JP6677333B2 - Cylindrical mask exposure equipment - Google Patents

Description

The present invention relates to a cylindrical mask exposure apparatus.
This application claims priority based on Japanese Patent Application No. 2011-278290 filed on December 20, 2011 and Japanese Patent Application No. 2012-024058 filed on February 7, 2012, the contents of which are incorporated herein by reference. Invite.

  2. Description of the Related Art A substrate processing apparatus such as an exposure apparatus is used for manufacturing various devices, for example, as described in Patent Document 1 below. The substrate processing apparatus can project an image of a pattern formed on the mask M arranged in the illumination area onto a substrate or the like arranged in the projection area. The mask M used in the substrate processing apparatus includes a planar mask and a cylindrical mask.

  Further, as one of the methods for manufacturing a device, for example, a roll-to-roll method as described in Patent Document 2 below is known. The roll-to-roll method is a method of performing various processes on a substrate on a transport path while transporting a substrate such as a film from a roll for sending to a roll for collection. The substrate may be processed in a substantially planar state, for example, between transport rollers. Further, the substrate may be processed in a curved state, for example, on the surface of a roller.

JP 2007-299918 A International Publication No. 2008/129819

  The above-described substrate processing apparatus (exposure apparatus) forms an image of a projection optical system used for exposure when one or both of an illumination area on a mask and a projection area on a substrate are curved at a predetermined curvature. When performance is taken into consideration, there is a restriction particularly on the setting of the principal ray of the imaging light beam. For example, the surface of a substrate (film, sheet, web, or the like) wound around a cylindrical rotating drum (roller) having a radius R by a projection optical system, using a mask pattern formed on the outer peripheral cylindrical surface of a cylindrical rotating mask having a radius R. Let's assume the case of imaging and projecting the image. In this case, generally, the principal ray of the imaging light flux from the mask pattern (cylindrical surface) to the surface of the substrate (cylindrical surface) is defined by the rotation center axis of the cylindrical rotation mask and the rotation center axis of the cylindrical rotation drum. And a projection optical system that forms an optical path that linearly connects

  However, when the size of the mask pattern is large in the rotation axis direction of the cylindrical rotary mask, it may be necessary to provide a plurality of such projection optical systems in the direction of the rotation axis. In the case of such a multi-unit, even if a plurality of projection optical systems are densely arranged in a line in the direction of the rotation axis, the projection field of view (projection area) of each projection optical system is equivalent to the thickness of a hardware such as a lens barrel. However, they are always separated, and it is no longer possible to faithfully expose a large mask pattern.

  Further, in the substrate processing apparatus as described above, for example, if the configuration of the apparatus is complicated, the cost of the apparatus may be increased, and the size of the apparatus may be increased. As a result, device manufacturing costs can be high.

  For example, when it is necessary to perform precise patterning, as a substrate processing apparatus, a mask on which a pattern of an electronic device or a display device is drawn is illuminated, and light from the pattern of the mask is formed on a photosensitive layer (photoresist or the like). An exposure apparatus for projecting and exposing on the substrate is used. Even in the case of repeatedly exposing a mask pattern on a flexible long substrate (film, sheet, web, etc.) that is continuously transported by the roll-to-roll method, the transport direction of the long substrate is the scanning direction. The use of a scanning exposure apparatus in which a mask is a cylindrical rotary mask is expected to dramatically improve productivity.

  Such a rotating mask has a transmission system in which a pattern is formed on the outer peripheral surface of a transparent cylindrical body such as glass with a light-shielding layer, and a reflecting section and an absorbing section on the outer peripheral surface of a metallic cylindrical body (or a cylindrical body). And a reflection type in which a pattern is formed. In the case of a transmission type cylindrical mask, it is necessary to incorporate an illumination optical system (optical members such as mirrors and lenses) for irradiating illumination light toward the pattern on the outer peripheral surface inside the cylindrical mask. It is difficult to pass the rotation shaft through the center, and the structure of the cylindrical mask holding structure and the rotation drive system may be complicated.

  On the other hand, in the case of a reflective cylindrical mask, since a metal cylindrical body (or a cylindrical body) can be used, the mask can be made inexpensively, but the illumination for irradiating the peripheral space of the cylindrical mask with illumination light for exposure. It is necessary to provide an optical system and a projection optical system for projecting the reflected light from the pattern formed on the outer peripheral surface toward the substrate, and the configuration on the exposure apparatus side to satisfy the required resolution, transfer fidelity, etc. Can be complicated.

  An aspect of the present invention is to enable a large mask pattern to be faithfully exposed even when one or both of a mask and a substrate (a flexible substrate such as a film, a sheet, and a web) are arranged in a cylindrical shape. An object of the present invention is to provide a cylindrical mask exposure apparatus equipped with a projection optical system. Another object is to provide a cylindrical mask exposure apparatus capable of faithfully exposing a large mask pattern.

  Another object of the present invention is to provide a cylindrical mask exposure apparatus capable of simplifying the configuration of the apparatus. Another object is to provide a cylindrical mask exposure apparatus that can reduce the manufacturing cost.

  According to one aspect of the present invention, a cylindrical mask on which a reflective mask pattern is formed along a cylindrical surface having a predetermined radius from the first center line is rotated around the first center line to provide a flexible flexible mask. A cylindrical mask exposure apparatus for projecting and exposing the mask pattern on the sheet substrate by moving a long sheet substrate along a long direction, wherein a second center set substantially parallel to the first center line is provided. A part of the sheet substrate is cylindrically supported on a cylindrical outer peripheral surface having a predetermined radius from a line, and a rotating drum that rotates around the second center line and sends the sheet substrate in the elongate direction; A first illumination disposed on one side of a center plane including the first center line and the second center line, and set on the cylindrical surface of the cylindrical mask at a predetermined angle of less than 90 ° from the center plane; First image generated in the radial direction of the cylindrical mask from a region The first image light beam is rotated toward a first projection area set at a predetermined angle of less than 90 ° from the center plane on the sheet substrate supported by the rotating drum. A first projection optical system that projects in the radial direction of the drum, and a second projection optical system that is disposed on the other side of the center plane and is set on the outer peripheral surface of the cylindrical mask at a predetermined angle of less than 90 ° from the center plane. (2) A second image light beam generated in the radial direction of the cylindrical mask is incident from the illumination area, and is set to be inclined by a predetermined angle of less than 90 ° from the center plane on the sheet substrate supported by the rotating drum. A second projection optical system for projecting the second image light beam in a radial direction of the rotary drum toward a second projection region, and an illumination light beam for epi-illuminating the first illumination region with the cylindrical mask and the cylindrical mask. When reflected from the first projection optical system Both, a first illumination system including a first beam splitter that transmits the first image light flux from the first illumination area toward the first projection optical system, and epi-illuminates the second illumination area. A second light beam is reflected between the cylindrical mask and the second projection optical system for reflecting the second image light beam from the second illumination area toward the second projection optical system. And a second illumination system including the beam splitter described above.

  According to the aspect of the present invention, even when one or both of the mask and the substrate have a cylindrical surface, a large mask pattern can be faithfully exposed by a cylindrical mask exposure apparatus having a compact projection optical system. Further, according to the aspect of the present invention, it is possible to provide a cylindrical mask exposure apparatus capable of faithfully exposing a large mask pattern.

  Further, according to the aspect of the present invention, it is possible to provide a cylindrical mask exposure apparatus capable of simplifying the configuration of the apparatus. Further, according to the aspect of the present invention, it is possible to provide a cylindrical mask exposure apparatus capable of reducing the manufacturing cost.

FIG. 1 is a diagram illustrating a configuration of a device manufacturing system according to a first embodiment. FIG. 1 is a diagram illustrating an overall configuration of a substrate processing apparatus (exposure apparatus) according to a first embodiment. FIG. 3 is a diagram illustrating a configuration of a mask holding device of the exposure apparatus illustrated in FIG. 2. FIG. 3 is a diagram illustrating a configuration of a first drum member and an illumination optical system of the exposure apparatus illustrated in FIG. 2. FIG. 3 is a diagram showing an arrangement of an illumination area and a projection area in the exposure apparatus shown in FIG. 2. FIG. 3 is a diagram illustrating a configuration of a projection optical system applied to the exposure apparatus illustrated in FIG. 2. FIG. 6 is a diagram illustrating an overall configuration of an exposure apparatus according to a second embodiment. FIG. 11 is a diagram illustrating an overall configuration of an exposure apparatus according to a third embodiment. FIG. 9 is a diagram illustrating a condition of a positional relationship of a projection area of an illumination area in the exposure apparatus illustrated in FIG. 8. 10 is a graph showing that the conditions described in FIG. 9 change according to the radius of the cylindrical mask. FIG. 14 is a diagram illustrating an overall configuration of an exposure apparatus according to a fourth embodiment. It is a figure showing composition of an epi-illumination system of an exposure device by a 5th embodiment. It is a figure showing the composition of the projection optical system by a 6th embodiment. FIG. 14 is a diagram showing a configuration in a case where the projection optical system shown in FIG. 13 is multiplied. FIG. 15 is a diagram of the multiplexed projection optical system shown in FIG. 14 when viewed from another direction. It is a figure showing the composition of the projection optical system by a 7th embodiment. It is a figure showing the composition of the projection optical system by an 8th embodiment. It is a figure showing the composition of the projection optical system by a 9th embodiment. It is a figure showing the composition of the projection optical system by a 10th embodiment. It is a figure showing the composition of the device manufacturing system of an eleventh embodiment. It is a figure showing composition of a substrate processing device (exposure device) of an 11th embodiment. It is a figure showing composition of an optical member of an 11th embodiment. It is a schematic diagram which shows the optical path from an illumination area to a projection area. It is a figure showing the example of composition of the light source device of an 11th embodiment. It is a figure showing the example of composition of the fly's eye lens array of an 11th embodiment. It is a figure showing the example of composition of the diaphragm in the illumination optical system of an 11th embodiment. It is a figure showing the example of composition of the optical member of an 11th embodiment. It is a figure showing the example of composition of the fly's eye lens array of a 12th embodiment. FIG. 37 is a diagram illustrating a configuration example of a fly-eye lens array according to a thirteenth embodiment. It is a figure showing the example of composition of the fly's eye lens array of a 14th embodiment. It is a figure showing the example of composition of the light source image formation part of a 15th embodiment. It is a figure showing the example of composition of the illumination optical system of a 16th embodiment. It is a figure showing the example of composition of the illumination optical system of a 16th embodiment. It is a figure showing each part of the illumination optical system of a 16th embodiment. It is a figure showing each part of the illumination optical system of a 16th embodiment. It is a figure showing each part of the illumination optical system of a 16th embodiment. It is a figure showing the composition of the substrate processing device (exposure device) of a 17th embodiment. It is a figure showing arrangement of an illumination field and a projection field of a 17th embodiment. It is a figure showing the example of composition of the exposure device of a 17th embodiment. FIG. 37 is a diagram illustrating a configuration example of a projection optical system according to an eighteenth embodiment. It is a figure showing the example of composition of the projection optical system of a 19th embodiment. 3 is a flowchart illustrating a device manufacturing method according to the embodiment.

[First Embodiment]
FIG. 1 is a diagram illustrating a configuration of a device manufacturing system 1001 according to the present embodiment. A device manufacturing system 1001 illustrated in FIG. 1 includes a substrate supply device 1002 that supplies a substrate P, a processing device 1003 that performs a predetermined process on the substrate P supplied by the substrate supply device 2, and a processing device 1003 that performs processing. And a higher-level control device 1005 for controlling each part of the device manufacturing system 1001.

  In the present embodiment, the substrate P is a flexible (sheet) substrate such as a so-called flexible substrate. The device manufacturing system 1001 of this embodiment can manufacture a flexible device using the flexible substrate P. The substrate P is selected so as to have such a degree of flexibility that the substrate P does not break when bent in the device manufacturing system 1001, for example.

  The flexibility of the substrate P at the time of device manufacture can be adjusted by, for example, the material, size, thickness, and the like of the substrate P, and is adjusted by environmental conditions such as humidity and temperature at the time of device manufacture. You can also. The substrate P may be a substrate having no flexibility, such as a so-called rigid substrate. Further, the substrate P may be a composite substrate obtained by combining a flexible substrate and a rigid substrate.

  The flexible substrate P is, for example, a resin film, a foil (foil) made of metal or alloy such as stainless steel, or the like. The material of the resin film is, for example, one of polyethylene resin, polypropylene resin, polyester resin, ethylene vinyl copolymer resin, polyvinyl chloride resin, cellulose resin, polyamide resin, polyimide resin, polycarbonate resin, polystyrene resin, and vinyl acetate resin. Or two or more.

  The substrate P is set to have a characteristic such as a coefficient of thermal expansion so that the amount of deformation due to heat received in various processing steps performed on the substrate P can be substantially ignored. As the substrate P, for example, a substrate having a coefficient of thermal expansion not significantly large can be selected. The thermal expansion coefficient may be set to be smaller than a threshold value according to a process temperature or the like by mixing an inorganic filler into a resin film, for example. The inorganic filler may be, for example, titanium oxide, zinc oxide, alumina, silicon oxide, or the like. Further, the substrate P may be a single-layered body of ultra-thin glass having a thickness of about 100 μm manufactured by a float method or the like, or a laminated body in which the above-described resin film, foil, and the like are bonded to this ultra-thin glass. It may be.

  In the present embodiment, the substrate P is a so-called multiple-panel substrate. The device manufacturing system 1001 of this embodiment repeatedly performs various processes for manufacturing one device on the substrate P. The substrate P that has been subjected to various kinds of processing is divided (diced) for each device into a plurality of devices. The dimensions of the substrate P are, for example, about 1 m to 2 m in the width direction (short direction) and about 10 m or more in the length direction (long direction).

  The dimensions of the substrate P are set as appropriate according to the dimensions of the device to be manufactured. For example, the dimension of the substrate P may be 1 m or less or 2 m or more in the width direction, or may be 10 m or less in the long direction. In addition, when the substrate P is a substrate for multi-panning, it may be a single band-shaped substrate or a substrate in which a plurality of substrates are joined. In addition, the device manufacturing system 1001 may manufacture a device using an independent substrate for each device. In this case, the substrate P may be a substrate having a size corresponding to one device.

  The substrate supply device 1002 of the present embodiment supplies the substrate P to the processing device 1003 by feeding out the substrate P wound around the supply roll 1006. The substrate supply device 1002 includes, for example, a shaft around which the substrate P is wound, a rotation driving unit that rotates the shaft, and the like. In the present embodiment, the substrate P is transported in the longitudinal direction and sent to the processing device 1003. That is, in the present embodiment, the transport direction of the substrate P is substantially the same as the long direction of the substrate P.

  Note that the substrate supply device 1002 may include a cover or the like that covers the substrate P wound around the supply roll 1006. Further, the substrate supply device 1002 may include a mechanism for sequentially feeding the substrates P in the longitudinal direction thereof, such as a nip-type driving roller.

  The substrate collecting apparatus 1004 of this embodiment collects the substrate P by winding the substrate P having passed through the processing apparatus 1003 around a collecting roll 1007. The substrate collection device 1004 includes, for example, a shaft portion around which the substrate P is wound, a rotation driving portion that rotates the shaft portion, and a cover portion that covers the substrate P wound up by the collection roll 1007, like the substrate supply device 1002. including.

  The processed substrate P may be cut by the cutting device, and the substrate collecting device 1004 may collect the cut substrate. In this case, the substrate collecting apparatus 1004 may be an apparatus that stacks and collects cut substrates. The above-described cutting device may be a part of the processing device 1003, or may be a device different from the processing device 1003, and may be, for example, a part of the substrate collecting device 1004.

  The processing apparatus 1003 transports the substrate P supplied from the substrate supply apparatus 1002 to the substrate recovery apparatus 1004, and performs a process on the surface to be processed of the substrate P during the transport. The processing apparatus 1003 includes a processing apparatus 1010 that performs processing on a surface to be processed of the substrate P, and a transport apparatus 1009 that includes a transport roller 1008 that sends the substrate P under conditions corresponding to the processing.

  The processing apparatus 1010 includes one or more apparatuses that execute various processes for forming elements constituting a device on the surface of the substrate P to be processed. In the device manufacturing system 1001 of the present embodiment, apparatuses for performing various processes are provided as appropriate along the transport path of the substrate P, and devices such as a flexible display can be produced by a so-called roll-to-roll method. According to the roll-to-roll method, devices can be efficiently produced.

  In the present embodiment, various apparatuses of the processing apparatus 1010 include a film forming apparatus, an exposure apparatus, a coater / developer apparatus, and an etching apparatus. The film forming device is, for example, a plating device, a vapor deposition device, a sputtering device, or the like. The film forming apparatus forms a functional film such as a conductive film, a semiconductor film, and an insulating film on the substrate P. The coater developer device forms a photosensitive material such as a photoresist film on the substrate P on which the functional film has been formed by the film forming device. The exposure apparatus performs an exposure process on the substrate P by projecting an image of a pattern corresponding to a film pattern forming the device onto the substrate P on which the photosensitive material is formed. The coater developer develops the exposed substrate P. The etching apparatus etches the functional film using the developed photosensitive material of the substrate P as a mask M. Thus, the processing apparatus 1010 forms a functional film having a desired pattern on the substrate P.

  Note that the processing apparatus 1010 may include an apparatus that directly forms a film pattern without using etching, such as an imprint-type film forming apparatus or a droplet discharge apparatus. At least one of the various devices of the processing device 1010 may be omitted.

  In the present embodiment, the host control device 1005 controls the substrate supply device 1002 to cause the substrate supply device 1002 to execute a process of supplying the substrate P to the processing device 1010. The host control device 1005 controls the processing device 1010 to cause the processing device 1010 to execute various processes on the substrate P. The host control device 1005 controls the substrate collection device 1004 to cause the substrate collection device 1004 to execute a process of collecting the substrate P on which the processing device 1010 has performed various processes.

  Next, the configuration of the substrate processing apparatus according to the present embodiment will be described with reference to FIGS. 2, 3, and 4. FIG. FIG. 2 is a diagram illustrating an overall configuration of the substrate processing apparatus 1011 according to the present embodiment. The substrate processing apparatus 1011 shown in FIG. 2 is at least a part of the processing apparatus 1010 as described above. The substrate processing apparatus 1011 according to the present embodiment includes an exposure apparatus EX that performs an exposure process, and at least a part of the transport apparatus 1009.

  The exposure apparatus EX of the present embodiment is a so-called scanning exposure apparatus, and is formed on the mask M while rotating the rotation of the cylindrical mask (cylindrical mask) M and the feeding of the flexible substrate P synchronously. An image of the pattern is projected onto the substrate P via a projection optical system PL (PL1001 to PL1006) having a projection magnification of 1 × (× 1). 2 to 4, the Y axis of the orthogonal coordinate system XYZ is set parallel to the rotation center line (first center line) AX1001 of the cylindrical mask M, and the X axis is the direction of scanning exposure, that is, The transfer direction of the substrate P at the exposure position is set.

  As shown in FIG. 2, the exposure apparatus EX includes a mask holding device 1012, an illumination device 1013, a projection optical system PL, and a control device 1014. The substrate processing apparatus 1011 rotates and moves the mask M held by the mask holding device 1012, and transfers the substrate P by the transfer device 1009. The illumination device 1013 illuminates a part (illumination region IR) of the mask M held by the mask holding device 1012 with the illumination light beam EL1 with uniform brightness. The projection optical system PL projects the image of the pattern in the illumination region IR on the mask M onto a part (projection region PA) of the substrate P being transported by the transport device 1009. A portion on the mask M arranged in the illumination region IR changes with the movement of the mask M, and a portion on the substrate P arranged in the projection region PA changes with the movement of the substrate P. An image of a predetermined pattern (mask pattern) on the mask M is projected on the substrate P. The control device 1014 controls each unit of the exposure apparatus EX and causes each unit to execute a process. In the present embodiment, the control device 1014 controls at least a part of the transport device 1009.

  Note that the control device 1014 may be a part or all of the host control device 1005 of the device manufacturing system 1001. The control device 1014 is controlled by the host control device 1005, and may be a device different from the host control device 1005. Control device 1014 includes, for example, a computer system. The computer system includes, for example, hardware such as a CPU, various memories, an OS, and peripheral devices. The process of the operation of each unit of the substrate processing apparatus 1011 is stored in a computer-readable recording medium in the form of a program, and various processes are performed by reading and executing the program by the computer system. The computer system also includes a homepage providing environment (or a display environment) if it can be connected to the Internet or an intranet system. The computer-readable recording medium includes a portable medium such as a flexible disk, a magneto-optical disk, a ROM, and a CD-ROM, and a storage device such as a hard disk built in a computer system. A computer-readable recording medium is a medium that dynamically holds a program for a short time, such as a communication line for transmitting a program through a network such as the Internet or a communication line such as a telephone line. Such as those that hold programs for a certain period of time, such as volatile memory inside a computer system serving as a server or client. Further, the program may be for realizing a part of the function of the substrate processing apparatus 1011 or may be for realizing the function of the substrate processing apparatus 1011 in combination with a program already recorded in the computer system. The upper control device 1005 can be realized using a computer system, similarly to the control device 1014.

  Next, each part of the exposure apparatus EX of FIG. 2 will be described in detail with reference to FIGS. FIG. 3 is a diagram showing a configuration of the mask holding device 1012, and FIG. 4 is a diagram showing a configuration of the first drum member 1021 and the illumination optical system IL.

  As shown in FIG. 3 (FIG. 2), the mask holding device 1012 includes a first member (hereinafter, referred to as a first drum member 1021) that holds the mask M, a guide roller 1023 that supports the first drum member 1021, and a first member. A drive roller 1024 that drives the drum member 1021, a first detector 1025 that detects the position of the first drum member 1021, and a first drive unit 1026 are provided.

  As shown in FIG. 4 (FIG. 2 or FIG. 3), the first drum member 1021 forms a first surface p1001 on which the illumination region IR on the mask M is arranged. In the present embodiment, the first surface p1001 includes a surface (hereinafter, referred to as a cylindrical surface) obtained by rotating a line segment (generating line) around an axis (first central axis AX1001) parallel to the line segment. The cylindrical surface is, for example, an outer peripheral surface of a cylinder, an outer peripheral surface of a cylinder, or the like. The first drum member 1021 is made of, for example, glass, quartz, or the like, has a cylindrical shape with a certain thickness, and an outer peripheral surface (cylindrical surface) forms a first surface p1001. That is, in the present embodiment, the illumination region IR on the mask M is curved in a cylindrical shape having a constant radius r1001 (see FIG. 1) from the rotation center line AX1001. A portion of the first drum member 1021 that overlaps the pattern of the mask M when viewed from the radial direction of the first drum member 1021, for example, a central portion other than both ends in the Y-axis direction of the first drum member 1021 as shown in FIG. It has a light-transmitting property with respect to the illumination light beam EL1001.

  The mask M is, for example, formed as a transmission-type planar sheet mask in which a pattern is formed on one surface of a strip-shaped ultra-thin glass plate (for example, having a thickness of 100 to 500 μm) having good flatness with a light-shielding layer such as chrome. It is used in a state of being curved along the outer peripheral surface of the first drum member 21 and wound (attached) to this outer peripheral surface. The mask M has a pattern non-formation area where no pattern is formed, and is attached to the first drum member 1021 in the pattern non-formation area. The mask M can be removed (released) from the first drum member 1021.

  The mask M is made of an ultra-thin glass plate, and instead of winding the mask M around the first drum member 1021 made of a transparent cylindrical base material, chrome or the like is directly formed on the outer peripheral surface of the first drum member 1021 made of a transparent cylindrical base material. A mask pattern by a light shielding layer may be formed by drawing and integrated. Also in this case, the first drum member 1021 functions as a support member for the mask (first object).

  Note that the first drum member 1021 may have a structure in which a thin plate-shaped mask M is attached to the inner peripheral surface thereof by bending it. Further, the mask M may be formed with the entire or a part of the panel pattern corresponding to one display device, or may be formed with the panel pattern corresponding to a plurality of display devices. Further, in the mask M, a plurality of panel patterns may be repeatedly arranged in the circumferential direction around the first central axis AX1001, or a small panel pattern may be repeated in a direction parallel to the first central axis AX1001. A plurality may be arranged. Further, the mask M may include a panel pattern of the first display device and a panel pattern of the second display device having a size different from that of the first display device. The outer peripheral surface (or inner peripheral surface) of the first drum member 1021 has a structure in which a plurality of separated thin plate-shaped masks M can be individually attached in a direction parallel to the first central axis AX1001 or in a circumferential direction. It may be provided.

  The guide roller 1023 and the drive roller 1024 shown in FIG. 3 extend in the Y-axis direction parallel to the first central axis AX1001 of the first drum member 1021. The guide roller 1023 and the drive roller 1024 are provided to be rotatable around an axis parallel to the first central axis AX1001. Each of the guide roller 1023 and the drive roller 1024 has an outer diameter at an axial end portion larger than the outer shape of the other portion, and this end portion is circumscribed to the first drum member 1021. Thus, the guide roller 1023 and the drive roller 1024 are provided so as not to contact the mask M held by the first drum member 1021. The drive roller 1024 is connected to the first drive unit 1026. The drive roller 1024 rotates the first drum member 1021 around the first central axis AX1001 by transmitting the torque supplied from the first drive unit 1026 to the first drum member 1021.

  Although the mask holding device 1012 includes one guide roller 1023 and one drive roller 1024, the number of guide rollers 1023 may be two or more, or the number of drive rollers 1024 may be two or more. At least one of the guide roller 1023 and the drive roller 1024 is disposed inside the first drum member 1021, and may be in contact with the first drum member 1021. Further, portions of the first drum member 1021 that do not overlap with the pattern of the mask M when viewed from the radial direction of the first drum member 1021 (both ends in the Y-axis direction) have a light-transmitting property with respect to the illumination light beam EL1. And may not have translucency. One or both of the guide roller 1023 and the drive roller 1024 may have, for example, a truncated cone shape, and the central axis (rotation axis) may be non-parallel to the first central axis AX1001.

  The first detector 1025 optically detects the rotational position of the first drum member 1021. The first detector 1025 includes, for example, a rotary encoder and the like. The first detector 1025 supplies information indicating the detected rotational position of the first drum member 1021 to the control device 1014. The first drive unit 1026 including an actuator such as an electric motor adjusts a torque for rotating the drive roller 1024 according to a control signal supplied from the control device 1014. The control device 1014 controls the rotation position of the first drum member 1021 by controlling the first driving unit 1026 based on the detection result of the first detector 1025. In other words, the control device 1014 controls one or both of the rotation position and the rotation speed of the mask M held by the first drum member 1021.

  Note that a sensor (hereinafter, referred to as a Y-direction position measurement sensor) for optically measuring the position of the first drum member 1021 in the Y-axis direction in FIG. 3 can be added to the first detector 1025. Although the position of the first drum member 1021 in the Y direction shown in FIGS. 2 and 3 is basically restricted so as not to fluctuate, the relative position between the exposure region or the alignment mark on the substrate P and the pattern of the mask M is restricted. It is conceivable to incorporate a mechanism (actuator) for finely moving the first drum member 1021 (mask M) in the Y direction in order to achieve accurate alignment. In such a case, the Y-direction fine movement mechanism of the first drum member 1021 can be controlled using the measurement information from the Y-direction position measurement sensor.

  As shown in FIG. 2, the transport device 1009 includes a first transport roller 1030, a first guide member 1031, and a second support member (hereinafter, referred to as a second support member) that forms a second surface p1002 on which the projection area PA on the substrate P is arranged. A second drum member 1022), a second guide member 1033, a second transport roller 1034, a second detector 1035, and a second drive unit 1036. Note that the transport roller 1008 illustrated in FIG. 1 includes a first transport roller 1030 and a second transport roller 1034.

  In the present embodiment, the substrate P transported from the upstream of the transport path to the first transport roller 1030 is transported to the first guide member 1031 via the first transport roller 1030. The substrate P having passed through the first guide member 1031 is supported by the surface of a cylindrical or columnar second drum member (cylindrical member) 1022 having a radius r1002, and is conveyed to the second guide member 1033. The substrate P that has passed through the second guide member 1033 is transported downstream of the transport path via the second transport roller 1034. Note that the rotation center line (second center line) AX1002 of the second drum member 1022 and each rotation center line of the first conveyance roller 1030 and the second conveyance roller 1034 are parallel to the Y axis. Is set.

  The first guide member 1031 and the second guide member 1033 move, for example, in a direction intersecting the width direction of the substrate P (move in the XZ plane in FIG. 2), and thereby tension acting on the substrate P in the transport path. To adjust. Further, the first guide member 1031 (and the first transport roller 1030) and the second guide member 1033 (and the second transport roller 1034) are configured to be movable in the width direction (Y direction) of the substrate P, for example. Thereby, the position and the like in the Y direction of the substrate P wound around the outer periphery of the second drum member 1022 can be adjusted. Note that the transport device 1009 only needs to be able to transport the substrate P along the projection area PA of the projection optical system PL, and its configuration can be appropriately changed.

  The second drum member 1022 forms a second surface p1002 that circularly supports a portion including the projection area PA on the substrate P on which the image-forming light beam from the projection optical system PL is projected. In the present embodiment, the second drum member 1022 is a part of the transport device 1009 and also serves as a support member (substrate stage) that supports the substrate P to be exposed. That is, the second drum member 1022 may be a part of the exposure apparatus EX.

  The second drum member 1022 is rotatable around a central axis thereof (hereinafter, referred to as a second central axis AX1002), and the substrate P has a cylindrical surface along the outer peripheral surface (cylindrical surface) on the second drum member 1022. The projection area PA is arranged in a part of the curved portion.

In this embodiment, the radius r1001 of the portion of the outer peripheral surface of the first drum member 1021 around which the mask M is wound and the radius r1002 of the portion of the outer peripheral surface of the second drum member 1022 around which the substrate P is wound are: They are set substantially the same. This is because it is assumed that the thickness of the thin plate-shaped mask M is substantially equal to the thickness of the substrate P.
On the other hand, for example, when a pattern is directly formed on the outer peripheral surface of the first drum member 1021 (transparent cylindrical base material) by a chrome layer or the like, the thickness of the chrome layer can be ignored, and the radius of the pattern surface of the mask is r1001. On the other hand, if the thickness of the substrate P is about 200 μm, the radius of the surface of the substrate P in the projection area PA is r1002 + 200 μm. In such a case, the radius r1002 of a portion of the outer peripheral surface of the second drum member 1022 around which the substrate P is wound may be reduced by the thickness of the substrate P.
From this, in order to strictly set the conditions, the radius of the pattern surface (cylindrical surface) of the mask supported on the outer peripheral surface of the first drum member 1021 should be adjusted to the substrate supported on the outer peripheral surface of the second drum member 1022. The radii of the first drum member 1021 and the second drum member 1022 may be determined so as to be equal to the radius of the surface of P.

  In the present embodiment, the second drum member 1022 is rotated by a torque supplied from a second driving unit 1036 including an actuator such as an electric motor. The second detector 1035 includes, for example, a rotary encoder or the like, and optically detects the rotational position of the second drum member 1022. The second detector 1035 supplies information indicating the detected rotational position of the second drum member 1022 to the control device 1014. The second driving unit 1036 adjusts the torque for rotating the second drum member 1022 according to a control signal supplied from the control device 1014. The control device 1014 controls the rotation position of the second drum member 1022 by controlling the second driving unit 1036 based on the detection result of the second detector 1035, and controls the first drum member 1021 and the second drum member 1022. Are moved synchronously (synchronous rotation).

  By the way, when the substrate P is a thin flexible film, wrinkles and twists may occur when the substrate P is wound around the second drum member 1022. Therefore, it is important to make the substrate P enter the substrate D as straight as possible to the contact position with the outer peripheral surface of the second drum member 1022, and to make the tension in the transport direction (X direction) given to the substrate P as constant as possible. From such a viewpoint, the control device 1014 controls the second driving unit 1036 so that the rotation speed unevenness of the second drum member 1022 is extremely small.

  In the present embodiment, when a plane including the first center axis AX1001 of the first drum member 1021 and the second center axis AX1002 of the second drum member 1022 is defined as a center plane p1003 (parallel to the YZ plane), the center plane p1003 Near the position where the first plane p1001 and the first plane p1001 intersect, the center plane p1003 and the first plane p1001 are approximately orthogonal to each other, and similarly, the center plane p1003 and the second plane p1002 are cylindrical. In the vicinity of the crossing point, the center plane p1003 and the second plane p1002 are approximately orthogonal to each other.

  The exposure apparatus EX of the present embodiment is an exposure apparatus on the assumption that a so-called multi-lens type projection optical system is mounted. The projection optical system PL includes a plurality of projection modules that project a partial image of the pattern of the mask M. For example, in FIG. 2, three projection modules (projection optical systems) PL1001, PL1003, and PL1005 are arranged at a certain interval in the Y direction on the left side of the center plane p1003, and three projection modules (projection optical systems) are also on the right side of the center plane p1003. (System) PL1002, PL1004, PL1006 are arranged at regular intervals in the Y direction.

  In such a multi-lens type exposure apparatus EX, the end portions in the Y direction of the areas (projection areas PA1001 to PA1006) exposed by the plurality of projection modules PL1001 to PL1006 are overlapped by scanning to obtain a desired pattern. Project the whole image. In such an exposure apparatus EX, even when the size of the pattern on the mask M in the Y direction becomes large and the necessity of handling the substrate P having a large width in the Y direction arises, the projection module and the illumination corresponding thereto are required. Since it is only necessary to add the module on the device 1013 side in the Y direction, there is an advantage that it can be easily applied to increase the panel size (width of the substrate P).

  Note that the exposure apparatus EX need not be a multi-lens type. For example, when the dimension in the width direction of the substrate P is somewhat small, the exposure apparatus EX may project an image of the entire width of the pattern onto the substrate P by using one projection module. Further, each of the plurality of projection modules PL1001 to PL1006 may project a pattern corresponding to one device. That is, the exposure apparatus EX may project the patterns for a plurality of devices in parallel by the plurality of projection modules.

  The illumination device 1013 of the present embodiment includes a light source device (not shown) and an illumination optical system IL. As shown in FIG. 4, the illumination optical system IL includes a plurality (for example, six) of illumination modules IL1001 to IL1006 arranged in the Y-axis direction corresponding to each of the plurality of projection modules PL1001 to PL1006. The light source device includes, for example, a lamp light source such as a mercury lamp or a solid light source such as a laser diode or a light emitting diode (LED). Illumination light emitted from the light source device is, for example, bright lines (g-line, h-line, i-line) emitted from a lamp light source, far ultraviolet light (DUV light) such as KrF excimer laser light (wavelength 248 nm), or ArF excimer laser light. (Wavelength 193 nm). Illumination light emitted from the light source device has a uniform illuminance distribution and is distributed to a plurality of illumination modules IL1001 to IL1006 via a light guide member such as an optical fiber.

  Note that the light source device may be arranged inside the first drum member 1021 or may be arranged outside the first drum member 1021. Further, the light source device may be another device (external device) different from the exposure device EX.

  Each of the plurality of illumination modules IL1001 to IL1006 includes a plurality of optical members such as lenses. In the present embodiment, light emitted from the light source device and passing through any one of the plurality of illumination modules IL1001 to IL1006 is referred to as an illumination light beam EL1. Each of the plurality of illumination modules IL1001 to IL1006 includes, for example, an integrator optical system, a rod lens, a fly-eye lens, and the like, and illuminates the illumination region IR with the illumination light beam EL1 having a uniform illumination distribution. In the present embodiment, the plurality of lighting modules IL1001 to IL1006 are arranged inside the first drum member 1021. Each of the plurality of illumination modules IL1001 to IL1006 passes through the first drum member 1021 from inside the first drum member 1021, and passes through each of the illumination regions IR (IR1001 to IR1001) on the mask M held on the outer peripheral surface of the first drum member 1021. Illuminate IR1006).

  In the present embodiment, each of the lighting modules is referred to as a first lighting module IL1001, a second lighting module IL1002, and a third lighting module in order from the −Y side (front side in FIG. 2) to the + Y side (back side in FIG. 2). The lighting module IL1003, the fourth lighting module IL1004, the fifth lighting module IL1005, and the sixth lighting module IL1006. That is, among the plurality of lighting modules IL1001 to IL1006, the first lighting module IL1001 is arranged closest to the −Y side, and the sixth lighting module IL1006 is arranged closest to the + Y side. The number of projection modules included in the projection optical system PL may be one or more and five or less, or seven or more.

  The plurality of illumination modules IL1001 to IL1006 are spaced apart from each other in a direction (for example, the X-axis direction) intersecting with the first central axis AX1001 so as not to interfere with each other. The first lighting module IL1001, the third lighting module IL1003, and the fifth lighting module IL1005 are arranged at positions overlapping each other when viewed from the Y-axis direction. The first lighting module IL1001, the third lighting module IL1003, and the fifth lighting module IL1005 are arranged apart from each other in the Y-axis direction.

  In the present embodiment, the second lighting module IL1002 is symmetrically disposed with respect to the center plane p1003 with respect to the first lighting module IL1001 when viewed from the Y-axis direction. The fourth lighting module IL1004 and the sixth lighting module IL1006 are arranged at positions overlapping the second lighting module IL1002 when viewed from the Y-axis direction. The second lighting module IL1002, the fourth lighting module IL1004, and the sixth lighting module IL1006 are arranged apart from each other in the Y-axis direction.

  Each of the plurality of lighting modules IL1001 to IL1006 extends in a first radial direction D1001 or a second radial direction D1002 intersecting with the center plane p1003 in the radial direction (radial direction) of the first drum member 1021 with respect to the first central axis AX1001. The illumination light beam EL1 is directed toward the light source. The irradiation direction of the illumination light beam EL1 of each illumination module changes alternately in the order in which the illumination modules are arranged in the Y-axis direction. For example, the irradiation direction (first radial direction D1001) of the illumination light beam from the first illumination module IL1 is inclined to the −X side from the Z-axis direction, and the irradiation direction of the illumination light beam from the second illumination module IL1002 (first direction). The two radial directions D1002) are inclined more toward the + X side than the -Z axis direction. Similarly, the irradiation direction of the illumination light beam from each of the third lighting module IL1003 and the fifth lighting module IL1005 is substantially parallel to the irradiation direction of the first lighting module IL1001, and the fourth lighting module IL1004 and the sixth The irradiation direction of the illumination light beam from each of the illumination modules IL1006 is substantially parallel to the irradiation direction of the second illumination module IL1002.

  FIG. 5 is a diagram illustrating an arrangement of the illumination region IR and the projection region PA in the present embodiment. Note that FIG. 5 is a plan view (left view in FIG. 5) of the illumination region IR on the mask M arranged on the first drum member 1021 as viewed from the −Z side, and is arranged on the second drum member 1022. A plan view (right diagram in FIG. 5) of the projection area PA on the substrate P as viewed from the + Z side is illustrated. The symbol Xs in FIG. 5 indicates the moving direction (rotation direction) of the first drum member 1021 or the second drum member 1022.

  The first to sixth illumination modules IL1001 to IL1006 illuminate the first to sixth illumination regions IR1001 to IR1006 on the mask M, respectively. For example, the first illumination module IL1001 illuminates the first illumination region IR1001, and the second illumination module IL1002 illuminates the second illumination region IR1002.

  The first illumination region IR1001 in the present embodiment will be described as a trapezoidal region elongated in the Y direction, but depending on the configuration of a projection optical system (projection module) PL described later, a rectangular region including the trapezoidal region. It is good. The third illumination region IR1003 and the fifth illumination region IR1005 are each a region having the same shape as the first illumination region IR1001, and are arranged at regular intervals in the Y-axis direction. The second illumination region IR1002 is a trapezoidal (or rectangular) region symmetrical to the first illumination region IR1001 with respect to the center plane p1003. The fourth illumination region IR1004 and the sixth illumination region IR1006 are each a region having the same shape as the second illumination region IR1002, and are arranged at regular intervals in the Y-axis direction.

  As shown in FIG. 5, each of the first to sixth illumination regions IR1001 to IR1006 has a triangular portion on the hypotenuse of an adjacent trapezoidal illumination region when viewed along the circumferential direction of the first surface p1001. They are arranged to overlap (overlap). Therefore, for example, the first region A1001 on the mask M that passes through the first illumination region IR1001 due to the rotation of the first drum member 1021 is on the mask M that passes through the second illumination region IR1002 due to the rotation of the first drum member 1021. It partially overlaps with the second area A1002.

  In the present embodiment, the mask M has a pattern formation region A1003 where a pattern is formed, and a pattern non-formation region A1004 where a pattern is not formed. The pattern non-forming region A1004 is arranged so as to surround the pattern forming region A1003 in a frame shape, and has a characteristic of shielding the illumination light beam EL1. The pattern formation region A1003 of the mask M moves in the direction Xs with the rotation of the first drum member 1021, and each of the partial regions in the Y-axis direction of the pattern formation region A1003 includes the first to sixth illumination regions IR1001 to IR1001. Passes through any of IR1006. In other words, the first to sixth illumination regions IR1001 to IR1006 are arranged so as to cover the entire width of the pattern formation region A1003 in the Y-axis direction.

  As shown in FIG. 2, the projection optical system PL includes a plurality of projection modules PL1001 to PL1006 arranged in the Y-axis direction. Each of the plurality of projection modules PL1001 to PL1006 has a one-to-one correspondence with each of the first to sixth illumination modules IL1006, and a part of the mask M appearing in the illumination region IR illuminated by the corresponding illumination module. Is projected onto each projection area PA on the substrate P.

  For example, the first projection module PL1001 corresponds to the first illumination module IL1001, and transfers the image of the pattern of the mask M in the first illumination region IR1001 (see FIG. 5) illuminated by the first illumination module IL1001 onto the substrate P. The image is projected on the first projection area PA1001. The third projection module PL1003 and the fifth projection module PL1005 correspond to the third illumination module IL1003 and the fifth illumination module IL1005, respectively. The third projection module PL1003 and the fifth projection module PL1005 are arranged at positions overlapping the first projection module PL1001 when viewed from the Y-axis direction.

  The second projection module PL1002 corresponds to the second illumination module IL1002, and transfers the image of the pattern of the mask M in the second illumination region IR1002 (see FIG. 5) illuminated by the second illumination module IL1002 onto the substrate P. The projection is performed on the second projection area PA1002. The second projection module PL1002 is disposed symmetrically with respect to the first projection module PL1001 with respect to the center plane p1003 when viewed from the Y-axis direction.

  The fourth projection module PL1004 and the sixth projection module PL1006 are arranged corresponding to the fourth illumination module IL1004 and the sixth illumination module IL1006, respectively. The fourth projection module PL1004 and the sixth projection module PL1006 are arranged in the Y-axis direction. Seen, it is arranged at a position overlapping the second projection module PL1002.

  In the present embodiment, light reaching each of the illumination regions IR1001 to IR1006 on the mask M from each of the illumination modules IL1001 to IL1006 of the illumination device 1013 is referred to as an illumination light beam EL1, and a portion of the mask M appearing in each of the illumination regions IR1001 to IR1006. The light that has received the intensity distribution modulation according to the pattern and is incident on each of the projection modules PL1001 to PL1006 and reaches each of the projection areas PA1001 to PA1006 is referred to as an image forming light flux EL2.

  As shown in the right diagram in FIG. 5, the image of the pattern in the first illumination area IR1001 is projected on the first projection area PA1001, the image of the pattern in the third illumination area IR1003 is projected on the third projection area PA1003, The image of the pattern in fifth illumination region IR1005 is projected onto fifth projection region PA1005. In the present embodiment, the first projection area PA1001, the third projection area PA1003, and the fifth projection area PA1005 are arranged so as to be aligned in the Y-axis direction.

  Further, the image of the pattern in second illumination region IR1002 is projected on second projection region PA1002. In the present embodiment, the second projection area PA1002 is arranged symmetrically with respect to the center plane p1003 with respect to the first projection area PA1001 when viewed from the Y-axis direction. Further, the image of the pattern in the fourth illumination region IR1004 is projected on the fourth projection region PA1004, and the image of the pattern in the sixth illumination region IR1006 is projected on the sixth projection region PA1006. In the present embodiment, the second projection area PA1002, the fourth projection area PA1004, and the sixth projection area PA1006 are arranged so as to be aligned in the Y-axis direction.

Each of the first to sixth projection areas PA1001 to PA1006 is, when viewed along the circumferential direction of the second surface p1002, a projection area adjacent in a direction parallel to the second central axis AX1002 and an end (trapezoidal shape). (Triangular portions) are arranged to overlap. Therefore, for example, the third area A1005 on the substrate P passing through the first projection area PA1001 due to the rotation of the second drum member 1022 is on the substrate P passing through the second projection area PA1002 due to the rotation of the second drum member 1022. It partially overlaps with the fourth area A1006.
Each of the first projection area PA1001 and the second projection area PA1002 is set such that the exposure amount in the area where the third area A1005 and the fourth area A1006 overlap is substantially the same as the exposure amount in the non-overlapping area. The shape and the like are set.

  In the present embodiment, a region to be exposed on the substrate P (hereinafter, referred to as an exposure region A1007) moves in the direction Xs with the rotation of the second drum member 1022 as shown in the right diagram in FIG. Each partial area in the Y-axis direction in the area A1007 passes through any of the first to sixth projection areas PA1001 to PA1006. In other words, the first to sixth projection areas PA1001 to PA1006 are arranged so as to cover the entire width of the exposure area A1007 in the Y-axis direction.

  Note that the irradiation direction of the illumination light beam EL1 to the first projection module PL1001 may be, for example, the traveling direction of the principal ray passing through any position in the first illumination region IR1001, or the principal direction passing the center of the first illumination region IR1001. The traveling direction of the light beam may be used. The same applies to the irradiation direction of the illumination light beam EL1 to the second to sixth projection modules PL1002 to PL1006.

  By the way, the first to sixth projection areas PA1001 to PA1006 may be arranged such that areas on the substrate P passing through any of them do not overlap each other at the ends. For example, the third area A1005 passing through the first projection area PA1001 may not partially overlap the fourth area A1006 passing through the second projection area PA1002. That is, even in the case of the multi-lens system, the joint exposure by each projection module may not be performed. In this case, the third area A1005 is an area where a pattern corresponding to the first device is projected, and the fourth area A1006 is an area where a pattern corresponding to the second device is projected. Good. The second device is a device of the same type as the first device, and the same pattern as that of the third region A1005 may be projected on the fourth region A1006. The second device is a device of a different type from the first device, and a pattern different from that of the third region A1005 may be projected on the fourth region A1006.

  Next, a detailed configuration of the projection optical system PL of the present embodiment will be described with reference to FIG. Note that, in the present embodiment, each of the second to sixth projection modules PL1001 to PL1006 has the same configuration as the first projection module PL1001. Therefore, the configuration of the first projection module PL1001 will be described as a representative of the projection optical system PL.

  The first projection module PL1001 illustrated in FIG. 6 includes a first optical system 1041 that forms an image of the pattern of the mask M arranged in the first illumination region IR1001 on the intermediate image plane p1007, and the first optical system 1041. A second optical system 1042 for re-imaging at least a part of the intermediate image on the first projection area PA1001 of the substrate P, and a first field stop 1043 arranged on an intermediate image plane p1007 on which the intermediate image is formed.

  The first projection module PL1001 includes a focus correction optical member 1044 for finely adjusting the focus state of a pattern image (hereinafter, referred to as a projection image) of a mask formed on the substrate P, and the projection image is minutely adjusted in the image plane. An image shift correction optical member 1045 for laterally shifting the image, a magnification correction optical member 1047 for finely correcting the magnification of the projected image, and a rotation correction mechanism 1046 for slightly rotating the projected image within the image plane.

  The focus correction optical member 1044 is arranged at a position where the imaging light beam EL2 emitted from the first illumination region IR1001 enters, and the image shift correction optical member 1045 receives the imaging light beam EL2 emitted from the focus correction optical member 1044. Is located in the position. The magnification correcting optical member 1047 is arranged at a position where the imaging light beam EL2 emitted from the second optical system 1042 is incident.

  The imaging light flux EL2 from the pattern of the mask M is emitted in the normal direction from the first illumination region IR1001, passes through the focus correction optical member 1044, and enters the image shift correction optical member 1045. The image forming light beam EL2 transmitted through the image shift correcting optical member 1045 is reflected by the first reflecting surface (plane mirror) p1004 of the first deflecting member 1050, which is an element of the first optical system 1041, and passes through the first lens group 1051. The light is reflected by the first concave mirror 1052, passes through the first lens group 1051 again, is reflected by the second reflecting surface (plane mirror) p1005 of the first deflecting member 1050, and enters the first field stop 1043.

The image forming light beam EL2 that has passed through the first field stop 1043 is reflected by the third reflecting surface (plane mirror) p1008 of the second deflecting member 1057, which is an element of the second optical system 1042, passes through the second lens group 1058, and passes through the second lens group 1058. The light is reflected by the two concave mirror 1059, passes through the second lens group 1058 again, is reflected by the fourth reflecting surface (plane mirror) p1009 of the second deflecting member 1057, and enters the magnification correcting optical member 1047.
The imaging light beam EL2 emitted from the magnification correcting optical member 1047 enters the first projection area PA1001 on the substrate P, and an image of a pattern appearing in the first illumination area IR1001 is magnified (×) in the first projection area PA1001. Projected in 1).

  The first optical system 1041 and the second optical system 1042 are, for example, telecentric catadioptric optical systems obtained by modifying a Dyson system. In the present embodiment, the optical axis of the first optical system 1041 (hereinafter, referred to as first optical axis AX1003) is substantially orthogonal to the center plane p1003. The first optical system 1041 includes a first deflecting member 1050, a first lens group 1051, and a first concave mirror 1052. The imaging light beam EL2 emitted from the image shift correction optical member 1045 is reflected by the first reflection surface p1004 of the first deflection member 1050, travels toward one side (−X side) of the first optical axis AX1003, and The light enters the first concave mirror 1052 disposed on the pupil plane through one lens group 1051. The imaging light flux EL2 reflected by the first concave mirror 1052 travels to the other side (+ X side) of the first optical axis AX1003, passes through the first lens group 1051, and is reflected by the second reflection surface p1005 of the first deflection member 1050. Then, the light enters the first field stop 1043.

  The first deflecting member 1050 is a triangular prism extending in the Y-axis direction. In the present embodiment, each of the first reflection surface p1004 and the second reflection surface p1005 includes a mirror surface (the surface of the reflection film) formed on the surface of the triangular prism. The principal ray EL3 of the imaging light beam EL2 passing through the center of the first illumination region IR1001 travels along the first radial direction D1001 inclined in the XZ plane with respect to the center plane p1003 and enters the first projection module PL1001. I do.

  The first deflecting member 1050 includes a principal ray EL3 reaching the first reflection surface p1004 from the first illumination region IR1001 and a principal ray EL3 (parallel to the center plane p1003) reaching the intermediate image plane p1007 from the second reflection plane p1005. The imaging light beam EL2 is deflected so as to be non-parallel (intersect) in the XZ plane.

  In order to form the above optical path, in the present embodiment, the first deflecting member 1050 includes a ridge line where the first reflection surface p1004 and the second reflection surface p1005 intersect and the first optical axis AX1003, and the XY plane. Assuming that the parallel surface is p1006, the first reflection surface p1004 and the second reflection surface p1005 are arranged at an asymmetric angle with respect to this surface p1006.

  Assuming that the angle of the first reflection surface p1004 with respect to the surface p1006 is θ1001 and the angle of the second reflection surface p1005 with respect to the surface p1006 is θ1002, in this embodiment, the angle (θ1001 + θ1002) is set to less than 90 °, and the angle θ1001 is 45. And the angle θ1002 is set to substantially 45 °.

By setting the principal ray EL3 reflected by the first reflection surface p1004 and entering the first lens group 1051 in parallel with the optical axis AX1003, the principal ray EL3 is located at the center of the first concave mirror 1052, that is, the optical axis of the pupil plane. It can pass through the intersection with AX1003, and a telecentric imaging state can be secured. For this purpose, in FIG. 6, when the inclination angle of the principal ray EL3 (first radial direction D1001) from the first illumination region IR1001 to the first reflection surface p1004 with respect to the center plane p1003 is θd, the first reflection surface p1004 May be set so as to satisfy the following equation (1).
θ1001 = 45 ° − (θd / 2) (1)

  In the present embodiment, each of the plurality of lenses belonging to the first lens group 1051 has an axially symmetric shape around the first optical axis AX1003. The imaging light beam EL2 reflected by the first reflection surface p1004 enters the first lens group 1051 from one side (+ Z side) of the surface p1006. The first concave mirror 1052 is arranged at or near the position of the pupil plane of the first optical system 1041.

  The principal ray EL3 of the imaging light beam EL2 that has passed through the first lens group 1051 is incident on the intersection of the first optical axis AX1003 and the first concave mirror 1052. The imaging light beam EL2 reflected by the first concave mirror 1052 travels in the first lens group 1051 along an optical path symmetrical with respect to the plane p1006 as compared to before entering the first concave mirror 1052. The image forming light beam EL2 reflected by the first concave mirror 1052 exits from the other side (−Z side) of the first lens group 1051, is reflected by the second reflecting surface p1005 of the first deflecting member 1050, and is reflected by the center plane p1003. It travels along a parallel principal ray EL3.

  The first field stop 1043 has an opening that defines the shape of the first projection area PA1001. That is, the shape of the opening of the first field stop 1043 defines the shape of the first projection area PA1001. Accordingly, as shown in FIG. 6, when the field stop 1043 can be arranged on the intermediate image plane p1007, the aperture shape of the field stop 1043 can be made trapezoidal as shown in the right diagram of FIG. In that case, the respective shapes of the first to sixth illumination regions IR1001 to IR1006 do not have to be similar to the respective shapes (trapezoids) of the first to sixth projection regions PA1001 to PA1006. The aperture may be rectangular so as to include the trapezoidal shape of the field stop 1043).

  The second optical system 1042 has the same configuration as the first optical system 1041, and is provided symmetrically with respect to the intermediate image plane p1007 including the first field stop 1043. An optical axis of the second optical system 1042 (hereinafter, referred to as a second optical axis AX1004) is substantially orthogonal to the center plane p1003. The second optical system 1042 includes a second deflecting member 1057, a second lens group 1058, and a second concave mirror 1059. The imaging light beam EL2 emitted from the first optical system 1041 and passed through the first field stop 1043 is reflected by the third reflecting surface p1008 of the second deflecting member 1057, passes through the second lens group 1058, and becomes the second concave mirror 1059. Incident on. The imaging light beam EL2 reflected by the second concave mirror 1059 passes through the second lens group 1058 again, is reflected by the fourth reflecting surface p1009 of the second deflecting member 1057, and enters the magnification correcting optical member 1047.

The second deflecting member 1057, the second lens group 1058, and the second concave mirror 1059 of the second optical system 1042 are the same as the first deflecting member 1050, the first lens group 1051, and the first concave mirror 1052 of the first optical system 1041, respectively. It is. The angle θ1003 formed by the third reflection surface p1008 of the second deflection member 1057 with the second optical axis AX1004 is substantially the same as the angle θ1002 formed by the second reflection surface p1005 of the first deflection member 1050 with the first optical axis AX1003. is there. The angle θ1004 formed by the fourth reflection surface p1009 of the second deflection member 1057 with the second optical axis AX1004 is substantially equal to the angle θ1001 formed by the first reflection surface p1004 of the first deflection member 1050 with the first optical axis AX1003. Is the same. Each of the plurality of lenses belonging to the second lens group 1058 has a shape that is axially symmetric about the second optical axis AX1004.
The second concave mirror 1059 is arranged at or near the position of the pupil plane of the second optical system 1042.

  The image forming light beam EL2 that has passed through the first field stop 1043 travels in a direction along a principal ray parallel to the central plane p1003, and enters the third reflecting surface (plane) p1008. The inclination angle θ1003 of the third reflection surface p1008 with respect to the second optical axis AX1004 (or the surface p1006 or the intermediate image plane p1007) of the second optical system 1042 is 45 ° in the XZ plane, and the image forming light beam EL2 reflected here is , Into the upper half viewing area of the second lens group 1058. The principal ray EL3 of the imaging light beam EL2 incident on the second lens group 1058 is parallel to the second optical axis AX1004, and is incident on the intersection of the second optical axis AX1004 and the second concave mirror 1059.

  The imaging light beam EL2 reflected by the second concave mirror 1059 travels symmetrically with respect to the second optical axis AX1004 as compared to before the light beam EL2 enters the second concave mirror 1059. The imaging light beam EL2 reflected by the second concave mirror 1059 passes through the lower half viewing area of the second lens group 1058 again, is reflected by the fourth reflecting surface p1009 of the second deflecting member 1057, and intersects with the center plane p1003. Proceed in the direction you want.

The traveling direction of the principal ray EL3 of the image forming light beam EL2 emitted from the second optical system 1042 toward the first projection area PA1001 is the first direction from the first illumination area IR1001 with respect to the intermediate image plane p1007 including the first field stop 1043. It is set symmetrically with the traveling direction of the principal ray EL3 of the imaging light beam EL2 incident on the optical system 1041. That is, when viewed in the XZ plane, the angle θ1004 of the fourth reflecting surface p1009 of the second deflecting member 1057 with respect to the second optical axis AX1004 satisfies the following expression (2) as in the above expression (1). It is set as follows.
θ1004 = 45 ° − (θd / 2) (2)
As a result, the principal ray EL3 of the imaging light beam EL2 emitted from the second optical system 1042 is directed to the normal direction of the first projection area PA1001 (cylindrical surface) on the substrate P (to the rotation center line AX1002 in FIG. 2). Direction).

  In the present embodiment, the focus correction optical member 1044, the image shift correction optical member 1045, the rotation correction mechanism 1046, and the magnification correction optical member 1047 constitute an imaging characteristic adjustment mechanism for adjusting the imaging characteristics of the first projection module PL1001. I do. By controlling the imaging characteristic adjustment mechanism, the projection condition of the projection image on the substrate P can be adjusted for each projection module. The projection condition here includes one or more items of a translation position, a rotation position, a magnification, and a focus of the projection area on the substrate P. The projection condition can be determined for each position of the projection area with respect to the substrate P during the synchronous scanning. By adjusting the projection conditions of the projected image, it is possible to correct the distortion of the projected image when compared with the pattern of the mask M. The configuration of the imaging characteristic adjustment mechanism can be changed as appropriate, and at least a part of the configuration can be omitted.

  The focus correction optical member 1044 is obtained by, for example, stacking two wedge-shaped prisms in opposite directions (in FIG. 6, opposite directions in the X direction) to form a transparent parallel plate as a whole. The thickness of the parallel plate is made variable by sliding the pair of prisms in the inclined direction without changing the distance between the surfaces facing each other. Thereby, the effective optical path length of the first optical system 1041 is finely adjusted, and the focus state of the pattern image formed on the intermediate image plane p1007 and the projection area PA1001 is finely adjusted.

  The image shift correction optical member 1045 is composed of a transparent parallel flat glass that can be tilted in the XZ plane in FIG. 6 and a transparent parallel flat glass that can be tilted in a direction orthogonal to the XZ plane. The pattern images formed on the intermediate image plane p1007 and the projection area PA1001 can be slightly shifted in the X direction and the Y direction by adjusting the tilt amounts of the two parallel flat glass plates.

  The magnification correcting optical member 1047 is configured such that, for example, a concave lens, a convex lens, and a concave lens are coaxially arranged at predetermined intervals, the front and rear concave lenses are fixed, and the convex lens therebetween is moved in the optical axis (principal ray) direction. It is what was constituted. Thus, the pattern image formed in projection area PA1001 is isotropically enlarged or reduced by a very small amount while maintaining the telecentric imaging state. The optical axes of the three lens groups constituting the magnification correcting optical member 1047 are inclined in the XZ plane so as to be parallel to the inclined principal ray EL3 passing therethrough.

  The rotation correction mechanism 1046 is for slightly rotating the first deflection member 1050 around an axis parallel to the first optical axis AX1003 by, for example, an actuator (not shown). By the rotation correction mechanism 1046, the pattern image formed on the intermediate image plane p1007 can be slightly rotated in the intermediate image plane p1007.

  As described above, the image forming light flux EL2 emitted from the first projection module PL1001 is applied to the first projection area PA1001 of the substrate P disposed on the outer peripheral surface of the second drum member 1022 in the pattern appearing in the first illumination area IR1001. Form an image. In the present embodiment, the principal ray EL3 of the imaging light beam EL2 passing through the center of the first illumination area IR1001 is emitted from the first illumination area IR1001 in the normal direction, and from the normal direction to the first projection area PA1001. Incident. In this manner, the image of the pattern of the mask M appearing in the cylindrical first illumination region IR1001 is projected onto the first projection area PA1001 on the cylindrical substrate P. Similarly, the image of the pattern of the mask M appearing in each of the second to sixth illumination regions IR1002 to IR1006 is projected onto each of the second to sixth projection regions PA1002 to PA1006 on the cylindrical substrate P. Is done.

  In this embodiment, as shown in FIGS. 2 and 5, the odd-numbered illumination regions IR1001, IR1003, and IR1005 and the even-numbered illumination regions IR1002, IR1004, and IR1006 are arranged at symmetric distances with respect to the center plane p1003. In addition, the odd-numbered projection areas PA1001, PA1003, and PA1005 and the even-numbered projection areas PA1002, PA1004, and PA1006 are also arranged at symmetric distances with respect to the center plane p1003. Therefore, all of the six projection modules can have the same configuration, the components of the projection optical system can be shared, the assembly process and the inspection process can be simplified, and the image forming characteristics (aberration) of each projection module can be simplified. Etc.) can be uniformly arranged. This means that the quality (transfer fidelity) of the pattern for the panel formed on the substrate P (transfer fidelity) is particularly controlled when the joint exposure is performed between the projection areas of the individual projection modules by the multi-lens method. This is advantageous in keeping the value constant regardless of.

  Further, in a general exposure apparatus, if the projection area is curved in a cylindrical shape, defocus may occur depending on the position of the projection area, for example, when an image forming light beam enters the projection area from a direction that is not perpendicular to the projection area. May be larger. As a result, an exposure defect may occur and a defective device may occur.

  In the present embodiment, the first deflecting member 1050 (the first reflecting surface p1004) and the second deflecting member 1057 (the fourth reflecting surface p1009) of the projection optical system PL (for example, the first projection module PL1001) perform the first illumination. The principal ray EL3 is deflected such that the principal ray EL3 emitted from the area IR1001 in the normal direction is projected onto the first projection area PA1001 from the normal direction. Therefore, the substrate processing apparatus 1011 determines that the focus error of the projection image in the projection area PA1001 and, in particular, the entire best focus surface of the projection image in each of the projection areas PA1001 to PA1006 shown in FIG. The deviation from the depth of focus (Depth of Focus) of ~ PL1006 can be reduced, and the occurrence of exposure failure and the like can be suppressed. As a result, occurrence of a defective device by the device manufacturing system 1001 is suppressed.

  In the present embodiment, since the projection optical system PL includes the first field stop 1043 arranged at a position where an intermediate image is formed, the shape and the like of the projection image can be managed with high accuracy. Therefore, the substrate processing apparatus 1011 can reduce, for example, an overlay error of the first to sixth projection areas PA1001 to PA1006, and suppress occurrence of exposure failure and the like. Further, the second reflection surface p1005 of the first deflection member 1050 deflects the principal ray EL3 from the first illumination region IR1001 so as to be orthogonal to the field stop 1043. Therefore, the substrate processing apparatus 1011 can manage the shape and the like of the projected image with higher accuracy.

  In the present embodiment, each of the first to sixth projection modules PL1001 to PL1006 projects an image of the pattern of the mask M as an erect image. Therefore, when the pattern of the mask M is divided and projected onto the first to sixth projection modules PL1001 to PL1006, the substrate processing apparatus 1011 may, for example, include a region where the projection image is projected (for example, the third region A1005 and the fourth region). A1006) can be partially exposed, so that the mask M can be easily designed.

  In the present embodiment, the exposure apparatus EX exposes the substrate P while the transport apparatus 1009 continuously transports the substrate P at a constant speed along the second surface p1002, so that the productivity of the exposure processing is improved. be able to. As a result, the device manufacturing system 1001 can manufacture devices efficiently.

  In the present embodiment, the first reflection surface p1004 and the second reflection surface p1005 are arranged on the surface of the same deflecting member (first deflecting member 1050), but may be arranged on the surface of different members. Good. In addition, one or both of the first reflection surface p1004 and the second reflection surface p1005 are arranged on the inner surface of the first deflection member 1050, and may have a property of reflecting light according to, for example, a total reflection condition.

  Further, the above-described modification regarding the first reflection surface p1004 and the second reflection surface p1005 can be applied to one or both of the third reflection surface p1008 and the fourth reflection surface p1009. For example, when the radius r1002 of the second surface p1002 is changed, the fourth reflection surface p1009 of the second deflecting member 1057 causes the imaging light beam EL2 to enter the first projection area PA1001 from the normal direction. , And the angle θ1004, and the arc-shaped perimeter between the center point of the first projection area PA1001 and the center point of the second projection area PA1002 is the same as that of the corresponding illumination area IR1001 on the mask M (radius r1001). The arrangement is set so as to coincide with the arc-shaped perimeter between the center point and the center point of the illumination region IR1002.

[Second embodiment]
Next, a second embodiment will be described. In the present embodiment, the same components as those in the above embodiment are denoted by the same reference numerals as those in the above embodiment, and the description thereof may be simplified or omitted.

  FIG. 7 is a diagram illustrating a configuration of the substrate processing apparatus 1011 according to the present embodiment. The transport device 1009 of the present embodiment includes a first transport roller 1030, a first guide member (such as an air turn bar) 1031, a fourth transport roller 1071, a fifth transport roller 1072, a sixth transport roller 1073, and a second guide. A member (such as an air turn bar) 1033 and a second transport roller 1034 are provided.

The substrate P transported from the upstream of the transport path to the first transport roller 1030 is transported to the first guide member 1031 via the first transport roller 1030. The substrate P via the first guide member 1031 is transported to the fifth transport roller 1072 via the fourth transport roller 1071. The fifth transport roller 1072 has its central axis arranged on the central plane p1003. The substrate P having passed through the fifth transport roller 1072 is transported to the second guide member 1033 via the sixth transport roller 1073.
The sixth transport roller 1073 is symmetrically disposed with respect to the center plane p1003 with the fourth transport roller 1071. The substrate P that has passed through the second guide member 1033 is transported downstream of the transport path via the second transport roller 1034. The first guide member 1031 and the second guide member 1033 adjust the tension acting on the substrate P in the transport path, similarly to the first guide member 1031 and the second guide member 1033 shown in FIG.

  The first projection area PA1001 in FIG. 7 is set on the substrate P that is linearly transported between the fourth transport roller 1071 and the fifth transport roller 1072. The substrate P is supported between the fourth transport roller 1071 and the fifth transport roller 1072 so that a predetermined tension is applied in the transport direction, and the substrate P is transported along the planar second surface p1002.

  The first projection area PA1001 (second plane p1002) is inclined so as to be non-perpendicular to the center plane p1003. The normal direction of the first projection area PA1001 (hereinafter, referred to as a first normal direction D1003) is different from the first radial direction D1001 with respect to a plane orthogonal to the center plane p1003, for example, an intermediate image plane p1007 shown in FIG. They are arranged symmetrically. The principal ray EL3 of the imaging light beam EL2 emitted from the first projection module PL1001 is incident on the first projection area PA1001 in the first normal direction D1003. In other words, the first normal direction D1003 of the substrate P stretched between the fourth transport roller 1071 and the fifth transport roller 1072 is symmetric with the first radial direction D1001 with respect to the intermediate image plane p1007 orthogonal to the center plane p1003. The fourth transport roller 1071 and the fifth transport roller 1072 are arranged such that

  The second projection area PA1002 is set on the substrate P being transported between the fifth transport roller 1072 and the sixth transport roller 1073. The substrate P is supported between the fifth transport roller 1072 and the sixth transport roller 1073 so that a constant tension is applied, and is sent along the planar second surface p1002.

  The second projection area PA1002 is inclined so as to be non-perpendicular to the center plane p1003. The normal direction (second normal direction D1004) of the second projection area PA1002 is symmetric with respect to the second radial direction D1002 with respect to the intermediate image plane p1007 orthogonal to the center plane p1003. The principal ray EL3 of the imaging light beam EL2 emitted from the second projection module PL1002 enters the second projection area PA1002 from the second normal direction D1004. In other words, the second normal direction D1004 of the substrate P stretched over the fifth transport roller 1072 and the sixth transport roller 1073 is symmetrical with the second radial direction D1002 with respect to the intermediate image plane p1007 orthogonal to the center plane p1003. The fifth transport roller 1072 and the sixth transport roller 1073 are arranged such that

  In the substrate processing apparatus 1011 of the present embodiment, the fourth transport roller 1071, the fifth transport roller 1072, and the sixth transport roller 1073 convert the cylindrical second surface p1002 shown in FIG. In each of the projection areas PA1001 to PA1006, the transfer fidelity of the pattern image projected on the substrate P is further improved from the viewpoint of the depth of focus (DOF). Further, as compared with the case where the second drum member 1022 having the radius r1002 is used for supporting and transporting the substrate P as shown in FIG. 2, the height of the entire transporting device 1009 in the Z direction can be reduced. In addition, the size of the entire apparatus can be reduced.

  In the apparatus configuration in FIG. 7, the fourth transport roller 1071, the fifth transport roller 1072, and the sixth transport roller 1073 are a part of the transport device 1009 and support members that support the substrate P to be exposed ( The substrate stage also functions as the exposure apparatus EX. In addition, between the fourth transport roller 1071 and the fifth transport roller 1072, and between the fifth transport roller 1072 and the sixth transport roller 1073, the Bell Nui that supports the back surface of the substrate P in a non-contact plane by a fluid bearing. A system pad plate may be provided to further enhance the flatness of a partial area of the substrate P where the projection areas PA1001 to PA1006 are located.

  Furthermore, at least one of the transport rollers of the transport device 1009 illustrated in FIG. 7 may be fixed to the projection optical system PL or may be movable. For example, the fifth transport roller 1072 has three translation directions, a translation direction parallel to the X-axis direction, a translation direction parallel to the Y-axis direction, and a translation direction parallel to the Z-axis direction, and an axis parallel to the X-axis direction. Out of the six directions (six degrees of freedom) including the rotation direction of, the rotation direction around an axis parallel to the Y-axis direction, and the three rotation directions around the axis parallel to the Z-axis direction. In ()), it may be slightly movable. Alternatively, by finely adjusting the relative position of one or both of the fourth transport roller 1071 and the sixth transport roller 1073 in the Z-axis direction with respect to the fifth transport roller 1072, the first normal line of the first projection area PA1001 is obtained. The angle between the direction D1003 or the second normal direction D1004 of the second projection area PA1002 and the surface of the planarized and supported substrate P can be finely adjusted. As described above, by slightly moving the selected roller, the posture of the surface of the substrate P with respect to the pattern projection image plane in each of the projection areas PA1001 to PA1006 can be adjusted with high accuracy.

[Third embodiment]
Next, a third embodiment will be described with reference to FIG. In the present embodiment, the same components as those in the above embodiments are denoted by the same reference numerals as those in the above embodiments, and the description thereof may be simplified or omitted.

  FIG. 8 shows a configuration of an exposure apparatus EX as a substrate processing apparatus 1011 of the present embodiment, and the basic configuration is the same as that of FIG. However, the angle θ1004 of the fourth reflection surface p1009 of the second deflecting member 1057 provided in each of the projection modules PL1001 to PL1006 of the projection optical system PL with respect to the optical axis AX1004 is set to 45 ° as compared with the configuration in FIG. The point that the substrate P transferred by the transfer device 1009 is supported at a position of each of the projection areas PA1001 to PA1006 so as to be on a plane perpendicular to the center plane p1003 (parallel to the XY plane in FIG. 8). different.

In the configuration of FIG. 8, the substrate P is transferred from the upstream of the transport path to the eighth transport roller 1076 via the first transport roller 1030, the first guide member 1031 (air turn bar, etc.), and the fourth transport roller 1071. Conveyed. The substrate P having passed through the eighth transport roller 1076 is transported downstream of the transport path via the second guide member 1033 (such as an air turn bar) and the second transport roller 1034.
As shown in FIG. 8, the substrate P is supported and transported with a predetermined tension between the fourth transport roller 1071 and the eighth transport roller 1076 so as to be parallel to the XY plane. In this case, the second surface p1002 on which the substrate P is supported is a flat surface, and the projection areas PA1001 to PA1006 are arranged in the second surface p1002.

  Further, in the second optical system 1042 configuring each of the projection modules PL1001 to PL1006, the third reflection surface p1008 and the fourth reflection surface p1009 of the second deflecting member 1057 form an image emitted from the second optical system 1042 to the substrate P. The main beam EL3 of the light beam EL2 is arranged so as to be substantially parallel to the center plane p1003. That is, the first deflecting member 1050 and the second deflecting member 1057 of the projection optical system PL (projection modules PL1001 to PL1006) are configured such that each chief ray EL3 emitted in the normal direction from each of the cylindrical illumination regions IR1001 to IR1006 is The imaging optical path is deflected so that the light enters the projection areas PA1001 to PA1006 set on a common plane from the normal direction.

  In the present embodiment, the center point of the projection area PA1001 (and PA1003, PA1005) and the center point of the projection area PA1002 (and PA1004, PA1006) in the XZ plane viewed from the direction parallel to the first center axis AX1001 of the mask M. The distance DFx along the second plane p1002 (the surface of the substrate P) to the first plane p1001 from the center of the illumination region IR1001 (and IR1003 and IR1005) to the center of the illumination region IR1002 (and IR1004 and IR1006). The distance (chord length or perimeter) DMx along the (cylindrical surface of radius r) is set substantially equal to DMx.

  Here, the mutual positional relationship between the illumination regions IR and the mutual positional relationship between the projection regions PA will be described with reference to FIG. In FIG. 9, the symbol α indicates an angle (opening angle) [°] between the first radial direction D1001 and the second radial direction D1002, and the symbol r indicates the radius [mm] of the first surface p1001. .

In FIG. 9, a circumference DMx [mm] from the center point of the illumination region IR1001 to the center point of the illumination region IR1002 in the XZ plane is represented by the following equation (3) using the angle α and the radius r. .
DMx = π · α · r / 180 (3)
The linear distance Ds from the center point of the illumination area IR1001 to the center point of the illumination area IR1002 is represented by the following equation (4).
Ds = 2 · r · sin (π · α / 360) (4)

  For example, when the angle α is 30 ° and the radius r is 180 mm, the circumference DMx is about 94.248 mm, and the distance Ds is about 93.175 mm. That is, the X coordinate of the center point of the illumination region IR1001 and the X coordinate of the center point of the projection region PA1001 match, and the X coordinate of the center point of the illumination region IR1002 matches the X coordinate of the center point of the projection region PA1002. Assuming that two points separated by the circumferential length DMx in the circumferential direction in the pattern of the mask M are projected onto the substrate P via the projection areas PA1001 and PA1002, respectively, the two points are separated by a distance Ds in the X direction on the substrate P. (Ds <DMx). That is, according to the above numerical examples, the pattern exposed on the substrate P through the odd-numbered projection areas PA1001, PA1003, and PA1005 and the pattern exposed on the substrate P through the even-numbered projection areas PA1002, PA1004, and PA1006. Means a maximum deviation of about 1.073 mm in the X direction.

  Therefore, in the present embodiment, the projection optical system is configured such that the linear distance DFx between the center point of the projection area PA1001 and the center point of the projection area PA1002 on the planarized substrate P is substantially equal to the circumference DMx. The arrangement condition of a specific optical member in the system PL is changed from the condition shown in FIG.

  Specifically, the fourth reflecting surface p1009 of the second deflecting member 1057 is slightly shifted from the position as shown in FIG. 6 in a direction parallel to the optical axis AX1004 (X axis), and as a result, the linear distance DFx Is set so as to coincide with the circumference DMx. According to the numerical examples given above, the difference between the circumference DMx and the distance Ds is 1.073 mm, and for example, the second deflecting member 1057 included in each of the odd-numbered projection modules PL1001, PL1003, and PL1005 It is easy to displace the position of the four reflection surface p1009 by about 1 mm in parallel to the second concave mirror 1059 side along the optical axis AX1004.

However, in that case, components different from the even-numbered projection modules PL1002, PL1004, and PL1006 may be required for the configuration of the second deflection member 1057 (the arrangement of the fourth reflection surface p1009).
Therefore, the position of the fourth reflecting surface p1009 of the second deflecting member 1057 mounted on all the projection modules PL1001 to PL1006 is parallel to the second concave mirror 1059 side along the optical axis AX1004 by about 0.5 mm, which is half of the above 1 mm. If it is moved, parts can be shared.

  FIG. 10 shows the difference between the circumference DMx along the pattern surface (first surface p1001) of the mask M described in FIG. 9 and the linear distance Ds between the centers of the odd-numbered and even-numbered illumination regions. 5 is a graph showing a correlation with the angle α, the vertical axis represents the difference, and the horizontal axis represents the opening angle α. A plurality of curves in the graph of FIG. 10 show the case where the radius r of the pattern surface (first cylindrical surface p1001) of the mask M is changed to 180 mm, 210 mm, 240 mm, and 300 mm. As described above with reference to numerical examples, when the angle α is 30 ° and the radius r is 180 mm, the circumference DMx is about 94.248 mm, and the distance Ds is about 93.175 mm. The difference shown on the vertical axis of the graph of No. 10 is about 1.073 mm.

  As shown in FIG. 10, the difference between the circumference DMx on the pattern surface (first surface p1001) of the mask M and the linear distance Ds from the center point of the illumination region IR1001 to the center point of the illumination region IR1002 is The position of the fourth reflecting surface p1009 of the second deflecting member 1057 may be set based on the relationship shown in the graph of FIG.

  In order to make the linear distance DFx on the substrate P substantially equal to the circumference DMx on the mask M, the position of the fourth reflection surface p1009 of the second deflection member 1057 in the X direction is optimally arranged. Since it is sometimes difficult to finally adjust the alignment on the order of submicrons, the residual difference of several μm to several tens μm or less can be obtained by using the image shift correction optical member 1045 shown in FIG. Is slightly shifted in the X direction so that the linear distance DFx and the circumference DMx can be matched with sufficient accuracy.

  As described above, the projected image is slightly shifted in the X direction using the image shift correcting optical member 1045, and the distance between the two object points (perimeter) in the scanning exposure direction on the mask pattern surface and the two object points The method for adjusting each of the projection modules PL1001 to PL1006 so that the interval distance (perimeter) of each image point in the scanning exposure direction when the image is projected on the substrate P is equal to the submicron order is described above. The same applies to the device configurations of FIGS. 2 to 6 and the device configuration of FIG.

[Fourth embodiment]
Next, a fourth embodiment will be described with reference to FIG. In FIG. 11, the same components as those in the above embodiments are denoted by the same reference numerals as those in the above embodiments, and the description thereof may be simplified or omitted.

  FIG. 11 is a diagram illustrating a configuration of an exposure apparatus EX as the substrate processing apparatus 1011. In the present embodiment, the configuration of the transport device 1009 for the substrate P is the same as the configuration of the transport device 1009 shown in FIG. The configuration of the substrate processing apparatus 1011 shown in FIG. 11 is different from the configuration of each of the apparatuses shown in FIGS. 2, 7 and 8 in that the mask M is not a rotary cylindrical mask but a normal transmission type planar mask. The point is that the angle θ1001 of the first reflection surface p1004 of the first deflection member 1050 provided in each of the projection modules PL1001 to PL1006 of the projection optical system PL with respect to the optical axis AX1003 (surface p1006) is set to 45 °.

  11, a mask holding device 1012 includes a mask stage 1078 for holding a planar mask M, and a moving device (not shown) for scanning and moving the mask stage 1078 in a direction perpendicular to the center plane p1003 in the X direction. And

  Since the pattern surface of the mask M in FIG. 11 is a plane substantially parallel to the XY plane, each principal ray EL3 on the mask M side of the projection modules PL1001 to PL1006 is perpendicular to the XY plane, and each illumination on the mask M The optical axes (principal rays) of the illumination modules IL1001 to IL1006 that illuminate the regions IR1001 to IR1006 are also arranged so as to be perpendicular to the XY plane.

  In the present embodiment, the first reflecting surface p1004 and the second reflecting surface p1005 of the first deflecting member 1050 included in the first optical system 1041 of the projection modules PL1001 to PL1006 form an imaging light flux EL2 emitted from the first optical system 1041. Are arranged so that the principal ray EL3 of the third embodiment is substantially parallel to the center plane p1003. In other words, the first deflecting member 1050 and the second deflecting member 1057 included in each of the projection modules PL1001 to PL1006 are arranged such that the principal ray EL3 traveling in the normal direction from each of the illumination regions IR1001 to IR1006 on the mask M extends along the cylindrical surface. The imaging light flux EL2 is deflected so that the light enters the projection areas PA1001 to PA1006 formed on the substrate P from the normal direction.

  Therefore, the first reflecting surface p1004 and the second reflecting surface p1005 of the first deflecting member 1050 are arranged so as to be orthogonal to each other, and both the first reflecting surface p1004 and the second reflecting surface p1005 have the first optical axis AX1003 (XY Plane) is set at substantially 45 °.

  Further, the third reflecting surface p1008 of the second deflecting member 1057 is non-planar symmetric with the fourth reflecting surface p1009 with respect to a plane including the second optical axis AX1004 and orthogonal to the center plane p1003 (parallel to the XY plane). Are located. The angle θ1003 formed by the third reflection surface p1008 with the second optical axis AX1004 is substantially 45 °, and the angle θ1004 formed by the fourth reflection surface p1009 with the second optical axis AX1004 is substantially less than 45 °. The setting of the angle θ1004 is as described with reference to FIG.

  Further, also in the present embodiment, similarly to FIG. 9, when viewed in the XZ plane, the illumination region IR1002 (and IR1003 and IR1005) on the mask M (first surface p1001) extends from the central point of the illumination region IR1002. The distance from the center point of the projection area PA1001 (and PA1003 and PA1005) on the cylindrical substrate P to the center point of the second projection area PA1002 (and PA1004 and PA1006) is determined. Is set substantially equal to the length (perimeter) along the cylindrical second surface p1002.

  Also in the substrate processing apparatus 1011 shown in FIG. 11, the control device 1014 shown in FIG. 2 controls a moving device (a linear motor for scanning exposure, an actuator for fine movement, etc.) of the mask holding device 1012, and the second The mask stage 1078 is driven in synchronization with the rotation of the drum member 1022. In the substrate processing apparatus 1011 shown in FIG. 11, an operation (rewinding) of returning the mask M to the initial position in the −X direction is required after performing the scanning exposure by the synchronous movement of the mask M in the + X direction. Therefore, when the second drum member 1022 is continuously rotated at a constant speed and the substrate P is continuously fed at a constant speed, the pattern exposure is not performed on the substrate P during the rewinding operation of the mask M, and the transport direction of the substrate P is changed. In this case, the pattern for the panel is formed discretely (separated). However, in practice, the speed of the substrate P during scanning exposure (here, the peripheral speed) and the speed of the mask M are assumed to be 50 to 100 mm / s. For example, by driving at a maximum speed of, for example, 500 mm / s, it is possible to reduce the margin in the substrate transport direction between the panel patterns formed on the substrate P.

[Fifth Embodiment]
Next, a fifth embodiment will be described with reference to FIG. In FIG. 12, the same components as those in the above embodiments are denoted by the same reference numerals as those in the above embodiments, and the description thereof may be simplified or omitted.

  The mask M of FIG. 12 uses a cylindrical mask M similar to that of FIGS. 2, 7, and 8, but forms a pattern with a high reflection portion and a low reflection (light absorption) portion with respect to the illumination light. As a reflective mask. For this reason, the transmissive illumination device 1013 (illumination optical system IL) as in each of the above embodiments cannot be used, and epi-illumination that projects illumination light from each of the projection modules PL1001 to PL1006 toward the reflective mask M is not available. A configuration like an illumination system is required.

  In FIG. 12, a polarizing beam splitter PBS and a quarter-wave plate PK are provided between the first reflection surface p1004 of the first deflection member 1050 constituting the first optical system 1041 and the reflection type mask M. In the configuration of each projection module shown in FIG. 6, the focus correction optical member 1044 and the image shift correction optical member 1045 are provided at the positions, but in the present embodiment, the focus correction optical member 1044 and the image shift correction The optical member 1045 is moved to a space in front of or behind the intermediate image plane p1007 (field stop 1043).

  The wavefront splitting surface of the polarizing beam splitter PBS has an angle α / 2 (θd) with respect to the center plane p1003 by an angle θ1001 (<45 °) of the first reflection surface p1004 of the first deflection member 1050 with respect to the optical axis AX1003 (plane p6). ) Is arranged at an angle of about 45 ° with respect to the principal ray EL3 that extends in the radial direction (normal direction) from the illumination region IR1001 on the reflection type mask M while tilting by only.

  The illumination light beam EL1 is emitted from, for example, a laser light source having good polarization characteristics, and becomes linearly polarized light (S-polarized light) via a beam shaping optical system, an illuminance uniforming optical system (a fly-eye lens, a rod element, or the like) and the like. It is incident on the beam splitter PBS. Most of the illumination light beam EL1 is reflected by the wavefront splitting surface of the polarizing beam splitter PBS, and the illumination light beam EL1 is converted into circularly polarized light through the quarter-wave plate PK, and the illumination region IR1001 on the reflection type mask M is set. Irradiate in shape or rectangle.

  The light (imaging light flux) reflected on the pattern surface (first surface p1001) of the mask M is again converted into linearly polarized light (P-polarized light) through the quarter-wave plate PK, and is split into wavefronts of the polarizing beam splitter PBS. The light is substantially transmitted through the surface and travels toward the first reflection surface p1004 of the first deflection member 1050. The configuration after the first reflection surface p1004 and the optical path of the imaging light flux (principal ray EL3) are the same as those described with reference to FIG. Is projected in the projection area PA1001.

  As described above, in the present embodiment, the reflection type cylindrical mask can be obtained only by adding the polarization beam splitter PBS and the quarter-wave plate PK to the first optical system 1041 of the projection module PL1001 (and PL1002 to PL1006). However, an epi-illumination system can be easily realized. Further, the illumination light beam EL1 is configured to be incident on the polarization beam splitter PBS from a direction intersecting with the direction of the principal ray EL3 of the imaging light beam reflected by the reflection type mask M, and to be directed to the reflection type mask M. ing. Therefore, even when the extinction ratio (separation characteristic) of the P-polarized light and the S-polarized light of the polarization beam splitter PBS is slightly small, a part of the illumination light beam EL1 is directly strayed from the wavefront splitting surface of the polarization beam splitter PBS as stray light. The first reflection surface p1004 of 1050 does not go to the projection area PA1001 of the substrate P, and the quality (contrast and the like) of the image projected and exposed on the substrate P is kept good, and the mask pattern can be faithfully transferred. .

[Sixth embodiment]
FIG. 13 is a diagram illustrating a configuration of a projection optical system PL (first projection module PL1001) according to the sixth embodiment. The first projection module PL1001 includes a third deflecting member (plane mirror) 1120, a first lens group (actual magnification projection) 1051, a first concave mirror 1052 arranged on a pupil plane, a fourth deflecting member (plane mirror) 1121, and A fifth optical system (enlarged projection system) 1122 is provided. The first surface p1001 on which the illumination region IR (first illumination region IR1001) is arranged is a pattern surface of the mask M (transmission type or reflection type) held on the cylindrical first drum member 1021, and Has become. Here, the second surface p1002 on the substrate P on which the projection area PA (first projection area PA1001) is arranged is a plane here.
When the mask M held by the first drum member 1021 (mask supporting member) is of a reflection type as shown in FIG. 12, a polarizing beam splitter and a first polarizing member 1120 are disposed between the mask M and the third deflecting member 1120. A quarter wave plate is provided.

  In FIG. 13, the image forming light beam EL2 emitted from the first illumination region IR1001 is reflected by the fifth reflecting surface p1017 of the third deflecting member 1120 and enters the first lens group 1051. The image forming light beam EL2 incident on the first lens group 1051 is reflected by the first concave mirror 1052, turned back, exits from the first lens group 1051, and enters the sixth reflecting surface p1018 of the fourth deflecting member 1121. By the first lens group 1051 and the first concave mirror 1052, an intermediate image of the pattern of the mask M appearing in the first illumination region IR1001 is formed at the same magnification as in the above embodiment.

  The imaging light beam EL2 reflected by the sixth reflection surface p1018 enters the fifth optical system 1122 through the formation position of the intermediate image, and reaches the first projection area PA1001 through the fifth optical system 1122. The fifth optical system 1122 re-images the intermediate image formed by the first lens group 1051 and the first concave mirror 1052 on the first projection area PA1001 at a predetermined magnification (for example, 2 or more).

  In FIG. 13, the fifth reflecting surface p1017 of the third deflecting member 1120 corresponds to the first reflecting surface p1004 of the first deflecting member 1050 described in FIG. 6, and the sixth reflecting surface p1018 of the fourth deflecting member 1121 is This corresponds to the second reflection surface p5 of the first deflection member 50 described in FIG.

  In the projection optical system shown in FIG. 13, the extension of the principal ray EL3 between the third deflecting member 1120 and the mask M (the first cylindrical surface p1001) is set so as to pass through the rotation center line AX1001 of the mask M. The principal ray EL3 of the imaged light beam EL2 between the second optical system 1122 having the optical axis AX1008 perpendicular to the surface of the substrate P (the second surface p1002) supported on a plane and the projection area PA1001 on the substrate P is It is set so as to be perpendicular to the two planes p1002, that is, to satisfy the telecentric imaging condition. In order to maintain such a condition, the projection optical system in FIG. 13 includes an adjustment mechanism for slightly rotating the third deflecting member 1120 or the fourth deflecting member 1121 in the XZ plane in FIG.

  It should be noted that the third deflecting member 1120 and the fourth deflecting member 1121 are not only slightly rotated in the YZ plane in FIG. 13 but also slightly moved in the X-axis direction or the Z-axis direction, and are rotated around an axis parallel to the Z-axis. A configuration that enables minute rotation may be used. In that case, the image projected in the projection area PA1001 can be slightly shifted in the X direction or slightly rotated in the XY plane.

  Note that the projection module PL1001 is an enlarged projection optical system as a whole, but may be a unit-size projection optical system or a reduced projection optical system as a whole. In this case, since the first optical system including the first lens group 1051 and the first concave mirror 1052 is an equal-magnification system, the projection magnification of the fifth optical system 1122 at the subsequent stage may be changed to equal magnification or reduction.

[Modification of Sixth Embodiment]
FIG. 14 is a view of the configuration of a modification using the projection optical system according to the sixth embodiment as viewed from the Y-axis direction, and FIG. 15 is a view of the configuration of FIG. 14 as viewed from the X-axis direction. The projection optical system shown in FIG. 14 and FIG. 15 is used in a case where a plurality of the enlarged projection optical system shown in FIG. It shows a modified example.

  As shown in FIG. 15, the projection optical system PL of this modification includes a first projection module PL1001 and a second projection module PL1002. The second projection module PL1002 has the same configuration as the first projection module PL1001, and is arranged in contrast to the first projection module PL1001 with respect to the center plane p1003 as shown in FIG. 14, but the Y axis in FIG. The directions are separated from each other as shown in FIG.

  As shown in FIG. 14, the first projection module PL1001 includes a third deflecting member 1120A, a first lens group 1051A, a first concave mirror 1052A, and a fourth deflecting member 1121A that receive an image forming light beam from the illumination region IR1001 on the mask M. , And a fifth optical system (enlarged imaging system) 1122A.

  In the projection module PL1001 shown in FIGS. 14 and 15, the inclination direction of the principal ray between the mask M and the third deflecting member 1120A is changed as compared with the above-mentioned respective projection optical systems (FIGS. 6 and 13). . That is, the reflecting surface p1004 of the first deflecting member 1050 in FIG. 6 and the reflecting surface of the third deflecting member 1120 in FIG. 13 transmit the principal ray EL3 from the illumination region IR1001 of the mask M to the first lens group 1051 (1051A). While the light is deflected at an obtuse angle (90 ° or more) so as to be parallel to the optical axis AX1003 of the first optical system constituted by the first concave mirror 1052 (1052A), in the configuration of FIG. Is deflected at an acute angle (less than 90 °) so that the principal ray EL3 from the optical system is parallel to the optical axis of the first optical system.

  Similarly, the second projection module PL1002 also receives a third deflecting member 1120B, a first lens group 1051B, a first concave mirror 1052B, which receives an image forming light beam from the illumination region IR1002 on the mask M, as shown in FIG. A fourth deflecting member 1121B and a fifth optical system (enlarged imaging system) 1122B are provided.

  The projection optical systems PL1001 and PL1002 shown in FIGS. 14 and 15 are enlarged projection optical systems as a whole, and as shown in FIG. 15, a mask M (first drum member 1021) on which a first illumination region IR1001 is arranged. The upper first area A1001 and the second area A1002 on the mask M (first drum member 1021) where the second illumination area IR1002 is arranged are separated from each other in the Y direction. However, by appropriately setting the magnification of the projection optical systems PL1001 and PL1002, the third area A1005 (image area) of the first area A1001 projected on the projection area PA1001 on the substrate P and the projection area on the substrate P The fourth area A1006 (image area) of the second area A1002 projected on the PA 1002 is set to have such a relationship as to partially overlap in the Y direction when viewed in the YZ plane. As a result, the first area A1001 and the second area A1002 on the mask M (the first drum member 1021) are formed so as to be connected in the Y direction on the substrate P, and a large panel pattern can be projected and exposed. .

  As described above, in the substrate processing apparatus including the projection optical system PL shown in FIGS. 14 and 15, the projection optical system shown in FIG. Compared to a case where a plurality of projection optical systems are arranged in the direction, the width in the X direction of the entire projection optical system can be made compact, and the size of the processing apparatus in the X direction can be reduced.

  As described above with reference to FIG. 9, in FIG. 14 as viewed in the XZ plane, the circumferential length between the respective center points of the illumination region IR1001 and the illumination region IR1002 defined on the mask M (first drum member 1021). DMx and the distance DFx between the respective center points of the corresponding projection areas PA1001 and PA1002 on the substrate P are set to have a relationship of DFx = Mp · DMx when the magnification of the projection optical system is Mp.

[Seventh embodiment]
FIG. 16 is a diagram showing a configuration of a projection optical system according to the seventh embodiment. An imaging light flux EL2 from the first illumination region IR1001 formed on the cylindrical first surface p1001 (mask pattern surface) enters the sixth optical system 1131 and passes through the sixth optical system 1131 to the seventh deflecting member. The imaging light beam EL2 reflected by the ninth reflection surface p1022 of the (plane mirror) 1132 reaches the intermediate image surface p1007 where the first field stop 1043 is arranged, and an image of the pattern of the mask M is formed on the intermediate image surface p1007. You.

  The imaging light beam EL2 passing through the intermediate image plane p1007 is reflected by the tenth reflecting surface p1023 of the eighth deflecting member (plane mirror) 1133, and is supported along the second cylindrical surface p1002 through the seventh optical system 1134. Reaches the first projection area PA1001 on the substrate P. The first projection module PL1001 in FIG. 16 projects the image of the pattern of the mask M in the first illumination region IR1001 onto the first projection region PA1001 as an erect image.

  In FIG. 16, a sixth optical system 1131 is an image forming optical system of the same magnification, and its optical axis AX1010 is substantially coaxial with the principal ray of the image forming light beam EL2 passing through the center of the first illumination region IR1001. . In other words, the optical axis AX1010 is substantially parallel to the first radial direction D1001 shown in FIG. 4 or FIGS.

  The seventh optical system 1134 is an image forming optical system of the same magnification, and re-images the intermediate image formed by the sixth optical system 1131 on the first projection area PA1001. The optical axis AX1011 of the seventh optical system 1134 is substantially parallel to the first normal direction (radial direction) D1003 of the cylindrical second surface p1002 passing through the center of the first projection area PA1001.

  In the present embodiment, the two deflecting members 1132 and 1133 are symmetrically arranged on the XZ plane in FIG. 16 with the intermediate image plane p1007 therebetween. For simplicity, an intermediate image plane is formed at a position where the optical axis AX1010 of the sixth optical system 1131 and the optical axis AX1011 of the seventh optical system 1134 intersect, and a reflective surface parallel to the YZ plane is formed at the position of the intermediate image plane. It is also conceivable to arrange a single plane mirror having However, when only one plane mirror is used, if the angle between the optical axis AX1010 of the sixth optical system 1131 and the optical axis AX1011 of the seventh optical system 1134 is larger than 90 ° in the XZ plane in FIG. The angle formed between the reflection surface of one plane mirror and each of the optical axes AX1010 and AX1011 becomes an acute angle of less than 45 °, and the imaging characteristics may not be very favorable. For example, when the angle between the optical axes AX1010 and AX1011 is about 140 °, the angle between the reflection surface of one plane mirror and each of the optical axes AX1010 and AX1011 is 20 °. Then, as shown in FIG. 16, if the optical path is bent using two deflection members (plane mirrors) 1132 and 1133, such a problem is reduced.

  In the configuration shown in FIG. 16, the sixth optical system 1131 may be an imaging lens with a magnification of Mf, and the seventh optical system 1134 may be an imaging lens with a reduction magnification of 1 / Mf. . Conversely, the sixth optical system 1131 may be an imaging lens having a reduction magnification of 1 / Mf, and the seventh optical system 1134 may be an imaging lens having an enlargement magnification of Mf.

[Eighth Embodiment]
FIG. 17 is a diagram illustrating a configuration of a projection optical system PL (first projection module PL1001) according to the eighth embodiment. The basic configuration of the optical system is the same as that of FIG. 16 except that two more deflecting members (plane mirrors) 1140 and 1143 are added.

  In FIG. 17, an eighth optical system 1135 corresponding to the imaging optical system 1131 in FIG. 16 includes a third lens 1139 and a fourth lens 1141, and its optical axis extends along the first cylindrical surface p1001. It is set substantially parallel to the principal ray of the imaging light beam EL2 emitted in the normal direction from the center of the first illumination region IR1001 on the mask M supported by the laser beam. A pupil plane of the eighth optical system 1135 is formed between the third lens 1139 and the fourth lens 1141, and an eleventh deflecting member (plane mirror) 1140 is provided at that position.

  The imaging light flux EL2 emitted from the first illumination region IR1001 and passed through the third lens 1139 is bent at an angle of 90 ° or an angle close thereto by the thirteenth reflecting surface p1026 of the eleventh deflecting member 1140, and is bent by the fourth lens 1141. The incident light is reflected by the eleventh reflecting surface p1024 of the ninth deflecting member (plane mirror) 1136 corresponding to the deflecting member 1132 in FIG. 16, and reaches the field stop 1043 arranged on the intermediate image plane p1007. Accordingly, the eighth optical system 1135 forms an image of the pattern of the mask M that appears in the first illumination region IR1001 at the position of the intermediate image plane p1007.

  The eighth optical system 1135 is an imaging optical system of the same magnification, and the intermediate image plane p1007 is configured to be orthogonal to the center plane p1003. The optical axis of the third lens 1139 is substantially coaxial or substantially coaxial with the principal ray of the imaging light beam EL2 emitted in the normal direction (radial direction of the cylindrical first surface p1001) from the center of the first illumination region IR1001. Parallel.

  The ninth optical system 1138 in FIG. 17 has the same configuration as the eighth optical system 1135, and includes a first field stop 1043 and an intermediate image plane p1007 substantially perpendicular to the center plane p1003. They are arranged symmetrically. The image forming light beam EL2 that has passed through the field stop 1043 via the eighth optical system 1135 and the ninth deflecting member 1136 is reflected by the twelfth reflecting surface p1025 of the tenth deflecting member (plane mirror) 1137, and passes through the ninth optical system 1138. The first projection area PA1001 on the substrate P supported along the second cylindrical surface p1002 through the fifth lens 1142, the twelfth deflecting member 1143 arranged at the pupil position, and the sixth lens 1144. Reach In the configuration of FIG. 17, the optical axis of the sixth lens 1144 is substantially the same as the principal ray of the imaging light beam EL2 that travels in the normal direction to the first projection area PA1001 (radial direction of the cylindrical second surface p1002). Is set to be coaxial or parallel.

[Ninth embodiment]
FIG. 18 is a diagram illustrating a configuration of a projection optical system PL (first projection module PL1001) according to the ninth embodiment. The first projection module PL1001 in FIG. 18 is a so-called in-line catadioptric projection optical system. The first projection module PL1001 includes a tenth optical system 1145 having the same magnification as the second concave mirror 1146 and the fifth concave mirror 1147, a first field stop 1043 (intermediate image plane p1007), and FIGS. A second optical system 1122 as shown is provided.

  The tenth optical system 1145 forms an intermediate image of the pattern appearing in the first illumination region IR1001 on the mask M supported along the cylindrical first surface p1001 at the position of the field stop 1043. In the present embodiment, the tenth optical system 1145 is a 1: 1 optical system. Each of the fourth concave mirror 1146 and the fifth concave mirror 1147 is configured as, for example, a part of a spheroid. The spheroid is a surface formed by rotating the ellipse around the major axis (X-axis direction) or the minor axis (Z-axis direction) of the ellipse.

  In the configuration of FIG. 18, the principal ray of the imaging light beam EL2 emitted from the center of the first illumination region IR1001 in the normal direction (radial direction) of the cylindrical first surface p1001 is the first surface when viewed in the XZ plane. p1001 (first drum member 1021) is set to be directed to the rotation center axis AX1001. That is, the principal ray of the imaging light beam EL2 traveling from the mask M (first surface p1001) to the fourth concave mirror 1146 of the projection module PL1001 is inclined in the XZ plane with respect to the center plane p1003.

  The fifth optical system 1122 is, for example, a refraction-type enlarged projection optical system as described with reference to FIG. 13, and converts the intermediate image formed at the position of the field stop 1043 by the tenth optical system 1145 into a second planar surface. The projection is performed on the first projection area PA1001 on the substrate P supported along p1002.

  The fourth concave mirror 1146 and the fifth concave mirror 1147 of the tenth optical system are arranged so that the image forming light beam EL2 emitted in the normal direction from the first illumination region IR1001 passes through the fifth optical system 1122 and is applied to the first projection region PA1001. The image forming light beam EL2 is deflected so as to be incident from a linear direction. The substrate processing apparatus provided with such a projection optical system PL suppresses the occurrence of exposure defects and enables faithful projection exposure, similarly to the substrate processing apparatus 1011 described in the above embodiment. Note that the fifth optical system 1122 may be an equal-magnification projection optical system or a reduction optical system.

[Tenth embodiment]
FIG. 19 is a diagram illustrating a configuration of a projection optical system PL (first projection module PL1001) according to the tenth embodiment. The first projection module PL1001 in FIG. 19 is a refractive optical system that does not include a reflective member having power. The first projection module PL1001 includes an eleventh optical system 1150, a thirteenth deflecting member 1151, a first field stop 1043, a fourteenth deflecting member 1152, and a twelfth optical system 1153.

  In the present embodiment, the imaging light beam EL2 emitted from the first illumination region IR1001 on the mask M held along the cylindrical first surface p1001 is formed of a wedge-shaped prism through the eleventh optical system 1150. The light is deflected in the XZ plane by the thirteenth deflecting member 1151 to reach the first field stop 1043 arranged on the intermediate image plane p1007, where an intermediate image of the mask pattern is formed. Further, the image forming light beam EL2 that has passed through the first field stop 1043 is deflected in the XZ plane by a fourteenth deflecting member 1152 formed of a wedge-shaped prism, enters the twelfth optical system 1153, and is incident on the twelfth optical system 1153. As a result, the light reaches the first projection area PA1001 on the substrate P supported along the second cylindrical surface p1002.

  The optical axis of the eleventh optical system 1150 is substantially coaxial or substantially the same as the principal ray of the imaging light beam EL2 emitted in the normal direction (radial direction of the cylindrical first surface p1001) from the center of the first illumination region IR1001. Parallel. The twelfth optical system 1153 has the same configuration as the eleventh optical system 1150, and is symmetrical with respect to the intermediate image plane p1007 (orthogonal to the center plane p1003) where the first field stop 1043 is arranged. Are arranged in a way. The optical axis of the twelfth optical system 1153 is set substantially parallel to the principal ray of the imaging light beam EL2 incident on the first projection area PA1001 along the normal to the planar second surface p1002.

  The thirteenth deflecting member 1151 has a ninth surface p1028 on which the imaging light flux EL2 passing through the eleventh optical system 1150 enters, and a tenth surface p1029 on which the imaging light flux incident from the ninth surface p1028 exits. It is arranged before or immediately before the first field stop 1043 (intermediate image plane p1007). In the present embodiment, each of the ninth surface p1028 and the tenth surface p1029 forming a predetermined apex angle is inclined with respect to a plane (XY plane) orthogonal to the center plane p1003, and is a plane extending in the Y-axis direction. Be composed.

  The fourteenth deflecting member 1152 is a prism member similar to the thirteenth deflecting member 1151, and is arranged symmetrically with respect to the intermediate image plane p1007 where the first field stop 1043 is located. The fourteenth deflecting member 1152 has an eleventh surface p1030 on which the imaging light beam EL2 passing through the first field stop 1043 is incident, and a twelfth surface p1031 on which the imaging light beam EL2 incident from the eleventh surface p1030 is emitted. , The first field stop 1043 (intermediate image plane p1007).

  In the present embodiment, the thirteenth deflecting member 1151 and the fourteenth deflecting member 1152 make the imaging light beam EL2 emitted from the first illumination region IR1001 in the normal direction incident on the first projection region PA1001 from the normal direction. Deflection. The substrate processing apparatus provided with such a projection optical system PL suppresses the occurrence of exposure defects and enables faithful projection exposure, similarly to the substrate processing apparatus 1011 described in the above embodiment.

  Note that the eleventh optical system 1150 or the twelfth optical system 1153 may be an enlarged projection system or a reduced projection system, but any one of the mask M and the substrate P may have a cylindrical surface (or When the projection exposure is performed in a state where the projection module is supported along the circular arc surface), the distance between the field of view on the object surface side (perimeter distance) between the two projection modules separated in the circumferential direction of the cylindrical surface and the final image surface The ratio with the interval (perimeter distance) of the projection visual field on the side may be set to match the projection magnification.

[Eleventh embodiment]
FIG. 20 is a diagram illustrating a partial configuration of a device manufacturing system (flexible display manufacturing line) according to the eleventh embodiment. Here, the flexible substrates P (sheets, films, etc.) drawn from the supply roll FR1 are sequentially passed through n processing units U1, U2, U3, U4, U5,. The example until it is wound up by FR2 is shown. The host control device 2005 performs overall control of each of the processing devices U1 to Un configuring the manufacturing line.

  20, the orthogonal coordinate system XYZ is set such that the front surface (or the back surface) of the substrate P is perpendicular to the XZ plane, and the width direction orthogonal to the transport direction (long direction) of the substrate P is set in the Y direction. Shall be performed. The substrate P may be one whose surface has been modified and activated by a predetermined pretreatment in advance, or one having a fine partition structure (uneven structure) for precise patterning formed on the surface.

  The substrate P wound around the supply roll FR1 is pulled out by the nipped drive roller DR1 and transported to the processing apparatus U1, and the center of the substrate P in the Y direction (width direction) is set to the target position by the edge position controller EPC1. Servo control is performed so that the position falls within a range of about ± 10 and several μm to several tens μm.

  The processing device U1 continuously or photosensitively transfers a photosensitive functional liquid (photoresist, photosensitive silane coupling material, UV curable resin liquid, etc.) on the surface of the substrate P in a printing method with respect to the transport direction (long direction) of the substrate P. This is a coating device for performing selective coating. An application mechanism including an impression roller DR2 around which the substrate P is wound, and an application roller for uniformly applying the photosensitive functional liquid to the surface of the substrate P on the impression roller DR2 in the processing apparatus U1. A drying mechanism Gp2 for rapidly removing a solvent or moisture contained in the photosensitive functional liquid applied to the substrate P is provided.

  The processing apparatus U2 heats the substrate P transported from the processing apparatus U1 to a predetermined temperature (for example, about several tens to 120 ° C.) to stabilize the photosensitive functional layer applied to the surface. It is. In the processing apparatus U2, a plurality of rollers and an air turn bar for returning and transporting the substrate P, a heating chamber section HA1 for heating the loaded substrate P, and a temperature of the heated substrate P, A cooling chamber section HA2 for lowering the temperature so as to be equal to the environmental temperature of the post-process (processing apparatus U3), a nipped drive roller DR3, and the like are provided.

  The processing apparatus U3 as a substrate processing apparatus is an exposure apparatus that irradiates the photosensitive functional layer of the substrate P transported from the processing apparatus U2 with ultraviolet patterning light corresponding to a display circuit pattern or a wiring pattern. is there. In the processing device U3, an edge position controller EPC that controls the center of the substrate P in the Y direction (width direction) at a fixed position, a nip-driven drive roller DR4, and the substrate P are partially wound with a predetermined tension, and A rotary drum DR5 for supporting a portion of the pattern P to be exposed to a pattern in a uniform cylindrical surface, and two sets of drive rollers DR6, DR7 for giving a predetermined slack (play) DL to the substrate P are provided. ing.

  Further, in the processing apparatus U3, a projection optical system for projecting an image of a part of a mask pattern of the cylindrical mask M onto a cylindrical mask M and a part of a substrate P supported in a cylindrical surface by the rotating drum DR5. In order to relatively align (align) the PL, the projected image of a part of the mask pattern with the substrate P, alignment microscopes AM1 and AM2 for detecting alignment marks and the like formed in advance on the substrate P are provided. Have been.

  In the present embodiment, since the cylindrical mask M is of a reflection type (the pattern on the outer peripheral surface is formed of a high reflection portion and a non-reflection portion), the mask is provided via some optical elements of the projection optical system PL. An epi-illumination optical system for irradiating the illumination light for exposure onto the cylindrical mask M is also provided. The configuration of the epi-illumination optical system will be described later in detail.

  The processing apparatus U4 is a wet processing apparatus that performs a wet developing process, an electroless plating process, and the like on the photosensitive functional layer of the substrate P transferred from the processing device U3. In the processing apparatus U4, there are provided three processing tanks BT1, BT2, and BT3 layered in the Z direction, a plurality of rollers for bending and transporting the substrate P, a nipped drive roller DR8, and the like.

  The processing apparatus U5 is a heating and drying apparatus that warms the substrate P transported from the processing apparatus U4 and adjusts the moisture content of the substrate P wetted by a wet process to a predetermined value, but the details are omitted. After that, the substrate P that has passed through several processing devices and passed through the last processing device Un in the series of processes is wound up on the collection roll FR2 via the nipped drive roller DR1. Also at the time of the winding, the edge position controller EPC2 uses the edge position controller EPC2 so that the center of the substrate P in the Y direction (width direction) or the substrate end in the Y direction does not vary in the Y direction. The relative position in the direction is sequentially corrected and controlled.

  As the substrate P used in the present embodiment, the same one as exemplified in the first embodiment can be used, and the description is omitted here.

  The device manufacturing system 2001 of this embodiment repeatedly executes various processes for manufacturing one device on the substrate P. The substrate P that has been subjected to various kinds of processing is divided (diced) for each device into a plurality of devices. The dimensions of the substrate P are, for example, about 10 cm to 2 m in the width direction (short Y direction) and about 10 m or more in the length direction (long X direction).

  Next, the configuration of the processing apparatus U3 (exposure apparatus) of the present embodiment will be described. Before that, the basic configuration of the exposure apparatus of the present embodiment will be described with reference to FIGS.

  The exposure apparatus U3 shown in FIG. 21 is a so-called scanning exposure apparatus, and is a reflective cylindrical mask M having a circumferential surface with a radius r2001 from the rotation center axis AX2001, and a circumferential surface with a radius r2002 from the rotation center axis AX2002. And a rotating drum 2030 (DR5 in FIG. 1). Then, by rotating the cylindrical mask M and the rotating drum 2030 synchronously at a predetermined rotation speed ratio, an image of a pattern formed on the outer periphery of the cylindrical mask M is formed on a part of the outer peripheral surface of the rotating drum 2030. Is continuously and repeatedly projected and exposed on the surface (the surface curved along the cylindrical surface) of the substrate P wound around.

  The exposure device U3 is provided with a transport mechanism 2009, a mask holding mechanism 2012, an illumination optical system IL, a projection optical system PL, and a control device 2013. The control device 2013 controls the cylindrical device held by the mask holding mechanism 2012. The rotation drive of the mask M and the fine movement in the direction of the rotation center axis AX2001, or the rotation drive and the fine movement in the direction of the rotation center axis AX2002 of the rotary drum 2030 which forms a part of the transfer mechanism 2009 for transferring the substrate P in the long direction are controlled. Is done.

  The mask holding mechanism 2012 applies a rotational driving force about the rotation center axis AX2001 to the rotation drum 2020 having the reflection type mask M (mask pattern) formed on the outer peripheral surface, or the direction of the rotation center axis AX2001 parallel to the Y axis. Transmission mechanisms 2021 and 2022 such as rollers, gears, and belts for finely moving the rotary drum 2020, a rotation motor for applying necessary driving force to these drive transmission mechanisms 2021 and 2022, and a linear for fine movement. A first drive unit 2024 including a motor, a piezo element, and the like. The rotation angle position of the rotating drum 2020 (mask M) and the position in the direction of the rotation center axis AX2001 are measured by a first detector 2023 including a rotary encoder, a laser interferometer, a gap sensor, and the like, and the measurement information is obtained in real time. The data is sent to the control device 2013 and used for controlling the first driving unit 2024.

  Similarly, the rotation driving force around the rotation center axis AX2002 parallel to the Y axis and the rotation center axis AX2002 are supplied to the rotation drum 2030 by the second drive unit 2032 including a rotation motor, a fine motor linear motor, and a piezo element. Is applied in the direction of. The rotation angle position and the position of the rotation drum 2030 in the direction of the rotation center axis AX2002 are measured by a second detector 2031 including a rotary encoder, a laser interferometer, a gap sensor, and the like, and the measurement information is sent to the control device 2013 in real time. Thus, it is used for controlling the second drive unit 2032.

Here, in the present embodiment, it is assumed that the rotation center axis AX2001 of the cylindrical mask M and the rotation center axis AX2002 of the rotating drum 2030 are parallel to each other and are located in a center plane pc parallel to the YZ plane.
An illumination region IR of the illumination light for exposure is set at a portion intersecting with the center plane pc on the cylindrical pattern surface p2001 on which the cylindrical mask M is formed, and the cylindrical shape is formed along the outer peripheral surface p2002 of the rotating drum 2030. It is assumed that a projection area PA for projecting an image of a part of the mask pattern appearing in the illumination area IR is set at a portion that intersects the center plane pc on the substrate P wound in the shape of a circle.

  In the present embodiment, the projection optical system PL emits the illumination light beam EL1 toward the illumination region IR on the cylindrical mask M, and the light beam (imaging light beam) EL2 reflected and diffracted by the mask pattern in the illumination region IR. And the illumination optical system IL is configured as an epi-illumination system that shares a part of the optical path of the projection optical system PL so that a pattern image is formed on the projection area PA on the substrate P.

  As shown in FIG. 21, the projection optical system PL includes a prism mirror 2041 having reflection planes 2041a and 2041b that are inclined at an angle of 45 ° in the XZ plane with respect to the center plane pc, and are orthogonal to the center plane pc. A second optical system 2015 having an axis 2015a and including a concave mirror 2040 arranged on the pupil plane pd and a plurality of lenses is provided.

  Here, assuming that a plane including the optical axis 2015a and parallel to the XY plane is p2005, the angle θ2001 of the reflection plane 2041a with respect to the plane p2005 is + 45 °, and the angle of the reflection plane 2041b with reference to the plane p2005. θ2002 is −45 °.

  The projection optical system PL is telecentric as, for example, a half image field type catatropic projection optical system (a modified type of Dyson optical system) in which a circular image field is divided by upper and lower reflection planes 2041a and 2041b of a prism mirror 2041. Be composed. Therefore, the image forming light beam EL2 reflected and diffracted by the pattern in the illumination area IR is reflected by the reflection plane 2041a on the upper side of the prism mirror 2041, passes through a plurality of lenses, and is arranged on the pupil plane pd. 2040 (which may be a plane mirror). Then, the imaging light flux EL2 reflected by the concave mirror 2040 passes through an optical path symmetrical with respect to the plane p2005, reaches the reflection plane 2041b of the prism mirror 2041, is reflected there, reaches the projection area PA on the substrate P, and has a mask. An image of the pattern is formed on the substrate P at the same magnification (× 1).

In order to apply the epi-illumination method to such a projection optical system PL, in the present embodiment, a passing portion (window) is formed on a part of the reflection surface p2004 of the concave mirror 2040 arranged on the pupil surface pd. The illumination light beam EL1 is made to enter from the surface p2003 (glass surface) side through the passing portion.
FIG. 21 shows only a part of the first optical system 2014 arranged behind the concave mirror 2040 in the illumination optical system IL of the present embodiment, and illumination from a light source, a fly-eye lens, an illumination field stop, and the like, which will be described later. Among the lights, only the illumination light beam EL1 related to one point light source image Sf of many point light source images generated on the pupil plane pd is shown.

  The point light source image Sf is set in an optically conjugate relationship with, for example, a point light source image (light emitting point of the light source) formed on each emission side of a plurality of lens elements constituting a fly-eye lens, and thus has a cylindrical shape. The illumination area IR on the mask M is illuminated by the second optical system 2015 of the projection optical system PL and the illumination light beam EL1 via the reflection plane 2041a on the upper side of the prism mirror 2041 with a uniform illumination distribution by the Koehler illumination method. .

  In FIG. 21, the optical axis 2014a of the first optical system 2014 of the illumination optical system IL is arranged coaxially with the optical axis 2015a of the projection optical system PL, and the illumination area IR on the cylindrical mask M is cylindrical. The width of the pattern surface p2001 in the circumferential direction is narrow, and is set in a slit shape elongated in the direction of the rotation center axis AX2001.

  As an example, if the radius r2001 of the pattern surface p2001 of the cylindrical mask M is 200 mm and the thickness tf of the substrate P is 0.2 mm, the condition for projection exposure is that the radius r2002 of the outer peripheral surface of the rotary drum 30 is r2002. = R2001-tf (199.8 mm).

  The narrower the width of the illumination area IR (or the projection area PA) in the circumferential direction (the width in the scanning exposure direction), the finer the pattern can be projected and exposed, but the inversely proportional. It is necessary to increase the illuminance per unit area. The width of the illumination area IR (or the projection area PA) is determined by the radius r2001 or r2002 of the cylindrical mask M or the rotating drum 2030, the fineness (line width or the like) of the pattern to be transferred, or the projection optics. It is determined by considering the depth of focus of the system PL and the like.

  In FIG. 21, assuming that the position on the reflection surface p2004 of the concave mirror 2040 through which the optical axis 2015a passes is the center point 2044, the point light source image Sf is shifted from the center point 2044 in the −Z direction in the paper plane (XZ plane). Of the imaging light beam EL2 (including the diffracted light) reflected by the illumination region IR on the cylindrical mask M, the regular reflected light (0th-order diffracted light) is at the center point on the reflecting surface p2004. It converges so as to form a point light source image Sf ′ at a point symmetric position with respect to 2044. Therefore, if a region including a portion where the point light source image Sf ′ is located on the reflecting surface p2004 and a surrounding portion where the ± 1st-order diffracted light is distributed is set as the reflecting portion, the imaged light flux EL2 from the illumination region IR can be obtained. With almost no loss, the light reaches the projection area PA via the plurality of lenses of the second optical system 2015 and the reflection plane 2041b of the prism mirror 2041.

  The concave mirror 2040 is formed by depositing a metallic reflective film such as aluminum on a concave surface of a concave lens made of a transparent optical glass material (quartz or the like) to form a reflective surface p2004. The transmittance is very small. Therefore, in the present embodiment, in order to make the illumination light beam EL1 incident from the surface p2003 on the back side of the reflection surface p2004, a part of the reflection film constituting the reflection surface p2004 is removed by etching or the like, and the converged illumination light beam EL1 passes ( A transparent (transmissible) window is formed.

  FIG. 22 is a diagram of the state of the reflection surface p2004 of such a concave mirror 2040 viewed from the X direction. In FIG. 22, for simplicity of explanation, the three windows 2042a and 2042b are located on the reflecting surface p2004 at positions shifted from the plane p2005 including the optical axis 2015a (parallel to the XY plane) by a certain amount in the −Z direction. , 2042c are spaced apart in the Y direction. The window portions 2042a, 2042b, and 2042c are formed by selectively removing the reflection film forming the reflection surface p2004 by etching, and here, each point light source image Sfa, Sfb, Sfc (the illumination light beam EL1a). , EL1b, and EL1c) are formed in a small rectangular shape so as not to block, but other shapes (a circle, an ellipse, a polygon, etc.) may be used. The three point light source images Sfa, Sfb, Sfc are created by, for example, three lens elements arranged in the Y direction among a plurality of lens elements of a fly-eye lens provided in the illumination optical system IL.

  When viewed in the reflection surface p2004, the mutual positional relationship between the windows 2042a, 2042b, and 2042c is determined to be a relationship that is not point-symmetric with respect to the center point 2044 (optical axis 2015a), that is, a non-point-symmetric relationship. . Although only three windows are shown here, even when more windows are made, the windows are set to have an asymmetrical positional relationship with respect to the center point 2044.

  When the illumination light beam EL1a from the point light source image Sfa generated in the window 2042a is converted into a substantially parallel light beam and applied to the illumination region IR of the cylindrical mask M, the image forming light beam is a reflected diffraction light. EL2a is converged as a point light source image Sfa ′ at a position symmetrical with respect to the center point 2044 with respect to the window 2042a on the reflection surface p2004 of the concave mirror 2040.

  Similarly, the illumination light beams EL1b and EL1c from the respective point light source images Sfb and Sfc generated in the window portions 2042b and 2042c also become substantially parallel light beams and are irradiated onto the illumination region IR of the cylindrical mask M. The imaging light fluxes EL2b and EL2c, which are the reflected light, are converged as point light source images Sfb 'and Sfc' at positions on the reflecting surface p2004 of the concave mirror 2040 that are point-symmetric with respect to each of the windows 2042b and 2042c with respect to the center point 2044. .

  Further, as shown in FIG. 22, the imaging light fluxes EL2a, EL2b, and EL2c that become the point light source images Sfa ′, Sfb ′, and Sfc ′ include 0-order diffracted light (specularly reflected light) and ± 1st-order diffracted light. However, each of the ± first-order diffracted lights DLa, DLb, and DLc is distributed in the Z-axis direction and the Y-axis direction with the zero-order diffracted light interposed therebetween.

  Further, the point light source images Sfa ′, Sfb ′, and Sfc ′ (especially, the 0th-order diffracted light) formed on the reflection surface p2004 have the cylindrical surface in the illumination area IR of the cylindrical mask M. Are distributed in the shape of each point light source image Sfa, Sfb, Sfc which becomes the illumination light beam EL1 in the Z direction (circumferential direction of the cylindrical mask).

  As shown in FIG. 22, when each point light source image Sfa, Sfb, Sfc is located below (−Z direction) the plane p2005 including the center point 2044 (optical axis 2015a), the position shown in FIG. In the (XZ plane), the illumination light beam EL1 (EL1a, EL1b, EL1c) reaches the cylindrical mask M via the second optical system 2015 and the reflection plane 2041a on the upper side of the prism mirror 2041. The illumination light beams EL1 (EL1a, EL1b, EL1c) are parallel light beams immediately before the cylindrical mask M, but slightly inclined with respect to the center plane pc. The amount of the inclination corresponds to the amount of displacement in the Z direction from the center point 2044 (optical axis 2015a) of the point light source image Sf (Sfa, Sfb, Sfc) on the reflection surface p2004 (within the pupil plane pd).

  The imaging light beam EL2 (EL2a, EL2b, EL2c) reflected and diffracted in the illumination area IR has a symmetrical inclination with respect to the center plane pc in the XZ plane with respect to the illumination light beam EL1 (EL1a, EL1b, EL1c). The light reaches the reflection plane 2041 a on the upper side of the mirror 2041, is reflected there and enters the second optical system 2015, and reaches a portion of the reflection surface p2004 of the concave mirror 2040 above the plane p2005 (center point 2044).

  In the example shown in FIGS. 21 and 22 described above, within the reflection surface p2004 of the concave mirror 2040, below the plane p2005 (-Z direction) parallel to the XY plane including the optical axis 2015a of the projection optical system PL, Although the point light source image (focus point) Sf of the illumination light beam EL1 is distributed, the condition described above, that is, the mutual positional relationship of the window 2042 in the reflection surface p2004 through which the point light source image of the illumination light beam passes, If the relationship is not point-symmetrical with respect to the center point 2044 (asymmetrical relationship), the position of the point light source image Sf (window portion 2042) on the reflecting surface p2004 can be set freely.

  At least under such a condition, when the window 2042 through which a number of point light source images Sf serving as the source of the illumination light beam EL1 pass is formed on the reflection surface p2004 of the concave mirror 2040, the illumination light beam is reflected on the reflection surface p2004 (pupil surface pd). And the imaging light flux can be efficiently spatially separated.

  While a large number of window portions 2042 (point light source images Sfa, Sfb, Sfc,... Of the illumination light flux) are uniformly distributed in the reflection surface p2004, the spatial separation between the illumination light flux and the imaging light flux is favorably maintained. For this purpose, the size of each point light source image Sfa ′, Sfb ′, Sfc ′... Formed by the convergence of the imaging light flux EL2 on the reflection surface p2004 (including the ± first-order diffracted lights DLa, DLb, DLc is also included) (Size) may be set to be smaller than the distance between the adjacent windows 2042 in the Y and Z directions. In other words, the pupil plane pd (reflection surface p2004) of each point light source image Sfa, Sfb, Sfc... Of the illumination light beam EL1 so that the individual dimensions of the windows 2042a, 2042b, 2042c. It is effective to reduce the dimensions in parentheses) as small as possible.

  In this embodiment, a mercury discharge lamp, a metal halide lamp, an ultraviolet LED, or the like can be used as a light source. However, in order to narrow down the point light source images Sfa, Sfb, Sfc,. A laser light source that emits light with a narrow oscillation wavelength band can be used.

  Here, an example of the configuration of the illumination optical system IL (first optical system 2014) shown in FIGS. 21 and 22 will be described with reference to FIG. 23, the same members as those described in FIGS. 21 and 22 are denoted by the same reference numerals, and description thereof will be omitted. In FIG. 23, the prism mirror 2041 in FIG. 21 is omitted, the optical path between the illumination area IR on the cylindrical pattern surface p2001 of the cylindrical mask M and the second optical system 2015, and the rotation drum 2030 The projection area PA on the outer peripheral surface (or the surface of the substrate P) p2002 and the optical path between the second optical system 2015 are shown in an expanded manner.

  As described above, the illumination optical system IL receives the light flux EL0 (illumination light flux EL0) from the light source to generate a large number of point light source images, and the fly-eye lens 2062 and the multiple point light source images. A condenser lens 2065 for superimposing the light beam on the illumination field stop (blind) 2064 and a lens system 2066 for guiding the illumination light passing through the opening of the illumination field stop 2064 to the concave mirror 2040 of the projection optical system PL (second optical system 2015). Are provided. In order to apply the Koehler illumination method, the surface Ep on which the point light source image is generated on the exit side of the fly-eye lens 2062 is formed by the glass material (concave lens shape) constituting the condenser lens 2065, the lens system 2066, and the concave mirror 2040. It is set to be conjugate with the pupil plane pd where the reflection surface is located.

  In the YZ plane, the center of the exit end of the fly-eye lens 2062 is arranged on the optical axis 2065a of the condenser lens 2065, and the center of the illumination field stop 2064 (opening) is arranged on the optical axis 2065a. Further, the illumination field stop 2064 is formed by a lens system 2066, a glass material (concave lens shape) constituting the concave mirror 2040, and a plurality of lenses of the second optical system 2015, and an illumination region IR (pattern plane p2001) on the cylindrical mask M. Are arranged on a surface 2014b optically conjugate to the above.

  Further, the optical axis 2014a of the first optical system 2014 of the illumination optical system IL is arranged coaxially with the optical axis 2015a of the projection optical system PL (second optical system 2015), but the optical axis 2065a of the condenser lens 2065 is set to the first axis. The optical system 2014 is disposed eccentrically in the −Z direction within the paper plane (XZ plane) of FIG. 23 with respect to the optical axis 2014 a.

  Here, of the plurality of point light source images generated on the emission side surface Ep of the fly-eye lens 2062, two point light source images SPa and SPd positioned asymmetrically in the Z direction with the optical axis 2065a interposed therebetween. The behavior of the illumination light beam will be described.

  The light beam from the point light source image SPa is converted into a substantially parallel light beam by the condenser lens 2065 and irradiates the illumination field stop 2064. The illumination light beam EL1a transmitted through the opening (slit shape elongated in the Y direction) of the illumination field stop 2064 converges as a point light source image Sfa in a window formed by the lens system 2066 on the reflection surface of the concave mirror 2040 of the projection optical system PL. Is done.

  As described with reference to FIG. 21, the illumination light beam EL1a from the point light source image Sfa passes through the second optical system 2015 of the projection optical system PL to the illumination region IR on the cylindrical pattern surface p2001 of the cylindrical mask M. To illuminate. The imaging light flux EL2a generated on the pattern surface p2001 by the irradiation of the illumination light flux EL1a from the point light source image Sfa moves backward through the second optical system 2015 to re-image the point light source image Sfa 'on the concave mirror 2040. In the pupil plane pd, the point light source image Sfa formed by the light beam from the illumination optical system IL and the point light source image Sfa 'formed by the imaging light beam EL2a are located in a point-symmetric relationship within the pupil plane pd.

  Similarly, the light beam from the point light source image SPd is converted into a substantially parallel light beam by the condenser lens 2065 and irradiates the illumination field stop 2064. The illumination light beam EL1d transmitted through the opening of the illumination field stop 2064 is converged as a point light source image Sfd in a window formed on the reflection surface of the concave mirror 2040 by the lens system 2066. The illumination light beam EL1d from the point light source image Sfd illuminates the illumination area IR on the cylindrical pattern surface p2001 via the second optical system 2015. The imaging light flux EL2d generated on the pattern surface p2001 by the irradiation of the illumination light flux from the point light source image Sfd moves backward through the second optical system 2015 to re-image the point light source image Sfd 'on the concave mirror 2040. In the pupil plane pd, the point light source image Sfd formed by the light beam from the illumination optical system IL and the point light source image Sfd 'formed by the imaging light beam EL2d are located in a point-symmetric relationship within the pupil plane pd.

  The imaging light fluxes EL2a and EL2d, on which the point light source images Sfa 'and Sfd' are formed on the reflecting surface of the concave mirror 2040, are projected into a cylindrical projection area PA on the substrate P, and the image of the mask pattern in the illumination area IR. Is image-formed and projected in the projection area PA of the substrate P.

  FIG. 24 illustrates a configuration of a light source device 2055 that generates an illumination light beam EL0 incident on the fly-eye lens 2062 of the illumination optical system IL illustrated in FIG. The light source device 2055 includes a solid light source 2057, an expander lens (concave lens) 2058, a condenser lens 2059, and a light guide member 2060. The solid state light source 2057 includes, for example, a laser diode (LD), a light emitting diode (LED), and the like. The illumination light beam LB emitted from the solid light source 2057 is converted into a divergent light beam by the expander lens 2058, and is condensed by the condenser lens 2059 on the incident end surface 2060a of the light guide member 2060 with a predetermined convergence degree (NA).

  The light guide member 2060 is, for example, an optical fiber or the like, and the illumination light beam LB incident on the incident end face 2060a exits from the exit end face 2060b while preserving NA (numerical aperture), and is substantially parallel illuminated by a lens system 2061 (collimator). The light is converted into a light flux EL0. The lens system 2061 adjusts the light beam diameter of the illumination light beam EL0 so as to irradiate the entire incident-side surface of the fly-eye lens 2062. The diameter of a single optical fiber is, for example, about 300 μm. However, when the light intensity of the illumination light beam LB from the solid-state light source 2057 is high, a plurality of optical fibers may be densely bundled.

  FIG. 25 shows an arrangement state of a large number of point light source images SP formed on the emission side surface Ep (parallel to the YZ plane) of the fly-eye lens 2062 in FIG. 23 as viewed from the condenser lens 2065 side. Assuming that the center point of the plane Ep on the emission side of the fly-eye lens 2062 is 2062a in the YZ plane, the center point 2062a is located on the optical axis 2065a of the condenser lens 2065.

  As shown in FIG. 25, the fly-eye lens 2062 of the present embodiment includes a plurality of lens elements 2062E arranged on a plane orthogonal to the optical axis 2065a of the condenser lens 2065. Each of the plurality of lens elements 2062E has a rectangular cross section that is elongated in the Y direction, and is tightly bundled in the Y direction and the Z direction. At the center of the exit end of each lens element 2062E, a point light source image (spot) SP is formed, which is a conjugate image of the exit end surface 2060b of the light guide member 2060 (optical fiber) in FIG. The plurality of lens elements 2062E are bundled such that the point light source images SP are asymmetric with respect to the center point 2062a (optical axis 2065a) when viewed in the YZ plane.

  In the example shown in FIG. 25, when a plane including the optical axis 2065a of the condenser lens 2065 and being parallel to the XY plane is p2006, a set of lens elements 2062E located on the + Z side of the plane p2006 is referred to as an upper lens element group. Assuming that a pair of the lens elements 2062E located on the −Z side with respect to the plane p2006 is the lower lens element group 2062D, the dimension of the lens element 2062E in the Y direction is between the upper lens element group 2062U and the lower lens element group 2062D. The position is shifted by １ ／. As a result, the plurality of point light source images SP scattered in the upper lens element group 2062U and the plurality of point light source images SP scattered in the lower lens element group 2062D are parallel to the Y axis passing through the center point 2062a. The lines are also asymmetrically arranged.

  The cross-sectional shape of each lens element 2062E of the fly-eye lens 2062 in the YZ plane is configured to be a rectangle extending in the Y direction in order to match the slit-shaped opening shape of the illumination field stop 2064 in FIG. . This will be described with reference to FIG.

  FIG. 26 is a view of the illumination field stop 2064 in FIG. 23 viewed in the YZ plane. The illumination field stop 2064 has a rectangular (or trapezoidal) opening 2064A elongated in the Y direction, and the light flux from each point light source image SP of the fly-eye lens 2062 is condensed by the condenser lens 2065 to the illumination field stop 2064. Above, it is superimposed as a rectangular illumination light beam EL1 including the opening 2064A. When the center of the opening 2064A is arranged on the optical axis 2065a of the condenser lens 2065, the optical axis 2014a of the first optical system 2014 of the illumination optical system IL is positioned eccentric in the + Z direction from the center of the opening of the opening 2064A. Pass.

  FIG. 27 shows the state of the reflecting surface p2004 (disposed on the pupil plane pd) of the concave mirror 2040 that can be used for the distribution of the point light source image SP generated by the fly-eye lens 2062 in FIG. This is viewed from the optical system 2015 side. Since the reflecting surface p2004 of the concave mirror 2040 is conjugate with the exit-side surface Ep of the fly-eye lens 2062, the distribution of the plurality of point light source images SP (lens elements 2062E) shown in FIG. In the pupil plane pd), the distribution of the point light source image Sf (black circle) is inverted left and right and up and down.

  As described with reference to FIG. 22, the window 2042 for transmitting the plurality of point light source images Sf is arranged on the reflection surface p2004 of the concave mirror 2040 in an asymmetry with respect to the center point 2044 (optical axis 2015a). Is done. In the example of FIG. 27, the window 2042 is formed in a slit shape elongated in the Z direction so as to collectively transmit the illumination light beams from the plurality of point light source images Sf arranged in a line in the Z direction. Portions other than the slit-shaped window portion 2042 in the reflection surface p2004 are high-reflection portions that efficiently reflect an imaged light beam from a pattern in the illumination region IR of the cylindrical mask M.

  The plurality of point light source images Sf are arranged asymmetrically with respect to a plane p2005 that includes the optical axis 2015a of the second optical system 2015 and is orthogonal to the center plane pc (FIG. 21). The dimension in the direction is set so narrow that the point light source image Sf is not shielded. As described with reference to FIG. 23, the light flux (illumination light flux EL1) from each of the plurality of point light source images Sf passing through each window 2042 passes through the second optical system 2015, and the pattern surface p2001 of the cylindrical mask M. The upper illumination region IR is irradiated while being superimposed. Thus, the illumination region IR is illuminated with a uniform illuminance distribution.

  The reflected light (imaging light flux EL2) from the mask pattern appearing in the illumination area IR of the pattern surface p2001 returns to the reflection surface p2004 of the concave mirror 2040, and the imaging light flux EL2 is again reflected by the point on the reflection surface p2004. It becomes a light source image Sf ′ and has a separated distribution. As described with reference to FIG. 22, the distribution of a large number of point light source images Sf ′ (particularly, the 0th-order diffracted light) generated on the reflecting surface p2004 by the imaging light flux EL2 is such that a large number of illumination light fluxes EL1 with respect to the center point 2044. The distribution of the point light source image Sf is point-symmetric.

  As shown in FIG. 27, all the regions on the reflection surface p2004 that are in point symmetry with the plurality of windows 2042 in which a number of point light source images Sf serving as the source of the illumination light beam EL1 are distributed are high reflection portions. Therefore, the point light source image Sf ′ (including the first-order diffracted light) re-imaged on the reflection surface p2004 is reflected with almost no loss and reaches the substrate P.

[Modification Example 1 of Eleventh Embodiment]
In FIG. 27, the illumination light flux is located on a portion of the reflection surface p2004 of the concave mirror 2040 on a line intersecting with a plane p2005 (parallel to the XY plane) including the optical axis 2015a of the projection optical system PL (second optical system 2015). Even when the point light source image Sf which is the source of the image is located, the portion where the point light source image Sf is located is defined as the window 2042 as in the above arrangement condition, and the center point 2044 is point-symmetric with the window 2042. May be set as a reflection part (light shielding part).

  However, in the case where the point light source image Sf (window portion 2042) is located at the center point 2044, when the illumination light flux radiated from the point light source image Sf illuminates the illumination region IR on the cylindrical mask M, it is reflected there. The formed image light flux converges so as to form a point light source image Sf ′ at the center point 2044 (window portion 2042) of the reflection surface p2004. From this, the arrangement of many lens elements 2062E constituting the fly-eye lens 2062 is changed so that the point light source image Sf is not located near the center point 2044 of the reflection surface p2004, or the position of the center point 2044 is changed. The corresponding lens element 2062E may be provided with a light-shielding film (black coating).

  Further, in the present embodiment, as shown in FIGS. 25 and 27, the arrangement of the point light source images SP (array of the lens elements 2062E) formed on the emission side surface Ep of the fly-eye lens 2062, and the reflection of the concave mirror 2040 Although the arrangement of the window 2042 formed on the surface p2004 is matched one-to-one, it is not always necessary. That is, of the many point light source images SP formed on the emission side surface Ep of the fly-eye lens 2062, a part that can enter from the surface p2003 on the back side of the concave mirror 2040 and reach the reflection surface p2004 (pupil surface pd). With respect to the point light source image Sf, the light may be shielded without providing the window portion 2042 while keeping the reflection surface. The light shielding can be similarly realized by forming a light shielding film or a light absorbing layer in a region where the point light source image Sf to be shielded is located in the surface p2003 on the back side of the concave mirror 2040.

[Modification 2 of Eleventh Embodiment]
The imaging light flux EL2 (a large number of point light source images Sf ′) incident on the concave mirror 2040 from the second optical system 2015 constituting the projection optical system PL does not need to be entirely reflected by the concave mirror 2040. For example, on the reflection surface p2004 of the concave mirror 2040, in addition to the transmissive window 2042 and the reflection portion, a plurality of point light source images Sf serving as a source of the illumination light beam EL1 and a plurality of light beams formed by convergence of the imaging light beam EL2. May be provided with a light-shielding portion that shields one or both of the point light source images Sf ′.

  The eleventh embodiment has been described above. In the present embodiment, as shown in FIG. 21 or FIG. 22, the illumination light from the illumination optical system IL is arranged on the pupil plane pd of the projection optical system PL. The light enters the illumination region IR on the cylindrical mask M as the illumination light beam EL1 via the second optical system 2015 constituting the projection optical system PL and the reflection plane 2041a on the upper side of the prism mirror 2041, which is incident from the back side of the concave mirror 2040. Reach.

  The imaging optical path of the projection optical system PL in the present embodiment includes the first optical path from the illumination area IR (object plane) to the concave mirror 2040 (pupil plane pd) and the projection optical system PL (image plane pd) from the concave mirror 2040 (pupil plane pd). ), The first optical path also serves as an optical path for epi-illumination for guiding the illumination light beam from the illumination optical system IL to the illumination area IR.

  As described above, in the processing apparatus U3 (exposure apparatus) of the present embodiment, the illumination light flux and the imaging light flux are efficiently spatially separated by the reflecting mirror arranged at or near the pupil plane of the projection optical system PL. With such an epi-illumination system, the configuration of the apparatus can be simplified. Further, as compared with a method in which the illumination light beam and the image forming light beam are separated based on the difference in polarization state, there is no need to use a large polarizing beam splitter, a wave plate, or the like, and the apparatus configuration can be simplified.

  Furthermore, in the method in which the illumination light flux and the imaging light flux are polarized and separated, it is necessary to deal with the wavefront disturbance due to the wave plate and the deterioration of the characteristics (contrast, aberration, etc.) of the projected image due to the problem of the extinction ratio in the polarization beam splitter. However, in the present embodiment, the characteristics of the projected image are hardly degraded due to such causes, and the occurrence of exposure failure can be suppressed. In addition, the exposure apparatus U3 of the present embodiment incorporates an epi-illumination method in which illumination light is applied to the reflective mask M via a part of the optical path of the projection optical system, so that the illumination is performed inside the transmissive mask. In particular, the degree of freedom in designing the illumination optical system is higher than when an optical system is incorporated.

  In the present embodiment, the light source device 2055 shown in FIG. 24 uses a laser light source (for example, excimer laser light such as KrF, ArF, XeF, or the like) having strong directivity of emitted light because the size of the point light source image can be reduced. However, it is not limited thereto. For example, a lamp light source that emits bright line light such as a g-line, an h-line, or an i-line, or a laser diode or a light-emitting diode (LED) having weak directivity of the emitted light may be used.

  In the device manufacturing system 2001 (FIG. 20) of the present embodiment, the configuration of the processing apparatus U3 (exposure apparatus) can be simplified, so that device manufacturing costs can be reduced. Further, since the processing apparatus U3 performs the scanning exposure while transporting the substrate P along the outer peripheral surface p2002 of the rotary drum 2030, the exposure processing can be efficiently performed. As a result, the device manufacturing system 2001 can manufacture devices efficiently.

[Twelfth embodiment]
Next, a twelfth embodiment will be described with reference to FIG. In the present embodiment, the configuration of the fly-eye lens 2062 and the arrangement of the point light source image Sf formed in the reflection surface p2004 of the concave mirror 2040 described with reference to FIGS. 25 and 27 are changed. About the same component, the same code | symbol as the above-mentioned embodiment is attached | subjected, and the description is simplified or abbreviate | omitted.

  FIG. 28 shows how the plurality of lens elements 2062E of the fly-eye lens 2062 are equivalently arranged in the reflection plane p2004 of the concave mirror 2040 in the YZ plane orthogonal to the optical axis 2015a of the projection optical system PL. FIG. The lens element closest to the center point 2044 so that the plurality of lens elements 2062E (point light source image Sf) are arranged in an asymmetrical arrangement with respect to the center point 2044 (optical axis 2015a) of the reflection surface p2004 of the concave mirror 2040. The center of 2062E is displaced from the center point 2044 in the Y and Z directions.

  Also in this embodiment, the cross-sectional shape (shape in the YZ plane) of each lens element 2062E of the fly-eye lens 2062 includes the rectangular opening 2064A of the illumination field stop 2064 as described with reference to FIG. In this case, it is assumed that the ratio Py / Pz between the cross-sectional dimension Py in the Y direction and the cross-sectional dimension Pz in the Z direction is set to approximately 4. Therefore, many point light source images Sf distributed in the reflection surface p2004 (pupil surface pd) are also arranged at a pitch of the cross-sectional dimension Py in the Y direction and at a pitch of the cross-sectional dimension Pz in the Z direction.

  In the case of a normal fly-eye lens, the center of each lens element 2062E is arranged straight in both the Y direction and the Z direction. In the present embodiment, the lens elements 2062E adjacent in the Z direction are separated by ΔY in the Y direction. And displace them. When this displacement amount ΔY is set to about １ ／ of the cross-sectional dimension (array pitch) Py of the lens element 2062E in the Y direction, each point light source image Sf can be either ± 45 degrees or ± 135 degrees in the YZ plane. It will be located in a certain direction away.

  In FIG. 28, when four point light source images Sf that are located in the immediate vicinity of the center point 2044 of the reflecting surface p2004 and surround the center point 2044 are specified, an area surrounded by the four point light source images Sf (here, an inclined rectangle) Is displaced from the center point 2044. In other words, the position of the center of gravity of the area surrounded by the four point light source images Sf is different from the center point 2044. By setting the positional relationship between the concave mirror 2040 and the fly-eye lens 2062 in the YZ plane so that such a displacement occurs, all of the point light source images Sf are in an asymmetric relationship with respect to the center point 2044. Can be arranged. This means that a region on the reflecting surface p2004 that has a point-symmetric relationship with each point light source image Sf with respect to the center point 2044 can always be a reflecting portion.

  In correspondence with the distribution of the point light source images Sf arranged as described above, windows 2042 for transmitting each point light source image Sf are formed in the reflection surface p2004 of the concave mirror 2040. Several forms are conceivable for dimensions and arrangement. In a simple manner, as shown in FIG. 28, a circular window 2042H that transmits only one point light source image Sf is distributed over the entire reflection surface p2004 in accordance with the arrangement of the point light source images Sf. .

  As another form, a slot-shaped window portion 2042K may be used that transmits all the point light source images Sf arranged in a line at an angle of 45 degrees with respect to the Y direction on the reflection surface p2004. When an illumination light flux originating from a series of point light source images Sf located in the window 2042K illuminates the illumination area IR of the cylindrical mask M, the reflected light flux (imaging light flux) is reflected on the reflection surface of the concave mirror 2040. On p2004, the point light source image Sf '(including the first-order diffraction image) converges on the reflection area 2042K' displaced from the window transmitting the point light source image Sf. Alternatively, an oval (or gourd-shaped) window portion 2042L may be formed so that two point light source images Sf arranged obliquely at 45 degrees to the Y direction are grouped and transmitted collectively. Any of the windows 2042H, 2042K, and 2042L is formed as small as possible within a range that does not partially block the illumination light from each point light source image Sf.

  In the twelfth embodiment, the displacement ΔY in the Y direction of the lens element 2062E of the fly-eye lens 2062 can be set arbitrarily, and the ratio Py / Pz of the sectional dimensions of the lens element 2062E does not necessarily need to be an integral multiple. .

[Thirteenth embodiment]
Next, a thirteenth embodiment will be described with reference to FIG. This embodiment also relates to the deformation of the configuration of the fly-eye lens 2062 and the arrangement of the point light source image Sf formed in the reflection surface p2004 of the concave mirror 2040, as in FIG. In the configuration of FIG. 29, the centers of the plurality of lens elements 2062E of the fly-eye lens 2062 are linearly arranged in the Y and Z directions in the YZ plane.

  In the case of such a fly-eye lens 2062, the point light source images Sf formed on the emission side of each lens element 2062E are arranged at a pitch of the sectional dimension Py in the Y direction and arranged at a pitch of the sectional dimension Pz in the Z direction. You. Even in such a case, as described in the twelfth embodiment of FIG. 28, four point light source images that are located immediately near the center point 2044 (optical axis 2015a) of the reflecting surface p2004 of the concave mirror 2040 and surround the center point 2044. When focusing on Sfv1, Sfv2, Sfv3, and Sfv4, the center of gravity Gc of the region (rectangle) surrounded by the four point light source images Sfv1 to Sfv4 is displaced from the center point 2044. In other words, the center of gravity Gc is at a position different from the center point 2044.

  By setting the positional relationship between the concave mirror 2040 and the fly-eye lens 2062 in the YZ plane so that such a displacement occurs, all of the point light source images Sf have an asymmetrical relationship with respect to the center point 2044. Can be arranged. Therefore, the area on the reflecting surface p2004 that has a point-symmetric relationship with each point light source image Sf with respect to the center point 2044 can always be a reflecting portion.

  A circular window 2042H for individually transmitting the point light source images Sf is formed on the reflection surface p2004 of the concave mirror 2040 according to the present embodiment in accordance with the pitch of the arrangement of the lens elements 2062E (point light source images Sf). Have been.

[Fourteenth embodiment]
Next, a fourteenth embodiment will be described with reference to FIG. This embodiment also relates to the deformation of the configuration of the fly-eye lens 2062 and the arrangement of the point light source images Sf formed in the reflection surface p2004 of the concave mirror 2040, as in FIGS. 28 and 29. In the configuration of FIG. 30, a plurality of lens elements 2062E (the cross-sectional shape is a rectangle elongated in the Y direction) of the fly-eye lens 2062 are arranged at a pitch of the cross-sectional dimension Py in the Y-direction, and densely arranged at a pitch of the cross-sectional dimension Pz in the Z direction. The lens elements 2062E for one row arranged in the Y direction are arranged alternately in the Y direction (shifted) by Py / 2 for each row in the Z direction.

  In the case of the fly-eye lens 2062, the point light source image Sf is generated on the exit end side of each lens element 2062E that receives illumination light (for example, EL0 in FIG. 24) from the light source. A light shield 2062s is formed on the corresponding lens element 2062E so as to block one of the two point light source images Sf having a point-symmetric arrangement relationship with respect to the center point 2044 of the reflection surface p2004 of the concave mirror 2040.

  In the configuration of FIG. 30, in the reflection surface p2004 of the concave mirror 2040, the corresponding point light source image Sf is randomly and uniformly distributed on the corresponding lens element 2062E to the light shield 2062s (metal thin film or the like). Is formed. Even when such a fly-eye lens 2062 is used, a circular window 2042H for transmitting the point light source image Sf is formed on the reflection surface p2004 of the concave mirror 2040 as shown in FIG.

[Fifteenth Embodiment]
Next, a fifteenth embodiment will be described with reference to FIG. In the present embodiment, a number of point light source images Sf are formed on the reflection surface p2004 of the concave mirror 2040 by the light source image forming unit without using the fly-eye lens 2062 described above. FIG. 31 shows a cross section of the concave mirror 2040 in a plane parallel to the XZ plane and including the optical axis 2015a (center point 2044). On the reflection surface p2004 where the point light source image Sf (Sfa) is located, windows 2042H are respectively provided. Are formed.

  The concave mirror 2040 is formed by forming a reflective film on the concave side of a base material made of, for example, fine ceramics or glass ceramics having a low coefficient of thermal expansion. A plurality of windows 2042H are formed on the reflective film according to the same conditions as in the above embodiments. In the present embodiment, the base material behind the window 2042H is a part of the illumination optical system IL. A through hole (about 1 mm in diameter) through which the optical fiber Fbs passes is formed.

  The exit end of each optical fiber Fbs functions as a point light source image, and is installed on substantially the same plane as the reflection surface p2004. The illumination light applied to the entrance end of each optical fiber Fbs is set so that the illumination light beam (for example, EL1a) projected from the exit end of the optical fiber Fbs has a predetermined numerical aperture (divergence angle characteristic). The direction of the illumination light beam from the exit end of each optical fiber Fbs is set to match the direction of the principal ray passing through the exit end (point light source image).

  In the configuration shown in FIG. 31, each of a large number of point light source images Sf is generated at the exit end of the optical fiber Fbs without using the fly-eye lens 2062, so that an optical fiber corresponding to the number of the windows 2042H is required. The system from the light source to the concave mirror 2040, that is, the entire illumination optical system IL can be made compact.

  The concave mirror 2040 is provided with small holes through which the exit end of the optical fiber Fbs penetrates. In each of the small holes, a thin light pipe (a cylindrical rod) made of quartz or the like is embedded, and each of the light pipes is embedded. An ultraviolet light emitting diode (LED) with a condensing lens may be installed on the incident end side of the light pipe, and the exit end side of each light pipe may be aligned with the reflection surface p2004 of the concave mirror 2040.

[Sixteenth embodiment]
Next, a sixteenth embodiment will be described with reference to FIGS. 32A and 32B and FIGS. 33A, 33B and 33C. In this embodiment, the illumination area IR on the cylindrical mask M is uniformly illuminated using a rod lens (a prismatic glass or quartz) instead of the fly-eye lens 2062 in the illumination optical system IL.

  FIG. 32A is a plan view of the optical path from the light guide member 2060 (optical fiber) for guiding the light of the light source to the projection optical system PL (second optical system 2015) viewed from the Y-axis direction. FIG. 32B is the optical path of FIG. FIG. 3 is a plan view when viewed from the Z-axis direction. 32A and 32B, the configuration of the optical path from the illumination field stop 2064 to the projection optical system PL is the same as the configuration in FIG. 23 described above, and a description thereof will be omitted.

  The illumination optical system IL illustrated in FIGS. 32A and 32B includes the light guide member 2060, the condenser lens 2093, the rod lens 2094, the illumination field stop 2064, the lens system 2066, and the like described with reference to FIG. The configuration of the projection optical system PL (second optical system 2015) after the concave mirror 2040 is the same as that in FIGS.

  The illumination light beam EL0 emitted from the light guide member (optical fiber) 2060 is converged by the condenser lens 2093 on the incident end face 2094a of the rod lens 2094 or in the vicinity thereof. The cross-sectional shape of the rod lens 2094 along the YZ plane (incident end face 2094a, exit end face 2094b) is formed in a rectangular shape including the trapezoid of the illumination field stop 2064 and the rectangular opening 2064A (FIG. 26). The cross-sectional shape is substantially similar to the cross-sectional shape of the lens element 2062E of the fly-eye lens 2062 shown in FIG. 25 and FIGS.

  When the rod lens 2094 is used, the illumination light beam EL0 converged on the incident end face 2094a is repeatedly turned inside the rod lens 2094 between the side face 2094c parallel to the XZ plane and the side face 2094d parallel to the XY plane. The reflection is repeated to advance to the emission end face 2094b. In the case of a rod lens, the illuminance distribution of the illumination light is most uniform on the emission end surface 2094b, but the uniformity is improved as the number of repetitions of internal reflection increases. Therefore, the emission end face 2094b is arranged so as to coincide with a face 2014b conjugate with the illumination region IR on the cylindrical mask M.

  Since the rod lens 2094 of the present embodiment has a rectangular cross section, the number of reflections of the illumination light between the opposing side surfaces 2094c is smaller than the number of reflections of the illumination light between the opposing side surfaces 2094d. The length and the like of the rod lens 2094 are set such that the number of times that the illumination light beam EL0 is reflected on the inner surface of the rod lens 2094 becomes two or more times from the viewpoint of improving the illuminance uniformity. Since the shape of the exit end face 2094b of the rod lens 2094 defines the outer edge of the illumination region IR, the illumination field stop 2064 may be omitted.

  Now, assuming that a line connecting the center point of the incident end surface 2094a of the rod lens 2094 in the YZ plane and the center point of the exit end surface 2094b in the YZ plane is the central axis AX2003, the central axis AX2003 is the projection optical system PL. Is parallel to the optical axis 2015a (optical axis 2014a of the lens system 2066), but is eccentric in the Z direction. Further, the emission end of the light guide member 2060 is disposed on the optical axis 2093a of the condenser lens 2093, and the optical axis 2093a is displaced in the −Y direction with respect to the center axis AX2003 of the rod lens 2094. Is done.

  Due to the displacement in the −Y direction, a large number of point light source images Sf generated in the reflection surface p2004 of the concave mirror 2040 can be arranged asymmetry with respect to the center point 2044 (optical axis 2015a) of the reflection surface p2004. . This will be described in detail with reference to FIGS. 33A is a view of the condenser lens 2093 in the X-axis direction from the exit end surface 2094b side of the rod lens 2094, FIG. 33B is a view of the rod lens 2094 in the X-axis direction from the lens system 2066 side, and FIG. 33C is a concave mirror 2040. FIG. 13 is a diagram of the reflection surface p2004 viewed from the X-axis direction.

  As shown in FIG. 33A, the cross section of the rod lens 2094 is a rectangle defined by a side surface 2094d parallel to the XY plane and a side surface 2094c parallel to the XZ plane, and the central axis AX2003 of the rod lens 2094 and the condenser lens 2093 The optical axis 2093a is relatively eccentric in the Y direction. As shown in FIG. 33B, the center axis AX2003 of the rod lens 2094 is eccentric in the Z direction with respect to the optical axis 2014a (2015a) of the lens system 2066.

  In such a configuration, the concave lens and the lens system 2066 serving as the base materials of the concave mirror 2040 are arranged such that the Fourier transform surface (pupil surface pd) of the surface 2014b on which the exit end surface 2094b of the rod lens 2094 is located is on the reflection surface p2004 of the concave mirror 2040. Formed. Therefore, as shown in FIG. 33C, on the reflecting surface p2004 of the concave mirror 2040, a number of point light source images Sf are formed at a pitch DSy in the Y direction and at a pitch DSz in the Z direction. These point light source images Sf appear as virtual images of spot images of the illumination light beam EL0 converged on the incident end face 2094a of the rod lens 2094.

  Since the plurality of point light source images Sf have a rectangular cross section of the rod lens 2094, the pitch DSy of the arrangement of the point light source images Sf in a direction (Y direction) parallel to the long side of the cross section is parallel to the short side. It is longer than the pitch DSz of the arrangement of the point light source images Sf in the direction (Z direction). Further, as shown in FIGS. 32A and 32B, the number of internal reflections of the illumination light in the rod lens 2094 is larger in the Z direction than in the Y direction, and thus is generated on the reflection surface p2004 of the concave mirror 2040. Also, the number of point light source images Sf is larger in the Z direction than in the Y direction. In the example of FIG. 33C, five point light source images Sf are arranged in the Z direction, and three point light source images Sf are arranged in the Y direction.

  Furthermore, the center axis AX2003 of the rod lens 2094 and the optical axis 2093a of the condenser lens 2093 are relatively decentered in the Y direction, so that the distribution of the point light source image Sf generated on the reflection surface p2004 of the concave mirror 2040 is as follows. Since the center point 2044 (optical axis 2015a) is entirely decentered in the Y direction, each of the point light source images Sf can be arranged in an asymmetric relationship with respect to the center point 2044.

  As in the embodiment shown in FIG. 27, a slot-like window 2042 for transmitting a plurality of point light source images Sf arranged in a line in the Z direction on the reflection surface p2004 of the concave mirror 2040 is formed in the Y direction. Three rows are formed at a pitch DSy. The width of each window 2042 in the Y direction is set to be as small as possible within a range that does not block the illumination light flux originating from the point light source image Sf. These slot-shaped windows 2042 are also formed so as to be non-point-symmetric with respect to the center point 2044.

  In the configuration of FIG. 33C, on the reflection surface p2004 (pupil plane pd) of the concave mirror 2040, the distance (Yk) in the Y direction from the point light source image Sf closest to the center point 2044 (optical axis 2015a) to the center point 2044. Is less than half the interval (Yw) between the windows 2042 arranged in the Y direction, that is, Yk <(Yw / 2), so that the light between the central axis AX2003 of the rod lens 2094 and the condenser lens 2093 is set. The amount of eccentricity of the shaft 2093a in the Y direction is set.

  As described above, when the point light source image Sf serving as the source of the illumination light beam EL1 irradiating the illumination region IR of the cylindrical mask M is disposed on the reflection surface p2004 (pupil surface pd) of the concave mirror 2040, the cylindrical mask M As shown in FIG. 33C, the imaging light flux EL2 generated from the illumination region IR on the reflection surface p2004 is a diffraction image Sf ′ (including 0th-order light and ± 1st-order diffraction light, etc.) of the point light source image Sf on the reflection surface p2004. Distributed. On the reflection surface p2004, the diffraction image Sf 'and the point light source image Sf that is the source of the illumination light beam EL1 are located point-symmetrically with respect to the center point 2044.

  In the present embodiment, since the relationship between the distance Yk and the interval Yw is set to be Yk <(Yw / 2), a plurality of images generated on the concave mirror 2040 (pupil plane pd) by the imaging light beam EL2. Each of the diffraction images Sf ′ is formed on the reflection part shifted from the window 2042. In this manner, the imaging light beam EL2 is reflected by the reflecting portion of the concave mirror 2040 with little loss, and the projection area on the substrate P held along the outer peripheral surface p2002 as shown in FIG. Projected to PA.

  As described above, even when the rod lens 2094 is used, by displacing the convergence position of the illumination light beam EL0 on the incident end surface 2094a of the rod lens 2094 from the central axis AX2003, each of the large number of point light source images Sf can be obtained. With respect to the center point 2044 of the reflecting surface p2004 of the concave mirror 2040, it is possible to set an asymmetry relationship with each other.

[Seventeenth embodiment]
Next, the configuration of a processing apparatus (exposure apparatus) U3 according to the seventeenth embodiment will be described with reference to FIGS. In the exposure apparatus of this embodiment, the dimension in the Y direction of the pattern area of the cylindrical mask M and the dimension in the Y direction of the pattern exposure area on the substrate P are illuminated by the projection optical system PL shown in FIG. In order to cope with the size of the region IR or the projection region PA being larger than the dimension in the Y direction, a plurality of projection optical systems are arranged in the Y direction, and the effective exposure range is extended in the Y direction.
For that purpose, it is necessary to project the pattern of the cylindrical mask M on the substrate P as an erect image. In the projection optical system PL shown in FIG. 21, the X direction of the mask pattern image projected on the substrate P is upright, but the mask pattern image is inverted in the Y direction. Therefore, by providing a projection optical system having the same configuration in tandem (serial), the projection image whose Y direction is inverted is again inverted in the Y direction, and as a result, X in the projection area PA on the substrate P. An erect image is obtained in both the direction and the Y direction.

  FIG. 34 shows the overall schematic configuration of the exposure apparatus according to the present embodiment. FIG. 35 shows the positional relationship between the illumination area IR and the projection area PA by each of the plurality of projection optical systems. , And the coordinate system set in the embodiment of FIG. In addition, the same reference numerals are given to the members and elements equivalent to those of the exposure apparatus shown in FIGS. 21 and 23.

  The substrate P transported from the upstream of the transport path is wound around a part of the outer peripheral surface of the rotary drum 2030 via a transport roller, a guide member, and the like (not shown). Conveyed downstream. The second drive section 2032 drives the rotary drum 2030 to rotate clockwise around the rotation center axis AX2002, and the substrate P is fed at a constant speed. The projection areas PA2001 to PA2006 of the six projection optical systems PL2001 to PL2006 are located at the portion of the cylindrical outer peripheral surface of the rotating drum 2030 where the substrate P is wound. Six illumination regions IR2001 to IR2006 are set on the outer peripheral surface (cylindrical mask pattern surface) of the cylindrical mask M corresponding to each of the six projection regions PA2001 to PA2006.

  Each of the six projection optical systems PL2001 to PL2006 has the same optical configuration, and has a central plane pc (parallel to the YZ plane) including the rotation center axis AX2001 of the cylindrical mask M and the rotation center axis AX2002. ), The projection optical systems PL2001, PL2003, PL2005 (collectively referred to as odd-numbered projection optical systems PLo) installed on the left side (−X direction) and the projection optical systems installed on the right side (+ X direction). PL2002, PL2004, and PL2006 (collectively referred to as an even-numbered projection optical system PLe).

  The projection optical systems PL2001 to PL2006 of the present embodiment include the projection optical system PL shown in FIG. 21 and illumination optical systems IL2001 to IL2006 for epi-illumination. Since the configuration is the same as that of FIG. 21, the projection optical system PL2001 and the illumination optical system IL2001 will be briefly described as representatives. The illumination optical system IL2001 receives the illumination light beam EL0 from the light source device 2055, and from behind the concave mirror 2040 arranged on the pupil plane of the upper unit (projection optical system PL similar to FIG. 21) of the projection optical system PL2001. , A large number of point light source images Sf are generated on the reflection surface p2004. The illumination light flux EL1 originating from the point light source image Sf is reflected by the reflection plane 2041a on the upper side of the prism mirror 2041, and illuminates the illumination area IR2001 on the outer peripheral surface of the cylindrical mask M.

The imaging light flux EL2 reflected from the mask pattern in the illumination area IR2001 is reflected by the reflecting plane 2041a, then by the concave mirror 2040, and by the lower reflecting surface (2041b) of the prism mirror 2041, A spatial image (intermediate image) of the mask pattern is formed on a plane p2007 (intermediate image plane p2007).
The projection unit at the subsequent stage of the projection optical system PL2001 is also a half-field equal-magnification catadioptric projection system including a prism mirror, a plurality of lens elements, a concave mirror 2078 arranged on a pupil plane, and the like. After forming the intermediate image, the image forming light beam EL2 is reflected by the concave mirror 2078, then reflected by the lower reflecting plane 2076b of the prism mirror (2076), reaches the projection area PA2001 on the substrate P, and enters the projection area PA2001. Generates an erect image of the mask pattern. Note that the projection unit at the subsequent stage (from the intermediate image plane to the projection area) of the projection optical system PL2001 only needs to re-focus the intermediate image formed on the intermediate image plane p2007 on the projection area PA2001 on the substrate P. On the reflecting surface of concave mirror 2078, window 2042 as formed on reflecting surface p2004 of concave mirror 2040 is not provided.

  The projection optical system PL2001 having the above configuration (the same applies to the other projection optical systems PL2002 to PL2006) is one projection system of a so-called multi-lens system. Therefore, as shown in the projection optical system PL of FIG. The principal ray passing through the center point in the region IR and the principal ray passing through the center point in the projection area PA2001 may not be arranged in the center plane pc.

  Therefore, as shown in FIG. 34, the projection optical system PL2001 (PL2003, PL2005 is also the same) so that the extension line D2001 of the principal ray passing through the center point in the illumination region IR2001 is directed to the rotation center axis AX2001 of the cylindrical mask M. The angle θ 2001 (see FIG. 21) of the reflection plane 2041a of the prism mirror 2041 of the projection unit above () is set to a value other than 45 °. Similarly, the reflection plane 2076b of the prism mirror 2076 of the projection unit below the projection optical system PL2001 such that the extension line D2001 of the principal ray passing through the center point in the projection area PA2001 is directed to the rotation center axis AX2002 of the rotation drum 2030. Is set to a value other than 45 ° with respect to the XY plane.

  The same applies to the projection optical system PL2002 (the same applies to PL2004 and PL2006) symmetrically arranged with respect to the center plane pc with respect to the projection optical system PL2001, and the extension line D2002 of the principal ray passing through the center point in the illumination area IR2002 is a cylinder. The angle θ2001 of the reflection plane 2041a of the prism mirror 2041 of the upper projection unit is set to a value other than 45 ° so as to be directed to the rotation center axis AX2001 of the mask M, and the principal ray passing through the center point in the projection area PA2002 Of the reflection plane 2076b of the prism mirror 2076 in the subsequent projection unit is set to a value other than 45 ° with respect to the XY plane such that the extension line D2002 of the projection mirror 20 goes to the rotation center axis AX2002 of the rotary drum 2030.

  As described above, the odd-numbered projection optical system PLo and the even-numbered projection optical system PLe in which the extension lines D2001 and D2002 of the principal ray are symmetrically inclined with respect to the center plane pc are viewed from the center plane pc when viewed in the XZ plane. However, when viewed in the XY plane, they are displaced in the Y direction. Specifically, each projection is performed such that the illumination regions IR2001 to IR2006 formed on the pattern surface of the cylindrical mask M and the projection regions PA2001 to PA2006 formed on the substrate P have the arrangement relationship shown in FIG. Optical systems PL2001 to PL2006 are provided.

  FIG. 35 is a diagram in which the arrangement of the illumination regions IR2001 to IR2006 and the projection regions PA2001 to PA2006 are viewed in the XY plane, and the left diagram shows the illumination regions IR2001 to IR2006 on the cylindrical mask M, and the intermediate image is The drawing on the right side shows the projection areas PA2001 to PA2006 on the substrate P supported by the rotating drum 2030 as viewed from the intermediate image plane p2007 side. Reference symbol Xs in FIG. 35 indicates the moving direction (rotation direction) of the cylindrical mask M (the rotating drum 2020) and the rotating drum 2030.

  In FIG. 35, each of the illumination regions IR2001 to IR2006 has an upper base and a lower base parallel to the center plane pc (parallel to the Y axis) and has a trapezoidal shape elongated in the Y direction. This means that each of the illumination optical systems IL2001 to IL2006 shown in FIG. 34 includes the illumination field stop 2064 as shown in FIG. Since each of the projection optical systems PL2001 to PL2006 in FIG. 34 forms an intermediate image on the intermediate image plane p2007, when a field stop having a trapezoidal opening is arranged therein, the shape of each of the illumination regions IR2001 to IR2006 is determined. May be simply rectangular (a size including a trapezoidal opening).

  On the outer peripheral surface of the cylindrical mask M, the center point of each of the illumination regions IR2001, IR2003, and IR2005 formed by the odd-numbered projection optical systems PLo is set to a plane Lo (perpendicular to the XY plane) parallel to the center plane pc. The center point of each of the illumination regions IR2002, IR2004, and IR2006 formed by the even-numbered projection optical system PLe is positioned on a plane Le (perpendicular to the XY plane) parallel to the center plane pc.

  Assuming that each of the illumination areas IR2001 to IR2006 has a trapezoidal shape, and the lower base Y dimension in the Y direction is A2002a, and the upper base Y dimension in the Y direction is A2002b, the center point of each of the odd-numbered illumination areas IR2001, IR2003, and IR2005 is The center points of the even-numbered illumination regions IR2002, IR2004, and IR2006 are arranged at intervals (A2002a + A2002b) in the Y direction. However, the even-numbered illumination regions IR2002, IR2004, and IR2006 are relatively displaced by the dimension (A2002a + A2002b) / 2 in the Y direction with respect to the odd-numbered illumination regions IR2001, IR2003, and IR2005. The distances in the X direction from the center plane pc of the plane Lo and the plane Le are set to be equal to each other.

  In the present embodiment, when viewed along the circumferential direction (Xs direction) of the outer peripheral surface of the cylindrical mask M, each of the illumination regions IR2001 to IR2006 has an end portion (trapezoidal shape) of the illumination regions adjacent in the Y direction. The hypotenuses are configured to overlap (overlap) each other. Thus, even when the dimension in the Y direction of the pattern area A2003 of the cylindrical mask M is large, an effective exposure area covering the dimension can be secured. Note that the pattern region A2003 is surrounded by a frame-shaped non-pattern forming region A2004, but the non-pattern forming region A2004 is made of a material having an extremely low reflectance (or high light absorption) with respect to illumination light. ing.

  On the other hand, as shown on the right side of FIG. 35, the projection areas PA2001 to PA2006 on the substrate P are cylindrical when each of the illumination optical systems IL2001 to IL2006 is provided with an illumination field stop 2064 as shown in FIG. It reflects (similar relationship) the arrangement and shape of the illumination regions IR2001 to IR2006 formed on the outer peripheral surface of the mask M in a shape of a circle. Accordingly, the center points of the odd-numbered projection areas PA2001, PA2003, and PA2005 are located on the plane Lo, and the center points of the even-numbered projection areas PA2002, PA2004, and PA2006 are located on the plane Le.

  35, the substrate P is sent at a constant speed in the circumferential direction (Xs direction) along the outer peripheral surface of the rotary drum 2030. The area A2007 indicated by oblique lines in FIG. This is a portion exposed by one of the projection areas PA2001 to PA2006 at 100% of a target exposure amount (toe amount).

  Further, for example, of the region A2005 exposed by the projection region PA2001 corresponding to the illumination region IR2001, the partial region A2005a exposed at the end (triangular portion) in the + Y direction does not reach the target exposure amount. However, when the substrate P is sent in the Xs direction (circumferential direction) and the projection area PA2002 corresponding to the illumination area IR2002 exposes the area A2006, the insufficient exposure amount is accumulated, and as a result, a partial area is obtained. A2005a is also exposed at 100% of the target exposure.

  In this manner, the projected image of the entire pattern area A2003 formed on the outer peripheral surface of the cylindrical mask M is repeatedly made at the same magnification in the longitudinal direction on the substrate P for each rotation of the cylindrical mask M. Will be transcribed.

  In addition, of the principal rays of each imaging light beam EL2 from each of the illumination regions IR2001 to IR2006 on the cylindrical mask M to the projection optical systems PL2001 to PL2006, the principal rays passing through the center point in each of the illumination regions IR2001 to IR2006. The extension lines D2001 and D2002 intersect with the rotation center axis AX2001 of the cylindrical mask M. However, this is not always necessary, and a principal ray passing through any point in each of the illumination regions IR2001 to IR2006 is used as the rotation center. What is necessary is just to cross the axis AX2001. Similarly, with respect to the imaging light flux EL2 traveling from each of the projection optical systems PL2001 to PL2006 to each of the projection areas PA2001 to PA2006 on the substrate P, any one of the chief rays is transmitted to the rotation center axis of the rotating drum 2030. What is necessary is just to make it coincide with the extension lines D2001 and D2002 intersecting with AX2002.

  Next, specific configurations of the projection optical systems PL2001 to PL2006 and the illumination optical systems IL2001 to IL2006 shown in FIG. 34 will be described with reference to FIG. FIG. 36 representatively shows a detailed configuration of the projection optical system PL2001 and the illumination optical system IL2001, but the configurations of the other projection optical systems PL2002 to PL2006 and the illumination optical systems IL2002 to IL2006 are the same.

  As shown in FIG. 36, the illumination light beam EL0 from the light source device 2055 (see FIG. 24) including the light guide member 2060 and the lens system 2061 is used as the fly-eye lens 2062 of the illumination optical system IL2001 (see FIGS. 25 and 28 to 30). ). The illumination luminous flux originating from a number of point light source images generated on the emission side surface Ep of the fly-eye lens 2062 is uniformly illuminated by the condenser lens 2065 on the surface 2014b conjugate with the mask on which the illumination field stop 2064 is arranged. Be distributed. The illumination light beam passing through the opening of the illumination field stop 2064 is reflected by the lens system 2066, the base material (quartz, etc.) of the concave mirror 2040 of the second optical system 2015 above the projection optical system PL2001 (first stage), and the concave mirror 2040. The window (2042) formed on the surface p2004 and the second optical system 2015 are transmitted, and further reflected by the reflection plane 2041a on the upper side of the prism mirror 2041 in the direction along the extension line D2001. The illumination area IR is reached.

  23, the reflection surface p2004 of the concave mirror 2040 is arranged on the pupil plane pd in the image forming optical path of the projection optical system PL2001, and the reflection surface p2004 is the same as the emission side surface Ep of the fly-eye lens 2062. Since a plurality of point light source images generated on the surface Ep on the exit end side of the fly-eye lens 2062 are relayed since they are substantially conjugated, they are generated in the window 2042 formed on the reflection surface p2004. You.

  In the specific configuration of FIG. 36, the focus correction optical member 2080 and the image shift optical member 2081 are inclined between the reflection plane 2041a on the upper side of the prism mirror 2041 and the pattern surface p2001 of the cylindrical mask M. Along the extended line D2001. The focus correction optical member 2080 is obtained by, for example, superposing two wedge-shaped prisms in opposite directions (in FIG. 36, opposite directions in the X direction) to form a transparent parallel plate as a whole. By sliding the pair of prisms to change the thickness as a parallel plate, the effective optical path length of the imaging optical path is finely adjusted, and the pattern formed on the intermediate image plane p2007 and the projection area PA2001 The focus state of the image is finely adjusted.

  The image shift optical member 2081 is composed of a transparent parallel flat glass that can be tilted in the XZ plane in FIG. 36 and a transparent parallel flat glass that can be tilted in a direction orthogonal to the XZ plane. The pattern images formed on the intermediate image plane p2007 and the projection area PA2001 can be slightly shifted in the X direction and the Y direction by adjusting the respective tilt amounts of the two parallel flat glass plates.

  Now, the image of the mask pattern appearing in the illumination area IR2001 is the focus correction optical member 2080, the image shift optical member 2081, the reflection plane 2041a of the prism mirror 2041, and the second optical system above the projection optical system PL2001 (first stage). 2015, an image is formed on the intermediate image plane p2007 via the reflection plane 2041b of the prism mirror 2041. A field stop 2075 that makes the shape of the projection area PA2001 trapezoidal as shown in FIG. 35 can be arranged on the intermediate image plane p2007. In that case, the opening of the illumination field stop 2064 provided in the illumination optical system IL2001 may be a rectangle (rectangle) including the trapezoidal opening of the field stop 2075.

  The image forming light flux which has become an intermediate image at the opening of the field stop 2075 is reflected by the reflection plane 2076 a of the lower (second stage) prism mirror 2076, the second optical system 2077, and the prism mirror 2076 which constitute the projection optical system PL2001. The light is projected onto the projection area PA2001 on the substrate P wound around the outer peripheral surface p2002 of the rotating drum 2030 via the reflection plane 2076b. The reflection surface of the concave mirror 2078 included in the second optical system 2077 is disposed on the pupil plane pd, and the reflection plane 2076b on the lower side of the prism mirror 2076 is an extension line in which the principal ray of the imaging light flux is inclined with respect to the center plane pc. The angle with respect to the XY plane is set to be less than 45 ° so as to proceed along D2001.

  In the specific configuration of FIG. 36, between the lower reflecting plane 2076b of the prism mirror 2076 and the projection area PA2001 on the substrate P wound around the rotating drum 2030, three lenses of a concave lens, a convex lens, and a concave lens are provided. Are arranged coaxially at predetermined intervals, the front and rear concave lenses are fixed, and a magnification correcting optical member 2083 for moving the convex lens therebetween in the optical axis (principal ray) direction is provided. Thus, the pattern image formed in projection area PA2001 is isotropically enlarged or reduced by a small amount while maintaining a telecentric imaging state.

  Although not shown in FIG. 36, there is also provided a rotation correction mechanism that allows one of the prism mirrors 2041 and 2076 to be slightly rotated around an axis parallel to the Z axis. This rotation correction mechanism is for slightly rotating each of the plurality of projection areas PA2001 to PA2006 (and the projected mask pattern image) shown in FIG. 35 in the XY plane.

  As described above, in the seventeenth embodiment, as shown in FIG. 34 and FIG. 36, each of the six sets of projection optical systems PL2001 to PL2006 controls the illumination on the outer peripheral surface (pattern surface) of the cylindrical mask M. Epi-illumination can be performed on the regions IR2001 to IR2006 with illumination light having a principal ray that intersects the rotation center axis AX2001 of the cylindrical mask M.

  Further, a principal ray traveling from each of the illumination regions IR2001 to IR2006 in the normal direction of the pattern surface p2001 of the cylindrical mask M is also applied to each of the projection regions PA2001 to PA2006 on the substrate P along the outer peripheral surface p2002. The imaging light flux is deflected so as to be incident from the. Therefore, the defocus of the projection image can be reduced, and the occurrence of processing defects such as exposure defects is suppressed, and as a result, the occurrence of defective devices is suppressed.

  Further, each of the projection optical systems PL2001 to PL2006 is configured such that the principal ray of the image-forming light beam is inclined with respect to the center plane pc from the outer peripheral surface of the cylindrical mask M to the prism mirror 2041 (reflection plane 2041a). With such a configuration, in the spatial arrangement of the projection optical systems PL2001 to PL2006, conditions for interference (collision) with each other are reduced.

  Note that the lower reflection plane 2041b and the prism mirror 2076 of the prism mirror 2041 are arranged such that the principal ray of the imaging light beam passing through the intermediate image plane p2007 of each of the projection optical systems PL2001 to PL2006 is parallel to the center plane pc. The upper reflecting plane 2076a is set at an angle of 45 ° with respect to the XY plane.

[Modification of Seventeenth Embodiment]
In the exposure apparatus provided with the projection optical system of the multi-lens type shown in FIGS. 34 to 36, the image of the cylindrical mask pattern is projected and exposed on the surface of the substrate P supported in a cylindrical shape. Either M or the substrate P may be supported on a plane, or both may be supported on a plane. For example, as shown in FIG. 34, the substrate P is wound around a rotating drum 2030 and supported in a cylindrical shape, and the mask M is formed on parallel flat glass (quartz) as in the related art, and is moved linearly in the X direction. Exposure method, conversely, a mask M is supported on a rotating drum 2020 as shown in FIG. 34, and a substrate P is supported by a flat surface stage or an air pad type holder and is fed linearly in the X direction. Any of these may be used.

  Further, the projection optical system and the illumination optical system according to the above embodiments can be applied to the mask M and the substrate P regardless of whether the supporting form is cylindrical or planar. On the side supported flat, the inclination angle of the reflection plane 2041a above the prism mirror 2041 and the reflection plane 2076b below the prism mirror 2076 with respect to the XY plane may be set to 45 °. In other words, the object plane of the projection optical system is adjusted to the normal passing through the center of the illumination area IR (object plane) on the mask M or the normal passing through the center of the projection area PA (image plane) on the substrate P. The principal ray on the side and the principal ray on the image plane side may be inclined in the XZ plane.

[Eighteenth Embodiment]
FIG. 37 is a diagram showing a configuration of a projection optical system PL (PL2001 in the case of a multi-lens system) according to the eighteenth embodiment. The projection optical system PL (PL2001) of the present embodiment converts an imaged light flux EL2 (chief ray is EL6) from a mask pattern in an illumination area IR (IR2001) on the outer peripheral surface of a cylindrical mask M into a plane mirror. The reflection surface of the plane mirror 2101 is reflected by the reflection surface 2100a of the plane mirror 2100 via a second optical system 2015 (half-field type catadioptric imaging system) having a concave mirror 2040 in which the reflection surface p2004 is arranged on the pupil surface. The light is reflected at 2101a, and an intermediate image of the same size as the mask pattern appearing in the illumination region IR (IR2001) is formed on the intermediate image plane Im.

  Further, the intermediate image formed on the intermediate image plane Im is transferred to an outer peripheral surface p2002 parallel to the XY plane by an enlarged imaging system 2102 (having an optical axis 2102a parallel to the Z axis) having, for example, a magnification of 2 or more. It is projected onto a projection area PA (PA2001) on a substrate P supported along. The substrate P is supported via a fluid bearing layer on a flat holder HH provided with a pad for a fluid bearing having a flat surface. Also in the case of the present embodiment, on the reflecting surface p2004 of the concave mirror 2040 constituting the projection optical system PL (PL2001), a large number of point light source images Sf generated by the illumination light from the illumination optical system IL (IL2001) located behind. A window 2042 for transmission is formed.

  When exposing a mask pattern having a large dimension in the Y direction by using a multi-lens in the enlarged projection optical system as shown in FIG. 37, the projection optical system PL (PL1) including the illumination optical system IL (IL2001) and the plane mirrors 2100 and 2101. Are arranged symmetrically with respect to the center plane pc in the XZ plane as shown in FIGS. 34 and 35, and the end (triangular portion) of the projection area PA (PA2001) in the Y direction in the Y direction. ), The projection images are arranged so as to be separated from each other so that the projection images partially overlap.

  In this embodiment, assuming that the center plane pc is a plane that includes the rotation center axis AX2001 of the cylindrical mask M and is perpendicular to the XY plane (the outer peripheral surface p2002), the odd-numbered projection optical systems PL2001, PL2003,. The central points of the illumination regions IR2001, IR2003,... (For example, points through which the principal ray EL6 passes) are inclined with respect to the central plane pc on the mask side, so that the outer peripheral surface and the central plane of the cylindrical mask M are provided. The circumference is away from the intersection with pc by the distance DMx. Therefore, each center point of the illumination regions IR2002, IR2004,... Of the even-numbered projection optical systems PL2002, PL2004,... Is also a distance from the intersection line between the outer peripheral surface of the cylindrical mask M and the central plane pc. They will be separated by DMx. .. And the even-numbered illumination regions IR2002 are separated by a distance (2DMx) in the circumferential direction on the cylindrical mask M.

  On the other hand, the center points (points through which the principal ray EL6 passes) of the projection areas PA2001, PA2003,... Of the odd-numbered projection optical systems PL2001, PL2003,. .. And the even-numbered projection areas PA2002... Are separated from each other by a distance (2DFx) in the X direction on the substrate P. Therefore, when the mask patterns for each of the illumination regions IR2001, IR2002,... Formed on the cylindrical mask M are aligned in the circumferential direction, the magnification of the projection optical systems PL2001, PL2002,. It is necessary to determine Mp so as to satisfy the relationship of Mp · (2DMx) = 2DFx. If such a condition is not possible due to mechanical reasons, the mask patterns for the odd-numbered illumination regions IR2001, IR2003... Formed on the cylindrical mask M and the even-numbered illumination regions IR2002 What is necessary is just to form the mask pattern for IR2004 ... shifted relatively in the circumferential direction.

[Nineteenth Embodiment]
FIG. 38 is a diagram showing the configuration of the projection optical system PL of the nineteenth embodiment. The projection optical system PL of this embodiment includes a lens system 2103, a lens system 2104, a concave mirror (reflection optical member) 2040 arranged on the pupil plane, deflection mirrors 2106 and 2107, and a lens system 2108.

  In the present embodiment, the imaging light flux EL2 from the illumination region IR on the outer peripheral surface of the cylindrical mask M enters the lens system 2103 via a half field on the −X side with respect to the optical axis 2103a of the lens system 2103. Then, the light enters the lens system 2104 (the optical axis 2104a is coaxial with the optical axis 2103a). The imaging light beam EL2 passing through the lens system 2104 is reflected by the reflecting surface p2004 of the concave mirror 2040 (the optical axis of which is 2104a), is reflected in the -X direction by the reflecting surface 2106a of the deflecting mirror 2106, and After being guided out of the optical path formed by the concave mirror 2040, the light is reflected in the −Z direction by the reflection surface 2107 a of the deflecting mirror 2107.

  The image forming light beam EL2 reflected by the deflecting mirror 2107 passes through the lens system 2108 and irradiates the projection area PA. With the above optical path, the projection optical system PL shifts the image of the mask pattern appearing in the illumination region IR on the cylindrical mask M into the projection region PA on the substrate P planarly supported by the same configuration as in FIG. Form an image. The projection optical system according to the present embodiment is designed so as not to form an intermediate image plane in order to particularly realize enlarged projection with a compact system. Further, the extension line D2001 of the chief ray EL6 on the cylindrical mask M side of the projection optical system PL is set to intersect with the rotation center axis AX2001 of the cylindrical mask M, and the chief ray EL6 on the substrate P side is It is set perpendicular to the surface of the substrate P supported on a plane.

  In FIG. 38, an image forming light beam EL2 from within the illumination region IR is designed to pass on the −X side of an optical axis 2108a (parallel to the Z axis and perpendicular to the substrate P) of the lens system 2108 that gives a main magnification. can do. Therefore, a portion of the lens system 2108 on the + X side from the optical axis 2108a that does not contribute to the projection of the mask pattern is cut out. Thereby, the size of the projection optical system PL in the X direction (scanning direction of the substrate P) can be reduced.

  In this modification as well, similarly to FIGS. 21, 23, 31, 32A, 32B, and 37, the illumination optical system IL and the light source device 2055 are disposed on the back side of the concave mirror 2040, and the reflection surface of the concave mirror 2040 Many point light source images Sf are generated in the window (2042) formed in p2004 (disposed on the pupil plane). The distribution of the point light source image on the reflection surface p2004 and the shape and arrangement of the windows in the reflection surface p2004 are as shown in FIGS. 27 to 30 or FIGS. 33A to 33C in accordance with the conditions described in FIG. Is set to

  In each of the above-described embodiments and modifications (FIGS. 12, 21, and 34 to 38), the cylindrical mask M is provided on the surface of a cylindrical base material such as metal, ceramics, and glass. It is assumed that the pattern is directly formed by the reflecting portion. However, a sheet-like reflection type in which a pattern is formed on one surface of a strip-shaped ultrathin glass plate (for example, 100 to 500 μm thick) having good flatness with a reflection film. A mask may be formed by curving and winding it along the outer peripheral surface of the metallic rotary drum 2020.

  Such a sheet-shaped reflective mask may be permanently attached to the outer peripheral surface of the rotating drum 2020, or may be fixed so as to be releasable (replaceable). The reflection film of the sheet-shaped reflection mask includes a film made of a material having a high reflectance to the illumination light beam EL1 such as aluminum, a dielectric multilayer film, or the like. In that case, the rotating drum 2020 may be provided with a light-shielding layer (film) that absorbs the illumination light beam EL1 that has passed through the transparent portion of the sheet-shaped reflective mask, and the light-shielding layer also suppresses the generation of stray light.

  Further, the cylindrical mask M may be one in which only a pattern corresponding to one device (one display panel) is formed over the entire circumference, or one pattern (one display panel). A plurality of patterns may be formed. Further, the device patterns on the cylindrical mask M may be repeatedly arranged in the circumferential direction of the outer peripheral surface, or may be arranged in a plurality of directions in a direction parallel to the rotation center axis AX2001. Further, the cylindrical mask M may be provided with a pattern for manufacturing a first device and a pattern for manufacturing a second device different from the first device.

[Device manufacturing method]
Next, a device manufacturing method will be described. FIG. 39 is a flowchart illustrating the device manufacturing method according to the present embodiment.

  In the device manufacturing method shown in FIG. 39, first, the function and performance of a device such as a display panel using a self-luminous element such as an organic EL are designed, and necessary circuit patterns and wiring patterns are designed by CAD and the like (Step 201). . Next, masks M (cylindrical or planar) for the necessary layers are manufactured based on the design of devices such as patterns for various layers designed by CAD or the like (step 202). In addition, a substrate such as a transparent film or sheet as a substrate of the device, a substrate such as an ultra-thin metal foil, or a flexible substrate (a resin film, a metal foil film, a plastic, etc.) as a substrate of a display panel is wound. The roll is prepared by purchasing, manufacturing, or the like (step 203).

  Note that the roll-shaped substrate prepared in step 203 has a surface modified as necessary, a base layer (for example, fine irregularities formed by an imprint method) formed in advance, A functional film or a transparent film (insulating material) laminated in advance may be used.

  Next, the prepared substrate is put into a roll-type or patch-type production line, and the substrate is constituted by electrodes and wiring constituting devices such as a display panel device, an insulating film, a TFT such as a semiconductor film (thin film semiconductor) and the like. In addition to forming a backplane layer to be formed, a light-emitting layer of a self-light-emitting element such as an organic EL to be a display pixel portion is formed so as to be laminated on the backplane layer (step 204). Step 204 typically includes a step of forming a resist pattern on a film on the substrate, and a step of etching the film using the resist pattern as a mask. In forming the resist pattern, a step of uniformly forming a resist film on the surface of the substrate, a step of exposing the resist film of the substrate to exposure light patterned via the mask M according to each of the above embodiments, A step of developing the resist film on which the latent image of the mask pattern is formed by exposure.

  In the case of manufacturing a flexible device using a printing technique or the like, a step of forming a functional photosensitive layer (photosensitive silane coupling material or the like) on the substrate surface by a coating method, through a mask M according to each of the above embodiments. Irradiating the functional photosensitive layer with exposure light patterned by exposure to light, and forming a pattern by forming a hydrophilic portion and a water-repellent portion on the functional photosensitive layer according to the pattern shape; A step of applying a plating base solution or the like to a highly hydrophilic portion of the layer and depositing and forming a metallic pattern by electroless plating is performed.

  This step 204 also includes a conventional photolithography step of exposing the photoresist layer using the exposure apparatus described in each of the above embodiments. It also includes a wet process of forming a pattern (wiring, electrode, etc.) of a metal film by a plating method, or a printing process of drawing a pattern with a conductive ink containing silver nanoparticles or the like.

  Then, depending on the device to be manufactured, for example, for each display panel device that is continuously manufactured on a long substrate by a roll method, dicing or cutting the substrate, or other substrates manufactured in a separate process For example, a step of bonding a protective film (for an environment barrier layer), a sheet-shaped color filter having a sealing function, a thin glass substrate, or the like to the surface of each display panel device is performed, and the device is assembled (Step 205). ). Next, post-processing (process) such as inspection is performed on the display panel device to determine whether it functions normally or satisfies desired performance and characteristics (step 206). As described above, a device such as a display panel (flexible display) can be manufactured.

  Note that the technical scope of the present invention is not limited to the above-described embodiment or the modified example. For example, one or more of the components described in the above embodiment or the modification may be omitted. Also, the components described in the above embodiment or the modified example can be appropriately combined.

  1001 ... device manufacturing system, 1009 ... transfer device, 1011 ... substrate processing device, 1021 ... first drum member, 1022 ... second drum member, 1050 ... first deflection member, 1057: second deflecting member, 1078: stage, 1120: third deflecting member, 1211: fourth deflecting member, 1132 ... seventh deflecting member, 1133 ... eighth deflecting member , 1136 ninth deflecting member, 1137 ... tenth deflecting member, 1140 ... eleventh deflecting member, 1143 ... twelfth deflecting member, 1151 ... thirteenth deflecting member, 1152 ... Fourteenth deflecting member, AX1001 ... first central axis, AX1002 ... second central axis, D1001 ... first radial direction, D1002 ... second radial direction, D1003 ... first normal direction , D 004: second normal direction, DFx: distance, DMx: circumference, IR: illumination area, M: mask, P: substrate, PA: projection area, PL ... Projection optical system, PL1001 to PL1006 Projection module, p1001 First plane, p1002 Second plane, p1003 Central plane, p1007 Intermediate image plane, 2001・ Device manufacturing system, 2005 ・ ・ ・ Higher-level control device, 2013 ・ ・ ・ Control device, 2014 ・ ・ ・ First optical system, 2015 ・ ・ ・ Second optical system, 2020 ・ ・ ・ Rotary drum, 2030 ・ ・ ・ Rotation Drum, 2040: concave mirror, 2094: rod lens, U3: processing apparatus (substrate processing apparatus, exposure apparatus).

Claims (10)

A cylindrical mask on which a reflective mask pattern is formed along a cylindrical surface having a predetermined radius from the first center line is rotated around the first center line, and a flexible long sheet substrate is moved in the longitudinal direction. A cylindrical mask exposure apparatus that moves along the mask pattern to project and expose the mask pattern on the sheet substrate,
A part of the sheet substrate is cylindrically supported on a cylindrical outer peripheral surface having a predetermined radius from a second center line set substantially parallel to the first center line, and is rotated around the second center line. A rotating drum for feeding the sheet substrate in the longitudinal direction,
A first center line that is disposed on one side of a center plane including the first center line and the second center line and that is set on the cylindrical surface of the cylindrical mask at a predetermined angle of less than 90 ° from the center plane; A first image light beam generated in a radial direction of the cylindrical mask is incident from an illumination area, and is set to be inclined by a predetermined angle of less than 90 ° from the center plane on the sheet substrate supported by the rotating drum. A first projection optical system that projects the first image light beam in a radial direction of the rotating drum toward a first projection area;
A second illumination region arranged on the other side of the center plane and inclined from the center plane by a predetermined angle of less than 90 ° and set on the outer peripheral surface of the cylindrical mask in a radial direction of the cylindrical mask; 2, the second image light beam is directed toward a second projection area set at a predetermined angle of less than 90 ° from the center plane on the sheet substrate supported by the rotating drum. A second projection optical system for projecting in the radial direction of the rotating drum,
An illumination light beam for epi-illuminating the first illumination area is reflected between the cylindrical mask and the first projection optical system, and the first image light beam from the first illumination area is projected onto the first projection area. A first illumination system including a first beam splitter for transmitting light toward the optical system;
An illumination light beam for epi-illuminating the second illumination area is reflected between the cylindrical mask and the second projection optical system, and the second image light flux from the second illumination area is projected onto the second projection area. A second illumination system including a second beam splitter that transmits the light toward the optical system;
A cylindrical mask exposure apparatus comprising: The cylindrical mask exposure apparatus according to claim 1,
Each of the first and second beam splitters is configured by a polarizing beam splitter having a wavefront splitting surface that separates incident light into light reflected and transmitted according to the polarization state,
Each of the first illumination system and the second illumination system has a quarter-wave plate that is disposed between the cylindrical mask and the polarization beam splitter and converts linearly polarized light into circularly polarized light. And
The illumination light flux incident on the polarization beam splitter for epi-illuminating each of the first illumination area and the second illumination area is set to linearly polarized light reflected on the wavefront splitting surface,
Cylindrical mask exposure equipment. The cylindrical mask exposure apparatus according to claim 2,
The first projection optical system and the second projection optical system include:
The first illumination region and the second illumination region are located on the cylindrical surface of the cylindrical mask so as to be shifted in the direction of the first center line, and the first projection region and the second projection region are located on the rotating drum. Is disposed so as to be shifted in the direction of the second center line on the sheet substrate supported by
Cylindrical mask exposure equipment. The cylindrical mask exposure apparatus according to claim 3,
The first projection optical system and the second projection optical system include:
A projected image of the mask pattern exposed on the sheet substrate in the first projection area and a projected image of the mask pattern exposed on the sheet substrate in the second projection area are the second center line. Are arranged to be exposed in the direction of
Cylindrical mask exposure equipment. A cylindrical mask exposure apparatus according to any one of claims 1 to 4,
Each of the first projection optical system and the second projection optical system includes:
Either a projection magnification for forming an image of the same size of the mask pattern on the sheet substrate in a telecentric state or a projection magnification for forming an enlarged image of the mask pattern on the sheet substrate in a telecentric state. Having one,
Cylindrical mask exposure equipment. It is a cylindrical mask exposure apparatus according to any one of claims 1 to 5,
The illumination light flux emitted from the first illumination system to the first illumination area is such that an extension of a principal ray of the illumination light flux passing through a center point of the first illumination area is the first center line of the cylindrical mask. Is set to head to
The illumination light flux emitted from the second illumination system to the second illumination area is such that an extension of a principal ray of the illumination light flux passing through a center point of the second illumination area is the first center line of the cylindrical mask. Set to head towards
Cylindrical mask exposure equipment. A cylindrical mask exposure apparatus according to any one of claims 1 to 6,
The first image light flux projected from the first projection optical system to the first projection area is the first image passing through a center point of the first projection area corresponding to a center point of the first illumination area. An extension of the principal ray of the light beam is set to be directed to the second center line of the rotating drum,
The second image light flux projected from the second projection optical system onto the second projection area is the second image passing through a center point of the second projection area corresponding to a center point of the second illumination area. An extension of the principal ray of the light beam is set so as to be directed to the second center line of the rotating drum.
Cylindrical mask exposure equipment. It is a cylindrical mask exposure apparatus of Claim 5, Comprising:
The peripheral length along the cylindrical surface of the cylindrical mask between the center point of the first illumination area and the center point of the second illumination area is DMx, and the center length of the first projection area and the second projection area When a circumference along the outer peripheral surface of the rotary drum between the center point and the center point is DFx, and a projection magnification of the first projection optical system and the second projection optical system is Mp,
At least one of the first projection optical system and the second projection optical system adjusts an optical path of the first image light flux or the second image light flux so as to satisfy a relationship of DFx = Mp · DMx. Comprising,
Cylindrical mask exposure equipment. A cylindrical mask exposure apparatus according to any one of claims 1 to 8,
An inclination angle of the cylindrical mask in the circumferential direction from the center plane to the center point of the first illumination area with respect to a circumferential direction of the cylindrical mask of the cylindrical mask from the center plane to the center point of the second illumination area; The inclination angle with respect to the direction was set to an equal angle of less than 90 ° symmetric with respect to the center plane,
Cylindrical mask exposure equipment. It is a cylindrical mask exposure apparatus according to any one of claims 1 to 9,
A peripheral inclination angle of the outer peripheral surface of the rotary drum from the center plane to the center point of the first projection area, and a peripheral angle of the outer peripheral surface of the rotary drum from the center plane to the center point of the second projection area; The inclination angle with respect to the direction was set to an equal angle of less than 90 ° symmetric with respect to the center plane,
Cylindrical mask exposure equipment.

Images