JP6689962B2 - Filament three-dimensional bonded body manufacturing apparatus and filament three-dimensional bonded body manufacturing method - Google Patents

Description

  The present invention relates to an apparatus for producing a three-dimensional filament assembly and a method for producing a three-dimensional filament assembly.

  As a cushion material used for a mattress or a pillow, a filament three-dimensional bonded body obtained by partially fusing a plurality of molten thermoplastic resin fibers (molten filaments) has been attracting attention in recent years.

  For example, in Patent Document 1, a thermoplastic resin in a molten state is extruded vertically downward from a plurality of horizontally arranged nozzles, and then a molten filament is dropped into cooling water to form a loop, and at the same time, a loop is formed. A method of manufacturing a three-dimensional filament combined body by fusion-bonding a plurality of molten filaments three-dimensionally is disclosed.

JP, 2010-154965, A

  However, in the above method for producing a three-dimensionally combined filament, the rotation direction and curvature of the loop formed by the filamentous molten filament cannot be controlled, a random loop is formed, and the coupling between filaments cannot be controlled. . Therefore, there is a problem in that the shape and the bonding position of each filament forming the three-dimensionally combined filament are irregular, and the repulsive force tends to locally vary. Further, in order to fuse and bond the molten filaments, (1) the molten filaments are formed into a random loop shape by utilizing the buoyancy of water, and the adjacent molten filaments are brought into contact with each other, and (2) the contact point It is necessary to fuse the molten filaments together with each other, but when the molten filaments fall into the cooling water, the surface temperature rapidly drops below the boiling point of water, so the softening temperature (melting point or glass transition point of the molten filaments If the temperature at which fusion bonding occurs is higher than the boiling point of water, the fusion bond is formed by the residual heat inside the molten filament, but there is a problem that it becomes difficult to form a strong fusion bond.

  The present invention has been made in view of the above problems, and an object of the present invention is to provide a filament three-dimensional bonded body manufacturing apparatus and a filament three-dimensional bonded body manufacturing method that facilitate control of the filament shape and the filament bonding location.

  A filament three-dimensional combined body manufacturing apparatus according to the present invention has a plurality of nozzles, and a molten filament supply apparatus that discharges a molten filament so as to translate from each of the nozzles and at least one of the translated molten filaments is pushed. A molten filament crimping device that realizes partial crimping to the other translating molten filaments, and a filament three-dimensional bonded body is formed using the molten filaments including the crimped ones. To do.

  According to this configuration, it becomes easier to control the shape of the filament and the connecting point of the filament, as compared with the case where the crimping is not performed. Note that the “compression bonding” in the present application is a concept of pressing so as to come into contact with each other and fusing, and is not limited to strongly pressing and adhering.

  Further, more specifically as the above configuration, the molten filament supply device has a specific nozzle group consisting of a plurality of the nozzles aligned in a predetermined direction, the molten filament crimping device from the adjacent nozzles in the specific nozzle group. A configuration may be adopted in which a filament crimping portion that realizes the crimping is performed by the discharged molten filaments.

  Further, as the above-mentioned configuration, more specifically, the filament pressure-bonding section may realize the pressure-bonding by pressing the molten filaments discharged from the adjacent nozzles toward each other. According to this configuration, it is possible to form a well-balanced intermediate body having a symmetrical shape, as compared with the case where only one of the molten filaments is pressed.

  Further, more specifically as the above configuration, the specific nozzle group includes nozzles arranged in order from the first to the fourth in the predetermined direction, and the filament crimping portion is discharged from the second and third nozzles. The first crimping, which is the crimping of the molten filaments, the crimping of the molten filaments discharged from the first and second nozzles, and the crimping of the molten filaments discharged from the third and fourth nozzles. The second pressure bonding is performed, and the location where the first pressure bonding is performed and the location where the second pressure bonding is performed may be different in the direction of the translation. According to this configuration, the molten filaments can be pressure-bonded in a well-balanced manner so as to form a two-dimensional mesh, and it is possible to suppress the deviation of the pressure-bonded portions.

  Further, in the filament three-dimensional combined body manufacturing apparatus having the above-mentioned configuration, which has a plurality of the specific nozzle groups, and forms an intermediate body in which the molten filaments are bonded together by the pressure bonding by the filament pressure bonding unit, for each of the specific nozzle groups, The molten filament crimping device may be configured to partially crimp the intermediate bodies in a direction different from the predetermined direction. According to this structure, it is possible to form an intermediate body in which the molten filaments are three-dimensionally bonded, and it becomes easier to control the shape of the filament and the bonding position of the filament.

  Further, more specifically as the above configuration, the filament supply device may be configured to discharge the molten filament vertically downward from each of the nozzles arranged at different positions in the horizontal direction. According to this configuration, the discharge direction of the molten filaments matches the gravity direction, and it becomes possible to easily translate the plurality of molten filaments.

  Further, the method for producing a three-dimensional filament combined body according to the present invention includes a step of supplying a plurality of molten filaments in a translational manner, and a step of pushing at least one of the translated filaments to move the other translated filaments. A molten filament crimping step of partially crimping to the molten filament, and a method for forming a three-dimensional filament combination by using the molten filament including the crimped filament.

  Further, in the above method in which a plurality of intermediates in which the molten filaments are bonded to each other are formed by the molten filament crimping step, an intermediate body crimping step of partially crimping the intermediates may be included.

  According to the filament three-dimensional bonded body manufacturing apparatus or the filament three-dimensional bonded body manufacturing method according to the present invention, it is easy to control the filament shape and the filament bonding position. Also, in the process of connecting filaments, that is, in the process of forming a random loop, it is not necessary to use the buoyancy of water, so the thermoplasticity is high and the deformation due to heat is hard to occur (high heat resistance) Even if a resin is used, a filament three-dimensional bonded body having a stable fusion bond can be obtained.

It is a block diagram of the filament three-dimensional combined body manufacturing apparatus which concerns on this embodiment. It is a cross-sectional arrow view of the filament three-dimensional combined body manufacturing apparatus shown in FIG. It is a block diagram in the vicinity of the crimping device according to the present embodiment. It is explanatory drawing regarding the nozzle group formation part which concerns on this embodiment. It is a block diagram from the upper viewpoint of a 1st filament pressure bonding part. FIG. 6 is a partially enlarged view of a first filament crimping portion shown in FIG. 5. It is a cross-sectional arrow view of the 1st filament pressure bonding part shown in FIG. It is a partial perspective view of a 1st filament pressure bonding part. It is explanatory drawing regarding operation | movement of a 1st filament crimping | compression-bonding part. It is explanatory drawing regarding operation | movement of a 1st filament crimping | compression-bonding part. It is explanatory drawing regarding operation | movement of a 1st filament crimping | compression-bonding part. It is a block diagram from the upper viewpoint of a 2nd filament pressure bonding part. It is a partially expanded view of the 2nd filament pressure bonding part shown in FIG. It is a front view of a 2nd filament pressure bonding part. It is a partial perspective view of a 2nd filament pressure bonding part. It is explanatory drawing regarding the operation | movement of a 2nd filament pressure bonding part. It is explanatory drawing regarding the operation | movement of a 2nd filament pressure bonding part. It is explanatory drawing regarding the operation | movement of a 2nd filament pressure bonding part. It is explanatory drawing regarding the structural example of a 2nd intermediate body. It is explanatory drawing regarding the modification of a 1st filament pressure bonding part.

  An example of an embodiment of the present invention will be described below with reference to the drawings. In the following description, the up, down, left, right, and front and rear directions are as shown in the drawings, and the downward direction corresponds to the vertically downward direction, and the front and rear and left and right directions correspond to the horizontal direction.

1. Overall Configuration of Filament Three-Dimensional Bonded Body Manufacturing Apparatus FIG. 1 is a schematic configuration diagram of a filament three-dimensional bonded body manufacturing apparatus 1 according to the present embodiment. FIG. 2 is a cross-sectional view of the filament three-dimensional bonded body manufacturing apparatus 1 shown in FIG. FIG. 3 is a schematic configuration diagram in the vicinity of the pressure bonding device 26 included in the filament three-dimensional bonded body manufacturing apparatus 1.

  The filament three-dimensional bonded body manufacturing apparatus 1 is an apparatus for manufacturing a filament three-dimensional bonded body 3 made of a thermoplastic resin fiber having a three-dimensional network structure, and includes an extrusion molding machine 10 and a three-dimensional bonded body forming apparatus 20. Is equipped with. Further, the filament three-dimensional bonded body manufacturing apparatus 1 includes a controller 27 (see FIG. 2) that controls each operation of the pressure bonding apparatus 26 described later. In the following description, the thermoplastic resin fiber may be referred to as a filament, and the three-dimensional filament assembly 3 may be referred to as a 3DF (3-dimensional filaments-linked structure) 3. In addition, the filament three-dimensional combined body manufacturing apparatus 1 may be referred to as a 3DF manufacturing apparatus 1.

  The extrusion molding machine 10 is an example of a molten filament supply device that forms a molten filament (filament) and discharges it toward the three-dimensional bonded body forming device 20. The extrusion molding machine 10 includes an extruder 11 that is a pressure melting unit including a hopper 13 for feeding materials, a die 12 that is connected to the extruder 11 and that includes a nozzle group forming unit 17, and the like. The filament in a molten state is discharged from the nozzle group forming portion 17. In the following, the filament in the molten state may be referred to as the molten filament 2.

  The hopper 13 is a material charging unit for charging the thermoplastic resin that is the material of the filament into the extruder 10. Examples of the thermoplastic resin include polyolefin resins such as polyethylene and polypropylene, polyester resins such as polyethylene terephthalate, polyamide resins such as nylon 66, polyvinyl chloride resins and polystyrene resins, styrene elastomers and vinyl chloride elastomers. Thermoplastic elastomers such as olefin elastomers, urethane elastomers, polyester elastomers, nitrile elastomers, polyamide elastomers, and fluorine elastomers can be used.

  The extruder 11 is a pressure melting unit that melts the thermoplastic resin while applying pressure. A cylinder 11 a is formed inside the extruder 11. A screw 14 that is rotated by a screw motor 15 is inserted into the cylinder 11a. A screw heater 16 (16a, 16b, 16c) is installed on the outer periphery of the cylinder 11a. The screw 14 is a pressurizing and conveying member that pressurizes the thermoplastic resin that is heated and melted by the screw heater 16 and conveys it from the filament discharge portion 11b to the die 12. The screw heater 16 is a heating unit that heats the thermoplastic resin in the cylinder 11a.

  The die 12 is a filament delivery unit for delivering the molten thermoplastic resin conveyed from the extruder 11 into fibrous molten filaments 2. Inside the die 12, a die guiding channel 12a is formed. The die heater 18 (18a to 18f) is a heating unit that heats the molten filament 2 passing through the die guiding channel 12a.

  A temperature sensor 19 (19a, 19b, 19c) for measuring the temperature of the molten filament 2 is provided near the die heater 18, and a temperature sensor (not shown) is also provided near the screw heater 16. The outputs of the screw heater 16 and the die heater 18 are controlled based on the temperature measurement results obtained by these temperature sensors.

  The extruder 10 melts the thermoplastic resin supplied from the hopper 13 in the cylinder 11a with the screw 14, the screw heater 16, the die heater 18, and the like. The melted thermoplastic resin is discharged vertically downward as a plurality of molten filaments 2 from each nozzle 17a formed in the nozzle group forming portion 17 via the die guiding channel 12a inside the die 12.

  The nozzle group forming portion 17 is a metal plate of a substantially rectangular parallelepiped (a substantially rectangular parallelepiped having front and rear, left and right, and upper and lower surfaces) in which a plurality of nozzles 17a that are circular openings are formed, and is the maximum of the die guiding channel 12a. It is provided below the die 12 corresponding to the downstream portion. The front-rear direction and the left-right direction dimensions of the nozzle group forming portion 17 can be set according to the cross-sectional dimensions (mattress thickness and width dimensions) when, for example, a 3DF3 for a mattress is manufactured. Since the nozzle group forming portion 17 in the present embodiment is used for manufacturing the 3DF3 for a wide mattress as an example, the dimension in the left-right direction is significantly larger than the dimension in the front-rear direction. FIG. 4 schematically shows the lower surface of the nozzle group forming portion 17 as viewed from below. Note that FIG. 4 also shows a partially enlarged view of the area indicated by α1 in this figure.

  As shown in FIG. 4, in the nozzle group forming portion 17, the nozzles 17a are arranged in a matrix in which the nozzles 17a are two-dimensionally arranged in the front-rear direction and the left-right direction. In other words, the nozzle group forming unit 17 has a plurality of nozzle groups (in the example of the present embodiment, seven nozzles 17a, which may be hereinafter referred to as “specific nozzle groups”) arranged in a line in the front-rear direction. There are rows. As an example, the seven nozzles 17a shown by SN in FIG. 4 are the third specific nozzle group from the left. The plurality of rows of specific nozzle groups are arranged so as to be arranged at equal intervals in the left-right direction.

  As shown in FIG. 4, regarding the pitch (nozzle spacing) between the nozzles 17a arranged in a matrix, in the following description, the pitch in the front-back direction is X1, and the pitch in the left-right direction (interval between specific nozzle groups). Can also be set) as X2. In the present embodiment, as an example, the pitch X1 and the pitch X2 are set to 10 mm. However, the specific form of the nozzle 17a is not particularly limited, and the nozzle shape, the nozzle inner diameter, the nozzle interval, the nozzle arrangement, or the like may be appropriately adjusted based on, for example, the specifications of the repulsive force of the three-dimensional filament combination. it can.

  The three-dimensional bonded body forming apparatus 20 forms the 3DF3 having a three-dimensional network structure by fusion bonding and cooling and solidifying the plurality of molten filaments 2. The three-dimensional combined body forming device 20 includes a pair of front and rear receiving plates 21a and 21b installed in a plane symmetric manner (symmetrical with respect to a plane that extends in the front-rear and left-right directions) at a predetermined interval, and a water tank 23 that stores cooling water 22a. And a pressure bonding device 26.

  The plurality of molten filaments 2 discharged from the nozzle group forming unit 17 and translated in the vertically downward direction reach the pair of receiving plates 21a, 21b arranged in the vertically downward direction via the pressure bonding device 26. Each of the pair of receiving plates 21a, 21b has a flat plate-like inclined surface 21a1, 21b1 that is inclined downward toward the center (symmetrical surface) of each other, and a flat plate-shaped extending vertically downward from the lower part of the inclined surfaces 21a1, 21b1. It includes vertical surfaces 21a2 and 21b2.

  A cooling water supply device (not shown) that supplies cooling water to the entire surfaces of the receiving plates 21a and 21b may be provided above the receiving plates 21a and 21b. By suppressing or preventing the temperature rise of the receiving plates 21a, 21b by supplying the cooling water, it is possible to prevent the molten filament 2 from being fused to the receiving plates 21a, 21b. The molten filament 2 that has reached the pair of receiving plates 21a and 21b passes through between the pair of front and rear vertical surfaces 21a2 and 21b2 and enters the cooler 22 below.

  The receiving plates 21a and 21b are made to have a high density by bringing both end portions (surface layers) in the thickness direction of the molten filament 2 sent from the pressure bonding device 26 toward the central portion so that the molten filament 2 (three-dimensionally combined filaments) 2) to form hard surface layers on both ends. By forming the hard surface layer, it is possible to suppress the change in the lengthwise direction (here, the direction corresponding to the conveying direction of the molten filament 2) of the filament three-dimensional bonded body, and to shape the filament three-dimensional bonded body. Can be stabilized.

  The cooler 22 cools and solidifies the fusion filament 2 that has been fusion bonded. The cooler 22 drives a water tank 23 that stores the cooling water 22a, a pair of endless conveyors 24a and 24b that conveys the 3DF3, a plurality of conveyance rollers 25a to 25g, and these endless conveyors and conveyance rollers via gears. And a transport motor (not shown).

  The endless conveyors 24a and 24b and the plurality of transport rollers 25a to 25g are transport devices that transport the 3DF3. The pair of endless conveyors 24a and 24b are provided in the lower portion of the receiving plates 21a and 21b in the vertical direction, and move the mesh-like molten filaments that have been three-dimensionally fusion-bonded downward while cooling with cooling water 22a. Then, the cooled and solidified 3DF3 is conveyed.

  The transport speed of the endless conveyors 24a and 24b is closely related to the filament density. That is, in relation to the cooling speed of the molten filament 2, the filament density becomes lower as the conveying speed becomes faster, and the filament density becomes higher as the conveying speed becomes slower. The transport rollers 25a to 25g are disposed in the subsequent stage of the pair of endless conveyors 24a and 24b, and transport the 3DF3 that has passed through the endless conveyors 24a and 24b to the outside of the water tank 23.

  In the present embodiment, the belt conveyor made of a mesh metal mesh is used as the endless conveyors 24a and 24b, but the present invention is not limited to this, and various types of transfer devices can be used. For example, a slat conveyor or the like can be adopted as the carrying device.

  Further, in the present embodiment, a crimping device 26 (a form of a molten filament crimping device) is provided between the nozzle group forming portion 17 and the pair of receiving plates 21a and 21b. The pressure bonding device 26 is a device that presses a part of the plurality of molten filaments 2 discharged and dropped from the nozzle group forming unit 17 and pressure-bonds them to the other molten filaments 2.

  The crimping device 26 has a first filament crimping section 51 and a second filament crimping section 61. The first filament crimping section 51 partially crimps the filamentous molten filaments 2 discharged from the nozzle group forming section 17 in the front-rear direction to form a plurality of first intermediate bodies 2a, and the second filament crimping section 61. Send to. The first intermediate body 2a can also be regarded as the molten filament 2 in a state in which it has been pressure-bonded to some extent.

  The second filament crimping section 61 partially crimps the first intermediate bodies 2a to each other in the left-right direction to form the second intermediate body 2b, and sends it to the pair of receiving plates 21a, 21b. Therefore, the molten filament 2 at the stage of reaching the receiving plates 21a and 21b is actually formed on the second intermediate body 2b by the pressure bonding device 26. The second intermediate body 2b can also be regarded as the molten filament 2 in a state in which the degree of pressure bonding is further advanced than that of the first intermediate body 2a.

2. Configuration and Operation of Crimping Device Hereinafter, the configuration and operation of the crimping device 26 will be described in more detail.

2-1. Configuration and Operation of First Filament Crimping Section First, the configuration of the first filament crimping section 51 will be described. FIG. 5 is a schematic configuration diagram of the first filament crimping portion 51 from an upper viewpoint. FIG. 6 is a partially enlarged view of the area indicated by α2 in FIG. FIG. 7 is a schematic arrow view of the plane indicated by BB ′ in FIG. Note that FIG. 7 also shows a partially enlarged view of the area indicated by α3 in this figure. Further, FIG. 8 is a schematic perspective view of a part of the first filament crimping portion 51. 8A shows a perspective view of the vicinity of the rear support portion 53, FIG. 8B shows a state in which the first crimping member 54 is movable in the front-rear direction, and FIG. Shows that the second crimping member 55 is movable in the front-rear direction.

  The first filament pressure-bonding portion 51 is provided with a front-side support portion 52 and a rear-side support portion 53, which extend in the left-right direction, for supporting the pressure-bonding members 54 and 55, spaced apart in the front-rear direction. The front support portion 52 is disposed in front of the rear support portion 53, and the rear surface of the front support portion 52 and the front surface of the rear support portion 53 face each other in the front-rear direction. The region sandwiched between the front support part 52 and the rear support part 53 is a region through which the molten filament 2 discharged from the nozzle group forming part 17 passes. A guide groove G1 is provided on the rear surface of the front support portion 52 and the front surface of the rear support portion 53.

  A plurality of first pressure-bonding members 54 and a plurality of second pressure-bonding members 55 are arranged between the support portions 52 and 53. The first crimping member 54 and the second crimping member 55 extend in the front-rear direction and are arranged so as to be alternately arranged in the left-right direction. The front end portion of each of the crimping members 54, 55 is fitted into the guide groove G1 of the front support portion 52, and the rear end portion thereof is fitted into the guide groove G1 of the rear support portion 53. Each crimping member 54, 55 is supported by each supporting portion 52, 53 so as to be movable in an operation cycle (see FIGS. 9 to 11) described later, and each of the melting filaments 2 being dropped is moved forward. Alternatively, it is pushed by pushing it backwards for displacement. In other words, the crimping members 54, 55 rotationally displace (rotate vibration) the molten filaments 2 in the horizontal plane direction.

  The first crimping member 54 has a configuration in which an upper first crimping member 54a and a lower first crimping member 54b are combined. The upper first crimping member 54a has a rod-shaped portion extending in the front-rear direction so as to reach the guide groove G1 of the rear support portion 53 from the guide groove G1 of the front support portion 52, and has a branch from the rod-shaped portion to the left and right. It has a plurality of protruding portions Pa protruding in the direction of. Each of the plurality of projecting portions Pa projects to the vicinity of the rod-shaped portion of the second crimping member 55 that is adjacent to the left and right, and is provided at an interval of twice the pitch X1 (see FIG. 4) in the front-rear direction. .

  The lower first crimping member 54b has a rod-shaped portion extending in the front-rear direction so as to reach the guide groove G1 of the rear support portion 53 from the guide groove G1 of the front support portion 52, and the rod-shaped portion is branched like a branch. It has a plurality of protrusions Pb protruding left and right. Each of the plurality of projecting portions Pb projects to the vicinity of the rod-shaped portion of the second crimping member 55 that is adjacent to the left and right, and is provided at an interval of twice the pitch X1 in the front-rear direction.

  The upper first pressure-bonding member 54a and the lower first pressure-bonding member 54b are arranged so as to vertically overlap with each other and are slidable in the front-rear direction. The vertical position of each protrusion Pa of the upper first pressure-bonding member 54a is the same as the vertical position of each protrusion Pb of the lower first pressure-bonding member 54b. In the basic state, each protrusion Pa is in contact with the rear side of the corresponding protrusion Pb. As shown in FIG. 8B, the upper first pressure-bonding member 54a and the lower first pressure-bonding member 54b are movable in the front-rear direction so as to be separated from each other.

  The second crimping member 55 has a configuration in which an upper second crimping member 55a and a lower second crimping member 55b are combined. The upper second crimping member 55a has a rod-shaped portion extending in the front-rear direction so as to reach the guide groove G1 of the rear support portion 53 from the guide groove G1 of the front support portion 52, and a plurality of portions protruding left and right from the rod-shaped portion. Has a protruding portion Qa. Each of the plurality of projecting portions Qa projects to the vicinity of the rod-shaped portion of the first crimping member 54 that is adjacent to the left and right, and is provided at an interval of twice the pitch X1 in the front-rear direction.

  The lower second crimping member 55b has a rod-shaped portion extending in the front-rear direction so as to reach the guide groove G1 of the rear support portion 53 from the guide groove G1 of the front support portion 52, and protrudes left and right from the rod-shaped portion. It has a plurality of protrusions Qb. Each of the plurality of projecting portions Qb projects to the vicinity of the rod-shaped portion of the first crimping member 54 that is adjacent to the left and right, and is provided at an interval of twice the pitch X1 in the front-rear direction.

  The upper second pressure-bonding member 55a and the lower second pressure-bonding member 55b are arranged so as to vertically overlap with each other, and are slidable in the front-rear direction. The vertical position of each protrusion Qa of the upper second pressure-bonding member 55a is the same as the vertical position of each protrusion Qb of the lower second pressure-bonding member 55b. In the basic state, each protrusion Qa is in contact with the rear side of the corresponding protrusion Qb. As shown in FIG. 8C, the upper second pressure-bonding member 55a and the lower second pressure-bonding member 55b are movable in the front-rear direction so as to be separated from each other.

  In the basic state, the protrusions Pa and Pb of the first pressure-bonding member 54 and the protrusions Qa and Qb of the second pressure-bonding member 55 are arranged at positions displaced in the front-rear direction by the pitch X1. Further, the rod-shaped portion of the first pressure-bonding member 54 and the rod-shaped portion of the second pressure-bonding member 55 that are adjacent to each other on the left and right are arranged at a pitch X2 (see FIG. 4) in the left-right direction.

  As shown in FIG. 6 and the like, the rod-shaped portions of the first pressure-bonding member 54 and the rod-shaped portions of the second pressure-bonding member 55 that extend in the front-rear direction are alternately arranged in the left-right direction, and extend in the left-right direction in the front-rear direction. Further, the protrusions Pa and Pb of the first pressure-bonding member 54 and the protrusions Qa and Qb of the second pressure-bonding member 55 are alternately arranged. Therefore, when the first filament pressure-bonding portion 51 in the basic state is viewed from above, the first pressure-bonding member 54 and the second pressure-bonding member 55 form a substantially lattice shape. The lattice-shaped squares are located directly below the nozzles 17a. Therefore, as shown by the broken line in FIG. 6, one of the melted filaments 2 discharged from each nozzle 17a and translated is passed through one square.

  Next, the operation of the first filament pressure bonding section 51 will be described in detail. 9 to 11 are explanatory diagrams related to the operation cycle of the first filament pressure bonding unit 51. More specifically, FIG. 9 is a schematic view from the same viewpoint as FIG. 7. FIG. 10 is a schematic view of the movement of each of the protrusions Pa, Pb, Qa, and Qb as viewed from the left. FIG. 11 is a schematic view of the movement of the first filament crimping portion 51 on the plane indicated by CC ′ in FIG. 10, as viewed from above. The position of BB 'shown in FIG. 11 is the same as the position of BB' shown in FIG.

  Further, (a) to (h) in FIGS. 9 to 11 show respective states of the first filament crimping portion 51. That is, the state of the first filament pressure bonding portion 51 transits in the order of (a) → (b) → (c) → (d) → (e) → (f) → (g) → (h). ). While the plurality of filamentous molten filaments 2 are translated downward from the nozzle group forming unit 17, the first filament pressure bonding unit 51 operates in such an operation cycle. Further, Fk (k is 1 to 7) in FIG. 10 indicates the molten filament 2 discharged from the kth nozzle 17a from the rear in the nozzle group forming portion 17.

  The state (a) is a basic state of the first filament pressure-bonding section 51, and the protrusions Pa and Pb of the first pressure-bonding member 54 and the protrusions Qa and Qb of the second pressure-bonding member 55 have the same vertical position. . When the second crimping member 55 moves downward in the state (a), the first filament crimping portion 51 is brought into the state (b). In the state (b), the protrusions Qa and Qb of the second pressure-bonding member 55 are located below the protrusions Pa and Pb of the first pressure-bonding member 54.

  In the state (b), the upper second pressure-bonding member 55a moves rearward by about the pitch X1 and the lower second pressure-bonding member 55b moves forward by about the pitch X1. The state of (c) is obtained. In the process of transitioning from the state (b) to the state (c), the protruding portion Qa of the upper second pressure-bonding member 55a pushes the molten filament 2 (F1, F3, F5, F7) on the rear side backward, The protruding portion Qb of the second crimping member 55b pushes the molten filament 2 (F2, F4, F6) on the front side thereof forward.

  As a result, the molten filaments 2 of F2 and F3, the molten filaments 2 of F4 and F5, and the molten filaments 2 of F6 and F7 are partially pressure-bonded to each other at substantially the center positions of both paths. Since the molten filaments 2 are in a molten state at a high temperature, they can be easily fused and brought into contact with each other by contacting each other to realize pressure bonding. Since these crimps are performed below the first crimping member 54, the protrusions Qa and Qb do not interfere with the first crimping member 54 during crimping, and thereafter, the crimped portion moves downward. Even if it advances, it does not hit the first pressure bonding member 54.

  In the state (c), the upper second pressure-bonding member 55a moves forward and the lower second pressure-bonding member 55b moves rearward, so that the first filament pressure-bonding portion 51 enters the state (d). Further, in the state (d), the second filament pressure-bonding member 55 moves upward, whereby the first filament pressure-bonding portion 51 enters the state (e). As the state of the first filament crimping portion 51, the state (d) is the same as the state (b), and the state (e) is the same as the state (a). That is, in the operation cycle from (a) to (e), a series of operations is performed in which the second crimping member 55 moves downward to crimp predetermined molten filaments 2 to each other and return to the original position.

  Next, in the state (e), the first crimping member 54 moves downward, so that the first filament crimping portion 51 enters the state (f). In the state (f), the protrusions Pa and Pb of the first pressure-bonding member 54 are located below the protrusions Qa and Qb of the second pressure-bonding member 55.

  In the state (f), the upper first crimping member 54a moves rearward by about the pitch X1 and the lower first crimping member 54b moves forward by about the pitch X1. The state of (g) is obtained. In the process of transitioning from the state (f) to the state (g), the protruding portion Pa of the upper first pressure-bonding member 54a pushes the molten filaments 2 (F2, F4, F6) on the rear side rearward, and the lower first The protruding portion Pb of the crimping member 54b pushes the molten filament 2 (F1, F3, F5, F7) on the front side thereof forward.

  As a result, the molten filaments 2 of F1 and F2, the molten filaments 2 of F3 and F4, and the molten filaments 2 of F5 and F6 are partially pressure-bonded to each other at substantially the center positions of both paths. Since these crimps are performed below the second crimp member 55, the protrusions Pa and Pb do not interfere with the second crimp member 55 during crimping, and thereafter the crimped portion is moved downward. Even if it advances, it does not hit the second pressure bonding member 55.

  In the state (g), the upper first pressure-bonding member 54a moves forward and the lower first pressure-bonding member 54b moves rearward, whereby the first filament pressure-bonding portion 51 enters the state (h). Further, in the state (h), the first filament pressure-bonding portion 54 moves to the state of (a) by the upward movement of the first pressure-bonding member 54. As the state of the first filament crimping portion 51, the state (h) is the same as the state (f), and the state (a) is the same as the state (e). That is, in the operation cycle from (e) to (a), a series of operations is performed in which the first crimping member 54 moves downward to crimp predetermined molten filaments 2 to each other, and returns to the original position.

  By repeating the above-described operation cycle, as shown in FIG. 10, the intermediate filaments 2a having a mesh shape are formed successively by the partially adjoining front and rear molten filaments 2 being pressure-bonded to each other. Such first intermediate bodies 2a are formed by the number of nozzles 17a provided in the nozzle group forming portion 17 in the left-right direction, and are discharged downward from the first filament crimping portion 51 in a state of being arranged in the left-right direction at a pitch X2. To be done. These intermediate bodies 2 a reach the second filament crimping section 61 provided below the first filament crimping section 51.

  Note that the pressure bonding by the first pressure bonding member 54 is performed at the positions indicated by V1, V3, V5, ... In FIG. 10 (h), and the pressure bonding by the second pressure bonding member 55 is denoted by V2, V4 ,. Done in position. In this way, the location where the first crimp member 54 is crimped and the location where the second crimp member 55 is crimped are different in the direction of translation of the molten filament 2. In addition, all of these crimps are performed by pushing the adjacent filaments 2 toward each other. Therefore, as shown in the lower part of FIG. 10 (h), a well-balanced mesh-like first intermediate body 2a that is substantially symmetrical in the front-rear direction is formed. However, the location where these crimps are made can be arbitrarily set based on, for example, the specifications of the repulsive force of the three-dimensional filament assembly. Further, the operation speed, operation cycle, etc. of the first filament crimping portion 51 may be set to be updateable, and the timing at which the molten filament 2 is pushed may be changed to appropriately adjust the portion to be crimped.

2-2. Configuration and Operation of Second Filament Crimping Section Next, the configuration of the second filament crimping section 61 will be described. FIG. 12 is a schematic configuration diagram of the second filament crimping portion 61 from an upper viewpoint. FIG. 13 is a partially enlarged view of the area indicated by β1 in FIG. FIG. 14 is a schematic arrow view of the plane indicated by DD ′ in FIG. Note that FIG. 14 also shows a partially enlarged view of a region indicated by β2 in this figure. Further, FIG. 15 is a schematic perspective view of a portion of the second filament crimping portion 61 in the vicinity of the rear support portion 53.

  The second filament crimping portion 61 is provided with a front side supporting portion 62 and a rear side supporting portion 63 which extend in the left-right direction and are spaced from each other in the front-rear direction. The front support portion 62 is disposed in front of the rear support portion 63, and the rear surface of the front support portion 62 and the front surface of the rear support portion 63 face each other in the front-rear direction. The region sandwiched between the front support part 62 and the rear support part 63 is a region through which the first intermediate body 2 a discharged from the first filament pressure bonding part 51 passes. A guide groove G2 is provided on the rear surface of the front support portion 62 and the front surface of the rear support portion 63.

  A plurality of third pressure-bonding members 64 and a plurality of fourth pressure-bonding members 65 are arranged between the support portions 62 and 63. The third pressure-bonding members 64 and the fourth pressure-bonding members 65 extend in the front-rear direction and are arranged so as to be alternately arranged in the left-right direction. The front end portion of each of the crimping members 64 and 65 is fitted into the guide groove G2 of the front support portion 62, and the rear end portion thereof is fitted into the guide groove G2 of the rear support portion 63. Each crimping member 64, 65 is supported by each supporting portion 62, 63 so as to be movable in an operation cycle described later (see FIGS. 16 to 18), and each first intermediate body 2a is falling. Momentarily push left or right to displace. In other words, the crimping members 64, 65 rotationally displace (rotate vibration) the first intermediate bodies 2a in the horizontal plane direction.

  The third crimping member 64 has a configuration in which the left third crimping member 64a and the right third crimping member 64b are combined. Each of the left third pressure-bonding member 64a and the right third pressure-bonding member 64b has a rod shape extending in the front-rear direction so as to reach the guide groove G2 of the rear support portion 63 from the guide groove G2 of the front support portion 62. .

  The left third pressure-bonding member 64a and the right third pressure-bonding member 64b are arranged so as to be in contact with each other in the left-right direction in the basic state, and have the same vertical position. The left third pressure-bonding member 64a and the right third pressure-bonding member 64b are movable in the left-right direction so as to separate from each other.

  The fourth pressure bonding member 65 has a configuration in which a left side fourth pressure bonding member 65a and a right side fourth pressure bonding member 65b are combined. Each of the left side fourth pressure-bonding member 65a and the right side fourth pressure-bonding member 65b has a rod shape extending in the front-rear direction so as to reach the guide groove G2 of the rear side support portion 63 from the guide groove G2 of the front side support portion 62. .

  The left-side fourth pressure-bonding member 65a and the right-side fourth pressure-bonding member 65b are arranged so as to be in contact with each other in the left-right direction in the basic state, and have the same vertical position. The left-side fourth pressure-bonding member 65a and the right-side fourth pressure-bonding member 65b are movable in the left-right direction so as to separate from each other. The third pressure-bonding member 64 and the fourth pressure-bonding member 65, which are adjacent to each other on the left and right, are arranged in the left-right direction at a pitch X2 (see FIG. 4). One of the first intermediate bodies 2a discharged from the first filament crimping portion 51 passes through one space formed between the third crimping member 64 and the fourth crimping member 65 which are adjacent to each other.

  Next, the operation of the second filament pressure bonding section 61 will be described in detail. 16 to 18 are explanatory diagrams related to the operation cycle of the second filament pressure bonding unit 61. More specifically, FIG. 16 is a schematic diagram from the same viewpoint as FIG. 14. FIG. 17 is a schematic view of the movement of each crimping member 64a, 64b, 65a, 65b as seen from the front. FIG. 18 is a schematic view of the movement of the second filament crimping portion 61 on the plane indicated by EE ′ in FIG. 17, as viewed from above.

  Further, (a) to (h) in FIGS. 16 to 18 show respective states of the second filament crimping portion 61. That is, the state of the second filament crimping portion 61 transits in the order of (a) → (b) → (c) → (d) → (e) → (f) → (g) → (h). ). While the plurality of first intermediate bodies 2a are translated downward from the first filament crimping portion 51, the second filament crimping portion 61 operates in such an operation cycle. Further, Mk (k is 1 to 7) in FIG. 17 indicates the k-th first intermediate body 2a from the left in an arbitrary region where the seven first intermediate bodies 2a are arranged on the left and right.

  The state (a) is the basic state of the second filament crimping portion 61, the left third crimping member 64a is in contact with the left side of the right third crimping member 64b, and the left fourth fourth crimping member 65a is the right fourth crimping member. It is in contact with the left side of 65b. In the state (a), the fourth filament pressure-bonding member 65 moves downward, so that the second filament pressure-bonding portion 61 enters the state (b).

  In the state (b), the left side fourth crimping member 65a moves to the left by about the pitch X2, and the right side fourth crimping member 65b moves to the right by about the pitch X2. Is in the state of (c). In the process of transitioning from the state (b) to the state (c), the left side fourth crimping member 65a pushes the first intermediate body 2a (M1, M3, M5, M7) on the left side to the left side, and the fourth side on the right side. The crimping member 65b pushes the first intermediate 2a (M2, M4, M6) on the right side thereof to the right.

  As a result, the first intermediate bodies 2a of M2 and M3, the first intermediate bodies 2a of M4 and M5, and the first intermediate bodies 2a of M6 and M7 are partially separated from each other at substantially the center positions of both paths. Crimp on. Since the first intermediate bodies 2a are in a molten state at a high temperature, they can be easily fused and brought into contact with each other to realize pressure bonding. Since these crimps are performed below the third crimp member 64, the fourth crimp member 65 does not interfere with the third crimp member 64 during crimping, and thereafter the crimped portion advances downward. However, it does not hit the third pressure bonding member 64.

  In the state (c), the left-side fourth pressure-bonding member 65a moves to the right and the right-side fourth pressure-bonding member 65b moves to the left, so that the second filament pressure-bonding portion 61 enters the state (d). . Further, in the state (d), the fourth filament pressure-bonding member 65 moves upward, so that the second filament pressure-bonding portion 61 enters the state (e). As for the state of the second filament crimp portion 61, the state (d) is the same as the state (b), and the state (e) is the same as the state (a). That is, in the operation cycle from (a) to (e), a series of operations is performed in which the fourth pressure-bonding member 65 moves downward, pressure-bonds the first intermediate bodies 2a to each other, and returns to the original position.

  Next, in the state (e), the third filament pressure-bonding member 64 moves downward, so that the second filament pressure-bonding portion 61 enters the state (f). In the state (f), the left third pressure-bonding member 64a moves to the left approximately by the pitch X2, and the right third pressure-bonding member 64b moves to the right approximately the pitch X2, whereby the second filament pressure-bonding portion 61 is formed. Is in the state of (g). In the process of transitioning from the state (f) to the state (g), the left side third crimping member 64a pushes the first intermediate body 2a (M2, M4, M6) on the left side to the left side, and the right side third crimping member. 64b will push the 1st intermediate body 2a (M1, M3, M5, M7) on the right side to the right.

  As a result, the first intermediate bodies 2a of M1 and M2, the first intermediate bodies 2a of M3 and M4, and the first intermediate bodies 2a of M5 and M6 are partially separated from each other at substantially the center positions of both paths. Crimp on. Since these crimps are performed below the fourth crimp member 65, the third crimp member 64 does not interfere with the fourth crimp member 65 during crimping, and thereafter the crimped portion advances downward. However, it does not hit the fourth pressure bonding member 65.

  In the state (g), the left third pressure-bonding member 64a moves to the right and the right third pressure-bonding member 64b moves to the left, so that the second filament pressure-bonding portion 61 becomes the state (h). . Further, in the state (h), the third filament pressure-bonding member 64 moves upward, so that the second filament pressure-bonding portion 61 enters the state (a). As for the state of the second filament crimp portion 61, the state (h) is the same as the state (f), and the state (a) is the same as the state (e). That is, in the operation cycle from (e) to (a), a series of operations is performed in which the third pressure-bonding member 64 moves downward, pressure-bonds the first intermediate bodies 2a to each other, and returns to the original position.

  By repeating the above operation cycle, the second intermediate bodies 2b in which the first intermediate bodies 2a adjacent to each other on the left and right sides are partially pressure-bonded are sequentially formed. As illustrated in FIG. 19, the second intermediate body 2b has a form in which thread-shaped molten filaments 2 are three-dimensionally combined. The second intermediate body 2b proceeds downward and is cooled and solidified through the pair of receiving plates 21a and 21b described above to obtain 3DF3.

  Note that the pressure bonding by the third pressure bonding member 64 is performed at the positions indicated by Y1, Y3, Y5, ... In FIG. 17 (h), and the pressure bonding by the fourth pressure bonding member 65 is denoted by Y2, Y4 ,. Done in position. As described above, the location where the third pressure-bonding member 64 is pressure-bonded and the location where the fourth pressure-bonding member 65 is pressure-bonded are different in the direction of translation of the first intermediate body 2a. In addition, all of these pressure bondings are performed by pushing the adjacent first intermediate bodies 2a toward each other. Therefore, as shown in the lower part of FIG. 17 (h), a well-balanced mesh-shaped second intermediate body 2b that is substantially symmetrical in the left-right direction is formed. However, the location where these crimps are made can be arbitrarily set based on, for example, the specifications of the repulsive force of the three-dimensional filament assembly. Further, the operation speed, operation cycle, etc. of the second filament crimping portion 61 may be set to be updateable, and the timing of pressing the first intermediate body 2a may be changed to appropriately adjust the portion to be crimped.

  Further, the position in the front-rear direction where the first intermediate bodies 2a adjacent to each other are pressure-bonded to each other can be an arbitrary position of the first intermediate body 2a forming a two-dimensional mesh shape, for example, as shown in FIG. The positions indicated by V1, V2, ... In h) may be used. However, in the case of this example, the four molten filaments 2 are pressure-bonded at the same position from the front-rear direction and the left-right direction. In this regard, if the positions in the front-rear direction where the first intermediate bodies 2a adjacent to each other are pressure-bonded to each other are the positions shown by W1, W2, ... In FIG. The portion to be crimped and the portion to be crimped using the second filament crimp portion 61 are in different states. As a result, it is easy to form a more uniform 3DF3 by suppressing the deviation of the connecting points of the filaments in the 3DF3.

3. Others In the present embodiment, the distance between the pair of front and rear vertical planes 21a2, 21b2 of the receiving plates 21a, 21b is slightly smaller than the dimension of the second intermediate body 2b in the front-rear direction. Therefore, when the second intermediate body 2b passes between the pair of receiving plates 21a, 21b, the vicinity of the front and rear end portions of the second intermediate body 2b is pushed so as to be guided to the central portion, and the second intermediate body 2b The front-rear dimension is restricted by the distance between the vertical surfaces 21a2, 21b2. Further, by being pushed in this way, the filament becomes relatively dense near the front and rear ends of the second intermediate body 2b, and it becomes easy to prevent the 3DF3 from losing its shape.

  Further, as is clear from the above description, each of the crimping members 54, 55, 64, 65 (hereinafter, sometimes collectively referred to as “crimping member Z”) provided in the crimping device 26 is the molten filament 2 or the first filament. It contacts the intermediate body 2a (hereinafter, sometimes collectively referred to as "molten filament 2x"). Therefore, it is desirable that the form of the crimping device 26 be devised so that the molten filament 2x is not fused to the crimping member Z.

  In consideration of this, the crimping member Z provided in the crimping device 26 may have a coating layer made of a material having low surface energy (for example, polytetrafluoroethylene resin). By providing the coating layer having a low surface energy, it is possible to more sufficiently prevent the fusion filament 2x from being fused to the pressure bonding member Z. The material for forming the coating layer is not particularly limited as long as it has a low surface energy, but a fluorine-based resin or a silicone resin, which does not easily adhere to the molten filament, is suitable.

  Further, the surface of the crimping member Z may be covered with a sheet-shaped water retention film (not shown) made of a cotton cloth. By doing so, the water adsorbed on the water retaining film is present between the pressure bonding member Z and the molten filament 2x to obtain a releasing effect, and it is possible to suppress the fusion of the molten filament 2x to the pressure bonding member Z. it can.

  The water-retaining film is not particularly limited as long as it has a water-retaining effect, but a cloth or mesh made of water-absorbent fibers, or a sheet containing cellulose fibers can be used, and hydrophilic silica particles having excellent heat resistance can be used. It is possible to use a resin coating containing Water may be appropriately supplied to the water retention film from a water supply device. When the temperature of the water supplied from the water supply device to the water retention film is too low, the temperature of the molten filament is locally lowered, and distortion is likely to occur. On the contrary, when it is too high, the water easily evaporates into the atmosphere. In consideration of this, it is usually preferable to set the temperature of the water to 80 ° C or higher and 95 ° C or lower.

  In addition, the coating of the water retention film described above may be provided on the pressure bonding member Z having the coating layer made of the above-mentioned material having a low surface energy, or may be provided on the pressure bonding member Z not having the coating layer. As means for preventing fusion of the molten filament 2x to the pressure bonding member Z, an ultrasonic vibration element is provided in the filament pressure bonding member 26, and the vicinity of the contact surface of the pressure bonding member Z with the molten filament 2x is vibrated. A means for preventing fusion of the molten filament 2x may be applied.

  Further, as a method for preventing the fusion filament 2x from being fused to the pressure bonding device 26 (the first filament pressure bonding portion 51 and the second filament pressure bonding portion 61), a method of coating a fluorine resin or silicone resin having low surface energy is used. In addition, silicone oil or wax having a low surface energy may be used as a release agent. Although wax has a low viscosity when melted, it becomes solid at room temperature, so that the surface of the obtained three-dimensionally combined filament is not sticky. As the wax, paraffin wax, Fischer-Tropsch wax, microcrystalline wax, carnauba wax, low molecular weight polyethylene wax, low molecular weight polypropylene wax and the like can be used.

  If the melting point of the wax is lower than the boiling point of water, after the wax is melted in the cooling water, the wax may be precipitated and clogged in a pipe or the like for circulating the cooling water. Therefore, as the wax to be used, a low molecular weight polyethylene wax or a low molecular weight polypropylene wax having a melting point of 105 ° C. or higher and 150 ° C. or lower is preferable.

  As a method of supplying a release agent such as silicone oil or wax to the pressure bonding device 26, there are a method of directly supplying a heated release agent in a liquid state and a method of adding it to a material forming a molten filament. If the amount of the release agent added to the thermoplastic resin is too small, the releasing effect becomes difficult to obtain, and if the amount of the release agent added to the thermoplastic resin is too large, a strong bond cannot be formed at the time of fusion bonding. Therefore, the amount of the release agent added to the thermoplastic resin is preferably in the range of 0.1 part by weight to 1 part by weight with respect to 100 parts by weight of the thermoplastic resin.

  Further, regarding the structure of each crimping member 54, 55 in the first filament crimping portion 51, in the present embodiment, the projecting portions Pa, Pb, Qa, Qb projecting like branches from the long rod-shaped portion are provided. It is also possible to adopt a structure in which the protruding portion is not provided like the second filament pressure bonding portion 61. FIG. 20 (views from the same viewpoint as FIGS. 5 and 6) illustrates the first filament crimping portion 51 in the case where the structure is provided with no protruding portion.

  The first filament crimping section 51 shown in FIG. 20 has a specification in which the configuration and operation of the second filament crimping section 61 described above are reversed in the front-rear direction and the left-right direction. That is, the support parts 72, 73 and the crimp members 74, 75 of the first filament crimp part 51 shown in FIG. 20 are, in principle, the support parts 62, 63 and the crimp member 64 of the second filament crimp part 61. , 65. As a result, the first filament crimping portion 51 can press the molten filament 2 in the front-rear direction to partially crimp the molten filament 2 to form the first intermediate body 2a.

  However, according to the structure illustrated in FIG. 20, each crimping member 74, 75 has an extremely long shape, and there is a possibility that component strength, operability, etc. may become a problem. In this respect, the structure of each crimping member 54, 55 shown in FIG. 5 is devised so as to be able to push the molten filament 2 in the front-back direction, but to be significantly shorter than that shown in FIG. Problems such as component strength and operability are unlikely to occur.

  Each crimping member in the first filament crimping portion 51 has a rod-like structure extending in a direction inclined from the front-rear direction, and is slanted by the front support portion and the rear support portion (direction orthogonal to the extending direction of the rod shape). Alternatively, the molten filaments 2 may be movably supported and then pressed in the movable direction to press the molten filaments 2 together. In this case, the crimping member can be made sufficiently shorter than that shown in FIG. 20 while having a simple rod-shaped configuration.

  It is also possible that the direction in which the first filament crimping portion 51 crimps the molten filaments 2 and the direction in which the second filament crimping portion 61 crimps the first intermediate bodies 2a are not orthogonal to each other. The direction of crimping by the first filament crimping portion 51 and the second filament crimping portion 61 can be arbitrarily set, and the molten filaments 2 can be three-dimensionally crimped by using these as different directions. The crimping device 26 may have a configuration in which the second filament crimping portion 62 is omitted, and the first intermediate body 2a may be supplied to the receiving plates 21a and 21b.

  The 3DF manufacturing apparatus 1 described above has a plurality of nozzles 17a, and the extruder 10 (melting filament supply device) that discharges the molten filaments 2 so as to translate downward from each of the nozzles 17a, and the translational melting. A crimping device 26 (molten filament crimping device) for pressing at least one of the filaments 2 to realize partial crimping on the other translating molten filaments 2, and the molten filaments 2 including the crimped ones are provided. Used to form 3DF3.

  Therefore, according to the 3DF manufacturing apparatus 1, for example, it is easier to control the shape of the filament in the 3DF 3 and the connection portion of the filament as compared with the case where the crimping is not performed. If the crimping device 26 is not provided, the molten filament 2 is likely to form a random loop in the vicinity of the receiving plates 21a and 21b, and thus the structure of the 3DF3 becomes irregular, which may result in non-uniform repulsive force. There is. Further, since the bonding between filaments cannot be controlled, the shape and the bonding position of each filament forming the 3DF3 become irregular, and it is difficult to control the repulsive force of the 3DF3 to the desired state.

  In this respect, since the crimping device 26 is provided in the present embodiment, the molten filaments 2 can be intentionally partially bonded to each other before reaching the receiving plates 21a and 21b. By the connection, the behavior of each molten filament 2 can be regulated by that amount, formation of a random loop in the vicinity of the receiving plates 21a and 21b can be suppressed, and the repulsive force of the 3DF3 can be easily equalized. Becomes Further, it is easy to positively control the coupling of the molten filaments 2 with each other by adjusting the configuration of the crimping device 26 or the operation setting, and the shapes and the coupling points of the filaments forming the 3DF3 are made regular. It is possible to control the repulsive force of the 3DF3 to the desired state.

  In the present embodiment, the molten filament 2 is pushed by using a predetermined member (compression member), but the form of pushing the molten filament 2 is not limited to this, and for example, by applying a fluid such as water or wind. The molten filament 2 may be pushed. The form of the crimping member is not particularly limited as long as the molten filament 2 can be appropriately pressed. In addition, the direction and position where the molten filaments 2 are pressed, the combination of the molten filaments 2 to be pressure-bonded (which molten filaments 2 are to be pressure-bonded), etc. are arbitrarily set without departing from the spirit of the present invention. Can be done.

  The extrusion molding machine 10 has a specific nozzle group including a plurality of nozzles 17 a arranged in the front-rear direction (predetermined direction), and the crimping device 26 has a first filament crimping portion 51. The first filament pressure bonding portion 51 realizes partial pressure bonding between the molten filaments 2 discharged from the adjacent nozzles 17a in the specific nozzle group.

  In addition, the first filament crimping portion 51 realizes the crimping of the molten filaments 2 by pressing the molten filaments 2 discharged from the adjacent nozzles 17a in the specific nozzle group toward each other. For example, referring to (c) of FIG. 10, the molten filaments 2 of F2 and F3, the molten filaments 2 of F4 and F5, and the molten filaments 2 of F6 and F7 are pressed toward each other. . The crimping can be performed by pushing only one of the molten filaments 2 discharged from the adjacent nozzles 17a, but by pushing both of them in a direction closer to each other, the first intermediate portion in a well-balanced form closer to a symmetrical shape. It is possible to form the body 2a.

  Further, the specific nozzle group includes nozzles 17a arranged in the order from the first to the fourth in the front-rear direction (here, as an example, nozzles for discharging the molten filaments 2 of F1 to F4). Then, the first filament crimping portion 51 performs the first crimping (see (c) of FIGS. 9 to 11), which is the crimping of the molten filaments 2 of F2 and F3, the molten filaments 2 of F1 and F2, and F3. And a second pressure bonding (see (g) of FIGS. 9 to 11), which is a pressure bonding of the molten filaments 2 of F4. The location where the first crimping is performed and the location where the second crimping is performed differ in the direction of translation of each molten filament 2. Therefore, at least the molten filaments 2 of F1 to F4 can be pressure-bonded in a well-balanced manner so as to form a two-dimensional mesh shape, and unevenness of pressure-bonded portions can be suppressed.

  In addition, in this embodiment, since the molten filaments 2 of F1 to F7 are pressure-bonded so as to have a two-dimensional mesh shape, it is possible to pressure-bond the entire molten filaments 2 discharged from the same specific nozzle group in good balance. is there. However, it is possible to arbitrarily set a region for realizing such pressure bonding, and only a part of the molten filaments 2 of F1 to F7 (for example, the molten filaments 2 of F1 to F4) has a two-dimensional mesh. You may make it crimp so that it may become a shape.

  Further, the 3DF manufacturing device 1 has a plurality of specific nozzle groups, and forms the first intermediate body 2a in which the molten filaments 2 are bonded by the pressure bonding by the first filament pressure bonding unit 51 for each specific nozzle group. Further, the crimping device 26 includes a second filament crimping portion 61 that partially crimps the first intermediate bodies 2a in the left-right direction (direction different from the front-back direction). As a result, the first intermediate bodies 2a can be pressed together to form the second intermediate body 2b in which the molten filaments are three-dimensionally bonded. Therefore, it is easier to control the shape of the filament and the connecting point of the filament in the 3DF3.

  Further, the extruder 10 (filament supply device) of the present embodiment is configured to discharge the molten filament 2 vertically downward from each of the nozzles 17a arranged at different positions in the horizontal direction. Therefore, the discharge direction of the molten filaments 2 coincides with the direction of gravity, and the plurality of molten filaments 2 translate in such a manner that they naturally fall.

  In addition to the above-described embodiment, the configuration of the present invention can be modified in various ways without departing from the spirit of the invention. That is, it should be considered that the above-described embodiments are illustrative in all points and not restrictive. It is understood that the technical scope of the present invention is shown not by the above description of the embodiments but by the scope of the claims, and includes all modifications equivalent to the scope of the claims and within the scope. Should be.

  INDUSTRIAL APPLICATION This invention can be utilized for manufacture of 3DF used for a mattress, a pillow, a cushion, etc.

1 ... Filament three-dimensional combined body manufacturing apparatus (3DF manufacturing apparatus)
2 ... Molten filament 2a ... 1st intermediate body 2b ... 2nd intermediate body 3 ... Filament three-dimensional combined body (3DF)
10 ・ ・ ・ Extrusion molding machine 11 ・ ・ ・ Pressure part 11a ・ ・ ・ Cylinder 11b ・ ・ ・ Filament discharge part 12 ・ ・ ・ Die 12a ・ ・ ・ Die guiding channel 13 ・ ・ ・ Hopper 14 ・ ・ ・ Screw 15・ ・ ・ Screw motor 16 (16a, 16b, 16c) ・ ・ ・ Screw heater 17 ・ ・ ・ Nozzle group forming part 17a ・ ・ ・ Nozzle 18 (18a to 18f) ・ ・ ・ Die heater 19 (19a, 19b, 19c)・ ・ ・ Temperature sensor 20 ・ ・ ・ Three-dimensional combined body forming devices 21a, 21b ・ ・ ・ Receiving plate 22 ・ ・ ・ Cooling machine 22a ・ ・ ・ Cooling water 23 ・ ・ ・ Water tanks 24a, 24b ・ ・ ・ Endless conveyor 25a〜 25 g ・ ・ ・ Conveying roller 26 ・ ・ ・ Crimping device (molten filament crimping device)
51 ... 1st filament crimping part 52 ... front side supporting part 53 ... rear side supporting part 54 ... 1st crimping member 54a ... upper 1st crimping member 54b ... lower 1st crimping Member 55 ・ ・ ・ Second crimping member 55a ・ ・ ・ Upper second crimping member 55b ・ ・ ・ Lower second crimping member 61 ・ ・ ・ Second filament crimping part 62 ・ ・ ・ Front side supporting part 63 ・ ・ ・ Rear side Support part 64 ... 3rd crimping member 64a ... Left side 3rd crimping member 64b ... Right side 3rd crimping member 65 ... 4th crimping member 65a ... Left 4th crimping member 65b ... Right side 4th pressure bonding member G1, G2 ... Guide groove Pa, Pb, Qa, Qb ... Protrusion

Claims (6)

A molten filament supply device having a plurality of nozzles, and discharging the molten filament so as to translate from each of the nozzles;
A movable filament crimping device that has a movable crimping member, and presses at least one of the translating molten filaments with the crimping member to realize partial crimping to the other translating molten filaments;
A method for forming a three-dimensional filament combined body by using the molten filaments including the already-compressed ones ,
The molten filament supply device has a specific nozzle group including a plurality of the nozzles arranged in a predetermined direction,
The crimping member is interposed between the translational molten filaments,
The molten filament pressure bonding device,
An apparatus for manufacturing a three-dimensional filament assembly, wherein the pressure bonding is realized by the molten filaments discharged from the adjacent nozzles in the specific nozzle group . The filament crimping device is
2. The filament three-dimensional bonded body manufacturing apparatus according to claim 1 , wherein the pressure bonding is realized by pushing the molten filaments discharged from the adjacent nozzles toward each other . The specific nozzle group,
Including nozzles arranged in order from the first to the fourth in the predetermined direction,
The filament crimping device is
First crimping, which is the crimping of the molten filaments discharged from the second and third nozzles,
A second crimping of the molten filaments discharged from the first and second nozzles, and a second crimping of the molten filaments discharged from the third and fourth nozzles.
3. The filament three-dimensional bonded body manufacturing apparatus according to claim 1 or 2, wherein a portion where the first pressure bonding is performed and a portion where the second pressure bonding is performed are different in the direction of the translation . The filament according to any one of claims 1 to 3, which has a plurality of the specific nozzle groups, and forms an intermediate body in which molten filaments are bonded together by the pressure bonding by the filament pressure bonding device, for each of the specific nozzle groups. A three-dimensional combined body manufacturing apparatus,
The molten filament pressure bonding device,
A filament three-dimensional combined body manufacturing apparatus , wherein the intermediate bodies are partially pressure-bonded to each other in a direction different from the predetermined direction . A molten filament supplying step of discharging a plurality of molten filaments in translation;
  A melt filament crimping step of pressing at least one of the translating melt filaments with a crimping member interposed between the translating melt filaments to partially crimp it to the other translating melt filaments;
  A method for producing a three-dimensional filament combination, characterized in that a three-dimensional filament combination is formed by using the molten filaments including the ones that have been pressure bonded. The filament three-dimensional bonded body manufacturing method according to claim 5, wherein a plurality of intermediate bodies in which the molten filaments are bonded are formed by the molten filament pressure bonding step.
  A method of manufacturing a three-dimensional filament assembly, comprising an intermediate body pressure bonding step of partially pressure-bonding the intermediate bodies.

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