JP6701596B2 - Exposure apparatus, exposure method, flat panel display manufacturing method, and device manufacturing method - Google Patents

Description

The present invention relates to an exposure apparatus, a method of manufacturing a flat panel display, and relates to a device manufacturing method, and more specifically, the scanning exposure for scanning the energy beam in a predetermined scanning direction relative to the object, the object on a predetermined pattern exposure equipment to form a, and a method of manufacturing a flat panel display or device using the exposure equipment.

  Conventionally, in a lithography process for manufacturing an electronic device (micro device) such as a liquid crystal display device or a semiconductor device (an integrated circuit or the like), a pattern formed on a mask or a reticle (hereinafter referred to as “mask”) is converted into an energy beam. There is used an exposure apparatus which is used to transfer onto a glass plate or a wafer (hereinafter collectively referred to as “substrate”).

  This type of exposure apparatus is a beam that forms a predetermined pattern on a substrate by scanning exposure illumination light (energy beam) in a predetermined scanning direction with the mask and the substrate substantially stationary. A scan type scanning exposure apparatus is known (for example, refer to Patent Document 1).

  In the exposure apparatus described in Patent Document 1, in order to correct the positional error between the exposure target area on the substrate and the mask, the projection optical system is moved through the projection optical system while moving in the direction opposite to the scanning direction at the time of exposure. The alignment microscope measures the marks on the substrate and the mask (alignment measurement), and the positional error between the substrate and the mask is corrected based on the measurement result. Here, in order to improve the exposure accuracy, it is desirable to measure more marks, but there is a risk that throughput will decrease.

JP, 2000-12422, A

According to a first aspect of the present invention is irradiated with illumination light from the illumination system relative Rupa turn mask is Yusuke, partitions on the object body a projection image before Kipa turn Ri by the projection system a row intends exposure apparatus projection products et run査露light region, a plurality of first marks formed apart from each other in the scanning direction on the mask, away from each other in the scanning direction on the object A detection unit that detects each of the plurality of formed second marks, and a detection unit drive system that moves the detection unit in the scanning direction so as to detect the plurality of first marks and the plurality of second marks. And the illumination system and the projection system in the scanning direction with respect to the mask and the partitioned area so as to scan and expose the partitioned area whose relative position to the mask is adjusted based on the detection result of the detection unit . a driving system for relatively moving the object to move the mask and the mask drive mechanism for moving to the scanning direction with respect to the object, the non-scanning direction intersecting said object to said scanning direction with respect to the mask A drive system, wherein the drive system is formed with a part of the partitioned area and a part of the pattern facing each other so that a part of the partitioned area on the object is scanned and exposed. relative to the first mask, a pre-Symbol illumination system and the projection system are relatively moved to the scanning direction, the object drive system, a pre-Symbol object part of which is the scanning exposure for the divided area the non is moved in the scanning direction, the mask drive system is to pair the mask on the object is relative movement to said scanning direction, the detector drive system, the plurality of second mark and said plurality of first marks So that the other part of the divided area opposed to each other by the object drive system and the mask drive system and the other part of the pattern provided adjacent to the first mask in the scanning direction are formed. against said second mask, said detection unit that spacing with respect to the projection system about the scanning direction is changed by moving to the scanning direction, wherein the drive system, other portions run査露light of the divided area to be, exposure apparatus to the relative to other portions of the divided area and the second mask, move the front Symbol illumination system and the projection system to the scanning direction, which are opposite to each other, is provided.

According to a second aspect of the present invention, it is developed and the resist used for a flat panel display using the exposure equipment according to the first aspect is to expose the substrate coated, exposed the substrate And a method for manufacturing a flat panel display including the following.

According to a third aspect of the present invention, the device comprising a the resist using an exposure equipment according to the first aspect is exposing the object being coated, and developing the exposed the object, the A manufacturing method is provided.

It is a conceptual diagram of the liquid crystal exposure apparatus which concerns on one Embodiment. FIG. 2 is a block diagram showing an input/output relationship of a main control device which mainly constitutes a control system of the liquid crystal exposure apparatus of FIG. 1. It is a figure for demonstrating the structure of a projection system main body and the measurement system of an alignment microscope. 4A to 4E are views (No. 1 to No. 5) for explaining the operation of the liquid crystal exposure apparatus during scanning exposure of the substrate. FIGS. 5A to 5E are views (No. 6 to No. 10) for explaining the operation of the liquid crystal exposure apparatus during scanning exposure of the substrate. FIGS. 6A to 6E are views (No. 11 to No. 15) for explaining the operation of the liquid crystal exposure apparatus during scanning exposure of the substrate. 7A and 7B are views (No. 16 and No. 17) for explaining the liquid crystal exposure apparatus during the scanning exposure of the substrate.

  Hereinafter, one embodiment will be described with reference to FIGS. 1 to 7B.

  FIG. 1 shows a conceptual diagram of a liquid crystal exposure apparatus 10 according to an embodiment. The liquid crystal exposure apparatus 10 is of a step-and-scan type in which a rectangular (square) glass substrate P (hereinafter, simply referred to as a substrate P) used in, for example, a liquid crystal display device (flat panel display) is an exposure target. It is a projection exposure apparatus, a so-called scanner.

  The liquid crystal exposure apparatus 10 includes an illumination system 20 that emits illumination light IL that is an energy beam for exposure, and a projection optical system 40. Hereinafter, a direction parallel to the optical axis of the illumination light IL emitted from the illumination system 20 to the substrate P via the projection optical system 40 will be referred to as a Z-axis direction, and X-axes orthogonal to each other in a plane orthogonal to the Z-axis. And the Y-axis will be set and explained. Further, in the coordinate system of the present embodiment, the Y axis is assumed to be substantially parallel to the direction of gravity. Therefore, the XZ plane is substantially parallel to the horizontal plane. Further, the rotation (tilt) direction around the Z axis will be described as the θz direction.

  In the liquid crystal exposure apparatus 10 of the present embodiment, for example, two light transmission type masks M1 and M2 are used. A mask pattern corresponding to a part of a desired circuit pattern formed in one partitioned area on the substrate P is formed on the mask M1, and a mask pattern corresponding to the other part of the circuit pattern is formed on the mask M2. There is. The length (height) in the Y-axis direction of each of the masks M1 and M2 is approximately half the length in the Y-axis direction of one partitioned area. In the liquid crystal exposure apparatus 10, the desired circuit pattern is formed in the partitioned area by connecting the patterns formed corresponding to the masks M1 and M2.

  Further, in the present embodiment, a plurality of exposure target areas (which will be appropriately referred to as partition areas or shot areas) are set on one substrate P, and mask patterns are sequentially transferred to these plurality of shot areas. It In the present embodiment, a case will be described in which four partitioned areas are set on the substrate P (a so-called four-chamfered case), but the number of partitioned areas is not limited to this and can be changed as appropriate. is there.

  Further, in the liquid crystal exposure apparatus 10, a so-called step-and-scan type exposure operation is performed. During the scan exposure operation, the mask M1 (or the mask M2) and the substrate P are kept substantially stationary, and the illumination system 20 and the projection optical system 40 (illumination light IL) relatively move with respect to the mask M1 (or the mask M2) and the substrate P in a long stroke in the X-axis direction (appropriately referred to as a scanning direction) (white arrow in FIG. 1). reference). On the other hand, during the step operation for changing the partitioned area to be exposed, the masks M1 and M2 are stepwise moved in the X-axis direction by a predetermined stroke, and the substrate P is stepwise moved in the Y-axis direction by a predetermined stroke. (Refer to the black arrows in FIG. 1 respectively).

  FIG. 2 is a block diagram showing an input/output relationship of a main controller 90 that integrally controls each component of the liquid crystal exposure apparatus 10. As shown in FIG. 2, the liquid crystal exposure apparatus 10 includes an illumination system 20, a mask stage device 30, a projection optical system 40, a substrate stage device 50, an alignment system 60 and the like.

  The illumination system 20 includes an illumination system main body 22 including a light source (for example, a mercury lamp) of the illumination light IL (see FIG. 1). During the scan exposure operation, main controller 90 controls drive system 24 including, for example, a linear motor to scan drive illumination system main body 22 in the X-axis direction with a predetermined long stroke. The main controller 90 obtains position information in the X-axis direction of the illumination system main body 22 via the measurement system 26 including, for example, a linear encoder, and controls the position of the illumination system main body 22 based on the position information. In the present embodiment, for example, g-line, h-line, i-line, etc. are used as the illumination light IL.

  The mask stage device 30 includes a stage body 32 that holds the masks M1 and M2. The stage main body 32 is configured to be capable of stepwise movement in the X-axis direction and the Y-axis direction by a drive system 34 including, for example, a linear motor. During a step operation for changing the partitioned area to be exposed in the X-axis direction, main controller 90 controls drive system 34 to step-drive stage body 32 in the X-axis direction. Further, as will be described later, during a step operation for changing the area (position) to be scanned and exposed in the partitioned area to be exposed in the Y-axis direction, main controller 90 controls drive system 34 to cause the stage to move. The main body 32 is step-driven in the Y-axis direction. The drive system 34 can also appropriately finely drive the mask M in the three-degree-of-freedom (X, Y, θz) directions in the XY plane during the alignment operation described later. The position information of the masks M1 and M2 is obtained by the measurement system 36 including, for example, a linear encoder.

  The projection optical system 40 includes a projection system main body 42 including an optical system that forms an erect image of the mask pattern on the substrate P (see FIG. 1) in the unity magnification system. The projection system body 42 is arranged in a space formed between the substrate P and the masks M1 and M2 (see FIG. 1). During the scan exposure operation, main controller 90 controls drive system 44 including, for example, a linear motor to cause projection system main body 42 to have a predetermined length in the X-axis direction so as to synchronize with projection system main body 22. Scan drive by stroke. The main controller 90 obtains position information in the X-axis direction of the projection system main body 42 via the measurement system 46 including a linear encoder and controls the position of the projection system main body 42 based on the position information.

  Returning to FIG. 1, in the liquid crystal exposure apparatus 10, when the illumination area IAM on the mask M1 (or mask M2) is illuminated by the illumination light IL from the illumination system 20, the illumination light that has passed through the mask M1 (or mask M2). By the IL, the projected image (partial erect image) of the mask pattern in the illumination area IAM via the projection optical system 40 becomes the irradiation area (exposure area IA) of the illumination light IL which is conjugate to the illumination area IAM on the substrate P. It is formed. Then, the scanning exposure operation is performed by the relative movement of the illumination light IL (the illumination area IAM and the exposure area IA) with respect to the mask M1 (or the mask M2) and the substrate P in the scanning direction. That is, in the liquid crystal exposure apparatus 10, the pattern of the mask M1 (or mask M2) is generated on the substrate P by the illumination system 20 and the projection optical system 40, and the pattern of the sensitive layer (resist layer) on the substrate P by the illumination light IL is formed. The pattern is formed on the substrate P by the exposure.

  The substrate stage device 50 includes a stage body 52 that holds the back surface (the surface opposite to the exposure surface) of the substrate P. Returning to FIG. 2, during the step operation for changing the partitioned area to be exposed in the Y-axis direction, the main controller 90 controls the drive system 54 including, for example, a linear motor to move the stage main body 52 to the Y direction. Step drive in the axial direction. The drive system 54 can also finely drive the substrate P in the three degrees of freedom (X, Y, θz) directions in the XY plane during the substrate alignment operation described later. The position information of the substrate P (stage main body 52) is obtained by the measurement system 56 including, for example, a linear encoder.

  Returning to FIG. 1, the alignment system 60 includes, for example, two alignment microscopes 62 and 64. The alignment microscopes 62 and 64 are arranged in a space formed between the substrate P and the mask M (a position between the substrate P and the mask M in the Z-axis direction), and the alignment formed on the substrate P. The mark Mk (hereinafter, simply referred to as the mark Mk) and the mark (not shown) formed on the mask M are detected. In the present embodiment, one mark Mk is formed in the vicinity of the four corners of each partitioned region (for example, four for each partitioned region), and the mark of the mask M is a mark formed through the projection optical system 40. It is formed at a position corresponding to Mk. The numbers and positions of the marks Mk and the marks of the mask M are not limited to this, and can be changed as appropriate. Further, in each drawing, the mark Mk is shown larger than it actually is in order to facilitate understanding.

  One alignment microscope 62 is arranged on the +X side of the projection system main body 42, and the other alignment microscope 64 is arranged on the −X side of the projection system main body 42. The alignment microscopes 62 and 64 each have a pair of detection fields (detection regions) separated in the Y-axis direction, and simultaneously detect, for example, two marks Mk that are separated in the Y-axis direction in one partitioned region. You can do it.

  Further, the alignment microscopes 62 and 64 can simultaneously detect the mark formed on the mask M and the mark Mk formed on the substrate P (in other words, without changing the positions of the alignment microscopes 62 and 64). Has become. The main controller 90, for example, each time the mask M performs the X-step operation or the substrate P performs the Y-step operation, the relative positional deviation information between the mark formed on the mask M and the mark Mk formed on the substrate P. Then, relative positioning of the substrate P and the mask M in the directions along the XY plane is performed so as to correct (cancel or reduce) the positional deviation. In the alignment microscopes 62 and 64, a mask detection unit that detects (observes) the mark of the mask M and a substrate detection unit that detects (observes) the mark Mk of the substrate P are integrally formed by a common housing or the like. It is configured and driven by the drive system 66 via the common housing. Alternatively, the mask detection unit and the substrate detection unit may be configured by separate housings or the like. In that case, for example, the mask detection unit and the substrate detection unit are substantially equivalent by a common drive system 66. It is preferable to be configured so that it can move with operating characteristics.

  Main controller 90 (see FIG. 2) controls alignment microscopes 62 and 64 independently by a predetermined long stroke in the X-axis direction by controlling drive system 66 (see FIG. 2) including, for example, a linear motor. To drive. The main controller 90 also obtains position information in the X-axis direction of each of the alignment microscopes 62 and 64 via a measurement system 68 including a linear encoder, and controls the position of the alignment microscopes 62 and 64 based on the position information. Each independently. The drive system 66 also has, for example, a linear motor for driving the alignment microscopes 62 and 64 in the Y-axis direction.

  Here, the alignment microscopes 62 and 64 of the alignment system 60 and the projection system main body 42 of the projection optical system 40 described above are elements that are physically (mechanically) independent (separated), and the main controller 90 (see FIG. The driving system 66 for driving the alignment microscopes 62 and 64 and the driving system 44 for driving the projection system main body 42 are controlled in the X-axis direction. In regard to the drive of, for example, a part of the linear motor, the linear guide, etc. is shared, and the drive characteristics of the alignment microscopes 62, 64 and the projection system main body 42 or the control characteristics by the main controller 90 are substantially equal. Is configured to be.

  As a specific example, when the alignment microscopes 62 and 64 and the projection system main body 42 are driven in the X-axis direction by, for example, a moving coil type linear motor, a magnetic body (for example, a permanent magnet or the like) that is a stator is used. The unit is shared by the drive system 66 and the drive system 44. On the other hand, in the coil unit which is the mover, the alignment microscopes 62 and 64 and the projection system main body 42 are independently provided, and the main controller 90 (see FIG. 2) individually supplies power to the coil unit. By doing so, the driving (speed and position) of the alignment microscopes 62 and 64 in the X-axis direction and the driving (speed and position) of the projection system main body 42 in the X-axis direction are independently controlled. Therefore, main controller 90 can change (arbitrarily change) the distance (distance) between alignment microscopes 62 and 64 and projection system main body 42 in the X-axis direction. Further, main controller 90 can also move alignment microscopes 62 and 64 and projection system body 42 at different speeds in the X-axis direction.

  Main controller 90 (see FIG. 2) detects a plurality of marks Mk formed on substrate P using at least one of alignment microscopes 62 and 64, and uses the detection result (positional information of a plurality of marks Mk) as the detection result. Based on this, the array information (including information on the position (coordinate value), shape, etc. of the partitioned area) of the partitioned area in which the mark Mk to be detected is formed is calculated by the known enhanced global alignment (EGA) method. ..

  Specifically, in the scanning exposure operation, the main control device 90 (see FIG. 2) uses the alignment microscope 62 arranged on the +X side of the projection system main body 42 to expose at least the exposure target, prior to the scanning exposure operation. The position information of, for example, four marks Mk formed in the partitioned area is detected to calculate the array information of the partitioned area. The main controller 90 performs precise positioning (substrate alignment operation) of the substrate P in the three-degree-of-freedom directions in the XY plane based on the calculated array information of the partitioned areas to be exposed, and the illumination system 20 and the projection. By appropriately controlling the optical system 40, the scanning exposure operation (transfer of the mask pattern) is performed on the target partitioned area.

  Next, a measurement system 46 (see FIG. 2) for obtaining the position information of the projection system body 42 of the projection optical system 40, and a measurement system 68 for obtaining the position information of the alignment microscopes 62, 64 of the alignment system 60. The specific configuration of will be described.

  As shown in FIG. 3, the liquid crystal exposure apparatus 10 has a guide 80 for guiding the projection system main body 42 in the scanning direction. The guide 80 is composed of a member extending parallel to the scanning direction. The guide 80 also has a function of guiding the movement of the alignment microscope 62 in the scanning direction. Further, although the guide 80 is shown between the mask M and the substrate P in FIG. 3, the guide 80 is actually arranged in a position avoiding the optical path of the illumination light IL in the Y-axis direction. ..

  A scale 82 including a reflection type diffraction grating having a periodic direction at least in a direction parallel to the scanning direction (X-axis direction) is fixed to the guide 80. Further, the projection system main body 42 has a head 84 which is arranged so as to face the scale 82. In the present embodiment, the scale 82 and the head 84 form an encoder system that constitutes a measurement system 46 (see FIG. 2) for obtaining position information of the projection system body 42. The alignment microscopes 62 and 64 each have a head 86 arranged to face the scale 82 (the alignment microscope 64 is not shown in FIG. 3). In the present embodiment, the scale 82 and the head 86 form an encoder system that constitutes a measurement system 68 (see FIG. 2) for obtaining the position information of the alignment microscopes 62 and 64. Here, the heads 84 and 86 respectively irradiate the scale 82 with a beam for encoder measurement, receive a beam that has passed through the scale 82 (a reflected beam by the scale 82), and based on the light reception result, the scale 82. It is possible to output position information relative to.

  As described above, in the present embodiment, the scale 82 constitutes the measurement system 46 (see FIG. 2) for obtaining the position information of the projection system main body 42, and the measurement system for obtaining the position information of the alignment microscopes 62 and 64. 68 (see FIG. 2). That is, the projection system body 42 and the alignment microscopes 62 and 64 are position-controlled based on a common coordinate system (measurement axis) set by the diffraction grating formed on the scale 82. The drive system 44 (see FIG. 2) for driving the projection system main body 42 and the drive system 66 (see FIG. 2) for driving the alignment microscopes 62 and 64 may have some common elements. It may be good or may be composed of completely independent elements.

  The encoder system that constitutes the measurement systems 46 and 68 (see FIG. 2 respectively) may be a linear (1 DOF) encoder system in which the length measurement axis is only in the X-axis direction (scanning direction), for example. It may have more length measurement axes. For example, by arranging a plurality of heads 84 and 86 at predetermined intervals in the Y-axis direction, the rotation amount of the projection system main body 42 and the alignment microscopes 62 and 64 in the θz direction may be obtained. Further, an XY two-dimensional diffraction grating may be formed on the scale 82, and a 3DOF encoder system having a length measuring axis in the three degrees of freedom in the X, Y, and θz directions may be used. Further, as the heads 84 and 86, by using a plurality of known two-dimensional heads capable of measuring the length in the direction orthogonal to the scale surface together with the periodic direction of the diffraction grating, the projection system main body 42 and the alignment microscope 62 can be freely moved. The position information in the degree direction may be obtained.

  Next, the step-and-scan exposure operation using the liquid crystal exposure apparatus 10 will be described with reference to FIGS. 4(a) to 7(b). The following exposure operation (including alignment operation) is performed under the control of main controller 90.

  In addition, in FIGS. 4A to 7B for explaining the relationship between the substrate P and the masks M1 and M2 during the exposure operation, the circuit pattern formed on the substrate P is illustrated to facilitate understanding. Let us explain with the letter F. A mask pattern corresponding to the -Y side half of the circuit pattern (F shape) is formed on the mask M1, and a +Y side half of the circuit pattern (F shape) is formed on the mask M2. A mask pattern is formed. The relative positional relationship between the mask M1 and the mask M2 is different in the X-axis direction and equal in the Y-axis direction.

  In addition, actually, when the illumination light IL (see FIG. 1) is not irradiated, the exposure area IA is not generated on the substrate P, but here, for ease of understanding, FIG. 4A to FIG. In b), when the exposure area IA is illustrated as white, it is assumed that the exposure area IA is generated on the substrate P by the illumination light IL from the illumination system 20 (see FIG. 1), and the exposure area IA is black. In the illustrated case, it is assumed that the illumination light IL is not emitted.

As shown in FIG. 4A, in this embodiment, the partitioned area having the first exposure order (hereinafter, referred to as the first shot area S ₁ ) is set on the −X side and the −Y side of the substrate P. Has been done. The mask M1 faces a half region on the −Y side of the first shot region S ₁ of the substrate P. The main controller 90 (not shown in FIGS. 4A to 7B, see FIG. 2) uses the alignment microscope 62 (see FIG. 2) to determine the relative relationship between the mask M1 and the first shot area S _1. The correct positioning. Specifically, main controller 90 drives alignment microscope 62 in the +X direction to detect mark Mk (not shown) formed in first shot region S ₁ . Main controller 90 performs precise positioning of substrate P in the three degrees of freedom in the XY plane based on the detection result of alignment microscope 62.

  Thereafter, as shown in FIG. 4B, main controller 90 causes illumination system main body 22 and projection system main body 42 (so that exposure area IA moves on substrate P in the +X direction at a constant speed. 1 and 2) are synchronously driven in the +X direction.

FIG. 4C shows a state immediately after the exposure operation to the −Y side half (lower half) of the first shot area S ₁ is completed. The main controller 90 drives each of the masks M1 and M2 in the X step in the −X direction as shown in FIG. 4D in order to perform the exposure operation on the +Y side half of the first shot area S ₁ . (See the white arrow in FIG. 4D), and the substrate P is driven in Y step in the Y direction (see the black arrow in FIG. 4D). As a result, the mask M2 is driven to a position facing the +Y side half region of the first shot region S ₁ of the substrate P.

The main controller 90 uses the alignment microscope 64 (see FIG. 2) to perform relative positioning between the mask M2 and the first shot area S ₁ . The main controller 90 includes the mask M2 and the −Y side half (lower half) of the first shot area S ₁ to which the pattern of the mask M1 is transferred, and the +Y side of the first shot area S ₁ to which the pattern of the mask M2 is transferred. Position relative to half (upper half). Specifically, main controller 90 drives alignment microscope 64 in the −X direction to detect mark Mk (not shown) formed in first shot region S ₁ . Main controller 90 performs precise positioning of substrate P in the three-degree-of-freedom direction on the XY plane based on the detection result of alignment microscope 64. The main controller 90 uses the alignment microscope 62 to perform relative positioning between the masks M1 and M2 and the substrate P each time the masks M1 and M2 are driven in X steps in the +X direction or the −X direction. The description is omitted below.

Next, the main controller 90 synchronously drives the illumination system main body 22 and the projection system main body 42 (see FIG. 1 and FIG. 2, respectively) in the −X direction, and the +Y side half (upper half) of the first shot region S ₁ is driven. ) Exposure operation. As described above, in the present embodiment, the scanning direction of the illumination light IL (exposure area IA) is reversed between the first exposure operation and the second exposure operation for one divided area.

FIG. 4E shows a state immediately after the exposure operation for the upper half of the first shot area S ₁ is completed. The pattern of the mask M1 is transferred to the lower half area of the first shot area S ₁ by the first scanning exposure operation (see FIG. 4B), and the first scanning area S _{1 has} the _first pattern by the second scanning exposure operation. by the pattern of the mask M2 on the upper half region of the shot areas S ₁ is being transferred, the pattern of the mask M1, is joined together with the pattern of the mask M2. As a result, a desired circuit pattern (here, the letter “F”) is formed in the first shot area S ₁ . That is, in order to form a desired circuit pattern in the partitioned area, the projection system main body 42 is reciprocally driven in the X direction to perform stitching exposure.

When the projection system main body 42 is reciprocated to perform the stitching exposure in order to form one mask pattern in the partitioned area, the forward and backward alignment microscopes having different detection fields are used in the scanning direction (X direction). It is arranged before and after the projection system main body 42. In this case, the marks Mk at the four corners of the divided region are detected by the alignment microscope for the forward path (for the first exposure operation), and the marks Mk near the joint are detected by the alignment microscope for the backward path (for the second exposure operation). May be detected. Here, the spliced portion means a spliced portion of the area exposed by the forward scanning exposure (area where the pattern is transferred) and the area exposed by the backward scanning exposure (area where the pattern is transferred). To do. As the mark Mk near the joint portion, the mark Mk may be formed on the substrate P in advance, or an exposed pattern may be used as the mark Mk. The same applies to the case where joint exposure is performed not only in the first shot area S ₁ but also in another shot area. In the above embodiment, when the projection system main body 42 is driven in the +X direction to perform the scanning exposure operation, the forward path alignment microscope is the alignment microscope 62, and the backward path alignment microscope is the alignment microscope 64. Further, when the projection system main body 42 is driven in the −X direction to perform the scanning exposure operation, the forward path alignment microscope is the alignment microscope 64, and the backward path alignment microscope is the alignment microscope 62.

Hereinafter, the main controller 90, the same procedure X step operation of the mask M1, M2 in, and by performing the Y stepping of the substrate P as appropriate, the remainder of the second to exposure in the fourth shot area _S 2 to S ₄ Take action. In FIG. 5A, in order to perform the exposure operation on the lower half of the second shot area S ₂ (+Y side of the first shot area S ₁ ), each of the masks M 1 and M 2 is driven by X steps in the +X direction. At the same time, the substrate P is driven in Y steps in the −Y direction. In this state, as shown in FIG. 5B, the illumination light IL (exposure area IA) is scanned in the +X direction, whereby the pattern of the mask M1 is transferred to the lower half of the second shot area S _2. It

In FIG. 5C, in order to perform the exposure operation for the upper half of the second shot area S ₂ , the masks M1 and M2 are respectively moved in the X step in the −X direction from the state shown in FIG. 5B. The state is shown in which the substrate P is driven and is stepped in the Y direction in the Y direction. In this state, as shown in FIG. 5 (d), the illumination light IL (exposure area IA) is scanned in the -X direction, whereby the pattern of the mask M2 on the upper half of the second shot area S ₂ is transferred (The operation of exposing the second shot area S ₂ is completed).

In FIG. 5E, in order to perform the exposure operation on the upper half of the third shot area S ₃ (on the +X side of the second shot area S ₁ ), the mask from the state shown in FIG. Each of M1 and M2 is shown to be driven in X steps in the X direction (the substrate P is not driven in Y steps). In this state, as shown in FIG. 6A, the illumination light IL (exposure area IA) is scanned in the +X direction, whereby the pattern of the mask M2 is transferred to the upper half of the third shot area S _3. (Unlike the first and second shot areas S ₁ and S ₂ , the pattern of the mask M2 is transferred first). From the state shown in FIG. 5D, when the masks M1 and M2 are driven in X steps in the +X direction, the illumination system main body 22 and the projection system main body 42 are moved in the +X direction of the masks M1 and M2. immediately pattern of the mask M2 on the upper half of the third shot area S ₃ after the step driving is completed may be allowed to drive the position easy transfer. In other words, while the masks M1 and M2 are driven in the X direction by X steps, the illumination system main body 22 and the projection system main body 42 are driven in advance to the exposure start position of the third shot area S ₃ . In addition, it is possible to shorten the time until the exposure of the third shot area S ₃ is started.

In FIG. 6B, in order to perform the exposure operation on the lower half of the third shot region S ₃ , the masks M1 and M2 are driven by X steps in the +X direction from the state shown in FIG. 6A. In addition, the substrate P is driven in the Y step in the +Y direction. In this state, as shown in FIG. 6C, the illumination light IL (exposure area IA) is scanned in the −X direction, whereby the pattern of the mask M1 is transferred to the lower half of the third shot area S _3. (The exposure operation for the third shot area S ₃ is completed).

In FIG. 6D, in order to perform the exposure operation on the upper half of the fourth shot region S ₄ (−Y side of the third shot region S ₃ ), the state shown in FIG. Each of the masks M1 and M2 is driven by X steps in the −X direction, and the substrate P is driven by Y steps in the +Y direction. In this state, as shown in FIG. 6E, the illumination light IL (exposure area IA) is scanned in the +X direction, whereby the pattern of the mask M2 is transferred to the upper half of the fourth shot area S _4. It

In FIG. 7A, in order to perform the exposure operation on the lower half of the fourth shot region S ₄ , the masks M1 and M2 are driven by X steps in the +X direction from the state shown in FIG. 6E. In addition, the substrate P is driven in the Y step in the +Y direction. In this state, as shown in FIG. 7B, the illumination light IL (exposure area IA) is scanned in the −X direction, whereby the pattern of the mask M1 is transferred to the lower half of the fourth shot area S _4. (The operation of exposing the fourth shot area S ₄ is completed).

Here, if the scanning exposure operation of one divided area is completed by one scanning exposure operation, the length of the illumination area IAM and the exposure area IA in the Y-axis direction (see FIG. 1, respectively) is It is necessary that the length of the (shot areas S _{1 to} S ₄ ) in the Y-axis direction is substantially the same. On the other hand, according to the above-described present embodiment, the length in the Y-axis direction of each of the illumination area IAM and the exposure area IA is approximately half the length in the Y-axis direction of each partitioned area. The main body 22 and the projection system main body 42 (see FIG. 1 respectively) can be reduced in size and weight. Thereby, the position controllability of the illumination system main body 22 and the projection system main body 42 is improved, so that high-speed and high-precision scanning exposure operation can be performed.

  Further, the masks M1 and M2 having a part and the other part of the desired pattern are moved in X steps to form the desired circuit pattern in the partitioned area. Therefore, the mask M1 and the mask M2 are exchanged every scanning exposure operation. No work required and efficient.

  Moreover, since the substrate P can be moved in Y steps, the positions of the illumination system main body 22 and the projection system main body 42 (that is, the optical axis of the illumination light IL) in the Y axis direction can be changed without changing the positions in the Y axis direction. The scanning exposure operation can be performed on a plurality of divided areas having different positions. Accordingly, the illumination system 20 and the projection optical system 40 can be configured as a single-axis (X-axis) stage device, and the device configuration is simplified. Further, the position controllability of the illumination system body 22 and the projection system body 42 is improved.

  The configuration according to the embodiment described above can be modified as appropriate. For example, in the above-described embodiment, a desired pattern is formed in one divided area by connecting the patterns of the two masks M1 and M2, for example, but the number of masks may be three or more. Of course, the patterns of the three masks may be joined together to form a desired pattern in one divided area.

Further, in the above embodiment, the relative positions of the mask M1 and the mask M2 are the same in the Y-axis direction, but the relative positions may be displaced in the Y-axis direction. For example, in the above embodiment, after the scanning exposure operation mask M1 to face the lower half of the first shot area S _1, were Y stepping of the substrate P together with X step operation of the mask M1, M2 However, by shifting the positions of the masks M1 and M2 in the Y-axis direction, it is possible to make the mask M2 face the upper half of the first shot region S ₁ only by the X step operation of the masks M1 and M2.

Further, in the above-described embodiment, the light source used in the illumination system 20 and the wavelength of the illumination light IL emitted from the light source are not particularly limited, and include, for example, ArF excimer laser light (wavelength 193 nm) and KrF excimer laser light (wavelength). It may be ultraviolet light such as 248 nm) or vacuum ultraviolet light such as F ₂ laser light (wavelength 157 nm).

  Further, in the above-described embodiment, the illumination system main body 22 including the light source is driven in the scanning direction. However, the present invention is not limited to this, and the light source is fixed like the exposure apparatus disclosed in JP 2000-12422A, for example. Alternatively, only the illumination light IL may be scanned in the scanning direction.

  Further, although the illumination area IAM and the exposure area IA are formed in a band shape extending in the Y-axis direction in the above-mentioned embodiment, the invention is not limited to this, and as disclosed in, for example, US Pat. No. 5,729,331. Alternatively, a plurality of areas arranged in a staggered pattern may be combined.

  Further, in the above embodiment, the masks M1 and M2 and the substrate P are arranged so as to be orthogonal to the horizontal plane (so-called vertical arrangement), but the present invention is not limited to this, and the masks M1 and M2 and the substrate P are horizontal planes. May be arranged in parallel with. In this case, the optical axis of the illumination light IL is substantially parallel to the gravity direction.

  Further, during the scanning exposure operation, the fine positioning of the substrate P in the XY plane was performed according to the result of the alignment measurement. Together with this, before the scanning exposure operation (or in parallel with the scanning exposure operation), the substrate P The surface position information may be obtained and surface position control of the substrate P (so-called autofocus control) may be performed during the scanning exposure operation.

  Further, the application of the exposure apparatus is not limited to the exposure apparatus for liquid crystal that transfers the liquid crystal display element pattern to the rectangular glass plate, and for example, the exposure apparatus for manufacturing an organic EL (Electro-Luminescence) panel, the semiconductor It can be widely applied to an exposure apparatus for manufacturing, a thin film magnetic head, an exposure apparatus for manufacturing a micromachine, a DNA chip and the like. Further, not only microdevices such as semiconductor elements, but also glass substrates or silicon wafers for manufacturing masks or reticles used in light exposure apparatuses, EUV exposure apparatuses, X-ray exposure apparatuses, electron beam exposure apparatuses, etc. It can also be applied to an exposure device that transfers a circuit pattern onto a substrate.

  The object to be exposed is not limited to the glass plate, and may be another object such as a wafer, a ceramic substrate, a film member, or a mask blank. When the exposure target is a flat panel display substrate, the thickness of the substrate is not particularly limited, and includes, for example, a film-shaped (flexible sheet-shaped member). The exposure apparatus of this embodiment is particularly effective when a substrate having a side length or a diagonal length of 500 mm or more is an exposure target. Further, when the substrate to be exposed has a flexible sheet shape, the sheet may be formed in a roll shape. In this case, it is possible to easily change (step move) the division area of the exposure target with respect to the illumination area (illumination light) by rotating (rolling) the roll regardless of the step operation of the stage device. ..

  For electronic devices such as liquid crystal display elements (or semiconductor elements), the step of designing the function/performance of the device, the step of manufacturing a mask (or reticle) based on this design step, the step of manufacturing a glass substrate (or wafer) The exposure apparatus of each of the above-described embodiments, and the lithography step of transferring the pattern of the mask (reticle) to the glass substrate by the exposure method, the developing step of developing the exposed glass substrate, and the portion other than the portion where the resist remains It is manufactured through an etching step of removing an exposed member of a portion by etching, a resist removing step of removing unnecessary resist after etching, a device assembling step, an inspection step and the like. In this case, in the lithography step, the above-described exposure method is executed by using the exposure apparatus of the above-described embodiment, and the device pattern is formed on the glass substrate, so that a highly integrated device can be manufactured with high productivity. ..

As described above, the exposure equipment of the present invention is suitable for scanning exposure an object. Moreover, the manufacturing method of the flat panel display of the present invention is suitable for the production of the flat panel display. Moreover, the device manufacturing method of the present invention is suitable for the production of microdevices.

  10... Liquid crystal exposure device, 20... Illumination system, 30... Mask stage device, 40... Projection optical system, 50... Substrate stage device, 60... Alignment system, M1, M2... Mask, P... Substrate.

Claims (15)

Irradiating the illumination light from the illumination system relative mask is Yusuke Rupa turn,査露light projection products et run the projection image before Kipa turn Ri by the projection system in the divided area on the object body a line intends exposure apparatus,
A detection unit that detects a plurality of first marks formed on the mask and separated from each other in the scanning direction, and a plurality of detection units that detect a plurality of second marks formed on the object and separated from each other in the scanning direction;
A detection unit drive system that moves the detection unit in the scanning direction so as to detect the plurality of first marks and the plurality of second marks;
The illumination system and the projection system are relative to the mask and the divided area in the scanning direction so that the divided area whose relative position with respect to the mask is adjusted based on the detection result of the detection unit is exposed by scanning. Drive system to move to
A mask drive mechanism for moving to the scanning direction of the mask relative to the object,
An object drive system for moving the object in a non-scanning direction that intersects the scanning direction with respect to the mask ,
The drive system is configured such that a part of the partitioned area and a part of the pattern that face each other are opposed to each other so that a part of the partitioned area on the object is scanned and exposed. the pre-Symbol illumination system and the projection system are relatively moved to the scanning direction,
The object drive system moves the previous SL object part of which is the scanning exposure for the partition area to the non-scanning direction,
The mask drive system is to pair the mask on the object is relative movement to said scanning direction,
The detection unit drive system scans the other part of the divided area opposed to each other by the object drive system and the mask drive system so as to detect the plurality of first marks and the plurality of second marks, and the scanning. The detection unit scans the second mask, which is provided adjacent to the first mask in the direction and in which the other part of the pattern is formed, so that the interval with respect to the projection system in the scanning direction is changed. Direction,
The drive system, so that the other part of the divided area is run査exposure, relative to said second mask and the other part of the divided areas facing each other, the scanning direction before Symbol illumination system and said projection system exposure apparatus to move to.   The object drive system is configured such that a second section region adjacent to the first section area, which is the section area in which the pattern is formed, in the non-scanning direction faces the first mask. The exposure apparatus according to claim 1, wherein the object is relatively moved in the non-scanning direction with respect to the first mask and the second mask facing the first partitioned region.   The mask drive system moves the second mask, which faces the first mask and the second region, in the scanning direction with respect to the object so that the second partitioned region and the first mask face each other. The exposure apparatus according to claim 2, wherein the exposure apparatus is moved relatively.   In the mask drive system, the second mask facing the scan-exposed second partitioned area faces a third partitioned area provided adjacent to the second partitioned area in the scanning direction. The exposure apparatus according to claim 3, wherein the second mask facing the second partitioned area is moved in the scanning direction relative to the object. The projection system, in査露light that run against a part of the divided area, the object of the projected image of the first pattern the first mask having a half length of the divided area with respect to the non-scanning direction has The exposure apparatus according to any one of claims 1 to 4, which projects the light onto the image. The projection system, in that run査露light against the other part, the projected image of the second pattern, wherein the second mask having a half length of the divided area with respect to the non-scanning direction has the object of the divided area The exposure apparatus according to any one of claims 1 to 5, wherein the exposure apparatus projects the light onto the image. The object driving system moves, in the non-scanning direction, the object in which a part of the partitioned area is scan-exposed while the mask driving system moves the mask in the scanning direction relative to the object. The exposure apparatus according to any one of 1 to 6. The mask drive system moves the mask relative to the object in the scanning direction while the object drive system is moving in the non-scanning direction of the object on which a part of the divided area is scan-exposed. The exposure apparatus according to claim 1. The drive system moves the illumination system and the projection system in the scanning direction so that a first part of the pattern and a second part of the other part of the pattern are spliced together for exposure. The exposure apparatus according to claim 1. A direction in which the illumination light is applied to the first mask and the second mask is parallel to a horizontal plane,
Wherein the object, an exposure apparatus according to any one of claim 1 to 9, the surface to be the scanning exposure is disposed in a state of being perpendicular to the horizontal plane. The drive system includes a first drive unit that drives the illumination system, and a second drive unit that drives the projection system,
The said 1st and 2nd drive part is an exposure apparatus as described in any one of Claims 1-10 which synchronizes and moves the said illumination system and the said projection system in the said scanning exposure. Wherein the object, an exposure apparatus according to any one of claim 1 to 11 which is a substrate used in flat panel displays. The exposure apparatus according to claim 12 , wherein the substrate has at least one side length or diagonal length of 500 mm or more. Exposing the substrate coated with the resist by the exposure apparatus according to claim 12 or 13 ;
Developing the exposed substrate, and manufacturing a flat panel display. And exposing the object on which the resist is applied by the exposure apparatus according to any one of claims 1-14,
Developing the exposed object.

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