as described in Patent Document 1, the distance between the fed adhesive sheet and the support surface is small. There is an inconvenience that the body is stuck to the adhesive sheet and the support surface cannot support the adherend, resulting in poor sticking.

  An object of the present invention is to allow an adherend to be supported on a support surface without placing the adherend on an adhesive sheet when the adherend is placed on the support surface, resulting in poor attachment. An object of the present invention is to provide a sheet sticking apparatus and a sheet sticking method that can prevent the sheet sticking.

The sheet sticking apparatus of the present invention includes a feeding unit that feeds an adhesive sheet to a position facing a support surface that supports an adherend, a support unit that supports the adherend on the support surface, and a support unit that supports the adherend. Pressing means for pressing and bonding the adhesive sheet; cutting means for cutting the adhesive sheet attached to the adherend into a predetermined shape so that the adhesive sheet portion remains on the adherend; and Winding means for winding an unnecessary sheet other than the adhesive sheet portion, and moving means for moving the winding means in a direction to separate and approach the supporting surface and the adhesive sheet from each other ; The winding means is rotated about a rotation axis parallel to a width direction intersecting with a feeding direction of the adhesive sheet .

The sheet sticking method of the present invention includes: a feeding step of feeding an adhesive sheet to a position facing a support surface supporting an adherend; a support step of supporting the adherend on the support surface; A pressing step of pressing and bonding the adhesive sheet, a cutting step of cutting the adhesive sheet attached to the adherend into a predetermined shape so that the adhesive sheet portion remains on the adherend, and a cutting step of cutting the adhesive sheet. A winding step of winding an unnecessary sheet other than the adhesive sheet portion by a winding means, wherein before the feeding step or the supporting step, a rotation axis parallel to a width direction intersecting the feeding direction of the adhesive sheet is centered. wherein the support surface in a direction of separating the adhesive sheet winding means is rotated, said after supporting step, the take-up means in a direction to approach the adhesive sheet on the supporting surface about said rotational axis as And wherein the pivoting.

  According to the present invention as described above, since the winding means is moved in a direction to separate the adhesive sheet from the support surface, when the adherend is placed on the support surface, the adherend is attached to the adhesive sheet. The adherend can be supported on the support surface without sticking, and it is possible to prevent inferior sticking.

  In addition, if the winding means is rotated about a rotation axis parallel to the width direction intersecting the feeding direction of the adhesive sheet, the winding means can be moved with a simple configuration.

The side view showing the sheet pasting device concerning one embodiment of the present invention. Operation | movement explanatory drawing of a sheet sticking apparatus. Operation | movement explanatory drawing of a sheet sticking apparatus.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
In this embodiment, the X axis, the Y axis, and the Z axis are orthogonal to each other. The X axis and the Y axis are axes within a predetermined plane, and the Z axis is an axis orthogonal to the predetermined plane. I do. Furthermore, in the present embodiment, based on the case of viewing from the near side in FIG. 1 parallel to the Y axis, when the direction is indicated, “up” is the arrow direction of the Z axis, “down” is the opposite direction, The left is the direction of the arrow on the X axis, the right is the opposite direction, the front is the front direction in FIG. 1 parallel to the Y axis, and the rear is the opposite direction.

  In FIG. 1, a sheet sticking apparatus 10 includes a feeding unit 20 that feeds an adhesive sheet AS to a position facing a support surface 31A that supports a semiconductor wafer (hereinafter, also simply referred to as a “wafer”) WF as an adherend, and a support surface. 31A, supporting means 30 for supporting the wafer WF, pressing means 40 for pressing and bonding the adhesive sheet AS to the supported wafer WF, and adhesive bonding to the wafer WF such that the adhesive sheet portion remains on the wafer WF. A cutting unit 50 for cutting the sheet AS into a predetermined shape, a winding unit 60 for winding the unnecessary sheet US other than the adhesive sheet portion in the adhesive sheet AS, and a direction in which the support surface 31A and the adhesive sheet AS are separated from each other and approached. Moving means 70 for moving the winding means 60.

  The feeding means 20 includes a support roller 21 that supports a raw RS with the adhesive sheet AS temporarily attached to one surface of the release sheet RL, guide rollers 22A and 22B that guide the raw RS, and a guide roller 22A. A linear motor 23 as a driving device that supports a pressing member 23B sandwiching the web RS between the output shaft 23A, and a load cell as a tension detecting unit that supports the guide roller 22B and can measure the tension of the adhesive sheet AS. 24A, a peeling plate 24B as a peeling member that peels the adhesive sheet AS from the peeling sheet RL, a driving roller 25 that is driven by a rotating motor 25A as a driving device, and sandwiches the peeling sheet RL with the pinch roller 25B. A collection roller 26 for collecting the sheet RL, and a support roller 21 and a A frame 27 supporting each member other than the collection roller 26, and a frame 27 supported by a slider (not shown), and a linear motor 29 as a driving device supported by a slider 29A (see FIG. 3) of a linear motor 29 as a driving device 28.

  The supporting means 30 is provided with a concave part 31B capable of holding the wafer WF by suction on the supporting surface 31A by a not-shown depressurizing means such as a depressurizing pump or a vacuum ejector, and the adhesive sheet AS is stuck together with the wafer WF supported on the supporting surface 31A and cut. A table 31 having an unnecessary sheet support surface 31C for supporting the unnecessary sheet US formed by cutting the means 50 is provided. The depth of the recess 31B is set to the same dimension as the thickness of the wafer WF.

  The pressing means 40 is rotatable via a bracket 43B on a linear motor 43 as a driving device supported by a slider 41A of a linear motor 41 as a driving device via a bracket 42, and an output shaft 43A of the linear motor 43. And a pressing roller 44 as a pressing member for pressing the adhesive sheet AS against the adhered surface WF1 of the wafer WF.

  The cutting means 50 includes an articulated robot 51 as a driving device, and a cutting blade 52 supported by a work arm 51A of the articulated robot 51. The articulated robot 51 is a so-called six-axis robot capable of displacing the cutting blade 52 at any position and any angle within the working range.

  The take-up means 60 is driven by a rotation motor 62 as a driving device supported by a frame 61, driven by a driving roller 63 that sandwiches the unnecessary sheet US with a pinch roller 64, and driven by a driving device (not shown) to a predetermined tension. And a receiving roller 66 that receives the frame 61 and is supported by the slider 41B of the linear motor 41.

  The moving means 70 includes a bracket 71 supported by the slider 41B of the linear motor 41, and a rotating motor 72 as a driving device supported by the bracket 71 and supporting the frame 61 with its output shaft 72A. The winding means 60 is configured to rotate around a rotation axis (an axis parallel to the Y axis) parallel to the width direction (Y axis) intersecting the feeding direction of the winding means 60.

A procedure for attaching the adhesive sheet AS to the attachment surface WF1 of the wafer WF in the sheet attaching apparatus 10 will be described.
First, an operator sets the raw fabric RS as shown by a solid line in FIG. 1 to the sheet sticking apparatus 10 in which each member is arranged at an initial position and is shown by a solid line in FIG. Then, automatic operation is instructed via an operation means (not shown) such as an operation panel or a personal computer, and when the wafer WF is placed on the support surface 31A of the table 31 by hand or a transfer means (not shown) such as a conveyor or a robot. Then, the supporting means 30 drives a pressure reducing means (not shown) to suction-hold the wafer WF on the supporting surface 31A. At this time, since the winding means 60 is in a state in which the adhesive sheet AS is separated from the support surface 31A, when the wafer WF is placed on the support surface 31A, the wafer WF and the transfer means (not shown) are attached to the adhesive sheet AS. The wafer WF can be supported on the support surface 31A without sticking. Thereafter, the moving means 70 drives the rotation motor 72 to rotate the frame 61 in the clockwise direction as shown by the two-dot chain line in FIG. 1 so that the adhesive sheet AS approaches the support surface 31A. The winding means 60 is moved. Next, the feeding means 20 and the winding means 60 drive the rotation motors 25A and 62 to wind the release sheet RL and the adhesive sheet AS, and that the tension of the adhesive sheet AS located on the table 31 has reached a predetermined value. Is detected by the load cell 24A, the driving of the rotation motors 25A and 62 is stopped. Next, the pressing means 40 drives the linear motor 43 to lower the pressing roller 44 to press the adhesive sheet AS against the upper surface of the table 31 with a predetermined pressure as shown in FIG. At this time, when an increase in the tension of the adhesive sheet AS located on the table 31 is detected by the load cell 24A, the feeding means 20 drives the rotation motor 25A and winds the peeling sheet RL to feed the adhesive sheet AS. Then, control for keeping the tension of the adhesive sheet AS at a predetermined value is performed. Next, the feeding means 20 drives the linear motor 23 to sandwich the adhesive sheet AS between the pressing member 23B and the guide roller 22A, as shown in FIG. 2, to suppress the feeding of the adhesive sheet AS.

  Next, the pressing means 40 drives the linear motor 41 to move the pressing roller 44 to the right as shown by the two-dot chain line in FIG. 2, and the pressing roller 44 applies the adhesive sheet AS to the adherend surface WF1 and the unnecessary surface. The sheet is pressed and attached to the sheet support surface 31C. At this time, further tension is applied to the adhesive sheet AS with the movement of the pressing roller 44. At the moment when the load cell 24A detects the tension, the feeding means 20 drives the linear motors 28 and 29, and is detected by the load cell 24A. The frame 27 is controlled to move in the left-right direction and the up-down direction so that the tension applied to the frame 27 does not deviate from a predetermined value.

  When the bonding of the adhesive sheet AS is completed, the cutting means 50 drives the articulated robot 51 to pierce the cutting blade 52 into the adhesive sheet AS as shown by a two-dot chain line in FIG. Move along the outer circumference. Thus, the adhesive sheet portion remains on the wafer WF, and the unnecessary sheet US is formed on the outer periphery of the adhesive sheet portion. Next, when the wafer WF is transferred to the next process from the support surface 31A by hand or by a transfer unit (not shown), the winding unit 60 drives the rotary motor 62, the linear motor 41, and a drive device (not shown), As shown by the dashed line, the frame 61 is moved rightward to wind up the unnecessary sheet US. Thereafter, the pressing means 40 and the moving means 70 drive the linear motor 43 and the rotating motor 72 to separate the pressing roller 44 from the unnecessary sheet US, and rotate the frame 61 in the counterclockwise direction to rotate the pinch roller 64. Is also separated from the unnecessary sheet US. Next, the feeding means 20 drives the linear motor 28, raises the frame 27 by a small amount to peel off the unnecessary sheet US from the unnecessary sheet supporting surface 31C, and then the feeding means 20 drives the linear motor 23 to press the pressing member 23B. And the guide roller 22A release the sandwiching of the adhesive sheet AS. Then, in a state in which the winding means 60 stops driving the rotation motor 62, each means drives each driving device to return each member to the initial position. By this return operation, a predetermined amount of the adhesive sheet AS is peeled off from the release sheet RL and placed on the table 31. Thereafter, the same operation as described above is repeated.

  According to the above-described embodiment, since the winding unit 60 is moved in a direction to separate the adhesive sheet AS from the support surface 31A, when the wafer WF is placed on the support surface 31A, the wafer WF is The wafer WF can be supported on the support surface 31A without sticking to the AS, and it is possible to prevent the sticking defect from being caused.

  As described above, the best configuration and method for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this. That is, although the present invention has been particularly shown and described with particular reference to particular embodiments, without departing from the spirit and scope of the invention, the shape, Those skilled in the art can make various modifications in materials, quantities, and other detailed configurations. In addition, the description in which the shapes, materials, and the like disclosed above are limited is merely an example for facilitating the understanding of the present invention, and does not limit the present invention. The description by the name of the member excluding some or all of the limitations such as is included in the present invention.

For example, the feeding unit 20 may be configured to feed an adhesive sheet AS that is not temporarily attached to the release sheet RL, and in this case, the release plate 24B may not be provided.
At least one of the support roller 21 and the collection roller 26 may be supported by the frame 27, and the tension detecting means may be any one that can measure the tension of the adhesive sheet AS, such as a pressure sensor or a regulator. Alternatively, the linear motor 23 may be omitted as a configuration for supporting the support roller 21 with a drive device that can be driven and locked.
The feeding means 20 may move the frame 27 stepwise, may move the frame 27 with a single driving device having two output shafts in the first direction and the second direction, or may move the frame 27 linearly. The motors 28 and 29 may be extended inclining with respect to each of the vertical direction and the horizontal direction, may be extended in directions that are not orthogonal to each other, or may be supported by a slider of the linear motor 28. Alternatively, the frame 27 may be supported by the slider 29A of the linear motor 29.

  In the table 31, the depth of the concave portion 31B may be greater than or less than the thickness of the wafer WF, the concave portion 31B may not be provided, or the table 31 may not be held by suction.

  The cutting unit 50 cuts the shape of the adhesive sheet portion left on the wafer WF into a different shape without cutting the same shape as the adhered surface WF1 of the wafer WF, or cuts the adhesive sheet portion larger than the adhered surface WF1. Alternatively, it may be cut smaller than the adherend surface WF1.

  The winding means 60 may wind the unnecessary sheet US without moving the frame 61 rightward, and after returning the feeding means 20 and the pressing means 40 to the initial positions, the winding means 60 is moved to the position shown by the solid line in FIG. The unnecessary sheet US may be wound by driving the rotation motor 62.

The moving means 70 may rotate the frame 61 by means other than the rotating motor 72. For example, the frame 61 may be freely rotatably supported by a shaft member having a rotating shaft extending in the front-rear direction, and a linear motor or an air cylinder may be used. An external force may be applied to the frame 61 using a direct-acting drive device such as the one described above to rotate the frame 61 about the rotation axis of the shaft member.
The moving unit 70 moves the frame 61 in one direction on an orthogonal plane (XZ plane) including a Z axis as an axis orthogonal to the adherend surface WF1 and an X axis as an axis in the pressing direction. For example, the frame 61 may be moved in the vertical direction, or the frame 61 may be moved in an inclined direction in an orthogonal plane inclined with respect to the vertical direction.

  Further, the material, type, shape, and the like of the adhesive sheet AS, the adhesive sheet portion left on the wafer WF, and the adherend in the present invention are not particularly limited. For example, the adhesive sheet portion left on the adhesive sheet AS and the wafer WF may be circular, elliptical, polygonal such as triangular or square, or other shapes, or may be adhesive such as pressure-sensitive adhesiveness or heat-sensitive adhesiveness. When the heat-sensitive adhesive sheet AS is adopted, an appropriate method such as providing a heating means such as a heating side such as a suitable coil heater or a heat pipe for heating the adhesive sheet may be used. What is necessary is just to be adhered. The adhesive sheet AS has, for example, three or more layers, such as a single-layer adhesive layer alone, an intermediate layer between the substrate sheet and the adhesive layer, and a cover layer on the upper surface of the substrate sheet. And further, may be a so-called double-sided adhesive sheet capable of peeling the substrate sheet from the adhesive layer, the double-sided adhesive sheet has a single-layer or a multilayer having an intermediate layer or , A single layer or multiple layers without an intermediate layer. Examples of the adherend include foods, resin containers, semiconductor wafers such as silicon semiconductor wafers and compound semiconductor wafers, circuit boards, information recording substrates such as optical discs, glass plates, steel plates, pottery, wood plates, resin plates, and the like. Any form of member or article can be targeted. It should be noted that the adhesive sheet AS may be replaced with a functional or application-specific reading method. An arbitrary sheet, film, tape, or the like having a shape can be attached to any of the adherends described above.

The means and steps in the present invention are not limited in any way as long as they can perform the operations, functions or steps described for the means and steps, much less the constituents of only one embodiment shown in the above embodiment and There is no limitation to the process at all. For example, the feeding means is not limited as long as the adhesive sheet can be fed at a position facing the support surface supporting the adherend, in light of the common general technical knowledge at the time of filing the application, as long as it is within the technical range. (The explanation of other means and steps is omitted).
Further, the driving device in the above embodiment includes a rotating motor, a linear motion motor, a linear motor, a single-axis robot, an electric device such as an articulated robot, an actuator such as an air cylinder, a hydraulic cylinder, a rodless cylinder, and a rotary cylinder. In addition to those that can be employed, those obtained by directly or indirectly combining them may be employed (some may overlap with those exemplified in the embodiment).
In the above-described embodiment, when rollers are employed, a driving device that rotationally drives each roller may be provided, or the surface of each roller may be formed of an elastically deformable member such as rubber or resin. However, each roller may be configured by a member that does not elastically deform, or when a pressing unit or a pressing member such as a pressing roller or a pressing head is employed, the roller may be used instead of or in combination with the above examples. , A pressing member such as a round bar, a blade material, rubber, resin, sponge, or the like, or a configuration in which the pressing is performed by blowing air such as air or gas, or a pressing unit or a pressing member may be used. The portion may be made of an elastically deformable member such as rubber or resin, or may be made of a member that is not elastically deformed. If a peeling means or a peeling member is adopted, a plate-like member or a round member may be used. Consists of rods, rollers, etc. Alternatively, when a structure that supports or holds a supported member such as a supporting (holding) means or a supporting (holding) member is employed, a gripping means such as a mechanical chuck or a chuck cylinder, Coulomb force, or an adhesive A configuration may be adopted in which the supported member is supported (held) by an adhesive, magnetic force, Bernoulli suction, a driving device, or the like. Or in combination, use cutting members such as cutter blade, laser cutter, ion beam, thermal power, heat, water pressure, heating wire, spraying gas or liquid, etc., or cut with a combination of appropriate driving equipment The member may be moved to be cut.

DESCRIPTION OF SYMBOLS 10 Sheet sticking apparatus 20 Feeding means 30 Support means 31A Support surface 40 Pressing means 50 Cutting means 60 Winding means 70 Moving means AS Adhesive sheet US Unnecessary sheet WF Wafer (substrate)

Claims (2)

Feeding means for feeding the adhesive sheet to a position facing the support surface supporting the adherend,
Support means for supporting the adherend on the support surface,
Pressing means for pressing and adhering the adhesive sheet to a supported adherend,
Cutting means for cutting the adhesive sheet attached to the adherend into a predetermined shape so that the adhesive sheet portion remains on the adherend,
Winding means for winding an unnecessary sheet other than the adhesive sheet portion in the adhesive sheet,
Moving means for moving the winding means in a direction to separate and approach the support surface and the adhesive sheet ,
The sheet sticking apparatus according to claim 1, wherein the moving unit rotates the winding unit around a rotation axis parallel to a width direction intersecting a feeding direction of the adhesive sheet . A feeding step of feeding the adhesive sheet to a position facing a support surface supporting the adherend,
A supporting step of supporting the adherend on the supporting surface,
A pressing step of pressing and bonding the adhesive sheet to a supported adherend,
A cutting step of cutting the adhesive sheet attached to the adherend into a predetermined shape so that the adhesive sheet portion remains on the adherend,
A winding step of winding an unnecessary sheet other than the adhesive sheet portion in the adhesive sheet by a winding unit,
Prior to the feeding step or the supporting step, the winding unit is rotated in a direction of separating the adhesive sheet from the support surface about a rotation axis parallel to a width direction intersecting the feeding direction of the adhesive sheet. , after it said supporting step, sheet sticking method characterized by rotating the winding means in a direction to approach the adhesive sheet on the supporting surface about said rotary shaft.

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