JP6693763B2 - Substrate transfer device, electronic component mounter, production line - Google Patents

Description

  The present invention relates to a board transfer device that transfers a board, an electronic component mounter that includes the board transfer device, and a production line that includes the board transfer device.

  An ionizer is arranged on the upper side of the substrate transfer unit of the electronic component mounting apparatus disclosed in Patent Document 1. When the amount of charges charged on the substrate to be transported is large, the substrate transport unit slows down the transport speed of the substrate when passing through the ionizer. Therefore, even when the charge amount of the substrate is large, the charge of the substrate can be sufficiently removed.

JP, 2006-86338, A

  However, according to the electronic component mounter of the same document, it is necessary to reduce the transfer speed of the substrate in order to sufficiently eliminate the charge on the substrate. Therefore, the productivity of the substrate is reduced. Therefore, it is an object of the present invention to provide a substrate transfer device, an electronic component mounting machine, and a production line capable of removing electricity from a substrate and less likely to reduce productivity.

  In order to solve the above problems, the substrate transfer apparatus of the present invention transfers a substrate from the upstream side to the downstream side, and has a transfer path having a static elimination section, and an ionizer for static elimination of the substrate in the static elimination section, Between the substrate and the conductor plate, by driving the conductor plate in the static elimination section so as to face the substrate being conveyed and in the static elimination section in a direction away from the substrate. And a conductor plate drive unit capable of increasing the inter-electrode distance, which is the distance of 1. In addition, when a member such as a wiring pattern, a solder portion, and an electronic component is arranged on the substrate, the “substrate” is a concept including the member.

  In order to solve the above-mentioned subject, an electronic component mounting machine of the present invention is characterized by including the above-mentioned board transportation device. Moreover, in order to solve the above-mentioned subject, the production line of the present invention is characterized by including the above-mentioned substrate transportation device.

When the substrate and the conductor plate are regarded as electrodes, a capacitor is formed between the substrate and the conductor plate. The dielectric is an inclusion (for example, air) between the substrate and the conductor plate. The capacitance C of the capacitor is derived from the following equation (1), where ε0 is the dielectric constant of vacuum, εγ is the relative dielectric constant of the dielectric, S is the electrode area, and d is the distance between the electrodes.
C = ε0 · εγ · S / d Equation (1)
Further, the potential difference V between the electrodes is derived from the following equation (2), where Q is the charge of the capacitor (charge charged on the substrate).
V = Q / C = {(Q / (ε0 · εγ · S)} · d (2)
Here, ε0, εγ, and S are constants. Further, the charge Q is constant. Therefore, if {(Q / (ε0 · εγ · S)} is put together into a constant K, Equations (2) to (3) are established.
V = K · d Equation (3)
From the formula (3), the potential difference V (apparent potential V of the substrate when the conductor plate is the reference) can be increased by increasing the inter-electrode distance d.

  On the other hand, the higher the potential of the substrate (specifically, the larger the absolute value of the potential), the more easily the ions of opposite polarity supplied from the ionizer are attracted. Therefore, the higher the potential of the substrate, the faster the charge removal rate. On the other hand, the lower the electric potential of the substrate (specifically, the smaller the absolute value of the electric potential), the more easily the static elimination is saturated. Therefore, the lower the potential of the substrate, the slower the charge removal speed.

  In this respect, according to the substrate transfer device of the present invention, the conductor plate driving unit can move the conductor plate in the direction away from the substrate in the static elimination section. That is, the distance between the electrodes can be increased in the static elimination section. Therefore, the apparent potential of the substrate can be increased. Therefore, the charge removal rate of the substrate by the ionizer can be increased. As described above, according to the substrate transfer apparatus of the present invention, the charge removal rate of the substrate can be increased.

  For example, at a predetermined position in the static elimination section, the static elimination speed of the substrate can be increased by increasing the distance between the electrodes while the substrate is stopped. Further, in a predetermined section of the static elimination section, by increasing the inter-electrode distance while transporting the substrate, the static elimination rate of the substrate can be increased. For this reason, the time required for the substrate to pass through the static elimination section, that is, the static elimination time of the substrate can be shortened. Therefore, the productivity of the substrate does not easily decrease.

  Further, according to the electronic component mounter of the present invention, at least one of the substrates before and after mounting the electronic component can be neutralized. Further, according to the production line of the present invention, it is possible to eliminate the charge on the substrate at a desired position on the production line.

It is a schematic diagram of the production line which is one embodiment of the production line of the present invention. It is a schematic diagram of the electronic component mounting machine which is one Embodiment of the electronic component mounting machine of this invention. It is a schematic diagram of the height of the conductor plate and the time change of the electric potential of the substrate in the static elimination method of the substrate. (A) is a schematic diagram of the static elimination area in time T0 of FIG. (B) is a schematic diagram of the static elimination area at time T1 in FIG. (C) is a schematic diagram of a static elimination section from time T2 to time T3 in FIG. 3. (D) is a schematic diagram of the static elimination area at time T4 in FIG. 3. (A) is a schematic diagram of the static elimination area of the board | substrate conveyance apparatus of other embodiment (the 1). (B) is a schematic diagram of the static elimination area of the board | substrate conveyance apparatus of other embodiment (the 2).

  Hereinafter, an embodiment of a board conveyance device, an electronic parts mounting machine, and a production line of the present invention is described.

<Production line configuration>
First, the configuration of the production line of this embodiment will be described. FIG. 1 shows a schematic diagram of the production line of this embodiment. As shown in FIG. 1, the production line 9 includes a solder printing machine 90, a solder printing inspection machine 91, and a plurality of electronic component mounting machines from the left side (upstream side in the transport direction) to the right side (downstream side in the transport direction). 1, a reflow furnace 92, and a board appearance inspection machine 93.

  FIG. 2 shows a schematic diagram of the electronic component mounter of this embodiment. The configurations of the plurality of electronic component mounters 1 are the same. As shown in FIG. 2, the electronic component mounting machine 1 includes a control device 3, a mounting head 4, and a substrate transfer device 5.

  The mounting head 4 includes a head body 40 and a suction nozzle 41. The head body 40 can be moved in the front-rear, left-right direction (horizontal direction) by a robot (not shown). The suction nozzle 41 can project downward from the head body 40. The suction nozzle 41 can mount the electronic component P on the substrate B. A wiring pattern, a solder portion, and an electronic component P (not shown) are arranged on the board B.

  The substrate transfer device 5 includes a transfer path 50, an ionizer 51, a conductor plate 52, a conductor plate drive unit 53, and a plurality of potential sensors 54a and 54b. The transport path 50 is a belt conveyor. The transport path 50 is rotationally driven by the motor 500. The transfer path 50 can transfer the substrate B from the left side to the right side. The transport path 50 includes a static elimination section L. The starting point L0 of the static elimination section L is arranged on the downstream side of the mounting position E1 where the electronic component P is mounted on the board B. The end point L1 of the static elimination section L is arranged at the carry-out position E2 where the board B is paid out from the electronic component mounter 1.

  The ionizer 51 can neutralize the electric charge on the substrate B which is being conveyed in the charge elimination section L by ions. That is, the charge on the substrate B can be removed. The ionizer 51 includes a plurality of nozzles 510 and an ion generator 511. The ion generator 511 includes an AC power supply (not shown) and a discharge needle. The ion generator 511 can generate ions (positive ions, negative ions) by applying an AC voltage to the discharge needle to cause corona discharge. The plurality of nozzles 510 are arranged above and below the static elimination section L in two upper and lower stages. The plurality of nozzles 510 communicate with the ion generator 511. The plurality of nozzles 510 blows ions (neutralizing gas) onto both upper and lower surfaces (both front and back surfaces) of the substrate B that is being transported in the charge elimination section L.

  The conductor plate 52 is made of metal (made of a conductor) and is arranged below the static elimination section L. The conductor plate 52 can face the substrate B, which is being transported in the static elimination section L, from below. Note that among the plurality of upper and lower nozzles 510, the lower plurality of nozzles 510 are arranged on the conductor plate 52.

  The conductor plate drive unit 53 includes a ball screw 530 and a motor 531. The conductor plate 52 is attached to the nut of the ball screw 530. The motor 531 rotates the shaft of the ball screw 530 around the axis. The motor 531 can move the nut, that is, the conductor plate 52, to the lower side (the direction away from the board B) or the upper side (the direction to approach the board B) by rotating the shaft. Therefore, the vertical distance between the substrate B and the conductor plate 52 can be changed. Here, when the substrate B and the conductor plate 52 are regarded as electrodes, respectively, a capacitor is formed between the substrate B and the conductor plate 52. The vertical distance between the substrate B and the conductor plate 52 corresponds to the inter-electrode distance d.

  The potential sensor 54a is arranged at the starting point L0 of the static elimination section L. The potential sensor 54a can detect the potential of the substrate B (apparent potential of the substrate B when the conductor plate 52 is used as a reference) at the starting point L0. Similarly, the potential sensor 54b is arranged at the end point L1 of the static elimination section L. The potential sensor 54b can detect the potential of the substrate B at the end point L1.

  The control device 3 includes an input / output interface 30, a calculation unit 31, and a storage unit 32. The input / output interface 30 is electrically connected to the plurality of potential sensors 54a and 54b, the motors 500 and 531, the ion generator 511, and the mounting head 4.

<Principle of static elimination method for substrate>
Next, the principle of the board static elimination method executed by the production line of this embodiment will be described. In the charge removal method for the substrate, which will be described later, the charge for the substrate B is removed while the conductor plate 52 is lowered. FIG. 3 schematically shows changes with time in the height of the conductor plate and the potential of the substrate in the method of removing static electricity from the substrate. The height H of the conductor plate 52 corresponds to the left vertical axis, and the potential V of the substrate B corresponds to the right vertical axis. FIG. 4A shows a schematic diagram of the static elimination section at time T0 in FIG. FIG. 4B shows a schematic diagram of the static elimination section at time T1 in FIG. FIG. 4C shows a schematic diagram of the static elimination section from time T2 to time T3 in FIG. FIG. 4D shows a schematic diagram of the static elimination section at time T4 in FIG.

  As shown in FIGS. 4A to 4D, when the height H of the conductor plate 52 decreases, the inter-electrode distance d increases. Therefore, the potential V of the substrate B becomes high as shown in the above-mentioned formula (3). On the other hand, when the potential V of the substrate B increases, the charge removal speed of the ionizer 51 increases. Therefore, the potential V of the substrate B easily drops.

  In this way, when the electric charge is removed from the substrate B while lowering the conductor plate 52, immediately after the start of the lowering, the potential increasing action acts on the substrate B mainly due to the increase in the inter-electrode distance d (time T0 to time T1 in FIG. 3). , Time T3 to time T4). Therefore, the potential V of the substrate B rises. After that, the action of increasing the potential and the action of decreasing the potential due to the increase in the charge removal speed act on the substrate B so as to cancel each other out (time T1 to time T2 in FIG. 3). For this reason, the potential V of the substrate B rises or falls depending on the magnitude relationship between the two actions. Alternatively, the potential V becomes constant. After the descent is stopped, the potential increasing action disappears, so that the potential decreasing action mainly acts on the substrate B (time T2 to time T3, time T4 to time T5 in FIG. 3). Therefore, the potential V of the substrate B drops.

<How to remove static electricity from the substrate>
Next, a method of removing static electricity from a substrate, which is performed by the production line of this embodiment, will be described. As shown in FIGS. 1 and 2, a solder portion is printed on the wiring pattern of the board B conveyed on the production line 9 by the solder printer 90. Further, the electronic parts P are mounted on the solder part in stages in the plurality of electronic part mounters 1. In the solder printer 90, when the mask is removed from the board B, the board B may be charged. Further, in the electronic component mounter 1, when the electronic component P is mounted on the substrate B, the substrate B may be charged. For this reason, in the board appearance inspection machine 93, when the inspection needle pin contacts the electronic component P, an unintended current flows through the electronic component P. Therefore, the static elimination of the board B is performed in the static elimination section L of the production line 9 of the present embodiment. The static elimination section L is set in the board transfer device 5 of the electronic component mounting machine 1 at the right end (downstream end in the transfer direction).

  In the static elimination method for the substrate B described below, the control device 3 automatically eliminates static electricity on the substrate B while controlling the potential V of the substrate B being conveyed by using the above-described principle. .. As shown in FIG. 3, the static elimination method for the substrate B is performed by a first descending step ST1 (time T0 to time T1), a moving and descending step ST2 (time T1 to time T2), and a first leaving step ST3 (time T2 to time T2). It has a time T3), a second descending step ST4 (time T3 to time T4), and a second leaving step ST5 (time T4 to time T5).

[First descending step ST1 (time T0 to time T1)]
When the mounting of the electronic component P on the board B is completed, the control device 3 shown in FIG. 2 first moves the transport path 50 via the motor 500. As shown in FIG. 4A, at time T0, the board B arrives at the starting point L0 of the static elimination section L from the mounting position E1. The control device 3 detects the potential of the substrate B with the potential sensor 54a. Ions (neutralizing gas) are constantly ejected from the plurality of nozzles 510 of the ionizer 51. Therefore, when the board B arrives at the starting point L0, static elimination is started. The height H of the conductor plate 52 is the highest H0 in the static elimination method.

  Next, the control device 3 shown in FIG. 2 lowers the conductor plate 52 via the conductor plate driving section 53 while checking the potential of the substrate B with the potential sensor 54a. As shown in FIGS. 4A and 4B, the substrate B remains stopped at the starting point L0.

  As shown in FIGS. 3 and 4B, in the control device 3, the potential V of the substrate B is the management upper limit value V0 (the management upper limit value V0 is stored in the storage unit 32 of the control device 3 in advance). The conductor plate 52 is lowered until the temperature reaches. That is, time T0 to time T1 is a short time. Therefore, the potential increasing action mainly acts on the substrate B. Therefore, the potential V of the substrate B rises to the control upper limit value V0. The time when the potential V reaches the management upper limit value V0 is time T1. In addition, the height H of the conductor plate 52 at time T1 is the height H1.

[Move down step ST2 (time T1 to time T2)]
Subsequently, the control device 3 shown in FIG. 2 moves the substrate 50 from the starting point L0 of the static elimination section L by moving the transport path 50 via the motor 500 while lowering the conductor plate 52 by the conductor plate driving unit 53. Transport to the end point L1. The time when the substrate B reaches the end point L1 is the time T2. In addition, the height H of the conductor plate 52 at time T2 is the height H2.

  In the static elimination section L, the substrate B passes between the plurality of nozzles 510. During the passage, ions (neutralizing gas) are sprayed from the plurality of nozzles 510 on the upper and lower surfaces of the substrate B. The transport speed of the substrate B when passing through the static elimination section L is constant. Further, the transport speed of the substrate B when passing through the static elimination section L is the same as the transport speed of the substrate B from the loading position E0 to the mounting position E1 shown in FIG.

  As shown in FIGS. 3 and 4C, in the control device 3, the lowering speed at which the potential V of the substrate B does not exceed the management upper limit value V0 (the lowering speed is stored in the storage unit 32 of the control device 3 in advance. Then, the conductor plate 52 is lowered. That is, as compared with the time T0 to the time T1, the time T1 to the time T2 is a long time. Therefore, the potential increasing action and the potential decreasing action act on the substrate B. The potential V of the substrate B is a potential that does not exceed the management upper limit value V0 and is held at a potential close to the management upper limit value V0.

[First leaving step ST3 (time T2 to time T3)]
Then, the control device 3 shown in FIG. 2 checks the potential of the substrate B by the potential sensor 54b. Note that the conductor plate drive unit 53 and the board B remain stopped. As shown in FIGS. 3 and 4C, in the control device 3, the potential V of the substrate B is the management lower limit value V1 (the management lower limit value V1 is stored in advance in the storage unit 32 of the control device 3). The conductor plate drive unit 53 and the substrate B are left until the temperature reaches the. That is, the conductor plate 52 does not descend from time T2 to time T3. Therefore, the potential lowering action mainly acts on the substrate B. Therefore, the potential V of the substrate B drops to the control lower limit value V1. The time when the potential V reaches the control lower limit value V1 is time T3.

[Second descending step ST4 (time T3 to time T4)]
After that, the control device 3 shown in FIG. 2 lowers the conductor plate 52 via the conductor plate driving unit 53 while checking the potential of the substrate B with the potential sensor 54b. As shown in FIGS. 4C and 4D, the substrate B remains stopped at the end point L1. As in the period between time T0 and time T1, the potential increase action mainly acts on the substrate B. Therefore, the potential V of the substrate B rises to the potential V2 (the potential V2 is stored in the storage unit 32 of the control device 3 in advance). The time when the potential V reaches the potential V2 is time T4. The height H of the conductor plate 52 at time T4 is the lowest height H3 in the static elimination method.

[Second leaving step ST5 (time T4 to time T5)]
Finally, the control device 3 shown in FIG. 2 checks the potential of the substrate B with the potential sensor 54b. Note that the conductor plate drive unit 53 and the board B remain stopped. As shown in FIG. 3 and FIG. 4D, the control device 3 leaves the conductor plate drive unit 53 and the substrate B left until the potential V of the substrate B reaches the control lower limit value V1. As in the period between time T2 and time T3, the potential lowering action mainly acts on the substrate B. Therefore, the potential V of the substrate B drops to the control lower limit value V1. The time when the potential V reaches the control lower limit value V1 is time T5.

  In this way, the charge removal of the substrate B is completed. After that, the control device 3 moves the transport path 50 via the motor 500 to discharge the static-eliminated substrate B to the reflow furnace 92 shown in FIG. Further, the control device 3 restores the height H of the conductor plate 52 from the height H3 to the height H0 in preparation for static elimination of the substrate B that is conveyed to the start point L0 of the static elimination section L next.

<Effect>
Next, the function and effect of the board transfer device, the electronic component mounter, and the production line of this embodiment will be described. As shown in FIGS. 4A to 4D, according to the board transfer device 5, the electronic component mounter 1, and the production line 9 (hereinafter, referred to as “the board transfer device 5 or the like”) of the present embodiment, In the static elimination section L, the conductor plate drive unit 53 can move the conductor plate 52 downward (in the direction away from the substrate B). That is, in the static elimination section L, the inter-electrode distance d can be increased. Therefore, as shown in FIG. 3, the apparent potential V of the substrate B can be increased. Therefore, the charge removal speed of the ionizer 51 can be increased. As described above, according to the substrate transfer device 5 and the like of the present embodiment, the charge removal speed of the substrate B can be increased. Therefore, the time required for the substrate B to pass through the static elimination section L (time T0 to time T5 in FIG. 3), that is, the static elimination time of the substrate B can be shortened.

  Further, it is not necessary to intentionally slow down the transport speed of the substrate B only when passing through the charge elimination section L. Therefore, the transfer speed of the board B when passing through the static elimination section L can be made equal to the transfer speed of the board B from the loading position E0 to the mounting position E1 shown in FIG. Therefore, when a plurality of substrates B are continuously mass-produced in the production line 9, the substrate B is less likely to stay in the static elimination section L. That is, the productivity of the substrate B is unlikely to decrease.

  Further, according to the substrate transfer device 5 and the like of the present embodiment, the potential V and the charge removal speed of the substrate B can be adjusted by lowering the conductor plate 52 (lowering speed, lowering amount). Therefore, when passing through the static elimination section L, it is not necessary to change the transport speed of the substrate B on the way. Therefore, the transport speed of the substrate B when passing through the static elimination section L can be made constant over the entire length of the static elimination section L. Therefore, the productivity of the substrate B is unlikely to decrease.

  Further, according to the substrate transfer device 5 and the like of this embodiment, the potential V of the substrate B and the charge removal speed can be adjusted by lowering the conductor plate 52. Therefore, even when a plurality of substrates B having different charge amounts are continuously passed through the static elimination section L, the transport speed of the plurality of substrates B can be made uniform. Therefore, the productivity of the substrate B is unlikely to decrease.

  Further, according to the electronic component mounter 1 of the present embodiment, it is possible to eliminate the charge on the board B after the electronic components are mounted. Further, according to the production line 9 of the present embodiment, it is possible to remove the electric charge of the substrate B at a desired position on the production line 9.

  Further, according to the production line 9 of the present embodiment, in the electronic component mounting machine 1 at the right end shown in FIG. 1, the board B has been destaticized. Therefore, in the board appearance inspection machine 93, even if the inspection needle pin comes into contact with the electronic component P, the electronic component P is unlikely to have a defect.

  Further, as shown at time T1 and time T4 in FIG. 3, according to the substrate transfer device 5 and the like of the present embodiment, the conductor plate drive unit 53 causes the potential V detected by the potential sensors 54a and 54b to be the management upper limit value V0. The conductor plate 52 is lowered so as not to exceed the upper limit, and the inter-electrode distance d is increased. Therefore, the electronic component P is unlikely to suffer from a defect due to an excessive rise in the potential V.

  Further, as shown at time T3 in FIG. 3, according to the substrate transfer apparatus 5 and the like of the present embodiment, the conductor plate drive unit 53 causes the conductor plate to move when the potential V detected by the potential sensor 54b reaches the control lower limit value V1. 52 is lowered to increase the inter-electrode distance d. That is, when the potential V of the substrate B has dropped, the inter-electrode distance d is increased and the potential V of the substrate B is increased. Therefore, the electric charge remaining on the substrate B until the end can be neutralized. That is, the substrate B can be sufficiently discharged.

  Further, as shown at time T5 in FIG. 3, according to the substrate transfer apparatus 5 and the like of the present embodiment, the conductor plate drive unit 53 causes the substrate B to move when the potential V detected by the potential sensor 54b reaches the control lower limit value V1. Pay out. Therefore, the substrate B that has been sufficiently discharged can be discharged to the subsequent process (reflow furnace 92).

  Further, as shown in FIG. 2, the plurality of nozzles 510 are arranged on both sides of the substrate B in the vertical direction. Therefore, the ions for neutralization (neutralizing gas) can be sprayed on the upper and lower surfaces of the substrate B. Therefore, the charges charged on the substrate B can be neutralized quickly and reliably.

<Other>
The embodiments of the substrate transfer device, the electronic component mounter, and the production line of the present invention have been described above. However, the embodiment is not particularly limited to the above embodiment. It is also possible to implement in various modified forms and improved forms that can be performed by those skilled in the art.

  FIG. 5A shows a schematic diagram of the charge removal section of the substrate transfer apparatus according to the other embodiment (No. 1). FIG. 5B shows a schematic diagram of the charge removal section of the substrate transfer apparatus according to the other embodiment (No. 2). The parts corresponding to those in FIG. 4A are indicated by the same reference numerals.

  As shown in FIG. 5A, a plurality of potential sensors 54c may be arranged over the entire length of the static elimination section L in the transport direction. By doing so, the control device 3 can detect the potential V of the substrate B over the entire length of the static elimination section L in the transport direction. Therefore, feedback control can be performed on the potential V in the moving and descending step ST2 (time T1 to time T2) shown in FIG. For example, when the potential V is about to exceed the control upper limit value V0, the potential V can be lowered by slowing down the lowering speed of the conductor plate 52 and promoting the above-described potential lowering action. On the contrary, when the potential V is much lower than the control upper limit value V0, the potential V can be increased by increasing the descending speed of the conductor plate 52 and promoting the above-described potential increasing action. When the feedback control is performed, in the movement descending step ST2 (time T1 to time T2) shown in FIG. 3, the potential V of the substrate B is a potential which does not exceed the control upper limit value V0 and is extremely close to the control upper limit value V0. Can be held at. Therefore, the charge removal speed can be increased. Therefore, the transport speed of the substrate B when passing through the static elimination section L can be increased.

  As shown in FIG. 5B, the potential sensor 54d driven by, for example, a robot may be arranged in parallel with the substrate B. Also in this case, the control device 3 can detect the potential V of the substrate B over the entire length of the static elimination section L in the transport direction. Therefore, feedback control can be performed on the potential V in the moving and descending step ST2 (time T1 to time T2) shown in FIG.

  The ionizer 51 shown in FIG. 2 may be a direct current type when the polarity of the substrate B is known. The plurality of nozzles 510 may be arranged only in the upper stage or only in the lower stage. The lower nozzle 510 may be arranged independently of the conductor plate 52 so as not to move together with the conductor plate 52.

  In the production line 9 shown in FIG. 1, the set place, the set number, and the set length of the static elimination section L are not particularly limited. For example, the static elimination section L may be set on the upstream side of the processing unit of the substrate visual inspection machine 93 (the portion that actually inspects the external appearance of the substrate). Further, a substrate carrier (for example, a conveyor device) may be arranged between the reflow furnace 92 and the substrate visual inspection machine 93, and the static elimination section L may be set in the substrate carrier.

  First descent step ST1 (time T0 to time T1), moving descent step ST2 (time T1 to time T2), first leaving step ST3 (time T2 to time T3), second descent step ST4 (time T3) shown in FIG. ~ Time T4), the time required for the second leaving step ST5 (time T4 to time T5), the descending speed of the conductor plate 52, the descending amount, the control upper limit value V0, the control lower limit value V1, the potential V2, etc. are not particularly limited. In the static elimination section L shown in FIG. 2, only the moving and descending step ST2 (time T1 to time T2) may be executed. The transport speed of the substrate B when passing through the static elimination section L shown in FIG. 2 may be faster than the transport speed of the substrate B from the carry-in position E0 to the mounting position E1.

  In the static elimination section L, the position and section where the conductor plate 52 is lowered (in other words, the position and section where the inter-electrode distance d is increased) are not particularly limited. The conductor plate 52 may be moved down in a predetermined section (for example, the section between the start point L0 and the end point L1 as in the moving / lowering step ST2 of FIG. 3) while the substrate B is being transported. Further, with the substrate B stopped, at a predetermined position (for example, the starting point L0 as in the first descending step ST1 in FIG. 3 and the ending point L1 as in the second descending step ST4 in FIG. 3), the conductor plate 52 May be lowered. Further, the conductor plate 52 may be lowered while the substrate B is stopped at least at the start point L0 among the start point L0 and the end point L1.

  The conductor plate 52 shown in FIG. 2 may be arranged on the upper side of the substrate B. In this case, the conductor plate drive unit 53 can increase the inter-electrode distance d by raising the conductor plate 52. Further, the conductor plate 52 shown in FIG. 2 (the conductor plate 52 having an area similar to that of the substrate B) may be lowered while running parallel to the substrate B, as in the potential sensor 54d shown in FIG. 5B. .. That is, the conductor plate 52 only needs to be able to vertically face the substrate B being conveyed in the charge elimination section L.

  1: electronic component mounter, 3: control device, 30: input / output interface, 31: arithmetic unit, 32: storage unit, 4: mounting head, 40: head body, 41: suction nozzle, 5: substrate transfer device, 50 : Transport path, 500: motor, 51: ionizer, 510: nozzle, 511: ion generator, 52: conductor plate, 53: conductor plate driving unit, 530: ball screw, 531: motor, 54a to 54d: potential sensor, 9: Production line, 90: Solder printing machine, 91: Solder printing inspection machine, 92: Reflow furnace, 93: Board appearance inspection machine, B: Board, E0: Loading position, E1: Mounting position, E2: Unloading position, H -H3: height, L: static elimination section, L0: start point, L1: end point, P: electronic component, ST1: first lowering step, ST2: moving lowering step, ST3: first leaving step, ST4: second lower side. Step, ST5: second standing step, T0 to T5: Time, V: voltage, V0: upper control limit, V1: the management lower limit value, V2: voltage, d: distance between electrodes

Claims (6)

While carrying the substrate from the upstream side to the downstream side, a carrying path having a static elimination section,
An ionizer for removing charge from the substrate in the charge removing section,
In the static elimination section, a conductor plate arranged to face the substrate being transported,
In the static elimination section, by driving the conductor plate in a direction away from the substrate, a conductor plate drive unit capable of expanding the inter-electrode distance, which is the distance between the substrate and the conductor plate,
Equipped with
A substrate transfer device that transfers the substrate from the start point to the end point of the static elimination section while lowering the conductor plate by the conductor plate drive unit . While carrying the substrate from the upstream side to the downstream side, a carrying path having a static elimination section,
An ionizer for removing charge from the substrate in the charge removing section,
In the static elimination section, a conductor plate arranged to face the substrate being transported,
In the static elimination section, by driving the conductor plate in a direction away from the substrate, a conductor plate drive unit capable of expanding the inter-electrode distance, which is the distance between the substrate and the conductor plate,
Equipped with
In the static elimination section, a potential sensor for detecting the potential of the substrate is provided,
The substrate transfer device, wherein the conductor plate drive unit enlarges the inter-electrode distance so that the detected potential does not exceed a predetermined control upper limit value . The substrate transfer device according to claim 2 , wherein the conductor plate drive unit increases the inter-electrode distance when the detected potential reaches a predetermined control lower limit value . 4. The substrate transfer device according to claim 1 , wherein the ionizer has a plurality of nozzles which are arranged on both sides of the substrate in the front-back direction and have a plurality of nozzles for spraying a neutralizing gas on both the front and back sides of the substrate. An electronic component mounter comprising the substrate transfer device according to claim 1. A production line comprising the substrate transfer device according to any one of claims 1 to 4.

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