JP6681114B2 - Method of manufacturing conductive circuit and conductive circuit - Google Patents

Description

  The present invention relates to a method for manufacturing a conductive circuit and a conductive circuit manufactured by the manufacturing method.

  Touch panels are used in smartphones and tablet devices. A touch panel is an electronic component that integrates a display and a touch sensor. A transparent conductive circuit is used for the touch sensor to ensure the visibility of the display. A transparent conductive circuit is an electrical circuit that appears transparent. Conventionally, a transparent conductive circuit having a transparent conductive film made of ITO (indium-tin oxide) is known (see, for example, Patent Document 1). However, in such a transparent conductive circuit, since the conductive film made of ITO has a high electric resistance, it is difficult to cope with an increase in the size of the touch sensor.

  A touch sensor having a transparent conductive film formed of a linear pattern of a metal film without using ITO is known (for example, refer to Patent Document 2). The linear pattern of the metal film has, for example, a mesh shape, and is formed thin so that it can be seen by the naked eye. However, since this transparent conductive film has a step of removing an unnecessary portion of the metal film by etching in the production, it is not easy to produce, and the treatment of the waste liquid generated by the etching is costly.

  The base material in the transparent conductive circuit is a transparent base material having a light-transmitting property. Light is diffusely reflected when the surface of the transparent substrate is roughened, so that the surface is preferably smooth. Therefore, when the linear pattern of the metal film is formed on a smooth transparent substrate, the metal film has a problem of ensuring adhesion to the transparent substrate, and it is not easy to form the metal film on the transparent substrate. Absent.

JP-A-5-291726 JP, 2005-65376, A

  The present invention solves the above-mentioned problems, and in the method for producing a conductive circuit and the conductive circuit, even if the base material is a transparent base material, a pattern of a conductor layer made of metal can be easily formed on the base material. The purpose is to do.

  The method for producing a conductive circuit of the present invention is a method for producing a conductive circuit having a base material and a conductor layer pattern, the step of forming a pattern of an adhesive resin layer on the base material, and copper fine particles dispersed therein. Forming a liquid film of a copper fine particle dispersion liquid dispersed in a medium on the adhesive resin layer; forming the copper fine particle layer by drying the dispersion medium in the liquid film; A step of forming a pattern of a conductor layer by applying electroless copper plating using the layer as a seed layer, wherein the adhesive resin layer contains an adhesive resin that adheres the copper fine particles to the base material. And

  In the method for manufacturing a conductive circuit, the base material preferably has a light-transmitting property.

  In this method for producing a conductive circuit, the substrate is preferably made of a transparent insulating material selected from the group consisting of glass, polyethylene terephthalate, polycarbonate and cyclic olefin copolymer.

  In this method for producing a conductive circuit, it is preferable that the adhesive resin layer further contains a black material.

  In this method for producing a conductive circuit, the conductor layer pattern preferably has a linear pattern with a line width of 5 μm or less.

  In this method for producing a conductive circuit, the adhesive resin is preferably a synthetic resin selected from the group consisting of epoxy resin, polyolefin resin and polyamide resin.

  In this method for producing a conductive circuit, in the step of forming a pattern of a conductor layer, electroless copper plating may be performed using the copper fine particle layer as a seed layer, and then electroless nickel plating may be further performed.

  In this method for producing a conductive circuit, in the step of forming the pattern of the conductor layer, the electroless copper plating may be performed using the copper fine particle layer as a seed layer, and then the electroplating may be further performed.

  The conductive circuit of the present invention has a base material and a conductor layer pattern, wherein the adhesive resin layer pattern on the base material, the copper fine particle layer on the adhesive resin layer, and the copper fine particles are provided. A pattern of a conductor layer bonded to the layer and bonded to the adhesive resin layer, the adhesive resin layer contains an adhesive resin that adheres the copper fine particles of the copper fine particle layer to the substrate, The conductor layer has a metal layer formed by electroless copper plating using the copper fine particle layer as a seed layer.

  In this conductive circuit, the base material preferably has a light-transmitting property.

  In this conductive circuit, the substrate is preferably made of a transparent insulating material selected from the group consisting of glass, polyethylene terephthalate, polycarbonate and cyclic olefin copolymer.

  In this conductive circuit, it is preferable that the adhesive resin layer further contains a black material.

  In this conductive circuit, the conductor layer pattern preferably has a linear pattern with a line width of 5 μm or less.

  In this conductive circuit, the adhesive resin is preferably a synthetic resin selected from the group consisting of epoxy resin, polyolefin resin and polyamide resin.

  According to the method for producing a conductive circuit of the present invention, since the copper fine particle dispersion liquid is used, the copper fine particle layer can be formed by a printing method or the like. Since the conductor layer pattern is formed by electroless copper plating using the copper fine particle layer as a seed layer, the conductor layer pattern made of metal can be easily formed. According to the conductive circuit of the present invention, since the adhesive resin layer adheres the copper fine particles of the copper fine particle layer to the base material, even if the base material is a transparent base material, the electroless copper having the copper fine particle layer as the seed layer is used. The conductor layer formed by plating ensures the adhesiveness with the base material via the adhesive resin layer.

(A)-(e) is sectional drawing which shows the manufacturing method of the electrically conductive circuit which concerns on one Embodiment of this invention in order of a time series. The sectional block diagram of the conductive circuit.

  A method for manufacturing a conductive circuit according to an embodiment of the present invention will be described with reference to FIGS. As shown in FIG. 1E, this method is a method of manufacturing the conductive circuit 1. The conductive circuit 1 has a base material 2 and a pattern of the conductor layer 5. FIG. 1E shows a cross-sectional structure of the conductive circuit 1. In the conductive circuit 1, the pattern of the conductor layer 5 is a circuit pattern in plan view.

  As shown in FIG. 1A, the base material 2 is formed of a plate-shaped material. In this embodiment, the base material 2 is translucent and is made of a transparent insulating material. The transparent insulating material is, for example, glass, and may be polyethylene terephthalate, polycarbonate, a cyclic olefin copolymer, or the like.

  First, as shown in FIG. 1B, a pattern of the adhesive resin layer 3 is formed on the base material 2. The adhesive resin layer 3 contains an adhesive resin. The adhesive resin is a resin that adheres the copper fine particles described below to the base material 2.

  The adhesive resin contained in the adhesive resin layer 3 is, for example, an epoxy resin. The adhesive resin may be a polyolefin resin or a polyamide resin (nylon resin).

  In the present embodiment, the adhesive resin layer 3 further contains a black material. The black material is, for example, carbon fine particles (carbon black), and blackens the adhesive resin layer 3. The particle size of the carbon fine particles is, for example, 13 nm to 24 nm in terms of BET conversion particle size, and is not limited thereto. Further, the black material may be a dye, a pigment, or a black resin.

  The pattern of the adhesive resin layer 3 is formed on the base material 2 by a printing method using, for example, an adhesive resin dissolved in a solvent as ink. Further, an adhesive resin dissolved in a solvent may be embedded with a squeegee or the like in the base material 2 in which grooves are formed by the nanoimprint method or the like. The adhesive resin layer 3 is not limited to a single layer, and a plurality of layers having different components may be laminated.

  Then, as shown in FIG. 1C, a liquid film 4 made of a copper fine particle dispersion is formed on the adhesive resin layer 3. In the copper fine particle dispersion liquid, copper fine particles 41 are dispersed in a dispersion medium 42.

  The copper fine particles 41 are, for example, nanoparticles having a median diameter (center particle diameter) of 1 nm or more and less than 100 nm. The copper fine particles 41 may be dispersed in the dispersion medium 42, and the particle size of the copper fine particles 41 is not limited. A dispersant for dispersing the copper fine particles 41 in the dispersion medium 42 may be added to the copper fine particle dispersion liquid.

  The dispersion medium 42 is, for example, a protic dispersion medium or an aprotic polar dispersion medium having a relative dielectric constant of 30 or more. The dispersant disperses the copper fine particles 41 in a dispersion medium, and is, for example, a compound having at least one acidic functional group and having a molecular weight of 200 or more and 100,000 or less, or a salt thereof.

  Examples of the protic dispersion medium include 3-methoxy-3-methylbutanol, triethylene glycol monomethyl ether, diethylene glycol monobutyl ether, diethylene glycol monomethyl ether, propylene glycol monobutyl ether, ethylene glycol monohexyl ether, ethylene glycol mono-tert-butyl ether. , 2-octanol, 2-methylpentane-2,4-diol, ethylene glycol, propylene glycol, 1,5-pentanediol, diethylene glycol, triethylene glycol, glycerin, sorbitol and the like, but are not limited thereto.

  Examples of the aprotic polar dispersion medium having a relative dielectric constant of 30 or more include propylene carbonate, 1,3-dimethyl-2-imidazolidinone, hexamethylphosphoramide, N-methylpyrrolidone, N-ethylpyrrolidone and nitrobenzene. , N, N-diethylformamide, N, N-dimethylacetamide, furfural, γ-butyrolactone, ethylene sulfite, sulfolane, dimethyl sulfoxide, succinonitrile, ethylene carbonate and the like, but are not limited thereto.

  The dispersant is, for example, a compound having a phosphoric acid group, a phosphonic acid group, a sulfonic acid group, a sulfuric acid group, a carboxyl group or the like as an acidic functional group.

  The liquid film 4 made of such a copper fine particle dispersion is formed by a printing method such as gravure offset printing or adhesive force contrast printing. Since the liquid film 4 is formed on the adhesive resin layer 3 and the adhesive resin layer 3 has a pattern, the liquid film 4 also has the same pattern.

  Then, the dispersion medium 42 in the liquid film 4 is dried to form a copper fine particle layer 43 as shown in FIG.

  By drying the liquid film 4, the copper fine particles 41 remain on the adhesive resin layer 3, and the copper fine particle layer 43 composed of the copper fine particles 41 is formed on the adhesive resin layer 3. Since the liquid film 4 has a pattern, the copper fine particle layer 43 also has the same pattern. The copper fine particle layer 43 is bonded to the adhesive resin layer 3. The adhesive force of the adhesive resin of the adhesive resin layer 3 is maintained by curing or evaporation of the solvent.

  Then, as shown in FIG. 1E, electroless copper plating is performed using the copper fine particle layer 43 as a seed layer to form a pattern of the conductor layer 5. Since the copper fine particle layer 43 has a pattern, the conductor layer 5 also has the same pattern.

  In this electroless copper plating, the copper fine particle layer 43 becomes a catalytically active seed layer for the oxidation reaction of the reducing agent contained in the plating solution.

  The conductor layer 5 may have a plurality of metal layers. For example, in the step of forming the pattern of the conductor layer 5, electroless copper plating may be performed using the copper fine particle layer 43 as a seed layer, and then electroless nickel plating may be further performed. Since nickel is blackened by oxidation, reflection of light incident on the surface of the conductor layer 5 can be reduced.

  In the step of forming the pattern of the conductor layer 5, electroless copper plating may be performed using the copper fine particle layer 43 as a seed layer, and then electroplating may be further performed.

  In electroplating, the electroless copper-plated copper fine particle layer 43 is immersed in a plating solution to form a cathode. Plating metals in electroplating include, but are not limited to, copper, nickel, tin, chromium, palladium, gold, bismuth, cobalt, iron, silver, lead, platinum, iridium, zinc, indium, ruthenium, rhodium and the like. . Electroplating increases the thickness of the conductor layer 5. Further, in this electroplating, for example, when the plating metal is gold, the corrosion prevention effect of the conductor layer 5 can be obtained.

  In the present embodiment, the pattern of the conductor layer 5 has a linear pattern with a line width of 5 μm or less.

  By forming a thin linear pattern of the conductor layer 5, the conductor layer 5 looks transparent to the naked eye. Since the method of manufacturing the conductive circuit of the present embodiment uses the copper fine particle dispersion liquid, it is possible to form a linear pattern having a line width of 5 μm or less. In the conductive circuit 1, the transparent layer is further improved in the portion where the conductor layer 5 has a linear pattern having a line width of 5 μm or less. Since the electrical resistance increases when the line width is small, the line width of the linear pattern is set to, for example, about 1 to 5 μm.

  As described above, according to the method for producing a conductive circuit according to the present embodiment, since the copper fine particle dispersion liquid is used, the copper fine particle layer 43 can be formed by a printing method or the like. Since the pattern of the conductor layer 5 is formed by electroless copper plating using the copper fine particle layer 43 as a seed layer, the step of etching is unnecessary, and the pattern of the conductor layer 5 made of metal can be easily formed.

  The conductive circuit 1 manufactured as described above will be described with reference to FIG. The conductive circuit 1 is an electric circuit having a base material 2 and a pattern of the conductor layer 5. The conductive circuit 1 includes a pattern of the adhesive resin layer 3 on the base material 2, a copper fine particle layer 43 on the adhesive resin layer 3, and a pattern of the conductor layer 5. The pattern of the conductor layer 5 is bonded to the adhesive resin layer 3 by being combined with the copper fine particle layer 43. The adhesive resin layer 3 contains an adhesive resin. The adhesive resin is a resin that adheres the copper fine particles of the copper fine particle layer 43 to the base material 2. The conductor layer 5 has a metal layer formed by electroless copper plating using the copper fine particle layer 43 as a seed layer.

  Although the copper fine particle layer 43 is integrated with the conductor layer 5 by electroless copper plating, traces of the copper fine particles adhered to the adhesive resin layer 3 are present at the boundary between the conductor layer 5 and the adhesive resin layer 3. Remain.

  The conductor layer 5 may further have a plating layer of the same or different plating metal on a layer formed by electroless copper plating using the copper fine particle layer 43 as a seed layer.

  The base material 2 is a plate-shaped material. In this embodiment, the base material 2 is translucent and is made of a transparent insulating material. The transparent insulating material is, for example, glass, and may be polyethylene terephthalate, polycarbonate, a cyclic olefin copolymer, or the like.

  The adhesive resin contained in the adhesive resin layer 3 is, for example, an epoxy resin. The adhesive resin may be a polyolefin resin or a polyamide resin (nylon resin). When using an epoxy resin, a curing agent is added.

  In the present embodiment, the adhesive resin layer 3 further contains a black material. The black material is, for example, carbon fine particles (carbon black), and blackens the adhesive resin layer 3. The particle size of the carbon fine particles is, for example, 13 nm to 24 nm in terms of BET conversion particle size, and is not limited thereto. Further, the black material may be a dye, a pigment, or a black resin.

  In the present embodiment, the pattern of the conductor layer 5 has a linear pattern with a line width of 5 μm or less.

  In the conductive circuit 1 configured as described above, the adhesive resin layer 3 adheres the copper fine particles of the copper fine particle layer 43 to the base material 2. Since the conductor layer 5 has a metal layer formed by electroless copper plating using the copper fine particle layer 43 as a seed layer, even if the base material is a transparent base material, the base material is interposed via the adhesive resin layer 3. Adhesion with 2 is secured.

  In addition, since the black material contained in the adhesive resin layer 3 absorbs light, the conductive circuit 1 prevents the glitter reflection caused by the metal of the conductor layer 5 when viewed from the base material 2 side.

  A conductive circuit 1 was manufactured as an example by using the conductive circuit manufacturing method of the present invention.

  As the base material 2, a plate-shaped glass was used. The surface of the base material 2 is smooth and not roughened. As the adhesive resin, a mixture of a phenoxy type epoxy resin (manufactured by Mitsubishi Chemical Co., Ltd., trade name “jER1256”) and a bisphenol type epoxy resin (manufactured by Mitsubishi Chemical Co., Ltd., trade name “jER828”) was used. The mixing ratio was 95: 5. A curing agent (2-ethyl-4-methylimidazole, trade name "EMI24", manufactured by Mitsubishi Chemical Corporation) was added to the epoxy resin. The addition amount of the curing agent is 0.5 to 1% by weight based on the weight of the epoxy resin solid content. Carbon fine particles (carbon black) were used as the black material. The adhesive resin layer 3 was formed on the base material 2 by the printing method. A copper fine particle dispersion liquid (manufactured by Ishihara Chemical Co., Ltd.) containing copper fine particles having a median diameter (center particle diameter) of 40 nm was used to form a liquid film 4 of the copper fine particle dispersion liquid on the adhesive resin layer 3 by a printing method. Formed. The dispersion medium 42 in the liquid film 4 was heated and dried to form a copper fine particle layer 43. Electroless copper plating was performed using the copper fine particle layer 43 adhered to the adhesive resin layer 3 as a seed layer. Electroless copper plating was possible, and the pattern of the conductor layer 5 made of plated metal was formed.

  The adhesion of the conductor layer 5 was tested by the cross cut method (JIS K5600). In this test, a grid pattern of 100 squares was cut on the test surface of the conductor layer 5 having a predetermined area, an adhesive tape was attached, the adhesive tape was peeled off, and the test surface was observed. Of the 100 squares, 100 squares were not peeled off.

  As an adhesive resin, a mixture of a phenoxy type epoxy resin (manufactured by Mitsubishi Chemical Co., Ltd., trade name “jER1256”) and a multifunctional special novolac type epoxy resin (manufactured by Mitsubishi Chemical Co., Ltd., trade name “jER157S70”) was used. The mixing ratio was 95: 5. The same curing agent as in Example 1 was added to the epoxy resin. The other conditions were the same as in Example 1. Electroless copper plating was performed using the copper fine particle layer 43 adhered to the adhesive resin layer 3 as a seed layer. Electroless copper plating was possible, and the pattern of the conductor layer 5 made of plated metal was formed.

  Similar to Example 1, the adhesion of the conductor layer 5 was tested by the cross cut method. Of the 100 squares, 100 squares were not peeled off.

  Phenoxy type epoxy resin (manufactured by Mitsubishi Chemical Co., Ltd., trade name “jER1256”) and bisphenol type epoxy resin (manufactured by Mitsubishi Chemical Co., Ltd., trade name “jER828”) and polyfunctional epoxy resin (Mitsubishi Gas Chemical Co., Ltd.) A mixture of trade name "TETRAD-X" manufactured by Co., Ltd. was used. The mixing ratio was 45: 5: 50. The same curing agent as in Example 1 was added to the epoxy resin. The other conditions were the same as in Example 1. Electroless copper plating was performed using the copper fine particle layer 43 adhered to the adhesive resin layer 3 as a seed layer. Electroless copper plating was possible, and the pattern of the conductor layer 5 made of plated metal was formed.

  The adhesion of the conductor layer 5 was tested by the cross cut method. Of the 100 squares, 100 squares were not peeled off.

  A polyamide resin (nylon resin) (trade name “Alon Mighty FS-175SV10” manufactured by Toagosei Co., Ltd.) was used as the adhesive resin. No curing agent is required. The other conditions were the same as in Example 1. Electroless copper plating was performed using the copper fine particle layer 43 adhered to the adhesive resin layer 3 as a seed layer. Electroless copper plating was possible, and the pattern of the conductor layer 5 made of plated metal was formed.

  The adhesion of the conductor layer 5 was tested by the cross cut method. Of the 100 squares, 100 squares were not peeled off.

  As the substrate 2, a plate-shaped PET (polyethylene terephthalate) was used. The same epoxy resin as in Example 1 was used as the adhesive resin. A curing agent (trade name “YN100” manufactured by Mitsubishi Chemical Corporation) was added to the epoxy resin. The other conditions were the same as in Example 1. Electroless copper plating was performed using the copper fine particle layer 43 adhered to the adhesive resin layer 3 as a seed layer. Electroless copper plating was possible, and the pattern of the conductor layer 5 made of plated metal was formed.

  The adhesion of the conductor layer 5 was tested by the cross cut method. Of the 100 squares, 100 squares were not peeled off.

  A modified polyolefin resin (manufactured by Unitika Ltd., trade name "Arrow Base SD-1200") was used as the adhesive resin. No curing agent is required. The other conditions were the same as in Example 5. Electroless copper plating was performed using the copper fine particle layer 43 adhered to the adhesive resin layer 3 as a seed layer. Electroless copper plating was possible, and the pattern of the conductor layer 5 made of plated metal was formed.

  The adhesion of the conductor layer 5 was tested by the cross cut method. Of the 100 squares, 100 squares were not peeled off.

  A modified polyolefin resin (manufactured by Unitika Ltd., trade name “Arrow Base SD-1205J2”) different from that of Example 6 was used as the adhesive resin. The other conditions were the same as in Example 6. Electroless copper plating was performed using the copper fine particle layer 43 adhered to the adhesive resin layer 3 as a seed layer. Electroless copper plating was possible, and the pattern of the conductor layer 5 made of plated metal was formed.

  The adhesion of the conductor layer 5 was tested by the cross cut method. Of the 100 squares, 100 squares were not peeled off.

  A modified polyolefin resin (manufactured by Unitika Ltd., trade name “Arrow Base SD-1210J2”) different from Examples 6 and 7 was used as the adhesive resin. The other conditions were the same as in Example 6. Electroless copper plating was performed using the copper fine particle layer 43 adhered to the adhesive resin layer 3 as a seed layer. Electroless copper plating was possible, and the pattern of the conductor layer 5 made of plated metal was formed.

  The adhesion of the conductor layer 5 was tested by the cross cut method. Of the 100 squares, 100 squares were not peeled off.

  By forming the adhesive resin layer 3 from the above Examples 1 to 8, electroless copper plating can be performed by using the copper fine particle layer 43 adhered to the adhesive resin layer 3 as a seed layer, and adhesion is improved. It was confirmed that the conductor layer 5 having the same could be formed.

  As a comparative example, the test was conducted by omitting the adhesive resin layer 3.

(Comparative Example 1)
A plate-shaped glass was used as the substrate. The surface of the substrate is smooth and not roughened. A copper fine particle dispersion liquid (manufactured by Ishihara Chemical Co., Ltd.) containing copper fine particles having a median diameter (center particle diameter) of 40 nm was used to form a liquid film of the copper fine particle dispersion liquid on the substrate by a printing method. The dispersion medium in the liquid film was heated and dried to form a copper fine particle layer. Electroless copper plating was performed using the copper fine particle layer as a seed layer. However, the plating metal was separated from the base material during plating, and the conductor layer made of the plating metal could not be formed.

(Comparative example 2)
A plate-shaped PET (polyethylene terephthalate) was used as the substrate. The other conditions were the same as in Comparative Example 1. During the plating, the plated metal was peeled off from the base material, and the conductor layer made of the plated metal could not be formed.

  From the above Comparative Examples 1 and 2, it was confirmed that when the adhesive resin layer was not formed, the adhesion of the conductor layer to the base material was not sufficient, and electroless copper plating could not be applied.

  The present invention is not limited to the configuration of the above embodiment, and various modifications can be made without departing from the spirit of the invention. For example, the base material 2 may not be a transparent base material, for example. Further, the shape of the base material 2 is not limited to the plate shape, and may be any three-dimensional shape.

1 Conductive Circuit 2 Base Material 3 Adhesive Resin Layer 4 Liquid Film 41 Copper Fine Particles 42 Dispersion Medium 43 Copper Fine Particle Layer 5 Conductor Layer

Claims (12)

A method for producing a conductive circuit having a base material and a pattern of a conductor layer,
A step of forming a pattern of the adhesive resin layer on the base material,
A step of forming a liquid film made of copper fine particle dispersion liquid in which copper fine particles are dispersed in a dispersion medium on the adhesive resin layer,
A step of drying the dispersion medium in the liquid film to form a copper fine particle layer,
A step of forming a pattern of a conductor layer by performing electroless copper plating using the copper fine particle layer as a seed layer,
The substrate is a transparent substrate having translucency,
The adhesive resin layer contains an adhesive resin for adhering the copper fine particles to the base material ,
The adhesive resin is a mixture of a phenoxy type epoxy resin and a bisphenol type epoxy resin, a phenoxy type epoxy resin and a polyfunctional special novolac type epoxy resin, and a phenoxy type epoxy resin, a bisphenol type epoxy resin and a polyfunctional epoxy resin. A method for producing a conductive circuit, which is an epoxy resin selected from the group consisting of : A method for producing a conductive circuit having a base material and a pattern of a conductor layer,
A step of forming a pattern of the adhesive resin layer on the base material,
A step of forming a liquid film made of copper fine particle dispersion liquid in which copper fine particles are dispersed in a dispersion medium on the adhesive resin layer,
A step of drying the dispersion medium in the liquid film to form a copper fine particle layer,
A step of forming a pattern of a conductor layer by performing electroless copper plating using the copper fine particle layer as a seed layer,
The substrate is a transparent substrate having translucency,
The adhesive resin layer contains an adhesive resin for adhering the copper fine particles to the base material ,
The method for producing a conductive circuit, wherein the adhesive resin is a polyolefin resin . The method for producing a conductive circuit according to claim 1 , wherein the base material is made of a transparent insulating material selected from the group consisting of glass, polyethylene terephthalate, polycarbonate, and a cyclic olefin copolymer. The said adhesive resin layer contains a black thing further, The manufacturing method of the electrically conductive circuit as described in any one of Claim 1 thru | or 3 characterized by the above-mentioned. Pattern of the conductor layer, a method for manufacturing a conductive circuit according to any one of claims 1 to 4, characterized in that the line width has the following linear pattern 5 [mu] m. Wherein in the step of forming a pattern of conductive layer, after applying the electroless copper plating the copper particle layer as a seed layer, any of claims 1 to 5, characterized in that it further subjected to electroless nickel plating 7. The method for manufacturing a conductive circuit according to item 1. Wherein in the step of forming a pattern of conductive layer, after applying the electroless copper plating the copper particle layer as a seed layer, any one of claims 1 to 5, characterized in further applying electroplating one A method for manufacturing a conductive circuit according to item. A conductive circuit having a base material and a pattern of a conductor layer,
A pattern of the adhesive resin layer on the base material,
A copper fine particle layer on the adhesive resin layer,
A pattern of a conductor layer bonded to the copper fine particle layer and bonded to the adhesive resin layer,
The substrate is a transparent substrate having translucency,
The adhesive resin layer contains an adhesive resin for adhering the copper fine particles of the copper fine particle layer to the base material,
The adhesive resin is a mixture of a phenoxy type epoxy resin and a bisphenol type epoxy resin, a phenoxy type epoxy resin and a polyfunctional special novolac type epoxy resin, and a phenoxy type epoxy resin, a bisphenol type epoxy resin and a polyfunctional epoxy resin. An epoxy resin selected from the group consisting of
A conductive circuit, wherein the conductor layer has a metal layer formed by electroless copper plating using the copper fine particle layer as a seed layer. A conductive circuit having a base material and a pattern of a conductor layer,
A pattern of the adhesive resin layer on the base material,
A copper fine particle layer on the adhesive resin layer,
A pattern of a conductor layer bonded to the copper fine particle layer and bonded to the adhesive resin layer,
The substrate is a transparent substrate having translucency,
The adhesive resin layer contains an adhesive resin for adhering the copper fine particles of the copper fine particle layer to the base material,
The adhesive resin is a polyolefin resin,
A conductive circuit, wherein the conductor layer has a metal layer formed by electroless copper plating using the copper fine particle layer as a seed layer. The conductive circuit according to claim 8 or 9 , wherein the base material is made of a transparent insulating material selected from the group consisting of glass, polyethylene terephthalate, polycarbonate, and a cyclic olefin copolymer. The conductive circuit according to any one of claims 8 to 10, wherein the adhesive resin layer further contains a black material. The conductive circuit according to any one of claims 8 to 11 , wherein the pattern of the conductor layer has a linear pattern having a line width of 5 µm or less.

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