JP6689900B2

JP6689900B2 - Soldering device and soldering method

Info

Publication number: JP6689900B2
Application number: JP2018041359A
Authority: JP
Inventors: 眞一郎中
Original assignee: Parat Co Ltd
Current assignee: Parat Co Ltd
Priority date: 2018-03-07
Filing date: 2018-03-07
Publication date: 2020-04-28
Anticipated expiration: 2038-03-07
Also published as: JP2019155381A

Description

この発明は、例えば、プリント基板やモータ等の適宜の製品における第１導体（端子、ランド、リード線等）と第２導体（端子、ランド、リード線等）を半田付けする半田付け装置、および半田付け方法に関する。 The present invention relates to a soldering device for soldering a first conductor (terminal, land, lead wire, etc.) and a second conductor (terminal, land, lead wire, etc.) in an appropriate product such as a printed circuit board and a motor, and Regarding the soldering method.

従来、プリント基板に電子部品を機械的に半田付けする半田付け装置が提供されている。この半田付け装置には、半田の液面にプリント基板を接触させて半田付けするフロー半田付け法や、予めパターンに合わせてクリーム半田を基板に印刷しておきクリーム半田に熱を加えて溶かすことで半田付けするリフロー半田付け法等、様々な方式が提案されている。 Conventionally, a soldering device for mechanically soldering an electronic component to a printed circuit board has been provided. This soldering device uses a flow soldering method in which a printed circuit board is brought into contact with the liquid surface of the solder for soldering, or cream solder is printed on the substrate in advance according to the pattern and the cream solder is heated and melted. Various methods have been proposed, such as a reflow soldering method of soldering with.

ここで、出願人は、半田ごてとして円筒形のノズルを用い、このノズル内にプリント基板のスルーホールに挿通された電子部品のピンを挿入し、内部で半田を溶かして半田付けする方式の半田付け装置を開発し、提供している（特許文献１参照）。 Here, the applicant uses a cylindrical nozzle as a soldering iron, inserts a pin of an electronic component inserted into a through hole of a printed circuit board into the nozzle, and melts the solder inside for soldering. A soldering device has been developed and provided (see Patent Document 1).

そして、ノズルの温度、ノズルの位置、ノズルの荷重および半田の供給量について、装置の起動時や運用中など所定のタイミングで確認することにより、半田付けの信頼性や確実性の更なる向上を図っている（特許文献２参照）。 Further, by confirming the temperature of the nozzle, the position of the nozzle, the load of the nozzle, and the supply amount of solder at a predetermined timing such as when the device is started up or during operation, the reliability and reliability of soldering can be further improved. (See Patent Document 2).

しかしながら、様々な形状を有する半田付け対象に対して半田付けが大量に行われている作業現場では、複数の半田付け対象に対して全て半田付け完了するまでの時間を短縮することが求められる。 However, at a work site where a large amount of solder is being applied to soldering objects having various shapes, it is required to shorten the time required to complete the soldering for a plurality of soldering objects.

特開２０１３−１２０８６９号公報JP, 2013-120869, A 特開２０１５−１１５４２７号公報JP, 2005-115427, A

この発明は、上述の問題に鑑みて、複数の半田付け対象を短時間で半田付け完了できる半田付け装置および半田付け方法を提供し、利用者の満足度を向上させることを目的とする。 In view of the above problems, an object of the present invention is to provide a soldering apparatus and a soldering method capable of completing soldering of a plurality of soldering targets in a short time, and to improve user satisfaction.

この発明は、第１導体と第２導体とを溶融半田によって半田付けする半田付け装置であって、糸半田を繰り出す糸半田繰出手段と、前記半田片を通過させる半田片供給通路を有するノズルと、前記第１導体と前記ノズルとの近接離間方向の相対距離を変化させて前記第１導体と前記ノズルを近接または当接させる相対距離変化手段と、前記ノズルの前記半田片供給通路内の前記半田片を加熱して溶融させる加熱手段とを備え、前記ノズルは、一直線の前記半田片供給通路が複数平行に形成され、前記糸半田繰出手段と前記ノズルの間に、前記半田片を収納する複数の半田片収納部を有する半田片収納体と、前記半田片収納部に収納された半田片を前記ノズル側へ移動しないように停止させる停止状態と移動許容する解放状態に切り替える切替手段とを備え、前記半田片収納体の前記半田片収納部が前記ノズルの前記半田片供給通路に対応する位置にて前記切替手段を前記停止状態から前記解放状態へ切り替えさせる構成であり、前記切替手段は、前記半田片収納体の複数の前記半田片収納部の位置に対応する複数の貫通孔または貫通溝が設けられたシャッタであり、前記貫通孔または前記貫通溝に隣接する部位が前記半田片収納体の複数の前記半田片収納部を閉鎖する閉鎖部として機能する構成である半田付け装置であることを特徴とする。 The present invention is a soldering device for soldering a first conductor and a second conductor with molten solder, and a wire solder feeding means for feeding wire solder, and a nozzle having a solder piece supply passage for passing the solder piece. A relative distance changing unit that changes the relative distance between the first conductor and the nozzle in the approaching / separating direction to bring the first conductor and the nozzle into close proximity or to abut, and the solder in the solder piece supply passage of the nozzle. A heating means for heating and melting the solder piece, the nozzle has a plurality of straight solder piece supply passages formed in parallel, and the solder piece is accommodated between the thread solder feeding means and the nozzle. A solder piece storage body having a plurality of solder piece storage portions, and switching between a stop state in which the solder pieces stored in the solder piece storage portion are stopped so as not to move to the nozzle side and a release state in which movement is allowed. And a step for switching the switching means from the stopped state to the released state at a position where the solder piece storage portion of the solder piece storage body corresponds to the solder piece supply passage of the nozzle, The switching means is a shutter provided with a plurality of through holes or through grooves corresponding to the positions of the plurality of solder piece storage portions of the solder piece storage body, and the through hole or a portion adjacent to the through groove is the shutter. A soldering device having a configuration that functions as a closing portion that closes the plurality of solder piece storage portions of the solder piece storage body.

この発明により、複数の半田付け対象を短時間で半田付け完了できる半田付け装置および半田付け方法を提供できる。 According to the present invention, it is possible to provide a soldering apparatus and a soldering method capable of completing soldering of a plurality of soldering targets in a short time.

半田付け装置の右側面図。The right view of a soldering device. 半田付け装置の正面図。The front view of a soldering apparatus. 半田付け装置の駆動系および制御系の構成を示すブロック図。The block diagram which shows the structure of the drive system and control system of a soldering apparatus. 糸半田切断機構部の構成を説明する説明図。Explanatory drawing explaining the structure of a thread solder cutting mechanism part. 半田片の切断からノズルへの供給までの動作の説明図。Explanatory drawing of the operation | movement from cutting of a solder piece to supply to a nozzle. ノズルとヒータの構成の説明図。Explanatory drawing of a structure of a nozzle and a heater.

以下、この発明の一実施形態を図面と共に説明する。 An embodiment of the present invention will be described below with reference to the drawings.

図１および図２は、半田付け装置１の外観構成の説明図であり、図１は右側面図、図２は正面図である。 1 and 2 are explanatory views of the external configuration of the soldering apparatus 1, FIG. 1 is a right side view, and FIG. 2 is a front view.

図１に示すように、半田付け装置１は、半田付け対象であるプリント基板Ｐのスルーホールに半田付けを行うノズル６０（半田ごて）を有するヘッド部３と、ヘッド部３およびノズル６０をフローティング状態にするエアーサスペンションユニット５と、エアーサスペンションユニット５およびノズル６０を半田付け対象に近接／離間させる方向（図１の上下方向）に移動させる近接離間方向移動ユニット６（相対距離変化手段）と、近接離間方向移動ユニット６およびノズル６０をプリント基板Ｐが搬送される搬送方向（図１の奥行方向，図２の左右方向）に移動させる搬送方向移動ユニット７と、搬送方向移動ユニット７およびノズル６０を搬送方向移動ユニット７の搬送幅方向（図１の左右方向，図２の前後方向）に移動させる搬送幅方向移動ユニット８と、を有している。 As shown in FIG. 1, the soldering apparatus 1 includes a head unit 3 having a nozzle 60 (soldering iron) for soldering through holes of a printed circuit board P to be soldered, a head unit 3, and a nozzle 60. An air suspension unit 5 to be in a floating state, and an approach / separation direction moving unit 6 (relative distance changing means) for moving the air suspension unit 5 and the nozzle 60 in a direction of approaching / separating from a soldering target (vertical direction in FIG. 1). A conveying direction moving unit 7 for moving the approaching / separating direction moving unit 6 and the nozzle 60 in the carrying direction in which the printed circuit board P is carried (the depth direction in FIG. 1, the left-right direction in FIG. 2), the carrying direction moving unit 7 and the nozzles. A conveyance width for moving 60 in the conveyance width direction of the conveyance direction moving unit 7 (left and right direction in FIG. 1, front and rear direction in FIG. 2) Has a direction moving unit 8.

エアーサスペンションユニット５の上部には、リールに巻かれた糸半田２が設けられている。この糸半田２は、φ０．３〜φ２．０ｍｍを用いることができ、φ０．６〜φ１．６ｍｍのものを用いることが好ましい。 On the upper part of the air suspension unit 5, the thread solder 2 wound on a reel is provided. This wire solder 2 can use φ0.3 to φ2.0 mm, and preferably φ0.6 to φ1.6 mm.

ヘッド部３の下部には、ノズル６０が設けられ、ノズル６０にはヒータ５１（加熱手段）が接続されている。
搬送幅方向移動ユニット８の上面は、プリント基板Ｐを搬送する搬送路９の上面とほぼ同じ高さに構成されている。 A nozzle 60 is provided below the head portion 3, and a heater 51 (heating means) is connected to the nozzle 60.
The upper surface of the transport width direction moving unit 8 is configured to have substantially the same height as the upper surface of the transport path 9 that transports the printed circuit board P.

ヘッド部３の可動範囲は、搬送幅方向移動ユニット８の上方に位置する待機位置（図１に示すＰ１の位置）と、プリント基板Ｐに対して半田付けを行う半田付け領域Ｅ１，Ｅ２（図１のＥ１と図２のＥ２で囲まれる領域）とになる。ヘッド部３は、これらの待機位置、及び半田付け領域のどの位置であっても近接離間方向移動ユニット６によって移動される。 The movable range of the head portion 3 is a standby position (position P1 shown in FIG. 1) located above the transport width direction moving unit 8 and soldering areas E1 and E2 for soldering the printed board P (see FIG. 1). The area surrounded by E1 of 1 and E2 of FIG. 2). The head section 3 is moved by the approaching / separating direction moving unit 6 at any of these standby positions and soldering areas.

この構成により、半田付け装置１は、待機時にはノズル６０を待機ポジションＰ１の高さおよび位置に待機しておき、半田付け工程を実行するときは半田付け領域Ｅ１，Ｅ２内で待機ポジションＰ１よりも低い（半田付け対象に近い）半田付けポジションＰ２の高さにて半田付けを行う。 With this configuration, the soldering apparatus 1 keeps the nozzle 60 on standby at the height and position of the standby position P1 during standby, and when performing the soldering process, it is positioned in the soldering areas E1 and E2 more than the standby position P1. Soldering is performed at a low (close to the soldering target) height of the soldering position P2.

図３は、半田付け装置１の駆動系および制御系の構成を示すブロック図である。半田付け装置１は、搬送幅方向移動ユニット８（図１参照）に固定されて搬送路９（図１参照）へ向かって真っすぐ伸びるＹ方向（搬送幅方向，図２の奥行方向）の搬送ガイド７ｆと、ステッピングモータ等の駆動機構部７ｅによりＹ方向の搬送ガイド７ｆに沿って移動するＸ方向（搬送方向，図２の左右方向）の搬送ガイド７ｃが設けられている。この駆動機構部７ｅおよびＹ方向の搬送ガイド７ｆは、搬送幅方向移動ユニット８（図１参照）内に収納されている。Ｘ方向の搬送ガイド７ｃは、搬送路９の搬送方向（Ｘ方向）へ向かって真っすぐ伸びている。 FIG. 3 is a block diagram showing a configuration of a drive system and a control system of the soldering device 1. The soldering device 1 is a conveyance guide in the Y direction (conveyance width direction, depth direction in FIG. 2) that is fixed to the conveyance width direction movement unit 8 (see FIG. 1) and extends straight toward the conveyance path 9 (see FIG. 1). 7f and a conveyance guide 7c in the X direction (conveyance direction, left-right direction in FIG. 2) that moves along the conveyance guide 7f in the Y direction by a drive mechanism section 7e such as a stepping motor. The drive mechanism portion 7e and the Y-direction transport guide 7f are housed in the transport width direction moving unit 8 (see FIG. 1). The X-direction transport guide 7c extends straight in the transport direction (X direction) of the transport path 9.

Ｘ方向の搬送ガイド７ｃの上部には、Ｘ方向の搬送ガイド７ｃに沿ってＸ方向に移動する移動体７ａと、この移動体７ａをＸ方向の搬送ガイド７ｃに沿ってＸ方向へ移動させるステッピングモータ等で構成された駆動機構部７ｂが設けられている。この移動体７ａ、駆動機構部７ｂ、およびＸ方向の搬送ガイド７ｃは、搬送方向移動ユニット７（図１参照）内に収納されている。この移動体７ａ、駆動機構部７ｂ、Ｘ方向の搬送ガイド７ｃ、駆動機構部７ｅ、およびＹ方向の搬送ガイド７ｆは、作業させたい任意の位置へノズル６０を移動させるノズル位置移動手段として機能する。 A moving body 7a that moves in the X direction along the X-direction transport guide 7c is provided above the X-direction transport guide 7c, and stepping that moves the moving body 7a in the X-direction along the X-direction transport guide 7c. A drive mechanism portion 7b including a motor and the like is provided. The moving body 7a, the drive mechanism portion 7b, and the X-direction transport guide 7c are housed in the transport direction moving unit 7 (see FIG. 1). The moving body 7a, the drive mechanism section 7b, the X-direction transport guide 7c, the drive mechanism section 7e, and the Y-direction transport guide 7f function as a nozzle position moving unit that moves the nozzle 60 to an arbitrary position to be operated. .

移動体７ａには、ノズル６０がスルーホールに近接／離間する方向に伸びるＺ方向（高さ方向）の搬送ガイド５ｃが設けられている。この搬送ガイド５ｃには、Ｚ方向に移動するヘッド固定部５ａ、およびステッピングモータ等で構成される駆動機構部５ｂが設けられている。ヘッド固定部５ａ、駆動機構部５ｂ、および搬送ガイド５ｃは、ノズル６０を半田付け対象に近接／離間させる方向へ移動させる近接離間方向移動手段として機能し、近接離間方向移動ユニット６（図１参照）内に収納されている。 The movable body 7a is provided with a transport guide 5c in the Z direction (height direction) that extends in a direction in which the nozzle 60 approaches / separates from the through hole. The transport guide 5c is provided with a head fixing portion 5a that moves in the Z direction and a drive mechanism portion 5b that includes a stepping motor and the like. The head fixing portion 5a, the drive mechanism portion 5b, and the transport guide 5c function as a proximity separation direction moving unit that moves the nozzle 60 in a direction of approaching / separating from the soldering target, and a proximity separation direction moving unit 6 (see FIG. 1). ) Is stored inside.

このように構成されたＹ方向の搬送ガイド７ｆとＸ方向の搬送ガイド７ｃ、および駆動機構部７ｂ，７ｅがノズル位置移動手段として機能することにより、ノズル６０の位置を半田付けする任意の位置へ移動させることができる。また、Ｚ方向の搬送ガイド５ｃおよび駆動機構部５ｂが近接離間方向移動手段として機能することにより、移動させた位置でノズル６０を近接方向へ移動させてノズル６０の孔（後述の半田片誘導通路６３）内に半田付けするピンを挿通しノズル６０の先端をスルーホールに当接させる等の半田付け位置にて半田付け対象に当接または近接させ、半田付け後に離間させることができる。また、Ｚ方向の搬送ガイド５ｃおよび駆動機構部５ｂにより、ノズルステーション（図示省略）で交換用のノズル６０またはヒータ５１に近接する方向へ移動させ、ノズル６０またはヒータ５１を交換した後に離間させることができる。 The Y-direction transport guide 7f, the X-direction transport guide 7c, and the drive mechanism portions 7b and 7e thus configured function as nozzle position moving means, so that the position of the nozzle 60 is moved to an arbitrary position for soldering. It can be moved. Further, the Z-direction transport guide 5c and the drive mechanism portion 5b function as the approaching / separating direction moving means, so that the nozzle 60 is moved in the approaching direction at the moved position, and the hole of the nozzle 60 (a solder piece guide passage described later) 63) A pin to be soldered can be inserted into the inside of 63) to be brought into contact with or close to the object to be soldered at a soldering position where the tip of the nozzle 60 is brought into contact with the through hole, and can be separated after the soldering. In addition, by using the Z-direction transport guide 5c and the drive mechanism portion 5b, the nozzle 60 (not shown) is moved toward the replacement nozzle 60 or the heater 51, and the nozzle 60 or the heater 51 is replaced and then separated. You can

ヘッド固定部５ａには、フローティングユニット１５が設けられている。このフローティングユニット１５は、エアーサスペンションユニット５（図１）内に設けられ、供給されたエアによってノズル６０を持ち上げ、プリント基板Ｐに対するフローティングユニット１５（ノズル６０が含まれる）の相対的な重みを軽くするものである。例えば、通常の加重を１００とするとフローティングユニット１５の加重が１０％となるようにするなど、適宜の構成とすることができる。 A floating unit 15 is provided on the head fixing portion 5a. The floating unit 15 is provided in the air suspension unit 5 (FIG. 1) and lifts the nozzle 60 by the supplied air to lighten the relative weight of the floating unit 15 (including the nozzle 60) with respect to the printed circuit board P. To do. For example, when the normal weight is 100, the weight of the floating unit 15 is 10%, so that an appropriate configuration can be adopted.

ヘッド部３は、フローティングユニット１５に固定され、糸半田２（図１参照）を挿通する糸半田供給ガイド１６と、糸半田供給ガイド１６内の糸半田をローラで挟み込んで送り出す糸半田送り出し機構部１７（糸半田を先端から繰り出す糸半田繰出手段）が設けられ、底部に糸半田切断機構部４０を備えている。この糸半田切断機構部４０は、ステッピングモータ等により構成される回転機構部１９（半田片収納体移動手段，相対移動手段）により移動可能に構成されており、糸半田供給ガイド１６に供給されてきた糸半田２（図１参照）を回転機構部１９の制御に従って先端から設定長さの位置で切断して半田片を作成する。 The head portion 3 is fixed to the floating unit 15, and a thread solder supply guide 16 through which the thread solder 2 (see FIG. 1) is inserted, and a thread solder delivery mechanism section that sandwiches the thread solder in the thread solder supply guide 16 with a roller and sends it out. Reference numeral 17 (soldering solder feeding means for feeding the solder solder from the tip) is provided, and the bottom portion is provided with the solder solder cutting mechanism 40. The thread solder cutting mechanism 40 is configured to be movable by a rotation mechanism 19 (solder piece container moving means, relative moving means) including a stepping motor and the like, and is supplied to the thread solder supply guide 16. The wire solder 2 (see FIG. 1) is cut at a position of a set length from the tip under the control of the rotation mechanism section 19 to form a solder piece.

また、これらの構成要素を駆動するべく、各要素は制御部２１によって制御される。制御部２１には、駆動機構部５ｂ、駆動機構部７ｂ、駆動機構部７ｅ、フローティングユニット１５、糸半田送り出し機構部１７、回転機構部１９、ヒータユニット密着確認センサ２２、温度センサ２３、着脱用エアシリンダ２４、カメラ２５、及び記憶部２６が接続されている。 Further, each element is controlled by the control unit 21 to drive these constituent elements. The control unit 21 includes a drive mechanism unit 5b, a drive mechanism unit 7b, a drive mechanism unit 7e, a floating unit 15, a solder solder feeding mechanism unit 17, a rotation mechanism unit 19, a heater unit contact confirmation sensor 22, a temperature sensor 23, and a detachable unit. The air cylinder 24, the camera 25, and the storage unit 26 are connected.

カメラ２５は、半田付け対象となるプリント基板のスルーホールおよびピンの位置等を確認して位置決めする際、および、半田付アカメが発生した場合等の半田付け異常を検出する際等に用いられる。 The camera 25 is used when confirming and positioning the positions of through holes and pins of a printed circuit board to be soldered, and when detecting a soldering abnormality such as when a soldering turtle occurs.

記憶部２６は、プリント基板等の半田付け対象ワークの画像と、この半田付け対象ワークに使用するツール（ノズル６０、若しくはヒータ５１）を関連づけた半田付け対象ワーク別ツールデータ、現在装着しているツールの種類、現在装着しているツールの使用回数および使用時間等のデータを記憶している。 The storage unit 26 associates an image of a soldering target work such as a printed circuit board and a tool (nozzle 60 or heater 51) used for this soldering target work with soldering target work-specific tool data, which is currently mounted. It stores data such as the type of tool, the number of times the tool is currently installed and the time it has been used.

図４は、糸半田切断機構部４０の構成を説明する説明図であり、図４（Ａ）は糸半田切断機構部４０の分解斜視図、図４（Ｂ）は糸半田切断機構部４０の縦断面図を示す。 4A and 4B are explanatory views for explaining the configuration of the thread solder cutting mechanism section 40. FIG. 4A is an exploded perspective view of the thread solder cutting mechanism section 40, and FIG. FIG.

糸半田切断機構部４０は、下方へ繰り出されてきた糸半田２ａを通過させる通路を有する糸半田供給ガイド１６と、切断した半田片２ｂを複数収納する半田片収納体４４と、半田片収納体４４を移動させる回転機構部１９（図３参照）により構成されている。また、半田片収納体４４には、収納された半田片２ｂの貯留／放出を制御するシャッタ３６（切替手段）と、シャッタ３６を付勢する付勢体３５（付勢手段）とが設けられている。また、半田片収納体４４とは分離して、シャッタ３６を解放操作するシャッタ操作部４９（シャッタ移動規制体）が設けられている。なお、半田片収納体４４と、回転機構部１９と、シャッタ３６と、シャッタ操作部４９は、半田片２ｂをノズル６０の孔（後述の半田片誘導通路６３）に供給する半田片供給手段として機能する。 The solder solder cutting mechanism 40 includes a solder solder supply guide 16 having a passage for passing the solder solder 2a fed downward, a solder piece storage body 44 for storing a plurality of cut solder pieces 2b, and a solder piece storage body. The rotation mechanism section 19 (see FIG. 3) for moving the 44 is configured. Further, the solder piece storage body 44 is provided with a shutter 36 (switching means) for controlling storage / release of the stored solder pieces 2b and a biasing body 35 (biasing means) for biasing the shutter 36. ing. Further, a shutter operation section 49 (shutter movement restricting body) for releasing the shutter 36 is provided separately from the solder piece container 44. The solder piece container 44, the rotation mechanism portion 19, the shutter 36, and the shutter operation portion 49 serve as a solder piece supply means for supplying the solder piece 2b to the hole (the solder piece guide passage 63 described later) of the nozzle 60. Function.

糸半田供給ガイド１６は、金属部材によって円筒形に形成されており、内側の孔（通路）に糸半田２ａを長手方向へ通過させる。また、糸半田供給ガイド１６は、糸半田２ａの通過方向と直角の方向（糸半田２ａの半径方向）へは移動しないように固定されている。 The solder paste supply guide 16 is formed of a metal member in a cylindrical shape, and allows the solder paste 2a to pass through the inner hole (passage) in the longitudinal direction. Further, the thread solder supply guide 16 is fixed so as not to move in a direction perpendicular to the passing direction of the thread solder 2a (radial direction of the thread solder 2a).

付勢体３５は、適宜のバネで構成することができ、この実施例では金属製の鶴巻ばねにて構成されている。 The urging body 35 can be formed of an appropriate spring, and in this embodiment, is formed of a metal crane spring.

シャッタ３６は、Ｌ字型に屈曲させた金属板により構成されており、Ｌ字の底面部が水平状態（近接離間方向に垂直な状態）の貯留／放出制御板部３８であり、Ｌ字の鉛直面部が付勢体３５に押圧される押圧操作部３７である。貯留／放出制御板部３８は、一直線に等間隔で複数の解放孔３８ａ（貫通孔または貫通溝）が設けられている。この実施例では解放孔３８ａは４つ設けられている。この解放孔３８ａの隣接部分（解放孔３８ａと解放孔３８ａの間部分を含む）は、半田片２ｂの落下を防止する閉鎖部として機能する。なお、シャッタ３６に複数の解放孔３８ａを設けているが、これに限らず、複数の解放溝を設けて、シャッタ３６の貯留／放出制御板部３８が平面視櫛状に見える構成としてもよい。この場合も同じ機能を確保できる。 The shutter 36 is composed of a metal plate bent in an L-shape, and the bottom portion of the L-shape is a storage / release control plate portion 38 in a horizontal state (a state vertical to the approaching / separating direction). The vertical surface portion is the pressing operation portion 37 that is pressed by the urging body 35. The storage / release control plate portion 38 is provided with a plurality of release holes 38a (through holes or through grooves) at equal intervals in a straight line. In this embodiment, four release holes 38a are provided. The adjacent portion of the release hole 38a (including the portion between the release hole 38a and the release hole 38a) functions as a closing portion that prevents the solder piece 2b from falling. Although the shutter 36 is provided with a plurality of release holes 38a, the present invention is not limited to this, and a plurality of release grooves may be provided so that the storage / release control plate portion 38 of the shutter 36 looks like a comb in a plan view. . In this case, the same function can be ensured.

半田片収納体４４は、横長の立方体形状のブロック部４３の下面に当該ブロック部４３の短手方向の幅よりも幅広で長手方向に同じ長さのガイド部４８が一体形成されている。ガイド部４８には、長手方向に貫通するシャッタ挿入孔４７が設けられている。このシャッタ挿入孔４７は、高さと幅がシャッタ３６の貯留／放出制御板部３８の高さと幅よりわずかに大きく形成され、シャッタ３６がブレなくスムーズに長手方向へスライド移動できるように構成されている。ブロック部４３とガイド部４８には、上下方向（近接離間方向）に貫通する半田片収納部４５が一直線に等間隔で複数設けられている。この実施例では４つ設けられており、シャッタ３６の解放孔３８ａと同じ大きさで同じ間隔で設けられている。 In the solder piece storage body 44, a guide portion 48, which is wider than the width of the block portion 43 in the lateral direction and has the same length in the longitudinal direction, is integrally formed on the lower surface of the horizontally long cubic block portion 43. The guide portion 48 is provided with a shutter insertion hole 47 penetrating in the longitudinal direction. The height and width of the shutter insertion hole 47 are formed slightly larger than the height and width of the storage / release control plate portion 38 of the shutter 36 so that the shutter 36 can be smoothly slid in the longitudinal direction without blurring. There is. The block portion 43 and the guide portion 48 are provided with a plurality of solder piece storage portions 45 penetrating in the up-down direction (approaching direction) in a straight line at equal intervals. In this embodiment, four holes are provided, the size of which is the same as the opening holes 38a of the shutter 36, and the holes are provided at the same intervals.

なお、シャッタ３６の解放孔３８ａは、半田片収納部４５よりも大きく形成されてもよい。これにより、確実に開放状態のときに半田片２ｂを落下させることができる。また、半田片収納部４５は、孔によって形成されているが、これに限らず、複数部材で周囲を囲まれて半田片２ｂを囲み内に収容できる囲み形状とするなど、半田片２ｂを落下可能に収納する適宜の形状とすることができる。 The release hole 38a of the shutter 36 may be formed larger than the solder piece storage portion 45. As a result, the solder piece 2b can be reliably dropped in the open state. Further, the solder piece storage portion 45 is formed by a hole, but the present invention is not limited to this, and the solder piece 2b is dropped such as being surrounded by a plurality of members so that the solder piece 2b can be housed inside. It can be formed in an appropriate shape so that it can be stored as much as possible.

半田片収納体４４の長手方向の一端上部には、半田片収納体４４の長手方向に長いガイド板４２の一端が連結されている。ガイド板４２の他端には、ネジ止め用の孔４１が設けられ、係止板３２がネジ３１によって孔４１にネジ止めされている。 One end of a guide plate 42, which is long in the longitudinal direction of the solder piece container 44, is connected to an upper portion of one end of the solder piece container 44 in the longitudinal direction. A hole 41 for screwing is provided at the other end of the guide plate 42, and the locking plate 32 is screwed into the hole 41 with a screw 31.

係止板３２は、上部にネジ４１を挿通するネジ孔３３が設けられている。係止板３２のネジ孔３３より下方部分には、シャッタ３６の押圧操作部３７に対向する押圧対抗面３４が設けられている。この押圧対抗面３４に付勢体３５の一端が当接し、シャッタ３６の押圧操作部３７に付勢体３５の他端が当接することで、押圧対抗面３４から押圧操作部３７までの距離よりも長く伸びた状態が通常状態である付勢体３５は、押圧対抗面３４と押圧操作部３７が離れる方向へ付勢する。これによって、シャッタ３６は、押圧操作部３７が半田片収納体４４の一端面に当接した状態に維持される。このとき、図４（Ｂ）に示すように、半田片収納体４４の半田片収納部４５とシャッタ３６の解放孔３８ａは位置がずれており、半田片収納体４４の半田片収納部４５がシャッタ３６の貯留／放出制御板部３８で閉じられた状態となっている。従って、半田片収納部４５に存在する半田片２ｂは、シャッタ３６の貯留／放出制御板部３８によって下方へ落下しないように貯留されている。 The locking plate 32 is provided with a screw hole 33 at the top thereof for inserting the screw 41. A pressing opposing surface 34 facing the pressing operation portion 37 of the shutter 36 is provided below the screw hole 33 of the locking plate 32. One end of the urging body 35 comes into contact with the pressing opposing surface 34, and the other end of the urging body 35 comes into contact with the pressing operating portion 37 of the shutter 36, so that the distance from the pressing opposing surface 34 to the pressing operating portion 37 becomes larger. The urging body 35, which is in the normal state when extended for a long time, urges the pressing opposing surface 34 and the pressing operation portion 37 in the direction of separating from each other. As a result, the shutter 36 is maintained in a state in which the pressing operation portion 37 is in contact with the one end surface of the solder piece storage body 44. At this time, as shown in FIG. 4B, the solder piece storage portion 45 of the solder piece storage body 44 and the release hole 38a of the shutter 36 are displaced from each other, and the solder piece storage portion 45 of the solder piece storage body 44 is displaced. The shutter 36 is closed by the storage / release control plate 38. Therefore, the solder pieces 2b existing in the solder piece storage portion 45 are stored by the storage / release control plate portion 38 of the shutter 36 so as not to drop downward.

半田片収納体４４のガイド板４２と反対側には、半田片収納体４４から離間した位置に半田片収納体４４とは独立してシャッタ操作部４９が設けられている。このシャッタ操作部４９は、シャッタ３６の貯留／放出制御板部３８の押圧操作部３７とは逆側の端面に対向して配置されている。従って、回転機構部１９（図３参照）の回転駆動によって半田片収納体４４がシャッタ３６と共にシャッタ操作部４９側へ移動されていくと、シャッタ３６の端面がシャッタ操作部４９に当接する。そして、回転機構部１９（図３参照）の回転駆動によって半田片収納体４４がさらに移動されると、シャッタ操作部４９によってシャッタ３６がそれ以上移動しないために半田片収納体４４とシャッタ３６の相対位置が変化していき、半田片収納体４４の半田片収納部４５とシャッタ３６の解放孔３８ａの位置が同じ位置になって解放状態となり、半田片２ｂが下方へ落下する。 On the opposite side of the solder piece storage body 44 from the guide plate 42, a shutter operation part 49 is provided at a position separated from the solder piece storage body 44, independently of the solder piece storage body 44. The shutter operating portion 49 is arranged to face the end surface of the storage / release control plate portion 38 of the shutter 36 on the opposite side of the pressing operating portion 37. Therefore, when the solder piece container 44 is moved to the shutter operating portion 49 side together with the shutter 36 by the rotational driving of the rotating mechanism portion 19 (see FIG. 3), the end surface of the shutter 36 contacts the shutter operating portion 49. When the solder piece storage body 44 is further moved by the rotational drive of the rotation mechanism portion 19 (see FIG. 3), the shutter operation portion 49 does not move the shutter 36 further, so that the solder piece storage body 44 and the shutter 36 are not moved. As the relative position changes, the positions of the solder piece storage portion 45 of the solder piece storage body 44 and the release hole 38a of the shutter 36 become the same position and the release state is reached, and the solder piece 2b drops downward.

半田片収納体４４と糸半田供給ガイド１６は、互いの対向面が当接して配置され、供給される糸半田２ａの半径方向へ相対的に移動できるように構成されている。この実施では、糸半田供給ガイド１６が固定され、半田片収納体４４が糸半田２ａの半径方向へスライド移動できる。従って、糸半田供給ガイド１６から繰り出された糸半田２ａの一部が半田片収納体４４の半田片収納部４５に供給されている状態で、半田片収納体４４を糸半田２ａの半径方向に移動させると、糸半田２ａは、半田片収納体４４と糸半田供給ガイド１６の相対移動によって半田片収納体４４と糸半田供給ガイド１６の互いの当接面で切断される。従って、半田片収納体４４と糸半田供給ガイド１６が半田片２ｂを切断する半田片切断手段となる。切断された半田片２ｂは、半田片収納体４４の半田片収納部４５に収納される。 The solder piece accommodating body 44 and the thread solder supply guide 16 are arranged such that their opposing surfaces are in contact with each other, and are configured to be relatively movable in the radial direction of the supplied thread solder 2a. In this embodiment, the thread solder supply guide 16 is fixed, and the solder piece container 44 can slide in the radial direction of the thread solder 2a. Therefore, in a state where a part of the thread solder 2a fed from the thread solder supply guide 16 is supplied to the solder piece storage portion 45 of the solder piece storage body 44, the solder piece storage body 44 is moved in the radial direction of the thread solder 2a. When moved, the wire solder 2a is cut at the contact surfaces of the solder piece container 44 and the thread solder supply guide 16 due to the relative movement of the solder piece container 44 and the thread solder supply guide 16. Therefore, the solder piece container 44 and the thread solder supply guide 16 serve as a solder piece cutting means for cutting the solder piece 2b. The cut solder piece 2b is stored in the solder piece storage portion 45 of the solder piece storage body 44.

また、半田片収納体４４の上面と糸半田供給ガイド１６の下面、シャッタ３６の貯留／放出制御板部３８は、全て半田片収納体４４の移動方向と平行（特にこの実施例では水平方向）に構成されている。また、半田片収納部４５の長手方向（半田片通過方向）とノズル６０の半田片誘導通路６３（半田片供給通路，図５（Ｄ）参照）の長手方向（半田片通過方向）は、全て半田片収納体４４の移動方向と垂直（特にこの実施例では鉛直方向）に構成されている。 Further, the upper surface of the solder piece container 44, the lower surface of the thread solder supply guide 16, and the storage / release control plate portion 38 of the shutter 36 are all parallel to the moving direction of the solder piece container 44 (particularly in the horizontal direction in this embodiment). Is configured. In addition, the longitudinal direction of the solder piece accommodating portion 45 (solder piece passage direction) and the longitudinal direction of the solder piece guide passage 63 (solder piece supply passage, see FIG. 5D) of the nozzle 60 (solder piece passage direction) are all It is configured to be perpendicular to the moving direction of the solder piece container 44 (particularly the vertical direction in this embodiment).

図５は、半田片収納体４４によって糸半田２を切断して半田片２ｂを複数貯留し、その後にシャッタ３６を開状態にして複数の半田片２ｂを落下させる動作を断面図により説明する説明図である。この動作は、制御部２１（図３参照）が糸半田送り出し機構部１７および回転機構部１９の駆動を制御して実行される。 FIG. 5 is a cross-sectional view for explaining an operation of cutting the solder wire 2 by the solder piece container 44 to store a plurality of solder pieces 2b and then opening the shutter 36 to drop the plurality of solder pieces 2b. It is a figure. This operation is executed by the control unit 21 (see FIG. 3) controlling the drive of the thread solder feeding mechanism unit 17 and the rotation mechanism unit 19.

図５（Ａ）の断面図に示すように、回転機構部１９（図３参照）の回転駆動によって、半田片収納体４４は、シャッタ操作部４９に最も近い半田片収納部４５が糸半田供給ガイド１６の下方位置で一直線に連通する状態で停止する。この状態で、巻かれていた糸半田２（図１参照）の先端側から引き出されて棒状となっている糸半田２ａが糸半田送り出し機構部１７（図３参照）によって送り出され、図５（Ｂ）に示すように糸半田２ａの先端が半田片収納部４５内に収納される。そして、半田片収納体４４と糸半田供給ガイド１６の対向面部（接触面部）から糸半田２ａの先端までの長さが必要な半田片２ｂの長さとなる状態まで糸半田２ａを繰り出すと、糸半田送り出し機構部１７（図３参照）は糸半田２ａの供給（繰り出し）を停止する。 As shown in the cross-sectional view of FIG. 5 (A), by the rotational driving of the rotation mechanism section 19 (see FIG. 3), the solder piece storage body 44 is supplied with the solder solder supply section 45 closest to the shutter operation section 49. It stops at a position below the guide 16 in a state of communicating in a straight line. In this state, the thread solder 2a, which is pulled out from the front end of the wound thread solder 2 (see FIG. 1) and has a rod shape, is delivered by the thread solder delivery mechanism unit 17 (see FIG. 3), As shown in B), the tip of the solder wire 2 a is stored in the solder piece storage portion 45. When the length of the solder piece 2b from the facing surface portion (contact surface portion) of the solder piece container 44 and the thread solder supply guide 16 to the tip of the solder wire 2a reaches the required length of the solder piece 2b, the thread solder 2a is unwound. The solder delivery mechanism 17 (see FIG. 3) stops the supply (delivery) of the thread solder 2a.

この状態で回転機構部１９（図３参照）の回転駆動によって、半田片収納体４４をスライド移動させると、半田片収納体４４と糸半田供給ガイド１６の対向面部（接触面部）によって糸半田２ａが切断されて半田片２ｂとなり、図５（Ｃ）に示すように半田片２ｂが半田片収納部４５に収納（貯留）される。図５（Ｃ）は、この切断を半田片収納部４５の数だけ（必要な数だけ）繰り返して切断完了した状態を示している。このときの半田片収納体４４をスライド移動させる距離は、隣接する半田片収納部４５の互いの中心間の距離と同一である。したがって、糸半田供給ガイド１６の直下には、その前に対応していた半田片収納部４５の隣の半田片収納部４５が位置することとなる。 In this state, when the solder piece storage body 44 is slid by the rotational drive of the rotation mechanism portion 19 (see FIG. 3), the solder solder storage body 44 and the solder solder supply guide 16 face each other (contact surface portion) and the solder wire 2a Are cut into the solder pieces 2b, and the solder pieces 2b are stored (stored) in the solder piece storage portion 45 as shown in FIG. 5C. FIG. 5C shows a state in which this cutting is repeated by the number of the solder piece storage portions 45 (the necessary number) and the cutting is completed. The distance by which the solder piece storage body 44 is slid at this time is the same as the distance between the centers of the adjacent solder piece storage portions 45. Therefore, the solder piece accommodating portion 45 adjacent to the solder piece accommodating portion 45 corresponding thereto before that is located immediately below the thread solder supply guide 16.

回転機構部１９（図３参照）の回転駆動によって半田片収納体４４をスライド移動させると、図５（Ｄ）に示すようにシャッタ３６の先端がシャッタ操作部４９に当接して押圧され、付勢体３５が縮み、半田片収納体４４の半田片収納部４５とシャッタ３６の解放孔３８ａが全て連通して複数の半田片２ｂが一斉に落下して下方へ供給される。なお、半田片２ｂを落下させる際に、図示省略する押し込みロッドを全ての半田片収納部４５に上方から下方へ挿入し、半田片２ｂを下方へ押し出して、強制的に半田片２ｂを下方のノズル６０（図３参照）に供給する構成としてもよい。 When the solder piece container 44 is slid by the rotational drive of the rotation mechanism section 19 (see FIG. 3), the tip of the shutter 36 comes into contact with the shutter operation section 49 and is pressed, as shown in FIG. 5D. The biasing body 35 contracts, the solder piece storage portion 45 of the solder piece storage body 44 and the release hole 38a of the shutter 36 all communicate with each other, and a plurality of solder pieces 2b drop all at once and are supplied downward. When the solder piece 2b is dropped, a push rod (not shown) is inserted into all the solder piece accommodating portions 45 from the upper side to the lower side, and the solder piece 2b is pushed out to force the solder piece 2b to move downward. It may be configured to supply to the nozzle 60 (see FIG. 3).

図６は、ノズル６０とヒータ５１の構成を説明する説明図であり、図６（Ａ）は分解斜視図、図６（Ｂ）は斜視図、図６（Ｃ）は縦断面図を示す。
ノズル６０は、第１部材６１と第２部材６５の２つの部材を重ね合わせて（当接させて）形成されている。第１部材６１と第２部材６５は、いずれもセラミックにより形成されている。 6A and 6B are explanatory views for explaining the configurations of the nozzle 60 and the heater 51. FIG. 6A is an exploded perspective view, FIG. 6B is a perspective view, and FIG. 6C is a vertical sectional view.
The nozzle 60 is formed by stacking (contacting) two members, a first member 61 and a second member 65. Both the first member 61 and the second member 65 are made of ceramic.

第１部材６１は、一部材として一体形成された直方体形状の一面（第２部材６５との対向面６１ａ）に鉛直方向（近接離間方向）に一直線の半田片誘導溝６３ａが複数平行に形成されている。また、第１部材６１は、半田片誘導溝６３ａが設けられた面の隣となる側面に、固定溝６２が設けられている。 In the first member 61, a plurality of parallel solder piece guide grooves 63a are formed in parallel in a vertical direction (approaching direction) on one surface (a surface 61a facing the second member 65) of a rectangular parallelepiped shape integrally formed as one member. ing. Further, the first member 61 is provided with the fixing groove 62 on the side surface adjacent to the surface on which the solder piece guiding groove 63a is provided.

第２部材６５は、外形が第１部材６１と同じ形状で同じ大きさの直方体に形成されている。すなわち、第２部材６５は、第１部材６１との対向面６５ａが、半田片誘導溝６３ａのない平面であり、第１部材６１と当接する面の大きさおよび形状が同じようになるように形成されている。また、第２部材６５は、第１部材６１との対向面の隣となる側面に、固定溝６６が設けられている。この固定溝６６の位置および深さは。第１部材６１の固定溝６２と同一に形成されている。 The second member 65 is formed in a rectangular parallelepiped having the same shape and the same size as the first member 61. That is, in the second member 65, the facing surface 65a facing the first member 61 is a flat surface without the solder piece guiding groove 63a, and the size and shape of the surface contacting the first member 61 are the same. Has been formed. Further, the second member 65 is provided with a fixing groove 66 on the side surface adjacent to the surface facing the first member 61. The position and depth of this fixing groove 66 are. It is formed in the same manner as the fixing groove 62 of the first member 61.

第２部材６５は、第１部材６１との対向面に近い位置で、複数の半田片誘導溝６３ａが並べられた並び方向に貫通するヒータ用貫通孔６７が設けられている。このヒータ用貫通孔６７には、ヒータ５１の加熱部５２が挿入される。図示の例では、ヒータ用貫通孔６７の両端の開口から２つのヒータ５１の各加熱部５２がそれぞれ挿入されている。 The second member 65 is provided with a heater through hole 67 penetrating in the arrangement direction in which the plurality of solder piece guide grooves 63a are arranged, at a position close to the surface facing the first member 61. The heating portion 52 of the heater 51 is inserted into the heater through hole 67. In the illustrated example, the heating portions 52 of the two heaters 51 are inserted from the openings at both ends of the heater through hole 67, respectively.

また、第２部材６５は、第１部材６１との対向面と反対側の面の中央に孔６８が設けられ、この孔６８に熱電対５７が挿入されている。熱電対５７は、温度センサ２３（図３参照）として機能し、ノズル６０の温度を測定する。 Further, the second member 65 is provided with a hole 68 at the center of the surface opposite to the surface facing the first member 61, and the thermocouple 57 is inserted into this hole 68. The thermocouple 57 functions as the temperature sensor 23 (see FIG. 3) and measures the temperature of the nozzle 60.

これらがすべて組み合わせされると、図６（Ｂ）に示すように、第１部材６１と第２部材６５の対向面同士が隙間なく当接され、第１部材６１の半田片誘導溝６３ａ（図６（Ａ）参照）と、第２部材６５の対向面のうち半田片誘導溝６３ａと対向している部分とで半田片２ｂを端子Ｔに当接させる位置まで誘導する半田片誘導通路６３が形成される。この半田片誘導通路６３は、鉛直方向（近接離間方向）に一直線で、かつ、複数（この実施例では４つ）が平行で等間隔に配置されている。 When all of these are combined, as shown in FIG. 6B, the facing surfaces of the first member 61 and the second member 65 are brought into contact with each other without a gap, and the solder piece guide groove 63 a (see FIG. 6 (A)) and a portion of the facing surface of the second member 65 facing the solder piece guiding groove 63a, a solder piece guiding passage 63 for guiding the solder piece 2b to a position where the solder piece 2b is brought into contact with the terminal T is formed. It is formed. The solder piece guide passages 63 are arranged in a straight line in the vertical direction (approach direction), and a plurality (four in this embodiment) are arranged in parallel at equal intervals.

各半田片誘導通路６３（および半田片誘導溝６３ａ）は、半田片収納体４４（図５参照）の半田片収納部４５と同じ大きさで同じ間隔に形成されている。 The solder piece guide passages 63 (and the solder piece guide grooves 63a) are formed in the same size and at the same intervals as the solder piece storage portions 45 of the solder piece storage body 44 (see FIG. 5).

従って、図５（Ｄ）に示したように一斉に（ほぼ同時に）落下する半田片２ｂは、その下方位置にて半田片収納部４５と半田片誘導通路６３が連通するように配置されたノズル６０の半田片誘導通路６３に、図６（Ｃ）に示すように一斉に（ほぼ同時に）供給される。 Therefore, as shown in FIG. 5D, the solder pieces 2b that drop all at once (substantially at the same time) are nozzles arranged so that the solder piece storage portion 45 and the solder piece guide passage 63 communicate with each other at the lower position. The solder piece guide passages 63 of 60 are supplied all at once (almost simultaneously) as shown in FIG. 6 (C).

半田付けをするとき、ノズル６０は、下端がプリント基板ＰのランドＲに接触する位置まで下げられており、この位置にて上述した半田片２ｂの供給を受ける。このとき、半田片２ｂは、プリント基板Ｐの電子部品Ｃの端子Ｔの先端（半田片誘導通路６３の半田片誘導方向（図６（Ｃ）の下方）に対して最も凸となる端部（図６（Ｃ）の上端））に接触して停止する。図示の例では端子Ｔの上に半田片２ｂが乗った状態で停止する。 When soldering, the nozzle 60 is lowered to a position where the lower end contacts the land R of the printed circuit board P, and the solder piece 2b is supplied at this position. At this time, the solder piece 2b is the most convex end portion (with respect to the solder piece guide direction of the solder piece guide passage 63 (downward in FIG. 6C) of the terminal T of the electronic component C of the printed circuit board P (the end portion). The upper end of FIG. 6 (C)) is contacted and stopped. In the illustrated example, the terminal 2 is stopped with the solder piece 2b on the terminal T.

そして、ノズル６０の半田片誘導通路６３に供給された半田片２ｂは、ヒータ５１の加熱部５２からの熱をうけて溶融する。このとき、加熱部５２の熱が半田片２ｂから端子Ｔに伝達され、この伝達熱によって端子Ｔも徐々に加熱されていく。また、ランドＲについては、ノズル６０から直接熱を受け、端子Ｔよりも先に加熱されている。 Then, the solder piece 2b supplied to the solder piece guide passage 63 of the nozzle 60 is melted by receiving heat from the heating portion 52 of the heater 51. At this time, the heat of the heating portion 52 is transferred from the solder piece 2b to the terminal T, and the terminal T is gradually heated by this transferred heat. The land R receives heat directly from the nozzle 60 and is heated before the terminal T.

そうして、半田片２ｂが溶融温度に達すると、半田片２ｂが溶融するが、まだ端子Ｔの上に略球状となって載った状態となる。この間も端子Ｔを伝達熱で加熱する。そして、さらに端子Ｔの加熱が進むと、半田片２ｂが溶融した複数（４つ）の溶融半田が端子Ｔに沿って流れ出し、複数（４つ）の端子Ｔ（第２導体）とランドＲ（第１導体）を一斉に（同時に）半付けして電気的に接続する。その後、ノズル６０を上方へ移動させて離間させ、溶融半田が冷えて固化することで、複数箇所の半田付けが一斉に（同時に）完了する。
この半田付けの動作について、以下に詳細に説明する。 Then, when the solder piece 2b reaches the melting temperature, the solder piece 2b melts, but the solder piece 2b remains in a substantially spherical shape on the terminal T. During this time, the terminal T is heated by the transfer heat. Then, when the heating of the terminal T further progresses, a plurality (four) of molten solder in which the solder pieces 2b are melted flows out along the terminal T, and a plurality (four) of the terminals T (second conductor) and the land R ( The first conductors are half-attached all at once (simultaneously) and electrically connected. After that, the nozzle 60 is moved upward and separated, and the molten solder is cooled and solidified, so that soldering at a plurality of points is completed all at once (simultaneously).
The soldering operation will be described in detail below.

＜半田付けの動作＞
図６（Ｃ）の断面図に示すように、半田付けの母材として、ランドＲが形成されたプリント基板Ｐに、当該プリント基板Ｐのスルーホールにプリント基板Ｐの表面側から裏面側（図６（Ｃ）では下面側から上面側）に向けて電子部品Ｃの端子Ｔが挿入されたものが準備されている。 <Soldering operation>
As shown in the cross-sectional view of FIG. 6C, a printed circuit board P on which lands R are formed as a base material for soldering is formed in through holes of the printed circuit board P from the front surface side to the rear surface side of the printed circuit board P (see FIG. In FIG. 6C, a terminal T of the electronic component C is prepared from the lower surface side to the upper surface side.

＜位置合わせ工程＞
制御部２１は、Ｙ方向の搬送ガイド７ｆとＸ方向の搬送ガイド７ｃ、および駆動機構部７ｂ，７ｅにより、ノズル６０の複数の半田片誘導通路６３の位置をＸＹ平面上で移動させて半田付けする複数のランドＲに対向させる。このときの位置は、プリント基板Ｐの裏面側のランドＲの中心と半田片誘導通路６３の中心がほぼ一致する位置とする、または、端子Ｔの先端中心と半田片誘導通路６３の中心がほぼ一致する位置とする。 <Positioning process>
The controller 21 moves the positions of the plurality of solder piece guide passages 63 of the nozzle 60 on the XY plane by the Y-direction transport guide 7f, the X-direction transport guide 7c, and the drive mechanism units 7b and 7e to perform soldering. The plurality of lands R to be opposed. At this time, the position is such that the center of the land R on the back surface side of the printed circuit board P and the center of the solder piece guide passage 63 are substantially aligned, or the center of the tip of the terminal T and the center of the solder piece guide passage 63 are almost the same. The position should match.

＜半田片切断収納工程＞
制御部２１は、糸半田送り出し機構部１７によって半田片収納体４４内の１つの半田片収納部４５に糸半田２ａを必要長さまで供給し、回転機構部１９を駆動させて半田片収納体４４を移動させ、糸半田切断機構部４０（糸半田切断手段）により糸半田２をカットして半田片２ｂを得て半田片収納部４５に収納する。このとき、シャッタ３６は閉鎖状態（半田片２ｂを収容状態で停止させる停止状態）となっているため、半田片収納部４５から半田片２ｂが落下することは無い。この動作を繰り返すことで、全ての半田片収納部４５に１つずつ必要長さの半田片２ｂを収納する。なお、この半田片切断収納工程は、前記ノズル近接工程よりも前に実行する、あるいは、ノズル近接工程と並行して実行するなど、適宜のタイミングとすることができる。 <Solder piece cutting and storing process>
The controller 21 supplies the thread solder 2a to the required length by the thread solder delivery mechanism 17 into one solder piece housing 45 in the solder piece housing 44, and drives the rotating mechanism 19 to drive the solder piece housing 44. Is moved, and the thread solder 2 is cut by the thread solder cutting mechanism section 40 (thread solder cutting means) to obtain the solder piece 2b and housed in the solder piece housing section 45. At this time, since the shutter 36 is in the closed state (the stopped state in which the solder piece 2b is stopped in the housed state), the solder piece 2b does not drop from the solder piece housing portion 45. By repeating this operation, the solder pieces 2b having a required length are stored in all the solder piece storage portions 45 one by one. The solder piece cutting and accommodating step can be performed at an appropriate timing such as before the nozzle approaching step or in parallel with the nozzle approaching step.

＜ノズル近接工程＞
制御部２１は、駆動機構部５ｂにより搬送ガイド５ｃに沿ってフローティング状態のヘッド部３をランドＲとの近接方向へ移動させて、ノズル６０の先端面（図示下端面）をプリント基板Ｐの裏面側のランドＲの表面に当接させる。これにより、ノズル６０の半田片誘導通路６３の内側に端子Ｔの先端が挿入された状態となる。 <Nozzle proximity process>
The control unit 21 moves the floating head unit 3 along the transport guide 5c in the direction close to the land R by the drive mechanism unit 5b so that the front end surface (lower end surface in the drawing) of the nozzle 60 is the back surface of the printed circuit board P. The land R on the side is brought into contact with the surface. As a result, the tip of the terminal T is inserted inside the solder piece guide passage 63 of the nozzle 60.

このとき、端子Ｔはノズル６０の半田片誘導通路６３の内壁から等距離だけ離れており、端子Ｔとノズル６０が非接触で離間した状態が保たれている。これにより、ノズル６０から端子Ｔに直接熱が伝達されることを防止しており、端子Ｔは、輻射熱伝達および対流熱伝達により徐々に加熱される。一方で、プリント基板ＰのランドＲは、接触するノズル６０からの直接の熱伝導と、対流熱伝達による伝熱で急速に加熱される。 At this time, the terminal T is separated from the inner wall of the solder piece guide passage 63 of the nozzle 60 by an equal distance, and the terminal T and the nozzle 60 are kept in a non-contact separated state. This prevents heat from being directly transferred from the nozzle 60 to the terminal T, and the terminal T is gradually heated by radiant heat transfer and convective heat transfer. On the other hand, the land R of the printed circuit board P is rapidly heated by direct heat conduction from the nozzle 60 in contact and heat transfer by convection heat transfer.

＜半田片供給工程＞
制御部２１は、回転機構部１９を駆動させて半田片収納体４４をさらに移動させ、シャッタ３６がシャッタ操作部４９に当接して押圧されるまで移動させる。これにより、シャッタ３６の複数の解放孔３８ａが複数の半田片収納部４５とそれぞれ連通し、複数の半田片２ｂが一斉に落下し、ノズル６０の複数の半田片誘導通路６３に１つずつ供給される。上方から落下するように供給された半田片２ｂは、半田片誘導通路６３を通過中に予熱され、端部が端子Ｔに当接して当接位置で停止し、位置および落下が規制される。このとき、半田片誘導通路６３の内壁は、半田片２ｂが端子Ｔの先端の上で垂直または斜めに立っている状態から落下しないように規制する落下規制部として機能する。 <Solder piece supply process>
The control unit 21 drives the rotation mechanism unit 19 to further move the solder piece storage body 44, and moves the shutter 36 until it abuts on the shutter operation unit 49 and is pressed. As a result, the plurality of release holes 38a of the shutter 36 communicate with the plurality of solder piece storage portions 45, respectively, and the plurality of solder pieces 2b drop all at once and are supplied to the plurality of solder piece guide passages 63 of the nozzle 60 one by one. To be done. The solder piece 2b supplied so as to drop from above is preheated while passing through the solder piece guide passage 63, the end portion of the solder piece 2b comes into contact with the terminal T and stops at the contact position, and the position and drop are regulated. At this time, the inner wall of the solder piece guide passage 63 functions as a drop restriction portion that restricts the solder piece 2b from falling from a state of standing vertically or obliquely on the tip of the terminal T.

＜溶融工程＞
当接位置に案内された溶融前の半田片２ｂは、その位置から落下することなく、端子Ｔと反対側の端部などの少なくとも一部が、ヒータ５１の加熱部５２の近くに位置して半田片誘導通路６３の内壁に当接する。このため、当接位置にある溶融前の複数の半田片２ｂは、半田片誘導通路６３の内壁に当接した半田片２ｂの一端部、両端部、又は側部を介した熱伝導により一斉に溶融される。なお、この半田片２ｂの溶融のとき、ノズル６０と接触しての直接熱伝導に加えて、ノズル６０からの輻射熱伝達、および、ノズル６０内を対流する熱風による対流熱伝達などの間接熱伝導も行われる。 <Melting process>
The solder piece 2b before melting guided to the contact position does not fall from that position, and at least a part of the end portion or the like on the side opposite to the terminal T is located near the heating portion 52 of the heater 51. It contacts the inner wall of the solder piece guide passage 63. Therefore, the plurality of solder pieces 2b at the abutting position before melting all at once due to heat conduction through one end portion, both end portions, or side portions of the solder piece 2b abutting on the inner wall of the solder piece guiding passage 63. To be melted. When the solder piece 2b is melted, in addition to direct heat conduction in contact with the nozzle 60, radiant heat transfer from the nozzle 60 and indirect heat transfer such as convective heat transfer by hot air convection in the nozzle 60. Is also done.

複数の半田片２ｂは、溶融すると表面張力によりそれぞれ丸まって略球状になろうとするが、ノズル６０の半田片誘導通路６３の内壁と端子Ｔの先端に規制されるため真球になれず、端子Ｔの先端に接触している状態（端子Ｔの上に載っている状態）で太く短い形状に変形する。この形状は、短い円柱の両端が球面になった形状となっている。 When melted, the plurality of solder pieces 2b tend to be rounded into a substantially spherical shape due to surface tension, but cannot be a true sphere because they are restricted by the inner wall of the solder piece guide passage 63 of the nozzle 60 and the tip of the terminal T. It deforms into a thick and short shape while it is in contact with the tip of T (on the terminal T). This shape is such that both ends of a short cylinder are spherical.

こうして溶融すると、ノズル６０から複数の半田片２ｂに熱が伝わり、さらに、複数の半田片２ｂから複数の端子Ｔにそれぞれ熱が伝わることで、複数の端子Ｔは以前にも増して急速に加熱される。この加熱中、溶融した半田片２ｂは端子Ｔに接触した状態、すなわち端子Ｔの上に載った状態で半田片供給方向（下方向）へ移動せずに停止している。尚、半田片２ｂが溶融するのは、２１７℃以上である。 When melted in this way, heat is transferred from the nozzle 60 to the plurality of solder pieces 2b, and further, heat is transferred from the plurality of solder pieces 2b to the plurality of terminals T, respectively, so that the plurality of terminals T are heated more rapidly than before. To be done. During this heating, the molten solder piece 2b is in contact with the terminal T, that is, in a state of being placed on the terminal T, and is stopped without moving in the solder piece supply direction (downward). The solder piece 2b melts at 217 ° C. or higher.

溶融した半田片２ｂを介して適正温度にまで端子Ｔが加熱されると、溶融した複数の半田片２ｂは、ぬれ始め、端子Ｔの先端から端子Ｔの側面を伝って一斉に流れ出す。ここで、溶融しはじめてから流れ出す前の半田片２ｂは、位置が停止したままで熱の影響等によって形状が変化し続けていても良い。そして、端子Ｔの側面を伝って流れ出した溶融した半田片２ｂは、裏面側のランドＲに広がり、さらに、毛細管現象により、端子Ｔの側面とスルーホールに面するランドＲとの隙間にも流入する。そして、表面側のランドＲにも広がっていく。 When the terminals T are heated to an appropriate temperature via the melted solder pieces 2b, the plurality of melted solder pieces 2b start to get wet and flow out from the tip of the terminal T along the side surface of the terminal T all at once. Here, the solder piece 2b that has started to melt and before flowing out may continue to change in shape due to the influence of heat or the like while the position is stopped. Then, the molten solder piece 2b flowing out along the side surface of the terminal T spreads to the land R on the back surface side, and further flows into the gap between the side surface of the terminal T and the land R facing the through hole due to the capillary phenomenon. To do. Then, it spreads to the land R on the front surface side.

＜ノズル離間工程＞
その後、制御部２１は、駆動機構部５ｂにより搬送ガイド５ｃに沿ってフローティング状態のヘッド部３をランドＲとの離間する方向へ移動させ、ノズル６０の先端面をプリント基板Ｐの裏面側のランドＲの表面から離隔する。これにより、ランドＲ、端子Ｔ、及び溶融した半田片２ｂは急速に冷却され、溶融した半田片２ｂが固化して半田付け動作は終了する。 <Nozzle separation process>
After that, the control unit 21 moves the floating head unit 3 along the transport guide 5c in the direction of separating from the land R by the drive mechanism unit 5b, and the tip end surface of the nozzle 60 is land on the back surface side of the printed circuit board P. Separate from the surface of R. As a result, the land R, the terminal T, and the melted solder piece 2b are rapidly cooled, the melted solder piece 2b is solidified, and the soldering operation is completed.

溶融した半田片２ｂのこのような動きにより、複数の端子Ｔは複数のランドＲにそれぞれ確実に半田付けされる。こうして一斉に（ほぼ同時に）半田付けされた複数箇所の半田の仕上がり外観は美しく、バックフィレット形状も綺麗に形成される。 Due to such movement of the melted solder piece 2b, the terminals T are reliably soldered to the lands R, respectively. In this way, the finish appearance of the solder at a plurality of points soldered all at once (almost at the same time) is beautiful, and the back fillet shape is also formed neatly.

以上の構成及び動作により、複数の半田付け対象を短時間で半田付け完了できる。上述した実施例では、４つの半田片２ｂを順次切断し、一斉に４ヶ所の半田付けを実施できるため、１か所ずつ半田付けするよりも非常に短時間で半田付け完了できる。 With the above configuration and operation, it is possible to complete soldering of a plurality of soldering targets in a short time. In the above-described embodiment, the four solder pieces 2b can be sequentially cut and the soldering can be performed simultaneously at four locations, so that the soldering can be completed in a much shorter time than the soldering at each location.

また、半田片２ｂの切断のみ１つずつ切断していくが、それ以外のノズル６０の近接離間動作、複数の半田片２ｂの溶融と半田付け動作については、１つずつ半田付けする場合と同じ時間でできるため、この同じ時間でノズル６０の半田片誘導通路６３の数の半田片２ｂについて一斉に実施して時間短縮を行える。 Further, only the solder pieces 2b are cut one by one, but the other operations of approaching and separating the nozzles 60 and melting and soldering operations of the plurality of solder pieces 2b are the same as the case of soldering one by one. Since it can be done in time, the solder pieces 2b corresponding to the number of the solder piece guide passages 63 of the nozzle 60 can be collectively executed at the same time to shorten the time.

また、制御部２１により回転機構部１９の駆動を制御するだけで、糸半田２ａから半田片２ｂを切断して各半田片収納部４５に収納し、シャッタ３６をシャッタ操作部４９で解放状態として収納した複数の半田片２ｂをノズル６０の半田片誘導通路６３に一斉に供給できる。従って、小型かつ軽量な構造で、無駄なく短時間に複数の半田片の切断から複数の半田片の一斉供給までを実施できる。 Further, only by controlling the drive of the rotation mechanism section 19 by the control section 21, the solder pieces 2b are cut from the thread solder 2a and stored in the solder piece storage sections 45, and the shutter 36 is released by the shutter operation section 49. The plurality of stored solder pieces 2b can be simultaneously supplied to the solder piece guide passage 63 of the nozzle 60. Therefore, with a small and lightweight structure, cutting of a plurality of solder pieces to simultaneous supply of a plurality of solder pieces can be performed in a short time without waste.

また、回転機構部１９の動作を制御部２１で制御することにより、ノズル６０の複数の半田片誘導通路６３を全て使って同時に複数の半田付けをするのか、あるいは一部の半田片誘導通路６３を使って１か所もしくは複数箇所の半田付けをするのかといったことを容易に制御できる。また、複数の半田片誘導通路６３のうちどの半田片誘導通路６３に半田片２ｂを収納するかは、制御部２１が、半田片収納体４４を移動させる距離と、糸半田送り出し機構部１７による糸半田２ａの送り出しタイミングを制御することで、自由に制御することができる。従って、１つのプリント基板Ｐに多数の半田付け箇所がある場合に、この部分は複数同時に半田付けを実行し、別のこの部分は１か所ずつ半田付けするといったことが可能となる。 Further, by controlling the operation of the rotation mechanism unit 19 by the control unit 21, a plurality of solder piece guide passages 63 of the nozzle 60 are all used to simultaneously make a plurality of solders, or a part of the solder piece guide passages 63. It is possible to easily control whether or not soldering is performed at one place or a plurality of places using. In addition, which of the plurality of solder piece guide passages 63 the solder piece 2b is to be accommodated in depends on the distance by which the control portion 21 moves the solder piece accommodating body 44 and the thread solder delivery mechanism portion 17. It is possible to freely control the timing by sending out the solder wire 2a. Therefore, when there are a large number of soldering points on one printed circuit board P, a plurality of soldering points can be simultaneously soldered, and another soldering point can be soldered one by one.

なお、この発明は、上述した実施形態に限られるものではなく、様々な実施形態とすることができる。 It should be noted that the present invention is not limited to the above-described embodiment, but various embodiments can be made.

例えば、半田片収納体４４の半田片収納部４５とシャッタ３６の解放孔３８ａとノズル６０の半田片誘導通路６３は、全て同じ間隔で一列に配置したが、これに限らず、配置間隔を変更する、１列ではなく複数列にするなど、適宜の構成とすることができる。これにより、半田付け対象の配置間隔に合わせて一斉に半田付けができるとともに、複数列にした場合には複数ずつ半田片２ｂを切断してより多くの半田片２ｂを一斉に半田付けすることができる。 For example, the solder piece storage portion 45 of the solder piece storage body 44, the release hole 38a of the shutter 36, and the solder piece guide passage 63 of the nozzle 60 are all arranged in a row at the same interval, but the arrangement interval is not limited to this. However, it is possible to adopt an appropriate configuration such as a plurality of columns instead of one column. As a result, it is possible to perform soldering all at once according to the arrangement interval of the soldering target, and in the case of forming a plurality of rows, a plurality of solder pieces 2b can be cut to solder more solder pieces 2b all at once. it can.

また、ノズル６０の形状と半田片誘導通路６３の数や形状は半田付け対象に合わせて様々構成とすることができ、これに合わせて半田片収納体４４の半田片収納部４５とシャッタ３６の形状を形成することで、様々な半田付け対象に対して複数箇所に一斉に半田付けすることができる。 Further, the shape of the nozzle 60 and the number and shape of the solder piece guide passages 63 can be variously configured according to the soldering target, and in accordance with this, the solder piece storage portion 45 of the solder piece storage body 44 and the shutter 36. By forming the shape, it is possible to solder various objects to be soldered simultaneously to a plurality of places.

また、半田片収納体４４は、一面に一直線の溝を複数平行に配置した２つの部材を互いの溝が対向するように合わせて、この溝が半田片収納部４５を形成するように構成してもよい。この場合、２つの部材の対向面は当接していることが好ましいが、半田片２ｂの厚みよりも小さい隙間だけ離間させて構成してもよい。この場合も半田片２ｂを半田片収納部４５に収納し、シャッタ３６を動作させて半田片２ｂを一斉に落下させることができる。 Further, the solder piece storage body 44 is configured such that two members having a plurality of straight grooves arranged in parallel on one surface are aligned so that the grooves face each other, and the grooves form the solder piece storage portion 45. May be. In this case, it is preferable that the facing surfaces of the two members are in contact with each other, but they may be separated by a gap smaller than the thickness of the solder piece 2b. Also in this case, the solder pieces 2b can be stored in the solder piece storage portion 45, and the shutter 36 can be operated to drop the solder pieces 2b all at once.

また、ノズル６０は、第１部材６１と第２部材６５を当接させて構成させたが、半田片２ｂの厚みよりも小さい隙間だけ離間させて構成してもよい。この場合も、半田片誘導通路６３にて半田片２ｂを端子Ｔに当接するまで誘導し、端子Ｔに当接して停止している半田片２ｂを端子Ｔの上で溶融して半田付けすることができる。なお、第１部材６１と第２部材６５を当接させていた場合は、半田ボールやフラックスが半田片収納部４５から外部へ放出されることをより防止できる効果が得られる。 Further, although the nozzle 60 is configured by abutting the first member 61 and the second member 65, it may be configured by separating the nozzle 60 by a gap smaller than the thickness of the solder piece 2b. Also in this case, the solder piece 2b is guided in the solder piece guide passage 63 until it comes into contact with the terminal T, and the solder piece 2b that comes into contact with the terminal T and stops is melted and soldered on the terminal T. You can In addition, when the first member 61 and the second member 65 are in contact with each other, it is possible to further effectively prevent the solder balls and the flux from being discharged from the solder piece storage portion 45 to the outside.

また、ノズル６０の半田片誘導通路６３は、断面四角の孔としたが、断面正方形、断面長方形、断面円形、断面楕円形、断面半円形など、適宜の形状の孔とすることができる。この場合、第１部材６１と第２部材６５の両方に半田片誘導溝６３ａを設けて重ね合わせたときにこれらの適宜の形状の孔となるように構成してもよい。 Further, the solder piece guide passage 63 of the nozzle 60 is a hole having a square cross section, but it may be a hole having an appropriate shape such as a square cross section, a rectangular cross section, a circular cross section, an elliptical cross section, and a semicircular cross section. In this case, the solder piece guide grooves 63a may be provided in both the first member 61 and the second member 65 so that these holes have appropriate shapes when they are overlapped.

また、ノズル６０の各半田片誘導通路６３から第１部材６１と第２部材６５の一方または両方に水平方向に伸びる側孔をそれぞれ設け、半田付け時に半田片誘導通路６３内で発生するヒュームを外部へ排出する構成としてもよい。この場合、この側孔は、半田片誘導通路６３内で端子Ｔに当接する半田片２ｂの上端よりも上方に設けることが好ましい。これにより、半田ボールやフラックス等が側孔からノズル６０の外へ飛散することを防止できる。 Further, side holes extending in the horizontal direction from the solder piece guide passages 63 of the nozzle 60 to one or both of the first member 61 and the second member 65 are provided to prevent fumes generated in the solder piece guide passages 63 during soldering. It may be configured to be discharged outside. In this case, this side hole is preferably provided above the upper end of the solder piece 2b that abuts the terminal T in the solder piece guide passage 63. As a result, it is possible to prevent solder balls, flux, etc. from scattering from the side holes to the outside of the nozzle 60.

また、半田付け対象である第１導体と第２導体は、プリント基板Ｐの端子ＴとランドＲに限らず、例えば、モータの端子とリード線とする、プリント基板の配線上に寝かした状態で置いた端子と当該配線とする、など、適宜の半田付け対象とすることができる。これらの場合も同様にノズルを第１導体に近接または当接させた状態で第１導体と第２導体を半田付けして電気的に接続することができる。 Further, the first conductor and the second conductor to be soldered are not limited to the terminals T and the lands R of the printed circuit board P, but may be laid on the wiring of the printed circuit board such as the terminals of the motor and the lead wires. Appropriate soldering targets such as the placed terminal and the wiring can be used. Also in these cases, similarly, the first conductor and the second conductor can be soldered and electrically connected in a state where the nozzle is close to or in contact with the first conductor.

また、切替手段としてのシャッタ３６の開閉により半田片収納体４４の半田片収納部４５から半田片２ｂをノズル６０の半田片誘導通路６３に供給する構成としたが、これに限らず、半田片２ｂを半田片収納部４５に収納した状態で半田片収納体４４を回転させて上下反転させ、半田片収納部４５から半田片２ｂを落下させてノズル６０の半田片誘導通路６３に供給する構成としてもよい。この場合、シャッタ３６を設けず、半田片収納体４４の一面（上面）に対して半田片収納部４５を開口させ、反対面（下面）については半田片収納部４５が開口せず閉じて底のある構成とすると良い。この場合も上述した実施形態と同様の作用効果を奏することができる。 Further, the configuration is such that the solder piece 2b is supplied from the solder piece storage portion 45 of the solder piece storage body 44 to the solder piece guide passage 63 of the nozzle 60 by opening and closing the shutter 36 as the switching means, but the invention is not limited to this. A configuration in which the solder piece storage body 44 is rotated and turned upside down while the 2b is stored in the solder piece storage portion 45, and the solder piece 2b is dropped from the solder piece storage portion 45 and supplied to the solder piece guide passage 63 of the nozzle 60. May be In this case, the shutter 36 is not provided, and the solder piece storage portion 45 is opened on one surface (upper surface) of the solder piece storage body 44, and the solder piece storage portion 45 is not opened and closed on the opposite surface (lower surface). It is good to have a structure with. In this case as well, the same operational effects as those of the above-described embodiment can be obtained.

この発明は、生産設備で半田付けを実行するような産業に利用することができる。 INDUSTRIAL APPLICABILITY The present invention can be used in an industry in which soldering is performed in production equipment.

１…半田付け装置
２，２ａ…糸半田
２ｂ…半田片
６…近接離間方向移動ユニット
１７…糸半田送り出し機構部
１９…回転機構部
３５…付勢体
３６…シャッタ
３８ａ…解放孔
４０…糸半田切断機構部
４４…半田片収納体
４５…半田片収納部
４９…シャッタ操作部
５１…ヒータ
６０…ノズル
６３…半田片誘導通路
Ｒ…ランド
Ｔ…端子 DESCRIPTION OF SYMBOLS 1 ... Soldering device 2, 2a ... Thread solder 2b ... Solder piece 6 ... Close-and-separation direction moving unit 17 ... Thread solder delivery mechanism section 19 ... Rotation mechanism section 35 ... Energizer 36 ... Shutter 38a ... Release hole 40 ... Thread solder Cutting mechanism portion 44 ... Solder piece storage body 45 ... Solder piece storage portion 49 ... Shutter operation portion 51 ... Heater 60 ... Nozzle 63 ... Solder piece guide passage R ... Land T ... Terminal

Claims

A soldering device for soldering a first conductor and a second conductor with molten solder, comprising:
A wire solder feeding means for feeding the wire solder,
A nozzle having a solder piece supply passage for passing the solder pieces,
Relative distance changing means for changing the relative distance between the first conductor and the nozzle in the approaching / separating direction to bring the first conductor and the nozzle into proximity or contact.
A heating means for heating and melting the solder piece in the solder piece supply passage of the nozzle;
The nozzle is
A plurality of the straight solder piece supply passages are formed in parallel,
Between the wire solder feeding means and the nozzle,
A solder piece storage body having a plurality of solder piece storage portions for storing the solder pieces,
A soldering piece housed in the soldering piece housing section, and a switching means for switching between a stopped state in which the solder piece is stopped so as not to move to the nozzle side and a released state in which the solder piece is allowed to move,
The solder piece storage portion of the solder piece storage body is configured to switch the switching means from the stopped state to the released state at a position corresponding to the solder piece supply passage of the nozzle,
The switching means is a shutter provided with a plurality of through holes or through grooves corresponding to the positions of the plurality of solder piece storage portions of the solder piece storage body, and the through hole or a portion adjacent to the through groove. A soldering device having a configuration that functions as a closing portion that closes the plurality of solder piece storage portions of the solder piece storage body.

Arrangement intervals of the plurality of solder piece supply passages of the nozzle,
An arrangement interval of the plurality of solder piece storage portions of the solder piece storage body,
The arrangement interval of the plurality of through holes or through grooves of the shutter is
The soldering device according to claim 1, wherein the soldering devices are all formed at the same arrangement interval.

A solder piece container moving means for moving the solder piece container in the thickness direction of the supplied solder piece;
Urging means for urging the shutter in the same direction as the moving direction of the solder piece container by the solder piece container moving means,
A shutter movement restricting body that restricts the movement of the shutter when the solder piece container moving means is moved together with the shutter by the solder piece container moving means to change the relative positional relationship between the solder piece container and the shutter. The soldering device according to claim 1, further comprising:

A soldering device for soldering a first conductor and a second conductor with molten solder, comprising:
A wire solder feeding means for feeding the wire solder,
A nozzle having a solder piece supply passage for passing the solder pieces,
Relative distance changing means for changing the relative distance between the first conductor and the nozzle in the approaching / separating direction to bring the first conductor and the nozzle into proximity or contact.
A heating means for heating and melting the solder piece in the solder piece supply passage of the nozzle;
The nozzle is
A plurality of the straight solder piece supply passages are formed in parallel,
Between the wire solder feeding means and the nozzle,
A solder piece storage body having a plurality of solder piece storage portions for storing the solder pieces,
A soldering piece housed in the soldering piece housing portion;
A configuration in which the solder piece storage portion of the solder piece storage body switches the shutter from the stopped state to the released state at a position corresponding to the solder piece supply passage of the nozzle,
A solder piece container moving means for moving the solder piece container in the thickness direction of the supplied solder piece;
When the solder piece container is moved together with the shutter by the solder piece container moving means, the movement of the shutter is restricted so that the relative positional relationship between the solder piece container and the shutter is released from the stopped state to the released state. A soldering device provided with a shutter movement restricting member that changes to.

Urging means for urging the shutter to bring the relative positional relationship into the stopped state,
The shutter movement restricting body restricts the movement of the shutter moved by the solder piece container moving means in a state of being biased by the biasing means to change the relative positional relationship of the shutter from the stopped state to the state described above. The soldering device according to claim 4, wherein the soldering device is configured to change to an open state.

A soldering method for soldering with the soldering device according to claim 1.
The solder pieces are sequentially stored one by one in the plurality of solder piece storage portions of the solder piece storage body,
After the solder pieces are stored in all the solder piece storage portions, the shutter is allowed to move from a stop state in which the solder pieces stored in the solder piece storage portion are stopped so as not to move to the nozzle side. Switch to the released state,
A soldering method in which a plurality of the solder pieces are made to correspond to the plurality of solder piece supply passages of the nozzle and are supplied all at once.

A soldering method for soldering with the soldering device according to claim 1.
Passing the solder piece through the solder piece supply passage provided in the nozzle,
Changing the relative distance between the first conductor and the nozzle in the approaching / separating direction by the relative distance changing means to bring the first conductor and the nozzle into close proximity or to contact with each other;
The solder piece in the solder piece supply passage of the nozzle is heated and melted by heating means,
The nozzle is
A plurality of the straight solder piece supply passage formed in parallel,
Between the wire solder feeding means and the nozzle,
The solder pieces are stored in a plurality of solder piece storage portions provided in the solder piece storage body,
The solder piece stored in the solder piece storage portion is switched by a switching means between a stopped state in which the solder piece is stopped so as not to move to the nozzle side and a released state in which the solder piece is allowed to move,
Switching the switching means from the stopped state to the released state at a position where the solder piece storage portion of the solder piece storage body corresponds to the solder piece supply passage of the nozzle,
The switching means is a shutter provided with a plurality of through holes or through grooves corresponding to the positions of the plurality of solder piece storage portions of the solder piece storage body, and the through hole or a portion adjacent to the through groove. A soldering method, which is configured to function as a closing portion that closes the plurality of solder piece storage portions of the solder piece storage body.